Resin encapsulation apparatus and resin encapsulation method

Abstract

To provide a resin sealing device and a resin sealing method which suppress adhesion of particles and can improve quality of a product.SOLUTION: A resin sealing device includes a first cleaner part which is provided between a workpiece storage part and a table, and has a first dust collection port facing the rear face of workpiece conveyed by a workpiece conveyance hand, and a second cleaner part which is provided on the workpiece conveyance hand, and has a second duct collection port facing the mounting surface of the table, wherein when the workpiece conveyance hand conveys the workpiece between the workpiece storage part and the table, the first cleaner part executes cleaning operation on the mounting surface of the table, and the second cleaner part executes the cleaning operation on the rear face of the workpiece.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a resin encapsulation device and a resin encapsulation method.

Background Art

[0002] In a resin encapsulation device that encapsulates an electronic component of a workpiece including a substrate and an electronic component with resin, a cleaning device may be provided to prevent contamination by particles (dust such as resin powder and foreign matter). For example, Patent Document 1 discloses a resin molding device including a press part having a mold for clamping a workpiece and a mold resin for resin encapsulation, and a cleaning device for cleaning the back surface of the workpiece conveyed to the press part.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, particles can not only directly adhere to the workpiece, but also once adhere to the part that contacts the workpiece in the device and then indirectly adhere to the workpiece. In addition, particles can adhere not only to the workpiece before resin encapsulation but also to the workpiece after resin encapsulation.

[0005] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a resin encapsulation device and a resin encapsulation method capable of suppressing the adhesion of particles and improving the quality of products.

Means for Solving the Problems

[0006] A resin encapsulation apparatus according to one aspect of the present invention is a resin encapsulation apparatus for encapsulating electronic components of a workpiece including a substrate and electronic components, comprising: a workpiece storage section for storing workpieces; a table having a mounting surface for placing workpieces; a workpiece transport hand for transporting workpieces between the workpiece storage section and the table; a first cleaner section provided between the workpiece storage section and the table, having a first dust collection port facing the back surface of the workpiece transported by the workpiece transport hand; and a second cleaner section provided on the workpiece transport hand, having a second dust collection port facing the mounting surface of the table, wherein when the workpiece transport hand transports a workpiece between the workpiece storage section and the table, the first cleaner section performs a cleaning operation on the back surface of the workpiece, and the second cleaner section performs a cleaning operation on the mounting surface of the table.

[0007] According to this embodiment, when transporting a workpiece between the workpiece storage section and the table, the underside of the workpiece and the table's mounting surface that contacts the underside of the workpiece can be cleaned simultaneously. Therefore, the adhesion of particles to the workpiece can be effectively suppressed, and the quality of the finished product can be improved.

[0008] In the above embodiment, the present invention further comprises a work supply unit for supplying workpieces before resin sealing, the work storage unit includes a supply storage unit for supplying workpieces before resin sealing in the work supply unit, and the work transport hand may include a first hand for placing workpieces supplied from the supply storage unit onto the mounting surface of the table.

[0009] In the above embodiment, the system further comprises a workpiece retrieval unit for retrieving the workpiece after resin sealing, the workpiece storage unit includes a retrieval storage unit for retrieving the workpiece after resin sealing in the workpiece retrieval unit, and the workpiece transport hand may include a second hand for acquiring the workpiece from the table's mounting surface for collection into the retrieval storage unit.

[0010] In the above embodiment, the system may further include a work supply unit for supplying workpieces before resin sealing, a work collection unit for collecting workpieces after resin sealing, and a transport mechanism for transporting workpieces using a table configured to be movable between the work supply unit and the work collection unit.

[0011] In the above embodiment, the conveying mechanism may further include a third cleaning unit provided on the movement path of the table, the third cleaning unit having a third dust collection port facing the side of the table's mounting surface, and when the table moves by the conveying mechanism, the third cleaning unit may perform a cleaning operation on the table's mounting surface.

[0012] Another aspect of the present invention relates to a resin encapsulation method using a resin encapsulation device for resin encapsulating an electronic component of a workpiece including a substrate and an electronic component, wherein the resin encapsulation device comprises a workpiece storage section for storing a workpiece, a table having a mounting surface for placing a workpiece, a workpiece transport hand for transporting a workpiece between the workpiece storage section and the table, a first cleaner section provided between the workpiece storage section and the table having a first dust collection port facing the back surface of the workpiece transported by the workpiece transport hand, and a second cleaner section provided on the workpiece transport hand having a second dust collection port facing the mounting surface of the table, and the resin encapsulation method includes a workpiece transport step in which the workpiece transport hand transports a workpiece between the workpiece storage section and the table, and a cleaning step in which the first cleaner section performs a cleaning operation on the back surface of the workpiece and the second cleaner section performs a cleaning operation on the mounting surface of the table.

[0013] According to this embodiment, when transporting a workpiece between the workpiece storage section and the table, the underside of the workpiece and the table's mounting surface that contacts the underside of the workpiece can be cleaned simultaneously. Therefore, the adhesion of particles to the workpiece can be effectively suppressed, and the quality of the finished product can be improved.

[0014] In the above embodiment, the work storage unit includes a supply storage unit for supplying workpieces before resin sealing in the work supply unit, and the work transport step may include placing the workpieces supplied from the supply storage unit onto the mounting surface of the table.

[0015] In the above embodiment, the work storage unit includes a recovery storage unit for recovering workpieces after resin sealing in the work recovery unit, and the work transport step may include taking the workpiece from the table's mounting surface for recovery in the recovery storage unit.

[0016] The above embodiment may further include the step of transporting the workpiece by a table configured to be movable between the workpiece supply unit and the workpiece retrieval unit. [Effects of the Invention]

[0017] According to the present invention, it is possible to provide a resin encapsulation apparatus and a resin encapsulation method that can suppress particle adhesion and improve the quality of the product. [Brief explanation of the drawing]

[0018] [Figure 1] This is a plan view of a resin encapsulation apparatus according to one embodiment of the present invention. [Figure 2] This is a partial cross-sectional view of the work supply unit shown in Figure 1. [Figure 3] This is a partial cross-sectional view of the workpiece retrieval unit shown in Figure 1. [Figure 4] This is a flowchart showing a part of a resin encapsulation method according to one embodiment of the present invention. [Figure 5] This is a flowchart showing a part of a resin encapsulation method according to one embodiment of the present invention. [Figure 6] This is a diagram illustrating a resin encapsulation method according to one embodiment of the present invention. [Figure 7] This is a diagram illustrating a resin encapsulation method according to one embodiment of the present invention. [Figure 8]It is a diagram for explaining a resin encapsulation method according to an embodiment of the present invention.

Embodiments for Carrying Out the Invention

[0019] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings of each embodiment are illustrative, and the dimensions and shapes of each part are schematic. The technical scope of the present invention should not be construed as being limited to the embodiments.

