Waterproof surface-emitting panel
The innovative surface-emitting panel design with a grooved light guide plate and resin-sealed heat dissipation allows for flexible shape and size adjustments, addressing size limitations and manufacturing costs while ensuring waterproof integrity and uniform light emission.
JP7888204B1Active Publication Date: 2026-07-13TD LIGHTEC CO LTD
Patent Information
- Application Number
- JP2026011824
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2026-01-28
- Publication Date
- 2026-07-13
- Estimated Expiration
- 2046-01-28
AI Technical Summary
Technical Problem
Conventional surface light-emitting panels housed in box bodies for waterproofing are limited in size and shape, leading to increased manufacturing costs and difficulty in adapting to different applications.
Method used
A waterproof surface-emitting panel design featuring a light guide plate with grooves for LED lamps, a heat dissipation portion sealed with resin, and a reflective tape covered by resin to prevent water ingress, allowing flexible shape and size modifications.
Benefits of technology
The design enables easy customization of shape and size while maintaining waterproof performance, preventing resin seepage and ensuring uniform light emission.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 0007888204000001_ABST
Abstract
To provide a waterproof surface-emitting panel and a method for manufacturing the same, which can be easily modified in shape and size. [Solution] A surface-emitting panel comprising: a light guide plate that diffuses light and has a surface that serves as a light-emitting surface; an LED lamp mounted on a printed circuit board; and a heat dissipation section having at least one bent portion, which is arranged to have a portion that contacts the back surface of the printed circuit board and a portion that contacts the surface of the light guide plate and / or the surface opposite it, wherein the space having the LED lamp mounted on the printed circuit board is sealed by the heat dissipation section and resin, and / or the periphery of the portion of the heat dissipation section that contacts the surface of the light guide plate and / or the surface opposite it, and the portion of the surface of the light guide plate and / or the surface opposite it that contacts the periphery of the heat dissipation section are covered with resin, and the seepage of resin into the gap between the heat dissipation section and the surface of the light guide plate and / or the surface opposite it is 10 mm or less.
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Citation Information
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