Imaging device

Abstract

To provide an imaging device that satisfies a heat radiation performance so as not to hinder a moving imaging element.SOLUTION: An imaging device comprises: an imaging element that can move within a movable range in a direction different from an optical axis direction; a first circuit board 115a that mounts the imaging element; a second circuit board 107 opposed to the first circuit board; a first flexible substrate 112 that electrically connects between the first and second circuit boards; and a fan 130. The first flexible substrate is bent at a region superposed with the movable range of the imaging element in the optical axis direction. An inner surface 112b of the closest bent part from a side connected with the first circuit board 115a, of the first flexible substrate 112, is arranged so as not to exist within a range 131a in a blow direction of an air flow exhausted from an air exhaustion port of the fan when viewed from the optical axis direction.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an imaging device having a heat dissipation structure for heat generated from a heat source.

Background Art

[0002] In recent years, with the demand for miniaturization of electronic devices, the miniaturization and high density of mounted components inside the devices have become remarkable.

[0003] On the other hand, while the demand for higher functionality of imaging devices, particularly for higher performance of video functions, is increasing, the amount of heat generated by the devices tends to increase.

[0004] When shooting a video in a high-temperature environment, as the temperature inside the imaging device rises, there is a high possibility that it may cause malfunction or performance degradation of the mounted components, and ultimately cause a failure of the imaging device.

[0005] Therefore, when the amount of heat dissipation by natural heat dissipation is not sufficient for the amount of heat generated by the imaging device, a heat dissipation structure by forced air cooling using a fan or a heat conduction member is used.

[0006] In Patent Document 1, a device for cooling by connecting a movable imaging element with a heat conduction member is disclosed.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0008] In recent years, an imaging device that moves an imaging element in a direction perpendicular to the optical axis direction to perform shake correction in order to improve image quality has become widespread.

[0009] Even in imaging devices that perform image stabilization, sufficient heat dissipation is required because the heat generated in the image sensor during the operation of the image stabilization mechanism, continuous shooting, and video recording affects image quality.

[0010] However, the device disclosed in Patent Document 1 mentioned above has the problem that it is physically connected to the movable image sensor, which hinders the operation of the image sensor.

[0011] The present invention has been made in view of the above problems, and in the embodiments of the present invention, the objective is to provide an imaging device that satisfies heat dissipation performance without obstructing a movable image sensor. [Means for solving the problem]

[0012] This invention One aspect is an image sensor that can move within a movable range in a direction different from the optical axis direction, 、 A first circuit board on which the image sensor is mounted, a second circuit board facing the first circuit board, and a first flexible connection that electrically connects the first circuit board and the second circuit board. component And the fans 、 Equipped with a first flexibility component It is bent in a region that overlaps with the movable range of the image sensor in the direction of the optical axis, and when viewed from the direction of the optical axis, the first flexibility component The inner surface of the bent portion closest to the side connected to the first circuit board is the exhaust port of the fan. On the extension in the direction of airflow It is characterized by being arranged so that it does not exist in [location]. Another aspect of the present invention is that it comprises an image sensor that can move within a range of motion in a direction different from the optical axis direction, a first circuit board on which the image sensor is mounted, a second circuit board facing the first circuit board, a first flexible member that electrically connects the first circuit board and the second circuit board, and a fan, wherein the first flexible member is bent in a region that overlaps with the range of motion of the image sensor in the optical axis direction, the position of the first flexible member in the optical axis direction is located on the extension of the airflow direction of the exhaust port of the fan, and the bending direction of the bent portion of the first flexible member closest to the side connected to the first circuit board is arranged to be perpendicular to the airflow direction of the air discharged from the exhaust port of the fan. [Effects of the Invention]

[0013] According to one embodiment of the present invention, it is possible to prevent the airflow generated by the airflow generating means from being obstructed by the flexible substrate, thereby preventing a reduction in the heat dissipation performance of the image sensor. [Brief explanation of the drawing]

[0014] [Figure 1] Digital camera 100 of the present invention [Figure 2] (a) Front exploded perspective view of the image sensor unit 106 of the present invention, (b) Rear exploded perspective view of the image sensor unit 106 of the present invention [Figure 3] (a) Rear view of the image sensor unit 106 and cooling fan 130 of the present invention, (b) schematic rear view of the cooling fan 130 of the image sensor unit 106 of the present invention [Figure 4] Rear perspective view of the image sensor unit 106 and heat dissipation fan 130 according to the first embodiment of the present invention [Figure 5] (a) Cross-sectional view AA of the image sensor unit 106 and heat dissipation fan 130 according to the first embodiment of the present invention, (b) Cross-sectional view BB of the image sensor unit 106 and heat dissipation fan 130 according to the first embodiment of the present invention, (c) Cross-sectional view CC of the image sensor unit 106 and heat dissipation fan 130 according to the first embodiment of the present invention, (d) Rear view of the image sensor unit 106 and heat dissipation fan 130 according to the first embodiment of the present invention [Figure 6] (a) Side view of the image sensor unit 106 according to the first embodiment of the present invention, (b) DD cross-sectional view of the image sensor unit 106 and the heat dissipation fan 130 according to the first embodiment of the present invention [Figure 7] (a) Cross-sectional view AA of the image sensor unit 106 according to the second embodiment of the present invention, (b) Cross-sectional view BB of the image sensor unit 106 according to the second embodiment of the present invention, (c) Rear view of the image sensor unit 106 and heat dissipation fan 130 according to the second embodiment of the present invention [Figure 8] (a) Side view of the image sensor unit 106 according to the second embodiment of the present invention, (b) CC cross-sectional view of the image sensor unit 106 and the heat dissipation fan 130 according to the second embodiment of the present invention [Figure 9] (a) Rear perspective view of the image sensor unit 106 and cooling fan 130 according to the third embodiment of the present invention, (b) Rear perspective view of the image sensor unit 106 and cooling fan 130 according to the third embodiment of the present invention [Figure 10](a) Cross-sectional view of the imaging device unit 106 and the cooling fan 130 according to the third embodiment of the present invention, (b) Cross-sectional view of the imaging device unit 106 and the cooling fan 130 according to the third embodiment of the present invention, (c) Cross-sectional view of the imaging device unit 106 and the cooling fan 130 according to the third embodiment of the present invention, (d) Rear view of the imaging device unit 106 and the cooling fan 130 according to the third embodiment of the present invention [Figure 11] Block diagram of the present invention