[0020] <Resin Encapsulation Device> With reference to FIGS. 1 and 2, the configuration of a resin encapsulation device 1 according to an embodiment of the present invention will be described. FIG. 1 is a plan view of a resin encapsulation device according to an embodiment of the present invention. FIG. 2 is a partial cross-sectional view of the work supply unit in FIG. 1, and FIG. 3 is a partial cross-sectional view of the work recovery unit in FIG. 1. For each of FIGS. 1 to 3, for the sake of clarifying the relationship between the respective drawings and assisting in understanding the positional relationship of each member, the directions of front, back, left, right, up, and down are arbitrarily assigned.

[0021] The resin encapsulation apparatus 1 is a manufacturing apparatus that produces a molded product M by molding resin R onto a workpiece W. The workpiece W includes a base material S and an electronic component P. The molded product M is the workpiece W in which the electronic component P is resin-encapsulated by resin R. The workpiece W corresponds to an example of a "workpiece before resin encapsulation" according to the present invention, and the molded product M corresponds to an example of a "workpiece after resin encapsulation" according to the present invention. In the following description, the back surface Wa of the workpiece W and the molded product M is the side opposite to the side on which the electronic component P is provided relative to the substrate S. The base material S is, for example, an interposer substrate, but is not limited thereto, and may be a lead frame, a carrier plate with an adhesive sheet, or a semiconductor substrate, etc. The electronic component P is, for example, a semiconductor element such as an IC chip, but is not limited thereto, and may be various active elements, passive elements, or MEMS devices, etc. The resin R is, for example, a granular thermosetting resin, but is not limited thereto, and may be in the form of powder, liquid, tablet, or sheet, etc. In this embodiment, as an example, resin R is molded onto the workpiece W and the functional member H. The functional member H is, for example, a plate-shaped member. The functional member H is provided so as to be exposed on the side opposite to the side where the base material S of the molded product M is exposed. The functional member H may be, for example, a heat dissipation member that releases heat generated by an electronic component P, a shielding member that shields electromagnetic waves, or a sheet-shaped resin member.

[0022] The resin encapsulation apparatus 1 according to this embodiment is a compression-type resin encapsulation apparatus (compression molding apparatus). As shown in Figure 1, the resin encapsulation apparatus 1 comprises a work supply unit 10, resin molding units 20 and 30, a resin supply unit 40, a functional component supply unit 50, a molded product recovery unit 90, a first transport mechanism 60, and a second transport mechanism 70.

[0023] The planar layout of the resin encapsulation apparatus 1 is not particularly limited, but in the example shown in Figure 1, the work supply unit 10, resin molding unit 20, resin supply unit 40, resin molding unit 30, and molded product recovery unit 90 are arranged in this order along the first transport mechanism 60 from left to right in Figure 1. Also, with respect to the first transport mechanism 60, the resin supply unit 41 is located at the rear and the functional component supply unit 50 is located at the front. The functional component supply unit 50 and the resin supply unit 40 are arranged in this order along the second transport mechanism 70 from front to back in Figure 1. Also, with respect to the second transport mechanism 70, the work supply unit 10 and resin molding unit 20 are located on the left side and the resin molding unit 30 and molded product recovery unit 90 are located on the right side.

[0024] The work supply unit 10 supplies workpieces W before resin encapsulation. The work supply unit 10 comprises a workpiece storage section 11, a workpiece transfer section 13, cleaner sections C11 and C12, a workpiece preheating section 15, and a work supply control panel 19. In the example planar layout shown in Figure 1, the workpiece storage section 11 and the workpiece transfer section 13 are located in front of the first transport mechanism 60, and the workpiece transfer section 13 is located between the workpiece storage section 11 and the first transport mechanism 60 in the front-rear direction. The workpiece preheating section 15 is located overlapping the first transport mechanism 60. The cleaner section C11 is located between the workpiece storage section 11 and the workpiece preheating section 15 in the front-rear direction. The cleaner section C12 is located overlapping the workpiece transfer section 13. The work supply control panel 19 is located on the front of the work supply unit 10.

[0025] The workpiece storage unit 11 is a supply storage unit for supplying workpieces W before resin sealing in the workpiece supply unit 10, and corresponds to an example of the "workpiece storage unit" according to the present invention. The workpiece storage unit 11 stores multiple workpieces W and sequentially feeds out the workpieces W. For example, the workpiece storage unit 11 includes multiple workpiece magazines WM and a workpiece elevation. Multiple workpieces W are stored in each of the multiple workpiece magazines WM so that they overlap. The workpiece elevation adjusts the position of the multiple workpiece magazines WM.

[0026] The workpiece transfer unit 13 transfers the workpiece W received from the workpiece storage unit 11 to the first table 61, which will be described later. For example, the workpiece transfer unit 13 includes a workpiece index unit and a pick-and-place hand 14 (first hand). The workpiece index unit receives the workpiece W sent out by the workpiece storage unit 11 and aligns it. The pick-and-place hand 14 is configured to be movable in the front-rear direction and transports the workpiece W between the workpiece storage unit 11 and the first table 61. The pick-and-place hand 14 corresponds to an example of a "workpiece transport hand" according to the present invention. As shown in Figure 2, the pick-and-place hand 14 acquires the workpiece W from the workpiece index unit, moves backward while holding the workpiece W, and places the workpiece W on the mounting surface 61a of the first table 61.

[0027] The cleaner unit C11 performs a cleaning operation on the back surface Wa of the workpiece W when the pick-and-place hand 14 transports the workpiece W between the workpiece storage unit 11 and the first table 61. The cleaner unit C11 is located between the first table 61 and the workpiece storage unit 11 when the pick-and-place hand 14 transports the workpiece W. In other words, the cleaner unit C11 is positioned so as to overlap with the movement path of the pick-and-place hand 14 in the planar layout. As shown in Figure 2, the cleaner unit C11 has a dust collection port D11 (an example of a first dust collection port). The dust collection port D11 faces the side of the back surface Wa of the workpiece W. The dust collection port D11 is configured to suck up and remove particles adhering to the back surface Wa of the workpiece W when the pick-and-place hand 14 transports the workpiece W. The cleaner unit C11 corresponds to an example of the "first cleaner unit" according to the present invention.

[0028] The cleaner unit C12 performs a cleaning operation on the mounting surface 61a of the first table 61 when the pick-and-place hand 14 transports the workpiece W between the workpiece storage unit 11 and the first table 61. The cleaner unit C12 is located at the front-to-back end of the pick-and-place hand 14 and is positioned behind the workpiece W when the pick-and-place hand 14 is holding the workpiece W. As shown in Figure 2, the cleaner unit C12 has a dust collection port D12 (an example of a second dust collection port). The dust collection port D12 faces the side of the mounting surface 61a of the first table 61. The dust collection port D12 is configured to suck up and remove particles adhering to the mounting surface 61a of the first table 61 when the pick-and-place hand 14 transports the workpiece W. The cleaner unit C12 corresponds to an example of the "second cleaner unit" according to the present invention.

