Resin composition and electronic component device

Abstract

To provide a resin composition capable of yielding a cured product that balances high relative dielectric constant with low dielectric loss tangent and exhibits superior flexural strength, and an electronic component device fabricated using the resin composition.SOLUTION: A resin composition contains a curable resin, an inorganic filler, and coupling agents. The inorganic filler contains calcium titanate particles. The coupling agents include a silane coupling agent and an aluminate coupling agent.SELECTED DRAWING: None

Description

[Technical Field]

[0001] This disclosure relates to resin compositions and electronic component devices. [Background technology]

[0002] In recent years, in the field of wireless communication using electronic components and devices, the frequency of radio waves used has been increasing along with the increase in the number of channels and the amount of information transmitted. Of the transmission losses of electrical signals used in wireless communication, the amount of loss (dielectric loss) related to insulators such as encapsulating materials contained in electronic components and devices increases in proportion to the product of the frequency of the radio wave, the square root of the dielectric constant of the insulator (√εr), and the dielectric loss tangent of the insulator. In other words, as the frequency of radio waves increases, reducing the relative permittivity or dielectric loss tangent of the insulator becomes increasingly important from the viewpoint of suppressing the transmission loss of electrical signals. On the other hand, in an insulator, the wavelength of radio waves is shortened to 1 / √εr. Therefore, from the viewpoint of miniaturizing electronic components and devices, a higher relative permittivity of the insulator is advantageous. Therefore, from the perspective of achieving both high frequency and miniaturization of electronic components and devices, there is a need for measures to increase the relative permittivity while keeping the dielectric loss tangent of the insulator low.

[0003] As a measure to increase the dielectric constant of an insulator, for example, Patent Documents 1 to 3 describe epoxy resin compositions containing a titanate compound with a high dielectric constant as an inorganic filler. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2015-036410 [Patent Document 2] Japanese Patent Publication No. 2017-057268 [Patent Document 3] Japanese Patent Publication No. 2018-141052 [Overview of the project] [Problems that the invention aims to solve]

[0005] As a result of our investigations, we found that epoxy resin compositions containing titanate compounds as inorganic fillers, as described in Patent Documents 1 to 3, have room for improvement in terms of dielectric loss tangent and physical strength when cured. This disclosure is made in view of the above circumstances, and aims to provide a resin composition that can achieve both a high relative permittivity and a low dielectric loss tangent, and yield a cured product with excellent bending strength, and an electronic component device that can be obtained using this resin composition. [Means for solving the problem]

[0006] The following embodiments are included as specific means for solving the aforementioned problems. <1> It comprises a curable resin, an inorganic filler, and a coupling agent. The inorganic filler contains calcium titanate particles. The coupling agent is a resin composition comprising a silane coupling agent and an aluminate coupling agent. <2> The molar ratio of the silane coupling agent to the aluminate coupling agent (silane coupling agent:aluminate coupling agent) is 75:25 to 35:65. <1> The resin composition described above. <3> The inorganic filler further contains alumina particles. <1> or <2> The resin composition described above. <4> The curable resin includes an epoxy resin. <1> ~ <3> A resin composition according to any one of the items. <5> Further containing an active ester compound, <1> ~ <4> A resin composition according to any one of the items. <6> Support member and An electronic component arranged on the support member, The aforementioned electronic component is sealed <1> ~ <5> A cured product of the resin composition described in any one of the items, An electronic component device equipped with the following features. <7> The aforementioned electronic component includes an antenna. <6> The electronic component device described above. [Effects of the Invention]

[0007] This disclosure provides a resin composition that can achieve both a high relative permittivity and a low dielectric loss tangent, and yields a cured product with excellent bending strength, as well as an electronic component device obtained using this resin composition. [Modes for carrying out the invention]

[0008] In this disclosure, the term "process" includes not only processes that are independent of other processes, but also processes that cannot be clearly distinguished from other processes, provided that the purpose of such process is achieved. In this disclosure, the numerical range indicated using "~" includes the numbers before and after "~" as the minimum and maximum values, respectively. In numerical ranges described in stages within this disclosure, the upper or lower limit of one numerical range may be replaced with the upper or lower limit of another numerical range described in stages. Furthermore, in numerical ranges described within this disclosure, the upper or lower limit of that range may be replaced with the values ​​shown in the examples. In this disclosure, each component may contain multiple types of the corresponding substance. If multiple types of the substance corresponding to each component are present in the composition, the content or amount of each component means the total content or amount of the multiple types of substances present in the composition, unless otherwise specified. In this disclosure, each component may contain multiple types of particles. If multiple types of particles corresponding to each component are present in the composition, the particle size of each component refers to the value for a mixture of such multiple types of particles present in the composition, unless otherwise specified.

[0009] The following describes in detail the forms for implementing this disclosure. However, this disclosure is not limited to the following embodiments. In the following embodiments, the components (including elemental steps, etc.) are not essential unless otherwise specified. The same applies to numerical values ​​and their ranges, and do not limit this disclosure.

[0010] <Resin composition> A resin composition according to one embodiment of the present disclosure is Comprising a curable resin, an inorganic filler, and a coupling agent, the inorganic filler comprises calcium titanate particles, the coupling agent comprises a silane coupling agent and an aluminate coupling agent.

[0011] A resin composition according to an embodiment of the present disclosure includes calcium titanate particles as an inorganic filler. As a result of studies conducted by the present inventors, it has been found that a cured product of a resin composition containing calcium titanate particles as an inorganic filler has a lower dielectric loss tangent than a cured product of a resin composition containing other titanic acid compound particles such as barium titanate particles. That is, since the resin composition according to an embodiment of the present disclosure contains calcium titanate particles as an inorganic filler, the cured product thereof has a high dielectric constant, while an increase in the dielectric loss tangent is suppressed to a low level.

