Indication device

Abstract

To provide highly reliable display devices, particularly those capable of stably supplying signals and power potentials. To provide a display device, or a curved display device capable of stably supplying signals and power potential. Provide a place. [Solution] The display device has a display unit on a flexible substrate and a signal input from the outside. It has multiple connection terminals and multiple wires, and one of the connection terminals is indicated by one of the wires. It is electrically connected to the part. Also, the wiring consists of a first part that branches into multiple wires, and multiple wires It has a second part that converges into a single line.

Description

[Technical Field]

[0001] The present invention relates to a display device. In particular, one aspect of the present invention relates to a display device having a bendable display section. Regarding the device. [Background technology]

[0002] In recent years, there has been a growing demand for greater diversity in the shapes of electronic devices with display functions. One example of this is... Display elements are mounted on a flexible substrate, allowing the display device to be curved or to conform to a curved surface. There is a need for electronic devices equipped with a display device capable of displaying information. Also known as flexible displays, development is underway for practical application.

[0003] Examples of display elements applicable to flexible displays include organic EL (Electroluminescent). Examples include luminescence elements and liquid crystal elements. Also, flexible digital elements. The display incorporates elements that perform display using methods such as electrophoresis and electron-powder fluid dynamics. Examples include paper.

[0004] For example, Patent Document 1 describes an organic EL element on a resin substrate made of a flexible film. An organic EL display panel on which a material is supported is disclosed. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] International Publication No. 2006 / 046679 Pamphlet [Overview of the project] [Problems that the invention aims to solve]

[0006] When incorporating a display device into electronic equipment, the enclosure is used to supply signals and power potential to the display device. It is necessary to attach the connecting wiring that electrically connects the display device to the display device. In terms of lines, a typical example is FPC (Flexible Printed Circuit). These include... When attaching an FPC to a substrate, an anisotropic conductive film (ACF: Aniso Heat-press bonding is performed using materials such as tropic conductive film.

[0007] However, in a display device that has a display element on a flexible substrate, thermocompression bonding is used. There is a problem that the heat and pressure can damage the circuit board and the wiring on it. However, bending the circuit board can cause problems such as the circuit board and connecting wires becoming detached.

[0008] One aspect of the present invention aims to provide a highly reliable display device. One of the objectives is to provide a display device capable of stably supplying voltage and power potential. One of the objectives is to provide a flexible display device that can stably supply signals and power potential. do.

[0009] Furthermore, the description of these problems does not preclude the existence of other problems. One approach does not require that all of these issues be resolved. The title will become clear from the description in the specification, drawings, claims, etc. It is possible to extract other issues from the descriptions in the drawings, claims, etc. [Means for solving the problem]

[0010] One aspect of the present invention provides a display unit on a flexible substrate and a system that can receive signals from an external source. A display device having a plurality of connection terminals and a plurality of wirings, wherein one of the connection terminals is electrically connected to the display portion by one of the wirings The wiring has a first portion branched into a plurality of lines and a second portion converging a plurality of lines into one line

[0011] In addition, it is preferable that the first portion of the wiring in the display device according to one aspect of the present invention has a region thinner than the thickness in the second portion

[0012] Alternatively, it is preferable that the first portion of the wiring in the display device according to one aspect of the present invention has a region thicker than the thickness in the second portion

[0013] In addition, it is preferable that the substrate in the display device according to one aspect of the present invention is curved in a region overlapping with the first portion of the wiring

[0014] In addition, in the display device according to one aspect of the present invention, the wiring is preferably arranged such that the bending direction of the substrate and the extending direction of the wiring do not match in the first portion

[0015] In addition, in the display device according to one aspect of the present invention, an IC is mounted on the substrate, and another one of the plurality of wirings electrically connects the IC and the display portion, and the IC is preferably provided between the first portion of the wiring and the connection terminal

[0016] In this specification etc., when a certain surface is deformed from a flat state, when the inclination of the line connecting any two points on the deformed surface along the surface is continuous, the surface is said to be curved At this time, the deformed surface has a radius of curvature greater than 0 at any point

[0017] ​​​​​​​​In this specification, the term "bendable device" means that a part of the device can be bent to a predetermined radius of curvature. This means that when the device is bent, the specific function it possesses is not lost. Therefore, for example, A flexible display device is one that can display information even when a part of it is bent. It refers to a display device. [Effects of the Invention]

[0018] According to one aspect of the present invention, a highly reliable display device can be provided. Alternatively, a signal or power supply can be used. A display device capable of stably supplying voltage can be provided. Alternatively, a device that can stably supply signals or power potential can be provided. We can provide a flexible, curved display device. [Brief explanation of the drawing]

[0019] [Figure 1] An example of the configuration of a display device according to an embodiment. [Figure 2] An example of the wiring configuration of a display device according to an embodiment. [Figure 3] An example of the configuration of a display device according to an embodiment. [Figure 4] An example of the wiring configuration of a display device according to an embodiment. [Figure 5] An example of the configuration of a display device according to an embodiment. [Figure 6] An example of the wiring configuration of a display device according to an embodiment. [Figure 7] An example of the configuration of a display device according to an embodiment. [Figure 8] A diagram illustrating an example of a method for manufacturing a display device according to an embodiment. [Figure 9] An example of the configuration of a display device according to an embodiment. [Figure 10] An example of the configuration of a display device according to an embodiment. [Figure 11] An example of the configuration of an electronic device according to an embodiment. [Modes for carrying out the invention]

[0020] Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. Without departing from the spirit and scope of the present invention, its form and details may be modified in various ways. Those skilled in the art will readily understand what is possible. Therefore, the present invention is as shown in the following embodiments. It should not be interpreted as being limited to the contents described herein.

[0021] In the configuration of the invention described below, the same part or part having a similar function is The same reference numerals are used consistently across different drawings, and explanations of their repetition are omitted. When referring to the function of [this], the hatch pattern is the same, and sometimes no specific symbol is assigned.

[0022] In each figure described herein, the size, layer thickness, or area of ​​each component is as follows: It may be exaggerated for clarity. Therefore, the relative size of each component is not necessarily large. It is not limited to minor relationships.

[0023] Furthermore, in this specification, etc., "electrically connected" means "having some kind of electrical effect." This includes cases where the connection is made via ". Here, "has some electrical effect The term "of" is not particularly limited as long as it enables the exchange of electrical signals between connected objects. For example, "things that have some kind of electrical effect" include electrodes and wiring, as well as transistors. Switching elements such as switches, resistive elements, coils, capacitive elements, and other elements with various functions This includes components such as sub-units and circuits with various functions.

[0024] (Embodiment 1) In this embodiment, an example of the configuration of a display device according to one aspect of the present invention will be described with reference to the drawings. do.

[0025] [Example of a display device configuration] Figure 1(A) is a schematic top view of a display device 100 according to one embodiment of the present invention.

[0026] The display device 100 has a display unit 102 and multiple wirings 111 on a flexible substrate 101. It includes multiple connection terminals 112, IC 113, and multiple wirings 114.

[0027] The display unit 102 includes a pixel unit 103 and a drive circuit 104.

[0028] The pixel section 103 has pixels having display elements arranged in a matrix. Each pixel is driven By doing so, an image can be displayed in the pixel section 103.

[0029] As for display elements applicable to pixels, organic EL (Electroluminescent) Examples include NC elements and liquid crystal elements. In addition, electrophoretic and electron powder fluid methods are used for pixels. The configuration may also include elements that perform display using methods such as [mention specific methods here].

[0030] When organic EL elements are applied as display elements in pixels, a backlight becomes unnecessary. Therefore, it is preferable. Also, when a backlight is required, such as when a liquid crystal element is applied to the display element. In this case, the display portion of the circuit board 101 is designed to conform to the shape when the circuit board 101 is curved. A flexible backlight can be attached to the side opposite to the surface where 102 is located.

[0031] The drive circuit 104 is a circuit that drives the pixels in the pixel section 103, for example, a gate drive circuit It can be a circuit that functions as a path. The drive circuit 104 is on the substrate 101. It is preferable that the device is composed of semiconductor elements such as thin-film transistors. Note that the drive circuit 104 does not necessarily need to be located on the circuit board 101; the drive circuit can be controlled by IC 113. It may also be given the function of road 104.

[0032] As shown in Figure 1(A), the substrate 101 has a shape in which a part of it protrudes. Furthermore, a portion of multiple wirings 111 and multiple connection terminals 112 are located on the protruding part of the circuit board 101. IC113 and wiring 114 are provided.

[0033] The connection terminal 112 receives power supply voltage, image signals, timing signals, etc. from an external source. This is a terminal that can receive various signals used to drive unit 2.

[0034] IC113 is a circuit that has the function of driving the display unit 102, for example, source drive cycle It can be a circuit that functions as a path, or it can be used in response to the input image signal. The circuit may also have the function of performing image processing and generating a new image signal. Figure 1 As shown in (A), it is preferable to mount the IC113 on the substrate 101. 113 does not necessarily need to be mounted on the circuit board 101; for example, IC 113 can be mounted on the display board. It is located outside of the unit 100, and the output signal from IC 113 is transmitted via connection terminal 112 and wiring 111. The data may be configured to be input to the display device 100.

[0035] One of the multiple wires 114 connects one of the multiple connection terminals 112 to IC 113. This is a wire that is electrically connected. The connection terminal 112 to which the wire 114 is electrically connected has an IC A signal is input to drive IC 113 or the display unit 102. If this is not the case, wiring 114 is not necessary.

[0036] Wiring 111 is the wiring placed between the connection terminal 112 and the display unit 102. 11 is electrically connected to the display unit 102, and signals to drive the display unit 102 It can be input to 102. Note that, for simplification, the number of wires 111 in Figure 1 has been reduced. Although explicitly stated, in reality, there are often many more wires than shown.

[0037] Furthermore, the wiring 111 directly electrically connects the connection terminal 112 and the display unit 102. There are wires and wires that electrically connect IC113 and display unit 102. They share the common function of transmitting a signal to drive 102 to the display unit 102. Therefore, in the following, these wires will be collectively referred to as wire 111.

[0038] The signal input to the connection terminal 112, which is electrically connected to the display unit 102 via the wiring 111. For example, signals for driving the drive circuit 104, or for driving IC 113. Examples include signals that contain a voltage different from the power supply voltage.

