Cooling structure of a fluid-flowable cooler

Abstract

The present invention relates to a cooling structure (1) for a cooler (100) through which fluid can flow, the cooling structure (1) being formed from a U-shaped profile (10) that is periodically repeated in a repeating direction (501), the U-shaped profile (10) including corrugated legs (15), the corrugated legs (15) extending in a longitudinal direction (502) of the cooling structure (1) and formed according to a trigonometric function (13).

Description

Technical Field

[0003]

[0001] The present invention relates to a cooling structure of a fluid - flowable cooler for cooling power electronics equipment, a method for manufacturing such a cooling structure, and a fluid - flowable cooler. Further, the present invention relates to a power electronics device comprising such a cooler and power electronics equipment.

Background Art

[0002] The power semiconductors of power electronics equipment are known to carry high currents. Together with switching losses, the resulting conduction losses cause a large amount of loss heat, which needs to be dissipated over a very small area. Here, the maximum allowable semiconductor temperature is important with regard to failures, and thus minimizing the thermal resistance between the semiconductor and the coolant is very important. For efficient cooling, the power substrate is attached to a fluid - flowable cooler. These coolers are made of aluminum, AlSiC, or copper alloy. Pins or fins are arranged inside the cooler to increase the heat transfer surface and enhance heat transfer. Due to the low thermal resistance between the power substrate, especially the AMB / DBC power substrate (AMB: active metal brazing, DBC: direct copper bonding) and the cooler, the power substrate is joined to the cooler by a soft brazing process and optionally by a sintering process. For this purpose, these coolers are surface - coated with materials suitable for the soft brazing process or the sintering process in some cases. In automotive engineering, aluminum coolers, as well as AlSiC or copper coolers, are often known, and these coolers consist of a plurality of parts joined especially by a hard brazing process.

Summary of the Invention

[0003] The cooling structure for a fluid-flowable cooler according to the present invention has the advantage of a good balance between achieving heat transfer performance from the cooling structure to the fluid used as a coolant and the pressure drop caused by the cooling structure when the cooling structure is used in such a cooler and a fluid flows through the cooler. This is achieved by the cooling structure for a fluid-flowable cooler, which is formed from a U-shaped profile that is periodically repeated in a repeating direction, including corrugated legs. The corrugated legs extend in the longitudinal direction of the cooling structure and are formed according to trigonometric functions. In other words, each corrugated leg has a trigonometric function shape. Since the corrugated legs are part of the repeating U-shaped profile, advantageously, all corrugated legs of the cooling structure have the same shape. The repetition of the U-shaped profile in a repeating direction advantageously results in a continuous, integrated profile that can be specifically called a corrugated profile within the scope of the present invention. The corrugated legs of the cooling structure cause turbulence in the fluid used as a coolant, which results in increased heat dissipation while keeping the pressure drop caused by the corrugated shape of the legs within an acceptable range. Therefore, the cooling structure according to the present invention is particularly suitable for use in fluid-flowable coolers, especially high-performance coolers, for power electronics applications.

[0004] The dependent claims represent preferred developments of the present invention. Preferably, the U-shaped profile is repeated an integer or non-integer number of times. This means that if the number of repetitions of the U-shaped profile is an integer, the cooling structure corresponds to an integer multiple of the periodically repeated U-shaped profile. Conversely, if the number of repetitions is non-integer, the cooling structure does not correspond to an integer multiple of the periodically repeated U-shaped profile. The number of repetitions of the U-shaped profile is advantageously determined by the width of the power electronics equipment cooled by the fluid-flowable cooler surrounded by the cooling structure. For example, the U-shaped profile may be repeated five times in the repetition direction. Here, the cooling structure has five repetition units of the U-shaped profile, or in other words, five U-shaped profiles connected to each other so as to produce a unified, continuous waveform profile.