Embodiments for Carrying Out the Invention

[0015] Hereinafter, exemplary embodiments of the technology of the present disclosure will be described in detail with reference to the drawings.

[0016] However, the dimensions, materials, shapes, and relative arrangements of the components described below should be appropriately changed according to the configuration of the device to which the invention is applied and various conditions.

[0017] Therefore, the scope of the present invention is not intended to be limited by the following description.<00第1の実施形態>

[0018] In particular, well-known techniques or publicly known techniques in the relevant technical field can be applied to configurations and processes that are not specifically illustrated or described. Also, duplicate explanations may be omitted.

[0019] <00第1の実施形態> In the drawings, the same reference numerals are used between the drawings to indicate elements that are the same or functionally similar.

[0020] [First Embodiment] (Rear exploded perspective view of the digital camera 100) FIG. 1 is a rear exploded perspective view of a digital camera 100 which is an imaging device of the present invention.

[0021] As shown in FIG. 1, the digital camera 100 is composed of a mount portion 102a, a rear cover 101, a front base 102, a top cover 103, a bottom cover 104, and a side cover 105.

[0022] Inside the digital camera 100 are an image sensor unit 106 with an image stabilization mechanism, a main circuit board 107, a shutter 108, a viewfinder 109, and a chassis 110.

[0023] The image sensor unit 106 consists of a movable unit including the image sensor 115 and a fixed unit, and is arranged perpendicular to the optical axis.

[0024] The front base 102 is made of, for example, magnesium die-cast or resin, and is equipped with a mount portion 102a for attaching interchangeable lenses.

[0025] The main board 107 is a multilayer board with electronic components mounted on both sides. The main board 107 is screw-fixed to the front base 102 and the metal chassis 110.

[0026] The main board 107 is equipped with a control IC 107a for controlling imaging signals, a recording medium connector 107b for housing an external recording medium, and an external communication terminal 107c for connecting cables to external devices.

[0027] The external communication terminal 107c is covered by the terminal cover 105a.

[0028] The image sensor unit 106 is a component that consumes a particularly large amount of power and generates a lot of heat, making it prone to rapid temperature increases, even within the digital camera 100.

[0029] The shooting time of the digital camera 100 is limited by the operating temperature of each component.

[0030] In order to maintain the shooting time as long as possible, it becomes necessary to take measures to dissipate the heat from the image sensor unit 106, which is the heat source, and to prevent it from exceeding the operating temperature.

[0031] The image sensor unit 106 is fixed to the front base 102 with screws, and the heat from the image sensor unit is dissipated to the front base 102.

[0032] The cooling fan 130 is positioned around the image sensor 106 so that its airflow direction is perpendicular to the optical axis. By allowing air to pass over the back of the image sensor 106, which is a heat source, it prevents localized overheating. (Details will be described later.)

[0033] Furthermore, in this embodiment, the cooling fan 130 is a centrifugal fan as the air blowing means, but this is not limited to this, and other types such as axial fans are not limited as long as they can achieve the purpose.

[0034] Furthermore, in this embodiment, the airflow direction of the cooling fan 130 is positioned perpendicular to the optical axis. However, this is not the case if the airflow from the cooling fan 130 directly hits the image sensor 106, and the fan may be positioned so that the airflow direction is not perpendicular to the optical axis.

[0035] Furthermore, the main board 107 is also a heat source, and a cooling fan 130 is positioned with its exhaust port 131 facing so that air is blown between the image sensor unit 106 and the main board 107.

[0036] This makes it possible to provide heat dissipation effects to multiple heat sources.

[0037] However, since the image sensor section 106, which has a movable part 114, has fewer heat dissipation paths, it is more advantageous for heat dissipation if the exhaust port 131 of the heat dissipation fan 130 is located closer to the image sensor section 106 than to the main board 107.

[0038] (Description of the image sensor unit 106) Figure 2 will be used to explain the details of the image sensor unit 106. Figure 2(a) is an exploded perspective view of the front of the image sensor unit 106, and Figure 2(b) is an exploded perspective view of the rear.

[0039] The movable part 114 has a coil section 116 on which coils and Hall elements are arranged for moving the image sensor 115, and is held by the sensor holder 117.

[0040] The drive mechanism 113 has three magnets 118 attached to it, and the movable part 114 is held in place by the magnets 118.

[0041] Between the movable part 114 and the drive mechanism 113, a ball (not shown) is placed in a ball holding part 117a provided on the sensor holder.

[0042] The movable part 114 can be moved by changing the amount of current supplied to the coil part 116.

