Machines and methods for processing parts of different shapes

Abstract

A machine (1) for processing parts (2) of different shapes, comprising a chamber (10), a vacuum system (20), a processing system (30, 60; 40, 60; 30, 40, 60) including a plasma generation system (30) and / or a vacuum deposition system (40), and a transport system (50) capable of displacing one or more parts (2) into the chamber (10) regardless of the shape of these parts (2), characterized in that the processing system (30, 60; 40, 60; 30, 40, 60) includes a laser system (60) designed to process one or more parts (2) placed in the chamber (10).

Description

Technical Field

[0001] The present invention relates to a machine for processing parts of different shapes. The present invention also relates to a processing method. The field of the present invention is the field of surface treatment.

Background Art

[0002] Various machines for processing the surface of parts are known. However, existing machines are often designed for a single type of processing (e.g., vacuum deposition). Other machines perform several processes in combination but are designed for parts of a single shape (e.g., film or disk).

[0003] Patent Document 1 describes an example of a processing machine including a chamber, a vacuum system, a plasma generation system, a vacuum deposition system, and a system for transporting parts.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] An object of the present invention is to improve the versatility of the machine with respect to the proposed processing.

[0006] For this reason, an object of the present invention is to provide a machine for processing parts of different shapes, comprising a chamber, a vacuum system, a processing system including a plasma generation system and / or a vacuum deposition system, and a transport system capable of displacing one or more parts in the chamber regardless of the shape of these parts. The machine is characterized in that the processing system includes a laser system designed to process one or more parts arranged in the chamber. [Means for solving the problem]

[0007] Therefore, the present invention makes it possible to improve the versatility of the machine and to change the proposed processing. Parts are processed sequentially, and sometimes in combination, by one or more processing systems in a manner that allows each operator to create and select processing sequences. The operator can choose to use the system in one order or others, such as repeating a certain procedure.

[0008] The machine can be composed of various methods for processing small parts (on the order of 1 to 10 cm) or large parts (on the order of 0.1 to 1 m or more).

[0009] Furthermore, the parts to be processed may be made from a variety of materials, such as metals, ceramics, composite materials, and plastics.

[0010] According to other advantageous features of the present invention, the following may be employed individually or in combination: - The processing system may be selectively used to process one or more components, either separately from other systems or simultaneously with one or more of the other systems. - The sequence of use of the processing system can be set by a variable usage order and / or a variable number of uses. - The processing system may be used to directly process one or more parts. - The laser system is separate from the plasma generation system. - The machine is equipped with a system to protect the laser system, or more precisely, a system to protect the window that allows the laser beam to enter the chamber. - The protective system includes a movable cover in front of the laser system. - The protective system includes a transparent film that moves in front of the laser system. - The protective system includes an inner wall that optically isolates the path of the laser beam originating from the laser system from the rest of the chamber and protects it from the flow (flux) originating from the processing system. - The protective system comprises a chamber fixed to the chamber wall and formed between the window of the laser system and the part to be processed, the chamber having an aperture facing the part to define an aperture angle of less than 45 degrees between the window and the chamber. - The laser system has a single laser source. - The laser system has multiple laser sources. - The laser system comprises one or more pulsed laser sources having pulse durations on the order of femtoseconds, picoseconds, or nanoseconds. - The laser source is monospectral. - The laser source is multispectral (selection of wavelength according to the material). - The laser sources are identical (same wavelength, same pulse duration, same polarization, same beam shape). - The laser sources are different from each other (different wavelengths and / or pulse durations and / or polarizations and / or beam shapes). - A laser beam can have multiple vector polarization states (e.g., azimuthal, radial, and vortex polarization). - The laser beam can be directed to incident obliquely or orthogonally on one or more parts. - The transport system can displace one or more parts in a manner such that two consecutive processing zones are adjacent to each other. - The laser system includes devices for modifying the path and / or shape, and / or focusing the laser beam. - The transport system includes a turntable intended to support one or more parts. - The transport system includes a turret intended to receive one or more parts mounted on a turntable. - The turret can rotate relative to the turntable. - The transport system includes a turntable rotatably mounted on the turret and intended to support parts. - The laser system is arranged horizontally. - The transport system includes a longitudinal transport device intended to support one or more parts. The device can be a carriage, a roller conveyor, a conveyor belt, or any other suitable means. - The transport system includes a position encoding device. - The transport system includes a visual mark and an optical sensor capable of cooperating with the mark.