[0029] The workpiece preheating unit 15 preheats the workpiece W received from the workpiece transfer unit 13. Preheating the workpiece W before it is transported to the resin molding units 20 and 30 suppresses deformation of the workpiece W due to rapid temperature changes. The workpiece preheating unit 15 is equipped with a preheating heater that heats the workpiece W placed on the mounting surface 61a of the stage 61. The preheating heater is, for example, a hot air heater or an infrared heater. The preheating heater is positioned, for example, to heat the workpiece W from above. The preheating heater is not limited to the above, and may heat the workpiece W from the front-to-back direction or from the left-to-right direction, or may be built into the stage 61. When the preheating heater is built into the stage 61, the preheating of the workpiece W may be performed while it is being transported by the first transport mechanism 60. From the viewpoint of suppressing the impact of the preheating heater on the surrounding environment and reducing heat loss, the workpiece preheating unit 15 may be equipped with a cover that surrounds the preheating heater. Alternatively, the workpiece preheating unit 15 may be omitted, and the workpiece W may not be preheated. In this case, the time from when the workpiece W is transported to the resin molding units 20 and 30 until the start of loading the resin R and functional members H into the resin molding units 20 and 30 or the start of mold closing may be controlled.

[0030] The work supply control panel 19 controls the operation of the work supply unit 10. For example, the work supply control panel 19 includes a display unit that displays the control parameters of the work supply unit 10 and an input unit that inputs the control parameters of the work supply unit 10. Alternatively, for example, the work supply control panel 19 may integrate display units that display the control parameters of the molded product recovery unit 90, resin supply unit 40, functional component supply unit 50, first transport mechanism 60, and second transport mechanism 70, as described later, and input units that input these control parameters.

[0031] The work supply unit 10 may further include a volume measuring unit for measuring the volume of the workpiece W, and an appearance inspection unit for inspecting the appearance of the workpiece W.

[0032] The molded product recovery unit 90 recovers the molded product M corresponding to the workpiece W after resin encapsulation. The molded product recovery unit 90 corresponds to an example of the "workpiece recovery unit" according to the present invention. The molded product recovery unit 90 includes a molded product heat removal unit 91, a molded product transfer unit 93, cleaner units C91 and C92, and a molded product storage unit 95. In the example of the planar layout shown in Figure 1, the molded product transfer unit 93 and the molded product storage unit 95 are located in front of the first transport mechanism 60, and the molded product transfer unit 93 is located between the molded product storage unit 95 and the first transport mechanism 60 in the front-rear direction. The molded product heat removal unit 91 is located overlapping the first transport mechanism 60. The cleaner unit C91 is located between the molded product storage unit 95 and the molded product heat removal unit 91 in the front-rear direction. The cleaner unit C92 is located overlapping the molded product transfer unit 93.

[0033] The molded product heat removal unit 91 removes heat from the molded product M that is to be handed over to the molded product transfer unit 93. The molded product heat removal unit 91 is equipped with a heat removal cooler that cools the molded product M placed on the mounting surface 62a of the stage 62, which will be described later. The heat removal cooler is, for example, an air-cooled cooling device or a Peltier-type cooling device. The heat removal cooler is, for example, positioned to cool the molded product M from above. The heat removal cooler is not limited to the above, and the molded product M may be cooled from the front-rear direction or the left-right direction, or it may be built into the stage 62. When the heat removal cooler is built into the stage 62, the heat removal of the molded product M may be performed while it is being transported by the first transport mechanism 60. Note that the molded product M may be cooled by natural cooling without the molded product heat removal unit 91, or the molded product M may not be heated at all.

[0034] The molded product transfer unit 93 transfers the molded product M received from the molded product heat removal unit 91 to the molded product storage unit 95. For example, the molded product transfer unit 93 includes a pick-and-place hand 94 (second hand) and a feed-out unit. The pick-and-place hand 94 is configured to be movable in the front-rear direction and transports the molded product M between the molded product storage unit 95 and the second table 62. The pick-and-place hand 94 corresponds to an example of a "workpiece transport hand" according to the present invention. As shown in Figure 3, the pick-and-place hand 94 acquires the molded product M from the mounting surface 62a of the second table 62, moves forward while holding the molded product M, and places the molded product M on the feed-out unit. The feed-out unit aligns the molded product M received from the pick-and-place hand 94 and sends it to the molded product storage unit 95.

[0035] The cleaner unit C91 performs a cleaning operation on the back surface Wa of the molded product M when the pick-and-place hand 94 transports the molded product M between the molded product storage unit 95 and the second table 62. The cleaner unit C91 is located between the second table 62 and the molded product storage unit 95 when the pick-and-place hand 94 transports the molded product M. In other words, the cleaner unit C91 is positioned so as to overlap with the movement path of the pick-and-place hand 94 in the planar layout. As shown in Figure 3, the cleaner unit C91 has a dust collection port D91 (an example of a first dust collection port). A dust collection port D92 (an example of a second dust collection port) faces the side of the back surface Wa of the molded product M. The dust collection port D91 is configured to suck up and remove particles adhering to the back surface Wa of the molded product M when the pick-and-place hand 94 transports the molded product M. The cleaner unit C91 corresponds to an example of the "first cleaner unit" according to the present invention.

[0036] The cleaner unit C92 performs a cleaning operation on the mounting surface 62a of the second table 62 when the pick-and-place hand 94 transports the molded product M between the molded product storage unit 95 and the second table 62. The cleaner unit C92 is located at the front-to-back end of the pick-and-place hand 94 and is positioned behind the molded product M when the pick-and-place hand 94 is holding the molded product M. As shown in Figure 3, the cleaner unit C92 has a dust collection port D92. The dust collection port D92 faces the side of the mounting surface 62a of the second table 62. The dust collection port D92 is configured to suck up and remove particles adhering to the mounting surface 62a of the second table 62 when the pick-and-place hand 94 transports the molded product M. The cleaner unit C92 corresponds to an example of the "second cleaner unit" according to the present invention.

[0037] The molded product storage section 95 is a recovery storage section for recovering the workpiece W after resin sealing in the molded product recovery unit 90, and corresponds to an example of the "workpiece storage section" according to the present invention. For example, the molded product storage section 95 comprises a plurality of molded product magazines MM and a molded product elevation. A plurality of molded products M are stored in each of the plurality of molded product magazines so as to overlap. The molded product elevation adjusts the position of the molded product magazines MM.

[0038] The molded product recovery unit 90 may further include a volume measuring unit for measuring the volume of the molded product M, and an appearance inspection unit for inspecting the appearance of the molded product M.

[0039] The resin molding unit 20 molds resin R onto the workpiece W and functional member H. The resin molding unit 20 comprises a resin encapsulation mold 21, a press loader 23, a film handler 27, and a resin molding control panel 29. In the example planar layout shown in Figure 1, the resin encapsulation mold 21 is located in front of the first transport mechanism 60, and the film handlers 27 are located to the left and right of the resin encapsulation mold 21. The resin molding control panel 29 is located in front of the resin molding unit 20.

