Method for manufacturing a molded body, and molded body

By preheating and molding poly(3-hydroxybutyrate) resin within a controlled temperature range, the method addresses cracking issues, resulting in a crack-free, biodegradable, and heat-resistant resin layer for packaging.

JP7888366B2Active Publication Date: 2026-07-13KANEKA CORP
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Patent Information

Application Number
JP2022099231
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-06-20
Publication Date
2026-07-13
Estimated Expiration
2042-06-20

AI Technical Summary

Technical Problem

Poly(3-hydroxybutyrate) resins, despite their heat resistance, suffer from poor mechanical strength and are prone to cracking during secondary processing, leading to issues like leakage in molded bags or containers.

Method used

A manufacturing method involving preheating the poly(3-hydroxybutyrate) resin layer to a specific temperature range and molding it within that range, using differential scanning calorimetry to control the crystal melting curve, thereby suppressing cracks.

Benefits of technology

The method produces a molded article with a poly(3-hydroxybutyrate) resin layer free from cracks, offering excellent biodegradability and heat resistance for packaging materials.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide a molded article having no crack in a resin layer, including a laminate having a resin layer containing a poly(3-hydroxybutyrate) resin.SOLUTION: In a method for manufacturing a molded article obtained by processing a laminate having at least a base material layer and a resin layer containing a poly(3-hydroxybutyrate) resin on at least one top surface of the base material layer, wherein the resin layer has at least one peak top temperature (Tma) at a range of 100 to 155°C by a crystal melting curve by differential scanning calorimetry, at least following steps (A) and (B) are performed sequentially. In the step (A), a surface temperature of the resin layer is adjusted to a temperature within a range of (Tma-20°C) to (Tma+25°C). In the step (B), the laminate is positioned so that the resin layer is in contact with a molding die during molding, and at least a part of the laminate is bent and molded while the surface temperature of the resin layer is 50 to 80°C.SELECTED DRAWING: Figure 3
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Citation Information

Patent Citations

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    JP2008195817A

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    WO2019239913A1