[0011] The present invention further relates to a method for processing parts of different shapes, comprising: a) evacuating a chamber in which one or more parts are placed, and then the following steps, namely b) laser processing one or more parts, c) low-pressure plasma processing one or more parts, and / or d) performing vacuum evaporation on one or more of the parts in combination with and provides a method including the above steps.

[0012] The method is characterized in that the various steps a), b), c) and / or d) are performed on the same machine adapted to process parts of different shapes.

[0013] Steps b), c) and d) can be selectively performed to process one or more parts separately from or simultaneously with one or more of the other steps.

[0014] Advantageously, step b), step c), step d) or a combination thereof can be performed according to a sequence of use that can be set by a variable order of use and / or a variable number of uses.

[0015] The present invention is given by way of non-limiting example only and will be better understood from the following description which refers to the accompanying drawings, which show diagrams below.

Brief Description of the Drawings

[0016] [Figure 1] A plan view of a machine according to the invention equipped with a rotary transport system. [Figure 2] A side view of the machine of FIG. 1 showing a transport system equipped with a turret and a laser system arranged laterally. [Figure 3] A view similar to FIG. 1 showing a variant form of the transport system. [Figure 4] A view similar to FIG. 2 showing another variant form of the transport system and a variant form of the laser system. [Figure 5] A side view showing another machine according to the invention equipped with a longitudinal transport system. [Figure 6] A front (side or top depending on the machine) view showing a first solution of a laser system protection system. [Figure 7] A view similar to FIG. 6 showing this first protection system solution in another position. [Figure 8] A view similar to FIG. 6 showing a second solution of a laser system protection system. [Figure 9] A view similar to FIG. 8 showing this second protection system solution during operation. [Figure 10] A view similar to FIG. 6 on a smaller scale showing a third solution of a laser system protection system according to a first configuration. [Figure 11] A view similar to FIG. 10 showing this third protection system solution according to a second configuration. [Figure 12]This diagram, similar to Figure 10, illustrates this third protection system solution based on a third configuration. [Figure 13] This figure, similar to Figure 10, shows the protection system in use according to the first configuration. [Figure 14] This diagram, similar to Figure 11, shows a protection system in use with a second configuration. [Figure 15] This diagram, similar to Figure 12, shows a third configuration of the protection system in use. [Figure 16] This is a front (side or top) view of a laser system, showing a fourth solution for the laser system protection system. [Figure 17] This diagram shows a cylindrical component and an incident laser beam, illustrating defocusing and deformation of the laser beam spot on the component. [Figure 18] This is a perspective view of a cylindrical component and the incident laser beam, showing the case of oblique incidence and the deformation of the laser beam spot on the component. [Figure 19] This diagram is similar to Figure 18, showing the zones to be processed adjacent to the zones that have been processed first. [Modes for carrying out the invention]

[0017] Figures 1 and 2 show a machine (1) according to the present invention, designed for processing parts (2) of different shapes.

[0018] In the context of this invention, the expression “of different shapes” includes parts of different geometric shapes and / or dimensions. This expression is not limited to parts of the same geometric shape but different dimensions, such as flat films of different widths. Machine (1) is adapted to handle not only flat shapes, i.e., parts with a thickness of very little (less than 5%) compared to other dimensions, but also bulky parts, i.e., three-dimensional parts of the same or similar degree of size. Parts may also be solids of revolution (e.g., cylinders), or even parallelepipeds. Finally, parts may also be irregular shapes, i.e., solids consisting of surfaces that are not necessarily orthogonal to each other, or surfaces with edges of different dimensions.

