Substrate processing system and article manufacturing method

Abstract

A substrate processing system comprises a plurality of operating modules, each configured to bring a curable composition on a substrate into contact with a mold and to separate the cured product of the curable composition from the mold; and one or more processing modules, each configured to be inserted into or removed from each of the plurality of operating modules by a pivot operation, wherein the one or more processing modules perform a process of forming a curable composition on a substrate using a mold in each of the plurality of operating modules, and the process includes at least one of a chemical process and a measurement process.

Description

Technology Field

[0001] The present invention relates to a substrate processing system and a method for manufacturing articles. Background Technology

[0002] Some substrate processing systems include multiple processing units and process a substrate using multiple processing units. For example, Japanese Patent Publication No. 2005-353969 discloses an exposure apparatus that includes an exposure stage unit and an alignment stage unit and performs an exposure operation and an alignment operation in parallel. The problem to be solved

[0003] The present invention provides a technology advantageous for simplifying the arrangement of a substrate processing system that processes two or more substrates in parallel. means of solving the problem

[0004] One aspect of the present invention provides a substrate processing system comprising: a plurality of operating modules each configured to bring a curable composition on a substrate into contact with a mold and to separate the cured product of the curable composition from the mold; and one or a plurality of processing modules configured to be inserted into / removed from each of the plurality of operating modules by a pivot operation, wherein the one or a plurality of processing modules perform a processing to form a curable composition on a substrate using a mold in each of the plurality of operating modules, and the processing includes at least one of a chemical processing and a measurement processing.

[0005] Further features of the present invention will become clear from the following description of exemplary embodiments with reference to the accompanying drawings. Brief explanation of the drawing

[0006] FIG. 1 is a drawing illustrating the arrangement of a substrate processing system according to one embodiment. FIGS. 2a to 2c are drawings illustrating an exemplary procedure for flattening treatment. FIGS. 3a to 3f are drawings for explaining the operation of a substrate processing system in a planarization process. Figure 4 is a diagram illustrating the operation of a substrate processing system in a planarization process. FIG. 5 is a drawing for exemplarily explaining the operation of a substrate processing system according to one embodiment. Specific details for implementing the invention

[0007] Hereinafter, embodiments are described in detail with reference to the accompanying drawings. It should be noted that the following embodiments are not intended to limit the scope of the claimed invention. Although numerous features are described in the embodiments, the invention is not limited to requiring all of these features, and numerous such features may be appropriately combined. Furthermore, in the accompanying drawings, the same reference numerals are assigned to identical or similar components, and redundant descriptions thereof are omitted.

[0008] FIG. 1 schematically illustrates the arrangement of a substrate processing system (100) according to one embodiment of the present disclosure. The substrate processing system (100) is configured to perform a molding process for molding a curable composition on substrates (3a, 3b). The substrate processing system (100) may include, for example, a processing station (101), a processing station (102), and a conveying mechanism (103). The processing station (102) performs a coating step for applying a curable composition on substrates (3a, 3b). The processing station (101) may perform a molding process for molding a curable composition on substrates (3a, 3b). The molding process may include a contact step, a curing step, and a separation step. The contact step may include bringing the curable composition on substrates (3a, 3b) into contact with molds (1a, 1b). The curing step may include curing the curable composition while in contact with the mold (1a, 1b) and the curable composition on the substrate (3a, 3b). The separation step may include separating the cured product of the curable composition from the mold (1a, 1b) after the curing step. Note that when the substrates (3a, 3b) are referred to without distinguishing from each other, they are referred to as substrate (3). Likewise, when the molds (1a, 1b) are referred to without distinguishing from each other, they are referred to as mold (1).

[0009] In this specification and the accompanying drawings, directions are indicated in an XYZ coordinate system in which a direction parallel to the surface of the substrate (3) is defined as the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis of the XYZ coordinate system are the X direction, Y direction, and Z direction, respectively. Rotation around the X-axis, rotation around the Y-axis, and rotation around the Z-axis are θX, θY, and θZ, respectively. Control or driving regarding the X-axis, Y-axis, and Z-axis means control or driving regarding a direction parallel to the X-axis direction, a direction parallel to the Y-axis, and a direction parallel to the Z-axis, respectively. Furthermore, control or driving regarding the θX-axis, θY-axis, and θZ-axis means control or driving regarding rotation around an axis parallel to the X-axis, rotation around an axis parallel to the Y-axis, and rotation around an axis parallel to the Z-axis, respectively. Additionally, position is information that can be specified based on coordinates of the X-axis, Y-axis, and Z-axis, and attitude is information that can be specified by values ​​of the X-axis, Y-axis, and Z-axis. Alignment means controlling the position and / or tilt. Alignment may include controlling the position and / or attitude of at least one of the substrate (3) and the mold (1). Additionally, alignment may include control for changing the position or shape of at least one of the substrate (3) and the mold (1).

