Test apparatus

Abstract

The present application relates to a test socket comprising: a base plate having first through holes; a floating plate provided on the base plate and having second through holes that are vertically superimposed with each of the first through holes, wherein the floating plate comprises a thin portion and a thick portion having a thickness greater than the thickness of the thin portion; and socket pins inserted into the first and second through holes, each of which is vertically superimposed with each other.

Description

Technology Field

[0001] This application relates to a test device. Background Technology

[0002] Semiconductor packages manufactured through general semiconductor production processes are subject to various testing processes to verify product reliability. Through these testing processes, semiconductor packages are classified into normal and defective products, thereby maintaining the reliability of the semiconductor package products. General testing processes include electrical characteristic tests to inspect the electrical properties and defects of the semiconductor package; the status of the semiconductor package can be verified by contacting the external terminals of the semiconductor package onto a test board equipped with a test signal generation circuit. The problem to be solved

[0003] The purpose of the present application is to provide a test device capable of reducing the contact area between a test socket and a semiconductor package. means of solving the problem

[0004] The present application relates to a test socket, comprising: a base plate having first through holes; a floating plate provided on the base plate and having second through holes that are vertically superimposed with each of the first through holes, wherein the floating plate comprises a thin portion and a thick portion having a thickness greater than the thickness of the thin portion; and socket pins inserted into the first and second through holes, each of which is vertically superimposed with each other.

[0005] The present application relates to a test socket comprising: a base plate having first through holes; a floating plate provided on the base plate, wherein the floating plate has a recessed trench from a portion of the upper surface of the floating plate, the floating plate comprises a rear portion of one side of the trench and a thin portion below the trench, the floating plate has second through holes penetrating the thin portion and the thick portion, the second through holes each vertically overlapping the first through holes; and socket pins inserted into the first and second through holes each of which are vertically overlapping each other.

[0006] The present application relates to a test device comprising: a test substrate; a base plate provided on the test substrate and having first through holes; a floating plate provided on the base plate and having second through holes that are vertically superimposed with each of the first through holes, wherein the floating plate comprises a thin portion and a thick portion having a thickness greater than the thickness of the thin portion; and socket pins inserted into the first and second through holes, each of which is vertically superimposed with each other; wherein the test substrate may be configured to be electrically connected to the socket pins to transmit and receive test signals.

[0007] The present application relates to a method of operating a test device, comprising: preparing a semiconductor package; mounting the semiconductor package in a test socket, wherein the test socket comprises: a base plate having first through holes; a floating plate provided on the base plate and having second through holes that are vertically superimposed with each of the first through holes, wherein the floating plate comprises a thin portion and a thick portion having a thickness greater than the thickness of the thin portion; and socket pins inserted into the first and second through holes, each of which is vertically superimposed with each other; and testing the semiconductor package by applying test signals to a test substrate provided below the test socket.

[0008] When the semiconductor package is mounted on the floating plate, the semiconductor package may be in contact with the rear portion of the floating plate and may not be in contact with the thin portion of the floating plate.

[0009] Mounting the semiconductor package on the test socket may include moving the semiconductor package by a package driver; and mounting the moved semiconductor package on the floating plate.

[0010] It further includes at least one elastic member provided between the base plate and the floating plate; and the elastic member may be configured to space the base plate and the floating plate apart.

[0011] Mounting the moved semiconductor package on the floating plate may include pressing the moved semiconductor package; and fixing the floating plate in a lowered position level.

[0012] Moving the semiconductor package by the package driver may include the package driver selecting the test socket according to the bending direction of the prepared semiconductor package; and the package driver moving the prepared semiconductor package to the selected test socket.

[0013] The above floating plate further includes an edge portion surrounding the thin portion and the rear portion from a planar perspective; and the level of the upper surface of the edge portion may be higher than the level of the upper end of the rear portion.

[0014] The above edge portion can guide the edge of the semiconductor package when the semiconductor package is mounted on the test socket.

[0015] After testing the semiconductor package, unloading the semiconductor package may be further included.