[0040] The resin encapsulation mold 21 comprises a pair of openable and closable lower and upper molds that seal electronic components P by heating and curing resin R in the cavity 25 inside. The resin encapsulation mold 21 is, as an example, a compression molding mold with a so-called movable upper cavity structure. Specifically, the lower mold has a flat surface on the side facing the upper mold on which the workpiece W is placed, and the upper mold has a concave surface on the side facing the lower mold that forms the cavity 25. The resin encapsulation mold 21 may also be a compression molding mold with a movable lower cavity structure.

[0041] The press loader 23 is configured to move in the front-rear direction and transports the workpiece W between the first table 61 and the resin encapsulation mold 21, and transports the molded product M between the second table 62 and the resin encapsulation mold 21. Specifically, the press loader 23 acquires the workpiece W from the first table 61, moves forward while holding the workpiece W to load the workpiece W into the resin encapsulation mold 21, delivers the workpiece W to the resin encapsulation mold 21, moves backward to exit the resin encapsulation mold 21. The press loader 23 also enters the resin encapsulation mold 21 from the rear, acquires the molded product M from the resin encapsulation mold 21, moves backward while holding the molded product M to unload the molded product M from the resin encapsulation mold 21, and delivers it to the second table 62. The movement path of the press loader 23 intersects with the movement path of the first transport mechanism 60.

[0042] The film handler 27 supplies film to the resin encapsulation mold 21. The film is a release film that prevents resin R from entering the gaps in the cavity 25 and facilitates the peeling of the molded product M from the cavity 25. The film handler 27 handles, for example, roll-shaped film and includes an unwinding section for supplying unused film and a winding section for collecting used film. As the film material, polymer materials with excellent heat resistance, ease of peeling, flexibility, and stretchability can be used, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene-ethylene copolymer), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), PET (polyethylene terephthalate), PP (polypropylene), and PVDC (polyvinylidine chloride). The thickness of the film is suitably selected according to the physical properties of the material, and is approximately 50 μm as an example. The shape of the film is not limited to roll shape, but may also be in strip shape.

[0043] The resin molding control panel 29 controls the operation of the resin molding unit 20. For example, the resin molding control panel 29 includes a display unit that displays the control parameters of the resin molding unit 20 and an input unit that inputs the control parameters of the resin molding unit 20.

[0044] The resin molding unit 30 comprises a resin encapsulation mold 31 with a cavity 35, a press loader 33, a film handler 37, and a resin molding control panel 39. Details of the resin encapsulation mold 31, press loader 33, film handler 37, and resin molding control panel 39 will be omitted in the following description, but configurations similar to those described for the resin molding unit 20 can be applied.

[0045] Furthermore, at least some of the functions of the resin molding control panels 29 and 39 may be integrated into the work supply control panel 19. For example, the control parameters of the resin molding units 20 and 30 may be displayed on the display unit of the work supply control panel 19, or the control parameters of the resin molding units 20 and 30 may be input into the input unit of the work supply control panel 19. If all the functions of the control panels of each unit are integrated into the work supply control panel 19, the resin molding control panels 29 and 39 may be omitted.

[0046] The resin supply unit 40 supplies resin R. The resin supply unit 40 includes a resin supply section 41. In the example of the planar layout shown in Figure 1, the resin supply section 41 is located behind the first transport mechanism 60.

[0047] The resin supply unit 41 supplies resin R to the resin loader 71, which will be described later. The resin supply unit 41 includes, for example, a hopper, a feeder, and a flow rate control valve. The hopper stores the resin R, the feeder sends the resin R from the hopper to the resin loader 71, and the flow rate control valve adjusts the amount of resin R supplied to the resin loader 71. If the resin is liquid, the resin supply unit may also include a syringe for storing the resin, a piston for pushing out the resin, a servo motor for driving the piston, and a pinch valve for opening and closing the tip of the syringe.

[0048] The resin supply unit 40 may further include a weight measuring unit for measuring the weight of the resin R, a resin preheating unit for preheating the resin R, a resin guard used as a frame surrounding the resin R, a vibration unit for dispersing the resin R by vibration, and an inspection unit for inspecting the degree of dispersion of the resin R.

[0049] The functional component supply unit 50 supplies the functional component H. The functional component supply unit 50 comprises a functional component storage section 51 and a functional component transfer section 53. In the example of the planar layout shown in Figure 1, the functional component transfer section 53 is located behind the functional component storage section 51.

[0050] The functional component storage unit 51 supplies functional components to the resin loader 71. The functional component storage unit 51 stores multiple functional components H and sequentially feeds out the functional components H. For example, the functional component storage unit 51 comprises multiple functional component magazines and a functional component elevation. Multiple functional components are stored in each of the multiple functional component magazines so that they overlap. The functional component elevation adjusts the position of the multiple functional component magazines.

[0051] The functional component transfer unit 53 transfers the functional component H received from the functional component storage unit 51 to the resin loader 71. For example, the functional component transfer unit 53 includes a functional component index unit and a functional component pick-and-place hand. The functional component index unit receives the functional component H sent out by the functional component storage unit 51 and aligns it. The functional component pick-and-place hand is configured to be movable in the front-rear direction and transports the workpiece W between the functional component storage unit 51 and the resin loader 71. The functional component pick-and-place hand retrieves the functional component from the functional component index unit, moves backward while holding the functional component, and places the functional component on the resin loader 71.

[0052] The functional component supply unit 50 may further include a volume measuring unit for measuring the volume of the functional component H, an appearance inspection unit for inspecting the appearance of the functional component H, and a functional component preheating unit for preheating the functional component H.

[0053] The first conveying mechanism 60 conveys the workpiece W or molded product M between units. The first conveying mechanism 60 comprises a first table 61, a second table 62, a first linear conveyor 60R, and cleaner sections C61 and 62.

[0054] The first table 61 is configured to be movable between the work supply unit 10 and the work collection unit 90. In the example planar layout shown in Figure 1, the first table 61 moves between position P13 in the work supply unit 10 and position P33 in the resin molding unit 30. The first table 61 has a mounting surface 61a for placing workpieces W. The first table 61 transports workpieces W from the work supply unit 10 to the resin molding unit 20 or the resin molding unit 30. Specifically, the first table 61 receives workpieces W at position P13 in the work supply unit 10 and delivers workpieces W at position P23 in the resin molding unit 20 or position P33 in the resin molding unit 30.

[0055] The second table 62 is configured to be movable between the work supply unit 10 and the work recovery unit 90. In the example planar layout shown in Figure 1, the second table 62 moves between position P33 in the resin molding unit 30 and position P93 in the work recovery unit 90. The second table 62 has a mounting surface 62a for placing molded products M. The second table 62 transports the molded products M from the resin molding unit 20 or the resin molding unit 30 to the molded product recovery unit 90. Specifically, the second table 62 picks up the molded products M at position P23 in the resin molding unit 20 or position P33 in the resin molding unit 30, and delivers the molded products M at position P93 in the molded product recovery unit 90.