[0039] Furthermore, in the configuration shown in Figure 1(A), IC113 is placed between the connection terminal 112 and the display unit 102. To prepare, the number of wires 114 between connection terminal 112 and IC113, and the label IC113 are indicated. This shows the case where the number of wires 111 between part 102 and part 102 does not match.

[0040] The display device 100 has a curved portion 110 that overlaps with the wiring 111 shown in Figure 1(A) on the substrate 101 The board 101, on which connection terminals 112 and IC 113 are provided, is curved, and a portion of the board 101 is separated from the display surface. It can be curved and folded back on the opposite side.

[0041] Figure 1(B) shows the display device 1 with the substrate 101 curved and folded at the curved portion 110. A schematic diagram of 00 is shown. Also, in Figure 1(B), the display unit 102 is curved in a concave shape. It is showing a certain attitude.

[0042] As shown in Figure 1(B), the connection terminals 112 and IC 113 of the substrate 101 are provided on the protrusion. The protruding part can be curved and folded back on the opposite side from the display surface, so the view from the display surface side The occupied area of ​​the device 100 can be reduced, and a narrow-bezel display device 100 can be made. For example, when incorporating the display device 100 into an electronic device, miniaturization of the electronic device is achieved. It can be expressed.

[0043] Furthermore, a connection terminal 112 is provided on the folded portion of the circuit board 101, and the connection terminal 1 12 can be connected to a connector provided on, for example, the casing of an electronic device. That is, A part of the display device 100 can perform functions similar to those of an FPC. Therefore, for example, When an FPC is attached to a flexible display device, the substrate and the material provided on the substrate This eliminates defects such as damaged wiring and peeling of the FPC when the circuit board 101 is bent. This is possible. Therefore, an extremely reliable display device can be realized.

[0044] Furthermore, as shown in Figure 1(B), the display device 100 has a display unit 102 that is curved in a convex or concave shape. Because it can be curved, it can reproduce curved surfaces as images to be displayed. Therefore This enables diverse image representations and applications that cannot be achieved with display devices that have a flat surface. It can be expressed.

[0045] Alternatively, a flexible touch sensor may be provided in conjunction with the display unit 102.

[0046] [Regarding the shape of the wiring] Next, we will explain an example of the shape of wiring 111. Figure 2(A) shows two wirings arranged in parallel. A schematic top view of a portion of line 111 is shown.

[0047] Wiring 111 has an opening in part of it, and branches out into multiple wires on either side of the opening. It has an eel shape. In other words, the wiring 111 has a first part 121 that branches into multiple wires, It has a second portion 122 in which the multiple lines converge into a single line.

[0048] If a part of the substrate 101 is curved, the curved part 110 will overlap with the first part 121. It is preferable to make it curved like a sea urchin.

[0049] Here, if the part where the wiring that transmits signals to the display unit 102 is provided is curved, The resulting stress can cause cracks in the wiring, and in the worst case, it can lead to a complete break. When this occurs, the signal cannot be transmitted to the display unit 102, resulting in a display malfunction. .

[0050] However, by making the wiring 111 that crosses the curved section 110 into the shape described above, multiple wires Even if one of the branched wires breaks, the signal will still be transmitted through the other branched wires. This makes it possible. Therefore, the occurrence of display defects due to curvature is suppressed, resulting in a highly reliable display. Display device 100 can be realized.

[0051] Here, as shown in Figure 2(B), in the first portion 121 of the wiring 111, it is branched. It is preferable to make the wire width of each of the multiple wires as large as possible. This makes it possible to suppress the increase in resistance caused by branching the wiring 111. Furthermore, even if one or more of the branched wires are disconnected, the increase in resistance can be suppressed. Therefore, it is possible to reduce the effects of signal delays and other factors.

[0052] Note that Figure 2 shows the case where wiring 111 is branched into three wires, but the number of branches is not limited to this. As long as there are two or more wires, it's fine. The more branches there are, the lower the risk of the wires breaking when bent. It can be reduced.

[0053] By making the wiring 111 this shape, the curvature of the curved portion 110 of the circuit board 101 is reduced. Because the diameter can be reduced, when a part of the substrate 101 is curved and folded back, the display device 100 The effective thickness can be reduced. The total thickness of the display device 100 in the curved portion 110 The allowable value for the radius of curvature at the center position is 0.1 mm or more and 10 mm or less, preferably. To reduce the size to 0.5 mm or more and 5 mm or less, more preferably to 0.5 mm or more and 2 mm or less. It is possible.

[0054] Here, in the curved display device 100 shown in Figure 1(B), the curved portion 110 An example of the cross-sectional configuration will be explained using Figure 3.

[0055] Figure 3(A) is a schematic cross-sectional view of the display device 100 including the curved portion 110. This indicates a region including wiring 111, IC 113, wiring 114, and connection terminal 112. .

[0056] In Figure 3(A), wiring 111 is formed on the substrate 101, and further, contact is made on the wiring 111. This diagram shows a configuration in which a flexible substrate 131 is provided via a bonding layer 132.

[0057] Wires 111 and 114 to which IC113 is electrically connected have their ends exposed. As shown above, the upper substrate 131 and the adhesive layer 132 are open. Bump 134 of IC113 connects electrically to wiring 111 or wiring 114 via ACF133. Connected.

[0058] Furthermore, in a portion of the wiring 114, an opening is made between the upper substrate 131 and the adhesive layer 132. The top surface of the wiring 114 is exposed. A portion of the exposed wiring 114 is connected to the terminal 112. It functions.

[0059] Here, the first portion 121 of the wiring 111 has a different thickness from the second portion 122. It is preferable to do so.

[0060] In Figure 3(A), the thickness of the first portion 121 of the wiring 111 is thinner than the thickness of the second portion 122. This shows a case where...

[0061] In the curved section 110, the upper and lower parts in the thickness direction of the wiring 111 change with the curvature. Furthermore, differences in the stress applied to the first part of the wiring 111 that overlaps with the curved part 110 By reducing the thickness of part 121, the upper and lower parts of the wiring 111 when curved... Furthermore, the difference in stress applied can be reduced, and the risk of the wiring 111 breaking can be suppressed. Cut.

[0062] Furthermore, reducing the thickness of the first portion 121 of the wiring 111 increases the wiring resistance. Because of the risk of damage, it is preferable to use a low-resistance conductive material such as Cu for the first part 121. Here, the wiring 111 uses different materials for the first part 121 and the second part 122. Alternatively, you could use the same materials.

[0063] Furthermore, if the wiring width of the first portion 121 of the wiring 111 is made larger than that of the second portion 122, This is preferable because it can suppress the increase in wiring resistance. Also, the first part of the wiring 111 When branching 121 into multiple lines, the top surface shape should be as shown in Figure 2(B). This effectively suppresses the increase in wiring resistance.

[0064] Also, in Figure 3(B), the thickness of the first portion 121 of the wiring 111 is greater than that of the second portion 122. This also shows the case where it is thick.

[0065] By increasing the thickness of the first portion 121 of the wiring 111 that overlaps with the curved portion 110, This increases the mechanical strength of the wire 111 itself and prevents the wire 111 from breaking due to bending. It can be suppressed.

[0066] Furthermore, the upper surface shape of the first part 121 is made by arranging multiple wires 111 as shown in Figure 2(A). When branching, increasing the thickness of the first section 121 suppresses the increase in wiring resistance. It is possible.

[0067] Note that in Figure 3, the substrate 131 is provided on the wiring 111 via an adhesive layer 132. Although this is shown, it is sufficient that the surface of the wiring 111 is insulated without being exposed, and this configuration is Not limited to this. For example, by forming resin on the wiring 111, the surface of the wiring 111 can be sealed. By doing so, the thickness of the display device 100 in the area where the wiring 111 is provided is reduced. This makes it easier to bend the wires 111 and 114. By removing the resin from certain areas and exposing the surface, wiring 111 and wiring 114 A portion of it can be used as connection terminal 112.

[0068] Figure 4 shows a schematic cross-sectional view of a portion of the wiring 111.

[0069] As shown in Figure 4(A), the thickness of the first portion 121 and the second portion 122 of the wiring 111 is If different thicknesses are used, the thicker and thinner parts will be made into a single-layer structure of the same material, and the wiring By removing a portion of the upper part through etching (also called half-etching), the thinner parts can be removed. It may be formed.

[0070] Alternatively, the thicker portion may have a laminated structure of two or more layers, and the thinner portion may have the same laminated structure The configuration may also be one in which one or more layers are omitted.

[0071] Figures 4(B) and 4(C) show that the thicker part of the wiring 111 is the same as the wiring 111a and the wiring This shows a schematic cross-sectional view of the 111b laminated structure.

[0072] As shown in Figure 4(B), wiring 111a is stacked on wiring 111b, and a portion of wiring 111a is The thin portion of wiring 111 may be formed by etching. If the materials for 1a and wiring 111b are different, wiring 111a will be processed by etching. During the process, the top surface of wiring 111b was etched, resulting in a thickness thinner than intended. This is preferable because it can suppress the occurrence of [unclear behavior].

[0073] Also, as shown in Figure 4(C), after removing a portion of wiring 111b by etching, the wiring By providing wiring 111a so as to cover the end of 111b, the thicker part of wiring 111 is shaped This is also acceptable. With this configuration, wiring 111a and wiring 111b are the same. This material is preferable because it does not cause any problems associated with etching.

[0074] Here, the material used for the first portion 121 of the wiring 111 is a material with high ductility or malleability. It is preferable that the material contains a certain component. In particular, it is preferable to use a material that has both high ductility and malleability. It seems that if the wiring used in the curved section 110 has high ductility, the wiring 111 will break due to the curve. It becomes more difficult. Also, if the malleability is high, when it returns from a curved state to a flat state, the wiring 1 This reduces the likelihood of cracks and other damage. Examples of materials with high ductility and malleability include gold, silver, platinum, and iron. Metal materials such as nickel, copper, aluminum, zinc, and tin, and alloys containing such metal materials. These are some examples.

[0075] If the first portion 121 of the wiring 111 is made into a laminated structure of two or more layers, then at least one layer Preferably, using the above-mentioned material for all layers can suppress disconnections and cracks in the wiring 111.

[0076] The above explains the shape of the wiring.

[0077] [Other display device configuration examples] The following describes an example of a display device configuration that differs in some aspects from the display device 100 shown in Figure 1. I will explain.

