Resonators, filters, dynamic antenna elements, and remote radio units

Abstract

This application relates to the field of antenna technology and discloses a resonator, a filter, a dynamic antenna element, and a remote radio unit. The resonator may include a dielectric having opposing upper and lower surfaces and sidewalls disposed between the upper and lower surfaces, with at least two first blind vias disposed on the upper surface, each extending toward the lower surface, and the at least two first blind vias arranged in a first direction. A through groove is disposed between any two adjacent first blind vias, and at least one second blind via is disposed in the sidewall between any two adjacent first blind vias, extending from the surface of the sidewall to the dielectric, the extension direction of the second blind via being perpendicular to the first direction, and the second blind via and the through groove are spaced apart from each other. The resonator disclosed in this application allows for improved performance when a miniaturized design of the resonator is implemented.

Description

Technical Field

[0001] This application was filed with the China National Intellectual Property Administration on November 30, 2022, claims priority to Chinese Patent Application No. 202211522769.0 entitled "RESONATOR, FILTER, DYNAMIC ANTENNA ELEMENT, AND REMOTE RADIO UNIT", and the entire content thereof is incorporated herein by reference.

[0002] This application relates to the field of antenna technology, and particularly relates to resonators, filters, dynamic antenna elements, and remote radio units.

Background Art

[0003] With the development of communication technology, especially the popularization of massive multiple-input multiple-output technology, the number of channels of base stations has increased, and accordingly, the requirements for the capacity of filters have also become higher. Resonators are important components of filters, and multimode technology has been a research topic attracting attention due to its excellent characteristics. Most current research on dielectric multimode is based on the original multimode with a symmetric structure, so the modes are not separated, leading to low productivity. However, it is difficult for conventional multimodes to be miniaturized. When reducing the volume of the resonator, the performance of the resonator cannot be ensured. Therefore, how to maintain the performance of the resonator and how to achieve miniaturization of the resonator are issues that should be urgently solved by those skilled in the art.

Summary of the Invention

[0004] This application provides a resonator, a filter, a dynamic antenna element, and a remote radio unit that can maintain the performance of the resonator when miniaturization of the resonator is implemented.

[0005] According to a first aspect, the application provides a resonator which may include a dielectric, the dielectric including an upper and lower surface facing each other, and a side wall disposed between the upper and lower surfaces. At least two first blind vias are provided on the upper surface, each of the first blind vias extending toward the lower surface, and at least two of the first blind vias are arranged in a first direction. A through groove is provided between any two adjacent first blind vias, and at least one second blind via is provided on the side wall between any two adjacent first blind vias, the second blind via extending from the surface of the side wall to the dielectric, the direction of extension of the second blind via is perpendicular to the first direction, and the second blind via and the through groove are spaced apart from each other.

[0006] In the resonator of the embodiment, each of the first blind vias forms a single-mode dielectric waveguide, i.e., one first blind via forms a resonant cavity. A through groove is provided between the two first blind vias, and a portion of the dielectric located between the through groove and the first blind vias may be configured to couple energy between the two resonant cavities. By providing a second blind via on the first sidewall, modes can be added to the filter from the side, and three resonant modes are implemented in the space of the original two resonant cavities. Because the second blind via is provided on the sidewall, the upper surface area can be reduced, thereby improving space utilization and enabling miniaturization of the resonator.

[0007] In some possible implementation solutions, two second blind vias are located between any two adjacent first blind vias. Alternatively, two second blind vias may be symmetrically arranged on either side of the through groove in the direction of extension of the second blind vias. Four resonant modes are realized within the range of the two resonant cavities, thereby further improving space utilization.

[0008] In some possible implementation solutions, the sidewalls may include a first and second sidewall facing each other, both of which are connected between the top and bottom surfaces, and which are positioned along the extending direction of the second blind via. Of the two second blind vias, one second blind via is provided on the first sidewall and extends toward the second sidewall, and the other second blind via is provided on the second sidewall and extends toward the first sidewall. The first and second sidewalls are positioned facing each other. This can help the resonator have a square structure to facilitate the provision of two symmetrical second blind vias.

[0009] In some possible implementation solutions, any two adjacent first blind vias are symmetrically positioned on either side of a through groove between them. In this way, the filter parameters can be conveniently tuned to implement optimal filter performance.