[0056] The first linear conveyor 60R moves the first table 61 and the second table 62 in the left-right direction. The first linear conveyor 60R extends in the left-right direction across the work supply unit 10, the resin molding unit 20, the resin supply unit 40, the resin molding unit 30, and the molded product recovery unit 90. The first linear conveyor 60R corresponds to the movement path of the first table 61 and the second table 62.

[0057] The cleaner unit C61 performs a cleaning operation on the mounting surface 61a of the first table 61 when the first table 61 is moved by the first transport mechanism 60. The cleaner unit C61 is located on the movement path of the first table 61 in the first transport mechanism 60. In the example of the planar layout shown in Figure 1, the cleaner unit C61 is located between position P13 and position P23. The cleaner unit C61 cleans the mounting surface 61a of the first table 61 as it moves to receive the next workpiece W after having delivered the previous one. As shown in Figure 2, the cleaner unit C61 has a dust collection port D61 (third dust collection port). The dust collection port D61 faces the side of the mounting surface 61a of the first table 61. The dust collection port D61 is configured to suck up and remove particles adhering to the mounting surface 61a of the first table 61 when the first table 61 moves from position P23 or position P33 to position P13. The cleaner section C61 corresponds to an example of the "third cleaner section" according to the present invention.

[0058] In the example of the planar layout shown in Figure 1, the cleaner unit C61 is located within the work supply unit 10. However, it may also be located within the resin molding unit 20 between positions P13 and P23. The cleaner unit C61 may also be vertically movable, and the gap between the cleaner unit C61 and the mounting surface 61a of the first table 61 when the workpiece W is being transported and when it is empty may be adjusted to improve dust collection efficiency. Furthermore, dust may be collected from the upper surface of the workpiece W when the workpiece W is being transported. In this case, the workpiece W may be able to be attracted to the mounting surface 61a of the first table 61.

[0059] The cleaner unit C62 performs a cleaning operation on the mounting surface 62a of the second table 62 when the second table 62 is moved by the first transport mechanism 60. The cleaner unit C62 is located on the movement path of the second table 62 in the first transport mechanism 60. In the example planar layout shown in Figure 1, the cleaner unit C62 is located between position P33 and position P93. The cleaner unit C62 cleans the mounting surface 62a of the second table 62 as it moves to receive the next molded product M after the previous one has been delivered. As shown in Figure 3, the cleaner unit C62 has a dust collection port D62. The dust collection port D62 faces the side of the mounting surface 62a of the second table 62. The dust collection port D62 is configured to suck up and remove particles adhering to the mounting surface 62a of the second table 62 when the second table 62 moves from position P93 to position P23 or position P33. The cleaner section C62 corresponds to an example of the "third cleaner section" according to the present invention.

[0060] In the example of the planar layout shown in Figure 1, the cleaner unit C62 is located within the molded product recovery unit 90. However, it may also be located within the resin molding unit 30 between positions P33 and P93. The cleaner unit C62 may also be vertically movable, and the gap between the cleaner unit C62 and the mounting surface 62a of the second table 62 when the molded product M is being transported and when it is empty may be adjusted to improve dust collection efficiency. Furthermore, dust may be collected from the upper surface of the molded product M when the molded product M is being transported. In this case, the molded product M may be able to adhere to the mounting surface 62a of the second table 62.

[0061] The second conveying mechanism 70 conveys the resin R and the resin supply unit 41. The second conveying mechanism 70 includes a resin loader 71 and a second linear conveyor 70R.

[0062] The resin loader 71 is configured to be movable between the resin supply unit 40 and the functional component supply unit 50. The resin loader 71 transports the resin R from the resin supply unit 40 to the resin molding unit 20 or the resin molding unit 30. The resin loader 71 also transports the functional component H from the functional component supply unit 50 to the resin molding unit 20 or the resin molding unit 30. Although not shown in the figures, the resin loader 71 includes a holding mechanism for holding the resin R and the functional component H, a pivoting mechanism for rotating between positions P1, P2, and P3, and a reciprocating mechanism for moving forward and backward relative to the pivoting starting point.

[0063] The second linear conveyor 70R moves the resin loader 71 in the front-rear direction. The second linear conveyor 70R extends in the front-rear direction across the resin supply unit 40 and the functional component supply unit 50. The second linear conveyor 70R corresponds to the movement path of the resin loader 71.

[0064] In the example of the planar layout shown in Figure 1, the resin loader 71 receives the resin R from the resin supply unit 41 and then moves to position P1 in front of the first linear conveyor 60R via the second linear conveyor 70R. Next, the resin loader 71 moves to position P2 behind the functional member transfer unit 53 via a swivel mechanism. Next, the resin loader 71 moves to the functional member transfer unit 53 via a reciprocating mechanism, receives the functional member H, and then moves back to position P2 via the reciprocating mechanism. Next, the resin loader 71 moves to position P3 to the right of the resin encapsulation mold 21 via a swivel mechanism. Next, the resin loader 71 enters the resin encapsulation mold 21 via a reciprocating mechanism and delivers the resin R and functional member H into the resin encapsulation mold 21. After delivering the resin R and functional member H to the resin encapsulation mold 21, the resin loader 71 exits the resin encapsulation mold 21 via a reciprocating mechanism and moves back to position P3.

[0065] The second transport mechanism 70 operates with respect to the resin encapsulation mold 31 of the resin molding unit 30 in the same way as it operates with respect to the resin encapsulation mold 21 of the resin molding unit 20. Therefore, the description of the operation of the first transport mechanism 60 and the second transport mechanism 70 with respect to the resin encapsulation mold 31 is omitted. However, the operation of the second transport mechanism 70 with respect to the resin encapsulation mold 31 is the reverse of the operation of the second transport mechanism 70 with respect to the resin encapsulation mold 21. <Method of resin encapsulation>

[0066] Next, a resin sealing method using the resin sealing apparatus 1 will be described with reference to Figures 4 to 8. Figures 4 and 5 are flowcharts showing a part of the resin sealing method according to one embodiment of the present invention. Figures 6 to 8 are diagrams illustrating the resin sealing method according to one embodiment of the present invention. In the following, the resin sealing method when resin sealing is performed using the resin molding unit 20 will be described as an example. The resin sealing method when resin sealing is performed using the resin molding unit 30 is similar and will therefore not be described.

[0067] First, the first table 61 is moved to the work supply unit 10 (S110). The first table 61, with its mounting surface 61a empty, is moved by the linear conveyor 60R and stopped at position P13.