[0078] Figure 5(A) shows an example of the display device 100 when IC113 is not installed.

[0079] In the display device 100 shown in Figure 5(A), IC 113 and wiring 114 are not provided. Furthermore, the display unit 102 and the connection terminal 112 are directly electrically connected via the wiring 111. It is.

[0080] In Figure 5(B), the curved portion 110 is closer to the display portion 102 than to the protruding portion of the substrate 101. This shows the case where it is located in the part. With this configuration, the table as seen from the display side The area occupied by the display device 100 can be further reduced, resulting in a display device 100 with a narrow bezel. .

[0081] In Figure 5(C), the curve of the substrate 101 intersects with the curved portion 110 of the wiring 111. This shows a configuration where the direction of the curve and the direction of extension of the wiring 111 do not coincide. In other words, the wiring 111 is provided so as to intersect the curved portion 110 at an angle.

[0082] The curvature and extension directions of wiring 111 will be explained using Figure 6.

[0083] First, let's explain the curvature direction of the surface using Figure 6(A). By stretching or compressing the plane... When it is curved, at any point on the formed curved surface 141, a tangent along the curved surface 141 occurs. Line 142 is uniquely determined. Here, as shown by the dashed arrow in Figure 6(A), on the curved surface The direction perpendicular to the tangent line 142 in the plane tangent to any point is defined as the curvature direction 143.

[0084] Here, as shown in Figure 6(B), if we specify any two points on the curved surface 141, these The line 144 connecting the two points along the curved surface along the shortest distance is uniquely determined. Here, the line 14 At any point on 4, if line 144 is perpendicular to the tangent line 142, then the curvature of the curved surface 141. Assume that the direction coincides with the extension direction of line 144.

[0085] Furthermore, a line 144 connects any two points on the curved surface 141 along the curved surface by the shortest distance, The angle formed with the tangent line 142 is always equal at any point on the line 144. Since line 142 and the curvature direction 143 are always perpendicular, the angle between line 144 and tangent line 142 is acute. For angles (including 90 degrees), the angle obtained by subtracting from 90 degrees is the extension method of the line 144. This is called the angle between the direction and the curvature direction of the curved surface 141. Here, Figure 6(B) shows the extension direction of line 144. This corresponds to the case where the angle between the direction and the curvature direction of the curved surface 141 is 0 degrees.

[0086] Figures 6(C) and (D) show the wiring when the surface 145 of the wiring 111 is curved, respectively. This shows the situation at 111.

[0087] Figure 6(C) shows that the extension direction of the wiring 111 coincides with the curvature direction of the surface to be formed 145 (parallel). The case where the wiring 111 is arranged as follows is shown.

[0088] At this time, the wiring 111 takes the minimum value of the radius of curvature along its extension direction, and the formed surface This matches the radius of curvature of 145.

[0089] Figure 6(D) shows that the extension direction of the wiring 111 does not coincide with the curvature direction of the surface to be formed 145. Next, we will show the case where wiring 111 is arranged. In other words, the extension method of wiring 111. The wiring 111 is arranged such that the angle between the direction and the curvature direction is greater than 0 degrees.

[0090] The angle between the extension direction and the curvature direction of the wiring 111 is preferably, for example, 5 degrees or more and less than 90 degrees. The temperature should be between 15 degrees and 60 degrees, more preferably between 30 degrees and 60 degrees.

[0091] At this time, the radius of curvature of the wiring 111 in its extension direction is half the radius of curvature of the surface to be formed 145. It becomes larger than the diameter. Therefore, when the surface to be formed 145 is curved, the wiring 111 may be damaged or This reduces the risk of wire breakage, enabling the creation of highly reliable display devices.

[0092] Furthermore, bending the wiring 111 may cause damage or breakage of the wiring 111. The surface to be formed 145 (or substrate 101) is curved with a radius of curvature smaller than the radius of curvature. This is possible. Therefore, when a part of the substrate 101 is curved and folded back, the display device 10 The effective thickness of 0 can be made even thinner.

[0093] Figure 7 shows an example of a display device configuration different from the one described above.

[0094] Figure 7(A) shows the drive rotation, which was located near the protruding portion of the substrate 101 in Figure 1(A). Instead of path 104, there are two drive circuits (drive circuits 104a, 104b) that sandwich the pixel section 103. An example of a case where this is provided is shown. In particular, in a display device equipped with a high-resolution pixel section 103, It is preferable to divide the drive circuit into two parts.

[0095] Here, depending on the form of the electronic device incorporating the display device 100, the display unit 102 may be curved. In some cases, the position is fixed. For example, electronic devices that can be folded back at a predetermined position. In such cases, it is necessary to repeatedly curve the display unit 102 at the same position. The drive circuits 104a and 104b also alternate between a flat state and a curved state, thus increasing the drive cycle The electrical characteristics of elements such as transistors that constitute the path 104a and the drive circuit 104b change. There is a risk that this will happen.

[0096] Therefore, as shown in Figure 7(B), the position in the display unit 102 that overlaps with the curved portion 120 is It is preferable to divide the drive circuit and provide it so as to sandwich it. In Figure 7(B), as in Figure 7(A) The drive circuit 104a shown is positioned so as to sandwich the two curved sections 120 between the drive circuit 104c and the drive circuit It is divided into three parts: 104d, and the drive circuit 104e. Similarly, as shown in Figure 7(A) The drive circuit 104b is further divided into drive circuits 104f, 104g, and 104h. It is divided.

[0097] Figure 7(C) shows a magnified view of the area enclosed by the dashed line in Figure 7(B). Figure 7(C) shows... Two drive circuits (drive circuits 104c, 104d) are provided separately, and each drive circuit is connected to an electrical This shows multiple pixels 150 that are connected in a matrix-like manner.

[0098] Multiple wires 151 are provided between drive circuit 104c and drive circuit 104d, Various signals input from 111 to drive the drive circuit 104d It can be input to this. At this time, the circuit elements in drive circuit 104c and drive circuit 104d The spacing between child components (such as shift registers and buffers) should be narrower than the spacing between 150 pixels. .

[0099] Furthermore, as shown in Figure 7(D), a portion of the drive circuit 104c and drive circuit 104d is folded. It may also be configured to be arranged in a way that returns. With this configuration, the drive circuit 104c and narrow the spacing between circuit elements (such as shift registers and buffers) within the drive circuit 104d. Without this, the drive circuits can be arranged at the same spacing as when they are not divided. Especially pixel 1 This arrangement is effective when the 50 elements are arranged in high definition.

[0100] Note that this example shows the case where the drive circuit is divided into three parts, but if you divide the drive circuit... The number is not limited to this; it may also be configured by dividing it into two or four or more sections.

[0101] The above describes other configuration examples for the display device.

[0102] This embodiment may be implemented in appropriate combination with other embodiments described herein. It is possible.

[0103] (Embodiment 2) The following describes an example of a method for manufacturing a display device according to one aspect of the present invention.

[0104] [Example of manufacturing method] [Formation of the delamination layer] First, a release layer 202 is formed on the support substrate 201.

[0105] The support substrate 201 is a substrate that is heat-resistant to the heat applied in subsequent processes. The support substrate 201 may be, for example, a glass substrate, a resin substrate, a semiconductor substrate, a metal substrate, Ceramic substrates and the like can be used.

[0106] The release layer 202 can be, for example, a high-melting-point metal material such as tungsten, titanium, or molybdenum. Materials can be used. Tungsten is preferably used.

[0107] The delamination layer 202 can be formed, for example, by a sputtering method.

[0108] [Formation of the peeled layer and oxide layer] Next, the peeling layer 203 is formed on the peeling layer 202, and the peeling layer 202 and the peeling layer An oxide layer 211 is formed between 203 and the oxide layer 213.

[0109] The stripped layer 203 includes silicon oxide, silicon oxide nitride, silicon nitride oxide, and silicon nitride Inorganic insulating materials such as silicon and aluminum oxide can be used. As for 03, the layer containing the above-mentioned inorganic insulating material can be used as a single layer or in a laminated form. ru.

[0110] In particular, the peelable layer 203 is a laminated structure of two or more layers, and at least the peelable layer 202 is the most It is preferable to use a layer that releases hydrogen upon heating in the adjacent layer. For example, the release layer 202 The structure consists of a laminated layer containing silicon oxide nitride and another layer containing silicon nitride, viewed from the side.

[0111] In this specification, "silicon oxidnitride" refers to a material whose composition contains more than nitrogen. This refers to substances with a high oxygen content. On the other hand, it also refers to substances with a higher nitrogen content than oxygen content. The substance is called "silicon nitride oxide."

[0112] The peelable layer 203 is formed by a film deposition method such as sputtering or plasma CVD. It is possible. In particular, it is preferable to deposit the film using a plasma CVD method with a hydrogen-containing deposition gas. stomach.

[0113] Here, when the film to be peeled 203 is formed, the surface of the peeling layer 202 is oxidized, causing peeling. An oxide layer 211 can be formed between layer 202 and the peeled layer 203.

[0114] The oxide layer 211 is a layer containing an oxide of the metal contained in the release layer 202. Preferably, The layer will contain tungsten oxide.

[0115] Tungsten oxide is generally WO (3-x) These are written as WO3 and W2O5. W4O 11 It is a non-stoichiometric compound that can take on various compositions such as WO2. Oxide (TiO (2-x) ), or molybdenum oxide (MoO (3-x) ) also an unstoichiometric compound It is an object.

[0116] At this stage, the oxide layer 211 is preferably in a state that contains a large amount of oxygen. If tungsten is used as the exfoliation layer 202, the oxide layer 211 will have WO3 as its main component. It is preferable that the tungsten oxide is such that...

[0117] Here, before the formation of the peeled layer 203, nitrous oxide gas is applied to the surface of the peeled layer 202. Plasma treatment is performed under an atmosphere containing the oxide layer 211 to be formed on the surface of the peeling layer 202 in advance. It is also possible to do this. Using this method, the thickness of the oxide layer 211 can be changed by the plasma treatment conditions. By varying the parameters, the oxidation can be altered, and compared to cases without plasma treatment, the oxidation can be increased. This allows for improved control over the thickness of the material layer 211.