[0016] Testing the semiconductor package may include determining whether the semiconductor package operates normally using the test signals. Effects of the invention

[0017] According to one embodiment of the present application, the contact area between the semiconductor package and the test socket can be reduced during the test process. As a result, the amount of electrostatic charge accumulated as the test process is repeated can be reduced. Brief explanation of the drawing

[0018] FIG. 1 is a plan view of a test device according to one embodiment of the present application. Figure 2 is a cross-sectional view taken along line II' of Figure 1. Figure 3 is a cross-sectional view taken along the line II-II' of Figure 1. FIG. 4 is a plan view of a test device according to one embodiment of the present application. Figure 5 is a cross-sectional view taken along line II' of Figure 4. FIGS. 6 to 8 are cross-sectional views illustrating a method of operation of a test device according to one embodiment of the present application. FIGS. 9 and FIGS. 10 are cross-sectional views showing a test apparatus according to one embodiment of the present application. FIGS. 11 and FIGS. 12 are flowcharts illustrating a method of operation of a test device according to one embodiment of the present application. FIGS. 13 to 16 are plan views of a test socket according to one embodiment of the present application. FIG. 17 is a plan view showing a test device according to one embodiment of the present application. FIG. 18 is a cross-sectional view taken along line II' of FIG. 17. Specific details for implementing the invention

[0019] Hereinafter, embodiments of the present application will be described in detail with reference to the attached drawings.

[0020] FIG. 1 is a plan view of a test device according to one embodiment of the present application. FIG. 2 is a cross-sectional view taken along line II' of FIG. 1. FIG. 3 is a cross-sectional view taken along line II-II' of FIG. 1. FIG. 4 is a plan view of a test device according to one embodiment of the present application. FIG. 5 is a cross-sectional view taken along line II' of FIG. 4. FIG. 6 to 8 are cross-sectional views illustrating a method of operation of a test device according to one embodiment of the present application.

[0021] Referring to FIGS. 1 to 3, a test device (10) according to one embodiment may include a test socket (100) and a test substrate (200). The test socket (100) may include a base plate (110), a floating plate (120), an elastic member (130), socket pins (140), and a cover (150).

[0022] A base plate (110) may be provided on a test substrate (200). The base plate (110) may have a lower surface of the base plate (110) in contact with the upper surface of the test substrate (200) and an upper surface of the base plate (120) facing the upper surface of the base plate (110). Additionally, the base plate (110) may have a plurality of first through holes (TH1). The first through holes (TH1) may penetrate the base plate (110). In this case, the first through holes (TH1) may penetrate the upper and lower surfaces of the base plate (110) and the body of the base plate (110) between the upper and lower surfaces of the base plate (110). In one embodiment, each of the socket pins (140) may be inserted into each of the first through holes (TH1). Additionally, the base plate (110) may have a first elastic member trench (ETR1). The first elastic member trench (ETR1) may be a trench formed by recessing from a part of the upper surface of the base plate (110). The base plate (110) may be formed from at least one of engineering plastics. For example, the base plate (110) may be formed from at least one of a polyamide-based material, a polyoxymethylene-based material, a polycarbonate-based material, a polybutylene terephthalate-based material, a modified polyphenylene oxide-based material, a polyimide-based material, a polysulfone-based material, a polyphenylene sulfide-based material, a polyamide-imide-based material, and a polyether ether ketone-based material, but is not limited thereto.The base plate (110) may be formed of MDS100, Vespel, Tolron, PEEK (polyetheretherketone), ceramic, etc. Additionally, the base plate (110) has a surface resistance of 10. 13 It may also be formed of at least one substance with a ohm or greater.

[0023] A floating plate (120) may be provided on a base plate (110). The floating plate (120) may have a lower surface of the floating plate (120) facing the upper surface of the base plate (110) and an upper surface of the floating plate (120) facing the lower surface of the floating plate (120). Additionally, the floating plate (120) may include a thin portion (121), a thick portion (123), and an edge portion (125), and may have a recessed trench (TR) from a portion of the upper surface of the floating plate (120). The inner surface of the trench (TR) may be substantially perpendicular to the lower surface of the floating plate (120), but is not limited thereto, so the inner surface of the trench (TR) may be inclined toward the lower surface of the floating plate (120). In other words, the distance between the inner sides of the trench (TR) may decrease as they approach the lower surface of the floating plate (120). The floating plate (120) may be formed from at least one of engineering plastics. For example, the floating plate (120) may be formed from at least one of a polyamide-based material, a polyoxymethylene-based material, a polycarbonate-based material, a polybutylene terephthalate-based material, a modified polyphenylene oxide-based material, a polyimide-based material, a polysulfone-based material, a polyphenylene sulfide-based material, a polyamide-imide-based material, and a polyether ether ketone-based material, but is not limited thereto.The floating plate (120) may be formed of MDS100, Vespel, Tolron, PEEK (polyetheretherketone), ceramic, etc. Additionally, the floating plate (120) has a surface resistance of 10. 13 It may also be formed of at least one substance with a ohm or greater.

