Light-emitting devices, electronic devices, and lighting devices

Abstract

To provide a light-emitting device with flexibility and high reliability.SOLUTION: A light-emitting device includes a first flexible substrate, a second flexible substrate, a light-emitting element between the first flexible substrate and the second flexible substrate, a first bonding layer between the second flexible substrate and the light-emitting element, and a second bonding layer with a frame shape that surrounds the first bonding layer. The light-emitting element includes a layer containing a light-emitting organic compound between a pair of electrodes. The second bonding layer has a higher gas barrier property than the first bonding layer.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a product, method, or method of manufacture. Or, the present invention relates to a process, machine, or machine. This invention relates to a manufacture or composition of matter. The invention relates to semiconductor devices, light-emitting devices, display devices, electronic devices, lighting devices, and methods for manufacturing them. In particular, one aspect of the present invention relates to organic electroluminescence (Electrolum This document relates to a light-emitting device utilizing the inescence (hereinafter also referred to as EL) phenomenon and its manufacturing method. ru. [Background technology]

[0002] In recent years, light-emitting devices and display devices are expected to have applications in a variety of uses, and diversification is required. Yes, they are.

[0003] For example, light-emitting devices and display devices for portable devices and the like require to be thin and lightweight. Alternatively, it is required to be resistant to damage, etc.

[0004] Light-emitting elements (also written as EL elements) that utilize the EL phenomenon are easy to make thin and light, input signal It has features such as being able to respond quickly to signals and being able to be driven using a DC low-voltage power supply. Applications in light-emitting devices and display devices are being considered.

[0005] For example, Patent Document 1 describes a film substrate on which a switching element such as a transistor or organic A flexible active-matrix light-emitting device equipped with an EL element is disclosed.

[0006] Organic EL elements are susceptible to loss of reliability due to impurities such as moisture and oxygen entering from the outside. There is a challenge in moving.

[0007] From the outside of the organic EL device, impurities such as moisture and oxygen may penetrate into the organic compounds and metal materials that constitute the organic EL device, significantly reducing the lifespan of the organic EL device. This is because the organic compounds and metal materials used in the organic EL device react with impurities such as moisture and oxygen and deteriorate. Therefore, research and development are underway on technologies for sealing organic EL devices to prevent the intrusion of impurities.

[0008]

Prior Art Documents

Patent Documents

[0009]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0010] One aspect of the present invention aims to provide a flexible, highly reliable light-emitting device, display device, electronic device, or lighting device.

[0011] Another aspect of the present invention aims to improve the yield in the manufacturing process of a flexible, highly reliable light-emitting device. Another aspect of the present invention aims to suppress the mixing of impurities in the manufacturing process of the light-emitting device.

[0012] Another aspect of the present invention aims to provide a novel light-emitting device, display device, electronic device, or lighting device. Or, one aspect of the present invention aims to provide a lightweight light-emitting device, display device, electronic device, or lighting device. Or, one aspect of the present invention ​​​An object of the present invention is to provide a light-emitting device, a display device, an electronic device, or a lighting device that is difficult to be damaged. Alternatively, an aspect of the present invention has an object to provide a light-emitting device, a display device, an electronic device, or a lighting device having a small thickness. Note that the description of these problems does not prevent the existence of other problems. Note that an aspect of the present invention does not necessarily need to solve all of these problems. Other problems will be apparent from the description of the specification, drawings, claims, etc., and it is possible to extract these other problems from the description of the specification, drawings, claims, etc. Note that the description of these problems does not prevent the existence of other problems. Note that an aspect of the present invention does not necessarily need to solve all of these problems. Other problems will be apparent from the description of the specification, drawings, claims, etc., and it is possible to extract these other problems from the description of the specification, drawings, claims, etc.

[0013] Note that the description of these problems does not prevent the existence of other problems. Note that an aspect of the present invention does not necessarily need to solve all of these problems. Other problems will be apparent from the description of the specification, drawings, claims, etc., and it is possible to extract these other problems from the description of the specification, drawings, claims, etc. Note that the description of these problems does not prevent the existence of other problems. Note that an aspect of the present invention does not necessarily need to solve all of these problems. Other problems will be apparent from the description of the specification, drawings, claims, etc., and it is possible to extract these other problems from the description of the specification, drawings, claims, etc. Note that the description of these problems does not prevent the existence of other problems. Note that an aspect of the present invention does not necessarily need to solve all of these problems. Other problems will be apparent from the description of the specification, drawings, claims, etc., and it is possible to extract these other problems from the description of the specification, drawings, claims, etc. Note that the description of these problems does not prevent the existence of other problems. Note that an aspect of the present invention does not necessarily need to solve all of these problems. Other problems will be apparent from the description of the specification, drawings, claims, etc., and it is possible to extract these other problems from the description of the specification, drawings, claims, etc. **Means for Solving the Problems**

[0014] A light-emitting device according to an aspect of the present invention includes a first flexible substrate, a second flexible substrate, a light-emitting element between the first flexible substrate and the second flexible substrate, a first bonding layer between the second flexible substrate and the light-emitting element, and a frame-shaped second bonding layer surrounding the first bonding layer. The light-emitting element has a layer containing a light-emitting organic compound between a pair of electrodes, and the second bonding layer has a higher gas barrier property than the first bonding layer. A light-emitting device according to an aspect of the present invention includes a first flexible substrate, a second flexible substrate, a transistor between the first flexible substrate and the second flexible substrate, a light-emitting element between the transistor and the second flexible substrate, an adhesive layer between the first flexible substrate and the transistor, a first bonding layer between the second flexible substrate and the light-emitting element, and a frame-shaped second bonding layer surrounding the first bonding layer. The light-emitting element has a layer containing a light-emitting organic compound between a pair of electrodes, and the second bonding layer has a higher gas barrier property than the first bonding layer. A light-emitting device according to an aspect of the present invention includes a first flexible substrate, a second flexible substrate, a transistor between the first flexible substrate and the second flexible substrate, a light-emitting element between the transistor and the second flexible substrate, an adhesive layer between the first flexible substrate and the transistor, a first bonding layer between the second flexible substrate and the light-emitting element, and a frame-shaped second bonding layer surrounding the first bonding layer. The light-emitting element has a layer containing a light-emitting organic compound between a pair of electrodes, and the second bonding layer has a higher gas barrier property than the first bonding layer. A light-emitting device according to an aspect of the present invention includes a first flexible substrate, a second flexible substrate, a transistor between the first flexible substrate and the second flexible substrate, a light-emitting element between the transistor and the second flexible substrate, an adhesive layer between the first flexible substrate and the transistor, a first bonding layer between the second flexible substrate and the light-emitting element, and a frame-shaped second bonding layer surrounding the first bonding layer. The light-emitting element has a layer containing a light-emitting organic compound between a pair of electrodes, and the second bonding layer has a higher gas barrier property than the first bonding layer. A light-emitting device according to an aspect of the present invention includes a first flexible substrate, a second flexible substrate, a transistor between the first flexible substrate and the second flexible substrate, a light-emitting element between the transistor and the second flexible substrate, an adhesive layer between the first flexible substrate and the transistor, a first bonding layer between the second flexible substrate and the light-emitting element, and a frame-shaped second bonding layer surrounding the first bonding layer. The light-emitting element has a layer containing a light-emitting organic compound between a pair of electrodes, and the second bonding layer has a higher gas barrier property than the first bonding layer.

[0015] A light-emitting device according to an aspect of the present invention includes a first flexible substrate, a second flexible substrate, a transistor between the first flexible substrate and the second flexible substrate, a light-emitting element between the transistor and the second flexible substrate, an adhesive layer between the first flexible substrate and the transistor, a first bonding layer between the second flexible substrate and the light-emitting element, and a frame-shaped second bonding layer surrounding the first bonding layer. The light-emitting element has a layer containing a light-emitting organic compound between a pair of electrodes, and the second bonding layer has a higher gas barrier property than the first bonding layer. A light-emitting device according to an aspect of the present invention includes a first flexible substrate, a second flexible substrate, a transistor between the first flexible substrate and the second flexible substrate, a light-emitting element between the transistor and the second flexible substrate, an adhesive layer between the first flexible substrate and the transistor, a first bonding layer between the second flexible substrate and the light-emitting element, and a frame-shaped second bonding layer surrounding the first bonding layer. The light-emitting element has a layer containing a light-emitting organic compound between a pair of electrodes, and the second bonding layer has a higher gas barrier property than the first bonding layer. A light-emitting device according to an aspect of the present invention includes a first flexible substrate, a second flexible substrate, a transistor between the first flexible substrate and the second flexible substrate, a light-emitting element between the transistor and the second flexible substrate, an adhesive layer between the first flexible substrate and the transistor, a first bonding layer between the second flexible substrate and the light-emitting element, and a frame-shaped second bonding layer surrounding the first bonding layer. The light-emitting element has a layer containing a light-emitting organic compound between a pair of electrodes, and the second bonding layer has a higher gas barrier property than the first bonding layer. A light-emitting device according to an aspect of the present invention includes a first flexible substrate, a second flexible substrate, a transistor between the first flexible substrate and the second flexible substrate, a light-emitting element between the transistor and the second flexible substrate, an adhesive layer between the first flexible substrate and the transistor, a first bonding layer between the second flexible substrate and the light-emitting element, and a frame-shaped second bonding layer surrounding the first bonding layer. The light-emitting element has a layer containing a light-emitting organic compound between a pair of electrodes, and the second bonding layer has a higher gas barrier property than the first bonding layer. A light-emitting device according to an aspect of the present invention includes a first flexible substrate, a second flexible substrate, a transistor between the first flexible substrate and the second flexible substrate, a light-emitting element between the transistor and the second flexible substrate, an adhesive layer between the first flexible substrate and the transistor, a first bonding layer between the second flexible substrate and the light-emitting element, and a frame-shaped second bonding layer surrounding the first bonding layer. The light-emitting element has a layer containing a light-emitting organic compound between a pair of electrodes, and the second bonding layer has a higher gas barrier property than the first bonding layer. A light-emitting device according to an aspect of the present invention includes a first flexible substrate, a second flexible substrate, a transistor between the first flexible substrate and the second flexible substrate, a light-emitting element between the transistor and the second flexible substrate, an adhesive layer between the first flexible substrate and the transistor, a first bonding layer between the second flexible substrate and the light-emitting element, and a frame-shaped second bonding layer surrounding the first bonding layer. The light-emitting element has a layer containing a light-emitting organic compound between a pair of electrodes, and the second bonding layer has a higher gas barrier property than the first bonding layer.

[0016] Furthermore, a light-emitting device according to one aspect of the present invention comprises a first flexible substrate, a second flexible substrate, and a first A highly gas-barrier insulating layer between the flexible substrate and the second flexible substrate, and the insulating layer and the second A light-emitting element between flexible substrates, an adhesive layer between the first flexible substrate and the insulating layer, and a second flexible A first bonding layer between the substrate and the light-emitting element, and a frame-shaped second bonding layer surrounding the first bonding layer. The light-emitting element has a layer containing a light-emitting organic compound between a pair of electrodes, and a second junction This layer has higher gas barrier properties than the first bonding layer.

[0017] Furthermore, a light-emitting device according to one aspect of the present invention comprises a first flexible substrate, a second flexible substrate, and a first A first insulating layer with high gas barrier properties between the flexible substrate and the second flexible substrate, and the first insulating The transistor between the layer and the second flexible substrate, and between the transistor and the second flexible substrate A light-emitting element, a colored layer between the light-emitting element and the second flexible substrate, and the colored layer and the second flexible A second insulating layer with high gas barrier properties between the substrates, and between the first flexible substrate and the first insulating layer. A first adhesive layer, a first bonding layer between the colored layer and the light-emitting element, and a frame surrounding the first bonding layer. It comprises a second bonding layer in the shape of a second insulating layer and a second adhesive layer between the second insulating layer and the second flexible substrate. The light-emitting element has a layer containing a light-emitting organic compound between a pair of electrodes, a first junction layer, and a colored layer. The layer, the second insulating layer, the second adhesive layer, and the second flexible substrate transmit light emitted by the light-emitting element. Furthermore, the second bonding layer has higher gas barrier properties than the first bonding layer.

[0018] Furthermore, an electronic device having the light-emitting device of each of the above configurations as a display unit is also one embodiment of the present invention.

[0019] Furthermore, a lighting device having the light-emitting devices of each of the above configurations as the light-emitting part is also one aspect of the present invention.

[0020] In this specification, the term "light-emitting device" includes a display device using a light-emitting element. A connector for the optical element, such as an anisotropic conductive film, or TCP (Tape Carrier) A module with an aftermarket package attached, and a printed circuit board beyond the TCP. The installed module or light-emitting element uses the COG (Chip On Glass) method. Modules on which ICs (integrated circuits) are directly mounted are also included in the definition of light-emitting devices. This also includes light-emitting devices used in lighting fixtures and the like. [Effects of the Invention]

[0021] According to one aspect of the present invention, a novel light-emitting device, display device, electronic device, or lighting device is provided. This is possible. Furthermore, according to one aspect of the present invention, a flexible and highly reliable light-emitting device is available. We can provide display devices, electronic devices, or lighting devices.

[0022] Furthermore, according to one aspect of the present invention, in the manufacturing process of a flexible and highly reliable light-emitting device Yield can be improved. Furthermore, according to one aspect of the present invention, the manufacturing process of the light-emitting device is improved. This can suppress the inclusion of impurities.

[0023] Furthermore, the description of these effects does not preclude the existence of other effects. The embodiment does not necessarily have to have all of these effects. Furthermore, other effects are... This will become clear from the description in the specification, drawings, claims, etc., and the specification, drawings Furthermore, it is possible to extract other effects from the descriptions in the claims and other documents. [Brief explanation of the drawing]

[0024] [Figure 1] A diagram illustrating an example of a light-emitting device. [Figure 2] A diagram illustrating an example of a light-emitting device. [Figure 3] A diagram illustrating an example of a light-emitting device. [Figure 4] A diagram illustrating an example of a light-emitting device. [Figure 5] A diagram illustrating an example of a light-emitting device. [Figure 6] A diagram illustrating an example of a method for manufacturing a light-emitting device. [Figure 7] A diagram illustrating an example of a method for manufacturing a light-emitting device. [Figure 8] A diagram illustrating an example of a method for manufacturing a light-emitting device. [Figure 9] A diagram illustrating an example of a method for manufacturing a light-emitting device. [Figure 10] A diagram illustrating an example of a method for manufacturing a light-emitting device. [Figure 11] A diagram illustrating an example of a method for manufacturing a light-emitting device. [Figure 12] A diagram illustrating the planar shape of the delamination layer. [Figure 13] A diagram illustrating an example of a method for creating a delamination layer. [Figure 14] A diagram illustrating an example of a method for manufacturing a light-emitting device. [Figure 15] A diagram illustrating an example of electronic equipment and lighting devices. [Figure 16] A diagram showing the transmittance of the sample. [Figure 17] A diagram showing the light-emitting device, which is a sample of the example. [Figure 18] A diagram showing a light-emitting device, which is a comparative sample of the examples. [Figure 19] A photograph showing the light-emitting device of the embodiment. [Figure 20] A photograph illustrating the preparation of flexible samples using peeling and transposition techniques. [Figure 21] A diagram showing an example of a light-emitting device that can be used in the light-emitting section. [Figure 22]A photograph showing an example of a light-emitting device that can be used in the light-emitting section. [Figure 23] A diagram illustrating an example of a method for manufacturing a light-emitting device. [Figure 24] A diagram illustrating an example of a method for manufacturing a light-emitting device. [Modes for carrying out the invention]

[0025] Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. Without departing from the spirit and scope of the present invention, its form and details may be modified in various ways. It will be easily understood by those skilled in the art to obtain this. Therefore, the present invention is as shown in the embodiments below. The interpretation is not limited to the content stated herein.

[0026] In the configuration of the invention described below, the same part or part having a similar function is used. The same symbol is used consistently across different drawings, and explanations of its repetition are omitted. When referring to a function, the same hatch pattern may be used, and a specific symbol may not be assigned.

[0027] Furthermore, the position, size, and scope of each component shown in the drawings, etc., are for ease of understanding. The position, size, and range of the edges may not be shown. Therefore, the disclosed invention is not necessarily However, this is not limited to the location, size, and scope disclosed in drawings, etc.