[0010] As a curable composition, a curable composition that is cured by receiving curing energy is used. Examples of curing energy include electromagnetic waves and heat. As electromagnetic waves, light selected from a wavelength range of, for example, 10 nm (inclusive) to 1 mm (inclusive) is used. Examples of electromagnetic waves are infrared, visible light, and ultraviolet light. The curable composition is a composition that is cured by irradiation with light or heating. Among these compositions, the photocurable material that is cured by light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent as needed. The non-polymerizable compound is at least one material selected from the group comprising sensitizers, hydrogen donors, internal release agents, surfactants, antioxidants, and polymer components. The curable material can be applied to a substrate in the form of a film by a spin coater or a slit coater. The curable material can be applied to a substrate in the form of droplets or in the form of an island or film formed by connecting a plurality of droplets using a liquid spray head. The viscosity of the curable material (viscosity at 25°C) is, for example, 1 mPa·s (inclusive) to 100 mPa·s (inclusive).

[0011] The mold (1) may, for example, have a flat surface. The substrate processing system (100) is configured as a flattening device that forms a flattening film consisting of a cured product of a curable composition by bringing a curable composition on a substrate (3) into contact with the mold (1) and curing the curable composition. The flattening device may, for example, form a flattening film over nearly the entire area of ​​each substrate (3) in a batch. Alternatively, the substrate processing system (100) may be configured as a pattern forming device (e.g., an imprint device) that uses a mold (1) having a pattern and transfers the pattern to the curable composition on the substrate (3). The pattern forming device may form a pattern individually for each partial area of ​​the substrate (3) or form a pattern in a batch for multiple partial areas. The pattern formed may be an optical element or a microcircuit.

[0012] Hereinafter, a substrate processing system (100) as a flattening device is described as an example. However, the substrate processing system (100) may be configured as a processing device.

[0013] The substrate (3) may be, for example, a silicon wafer, but is not limited thereto. The substrate (3) may be arbitrarily selected from substrates known as semiconductor device substrates, such as aluminum, titanium-tungsten alloy, aluminum-silicon alloy, aluminum-copper-silicon alloy, silicon oxide, and silicon nitride. The substrate (3) used may be a substrate that has improved adhesion to a curable composition by forming an adhesive layer through surface treatment such as silane coupling treatment, silazane treatment, or organic thin film formation. The substrate (3) may be a circular substrate having a diameter of 300 mm, but is not limited thereto.

[0014] For example, light is used as the energy to cure the curable composition. In this case, the mold (1) is formed of a light-transmitting material. The mold (1) is formed of at least one of the following materials, for example: glass; quartz; a light-transmitting resin such as PMMA (polymethyl methacrylate) or polycarbonate resin; a transparent metal deposition film; a flexible film made of, for example, dimethylpolysiloxane; a photocurable film; and a metal film. For example, the mold (1) may be a circular mold having a diameter of 300 mm or more and 500 mm or less, but is not limited thereto. The thickness of the mold (1) may be, for example, 0.25 mm or more and 2 mm or less, but is not limited thereto. As the curable composition, a UV-curable liquid may be used when UV light is used as the curing energy. The curable composition may be a monomer such as acrylate or methacrylate.

[0015] As described above, the substrate processing system (100) may include a processing station (101), a processing station (102), and a conveying mechanism (103). The molds (1a, 1b) may each have mold marks (1a-1, 1b-1). The substrates (3a, 3b) may each have substrate marks (3a-1, 3b-1). The processing station (101) may include a first operation module (A) and a second operation module (B) as a plurality of operation modules that each perform the operation of contacting the mold (1) with the curable composition on the substrate (3) and separating the cured product of the curable composition from the mold (1).

[0016] The first operation module (A) may include a mold head (2a) that holds and supports a mold (1a), a substrate fine adjustment stage mechanism (4a), and a substrate coarse adjustment stage mechanism (5a). The second operation module (B) may include a mold head (2b) that holds and supports a mold (1b), a substrate fine adjustment stage mechanism (4b), and a substrate coarse adjustment stage mechanism (5b). The mold heads (2a, 2b) may each have mold reference marks (2a-1, 2b-1). The processing station (101) may include a mold head base (8) that supports the mold heads (2a, 2b) and a stage base (9) that supports the substrate coarse adjustment stage mechanisms (5a, 5b).