[0043] Image stabilization can be applied by moving the movable part 114 in a direction that cancels out the shaking of the digital camera body 100.

[0044] The image sensor 115 has a sensor chip (not shown) bonded to an imaging substrate 115a on which an imaging circuit is mounted, and is electrically connected to the imaging substrate 115a by wire bonding.

[0045] The image sensor 115 and the sensor holder 117 are bonded and fixed together with adhesive.

[0046] On the back surface of the sensor chip mounting surface on the imaging substrate 115a, components 115b such as capacitors, resistors, and regulators for the imaging circuit are mounted.

[0047] The electrical connection between the image sensor unit 106 and the main circuit board 107 is made using a flexible wiring board.

[0048] The imaging signal flexible board 111 is wired with imaging signals output from the image sensor 115 and control signals necessary for driving the image sensor 115, and these signals are sent to the control IC 107a on the main board 107.

[0049] The imaging power supply flexible board 112 is a flexible circuit that supplies power to drive the image sensor 115. Inter-board connectors are used to connect the imaging board 115a to each flexible circuit.

[0050] (A view of the cooling fan 130 and the image sensor unit 106 from the rear, and a schematic diagram thereof) Figures 3(a) and 3(b) show the heat dissipation fan 130 and the image sensor unit 106 as viewed from the rear, and a schematic diagram thereof.

[0051] Here, we will explain the relationship between the movement of the movable part 114 of the image sensor unit 106 and the position of the cooling fan 113.

[0052] The movable part 114 is movable perpendicular to the optical axis, and its range of movement is indicated by 114a. The range in which the movable part 114 is always present when it moves is indicated by 114b.

[0053] This range is the range in which the movable part 114 exists regardless of the position of the movable part 114 on 114a.

[0054] Next, the arrangement of the cooling fan 130 will be explained. As mentioned above, the cooling fan 130 blows air so that it passes over the back of the image sensor unit 106.

[0055] Specifically, the exhaust port 131 of the cooling fan 130 is oriented so that air is blown into the area 114b where the movable part 114 is always located when the movable part 114 moves.

[0056] Here, the general direction of airflow is shown by 131a. As long as the airflow direction 131a is within the range of 114a, heat dissipation can be obtained regardless of the position of the movable part 114, which is the heat source of the image sensor unit 106.

[0057] Furthermore, since it is not physically connected to the movable part 114, it is possible to generate heat dissipation without hindering the image stabilization function caused by movement.

[0058] (Positional relationship between the imaging signal flexible board 111, the imaging power supply flexible board 112, and the cooling fan 130) Furthermore, using Figures 4 and 5, the positional relationship between the imaging signal flexible substrate 111, the imaging power supply flexible substrate 112, and the heat dissipation fan 130 will be explained in detail.

[0059] Figure 4 shows the image sensor unit 106 and the heat dissipation fan 130 as viewed from the rear of the camera at an angle.

[0060] As shown in Figure 4, the image sensor unit 106 is equipped with an imaging power supply flexible board 112 and an imaging signal flexible board 111, which are fixed to the movable part 114 and the drive mechanism 113, respectively.

[0061] Figure 5(d) is a view of the image sensor unit 106 from the rear, and Figures 5(a), 5(b), and 5(c) are cross-sectional views AA, BB, and CC of Figure 5(d), respectively.

[0062] As shown in Figure 5(a), the imaging power supply flexible substrate 112 is connected to a connector mounted on the side of the imaging substrate 115a on which the element 115b is mounted, and has a first end portion 112a that is positioned substantially parallel to the imaging substrate 115a.

[0063] Furthermore, it has a bent portion 112b that is bent 180° from the first end 112a with a predetermined bending diameter, and an excess portion 112c that forms from the bent portion 112b to a fixing portion 112d for fixing the imaging power supply flexible substrate 112 to the drive mechanism 113.

[0064] The second end portion 112e, extending from the fixing portion 112d, is connected to the main board 107.

[0065] In this way, the movable part 114 of the image sensor unit 106 is driven for image stabilization.

[0066] Even so, the deformation of the imaging power supply flexible substrate 112 is absorbed by the bent portion 112b and the excess portion 112c, reducing the effect of the tension of the imaging power supply flexible substrate 112 on the control of the movable portion 114.

[0067] As shown in Figure 5(b), the imaging signal flexible substrate 111 has a folding configuration similar to that of the imaging power supply flexible substrate 112, so as to minimize the effect of its tension on the control of the movable part 114.

[0068] Furthermore, as shown in Figure 5(d), when the left-right direction is defined as the X direction and the up-down direction as the Y direction when viewed from the back of the camera, the three magnets 118 provided in the drive mechanism 113 can be divided into X-direction magnet 118a, Y-direction magnet 118b, and 118c, respectively, in the direction in which they generate driving force.

[0069] The Y-direction magnet 118b is positioned closer to the X-direction magnet 118a than the Y-direction magnet 118c.

[0070] The bent portion 111b of the imaging signal flexible substrate 111 and the bent portion 112b of the imaging power supply flexible substrate 112 are formed on the side away from the Y-direction magnets 118b and 118c, with the connection portion with the imaging substrate 115a in between.

[0071] Furthermore, as shown in Figure 5(c), the airflow direction when the heat dissipation fan 130 is observed from a plane perpendicular to the optical axis is defined as 131b.

[0072] The airflow direction 131b is such that it passes through at least a portion of the space sandwiched between the excess portion 111c of the imaging signal flexible substrate 111 and the imaging substrate 115a, and between the excess portion 112c of the imaging power supply flexible substrate 112 and the imaging substrate 115a.