[0019] The machine (1) according to the present invention is designed to perform surface treatment on a part (2). Surface treatment is part of the applicant's area of ​​expertise, and surface treatments may include, but are not limited to, the following: chemical deposition, activation, stripping or cleaning of thin films; texturing (i.e., creating relief motifs on the surface of a part, having dimensions from the order of 1 nanometer to 1 / 10 meter); and heat treatment (i.e., modification of the crystalline structure of a metal by a predetermined temperature cycle).

[0020] These processes are called surface treatments or external treatments as long as the zone in which they act is limited at most to a few tenths of a millimeter below the surface of the part, and they are not intended to treat the core of the part, i.e., the deep parts of the part, where the entire material is treated.

[0021] The machine (1) comprises a chamber (10), a vacuum system (20), a plasma generation system (30), a vacuum deposition system (40), a transport system (50), a laser system (60), and a protection system (70).

[0022] Alternatively, machine (1) may be equipped with a plasma generation system (30) but not a vacuum deposition system (40), or it may be equipped with a vacuum deposition system (40) but not a plasma generation system (30).

[0023] Generally, such a machine (1) further includes a heating system for degassing the parts (2) and the inside of the chamber (10) before any other processing. The machine (1) further includes a system for injecting pure gas or a gas mixture to introduce the gas required for processing into the chamber (10) in a controlled manner. For simplicity, neither the heating system nor the gas injection system is shown in the drawings.

[0024] Advantageously, system (10-70) can be used separately or simultaneously with one or more other systems (10-70). - As an example, the operator may choose to use the laser system (60) while the chamber (10) is under vacuum by using the vacuum system (20). - In other examples, the operator may choose to process the first part (2) with the plasma system (30) simultaneously with processing the second part (2) with the laser system (60).

[0025] In addition, the order and number of uses of different systems (10-70) can be parameterized according to different sequences. - As an example, the operator may choose to process the part using a laser system (60) before displacing it into a plasma processing system (30). - In other examples, the operator may choose to generate a first deposit using a vacuum deposition system (40), then perform laser processing with a laser system (60), and then generate a second deposit using the vacuum deposition system (40).

[0026] The chamber (10) has a parallelepiped shape, including two pairs of parallel horizontal walls that make up the top and bottom of the chamber (10), and four parallel vertical walls that make up the sides of the chamber (10). Clearly, the walls may have different shapes without departing from the scope of the present invention. As an example, a cylindrical chamber (10) with a single cylindrical vertical wall can be considered. This chamber (10) may comprise a single compartment (11) as shown in Figures 1 and 2, or multiple compartments (11) as shown in Figure 5.

[0027] The vacuum system (20) is intended to evacuate the atmosphere inside the chamber (10). The system (20) is intended to evacuate the atmosphere inside the chamber (10) when the pressure spreading therein is, for example, 10 -2 from 10 -9 The air can be exhausted, that is, the air present in the chamber (10), so that the pressure can be reduced to Pa.

[0028] The plasma treatment system (30) may be used to delaminate part (2) in order to clean it with subsequent processing in mind. In addition, the system (30) may be used to activate the surface in a manner that can accommodate further processing such as glow discharge cleaning for plastics or ceramics. The plasma treatment system (30) may be used in combination with a gas injection system to produce PACVD (plasma-assisted chemical vapor deposition) type deposits.

[0029] The vacuum deposition system (40) is intended to generate deposits on the surface of the part (2). As an example, the system (40) may be designed for deposition by PACVD or PVD (physical vapor deposition). The vacuum deposition system (40) may optionally be used to strip the part (2) if it provides sufficient ionized species, such as in the case of an arc deposition source.