[0012] A resin composition according to an embodiment of the present disclosure includes a silane coupling agent and an aluminate coupling agent as coupling agents. As a result of studies conducted by the present inventors, it has been found that when the resin composition contains both a silane coupling agent and an aluminate coupling agent as coupling agents, the bending strength of the cured product is improved compared to when the resin composition contains only either one of a silane coupling agent or an aluminate coupling agent as a coupling agent. Although the reason for this is not necessarily clear, it is considered as follows. The reason why the bending strength of a cured product of a resin composition containing a silane coupling agent and an aluminate coupling agent is improved compared to that of a resin composition containing only a silane coupling agent is considered to be that in the resin composition, the aluminate coupling agent is more likely to approach the inorganic filler, and contributes to improving the wettability of the inorganic filler to the resin component. The reason why the flexural strength of a cured resin composition containing both a silane coupling agent and an aluminate coupling agent is improved compared to a resin composition containing only an aluminate coupling agent is thought to be that the silane coupling agent, which has superior adhesion at the interface with the resin, contributes to improving the adhesion between the inorganic filler and the resin component.

[0013] (curable resin) The resin composition in this embodiment includes a curable resin. The curable resin may be either a thermosetting resin or a photocurable resin, but from the viewpoint of mass production, a thermosetting resin is preferable. Examples of thermosetting resins include epoxy resins, phenolic resins, melamine resins, urea resins, unsaturated polyester resins, alkyd resins, urethane resins, polyimide resins such as bismaleimide resins, polyamide resins, polyamideimide resins, silicone resins, and acrylic resins. From the viewpoint of moldability and electrical properties, the thermosetting resin is preferably at least one selected from the group consisting of epoxy resins and polyimide resins, more preferably at least one selected from the group consisting of epoxy resins and bismaleimide resins, and even more preferably an epoxy resin. The resin composition may contain only one type of curable resin, or it may contain two or more types. Below, epoxy resin will be described as an example of a curable resin.

[0014] -Epoxy resin- The resin composition preferably contains an epoxy resin as the curable resin. When the resin composition contains epoxy resin as the curable resin, the content of epoxy resin relative to the total curable resin is preferably 80% by mass or more, more preferably 90% by mass or more, and even more preferably 95% by mass or more. The type of epoxy resin is not particularly limited as long as it has epoxy groups in its molecule.

[0015] Specifically, the epoxy resins include: novolac-type epoxy resins (phenol novolac-type epoxy resins, orthocresol novolac-type epoxy resins, etc.) which are obtained by condensing or co-condensing a novolac resin obtained by condensing or co-condensing a novolac resin obtained by phenol compounds selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene, with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, or propionaldehyde, under an acidic catalyst; triphenylmethane-type epoxy resins which are obtained by condensing or co-condensing a triphenylmethane-type phenol resin obtained by condensing or co-condensing the above phenol compound with an aromatic aldehyde compound such as benzaldehyde or salicylaldehyde, under an acidic catalyst; and novolac resins obtained by co-condensing the above phenol compound and naphthol compound with an aldehyde compound under an acidic catalyst. Copolymer epoxy resins, which are resins that have been epoxidized; diphenylmethane-type epoxy resins, which are diglycidyl ethers of bisphenol A, bisphenol F, etc.; biphenyl-type epoxy resins, which are diglycidyl ethers of alkyl-substituted or unsubstituted biphenols; stilbene-type epoxy resins, which are diglycidyl ethers of stilbene-based phenol compounds; sulfur atom-containing epoxy resins, which are diglycidyl ethers of bisphenol S, etc.; epoxy resins, which are glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; glycidyl ester-type epoxy resins, which are glycidyl esters of polycarboxylic acid compounds such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; glycidylamine-type epoxy resins, in which the active hydrogen bonded to the nitrogen atom of aniline, diaminodiphenylmethane, isocyanuric acid, etc., is replaced with a glycidyl group; dicyclopentadiene-type epoxy resins, which are co-condensed resins of dicyclopentadiene and phenol compounds that have been epoxidized;Alicyclic epoxy resins such as vinylcyclohexene diepoxide, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, and 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane, which have epoxidized olefin bonds within the molecule; paraxylylene-modified epoxy resins, which are glycidyl ethers of paraxylylene-modified phenol resins; metaxylylene-modified epoxy resins, which are glycidyl ethers of metaxylylene-modified phenol resins; terpene-modified epoxy resins, which are glycidyl ethers of terpene-modified phenol resins; and dicyclopentadiene-modified phenol resins, which are glycidyl ethers of dicyclo Examples of epoxy resins include: pentadiene-modified epoxy resins; cyclopentadiene-modified epoxy resins, which are glycidyl ethers of cyclopentadiene-modified phenolic resins; polycyclic aromatic ring-modified epoxy resins, which are glycidyl ethers of polycyclic aromatic ring-modified phenolic resins; naphthalene-type epoxy resins, which are glycidyl ethers of naphthalene ring-containing phenolic resins; halogenated phenol novolac-type epoxy resins; hydroquinone-type epoxy resins; trimethylolpropane-type epoxy resins; linear aliphatic epoxy resins obtained by oxidizing olefin bonds with peracids such as peracetic acid; and aralkyl-type epoxy resins, which are epoxidized aralkyl-type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins. Furthermore, epoxides of acrylic resins can also be cited as epoxy resins. These epoxy resins may be used individually or in combination of two or more types.

[0016] The epoxy equivalent (molecular weight / number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of balancing various properties such as moldability, reflow resistance, and electrical reliability, the epoxy equivalent of the epoxy resin is preferably 100 g / eq to 1000 g / eq, and more preferably 150 g / eq to 500 g / eq. The epoxy equivalent of the epoxy resin shall be the value measured according to the method conforming to JIS K 7236:2009.

[0017] When the epoxy resin is solid, the softening point or melting point of the epoxy resin is not particularly limited. From the viewpoint of moldability and reflow resistance, the softening point or melting point of the epoxy resin is preferably 40°C to 180°C, and from the viewpoint of ease of handling during the preparation of the resin composition, it is more preferably 50°C to 130°C. The melting point or softening point of the epoxy resin shall be the value measured by differential scanning calorimetry (DSC) or by a method (ring-sphere method) in accordance with JIS K 7234:1986.