[0028] (Embodiment 1) This embodiment provides a flexible light-emitting device according to one aspect of the present invention and a method for manufacturing the light-emitting device. This will be explained using Figures 1 to 12.

[0029] A light-emitting device according to one aspect of the present invention is a light-emitting element sealed by a pair of flexible substrates and a bonding layer. It holds.

[0030] Since the bonding layer is a layer exposed on the side of the light-emitting device, if the gas barrier properties of the bonding layer are low, Impurities such as moisture and oxygen can enter the EL element from the outside. When it enters, for example, shrinkage of the light-emitting part (in this case, brightness degradation from the edge of the light-emitting part) occurs. This can result in an expansion of the non-emitting region of the light-emitting part. Therefore, the organic EL element is covered The bonding layer is preferably one with high gas barrier properties (especially low water vapor and oxygen permeability). stomach.

[0031] Furthermore, when a liquid composition is used as the material for the bonding layer, if the volume shrinkage due to hardening is large, Stress can be applied to the organic EL element, causing damage and resulting in malfunction. Therefore, it is preferable that the volume shrinkage associated with the hardening of the material used in the bonding layer is small.

[0032] Furthermore, if the bonding layer is located on the side that transmits the light emitted by the organic EL element, the light extraction of the light-emitting device To improve efficiency, it is preferable that the light-transmitting properties of the bonding layer are high. For the same reason, the bonding layer A high refractive index is preferable.

[0033] Thus, there are multiple properties required for the bonding layer, and the material of the bonding layer must meet any two of these requirements. It is extremely difficult to achieve both of the above simultaneously.

[0034] Therefore, in one aspect of the present invention, the light-emitting device has two types of bonding between the flexible substrate and the organic EL element. A layer is used. Specifically, for example, a bonding layer with a higher gas barrier function than the bonding layer is used. It is enclosed in a layer. By using a material with higher gas barrier properties in the outer bonding layer than in the inner bonding layer, the inner layer is enclosed. The bonding layer on the side has low volume shrinkage during curing, high light transmittance (especially visible light transmittance), and Alternatively, even if a material with low gas barrier properties having properties such as a high refractive index is used, moisture and oxygen can be prevented from entering the light-emitting device from the outside. Therefore, shrinkage of the light-emitting portion can be suppressed and a highly reliable light-emitting device can be realized.

[0035] The layer with high gas barrier properties has, for example, a gas permeation rate, an oxygen permeation rate, or a water vapor permeation rate of 1×1 0 , <00000​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​·day] More preferably 1 ×10 -7 [g / m 2 • day] More preferably 1 x 10 -8 [g / m 2 ·da Let y] be less than or equal to the following.

[0039] In the film thickness direction, the distance between the organic EL element and the adhesive layer 103 is greater than the shortest distance between the organic EL element and the adhesive layer 103. It is preferable that the shortest distance between the 1 bonding layers 107 is shorter. In the film thickness direction, organic Even if the distance between the EL element and the first junction layer 107 is short, the first junction layer 107 is more gas-resistant. Because it is surrounded by a highly transparent second junction layer 109, impurities do not penetrate the organic EL element. This can suppress that.

[0040] For example, the element layer 105 has a transistor between the adhesive layer 103 and the first junction layer 107, and The transistor and the first junction layer 107 may have an organic EL element. Also, for example, The element layer 105 has an insulating layer between the adhesive layer 103 and the first bonding layer 107, and the insulating layer and the first The bonding layer 107 may have an organic EL element. In this case, the gas barrier properties of the insulating layer It is preferable that the value is high. The insulating layer prevents the organic EL element from the first flexible substrate 101 side. The intrusion of impurities can be suppressed. The insulating layer is provided between the adhesive layer 103 and the transistor. It may be made of an insulating layer that makes up a transistor, or it may be a transistor and It may be placed between organic EL elements.

[0041] The light-emitting devices shown in Figures 1(B) and (C) each consist of a first flexible substrate 101 and a second flexible substrate Flexible substrate 111 and element layer 1 between the first flexible substrate 101 and the second flexible substrate 111 05, the third bonding layer 113 between the first flexible substrate 101 and the element layer 105, and the third A frame-shaped fourth bonding layer 115 surrounds the bonding layer 113, and the second flexible substrate 111 and the element layer A first bonding layer 107 between 105, and a frame-shaped second bonding layer 1 surrounding the first bonding layer 107 The element layer 105 has an organic EL element. The second junction layer 109 has The fourth bonding layer 115 has higher gas barrier properties than the first bonding layer 107, and the third bonding layer 11 It has better gas barrier properties than 3.

[0042] In one embodiment of the present invention, as shown in Figure 1(B), a second bonding layer is provided on the side surface of the light-emitting device. The configuration may also include the exposure of 109 and the fourth bonding layer 115. Thus, one of the second bonding layer 109 or the fourth bonding layer 115 covers the other, and the side of the light-emitting device The configuration may also involve either the second bonding layer 109 or the fourth bonding layer 115 being exposed on the surface.

[0043] The following will explain a more specific example of the configuration.

[0044] <Configuration Example 1> Figure 2(A) shows a plan view of the light-emitting device, and Figures 2(B) and (C) show the dashed line X in Figure 2(A). Examples of cross-sectional views between 1 and Y1 are shown. The light-emitting devices shown in Figures 2(A) to (C) are color This is a top-emission type light-emitting device that uses a filter system.

[0045] The light-emitting device shown in Figure 2(A) consists of a light-emitting unit 491, a drive circuit unit 493, and an FPC (Flexible Printed Circuit). It has a Printed Circuit (495). Light-emitting section 491 and drive circuit section The organic EL elements and transistors included in 493 are on flexible substrate 420, flexible substrate 428, It is sealed by a first bonding layer 407 and a second bonding layer 404.

[0046] The light-emitting device shown in Figures 2(B) and (C) consists of a flexible substrate 420, an adhesive layer 422, and an insulating layer 424. , transistor 455, insulating layer 463, insulating layer 465, insulating layer 405, organic EL element 45 0 (first electrode 401, EL layer 402, and second electrode 403), first junction layer 407, Second bonding layer 404, overcoat 453, light-shielding layer 431, coloring layer 432, insulating layer 22 6. It has an adhesive layer 426, a flexible substrate 428, and a conductive layer 457. Flexible substrate 428, Adhesive layer 426, insulating layer 226, first bonding layer 407, overcoat 453, and second Electrode 403 transmits visible light.

[0047] In the light-emitting section 491 of the light-emitting device shown in Figures 2(B) and (C), the adhesive layer 422 and the insulating layer 424 A transistor 455 and an organic EL element 450 are provided on the flexible substrate 420 via [a certain method]. The organic EL element 450 has a first electrode 401 on the insulating layer 465 and the first electrode 401 It has an upper EL layer 402 and a second electrode 403 on the EL layer 402. First electrode 401 It is electrically connected to the source or drain electrode of transistor 455. The end of electrode 401 is covered with an insulating layer 405. The first electrode 401 reflects visible light. Preferably, the light-emitting device has an organic EL element 450 via the first bonding layer 407. A light-shielding layer 4 has an overlapping colored layer 432 and overlaps with the insulating layer 405 via a first bonding layer 407. It has 31.

[0048] The drive circuit section 493 has multiple transistors. In Figures 2(B) and (C), the drive circuit section This shows one of the transistors that 493 has. This shows an example where the drive circuit section 493 is located inside the frame-shaped second bonding layer 404, but on the outside It may be located.

[0049] The conductive layer 457 receives external signals (video signal, clock signal, etc.) from the drive circuit section 493. It is electrically connected to an external input terminal that transmits a signal (such as a reset signal or a power signal) or electric potential. This example shows the FPC495 being provided as an external input terminal. Also, here, The electrode layer 457 is made of the same material as the source electrode and drain electrode of transistor 455, and is identical to the same material as the source electrode and drain electrode of transistor 455. An example of the process is shown. The connector 497 on the insulating layer 226 is connected to the conductive layer 457. Furthermore, connector 497 is connected to FPC495. FPC49 5 and the conductive layer 457 are electrically connected.

[0050] The conductive layer 457 is located outside the second bonding layer 404, so that the FPC 495 and the connector 49 Moisture and other substances can easily penetrate the connection part of 7, and the connection part between the connector 497 and the conductive layer 457. Even in this case, it is preferable because it can suppress the intrusion of impurities such as moisture into the organic EL element 450.

[0051] The insulating layer 463 has the effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. Furthermore, the insulating layer 465 has a planarization function to reduce surface irregularities caused by transistors. It is preferable to select an insulating layer that has the properties of the material.

[0052] Figure 2(C) differs from Figure 2(B) in that the insulating layer 465 is not exposed on the side of the light-emitting device. When using an organic insulating material with low gas barrier properties as the material for the insulating layer 465, the insulating layer It is preferable that 465 is not exposed on the side of the light-emitting device. And, a second with high gas barrier properties The bonding layer 404 is located on the side of the light-emitting device, thereby increasing the reliability of the light-emitting device. This is preferable. However, depending on the material of the insulating layer 465, as shown in Figure 2(B), The insulating layer 465 may be exposed at the end of the light-emitting device.

[0053] The second bonding layer 404 is a layer with higher gas barrier properties than the first bonding layer 407. This prevents moisture and oxygen from entering the light-emitting device from the sides. This makes it possible to realize a highly reliable light-emitting device.

[0054] In Configuration Example 1, the light emitted from the organic EL element 450 is taken from the light-emitting device via the first junction layer 407. Therefore, the first bonding layer 407 has better light transmission than the second bonding layer 404. A higher refractive index is preferable. Furthermore, the first bonding layer 407 has a refractive index that is higher than that of the second bonding layer 404. It is preferable that the curing rate is high. Also, the first bonding layer 407 hardens more than the second bonding layer 404. It is preferable that the volume contraction over time is small.

[0055] The insulating layer 424 preferably has high gas barrier properties. This is because the flexible substrate 420 side This prevents moisture and oxygen from entering the light-emitting device. Similarly, the insulating layer 226 can prevent gas High barrier properties are preferable. This prevents moisture and oxygen from emitting light from the flexible substrate 428 side. This can prevent intrusion into the device.

[0056] <Configuration Example 2> Figure 3(A1) shows a plan view of the light-emitting device, and Figure 3(B) shows the dashed line X21 in Figure 3(A1). -A cross-sectional view between Y21 is shown. The light-emitting device shown in Figure 3(B) uses a top-up method with a color-shading technique. It is a mission-type light-emitting device.

[0057] The light-emitting device shown in Figure 3(A1) comprises a light-emitting unit 491, a drive circuit unit 493, and an FPC 495. The organic EL elements and transistors included in the light-emitting section 491 and the drive circuit section 493 are flexible. By substrate 420, flexible substrate 428, first bonding layer 407, and second bonding layer 404 It is sealed. In Figure 3(B), the conductive layer 457 is at the opening of the second bonding layer 404. This shows an example of connection between connector 497 and the other element.

[0058] The light-emitting device shown in Figure 3(B) consists of a flexible substrate 420, an adhesive layer 422, an insulating layer 424, and a transistor Zistor 455, insulating layer 463, insulating layer 465, insulating layer 405, organic EL element 450 (1st (Electrode 401, EL layer 402, and second electrode 403), second bonding layer 404, first bonding It has a composite layer 407, a flexible substrate 428, and a conductive layer 457. The flexible substrate 428, first The junction layer 407 and the second electrode 403 transmit visible light.

[0059] In the light-emitting section 491 of the light-emitting device shown in Figure 3(B), via the adhesive layer 422 and the insulating layer 424 A transistor 455 and an organic EL element 450 are provided on a flexible substrate 420. The EL element 450 has a first electrode 401 on the insulating layer 465 and an EL on the first electrode 401. It has a layer 402 and a second electrode 403 on the EL layer 402. The first electrode 401 is a tra The first electrode 40 is electrically connected to the source or drain electrode of the converter 455. 1 preferably reflects visible light. The end of the first electrode 401 is covered with an insulating layer 405. It is.

[0060] The drive circuit section 493 has multiple transistors. In Figure 3(B), the drive circuit section 493 is This shows one of the transistors it possesses.

[0061] The conductive layer 457 has an external input terminal that transmits external signals and potentials to the drive circuit section 493 and an electrical Connect them electrically. Here, we show an example where an FPC495 is provided as an external input terminal.

[0062] To prevent an increase in the number of manufacturing steps, the conductive layer 457 is the same as the electrodes and wiring used in the light-emitting section and drive circuit section. It is preferable to manufacture it using one material and the same process. Here, the conductive layer 457 is a transistor This shows an example of a source electrode and drain electrode manufactured using the same material and process as those of the Ta455.

[0063] The second bonding layer 404 is a layer with higher gas barrier properties than the first bonding layer 407. This prevents moisture and oxygen from entering the light-emitting device from the outside. Therefore, reliability This makes it possible to realize a highly efficient light-emitting device.

[0064] In configuration example 2, the light emitted from the organic EL element 450 is taken from the light-emitting device via the first junction layer 407. Therefore, the first bonding layer 407 has better light transmission than the second bonding layer 404. A higher refractive index is preferable. Furthermore, the first bonding layer 407 has a refractive index that is higher than that of the second bonding layer 404. It is preferable that the curing rate is high. Also, the first bonding layer 407 hardens more than the second bonding layer 404. It is preferable that the volume contraction over time is small.

[0065] <Configuration Example 3> Figure 3(A2) shows a plan view of the light-emitting device, and Figure 3(C) shows the dashed line X22 in Figure 3(A2). -A cross-sectional view between Y22 is shown. The light-emitting device shown in Figure 3(C) uses a color filter method. It is a Tom emission type light-emitting device.

[0066] The light-emitting device shown in Figure 3(C) consists of a flexible substrate 420, an adhesive layer 422, an insulating layer 424, and a transistor Distor 454, transistor 455, insulating layer 463, colored layer 432, insulating layer 465, conductive Layer 435, insulating layer 467, insulating layer 405, organic EL element 450 (first electrode 401, EL Layer 402, and second electrode 403), second bonding layer 404, first bonding layer 407, flexible It has a substrate 428 and a conductive layer 457. Flexible substrate 420, adhesive layer 422, insulating layer 42 4. The insulating layer 463, insulating layer 465, insulating layer 467, and the first electrode 401 transmit visible light. do.

[0067] In the light-emitting section 491 of the light-emitting device shown in Figure 3(C), via the adhesive layer 422 and the insulating layer 424 A switching transistor 454 and a current control transistor are placed on the flexible substrate 420. 455 and an organic EL element 450 are provided. The organic EL element 450 has an insulating layer 46 7 The first electrode 401 on the first electrode 401, the EL layer 402 on the first electrode 401, and the EL layer 402 It has two electrodes 403. The first electrode 401 is connected to the transistor 4 via a conductive layer 435. It is electrically connected to the source or drain electrode 55. The end of the first electrode 401 is It is covered with an insulating layer 405. The second electrode 403 preferably reflects visible light. Furthermore, the light-emitting device has a colored layer 432 on an insulating layer 463 that overlaps with an organic EL element 450.

[0068] The drive circuit section 493 has multiple transistors. In Figure 3(C), the drive circuit section 493 is This shows one of the transistors it possesses.

[0069] The conductive layer 457 has an external input terminal that transmits external signals and potentials to the drive circuit section 493 and an electrical Connect them electrically. Here, we show an example where an FPC495 is provided as an external input terminal. Furthermore, here the conductive layer 457 is the same as the source electrode and drain electrode of the transistor 455. This shows an example made using the same materials and the same process.

[0070] In Figure 3(C), a frame-shaped first bonding layer 407 is further placed on the outside of the frame-shaped second bonding layer 404. The conductive layer 457 and the connecting body 497 are in contact at the opening of the frame-shaped first bonding layer 407. Further examples are shown.

[0071] Located outside the second bonding layer 404, the second bonding layer has lower gas barrier properties than the second bonding layer 404. At the opening of the bonding layer 407, the connection between FPC 495 and the connector 497, and the connector 49 Moisture may easily penetrate the connection between 7 and the conductive layer 457. A second junction layer 404 with high gas barrier properties is located between the connecting portion and the organic EL element 450. Therefore, it is preferable that impurities such as moisture do not enter the organic EL element 450.

[0072] The insulating layer 463 has the effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. Furthermore, insulating layers 465 and 467 reduce surface irregularities caused by transistors and wiring. Therefore, it is preferable to select an insulating layer that has a planarization function.