[0010] In some possible implementation solutions, in the first direction, one of the second blind vias is positioned midway between the two first blind vias. In this way, the filter parameters can be conveniently tuned to implement optimal filter performance.

[0011] In some possible implementation solutions, the top surface is further provided with a third blind via extending from the top surface to the bottom surface, with the third blind via and the second blind via positioned separately on either side of the through groove in a plane parallel to the top surface and along the direction of extension of the second blind via. The third blind via is provided on the top surface and may be used to implement a negative coupling between the first and second blind vias and to implement the low-end zero point of the bandpass.

[0012] In some possible implementation solutions, the depth of the third blind via is greater than the depth of the first blind via in the direction from top to bottom. Negative coupling between the first blind via and the third blind via may be implemented by providing the third blind via.

[0013] In some possible implementation solutions, in the first direction, the third blind via is positioned midway between the two first blind vias. In this way, the filter parameters can be conveniently adjusted to implement optimal filter performance.

[0014] According to a second aspect, the application provides a filter which may include a resonator by any one of the possible implementation solutions of the first aspect. The filter in this application can implement a miniaturized filter design and improve space utilization, as well as maintain the performance of the filter.

[0015] According to a third aspect, the application provides a dynamic antenna element including a filter according to a second aspect. The dynamic antenna element provided in this application can improve system capacitance and three-dimensional coverage.

[0016] According to a fourth aspect, the application provides a remote wireless unit including a filter according to a second aspect. The remote wireless unit provided in this application may have improved system capacity and three-dimensional coverage. [Brief explanation of the drawing]

[0017] [Figure 1] This is a diagram showing the structure of a dynamic antenna element according to one embodiment of this application.

[0018] [Figure 2] This is a diagram showing the structure of a remote wireless unit according to one embodiment of this application.

[0019] [Figure 3] It is a diagram of the structure of a resonator according to an embodiment of this application.

[0020] [Figure 4] It is a diagram of the top view structure of the resonator in FIG. 3.

[0021] [Figure 5] It is a diagram of another structure of a resonator according to an embodiment of this application.

[0022] [Figure 6] It is a diagram of the top view structure of the resonator in FIG. 5.

[0023] [Figure 7] It is a schematic diagram of the equivalent circuit of a resonator having a single blind via.

[0024] [Figure 8] It is an equivalent case of the equivalent circuit in FIG. 7.

[0025] [Figure 9] It is another equivalent case of the equivalent circuit in FIG. 7.

[0026] [Figure 10] It is a schematic diagram of the equivalent circuit when two blind vias are directly connected.

[0027] [Figure 11] It is a schematic diagram of the equivalent circuit conversion of the resonator in FIG. 4.

[0028] [Figure 12] It is yet another diagram of the structure of a resonator according to an embodiment.

[0029] [Figure 13] It is a diagram of the top view structure of the resonator in FIG. 12.

[0030] Reference numerals: 10-Radio frequency unit, 11-Antenna interface and digital intermediate frequency, 12-Digital-to-analog conversion module, 13-Radio frequency signal, 14-Power amplification module, 15-Filter, 20-Antenna element, 30-Power module, 40-Remote radio unit, 41-High-speed interface module, 42-Signal processing unit, 43-Power amplification unit, 44-Filter, 50-Baseband processing unit, 60-Antenna, 70-Power supply module, 100-Resonator, 110-Dielectric, 111-Top surface, 112-Bottom surface, 113-First side wall, 114-Second side wall, 115-Third side wall, 116-Fourth side wall, 120-First blind via, 130-Through groove, 140-Second blind via, 150-Third blind via, 160-Second blind via. [Modes for carrying out the invention]

[0031] The terms used in the following embodiments are intended solely to describe specific embodiments and are not intended to limit this application. The singular terms “one,” “a,” “the,” “the foregoing,” “this,” and “the one” used in this specification and the appended claims of this application are also intended to include expressions such as “one or more” unless explicitly specified in the context.