[0018] When the resin composition contains epoxy resin as a curable resin, the mass percentage of epoxy resin in the total amount of the resin composition is preferably 0.5% to 30% by mass, more preferably 2% to 20% by mass, and even more preferably 3.5% to 13% by mass, from the viewpoint of strength, fluidity, heat resistance, moldability, etc.

[0019] -Hardening agent- If the resin composition includes an epoxy resin as the curable resin, the resin composition may further include a curing agent.

[0020] From the viewpoint of reducing the dielectric loss tangent of the cured product, it is preferable that the resin composition contains an active ester compound as a curing agent. The active ester compound may be used alone or in combination of two or more types. Here, an active ester compound refers to a compound that has one or more ester groups that react with epoxy groups in one molecule and has the curing effect of epoxy resin. Note that when the curing agent contains an active ester compound, the curing agent may contain curing agents other than the active ester compound, or it may not contain curing agents other than the active ester compound.

[0021] Using an active ester compound as a curing agent allows for a lower dielectric loss tangent of the cured product compared to using other curing agents (e.g., phenolic curing agents). The reason for this is presumed to be as follows. In the reaction between epoxy resin and phenol curing agent, secondary hydroxyl groups are generated. In contrast, in the reaction between epoxy resin and activated ester compound, ester groups are generated instead of secondary hydroxyl groups. Since ester groups have lower polarity than secondary hydroxyl groups, a resin composition containing an activated ester compound as a curing agent can keep the dielectric loss tangent of the cured product lower than a resin composition containing only a curing agent that generates secondary hydroxyl groups. Furthermore, since polar groups in the cured product increase its water absorption, using an active ester compound as a curing agent can reduce the concentration of polar groups in the cured product, thereby suppressing its water absorption. By suppressing the water absorption of the cured product, that is, by reducing the content of H2O, a polar molecule, the dielectric loss tangent of the cured product can be further reduced.

[0022] The type of active ester compound is not particularly limited as long as it is a compound that has one or more ester groups in its molecule that react with epoxy groups. Examples of active ester compounds include phenol ester compounds, thiophenol ester compounds, N-hydroxyamine ester compounds, and esterified heterocyclic hydroxy compounds.

[0023] Examples of active ester compounds include ester compounds obtained from at least one aliphatic carboxylic acid and an aromatic carboxylic acid, and at least one aliphatic hydroxy compound and an aromatic hydroxy compound. Ester compounds in which an aliphatic compound is the polycondensation component tend to have excellent compatibility with epoxy resins due to the presence of an aliphatic chain. Ester compounds in which an aromatic compound is the polycondensation component tend to have excellent heat resistance due to the presence of an aromatic ring.

[0024] Specific examples of active ester compounds include aromatic esters obtained by the condensation reaction of aromatic carboxylic acids and phenolic hydroxyl groups. In particular, aromatic esters obtained by the condensation reaction of aromatic carboxylic acids and phenolic hydroxyl groups using a mixture of aromatic carboxylic acid components in which 2 to 4 hydrogen atoms of the aromatic ring are substituted with carboxyl groups (such as benzene, naphthalene, biphenyl, diphenylpropane, diphenylmethane, diphenyl ether, and diphenylsulfonic acid), monohydric phenols in which 1 hydrogen atom of the aforementioned aromatic ring is substituted with a hydroxyl group, and polyhydric phenols in which 2 to 4 hydrogen atoms of the aforementioned aromatic ring are substituted with hydroxyl groups as raw materials are preferred. That is, aromatic esters having structural units derived from the above aromatic carboxylic acid component, structural units derived from the above monohydric phenol, and structural units derived from the above polyhydric phenol are preferred.

[0025] Specific examples of active ester compounds include active ester resins having a structure obtained by reacting a phenol resin having a molecular structure in which a phenol compound is bonded via an aliphatic cyclic hydrocarbon group, as described in Japanese Patent Publication No. 2012-246367, with an aromatic dicarboxylic acid or its halide and an aromatic monohydroxy compound. The compound represented by the following structural formula (1) is preferred as the active ester resin.

[0026] [ka]

[0027] In structural formula (1), R 1 X is a hydrogen atom, a C1-C4 alkyl group, or a phenyl group; X is an unsubstituted benzene ring, an unsubstituted naphthalene ring, a benzene or naphthalene ring substituted with a C1-C4 alkyl group, or a biphenyl group; Y is a benzene ring, a naphthalene ring, or a benzene or naphthalene ring substituted with a C1-C4 alkyl group; k is 0 or 1; and n represents the average number of repetitions, ranging from 0.25 to 1.5.

[0028] Specific examples of compounds represented by structural formula (1) include the following example compounds (1-1) to (1-10). In the structural formula, t-Bu is a tert-butyl group.

[0029] [ka]

[0030] [ka]

[0031] Other specific examples of active ester compounds include the compound represented by the following structural formula (2) and the compound represented by the following structural formula (3), as described in Japanese Patent Publication No. 2014-114352.

[0032] [ka]

[0033] In structural formula (2), R 1 and R 2 Each of these is independently a hydrogen atom, a C1-C4 alkyl group, or a C1-C4 alkoxy group, and Z is an ester-forming structural site (z1) selected from the group consisting of an unsubstituted benzoyl group, an unsubstituted naphthoyl group, a benzoyl or naphthoyl group substituted with a C1-C4 alkyl group, and a C2-C6 acyl group, or a hydrogen atom (z2), and at least one of Z is an ester-forming structural site (z1).

[0034] In structural formula (3), R 1 and R 2Each of these is independently a hydrogen atom, a C1-C4 alkyl group, or a C1-C4 alkoxy group, and Z is an ester-forming structural site (z1) selected from the group consisting of an unsubstituted benzoyl group, an unsubstituted naphthoyl group, a benzoyl or naphthoyl group substituted with a C1-C4 alkyl group, and a C2-C6 acyl group, or a hydrogen atom (z2), and at least one of Z is an ester-forming structural site (z1).

[0035] Specific examples of compounds represented by structural formula (2) include the following example compounds (2-1) to (2-6).

[0036] [ka]

[0037] Specific examples of compounds represented by structural formula (3) include the following example compounds (3-1) to (3-6).

