Electronic devices

Abstract

To provide an electronic device in which decrease in electric connection reliability can be suppressed.SOLUTION: An electronic device includes an electronic component 10, a sub-substrate 20 that has the electronic component mounted on one surface S21 and is electrically connected to the electronic component, and a main substrate 30 that has the sub-substrate mounted on a mount surface S31 and is electrically connected to the sub-substrate. The electronic device also includes a reinforcement resin part 41 that is in contact with the electronic device and the one surface and reinforces connection between the electronic component and the sub-substrate. In addition, the electronic device includes a plurality of electric connection parts at least a part of which is disposed between the main substrate and the sub-substrate and which contributes to electric connection between the main substrate and the sub-substrate. At least a part of each electric connection part is provided at a position displaced from a member counter part FA that is a counter region of the reinforcement resin part.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to an electronic device. [Background Art]

[0002] As an example of an electronic device, there is an electronic device disclosed in Patent Document 1. In the electronic device, a lower IC package is mounted on a printed circuit board, and an upper IC package is mounted on the lower IC package. [Prior Art Documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Unexamined Patent Publication No. 2021-125555 [Summary of Invention] [Problems to be Solved by the Invention]

[0004] Incidentally, it is conceivable that an electronic device has a configuration including a reinforcing resin to ensure the reliability of electrical connection between the lower IC package and the upper IC package. The reinforcing resin is provided, for example, in contact with the surface of the lower IC package and the side surface of the upper IC package. However, the reinforcing resin deforms with temperature changes. Therefore, in the electronic device, stress resulting from deformation of the reinforcing resin may be applied to the electrical connection between the printed circuit board and the lower IC package. Accordingly, there is a risk that the reliability of electrical connection of the electronic device may be degraded. In view of the above, or from other perspectives not mentioned, further improvements are needed for electronic devices.

[0005] One object disclosed herein is to provide an electronic device that can suppress a decrease in reliability of electrical connection. [Means for Solving the Problems]

[0006] The electronic device disclosed herein includes: a first circuit component (10), and The first circuit component is mounted on one side (S21), and the second circuit component (20) is electrically connected to the first circuit component. It is provided so as to avoid the area between the first circuit component and the second circuit component, A reinforcing member (40-42) made primarily of resin is in contact with one surface of the side wall (S11) of the first circuit component, and reinforces the connection between the first circuit component and the second circuit component. A second circuit component is mounted on the mounting surface (S31), and a third circuit component (30) is electrically connected to the second circuit component. It comprises a plurality of electrical connection parts (22, 50, 51) that are at least partially positioned between the second circuit component and the third circuit component and contribute to the electrical connection between the second circuit component and the third circuit component, Each electrical connection point is provided at a position offset from the member-facing portion, which is the opposing region of the reinforcing member, at least a portion of which is located therein. and provided in the opposing region of the first circuit component and around the opposing region of the first circuit component. An electronic device characterized by having the following features.

[0007] Thus, each electrical connection point is positioned at least partially offset from the opposing member. Therefore, the electronic device can suppress the application of stress from the reinforcing member to the electrical connection points due to temperature changes. Consequently, the electronic device can suppress a decrease in the electrical connection reliability between the second and third circuit components.

[0008] The various embodiments disclosed in this specification employ different technical means to achieve their respective objectives. The claims and the reference numerals in parentheses in this section are illustrative in their correspondence with the embodiments described later and are not intended to limit the technical scope. The objectives, features, and effects disclosed in this specification will become clearer by referring to the subsequent detailed description and the accompanying drawings. [Brief explanation of the drawing]

[0009] [Figure 1] This is a plan view showing the schematic configuration of the electronic device in the embodiment. [Figure 2] This is a cross-sectional view along the line II-II in Figure 1. [Figure 3] This is an enlarged view of section III in Figure 2. [Figure 4] It is a plan view illustrating a schematic configuration of an opposing surface side of a sub-substrate. [Figure 5] It is a plan view illustrating a schematic configuration of an electronic device according to an embodiment. [Figure 6] It is a plan view illustrating a schematic configuration of an electronic device in a comparative example. [Figure 7] It is a cross-sectional view illustrating a schematic configuration of an electronic device according to Modification 1. [Figure 8] It is a cross-sectional view illustrating a schematic configuration of an electronic device according to Modification 2. [Figure 9] It is a cross-sectional view illustrating a schematic configuration of an electronic device according to Modification 3. [Figure 10] It is a plan view illustrating a schematic configuration of an electronic device according to Modification 4. [Figure 11] It is a cross-sectional view illustrating a schematic configuration of an electronic device according to Modification 5. [Figure 12] It is a plan view illustrating a schematic configuration of an opposing surface side of a sub-substrate according to Modification 5. [Figure 13] It is a cross-sectional view illustrating a schematic configuration of an electronic device according to Modification 6. [Figure 14] It is a plan view illustrating a schematic configuration of an opposing surface side of a sub-substrate according to Modification 6. [Figure 15] It is a plan view illustrating a schematic configuration of an opposing surface side of a sub-substrate according to Modification 7. [Figure 16] It is a plan view illustrating a schematic configuration of an opposing surface side of a sub-substrate according to Modification 8. [Figure 17] It is a cross-sectional view illustrating a schematic configuration of an electronic device according to Modification 9. [Figure 18] It is a plan view illustrating a schematic configuration of an opposing surface side of a sub-substrate according to Modification 9. [Figure 19] It is a cross-sectional view illustrating a schematic configuration of an electronic device according to Modification 10. [Figure 20] It is a plan view illustrating a schematic configuration of an opposing surface side of a sub-substrate according to Modification 10. [Figure 21] It is a plan view illustrating a schematic configuration of an electronic device according to Modification 11. Description of Embodiments

[0010] Hereinafter, a plurality of modes for carrying out the present disclosure will be described with reference to the drawings. In each mode, portions corresponding to matters described in preceding modes are denoted by the same reference numerals, and overlapping description may be omitted. In each mode, when only a part of the configuration is described, other modes described previously can be referred to and applied for the other parts of the configuration. In the following description, three mutually orthogonal directions are referred to as the X direction, the Y direction, and the Z direction.