[0032] References to “one embodiment,” “several embodiments,” etc., described in this specification indicate that one or more embodiments of this application include certain features, structures, or characteristics described by reference to the embodiments. Therefore, phrases such as “in one embodiment,” “in some embodiments,” “in some other embodiments,” and “in other embodiments,” appearing in different parts of this specification, do not necessarily refer to the same embodiment. Instead, unless otherwise specifically emphasized, the phrase means “one or more embodiments, but not all.” The terms “include,” “have,” and their variations all mean “include, but not limited to,” unless otherwise specifically emphasized.

[0033] With advancements in communication technology, particularly the widespread adoption of massive multiple-input multiple-output (MAAA) antenna array technology, the number of channels at base stations is increasing, which in turn is raising the demands on filter capacity.

[0034] In existing single-mode dielectric waveguide technology, all frequency-loaded blind vias are located on one side surface of the dielectric, and only increasing the depth of the blind vias is used to achieve continuous miniaturization. Increasing the depth of the blind vias continuously degrades the quality factor of the single cavity and worsens the filter losses. Additionally, existing multimode technology lacks any loading structure, such as blind vias. This means that the physical size of the filter is entirely determined by the frequency and dielectric constant of the material. As a result, the filters lack the potential for miniaturization and are difficult to tune.

[0035] Therefore, how to maintain filter performance and how to achieve filter miniaturization are issues that should be urgently addressed by those skilled in the art.

[0036] Based on this, embodiments of this application provide a resonator, a filter, a dynamic antenna element, and a remote radio unit, thereby reducing the space occupied by the resonator, achieving miniaturization, and maintaining the performance of the resonator. The resonator, filter, dynamic antenna element, and remote radio unit will be described in detail below with reference to specific embodiments.

[0037] Figure 1 shows the structure of a dynamic antenna element according to one embodiment of this application. The dynamic antenna element in this embodiment may include a radio frequency unit 10, an antenna element 20, and a power module 30, the power module 30 may be configured to provide an operating voltage to the antenna element 20 and the radio frequency unit 10.

[0038] The radio frequency unit 10 includes an antenna interface and a digital intermediate frequency 11, a digital-to-analog conversion module 12, a radio frequency signal 13, a power amplification module 14, and a filter 15, which are sequentially connected, and the filter 15 is connected to the antenna element 20. The radio frequency unit 10 may be configured to complete the processing of uplink and downlink radio frequency signals, radio frequency channel phase correction, etc., and the antenna element 20 may use a large antenna array to transmit and receive radio waves.

[0039] Figure 2 shows the structure of a remote radio unit according to one embodiment of this application. The remote radio unit 40 in this application includes a high-speed interface module 41, a signal processing unit 42, a power amplification unit 43, and a filter 44, the high-speed interface module 41 being connected to a baseband processing unit 50 via an optical fiber, and the filter 44 being connected to an antenna 60. A radio frequency signal is output to the remote radio unit 40 via the baseband processing unit 50, processed by the remote radio unit 40, and then sent to the antenna 60 to complete the transmission of the radio frequency signal. Alternatively, the antenna 60 receives radio waves, sends the radio waves to the remote radio unit 40, processes the radio waves by the remote radio unit 40 and then sends them back to the baseband processing unit 50 to complete the reception of the radio waves.

[0040] The remote wireless unit 40 may further include a power supply module 70, which may provide operating voltages to the signal processing unit 42, the power amplification unit 43, and the filter 44.

[0041] Figure 3 is a diagram of the structure of a resonator according to one embodiment of this application. The filter 15 shown in Figure 1 or the filter 44 shown in Figure 2 may include a resonator 100, the resonator 100 may include a dielectric 110, the dielectric 110 including an upper surface 111 and a lower surface 112 facing each other, and a side wall located between the upper surface 111 and the lower surface 112. The shape of the resonator 100 in this embodiment is not limited. For example, the resonator 100 may have a cylindrical structure. In this case, the side wall of the resonator 100 has a structure formed by a continuous arc surface. For example, the resonator 100 may have a square structure. In this specification, embodiments are not described one by one.

[0042] For example, the resonator 100 has a square structure, that is, the dielectric 110 has a square structure. In this case, the side walls of the dielectric may be a first side wall 113 and a second side wall 114 facing each other, and a third side wall 115 and a fourth side wall 116 facing each other. The upper surface 111, the lower surface 112, the first side wall 113, the second side wall 114, the third side wall 115, and the fourth side wall 116 surround each other to form the outer surface of the dielectric 110.