[0030] The transport system (50) is designed to receive parts (2) and displace them within the chamber (10). This transport system (50) can be constructed in various ways. In the example shown in Figures 1 and 2, the system (50) comprises a turntable (51) that rotates around a vertical central axis forming a carousel supporting one or more parts (2), and a turret (52) rotatably mounted on the turntable (51) around a vertical axis parallel to the central axis. The turret (52) allows for maximum utilization of the height of the chamber (10), especially when handling small parts (2). The turntable (51) and the turret (52) can rotate in the same direction or in opposite directions. The turret (52) is independently motor-driven, thereby allowing the turntable (51) and the turret (52) to rotate separately or simultaneously. In one variant, the turret (52) may be fixedly mounted on the turntable (51). In other variations, the turntable (51) may not have a turret (52).

[0031] According to the present invention, the machine (1) is further equipped with a laser system (60) comprising a laser source (61) that emits a laser beam (62). The laser source (61) is pulsed and can emit pulses having durations on the order of femtoseconds, picoseconds, or nanoseconds. The laser source (61) can be multispectral (wavelengths selected depending on the material).

[0032] As shown in Figure 2, the laser system (60) may comprise multiple laser sources (61) to process multiple parts (2) simultaneously or multiple zones of a larger part (2). The laser sources (61) may be identical (same wavelength, same pulse duration, same polarization, same beam shape) or different (different wavelengths and / or pulse durations and / or polarizations and / or beam shapes). In the following, only "the" laser source (61) will be described, even if there may be several.

[0033] The laser system (60) is light-transmitting to the beam (62) and includes a (mark) window (63) for observing the transition between the laser system (60) and the chamber (10).

[0034] The system (60) comprises various optical devices, specifically a focusing correction device (65) that concentrates the energy of the beam (62) to a selected distance from the beam (62). Focusing correction is necessary when the parts (2) to be processed are of various dimensions and when the distance between the surface of the parts (2) and the laser system (60) differs for each part (2).

[0035] The system (60) further includes a deflection device (66) for directing the laser beam (62) and scanning the surface of the part (2) to be processed.

[0036] The laser system (60) can be used in various ways and for various purposes. - Texture processing, which involves removing material from part (2) to create cavities on the surface of part (2). The cavities may be arranged according to discontinuous motifs, i.e., the cavities are separate from one another. Alternatively, the cavities may be arranged according to continuous motifs, i.e., the cavities are connected to one another. According to other alternative embodiments, the cavities may comprise a combination of discontinuous and continuous motifs. - Nanotexturing without material removal. In this embodiment, the material is redistributed by pulses of a laser beam (62), and nanometer-sized motifs are formed on the surface of the part. Depending on the operating conditions, the nanomotifs may be debossed, embossed, or both. This can be used, for example, to increase a specific surface area of ​​part (2). - A surface treatment that modifies the crystal structure of a material without removing the material itself. - A surface treatment that modifies the topography of a material without removing the material itself. - For example, chemical modification of materials when laser processing is performed in the presence of a purely reactive gas.

[0037] Other processes can also be carried out without departing from the scope of the present invention.

[0038] The machine (1) may further be equipped with a protective system (70) intended to protect the window (63) of the laser system. If it is advantageous for the machine (1) to combine the various processing systems (20-60) described above, it is a fact that the systems may consequently interfere with each other. Specifically, the window (63) of the laser system (60) needs to be as transparent as possible to ensure the effectiveness of the laser processing. This lack of transparency may result from deposits on the window (63) originating from material removed during the laser texture processing of the part (2), or from the vacuum deposition system (40), or even from the plasma generation system (30). Therefore, protecting the window (63) can be a significant advantage for the machine (1), not only in terms of the results of the laser processing to be performed, but also in terms of the degree of usefulness of the machine (1), if maintenance work aimed at cleaning or replacing the window (63) is infrequent.