[0011] (Embodiment) The electronic device 100 according to the embodiment will be described with reference to FIGS. 1 to 6. As shown in FIGS. 1 and 2, the electronic device 100 includes an electronic component 10, a sub-substrate 20, and a main substrate 30. The electronic device 100 also includes a reinforcing resin portion 40, a plurality of first solders 50, and the like.

[0012] As shown in FIG. 2, in the electronic device 100, the main substrate 30, the sub-substrate 20, and the electronic component 10 are stacked and arranged in the Z direction. The electronic component 10 is mounted facing one surface S21 of the sub-substrate 20. The electronic component 10 is electrically connected to the sub-substrate 20 via a second solder 70. The sub-substrate 20 is mounted facing a mounting surface S31 of the main substrate 30. Further, in the sub-substrate 20, a facing surface S22, which is the opposite surface to the one surface S21, is arranged facing the mounting surface S31. The sub-substrate 20 is electrically connected to the main substrate 30 via the first solder 50. The first solder 50 can also be referred to as a first solder ball. Similarly, the second solder 70 can also be referred to as a second solder ball.

[0013] The electronic device 100 has a circuit formed by electrically connecting the electronic component 10, the sub-board 20, and the main board 30. The electronic device 100 can be applied to control devices and the like. Thus, the electronic device 100 can be said to have the electronic component 10, the sub-board 20, and the main board 30 as circuit components that constitute a circuit. In this embodiment, the electronic component 10 corresponds to the first circuit component, the sub-board 20 to the second circuit component, and the main board 30 to the third circuit component.

[0014] As shown in Figure 1, the electronic component 10 is a smaller circuit component than the sub-board 20 and the main board 30. The sub-board 20 is a smaller circuit component than the main board 30. Here, "smaller" refers to a smaller physical size, at least when viewed from the Z direction.

[0015] <Main board> The main board 30 will be explained using Figures 2 and 3. The main board 30 comprises an electrically insulating base material 31 and conductive wiring sections 32 to 34 provided on the base material 31. The main board 30 also has a mounting surface S31 on which the sub-board 20 is mounted. The base material 31 is, for example, a substrate mainly composed of resin. Therefore, the base material 31 can also be called a resin substrate. The main board 30 can also be called a printed circuit board.

[0016] The wiring sections 32-34 include wiring layers 34 laminated via a base material 31 and interlayer connection sections 33 that electrically connect wiring layers 34 of different layers. The wiring layers 34 are provided inside the base material 31 and on the surface of the base material 31. The wiring layers 34 are exposed on the mounting surface S31 side and include mounting surface lands 32. The first solder 50 is connected to the mounting surface lands 32. The mounting surface lands 32 function as electrodes for external connections. External connections refer to connections to sub-boards 20 and the like provided outside the main board 30. The main board 30 has multiple mounting surface lands 32. The mounting surface lands 32 correspond to mounting surface electrodes.

[0017] Furthermore, the main board 30 may be provided with a board-side protective film that covers a portion of the base material 31 and the wiring sections 32-34. The board-side protective film covers a portion of the base material 31 and a portion of the wiring sections 32-34 for the purpose of protecting against the adhesion of dust and other debris, as well as damage.

[0018] A portion of the base material 31 is the surface on the mounting surface S31 side, where the wiring portions 32-34 are not provided. A portion of the wiring portions 32-34 is a portion of the wiring layer 34 in the wiring portions 32-34. A portion of the wiring layer 34 is a portion of the wiring layer 34 provided on the mounting surface S31 side, excluding the mounting surface land 32. In other words, the substrate-side protective film covers the wiring layer 34 provided on the mounting surface S31 side of the base material 31 so that the mounting surface land 32 is exposed. Thus, the mounting surface land 32 is a portion of the wiring layer 34 that is exposed from the base material 31 and the substrate-side protective film.

[0019] In this embodiment, a multilayer substrate with a wiring layer 34 is used as the main substrate 30. However, this disclosure is not limited to this. The main substrate 30 can also be called a wiring substrate or a mother substrate.

[0020] <Sub-board> As shown in Figures 2 and 3, the sub-substrate 20 comprises an electrically insulating base material 21 and conductive opposing surface lands 22. The sub-substrate 20 has one surface S21 on which the electronic components 10 are mounted and an opposing surface S22 that faces the main substrate 30 (mounting surface S31).

[0021] The base material 21 is, for example, a substrate mainly composed of resin. Therefore, the base material 21 can also be called a resin substrate. The sub-substrate 20 may have wiring patterns or the like provided on the base material 21.

[0022] The opposing surface lands 22 are provided at multiple locations on the opposing surface S22. Therefore, it can be said that the sub-board 20 has multiple opposing surface lands 22. The first solder 50 is electrically connected to the opposing surface lands 22.