[0024] The thin portion (121) may be the body of the floating plate (120) under the trench (TR). The thin portion (121) may be a part of the floating plate (120) and may be a thin portion of the floating plate (120) with respect to the thickness of the rear portion (123). In other words, the thin portion (121) may have a thickness smaller than that of the rear portion (123).

[0025] The rear portion (123) may be the body of the floating plate (120) on one side of the trench (TR). The rear portion (123) may be a part of the floating plate (120) and may be a thicker portion of the floating plate (120) relative to the thickness of the thin portion (121). In other words, the rear portion (123) may have a thickness greater than that of the thin portion (121).

[0026] In one embodiment, the difference between the thickness of the thin portion (121) and the thickness of the rear portion (123) may be 0.05 mm to 5 mm. For example, the difference between the thickness of the thin portion (121) and the thickness of the rear portion (123) may be 0.05 mm to 2 mm. For example, the difference between the thickness of the thin portion (121) and the thickness of the rear portion (123) may be 0.1 mm to 0.5 mm.

[0027] In one embodiment, the lower surface of the thin portion (121) may form a co-surface with the lower surface of the rear portion (123). As previously disclosed, since the thin portion (121) is thinner than the thickness of the rear portion (123), the upper surface of the thin portion (121) may be lower than the upper surface of the rear portion (123).

[0028] In one embodiment, the planar area of ​​the thin portion (121) may be 50% to 90% of the sum of the planar areas of the thin portion (121) and the rear portion (123). For example, the planar area of ​​the thin portion (121) may be 50% to 80% of the sum of the planar areas of the thin portion (121) and the rear portion (123). For example, the planar area of ​​the thin portion (121) may be 55% to 75% of the sum of the planar areas of the thin portion (121) and the rear portion (123).

[0029] The floating plate (120) may have a plurality of second through holes (TH2). The second through holes (TH2) may penetrate the floating plate (120). In this case, the second through holes (TH2) may penetrate the upper and lower surfaces of the floating plate (120) and the body of the floating plate (120) between the upper and lower surfaces of the floating plate (120). More specifically, the thin portion (121) and the rear portion (123) may have a plurality of second through holes (TH2). In this case, the second through holes (TH2) may penetrate the upper and lower surfaces of the thin portion (121), the body of the thin portion (121) between the upper and lower surfaces of the thin portion (121), the upper and lower surfaces of the rear portion (123), and the body of the rear portion (123) between the upper and lower surfaces of the rear portion (123). In one embodiment, each of the socket pins (140) may be inserted into each of the second through holes (TH2). Additionally, the second through holes (TH2) may be vertically overlapped with each of the first through holes (TH1).

[0030] The edge portion (125) may be configured to surround the thin portion (121) and the rear portion (123) in a planar view. In other words, the edge portion (125) may be provided along the outer edge of the thin portion (121) and / or the rear portion (123) while in contact with parts of the thin portion (121) and / or the rear portion (123). In one embodiment, the level of the upper surface of the edge portion (125) may be higher than the level of the top of the rear portion (123). Additionally, a part of the edge portion (125) may have an inclined surface.

[0031] The lower surface of the edge portion (125) may form a co-surface with the lower surface of the thin portion (121) and / or the lower surface of the rear portion (123). As previously disclosed, since the level of the upper surface of the edge portion (125) is higher than the level of the upper surface of the rear portion (123), the edge portion (125) may have a thickness greater than the thickness of the thin portion (121) and / or the rear portion (123).

[0032] Each of the thin portion (121), the rear portion (123), and the edge portion (125) may be formed of different materials, some of which may be formed of the same or similar materials, and all of which may be formed of the same material. The thin portion (121), the rear portion (123), and the edge portion (125) may be formed integrally when formed of the same material.

[0033] The floating plate (120) may have a second elastic member trench (ETR2). The second elastic member trench (ETR2) may be a trench formed by recessing from a part of the lower surface of the floating plate (120). More specifically, the edge portion (125) of the floating plate (120) may have a second elastic member trench (ETR2). The second elastic member trench (ETR2) may be a trench formed by recessing from a part of the lower surface of the edge portion (125).

[0034] An elastic member (130) may be provided between the base plate (110) and the floating plate (120). More specifically, the lower surface of the elastic member (130) may be in contact with the upper surface of the base plate (110), and the upper surface of the elastic member (130) may be in contact with the lower surface of the floating plate (120). Through this, the elastic member (130) may be configured to separate the base plate (110) and the floating plate (120), and to contract or expand to adjust the position level of the floating plate (120). In one embodiment, the elastic member (130) may be a spring, specifically a coil spring, and as long as it possesses an elastic force capable of separating the base plate (110) and the floating plate (120), the material, type, size, shape, etc. of the elastic member (130) are not limited.

