A deposition mask for OLED pixel deposition

Abstract

A deposition mask according to an embodiment includes a metal plate comprising a first surface and a second surface opposite to the first surface, wherein the metal plate has a first direction defined in the longitudinal direction and a second direction defined in the width direction of the metal plate, and the metal plate includes a first surface hole formed on the first surface, a second surface hole formed on the second surface, and a plurality of through holes formed by a connecting portion connecting the first surface hole and the second surface hole, wherein the width of the first surface hole is smaller than the width of the second surface hole, and a plurality of pattern portions are arranged on the first surface.

Description

Technology Field

[0001] The embodiment relates to a deposition mask for depositing OLED pixels. Background Technology

[0002] Display devices are applied and used in a variety of devices. For example, display devices are used not only in small devices such as smartphones and tablet PCs, but also in large devices such as TVs, monitors, and public displays (PDs). In particular, recently, there has been an increasing demand for ultra-high resolution UHD (Ultra High Definition) with 500 PPI (Pixels Per Inch) or higher, and high-resolution display devices are being applied to both small and large devices. Accordingly, interest in technologies for low power consumption and high resolution is growing.

[0003] Commonly used display devices can be broadly classified into LCD (Liquid Crystal Display) and OLED (Organic Light Emitting Diode) depending on the driving method.

[0004] An LCD is a display device driven using liquid crystal, having a structure in which a light source including a CCFL (Cold Cathode Fluorescent Lamp) or LED (Light Emitting Diode) is disposed below the liquid crystal, and is a display device driven by controlling the amount of light emitted from the light source using the liquid crystal disposed on the light source.

[0005] In addition, OLEDs are display devices driven by organic materials, and they do not require a separate light source; instead, the organic material itself acts as the light source, allowing them to operate at low power. Furthermore, OLEDs can express infinite contrast ratios, have a response speed approximately 1,000 times faster than LCDs, and offer excellent viewing angles, making them a promising display device capable of replacing LCDs.

[0006] In particular, the organic material included in the light-emitting layer of the OLED can be deposited on a deposition substrate by a deposition mask called a Fine Metal Mask (FMM), and the deposited organic material can perform the function of a pixel by forming a pattern corresponding to the pattern formed on the deposition mask. The deposition mask is generally manufactured from an Invar alloy metal plate containing iron (Fe) and nickel (Ni). At this time, through holes penetrating one side and the other side of the metal plate are formed, and the through holes can be formed at positions corresponding to the pixel pattern. Accordingly, organic materials such as red, green, and blue can be deposited on the substrate by passing through the through holes of the metal plate, and a pixel pattern can be formed on the substrate.

[0007] In order to deposit an organic material on a deposition substrate using the above deposition mask, a plurality of deposition masks can be attached to the deposition substrate so that the organic material can be deposited on the deposition substrate. Subsequently, the deposition mask is separated from the deposition substrate, and the deposition mask is attached to another deposition substrate to deposit an organic material on another deposition substrate.

[0008] In other words, the deposition mask undergoes a process of repeatedly adhering to and separating from the deposition substrate. At this time, when separating the deposition mask and the deposition substrate, there is a problem in that the deposition substrate or the deposition mask is damaged during the separation process due to static electricity between the deposition mask and the deposition substrate.

[0009] Therefore, a new deposition mask capable of solving the above-mentioned problems is required. The problem to be solved

[0010] The embodiment aims to provide a deposition mask with improved reliability. means of solving the problem

[0011] A deposition mask according to an embodiment includes a metal plate comprising a first surface and a second surface opposite to the first surface, wherein the metal plate has a first direction defined in the longitudinal direction and a second direction defined in the width direction of the metal plate, and the metal plate includes a first surface hole formed on the first surface, a second surface hole formed on the second surface, and a plurality of through holes formed by a connecting portion connecting the first surface hole and the second surface hole, wherein the width of the first surface hole is smaller than the width of the second surface hole, and a plurality of pattern portions are arranged on the first surface.