[0073] The exhaust port 131 of the cooling fan 130 is positioned relative to the image sensor unit 106.

[0074] Therefore, as shown in Figure 5(c), the bent portion 111b connecting the first end 111a and the excess portion 111c of the imaging signal flexible substrate 111 partially overlaps with the range of the airflow direction 131b.

[0075] The bent portion 112b connecting the first end 112a and the excess portion 112c of the imaging power supply flexible substrate 112 partially overlaps with the range of the airflow direction 131b.

[0076] Here, the movement of the airflow generated by the cooling fan 130 will be explained using Figures 5(c) and 6. Figure 6(a) is a view of the image sensor unit 106 from the side of the camera. Figure 6(b) is a cross-sectional view of the DD in Figure 6(a).

[0077] As shown by the arrows in Figure 5(c), the airflow from the heat dissipation fan 130 is discharged from the exhaust port 131 and then passes through the space between the imaging substrate 115a, the excess portion 111c of the imaging signal flexible substrate 111, and the excess portion 112c of the imaging power supply flexible substrate 112.

[0078] At that time, the air on the imaging substrate 115a that has received heat from the imaging substrate 115a is moved along the arrow in Figure 5(c) by the airflow from the heat dissipation fan 130 and diffused into the camera.

[0079] When observing the image sensor 106 from the back of the camera at this time, air is flowing through it as shown by the arrow in Figure 6(b).

[0080] As mentioned above, the bent sections 111b and 112b partially overlapped with the range of the airflow direction 131b, but the cooling fan 130 is positioned so that they are outside the range of the airflow direction 131a.

[0081] Therefore, a folded structure can be achieved without obstructing airflow at the folded portions 111b and 112b.

[0082] Therefore, the airflow from the heat dissipation fan 130 can spread over a wide area on the imaging substrate 115a, effectively suppressing the temperature rise of the image sensor 115.

[0083] Furthermore, the bent portions 111b and 112b change position by a small amount in the Y direction when the movable portion 114 is driven.

[0084] Therefore, it is necessary to maintain a certain distance in the Y direction from the Y-direction magnets 118b and 118c in order to prevent them from coming into contact with the Y-direction magnets 118b and 118c and affecting the attitude control of the movable part 114.

[0085] In the first embodiment of the present invention, the bent portions 111b and 112b are formed in positions facing the Y-direction magnets 118b and 118c, with the connection portion with the imaging substrate 115a in between.

[0086] Furthermore, as shown in Figure 6(b), the exhaust port center 131c of the cooling fan 130 is positioned between the bent portions 111b and 112b and the Y-direction magnets 118b and 118c.

[0087] By configuring it in this way, the distance required to prevent the bent portions 111b and 112b from coming into contact with the Y-direction magnets 118b and 118c can be included within the region of the airflow direction 131a.

[0088] Therefore, even if the cooling fan 130 is positioned such that the bent portions 111b and 112b are outside the range of the airflow direction 131a, a large area can be obtained in which the airflow direction 131a and the imaging substrate 115a overlap when viewed from the optical axis direction, resulting in good heat dissipation efficiency.

[0089] Furthermore, this configuration prevents the bent sections 111b and 112b from being subjected to force from the airflow generated by the cooling fan 130, thereby reducing the influence of airflow on the controllability of the movable section 114.

[0090] The features of this embodiment are described below.

[0091] The nearest bent portion 112b is not located within the range of the airflow direction.

[0092] The imaging device of the present invention includes an image sensor 115 that can move within a movable range in a direction different from the optical axis direction, a first circuit board 115a on which the image sensor is mounted, and a second circuit board 107 facing the first circuit board.

[0093] Furthermore, it includes a first flexible substrate 112 that electrically connects the first circuit board and the second circuit board, and a fan 130.

[0094] The first flexible substrate is bent in a region that overlaps with the movable range of the image sensor in the direction of the optical axis.

[0095] Furthermore, when viewed from the optical axis direction, the inner circumferential surface (inner surface) 112b of the bent portion of the first flexible substrate closest to the side connected to the first circuit board is positioned such that it is not within the range of the airflow direction 131a of the airflow discharged from the fan's exhaust port.

[0096] The next characteristic is that, from top to bottom, the nearest bent portion 112b, the connecting portion, and the magnet are arranged in that order.

[0097] The system includes a magnet 118 for moving the image sensor within the aforementioned movable range.

[0098] The bending portion closest to the side connected to the first circuit board is characterized by being positioned opposite the magnet, with the connection portion between the first circuit board and the first flexible substrate in between.

[0099] The next characteristic is the central position of the fan's exhaust port.

[0100] When viewed from the optical axis direction, the center of the fan's exhaust port is located between the bent portion closest to the side connected to the first circuit board and the magnet.

[0101] The next characteristic is the position of the first flexible substrate in the optical axis direction.

[0102] The position of the first flexible substrate in the optical axis direction is within the range of the airflow direction 131b of the airflow discharged from the fan's exhaust port.

[0103] [Second Embodiment] (View of the image sensor unit 106 from the rear) A second embodiment of the present invention will be described using Figures 7 and 8. For the sake of simplicity, the parts common to the first embodiment will be omitted from the description, and only the differences from the first embodiment will be described.

[0104] Figure 7(c) is a view of the image sensor unit 106 from the rear, and Figures 7(a) and 7(b) are cross-sectional views AA and BB of Figure 7(c), respectively.