[0035] In one embodiment, the elastic member (130) may be provided within the first elastic member trench (ETR1) and / or the second elastic member trench (ETR2). For example, the elastic member (130) may be provided within the first elastic member trench (ETR1). For example, the elastic member (130) may be provided within the second elastic member trench (ETR2). For example, a portion of the elastic member (130) may be provided within the first elastic member trench (ETR1), and a portion of the elastic member (130) may be provided within the second elastic member trench (ETR2). In this case, the lower surface of the elastic member (130) may be provided on the upper surface of the first elastic member trench (ETR1), and the upper surface of the elastic member (130) may be provided on the lower surface of the second elastic member trench (ETR2).

[0036] Socket pins (140) may be provided within the base plate (110) and the floating plate (120). More specifically, socket pins (140) may be provided within the first through holes (TH1) of the base plate (110) and the second through holes (TH2) of the floating plate (120). In this case, the first and second through holes (TH1, TH2) may each overlap vertically with each other, and each of the socket pins (140) may be inserted into each of the first and second through holes (TH1, TH2) that overlap vertically with each other.

[0037] Referring to FIGS. 2 and FIGS. 6, each of the upper portions of the socket pins (140) can contact the external terminals (B, ball) of the semiconductor package (PA), and the lower portions of the socket pins (140) can contact the test board (200). In this way, the socket pins (140) can electrically connect the external terminals (B) of the semiconductor package (PA) and the test board (200). Each of the socket pins (140) may include a pin body (141) and a pin head (143) on the pin body (141). The pin body (141) may correspond to the middle-lower portion of each socket pin (140), and the lower portion of the pin body (141) may be electrically connected to the terminals (not shown in the drawings) of the test board (200). The pin body (141) may include a spring in the intermediate region, and as the spring of the pin body (141) contracts due to pressure applied from the direction of the semiconductor package (PA), the pin head (143) may be moved in a direction toward the pin body (141) from the semiconductor package (PA). The pin head (143) may correspond to the upper region of each of the socket pins (140), and the upper end of the pin head (143) may be electrically connected to the semiconductor package (PA). The pin head (143) may contact the external terminals (B) of the semiconductor package (PA). Additionally, the pin head (143) may further include an inwardly recessed portion. The pin head (143) may increase the contact area with the external terminals (B) of the semiconductor package (PA) by including the recessed portion.

[0038] In one embodiment, the pin body (141) may be provided within the first through holes (TH1) or the first and second through holes (TH1, TH2), and the pin head (143) may be provided within the second through holes (TH2). In this case, the levels of the tops of the socket pins (140) may be higher than the level of the upper surface of the foil (121). In other words, the level of the upper surface of the foil (121) may be lower than the level of the top of the pin head (143). Also, the level of the top of the pin body (141) may be lower than the level of the upper surface of the foil (121). In other words, the level of the upper surface of the foil (121) may be higher than the level of the top of the pin body (141). Accordingly, the level of the upper surface of the foil (121) may be located between the level of the top of the pin body (141) and the level of the top of the pin head (143).

[0039] The cover (150) may be configured to surround the base plate (110) and the floating plate (120) in a planar view. In other words, the cover (150) may be provided along the outer edge of the base plate (110) and the floating plate (120) while in contact with parts of the base plate (110) and the floating plate (120). In one embodiment, the level of the upper surface of the cover (150) may be co-planar with the level of a part of the upper surface of the floating plate (120). For example, the level of the upper surface of the cover (150) may be co-planar with the level of a part of the upper surface of the edge portion (125). Additionally, the level of the lower surface of the cover (150) may be co-planar with the level of the lower surface of the floating plate (120) and / or the level of the upper surface of the test substrate (200). The cover (150) may be formed from at least one of engineering plastics and may be formed from at least one of metal materials such as aluminum, but is not limited thereto.

[0040] The test board (200) may be a printed circuit board (PCB). The test board (200) may be electrically connected to the socket pins (140) and configured to transmit and receive test signals. A portion or terminals (not shown in the drawing) of the test board (200) may be connected to the bottom of the socket pins (140). A portion or terminals (not shown in the drawing) of the test board (200) may also be coupled to the bottom of each of the pin bodies (141).

[0041] Referring to FIG. 1, from a planar perspective, the rear portion (123) may be set to surround the thin portion (121) provided in a rectangular shape, and the rear portion (123) may be provided in a rectangular shape following the shape of the thin portion (121). In one embodiment, the shapes of the thin portion (121), the rear portion (123), and the edge portion (125) are disclosed as rectangular shapes, but are not limited thereto. In particular, the shapes of the thin portion (121) and the rear portion (123) may be varied as in embodiments disclosed later.