[0118] The thickness of the oxide layer 211 is, for example, 0.1 nm to 100 nm, preferably 0.5 nm. The thickness should be between m and 20 nm. If the oxide layer 211 is extremely thin, the cross-sectional image should be... This may not be possible to confirm.

[0119] The schematic cross-sectional view at this stage corresponds to Figure 8(A).

[0120] [Heat treatment] Next, a heat treatment is performed to alter the oxide layer 211.

[0121] By performing the heat treatment, hydrogen is released from the stripped layer 203 and supplied to the oxide layer 211. To be given.

[0122] The hydrogen supplied to the oxide layer 211 reduces the metal oxide within the oxide layer 211. Multiple regions with different oxygen compositions coexist within the oxide layer 211. For example, the exfoliation layer When tungsten is used as 202, the WO3 in the oxide layer 211 is reduced. A state with a lower oxygen composition (e.g., WO2) is produced, and these are mixed together. This is the state in which the metal oxides exhibit different crystal structures depending on the oxygen composition, thus oxidizing. By providing multiple regions with different oxygen compositions within the material layer 211, the mechanical strength of the oxide layer 211 is increased. The degree of weakening occurs. As a result, a state is created within the oxide layer 211 that is prone to collapse, and later This can improve the peelability in the peeling process.

[0123] The heat treatment is performed at a temperature above the temperature at which hydrogen is desorbed from the peeled layer 203, and before the softening point of the support substrate 201. It should be carried out at full capacity. Also, the temperature should be above the temperature at which the reduction reaction between the metal oxide and hydrogen in the oxide layer 211 occurs. It is preferable to do so. For example, when tungsten is used for the release layer 202, 420 Heat to a temperature of 450°C or higher, 600°C or higher, or 650°C or higher.

[0124] The higher the heat treatment temperature, the greater the amount of hydrogen desorbed from the stripped layer 203, and thereafter... This can improve the peelability. However, the heat resistance of the support substrate 201 and productivity must be considered. If you want to lower the heating temperature, you can pre-treat the peeling layer 202 with plasma as described above. By applying a treatment to form the oxide layer 211, high peeling is achieved even at low heat treatment temperatures. Sex can be realized.

[0125] [Formation of display unit and wiring] Next, the display section 102, wiring 111, and wiring 114 are formed on the peelable layer 203. Figure 8(B)).

[0126] The display unit 102 includes at least a display element, and in addition to the display element, it is electrically connected to the display element. It may also include transistors used in the wiring and circuits that control the driving of the display elements.

[0127] A bottom-gate type transistor is fabricated as the transistor included in the display unit 102. In this case, the gate electrode, gate insulating layer, semiconductor layer, source electrode and A transistor can be fabricated by sequentially forming drain electrodes.

[0128] The transistor configurations include staggered transistors and inverse staggered transistors. Any type may be used. Also, either a top-gate or bottom-gate transistor may be used. It may also be a channel-etched transistor or a channel-protected transistor. Transistors may be used. In the case of channel protection, only the channel region is used. A protective film may be provided in the portion where the source and drain electrodes and the semiconductor layer are in contact. In addition to providing an opening, a channel protective film may also be provided in locations other than the opening.

[0129] As a semiconductor applicable to the semiconductor layer in which the transistor channel is formed, for example, silicon Semiconductor materials such as condensate and germanium, compound semiconductor materials, organic semiconductor materials, or oxides Semiconductor materials may also be used.

[0130] Furthermore, there are no particular limitations on the crystallinity of the semiconductor used in the transistor; amorphous semiconductors are also acceptable. , crystalline semiconductors (microcrystalline semiconductors, polycrystalline semiconductors, single-crystal semiconductors, or partially crystalline semiconductors) Any semiconductor having a crystalline region may be used. If a semiconductor with crystalline properties is used, This is preferable because it suppresses the degradation of the transistor characteristics.

[0131] For example, when silicon is used as the semiconductor mentioned above, amorphous silicon, microcrystalline silicon Polycrystalline silicon or monocrystalline silicon can be used.

[0132] Furthermore, when using an oxide semiconductor as the above semiconductor, indium, gallium, zinc capsule It is preferable to use an oxide semiconductor containing at least one of the following. Typical examples include In-Ga -Examples include Zn-based metal oxides. They have a wider band gap than silicon, and Using an oxide semiconductor with a low rif density can suppress leakage current in the off state. It is preferable.

[0133] Furthermore, as a display element provided in the display unit 102, a light-emitting organic compound is used between a pair of electrodes. By forming a light-emitting element with a layer containing on the peelable layer 203, flex It is also possible to fabricate flexible light-emitting devices. For example, a flexible lighting device with a light-emitting element. It is also possible to fabricate a device (or light source), or to use transistors and light-emitting elements or liquid crystal elements. An image display device is fabricated by creating multiple pixels, including display elements, on the peelable layer 203. This is also possible. Examples of flexible image display devices will be described in later embodiments.

[0134] Here, wiring 111 and wiring 114 are the same as the wiring and electrodes that constitute part of the display unit 102. It is preferable to form it by processing a single layer. For example, the gate electrode and source electrode of a transistor. The electrode, drain electrode, electrode constituting part of the light-emitting element, and the transistor and light-emitting element are electrically connected. Examples include wiring for connecting to it.

[0135] Figure 8(B) shows an example where wiring 111 has a layered structure of wiring 111b and wiring 111a. The portion where only the wiring 111a of wiring 111 is formed corresponds to the first portion, The portion where wiring 111a and wiring 111b of line 111 are stacked corresponds to the second portion. Furthermore, wiring 114 has the same configuration as the second part of wiring 111. Here, for example, wiring The same material as the transistor's gate electrode is used for 111b, and the same material as the transistor is used for wiring 111a. By using the same material as the source electrode or drain electrode, wiring 11 can be done without increasing the number of steps. It is possible to form 1.

[0136] [Bonding] Next, the support substrate 201 and the substrate 131 are bonded together via the adhesive layer 132 (Figure 8( C)).

[0137] It is preferable to use a flexible substrate as the substrate 131. For example, polyethylene In addition to resins such as terephthalate (PET) and polyethylene naphthalate (PEN), A metal substrate, glass substrate, etc., that is thin enough to be flexible can be used. Alternatively, gold A composite material consisting of two or more of the following materials, glass, or resins may also be used.

[0138] Furthermore, if resin is used as the substrate 131, impurities such as water may be present on any of its surfaces. It is preferable that a barrier layer that is difficult to penetrate is provided. For example, silicon oxide, nitrile oxide Layers of silicon oxide, silicon nitride, silicon nitride, aluminum oxide, etc. are provided. It's okay to be there.

[0139] The adhesive layer 132 only needs to be able to fix the surfaces to be bonded together, and can be made of thermosetting resin or purple resin. External curing resins can be used. For example, acrylic, urethane, epoxy, or syl Resins such as resins having roxane bonds can be used. Also, the substrate 131 can be removed later. For removal, water-soluble resins or resins soluble in organic solvents can be used.

[0140] [Peeling] Next, the release layer 202 and the layer to be released 203 are separated at the oxide layer 211 (Figure 8(D)).

[0141] As a method of detachment, for example, the support substrate 201 or substrate 131 is fixed to the suction stage. This creates a starting point for peeling between the peeling layer 202 and the peeled layer 203. For example, a blade between them. A starting point for peeling may be formed by inserting a sharp object or other sharp-shaped tool. By irradiating the area with laser light, a portion of the peeling layer 202 is dissolved, evaporated, or thermally destroyed. A starting point for peeling may be formed. Also, a liquid (e.g., alcohol, water, or water containing carbon dioxide) may be used. (etc.) is dropped onto the edge of the release layer 202, and the liquid is transferred to the release layer 202 using capillary action. The peeling point may be formed by allowing the substance to penetrate the boundary of the peeling layer 203.

[0142] Next, in the portion where the starting point of delamination is formed, gently in the direction perpendicular to the adhesion surface By applying physical force, the peeled layer 203 can be peeled off without damaging it. To do this, attach tape or the like to the support substrate 201 or substrate 131, and the tape The peeling may be performed by pulling in the direction described above, or the hook-shaped member may be attached to the support substrate 201 or base The peeling process may be performed by hooking it onto the edge of the plate 131. Adhesive materials or vacuum suction are also possible. The material is attached to the back surface of the support substrate 201 or substrate 131 by suction and then pulled to remove it. You may do so. Alternatively, press an adhesive roller against the back surface of the support substrate 201 or substrate 131. The peeling process may also be performed by attaching the roller and moving it while rotating it.

[0143] Here, during the peeling process, a liquid containing water, such as water or an aqueous solution, is added to the peeling interface, and the liquid peels off. By performing the exfoliation in a way that penetrates the interface, the exfoliation properties can be improved.

[0144] Delamination occurs mainly within the oxide layer 211 and at the interface between the oxide layer 211 and the delamination layer 202. Therefore, as shown in Figure 8(D), the surface of the peeled layer 202 after peeling and the peeled layer The oxide layer 211 may adhere to the surface of layer 203. In Figure 8(D), the peeled layer The oxide layer 211a attached to the 203 side and the oxide layer 211b attached to the release layer 202 side This indicates that the thicknesses of the attached oxide layers 211a and 211b are different. This is also possible, as, as mentioned above, peeling is likely to occur at the interface between the oxide layer 211 and the peeling layer 202. It often adheres thickly to the peeled-off layer 203.

[0145] [Bonding] Subsequently, as shown in Figure 8(E), the adhesive layer 135 is applied to the peeled surface side of the peeled layer 203. The plate 101 is attached. Materials that can be used for the adhesive layer 135 and the substrate 101 include: The adhesive layer 132 and the substrate 131 can be considered, respectively.

[0146] [Exposed wiring] Next, in order to expose a portion of the surface of wiring 111 and wiring 114, the substrate 131 and the connecting A portion of the deposition layer 132 is removed to form an opening (Figure 8(F)).

[0147] For example, if resin is used for the substrate 131, masking tape can be used around the opening. Cover with a material such as a liner, and drop a solvent that dissolves the substrate 131 and adhesive layer 132 into the opening. By wiping away the separated substrate 131 and adhesive layer 132, the wiring 111 and wiring 114 An opening can be formed that exposes a portion of the surface. Alternatively, the substrate can be surrounded to enclose the opening. Cut an incision into the top surface of 131 with a cutter or other blade, and separate the substrate 131 and the adhesive layer 132. The substrate 131 and the adhesive layer may be peeled off by force. Alternatively, they may be peeled off by laser irradiation or the like. You may remove part of 132.