[0073] The second bonding layer 404 is a layer with higher gas barrier properties than the first bonding layer 407. This prevents moisture and oxygen from entering the light-emitting device from the outside. Therefore, reliability This makes it possible to realize a highly efficient light-emitting device.

[0074] In configuration example 3, the first bonding layer 407 exhibits greater volume shrinkage during curing compared to the second bonding layer 404. It is preferable that it be small.

[0075] In one aspect of the present invention, the pixel has an active element (active element, nonlinear element). Using an active matrix system or a passive matrix system in which pixels do not have active elements. It is possible.

[0076] In the active matrix system, the active elements include not only transistors, but also various other components. Active elements can be used. For example, MIM (Metal Insulator M It is also possible to use etal, or TFD (Thin Film Diode), etc. Yes, these elements have fewer manufacturing steps, which reduces manufacturing costs or improves yield. This can be achieved. In addition, because these elements are small in size, the aperture ratio can be improved. This allows for lower power consumption and higher brightness.

[0077] In the passive matrix method, active elements are not used, resulting in fewer manufacturing steps and lower manufacturing costs. This can reduce emissions and improve yield. Also, because no active elements are used, the aperture ratio can be reduced. This can improve performance, leading to lower power consumption or higher brightness.

[0078] <Configuration Example 4> Figure 4(A) shows a plan view of the light-emitting device, and Figure 4(B) shows the dashed line X3-Y3 in Figure 4(A). A cross-sectional view is shown. The light-emitting devices shown in Figures 4(A) and (B) are bottom-emission type light-emitting devices. It is placed there.

[0079] The light-emitting device shown in Figure 4(B) consists of a flexible substrate 419, an adhesive layer 422, an insulating layer 424, and a conductive layer 406, conductive layer 416, insulating layer 405, organic EL element 450 (first electrode 401, EL layer) 402, and the second electrode 403), the second bonding layer 404, the first bonding layer 407, and the flexible It has a flexible substrate 428, a first electrode 401, an insulating layer 424, an adhesive layer 422, and a flexible group The plate 419 transmits visible light.

[0080] On the flexible substrate 419, an organic EL element 450 is provided via an adhesive layer 422 and an insulating layer 424. It is provided. Flexible substrate 419, second bonding layer 404, first bonding layer 407, and The organic EL element 450 is sealed by the flexible substrate 428. , a first electrode 401, an EL layer 402 on the first electrode 401, and a second on the EL layer 402 It has an electrode 403. The second electrode 403 preferably reflects visible light.

[0081] The first electrode 401, the conductive layer 406, and the edges of the conductive layer 416 are covered with an insulating layer 405. The conductive layer 406 is electrically connected to the first electrode 401, and the conductive layer 416 is electrically connected to the second electrode 403. Electrically connected. The conductive layer 406, covered by the insulating layer 405 via the first electrode 401, It functions as auxiliary wiring and is electrically connected to the first electrode 401. Having auxiliary wiring that connects electrically can suppress voltage drops caused by electrode resistance, Preferably, the conductive layer 406 may be provided on the first electrode 401. Also, an insulating layer 405 may have auxiliary wiring that is electrically connected to the second electrode 403.

[0082] To improve the light extraction efficiency of the light-emitting device, a light extraction mechanism is installed on the side that extracts light from the light-emitting element. It is preferable to have a structure. In Figure 4(B), the side that extracts light from the light-emitting element is located This example shows a flexible substrate 419 that also serves as a light extraction structure.

[0083] The second bonding layer 404 is a layer with higher gas barrier properties than the first bonding layer 407. This prevents moisture and oxygen from entering the light-emitting device from the outside. Therefore, reliability This makes it possible to realize a highly efficient light-emitting device.

[0084] In configuration example 4, the first bonding layer 407 exhibits greater volume shrinkage during curing compared to the second bonding layer 404. It is preferable that it be small.

[0085] <Configuration Example 5> Figure 5(A) shows a plan view of the light-emitting device, and Figure 5(B) shows the dashed line X4-Y4 in Figure 5(A). A cross-sectional view is shown. The light-emitting devices shown in Figures 5(A) and (B) are top-emission type light-emitting devices. It is placed there.

[0086] The light-emitting device shown in Figure 5(B) consists of a flexible substrate 420, an adhesive layer 422, an insulating layer 424, and a conductive layer 408, insulating layer 405, organic EL element 450 (first electrode 401, EL layer 402, and Electrode 403), conductive layer 410, second bonding layer 404, first bonding layer 407, flexible group It has a plate 428 and a light extraction structure 409. Second electrode 403, first bonding layer 407 The flexible substrate 428 and the light extraction structure 409 transmit visible light.

[0087] On the flexible substrate 420, an organic EL element 450 is provided via an adhesive layer 422 and an insulating layer 424. It is provided by a flexible substrate 420, a first bonding layer 407, and a flexible substrate 428. The organic EL element 450 is then sealed. The organic EL element 450 has a first electrode 401 and The first electrode 401 has an EL layer 402 on it, and the second electrode 403 has an EL layer 402 on it. The first electrode 401 preferably reflects visible light. The removal structure 409 is attached.

[0088] The first electrode 401 and the end of the conductive layer 410 are covered with an insulating layer 405. The conductive layer 410 is The first electrode 401 can be formed using the same process and the same material, and the second electrode 403 and To connect electrically.

[0089] The conductive layer 408 on the insulating layer 405 functions as auxiliary wiring and is electrically connected to the second electrode 403. Connect. The conductive layer 408 may be provided on the second electrode 403. Also, configuration example Similar to 4, it may have auxiliary wiring that is electrically connected to the first electrode 401.

[0090] The second bonding layer 404 is a layer with higher gas barrier properties than the first bonding layer 407. This prevents moisture and oxygen from entering the light-emitting device from the sides. This makes it possible to realize a highly reliable light-emitting device.

[0091] In configuration example 5, the light emitted from the organic EL element 450 is taken from the light-emitting device via the first junction layer 407. Therefore, the first bonding layer 407 has better light transmission than the second bonding layer 404. A higher refractive index is preferable. Furthermore, the first bonding layer 407 has a refractive index that is higher than that of the second bonding layer 404. It is preferable that the curing rate is high. Also, the first bonding layer 407 hardens more than the second bonding layer 404. It is preferable that the volume contraction over time is small.

[0092] <Materials for the device> Next, we will show an example of a material that can be used in a light-emitting device.

[0093] [Flexible board] Flexible substrates use flexible materials. For example, organic resins or materials with a certain degree of flexibility. Glass of a certain thickness can be used. Furthermore, the base on the side from which light is extracted in the light-emitting device The board is made of a material that transmits visible light. (This applies when the flexible substrate does not need to transmit visible light.) Metal substrates and the like can also be used.

[0094] Because organic resins have a lower specific gravity than glass, using organic resin as a flexible substrate results in... This method allows for a light-emitting device to be made lighter compared to using lath, which is preferable.

[0095] Examples of materials that are flexible and translucent include polyethylene terephthalate (PET). ), polyester resins such as polyethylene naphthalate (PEN), polyacrylonitrile Resins, polyimide resins, polymethyl methacrylate resins, polycarbonate (PC) resins Polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, poly Examples include styrene resin, polyamide-imide resin, and polyvinyl chloride resin. In particular, thermal expansion It is preferable to use materials with low tensile strength, such as polyamide-imide resin and polyimide resin. Fat, PET, etc. can be suitably used. In addition, a substrate (prep) in which resin is impregnated into a fibrous material can be used. This involves using substrates made by mixing inorganic fillers with organic resin to reduce the coefficient of thermal expansion (also known as REGs). It can also be done this way.

[0096] When a flexible and light-transmitting material contains fibers, the fibers are organic compounds or High-strength fibers made of inorganic compounds are used. Specifically, high-strength fibers refer to fibers with a tensile modulus or Young's modulus. This refers to fibers with high density, and typical examples include polyvinyl alcohol-based fibers and polyester. Polyamide fibers, polyethylene fibers, aramid fibers, poly(p-phenylene) fibers Examples include benzobisoxazole fibers, glass fibers, or carbon fibers. Examples include glass fibers using E-glass, S-glass, D-glass, Q-glass, etc. These are used in the form of woven or nonwoven fabrics, and the structure is formed by impregnating the fibrous material with resin and curing the resin. The fabricated material may be used as a flexible substrate. The flexible substrate may be a structure made of fibers and resin. Using this method is preferable because it improves reliability against fracture due to bending or localized pressure.

[0097] To improve the efficiency of light extraction, a higher refractive index is preferable for flexible and light-transmitting materials. For example, by dispersing an inorganic filler with a high refractive index in an organic resin, the organic resin This makes it possible to create substrates with a higher refractive index than substrates made of only these materials. In particular, for small particles with a diameter of 40 nm or less. Using inorganic fillers is preferable because it does not compromise optical transparency.

[0098] The thickness of the metal substrate is preferably between 10 μm and 200 μm in order to obtain flexibility and bendability. It is preferable that the thickness is between 20 μm and 50 μm. Because metal substrates have high thermal conductivity, The heat generated by the light emission of the light-emitting element can be effectively dissipated.

[0099] There are no particular limitations on the materials that make up the metal substrate, but for example, aluminum, copper, nickel Preferably, use a metal alloy such as a kerl, aluminum alloy, or stainless steel. It is possible.

[0100] As a flexible substrate, the layer using the above material protects the surface of the device from scratches and other damage. A layer (for example, a silicon nitride layer) or a layer of material that can distribute pressure (for example, aramic It may also be constructed by laminating with a resin layer, etc. Furthermore, it may be a functional element (special) that is affected by moisture, etc. In order to suppress the reduction in lifespan of organic EL elements, etc., a highly gas-barrier insulating layer, as described below, is used. It's a good idea to be prepared.

[0101] Flexible substrates can also be used by stacking multiple layers. In particular, a configuration having a glass layer This improves the barrier properties against water and oxygen, resulting in a more reliable light-emitting device. ru.

[0102] For example, a flexible material in which a glass layer, an adhesive layer, and an organic resin layer are laminated from the side closest to the organic EL element. A substrate can be used. The thickness of the glass layer is 20 μm or more and 200 μm or less. Preferably, the thickness is 25 μm or more and 100 μm or less. Glass layers of this thickness are susceptible to water and oxygen It can simultaneously achieve high barrier properties and flexibility. Furthermore, the thickness of the organic resin layer is as follows: The particle size should be between 10 μm and 200 μm, preferably between 20 μm and 50 μm. By placing the organic resin layer outside the glass layer, cracks and fractures in the glass layer are suppressed. This allows for improved mechanical strength. Such composite materials of glass and organic resins... By applying this to a substrate, it is possible to create an extremely reliable and flexible light-emitting device. can.

[0103] However, one aspect of the present invention relates to a bonding layer for bonding a pair of substrates, wherein the first bonding layer is One of its features is that it is surrounded by a second bonding layer, which has a higher gas barrier function than the first bonding layer. Therefore, the substrates include not only flexible substrates, but also non-flexible glass substrates and tempered glass. A material may be used. In this case, the element may be formed directly on the substrate without using an adhesive layer. Even in combination, the goal is to realize a highly reliable light-emitting device with suppressed shrinkage of the light-emitting part. It is possible.

[0104] [Adhesive layer, bonding layer] The adhesive layer and bonding layer can be a photocuring adhesive such as UV-curing type, a reaction-curing adhesive, or a thermosetting adhesive. Various types of curing adhesives, such as adhesives and anaerobic adhesives, can be used. Epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, Mido resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, Examples include EVA (ethylene vinyl acetate) resin. In particular, gases such as epoxy resins. Materials with high barrier properties are preferred. A two-component resin may also be used. You may use a scrib or similar.

[0105] Furthermore, the above resin may contain a desiccant. For example, an alkaline earth metal oxide (oxidation This method uses substances that adsorb moisture through chemical adsorption, such as calcium or barium oxide. It is possible to absorb moisture through physical adsorption, such as with zeolite or silica gel. A desiccant may be used. If a desiccant is included, impurities such as moisture may penetrate the functional element. This is preferable because it can suppress the ingress of harmful substances and improve the reliability of the light-emitting device.

[0106] Furthermore, by mixing a filler or light scattering material with a high refractive index into the above resin, a light-emitting element can be created. The light extraction efficiency can be improved. For example, titanium dioxide, barium oxide, and ze Olite, zirconium, and the like can be used.

[0107] [Insulating layer] It is preferable to use insulating layers with high gas barrier properties for insulating layer 424 and insulating layer 226. Furthermore, a highly gas-barrier insulating layer is formed between the first bonding layer 407 and the second electrode 403. It's fine if it is done.

[0108] Examples of insulating layers with high gas barrier properties include silicon nitride films and silicon nitride oxide films, which contain nitrogen and silicon. Examples include films containing elements, and films containing nitrogen and aluminum, such as aluminum nitride films. Alternatively, silicon oxide films, silicon oxide-nitride films, aluminum oxide films, etc., may be used.

[0109] For example, the gas permeability, oxygen permeability, or water vapor permeability of an insulating layer with high gas barrier properties is 1 ×10 -5 [g / m 2 • day] Preferably 1 x 10 -6 [g / m 2 ·day] or later Below, fer 1 × 10 -7 [g / m 2 • day] More preferably 1 x 10 -8 [g / m 2 The following applies: • day]

[0110] Furthermore, the inorganic insulating layer mentioned above can also be used for other insulating layers.

[0111] Examples of insulating layer 463 include silicon oxide film, silicon oxide nitride film, aluminum oxide film. Inorganic insulating layers such as a film can be used. Also, insulating layer 465 and insulating layer 467 Examples include polyimide, acrylic, polyamide, polyimideamide, and benzocyclobuterol. Organic materials such as ion-based resins can be used. Also, low dielectric constant materials (low-k materials) can be used. It can be used. Also, by laminating multiple insulating layers, insulating layer 465 and insulating layer 4 67 may be formed.

[0112] The insulating layer 405 is formed using an organic insulating material or an inorganic insulating material. For example, polyimide resin, polyamide resin, acrylic resin, siloxane resin, epoxy Resins, or phenolic resins, etc., can be used. In particular, photosensitive resin materials can be used for insulation. It is preferable to form the side walls of layer 405 into inclined surfaces with a continuous curvature. It seems so.

[0113] The method for forming the insulating layer 405 is not particularly limited, but may include photolithography, sputtering, Vapor deposition, droplet ejection (inkjet, etc.), printing methods (screen printing, offset printing) You can use "etc." etc.

[0114] [transistor] The structure of the transistor used in a light-emitting device according to one aspect of the present invention is not particularly limited. For example, It can be a staggered transistor or an inverse staggered transistor. Whether it is a top-gate or bottom-gate transistor structure That's good. Furthermore, there are no particular limitations on the materials used in the transistor. For example, silicon. Applying transistors that use germanium or oxide semiconductors in the channel formation region. This is possible. The crystallinity of the semiconductor is not particularly limited, and amorphous semiconductors or semiconductors having crystalline properties are possible. Which of the following semiconductors (microcrystalline semiconductors, polycrystalline semiconductors, or semiconductors having a crystalline region in part) It may also be used. Using a crystalline semiconductor suppresses the degradation of transistor characteristics. Therefore, it is preferable. Examples of silicon include amorphous silicon, single-crystal silicon, and polycrystalline silicon. These can be used, and as oxide semiconductors, In-Ga-Zn-O based metal oxides, etc. It can be used.

[0115] It is preferable to provide an undercoat to stabilize the characteristics of the transistor. The undercoat may be: Inorganic silicon oxide films, silicon nitride films, silicon oxide-nitride films, silicon nitride-oxide films, etc. It can be manufactured using an insulating layer, either as a single layer or in multiple layers. The undercoat is made by sputtering. It can be formed using plasma CVD, coating, printing, etc. A base film is not necessary. If provided, it does not need to be provided. In each of the above configuration examples, the insulating layer 424 also serves as the underlayer of the transistor. It is possible.

[0116] [Organic EL element] The structure of the organic EL element used in a light-emitting device according to one aspect of the present invention is not particularly limited. Organic EL elements with a cushion structure may be used, or organic EL elements with a bottom emission structure may be used. Alternatively, you may use a dual-emission organic EL element.

[0117] When a voltage higher than the threshold voltage of the organic EL element is applied between the pair of electrodes, the EL layer 402 becomes anode. Holes are injected from the side, and electrons are injected from the cathode side. The injected electrons and holes are in the EL layer 4 At 02, recombination occurs, and the light-emitting material contained in the EL layer 402 emits light.