[0005] Preferably, the cooling structure has a width direction and a height direction in addition to a longitudinal direction. The repeating direction preferably corresponds to the width direction. The longitudinal direction may preferably be perpendicular to the repeating direction or inclined. The height direction is perpendicular to the width direction and the length direction. Preferably, the longitudinal direction is parallel to the line connecting the geometric centroid of the cross section of the U-shaped profile at the first end of the cooling structure and the geometric centroid of the cross section of the U-shaped profile at the second end of the cooling structure.

[0006] Preferably, the direction of iteration is parallel to the Y-axis of the spatially fixed coordinate system, and the height direction is parallel to the Z-axis of the spatially fixed coordinate system. The longitudinal direction may preferably be parallel to the X-axis of the spatially fixed coordinate system, or it may be inclined with respect to the X-axis. The X, Y, and Z axes of the spatially fixed coordinate system are perpendicular to each other. In other words, the spatially fixed coordinate system is a Cartesian coordinate system in three-dimensional space.

[0007] The longitudinal direction may preferably be the direction in which the cooling structure has its longest dimension. The longitudinal direction of the cooling structure preferably corresponds to the direction of extension of the repeated U-shaped profile. The trigonometric function can be, for example, a sine function. Within the scope of this invention, the legs can also be called side walls.

[0008] Preferably, the height of the periodically repeating U-shaped profile is 3.7 mm to 4.5 mm, and particularly preferably 4 mm. The height of the U-shaped profile corresponds to the dimension of the U-shaped profile in the height direction perpendicular to the repeating direction. Advantageously, the height of the U-shaped profile corresponds to the height of the cooling structure. This specifically means that the cooling structure has a constant height.

[0009] Preferably, the period of the periodically repeating U-shaped profile is 2 mm to 3.1 mm, and particularly preferably 2.8 mm. It should be understood that the period of the periodically repeating U-shaped profile is a dimension in the direction of repetition. Furthermore, it should be understood that the period between the first end (side end) and the second end (side end) of the cooling structure is constant in the direction of repetition. In other words, this specifically means that the periodically repeating U-shaped profile is regularly repeated.

[0010] Preferably, the period of the trigonometric function is 5.1 mm to 6 mm, and particularly preferably 5.5 mm. It should be understood that the period of the trigonometric function is the lengthwise dimension. Preferably, the amplitude of the trigonometric function is 0.25 mm to 0.8 mm, and particularly preferably 0.4 mm. The amplitude of the trigonometric function corresponds to the maximum distance of the trigonometric function from the reference position of the trigonometric function, which is located midway between the highest and lowest function values ​​of the trigonometric function.

[0011] Preferably, the material thickness of the periodically repeating U-shaped profile is 0.2 mm to 0.4 mm, and particularly preferably 0.3 mm. In other words, the material thickness of the corrugated legs is preferably 0.2 mm to 0.4 mm, and particularly preferably 0.3 mm. The periodically repeating profile advantageously has a constant material thickness.

[0012] The previously presented value ranges each contribute to a good balance between the heat transfer performance achieved and the resulting pressure drop. Particularly preferred values ​​for each of the above parameters (height of the periodically repeating U-shaped profile, period of the periodically repeating U-shaped profile, period of the trigonometric function, amplitude of the trigonometric function, and material thickness of the periodically repeating profile) achieve the optimal balance between the heat transfer performance achieved and the resulting pressure drop for each parameter.

[0013] According to a particularly preferred exemplary embodiment of the present invention, the height of the periodically repeating U-shaped profile is 4 mm, the period of the trigonometric function is 5.5 mm, the amplitude of the trigonometric function is 0.8 mm, and the material thickness of the periodically repeating U-shaped profile is 0.3 mm. This form of the cooling structure has the advantage that the balance between the heat transfer performance achieved and the pressure drop caused is optimal.

[0014] Within the scope of the present invention, a U-shaped profile may preferably represent a part of a cooling structure comprising two (adjacent) legs, two first connection regions, and one second connection region. The second connection region connects the two legs to each other, and the first connection region connects each U-shaped profile to an adjacent U-shaped profile (a repeating unit of the U-shaped profile). The first and second connection regions are preferably parallel to a plane perpendicular to the height direction. In the assembled state of the cooling structure within a fluid-flowable cooler in which power electronics equipment is placed, the first connection region is closer to the power electronics equipment than the second connection region.