[0012] The deposition mark according to the embodiment has the pattern portion arranged in a raised shape, the thickness of the pattern portion is 10% or less of the thickness of the metal plate, and the area of ​​the pattern portion is 80% or more of the total area of ​​the first surface.

[0013] In the deposition mark according to the embodiment, the pattern portion is arranged in an intaglio shape, the depth of the pattern portion is 10% or less with respect to the thickness of the metal plate, and the area of ​​the pattern portion is 20% or less with respect to the total area of ​​the first surface.

[0014] A deposition mark according to an embodiment comprises a metal plate including a deposition area and a non-deposition area, and the pattern portion is disposed in at least one of the deposition area and the non-deposition area.

[0016] In the deposition mark according to the embodiment, the surface roughness of the first surface of the metal plate and the surface roughness of the upper or lower surface of the pattern part are different from each other. Effects of the invention

[0017] The deposition mask according to the embodiment can prevent damage to the deposition mask or the deposition substrate that is adhered to the deposition mask.

[0018] Specifically, by reducing the magnitude of static electricity generated when the deposition mask adheres to the deposition substrate, damage to the deposition mask or the deposition substrate caused by the static electricity can be prevented when the deposition mask and the deposition substrate are separated.

[0019] That is, the static electricity generated on the deposition mask is proportional to the contact area between the deposition mask and the deposition substrate that adheres to it, and the deposition mask according to the embodiment includes a pattern portion that reduces the contact area.

[0020] That is, when the deposition mask is adhered to the deposition substrate by the pattern portion of the embossed or intaglio shape, the contact area between the deposition mask and the deposition substrate can be reduced.

[0021] Accordingly, the electrostatic magnitude of the deposition mask proportional to the contact area is reduced, thereby preventing damage to the deposition mask and the deposition substrate attached thereto. Brief explanation of the drawing

[0022] FIG. 1 is a drawing illustrating an organic deposition apparatus including a deposition mask according to an embodiment. FIG. 2 is a diagram illustrating the formation of a deposition pattern on a deposition substrate through a deposition mask according to an embodiment. FIG. 3 is a plan view of a deposition mask according to a first embodiment. Figure 4 is a cross-sectional view of the AA' region of Figure 3. Figure 5 is a cross-sectional view showing the deposition mask of Figure 3 adhering to the deposition substrate. FIG. 6 is a plan view of a deposition mask according to a second embodiment. Figure 7 is a cross-sectional view showing the BB' region of Figure 6. Figure 8 is a cross-sectional view showing the deposition mask of Figure 7 adhering to the deposition substrate. Specific details for implementing the invention

[0023] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted. Furthermore, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a meaning generally understood by those skilled in the art to which the present invention belongs, unless explicitly and specifically defined otherwise. Terms used generally, such as those defined in advance, may be interpreted in consideration of their meaning in the context of the relevant technology.

[0024] Furthermore, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention. In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as “A and at least one of B and C (or more than one),” it may include one or more of all combinations that can be formed from A, B, and C.

[0025] In addition, terms such as first, second, A, B, (a), (b), etc., may be used when describing the components of the embodiments of the present invention. These terms are used merely to distinguish the components from other components and are not intended to limit the essence, order, or sequence of the components.

[0026] And, where it is stated that a component is 'connected', 'combined', or 'joined' to another component, this may include not only cases where the component is directly connected, combined, or joined to the other component, but also cases where it is 'connected', 'combined', or 'joined' due to another component located between the component and the other component.

[0027] Additionally, where described as being formed or placed on the "top or bottom" of each component, the top or bottom includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components.

[0028] In addition, when expressed as “up” or “down,” it can include the meaning of a downward direction as well as an upward direction relative to a single component.

[0030] Hereinafter, a deposition mask according to an embodiment is described with reference to the drawings.