[0118] In organic EL devices, a conductive film that transmits visible light is used for the electrode that extracts light. Furthermore, it is preferable to use a conductive film that reflects visible light on the electrode that does not extract light. .

[0119] Conductive films that transmit visible light include, for example, indium oxide and indium tin oxide (ITO:I). Indium zinc oxide, zinc oxide, and gallium are added. It can be formed using zinc oxide, etc. Also, gold, silver, platinum, magnesium, Nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or This refers to metallic materials such as titanium, alloys containing these metallic materials, or nitrides of these metallic materials (for example) For example, titanium nitride and the like can also be used by forming them thinly enough to be translucent. Furthermore, the laminated film of the above materials can be used as a conductive layer. For example, silver and magnesium. Using a laminated film of this alloy and ITO is preferable because it can improve conductivity. Alternatively, graphene or the like may be used.

[0120] Examples of conductive films that reflect visible light include aluminum, gold, platinum, silver, nickel, and tungsten. Metal materials such as tetracellulose, chromium, molybdenum, iron, cobalt, copper, or palladium, Alloys containing these metal materials can be used. In addition, Lantha It may also contain added elements such as cellulose, neodymium, or germanium. Aluminum alloys such as aluminum alloys, aluminum-nickel alloys, aluminum-neodymium alloys, etc. Alloys containing um (aluminum alloys), alloys of silver and copper, alloys of silver, palladium and copper, silver It can be formed using an alloy containing silver, such as a magnesium alloy. Gold is preferred because of its high heat resistance. Furthermore, the metal film or metal in contact with the aluminum alloy film. By laminating an oxide film, the oxidation of the aluminum alloy film can be suppressed. Examples of materials for films and metal oxide films include titanium and titanium oxide. A conductive film that transmits visible light and a film made of a metal material may be laminated. For example, silver and ITO Multilayer films, such as a silver-magnesium alloy and an ITO multilayer film, can be used.

[0121] The electrodes can be formed using methods such as vapor deposition or sputtering. Formed using extrusion methods such as the cjet method, printing methods such as screen printing, or plating methods. It is possible.

[0122] The EL layer 402 has at least an emissive layer. The EL layer 402 has layers other than the emissive layer, Materials with high hole injection potential, materials with high hole transport potential, hole blocking materials, materials with high electron transport potential , substances with high electron injection properties, or bipolar substances (substances with high electron transport and hole transport properties) It may further have layers containing (quality, etc.).

[0123] The EL layer 402 can use either low molecular weight compounds or high molecular weight compounds, and is inorganic. It may contain compounds. Each layer constituting the EL layer 402 is deposited by a vapor deposition method (vacuum deposition). It can be formed by methods such as (including) transfer, printing, inkjet, and coating. ru.

[0124] Although an organic EL element was described here as an example of a light-emitting element, the present invention relates to this. The present invention is not limited to, and other display elements, light-emitting elements, semiconductor elements, etc. may be used. Regarding the bonding layer that joins a pair of substrates, the first bonding layer is made more gas-filled than the first bonding layer. One of its features is that it is surrounded by a second bonding layer with high realism. The pair of substrates and the bonding layer Examples of elements to be sealed include display elements, light-emitting elements, or semiconductor elements.

[0125] For example, in this specification, etc., display element, display device having a display element, light-emitting element A light-emitting device, which is a device having sub-elements and light-emitting elements, can use various forms, or various It may have elements. Examples of display elements, display devices, light-emitting elements, or light-emitting devices include , EL elements (EL elements including organic and inorganic substances, organic EL elements, inorganic EL elements), LEDs (white LEDs, red LEDs, green LEDs, blue LEDs, etc.), transistors (transistors that emit light according to current), electron-emitting elements, liquid crystal elements, electronic ink, electrophoretic elements, gray -tint light valves (GLVs), plasma display panels (PDPs), MEMS (micro-electro-mechanical systems), digital micromirror devices (DMDs), DMS (digital microshutters), IMOD (interference modulation) elements, electro-wetting elements, piezoelectric ceramic displays , carbon nanotubes, etc., and there are those having a display medium in which contrast, brightness, reflectance , transmittance, etc. change due to electromagnetic action. An example of a display device using an EL element [[ID=I7]] is an EL display, etc. An example of a display device using an electron-emitting element is , a field emission display (FED) or an SED method flat panel display <000T893>(SED: Surface-conduction Electron-emitter Display), etc. An example of a display device using a liquid crystal element is a liquid crystal display (transmissive liquid crystal display, transflective liquid crystal display, reflective liquid crystal display, direct-view liquid crystal display, projection liquid crystal display), etc. An example of a display device using electronic ink or an electrophoretic element is an electronic paper, etc.

[0126] [Coloring layer, light-shielding layer, and overcoat] The coloring layer is a colored layer that transmits light in a specific wavelength band. For example, a red (R) color filter that transmits light in the red wavelength band, a green (G) color filter that transmits light in the green wavelength band It is possible to use a filter, a blue (B) color filter that transmits light in the blue wavelength band, etc. Each colored layer can be formed at a desired position using various materials by a printing method, an inkjet method, an etching method using a photolithography method, etc.

[0127] The light shielding layer is provided between adjacent colored layers. The light shielding layer shields light from adjacent organic EL elements and suppresses color mixing between adjacent organic EL elements. Here, by providing the end portion of the colored layer so as to overlap with the light shielding layer, light leakage can be suppressed. As the light shielding layer it is possible to use a material that shields light emitted from the organic EL element. For example, a black matrix can be formed using a metal material, a resin material containing a pigment or a dye. In addition, if the light shielding layer is provided in a region other than the light emitting portion such as a drive circuit portion, unintended light leakage due to waveguide light or the like can be suppressed, which is preferable.

[0128] Also, an overcoat covering the colored layer and the light shielding layer may be provided. By providing an overcoat it is possible to prevent the diffusion of impurities contained in the colored layer into the organic EL element. The overcoat is composed of a material that transmits light emitted from the organic EL element.For example, a silicon nitride film, an inorganic insulating layer such as a silicon oxide film, or an organic insulating layer such as an acrylic film or a polyimide film can be used, and a laminated structure of an organic insulating layer and an inorganic insulating layer may be used.

[0129] Also, when applying the material of the first bonding layer 407 onto the colored layer 432 and the light shielding layer 431, it is preferable to use a material having a high wettability with respect to the material of the first bonding layer 407 as the material of the overcoat For example, as the overcoat 453 (see FIG. 2(C)), an ITO film It is preferable to use any oxide conductive film or a metal film such as an Ag film that is thin enough to be translucent. stomach.

[0130] [Conductive layer] Conductors that function as electrodes or wiring for transistors, or auxiliary electrodes or wiring for organic EL elements, etc. The electrochemical layer can be made of, for example, molybdenum, titanium, chromium, tantalum, tungsten, or aluminum. Using metallic materials such as copper, neodymium, scandium, or alloy materials containing these elements, It can be formed as a single layer or in a laminated manner. Furthermore, the conductive layer may use a conductive metal oxide. It may be formed by [method]. Conductive metal oxides include indium oxide (In2O3, etc.), oxidation Tin (SnO2, etc.), zinc oxide (ZnO), ITO, indium zinc oxide (In2O3) -ZnO, etc.) or materials containing silicon oxide are used. can.

[0131] Furthermore, the film thickness of the auxiliary wiring can be 0.1 μm or more and 3 μm or less, preferably 0 The particle size is between 0.1 μm and 0.5 μm.

[0132] When a paste (such as silver paste) is used as the material for auxiliary wiring, the metal that makes up the auxiliary wiring becomes granular. It aggregates into a certain shape. As a result, the surface of the auxiliary wiring becomes rough and has many gaps, and the EL layer It is difficult to completely cover the auxiliary wiring, and it is difficult to make an electrical connection between the upper electrode and the auxiliary wiring. It becomes easier, which is preferable.

[0133] [Light extraction structure] The light extraction structure includes a hemispherical lens, a microlens array, and a filter with a convex-concave structure. Lenses, light-diffusing films, etc., can be used. For example, the above lenses and films can be placed on a substrate. Using an adhesive or the like having a refractive index similar to that of the substrate, the lens, or the film, etc., to perform bonding, a light extraction structure can be formed. By bonding, a light extraction structure can be formed.

[0134] [Connector] As the connector 497, a paste-like or sheet-like material obtained by mixing metal particles in a thermosetting resin and exhibiting anisotropic conductivity by thermocompression bonding can be used. As the metal particles for example, particles in which two or more kinds of metals are layered, such as those obtained by coating nickel particles with gold, etc., are preferably used. For example, particles in which two or more kinds of metals are layered, such as those obtained by coating nickel particles with gold, etc., are preferably used. are preferably used.

[0135] [Manufacturing method of device 1] Hereinafter, an example of manufacturing a light-emitting device (the above-described configuration example 1) having a top emission structure using the color filter method shown in FIGS. 2(A) and (B) will be shown. Hereinafter, an example of manufacturing a light-emitting device (the above-described configuration example 1) having a top emission structure using the color filter method shown in FIGS. 2(A) and (B) will be shown.

[0136] First, as shown in FIG. 6(A), a release layer 203 is formed on a manufacturing substrate 201, and a layer to be released 205 is formed on the release layer 20 3. Here, an example of forming an island-shaped release layer is shown, but it is not limited to this. Also, the layer to be released 205 may be formed in an island shape. In this step, when peeling the layer to be released 205 from the manufacturing substrate 201, a material that causes peeling at the interface between the manufacturing substrate 201 and the release layer 203, the interface between the release layer 203 and the layer to be released 205, or within the release layer 203 is selected In the present embodiment, a case where peeling occurs at the interface between the layer to be released 205 and the release layer 203 will be shown as an example, but depending on the combination of materials used for the release layer 203 and the layer to be released 205, it is not limited [[ID=3)]] to this. When the layer to be released 205 has a laminated structure, the layer in contact with the release layer 203 is particularly referred to as the first layer. For example, when the release layer 203 has a laminated structure of a tungsten film and a tungsten oxide film, it is not limited to this. When the layer to be released 205 has a laminated structure, the layer in contact with the release layer 203 is particularly referred to as the first layer.

[0137] For example, when the release layer 203 has a laminated structure of a tungsten film and a tungsten oxide film, Delamination occurs at the interface (or near the interface) between the tungsten film and the tungsten oxide film. It is acceptable for a portion of the peeled layer 203 (in this case, the tungsten oxide film) to remain on the peeled layer 205 side. Furthermore, the peeled layer 203 remaining on the peeled layer 205 side may be removed afterward.

[0138] The fabricated substrate 201 is a substrate that has heat resistance capable of withstanding at least the processing temperature during the fabrication process. For example, the fabricated substrate 201 can be a glass substrate, a quartz substrate, a sapphire substrate, or a semiconductor substrate. Body substrates, ceramic substrates, metal substrates, resin substrates, plastic substrates, etc. can be used. Cut.

[0139] Furthermore, in order to improve mass production efficiency, a large glass substrate may be used as the fabrication substrate 201. Preferred. For example, the third generation (550mm x 650mm), the 3.5 generation (600mm x 720mm, or 620mm x 750mm), 4th generation (680mm x 880mm, (730mm x 920mm), 5th generation (1100mm x 1300mm), 6th generation ( 1500mm x 1850mm), 7th generation (1870mm x 2200mm), 8th generation ( 2200mm x 2400mm), 9th generation (2400mm x 2800mm, 2450mm) Glass substrates such as 3050mm x 10th generation (2950mm x 3400mm), or this Larger glass substrates can be used.

[0140] When a glass substrate is used for the fabricated substrate 201, a layer is placed between the fabricated substrate 201 and the release layer 203. As a base layer, silicon oxide film, silicon oxide nitride film, silicon nitride film, silicon oxide nitride Forming an insulating layer, such as a film, is preferable because it prevents contamination from the glass substrate.

[0141] The release layer 203 is made of tungsten, molybdenum, titanium, tantalum, niobium, nickel, and Balt, zirconium, zinc, ruthenium, rhodium, palladium, osmium, iridium An element selected from um, silicon, an alloy material containing the element, or a compound material containing the element. It can be formed using materials, etc. The crystalline structure of the silicon-containing layer can be amorphous, microcrystalline, or polycrystalline. A slight deviation is acceptable. Also, aluminum oxide, gallium oxide, zinc oxide, titanium dioxide, oxide Indium, indium tin oxide, indium zinc oxide, In-Ga-Zn oxide, etc. Metal oxides such as tungsten, titanium, and molybdenum may be used in the release layer 203. Using a high-melting-point metal material is preferable because it increases the degree of freedom in the formation process of the peelable layer 205. .

[0142] The release layer 203 can be formed by, for example, sputtering, plasma CVD, or coating (spin coating). It can be formed by methods such as the smearing method, droplet ejection method, dispensing method, printing method, etc. Release layer 2 The thickness of 03 is, for example, 10 nm to 200 nm, preferably 20 nm to 100 nm. It will be below.

[0143] If the release layer 203 has a single-layer structure, it may consist of a tungsten layer, a molybdenum layer, or tungsten and molybdenum. It is preferable to form a layer containing a mixture of ribdenum. Also, tungsten oxide is also or a layer containing oxidized nitride, a layer containing molybdenum oxide or oxidized nitride, or tang A layer containing an oxide or oxidized nitride of a mixture of stainless steel and molybdenum may be formed. Oh, a mixture of tungsten and molybdenum is, for example, an alloy of tungsten and molybdenum. It corresponds to this.

[0144] Furthermore, the release layer 203 is the sum of a layer containing tungsten and a layer containing tungsten oxide. When forming a layered structure, a layer containing tungsten is formed, and an oxide layer is formed on top of it. By forming an insulating layer, tungsten oxide is formed at the interface between the tungsten layer and the insulating layer. The formation of a tungsten-containing layer may also be utilized. Alternatively, the surface of the tungsten-containing layer may be treated with hot acid. Oxidizing treatments such as chemical treatment, oxygen plasma treatment, nitrous oxide (N2O) plasma treatment, and ozonated water A layer containing tungsten oxide may be formed by treatment with a strong solution. Zuma treatment and heat treatment are performed using oxygen, nitrogen, nitrous oxide alone, or a combination of these gases and other gases. This may be carried out in a mixed gas atmosphere. The above plasma treatment or heat treatment removes the peeled layer 203 By changing the surface condition, the adhesion between the release layer 203 and the subsequently formed insulating layer can be controlled. It is possible to do so.

[0145] Furthermore, if peeling is possible at the interface between the fabricated substrate and the peel-off layer, a peel-off layer may not be necessary. For example, glass is used as the fabrication substrate, and polyimide, polyester, and poly are placed in contact with the glass. Forming organic resins such as olefins, polyamides, polycarbonates, or acrylics, Insulating films, transistors, etc., are formed on the resin. In this case, the organic resin is processed using laser light, etc. By heating it locally, the substrate can be peeled off at the interface between the fabricated substrate and the organic resin. Alternatively, a metal layer is placed between the fabricated substrate and the organic resin, and by passing an electric current through the metal layer, the metal layer is transformed. Heating may be performed to peel off the metal layer at the interface between the metal layer and the organic resin. At this time, the organic resin is used in the light-emitting device. It can be used as a substrate. Furthermore, the organic resin and other substrates can be bonded together with an adhesive. That's fine.

[0146] There are no particular limitations on the layer formed as the peeled layer 205. Here, the configuration shown in Figure 2(B) is used. To fabricate the light-emitting device, first, insulating layer 424, transistor 455, insulating layer 463, The edge layer 465 is formed in this order. Then, a part of the insulating layer 463 and insulating layer 465 is opened. A first electrode 401 is formed which is electrically connected to the source electrode or drain electrode of the transistor. Furthermore, the source and drain electrodes of the transistor are manufactured using the same process and materials. A conductive layer 457 is also formed.

[0147] The insulating layer 424 is a silicon nitride film, a silicon oxide nitride film, a silicon oxide film, or a silicon nitride oxide film. It is preferable to form it in a single layer or multiple layers using a silicon film or the like.

[0148] The insulating layer is formed using methods such as sputtering, plasma CVD, coating, and printing. It is possible to achieve, for example, by plasma CVD, a film deposition temperature of 250°C to 400°C. By forming it as follows, a dense film with extremely high gas barrier properties can be obtained. Oh, the thickness of the insulating layer is 10nm to 3000nm, and even more specifically, 200nm to 1500nm. m or less is preferable.

