Wireless power transmission device

JPWO2025100004A5Pending Publication Date: 2026-06-15
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Filing Date
2026-03-11
Publication Date
2026-06-15

AI Technical Summary

Technical Problem

In radio energy transmission equipment, the discharge mode of the MOSFET causes radiated noise, and when using heat, a floating capacitor will form, increasing the noise propagation path, and the electromagnetic shielding material covering the entire circuit board will affect the transmission of electricity.

Method used

A wireless power transmission device is designed, which includes a circuit board, a power transmission resonance circuit, a noise suppression circuit, a power semiconductor device and a control circuit. By forming a specific electrical mode on the circuit board, the power semiconductor device is electrically connected to the noise suppression circuit and conducting heat through a heat sink to the other side of the circuit board, thereby forming a floating capacitor to stabilize the ground potential of the control circuit and suppressing radiated noise.

Benefits of technology

It effectively suppresses the local temperature rise on the circuit board, stabilizes the operation of the circuit, reduces radiated noise, and improves the reliability of the radio energy transmission equipment.

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Abstract

This power transmission device is provided with: a power transmission resonance circuit that is mounted on a first main surface of a circuit board; a noise suppression circuit that is mounted on the first main surface and is electrically connected to the power transmission resonance circuit; a power semiconductor element that is mounted on the first main surface and includes a switching element that applies a periodically varying voltage to the power transmission resonance circuit; a control circuit that is mounted on the first main surface and controls the switching element; and a heat spreader that is in thermal contact with a second main surface of the circuit board. The circuit board has an electrical pattern formed thereon that electrically connects a switching node of the power semiconductor element and the noise suppression circuit. The heat spreader radiates heat generated by the power semiconductor element, overlaps the entire control circuit in a plan view, and does not overlap either the power semiconductor element or the noise suppression circuit.
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