[0043] Two first blind vias 120 are provided in the center of the upper surface 111 along the lower surface 112, the two first blind vias 120 are arranged in a first direction, and a through groove 130 is provided between the two first blind vias 120, penetrating from the upper surface 111 of the dielectric to the lower surface 112 of the dielectric, the first direction may also be understood as the direction of arrangement of the third side wall 115 and the fourth side wall 116. The first side wall 113 is provided with a second blind via 140 extending toward the second side wall 114, the second blind via 140 is located between the two first blind vias 120 in the first direction. Additionally, the second blind via 140 and the through groove 130 are spaced apart from each other, with a specific distance between the bottom of the second blind via 140 and the through groove 130.

[0044] In this embodiment of the filter, each of the first blind vias 120 forms a single-mode dielectric waveguide, i.e., one first blind via 120 forms a resonant cavity. A through groove 130 is provided between the two first blind vias 120, and a portion of the dielectric 110 located between the through groove and the first blind vias 120 may be configured to couple energy between the two resonant cavities. However, by providing a second blind via 140 on the first sidewall 113, modes can be introduced into the filter from the side, and three resonant modes are implemented in the space of the original two resonant cavities (i.e., the space occupied by the two first blind vias 120 and the through groove 130). Because the second blind via 140 is provided on the first sidewall 113, the occupied area of ​​the top surface 111 can be reduced, thereby improving space utilization and enabling miniaturization of the filter.

[0045] An implementation solution may involve providing two first blind vias 120 symmetrically on either side of the through groove 130, or positioning a second blind via 140 centrally between the two first blind vias 120. In this way, the filter parameters can be conveniently adjusted to implement optimal filter performance.

[0046] In this embodiment, the energy coupling effect may be adjusted by adjusting the frequency coupling parameters of the resonant modes of the two first blind vias 120 and the resonant mode of the second blind via 140. Based on this, see Figure 4, which is a diagram of the top view structure of the resonator in Figure 3. Adjusting the frequency coupling parameters of the three resonant modes may be implemented based on the following parameters: d1, the distance between the first blind via 120 and the second blind via 140 in the direction of alignment of the first sidewall 113 and the second sidewall 114; d2, the distance between the first blind via 120 and the second blind via 140 in the direction of alignment of the third sidewall 115 and the fourth sidewall 116; d3, the distance between the two first blind vias 120; and d4, the distance between the through groove 130 and the second sidewall 114 (which may also be understood as the sidewall opposite to the sidewall on which the second blind via 140 is located).

[0047] In the parameters described above, smaller values ​​for d1 and / or d2 indicate a better coupling effect. Smaller values ​​for d3 indicate a better coupling effect. Larger values ​​for d4 indicate a better coupling effect. That is, within a certain range, shorter distances between the second blind via 140 and the first blind via 120 indicate a better coupling effect, shorter distances between the two first blind vias 120 indicate a better coupling effect, and longer distances between the through groove 130 and the second side wall 114 indicate a better coupling effect. Therefore, in actual applications, the optimal performance of the filter may be achieved by adjusting the parameters described above.

[0048] Additionally, the resonant frequency may also be adjusted by adjusting the depth of the first blind via 120 (i.e., the magnitude of the upper surface 111 and the lower surface 112 in the alignment direction). Within a certain range, a smaller depth of the first blind via 120 indicates a larger resonant frequency.

[0049] In this embodiment, the shape of the first blind via 120 is not limited. For example, the cross-sectional shape of the first blind via 120 may be square, circular, or elliptical. Similarly, the shape of the through groove 130 is not limited. For example, the cross-sectional shape of the through groove 130 may be square, circular, or elliptical. Similarly, the shape of the second blind via 140 is not limited. For example, the cross-sectional shape of the second blind via 140 may be square, circular, or elliptical.

[0050] It should be noted that in actual applications, the number of first blind vias 120 and the number of second blind vias 140 of the resonator 100 are not limited to the numbers described in the embodiments. The number of first blind vias 120 may alternatively be 3, 4, 5, etc. Correspondingly, a second blind via 140 may be provided between any two adjacent first blind vias 120, depending on the requirements, and the parameters of any second blind via may also be designed based on the parameters of the second blind via 140 in the embodiments described above. For ease of understanding, two first blind vias 120 are used as an example for the explanation of the embodiments of this application.