[0105] Figure 8(a) is a view of the image sensor unit 106 from the side of the camera, and Figure 8(b) is a cross-sectional view of CC in Figure 8(a).

[0106] As shown in Figures 7(a) and 7(b), unlike the first embodiment, the imaging power supply flexible substrate 212 is positioned 180° opposite to the imaging signal flexible substrate 111.

[0107] In this way, the effects of the tension exerted by the imaging power supply flexible substrate 212 and the imaging signal flexible substrate 111 on the movable part 114 can be canceled out, which is advantageous for the controllability of the movable part 114.

[0108] However, as shown in Figure 8(b), the bent portion 212b is positioned at a certain distance from the Y-direction magnet 118b.

[0109] Therefore, the bent portion 212b is located within the range of the airflow direction 131a of the heat dissipation fan 130, making it more susceptible to force from the airflow.

[0110] However, as shown in Figure 8(b), the thickness direction of the bent portion 212b of the imaging power supply flexible substrate 212 is perpendicular to the airflow direction 131a, and is positioned to be less susceptible to force from the airflow.

[0111] Furthermore, as shown in Figure 8(b), the imaging power supply flexible substrate 212 is bent in the Y direction when viewed from the optical axis direction, and can be said to be perpendicular to the airflow direction 131a.

[0112] This configuration is advantageous for the controllability of the movable part 114 when the cooling fan 130 is not running, while also reducing the influence of the force on the imaging power supply flexible substrate 212 from the airflow when the cooling fan 130 is running.

[0113] Furthermore, since the airflow is not easily obstructed by the bent portion 212b, the airflow from the heat dissipation fan 130 can spread over a wide area on the imaging substrate 115a, effectively suppressing the temperature rise of the image sensor 115.

[0114] The features of this embodiment are described below. The main feature is that the airflow direction and thickness direction of the exhaust port are perpendicular to each other.

[0115] The imaging device of this embodiment includes an image sensor 115 that can move within a movable range in a direction different from the optical axis direction, a first circuit board 115a on which the image sensor is mounted, and a second circuit board 107 facing the first circuit board.

[0116] Furthermore, it includes a first flexible substrate 112 that electrically connects the first circuit board and the second circuit board, and a fan 130.

[0117] The first flexible substrate is bent in a region that overlaps with the movable range of the image sensor in the direction of the optical axis.

[0118] Furthermore, the position of the first flexible substrate in the optical axis direction is located within the range of the airflow direction 131a of the airflow discharged from the exhaust port of the fan.

[0119] Furthermore, the thickness direction of the bent portion 212b closest to the side of the first flexible substrate connected to the first circuit board is positioned perpendicular to the airflow direction 131a of the airflow discharged from the fan's exhaust port.

[0120] The next characteristic is that the bending direction and the airflow direction are perpendicular.

[0121] The imaging device of this embodiment includes an image sensor 115 that can move within a movable range in a direction different from the optical axis direction, a first circuit board 115a on which the image sensor is mounted, and a second circuit board 107 facing the first circuit board.

[0122] Furthermore, it includes a first flexible substrate 112 that electrically connects the first circuit board and the second circuit board, and a fan 130.

[0123] The first flexible substrate is bent in a region that overlaps with the movable range of the image sensor in the direction of the optical axis.

[0124] Furthermore, the position of the first flexible substrate in the optical axis direction is located within the range of the airflow direction 131a of the airflow discharged from the fan's exhaust port.

[0125] Furthermore, the bending direction of the bent portion 212b closest to the side of the first flexible substrate connected to the first circuit board is arranged to be perpendicular to the airflow direction 131a of the airflow discharged from the exhaust port of the fan.

[0126] The following features relate to the longitudinal and transverse directions of the image sensor.

[0127] The airflow direction 131a is the longitudinal direction of the image sensor, and the bending direction is the short direction of the image sensor.

[0128] [Third Embodiment] A third embodiment of the present invention will be described using Figures 9 and 10. For the sake of simplicity, the parts common to the first embodiment will be omitted from the description, and only the differences from the first embodiment will be described.

[0129] Figure 9(a) shows the image sensor unit 106 and the heat dissipation fan 130 as viewed from the rear of the camera at an angle. Figure 9(b) is a view of Figure 9(a) with the imaging signal flexible substrate 111 and the imaging power supply flexible substrate 112 hidden for easier viewing.

[0130] In this embodiment, the first flexible substrate was not only used as a flexible substrate but also adapted for use as a graphite sheet.

[0131] As shown in Figures 9(a) and 9(b), the image sensor unit 106 is provided with graphite sheets 121 and 122 that are fixed to the movable part 114 and the drive mechanism 113, respectively, so as to be superimposed on the imaging power supply flexible substrate 112 and the imaging signal flexible substrate 111.

[0132] The graphite sheets 121 and 122 function as heat dissipation members that have flexibility to transmit heat generated in the movable part 114 to the drive mechanism 113 while minimizing the impact on the controllability of the movable part 114.

[0133] Figure 10(c) is a view of the image sensor unit 106 from the rear, and Figures 10(a), 10(b), and 10(c) are cross-sectional views AA, BB, and CC in Figure 10(d).

[0134] As shown in Figure 10(a), the graphite sheet 122 is attached so as to be in contact with the element 115b of the imaging substrate 115a and has a first end portion 122a that is positioned substantially parallel to the imaging substrate 115a.

[0135] Furthermore, it has a bent portion 122b that is bent 180° from the first end 122a with a predetermined bending diameter, and an excess portion 122c that forms from the bent portion 122b to a fixing portion 122d for fixing the graphite sheet 122 to the drive mechanism 113.