[0015] The repeated U-shaped profile is preferably a rounded profile. This specifically means that the transition between the leg and the connecting region (first or second connecting region) is rounded. In other words, the leg transitions to the first or second connecting region with a rounded radius. However, the repeated U-shaped profile may also be a profile with rounded corners at the aforementioned locations, i.e., a profile without rounding.

[0016] According to one embodiment of the present invention, the cooling structure is formed such that all cross-sections of the cooling structure have equal cross-sectional areas in a cross-section including a plane having a normal vector perpendicular to the iteration direction. Alternatively, the cooling structure is formed such that not all cross-sections of the cooling structure have equal cross-sectional areas in a cross-section including a plane having a normal vector perpendicular to the iteration direction.

[0017] Cooling structures can be manufactured by stamping, roll forming, or extrusion processes. Within the scope of the present invention, the cooling structure is preferably understood as a structure that increases surface area, guides flow, and increases heat transfer.

[0018] Within the scope of the present invention, since cooling fins are formed by repeated U-shaped profiles, the cooling structure can also be called a cooling fin structure. As already described above, the cooling structure causes turbulence in the flowing fluid, and can therefore also be specifically called a turbulence generator.

[0019] The flow direction of the cooler corresponds, in particular, to the main flow direction of the fluid used as a coolant, which flows through through-openings formed through the cooling structure. Here, the main flow direction is, in particular, the direction in which the fluid primarily flows, i.e., the direction in which the velocity component of the fluid is greater than the velocity component of the fluid in the direction perpendicular to the main flow direction. The main flow direction may preferably correspond to the direction in which the fluid is introduced into the cooler through which the fluid flows.

[0020] The cooling structure is preferably formed from and / or coated with a material having a thermal conductivity greater than 200 W / (m·K), at least partially, and especially entirely. Advantageously, the cooling structure may be formed from or coated with aluminum, at least partially, and especially entirely.

[0021] Fluid-flowable coolers can also be used to cool components other than power electronics equipment that are located on the cooler in power electronics devices, such as EMC filters, condensers, or busbars.

[0022] Furthermore, the present invention relates to a fluid-flowable cooler for cooling power electronics equipment. The fluid-flowable cooler includes the cooling structure, a first metal component, and a second metal component as described above. The first metal component and the second metal component are connected to each other to define a cooling channel, and the cooling structure is positioned within the cooling channel. The direction of the cooling channel, i.e., the direction in which the cooling channel extends, is preferably parallel to the longitudinal direction of the cooling structure, or inclined with respect to the longitudinal direction, or parallel to the longitudinal axis of the spatially fixed coordinate system described above.

[0023] The first and second metal components advantageously form a housing, which defines and, in particular, surrounds a cooling channel. The cooling channel corresponds in particular to the internal space of the housing. Preferably, the inlet and outlet for the fluid used as a coolant are located directly in the housing.

[0024] The first metal part and the second metal part may preferably be connected to each other directly or indirectly. Direct connection means, in particular, that only a connecting layer, in particular a connecting brazed layer, is present between the first metal part and the second metal part. Indirect connection means, in particular, that at least one further metal part is provided between the first metal part and the second metal part, and the first metal part is connected to the second metal part via at least one further metal part, a connecting layer, in particular a connecting brazed layer, between the first metal part and at least one further metal part, and a connecting layer, in particular a connecting brazed layer, between the second metal part and at least one further metal part.

[0025] The first metal part and / or the second metal part are preferably formed as sheet metal. A further aspect of the present invention relates to a power electronics device including the aforementioned fluid-flowable cooler for cooling a power electronics device and a power electronics device disposed in the fluid-flowable cooler. Heat generated by the power electronics device during operation can be efficiently dissipated by the fluid-flowable cooler.