[0051] Refer to Figures 5 and 6. Figure 5 is yet another diagram of the structure of a resonator according to one embodiment of this application, and Figure 6 is a diagram of the upper structure of the resonator of Figure 5. The resonator 100 may include a dielectric 110, which includes an upper surface 111 and a lower surface 112 facing each other, a first side wall 113 and a second side wall 114 facing each other, and a third side wall 115 and a fourth side wall 116 facing each other. Two first blind vias 120 are provided in the center of the upper surface 111 along the lower surface 112, the two first blind vias 120 are arranged in a first direction, and a through groove 130 is provided between the two first blind vias 120 that penetrates from the upper surface 111 of the dielectric to the lower surface 112 of the dielectric. The first side wall 113 is provided with a second blind via extending toward the second side wall 114, and in the first direction, the second blind via 140 is located between the two first blind vias 120.

[0052] A third blind via 150 is provided on the upper surface 111, and in the first direction, the third blind via 150 is located between the two first blind vias 120. Additionally, in a plane parallel to the upper surface 111 and in the direction of extension of the second blind via 140, the third blind via 150 and the second blind via 140 are located separately on either side of the through groove 130. That is, the third blind via 150 is provided in close proximity to the second side wall 114. Compared to the resonator 100 of Figure 3, it will be understood that the resonator 100 in this embodiment has one additional third blind via 150. In this embodiment, the depth of the third blind via 150 is greater than the depth of the first blind vias 120. Since the third blind via 150 is located between the two first blind vias 120, the third blind via 150 may be considered a negatively coupled blind via, implementing a negative coupling between the first blind via 120 and the second blind via 140.

[0053] In this embodiment, the through groove 130 may be used as the axis of symmetry, and the two first blind vias 120 may be arranged symmetrically, with the second blind via 140 positioned midway between the two first blind vias 120, and the third blind via 150 also positioned midway between the two first blind vias 120. In this way, the filter parameters may be conveniently adjusted to implement the optimal performance of the filter.

[0054] Additionally, the shapes of the first blind via 120, the through groove 130, and the second blind via 140 in this embodiment may be the same as those in Figure 3. Further details will not be described again here. The shape of the third blind via 150 is also not limited. For example, the cross-sectional shape of the third blind via 150 may be square, circular, or elliptical.

[0055] Figure 7 is a schematic diagram of the equivalent circuit of a resonator with a single blind via. As shown in Figure 7, the equivalent circuit of a resonator with a single blind via includes a capacitor and an inductor connected in parallel.

[0056] Figure 8 shows an equivalent case of the equivalent circuit in Figure 7. In a resonator with a single blind via, the resonator inductor plays the main role when the signal frequency is lower than the resonant frequency, and the circuit may be equivalent to the structure shown in Figure 7.

[0057] Figure 9 shows another equivalent case of the equivalent circuit in Figure 7. In a resonator with a single blind via, the capacitor plays the main role when the signal frequency is higher than the resonant frequency, and the circuit may be equivalent to the structure shown in Figure 8.

[0058] Figure 10 is a schematic diagram of the equivalent circuit when two blind vias are directly coupled. When two blind vias are directly coupled, the circuit may be equivalent to a series inductor as shown in Figure 10.

[0059] Figure 11 is a schematic diagram of the equivalent circuit transformation of the resonator in Figure 5. Based on the principles in Figures 7 to 10, in the resonator of Figure 4, the equivalent circuit of the resonator may ultimately be transformed to the case where a capacitor is connected in series between the two first blind vias 120. In this embodiment, it will be understood that the low-end zeros of the passband may be implemented by providing a third blind via 150.

[0060] In this embodiment, referring again to Figure 6, the performance of the resonator may be adjusted by adjusting parameters d1, d2, d3, and d5, where d5 may be understood as the depth of the third blind via 150. The adjustment methods for d1, d2, and d3 will be understood to be the same as those in Figure 3. Further details will not be explained again here.

[0061] It should be understood that when the number of first blind vias 120 is greater than 3, a third blind via 150 may be provided between any two adjacent first blind vias 120. Additionally, the parameters of any third blind via 150 may be designed with reference to the embodiments described above.