[0148] By following the above steps, a display device according to one aspect of the present invention can be manufactured.

[0149] Furthermore, the display unit 102, wiring 111, and wiring 114 are formed on the flexible substrate 101. The method is not limited to the above, and the display unit 102 and wiring 111 and Wiring 114 may be formed. The substrate 101 is connected to the display unit 102 and the wiring 111 and wiring 114. If the substrate 101 has heat resistance to the heat applied during the formation process, the display unit 1 Forming 02, wiring 111, and wiring 114 is preferable because it simplifies the process. At that time, with the substrate 101 fixed to the support substrate, the display unit 102 and wiring 111 and wiring 114 Forming these facilitates transport within and between the devices used to form them. It is preferable.

[0150] Furthermore, the combination of the release layer and the layer to be released is not limited to the above, and the release layer and the layer to be released You should select a material in which delamination occurs at the interface with the layer or within the delamination layer. For example, a metal and A combination of materials with low adhesion, such as resin, may also be used.

[0151] Furthermore, if peeling is possible at the interface between the support substrate and the layer to be peeled, a peeling layer may not be necessary. . For example, glass may be used as the support substrate, and an organic resin such as polyimide may be used as the peelable layer. Peeling may be performed by heating the organic resin. Alternatively, a metal layer may be provided between the support substrate and the peelable layer made of the organic resin, and peeling may be performed at the interface between the metal layer and the peelable layer by flowing an electric current through the metal layer to heat the metal layer.

[0152] This embodiment can be implemented in appropriate combination with other embodiments described in this specification.

[0153] (Embodiment 3) In this embodiment, a more specific configuration example of the display device exemplified in Embodiment 1 will be described with reference to the drawings. Hereinafter, an example of an image display device to which an organic EL element is applied will be described.

[0154] [Configuration Example 1 of Display Device] FIG. 9 shows a schematic cross-sectional view of a display device 300 employing a top emission method. Note that the schematic top view of the display device 300 shown in FIG. 9 can be considered in reference to FIG. 1, and FIG. 9 corresponds to a schematic cross-sectional view of the region including the display unit 102, the wiring 111, and the connection terminal 112 in FIG. 1, taken along a cut.

[0155] The display device 300 has a peelable layer 203 via an adhesive layer 135 on a flexible substrate 354. Further, on the peelable layer 203, there are a pixel unit 103 including a light-emitting element 340, a driving circuit 104, wiring 111, and a connection terminal 112. Also, a flexible substrate 353 is provided to face the substrate 354 via a sealing layer 352.

[0156] The wiring 111 has a first portion 121 and a second portion 122 having different thicknesses. The wiring 1​​​​​​​​​​​ The thick portion with a thickness of 11 (the second portion 122 in FIG. 9) has a laminated structure of the same conductive film as the gate electrode of the transistor to be described later and the same conductive film as the source electrode and the drain electrode. Also, the thin portion of the wiring 111 (the first portion 121 in FIG. 9) is composed of the same conductive film as the source electrode and the drain electrode of the transistor. Further, a part of the surface of the wiring 111 is exposed to form the connection terminal 112. As materials that can be used for the electrodes and wirings constituting the transistor and the display element, metals such as Al, Ti, Cr, Co, Ni, Cu, Y, Zr, Mo, Ru, Ag, Ta, and W, or alloys containing the above-mentioned metals, or nitrides of the above-mentioned metals can be used. When the wiring 111 is formed by processing the same conductive film as the electrodes and wirings constituting the transistor and the display element, in many cases, since its thickness is sufficiently thin, even materials with poor ductility and malleability can suppress breakage and disconnection due to bending.

[0157] FIG. 9 shows an example having a circuit in which the transistor 311 and the transistor 312, both of which are n-channel type, are combined as part of the drive circuit 104. Note that the drive circuit 104 is not limited to a circuit combining n-channel type transistors, and may be configured to have various CMOS circuits combining n-channel type transistors and p-channel type transistors, or circuits combining p-channel type transistors. FIG. 9 shows, as an example of the pixel portion 103, a cross-sectional structure of one pixel. The pixel includes a switching transistor 313, a current control transistor 314, and a current control As materials that can be used for the electrodes and wirings constituting the transistor and the display element, metals such as Al, Ti, Cr, Co, Ni, Cu, Y, Zr, Mo, Ru, Ag, Ta, and W, or alloys containing the above-mentioned metals, or nitrides of the above-mentioned metals can be used. When the wiring 111 is formed by processing the same conductive film as the electrodes and wirings constituting the transistor and the display element,

[0158] FIG. 9 shows an example having a circuit in which the transistor 311 and the transistor 312, both of which are n-channel type, are combined as part of the drive circuit 104. Note that the drive circuit 104 is not limited to a circuit combining n-channel type transistors, and may be configured to have various CMOS circuits combining n-channel type transistors and p-channel type transistors, [[ID=3%]] 4 is not limited to a circuit combining n-channel type transistors, and may be configured to have various CMOS circuits combining n-channel type transistors and p-channel type transistors, or circuits combining p-channel type transistors. type transistors.

[0159] In FIG. 9, as an example of the pixel portion 103, a cross-sectional structure of one pixel is shown. The pixel includes a switching transistor 313, a current control transistor 314, and a current control transistor 313 for switching, a transistor 314 for current control, and a transistor for current control The first electrode (source electrode or drain electrode) of transistor 314 is electrically connected. It includes an electrode 333. An insulating layer 319 is also provided to cover the end of the first electrode 333. .

[0160] The light-emitting element 340 has a first electrode 333, an EL layer 335, and a second electrode 3 on an insulating layer 317. 37 is a laminate in which the layers are stacked in order. The display device 300 illustrated in this configuration example is a top-surface light-emitting type Since the formula is applied to the display device, a translucent material is used for the second electrode 337. It is preferable to use a reflective material for electrode 333 of 1. The EL layer 335 is at least Contains a photosensitive organic compound. First electrode 333 and second electrode 337 sandwich the EL layer 335. By applying a voltage between them and allowing current to flow through the EL layer 335, the light-emitting element 340 is made to emit light. It is possible.

[0161] On the surface of the flexible substrate 353 facing the substrate 354, an adhesive layer 342 is applied. It has a peelable layer 343. Also, a color is located on the peelable layer 343 at a position opposite to the light-emitting element 340. - It has a filter 321 and a black matrix 322 in a position that overlaps with the insulating layer 319. The peelable layer 343 is a layer made of the same material as the peelable layer 203.

[0162] Furthermore, on the surface of substrate 353 that does not face substrate 354, wiring made of a transparent conductive film is provided. A touch sensor may be formed. In addition, a flexible material separate from substrates 353 and 354 may be used. A touch sensor formed on a substrate having the same properties may be mounted on top of the light-emitting substrate. Furthermore, when applying a touch sensor equipped with an optical sensor, multiple photoelectric transformers are provided in the pixel section 103. The conversion elements are arranged in a matrix.

[0163] The release layer 203 and the release layer 343 preferably have a function of suppressing the diffusion of impurities contained in the substrate 354 or the substrate 353, respectively. Further, the insulating layers 316 and 318 in contact with the semiconductor layer of the transistor preferably suppress the diffusion of impurities into the semiconductor layer. For these insulating layers, oxides or nitrides of semiconductors such as silicon or metals such as aluminum can be used. Further, a laminated film of such an inorganic insulating material or a laminated film of an inorganic insulating material and an organic insulating material may be used. As the inorganic insulating material, for example, materials selected from aluminum nitride, aluminum oxide, aluminum oxynitride, aluminum nitride oxide, magnesium oxide, gallium oxide, silicon nitride, silicon oxide, silicon oxynitride, silicon nitride oxide, germanium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, tantalum oxide, etc. can be used. Also, the above materials may be used alone or in a laminated form. In this specification, oxynitride means that the nitrogen content is higher than the oxygen content in its composition, and nitride oxide means that the oxygen content is higher than the nitrogen content in its composition. The content of each element can be measured using, for example, the Rutherford backscattering spectrometry (RBS spectrometry). Also, as the inorganic insulating material, hafnium silicate (HfSiO), hafnium silicate with nitrogen added (HfSiON), hafnium aluminate with nitrogen added (HfAl ), etc. can be used. また、このような無機絶縁材料の積層膜、または無機絶縁材料と有機絶縁材料の積層膜を用いてもよい。 Further, a laminated film of such an inorganic insulating material or a laminated film of an inorganic insulating material and an organic insulating material may be used.