[0023] The opposing surface land 22 is provided for electrical connection between the sub-board 20 and the main board 30. In other words, the sub-board 20 is electrically connected to the main board 30 by connecting the first solder 50 to the opposing surface land 22. The opposing surface land 22 corresponds to the opposing surface electrode.

[0024] Figure 4 is a plan view of the opposing surface S22 side of the sub-board 20. Figure 4 also shows the state in which the first solder 50 is connected to the opposing surface land 22. The opposing surface land 22 is located in a position hidden by the first solder 50.

[0025] In Figure 4, the outline of the electronic component 10 is shown by a dashed line, and the semiconductor chip 11 and reinforcing resin portion 40 are shown by a double-dash line. Also in Figure 4, the positions where the first solder 50 has been removed, that is, the positions where no electrical connection portion is provided, are indicated by dashed circles. In other words, the dashed circles in Figure 4 indicate non-formed areas where the first solder 50 (electrical connection portion) is not provided. Opposing surface lands 22 may also be provided in the region opposite the non-formed area. The non-formed area will be explained in detail later.

[0026] As shown in Figure 2, the sub-board 20 has electronic components 10 mounted on one side S21. Multiple lands are formed on the one side S21 of the sub-board 20 for electrical connection with the electronic components 10. These lands can also be called single-sided lands or single-sided electrodes. The single-sided lands are electrically connected to the opposing side lands 22 via wiring patterns, etc. Second solder 70 is connected to the single-sided lands. The sub-board 20 is electrically connected to the electronic components 10 by the connection of the second solder 70 to the single-sided lands.

[0027] The sub-substrate 20 may be provided with a component-side protective film so that the opposing surface lands 22 and the single-surface lands are exposed. The component-side protective film covers a portion of the base material 21 for the purpose of protecting against the adhesion of dust and other debris, as well as damage. The portion of the base material 21 is the area excluding the single-surface lands on the single-surface S21 side, and the area excluding the opposing surface lands 22 on the opposing surface S22 side.

[0028] The opposing surface lands 22 and single-surface lands are exposed from the component-side protective film and function as electrodes for external connections. It can also be said that the sub-substrate 20 has multiple single-surface lands exposed on one surface S21 and multiple opposing surface lands 22 exposed on the opposing surface S22.

[0029] Furthermore, the sub-board 20 can be a module component equipped with multiple semiconductor chips that make up the system. This module component can also be called a system-on-a-chip (SoC) or multi-chip module. Module components tend to be larger in size than discrete components.

[0030] <Electronic Components> As shown in Figure 2, the electronic component 10 includes a bare-chip semiconductor chip 11, a substrate 12 on which the semiconductor chip 11 is mounted, and a sealing resin part 13 that encloses the semiconductor chip 11. As shown in Figure 4, the semiconductor chip 11 has four side walls S11 and four corners C11.

[0031] The substrate 12 has a semiconductor chip 11 and a sealing resin portion 13 on one side. The substrate 12 also has electrodes on the other side that are electrically connected to the semiconductor chip 11. These electrodes are electrically connected by a second solder 70. The electronic component 10 is electrically connected to the sub-substrate 20 via the second solder 70.

[0032] Furthermore, discrete components can be used for the electronic component 10. Discrete components are electronic components that have a single function, such as MOSFETs, IGBTs, diodes, and resistors.

[0033] <Reinforced resin part> As shown in Figures 1 and 2, the reinforcing resin portion 40 is provided so as to be in contact with the electronic component 10 and one surface S21. The reinforcing resin portion 40 is mainly composed of resin. The reinforcing resin portion 40 corresponds to a reinforcing member.

[0034] The reinforcing resin portion 40 is in close contact with the side wall S11 and corner C11 of the electronic component 10, and one surface S21 of the sub-board 20. In other words, the reinforcing resin portion 40 can be said to be connecting the electronic component 10 and the sub-board 20.

[0035] The semiconductor chip 11, the substrate 12, and the sealing resin portion 13 have different coefficients of thermal expansion. Therefore, stress is generated in the second solder 70 and the areas connected to the second solder 70 due to temperature changes during thermal cycling tests and in actual operating environments. The reinforcing resin portion 40 reduces the stress applied to the second solder 70 and the areas connected to the second solder 70 by contacting both the electronic component 10 and one surface S21. Thus, the reinforcing resin portion 40 is a component for reinforcing the connection between the electronic component 10 and the sub-substrate 20. Note that stress on the second solder 70 and other areas is particularly likely to be applied to the opposing region of the semiconductor chip 11, especially at the position facing the edge of the semiconductor chip 11.

[0036] In this embodiment, as an example, a reinforcing resin portion 40 is provided around the entire circumference of the electronic component 10. However, the reinforcing resin portion 40 is not limited to this.

[0037] <Vectoring connection> The electrical connection points will be explained using Figures 2 to 6. The electrical connection points are the parts that contribute to the electrical connection between the sub-board 20 and the main board 30. The electrical connection points include the opposing surface lands 22 and the first solder 50. As described above, the electronic device 100 is equipped with a plurality of opposing surface lands 22 and a plurality of first solder 50. Therefore, the electronic device 100 is equipped with a plurality of electrical connection points. In Figure 2, the positions where the first solder 50 has been removed, that is, the positions where no electrical connection points are provided, are indicated by dashed circles. In Figures 5 and 6, the positions where the first solder 50 is provided, that is, the positions where electrical connection points are provided, are indicated by dotted circles.