[0017] The processing station (101) may include a measurement module (6a) and an exposure module (7a) as one or more processing modules that are inserted into / removed from each of the plurality of operation modules (A, B) by pivot operation. The measurement module (6a) may be used to measure substrate reference marks (4a-1, 4b-1), etc. The exposure module (7a) may be used to expose the curable composition between the substrate (3) and the mold (1) to light to cure the said curable composition. The measurement module (6a) and the exposure module (7a) are examples of processing modules that perform at least one of a chemical treatment and a measurement treatment, for example, a treatment to form a curable composition on the substrate (3) using the mold (1). The processing station (101) may include a first pivot mechanism (6b) for pivoting the measurement module (6a) around the θZ axis and a second pivot mechanism (7b) for pivoting the exposure module (7a) around the θZ axis. The measurement module (6a) may include measurement units (6a-1, 6a-2, 6a-3) for performing measurements to position the substrate and the mold. The exposure module (7a) may include an exposure unit (7a-1).

[0018] Referring to FIG. 5, the positional relationship between the first pivot mechanism (6b) and the second pivot mechanism (7b) with respect to the first operating module (A) and the second operating module (B) is described exemplarily. First, the central position between the first operating module (A) and the second operating module (B) may coincide with the central position between the molds (1a, 1b) held and supported by the mold heads (2a, 2b). The pivot axes of the first pivot mechanism (6b) and the second pivot mechanism (7b) may coincide with each other. It is preferable that the distance (U, V) between the pivot axis (pivot center) (S) of the first pivot mechanism (6b) and the center of the molds (1a, 1b) held and supported by the mold heads (2a, 2b) of the first operating module (A) and the second operating module (B) be equal to each other. It is preferable that the distance (W, X) between the pivot axis (pivot center) (T) of the second pivot mechanism (7b) and the center of the substrate (3a, 3b) held and supported by the substrate fine adjustment stage mechanism (4a, 4b) of the first operation module (A) and the second operation module (B) be equal to each other. If U=V is not satisfied, a translation mechanism may be provided to at least one of the measurement module (6a), measurement units (6a-1, 6a-2, 6a-3), and the first pivot mechanism (6b), and the measurement units (6a-1, 6a-2, 6a-3) may be positioned using the translation mechanism. If W=X is not satisfied, a translation mechanism may be provided to at least one of the exposure module (7a), exposure unit (7a-1), and the second pivot mechanism (7b), and the exposure unit (7a-1) may be positioned using this translation mechanism.

[0019] One of the first pivot mechanism (6a) and the second pivot mechanism (6b) is positioned above the other of the first pivot mechanism (6a) and the second pivot mechanism (6b), and the pivot axes of the first pivot mechanism (6a) and the second pivot mechanism (6b) may be positioned on the same straight line. In the case shown in FIG. 1, the second pivot mechanism (6b) is positioned above the first pivot mechanism (6a), and the pivot axes of the first pivot mechanism (6a) and the second pivot mechanism (6b) are positioned on the same straight line. The first pivot mechanism (6a) and the second pivot mechanism (6b) may perform pivot operations independently or simultaneously.

[0020] When three or more operation modules are arranged, their centers may be arranged on a circumference centered on the pivot axis of a plurality of pivot mechanisms (6a, 6b) that pivot a plurality of processing modules (e.g., measurement module (6b) and exposure module (7b)).

[0021] The exposure module (7a) may have a specification that enables light to be irradiated over the entire area of ​​the mold (1) and the substrate (3), a specification that enables the entire area of ​​the mold (1) and the substrate (3) to be scanned with slit light using the second pivot mechanism (7b), or other specifications.

[0022] The processing station (102) may include a dispenser (10), an alignment scope (11), a measurement base (12) supporting the dispenser (10) and the alignment scope (11), a measurement stage mechanism (13), and a measurement stage base (14) supporting the measurement stage mechanism (13). The measurement stage mechanism (13) holds and supports a substrate (3) as a measurement target. The measurement stage mechanism (13) includes a stage, and a substrate reference mark (13a-1) may be provided on the stage. The conveying mechanism (103) includes a conveying robot (15) that conveys the mold (1) and the substrate (3).