[0149] Then, an insulating layer 405 is formed to cover the end of the first electrode 401. Next, the first electrode 40 1 and an EL layer 402 is formed on the insulating layer 405, and a second electrode 403 is formed on the EL layer 402. This is achieved. Here, the layer from the insulating layer 424 to the second electrode 403 corresponds to the peelable layer 205.

[0150] Furthermore, as shown in Figure 6(B), a release layer 223 and a layer to be released 225 are placed on the manufactured substrate 221. Formed in this order. Here, the layer to be peeled 225 is formed by placing an insulating layer 226 on top of the peeling layer 223. Formed, a light-shielding layer 431 and a colored layer 432 are formed on the insulating layer 226, and the light-shielding layer 431 and An overcoat 453 is formed on the color layer 432.

[0151] Next, the fabricated substrate 201 and the fabricated substrate 221 are placed so that the surfaces on which the peel-off layers are formed face each other. To that end, the first bonding layer 407 and the second bonding layer 404 are used to bond the first bonding The composite layer 407 and the second bonding layer 404 are cured (Figure 6(C)). Here, the peeled layer 2 A frame-shaped second bonding layer 404 is placed on top of 25, and a first bonding layer is placed inside the frame-shaped second bonding layer 404. After setting up 407, the fabricated substrate 201 and the fabricated substrate 221 are placed facing each other and bonded together.

[0152] The method for curing the first bonding layer 407 and the second bonding layer 404 is the material used in each layer. Depending on the material, for example, it can be cured at room temperature, or it can be cured by heating or light irradiation. stomach.

[0153] If a material with low heat resistance is used for the layer to be peeled off, heat it at a temperature below the temperature that the material can withstand. This is preferable. For example, in this embodiment, the layer to be peeled off includes an organic EL element, When using a thermosetting resin as the material for the bonding layer, it is preferable to heat it at a temperature of 80°C or lower. It seems so.

[0154] Furthermore, when a photocurable resin is used as the material for the bonding layer, the fabricated substrate 201 and the release layer 203 , and the peel-off layer 205, or the manufactured substrate 221, the peel-off layer 223, and the peel-off layer 225, A light-transmitting material is used to cure the photocurable resin. In this case, the light transmission of each layer is performed. The rate should be greater than 0%, preferably 1% or higher, and the higher the rate, the better.

[0155] A specific example of a method for curing the first bonding layer 407 and the second bonding layer 404 is given in Embodiment 2. I will explain.

[0156] Furthermore, it is preferable to perform the bonding of the fabricated substrate 201 and the fabricated substrate 221 under reduced pressure. stomach.

[0157] Here, as shown in Figure 23(A), the first bonding layer 407 is formed on the peel-off layer 225. The second bonding layer 404 does not need to be in contact. The fabricated substrate 201 and the fabricated substrate 221 are attached. When joining them, one or both of the first bonding layer 407 or the second bonding layer 404 are crushed. As it spreads, the first bonding layer 407 or the second bonding layer is formed as shown in Figure 6(C) and Figure 11(A). One or both of the bonding layers 404 may be deformed.

[0158] Furthermore, when bonding the fabricated substrate 201 and the fabricated substrate 221, the first bonding layer 407 and the second Air bubbles may remain between the bonding layers 404. The areas containing air bubbles have weaker mechanical strength. Furthermore, cracks may easily occur. Therefore, as shown in Figures 23(B), (C), etc. In addition, a portion of the substrate near the corner is provided that does not have a second bonding layer 404, and the air bubbles are in the second bonding layer The outer part of 404 may be made to allow for easier removal. Note that fabricated substrate 201 and fabricated substrate 22 The shapes of the first bonding layer 407 and the second bonding layer 404 after bonding 1 are shown in Figure 11(A). It is not limited to this, and as shown in Figure 23(D), the second bonding layer 404 is not connected as one. That's good too.

[0159] For example, as shown in Figure 24(A), the first bonding layer 407 and the second bonding layer 404 are peeled off. Formed on the abscission layer (here, the layer to be exfoliated 225), the fabricated substrate 201 and the fabricated substrate 221 are reduced The two layers are bonded together under a compressed atmosphere. As a result, as shown in Figure 24(B), the second bonding layer 404 is formed It is crushed and spreads horizontally across the paper. Here, the horizontal spreading is small, and the first bonding layer 4 If there is a difference in film thickness (length in the vertical direction of the paper) between 07 and the second bonding layer 404, the point shown in Figure 24(B) As shown in the area enclosed by the lines, there may be steps or uneven surfaces.

[0160] Furthermore, as shown in Figure 24(B), between the first bonding layer 407 and the second bonding layer 404, When there is a reduced-pressure hollow region, the manufacturing process of bonding substrates together under a reduced-pressure atmosphere is affected. By exposing the optical device to atmospheric pressure, either the first bonding layer 407 or the second bonding layer 404 One or both extend into the hollow region. For example, as shown in Figure 24(C), the first extends into the hollow region. The bonding layer 407 expands, and the thickness of the first bonding layer 407 decreases, further reducing the first The difference in film thickness between the bonding layer 407 and the second bonding layer 404 can widen, sometimes resulting in a large step.

[0161] Therefore, one embodiment of the present invention provides a light-emitting device with a film thickness near the end and a central film thickness inside the end. It has the characteristic that the film thickness of the part is different from that of the part. For example, as shown in Figure 24(C), the light-emitting device The film thickness near the edges may be thicker than the film thickness in the center, and as shown in Figure 24(D), it may be thin. That's good too.

[0162] Furthermore, in areas of the light-emitting device during or after fabrication where there are differences in film thickness (steps), peeling may occur. The layers are prone to delamination, leading to a reduction in the yield of delamination and an increase in the reliability of the equipment. This can lead to a decrease in performance. Also, if there is a difference in the thickness of the light-emitting device within the light-emitting region, interference may occur. Display quality may be reduced, such as the appearance of stripes.

[0163] Therefore, in one aspect of the present invention, the film thickness near the end of the light-emitting portion and the film thickness inside the end It is preferable that the film thickness in the central part of the side is approximately equal to that of the light-emitting part. The film thickness near the end of the light-emitting device, outside the end of the light-emitting section, may be different. Furthermore, in one aspect of the present invention, the distance from the interference fringes to the end of the light-emitting device is short. This is preferable. For example, it may be within 30 mm, within 20 mm, within 10 mm, etc. Interference fringes By shortening the distance from the end of the light-emitting device, the light-emitting area used in the light-emitting device can be shortened. This expands the range of possibilities, which is desirable.

[0164] Furthermore, in one embodiment of the present invention, the light-emitting device has a film thickness near the edge and a central portion inside the edge. The film thickness (for example, the film thickness in the center of the light-emitting part, or the film thickness near the edges of the light-emitting part) is approximately equal. It is preferable.

[0165] Specifically, the film thickness, material, and coating amount of the first bonding layer 407 and the second bonding layer 404 are adjusted as appropriate. By making this determination, near the interface between the first bonding layer 407 and the second bonding layer 404, the light-emitting element This can suppress variations in thickness.

[0166] Figure 6(C) shows the case where the size of the release layer 223 is the same as the release layer 203, As shown in Figure 6(D), different sizes of peeling layers may be used.

[0167] The first bonding layer 407 and the second bonding layer 404 are a release layer 203, a peeled layer 205, and a peeled layer 225 is positioned to overlap with the release layer 223. And the end of the second bonding layer 404 This is more than at least one end of the peeling layer 203 or peeling layer 223 (the one you want to peel first) It is preferable that it be located on the inside. This ensures that the fabricated substrate 201 and the fabricated substrate 221 are tightly packed together. This can suppress adhesion and prevent a decrease in yield in the subsequent peeling process.

[0168] Here, the fluidity of the material in the second bonding layer 404 before hardening is equal to the hardness of the material in the first bonding layer 407. It is preferable that the fluidity is lower than that before the transformation. Inside the frame-shaped second bonding layer 404 By filling with bonding layer 407, the first bonding layer 407 and the second bonding layer 404 are separated. This can prevent the substance from spreading outside layer 203 and also prevent a decrease in the yield of the peeling process. .

[0169] The formation order of the first bonding layer 407 and the second bonding layer 404 is irrelevant. For example, screen After forming the first bonding layer 407 using a printing method or the like, a second bonding layer 40 is formed using a coating method or the like. 4 may be formed. Alternatively, after forming a second bonding layer 404 using a coating method, etc., OD The first bonding layer 407 is formed using an F (One Drop Fill) type apparatus, etc. That's good too.

[0170] Next, the starting point for delamination is formed by irradiation with laser light (Figure 7(A), (B)).

[0171] The laser beam overlaps the hardened second bonding layer 404, the peel-off layer 205, and the peel-off layer 203. Irradiate the area (see arrow P1 in Figure 7(A)).

[0172] Cracks in at least the first layer (the layer included in the peeled layer 205 that is in contact with the peeled layer 203) By introducing (causing film cracks or fissures), a portion of the first layer is removed, and the starting point of delamination is established. It can be formed (see the area enclosed by the dotted line in Figure 7(B)). At this time, not only the first layer, but also Other layers of the release layer 205, or parts of the release layer 203 and the second bonding layer 404 may be removed. By irradiating the film with laser light, a portion of the film can be dissolved, evaporated, or thermally destroyed.

[0173] The laser beam can be irradiated from either side of the substrate, but the substrate from which the delamination layer to be removed is located should be the one that has the delamination layer to be removed. It is preferable to irradiate from the side. In the region where the peeling layer 203 and the peeling layer 223 overlap, laser light When irradiating, only the layer to be peeled 205 of the two layers to be peeled 225 will be treated. By inserting a block, the fabricated substrate 201 and the release layer 203 can be selectively removed. Furthermore, the substrate on the side irradiated with laser light shall be made of a material that transmits the laser light.

[0174] Figures 11(B-1) to (B-4) show enlarged views of the region E enclosed by the dashed line in Figure 11(A). Each enlarged view illustrates the laser beam irradiation area 215.

[0175] During the peeling process, the force that separates the peeled layer 205 and the peeled layer 203 is concentrated at the starting point of the peeling. Since it is preferable, the starting point of delamination is located near the edge rather than in the center of the hardened second bonding layer 404. It is preferable to form it. In particular, peeling occurs near the corners compared to the edges, even within the vicinity of the ends. It is preferable to form the starting point.

[0176] For example, as shown in Figures 11(B-1) to (B-3), the hardened second bonding layer 404 and The laser beam irradiation area 215 may be located in the region that overlaps with the peeling layer 203. As shown in 1(B-4), the laser beam can also be irradiated in contact with the edge of the second bonding layer 404. The laser beam is irradiated onto the region where the hardened second bonding layer 404 and the release layer 203 overlap. It is one of the manners.

[0177] Furthermore, as shown in Figures 11(B-1), (B-3), and (B-4), the second bonding layer 404 By intermittently irradiating the area near the edge with laser light, a dotted line-shaped starting point for delamination is formed, and then the delamination occurs. This is preferable because it makes the process easier.

[0178] Furthermore, in the region where the hardened second bonding layer 404 and the release layer 203 overlap, continuous or intermittent By continuously irradiating with laser light, a frame-like starting point for peeling in the shape of a solid or dashed line is formed. That's good too.

[0179] There are no particular limitations on the laser used to form the starting point for delamination. For example, a continuous-wave type laser Lasers and pulsed lasers can be used. Laser light irradiation conditions (frequency, power) (Density, energy density, beam profile, etc.) are affected by the thickness of the fabricated substrate and the delamination layer, the material, etc. This should be taken into consideration and controlled accordingly.

[0180] Then, the peeled layer 205 and the fabricated substrate 201 are separated from the starting point of the formed peel (Figure 7). (C), (D). This allows the peelable layer 205 to be removed from the fabricated substrate 201 to the fabricated substrate 221. It can be transposed.

[0181] In this case, it is preferable to fix one of the substrates to an adsorption stage or the like. For example, fabricated substrate 2 Alternatively, 01 may be fixed to the adsorption stage, and the peelable layer 205 may be peeled off from the fabricated substrate 201. Next, the fabricated substrate 221 is fixed to the suction stage, and the fabricated substrate 201 is peeled off from the fabricated substrate 221. You may do so.

[0182] For example, starting from the point of peeling, physical force (processing such as peeling with human hands or jigs, or using rollers) The peelable layer 205 and the fabricated substrate 201 are separated by a process such as separation while rotating. Yes.

[0183] Furthermore, a liquid such as water is impregnated into the interface between the release layer 203 and the layer to be released 205 to produce the substrate 20 1 and the peeled layer 205 may be separated. Due to capillary action, the liquid separates from the peeled layer 203. It can be easily separated by seeping into the layers 205. Also, the static generated during peeling Electricity adversely affects the functional elements contained in the peeled layer 205 (semiconductor elements are affected by static electricity). This can suppress damage (such as destruction caused by this).

[0184] Next, the peelable layer 205 that was peeled off from the fabricated substrate 201 and the flexible substrate 420 are bonded together by the adhesive layer 42 The parts are bonded together using part 2, and the adhesive layer 422 is cured (Figure 8(A)).

[0185] Next, a sharp cutting tool such as a cutter is used to create a starting point for peeling (Figure 8(B), (C)). .

[0186] If the flexible substrate 420 on the side where the release layer 223 is not provided can be cut with a cutting tool, Cuts may be made in the substrate 420, the adhesive layer 422, and the peelable layer 225 (Figure 8(B) (See arrow P2). This allows a portion of the first layer to be removed and a starting point for delamination to be formed. (See the area enclosed by the dotted line in Figure 8(C)).

[0187] Here, a frame-shaped cut is made in the region where the hardened second bonding layer 404 and the release layer 223 overlap. The example shown illustrates how adding a smear can create a delamination starting point in a solid line pattern, but this is not the only example. The peeling layer 223 may also have cuts in it.

[0188] As shown in Figures 8(B) and (C), the fabricated substrate 221 and the flexible substrate do not overlap with the release layer 223. If there is a region where the substrate 420 is bonded by the adhesive layer 422, then the fabricated substrate 22 Depending on the degree of adhesion between 1 and the flexible substrate 420, the yield in the subsequent peeling process may decrease. Therefore, cut a frame-shaped section into the region where the hardened adhesive layer 422 and the release layer 223 overlap. It is preferable to make indentations and form peeling starting points in a solid line shape. This allows for the peeling process to proceed. It can increase the retention rate.

[0189] Then, the peeled layer 225 and the fabricated substrate 221 are separated from the starting point of the formed peeling (Figure 8). (D)). This transfers the peelable layer 225 from the fabricated substrate 221 to the flexible substrate 420. It is possible.

[0190] Subsequently, the conductive layer 457 is exposed, and the insulating layer 226 and the flexible substrate 428 are bonded together. The process involves bonding using 426. Either process can be performed first.

[0191] The method of removing the layer overlapping the conductive layer 457 in order to expose the conductive layer 457 is irrelevant. For example, by damaging the insulating layer 226 with a needle or cutter, or by irradiating it with laser light. By removing a portion of the insulating layer 226, etc., the conductive layer 457 and other components are brought together starting from the removed area. The layer may be removed. For example, an adhesive roller can be pressed against the insulating layer 226, and the roller Rotate and move it relative to the other part. Alternatively, attach adhesive tape to the insulating layer 226. You can attach and detach it.

[0192] Furthermore, openings are provided in advance in the regions of the insulating layer 463 and insulating layer 465 that overlap with the conductive layer 457. A second electrode is formed in the opening using the same process and materials as the EL layer 402. The conductive layer may be formed using the same process and materials as in 403. Adhesion between the EL layer and the conductive layer Or, because the adhesion between the layers that make up the EL layer is low, the interface between the EL layer and the conductive layer, or the EL layer Separation occurs inside. This results in the insulating layer 226, the bonding layer, the EL layer, or the conductive layer 4 of the conductive layer. The region overlapping with 57 can be selectively removed. Note that if an EL layer or the like is placed on the conductive layer 457 If any residue remains, it can be removed with an organic solvent or similar.

[0193] In the method for manufacturing a light-emitting device according to one aspect of the present invention described above, laser light irradiation and sharp blades, etc. This creates an initiation point for delamination, making it easier to separate the delamination layer from the layer to be delaminated, and then the delamination process begins. This will improve the yield of the peeling process.