[0038] The opposing surface land 22, which is part of the electrical connection, is provided on the sub-board 20. The first solder 50, which is also part of the electrical connection, is located between the sub-board 20 and the main board 30. Thus, it can be said that at least a portion of the electrical connection is located between the sub-board 20 and the main board 30.

[0039] As shown in Figures 2, 3, and 4, the member-facing portion FA, which is the region opposite the reinforcing resin portion 40, does not have an electrical connection point. In other words, each electrical connection point is located at a position offset from the member-facing portion FA.

[0040] Therefore, in the component-facing portion FA, the sub-substrate 20 and the main substrate 30 are not electrically connected. It can also be said that the component-facing portion FA has a non-formed area. Furthermore, it can be said that each electrical connection portion is provided around the component-facing portion FA. The non-formed area can also be said to be a region in the electrical connection portion where at least the first solder 50 is not formed.

[0041] In this embodiment, as an example, an example is adopted in which the entire electrical connection portion is provided at a position offset from the member-facing portion FA. In other words, the entire electrical connection portion is positioned offset from the member-facing portion FA. More specifically, as shown in Figure 3, the opposing surface land 22 is provided at a position offset from the member-facing portion FA. Similarly, the first solder 50 is provided at a position offset from the member-facing portion FA. The first solder 50 is offset not only at the connection portion with the opposing surface land 22, but the entire structure is offset from the member-facing portion FA. In this embodiment, the mounting surface land 32 is also provided at a position offset from the member-facing portion FA.

[0042] As shown in Figure 4, the reinforcing resin portion 40 is provided in an annular shape to surround the electronic component 10. Therefore, the member-facing portion FA is annular. Consequently, the electronic device 100 has an annular shape in the non-formed region where no electrical connection portion is provided.

[0043] However, this disclosure is not limited thereto. Each electrical connection only needs to be positioned at least partially offset from the member-facing portion FA. In other words, all electrical connections include those in which the entire electrical connection is positioned at a location offset from the member-facing portion FA. Furthermore, all electrical connections include those in which only a portion of the electrical connection is positioned at a location offset from the member-facing portion FA. The electronic device 100 can be adopted with such a configuration.

[0044] Furthermore, as shown in Figures 2 and 4, in this embodiment, as an example, each electrical connection portion is provided at a position offset from the edge-facing portion OP that faces the edge of the semiconductor chip 11. Each electrical connection portion is provided so as to overlap the edge-facing portion OP. However, this disclosure is not limited to this. The electrical connection portions may also be provided on the edge-facing portion OP. The edge of the semiconductor chip 11 can also be called the outer periphery of the semiconductor chip 11 or the contour of the semiconductor chip 11.

[0045] The electrical connection portion may include the mounting surface land 32. Alternatively, the electrical connection portion may include only one of the opposing surface land 22 or the first solder 50.

[0046] Here, using Figures 5 and 6, we will explain an arrangement method in which the electrical connection part is positioned offset from the opposing part FA of the component. In Figures 5 and 6, a main substrate 30 is adopted in which opposing surface lands 22 are provided in the central region IA and the outer peripheral region OA. The outer peripheral region OA is an annular region provided at the edge of the opposing surface S22. The central region IA is the region surrounded by the outer peripheral region OA. Multiple opposing surface lands 22 are provided in both the central region IA and the outer peripheral region OA.

[0047] Note that in Figures 5 and 6, the opposing surface lands 22 and mounting surface lands 32 are omitted from the illustration in order to simplify the drawings. However, the opposing surface lands 22 and mounting surface lands 32 are located opposite the first solder 50.

[0048] First, Figure 6 shows an electronic device (comparative example) in which the electronic components 10 are mounted on the sub-substrate 20 without considering the positions of the opposing component portion FA and the electrical connection portion. In this case, as shown by the dashed line CA, some of the electrical connection portions are positioned opposite the opposing region of the reinforcing resin portion 40 or the edge of the semiconductor chip 11. The dashed line CA indicates a region of concern. Region CA is a region where the connection reliability of the electrical connection portion is a concern.

[0049] In other words, the area of ​​concern CA is an area where stress is likely to be generated at the electrical connection points due to the temperature changes described above. At the electrical connection points in the area opposite the semiconductor chip 11, particularly at the position opposite the edge of the semiconductor chip 11, stress generated in the second solder 70 is easily applied through the sub-substrate 20. Also, at the electrical connection points in the area opposite the reinforcing resin part 40, stress is easily applied through the sub-substrate 20 due to curing shrinkage (deformation) of the reinforcing resin part 40 due to temperature changes.

[0050] On the other hand, Figure 5 shows the electronic device 100 when the electronic components 10 are mounted on the sub-substrate 20, taking into consideration the positions of the member-facing portion FA and the electrical connection portion. The electronic components 10 are mounted offset as indicated by the white arrows. In other words, the electronic device 100 is mounted such that the reinforcing resin portion 40 and the edges of the semiconductor chip 11 are not located in the area of ​​concern CA. As a result, the electronic device 100 has an electrical connection portion located offset from the member-facing portion FA. Also, the electronic device 100 has an electrical connection portion located offset from the edge-facing portion OP. Note that the arrangement method described here is merely an example. This disclosure is not limited thereto.