[0023] The substrate fine adjustment stage mechanism (4a, 4b) and the measurement stage mechanism (13) each include a stage having a chuck, such as a vacuum chuck or an electrostatic chuck, and can hold and support the substrate (3) by the chuck. For example, the substrate fine adjustment stage mechanism (4a, 4b) drives the stage having the chuck in the X-axis, Y-axis, and θZ-axis directions. The substrate coarse adjustment stage mechanism (5a, 5b) drives the substrate fine adjustment stage mechanism (4a, 4b) in the Z-axis direction. By doing so, the substrate (3) can be positioned in the six-axis direction. For example, the measurement stage mechanism (13) drives the stage having the chuck in the X-axis, Y-axis, and θZ-axis directions. The substrate fine adjustment stage mechanism (4a, 4b), the substrate coarse adjustment stage mechanism (5a, 5b), and the measurement stage mechanism (13) may each include at least one actuator, such as a linear motor, a ball screw, a rack and pinion, and a cylinder.

[0024] Each mold head (2a, 2b) may include a chuck, such as a vacuum chuck or an electrostatic chuck, and may hold and support the mold (1) by the said chuck. The mold (1) may be driven by driving the mold heads (2a, 2b) using a mold head driving unit (not shown). Each mold head driving unit may be configured to drive the mold (1) about a plurality of axes. By driving the mold heads (2a, 2b) in the Z-axis direction, the mold (1) may be brought into contact with a curable composition on a substrate (3), or the cured product of the curable composition on the substrate (3) may be separated from the mold (1). The mold head driving unit may include a mechanism for driving the mold heads (2a, 2b) about an axis other than the Z-axis. For example, the mold head driving unit may include a mechanism for driving the mold head (2a, 2b) with respect to a plurality of axes (e.g., 3 axes including θX-axis, θY-axis, and Z-axis, or 6 axes including X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis).

[0025] The mold (1) and the substrate (3) can be brought into the substrate processing system (100) from outside the substrate processing system (100) by a conveying robot (15) having a conveying hand, etc., and can be delivered to the mold head (2a, 2b), the substrate fine movement stage mechanism (4a, 4b), and the measurement stage (13).

[0026] A dispenser (10) (supply unit) placed in a processing station (102) can place or supply an uncured (liquid) curable composition onto a substrate (3). The dispenser (10) may include an orifice (nozzle) for dispensing the curable material. The dispenser (10) can supply a small volume (e.g., 1 picoliter) of the curable composition onto the substrate (3) by a piezoelectric method or a microsolenoid method. The number of orifices provided to the dispenser (10) is not particularly limited and may be one or more than two. For example, the dispenser (10) has more than 100 orifices. For example, these multiple orifices are placed in one or multiple lines.

[0027] The substrate fine adjustment stage mechanism (4a, 4b) or substrate coarse adjustment stage mechanism (5a, 5b) of the processing station (101) may include a push pin (not shown). The push pin may perform an auxiliary function when the mold (1) is separated from the curable composition on the substrate (3). For example, when separating the mold (1a, 1b) from the cured material of the curable composition, the push pin may be protruded toward the mold (1) from a gap in a cutout of the substrate (3), such as a notch or an orientation flat. By protruding the push pin, force may be applied to the mold (1) in a direction that separates the mold (1) from the substrate (3). This may assist in the separation step.

[0028] The alignment scope (11) of the processing station (102) can be used to detect reference marks (13a-1) and substrate marks (3a-1, 3b-1) provided on the stage of the measurement stage mechanism (13). The alignment scope (11) can be used to detect the shape of the end of the substrate (3a, 3b). Additionally, the alignment scope (11) can be used to detect the position and shape of the curable material placed by the dispenser (10). More specifically, the alignment scope (11) can be used for alignment processing to detect a plurality of alignment marks provided on the reference mark (13a-1) and the substrate (3a, 3b) and to determine the position of the substrate (3a, 3b). In addition, by using an alignment scope (11) to detect the shape of the end portions of the substrates (3a, 3b) and to determine the size of the substrates (3a, 3b), the dispensing range of the curable material by the dispenser (10) can be determined. In addition, by using an alignment scope (11) to detect the position and shape of the curable composition placed by the dispenser (10), the position and shape of the curable composition dispensed by the dispenser (10) can be adjusted. The alignment scope (11) may include an optical system and an imaging system.