[0038] [ka]

[0039] Commercially available active ester compounds may be used. Examples of commercially available active ester compounds include: "EXB9451," "EXB9460," "EXB9460S," and "HPC-8000-65T" (manufactured by DIC Corporation) as active ester compounds containing a dicyclopentadiene-type diphenol structure; "EXB9416-70BK," "EXB-8," and "EXB-9425" (manufactured by DIC Corporation) as active ester compounds containing an aromatic structure; "DC808" (manufactured by Mitsubishi Chemical Corporation) as an active ester compound containing an acetylated phenol novolac; and "YLH1026" (manufactured by Mitsubishi Chemical Corporation) as an active ester compound containing a benzoylated phenol novolac.

[0040] The ester equivalent (molecular weight / number of ester groups) of the active ester compound is not particularly limited. From the viewpoint of balancing various properties such as moldability, reflow resistance, and electrical reliability, 150 g / eq to 400 g / eq is preferred, 170 g / eq to 300 g / eq is more preferred, and 200 g / eq to 250 g / eq is even more preferred. The ester equivalent of the active ester compound shall be the value measured by the method in accordance with JIS K 0070:1992.

[0041] The curing agent may include curing agents other than active ester compounds. The type of other curing agent is not particularly limited and can be selected according to the desired properties of the resin composition. Examples of other curing agents include phenol curing agents, amine curing agents, acid anhydride curing agents, polymer captan curing agents, polyaminoamide curing agents, isocyanate curing agents, and blocked isocyanate curing agents.

[0042] Specifically, as phenol curing agents, polyhydric phenol compounds such as resorcinol, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenols; novolac-type phenolic resins obtained by condensing or co-condensing at least one phenolic compound selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, aminophenol, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene, with aldehyde compounds such as formaldehyde, acetaldehyde, and propionaldehyde under an acidic catalyst; and those synthesized from the above phenolic compounds with dimethoxyp-xylene, bis(methoxymethyl)biphenyl, etc. Examples include aralkyl-type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins; paraxylylene-modified phenolic resins and metaxylylene-modified phenolic resins; melamine-modified phenolic resins; terpene-modified phenolic resins; dicyclopentadiene-type phenolic resins and dicyclopentadiene-type naphthol resins synthesized by copolymerization of the above phenolic compounds and dicyclopentadiene; cyclopentadiene-modified phenolic resins; polycyclic aromatic ring-modified phenolic resins; biphenyl-type phenolic resins; triphenylmethane-type phenolic resins obtained by condensation or co-condensation of the above phenolic compounds and aromatic aldehyde compounds such as benzaldehyde and salicylaldehyde under an acidic catalyst; and phenolic resins obtained by copolymerizing two or more of these. These phenolic curing agents may be used individually or in combination of two or more.

[0043] The functional group equivalents of other curing agents (hydroxyl group equivalents in the case of phenol curing agents) are not particularly limited. From the viewpoint of balancing various properties such as moldability, reflow resistance, and electrical reliability, the functional group equivalents of other curing agents are preferably 70 g / eq to 1000 g / eq, and more preferably 80 g / eq to 500 g / eq. The functional group equivalents of other curing agents (hydroxyl group equivalents in the case of phenol curing agents) shall be values ​​measured according to the method in accordance with JIS K 0070:1992.

[0044] The softening point or melting point of the curing agent is not particularly limited. From the viewpoint of moldability and reflow resistance, the softening point or melting point of the curing agent is preferably 40°C to 180°C, and from the viewpoint of handling during the manufacture of the resin composition, it is more preferably 50°C to 130°C. The melting point or softening point of the curing agent shall be a value measured in the same manner as the melting point or softening point of the epoxy resin.

[0045] The equivalent ratio of epoxy resin to curing agent (all curing agents if multiple types are used), i.e., the ratio of the number of functional groups in the curing agent to the number of functional groups in the epoxy resin (number of functional groups in curing agent / number of functional groups in epoxy resin), is not particularly limited. From the viewpoint of minimizing unreacted components, it is preferable to set it in the range of 0.5 to 2.0, and more preferably in the range of 0.6 to 1.3. From the viewpoint of moldability and reflow resistance, it is even more preferable to set it in the range of 0.8 to 1.2.

[0046] When the curing agent contains an active ester compound and other curing agents, the mass ratio of the active ester compound to the total amount of the active ester compound and other curing agents is preferably 40% by mass or more, more preferably 50% by mass or more, and even more preferably 60% by mass or more, from the viewpoint of keeping the dielectric loss tangent of the cured product low.

[0047] (Inorganic filler) The resin composition contains calcium titanate particles as an inorganic filler. The inclusion of calcium titanate particles as an inorganic filler in the resin composition increases the dielectric constant of the cured product. Furthermore, the dielectric loss tangent of the cured product is kept lower compared to cases containing other titanate compounds.

[0048] The content of calcium titanate particles in the resin composition is preferably 10% to 80% by mass, more preferably 20% to 70% by mass, and even more preferably 30% to 60% by mass, relative to the total inorganic filler.

[0049] The resin composition preferably further contains alumina particles as an inorganic filler. By including alumina particles as an inorganic filler in the resin composition, the thermal conductivity of the cured product is increased, improving heat dissipation.

[0050] The content of alumina particles in the resin composition is preferably 10% to 80% by mass, more preferably 20% to 70% by mass, and even more preferably 30% to 60% by mass, relative to the total inorganic filler.

[0051] The resin composition may further contain inorganic fillers other than calcium titanate particles and alumina particles as inorganic fillers. Other inorganic fillers besides calcium titanate particles and alumina particles include crystalline silica, fused silica, barium titanate, glass, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, fossterite, steatite, spinel, mullite, titania, talc, clay, mica, and other inorganic materials. The resin composition may contain an inorganic filler having a flame-retardant effect. Examples of inorganic fillers having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, composite metal hydroxides such as magnesium-zinc composite hydroxides, and zinc borate. Inorganic fillers other than calcium titanate particles and alumina particles may be used individually or in combination of two or more types. When the resin composition contains inorganic fillers other than calcium titanate particles and alumina particles, the content of these fillers is preferably 400% by mass or less, more preferably 30% by mass or less, and even more preferably 20% by mass or less, relative to the total amount of inorganic fillers.