[0051] <Effects> In the electronic device 100, stress is applied to the sub-substrate 20 as the reinforcing resin part 40 deforms in response to temperature changes. In a configuration where an electrical connection part is provided on the member-facing part FA, stress is also applied to the electrical connection part via the sub-substrate 20.

[0052] However, each electrical connection point is positioned at least partially offset from the opposing member portion FA. Therefore, the electronic device 100 can suppress the application of stress from the reinforcing resin portion 40 to the electrical connection points. Consequently, the electronic device 100 can suppress distortion of the electrical connection points. Thus, the electronic device 100 can suppress the occurrence of cracks or other defects in the opposing surface land 22 or the first solder 50, which would result in poor electrical connection points.

[0053] Therefore, the electronic device 100 can suppress a decrease in the electrical connection reliability between the sub-board 20 and the main board 30. In other words, the electronic device 100 can suppress a decrease in the electrical connection reliability between the sub-board 20 and the main board 30 more effectively than a configuration in which the entirety of some electrical connection parts is located in the component-facing part FA. Furthermore, it can be said that the electronic device 100 can improve the thermal cycle reliability of the electrical connection parts. In addition, the electronic device 100 can also suppress the application of stress to parts of the sub-board 20 and the main board 30 other than the electrical connection parts.

[0054] In particular, this embodiment employs an example in which the entire electrical connection portion is located offset from the member-facing portion FA. Therefore, the electronic device 100 can suppress the application of electrical force to the electrical connection portion more effectively than a configuration in which a portion of the electrical connection portion is located on the member-facing portion FA.

[0055] Furthermore, in this embodiment, each electrical connection portion is provided in a position where the opposing surface land 22 is offset from the member opposing portion FA. The electronic device 100 can suppress connection failures in the electrical connection portions if at least the opposing surface land 22 is provided at a position offset from the member opposing portion FA.

[0056] Furthermore, the electronic device 100 has each electrical connection point positioned offset from the edge-facing portion OP. Therefore, the electronic device 100 can further suppress the decrease in electrical connection reliability between the sub-board 20 and the main board 30.

[0057] Preferred embodiments of the present disclosure have been described above. However, the present disclosure is not limited to the above embodiments, and various modifications are possible without departing from the spirit of the present disclosure. Below, modifications 1 to 11 are described as other forms of the present disclosure. Modifications 1 to 11 mainly describe the differences from the above embodiments and other modifications. The above embodiments and modifications 1 to 11 can be implemented individually, but they can also be implemented in various combinations as appropriate. The present disclosure can be implemented in various combinations, not limited to the combinations shown in the embodiments.

[0058] (Variation 1) Using Figure 7, we will explain the electronic device 101 of the modified example 1. The electronic device 101 differs in the configuration of the member-facing portion FA.

[0059] In the electronic device 101, at least a portion of each electrical connection is located offset from the component-facing portion FA. Furthermore, as shown in Figure 7, the electronic device 101 has dummy solder 60 provided on the component-facing portion FA. The dummy solder 60 mechanically connects the sub-board 20 and the main board 30. More specifically, the dummy solder 60 is connected to the opposing surface land 22 and the mounting surface land 32. However, the opposing surface land 22 to which the dummy solder 60 is connected is electrically insulated from other opposing surface lands 22 and wiring patterns. Similarly, the mounting surface land 32 to which the dummy solder 60 is connected is electrically insulated from other wiring portions 32-34. Therefore, although the dummy solder 60 mechanically connects the sub-board 20 and the main board 30, it does not provide an electrical connection. In other words, the dummy solder 60 is a connection that does not contribute to the electrical connection between the sub-board 20 and the main board 30.

[0060] Electronic device 101 can achieve the same effect as electronic device 100. Furthermore, because electronic device 101 is provided with dummy solder 60, it can improve the mechanical connection strength between the sub-board 20 and the main board 30 compared to electronic device 100.

[0061] The dummy solder 60 may also be provided in areas other than the component-facing portion FA. For example, the dummy solder 60 may be provided in the edge-facing portion OP. The dummy solder 60 corresponds to a mechanical connection portion.

[0062] (Modification 2) Using Figure 8, we will explain the modified electronic device 102 of the second example. The configuration of the electrical connection part of the electronic device 102 differs from that of the electronic device 100.

[0063] As shown in Figure 8, in the electronic device 102, a portion of the first solder 50 is positioned on the component-facing portion FA. More specifically, the portion of the first solder 50 that is not connected to the opposing surface land 22 or the mounting surface land 32 is positioned on the component-facing portion FA. However, each electrical connection is provided at a position offset from the component-facing portion FA on the opposing surface land 22. Thus, each electrical connection only needs to be provided at a position offset from the component-facing portion FA, at least a portion of it. Similar to the electronic device 100, the electronic device 102 can suppress the decrease in electrical connection reliability between the sub-board 20 and the main board 30 more effectively than a configuration where the entirety of some electrical connection parts is positioned on the component-facing portion FA.

[0064] (Variation 3) Using Figure 9, the electronic device 103 of the modified example will be explained. The configuration of the electrical connection part of the electronic device 103 differs from that of the electronic device 100.

[0065] As shown in Figure 9, in the electronic device 103, the opposing surface land 22 and a portion of the first solder 50 are located on the component opposing portion FA. In this way, each electrical connection only needs to be located at a position offset from the component opposing portion FA, at least in part. Similar to the electronic device 100, the electronic device 103 can suppress the decrease in electrical connection reliability between the sub-board 20 and the main board 30 more effectively than a configuration in which the entirety of some electrical connection parts is located on the component opposing portion FA.