[0029] The measurement unit (6a-1, 6a-2) of the measurement module (6a) of the processing station (101) can be used to detect substrate reference marks (4a-1, 4b-1) and substrate marks (3a-1, 3b-1) provided on the stage of the substrate fine movement stage mechanism (4a, 4b). The measurement unit (6a-1, 6a-2) can be used to detect the shape of the end of the substrate (3a, 3b), the mold reference marks (2a-1, 2b-1) provided on the mold head (2a, 2b), and the mold marks (1a-1, 1b-1) provided on the mold (1a, 1b). The measurement unit (6a-1, 6a-2) can be used to detect the shape of the end of the mold (1a, 1b). The measurement unit (6a-1, 6a-2) may include an optical system and an imaging system.

[0030] The measurement unit (6a-3) of the measurement module (6a) of the processing station (101) can be used to detect the position and shape of a cutout, such as a notch or orientation flat, of the substrate (3a, 3b) and the position and shape of a push pin. The measurement unit (6a-3) may include an optical system and an imaging system.

[0031] An exposure unit (7a-1) is provided in the exposure module (7a) of the processing station (101). The exposure unit (7a-1) can emit curing energy (e.g., light such as UV light).

[0032] The substrate processing system (100) includes a control unit (CNT). The control unit (CNT) may be composed of, for example, a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array), an ASIC (Application Specific Integrated Circuit), a general-purpose or dedicated computer with a built-in program, or a combination of all or part of these components.

[0033] For example, a control unit (CNT) may be configured to control the execution of a molding process such as a planarization process. A planarization process is an example of a molding process for molding a curable composition on a substrate (3), and is a process for forming a film having a planarized surface using a cured product of the curable composition. More specifically, a planarization process is a process for flattening the curable composition by bringing the flat surface of the mold (1) into contact with the curable composition on the substrate (3) and conforming the curable composition to the surface shape of the substrate (3). A planarization process is generally performed for each lot, that is, for each of the multiple substrates included in the same lot.

[0034] Hereinafter, an overview of the planarization process will be described with reference to FIGS. 2a to 2c and FIGS. 3a to 3f. FIGS. 2a to 2c exemplarily illustrate the procedure for the planarization process. FIGS. 3a to 3f exemplarily illustrate the operation of the substrate processing system (100) in the planarization process. First, in the step shown in FIG. 2a, the dispenser (10) of the processing station (102) supplies or places a curable composition (IM) onto a substrate (3a, 3b) having a base pattern (Pat). FIG. 2a exemplarily shows the state before the mold (1a, 1b) is brought into contact with the curable composition (IM) after the curable composition (IM) has been supplied onto the substrate (3a, 3b). Subsequently, the transfer robot (15) transfers the substrate (3a, 3b) from the processing station (102) to the processing station (101).

[0035] The operation of operation module A among operation modules A and B of the subsequent processing station (101) will be explained first. As schematically illustrated in FIG. 3a, the first pivot mechanism (6b) pivots the measurement module (6a) so that it is positioned in the +Z direction relative to the substrate (3a) and in the -Z direction relative to the mold (1a). Subsequently, positioning between the substrate (3a) and the mold (1a) is performed using the measurement module (6a). In this case, using the measurement unit (6a-2), at least one of the position of the substrate reference mark (4a-1) provided on the stage of the substrate fine movement stage mechanism (4a), the position of the substrate mark (3a-1), and the shape of the substrate (3a) can be measured. Additionally, using the measurement unit (6a-1), at least one of the position of the mold reference mark (2a-1) provided on the mold head (2a), the position of the mold mark (1a-1) provided on the mold (1a), and the shape of the mold (1a) can be detected. Using the measurement unit (6a-3), positioning between the cutout of the substrate (3a) and the push pin can be performed. In this case, the order of measurement operations by the measurement units (6a-1, 6a-2, 6a-3) is arbitrary. Additionally, the measurement operations of the measurement units (6a-1, 6a-2, 6a-3) can be performed multiple times. Additionally, the measurement operations of the measurement units (6a-1, 6a-2, 6a-3) can be performed during the pivot movement of the measurement module (6a) or after the cessation of the pivot movement.

[0036] By using a measurement module (6a) to measure the positions of the marks on the substrate (3) and the marks on the mold (1a), the positional misalignment between the substrate (3a) and the mold (1a) can be detected. Alternatively, by using a measurement module (6a) to measure the shape of the end portions of the substrate (3) and the mold (1a) based on the end portion images, the positional misalignment between the substrate (3a) and the mold (1a) can be detected. Alternatively, by using a displacement sensor or a height sensor as a measurement unit (6a-1, 6a-2) to measure the shape of the end portions of the substrate (3), the positional misalignment between the substrate (3a) and the mold (1a) can be detected. Subsequently, the substrate fine adjustment stage mechanism (4a) can position the substrate (3a) and the mold (1a) by positioning the substrate (3a) to offset the positional misalignment.

