Gas treatment module, gas treatment method, and gas-phase organic compound treatment method
The gas treatment module and method enhance VOC removal in semiconductor manufacturing by using a photocatalyst and solvent interaction to continuously react with and dissolve adherent compounds, addressing inefficiencies in conventional methods.
Patent Information
- Application Number
- JP2024134519
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2024-03-25
- Filing Date
- 2024-08-09
- Publication Date
- 2026-07-13
- Estimated Expiration
- 2044-08-09
AI Technical Summary
Conventional methods for removing volatile organic compounds (VOCs) in semiconductor manufacturing, such as adsorption using activated carbon and photocatalytic reactions, are ineffective for certain compounds like alcohols, ketones, acids, and esters, leading to reduced reaction rates and incomplete treatment.
A gas treatment module and method utilizing a chamber with a photocatalyst, solvent introduction, and controlled solvent flow to dissolve and separate organic compound products, enhancing reaction efficiency by exploiting differences in solubility and volatility between gas-phase and liquid-phase compounds.
Significantly improves the reaction rate and treatment effectiveness for mixed gas-phase organic compounds by continuously removing adherent products from the photocatalyst surface, allowing continuous reaction with VOCs.
Smart Images

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Abstract
Description
[Technical Field]
[0001] The present invention relates to a gas treatment module, a gas treatment method, and a gas-phase organic compound treatment method. More specifically, the present invention relates to a gas treatment module, a gas treatment method, and a gas-phase organic compound treatment method applied to remove airborne molecular contaminants (AMCs) containing volatile organic compounds (VOCs) in processes related to the semiconductor industry. [Background technology]
[0002] For example, in industrial manufacturing sectors such as semiconductor manufacturing, cleanrooms are widely used to produce and manufacture products in a clean, contamination-free, and isolated environment in order to further improve product yield.
[0003] To meet the environmental requirements of a cleanroom, a fan and filtration system are typically installed at the cleanroom's gas inlet. The gas flow is then directed through the fan, passing through the filter of the filtration system before entering the cleanroom, thereby filtering out dust and various organic and inorganic contaminants.
[0004] For example, airborne molecular pollutants such as benzene, acetone, isopropanol, ethyl acetate, dimethyl sulfoxide, ethanolamine, propylene glycol methyl ether, and propylene glycol methyl ether acetate. One common method for removing volatile organic compounds (VOCs) from contaminants (AMCs) is adsorption using activated carbon. While activated carbon exhibits good physical adsorption for alkanes, alkenes, ethers, and benzene compounds among VOCs due to its pore structure, it exhibits inferior physical adsorption for alcohols, ketones, acids, and ester compounds among VOCs. Therefore, a photocatalytic reaction treatment method was proposed. However, in conventional photocatalytic reaction treatments, the product accumulates on the surface of the photocatalyst, reducing the reaction rate and resulting in the overall effectiveness failing to meet the requirements. [Overview of the Initiative]
[0005] The object of the present invention is to provide a gas treatment module that has a good treatment effect on gas-phase organic compounds in a mixed gas.
[0006] Another object of the present invention is to provide a gas treatment method that has a good treatment effect on gas-phase organic compounds in a mixed gas.
[0007] Another object of the present invention is to provide a method for treating gas-phase organic compounds that has a good treatment effect on gas-phase organic compounds.
[0008] The gas treatment module of the present invention includes a chamber, a gas introduction unit, a light source, a photocatalyst, a liquid introduction unit, a gas discharge unit, and a liquid discharge unit. The gas introduction unit communicates with the inside of the chamber and can supply the gas to be treated into the chamber, and the gas to be treated contains gaseous organic compounds. The light source is provided inside the chamber and can provide a first ray. The photocatalyst is provided inside the chamber and, when irradiated with the first ray, at least a portion of the gaseous organic compounds in the gas to be treated that come into contact with the photocatalyst can generate organic compound products through the action of the photocatalyst. Liquid introduction unit The chamber is connected to the interior and can provide a solvent in contact with the surface of the photocatalyst, allowing the organic compound product to dissolve in the solvent, with the solubility of the organic compound product in the solvent being higher than that of the gas-phase organic compound in the solvent, or the volatility of the organic compound product in the solvent being lower than that of the gas-phase organic compound in the solvent. The gas discharge unit is connected to the interior of the chamber and can discharge the treated gas that has been in contact with the photocatalyst, separated from the photocatalyst. The liquid discharge unit is connected to the interior of the chamber and can discharge the solvent containing the organic compound product, separated from the photocatalyst.
[0009] In embodiments of the present invention, the light source includes ultraviolet light continuously provided as the first ray.