[0066] (Modification 4) Using Figure 10, the electronic device 104 of the modified example will be explained. The configuration of the electrical connection part of the electronic device 104 differs from that of the electronic device 100. Note that Figure 10 is a plan view corresponding to Figure 5. In Figure 10, the positions where the first solder 50 has been removed, that is, the positions where no electrical connection part is provided, are indicated by hatched dotted circles.

[0067] As shown in Figure 10, the electronic device 104 has electrical connection points at positions offset from the member-facing portion FA and the edge-facing portion OP, as well as at positions offset from the region between the member-facing portion FA and the edge-facing portion OP. The non-formed region 50a is the region between the member-facing portion FA and the edge-facing portion OP. The non-formed region 50a does not have electrical connection points. It can be said that the electronic device 104 has a non-formed region 50a.

[0068] The region between the member-facing portion FA and the edge-facing portion OP is susceptible to stress due to temperature changes, similar to the member-facing portion FA and the edge-facing portion OP. However, because the electronic device 104 has a non-formed region 50a, it can suppress the decrease in electrical connection reliability between the sub-substrate 20 and the main substrate 30 more effectively than the electronic device 100.

[0069] (Variation 5) The electronic device 105 of the modified example 5 will be explained using Figures 11 and 12. The configuration of the reinforcing resin part 41 in the electronic device 105 differs from that of the electronic device 100. Figure 11 is a cross-sectional view of the electronic device 109 passing through two adjacent reinforcing resin parts 41 and electronic components 10 in the X direction. Figure 12 is a plan view corresponding to Figure 4.

[0070] As shown in Figures 11 and 12, the reinforcing resin portion 41 is in contact with the corner C11 of the electronic component 10 and one surface S21 of the sub-substrate 20. In other words, unlike the reinforcing resin portion 40, the reinforcing resin portion 41 is provided opposite the corner C11 of the electronic component 10. The reinforcing resin portion 41 can also be called a corner bond. The electronic device 105 can achieve the same effect as the electronic device 100.

[0071] (Experimental variation 6) The electronic device 106 of the modified example 6 will be explained using Figures 13 and 14. The electronic device 106 differs from the electronic device 100 in the configuration of the reinforcing resin part 42. Figure 13 is a cross-sectional view corresponding to Figure 2. Figure 14 is a plan view corresponding to Figure 4.

[0072] As shown in Figures 13 and 14, the reinforcing resin portion 42 is in contact with the side wall S11, the corner C11 of the electronic component 10, and one surface S21 of the sub-substrate 20. Furthermore, the reinforcing resin portion 42 is also in contact with the surface of the electronic component 10 that is opposite to the surface S21. Therefore, the reinforcing resin portion 42 is also provided between the electronic component 10 and the surface S21. The reinforcing resin portion 42 can also be called an underfill. The electronic device 106 can achieve the same effects as the electronic device 100.

[0073] (Example 7) Using Figure 15, the modified electronic device 107 of the seventh modification will be explained. The configuration of the electrical connection part of the electronic device 107 differs from that of the electronic device 105. Figure 15 is a plan view corresponding to Figure 12. In Figure 15, the parts that have been changed from the electronic device 105 are shown by hatched dashed circles. The changed parts are the positions where the first solder 50 has been removed, that is, the positions where no electrical connection part is provided.

[0074] As shown in Figure 15, the electronic device 107 has electrical connection points provided at positions offset from the member-facing portion FA and the periphery of the member-facing portion FA. The periphery of the member-facing portion FA is not the gap between the electrical connection points. The periphery of the member-facing portion FA is, for example, the region between the opposing surface land 22 adjacent to the member-facing portion FA and the mounting surface land 32 facing that opposing surface land. Alternatively, the periphery of the member-facing portion FA may be the opposing region of the mounting surface land 32 adjacent to the member-facing portion FA.

[0075] The stress resulting from the deformation of the reinforcing resin portion 40 as described above can reach not only the member-facing portion FA but also the area surrounding the member-facing portion FA. The electronic device 107 has each electrical connection point located not only at the member-facing portion FA but also at a position offset from the area surrounding the member-facing portion FA. For this reason, the electronic device 107 can suppress the deterioration of the electrical connection reliability between the sub-board 20 and the main board 30 even more effectively than the electronic device 105. Note that at least a portion of each electrical connection point should be located at a position offset from the member-facing portion FA and the area surrounding the member-facing portion FA.

[0076] (Variation 8) Using Figure 16, the electronic device 108 of the modified example will be explained. The configuration of the electrical connection part of the electronic device 108 differs from that of the electronic device 106. Figure 16 is a plan view corresponding to Figure 14. In Figure 16, the parts that have been changed from the electronic device 106 are indicated by hatched dashed circles. The changed parts are the positions where the first solder 50 has been removed, that is, the positions where no electrical connection part is provided.

[0077] As shown in Figure 16, the electronic device 108 is an example in which the configuration of the electronic device 107 is applied to the electronic device 106, which uses underfill as the reinforcing resin part 42. In the electronic device 108, each electrical connection part is provided at a position offset from the member facing part FA and the periphery of the member facing part FA. Therefore, the electronic device 108 can achieve the same effect as the electronic device 107.