[0068] Next, the workpiece W is transported to the first table 61 while a cleaning operation is performed (S120). That is, step S120 includes a workpiece transport step and a cleaning step which are performed simultaneously. As shown in Figure 6, in the cleaning step of step S120, the cleaner unit C11 performs a cleaning operation on the back surface Wa of the workpiece W, and the cleaner unit C12 performs a cleaning operation on the mounting surface 61a of the first table 61. Specifically, first, the workpiece W taken out of the workpiece storage unit 11 is aligned with the workpiece index unit of the workpiece transfer unit 13. Next, the pick-and-place hand 14 retrieves the workpiece W from the workpiece index unit and moves the pick-and-place hand 14 toward the first table 61. As the pick-and-place hand 14 holding the workpiece W moves, the dust collection port D11 of the cleaner unit C11 sucks up and removes particles adhering to the back surface Wa of the workpiece W as it passes above the cleaner unit C11, and the dust collection port D12 of the cleaner unit C12 sucks up and removes particles adhering to the mounting surface 61a of the first table 61 as it passes above the first table 61.

[0069] Next, the workpiece W is placed on the first table 61 (S130), and the workpiece W is preheated (S140). The pick-and-place hand 14 holding the workpiece W is moved to the placement surface 61a of the first table 61, and the workpiece W is released from the pick-and-place hand 14. The now-empty pick-and-place hand 14 moves from the placement surface 61a of the first table 61 towards the workpiece storage section 11. The workpiece W is heated on the placement surface 61a of the first table 61.

[0070] Next, the first table 61 is moved to the resin molding unit 20 (S150). The first table 61, on which the workpiece W is placed, is moved by the linear conveyor 60R and stopped at position P23.

[0071] Next, the workpiece W is loaded into the resin encapsulation mold 21 (S160). First, the press loader 23 retrieves the workpiece W from the first table 61. Next, the press loader 23, holding the workpiece W, enters the resin encapsulation mold 21. Next, the workpiece W is released from the press loader 23 inside the resin encapsulation mold 21, and the empty press loader 23 exits the resin encapsulation mold 21.

[0072] Next, the workpiece W is resin-encapsulated (S170). First, the resin R and functional component H are loaded into the resin encapsulation mold 21 by the resin loader 71. Next, the heated resin encapsulation mold 21 is clamped, and the resin R is heated and compressed. As a result, the resin R is molded into the shape of the cavity 25, and the electronic component P of the workpiece W is resin-encapsulated.

[0073] Next, the cleaning operation is performed while moving the first table 61 (S180). First, the first table 61, with an empty mounting surface 61a, is moved by the linear conveyor 60R. The first table 61 moves from position P23 to position P13. As shown in Figure 7, in the cleaning operation in step S180, the cleaner unit C61 performs a cleaning operation on the mounting surface 61a of the first table 61. Specifically, while the first table 61, with an empty mounting surface 61a, is moving, the dust collection port D61 of the cleaner unit C61 sucks up and removes particles adhering to the mounting surface 61a of the first table 61 as it passes below the cleaner unit C61.

[0074] Next, the second table 62 is moved to the resin molding unit 20 (S210). The second table 62, with its mounting surface 62a empty, is moved by the linear conveyor 60R and stopped at position P23.

[0075] Next, the molded product M is removed from the resin encapsulation mold 21 and placed on the second table 62 (S220). First, the press loader 23 is inserted into the resin encapsulation mold 21 after the molded product M is completed and the mold has been opened. Next, the press loader 23 retrieves the molded product M from the resin encapsulation mold 21. Next, the press loader 23, holding the molded product M, is removed from the resin encapsulation mold 21. The molded product M is released from the press loader 23 on the mounting surface 62a of the second table 62.

[0076] Next, the second table 62 is moved to the molded product recovery unit 90 (S230). The second table 62, on which the molded product M is placed, is moved by the linear conveyor 60R and stopped at position P93.

[0077] Next, the molded product M is retrieved from the second table 62 (S240). First, an empty pick-and-place hand 94 is moved onto the mounting surface 62a of the second table 62. Then, the pick-and-place hand 94 is used to retrieve the molded product M from the mounting surface 62a of the second table 62.

[0078] Next, a cleaning operation is performed while the molded product M is transported from the second table 62 (S250). That is, step S250 includes a molded product transport step and a cleaning step, which are performed simultaneously. As shown in Figure 8, in the cleaning step of step S250, the cleaner unit C91 performs a cleaning operation on the back surface Wa of the molded product M, and the cleaner unit C92 performs a cleaning operation on the mounting surface 62a of the second table 62. Specifically, while the pick-and-place hand 94 holding the molded product M is moving, the dust collection port D91 of the cleaner unit C91 sucks up and removes particles adhering to the back surface Wa of the molded product M as it passes above the cleaner unit C91, and the dust collection port D92 of the cleaner unit C92 sucks up and removes particles adhering to the mounting surface 62a of the second table 62 as it passes above the second table 62.

[0079] Next, the molded product M is collected into the molded product storage section 95 (S260). First, at the feed-out section of the molded product transfer section 93, the molded product M, whose back surface Wa has been cleaned, is released from the pick-and-place hand 94. Next, the molded product M, which has been aligned at the feed-out section, is stored in the molded product magazine MM of the molded product storage section 95.

[0080] Next, the cleaning operation is performed while the second table 62 is moved (S270). Similar to step S180, while the second table 62 is moving with an empty mounting surface 62a, the cleaner unit C62 performs a cleaning operation on the mounting surface 62a of the second table 62. Specifically, while the second table 62 is moving with an empty mounting surface 62a, the dust collection port D62 of the cleaner unit C62 sucks up and removes particles adhering to the mounting surface 62a of the second table 62 as it passes below the cleaner unit C62.

[0081] As described above, the resin sealing apparatus 1 according to one aspect of the present invention comprises a work storage section 11 for storing a workpiece W, a first table 61 having a mounting surface 61a for placing the workpiece W, a pick-and-place hand 14 for transporting the workpiece W between the work storage section 11 and the first table 61, a cleaner section C11 provided between the work storage section 11 and the first table 61 having a dust collection port D11 facing the back surface Wa of the workpiece W transported by the pick-and-place hand 14, and a cleaner section C12 provided on the pick-and-place hand 14 having a dust collection port D12 facing the mounting surface 61a of the first table 61. When the pick-and-place hand 14 transports the workpiece W between the work storage section 11 and the first table 61, the cleaner section C11 performs a cleaning operation on the back surface Wa of the workpiece W, and the cleaner section C12 performs a cleaning operation on the mounting surface 61a of the first table 61.

[0082] According to this, when transporting the workpiece W between the workpiece storage section 11 and the first table 61, the back surface Wa of the workpiece W and the mounting surface 61a of the first table 61 that comes into contact with the back surface Wa of the workpiece W can be cleaned simultaneously. Therefore, the adhesion of particles to the workpiece W can be effectively suppressed, and the quality of the product can be improved.