[0010] In embodiments of the present invention, the gas treatment module further includes a filtration unit through which the gas to be treated can pass.
[0011] In the embodiment of the present invention, the photocatalyst is provided on one side of the filtration unit, and the light source and liquid introduction unit are provided on the outside of the filtration unit and face the photocatalyst.
[0012] In embodiments of the present invention, there may be multiple gas processing modules, and they may be arranged to be connected in series.
[0013] In embodiments of the present invention, the gas to be treated can pass through a solvent so that at least a portion of the gas-phase organic compound forms a liquid-phase organic compound, and the liquid-phase organic compound can generate organic compound products through the action of a photocatalyst.
[0014] In the embodiments of the present invention, the liquid introduction unit supplies the solvent in a batch manner.
[0015] In this embodiment of the present invention, the liquid introduction unit continuously supplies the solvent.
[0016] In an embodiment of the present invention, the flow rate at which the solvent flows over the surface of the photocatalyst is 75.6 L / min·m 2 or more.
[0017] In an embodiment of the present invention, the flow rate at which the gaseous organic compound flows over the surface of the photocatalyst is 0.7 m / s or less.
[0018] In an embodiment of the present invention, in the liquid introduction unit, the solvent is sprayed onto the surface of the photocatalyst by a shower.
[0019] In an embodiment of the present invention, in the liquid introduction unit, the solvent flows over the surface of the photocatalyst by reciprocating immersion.
[0020] In an embodiment of the present invention, the gaseous organic compound contains one or more selected from isopropanol, acetone, and toluene.
[0021] In an embodiment of the present invention, the gaseous organic compound does not contain one or more selected from polyhalogen compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkane compounds.
[0022] The gas treatment method of the present invention includes: (S1000) providing a treated gas containing a gaseous organic compound; (S2000) bringing the treated gas into contact with the surface of the photocatalyst to generate at least a part of the gaseous organic compound into an organic compound product by the action of the photocatalyst; (S3000) providing a solvent; (S4000) bringing the solvent into contact with the photocatalyst to dissolve the organic compound product in the solvent, where the solubility of the organic compound product in the solvent is higher than the solubility of the gaseous organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gaseous organic compound in the solvent; and (S5000) separating the treated gas in contact with the photocatalyst and the solvent containing the organic compound product from the photocatalyst. compound product in the solvent, where the solubility of the organic compound product in the solvent is higher than the solubility of the gaseous organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gaseous organic compound in the solvent; and (S5000) separating the treated gas in contact with the photocatalyst and the solvent containing the organic compound product from the photocatalyst.
[0023] In an embodiment of the present invention, step S2000 includes continuously providing ultraviolet light to irradiate the photocatalyst so that the vapor-phase organic compound acts to produce an organic compound product.
[0024] In an embodiment of the present invention, step S2000 includes that the vapor-phase organic compound acts on the photocatalyst multiple times to produce an organic compound product.
[0025] In an embodiment of the present invention, the gas treatment method further includes a step (S3200) of passing the gas to be treated through a solvent so that at least a part of the vapor-phase organic compound forms a liquid-phase organic compound, and a step (S3400) of producing an organic compound product from the liquid-phase organic compound by the action of the photocatalyst.
[0026] In an embodiment of the present invention, step S3400 includes that the liquid-phase organic compound acts on the photocatalyst multiple times to produce an organic compound product.
[0027] In an embodiment of the present invention, step S3000 includes supplying the solvent in a batch manner.
[0028] In an embodiment of the present invention, step S3000 includes supplying the solvent in a continuous manner.
[0029] In an embodiment of the present invention, the flow rate of the solvent flowing over the surface of the photocatalyst is 75.6 L / min·m 2 or more.
[0030] In an embodiment of the present invention, the flow rate of the vapor-phase organic compound flowing over the surface of the photocatalyst is 0.7 m / s or less.
[0031] In an embodiment of the present invention, step S3000 includes spraying the solvent onto the surface of the photocatalyst by a shower.
[0032] <000In the embodiments of the present invention, the gas-phase organic compound includes one or more selected from isopropanol, acetone, and toluene.
[0034] In the embodiments of the present invention, the gas-phase organic compound does not include one or more selected from polyhalogen compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkane compounds.
[0035] The present invention provides a method for treating a gas-phase organic compound, comprising: (A1000) providing a gas-phase organic compound; (A2000) causing the gas-phase organic compound to generate an organic compound product through the action of a photocatalyst; (A3000) providing a solvent; (A4000) contacting the solvent with the surface of a photocatalyst to dissolve the organic compound product in the solvent, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the gas-phase organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gas-phase organic compound in the solvent; and (A5000) separating the solvent containing the organic compound product from the photocatalyst.