[0052] The volume-average particle size of the inorganic filler is preferably 0.1 μm to 100 μm, more preferably 0.2 μm to 80 μm, and even more preferably 0.5 μm to 30 μm. The resin composition may contain multiple types of inorganic fillers with different volume-average particle sizes.

[0053] The volume-average particle size of the inorganic filler is defined as the particle size at 50% of the integrated value (volume-based) of the particle size distribution obtained by laser diffraction / scattering. The particle size distribution is measured, for example, as follows. First, an inorganic filler is added to a dispersion medium (water) in an amount ranging from 0.01% to 0.1% by mass, and dispersed in a bath-type ultrasonic cleaner for 5 minutes. Next, 5 ml of the resulting dispersion is injected into a cell, and the particle size distribution is measured at 25°C using a laser diffraction / scattering particle size distribution analyzer (Horiba, Ltd., LA920).

[0054] The inorganic filler content is preferably 40% to 90% by volume, more preferably 45% to 85% by volume, and even more preferably 50% to 80% by volume, relative to the entire resin composition.

[0055] The inorganic filler content (volume %) in a resin composition can be calculated from the mass and density of each material contained in the resin composition if the composition of the resin composition is known. If the composition of the resin composition is not known, the inorganic filler content (volume %) can be determined by the following method. Thin sections of cured resin compositions are imaged using a scanning electron microscope (SEM). An arbitrary area S is identified in the SEM image, and the total area A of the inorganic filler contained in area S is determined. The total area A of the inorganic filler is divided by area S and converted to a percentage (%), and this value is taken as the inorganic filler content (volume %) in the resin composition. The area S should be sufficiently large relative to the size of the inorganic filler. For example, it should be large enough to contain 100 or more inorganic fillers. The area S may also be the sum of multiple cross-sections. Inorganic fillers may exhibit uneven distribution in the direction of gravity during the curing of the resin composition. In such cases, when imaging with a scanning electron microscope (SEM), the entire direction of gravity of the cured material is imaged, and the area S encompassing the entire direction of gravity of the cured material is identified.

[0056] (Coupling agent) The resin composition contains a silane coupling agent and an aluminate coupling agent as coupling agents.

[0057] Specifically, as a silane coupling agent, Silane compounds having an amino group, such as N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethylbutylidene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, and hydrochloride salts of N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane; Silane compounds having a vinyl group, such as vinyltrimethoxysilane and vinyltriethoxysilane; Silane compounds having epoxy groups, such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, and 3-glycidoxypropyltriethoxysilane; Silane compounds having a styryl group, such as p-styryltrimethoxysilane; Silane compounds having a methacryloyl group, such as 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, and 3-methacryloxypropyltriethoxysilane; Silane compounds having an acryloyl group, such as 3-acryloxypropyltrimethoxysilane; Silane compounds having a ureido group, such as 3-ureidopropyltrialkoxysilane; Silane compounds having an isocyanate group, such as 3-isocyanate-propyltriethoxysilane; Examples include silane compounds having a mercapto group, such as 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane.

[0058] Among the silane compounds mentioned above, silane compounds having an amino group are preferred from the viewpoint of adhesion at the interface between the inorganic material and the resin. The resin composition may contain only one type of silane coupling agent or two or more types.

[0059] Specific examples of aluminate coupling agents include aluminate compounds having an alkoxide group, such as alkylacetacetate aluminum diisopropylate, and aluminate compounds having an acetylacetonate group, such as aluminum trisacetylacetonate.

[0060] The resin composition may contain only one type of aluminate coupling agent or two or more types.

[0061] The molar ratio (silane coupling agent:aluminate coupling agent) of the silane coupling agent and the aluminate coupling agent contained in the resin composition is preferably 75:25 to 35:65. When the molar ratio of the silane coupling agent to the aluminate coupling agent is within the above range, the flexural strength of the cured resin composition is effectively improved. The above molar ratio is more preferably 70:30 to 40:60, and even more preferably 60:40 to 40:60.

[0062] The resin composition may contain coupling agents other than silane coupling agents and aluminate coupling agents. Other coupling agents besides silane coupling agents and aluminate coupling agents include titanium compounds, aluminum chelate compounds, and aluminum / zirconium compounds. When the resin composition contains coupling agents other than silane coupling agents and aluminate coupling agents, the proportion of silane coupling agents and aluminate coupling agents to the total coupling agents is preferably 70% by mass or more, more preferably 80% by mass or more, and even more preferably 90% by mass or more.

[0063] The amount of coupling agent contained in the resin composition is preferably 0.05 to 5 parts by mass, and more preferably 0.1 to 2.5 parts by mass, per 100 parts by mass of inorganic filler.

[0064] [Various additives] In addition to the components described above, the resin composition may also contain various additives such as curing accelerators, colorants, ion exchangers, mold release agents, flame retardants, stress relievers, and fluidity imparters, as exemplified below. The resin composition may also contain, as necessary, various additives well known in the art, in addition to those exemplified below.

[0065] (Curing accelerator) The resin composition may contain a curing accelerator. The type of curing accelerator is not particularly limited and can be selected according to the type of curable resin, the desired properties of the resin composition, etc.