[0083] Furthermore, the resin sealing device 1 includes a molded product storage section 95 for storing molded products M, a second table 62 having a mounting surface 62a for placing molded products M, a pick-and-place hand 94 for transporting molded products M between the molded product storage section 95 and the second table 62, and a cleaner section C91 provided between the molded product storage section 95 and the second table 62, the cleaner section C91 having a dust collection port D91 facing the back surface Wa of the molded product M transported by the pick-and-place hand 94. The pick-and-place hand 94 is provided with a cleaner unit C92 which has a dust collection port D92 facing the mounting surface 62a of the second table 62. When the pick-and-place hand 94 transports a molded product M between the molded product storage unit 95 and the second table 62, the cleaner unit C91 performs a cleaning operation on the back surface Wa of the molded product M, and the cleaner unit C92 performs a cleaning operation on the mounting surface 62a of the second table 62.

[0084] According to this, when transporting the molded product M between the molded product storage section 95 and the second table 62, the back surface Wa of the molded product M and the mounting surface 62a of the second table 62 that comes into contact with the back surface Wa of the molded product M can be cleaned simultaneously. Therefore, the adhesion of particles to the molded product M can be effectively suppressed, and the quality of the product can be improved.

[0085] In one embodiment described above, the resin encapsulation device 1 may further include a first conveying mechanism 60 having a first table 61 and a second table 62 configured to be movable between a work supply unit 10 and a molded product recovery unit 90, the first table 61 conveying the workpiece W and the second table 62 conveying the molded product M.

[0086] In one embodiment described above, the resin sealing device 1 further comprises a cleaner unit C61 provided on the movement path of the first table 61 in the first transport mechanism 60, the cleaner unit C61 having a dust collection port D61 facing the mounting surface 61a of the first table 61, and when the first table 61 is moved by the first transport mechanism 60, the cleaner unit C61 may perform a cleaning operation on the mounting surface 61a of the first table 61, or the cleaner unit C61 may further perform a cleaning operation on the upper surface of the workpiece W.

[0087] According to this, particle adhesion to the workpiece W can be further suppressed, leading to a further improvement in the quality of the product.

[0088] In one embodiment described above, the resin sealing device 1 further comprises a cleaner unit C62 provided on the movement path of the second table 62 in the first transport mechanism 60, the cleaner unit C62 having a dust collection port D62 facing the mounting surface 62a of the second table 62, and when the second table 62 is moved by the first transport mechanism 60, the cleaner unit C62 may perform a cleaning operation on the mounting surface 62a of the second table 62, or the cleaner unit C62 may further perform a cleaning operation on the upper surface of the molded product M.

[0089] According to this, it is possible to further suppress the adhesion of particles to the molded product M and to further improve the quality of the product.

[0090] A resin sealing method using a resin sealing apparatus 1 according to another aspect of the present invention includes a work transport step in which a pick-and-place hand 14 transports a workpiece W between a workpiece storage unit 11 and a first table 61, a cleaning step in which a cleaner unit C11 performs a cleaning operation on the back surface Wa of the workpiece W, and a cleaner unit C12 performs a cleaning operation on the mounting surface 61a of the first table 61.

[0091] According to this, when transporting the workpiece W between the workpiece storage section 11 and the first table 61, the back surface Wa of the workpiece W and the mounting surface 61a of the first table 61 that comes into contact with the back surface Wa of the workpiece W can be cleaned simultaneously. Therefore, the adhesion of particles to the workpiece W can be effectively suppressed, and the quality of the product can be improved.

[0092] Furthermore, the resin sealing method using the resin sealing device 1 includes a molded product transport step in which a pick-and-place hand 94 transports the molded product M between the molded product storage section 95 and the second table 62, a cleaning step in which a cleaner section C91 performs a cleaning operation on the back surface Wa of the molded product M, and a cleaning section C92 performs a cleaning operation on the mounting surface 62a of the second table 62.

[0093] According to this, when transporting the molded product M between the molded product storage section 95 and the second table 62, the back surface Wa of the molded product M and the mounting surface 62a of the second table 62 can be cleaned simultaneously. Therefore, the adhesion of particles to the molded product M can be effectively suppressed, and the quality of the product can be improved.

[0094] In one embodiment described above, the resin encapsulation method may further include the step of transporting a workpiece W using a first table 61 configured to be movable between a workpiece supply unit 10 and a molded product recovery unit 90, and may further include the step of transporting a molded product M using a second table 62 configured to be movable between a workpiece supply unit 10 and a molded product recovery unit 90.

[0095] In this embodiment, the resin encapsulation device 1 has cleaner sections C11 and C12 as a workpiece cleaning mechanism in the workpiece supply unit 10, and cleaner sections C91 and C92 as a molded product cleaning mechanism in the molded product recovery unit 90. However, either one of the cleaning mechanisms may be omitted. For example, if the resin encapsulation device has a workpiece supply cleaning mechanism, the molded product cleaning mechanism may be omitted. Conversely, if the resin encapsulation device has a molded product cleaning mechanism, the workpiece supply cleaning mechanism may be omitted. However, it is desirable that the resin encapsulation device has at least a workpiece supply cleaning mechanism.

[0096] The resin sealing device may include a cleaning section on the movement paths of both the first and second tables in the first transport mechanism, i.e., between position P23 and position P33. This cleaning section is configured in the same way as the cleaning sections C61 and C62 according to this embodiment. This cleaning section can clean the mounting surfaces of both the first and second tables.

[0097] In this embodiment, each cleaner unit may further include, in addition to the dust collection port, a brush, an anti-static blower, an air blower, or a radiating unit that emits ultrasonic waves. The brush is provided so that its tip contacts the mounting surface 61a, 62a or the back surface Wa (hereinafter referred to as the "cleaning surface") to be cleaned, and is configured to peel off particles adhering to the cleaning surface. Preferably, the brush is an anti-static brush made of a material capable of removing static electricity. This makes it easier to peel off particles electrostatically attached to the cleaning surface by removing static electricity, and also makes it difficult for particles to electrostatically adhere to the cleaning surface because the cleaning surface is statically discharged. The anti-static blower is configured to blow ionic air onto the cleaning surface to remove static electricity. This provides the same effect as the anti-static brush. The air blower is configured to blow air onto the cleaning surface to blow away particles. Alternatively, for example, ultrasonic waves may be emitted from the radiating unit to lift and remove dust.

[0098] In this embodiment, the first transport mechanism 60 includes a first table 61 for supplying workpieces and a second table 62 for collecting molded products, but is not limited to this. The first transport mechanism may also include a single table that serves both the workpiece supply and molded product collection purposes.

[0099] In this embodiment, a resin supply unit 40 is provided between the resin molding unit 20 and the resin molding unit 30, but either the resin molding unit 20 or the resin molding unit 30 may be omitted. That is, one resin supply unit may supply resin to one resin molding unit. Furthermore, there may be three or more resin molding units, and two or more resin supply units. For example, two resin molding units and a resin supply unit provided between the two resin molding units to supply resin to the two resin molding units may be considered as one unit group, and multiple unit groups may be arranged side by side in the left-right direction.