[0036] In embodiments of the present invention, step A2000 includes irradiating a photocatalyst with ultraviolet light by continuously supplying it so that a gas-phase organic compound acts to produce an organic compound product.
[0037] In embodiments of the present invention, step A2000 includes the reaction of a gas-phase organic compound multiple times with a photocatalyst to produce an organic compound product.
[0038] In embodiments of the present invention, the gas-phase organic compound treatment method further includes the steps of (A3200) passing a gas-phase organic compound through a solvent so that at least a portion of the gas-phase organic compound forms a liquid-phase organic compound, and (A3400) causing the liquid-phase organic compound to generate an organic compound product through the action of a photocatalyst.
[0039] In embodiments of the present invention, step A3400 includes the reaction of a liquid-phase organic compound multiple times with a photocatalyst to produce an organic compound product.
[0040] In embodiments of the present invention, step A1000 includes providing a gas-phase organic compound together with a solvent.
[0041] In embodiments of the present invention, step A3000 includes supplying the solvent in a batch manner.
[0042] In embodiments of the present invention, step A3000 includes supplying the solvent in a continuous manner.
[0043] In the embodiments of the present invention, the flow velocity of the solvent across the surface of the photocatalyst is 75.6 L / min·m 2 That's all.
[0044] In the embodiments of the present invention, the flow velocity of the gas-phase organic compound across the surface of the photocatalyst is 0.7 m / s or less.
[0045] In embodiments of the present invention, step A3000 includes spraying a solvent onto the surface of the photocatalyst by showering.
[0046] In embodiments of the present invention, step A3000 includes the solvent flowing over the surface of the photocatalyst by reciprocal immersion.
[0047] In the embodiments of the present invention, the gas-phase organic compound includes one or more selected from isopropanol, acetone, and toluene.
[0048] In the embodiments of the present invention, the gas-phase organic compound does not include one or more selected from polyhalogen compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkane compounds. [Brief explanation of the drawing]
[0049] [Figure 1A] This is a schematic diagram of an embodiment of the gas processing module of the present invention.
[0050] [Figure 1B] This is a schematic diagram of the AA' section in Figure 1A.
[0051] [Figure 1C] This is a schematic diagram of an embodiment in which a spray hole is provided in the liquid introduction unit of the gas processing module of the present invention.
[0052] [Figure 2A] This is a schematic diagram showing the acetone removal effect with and without rinsing.
[0053] [Figure 2B] This is a schematic diagram illustrating the effectiveness of isopropanol, acetone, and toluene removal with water rinsing.
[0054] [Figure 3A] This is a schematic diagram showing the results of acetone removal using no rinsing, circulating rinsing, and continuous rinsing. [Figure 3B] This is a schematic diagram showing the results of acetone removal using no rinsing, circulating rinsing, and continuous rinsing.
[0055] [Figure 3C] This is a schematic diagram showing the results of removing acetone by continuously rinsing a photocatalyst with water at different flow rates.
[0056] [Figure 4] This is a schematic diagram of the flow of an embodiment of the gas treatment method of the present invention.
[0057] [Figure 5] This is a schematic diagram of the flow of a different embodiment of the gas treatment method of the present invention. [Figure 6] This is a schematic diagram of the flow of a different embodiment of the gas treatment method of the present invention.
[0058] [Figure 7] This is a schematic diagram of the flow of an example of the gas-phase organic compound treatment method of the present invention.
[0059] [Figure 8]This is a schematic diagram of the flow chart of a different embodiment of the gas-phase organic compound treatment method of the present invention. [Figure 9] This is a schematic diagram of the flow chart of a different embodiment of the gas-phase organic compound treatment method of the present invention. [Modes for carrying out the invention]
[0060] The following describes embodiments of the connection assemblies disclosed herein with reference to specific examples and drawings, but a person skilled in the art will be able to understand the advantages and effects of the present invention from the disclosure herein. However, the following disclosure is not intended to limit the scope of protection of the present invention, and a person skilled in the art will be able to realize the present invention in other different embodiments based on different viewpoints and applications without departing from the spirit of the invention. In the accompanying drawings, the thickness of layers, films, panels, regions, etc., is enlarged for clarity. Throughout the specification, the same reference numerals represent the same elements. It should be understood that when an element such as a layer, film, region, or substrate is described as being "on" another element or "connected" to another element, that element may be directly on or directly connected to another element, or there may be an intermediate element. Conversely, when an element is described as being "directly on" another element or "directly connected" to another element, there is no intermediate element. As used in this text, "connection" may refer to a physical and / or electrical connection. In the case of an "electrical connection" or "bonding," there may be other elements between the two elements.