[0031] FIG. 1 is a diagram illustrating an organic deposition apparatus to which a deposition mask according to an embodiment is applied, and FIG. 2 is a diagram illustrating the formation of a deposition pattern on a deposition substrate through a deposition mask according to an embodiment.

[0032] Referring to FIGS. 1 and 2, the organic deposition apparatus includes a deposition mask (1000), a mask frame (2000), a deposition substrate (3000), an organic deposition vessel (4000), and a vacuum chamber (5000).

[0033] The deposition mask (1000) includes a metal plate (10). For example, the deposition mask (1000) may include a metal plate (10) containing iron (Fe) and nickel (Ni). For example, the deposition mask (1000) may include a metal plate (10) containing invar.

[0034] The deposition mask (1000) includes a plurality of through holes (TH) formed in an effective portion for deposition. For example, the metal plate (10) includes a first surface (1S) and a second surface (2S), and the through holes (TH) are formed by penetrating the first surface (1S) and the second surface (2S) of the metal plate (10). Specifically, a first surface hole (V1) is formed in the first surface (1S), a second surface hole (V2) is formed in the second surface (2S), and the first surface hole (V1) and the second surface hole (V2) are connected by a connecting portion (CA).

[0035] The first face hole (V1) and the second face hole (C2) have different sizes. Specifically, the width of the first face hole (V1) is smaller than the width of the second face hole (V2). That is, the first face hole (V1) is defined as a small face hole, and the second face hole (V2) is defined as a large face hole.

[0036] The organic material of the above organic material deposition device can enter the second surface hole (V2), come out through the first surface hole (V1), and be deposited on the deposition substrate (3000).

[0037] The deposition mask (1000) may be a substrate for a deposition mask that includes a plurality of through holes (TH). In this case, the through holes (TH) are formed to correspond to a pattern (DP) to be formed on the substrate. The deposition mask (1000) may include non-effective portions other than effective portions that include a deposition area.

[0038] The deposition mask (1000) is placed and fixed on a mask frame (2000). Specifically, a plurality of deposition masks (1000) are fixed to the mask frame (2000). That is, a plurality of mask frames having a stick shape are arranged in one direction on the mask frame (2000).

[0039] The deposition mask (1000) is fixed to the mask frame (2000) by welding one end and the other end of the deposition mask (1000) to the mask frame (2000). For example, the deposition mask (1000) can be tensioned with a constant tensile force, and the one end and the other end of the deposition mask (1000) can be fixed by welding them to the mask frame (2000). Subsequently, a portion of the deposition mask (1000) placed outside the mask frame (2000) can be removed by a method such as cutting.

[0040] The above-deposited substrate (3000) is a substrate used in the manufacture of a display device. For example, the above-deposited substrate (3000) may be a substrate for depositing organic material for an OLED pixel pattern. On the above-deposited substrate (3000), organic material patterns of red, green, and blue are formed to form pixels of the three primary colors of light. That is, RGB patterns may be formed on the above-deposited substrate (3000).

[0041] The organic material deposition vessel (4000) may be a crucible. An organic material is placed inside the crucible. The organic material deposition vessel (4000) moves within a vacuum chamber (5000). That is, the organic material deposition vessel (4000) moves in a first direction within the vacuum chamber (5000). That is, the organic material deposition vessel (4000) moves in the width direction of the deposition mask (1000) within the vacuum chamber (5000). That is, the organic material deposition vessel (4000) moves in a direction perpendicular to the tension direction of the deposition mask (1000) within the vacuum chamber (5000).

[0042] As a heat source and / or current is supplied to the crucible, which is the organic material deposition vessel (4000), within the vacuum chamber (5000), the organic material is deposited on the deposition substrate (3000).

[0043] The deposition mask (1000) is adhered to the deposition substrate (3000). That is, among the surfaces of the deposition mask (1000), one surface where the first surface hole (V1) is formed is adhered to the deposition substrate (3000).