[0039] In reality, machine (1) is, a) The step of exhausting the chamber (10), and then, The following steps, namely, b) A step of laser processing part (2), c) Plasma treatment of part (2), and / or d) A step of performing vacuum deposition on part (2), Various methods can be implemented, including combinations of these.

[0040] Advantageously, the various steps a) through d) can be performed in the same machine (1) adapted to process parts (2) of different shapes for a wide range of applications.

[0041] Steps a) and b) are always performed in this method and are supplemented by either step c) and step d), or both step c) and step d). The order of steps b), c), or d) is not chronological.

[0042] Step a) precedes any other step b), step c), or step d).

[0043] Steps b), c), and d) may be performed selectively, separately from other steps, or concurrently with one or more of the other steps, to process one or more parts. Steps b), c), d), or any combination thereof may be performed according to a sequence of use, which may be parameterized by a variable order of use and / or a variable number of uses. For example, step b) may be performed several times before step c) and / or step d).

[0044] Figures 3 to 17 show other embodiments of machine (1) according to the present invention. Some components of machine (1) are similar to those of the first embodiment described above and therefore have the same reference numerals for simplicity.

[0045] Figure 3 shows a transport system (50) that lacks a turret (52) and simply has a turntable (51). The turntable (51) forms a carousel on which one or more parts (2) are placed. This structure is advantageous when handling large parts (2).

[0046] Figure 4 shows a laser system (60) comprising a single source (61) and a device (67) for distributing and / or directing a laser beam (62) to process multiple small parts (2) simultaneously or several zones of the same large part (2). This distribution and / or directing device (67) may be based on splitting the beam (62) by using a semi-reflective mirror, for example, as shown in Figure 4, or, in fact, on deflecting the beam (62) by using a prism whose facets are rotated to continuously direct the beam (62) toward one zone (or one part) and then toward another. For the remainder of this specification, the distribution device (67) will be referred to without specifying whether it is a device that splits or deflects the beam (62).

[0047] When the transport system (50) is equipped with a carousel, it may be advantageous for the laser system (60) to be positioned laterally. Unlike the machine (1) in which the laser system (60) is positioned at the top, this configuration makes it possible to process what are known as "bulky" parts (2), as opposed to simply flat parts such as discs or films.

[0048] Figure 4 further shows a turret (52) equipped with a platen (53) that can rotate and move on its own, so that the three rotations, the rotations of the turntable (51), the turret (52), and / or the platen (53), can be controlled simultaneously or separately as required.

[0049] Figure 5 shows another mechanical structure (1) comprising a longitudinal transport system (50) and multiple compartments (11).

[0050] The longitudinal transport system (50) comprises a carriage (54) supporting the parts (2) and rollers (55) supporting the carriage (54). Alternatively, the longitudinal transport system (50) may comprise a conveyor belt, a roller conveyor (55) without carriages, a carriage (54) associated with an endless screw, or any other suitable device.

[0051] The compartments (11) of the chamber (10) are separated by vertical inner walls equipped with valves (12) that allow adjacent compartments (11) to be partitioned or connected. This structure is advantageous for protecting one of the systems (20-60) from contamination caused by the use of one of the other systems. The plasma system (30) is mounted on the upper wall of the first compartment (11), the vacuum deposition system (40) is mounted on the upper wall of the second compartment (11), and the laser system (60) is mounted on the upper wall of the third compartment (11). Other configurations can also be envisioned without departing from the scope of the invention. Due to the simplification of the figures, only one vacuum system (20) is shown. Such a machine (1) generally comprises multiple vacuum systems (20), so that during processing one compartment (11) may be isolated from other compartments (11). This compartment (11) must have its own system (20) for pumping. The same applies to heating and gas injection systems.

[0052] Figures 6 to 16 show different variations of the protective system (70) for the laser system (60). Numerous solutions are intended for integration into the protective system (70), and each of them can be utilized and used in combination to improve the effectiveness of the resulting overall protection.