[0136] In this way, even if the movable part 114 of the image sensor unit 106 is driven for image stabilization, the deformation of the graphite sheet 122 is absorbed by the folded part 122b and the excess part 122c, reducing the influence of the tension of the graphite sheet 122 on the control of the movable part 114.

[0137] As shown in Figure 10(a), the imaging power supply flexible substrate 112 is positioned so that the inner surface (inner surface) of the bent portion 112b of the imaging power supply flexible substrate 112 faces the outer surface of the bent portion 122b of the graphite sheet 122.

[0138] The graphite sheet 121 has a folding configuration similar to that of the graphite sheet 122, so as to minimize the effect of its tension on the control of the movable part 114.

[0139] As shown in Figure 10(b), the imaging signal flexible substrate 111 is positioned so that the inner surface (inner surface) of the folded portion 111b of the imaging signal flexible substrate 111 faces the outer surface of the folded portion 121b of the graphite sheet 121.

[0140] By arranging them in this way, the fixing portions 121d and 122d of the graphite sheets 121 and 122 can directly contact and fix to the drive mechanism 113 without having to sandwich the imaging signal flexible substrate 111 or the imaging power supply flexible substrate 112.

[0141] Therefore, it is suitable for heat dissipation from the movable part 114 to the drive mechanism 113.

[0142] In addition, the configuration of the bent portions 121b and 122b of the graphite sheets 121 and 122 can be replaced with the bent portions 111b and 112b of the imaging signal flexible substrate 111 and the imaging power supply flexible substrate 112 in the first embodiment.

[0143] It is clear that this will yield the same effects as the first embodiment.

[0144] Furthermore, in the first, second, and third embodiments, the cooling fan 130 itself is not physically connected to the movable part 114, so it is possible to generate a heat dissipation effect without hindering the image stabilization function caused by movement.

[0145] Furthermore, in the first, second, and third embodiments, the airflow direction 131a coincides with the longitudinal direction of the image sensor 115.

[0146] The bending directions of the imaging signal flexible substrate 111, the imaging power supply flexible substrate 112, and the graphite sheets 121 and 122 coincide with the short side direction of the image sensor 115.

[0147] By configuring it in this way, there is no need to enlarge the width of the airflow direction 131a of the heat dissipation fan 130 to match the longitudinal width of the image sensor 115, and the air on the imaging substrate 115a can be efficiently diffused into the camera.

[0148] In the first, second, and third embodiments, for example, the cooling fan 130 is operated at an airflow rate of 4.5 L / min. Liters per minute (L / min) is a unit of volumetric flow rate.

[0149] By incorporating a cooling fan 130, it is possible to reduce the maximum temperature reached by the image sensor 106 by 10°C. This suppresses the temperature rise of the heat source, making it less likely for the digital camera 100 to reach the limit temperature at which it would shut down due to overheating.

[0150] (Block diagram showing an example configuration of the digital camera 400) Figure 11 is a block diagram showing an example configuration of the digital camera 400 according to the present invention.

[0151] The shutter 410 is a focal-plane shutter that can freely control the exposure time of the imaging unit 411, which will be described later. This control is performed by the system control unit 420, which will be described later.

[0152] The imaging unit 411 has an imaging surface on which the subject image (optical image) that has passed through the lens 501 is formed, and is an imaging device that outputs an electrical signal (analog signal) corresponding to the optical image on the imaging surface by photoelectric conversion.

[0153] The imaging unit 411 can be a CCD (Charge Couple Device) or a CMOS (Complementary MOS) sensor.

[0154] The A / D converter 412 is a signal conversion means used to convert the analog signal output from the imaging unit 411 into a digital signal.

[0155] The image processing unit 413 is an image processing means that generates image data by performing resizing processing such as pixel interpolation and reduction, and color conversion processing on the digital signal from the A / D converter 412 or the digital signal from the memory control unit 422, which will be described later.

[0156] Based on the calculation results obtained by the image processing unit 413, the system control unit 420 controls the aperture position and lens position.

[0157] The image processing unit 413 further performs calculations using the image data and performs TTL-type AWB (auto white balance) processing based on the obtained calculation results.

[0158] The system control unit 420 is a control unit consisting of at least one processor or circuit, and controls the entire digital camera 400.

[0159] Each process of the present invention is realized by executing the program recorded in the non-volatile memory 423 described later.

[0160] The memory 421 is a storage means for temporarily recording digital signals obtained by the imaging unit 411 and converted by the A / D converter 412, as well as image data generated by the image processing unit 413.

[0161] The memory 421 has sufficient storage capacity to store a predetermined number of still images, a predetermined amount of video footage, and audio.

[0162] The memory control unit 422 is a memory control means that controls the transmission and reception of data controlled by the system control unit 420 to and from the A / D converter 412, the image processing unit 413, and the memory 421.

[0163] The digital signal output from the A / D converter 412 is written directly to the memory 421 via the image processing unit 413 and the memory control unit 422, or via the memory control unit 422 alone.

[0164] The non-volatile memory 423 is an electrically erasable and recordable read-only storage means, and stores constants, programs, and the like for the operation of the system control unit 420.

[0165] The system memory 424 is a read-and-write storage means that stores constants, variables, and programs read from the non-volatile memory 423 for the operation of the system control unit 420.

[0166] The system timer 425 is a timing unit that measures the time until the auto power-off operation, which turns off the various display components described later, is performed, as well as the exposure time.