[0066] As curing accelerators used in resin compositions containing at least one selected from the group consisting of epoxy resins and polyimide resins as a curable resin, diazabicycloalkenes such as 1,5-diazabicyclo[4.3.0]nonene-5 (DBN) and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU), 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 2-ethyl-4-methylimidazole are used. Cyclic amidine compounds such as dazole and 2-heptadecylimidazole; derivatives of the cyclic amidine compounds; phenol novolac salts of the cyclic amidine compounds or their derivatives; these compounds with maleic anhydride, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1 Compounds having intramolecular polarization obtained by adding compounds with π bonds, such as quinone compounds like ,4-benzoquinone and phenyl-1,4-benzoquinone, and diazophenylmethane; cyclic amidinium compounds such as tetraphenylborate salt of DBU, tetraphenylborate salt of DBN, tetraphenylborate salt of 2-ethyl-4-methylimidazole, and tetraphenylborate salt of N-methylmorpholine; tertiary amine compounds such as pyridine, triethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; derivatives of the above tertiary amine compounds; ammonium salt compounds such as tetra-n-butylammonium acetate, tetra-n-butylammonium phosphate, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, and tetrapropylammonium hydroxide;Organic phosphines such as primary phosphines like ethylphosphine and phenylphosphine, secondary phosphines like dimethylphosphine and diphenylphosphine, triphenylphosphine, diphenyl(p-tolyl)phosphine, tris(alkylphenyl)phosphine, tris(alkoxyphenyl)phosphine, tris(alkyl·alkoxyphenyl)phosphine, tris(dialkylphenyl)phosphine, tris(trialkylphenyl)phosphine, tris(tetraalkylphenyl)phosphine, tris(dialkoxyphenyl)phosphine, tris(trialkoxyphenyl)phosphine, tris(tetraalkoxyphenyl)phosphine, trialkylphosphine, dialkylarylphosphine, alkyldiarylphosphine, trinaphthylphosphine, tris(benzyl)phosphine, and other tertiary phosphines; phosphine compounds such as complexes of the above organic phosphines with organoborons; and the above organic phosphines or the above phosphine compounds containing maleic anhydride, 1,4-benzoquinone, 2,5-tholquinone, 1,4-naphthoquinone, and 2,3-dimethylbenzoquinone. Compounds having intramolecular polarization obtained by adding compounds having π bonds, such as quinone compounds like 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, anthraquinone, and diazophenylmethane; the organophosphine or the phosphine compound and 4-bromophenol, 3-bromophenol, 2-bromophenol, 4-chlorophenol, 3-chlorophenol, 2-chlorophenol, 4-iodidephenol, 3 Compounds having intramolecular polarization obtained by reacting halogenated phenol compounds such as -iodide phenol, 2-iodide phenol, 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2,6-dimethylphenol, 4-bromo-3,5-dimethylphenol, 4-bromo-2,6-di-tert-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, and 4-bromo-4'-hydroxybiphenyl with a dehalogenation step;Examples include tetrasubstituted phosphonium compounds such as tetraphenylphosphonium, tetraphenylborate salts of tetrasubstituted phosphoniums such as tetraphenylphosphonium tetra-p-tolylborate, and salts of tetrasubstituted phosphonium with phenolic compounds; salts of tetraalkylphosphonium with partially hydrolyzed aromatic carboxylic acid anhydrides; phosphobetaine compounds; and adducts of phosphonium compounds with silane compounds. The hardening accelerator may be used alone or in combination of two or more types.

[0067] Among these, the curing accelerator is preferably one that contains an organophosphine. Examples of curing accelerators containing organophosphines include the organophosphine, phosphine compounds such as complexes of the organophosphine and organoborons, and compounds having intramolecular polarization obtained by adding a compound having a π bond to the organophosphine or the phosphine compound. Among these, particularly suitable curing accelerators include triphenylphosphine, adducts of triphenylphosphine and quinone compounds, adducts of tributylphosphine and quinone compounds, and adducts of tri-p-tolylphosphine and quinone compounds.

[0068] When the resin composition contains a curing accelerator, the amount is preferably 0.1 to 30 parts by mass, and more preferably 1 to 15 parts by mass, per 100 parts by mass of the resin component (total amount of curable resin and curing agent as needed, hereinafter the same). When the amount of curing accelerator is 0.1 parts by mass or more per 100 parts by mass of the resin component, it tends to cure well in a short time. When the amount of curing accelerator is 30 parts by mass or less per 100 parts by mass of the resin component, it tends to result in a good molded product with a curing speed that is not too fast.

[0069] (Coloring agent) The molding resin composition of the present embodiment may contain a colorant. Examples of the colorant include known colorants such as carbon black, organic dyes, organic pigments, titanium oxide, red lead, and red iron oxide. The content of the colorant can be appropriately selected according to the purpose and the like. One type of colorant may be used alone, or two or more types may be used in combination.

[0070] When the resin composition contains a colorant, the content of the colorant is preferably 0.1 parts by mass to 30 parts by mass, more preferably 1 part by mass to 10 parts by mass, relative to 100 parts by mass of the resin component.

[0071] (Ion Exchanger) The resin composition may contain an ion exchanger. The ion exchanger is not particularly limited, and conventionally known ones can be used. Specific examples include hydrotalcite compounds and hydrated oxides of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium, and bismuth. One type of ion exchanger may be used alone, or two or more types may be used in combination. Among these, hydrotalcite represented by the following general formula (A) is preferable.

[0072] Mg (1-X) Al X (OH)2(CO3) X / 2 ·mH2O ……(A) (0 < X ≦ 0.5, m is a positive number)

[0073] When the resin composition contains an ion exchanger, the content of the ion exchanger is preferably 0.1 parts by mass to 30 parts by mass, more preferably 1 part by mass to 10 parts by mass, relative to 100 parts by mass of the resin component.

[0074] (Release Agent) The resin composition may contain a release agent. The release agent is not particularly limited, and conventionally known ones can be used. Specifically, examples include carnauba wax, higher fatty acids such as montanic acid and stearic acid, higher fatty acid metal salts, ester waxes such as montanic acid esters, and polyolefin waxes such as oxidized polyethylene and non-oxidized polyethylene. The release agent may be used alone or in combination of two or more types.

[0075] If the resin composition contains a release agent, the amount is preferably 0.01 to 10 parts by mass, and more preferably 0.1 to 5 parts by mass, per 100 parts by mass of the resin component.

[0076] (Flame retardant) The resin composition may contain a flame retardant. The flame retardant is not particularly limited, and conventionally known ones can be used. Specifically, examples include organic or inorganic compounds containing halogen atoms, antimony atoms, nitrogen atoms, or phosphorus atoms, and metal hydroxides. The flame retardant may be used alone or in combination of two or more types.