[0042] Referring to FIGS. 2 and 3, the thin portion (121) may be positioned in the central portion of the floating plate (120), and the rear portion (123) may be positioned in the outer portion of the floating plate (120). In other words, the central portion of the floating plate (120) may be a portion where the thickness of the floating plate (120) is relatively thin, including the trench (TR), and the outer portion of the floating plate (120) may be a portion where the thickness of the floating plate (120) is relatively thick, not including the trench (TR).

[0043] Referring to FIG. 4, from a planar perspective, the thin portion (121a) can be set to surround the rear portion (123a) provided in a rectangular shape, and the thin portion (121a) can be provided in a rectangular shape along the shape of the rear portion (123a).

[0044] Referring to FIG. 5, the thin portion (121a) may be positioned on the outer portion of the floating plate (120a), and the rear portion (123a) may be positioned on the central portion of the floating plate (120a). In other words, the outer portion of the floating plate (120a) may be a portion where the thickness of the floating plate (120a) is relatively thin, including the trench (TR), and the central portion of the floating plate (120a) may be a portion where the thickness of the floating plate (120a) is relatively thick, not including the trench (TR).

[0045] Referring to FIGS. 3 and 5, the thin portions (121, 121a) may be set so that their positions are reversed with those of the rear portions (123, 123a). The present application may be set so that the rear portion (123a) is provided in the part where the thin portion (121) is located as in FIG. 3 as in FIG. 3, and may be set so that the thin portion (121a) is provided in the part where the rear portion (123) is located as in FIG. 3 as in FIG. 5.

[0046] Referring to FIGS. 6 to 8, the test device (10) may include a test substrate (200), a test socket (100) provided on the test substrate (200), and a package driver (300) configured to mount a semiconductor package (PA) on the test socket (100).

[0047] The package driver (300) can fix a prepared semiconductor package (PA) to one side of the package driver (300). In this case, the package driver (300) may include means for physically fixing the semiconductor package (PA), such as a grapher, a suction device, or a vacuum chuck, but is not limited thereto. Additionally, the package driver (300) can move the semiconductor package (PA) by moving it while the semiconductor package (PA) is fixed. Additionally, the package driver (300) can provide the semiconductor package (PA) to the test socket (100) by releasing the fixation of the semiconductor package (PA). Additionally, the package driver (300) can mount the semiconductor package (PA) to the test socket (100) by applying pressure to the semiconductor package (PA) provided to the test socket (100). In one embodiment, the package driver (300) may include a body part (310), a fixing part (320), a pressing part (330), and a moving part (not shown in the drawing). The above moving part can be set to change the position of the package driver (300).

[0048] The body part (310) may include frames on which a fixed part (320) and a pressurizing part (330) can be placed, and may be provided with various components belonging to the package actuator (300).

[0049] The fixing part (320) includes means capable of physically fixing, such as a grapher, a suction device, and a vacuum chuck, so that the semiconductor package (PA) can be fixed to the package driver (300). As previously disclosed, the fixing part (320) is not limited to the means disclosed previously, so any means capable of minimizing the impact on the semiconductor package (PA) can be applied.

[0050] The pressurizing unit (330) may include means for applying pressure and may pressurize the semiconductor package (PA) provided in the test socket (100) in a vertical direction. The pressurizing unit (330) may be configured to pressurize the entire semiconductor package (PA) or may be configured to pressurize a part of the semiconductor package (PA). By applying appropriate pressure to the semiconductor package (PA) on the test socket (100) through the pressurizing unit (330), the package driver (300) may control the external terminals (B) of the semiconductor package (PA) to make secure contact with the socket pins (140) of the test socket (100).

[0051] FIGS. 9 and FIGS. 10 are cross-sectional views showing a test apparatus according to one embodiment of the present application.

[0052] Referring to FIGS. 9 and 10, the arrangement of the thin portion (121) and the rear portion (123) of a suitable floating plate (120) can be determined according to the bending direction of the semiconductor packages (PAs, PAc). For example, if a shrinkage difference due to low temperature occurs as shown in FIG. 9, the semiconductor packages (PAs) may have a downwardly concave shape (or a smile shape, etc.). In this case, the floating plate (120) suitable for use may be a floating plate (120) with a thin thickness in the central portion and a thick thickness in the outer portion. For example, if a tensile difference due to high temperature occurs as shown in FIG. 10, the semiconductor packages (PAc) may have an upwardly concave shape (or a crying shape, etc.). In this case, the floating plate (120) suitable for use may be a floating plate (120) with a thick thickness in the central portion and a thin thickness in the outer portion.