[0078] (Extreme variation 9) The modified electronic device 109 of the 9th modification will be explained using Figures 17 and 18. The configuration of the electrical connection part of the electronic device 109 differs from that of the electronic device 100. Figure 17 is a cross-sectional view corresponding to Figure 11. Figure 18 is a plan view corresponding to Figure 12.

[0079] As shown in Figure 17, the electronic device 109 uses a connecting pin 51 instead of the first solder 50. The connecting pin 51 is provided protruding from the sub-board 20 (base material 21). The connecting pin 51 is electrically connected to the second solder 70 via a wiring pattern or the like. Reference numeral 22a indicates the base of the connecting pin 51.

[0080] The main board 30 has a through electrode 32a into which a connection pin 51 is inserted and which is electrically connected to the connection pin 51. The main board 30 also has a wiring section which includes the through electrode 32a, an interlayer connection section 33, and a wiring layer 34. Thus, the electronic device 109 has a connection pin 51 as an electrical connection section. Note that the electrical connection section may also include the through electrode 32a.

[0081] As shown in Figure 18, each electrical connection point is located at a position offset from the member-facing portion FA, similar to the electronic device 100. Furthermore, each electrical connection point is located at a position offset from the edge-facing portion OP. The electronic device 109 can achieve the same effects as the electronic device 100.

[0082] Furthermore, each electrical connection point only needs to be positioned so that at least a portion of it is offset from the member-facing part FA. Modification 9 can be applied to the above embodiment and other modifications. In other words, in the above embodiment and other modifications, the connection pin 51 can be used instead of the first solder 50. Also, when modification 9 is applied to modification 1, a dummy pin can be used instead of the dummy solder 60. A dummy pin is a pin that, like the dummy solder 60, is not electrically connected.

[0083] (Variation 10) The modified electronic device 110 will be described using Figures 19 and 20. The configuration of the electrical connection part of the electronic device 110 differs from that of the electronic device 105. Figure 19 is a cross-sectional view corresponding to Figure 2. Figure 20 is a plan view corresponding to Figure 4.

[0084] As shown in Figures 19 and 20, the electronic device 110 has its electrical connection points positioned offset from the chip-facing portion CPA, which is the region facing the semiconductor chip 11. In other words, each electrical connection point is located not only in the edge-facing portion OP, but also offset from the chip-facing portion CPA, which is the entire region facing the semiconductor chip 11.

[0085] The electronic device 110 can achieve the same effects as the electronic device 105. Furthermore, the electronic device 110 can suppress the deterioration of electrical connection reliability between the sub-board 20 and the main board 30 even more effectively than the electronic device 105.

[0086] (Variation 11) Using Figure 21, the modified electronic device 111 will be explained. The configuration of the electrical connection part of the electronic device 111 differs from that of the electronic device 100. In Figure 21, the positions where the first solder 50 has been removed, that is, the positions where no electrical connection part is provided, are indicated by hatched dotted circles.

[0087] As shown in Figure 21, the electronic device 111 has, in addition to the electronic component 10, a smaller electronic component 10a mounted on the sub-board 20. For this reason, the electronic component 10 can also be called a large electronic component 10. A large electronic component 10 is, for example, one with a side length of 5 mm or more. On the other hand, a small electronic component 10a is, for example, one with a side length of less than 5 mm. Here, sides refer to sides along the X direction and sides along the Y direction.

[0088] Figure 21 shows, as an example, an electronic device 111 equipped with two large electronic components 10 and two small electronic components 10a. However, the number of large electronic components 10 and small electronic components 10a is not limited to this.

[0089] The small electronic component 10a is less affected by temperature changes in its electrical connections than the large electronic component 10. Therefore, the electronic device 111 may be configured with the above-described arrangement of electrical connections only for the large electronic component 10.

[0090] In other words, the electronic device 111 does not have an electrical connection in the member-facing portion FA, which is the region opposite the reinforcing resin portion 40 provided on the large electronic component 10. That is, the electrical connection is located at a position offset from the member-facing portion FA, which is the region opposite the reinforcing resin portion 40 provided on the large electronic component 10. On the other hand, the electronic device 111 has an electrical connection in the member-facing portion FA, which is the region opposite the reinforcing resin portion 40 provided on the small electronic component 10a.

[0091] Furthermore, in the electronic device 111, no electrical connection is provided on the edge-facing portion OP that faces the edge of the semiconductor chip 11 of the large electronic component 10. In other words, the electrical connection is provided at a position offset from the edge-facing portion OP that faces the edge of the semiconductor chip 11 of the large electronic component 10. On the other hand, in the electronic device 111, an electrical connection is provided on the edge-facing portion OP that faces the edge of the semiconductor chip 11 of the small electronic component 10a.

[0092] Furthermore, the electrical connection portion may be provided at a position offset from the chip-facing portion CPA of the large electronic component 10 that faces the semiconductor chip 11. Alternatively, the electrical connection portion may be provided on the chip-facing portion CPA of the small electronic component 10a that faces the semiconductor chip 11. Moreover, at least a portion of each electrical connection portion may be provided at a position offset from the component-facing portion FA.

[0093] The electronic device 111 can achieve the same effect as the electronic device 100. Note that the small electronic component 10a does not necessarily need to be reinforced by the reinforcing resin part 40.