[0194] Furthermore, in this manufacturing method, a pair of fabrication substrates, each with a peelable layer formed on it, are pre-attached. After joining, the layers can be peeled off and a flexible substrate can be bonded to them. Therefore, peeling is not possible. When bonding layers, it is possible to bond together fabricated substrates with low flexibility, and flexibility This method allows for improved alignment accuracy when bonding circuit boards together compared to simply bonding them together. Therefore, the alignment accuracy of the bonded organic EL elements and color filters is high. It can be described as a manufacturing method.

[0195] Furthermore, peeling begins in the region where the hardened second bonding layer 404 and the peeling layer overlap, The abscission layer can be double-sealed by the first bonding layer 407 and the second bonding layer 404. Therefore, it is possible to suppress the degradation of organic EL elements due to moisture and oxygen, resulting in highly reliable light emission. We can manufacture the device.

[0196] Figure 8(D) shows the state in which the adhesive layer 422 covers the edge of the second bonding layer 404. However, the light-emitting device according to one aspect of the present invention is not limited thereto. The gas barrier properties of the adhesive layer 422 In the case of high pressure, the adhesive layer 422 covers the end of the second bonding layer 404. This is preferable as it can suppress the entry of impurities into the light-emitting device. Alternatively, the ends of the light-emitting device can be cut. By doing so, the second bonding layer 404 may be exposed on the side of the light-emitting device. The non-emitting region of the optical device can be narrowed (a narrow bezel can be created). In one aspect of the present invention, a second bonding Because a layer with high gas barrier properties is used for layer 404, a second bonding layer 404 is attached to the side of the light-emitting device. Even when exposed, the degradation of the reliability of the light-emitting device can be suppressed.

[0197] <Method for fabricating the device 2> The second method for fabricating the device is the same as the first method for fabricating the device up to the first peeling step. The process following Figure 7(D) will be described in detail.

[0198] The peelable layer 205 separated from the fabricated substrate 201 and the flexible substrate 231 are bonded together by a third bonding layer 2 Bonded using 33 and the fourth bonding layer 235, the third bonding layer 233 and the fourth bonding layer 235 is cured (Figure 9(A)). Here, a frame-shaped fourth bonding layer is placed on the peeled layer 225. A 235 and a third bonding layer 233 inside the fourth bonding layer 235 are provided, and the peelable layer 225 The flexible substrate 231 is then bonded together.

[0199] Furthermore, it is preferable to perform the bonding of the peelable layer 205 and the flexible substrate 231 under reduced pressure. It's nice.

[0200] Next, the starting point for delamination is formed by irradiation with laser light (Figure 9(B), (C)).

[0201] Here, the fourth bonding layer 235, which is in a hardened state, is irradiated with laser light (arrow P3 in Figure 9(B)). (See reference). By removing a portion of the first layer, a starting point for delamination can be formed (dotted line in Figure 9(C)). (See the area enclosed by the symbol). At this time, not only the first layer, but also the other layers of the peeled layer 225, and peeling Layer 223 and a portion of the fourth bonding layer 235 may be removed.

[0202] It is preferable to irradiate the fabricated substrate 221, on which the peeling layer 223 is provided, with laser light.

[0203] Then, the peeled layer 225 and the fabricated substrate 221 are separated from the starting point of the formed peel (Figure 9). (D)). This transfers the peelable layer 205 and the peelable layer 225 onto the flexible substrate 231. It is possible.

[0204] Subsequently, the conductive layer 457 is exposed, and the insulating layer 226 and the flexible substrate 428 are bonded together. The process involves bonding using 426. Either process can be performed first.

[0205] In the method for manufacturing a light-emitting device according to one embodiment of the present invention described above, the peeling layer and the layer to be peeled are respectively After bonding the two fabricated substrates together, a starting point for delamination is formed by irradiation with laser light. Then, the peeling process is carried out after preparing each peeling layer and the layer to be peeled for easy separation. This can improve the yield of the peeling process.

[0206] Furthermore, after bonding together a pair of fabricated substrates, each with a peelable layer formed on it, The substrates that make up the device to be manufactured can be separated and bonded together. During the bonding of abscission layers, it is possible to bond together fabricated substrates with low flexibility, and This method improves the alignment accuracy of the bonded substrates compared to when the substrates are bonded together. Cut.

[0207] Furthermore, peeling begins in the region where the hardened second bonding layer 404 and the peeling layer overlap, The abscission layer can be double-sealed by the first bonding layer 407 and the second bonding layer 404. Therefore, it is possible to suppress the degradation of organic EL elements due to moisture and oxygen, resulting in highly reliable light emission. We can manufacture the device.

[0208] In the configuration shown in Figure 9(D), the organic EL element 450 is connected to the first junction layer 407 and the second junction layer It is sealed by layer 404, as well as the third bonding layer 233 and the fourth bonding layer 235. Therefore, it is possible to suppress the intrusion of impurities into the light-emitting device. The configuration is not limited to this. By cutting the end of the light-emitting device, the third bonding layer 233 and At least a portion of the fourth bonding layer 235 is removed, and the second bonding layer 404 is attached to the side of the light-emitting device. It may be exposed. This allows for a narrower non-emitting area of ​​the light-emitting device (a narrower bezel). In one aspect of the present invention, a layer with high gas barrier properties is used for the second bonding layer 404, so light emission Even if the second bonding layer 404 is exposed on the side of the device, a decrease in the reliability of the light-emitting device can be suppressed.

[0209] <Method for fabricating the device 3> The following describes the top emission structure using the color-coding method shown in Figures 3(A) and (B). An example of fabricating an optical device (configuration example 2 above) is shown.

[0210] Furthermore, by changing the composition of the layer to be peeled off, the above configuration examples 3 to 5 can also be manufactured using the same method. .

[0211] First, as shown in Figure 10(A), a release layer 203 is formed on the fabricated substrate 201, and then a release layer 2 A peelable layer 205 is formed on 03. The peelable layer 205 is the same as in the method for manufacturing the apparatus 1. A layer is formed. However, since a color-shading method is used here, the organic EL element 450 is At least a portion of the EL layer 402 is divided into individual pixels.

[0212] Next, the fabricated substrate 201 and the flexible substrate 428 are bonded together by the first bonding layer 407 and the second bonding layer 4 The first bonding layer 407 and the second bonding layer 404 are bonded together using 04 and cured (Figure 10(B)). Here, a frame-shaped second bonding layer 404 and a frame-shaped second bonding layer 404 are placed on the flexible substrate 428. After providing the first bonding layer 407 inside the second bonding layer 404, the fabricated substrate 201 and the flexible group Place board 428 opposite to it and glue them together.

[0213] Furthermore, it is preferable to perform the bonding of the fabricated substrate 201 and the flexible substrate 428 under reduced pressure. It's nice.

[0214] Here, the first bonding layer 407 and the second bonding layer 404 are the release layer 203 and the layer to be released 205 It is positioned so as to overlap with it. Then, as shown in Figure 10(B), the edge of the second bonding layer 404 The part is preferably not located outside the edge of the release layer 203. Second bonding layer 404 If it has a region that does not overlap with the delamination layer 203, the size of that region and the second bonding layer 404 Depending on the degree of adhesion with the adjacent layer, peeling defects may occur. The second bonding layer 404 is located inside the release layer 203, or the second bonding layer 404 It is preferable that the end of the part and the end of the release layer 203 are aligned.

[0215] Furthermore, as shown in Figure 11(C), on the outside of the first bonding layer 407 and the second bonding layer 404 A resin layer 213 may be provided. Figure 11(C) is a plan view seen from the flexible substrate 428 side. The cross-sectional view between the dashed line A1-A2 in the plan view is shown (flexible substrate 42 in the plan view). (8 is not shown in the figure). By providing the resin layer 213, even when exposed to the atmosphere during the manufacturing process This prevents impurities such as moisture from being mixed into the peeled layer 205.

[0216] Furthermore, when the resin layer 213 is in a cured state, the adhesion between the fabricated substrate 201 and the flexible substrate 428 is Depending on the degree, the yield of the subsequent peeling process may decrease. Therefore, the resin layer 21 It is preferable that at least a portion of 3 be in a semi-cured or uncured state. Resin layer 213 By using a high-viscosity material, even in a semi-cured or uncured state, moisture in the air can be absorbed. This enhances the effect of suppressing the incorporation of impurities such as these into the peeled layer 205.

[0217] Furthermore, for example, by using a photocurable resin as the resin layer 213 and irradiating a part of it with light, A portion of the lipid layer 213 may be left in a hardened state. By leaving a portion in a hardened state, the amount of material removed during the process can be reduced. Even when moved from a pressurized atmosphere to an atmospheric pressure atmosphere, the fabricated substrate 201 and the flexible substrate 428 It is preferable that the spacing and position can be kept constant. It is preferable to form a resin layer 213.

[0218] Next, a starting point for delamination is formed by irradiation with laser light (Figure 10(B), (C)).

[0219] The laser beam overlaps the hardened second bonding layer 404, the peel-off layer 205, and the peel-off layer 203. Irradiate the area (see arrow P4 in Figure 10(B)).

[0220] By removing a portion of the first layer, a starting point for delamination can be formed (circled by the dotted line in Figure 10(C)). (See region). At this time, not only the first layer, but also the other layers of the peeled layer 205 and the peeled layer 20 3. A portion of the second bonding layer 404 may be removed.

[0221] The laser light can be irradiated from either side of the substrate, but scattered light will irradiate organic EL elements, etc. To suppress this, irradiation is performed from the side of the fabricated substrate 201 where the peeling layer 203 is provided. This is preferable.

[0222] Then, the peeled layer 205 and the fabricated substrate 201 are separated from the starting point of the formed peeling (Figure 1). 0(D)). This transfers the peelable layer 205 from the fabricated substrate 201 to the flexible substrate 428. It is possible.

[0223] In the method for manufacturing a light-emitting device according to one aspect of the present invention described above, peeling occurs by irradiation with laser light. Points are formed to make it easier to separate the release layer 203 and the layer to be released 205, and then the peeling is performed. This improves the yield of the peeling process.

[0224] In the above, a laser beam was used to form the starting point for peeling, but the flexible substrate 428 cutter - If it can be cut with a sharp blade such as the flexible substrate 428, the second bonding layer 404, and the An incision may be made in the peeling layer 205. This removes a portion of the first layer and peels off It can create a starting point.

[0225] Subsequently, the conductive layer 457 is exposed, and the peelable layer 205 and the flexible substrate 420 are bonded together. The process involves bonding using layer 422. Either process can be performed first.

[0226] Furthermore, peeling begins in the region where the hardened second bonding layer 404 and the peeling layer 203 overlap. The peelable layer 205 is double-sealed with the first bonding layer 407 and the second bonding layer 404. Yes, it is possible. Therefore, it is possible to suppress the degradation of organic EL elements due to moisture and oxygen, and it is reliable. Highly efficient light-emitting devices can be fabricated.

[0227] As described above, the edges of the region that can be peeled and transposed are inward from the edges of the peeling layer 203. As shown in Figures 12(A) to (C), the edges of the layer to be peeled off 205 are located in the peeling layer 2 It is formed so that it is located inside the edge of 03. When there are multiple layers to be peeled off 205 Alternatively, as shown in Figure 12(B), a peeling layer 203 may be provided for each peeling layer 205, As shown in Figure 12(C), multiple peelable layers 205 may be provided on a single peelable layer 203. stomach.

[0228] An example of preparing a flexible sample by peeling and transposition will be explained using Figure 20. Here, we show an example in which the peelable layer is transferred from a glass substrate to an organic resin film substrate.

[0229] The sample preparation method involves first placing island-shaped tannins on a 600mm x 720mm glass substrate. A Gusten film (579 mm x 696 mm) was formed as a release layer. Then, a coating was applied on top of the release layer. A delamination layer was formed. The layers to be delaminated were an inorganic insulating film on a tungsten film and an inorganic insulating film on Multiple transistors, an adhesive layer on the multiple transistors, and an organic resin fill on the adhesive layer. A glass substrate and a layer were stacked. Figure 20(A) shows multiple transistors formed on a glass substrate. This indicates.

[0230] Then, the glass substrate and the layer to be peeled were separated using a release layer. As shown in Figure 20(B) Furthermore, the peeled layer, which has been removed from the glass substrate, is flexible. Subsequently, an adhesive layer is used to expose An organic resin film substrate was bonded to the inorganic insulating film. As a result, Figure 20(C), (D) A flexible sample in which the peelable layer is sandwiched between a pair of organic resin film substrates. We were able to fabricate it. Figures 20(C) and (D) show the organic resin film substrate used. The materials used are different. In Figure 20(D), the light transmittance to visible light is higher compared to Figure 20(C). A film (specifically PEN film) was used.

[0231] Applying one aspect of the present invention, the peelable layer is an organic EL element, a first bonding layer and a second bonding layer By forming a composite layer, a large light-emitting device measuring 600mm x 720mm or larger can be created, similar to the above. It is possible.

[0232] As described above, the light-emitting device according to one aspect of the present invention has a first between a flexible substrate and an organic EL element. A bonding layer and a second bonding layer are used. The first bonding layer has better gas barrier properties than the first bonding layer. By surrounding the first bonding layer with a high second bonding layer, the volume shrinkage during curing is small, and light transmission is achieved. Low gas barrier properties (especially high transmittance of visible light) or high refractive index. Even when using certain materials, it is possible to suppress the intrusion of moisture and oxygen into the light-emitting device from the outside. Therefore, it is possible to realize a highly reliable light-emitting device in which shrinkage of the light-emitting part is suppressed. ru.

[0233] This embodiment can be combined with other embodiments as appropriate.

[0234] (Embodiment 2) This embodiment describes a method for curing a bonding layer in the fabrication of a light-emitting device according to one aspect of the present invention. Let me explain an example.

[0235] In this embodiment, the first bonding layer 407 and in the light-emitting device shown in Figures 2(A) and (B) The case of curing the second bonding layer 404 will be explained. As shown in Figure 6(C), the first The bonding layer 407 and the second bonding layer 404 are on one side of the fabricated substrate 201, the release layer 203, And overlapping with the peel-off layer 205, the fabricated substrate 221, the peel-off layer 223, and the peel-off layer are on the other side. It overlaps with layer 225.

[0236] Since the edges of the area that can be peeled and transferred are inward from the edges of the peeled layer, the first bonding layer 4 In order to fabricate a light-emitting device having 07 and a second bonding layer 404, the first bonding layer 407 Furthermore, the second bonding layer 404 must be provided overlapping with the release layer. Therefore, the first bonding layer 407 and the second bonding layer 404 need to be cured.

[0237] Below are two examples of processes for curing the bonding layer. In the first example, the first bonding layer 407 An example is shown in which a photocurable resin is used for the second bonding layer 404. In the second example, the second bonding An example of using a thermosetting resin in layer 404 is shown.

[0238] <Method 1 for curing the bonding layer> When using a photocurable resin as the material for the bonding layer, the light used to cure the photocurable resin is used as the fabrication base. The plate, the delamination layer, and the layer being delaminated need to be permeable.

[0239] In one embodiment of the present invention, a method for manufacturing a light-emitting device is used, in which a tungsten film and tungsten oxide are used as the release layer. Using a laminated structure with a tungsten film, the interface (or near the interface) between the tungsten film and the tungsten oxide film. The delamination that occurs at the side allows for the separation of the fabricated substrate from the layer to be delaminated.

[0240] Here, in the case of metal films such as tungsten films, if the release layer is too thick, depending on the material, it may cause leakage. The phototability decreases, making it difficult for light to penetrate the material needed to cure the photocurable resin. As a result, light Problems include the curing resin not curing, or the photocuring resin taking a long time to cure. To occur.

[0241] Therefore, the light transmittance in the release layer for curing the photocurable resin is greater than 0%. It is preferable to have a concentration of 1% or more.

[0242] On the other hand, if the film thickness of the peeling layer is made too thin, the yield of the peeling process may decrease. Furthermore, if the film thickness is thin, it may be difficult to deposit a film of uniform thickness.

[0243] Therefore, the thickness of the release layer is preferably 2 nm or more, and more preferably 5 nm or more.

[0244] For example, a glass substrate is used as the fabrication substrate 201 shown in Figure 6(A), and the release layer 203 is Using a tungsten film, the peelable layer 205 is a silicon oxidizide film with a thickness of 600 nm and a film Figure 16 shows the transmittance of a sample using a 200 nm thick silicon nitride film layer.