[0164] 上記無機絶縁材料としては、例えば窒化アルミニウム、酸化アルミニウム、窒化酸化アルミニウム、酸化窒化アルミニウム、酸化マグネシウム、酸化ガリウム、窒化シリコン、 酸化シリコン、窒化酸化シリコン、酸化窒化シリコン、酸化ゲルマニウム、酸化ジルコニウム、酸化ランタン、酸化ネオジム、酸化タンタル等から選ばれた材料を用いることができる。また上記材料を単層で又は積層して用いてもよい。なお、本明細書中において、窒化酸化とは、その組成として、酸素よりも窒素の含有量が多いものであって、酸化窒化とは、その組成として、窒素よりも酸素の含有量が多いものを示す。なお、各元素の含有量は、例えば、ラザフォード後方散乱分析法(RBS分析法:Rutherford Backscattering Spectrometry)等を用いて測定することができる。また、上記無機絶縁材料として、ハフニウムシリケート(HfSiO)、窒素が添加されたハフニウムシリケート(HfSiON)、窒素が添加されたハフニウムアルミネート(HfAl 酸化シリコン、窒化酸化シリコン、酸化窒化シリコン、酸化ゲルマニウム、酸化ジルコニウム、酸化ランタン、酸化ネオジム、酸化タンタル等から選ばれた材料を用いることができる。また上記材料を単層で又は積層して用いてもよい。なお、本明細書中において、窒化酸化とは、その組成として、酸素よりも窒素の含有量が多いものであって、酸化窒化とは、その組成として、窒素よりも酸素の含有量が多いものを示す。なお、各元素の含有量は、例えば、ラザフォード後方散乱分析法(RBS分析法:Rutherford Backscattering Spectrometry)等を用いて測定することができる。また、上記無機絶縁材料として、ハフニウムシリケート(HfSiO)、窒素が添加されたハフニウムシリケート(HfSiON)、窒素が添加されたハフニウムアルミネート(HfAl ... きる。また上記材料を単層で又は積層して用いてもよい。なお、本明細書中において、窒化酸化とは、その組成として、酸素よりも窒素の含有量が多いものであって、酸化窒化とは、その組成として、窒素よりも酸素の含有量が多いものを示す。なお、各元素の含有量は、例えば、ラザフォード後方散乱分析法(RBS分析法:Rutherford Backscattering Spectrometry)等を用いて測定することができる。また、上記無機絶縁材料として、ハフニウムシリケート(HfSiO)、窒素が添加されたハフニウムシリケート(HfSiON)、窒素が添加されたハフニウムアルミネート(HfAl きる。また上記材料を単層で又は積層して用いてもよい。なお、本明細書中において、窒化酸化とは、その組成として、酸素よりも窒素の含有量が多いものであって、酸化窒化とは、その組成として、窒素よりも酸素の含有量が多いものを示す。なお、各元素の含有量は、例えば、ラザフォード後方散乱分析法(RBS分析法:Rutherford Backscattering Spectrometry)等を用いて測定することができる。また、上記無機絶縁材料として、ハフニウムシリケート(HfSiO)、窒素が添加されたハフニウムシリケート(HfSiON)、窒素が添加されたハフニウムアルミネート(HfAl 化酸化とは、その組成として、酸素よりも窒素の含有量が多いものであって、酸化窒化とは、その組成として、窒素よりも酸素の含有量が多いものを示す。なお、各元素の含有量は、例えば、ラザフォード後方散乱分析法(RBS分析法:Rutherford Backscattering Spectrometry)等を用いて測定することができる。また、上記無機絶縁材料として、ハフニウムシリケート(HfSiO)、窒素が添加されたハフニウムシリケート(HfSiON)、窒素が添加されたハフニウムアルミネート(HfAl は、その組成として、窒素よりも酸素の含有量が多いものを示す。なお、各元素の含有量は、例えば、ラザフォード後方散乱分析法(RBS分析法:Rutherford Backscattering Spectrometry)等を用いて測定することができる。また、上記無機絶縁材料として、ハフニウムシリケート(HfSiO)、窒素が添加されたハフニウムシリケート(HfSiON)、窒素が添加されたハフニウムアルミネート(HfAl は、例えば、ラザフォード後方散乱分析法(RBS分析法:Rutherford Backscattering Spectrometry)等を用いて測定することができる。また、上記無機絶縁材料として、ハフニウムシリケート(HfSiO)、窒素が添加されたハフニウムシリケート(HfSiON)、窒素が添加されたハフニウムアルミネート(HfAl ckscattering Spectrometry)等を用いて測定することができる。また、上記無機絶縁材料として、ハフニウムシリケート(HfSiO)、窒素が添加されたハフニウムシリケート(HfSiON)、窒素が添加されたハフニウムアルミネート(HfAl る。また、上記無機絶縁材料として、ハフニウムシリケート(HfSiO)、窒素が添加されたハフニウムシリケート(HfSiON)、窒素が添加されたハフニウムアルミネート(HfAl x )、窒素が添<000​​​​​​​​x O y N z ) high-k materials such as hafnium oxide and yttrium oxide may also be used.

[0165] Here, the peelable layer 343 can be fabricated by applying the method exemplified in Embodiment 2. That is, a peelable layer, an oxide layer, and the peelable layer 343 are formed on a support substrate, and after forming the color filter 321 and the black matrix 322 on the peelable layer 343, peeling is performed, and then the substrate 353 is attached via the adhesive layer 342 to the back side of the peelable layer 343, whereby the configuration shown in FIG. 9 can be obtained.

[0166] Also, as shown in FIG. 9, an oxide layer 211a or an oxide layer 341 may be provided between the peelable layer 203 and the adhesive layer 135, or between the peelable layer 343 and the adhesive layer 342. Since the oxide layer 211a and the oxide layer 341 are extremely thin and have light transmittance, even if they are provided on the light extraction side of the light emitted from the light-emitting element 340, there is almost no risk of reducing the light emission efficiency.

[0167] Here, when bonding the peelable layer 203 on which a transistor or the like is formed and the peelable layer 343 on which a color filter 321 or the like is formed with a sealing layer 352, it is preferable to perform the bonding in a state where they are provided on a support substrate before peeling respectively, and then peel them from their respective support substrates after the bonding. Particularly, in the case of a display device having a high-definition pixel portion 103, when high accuracy is required for the alignment between the color filter 321 and the pixel, by performing the bonding in a state fixed to a support substrate such as a glass substrate, these positions can be aligned with high accuracy. <统一替换为 ​​​​​​​​​​​​​​Alignment can be performed. This method enables high-definition flexible This makes it possible to create a display device.

[0168] Figure 9 shows the case where a light-emitting element is used as the display element. However, the present invention is one The embodiments are not limited thereto. Display elements include liquid crystal elements and electrophoretic elements (electron paper). It is also possible to use other methods. When using an electrophoretic element, a backlight is not required. Therefore, it is suitable as one form of a flexible display device.

[0169] [Example of display device configuration 2] This example describes a display device that employs a bottom emission method. This will be clarified. Note that explanations for parts that overlap with the above configuration example 1 will be omitted.

[0170] Figure 10 is a schematic cross-sectional view of the display device 350 illustrated in this configuration example.

[0171] The display device 350 differs from the display device 300 illustrated in Configuration Example 1 mainly in the following respects: The display device 350 has a color filter 321 on the substrate 354 side of the light-emitting element 340. It has the following features. Furthermore, the flexible substrate 353 is provided in direct contact with the sealing layer 352. The display device 300 does not have a peelable layer 343 or an adhesive layer 342.

[0172] In the light-emitting element 340, a translucent material is used for the first electrode 333, and the second electrode 33 A reflective material is used for 7. Therefore, the light emitted from the EL layer 335 is directed towards the substrate 354. It is launched.

[0173] In addition, a color filter is placed on the insulating layer 318 covering the transistor, in a position that overlaps with the light-emitting element 340. A filter 321 is provided. Furthermore, an insulating layer 317 covers the color filter 321. It is provided.

[0174] Here, the substrate 353 is such that impurities such as water cannot permeate from the outside of the substrate 353. It is preferable to use the material. Alternatively, the above-mentioned material is used on the surface of the substrate 353 that is in contact with the sealing layer 352. A film containing an insulating material that has the function of suppressing the diffusion of impurities is provided. It is preferable.

[0175] [Regarding materials and forming methods] The following describes the materials that can be used for each of the elements mentioned above, as well as the methods for forming them. .

[0176] [Flexible substrate] Materials for flexible substrates include organic resins and glass materials that are thin enough to be flexible. These can be used.

[0177] For example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN) ) Polyester resins such as polyacrylonitrile resin, polyimide resin, polymethylmeth Crylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin Polyamide resin, cycloolefin resin, polystyrene resin, polyamide-imide resin, Examples include polyvinyl chloride resin. In particular, it is preferable to use a material with a low coefficient of thermal expansion. For example, if the coefficient of thermal expansion is 30 × 10 -6 Polyamide-imide resins with a K value of / K or less, poly Mid resin, PET, etc. can be suitably used. Also, a substrate in which resin is impregnated into a fibrous material ( (Also written as prepreg) or substrates in which inorganic fillers are mixed with organic resin to lower the coefficient of thermal expansion are used. It can also be used.

[0178] If the above material contains fibrous material, the fibrous material is a high strength organic or inorganic compound. High-strength fibers are used. Specifically, high-strength fibers are fibers with a high tensile modulus or Young's modulus. This refers to polyvinyl alcohol-based fibers, polyester fibers, and poly- Aramid fibers, polyethylene fibers, aramid fibers, poly(p-phenylenebenzobisoxide) Examples include sazole fibers, glass fibers, or carbon fibers. Examples of glass fibers include E-glass. Examples include glass fibers using S glass, D glass, Q glass, etc. These are woven fabrics. Alternatively, it can be used in the form of a nonwoven fabric, and a structure made by impregnating this fiber with resin and hardening the resin is made flexible. It may also be used as a substrate having flexibility. As a substrate having flexibility, it may be made of fibers and resin. Using structures improves reliability against damage caused by bending and localized compression, therefore it is preferable. stomach.

[0179] The flexible substrate on the side from which light is extracted from the light-emitting element 340 has an EL layer 335 A material that is translucent to light emission is used. In the material provided on the light emission side, the light extraction For improved efficiency, a higher refractive index is preferable for materials that are flexible and translucent. For example, by dispersing an inorganic filler with a high refractive index in an organic resin, the organic resin alone can be used. This enables the creation of substrates with a higher refractive index than conventional substrates. In particular, it enables the creation of substrates with small inorganic particles of 40 nm or less. Using a rayon is preferable because it does not compromise optical transparency.

[0180] Furthermore, the substrate provided on the side opposite to the light emission side does not need to be light-transmitting, therefore, In addition to the substrates listed above, metal substrates can also be used. The thickness of the metal substrate depends on its flexibility and bending properties. To obtain the desired properties, the particle size should be between 10 μm and 200 μm, preferably between 20 μm and 50 μm. It is preferable that this be the case. There are no particular limitations on the material that constitutes the metal substrate, but for example, A Aluminum, copper, nickel, or alloys of metals such as aluminum alloy or stainless steel Gold and other materials can be suitably used. A flexible substrate on the side that does not extract light is made of metal. Alternatively, using a conductive substrate containing an alloy material allows for heat dissipation from the light-emitting element 340. It is desirable because it increases the likelihood of infection.

[0181] Furthermore, when using a conductive substrate, the surface of the substrate may be oxidized or an insulating coating may be applied to the surface. It is preferable to use a substrate that has been insulated by forming a border film or similar treatment. For example, electrodeposition Coating methods such as spin coating and dip coating, printing methods such as screen printing, and vapor deposition. An insulating film is formed on the surface of a conductive substrate using deposition methods such as sputtering. Alternatively, the base can be left or heated in an oxygen atmosphere, or by methods such as anodic oxidation. The surface of the board may be oxidized.