[0167] The auto power-off function has the ability to turn off various indicator lights (described later) to prevent battery drain when it determines that the photographer is not operating the digital camera 400.

[0168] The power supply unit 430 consists of primary batteries such as alkaline batteries and lithium batteries, secondary batteries such as NiCd batteries, NiMH batteries and Li batteries, and an AC adapter.

[0169] The power control unit 431 consists of a circuit for detecting the power supply unit 430, which is the power source for driving the digital camera 400, a DC-DC converter, a switch circuit for switching the power supply destination, and the like.

[0170] The power supply unit 430 then detects whether a battery is installed, the type of battery, and the remaining battery level.

[0171] Furthermore, the power control unit 431 controls the DC-DC converter based on the detection results and instructions from the system control unit 420, and supplies the necessary voltage to the recipient at the necessary timing.

[0172] The communication terminal 440 is provided on the digital camera 400 and is electrically connected to the lens communication terminal 506, which will be described later.

[0173] When the communication terminal 440 is electrically connected, the system control unit 420, which controls the entire digital camera 400, becomes able to communicate with the lens 500, which will be described later.

[0174] The recording medium I / F441 is an interface with the recording medium 600, which will be described later.

[0175] The attitude detection unit 442 detects the attitude of the digital camera 400 relative to the direction of gravity.

[0176] Based on the posture detected by the posture detection unit 442, the imaging unit 411 can output orientation information indicating whether the image was taken with the digital camera held horizontally or vertically.

[0177] The system control unit 420 can add orientation information output by the attitude detection unit 442 to the image data.

[0178] The attitude detection unit 442 can use an acceleration sensor, a gyroscope, or the like.

[0179] By using an acceleration sensor and a gyro sensor as the attitude detection unit 442, it is also possible to detect the movement of the digital camera 400 (pan, tilt, lift, whether it is stationary or not, etc.).

[0180] The eyepiece section 443 is the point where the photographer's eye (object) 700 approaches (eyepieces) the digital camera 400.

[0181] The eyepiece detection unit 444 is an approach or eyepiece detection sensor that detects when the eye 700 approaches (approaches) and moves away from (separates) the eyepiece unit 443.

[0182] The eyepiece detection unit 444 detects the presence of an eye 700 in the eyepiece unit 443 based on whether or not light is received by the light-receiving unit (not shown) of the infrared proximity sensor.

[0183] After detecting eye placement, the system control unit 420 determines that the eye placement state is maintained until eye separation is detected.

[0184] After detecting eye separation, the system control unit 420 remains in a non-eyepiece state until eyepiece detection is detected.

[0185] Note that the infrared proximity sensor is just one example; the eyepiece detection unit 444 may use any other sensor that can detect the approach of an eye or object that can be considered an eyepiece.

[0186] The aforementioned memory 421 also serves as memory for displaying images (video memory).

[0187] Digital signals and image data written to memory 421 are displayed via memory control unit 422 by rear display unit 450 and EVF 451.

[0188] The rear display unit 450 displays information according to the signal from the memory control unit 422.

[0189] The EVF451 displays information according to the signal from the memory control unit 422 when the eyepiece detection unit 444 detects that an eyepiece has been used.

[0190] The analog signal generated by the imaging unit 411 is converted by the A / D converter 412 and recorded as a digital signal in the memory 421. This digital signal is then sequentially transferred to the rear display unit 450 or the EVF 451 for display.

[0191] This enables real-time display, known as live view shooting display.

[0192] The system control unit 420 switches the display (display state) / hidden (hidden state) of the rear display unit 450 and the EVF 451 according to the state detected by the eyepiece detection unit 444.

[0193] When not using an eyepiece, the display is shown on the rear display unit 450, and the EVF 451 is turned off.

[0194] Additionally, the EVF451 displays the image while the eyepiece is engaged, and the rear display unit 450 is turned off.

[0195] The operation unit 460 consists of various operating components that act as input units for receiving operations from the user.

[0196] The control unit 460 includes various control elements described later (mode switching switch 461, shutter button 462, first shutter switch 463, second shutter switch 464, touch panel 465, power switch 466).

[0197] Furthermore, the operation unit 460 is an operating means for inputting various operation instructions to the system control unit 420.

[0198] The mode switching switch 461 switches the operating mode of the system control unit 420 to one of the following: still image shooting mode, video shooting mode, etc.

[0199] The shooting modes included in still image shooting mode are Auto Shooting Mode, Auto Scene Recognition Mode, and Manual Shooting Mode.

[0200] In addition, the still image shooting modes include aperture priority mode (Av mode), shutter speed priority mode (Tv mode), and program AE mode (P mode).

[0201] Similarly, video recording modes may also include multiple shooting modes.

[0202] The shutter button 462 is a button used by the photographer to give instructions for preparing to take a picture and to take the picture.

[0203] The first shutter switch 463 turns ON during the operation of the shutter button 462 on the digital camera 400, specifically when it is half-pressed (indicating preparation for shooting), and generates the first shutter switch signal SW1.

[0204] The first shutter switch signal SW1 initiates shooting preparation operations such as AF (autofocus), AE (automatic exposure), and AWB (automatic white balance).

[0205] The second shutter switch 464 turns ON when the shutter button 462 is fully pressed (instructing the camera to take a picture), generating the second shutter switch signal SW2.

[0206] The system control unit 420 receives the second shutter switch signal SW2, which reads out the analog signal from the imaging unit 411 and performs signal conversion processing in the A / D converter 412 and the image processing unit 413.