[0026] The power electronics device can preferably include at least one power module having a power substrate. The at least one power module is fixed to / on a first metal part of the fluid-flowable cooler by the power substrate.

[0027] The power substrate can preferably be formed of copper and / or ceramic (AMB / DBC power substrate, AMB: active metal brazing, DBC: direct copper bonding). Due to the low thermal resistance between the power substrate and the cooler, particularly the first metal part, the power substrate can preferably be joined to the cooler, particularly the first metal part, by a soft brazing process, and optionally a sintering process. This means that the power module is preferably joined to the fluid-flowable cooler or the first metal part by a layer (and thus correspondingly a soft brazing layer or a sintering layer) generated by a soft brazing process or a sintering process.

[0028] The power module preferably includes one or more power semiconductors. The power semiconductors generate heat during operation of the power module, and this heat can be dissipated by the cooler.

[0029] Furthermore, the present invention relates to a cooling structure for a fluid-flowable cooler, in particular the aforementioned cooling structure formed from a U-shaped profile that is periodically repeated in a repeating direction, wherein the U-shaped profile includes corrugated legs, the corrugated legs extending in the longitudinal direction of the cooling structure and formed according to a trigonometric function. The method includes the step of extruding the repeating U-shaped profile in an extrusion direction along a trigonometric function, wherein the extrusion direction is perpendicular to the repeating direction, or tangential to the trigonometric function, or located between these two directions. The expression "between these two directions" means, in particular, that the extrusion direction is between the tangent to each of the trigonometric functions and the perpendicular to the repeating direction.

[0030] The expression that a U-shaped profile is extruded along a trigonometric function preferably means that the geometric centroid of the U-shaped profile moves along / on the drawing of the geometric function.

[0031] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the attached drawings. [Brief explanation of the drawing]

[0032] [Figure 1] This is a schematic simplified cross-sectional view of a power electronics device according to the present invention, comprising power electronics equipment and a cooler according to the present invention, which includes a cooling structure according to a first exemplary embodiment of the present invention. [Figure 2] This is a schematic simplified perspective view of a cooling structure according to a first exemplary embodiment of the present invention. [Figure 3] This is a simplified diagram illustrating a manufacturing method according to the present invention for a cooling structure according to a first exemplary embodiment, and the cooling structure is shown in a plan view. [Figure 4] This is a simplified diagram illustrating a method for manufacturing a cooling structure according to a second exemplary embodiment, wherein the cooling structure is shown in a plan view. [Figure 5]This is a schematic simplified cross-sectional view of a power electronics device according to the present invention, comprising power electronics equipment and a cooler according to a third exemplary embodiment, including a cooling structure from Figure 2. [Modes for carrying out the invention]

[0033] The power electronics device 1000 according to the present invention will be described below with reference to Figures 1 to 3. The power electronics device 1000 includes a power electronics device 200 and a cooler 100 equipped with a cooling structure 1 according to a first exemplary embodiment of the present invention.

[0034] As can be seen from Figure 1, the power electronics device 200 includes a power module 210, which may also be called a power electronics assembly. The power module 210 comprises a circuit board 204, conductor tracks 203, 205, and power semiconductors 201. The conductor tracks 203, 205 are formed as copper conductor tracks in particular, and the circuit board 204 is preferably formed from ceramic.

[0035] The power semiconductor 201 is attached to the conductor track 203 by a layer 202, where the layer 202 is formed in particular as a brazed or sintered layer. Conductor tracks 203 and 205, together with the circuit board 204, form the power board 208. The power board 208 is bonded to the first metal component 101 of the cooler 100, in particular the housing 110 of the cooler 100, by a layer 206 (and therefore correspondingly a brazed layer or sintered layer) produced by a brazing or sintering process.

[0036] The housing 110 of the cooler 100 further includes a second metal part 102, which is connected to the first metal part 101 by a layer (connecting layer) 103 specifically formed as a brazed layer. Both the first metal part 101 and the second metal part 102 are preferably aluminum parts.