[0053] In Figures 6 and 7, the system (70) includes a cover (71) in front of the window (63). The cover (71) can move between an "open" position, away from the window (63) when the laser system (60) is in use, and a "closed" position, positioned in front of the window (63) when the laser system (60) is not in use and other systems are in use. Thus, the duration for which the window (63) is exposed to projections originating from other systems is reduced. The cover (71) may be a plate in the shape of the window (63) that is moved translationally by a cylinder (72). Any other relevant technical solutions, such as a diaphragm, are also possible.

[0054] In Figures 8 and 9, the system (70) comprises a film (73) that can move between two rollers (74) in front of a window (63). This film (73) must be light-transmitting to the beam (62) and should not disturb the beam (62) as little as possible. This film (73) is intended to collect projections that may originate from other systems (20-50) or from parts (2) to be processed when texturing by removal is in progress. Advantageously, the operator can choose to leave the film (73) in a fixed position and move it only when it is anticipated that the film (73) has received excessive projections, or in fact, to advance it continuously to always ensure maximum transmittance of the film (73). Automatic advancement after a period of time may also be envisioned.

[0055] In Figures 10 to 15, the protective system (70) comprises a chamber (75) positioned in front of the window (63), with an aperture (76). This is a geometric solution aimed at increasing the distance between the window (63) and the aperture (76) through which the beam (62) enters the chamber (10). The chamber (75) defines a solid angle characterized by the ratio of the length of the chamber (75) to the width of the aperture (76). As shown in Figures 10 and 13, if this angle is too open, projectiles from the process will accumulate on the window (63) without difficulty penetrating the chamber (75). However, as shown in Figures 12 and 15, if this angle is closed, the chamber (75) constructs a tunnel inaccessible to the projectiles, thereby preventing the projectiles from accumulating on the window (63). Preferably, the chamber (75) defines an aperture angle of less than 45 degrees between the window (63) and the aperture (76). More preferably, this aperture angle is a lateral aperture angle, as opposed to a vertical aperture angle.

[0056] In Figure 16, the protective system (70) is created by introducing an oblique angle between the beam (62) and the window (63), resulting in an oblique angle of incidence between the laser beam (62) and the surface of the part (2) to be processed. In this way, projections originating from the texture are emitted in a direction other than the direction of the slit through which the laser beam (62) passes through the window (63). Projections directed toward the window (63) are thus reduced or even eliminated.

[0057] In one variant of this version of the protection system, the orthogonal angle of the passage of the laser beam (62) through the window (63) is maintained and combined with oblique incidence to the surface of the part (2). This can be achieved, for example, by offsetting the laser beam (62) with respect to the center of the turntable (51) or by tilting the window (63) with respect to the wall of the chamber (10).

[0058] In one variant not shown, the protective system (70) may also include a wall positioned between the window (63) and the chamber (10) to optically isolate the path of the laser beam (62), thereby protecting the window (63) from projectiles.

[0059] Figures 17 and 18 illustrate the advantages of bringing a device to the laser system (60) to modify its trajectory, focus, or shape. Specifically, the device may be used to process a part (2) that does not have a surface perpendicular to the beam (62). Figure 17 shows the beam (62) projected onto the surface of part (2) that is not perpendicular to the direction of the beam (62). For ease of understanding, the beam (62) is illustrated in a parallel, circular cross-section. In Figure 18, it can be seen that the spot (68) resulting from the projection of the beam (62) onto part (2) is elliptical, not circular. This is problematic, in particular, when the purpose of the laser processing is to achieve texture processing with a circular cavity. In this context, the modification device may be used to modify the shape of the laser beam (62) to correct deformation caused by the surface, as in this example. The laser system (60) may also include a shaping module upstream of the modification device to obtain, for example, a given non-circular structure.