[0044] When the deposition of a pixel pattern on the deposition substrate (3000) is completed through the deposition mask (1000), the deposition mask (1000) is separated from the deposition substrate (3000).

[0045] At this time, damage may occur to the deposition mask (1000) or the deposition substrate (3000) during the process of separating the deposition mask (1000) and the deposition substrate (3000) due to static electricity between the deposition mask (1000) and the deposition substrate (3000).

[0047] Hereinafter, a deposition mask capable of solving the above-mentioned problems is described with reference to the drawings.

[0048] First, a deposition mask according to the first embodiment will be described with reference to FIGS. 3 to 5.

[0049] Referring to FIGS. 3 to 5, the deposition mask (1000) comprises a metal plate (10) in which a first direction (1D) and a second direction (2D) are defined. More specifically, the deposition mask (1000) comprises a metal plate (100) in which a first direction and a second direction (2D) intersecting the first direction (1D) are defined. For example, the first direction (1D) may be the length direction of the deposition mask (1000) or the metal plate (10), and the second direction (2D) may be the width direction of the deposition mask (1000) or the metal plate (10).

[0050] The metal plate (10) includes a first surface (1S) and a second surface (2S). Specifically, the metal plate (10) includes a first surface (1S) where the first surface hole (V1) is formed and a second surface (2S) where the second surface hole (V2) is formed. That is, the first surface (1S) of the metal plate (10) is a surface where the first surface hole (V1) from which organic material comes out is formed, and the second surface (2S) is a surface where the second surface hole (V2) into which organic material enters is formed.

[0051] The above deposition mask (1000) includes a deposition area (DA) and a non-deposition area (NDA).

[0052] The deposition area (DA) is an area for forming a deposition pattern on the deposition substrate (3000). The deposition area (DA) includes a pattern area and a non-pattern area. The pattern area is an area including a first face hole (V1), a second face hole (V2), and a through hole (TH), and the non-pattern area is an area that does not include the first face hole (V1), the second face hole (V2), and the through hole (TH).

[0053] The deposition mask (1000) may include a plurality of deposition regions (DA). For example, the deposition region (DA) may include a plurality of effective portions (AA1, AA2, AA3) capable of forming a plurality of deposition patterns. That is, the pattern region includes the plurality of effective portions (AA1, AA2, AA3).

[0054] The deposition region (DA) includes separation regions (IA1, IA2). Specifically, separation regions (IA1, IA2) are arranged between adjacent effective regions. The separation regions (IA1, IA2) are separated regions between multiple effective regions. For example, a first separation region (IA1) is arranged between the first effective region (AA1) and the second effective region (AA2), and a second separation region (IA2) is arranged between the second effective region (AA2) and the third effective region (AA3). That is, adjacent effective regions can be distinguished from each other by the separation regions (IA1, IA2).

[0055] The above non-depositing area (NDA) is an area that does not participate in deposition. The above non-depositing area (NDA) includes a frame fixing area (FA1, FA2), a half-etching area (HF1, HF2), and an open area (OA1, OA2). The above frame fixing area (FA1, FA2) is an area where the deposition mask (1000) and the mask frame (2000) are fixed. That is, the above frame fixing area (FA1, FA2) is an area where the deposition mask (1000) and the mask frame (2000) are welded.

[0056] The above half-etching portions (HF1, HF2) can disperse the stress generated when the deposition mask (1000) is tensioned. Additionally, the above open portions (OA1, OA2) are areas for tensioning the deposition mask (1000).

[0057] The deposition mask (1000) includes a plurality of pattern portions (P). Specifically, a pattern portion (P) is disposed on at least one of the first surface (1S) and the second surface (2S) of the metal plate (10). More specifically, a pattern portion (P) is disposed on the first surface (1S) of the metal plate (10).