[0037] Furthermore, Figure 1 shows that the first metal part 101 is the upper part of the housing 110, and the second metal part 102 is the lower part of the housing 110. The first metal part 101 faces the power module 210, and the second metal part 102 faces away from the power module 210. In addition, in this exemplary embodiment, the first metal part 101 is formed in a plate shape, and the second metal part 102 has a plate-shaped region and a region with a trapezoidal cross-section. However, the first metal part 101 and the second metal part 102 may have other shapes. The second metal part 102 can be advantageously manufactured by deep drawing.

[0038] Advantageously, an intervening layer 107 is present between layer 206 and the cooler 100, particularly the first metal component 101, the intervening layer 107 being firmly connected to the first metal component 101 and allowing wetting of layer 206. The intervening layer 107 is an optional feature of the power electronics device 1000 and can be considered in particular as a separate component or as part of the housing 110 of the cooler 100.

[0039] The first metal part 101 and the second metal part 102, which form the housing 110 of the cooler 100 when joined together, define the internal space that acts as the cooling channel 111 of the cooler 100.

[0040] The cooling structure 1 is positioned within the cooling channel 111, and the cooling structure 1 acts as a structure that increases the surface area, guides the flow of the fluid used as a coolant, and enhances heat transfer. The cooling structure 1 is advantageously joined to the first metal part 101 and the second metal part 102 by layer 103.

[0041] As can be seen from Figures 1 and 2, the cooling structure 1 is formed from a U-shaped profile 10 that is periodically repeated in a repetition direction 501. The repetition direction 501 is perpendicular to the flow direction 500 and corresponds in particular to the width direction of the cooler 100. The flow direction 500 corresponds to the main flow direction of the fluid used as a coolant when it flows through the cooling channel 111, in particular the through-opening 14 (Figure 1) formed by the repetition U-shaped profile 10. The flow direction 500 further corresponds to the cooling channel direction, which is the direction in which the cooling channel 11 essentially extends. In this exemplary embodiment, the U-shaped profile 10 is repeated six times, and the cooling structure 1 is provided with six repetition units 19 of the U-shaped profile 10, or in other words, six U-shaped profiles connected to one another.

[0042] Figure 2 also shows the longitudinal direction 502 and the height direction 503 in addition to the iterative direction 501. In this exemplary embodiment, the longitudinal direction 502 is inclined with respect to the iterative direction 501 (i.e., not perpendicular). The height direction 503 is perpendicular to the iterative direction 501 and the longitudinal direction 502. As is evident from Figure 3, the longitudinal direction 502 is in particular parallel to the line 509 connecting the geometric centroid 508 of the cross section of the U-shaped profile 10 at the first end 11 of the cooling structure 1 and the geometric centroid 510 of the cross section of the U-shaped profile 10 at the second end 12 of the cooling structure 1.

[0043] Figure 2 also shows a spatially fixed orthogonal three-dimensional coordinate system. The iteration direction 501 is parallel to the Y-axis 601 of the coordinate system, and the height direction 503 is parallel to the Z-axis of the coordinate system 603. The longitudinal direction 502 is inclined with respect to the X-axis 602 of the coordinate system.

[0044] Referring to Figures 1 and 2, the repeating U-shaped profile 10 has corrugated legs 15, a first connection region 16, and a second connection region 17. The first connection region 16 is the upper region of the corrugated legs 15 and connects two adjacent corrugated legs 15 of adjacent repeating units 19 of the U-shaped profile 10 to each other, while the second connection region 17 is the lower region of the legs 15 and connects adjacent legs 15 of the same repeating unit 19 of the U-shaped profile 10 to each other. The first connection region 16 is closer to the power electronics equipment 200 than the second connection region 17. In particular, the corrugated legs 15 of each repeating unit 19 are connected to each other by the second connection region 16. Furthermore, the corresponding first connection regions 16 of the two repeating units 19 connect each repeating unit 19 of the U-shaped profile 10 to adjacent repeating units of the U-shaped profile 10, in particular, the waveform legs 15 of each repeating unit 19 of the U-shaped profile 10 are connected to the corresponding waveform legs 15 of adjacent repeating units 19 of the U-shaped profile 10.