[0077] If the resin composition contains a flame retardant, the amount of the flame retardant is preferably 1 to 30 parts by mass, and more preferably 2 to 20 parts by mass, per 100 parts by mass of the resin component.

[0078] (Stress reliever) The resin composition may contain a stress-relieving agent. The inclusion of a stress-relieving agent in the resin composition can further reduce package warping and cracking. Examples of commonly used stress-relieving agents (flexible agents) include thermoplastic elastomers such as silicone, styrene, olefin, urethane, polyester, polyether, polyamide, and polybutadiene; rubber particles such as NR (natural rubber), NBR (acrylonitrile-butadiene rubber), acrylic rubber, urethane rubber, and silicone powder; and rubber particles having a core-shell structure such as methyl methacrylate-styrene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer, and methyl methacrylate-butyl acrylate copolymer. The stress-relieving agent may be used individually or in combination of two or more types. Among stress relaxants, silicone-based stress relaxants are preferred. Examples of silicone-based stress relaxants include those having epoxy groups, those having amino groups, and those modified with polyethers, with silicone compounds such as epoxy-grouped silicone compounds and polyether-based silicone compounds being more preferred.

[0079] If the resin composition contains a stress-relieving agent, the amount of the stress-relieving agent is preferably 1 to 30 parts by mass, and more preferably 2 to 20 parts by mass, per 100 parts by mass of the resin component.

[0080] (Fluid-improving agent) The resin composition may contain a fluidity imparting agent. Specific examples of fluidity imparting agents include indencumarone resin and triphenylphosphine oxide.

[0081] If the resin composition contains a fluidity imparter, the amount of the fluidity imparter is preferably 1 to 30 parts by mass, and more preferably 2 to 20 parts by mass, per 100 parts by mass of the resin component.

[0082] The resin composition is preferably solid at room temperature and atmospheric pressure (for example, 25°C and atmospheric pressure). The shape of the solid resin composition is not particularly limited and can be in the form of powder, granules, or tablets. When the resin composition is in tablet form, the dimensions and mass should be such that they are suitable for the packaging molding conditions, from the viewpoint of ease of handling.

[0083] (Various physical properties of resin compositions) The relative permittivity at 10 GHz of a cured product obtained by compression molding a resin composition under the conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 600 seconds can be, for example, 9 to 40. From the viewpoint of miniaturizing electronic components and devices, the relative permittivity at 10 GHz of the cured product is preferably 10 or higher, and more preferably 13 or higher. From the viewpoint of reducing transmission loss, the relative permittivity at 10 GHz of the cured product is preferably 35 or lower, and more preferably 30 or lower. The relative permittivity is measured by the method described in the examples.

[0084] The dielectric loss tangent at 10 GHz of a cured product obtained by compression molding a resin composition under the conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 600 seconds can be, for example, 0.020 or less. From the viewpoint of reducing transmission loss, the dielectric loss tangent at 10 GHz of the cured product is preferably 0.018 or less, more preferably 0.015 or less, and even more preferably 0.010 or less. The lower limit of the dielectric loss tangent at 10 GHz of the cured product is not particularly limited, and for example, 0.004 can be cited. The dielectric loss tangent is measured by the method described in the examples.

[0085] When a resin composition is molded using a spiral flow measurement mold conforming to EMMI-1-66 under the conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds, the flow distance is preferably 60 cm or more, more preferably 70 cm or more, and even more preferably 80 cm or more. Hereinafter, the above flow distance will also be referred to as "spiral flow". The upper limit of the spiral flow is not particularly limited, and for example, 200 cm can be cited. The spiral flow is measured by the method described in the examples.

[0086] The gel time of the resin composition at 175°C is preferably 30 seconds or more to 100 seconds, and more preferably 40 seconds to 70 seconds. The gel time of the resin composition at 175°C is measured as follows. Specifically, a 3g sample of the resin composition is measured at 175°C using a Curlastometer from JSR Trading Co., Ltd., and the time until the torque curve rises is defined as the gel time (sec). The gel time is measured by the method described in the examples.

[0087] (Uses of resin compositions) The resin composition of this embodiment yields a cured product with a high dielectric constant and a low dielectric loss tangent. Therefore, the resin composition of this embodiment is suitable as a encapsulant for electronic components and devices that use high-frequency radio waves for communication.

[0088] As an electronic component device that uses high-frequency radio waves for communication, development is also underway on antenna-in-package (AiP) packages that have antenna functionality. In AiP, the radio waves used for communication are becoming higher in frequency to accommodate the increase in the number of channels due to the diversification of information, and the encapsulating material is required to have both a high relative permittivity and a low dielectric loss tangent. Therefore, the resin composition in this embodiment is also suitable as a encapsulant for AiP-type electronic component devices.

[0089] <Electronic Components and Devices> An electronic component device according to one embodiment of the present disclosure comprises a support member, an electronic component disposed on the support member, and a cured product of the aforementioned resin composition that encapsulates the electronic component. Examples of electronic component devices include those in which electronic components (active elements such as semiconductor chips, transistors, diodes, and thyristors; passive elements such as capacitors, resistors, and coils; and antennas) are mounted on support members such as lead frames, pre-wired tape carriers, wiring boards, glass, silicon wafers, and organic substrates, and the resulting electronic component region is sealed with a resin composition (e.g., a high-frequency device).

[0090] The type of support member is not particularly limited, and any support member commonly used in the manufacture of electronic component devices can be used. The above electronic components may include an antenna, or may include an antenna and elements other than an antenna. The above antenna is not limited to anything that performs the function of an antenna, and may be an antenna element or wiring.

[0091] Furthermore, in the electronic component device of this embodiment, other electronic components may be arranged on the side of the support member opposite to the side on which the above-mentioned electronic components are arranged, if necessary. The other electronic components may be sealed with the aforementioned resin composition, or with other resin compositions, or may not be sealed at all.

[0092] (Manufacturing method for electronic component devices) The method for manufacturing an electronic component device according to this embodiment includes the steps of arranging an electronic component on a support member and sealing the electronic component with the aforementioned resin composition. The method for carrying out each of the above steps is not particularly limited and can be carried out using general methods. Furthermore, the types of support members and electronic components used in the manufacture of electronic component devices are not particularly limited and can be those commonly used in the manufacture of electronic component devices.