[0058] The pattern portion (P) is arranged in a raised shape on the first surface (1S) of the metal plate (10). In the drawing, the pattern portion (P) is shown as having a rectangular shape, but the embodiment is not limited thereto. That is, the pattern portion (P) may be formed in a semicircular shape including a curved surface.

[0059] Since the pattern portion (P) is placed on the first surface (1S) of the metal plate (10), the first surface (1S) of the metal plate (10) may include areas with different surface roughness. Specifically, the first surface (1S) of the metal plate (10) may include different surface roughness on the surface where the pattern portion (10) is placed and on the surface where the pattern portion (P) is not placed. For example, the surface roughness of the surface where the pattern portion (P) is placed, i.e., the upper surface of the pattern portion (P), may be smaller than the surface roughness of the surface where the pattern portion (P) is not placed, i.e., the first surface (1S) of the metal plate (100).

[0060] The pattern portion (P) is disposed in at least one of the deposition area (DA) and the non-deposition area (NDA). For example, the pattern portion (P) may be disposed in both the deposition area (DA) and the non-deposition area (NDA) of the deposition mask (1000). Alternatively, the pattern portion (P) may be disposed in either the deposition area (DA) or the non-deposition area (NDA) of the deposition mask (1000).

[0061] The thickness of the pattern portion (P) is formed within a set range. Specifically, the thickness (T2) of the pattern portion (P) is smaller than the thickness (T1) of the metal plate (10). For example, the thickness of the pattern portion (P) may be 10% or less, 7% or less, 5% or less, or 3% or less compared to the thickness of the metal plate (10).

[0062] If the thickness of the pattern portion (P) exceeds 10% of the thickness of the metal plate (10), the thickness of the deposition mask may be increased overall. Additionally, when the deposition mask and the deposition substrate are bonded, the gap between the deposition mask and the deposition substrate may increase, thereby reducing the deposition uniformity.

[0064] The above pattern portion (P) can serve to reduce the generation of static electricity in the deposition mask (1000). Specifically, it reduces the amount of static electricity generated when the deposition mask (1000) is attached to the deposition substrate (3000). Static electricity is generated when the deposition mask (1000) and the deposition substrate (3000) come into contact with each other. This static electricity is proportional to the contact area between the deposition mask and the deposition substrate.

[0065] The pattern portion (P) formed on the first surface (1S) of the metal plate (10) serves to reduce the contact area between the deposition mask (1000) and the deposition substrate (3000).

[0066] In detail, referring to FIG. 5, the deposition mask (1000) and the deposition substrate (3000) are bonded to each other, and then a region separated from each other is created by the pattern portion (P).

[0067] That is, the deposition mask (1000) is defined with a first region (1A) where the pattern portion (P) is placed and a second region (2A) where the pattern portion (P) is not placed, depending on whether the pattern portion (P) is placed.

[0068] In the first region (1A), the deposition mask (1000) and the deposition substrate (3000) are in contact. Also, in the second region (2A), the deposition mask (1000) and the deposition substrate (3000) are separated.

[0069] Accordingly, when the deposition mask (1000) and the deposition substrate (3000) are bonded, the magnitude of the static electricity is reduced in proportion to the contact area between the deposition mask (1000) and the deposition substrate (3000).

[0070] The above pattern portion (P) is placed over an area within a set size range for the entire area of ​​the first surface (1S) of the metal plate (10).

[0071] Specifically, the pattern portion (P) can be placed over an area of ​​80% or more, 85% or more, 90% or more, or 95% or more of the total area of ​​the first surface (1S) of the metal plate (10).

[0072] If the area of ​​the pattern portion (P) is less than 80% of the total area of ​​the first surface (1S) of the metal plate (10), the deposition mask and the deposition substrate may be separated during the deposition process due to the reduction in the contact area between the deposition mask and the deposition substrate, which may reduce deposition reliability.