[0045] In this exemplary embodiment, the repeated profile 10 is rounded. This means that each leg 15 transitions to the corresponding first connection region 16 and the corresponding second connection region 17 with a rounded radius.

[0046] In order to achieve a good balance between the heat transfer between the fluid used as a coolant and the cooling structure 1, and the pressure drop caused by the cooling structure 1, the cooling structure 1 is formed as follows.

[0047] The height 401 of the repeating U-shaped profile 10 or cooling structure 1 is 3.7 mm to 4.5 mm, and is particularly preferably 4 mm. The period 402 of the periodically repeating U-shaped profile 10 is 2 mm to 3.1 mm, and is particularly preferably 2.8 mm. The period 403 of the trigonometric function 13 is 5.1 mm to 6 mm, and is particularly preferably 5.5 mm. Furthermore, the amplitude 404 of the trigonometric function 13 is 0.25 mm to 0.8 mm, and is particularly preferably 0.4 mm. Furthermore, the material thickness 405 of the periodically repeating U-shaped profile or cooling structure 1 is 0.2 mm to 0.4 mm, and is particularly preferably 0.3 mm.

[0048] It should be noted that the length of the cooling structure 1 is preferably matched to the length of the power module 10. To assist heat dissipation from the power module 210 by a fluid used as a coolant, the cooling structure 1 is formed from and / or coated with a material having a thermal conductivity greater than 200 W / (m·K), at least partially, and especially entirely. Advantageously, the cooling structure 1 may be formed from or coated with aluminum, at least partially, and especially entirely.

[0049] Figure 3 shows a simplified diagram illustrating a method for manufacturing the cooling structure 1 according to the first exemplary embodiment. In particular, Figure 3 shows the trigonometric function 13 graphically. Furthermore, rectangles are drawn representing each of the regions of the cooling structure 1 as viewed from above.

[0050] According to this manufacturing method, the repeated U-shaped profile 10 may be extruded along the trigonometric function 13 in an extrusion direction 504 that is tangential to the trigonometric function 13. Note that the extrusion direction 504 does not have a fixed orientation and always proceeds tangentially to the trigonometric function 13.

[0051] Therefore, in this exemplary embodiment, the cooling structure 1 is formed as an extruded part in which the longitudinal direction 502 is inclined with respect to the iterative direction 501 (at an angle other than 90 degrees). According to this manufacturing method, the cooling structure 1 is formed such that, in a cross-section including a plane having a normal vector perpendicular to the repetition direction 501, not all cross-sections of the cooling structure 1 have the same cross-sectional area.

[0052] The cooling structure 1 according to the present invention, and therefore also the cooler 100 and power electronics device 1000, is characterized by a good relationship between the thermal performance in the cooling channel 111 and the resulting pressure loss, due to the above-described form of the repeated U-shaped profile 10.

[0053] Figure 4 is a simplified diagram illustrating a method for manufacturing the cooling structure 1 according to a second exemplary embodiment. Similar to Figure 3, the trigonometric function 13 is also shown graphically in Figure 4. Furthermore, rectangles are drawn representing each of the regions of the cooling structure 1 as viewed from above.

[0054] To manufacture the cooling structure 1 according to the second embodiment, the repeating U-shaped profile 10 can be extruded in an extrusion direction 504 along a trigonometric function 13, which, unlike the method for manufacturing the cooling structure 1 according to the first exemplary embodiment, is perpendicular to the repeating direction 501, or in other words, parallel to the cooling channel direction, rather than tangential to the trigonometric function 13. Here, the extrusion direction 504 is (always) parallel to the longitudinal direction 502.

[0055] According to this manufacturing method, the cooling structure 1 is formed such that all cross-sections of the cooling structure 1 have the same cross-sectional area in a cross-section that includes a plane having a normal vector perpendicular to the repetition direction 501.