[0245] Figure 16 shows the results for tungsten film thicknesses of 5 nm, 15 nm, and 30 nm. show.

[0246] Even with a film thickness of 30 nm, tungsten films have a UV light transmittance of only about 2-3%, and testing It is possible to cure UV-curable resins via a material. Also, tungsten By making the film thinner, the transmittance increases, ensuring that the UV-curable resin is reliably cured through the sample. It is suggested that it is possible to cause or rapidly harden it.

[0247] Figure 12(D) shows an example of the upper surface shape of the peeling layer used in the method for manufacturing a light-emitting device according to one embodiment of the present invention. (F) is shown.

[0248] Figure 12(D) shows the use of photocurable resin in the first bonding layer 407 and the second bonding layer 404, respectively. This is an example of a release layer used in the case of [unspecified]. In Figure 12(D), a release layer 3 is applied to the fabricated substrate 301. 03 is provided in an island-like manner. At this time, the film thickness of the release layer 303 is determined by the photohardness used for each bonding layer. It is determined that the resin will transmit light to cure it. This results in the first bonding layer 407 Furthermore, the photocurable resin used in the second bonding layer 404 can be cured, improving the reliability of the light-emitting device. It can be improved. Also, if the film thickness is 2 nm or more, the film formation process of the release layer 303 and the peeling process can be improved. This is preferable because it can suppress the decrease in yield during the process.

[0249] Figures 12(E) and (F) show the release layer used when a photocurable resin is used for the second bonding layer 404. This is an example.

[0250] In Figure 12(E), the island-shaped delamination layer provided on the fabricated substrate 301 is compared to region 303b. It has a frame-shaped region 303a with a thin film thickness. Region 303a overlaps with the second bonding layer 404. To form in that manner.

[0251] In Figure 12(F), the island-shaped delamination layer provided on the fabricated substrate 301 is compared to region 303b. It has a thin, grid-like region 303a in a frame shape. Region 303a is the second bonding layer 4 Form it so that it overlaps with 04.

[0252] The film thickness of region 303a shown in Figures 12(E) and (F) is determined by the photocuring used for the second bonding layer 404. It is determined that the light required to cure the resin will be transmitted. This will allow the second bonding layer 404 to The photocurable resin used can be cured, and the reliability of the light-emitting device can be improved. By setting the film thickness to 2 nm or more, the decrease in yield during the film formation and peeling processes of the release layer can be suppressed. This can be controlled and is preferable. However, if region 303b is thicker than region 303a, the film formation will be affected. Because processing the film takes time, a range of 2 nm to 1000 nm is preferred, and 5 nm More preferably, the wavelength is 100 nm or less.

[0253] Using Figure 13, a release layer having a thin film region 303a and a thick film region 303b is shown. An example of a manufacturing method will be explained.

[0254] First, as shown in Figure 13(A), a base film 302 is formed on the fabricated substrate 301, and the base film 3 A release layer 303 is formed on 02.

[0255] In this case, a tungsten film with a thickness of 25 nm is formed as the release layer 303.

[0256] Next, as shown in Figure 13(B), a resist 304 is formed on the release layer 303.

[0257] Then, the peeling layer 303 is applied to multiple island-shaped peeling layers 303c by a photolithography process. To work on.

[0258] Then, a further peeling layer is formed on the base film 302 and the peeling layer 303c. Here, film thickness A 5nm tungsten film is formed.

[0259] As described above, the peel has a region 303b with a film thickness of approximately 30 nm and a region 303a with a film thickness of approximately 5 nm. A separation layer can be formed. A thin-film region 303a is provided overlapping with the bonding layer to be cured. This allows the bonding layer to harden more quickly and reliably.

[0260] The above examples illustrate the use of tungsten in the release layer, but the present invention is not limited thereto. When using a material (such as a metal) whose light transmittance changes depending on the film thickness as the release layer, similarly, At least a portion of the area overlapping with the bonding layer is made transparent to the extent that light for curing the photocurable resin is transmitted. By making it thin, the hardening of the bonding layer can be made more reliable. By curing it, the light-emitting device can include a bonding layer, thereby increasing the reliability of the light-emitting device. It is possible to do so.

[0261] <Method 2 for curing the bonding layer> Next, an example is shown in which a thermosetting resin is used for the second bonding layer 404.

[0262] When using thermosetting resin in the bonding layer, a heat source such as a heater or a light source such as a lamp or laser is used. The bonding layer can be hardened by heat treatment. When using lamp light or laser light... The fabricated substrate, the release layer, and the layer to be released must transmit the light.

[0263] When the layer to be peeled off has a color filter or organic EL element with low heat resistance, the bonding layer material is When using thermosetting resin, the color filter and organic EL elements are damaged by heat during the heat treatment. There is a risk of taking damage.

[0264] Therefore, in a method for manufacturing a light-emitting device according to one aspect of the present invention, an absorption layer is formed in superimposed on a bonding layer. Then, by applying heat to the bonding layer through the absorption layer, the bonding layer is hardened. This allows, Only the bonding layer that overlaps with the absorption layer can be selectively heated. Furthermore, materials with low heat resistance can be used. This can prevent heating.

[0265] The absorption layer is a layer that absorbs light irradiated to heat the bonding layer and converts it into heat. A converging layer has a low reflectivity of 70% or less to the irradiated light, and also has a high absorptivity. It is preferable that the material is formed from such a material. Furthermore, the absorption layer itself changes due to heat. To prevent this, it is preferable that it be formed from a material with excellent heat resistance. Materials that can be used include, for example, titanium nitride, tantalum nitride, molybdenum nitride, and tan nitride. Metal nitrides such as gusten, chromium nitride, and manganese nitride, as well as molybdenum, titanium, and tungsten. It is preferable to use materials such as stainless steel or carbon.

[0266] If the release layer also functions as an absorption layer, it is not necessary to provide a separate absorption layer.

[0267] For example, as shown in Figure 14(A), an island-shaped absorption layer 222 is formed on the fabricated substrate 221. A release layer 223 is formed covering the absorption layer 222, and a peelable layer 225 is formed on the release layer 223. Then, a peelable layer 205 is provided on the fabricated substrate 201 via a peelable layer 203, and The abscission layer 225 is bonded together using the first bonding layer 407 and the second bonding layer 404.

[0268] Note that Figure 14(A) shows an example where the entire second bonding layer 404 overlaps with the absorption layer 222. At least a partial overlap is sufficient.

[0269] By irradiating the fabricated substrate 221 with lamp light or laser light, the absorption layer 222 converts the light into heat. The heat is then used to cure the second bonding layer 404.

[0270] Furthermore, in a method for manufacturing a light-emitting device according to one aspect of the present invention, an absorption layer is formed in superposition with a bonding layer, and heat-resistant A reflective layer is formed by layering it with low-performance organic EL elements, etc. Then, heat is transferred to the bonding layer via the absorption layer. By applying this, the bonding layer is hardened. This selectively hardens only the bonding layer that overlaps with the absorption layer. It can be heated. Also, by having a reflective layer, the organic EL element and the like are not heated. It can suppress and.

[0271] The reflective layer reflects the light irradiated to heat the bonding layer, so as not to heat the organic EL elements, etc. It is a layer that blocks and illuminates light. The reflective layer is formed of a material that has a high reflectivity to the irradiating light. Preferably, the reflective layer reflects 85% or more of the irradiated light. Preferably, it is formed from a material having a high reflectivity of 90% or more.

[0272] Materials that can be used for the reflective layer include, for example, aluminum, silver, gold, platinum, copper, Aluminum-containing alloys (e.g., aluminum-titanium alloy, aluminum-neodymium alloy) Alloys, or alloys containing silver (silver-neodymium alloy), can be used.

[0273] For example, as shown in Figure 14(B), organic EL elements and color filters are placed on the fabricated substrate 221. A reflective layer 224 is provided that overlaps with the fabricated substrate 221, and an absorption layer 222 is provided on the fabricated substrate 221 and the reflective layer 224. Then, a release layer 223 and a peelable layer 225 are sequentially laminated on the absorption layer 222. Then, the fabricated substrate is created. A peelable layer 205 and a peelable layer 225 are provided on 201 via a peeling layer 203. The first bonding layer 407 and the second bonding layer 404 are used to bond the parts together.

[0274] Note that Figure 14(B) shows an example where the reflective layer 224 and the second bonding layer 404 do not overlap. It's okay if there's some overlap.

[0275] By irradiating the fabricated substrate 221 with lamp light or laser light, the absorption layer 222 converts the light into heat. The heat generated by this process can then cure the second bonding layer 404.

[0276] Furthermore, if an insulating layer is provided that overlaps with the organic EL elements or color filters, a heat source such as a heater should be used. It can also be used. As an insulating layer, for example, titanium dioxide, silicon dioxide, silicon oxide nitride, Zirconium oxide, titanium carbide, etc. can be preferably used. The heat insulating layer includes a reflective layer and A material with lower thermal conductivity than the material used for the absorption layer is used.

[0277] Lamps used for heat treatment include flash lamps (xenon flash lamps, crystal Discharges, such as those found in Puton flash lamps, xenon lamps, and metal halide lamps. Incandescent lamps such as lamps, halogen lamps, and tungsten lamps can be used.

[0278] In addition, lasers used for heat treatment include Ar lasers, Kr lasers, and excimer lasers. Gas lasers, single crystal YAG, YVO4, forsterite (Mg2SiO4), YA IO3, GdVO4, or polycrystalline (ceramic) YAG, Y2O3, YVO4, Y AlO3 and GdVO4 are used as dopants for Nd, Yb, Cr, Ti, Ho, Er, and Tm. Lasers and glass lasers using a medium containing one or more types of Ta, Ruby laser, alexandrite laser, Ti:sapphire laser, copper vapor laser, Gold vapor lasers and the like can be used.

[0279] Furthermore, if the light-emitting device to be fabricated may have an absorption layer 222 or a reflective layer 224, see Figure 14( As shown in C), an absorption layer 222 or a reflection layer 224 may be formed on the release layer 223. In this case, the order in which each layer constituting the peelable layer 225, the absorption layer, and the reflection layer are formed does not matter. .

[0280] As described above, when forming a bonding layer using thermosetting resin, providing an absorption layer allows for The bonding layer can be selectively heated. In addition, by providing a reflective layer, it is possible to heat materials with low heat resistance. This suppresses damage to the EL element due to heat. This allows the hardening of the bonding layer to be reduced. This allows for more reliable operation. Furthermore, it helps to suppress the decline in the reliability of the light-emitting device.

[0281] By using the method for curing the bonding layer described in this embodiment, a thermosetting resin or Photocurable resins can be used. Furthermore, the bonding layer can be reliably cured in a short time. Furthermore, even if heat treatment is performed, the organic EL elements and color filters will not suffer damage from heat. This can suppress the peeling process. Also, even if the thickness of the peeling layer is thin enough to transmit light, the peeling process This can suppress the decline in yield.

[0282] This embodiment can be combined with other embodiments as appropriate.

[0283] (Embodiment 3) In this embodiment, regarding electronic equipment and lighting devices using a light-emitting device according to one aspect of the present invention, This will be explained using Figure 15.

[0284] By using a light-emitting device according to one aspect of the present invention, highly reliable, flexible electronic devices and lighting can be created. A lighting device can be fabricated.

[0285] Examples of electronic devices include television equipment (also known as televisions or television receivers). (u) Monitors for computers, digital cameras, digital video cameras, digital Photo frames, mobile phones (also called mobile phones or mobile phone devices), portable game consoles, portable Examples include mobile information terminals, sound playback devices, and large game machines such as pachinko machines.

[0286] Furthermore, since the light-emitting device according to one aspect of the present invention is flexible, it can be used on the interior or exterior walls of houses and buildings. Alternatively, it can be incorporated along the curved surfaces of the interior or exterior of a vehicle.

[0287] Figure 15(A) shows an example of a mobile phone. Mobile phone 7400 has a housing 7401 In addition to the display unit 7402 incorporated into it, there are also operation buttons 7403, an external connection port 7404, It is equipped with speaker 7405, microphone 7406, etc. Note that mobile phone 7400 is... This invention is manufactured by using a light-emitting device according to one aspect of the invention in the display unit 7402. Depending on the design, it is possible to provide a mobile phone with a curved display and high reliability.

[0288] The mobile phone 7400 shown in Figure 15(A) allows information to be conveyed by touching the display unit 7402 with a finger or the like. You can enter information. You can also make phone calls or type text. The operation can be performed by touching the display unit 7402 with a finger or the like.

[0289] Furthermore, the operation button 7403 can be used to turn the power ON or OFF, and the display unit 7402 will display... You can switch the type of image displayed. For example, from the email composition screen, You can switch to the menu screen.

[0290] Figure 15(B) shows an example of a wristband-type portable display device. Portable display device 71 00 represents the housing 7101, the display unit 7102, the operation buttons 7103, and the transmitting / receiving device 7104. It is equipped with.

[0291] The portable display device 7100 is capable of receiving video signals by the transceiver 7104, and the received The video can be displayed on the display unit 7102. Additionally, the audio signal can be transmitted to other receiving devices. It is also possible to do so.

[0292] Additionally, the 7103 control button allows you to turn the power on and off, and switch the displayed image. Alternatively, you can adjust the volume of the sound, etc.

[0293] Here, the display unit 7102 incorporates a light-emitting device according to one aspect of the present invention. In one embodiment, a highly reliable portable display device equipped with a curved display section can be provided.

[0294] Figures 15(C) to (E) show an example of a lighting device. Lighting device 7200, lighting device 7 210 and the lighting device 7220 each have a base 720 equipped with an operating switch 7203 It has 1 and a light-emitting part supported by a base portion 7201.

[0295] The lighting device 7200 shown in Figure 15(C) includes a light-emitting section 7202 having a wave-shaped light-emitting surface. Therefore, it is a lighting fixture with a highly aesthetic design.

[0296] Figure 21(A) shows an example of a light-emitting device that can be used in the light-emitting section 7202 shown in Figure 15(C). As shown in Figure 21(A), the light-emitting device 7209 can emit light while curved. It has a light-emitting panel 7205 that can be used. The light-emitting panel 7205 is flexible and has convex and concave surfaces. It has a curved light-emitting region 7204. The light-emitting region 7204 is part of the light-emitting device 7209. It is located on the front side.

[0297] An example of a plan view of the back surface of the light-emitting device 7209 is shown in Figures 21(B) and (C). Furthermore, Figure 21( In B), the cross-sectional view is shown between the dashed lines Z1 and Z2 in the plan view, and in Figure 21(C), the plan view is shown. A cross-sectional view of the section between the dashed line Z3 and Z4 is also shown. Note that in Figures 21(B) and (C) An example of the light-emitting device 7209 in an uncurved state is shown.

[0298] As shown in Figure 21(B), the light-emitting device is electrically connected to the light-emitting panel 7205 on its back side. The configuration may include an FPC7207 and a support 7206.

[0299] Furthermore, as shown in Figure 21(C), the light-emitting device has an electrical connection to the light-emitting panel 7205 on its back side. The configuration includes a connecting FPC7207 and a support 7206 that covers the FPC7207. That's fine.

[0300] Furthermore, as shown in Figure 22(D), each of the opposing pairs of surfaces of the support 7206 has FP By having C and a light-emitting panel, a double-sided light-emitting device can be manufactured.

[0301] As the support 7206, in addition to the flexible substrate exemplified in Embodiment 1, a curved flexible A substrate without this feature can be used. The light-emitting panel 7205 is curved along the support 7206. By doing so, a light-emitting section 7202 having a wave-shaped light-emitting surface can be realized.

[0302] A perspective view of an example of the light-emitting device 7209 is shown in Figure 22(A), and a plan view is shown in Figure 22(B). Regarding the positional relationship between FPC7207 and support 7206 in the configuration shown in Figure 21(B) This is shown in Figure 22(C).

[0303] The light-emitting section 7212 of the lighting device 7210 shown in Figure 15(D) has two convexly curved parts The light-emitting parts are arranged symmetrically. Therefore, the entire lighting system is centered around the lighting device 7210. It can illuminate directions.

[0304] The lighting device 7220 shown in Figure 15(E) includes a concavely curved light-emitting section 7222. Therefore, in order to concentrate the light emitted from the light-emitting unit 7222 onto the front of the lighting device 7220, It is suitable for brightly illuminating a wide area.