[0182] Furthermore, if the surface of the flexible substrate has an uneven shape, the uneven shape is covered and smoothed. A planaring layer may be provided to form a flattened insulating surface. The planaring layer may be an insulating material. Materials can be used, and they can be formed from organic or inorganic materials. For example, flat The flattened layer can be formed using deposition methods such as sputtering, coating methods such as spin coating and dip coating, Using ejection methods such as inkjet and dispensing methods, and printing methods such as screen printing. It can be formed by doing so.

[0183] Furthermore, a material consisting of multiple layers can be used as a flexible substrate. For example, a material made by laminating two or more layers of organic resin, or a material made from an organic resin layer and an inorganic material. Materials are used that consist of layers of inorganic materials, or materials that consist of layers of two or more inorganic materials. By providing a layer made of the material, the intrusion of moisture and other substances into the interior is suppressed, thus preventing the light-emitting device from being damaged. This can improve the reliability of the installation.

[0184] The inorganic materials mentioned above include oxide materials, nitride materials, and oxynitriding materials of metals and semiconductors. They can exist. For example, silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide. Aluminum, aluminum nitride, aluminum oxynitride, etc., can be used.

[0185] For example, when laminating a layer made of organic resin and a layer made of inorganic material, the organic resin The above inorganic material is applied to the upper or lower layer of the layer by sputtering, CVD, or coating methods. A layer made of the material can be formed.

[0186] [Light-emitting element] In the light-emitting element 340, the electrode provided on the light-emitting side is for light emission from the EL layer 335. A translucent material is used.

[0187] Examples of translucent materials include indium oxide, indium oxide tin oxide, and indium oxide. Zinc oxide with added gallium, zinc oxide, and zinc oxide with added gallium can be used. Graphene may be used as the conductive layer of the electrode. Gold, silver, platinum, magnesium Cium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium Alternatively, metallic materials such as titanium, or alloys containing these, can be used. Nitrides of these metallic materials (for example, titanium nitride) may also be used. When using the nitride (or its equivalent), it should be thinned to a degree that allows light to pass through. A laminated film of the material can be used as the conductive layer of the electrode. For example, silver and magnesium. By using a laminated film of an alloy and indium tin oxide, the conductivity can be improved. Therefore, it is preferable.

[0188] Such electrodes are formed by methods such as vapor deposition and sputtering. Shapes are formed using extrusion methods such as the cuteting method, printing methods such as screen printing, or plating methods. It is possible.

[0189] Furthermore, when forming the above-mentioned conductive oxide having light-transmitting properties by sputtering, When the conductive oxide is deposited in an atmosphere containing argon and oxygen, its light transmittance is improved. It is possible.

[0190] Furthermore, when forming a conductive oxide film on the EL layer, it contains argon with reduced oxygen concentration. A first conductive oxide film deposited under an atmosphere, and a film deposited under an atmosphere containing argon and oxygen. If a second conductive oxide film is used as a laminated film, the film deposition damage to the EL layer can be reduced. This is preferable because it allows for this. In particular, the argon gas used when forming the first conductive oxide film is preferable. The purity of the material is preferable, for example, the dew point should be -70°C or lower, preferably -100°C or lower. It is preferable to use argon gas.

[0191] The electrode located on the side opposite to the light emission side has reflectivity to the light emitted from the EL layer 335. It is preferable to use materials that are suitable for this purpose.

[0192] Examples of light-reflecting materials include aluminum, gold, platinum, silver, nickel, and tan. Metals such as gusten, chromium, molybdenum, iron, cobalt, copper, or palladium, Alloys containing these can be used. In addition, lanthanum and neodymium can be added to these metals or alloys. You may also add aluminum, germanium, etc. In addition, aluminum-titanium alloys, aluminum Aluminum-containing alloys such as aluminum-nickel alloys and aluminum-neodymium alloys. Gold (aluminum alloy), silver and copper alloy, silver, palladium and copper alloy, silver and magnesium Silver-containing alloys such as copper alloys can also be used. Alloys containing silver and copper have high heat resistance. It is preferable to further laminate a metal film or a metal oxide film in contact with the aluminum alloy film. This makes it possible to suppress the oxidation of the aluminum alloy film. The metal film, metal oxide film Examples of materials include titanium and titanium oxide. Also, the above-mentioned translucent materials... A film made of a certain material and a film made of a metal material may be laminated together. For example, silver and indium oxide The materials used include tin multilayer films, silver-magnesium alloys, and indium tin oxide multilayer films. It is possible.

[0193] Such electrodes are formed by methods such as vapor deposition and sputtering. Shapes are formed using extrusion methods such as the cuteting method, printing methods such as screen printing, or plating methods. It is possible.

[0194] The EL layer 335 is a layer containing at least a luminescent organic compound (hereinafter also referred to as the luminescent layer). It is sufficient to include it, and it can consist of a single layer or multiple layers stacked on top of each other. The structure consists of, from the anode side, a hole injection layer, a hole transport layer, a light emission layer, and an electron transport layer. An example is a configuration in which layers and electron injection layers are stacked. Note that this excludes the light-emitting layer. These layers do not necessarily all need to be present in the EL layer 335. Also, these layers do not overlap. It can also be provided in this way. Specifically, multiple light-emitting layers can be stacked within the EL layer 335. Furthermore, a hole injection layer may be provided on top of the electron injection layer. In addition, a charge generation layer may be used as an intermediate layer. Other components, such as an electronic relay layer, can be added as appropriate. Also, for example, different light emission colors can be used. A configuration in which multiple light-emitting layers are stacked may also be used. For example, two or more light-emitting layers that are complementary in color. By stacking these layers, white light emission can be obtained.

[0195] The EL layer 335 is produced by vacuum deposition, or by ejection methods such as inkjet or dispensing. It can be formed using coating methods such as spin coating.

[0196] [Adhesive layer, sealing layer] Examples of adhesive and sealing layers include resins that cure at room temperature, such as two-component mixed resins, and thermosetting resins. Curable materials such as resins, photocurable resins, and gels can be used. For example, POXy resins, acrylic resins, silicone resins, phenolic resins, polyimides, polyvinyl Chloride (PVC), polyvinyl butyral (PVB), ethylene vinyl acetate (E) Materials such as VA can be used. In particular, materials with low moisture permeability, such as epoxy resin, are preferred. .

[0197] Furthermore, the adhesive layer and sealing layer may contain a desiccant. For example, an alkaline earth metal acid. Substances that adsorb moisture through chemical adsorption, such as phosphates (calcium oxide, barium oxide, etc.) Quality can be used. Other desiccants include zeolite and silica gel, A substance that adsorbs moisture by physical adsorption may be used. Additionally, a granular desiccant may be provided. As a result, the light emitted from the light-emitting element 340 is diffusely reflected by the desiccant, thus providing high reliability. Furthermore, it is possible to realize a light-emitting device with improved viewing angle dependence (particularly useful for lighting applications).

[0198] [Color filter and black matrix] The color filter 321 is intended to adjust the color of the light emitted from the light-emitting element 340 and improve color purity. It is provided as follows. For example, when using a white light-emitting element to make a full-color display device. In this case, multiple pixels with different color filters are used. You can also use three color filters: green (G), blue (B), and yellow (Y). It is also possible to use four colors by adding this. In addition, white (W) can be added in addition to R, G, B (and Y). Pixels may be used, and four (or five) colors may be used.

[0199] Furthermore, a black matrix 322 is provided between adjacent color filters 321. The black matrix 322 blocks light that wraps around from the light-emitting elements 340 of adjacent pixels. This reduces light and suppresses color mixing between adjacent pixels. Here, the edges of the color filter 321 are... By positioning it so as to overlap with the rack matrix 322, light leakage can be suppressed. The black matrix 322 uses a material that blocks the light emitted from the light-emitting element 340. It can be formed using metals, organic resins containing pigments, etc. The pixel matrix 322 may be provided in areas other than the pixel section 103, such as the drive circuit 104. .

[0200] Furthermore, an overcoat is provided to cover the color filter 321 and the black matrix 322. It is acceptable to leave it as is. The overcoat preserves the color filter 321 and the black matrix 322. In addition to protecting the surface, it also suppresses the diffusion of impurities contained within it. The overcoat is luminescent. It is composed of a material that transmits light emitted from element 340, and uses an inorganic insulating film or an organic insulating film. It is possible.

[0201] The above is a description of the materials and the manufacturing method.

[0202] This embodiment may be implemented in appropriate combination with other embodiments described herein. It is possible.

[0203] (Embodiment 4) This embodiment describes an example of an electronic device equipped with a display device according to one aspect of the present invention. .

[0204] A display device according to one aspect of the present invention can have a curved display surface. Examples of electronic devices that can incorporate it include television equipment (television, or television). (also called a revision receiver), monitors for computers, digital cameras, digital Video cameras, digital photo frames, mobile phones (also called mobile phones or mobile phone devices) ), portable game consoles, personal digital assistants, sound playback devices, large game machines such as pachinko machines, etc. Examples include lighting and display devices used on the interior or exterior walls of houses and buildings, and in the interiors of automobiles. Alternatively, it can be incorporated along the curved surface of the exterior.

[0205] Figure 11(A) shows an example of a mobile phone. The mobile phone 7400 has a housing 740 In addition to the display unit 7402 incorporated into 1, there are also operation buttons 7403, an external connection port 7404, It is equipped with speaker 7405, microphone 7406, etc. Note that mobile phone 7400 is... The device is manufactured by using a display device according to one embodiment of the invention as the display unit 7402.

[0206] The mobile phone 7400 shown in Figure 11(A) allows the user to touch the display unit 7402 with their finger or the like. Information can be entered. Also, all kinds of actions such as making phone calls or typing text can be performed. This operation can be performed by touching the display unit 7402 with a finger or the like.

[0207] Furthermore, the power can be turned ON or OFF by operating the control button 7403, and the display unit 7402 will show the following: You can switch the type of image displayed. For example, from the email composition screen to the main menu You can switch to the window screen.

[0208] Here, the display unit 7402 incorporates a display device according to one aspect of the present invention. This means that it can display information along a curved screen surface and is a highly reliable mobile phone. It is possible.

[0209] Figure 11(B) shows an example of a wristband-type display device. Portable display device 710 0 comprises the housing 7101, the display unit 7102, the operation buttons 7103, and the transmitting / receiving device 7104. Prepare.