[0207] Furthermore, the system control unit 420 starts the shooting process operation until the image data temporarily recorded in the memory 421 is written to the recording medium 600, which will be described later.

[0208] The touch panel 465 is a device that detects touch or drag operations by the photographer.

[0209] Here, it is integrated with the rear display unit 450, and can be operated by touching the display area of ​​the rear display unit 450 with your finger.

[0210] The power switch 466 is a switch that turns the power ON / OFF. The power control unit 431 controls the power supply from the power supply unit 430 based on the switching operation of the power switch 466.

[0211] The cooling fan 470 is controlled by the system control unit 420 to cool the heat source inside the digital camera 400.

[0212] The lens unit 500 is an interchangeable lens that can be attached to and detached from the digital camera 400.

[0213] Lens 501 is a group of lenses that generate an optical image (subject image) from the subject light reflected by the subject, and is composed of multiple lenses, but in this diagram, for simplicity, only one lens is shown.

[0214] The lens communication terminal 506 is a communication terminal for the lens unit 500 to communicate with the digital camera 400.

[0215] As described above, the lens unit 500 can communicate with the system control unit 420, which controls the entire digital camera 400, by electrically connecting the lens communication terminal 506 and the communication terminal 440.

[0216] This enables the system control unit 420 to communicate with the lens system control circuit 505 and the aperture drive circuit 504 to control the position of the aperture 503 and the focus state of the real image by displacing the lens 501.

[0217] The recording medium 600 is a recording medium such as a memory card that is detachable from the digital camera 400 and is used to record captured images.

[0218] Examples include SD cards, FLASH® memory, and hard drives. [Industrial applicability]

[0219] The technology disclosed herein is used in electronic devices and imaging systems. [Explanation of symbols]

[0220] 100, 400 digital cameras 102 Front Base 102a Mounting section 106 Image sensor section 107 Main board 111 Flexible substrate for imaging signals 111a First end 111b Folded section 111c surplus portion 111d Fixed part 111e Second end 112, 212 Imaging power supply flexible board 112a, 212a First end 112b, 212b Folded section 112c, 212c surplus portion 112d, 212d fixed part 112e, 212e Second end 113 Drive mechanism 114 Moving parts 114a Movement range 114b The range in which a movable part exists at any movement position. 115 Image sensor 115a Imaging substrate 115b element 115c center 116 Coil section 118 Magnets 118a X direction magnet 118b Y-direction magnet 118c Y direction magnet 121 Graphite Sheet 121a First end 121b Folded section 121c surplus portion 121d Fixed part 122 Graphite Sheets 122a First end 122b Folded section 122c surplus portion 122d Fixed part 130, 470 cooling fan 131 Exhaust vent 131a Air blow direction 131b Air blow direction

Claims

1. An image sensor that can move within a movable range in a direction different from the optical axis, A first circuit board on which the aforementioned image sensor is mounted, A second circuit board facing the first circuit board, A first flexible member that electrically connects the first circuit board and the second circuit board, With fans, The first flexible member is bent in a region that overlaps with the movable range of the image sensor in the direction of the optical axis, An imaging apparatus characterized in that, when viewed from the optical axis direction, the inner surface of the bent portion of the first flexible member closest to the side connected to the first circuit board is not located on the extension of the airflow direction of the exhaust port of the fan.

2. The image sensor is provided with a magnet for moving it within the movable range, The imaging apparatus according to claim 1, characterized in that the bending portion closest to the side connected to the first circuit board is positioned opposite the magnet, with the connection portion between the first circuit board and the first flexible member in between.

3. The imaging apparatus according to claim 2, wherein, when viewed from the optical axis direction, the center of the fan's exhaust port is located between the bent portion closest to the side connected to the first circuit board and the magnet.

4. The imaging apparatus according to any one of claims 1 to 3, wherein the position of the first flexible member in the optical axis direction is located on the extension of the airflow direction of the exhaust port of the fan.

5. An image sensor that can move within a movable range in a direction different from the optical axis, A first circuit board on which the aforementioned image sensor is mounted, A second circuit board facing the first circuit board, A first flexible member that electrically connects the first circuit board and the second circuit board, With fans, The first flexible member is bent in a region that overlaps with the movable range of the image sensor in the direction of the optical axis, The position of the first flexible member in the optical axis direction is located on the extension of the airflow direction of the exhaust port of the fan, The imaging device is characterized in that the thickness direction of the bent portion closest to the side of the first flexible member connected to the first circuit board is arranged to be perpendicular to the airflow direction of the air discharged from the exhaust port of the fan.

6. An image sensor that can move within a movable range in a direction different from the optical axis, A first circuit board on which the aforementioned image sensor is mounted, A second circuit board facing the first circuit board, A first flexible member that electrically connects the first circuit board and the second circuit board, With fans, The first flexible member is bent in a region that overlaps with the movable range of the image sensor in the direction of the optical axis, The position of the first flexible member in the optical axis direction is located on the extension of the airflow direction of the exhaust port of the fan, The imaging device is characterized in that the bending direction of the bending portion of the first flexible member closest to the side connected to the first circuit board is arranged to be perpendicular to the airflow direction of the air discharged from the exhaust port of the fan.

7. The imaging apparatus according to claim 5 or 6, wherein the airflow direction is the longitudinal direction of the image sensor, and the bending direction is the short direction of the image sensor.

8. The imaging apparatus according to any one of claims 1 to 7, wherein the first flexible member is a flexible substrate.

Images