[0037] By using a measurement module (6a) to measure the position of a mark on the substrate (3) or the shape of the end of the substrate (3) based on their images, a positional misalignment between the cutout of the substrate (3a) and the push pin can be detected. Alternatively, a displacement sensor or a height sensor can be used as a measurement unit (6a-2) to measure the shape of the end of the substrate (3) to detect a positional misalignment between the cutout of the substrate (3a) and the push pin. Subsequently, a substrate fine adjustment stage mechanism (4a), which can be driven independently of the push pin, can position the cutout of the substrate (3a) and the push pin by positioning the substrate (3a) to offset the positional misalignment. FIG. 3a schematically illustrates an operation module A in this state.

[0038] Next, as schematically illustrated in FIG. 3b, the first pivot mechanism (6b) causes the measurement module (6a) to be withdrawn from the operation module A. Then, the substrate coarse adjustment stage mechanism (5a) drives the substrate fine adjustment stage mechanism (4a) (substrate (3a)) in the +Z direction. Next, the mold head driving unit adjusts the distance between the substrate (3a) and the mold (1a) so that the curable composition (IM) on the substrate (3a) and the mold (1a), which are held and supported by the mold head (2a), come into contact (contact step). FIG. 2b schematically illustrates this contact step. Next, the mold head (2a) releases the holding support of the mold (1a), and the substrate fine adjustment stage mechanism (4a) drives the laminate of the substrate (3a), the curable composition (IM), and the mold (1a) in the -Z direction, thereby forming a space on the laminate where the exposure module (7a) can pivot.

[0039] Thereafter, as schematically illustrated in FIG. 3f, the second pivot mechanism (7b) places the exposure module (7a) on the laminate of the substrate (3a), the curable composition (IM), and the mold (1a) by pivoting the exposure module (7a). Subsequently, curing energy is irradiated onto the curable composition (IM) on the substrate (3a) through the mold (1a), thereby curing the curable composition (IM) (curing step).

[0040] The operation of the operation module B is described below. In the state shown in FIGS. 3a and 3b, in the operation module B, the exposure module (7a) irradiates curing energy onto the curable composition (IM) between the substrate (3b) and the mold (1b), thereby curing the curable composition (IM) (curing step).

[0041] As schematically illustrated in FIG. 3c, the second pivot mechanism (7b) pivots the exposure module (7a) so that the exposure module (7a) is withdrawn from the upper side of the mold (1b). Subsequently, the first pivot mechanism (6b) pivots the measurement module (6a) so that it is positioned in the +Z direction with respect to the substrate (3b) and the -Z direction with respect to the mold (1b).

[0042] The mold (1b) and the mold head (2b) are positioned using a measurement module (6a). In this case, at least one of the substrate reference mark (4b-1), the substrate mark (3b-1), the shape of the substrate (3b), the mold mark (1b-1) provided on the stage of the substrate fine movement stage mechanism (4b), and the shape of the mold (1b) can be measured using a measurement unit (6a-2). Additionally, the position of the mold reference mark (2b-1) provided on the mold head (2b) can be measured using a measurement unit (6a-1). By doing so, the positional misalignment between the mold (1b) and the mold head (2b) can be detected. Subsequently, the substrate fine movement stage mechanism (4a) can position the laminate (mold (1b)) and the mold head (2b) by positioning the laminate of the substrate (3b), the curable composition (IM), and the mold (1b) to offset the positional misalignment. The first pivot mechanism (6b) causes the measurement module (6a) to pivot, thereby causing the measurement module (6a) to retract from the upper side of the mold (1b).

[0043] As schematically illustrated in FIG. 3d, the substrate coarse stage mechanism (5b) drives the substrate fine stage mechanism (4b) (substrate (3b)) in the +Z direction. Subsequently, the mold head driving unit adjusts the distance between the substrate (3b) and the mold (1b) to separate the mold (1b) from the cured product of the curable composition (IM) on the substrate (3b) (separation step). By doing so, a flattened cured product of the curable composition (IM) can be formed on the substrate (3b). FIG. 2c schematically illustrates the substrate (3b) and the flattened cured product of the curable composition (IM) after the separation step.