[0094] This disclosure is described in accordance with embodiments, but it is understood that this disclosure is not limited to such embodiments or structures. This disclosure also includes various modifications and variations within the scope of equivalents. In addition, while various combinations and forms are shown in this disclosure, other combinations and forms that include one, more, or fewer of those elements also fall within the scope and idea of ​​this disclosure. (Disclosure of technical ideas) This specification discloses several technical concepts, as listed in the following paragraphs. Some paragraphs are written in a multiple dependent form, where subsequent paragraphs optionally refer to preceding paragraphs. Furthermore, some paragraphs are written in a multiple dependent form, referring to other multiple dependent forms. These paragraphs written in multiple dependent forms define several technical concepts. (Technical thought 1) First circuit component (10), The first circuit component is mounted on one side (S21), and a second circuit component (20) is electrically connected to the first circuit component, Reinforcing members (41-42) made primarily of resin, which are in contact with the first circuit component and the one surface, and which reinforce the connection between the first circuit component and the second circuit component, The second circuit component is mounted on the mounting surface (S31), and a third circuit component (30) is electrically connected to the second circuit component, It comprises a plurality of electrical connection parts (22, 50, 51) which are at least partially positioned between the second circuit component and the third circuit component and contribute to the electrical connection between the second circuit component and the third circuit component, An electronic device in which each electrical connection portion is provided at a position offset from the member-facing portion, which is at least a portion of the reinforcing member's opposing region. (Technical thought 2) The electronic device according to technical concept 1, wherein each electrical connection is provided at a position offset from the member-facing portion. (Technical Thought 3) Each electrical connection portion includes an opposing surface electrode (22) provided on the opposing surface (S22) that is opposite to the one surface of the second circuit component and faces the mounting surface, and a solder ball (50) electrically connected to the opposing surface electrode, wherein the opposing surface electrode is provided at a position offset from the member opposing portion, as described in technical concept 1. (Technical Thought 4) The aforementioned first circuit component includes a semiconductor chip, The electronic device according to any one of the technical concepts 1 to 3, wherein each electrical connection portion is provided at a position offset from the edge-facing portion opposite to the edge of the semiconductor chip. (Technical Thought 5) The aforementioned first circuit component includes a semiconductor chip, The electronic device according to any one of the technical concepts 1 to 3, wherein each electrical connection portion is provided at a position offset from the chip-facing portion facing the semiconductor chip. (Technical Thought 6) The electronic device according to any one of technical concepts 1 to 5, wherein each electrical connection is provided at a position offset from the member-facing portion and the periphery of the member-facing portion. (Technical Thought 7) The system further includes a mechanical connection part (60) that mechanically connects the second circuit component and the third circuit component, The aforementioned mechanical connection portion is provided in at least the opposing region, as described in technical concept 1 of the electronic device. [Explanation of symbols]

[0095] 10...Electronic component, 11...Semiconductor chip, 12...Substrate, 13...Sealing resin part, 20...Sub-substrate, 21...Base material, 22...Opposite surface land, 22a...Root part, 30...Main substrate, 31...Base material, 32...Mounting surface land, 32a...Through-hole electrode, 33...Interlayer connection part, 34...Wiring layer, 40~42...Reinforcement resin part, 50...First solder, 50a...Non-formed area, 51...Connecting pin, 60...Dummy solder, 70...Second solder, 100~111...Electronic device, S11...Side, C11...Corner, S21...One side, S22...Opposite surface, S31...Mounting surface, FA...Opposite area, OP...Peripheral area, OPA...Chip opposite area, IA...Central area, OA...Peripheral area, CA...Area of ​​concern

Claims

1. First circuit component (10), The first circuit component is mounted on one surface (S21), and a second circuit component (20) is electrically connected to the first circuit component, Reinforcing members (40-41) made primarily of resin are provided to avoid the area between the first circuit component and the second circuit component, and are in contact with the side wall (S11) of the first circuit component and the one surface, thereby reinforcing the connection between the first circuit component and the second circuit component. The second circuit component is mounted on the mounting surface (S31), and a third circuit component (30) is electrically connected to the second circuit component, It comprises a plurality of electrical connection parts (22, 50, 51) which are at least partially positioned between the second circuit component and the third circuit component and contribute to the electrical connection between the second circuit component and the third circuit component, Each electrical connection portion is provided at a position offset from the member-facing portion which is the opposing region of the reinforcing member, and is provided in the opposing region of the first circuit component and around the opposing region of the first circuit component.

2. The electronic device according to claim 1, wherein each electrical connection is provided at a position offset from the member-facing portion.

3. Each electrical connection portion includes an opposing surface electrode (22) provided on an opposing surface (S22) that is opposite to the one surface of the second circuit component and faces the mounting surface, and a solder ball (50) electrically connected to the opposing surface electrode, wherein the opposing surface electrode is provided at a position offset from the member opposing portion, as described in claim 1.

4. The first circuit component comprises a semiconductor chip, The electronic device according to any one of claims 1 to 3, wherein each electrical connection portion is provided at a position offset from the edge-facing portion that faces the edge of the semiconductor chip.

5. The first circuit component comprises a semiconductor chip, The electronic device according to any one of claims 1 to 3, wherein each electrical connection portion is provided at a position offset from the chip-facing portion facing the semiconductor chip.

6. The electronic device according to any one of claims 1 to 3, wherein each electrical connection is provided at a position offset from the member-facing portion and the periphery of the member-facing portion.

7. The system further includes a mechanical connection part (60) that mechanically connects the second circuit component and the third circuit component, The electronic device according to claim 1, wherein the mechanical connection portion is provided at least on the portion facing the member.

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