[0061] It is important to understand that while terms such as "first," "second," and "third" are used in this text to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, and / or parts should not be limited by these terms. These terms are used only to distinguish between one element, component, region, layer, or part and another. Therefore, the "first element," "component," "region," "layer," or "part" described below can be called the second element, component, region, layer, or part without deviating from the teachings of this text.
[0062] Furthermore, relative terms such as "bottom" or "bottom" and "top" or "summit" may be used in the text to describe the relationship between one element and another, as shown in the drawings. It should be understood that relative terms are intended to include different orientations of the device other than those shown in the drawings. For example, if the device in one drawing is inverted, an element shown as being "below" another element will be oriented "above" the other element. Thus, the exemplary term "bottom" may include both "bottom" and "top" orientations, depending on the specific orientation of the drawing. Similarly, When the device in the drawing is inverted, elements that appear to be "below" or "below" other elements are oriented "above" other elements. Therefore, the exemplary terms "below" or "below" may include both "above" and "below" orientations.
[0063] As used in this text, “approximately,” “about,” or “substantially” includes the mean values within the acceptable range of deviations of the stated values and specific values determined by an ordinary technician of the art, taking into account the measurement described and a certain number of errors associated with the measurement (i.e., limitations of the measurement system). For example, “approximately” can indicate that the stated value is within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5%. Furthermore, as used in this text, “approximately,” “about,” or “substantially” may be used to select a relatively acceptable range of deviations or standard deviations based on optical properties, etching properties, or other properties, without applying a single standard deviation to all properties.
[0064] As shown in the embodiment in Figure 1A, the gas treatment module 900 of the present invention includes a chamber 100, a gas introduction unit 210, a light source 300, a photocatalyst 400, a liquid introduction unit 510, a gas discharge unit 220, and a liquid discharge unit 520. In one embodiment, the chamber 100 is made of stainless steel, but in a different embodiment, the chamber 100 may be made of other alloys, metals, metal oxides, or nonmetallic materials such as polymers or glass. The gas introduction unit 210 communicates with the inside of the chamber 100 and can supply the gas to be treated to the chamber 100. Specifically, in one embodiment, the gas introduction unit 210 may be an opening on one side of the chamber 100 or a connection port connected to an external line, and the gas to be treated may be transported by a device such as a pump or fan and supplied to the chamber 100 through the gas introduction unit 210.
[0065] The gas to be treated contains gas-phase organic compounds. The gas-phase organic compounds include volatile organic compounds (VOCs). In one example, the gas-phase organic compounds include one or more selected from isopropanol, acetone, and toluene. In other examples, to avoid, for example, a possible decrease in efficacy, the gas-phase organic compounds do not include one or more selected from polyhalogen compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, or long-chain alkane compounds.
[0066] As shown in the embodiment in Figure 1A, the light source 300 is provided in the chamber 100 and can provide a first ray continuously or intermittently. The photocatalyst 400 is provided in the chamber 100 and, when irradiated with the first ray, at least a portion of the gas-phase organic compound of the gas to be treated that comes into contact with the photocatalyst 400 can produce organic compound products by the action of the photocatalyst 400. More specifically, in one embodiment, the light source 300 may be a lamp capable of emitting ultraviolet light with a wavelength less than 400 nm, the reaction module 900 further includes a filtration unit 410 through which the gas to be treated can pass, and the photocatalyst 400 is titanium dioxide (TiO2) located in a place where it can be directly or indirectly irradiated by the ray, such as on one side of the filtration unit 410 which is, for example, a honeycomb ceramic filter. The gas-phase organic compound is acetone, and as it passes through the filtration unit 410, the photocatalyst 400 can cause reactions such as those shown in formulas (1) and (2) below. In other words, in this embodiment, the organic compound product is formic acid (HCOOH). CH3COCH3→HCOOH+CH3CHO……Formula (1) CH3CHO→2HCOOH……Formula (2) However, in different embodiments, the light source 300 may be a light-emitting device that emits a first ray of a different wavelength, the photocatalyst 400 is not limited to titanium dioxide, and the organic compound product may be acetic acid or the like.