[0060] Figure 17 further shows that the position of the beam (62) collision point on part (2) is a collision point on the distance to be reached between spot (68) and laser source (61). If beam (62) is offset to the right of part (2), the distance to be reached becomes longer. In fact, the beams (62) are not strictly parallel but approach each other so as to converge on the surface of part (2). If the path along which beam (62) travels has a variable length, convergence will be lost. Therefore, it is appropriate to introduce a device to correct convergence into the system (60).

[0061] Figure 19 shows a cylindrical part (2) that has already been partially processed, and a new zone (64) ready for processing. Since the machine (1) may be intended to process a large surface of one or more parts (2), this surface must pass through one or more systems (20-60) in use. Therefore, the transport system (50) is designed to displace the part (2) in a manner such that two consecutive processing zones (64) are adjacent. This point is illustrated in more detail with laser processing as an example, but this feature of the transport system (50) can also be implemented in the case of other systems (30, 40).

[0062] Performing laser processing implies that the surface of the part (2) must be positioned facing the window (63) of the laser system (60). The laser system (60) comprises complex optical devices that require considerable mechanical adjustment and stability. The laser system casing (60) is fixed in place. The relative displacement of the beam (62) to the part (2) is performed by displacing the optical devices of the laser system (60) and / or by displacing the part (2) to be processed. As a result, the part (2) is generally processed within a series of zones (64), and in some cases, multiple zones (64) may be processed in parallel by multiple laser beams (62). The laser system (60) processes the portion of the part (2) exposed to it. The part (2) is displaced so that the next zone to be processed is positioned facing the laser system (60). Preferably, this displacement is performed concurrently with the ongoing processing. Alternatively, this displacement may be performed alternately with the processing. This is shown in Figure 19, where it can be seen that a portion of the cylindrical part (2) has already been processed and the new zone (64) is ready for processing.

[0063] The positioning accuracy of part (2) can be improved, for example, by a position coding device, which includes, for example, an encoder, positioned within a chain of moving a turntable (51) or one or more carriages (54). Alternatively, or in addition, visual marks may be provided that can cooperate with one or more optical sensors. These visual marks can be marks made on part (2) in a manner such as being identified by a camera. Furthermore, if the already processed zones have different colors or textures that can be detected by sensors or cameras using, for example, polarized light or light of a selected wavelength, the visual marks can also be assumed to be these zones. Part (2) can be moved continuously relative to the laser system (60) without this change in the interpretation of the arrangement described above. In this case, the processing zones (64) have a smaller surface area and are refreshed much more frequently.

[0064] Furthermore, machine (1) can be configured in various ways, as shown in Figures 1 to 19, without departing from the scope of the present invention as defined in the claims. Moreover, the technical features of the various embodiments and variations described above can be combined in whole or in part. Thus, machine (1) can be adapted in terms of cost, function and performance. [Explanation of Symbols]

[0065] 1 machine 2 parts 10 Chambers 11 compartments 12 valves 20 Vacuum Systems 30 Plasma generation system 40 Vacuum deposition systems 50 Transportation Systems 51 Turntable 52 Turrets 53 Platen 54 Carriage 55 Rollers, roller conveyors 60 Laser Systems 61 Laser source 62 laser beams 63 windows 64 Zones 65 Focusing Correction Device 66 Deflection Devices 67 Distribution and / or orientation devices 68 spots 70 Protection Systems 71 Cover 72 liters 73 film 74 Laura 75 Chambers 76 Aperture

Claims

1. A machine (1) for processing parts (2), - Chamber (10) and, - Vacuum system (20), - Processing systems (30, 60; 40, 60; 30, 40, 60) including a plasma generation system (30) and / or a vacuum deposition system (40), - A transport system (50) that can displace one or more of the parts (2) within the chamber (10), In a machine (1) equipped with, The processing system (30, 60; 40, 60; 30, 40, 60) includes a laser system (60) designed to process one or more of the components (2) located within the chamber (10), wherein the laser system (60) is separate from the plasma generating system (30), and the laser system comprises a device for modifying the path and / or shape and / or focus of the laser beam, wherein the machine (1).