[0100] In this embodiment, the second transport mechanism 70 simultaneously transports both the resin R and the functional member H into the resin encapsulation mold 21, but is not limited to this. The second transport mechanism may transport one of the resin or the functional member first, and then the other. Furthermore, the mechanism for rotating the resin loader in the second transport mechanism may be omitted.

[0101] In this embodiment, the transport of workpieces W in the left-right direction between units is performed by the first table 61, and the transport of workpieces W in the front-rear direction in the resin molding units 20 and 30 is performed by press loaders 23 and 33, but the embodiment is not limited to this. For example, the first transport mechanism may be configured to have press loaders movable between units instead of the first table, and the workpiece preheating section may have a fixed heating stage. In this case, the workpieces are taken from the workpiece preheating section by the press loaders, transported to the resin molding unit by the press loaders, and loaded into the resin sealing mold by the press loaders in the resin molding unit. Similarly, the first transport mechanism may be configured to have press unloaders movable between units instead of the second table.

[0102] The resin molding units 20 and 30 according to this embodiment are compression molding units having compression-type molding resin sealing molds 21 and 31 with a movable cavity structure. However, they may also be transfer molding units having transfer-type molding resin sealing molds equipped with a mechanism for pressurized injection of resin into a fixed-capacity cavity. Furthermore, although this embodiment is described assuming a compression molding apparatus with a movable upper cavity, it may also be applied to a compression molding apparatus with a movable lower cavity. In that case, the transport shown in Figures 2 and 3 can be performed by reversing the orientation (upper and lower).

[0103] As described above, according to one aspect of the present invention, a resin encapsulation apparatus and a resin encapsulation method can be provided that can suppress particle adhesion and improve the quality of the product.

[0104] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit its interpretation. The elements, arrangement, materials, conditions, shapes, and sizes of the embodiments are not limited to those exemplified and can be modified as appropriate. Furthermore, it is possible to partially substitute or combine the configurations shown in different embodiments. [Explanation of symbols]

[0105] 1… Resin encapsulation device 10…Work supply unit 11…Work storage section 13…Work Transfer Section 14…Pick and place hand 15…Workpiece preheating section C11, C12... Cleaner section D11, D12... Dust collection port 20, 30… Resin molding units 23,33…Press loader 40… Resin supply unit 50…Functional component supply unit 60…First conveying mechanism 60R…Linear conveyor 61...Table 1 62... Table 2 61a, 62a... Mounting surface C61, C62... Cleaner section 70...Second conveying mechanism 71... Resin loader 90…Molded product recovery unit 91... Molded product heat removal section 93…Molded product delivery department 94…Pick and place hand 95... Molded product storage section C91, C92... Cleaner section D91, D92... Dust collection port W...work Wa...back P…Electronic parts S...Base material R…Resin H... Functional component M…molded product

Claims

1. A resin sealing apparatus for resin sealing an electronic component of a workpiece including a substrate and an electronic component, A workpiece storage section for storing the aforementioned workpiece, A table having a mounting surface for placing the aforementioned workpiece, A workpiece transport hand for transporting the workpiece between the workpiece storage section and the table, A first cleaner unit provided between the work storage unit and the table, the first cleaner unit having a first dust collection port facing the back surface of the workpiece being transported by the workpiece transport hand, A second cleaner unit provided on the workpiece transfer hand, the second cleaner unit having a second dust collection port facing the aforementioned surface of the table, A workpiece supply unit that supplies the workpiece before resin sealing, A workpiece recovery unit for recovering the workpiece after resin encapsulation, A transport mechanism that transports the workpiece using a table configured to be movable between the workpiece supply unit and the workpiece retrieval unit, A third cleaner unit provided on the movement path of the table in the transport mechanism, the third cleaner unit having a third dust collection port facing the side of the aforementioned surface of the table, Equipped with, When the workpiece transport hand transports the workpiece between the workpiece storage section and the table, the first cleaner unit performs a cleaning operation on the back surface of the workpiece, and the second cleaner unit performs a cleaning operation on the aforementioned surface of the table. A resin sealing device wherein, when the table is moved by the transport mechanism, the third cleaning unit performs a cleaning operation on the surface of the table as described above.

2. The work storage section includes a supply storage section for supplying the work before resin sealing in the work supply unit, The workpiece transfer hand includes a first hand that places the workpiece supplied from the supply storage unit onto the front surface of the table. The resin encapsulation apparatus according to claim 1.

3. The work storage section includes a recovery storage section for recovering the work after resin sealing in the work recovery unit, The workpiece handling hand includes a second hand for acquiring the workpiece from the front surface of the table for collection into the collection storage unit. The resin encapsulation apparatus according to claim 1 or 2.

4. A resin sealing method using a resin sealing apparatus for resin sealing an electronic component of a workpiece including a substrate and an electronic component, The resin sealing device is A workpiece storage section for storing the aforementioned workpiece, A table having a mounting surface for placing the aforementioned workpiece, A workpiece transport hand for transporting the workpiece between the workpiece storage section and the table, A first cleaner unit provided between the work storage unit and the table, the first cleaner unit having a first dust collection port facing the back surface of the workpiece being transported by the workpiece transport hand, A second cleaner unit provided on the workpiece transfer hand, the second cleaner unit having a second dust collection port facing the aforementioned surface of the table, A workpiece supply unit that supplies the workpiece before resin sealing, A workpiece recovery unit for recovering the workpiece after resin encapsulation, A transport mechanism that transports the workpiece using a table configured to be movable between the workpiece supply unit and the workpiece retrieval unit, A third cleaner unit provided on the movement path of the table in the transport mechanism, the third cleaner unit having a third dust collection port facing the side of the aforementioned surface of the table, Equipped with, The resin sealing method described above is A workpiece transport step in which the workpiece transport hand transports the workpiece between the workpiece storage section and the table, In the workpiece transport step, the first cleaner unit performs a cleaning operation on the back surface of the workpiece, and the second cleaner unit performs a cleaning operation on the aforementioned surface of the table, When the table moves due to the transport mechanism, the third cleaning unit performs a cleaning operation on the aforementioned surface of the table in a cleaning step. A resin encapsulation method, including the above.

5. The work storage section includes a supply storage section for supplying the work before resin sealing in the work supply unit. The workpiece transport step includes placing the workpiece supplied from the supply storage unit onto the front surface of the table, The resin encapsulation method according to claim 4.

6. The workpiece storage section includes a collection storage section for collecting the workpiece after resin sealing in the workpiece recovery unit. The workpiece transport step includes taking the workpiece from the aforementioned surface of the table for collection into the collection storage unit. The resin encapsulation method according to claim 4 or 5.

7. The step of transporting the workpiece by a table configured to be movable between the workpiece supply unit and the workpiece retrieval unit, The resin encapsulation method according to claim 4.

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