[0067] Figure 1B is a schematic cross-sectional view of AA' in Figure 1A. As shown in the embodiment in Figure 1B, the liquid The liquid introduction unit 510 communicates with the inside of the chamber 100 and can provide a solvent to come into contact with the surface of the photocatalyst 400. The organic compound product can be dissolved in the solvent, for example, water, and the solubility of the organic compound product in the solvent is higher than the solubility of the gas-phase organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gas-phase organic compound in the solvent. Specifically, in one embodiment, the liquid introduction unit 510 may be a line penetrating from outside the chamber 100, and the solvent can enter the chamber 100 by transport, for example, by a device such as a pump or by gravity, and come into contact with the surface of the photocatalyst 400. The solvent may be sprayed onto the surface of the photocatalyst 400 by showering by providing a spray hole 511 directed toward the photocatalyst 400 at one end of the line inside the chamber 100. In a different embodiment, the one end of the line inside the chamber 100 may not be directed toward the photocatalyst 400, and the solvent may simply flow into the chamber 100, flow out of the chamber 100, and flow across the surface of the photocatalyst 400 by reciprocal immersion. The liquid introduction unit 510 may supply the solvent in a batch or continuous manner, that is, the solvent may flow intermittently or continuously across the surface of the photocatalyst 400.
[0068] As shown in the embodiment in Figure 1B, the gas discharge unit 220 is in communication with the inside of the chamber 100 and can discharge the treated gas that has come into contact with the photocatalyst and has been separated from the photocatalyst 400. Specifically, in one embodiment, the gas discharge unit 220 may be an opening on one side of the chamber 100 or a connection port connected to an external line, and the treated gas may be transported by a device such as a pump or fan and discharged from the chamber 100 after passing through the gas discharge unit 220. The liquid discharge unit 520 is in communication with the inside of the chamber 100 and can discharge the solvent containing organic compound products that have been separated from the photocatalyst 400. Specifically, in one embodiment, the liquid discharge unit 520 may be a line penetrating from the outside of the chamber 100, and the solvent can be separated from the chamber 100 by transport by a device such as a pump or by gravity.
[0069] Furthermore, in one embodiment, acetone, the aforementioned gas-phase organic compound, generates formic acid, an organic compound product, through the action of photocatalyst 400, and at least a portion of it can adhere to the surface of photocatalyst 400. Generally, formic acid undergoes the reaction of formula (3) below, 2HCOOH+O2→2CO2+2H2O...Formula (3) It can be decomposed into carbon dioxide and water. However, this reaction is slow and can be considered a rate-determining step (RDS). Due to the adhesion of formic acid to the surface of the photocatalyst 400, it cannot continue to react with acetone, a gas-phase organic compound, and the reaction rate is significantly reduced. In contrast, in the present invention, a solvent is provided so as to come into contact with the surface of the photocatalyst 400, and the solubility of the organic compound product (formic acid) in the solvent (water) is higher than the solubility of the gas-phase organic compound (acetone) in the solvent (water), or the volatility of the organic compound product (formic acid) in the solvent (water) is lower than the volatility of the gas-phase organic compound (acetone) in the solvent (water). Therefore, the formic acid adhering to the surface of the photocatalyst 400 can be quickly removed by water, and the photocatalyst 400 can continue to react with acetone, significantly improving the reaction rate. For example, with gaseous organic compounds such as acetone, it is preferable that the time spent in contact with the photocatalyst is longer than the time it takes to react with the photocatalyst to produce an organic compound product such as formic acid, but shorter than the time it takes for the reaction to be complete and produce final reactants such as carbon dioxide and water. From a different perspective, the present invention seeks to significantly improve the reaction rate by utilizing the difference in solubility or volatility of the gaseous organic compound and the organic compound product in the solvent, substantially rinsing the surface of the photocatalyst 400 with the solvent to remove the organic compound product adhering to the surface of the photocatalyst 400, and enabling the photocatalyst 400 to continuously react with the gaseous organic compound under ultraviolet light irradiation.
[0070] In a different embodiment, the gas to be treated passes through a solvent, and at least a portion of the gas-phase organic compounds form liquid-phase organic compounds, which can then generate organic compound products through the action of a photocatalyst. From a different perspective, the gas to be treated entering the chamber can be washed with water to dissolve at least a portion of the gas-phase organic compounds in water, forming liquid-phase organic compounds, which then similarly generate organic compound products through the action of a photocatalyst and can be removed from the surface of the photocatalyst with water.
[0071] As shown in the embodiments in Figures 1A to 1C, the shape, size, arrangement, relative angles, etc., of each element in the gas treatment module 900 can be adjusted as needed. On the other hand, the gas treatment module 900 may be provided in multiple units and connected in series to improve the treatment effect and / or processing amount for gas-phase organic compounds.