[0074] Hereinafter, a deposition mask according to a second embodiment will be described with reference to FIGS. 6 to 8. In the description of the deposition mask according to the second embodiment, descriptions identical or similar to those of the deposition mask according to the first embodiment described above will be omitted, and identical components will be given the same reference numerals.

[0075] Referring to FIGS. 6 to 8, the deposition mask (1000) includes a plurality of pattern portions (P). Specifically, the pattern portions (P) are disposed on at least one of the first surface (1S) and the second surface (2S) of the metal plate (10). More specifically, the pattern portions (P) are disposed on the first surface (1S) of the metal plate (10).

[0076] The pattern portion (P) is arranged in an intaglio shape on the first surface (1S) of the metal plate (10). That is, unlike the first embodiment described above, the pattern portion (P) is arranged in an intaglio shape rather than a relief shape.

[0077] Since the pattern portion (P) is placed on the first surface (1S) of the metal plate (10), the first surface (1S) of the metal plate (10) may include areas with different surface roughness. Specifically, the first surface (1S) of the metal plate (10) may include different surface roughness on the surface where the pattern portion (10) is placed and on the surface where the pattern portion (P) is not placed. For example, the surface roughness of the surface where the pattern portion (P) is placed, i.e., the bottom surface of the pattern portion (P), may be smaller than the surface roughness of the surface where the pattern portion (P) is not placed, i.e., the first surface (1S) of the metal plate (100).

[0078] The pattern portion (P) is disposed in at least one of the deposition area (DA) and the non-deposition area (NDA). For example, the pattern portion (P) may be disposed in both the deposition area (DA) and the non-deposition area (NDA) of the deposition mask (1000). Alternatively, the pattern portion (P) may be disposed in either the deposition area (DA) or the non-deposition area (NDA) of the deposition mask (1000).

[0079] The depth of the pattern portion (P) is formed within a set range. Specifically, the depth (D) of the pattern portion (P) is smaller than the thickness (T1) of the metal plate (10). For example, the depth of the pattern portion (P) may be 10% or less, 7% or less, 5% or less, or 3% or less compared to the thickness of the metal plate (10).

[0080] If the depth of the pattern portion (P) exceeds 10% of the thickness of the metal plate (10), the strength of the deposition mask may be reduced overall.

[0082] The above pattern portion (P) can serve to reduce the generation of static electricity in the deposition mask (1000). Specifically, it reduces the amount of static electricity generated when the deposition mask (1000) is attached to the deposition substrate (3000). Static electricity is generated when the deposition mask (1000) and the deposition substrate (3000) come into contact with each other. This static electricity is proportional to the contact area between the deposition mask and the deposition substrate.

[0083] The pattern portion (P) formed on the first surface (1S) of the metal plate (10) serves to reduce the contact area between the deposition mask (1000) and the deposition substrate (3000).

[0084] In detail, referring to FIG. 8, the deposition mask (1000) and the deposition substrate (3000) are bonded to each other, and then a region separated from each other is created by the pattern portion (P).

[0085] That is, the deposition mask (1000) is defined with a third region (3A) where the pattern portion (P) is placed and a fourth region (4A) where the pattern portion (P) is not placed, depending on whether the pattern portion (P) is placed.

[0086] In the third region (3A), the deposition mask (1000) and the deposition substrate (3000) are separated. In addition, in the fourth region (4A), the deposition mask (1000) and the deposition substrate (3000) are in contact.

[0087] Accordingly, when the deposition mask (1000) and the deposition substrate (3000) are bonded, the magnitude of the static electricity is reduced in proportion to the contact area between the deposition mask (1000) and the deposition substrate (3000).

[0088] The above pattern portion (P) is placed over an area within a set size range for the entire area of ​​the first surface (1S) of the metal plate (10).

[0089] Specifically, the pattern portion (P) may be arranged in an area of ​​20% or less, 15% or less, 10% or less, or 5% or less of the total area of ​​the first surface (1S) of the metal plate (10).