[0044] As schematically illustrated in FIG. 3e, the first pivot mechanism (6b) causes the measurement module (6a) to pivot so that it is positioned in the +Z direction with respect to the substrate (3b) and in the -Z direction with respect to the mold (1b). In this state, a static discharge unit (not shown) provided to the measurement module (6a) can perform static discharge.

[0045] As schematically illustrated in FIG. 3f, the first pivot mechanism (6b) causes the measurement module (6a) to be withdrawn from the operation module B. Then, the return robot (15) takes out the substrate (3b). At this time, if the measurement module (6a) does not interfere with the return robot (15), the substrate (3b) can be taken out without withdrawing the measurement module (6a).

[0046] FIG. 4 illustrates the operation of a substrate processing system (100) focusing on substrates N-1, N, and N+1. S1 to S5, T1 to T9, and U1 to U9 represent steps. Below, steps are described regarding substrates (3a, 3b) receiving processing from S1 to S6 at the processing station (102) and being returned to the processing station (101). To explain the procedure for sequential processing of substrates (3a, 3b), substrates (3a, 3b) are assumed to be substrates N-1, N, and N+1. In this case, substrates N-1, N, and N+1 processed by the processing station (102) are alternately brought into operation module A and operation module B of the processing station (101) and processed in parallel. Additionally, in this case, the measurement module (6a) and the exposure module (7a) are shared by operation module A and operation module B, but are not used simultaneously in each step. In this case, the measurement module (6a) and the exposure module (7a) can each handle a plurality of operation modules.

[0047] T1 through T9 represent steps executed by the operation module A. At T1, the transfer robot (15) brings the substrate N, which has been removed from the processing station (102), into the operation module A of the processing station (101). At T2, the first pivot mechanism (6b) places the measurement module (6a) in the operation module A, uses the measurement module (6a) to position the substrate N and the mold (1a), and performs positioning of the cutout of the substrate N and the push pin. After that, the first pivot mechanism (6b) causes the measurement module (6a) to be withdrawn from the operation module A. At T3, the substrate coarse stage mechanism (5a) drives the substrate fine stage mechanism (4a) (substrate N) in the +Z direction. Additionally, the mold head drive unit adjusts the distance between the substrate (N) and the mold (1a) so that the curable composition (IM) on the substrate N comes into contact with the mold (1a). Accordingly, the mold (1a) comes into contact with the curable composition on substrate N, and the mold (1a) conforms to the surface shape of substrate N. At T4, the second pivot mechanism (7b) places the exposure module (7a) in the operation module A, and the exposure module (7a) irradiates curing energy to the curable composition (IM) on substrate N through the mold (1a), thereby curing the curable composition (IM) (curing step). After that, the second pivot mechanism (7b) causes the exposure module (7a) to be withdrawn from the operation module A. At T5, the first pivot mechanism (6b) places the measurement module (6a) in the first operation module (A), and uses the measurement module (6a) to perform positioning of the mold head (2a) and the mold (1a). At T6, the substrate coarse stage mechanism (5a) drives the substrate fine stage mechanism (4a) (substrate N) in the +Z direction and drives the mold head (2a) to separate the mold (1a) from the cured material of the curable composition (IM) on substrate N (separation step). At T7, the first pivot mechanism (6b) causes the measurement module (6a) to pivot to the operation module A, and the static discharge unit (not shown) provided to the measurement module (6a) performs static discharge.At T8, the substrate N processed in the operation module A of the processing station (101) is discharged. At T9, the presence or absence of the next substrate to be processed is checked. If there is a next substrate to be processed, the processing returns to T1 and continues. If there is no next substrate to be processed, the processing ends.