[0305] Furthermore, each of the light-emitting parts provided in the lighting device 7200, lighting device 7210, and lighting device 7220 Because it is flexible, the light-emitting part can be made of plastic material or a movable frame or other material. The light-emitting surface of the light-emitting part may be freely curved to suit the application, while remaining fixed in place.

[0306] In this example, we have shown a lighting device in which the light-emitting part is supported by a base, but the light-emitting part The enclosure can be fixed to the ceiling or suspended from the ceiling. Because the surface can be curved for use, the light-emitting surface can be curved into a concave shape to brighten a specific area. It can illuminate a room, or the light-emitting surface can be curved into a convex shape to brightly illuminate the entire room.

[0307] Here, each light-emitting unit incorporates a light-emitting device according to one aspect of the present invention. This makes it possible to provide a lighting device with a curved light-emitting section and high reliability.

[0308] Figure 15(F) shows an example of a portable display device. The display device 7300 is housed in a casing 7 301, display unit 7302, operation button 7303, pull-out member 7304, control unit 7305 It is equipped with.

[0309] The display device 7300 has a flexible display unit wound in a roll inside a cylindrical housing 7301. It is equipped with 7302.

[0310] Furthermore, the display device 7300 can receive video signals via the control unit 7305, and the received video This can be displayed on the display unit 7302. Furthermore, the control unit 7305 is equipped with a battery. Furthermore, the control unit 7305 is equipped with a terminal section for connecting a connector, allowing video signals and power to be transmitted via wired connections. This configuration may involve supplying power directly from an external source.

[0311] Additionally, the 7303 control button allows you to turn the power on and off and switch the displayed image. These can be done.

[0312] Figure 15(G) shows the display unit 7302 pulled out by the pull-out member 7304. The device 7300 is shown. In this state, an image can be displayed on the display unit 7302. Also, The operation buttons 7303 located on the surface of the housing 7301 allow for easy one-handed operation. This is possible. Also, as shown in Figure 15(F), the operation button 7303 is located in the center of the housing 7301. By positioning it to one side, it can be easily operated with one hand.

[0313] Furthermore, when the display unit 7302 is pulled out, the display surface of the display unit 7302 is fixed to become flat. To ensure stability, a reinforcing frame may be provided on the side of the display unit 7302.

[0314] In addition to this configuration, a speaker is installed in the enclosure, and the audio signal received along with the video signal is used. It may also be configured to output sound.

[0315] The display unit 7302 incorporates a light-emitting device according to one aspect of the present invention. This allows us to provide lighter and more reliable display devices.

[0316] This embodiment can be freely combined with other embodiments. [Examples]

[0317] In this embodiment, a flexible light-emitting device according to one aspect of the present invention is fabricated and its reliability is evaluated. I will now explain the results.

[0318] A plan view of sample 1 prepared in this embodiment is shown in Figure 17(A1), and the dashed line in Figure 17(A1) Figure 17(B) shows a cross-sectional view between X5 and Y5. Also shown is a plan view of sample 2 prepared in this embodiment. Figure 17(A2) shows the cross-sectional view between the dashed line X6-Y6 in Figure 17(A2), and Figure 17(C) shows the cross-sectional view between the dashed line X6-Y6 in Figure 17(A2). Figure 18(A) shows a plan view of a comparative sample prepared as a comparative example. Figure 18(B) shows a cross-sectional view of the section between X7 and Y7, indicated by the dashed line in (A).

[0319] In addition, the sample of this embodiment is configured as shown in Example 1 of Embodiment 1 (Figures 2(A), (B) For configurations similar to those described above, the explanation may be omitted. Also, the method for preparing the sample in this embodiment is described below. In the law, the same manufacturing process as the manufacturing method 1 of the apparatus described in Embodiment 1 (Figures 6-8) Therefore, explanations may be omitted in some cases.

[0320] Sample 1 consists of a flexible substrate 420, a flexible substrate 428, and a flexible substrate 420 and a flexible substrate The transistor 455 between 428 and the flexible substrate 428 The first bonding layer 40 between the EL element 450 and the flexible substrate 428 and the EL element 450 It has 7, and a frame-shaped second bonding layer 404a surrounding the first bonding layer 407.

[0321] In sample 1, the organic EL elements and transistors included in the light-emitting section 491 and the drive circuit section 493 The substrate consists of a flexible substrate 420, a flexible substrate 428, a first bonding layer 407, and a second bonding layer. It is sealed with 404a.

[0322] Sample 1 has a first bonding layer 407 between the insulating layer 226 and the second bonding layer 404a. This differs from Configuration Example 1 (Figures 2(A), (B)).

[0323] Sample 2 consists of a flexible substrate 420, a flexible substrate 428, and a flexible substrate 420 and a flexible substrate The transistor 455 between 428 and the flexible substrate 428 The first bonding layer 40 between the EL element 450 and the flexible substrate 428 and the EL element 450 7, a frame-shaped third bonding layer 404b surrounding the first bonding layer 407, and the third bonding layer 404b It has a frame-shaped second bonding layer 404a surrounding it.

[0324] In sample 2, the organic EL elements and transients included in the light-emitting section 491 and the drive circuit section 493 The substrate consists of a flexible substrate 420, a flexible substrate 428, a first bonding layer 407, and a third bonding layer 40 It is sealed by 4b and the second bonding layer 404a.

[0325] In a light-emitting device according to one aspect of the present invention, a second bonding layer 404a and surrounds the first bonding layer 407. At least one of the third bonding layers 404b has higher gas barrier properties than the first bonding layer 407. It is preferable that both have higher gas barrier properties than the first bonding layer 407. It's nice.

[0326] Sample 2 has a third bonding layer 404b, and an insulating layer 226 and a second bonding layer 40 A first bonding layer 40 is placed between 4a and between the insulating layer 226 and the third bonding layer 404b, respectively. This configuration differs from Example 1 (Figures 2(A), (B)) in that it has element 7.

[0327] The comparative samples are flexible substrate 420, flexible substrate 428, and flexible substrate 420 and flexible group The transistor 455 between the boards 428 and between the transistor 455 and the flexible substrate 428 The first bonding layer 4 between the organic EL element 450 and the flexible substrate 428 and the organic EL element 450 It has 07 and .

[0328] In the comparative sample, the organic EL elements and transistors included in the light-emitting section 491 and the drive circuit section 493 The zista is sealed by a flexible substrate 420, a flexible substrate 428, and a first bonding layer 407. It is being done.

[0329] The comparative sample lacks the second bonding layer 404, which is characteristic of configuration example 1 (Figure 2(A), (B)). It is different.

[0330] The method for preparing samples 1, 2, and the comparative sample is as follows: First, a release layer is applied to each of the two prepared substrates. A layer was formed, and a layer to be peeled was formed on the peeling layer. As for the peeling layer, a layer with a thickness of 30 nm was used. A ngsten film was formed. The peelable layer on one of the fabricated substrates is shown in Figure 17(B). A laminated structure was formed from the insulating layer 424 to the organic EL element 450. The peeling layer is the sum of the layers from the insulating layer 226 to the overcoat 453 in Figure 17(B). It formed a layered structure.

[0331] Next, in sample 1, the pair of fabricated substrates are arranged so that the surfaces on which the peel-off layer is formed face each other. The first bonding layer 407 and the second bonding layer 404a are used to bond the first bonding layer 4 The 07 and the second bonding layer 404a were cured.

[0332] Furthermore, in sample 2, the pair of fabricated substrates were arranged so that the surfaces on which the peel-off layer was formed faced each other. The first bonding layer 407, the second bonding layer 404a, and the third bonding layer 404b are used to bond the material. The first bonding layer 407, the second bonding layer 404a, and the third bonding layer 404b are bonded together and hardened. I transformed it.

[0333] Furthermore, in the comparative sample, the pair of fabricated substrates were arranged so that the surfaces on which the peel-off layer was formed faced each other. The sea urchins were bonded together using the first bonding layer 407, and the first bonding layer 407 was cured.

[0334] In each sample, a thermosetting resin was used for the first bonding layer 407. The material was hardened by a heat treatment at 80°C for 2 hours.

[0335] In sample 1, a UV-curable resin was used for the second bonding layer 404a. 04a was cured by irradiating it with ultraviolet light for 200 seconds.

[0336] In sample 2, a UV-curing resin is used for the second bonding layer 404a, and the third bonding layer 40 4b uses a UV-curing resin containing zeolite. The zeolite functions as a desiccant. The second bonding layer 404a and the third bonding layer 404b can be exposed to ultraviolet light for 200 seconds. It was cured by intermittent irradiation. Furthermore, the bonding layer formed using a resin containing a desiccant is resin Even if the gas barrier properties of the material itself are low, the amount of water vapor transmitted is reduced because the desiccant adsorbs moisture, etc. In such cases, it can be said that the layer has high gas barrier properties.

[0337] As shown in the transmittance results for the bonding layer curing method 1 described in Embodiment 2, in samples 1 and 2... We were able to cure the UV-curable resin via a tungsten film with a thickness of 30 nm.

[0338] Each sample was bonded together under reduced pressure.

[0339] Next, a starting point for delamination was formed by irradiation with laser light. In particular, in samples 1 and 2, the laser light The area overlapping with the hardened second bonding layer 404a was irradiated. This resulted in the sample 1 being treated as follows: A configuration having a second bonding layer 404a and a first bonding layer 407, sample 2, second bonding layer 4 The light-emitting device has a configuration comprising 04a, a third bonding layer 404b, and a first bonding layer 407. It is possible.

[0340] Then, the peeled layer and the first fabricated substrate were separated from the starting point of the formed peel.

[0341] Subsequently, the exposed peelable layer and the flexible substrate are bonded together using an adhesive layer, and the adhesive layer is cured. Next, a starting point for delamination was formed with a cutter, and the layer to be peeled off was separated from the formed starting point. The eye fabrication substrate was separated.

[0342] Subsequently, the exposed peelable layer and the flexible substrate are bonded together using an adhesive layer, and the adhesive layer is cured. This was done. Furthermore, the conductive layer 457 was exposed and electrically connected to the FPC 495.

[0343] Reliability tests were performed on each of the prepared samples. Specifically, each sample was subjected to high temperature and high humidity conditions (temperature 65°C). The samples were maintained at °C and 90% humidity. Figures 19(A) to (G) show the display state of each sample under an optical microscope. The results of the observations are shown. In Figures 19(A) to (F), the top row shows photographs at 100x magnification, and the bottom row shows photographs at 2x magnification. Each image shows a magnification of 500x. Figure 19(G) shows only images at 100x magnification.

[0344] Figure 19(A) shows the display state of the comparison sample before reliability testing. Also, Figure 19(B) shows This shows the display state of the comparison sample after being kept in a high-temperature, high-humidity environment for 100 hours.

[0345] Figure 19(C) shows the display state of sample 1 before the reliability test. Also, Figure 19(D) shows the test This shows the display state after 500 hours of being kept in a high-temperature, high-humidity environment as described in Material 1.

[0346] Figure 19(E) shows the display state of sample 2 before the reliability test. Also, Figure 19(F) shows the test Figure 19 shows the display state after 500 hours of being kept in a high-temperature, high-humidity environment as described in Material 2. (G) shows the display state of sample 2 after being kept in a high-temperature, high-humidity environment for 1000 hours.

[0347] In the comparative sample, 100 hours after the start of the reliability test, shrinkage (here, The occurrence of brightness degradation from the edges of the light-emitting area and expansion of the non-emitting area of ​​the light-emitting part was confirmed. Furthermore, after 500 hours since the start of the reliability test, some shrinkage occurred in sample 1. Although its presence was confirmed, no shrinkage was observed in sample 2. Even 1000 hours after the start of the sex test, sample 2 is generally prone to shrinkage. No shrinkage was observed at the four corners of the light-emitting section.

[0348] Based on the results of this embodiment, samples 1 and 2 to which one aspect of the present invention is applied are more reliable than the comparative sample. It was found that the value was high. Samples 1 and 2 have a frame-shaped bonding layer surrounding the first bonding layer. This configuration prevents moisture from penetrating the first bonding layer and further into elements such as organic EL elements. This suggests that it can be suppressed.

[0349] Furthermore, as in Sample 2, a third bonding layer in the shape of a frame surrounding the first bonding layer is made of resin containing a desiccant. Using fat, a resin without a desiccant is used as the frame-shaped second bonding layer surrounding the third bonding layer. This can further improve the reliability of the light-emitting device. A second joint with high gas barrier properties. The layer can suppress the intrusion of moisture, etc., and even if moisture permeates through the second bonding layer Even so, since the desiccant contained in the third bonding layer can adsorb the moisture, the first bonding layer, Furthermore, it was suggested that this method can suppress the intrusion of moisture into elements such as organic EL elements. [Explanation of Symbols]

[0350] 101 First flexible substrate 103 Adhesive layer 105 element layer 107 First bonding layer 109 Second bonding layer 111 Second flexible substrate 113 Third bonding layer 115 The fourth bonding layer 201 Fabricated substrate 203 Exfoliation layer 205 Peeling layer 213 Resin layer 215 Irradiation area 221 Fabricated substrate 222 Absorption layer 223 Exfoliation layer 224 Reflective layer 225 Peeling layer 226 Insulating layer 231 Flexible substrate 233 Third bonding layer 235 The fourth bonding layer 301 Fabricated substrate 302 Undercoat 303 Exfoliation layer 303a area 303b area 303c Delamination layer 304 Resist 401 First electrode 402 EL layer 403 Second electrode 404 Second bonding layer 404a Second bonding layer 404b Third bonding layer 405 Insulating layer 406 Conductive layer 407 First bonding layer 408 Conductive layer 409 Light extraction structure 410 Conductive layer 416 Conductive layer 419 Flexible substrate 420 Flexible substrate 422 Adhesive layer 424 Insulating layer 426 Adhesive layer 428 Flexible substrate 431 Light blocking layer 432 Colored layer 435 Conductive layer 450 Organic EL elements 453 Overcoat 454 transistors 455 transistors 457 Conductive layer 463 Insulating layer 465 Insulating layer 467 Insulating layer 491 Light-emitting part 493 Drive Circuit Section 495 FPC 497 Connectors 7100 Portable Display Device 7101 enclosure 7102 Display section 7103 Operation Buttons 7104 Transceiver 7200 Lighting device 7201 Daibu 7202 Light-emitting part 7203 Operation switch 7204 Emitting region 7207 FPC 7210 Lighting device 7212 Light-emitting part 7220 Lighting device 7222 Light-emitting part 7300 display device 7301 enclosure 7302 Display section 7303 Operation Buttons 7304 component 7305 Control Unit 7400 mobile phones 7401 enclosure 7402 Display section 7403 Operation Buttons 7404 External connection port 7405 Speaker 7406 Microphone

Claims

1. A first flexible substrate and A second flexible substrate, A light-emitting element between the first flexible substrate and the second flexible substrate, The first bonding layer between the second flexible substrate and the light-emitting element, A second bonding layer surrounding the first bonding layer, A third bonding layer surrounding the second bonding layer, The second flexible substrate has an insulating layer provided on it, The light-emitting element has a layer containing a light-emitting organic compound between a pair of electrodes, The first bonding layer is provided between the insulating layer and the second bonding layer, and between the insulating layer and the third bonding layer. A light-emitting device wherein at least one of the second bonding layer and the third bonding layer has higher gas barrier properties than the first bonding layer.

2. A first flexible substrate and A second flexible substrate, A light-emitting element between the first flexible substrate and the second flexible substrate, The first bonding layer between the second flexible substrate and the light-emitting element, A second bonding layer surrounding the first bonding layer, A third bonding layer surrounding the second bonding layer, The second flexible substrate has an insulating layer provided on it, The first bonding layer has a region that overlaps with the light-emitting element, The second bonding layer does not have a region that overlaps with the light-emitting element. The light-emitting element has a layer containing a light-emitting organic compound between a pair of electrodes, The first bonding layer is provided between the insulating layer and the second bonding layer, and between the insulating layer and the third bonding layer. A light-emitting device wherein at least one of the second bonding layer and the third bonding layer has higher gas barrier properties than the first bonding layer.

3. In claim 1 or claim 2, The second bonding layer is a light-emitting device having a frame-like shape.

4. An electronic device comprising a light-emitting device according to any one of claims 1 to 3, and an operating button.

5. A lighting device comprising a light-emitting device according to any one of claims 1 to 3, and an operating switch.

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