[0053] FIGS. 11 and FIGS. 12 are flowcharts illustrating a method of operation of a test device according to one embodiment of the present application.

[0054] Referring to FIG. 11, a method of operation of a test device according to one embodiment of the present application may include preparing a semiconductor package (S100), mounting the semiconductor package in a test socket (S200), and testing the semiconductor package (S300). Referring to FIG. 12, mounting the semiconductor package in a test socket (S200) may include picking up the semiconductor package (S210) and mounting the semiconductor package on a floating plate (S220). This is described in detail as follows.

[0055] Referring to FIGS. 6 and FIGS. 11, a semiconductor package (PA) can be prepared, and the prepared semiconductor package (PA) can be fixed to a package driver (300).

[0056] Referring to FIGS. 7, 11, and 12, a semiconductor package (PA) fixed to a package driver (300) can be moved according to the movement of the package driver (300) and provided on a floating plate (120). In other words, the semiconductor package (PA) can be picked up to the position of the floating plate (120) by the package driver (300). The package driver (300) can select the arrangement of the thin portion (121) and the rear portion (123) of the floating plate (120) according to the bending direction of the prepared semiconductor package (PA). The package driver (300) can move the prepared semiconductor package (PA) to the floating plate (120) having the selected arrangement of the thin portion (121) and the rear portion (123). According to one embodiment, a floating plate (120) may include an edge portion (125) that surrounds a thin portion (121) and a rear portion (123) in a planar view, and the level of the upper surface of the edge portion (125) may be higher than the level of the upper surface of the rear portion (123). During the process of mounting a semiconductor package (PA) on the floating plate (120), the edge portion (125) may guide the edge of the semiconductor package (PA). The semiconductor package (PA) guided by the edge portion (125) may come into contact with a part of the floating plate (120) while fixed to the package driver (300).

[0057] Referring to FIGS. 3, FIGS. 8, FIGS. 11, and FIGS. 12, the fixation by the package driver (300) is released so that the semiconductor package (PA) can come into closer contact with a part of the floating plate (120). Subsequently, the package driver (300) can press the semiconductor package (PA) in a vertical direction to lower the position level of the floating plate (120). Pressure from the package driver (300) can be transmitted to the floating plate (120) through the semiconductor package (PA), and the pressure transmitted to the floating plate (120) can be transmitted to the elastic member (130). As the elastic member (130) is compressed in a vertical direction by the transmitted pressure, the position level of the floating plate (120) can be lowered. Before receiving pressure, the base plate (110) and the floating plate (120) are separated by the elastic member (130), but as the elastic member (130) is compressed while pressure is applied by the package driver (300), the distance between the base plate (110) and the floating plate (120) may be reduced, and the distance between the base plate (110) and the floating plate (120) may reach zero, so that a part of the base plate (110) and the floating plate (120) come into contact. When the position level of the elastic member (130) and / or the socket pins (140) according to one embodiment drops below a set value, the position level of the elastic member (130) and / or the socket pins (140) may be fixed. Through this, the semiconductor package (PA) can be mounted on the floating plate (120).

[0058] According to one embodiment, when a semiconductor package (PA) is mounted on a floating plate (120), the semiconductor package (PA) may come into contact with the rear portion (123) of the floating plate (120) but may not come into contact with the thin portion (121) of the floating plate (120). As previously disclosed, the thin portion (121) is thinner than the thickness of the rear portion (123) and has an upper portion that is lower than the upper portion of the rear portion, so the semiconductor package (PA) may not come into contact with the thin portion (121).

[0059] Referring to FIGS. 8 and FIGS. 11, a test process can be performed on a semiconductor package (PA) mounted on a floating plate (120). More specifically, test signals can be applied from a test board (200) to socket pins (140), and the socket pins (140) can transmit the provided test signals to an external terminal (B) of the semiconductor package (PA). Test signals introduced through the external terminal (B) of the semiconductor package (PA) can be processed into specific signals after passing through the interior of the semiconductor package (PA) and then provided to the external terminal (B) of the semiconductor package (PA), and the introduced test signals can be slightly modified or provided as is to the external terminal (B) of the semiconductor package (PA) after passing through the interior of the semiconductor package (PA). Signals provided from an external terminal (B) of a semiconductor package (PA) can be transmitted to a test board (200) via socket pins (140), and it can be determined whether the semiconductor package (PA) is operating normally based on signals transmitted from the test board (200) or other devices connected to the test board (200).