2. The machine (1) according to claim 1, characterized in that the processing systems (30, 60; 40, 60; 30, 40, 60) can be selectively used for processing one or more of the components (2) separately from the other systems or simultaneously with one or more of the other systems.

3. The machine (1) according to claim 1 or 2, characterized in that the sequence of use of the processing system (30, 60; 40, 60; 30, 40, 60) can be set by a variable order of use and / or a variable number of uses.

4. The machine (1) according to any one of claims 1 to 3, characterized by comprising a protective system (70) for the laser system (60).

5. The machine (1) according to claim 4, characterized in that the protective system (70) comprises a cover (71) that can be moved in front of the laser system (60).

6. The machine (1) according to claim 4 or 5, characterized in that the protective system (70) comprises a transparent film (73) that moves in front of the laser system (60).

7. The machine (1) according to any one of claims 4 to 6, characterized in that the protective system (70) comprises an inner wall that optically isolates the path of the laser beam (62) originating from the laser system (60) from the rest of the chamber (10) and protects it from the flow originating from the processing system (30, 60; 40, 60; 30, 40, 60).

8. The machine (1) according to any one of claims 4 to 7, wherein the protective system (70) comprises a chamber (75) fixed to the wall of the chamber (10) and formed between the window (63) of the laser system (60) and the part to be processed, and the chamber is provided with an aperture (76) facing the part to define an aperture angle of less than 45 degrees between the window (63) and the chamber (10).

9. The machine (1) according to any one of claims 1 to 8, characterized in that the laser system (60) comprises a pulsed laser source (61).

10. The machine (1) according to any one of claims 1 to 9, characterized in that the laser beam (62) can be directed to incident obliquely or orthogonally on one or more of the parts (2).

11. The machine (1) according to any one of claims 1 to 10, characterized in that the transport system (50) can displace one or more of the parts in a manner such that two consecutive processing zones (64) are adjacent to each other.

12. The machine (1) according to any one of claims 1 to 11, characterized in that the transport system (50) comprises a position coding device.

13. The machine (1) according to any one of claims 1 to 12, characterized in that the transport system (50) comprises a turntable (51) intended to support one or more parts (2).

14. The machine (1) according to claim 13, characterized in that the transport system (50) comprises a turret (52) mounted on the turntable (51) and intended to receive one or more parts.

15. The machine (1) according to claim 14, characterized in that the turret (52) can rotate and move relative to the turntable (51).

16. The machine (1) according to claim 14 or 15, characterized in that the transport system (50) comprises a platen (53) rotatably mounted on the turret (52) and intended to support the component (2).

17. The machine (1) according to any one of claims 13 to 16, characterized in that the laser system (60) is arranged in a horizontal orientation.

18. The machine (1) according to any one of claims 1 to 12, characterized in that the transport system (50) comprises longitudinal transport devices (54, 55) intended to support one or more parts (2).

19. The machine (1) according to any one of claims 1 to 18, characterized in that the transport system (50) comprises a visual mark and a light sensor capable of cooperating with the visual mark.

20. A method for processing part (2), a) The step of creating a vacuum in the chamber (10) in which one or more of the components (2) are arranged, and then, The following steps, namely, b) A step of laser processing one or more of the parts (2) with a laser system, wherein the laser system includes a device for correcting the path and / or shape and / or focus of the laser beam, c) The step of subjecting one or more of the components (2) to low-pressure plasma treatment, and / or d) A step of performing vacuum deposition on one or more of the parts (2), The combination of, In a method including, A method characterized in that the various steps are performed in the same machine (1) adapted to process a part (2).

21. The method according to claim 20, characterized in that step b), step c), and step d) are performed selectively to process one or more of the components, separately from the other steps or simultaneously with one or more of the other steps.

22. The method according to claim 20 or 21, characterized in that step b), step c), step d), or a combination thereof is performed according to a sequence of use which can be set by a variable order of use and / or a variable number of uses.

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