[0072] Gas treatment module example 1: A substrate with a length of 150 mm, a width of 150 mm, a thickness of 50 mm, and a pore diameter of 4 mm was used, and the material was cordierite, mullite, aluminum titanate, silicon carbide, zirconium oxide, silicon nitride, etc. A photocatalyst made of titanium dioxide was placed on its surface, and the photocatalyst was irradiated with ultraviolet light emitting a wavelength slightly less than 400 nm using a lamp with a taper angle of 30° and a lamp spacing of 150 mm, and the distance between the spray heads was 50 mm. The flow rate of the gas to be treated was 0.4 m³. 3 When the value was / min, the result without rinsing and the flow rate was 75.6 L / min·m 2 The results of continuously flowing water through the photocatalyst are shown in Table 1 and Figure 2A below. It is clear that the average amount of acetone removed and the average removal efficiency after continuous water washing were significantly better than those without water washing. From this, it can be demonstrated that the gas treatment module of the present invention has a favorable removal effect on gaseous organic compounds in mixed gases. [Table 1]
[0073] In Example 1 of the gas treatment module described above, when the flow rate of the gas to be treated was 0.4 m 3 / min and water with a flow rate of 75.6 L / min·m 2 continuously flowed through the photocatalyst, the removal results for isopropanol, acetone, and toluene are shown in Fig. 2B, revealing that the gas treatment module of the present invention has good removal effects for all three of the above substances.
[0074] In Example 1 of the gas treatment module described above, when the flow rate of the gas to be treated was 0.4 m 3 / min, and there was no water washing, circulating water washing, or continuous water washing (rinsing the photocatalyst continuously by showering with water at a flow rate of 75.6 L / min·m 2 ), the removal results for acetone are shown in Figs. 3A and 3B, revealing that continuous water washing has a preferable effect.
[0075] In Example 1 of the gas treatment module described above, when the flow rate of the gas to be treated was 0.4 m 3 / min and the photocatalyst was continuously rinsed with water at flow rates of 4.27, 50.7, and 75.6 L / min·m 2 respectively, the removal results for acetone are shown in Table 2 below and Fig. 3C, revealing that a flow rate of 75.6 L / min·m 2 has a preferable effect.
Table 2
[0076] In Example 1 of the gas treatment module described above, when the flow velocities of the gas to be treated were 2.5, 1.5, and 0.7 m / s respectively and water with a flow rate of 75.6 L / min·m 2 continuously flowed through the photocatalyst, the removal results for acetone are shown in Table 3 below, revealing that a flow velocity of 0.7 m / s has a preferable effect.
Table 3
[0077] As shown in the schematic flow diagram of the embodiment in Figure 4, the gas treatment method of the present invention includes, for example, the following steps.
[0078] In step S1000, the gas to be treated, which contains a gas-phase organic compound, is provided. In one embodiment, this step includes providing the gas to be treated together with a solvent. More specifically, the gas-phase organic compound includes volatile organic compounds (VOCs). In one embodiment, the gas-phase organic compound includes one or more selected from isopropanol, acetone, and toluene. In different embodiments, to avoid, for example, a possible decrease in efficacy, the gas-phase organic compound does not include one or more selected from polyhalogen compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, or long-chain alkane compounds.
[0079] In step S2000, the gas to be treated is brought into contact with the surface of the photocatalyst, so that at least a portion of the gas-phase organic compound generates an organic compound product through the action of the photocatalyst. More specifically, in one embodiment, the gas to be treated is brought into contact with the surface of a photocatalyst 400 as shown in Figure 1A, so that at least a portion of the gas-phase organic compound generates an organic compound product through the action of the photocatalyst 400. In another embodiment, this step further includes irradiating the photocatalyst with ultraviolet light continuously so that the gas-phase organic compound acts to generate an organic compound product. In yet another embodiment, this step further includes causing the gas-phase organic compound to act on the photocatalyst multiple times to generate an organic compound product.
[0080] In step S3000, a solvent is provided and brought into contact with the photocatalyst to dissolve the organic compound product in the solvent. The solubility of the organic compound product in the solvent is higher than the solubility of the gas-phase organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gas-phase organic compound in the solvent. More specifically, in one embodiment, as shown in Figure 1A, the solvent is brought into contact with the photocatalyst 400 so as to dissolve the organic compound product in the solvent. This step may include supplying the solvent in a batch or continuous manner, i.e., the solvent flowing intermittently or continuously across the surface of the photocatalyst 400. The flow rate of the solvent across the surface of the photocatalyst is preferably 75.6 L / min·m 2 That concludes the procedure. The flow velocity of the gaseous organic compound across the surface of the photocatalyst is preferably 0.7 m / s or less. This step may include spraying the solvent onto the surface of the photocatalyst by showering or flowing it across the surface of the photocatalyst by reciprocal immersion.
[0081] In step S4000, the gas to be treated and the solvent containing the organic compound product that has come into contact with the photocatalyst are separated from the photocatalyst. More specifically, in one embodiment, as shown in Figure 1B, the gas to be treated and the solvent containing the organic compound product that has come into contact with the photocatalyst 400 are separated from the photocatalyst 400. Furthermore, for example, a gaseous organic compound such as acetone should have a contact time with the photocatalyst that is longer than the time it takes to react with the photocatalyst to produce an organic compound product such as formic acid, but shorter than the time it takes for it to completely react to form final reactants such as carbon dioxide and water.