[0060] After the test is performed, the semiconductor package (PA) mounted on the floating plate (120) can be detached (or unloaded).

[0061] FIGS. 13 to 16 are plan views of a test socket according to one embodiment of the present application.

[0062] FIGS. 13 to 16 are plan views of a test socket according to one embodiment of the present application. At least one trench (TR) of the test socket (100) according to one embodiment of the present application may include embodiments extendable from the trench (TR) shown in FIGS. 1 and FIGS. 4, and more detailed embodiments may be described based on the embodied drawings, but are not limited thereto.

[0063] Referring to FIGS. 1, FIGS. 4, and FIGS. 13 through 16, the trench (TR) within the floating plate (120) of the test socket (100) can be formed in various shapes. As previously discussed, the trench (TR) in FIGS. 1 and FIGS. 4 can be formed as a rectangle in a planar view, and the trench (TR) in FIGS. 4 can be formed at an inverted position of the trench (TR) in FIGS. 1. In other words, the thin portion (121) in FIGS. 1 can be inverted and changed to the rear portion (123a) in FIGS. 4, and the rear portion (123) in FIGS. 1 can also be inverted and changed to the thin portion (121a) in FIGS. 4.

[0064] Referring to FIG. 13, the trench (TR) within the floating plate (120) of the test device (10b) may be a plus shape (or cross shape, or cross shape) formed by two rectangles intersecting in a vertical direction from a planar perspective. In one embodiment, since the bottom of the trench (TR) corresponds to the thin section (121), the thickness of the thin section (121), which is the floating plate (120) separated by the plus shape, may be thinner than the thickness of the rear section (123), which is the floating plate (120) separated by the remainder excluding the plus shape. Additionally, as the position of the trench (TR) is reversed, the rear section (123) may be reversed into the thin section (121b), and the thin section (121) may be reversed into the rear section (123b).

[0065] Referring to FIG. 14, the trench (TR) within the floating plate (120) of the test device (10c) may be an X shape formed by two rectangles intersecting diagonally from a planar perspective. In one embodiment, since the bottom of the trench (TR) corresponds to the thin section (121), the thickness of the thin section (121), which is the floating plate (120) divided by the X shape, may be thinner than the thickness of the rear section (123), which is the floating plate (120) divided by the remainder excluding the X shape. Additionally, as the position of the trench (TR) is reversed, the rear section (123) may be reversed into the thin section (121c), and the thin section (121) may be reversed into the rear section (123c).

[0066] Referring to FIG. 15, the trench (TR) within the floating plate (120) of the test device (10d) may be a windmill shape (or a pinwheel shape, a combination of four blades, a fan blade shape, etc.) formed by four blade shapes intersecting at the center from a planar perspective. In one embodiment, since the area below the trench (TR) corresponds to the thin section (121), the thickness of the thin section (121), which is the floating plate (120) divided into the windmill shape, may be thinner than the thickness of the rear section (123), which is the floating plate (120) divided into the rest excluding the windmill shape. Additionally, as the position of the trench (TR) is reversed, the rear section (123) may be reversed into the thin section (121d), and the thin section (121) may be reversed into the rear section (123d).

[0067] Referring to FIG. 16, the trench (TR) within the floating plate (120) of the test device (10e) may be circular in shape from a planar perspective. In one embodiment, since the lower part of the trench (TR) corresponds to the thin portion (121), the thickness of the thin portion (121), which is the floating plate (120) divided into circular shapes, may be thinner than the thickness of the rear portion (123), which is the floating plate (120) divided into the remainder excluding the circular shape. Additionally, as the position of the trench (TR) is reversed, the rear portion (123) may be reversed into the thin portion (121e), and the thin portion (121) may be reversed into the rear portion (123e).

[0068] FIG. 17 is a plan view showing a test apparatus according to one embodiment of the present application. FIG. 18 is a cross-sectional view taken along line II' of FIG. 17. FIG. 17 and FIG. 18 show another embodiment of FIG. 1 and further include an inclined portion (127).

[0069] Referring to FIGS. 17 and 18, when the floating plate (120f) of the test device (10f) is recessed to form a trench (TR), the trench (TR) may have an inner surface inclined from the upper surface of the floating plate (120f) toward the lower surface of the floating plate (120f). The inclined portion (127) may be the body of the floating plate (120f) below the inclined inner surface of the trench (TR). The inclined portion (127) may be a part of the floating plate (120f) that is shallow relative to the thickness of the rear portion (123) and thick relative to the thickness of the thin portion (121) of the floating plate (120f). In other words, the inclined portion (127) may be the body of the floating plate (120f) between the thin portion (121) and the rear portion (123).