[0210] The portable display device 7100 is capable of receiving video signals via the transceiver 7104, and receives The video can be displayed on the display unit 7102. Additionally, the audio signal can be transmitted to other receiving devices. It is also possible.

[0211] Additionally, the operation button 7103 can be used to turn the power on and off, and to switch the displayed image. You can also adjust the volume of the sound, etc.

[0212] Here, the display unit 7102 incorporates a display device according to one aspect of the present invention. This allows for the creation of a highly reliable portable display device equipped with a curved display section.

[0213] Figure 11(C) shows an example of a wristwatch-type personal information terminal. Personal information terminal 7200 The components are: housing 7201, display unit 7202, band 7203, buckle 7204, and operation button 7 It is equipped with terminals 205 and input / output terminals 7206, etc.

[0214] The 7200 mobile information terminal offers mobile phone calls, email, document viewing and creation, music playback, and more. It can run various applications such as internet communication and computer games. Cut.

[0215] The display unit 7202 has a curved display surface, and displays information along the curved surface. It is possible to do so. In addition, the display unit 7202 is equipped with a touch sensor, and the screen can be touched with a finger or stylus. It can be operated by touching it. For example, icon 7 displayed on the display unit 7202 Touching 207 will launch the application.

[0216] The 7205 control button is used for time setting, as well as power on / off, wireless communication on, and more. Various functions such as operation, activation and deactivation of silent mode, and activation and deactivation of power saving mode. It can be made to hold. For example, the operation system built into the portable information terminal 7200 The stem also allows you to freely configure the function of the control button 7205.

[0217] Furthermore, the personal information terminal 7200 is capable of performing short-range wireless communication. For example, By communicating with a wireless headset, hands-free calls can be made. It's also possible.

[0218] Furthermore, the portable information terminal 7200 is equipped with an input / output terminal 7206, and connects to other information terminals via a connector. It can directly exchange data via this. It can also be charged via input / output terminal 7206. It is also possible to perform this operation. Note that charging is performed wirelessly without using input / output terminal 7206. That's fine.

[0219] Applying a display device according to one aspect of the present invention to the display unit 7202 of the portable information terminal 7200. It is possible.

[0220] A display device according to one aspect of the present invention can be applied to the display unit of the electronic device illustrated in this embodiment. Therefore, it is possible to realize electronic devices that are highly reliable, capable of displaying on curved surfaces, and have narrow bezels. can.

[0221] This embodiment may be implemented in appropriate combination with other embodiments described herein. It is possible. [Explanation of symbols]

[0222] 100 display device 101 circuit board 102 Display section 103 pixel section 104 Drive Circuit 104a Drive Circuit 104b Drive Circuit 104c drive circuit 104d drive circuit 104e drive circuit 104f drive circuit 104g drive circuit 104h drive circuit 110 Curved section 111 Wiring 111a Wiring 111b wiring 112 Connection terminals 113 IC 114 Wiring 120 Curved section 121 Part 1 122 Part 2 131 circuit boards 132 Adhesive layer 133 ACF 134 Bump 135 Adhesive layer 141 Curved surface 142 Tangent line 143 Curving direction 144 line 145 Surface to be formed 151 Wiring 201 Support substrate 202 Exfoliation layer 203 Peeling layer 211 Oxide layer 211a Oxide layer 211b Oxide layer 300 display device 311 transistors 312 transistors 313 Transistors 314 transistors 316 Insulating layer 317 Insulating layer 318 Insulating layer 319 Insulating layer 321 Color Filters 322 Black Matrix 333 Electrode 335 EL layer 337 Electrode 340 light-emitting elements 341 Oxide layer 342 Adhesive layer 343 Peeling layer 350 Display device 352 Sealing layer 353 circuit boards 354 circuit boards 7100 Portable Display Device 7101 enclosure 7102 Display section 7103 Operation Buttons 7104 Transceiver 7200 Mobile Information Terminal 7201 enclosure 7202 Display section 7203 Band 7204 Buckle 7205 Operation Buttons 7206 Input / output terminal 7207 Icons 7400 mobile phones 7401 enclosure 7402 Display section 7403 Operation Buttons 7404 External connection port 7405 Speaker 7406 Microphone

Claims

1. A display device having a pixel portion and a plurality of wirings arranged between the pixel portion and a plurality of connection terminals on one side of a flexible substrate, The substrate has a curved portion that is curved such that the plurality of connection terminals are arranged on the opposite side of the pixel portion. At least one of the plurality of wirings has a first portion having a first thickness, and a second portion that branches into a plurality of regions by at least one opening, and each of the plurality of regions has a thickness greater than that of the first portion. The second part is a display device having a region located in the curved portion.

2. A flexible substrate has a pixel section on one side, and a plurality of wires arranged between the pixel section and a plurality of connection terminals. The aforementioned pixel portion is a display device that can be repeatedly bent at a predetermined position, The substrate has a curved portion that is curved such that the plurality of connection terminals are arranged on the opposite side of the pixel portion. At least one of the plurality of wirings has a first portion having a first thickness, and a second portion that branches into a plurality of regions by at least one opening, and each of the plurality of regions has a thickness greater than that of the first portion. The second part is a display device having a region located in the curved portion.

3. A display device having a pixel portion and a plurality of wirings arranged between the pixel portion and a plurality of connection terminals on one side of a flexible substrate, The substrate has a curved portion that is curved such that the plurality of connection terminals are arranged on the opposite side of the pixel portion. At least one of the plurality of wirings has a first portion having a first thickness, and a second portion that branches into a plurality of regions by at least one opening, and each of the plurality of regions has a thickness greater than that of the first portion. The second portion has a region located in the curved portion, In a plan view, the first portion has a first wiring width, In plan view, the second portion has a second wiring width including the at least one opening in the region located in the curved portion. A display device in which the first wiring width and the second wiring width are the same width or approximately the same width.

4. A flexible substrate has a pixel section on one side, and a plurality of wires arranged between the pixel section and a plurality of connection terminals. The aforementioned pixel portion is a display device that can be repeatedly bent at a predetermined position, The substrate has a curved portion that is curved such that the plurality of connection terminals are arranged on the opposite side of the pixel portion. At least one of the plurality of wirings has a first portion having a first thickness, and a second portion that branches into a plurality of regions by at least one opening, and each of the plurality of regions has a thickness greater than that of the first portion. The second portion has a region located in the curved portion, In a plan view, the first portion has a first wiring width, In plan view, the second portion has a second wiring width including the at least one opening in the region located in the curved portion. A display device in which the first wiring width and the second wiring width are the same width or approximately the same width.

5. A display device having a pixel portion and a plurality of wirings arranged between the pixel portion and a plurality of connection terminals on one side of a flexible substrate, The substrate has a protrusion, and at least one of the plurality of connection terminals is arranged on at least a part of the protrusion. The protruding portion has a curved portion that is curved so that the plurality of connection terminals are arranged on the opposite side of the pixel portion. At least one of the plurality of wirings has a first portion having a first thickness, and a second portion that branches into a plurality of regions by at least one opening, and each of the plurality of regions has a thickness greater than that of the first portion. The second part is a display device having a region located in the curved portion.

6. A flexible substrate has a pixel section on one side, and a plurality of wires arranged between the pixel section and a plurality of connection terminals. The aforementioned pixel portion is a display device that can be repeatedly bent at a predetermined position, The substrate has a protrusion, and at least one of the plurality of connection terminals is arranged on at least a part of the protrusion. The protruding portion has a curved portion that is curved so that the plurality of connection terminals are arranged on the opposite side of the pixel portion. At least one of the plurality of wirings has a first portion having a first thickness, and a second portion that branches into a plurality of regions by at least one opening, and each of the plurality of regions has a thickness greater than that of the first portion. The second part is a display device having a region located in the curved portion.

7. A display device having a pixel portion and a plurality of wirings arranged between the pixel portion and a plurality of connection terminals on one side of a flexible substrate, The substrate has a protrusion, and at least one of the plurality of connection terminals is arranged on at least a part of the protrusion. The protruding portion has a curved portion that is curved so that the plurality of connection terminals are arranged on the opposite side of the pixel portion. At least one of the plurality of wirings has a first portion having a first thickness, and a second portion that branches into a plurality of regions by at least one opening, and each of the plurality of regions has a thickness greater than that of the first portion. The second portion has a region located in the curved portion, In a plan view, the first portion has a first wiring width, In plan view, the second portion has a second wiring width including the at least one opening in the region located in the curved portion. A display device in which the first wiring width and the second wiring width are the same width or approximately the same width.

8. A flexible substrate has a pixel section on one side, and a plurality of wires arranged between the pixel section and a plurality of connection terminals. The aforementioned pixel portion is a display device that can be repeatedly bent at a predetermined position, The substrate has a protrusion, and at least one of the plurality of connection terminals is arranged on at least a part of the protrusion. The protruding portion has a curved portion that is curved so that the plurality of connection terminals are arranged on the opposite side of the pixel portion. At least one of the plurality of wirings has a first portion having a first thickness, and a second portion that branches into a plurality of regions by at least one opening, and each of the plurality of regions has a thickness greater than that of the first portion. The second portion has a region located in the curved portion, In a plan view, the first portion has a first wiring width, In plan view, the second portion has a second wiring width including the at least one opening in the region located in the curved portion. A display device in which the first wiring width and the second wiring width are the same width or approximately the same width.

9. In any one of claims 5 to 8, The first part is a display device having a region located at the protruding portion.

10. In any one of claims 1 to 9, In a plan view, the substrate has at least a portion whose length along the short-side direction of the pixel portion from one end to the other is a first length, and a portion whose length is a second length that is smaller than the first length. In a plan view, the pixel portion is arranged in the portion of the first length, In a plan view, the plurality of connection terminals are arranged in the portion of the second length of the display device.

11. In any one of claims 1 to 10, The plurality of connection terminals overlap with the pixel portion, wherein the display device.

12. In any one of claims 1 to 11, The second part of the display device is a metal material selected from gold, silver, platinum, iron, nickel, copper, aluminum, zinc, or tin.

13. In any one of claims 1 to 12, The first part is a display device having a region located between the curved portion and the pixel portion.

14. In any one of claims 1 to 12, The first part is a display device having a region located between the curved portion and the plurality of connection terminals.

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