[0056] Figure 5 shows a power electronics device 1000 according to a third exemplary embodiment of the present invention. The power electronics device 1000 according to the third exemplary embodiment differs from the first exemplary embodiment in that the first metal component 101, which is the upper portion and therefore faces the power module 210, has a plate-shaped region and a trapezoidal cross-section region, and the second metal component 102, which is the lower portion and therefore faces the power module 210, is plate-shaped.

[0057] This configuration of housing 110 can be advantageous when space is limited in the immediate vicinity of the power module 210. It should be noted that the housing 110 of the cooler 100 according to the third exemplary embodiment can also be combined with the cooling structure 1 according to the manufacturing method of the second exemplary embodiment.

[0058] In the exemplary embodiment described above, the power electronics device 200 includes only one power module 210. However, it is also possible for the power electronics device 200 to have two or more power modules 210. For this purpose, a corresponding number of cooling structures 1 can be placed in the cooling channels 111 of the cooler 100, and each cooling structure 1 is assigned to one of the power modules 210.

Claims

1. A cooling structure (1) for a fluid-flowable cooler (100), wherein the cooling structure (1) is formed from a U-shaped profile that is periodically repeated in a repeating direction (501), the U-shaped profile includes corrugated legs (15), the corrugated legs (15) extend in the longitudinal direction (502) of the cooling structure (1) and are formed according to trigonometric functions (13).

2. The cooling structure (1) according to claim 1, wherein the height (401) of the periodically repeating U-shaped profile (10) is 3.7 mm to 4.5 mm, preferably 4 mm.

3. The cooling structure (1) according to claim 1, wherein the period (402) of the periodically repeating U-shaped profile (10) is 2 mm to 3.1 mm, preferably 2.8 mm.

4. The cooling structure (1) according to claim 1, wherein the period (403) of the trigonometric function (13) is 5.1 mm to 6 mm, preferably 5.5 mm.

5. The cooling structure (1) according to claim 1, wherein the amplitude (404) of the trigonometric function (13) is 0.25 mm to 0.8 mm, preferably 0.4 mm.

6. The cooling structure (1) according to claim 1, wherein the material thickness of the periodically repeated U-shaped profile (10) is 0.2 mm to 0.4 mm, preferably 0.3 mm.

7. The cooling structure (1) according to claim 1, wherein the cooling structure (1) is formed such that all cross-sections of the cooling structure (1) have the same cross-sectional area in a cross-section including a plane having a normal vector perpendicular to the repetition direction (501), or is formed such that all cross-sections of the cooling structure (1) do not have the same cross-sectional area in a cross-section including a plane having a normal vector perpendicular to the repetition direction (501).

8. A fluid-flowable cooler (100) for cooling power electronics equipment (200), A cooling structure (1) according to any one of claims 1 to 7, The first metal part (101) and The cooling structure (1) is located within the cooling channel (111), and includes a second metal part (102), wherein the first metal part (101) and the second metal part (102) are connected to each other to define a cooling channel (111), and the cooling structure (1) is located within the cooling channel (111). Cooler (100).

9. A fluid-flowable cooler (100) according to claim 8 for cooling power electronics equipment, Power electronics equipment (200) placed in the aforementioned fluid-flowable cooler (100) and A power electronics device (1000) including [a specific component].

10. A method for manufacturing a cooling structure (1) for a fluid-flowable cooler (100), wherein the cooling structure (1) is formed from a U-shaped profile (10) that is periodically repeated in a repeating direction, the U-shaped profile (10) includes corrugated legs (15), the corrugated legs (15) extend in the longitudinal direction of the cooling structure (1) and are formed according to a trigonometric function (13), the repeating U-shaped profile (10) is extruded in an extrusion direction along the trigonometric function (13), the extrusion direction being perpendicular to the repeating direction (501), or tangential to the trigonometric function (13), or located between these two directions.

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