[0062] Figure 12 is yet another diagram of the structure of a resonator according to one embodiment. In this embodiment, the resonator 100 may include a dielectric 110, which includes an upper surface 111 and a lower surface 112 facing each other, a first side wall 113 and a second side wall 114 facing each other, and a third side wall 115 and a fourth side wall 116 facing each other. Two first blind vias 120 are provided in the center of the upper surface 111, extending toward the lower surface 112, and the two first blind vias 120 are arranged in a first direction, and a through groove 130 is provided between the two first blind vias 120, penetrating from the upper surface 111 of the dielectric to the lower surface 112 of the dielectric.

[0063] The first side wall 113 is provided with a second blind via 140 extending toward the second side wall 114, and in the first direction, the second blind via 140 is located between two first blind vias 120. The second side wall 114 is provided with a second blind via 160 extending toward the first side wall 113, and in the first direction, the second blind via 160 is located between two first blind vias 120. In addition, the second blind vias 160 and the through grooves 130 are spaced apart from each other.

[0064] Compared to the resonator in Figure 3, it will be seen that the resonator 100 in this embodiment has an additional second blind via 160. Four resonant modes are implemented in the space of the original two resonant cavities, thereby further improving space utilization and implementing a smaller filter.

[0065] In this embodiment, two first blind vias 120 may be symmetrically arranged on both sides of the through groove 130, and a second blind via 140 may be located in the center between the two first blind vias 120. Additionally, in the direction of extension of the second blind via 140, the second blind via 140 and a second blind via 160 may be symmetrically arranged on both sides of the through groove 130. In this way, the filter parameters may be conveniently adjusted to implement the optimal performance of the filter.

[0066] Based on this, refer to Figure 13, which shows the top view structure of the resonator in Figure 12. In this embodiment, the optimal performance of the filter may be achieved by adjusting d1, d2, and d3.

[0067] The resonators in this application may also be used not only in filters but also in duplexer modules or other devices. This is not limited to this application.

[0068] According to the resonator in this application, resonant blind vias are provided at the sidewall position between two single-mode dielectric cavities, thereby improving space utilization and enabling miniaturization of the filter. Additionally, filter performance can be maintained when the filter volume is reduced.

[0069] The above description is merely a specific implementation of this application, but is not intended to limit the scope of protection of this application. Any modification or substitution that is readily understood by a person skilled in the art within the technical scope disclosed in this application shall fall within the scope of protection of this application. Accordingly, the scope of protection of this application shall be subject to the scope of protection of the claims.

Claims

1. A resonator containing a dielectric, The dielectric material has an upper and lower surface facing each other, and a side wall disposed between the upper and lower surfaces, with at least two first blind vias provided on the upper surface, each of the first blind vias extending toward the lower surface, and the at least two first blind vias arranged in a first direction. A through groove is provided between any two adjacent first blind vias, and at least one second blind via is provided on the side wall between the two adjacent first blind vias, wherein the second blind via extends from the surface of the side wall to the dielectric, the direction of extension of the second blind via is perpendicular to the first direction, and the second blind via and the through groove are spaced apart from each other. A resonator wherein the upper surface is further provided with a third blind via extending from the upper surface to the lower surface, and the third blind via and the second blind via are separately located on both sides of the through groove in a plane parallel to the upper surface and along the direction of extension of the second blind via.

2. The resonator according to claim 1, wherein two second blind vias are located between any two adjacent first blind vias, and the two second blind vias are arranged symmetrically on both sides of the through groove in the direction of extension of the second blind vias.

3. The side wall includes a first side wall and a second side wall facing each other, and the first side wall and the second side wall are arranged along the extending direction of the second blind via. The resonator according to claim 2, wherein one of the second blind vias is provided in the first side wall, and the other of the second blind vias is provided in the second side wall.

4. The resonator according to claim 1 or 2, wherein any two adjacent first blind vias are provided symmetrically on both sides of the through groove between the two first blind vias.

5. The resonator according to claim 1 or 2, wherein, in the first direction, one of the second blind vias is located at the midpoint between the two first blind vias.

6. The resonator according to claim 1, wherein, in the direction from the upper surface to the lower surface, the depth of the third blind via is greater than the depth of the first blind via.