[0093] Methods for encapsulating electronic components using the aforementioned resin composition include low-pressure transfer molding, injection molding, and compression molding. Among these, low-pressure transfer molding is the most common. [Examples]

[0094] The above embodiments will be described in detail below with reference to examples, but the scope of the above embodiments is not limited to these examples.

[0095] <Preparation of resin composition> The components listed below were mixed in the proportions (parts by mass) shown in Table 1 to prepare the resin compositions for the examples and comparative examples. The resulting resin compositions were solid at room temperature and pressure. In Table 1, blank spaces indicate that the ingredient is not present.

[0096] • Epoxy resin 1: Orthocresol novolac type epoxy resin, epoxy equivalent 200g / eq (DIC Corporation, product name "N500P-2") • Epoxy resin 2: Biphenyl-type epoxy resin, epoxy equivalent 192 g / eq (Mitsubishi Chemical Corporation, product name "YX-4000") • Hardener 1: Active ester compound, DIC Corporation, Product name "EXB-8"

[0097] • Curing accelerator: Additive of triphenylphosphine and 1,4-benzoquinone • Coupling agent 1: N-phenyl-3-aminopropyltrimethoxysilane (molecular weight: 255, Shin-Etsu Chemical Co., Ltd., product name "KBM-573") • Coupling material 2: Alkyl acetacetate aluminum diisopropylate (molecular weight: 496, Ajinomoto Fine Techno Co., Ltd., product name "PlenAct AL-M") • Release agent: Montane ester wax (Clariant Japan Co., Ltd., product name "HW-E") • Coloring agent: Carbon black

[0098] • Inorganic filler 1: Calcium titanate particles, volume-average particle size: 0.2 μm • Inorganic filler 2: Calcium titanate particles, volume-average particle size: 6 μm • Inorganic filler 3: Alumina particles, volume-average particle size: 7 μm • Inorganic filler 4: Barium titanate particles, volume average particle size: 6.6 μm

[0099] (Liquidity) Using a spiral flow measurement mold conforming to EMMI-1-66, the resin composition was molded under the conditions of a mold temperature of 180°C, a molding pressure of 6.9 MPa, and a curing time of 120 seconds, and the flow distance SF (cm) was determined. The results are shown in Table 1.

[0100] (Geltime) Measurements were performed at 175°C using a Curlastometer from JSR Trading Co., Ltd. for 3g of the resin composition, and the time until the torque curve rose was defined as the gel time GT (seconds). The results are shown in Table 1.

[0101] (Relative permittivity and dielectric loss tangent) The resin composition was placed in a vacuum hand press and molded under the following conditions: mold temperature 175°C, molding pressure 6.9 MPa, curing time 600 seconds. Post-curing was carried out at 175°C for 6 hours to obtain a plate-shaped cured material (12.5 mm long, 25 mm wide, 0.2 mm thick). Using this plate-shaped cured material as a test specimen, the relative permittivity Dk and dielectric loss tangent Df were measured at 10 GHz at a temperature of 25 ± 3°C using a dielectric constant measuring device (Agilent Technologies, product name "Network Analyzer N5227A"). The results are shown in Table 1.

[0102] (Bending strength) The resin compositions obtained in each of the Examples and each of the Comparative Examples were molded into 4.0 mm × 10.0 mm × 80 mm rectangular parallelepipeds using a transfer molding machine under the conditions of a mold temperature of 180°C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds, followed by post-curing at 180°C for 5 hours to prepare test pieces for bending strength evaluation. Using these test pieces, a bending test was carried out on a Tensilon universal material testing machine (Instron 5948, Instron) under the conditions of a span between supports of 64 mm, a crosshead speed of 10 mm / min, and a temperature of 25°C. Using the measured results, a bending stress-displacement curve was created from formula (A), and the maximum stress thereof was taken as the bending strength (MPa). The results are shown in Table 1.

[0103] σ=3FL / 2bh 2 ··· Formula (A) σ: Bending stress (MPa) F: Bending load (N) L: Span between supports (mm) b: Width of test piece (mm) h: Thickness of test piece (mm)

[0104]

Table 1

[0105] The "molar ratio" shown in Table 1 is the molar ratio of the silane coupling agent to the aluminate coupling agent (silane coupling agent: aluminate coupling agent).

[0106] As shown in Table 1, the cured products of the resin compositions of the Examples containing both a silane coupling agent and an aluminate coupling agent have higher bending strength than the cured products of the resin compositions of the Comparative Examples containing only one of a silane coupling agent and an aluminate coupling agent. This result indicates that the combined use of a silane coupling agent and an aluminate coupling agent is effective for improving the bending strength of a cured product.

[0107] As shown in Table 1, the resin composition of Comparative Example 1, which is identical to that of Comparative Example 3 except for containing calcium titanate particles instead of barium titanate particles, has a smaller dielectric loss tangent Df of the cured product compared to the resin composition of Comparative Example 3. This result indicates that using calcium titanate particles as an inorganic filler is effective in reducing the dielectric loss tangent Df of the cured product.

Claims

1. A curable resin containing epoxy resin, an inorganic filler, a coupling agent, and an active ester compound, The inorganic filler contains calcium titanate particles. The coupling agent is a resin composition comprising a silane coupling agent and an aluminate coupling agent.

2. The resin composition according to claim 1, wherein the molar ratio of the silane coupling agent to the aluminate coupling agent (silane coupling agent:aluminate coupling agent) is 75:25 to 35:

65.

3. The resin composition according to claim 1, further comprising alumina particles as the inorganic filler.

4. The resin composition according to claim 1, which is solid at 25°C and atmospheric pressure.

5. Support member and An electronic component arranged on the support member, A cured product of the resin composition according to any one of claims 1 to 4, which is used to seal the electronic component, An electronic component device equipped with the following features.

6. The electronic component apparatus according to claim 5, wherein the aforementioned electronic component includes an antenna.

Images