[0090] If the area of ​​the pattern portion (P) exceeds 20% of the total area of ​​the first surface (1S) of the metal plate (10), the deposition mask and the deposition substrate may be separated during the deposition process due to the reduction in the contact area between the deposition mask and the deposition substrate, and thus the deposition reliability may be reduced.

[0092] The deposition mask according to the embodiment can prevent damage to the deposition mask or the deposition substrate that is adhered to the deposition mask.

[0093] Specifically, by reducing the magnitude of static electricity generated when the deposition mask adheres to the deposition substrate, damage to the deposition mask or the deposition substrate caused by the static electricity can be prevented when the deposition mask and the deposition substrate are separated.

[0094] That is, the static electricity generated on the deposition mask is proportional to the contact area between the deposition mask and the deposition substrate that adheres to it, and the deposition mask according to the embodiment includes a pattern portion that reduces the contact area.

[0095] That is, when the deposition mask is adhered to the deposition substrate by the pattern portion of the embossed or intaglio shape, the contact area between the deposition mask and the deposition substrate can be reduced.

[0096] Accordingly, the electrostatic magnitude of the deposition mask proportional to the contact area is reduced, thereby preventing damage to the deposition mask and the deposition substrate attached thereto.

[0098] The features, structures, effects, etc. described in the above-described embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment may be combined or modified and implemented in other embodiments by a person skilled in the art to which the embodiments belong. Therefore, details regarding such combinations and modifications should be interpreted as being included within the scope of the present invention.

[0099] Furthermore, although the invention has been described above with reference to embodiments, this is merely illustrative and does not limit the invention. Those skilled in the art will understand that various modifications and applications not exemplified above are possible within the scope of the essential characteristics of the embodiments. For example, each component specifically shown in the embodiments may be modified and implemented. Differences related to such modifications and applications should be interpreted as being included within the scope of the invention as defined in the appended claims.

Claims

Claim 1 A deposition mask disposed on a predetermined deposition substrate, comprising a metal plate including a first surface and a second surface located opposite to the first surface, wherein the metal plate comprises a first surface hole formed on the first surface, a second surface hole formed on the second surface, and a plurality of through holes formed by a connecting portion connecting the first surface hole and the second surface hole, wherein the width of the first surface hole is smaller than the width of the second surface hole, and a plurality of pattern portions are formed on the first surface, wherein the pattern portions are formed in an intaglio shape recessed from the outer surface of the first surface facing the deposition substrate. Claim 2 A deposition mask according to claim 1, characterized in that the depth of the pattern portion is 10% or less of the thickness of the metal plate. Claim 3 A deposition mask according to claim 1, characterized in that the depth of the pattern portion is 7% or less with respect to the thickness of the metal plate. Claim 4 A deposition mask according to claim 1, characterized in that the area of ​​the pattern portion is 20% or less of the total area of ​​the first surface. Claim 5 A deposition mask according to claim 4, characterized in that the area of ​​the pattern portion is 15% or less of the total area of ​​the first surface. Claim 6 A deposition mask according to claim 1, characterized in that the surface roughness of the bottom surface of the pattern portion and the surface roughness of the first surface are different from each other. Claim 7 A deposition mask according to claim 1, wherein the metal plate includes a deposition area and a non-deposition area, and the pattern portion is disposed in at least one of the deposition area and the non-deposition area. Claim 8 A deposition mask according to claim 1, characterized in that a plurality of spaced-apart regions are formed between the deposition substrate and the first surface by the pattern portion. Claim 9 A deposition mask according to claim 8, characterized in that the spaced-apart regions are alternately formed between the region where the pattern portion is formed and the region where the pattern portion is not formed. Claim 10 A deposition mask according to claim 1, characterized in that the intaglio pattern portion is configured to reduce the contact area between the deposition substrate and the first surface to reduce static electricity generated between the deposition substrate and the deposition mask.

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