[0082] In conventional photocatalysts used to decompose gas-phase organic compounds, the surface of the photocatalyst cannot continue reacting with the gas-phase organic compound due to the adhesion of organic compound products, resulting in a significant decrease in the reaction rate. In contrast, in the present invention, a solvent is provided in contact with the surface of the photocatalyst, and the solubility of the organic compound product (formic acid) in the solvent (water) is higher than the solubility of the gas-phase organic compound (acetone) in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gas-phase organic compound in the solvent. Therefore, the organic compound product adhering to the surface of the photocatalyst can be rapidly removed by the solvent, allowing the photocatalyst to continue reacting with the gas-phase organic compound and significantly improving the reaction rate. From a different perspective, the present invention does not aim to accelerate the complete reaction of the gas-phase organic compound, but rather to utilize the difference in solubility or volatility of the gas-phase organic compound and its products in the solvent. By substantially rinsing the surface of the photocatalyst with the solvent, the organic compound product adhering to the surface of the photocatalyst is removed, allowing the photocatalyst to continue reacting with the gas-phase organic compound, thereby significantly improving the reaction rate.
[0083] As shown in the schematic flow diagram of the embodiment in Figure 5, the gas treatment method of the present invention further includes step S1200, which involves passing the gas to be treated through a filtration unit. More specifically, as shown in Figure 1B, the gas to be treated is passed through a filtration unit 410.
[0084] As shown in the schematic flow diagram of the embodiment in Figure 6, the gas treatment method of the present invention further includes step S1500, which involves passing the gas to be treated through a solvent so that at least a portion of the gas-phase organic compound forms a liquid-phase organic compound, and step S2500, which involves the liquid-phase organic compound generating an organic compound product through the action of a photocatalyst. Viewed from a different angle, the gas to be treated entering the chamber can be washed with water to dissolve at least a portion of the gas-phase organic compound in water to form a liquid-phase organic compound, and then similarly generate an organic compound product through the action of a photocatalyst, which can be removed from the surface of the photocatalyst with water. Step S2500 includes the liquid-phase organic compound being subjected to the action of the photocatalyst multiple times to generate an organic compound product.
[0085] In the gas treatment method described above, the gas to be treated may contain one or more gas-phase organic compounds, that is, one or more gas-phase organic compounds may be treated simultaneously. In one embodiment, the same concept can be applied to the treatment of gas-phase organic compounds alone and mixtures thereof.
[0086] As shown in the schematic flow diagram of the embodiment in Figure 7, the gas-phase organic compound treatment method of the present invention includes, for example, the following steps.
[0087] In step A1000, a gas-phase organic compound is provided. In one embodiment, this step The invention includes providing a gas-phase organic compound together with a solvent. More specifically, the gas-phase organic compound includes volatile organic compounds (VOCs). In one example, the gas-phase organic compound includes one or more selected from isopropanol, acetone, and toluene. In a different example, to avoid, for example, a possible decrease in efficacy, the gas-phase organic compound does not include one or more selected from polyhalogen compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, or long-chain alkane compounds.
[0088] In step A2000, a gas-phase organic compound generates an organic compound product through the action of a photocatalyst. In one embodiment, this step includes irradiating the photocatalyst with ultraviolet light continuously so that the gas-phase organic compound acts to generate an organic compound product. In another embodiment, this step includes allowing the gas-phase organic compound to act multiple times with the photocatalyst to generate an organic compound product.
[0089] In step A3000, a solvent is provided and brought into contact with the surface of the photocatalyst to dissolve the organic compound product in the solvent. The solubility of the organic compound product in the solvent is higher than the solubility of the gas-phase organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gas-phase organic compound in the solvent. Step A3000 includes supplying the solvent in a batch or continuous manner. The flow rate of the solvent over the surface of the photocatalyst is preferably 75.6 L / min·m 2 The above describes the process. The flow velocity of the gaseous organic compound across the surface of the photocatalyst is preferably 0.7 m / s or less. In one embodiment, this step includes spraying the solvent onto the surface of the photocatalyst by showering. In another embodiment, this step includes flowing the solvent across the surface of the photocatalyst by reciprocating immersion.
[0090] In step A4000, the solvent containing the organic compound product is separated from the photocatalyst.
[0091] As shown in the schematic flow diagram of the embodiment in Figure 8, the gas-phase organic compound treatment method of the present invention further includes step A1200, which involves passing the gas-phase organic compound through a filtration unit.