[0070] The inclined portion (127) can be configured to be provided between the thin portion (121) and the rear portion (123) in a planar view. In other words, the inclined portion (127) can separate the thin portion (121) and the rear portion (123) while contacting parts of both the thin portion (121) and the rear portion (123).

[0071] Additionally, the inclined portion (127) may have a plurality of second through holes (TH2). In this case, the second through holes (TH2) may penetrate the upper and lower surfaces of the inclined portion (127) and the body of the inclined portion (127) between the upper and lower surfaces of the inclined portion (127).

[0072] In one embodiment, the lower surface of the inclined portion (127) may form a co-surface with the lower surface of the thin portion (121) and the rear portion (123). As previously disclosed, since the inclined portion (127) is thicker than the thickness of the thin portion (121) and thinner than the thickness of the rear portion (123), the upper surface of the inclined portion (127) may be higher than the upper surface of the thin portion (121) and lower than the upper surface of the rear portion (123).

[0073] The inclined portion (127) may be formed from materials different from at least one of the thin portion (121), the rear portion (123), and the edge portion (125), some of which may be formed from the same or similar materials, and may be formed from the same material. The thin portion (121), the rear portion (123), the edge portion (125), and the inclined portion (127) may be formed integrally when formed from the same material.

[0074] As described above, according to an embodiment of the present application, the contact area between the semiconductor package and the test socket can be reduced during the test process. As a result, the amount of electrostatic charge accumulated as the test process is repeated can be reduced. In addition, the test process can be smoothly performed on semiconductor packages that have undergone slight bending. Through this, the number of cases where the semiconductor package is damaged due to problems occurring during the test process can be reduced, thereby increasing the yield of the semiconductor package itself.

[0075] Although the present application has been described with reference to preferred embodiments thereof, those skilled in the art or those with ordinary knowledge in the art will understand that the present application may be modified and changed in various ways without departing from the spirit and scope of the application as set forth in the claims below. For example, the embodiments described above may be combined with one another in various forms, provided they are not mutually incompatible.

[0076] Therefore, the technical scope of the present application should not be limited to the contents described in the detailed description of the specification, but should be determined by the claims.

Claims

Claim 1 A test socket comprising: a base plate having first through holes; a floating plate provided on the base plate and having second through holes that are vertically superimposed with each of the first through holes, wherein the floating plate comprises a thin portion and a thick portion having a thickness greater than the thickness of the thin portion; and socket pins inserted into each of the first and second through holes that are vertically superimposed with each other. Claim 2 In claim 1, the lower surface of the thin portion forms a co-plane with the lower surface of the rear portion, and the upper surface of the thin portion is lower than the upper surface of the rear portion, a test socket. Claim 3 A test socket according to claim 1, wherein the planar area of ​​the thin portion is 50% to 80% of the sum of the planar areas of the thin portion and the rear portion. Claim 4 In claim 1, the level of the upper surface of the foil portion is lower than the levels of the upper portions of the socket pins, for the test socket. Claim 5 A test socket comprising: a base plate having first through holes; a floating plate provided on the base plate, wherein the floating plate has a recessed trench from a portion of the upper surface of the floating plate, the floating plate comprises a thick portion on one side of the trench and a thin portion below the trench, the floating plate has second through holes penetrating the thin portion and the thick portion, the second through holes each vertically overlapping the first through holes; and socket pins inserted into the first and second through holes each of which are vertically overlapping each other. Claim 6 In claim 5, a test socket in which the planar area of ​​the thin portion is 50% to 80% of the sum of the planar areas of the thin portion and the rear portion. Claim 7 A test socket according to claim 5, wherein the difference between the thickness of the thin portion and the thickness of the rear portion is 0.05 mm to 5 mm. Claim 8 In claim 5, the level of the upper surface of the above-mentioned foil is lower than the levels of the upper ends of the socket pins, for the test socket. Claim 9 A test device comprising: a base plate provided on a test substrate and having first through holes; a floating plate provided on the base plate and having second through holes vertically overlapping each of the first through holes, wherein the floating plate comprises a thin portion and a thick portion having a thickness greater than the thickness of the thin portion; and socket pins inserted into each of the first and second through holes that are vertically overlapping each other; wherein the test substrate is electrically connected to the socket pins and configured to transmit and receive test signals. Claim 10 In claim 9, the lower surface of the above-mentioned thin part forms a co-plane with the lower surface of the above-mentioned rear part, and the upper surface of the above-mentioned thin part is lower than the upper surface of the above-mentioned rear part, a test device.

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