7. The resonator according to claim 1, wherein in the first direction, the third blind via is located at a central position between the two first blind vias.

8. A filter including a resonator, wherein the resonator includes a dielectric, The dielectric material has an upper and lower surface facing each other, and a side wall disposed between the upper and lower surfaces, with at least two first blind vias provided on the upper surface, each of the first blind vias extending toward the lower surface, and the at least two first blind vias arranged in a first direction. A through groove is provided between any two adjacent first blind vias, and at least one second blind via is provided on the side wall between the two adjacent first blind vias, wherein the second blind via extends from the surface of the side wall to the dielectric, the direction of extension of the second blind via is perpendicular to the first direction, and the second blind via and the through groove are spaced apart from each other. A third blind via is further provided on the upper surface, extending from the upper surface to the lower surface, and the third blind via and the second blind via are separately located on both sides of the through groove in a plane parallel to the upper surface and along the direction of extension of the second blind via.

9. The filter according to claim 8, wherein two second blind vias are located between any two adjacent first blind vias, and the two second blind vias are symmetrically arranged on both sides of the through groove in the direction of extension of the second blind vias.

10. The side wall includes a first side wall and a second side wall facing each other, and the first side wall and the second side wall are arranged along the extending direction of the second blind via. The filter according to claim 9, wherein one of the second blind vias is provided in the first side wall, and the other of the second blind vias is provided in the second side wall.

11. The filter according to claim 8 or 9, wherein any two adjacent first blind vias are provided symmetrically on both sides of the through groove between the two first blind vias.

12. The filter according to claim 8 or 9, wherein, in the first direction, any one of the second blind vias is located at the midpoint between the two first blind vias.

13. A dynamic antenna element including a filter, wherein the filter includes a resonator, and the resonator includes a dielectric, The dielectric material has an upper and lower surface facing each other, and a side wall disposed between the upper and lower surfaces, with at least two first blind vias provided on the upper surface, each of the first blind vias extending toward the lower surface, and the at least two first blind vias arranged in a first direction. A through groove is provided between any two adjacent first blind vias, and at least one second blind via is provided on the side wall between the two adjacent first blind vias, wherein the second blind via extends from the surface of the side wall to the dielectric, the direction of extension of the second blind via is perpendicular to the first direction, and the second blind via and the through groove are spaced apart from each other. A third blind via is further provided on the upper surface, extending from the upper surface to the lower surface, and the third blind via and the second blind via are separately located on both sides of the through groove in a plane parallel to the upper surface and along the extending direction of the second blind via.

14. The dynamic antenna element according to claim 13, wherein two second blind vias are located between any two adjacent first blind vias, and the two second blind vias are symmetrically arranged on both sides of the through groove in the direction of extension of the second blind vias.

15. The side wall includes a first side wall and a second side wall facing each other, and the first side wall and the second side wall are arranged along the extending direction of the second blind via. The dynamic antenna element according to claim 14, wherein one of the second blind vias is provided on the first side wall, and the other of the second blind vias is provided on the second side wall.

16. The dynamic antenna element according to claim 13 or 14, wherein any two adjacent first blind vias are provided symmetrically on both sides of the through groove between the two first blind vias.

17. The dynamic antenna element according to claim 13 or 14, wherein in the first direction, one of the second blind vias is located at the midpoint of the two first blind vias.

18. A remote wireless unit including a filter, wherein the filter includes a resonator, and the resonator includes a dielectric, The dielectric material has an upper and lower surface facing each other, and a side wall disposed between the upper and lower surfaces, with at least two first blind vias provided on the upper surface, each of the first blind vias extending toward the lower surface, and the at least two first blind vias arranged in a first direction. A through groove is provided between any two adjacent first blind vias, and at least one second blind via is provided on the side wall between the two adjacent first blind vias, wherein the second blind via extends from the surface of the side wall to the dielectric, the direction of extension of the second blind via is perpendicular to the first direction, and the second blind via and the through groove are spaced apart from each other. A third blind via is further provided on the upper surface, extending from the upper surface to the lower surface, and the third blind via and the second blind via are separately located on both sides of the through groove in a plane parallel to the upper surface and along the direction of extension of the second blind via.

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