[0092] As shown in the schematic flow diagram of the embodiment in Figure 9, the gas-phase organic compound processing method of the present invention further includes step A1500, which involves passing a gas-phase organic compound through a solvent so that at least a portion of the gas-phase organic compound forms a liquid-phase organic compound, and step A2500, which involves the liquid-phase organic compound generating an organic compound product through the action of a photocatalyst. Step A2500 includes the liquid-phase organic compound being subjected to the photocatalyst multiple times to generate an organic compound product.
[0093] While the foregoing description and drawings disclose preferred embodiments of the present invention, it should be understood that various additions, numerous modifications, and substitutions can be made to these preferred embodiments without departing from the spirit and scope of the principles of the present invention, as limited by the appended claims. Anyone with ordinary skill in the art to which the present invention pertains will understand that the present invention can be used to modify many forms, structures, arrangements, proportions, materials, elements, and assemblies. Therefore, the embodiments disclosed herein are not intended to limit the present invention, but rather to illustrate it. The scope of the present invention is limited by the appended claims, encompassing their lawful equivalents and not limited to the foregoing description. [Explanation of Symbols]
[0094] 100: Chamber 210: Gas introduction unit 220: Gas exhaust unit 300: Light source 400: Photocatalyst 410: Filtration unit 510: Liquid introduction unit 511: Spray Hole 520: Liquid discharge unit 900: Processing module
Claims
1. Chamber and, A gas introduction unit that communicates with the inside of the chamber and can supply the gas to be treated to the chamber, wherein the gas to be treated contains a gaseous organic compound, and the gas introduction unit A light source provided in the chamber, capable of providing a first ray, A photocatalyst immobilized in the chamber, wherein the photocatalyst comes into contact with the gas to be treated and, when irradiated with a first ray, at least a portion of the gas-phase organic compound in the gas to be treated that comes into contact with the photocatalyst can generate organic compound products through the action of the photocatalyst, A liquid introduction unit that communicates with the inside of the chamber and provides a solvent to bring into flowing contact with the surface of the photocatalyst, wherein the organic compound product is soluble in the solvent, and the solubility of the organic compound product in the solvent is higher than the solubility of the gas-phase organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gas-phase organic compound in the solvent, A gas discharge unit is provided, which is in communication with the inside of the chamber and capable of discharging the gas to be treated that has come into contact with the photocatalyst and is separated from the photocatalyst, The chamber includes a liquid discharge unit that communicates with the inside of the chamber and can discharge the solvent containing the organic compound product, separated from the photocatalyst. Gas processing module.
2. The gas processing module according to claim 1, wherein the light source includes ultraviolet light continuously provided as the first ray.
3. The gas treatment module according to claim 1, further comprising a filtration unit through which the gas to be treated can pass.
4. The gas treatment module according to claim 3, wherein the photocatalyst is provided on one side of the filtration unit, and the light source and the liquid introduction unit are provided on the outside of the filtration unit and face the photocatalyst.
5. The gas processing module according to claim 1, which can be provided in multiple quantities and connected in series.
6. The gas to be treated passes through the solvent, causing at least a portion of the gas-phase organic compound to form a liquid-phase organic compound. The liquid-phase organic compound can produce the organic compound product through the action of the photocatalyst. The gas processing module according to claim 1.
7. The gas processing module according to claim 1, wherein the liquid introduction unit supplies the solvent in a batch manner.
8. The gas processing module according to claim 1, wherein the liquid introduction unit continuously supplies the solvent.
9. The gas treatment module according to claim 8, wherein the flow velocity of the solvent across the surface of the photocatalyst is 75.6 L / min·m².
10. The gas treatment module according to claim 1, wherein the flow velocity of the gas-phase organic compound across the surface of the photocatalyst is 0.7 m / s.
11. The gas treatment module according to claim 1, wherein the liquid introduction unit sprays the solvent onto the surface of the photocatalyst by showering.
12. The gas treatment module according to claim 1, wherein the liquid introduction unit allows the solvent to flow across the surface of the photocatalyst by reciprocal immersion.
13. The gas treatment module according to claim 1, wherein the gas-phase organic compound comprises one or more selected from isopropanol, acetone, and toluene.
14. The gas treatment module according to claim 1, wherein the gas-phase organic compound does not include one or more selected from polyhalogen compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkane compounds.
Citation Information
Patent Citations
Apparatus for treating volatile organic compound
JP1997103644A
Photocatalyst bearing structure and decomposition device for volatile organic compound using this structure
JP2000185219A
Method and apparatus for treating water
JP2000263070A
Photocatalytic treatment system and method for contaminated media
JP2001515786A
Removal system for volatile organic compound by gas absorption tower
JP2010036148A