[0048] U1 to U9 represent steps executed in operation module B. In U1, the transfer robot (15) brings substrate N+1, which has been removed from the processing station (102), into operation module B of the processing station (101). In U2, the first pivot mechanism (6b) places the measurement module (6a) in operation module B and uses the measurement module (6a) to perform positioning between substrate N+1 and the mold (1b) and positioning between the cutout of substrate N+1 and the push pin. Afterward, the first pivot mechanism (6b) causes the measurement module (6a) to be withdrawn from operation module B. In U3, the substrate coarse stage mechanism (5b) drives the substrate fine stage mechanism (4b) (substrate N+1) in the +Z direction. Additionally, the mold head drive unit adjusts the distance between substrate N+1 and the mold (1b) so that the curable composition (IM) on substrate N+1 comes into contact with the mold (1b). Accordingly, the mold (1b) comes into contact with the curable composition on substrate N+1, and the mold (1b) conforms to the surface shape of substrate N+1. In U4, the second pivot mechanism (7b) places the exposure module (7a) in the operation module B, and the exposure module (7a) irradiates curing energy to the curable composition (IM) on substrate N+1 through the mold (1b), thereby curing the curable composition (IM) (curing step). After that, the second pivot mechanism (7b) causes the exposure module (7a) to be withdrawn from the operation module B. In U5, the first pivot mechanism (6b) places the measurement module (6a) in the operation module B, and uses the measurement module (6a) to perform positioning between the mold head (2b) and the mold (1b). In U6, the substrate coarse stage mechanism (5b) drives the substrate fine stage mechanism (4b) (substrate N) in the +Z direction, and the mold head (2b) drives the mold (1b) to separate from the cured product of the curable composition (IM) on substrate N+1 (separation step).In U7, the first pivot mechanism (6b) causes the measurement module (6a) to pivot to the operation module B, and the static discharge unit (not shown) provided to the measurement module (6a) performs static discharge. In U8, the N+1 substrates processed by the operation module B of the processing station (101) are discharged. In U9, the presence or absence of the next substrate to be processed is checked. If there is a next substrate to be processed, the processing returns to U1 and continues processing. If there is no next substrate to be processed, the processing ends.

[0049] As described above, the substrate processing system according to the present embodiment includes a plurality of operation modules and one or more processing modules that are inserted into or removed from each of the plurality of operation modules by pivot operation. The one or more processing modules perform a process for forming a curable composition on a substrate using a mold in each of the plurality of operation modules. According to this arrangement, the arrangement of a substrate processing system that processes two or more substrates in parallel can be simplified. In addition, productivity can be improved by using one or more processing modules at different timings in the plurality of operation modules.

[0050] A method for manufacturing an article according to one embodiment may include the steps of forming a film made of a curable composition on a substrate using a substrate processing system (100), and processing the substrate on which the film is formed to obtain an article. The film may be a planarized film. Alternatively, the film may be a film on which a pattern of a mold is transferred.

[0051] Although the present invention has been described with reference to exemplary embodiments, it should be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims should be interpreted in the broadest sense to include structures and functions equivalent to all such variations.

Claims

Claim 1 A substrate processing system comprising a plurality of operating modules each configured to perform a contact operation in which a curable composition on a substrate is brought into contact with a mold and a separation operation in which a cured product of the curable composition is separated from the mold, and an irradiation module configured to be selectively positioned at a processing position for each of the plurality of operating modules by a pivot operation around a pivot axis and to be withdrawn from the processing position, wherein the irradiation module is shared by the plurality of operating modules, and when the irradiation module is positioned at the processing position for one of the plurality of operating modules, the irradiation module irradiates light through the mold to the curable composition on the substrate within the one operating module to cure the curable composition. Claim 2 A substrate processing system according to claim 1, further comprising a measurement module configured to be selectively positioned at a measurement position for each of the plurality of operating modules by a pivot operation around a pivot axis and to be withdrawn from the measurement position, wherein, when the measurement module is positioned at the measurement position for one of the plurality of operating modules, the measurement module performs measurement for positioning the substrate and the mold within the one operating module. Claim 3 A substrate processing system according to paragraph 2, further comprising a first pivot mechanism configured to pivot the investigation module around a first pivot axis, and a second pivot mechanism configured to pivot the measurement module around a second pivot axis. Claim 4 A substrate processing system according to paragraph 3, wherein one of the first pivot mechanism and the second pivot mechanism is positioned above the other of the first pivot mechanism and the second pivot mechanism. Claim 5 A substrate processing system according to paragraph 3, wherein the first pivot axis and the second pivot axis are positioned on the same straight line. Claim 6 A substrate processing system according to paragraph 3, wherein the first pivot mechanism and the second pivot mechanism are configured to perform pivot operations independently. Claim 7 A substrate processing system according to claim 1, wherein each of the plurality of operating modules comprises a stage mechanism configured to hold and drive the substrate, and a mold head configured to hold and drive the mold. Claim 8 In claim 7, the substrate processing system is configured such that the investigation module is positioned between the stage mechanism and the mold head of each of the plurality of operation modules. Claim 9 A substrate processing system according to claim 7, wherein the investigation module is configured to be positioned between the mold head and the stage mechanism having a laminate comprising the substrate, the curable composition, and the mold. Claim 10 A substrate processing system according to claim 1, wherein the irradiation module is configured to irradiate slit-shaped light onto the curable composition and to scan the entire area of ​​the substrate and the mold by the pivot operation. Claim 11 A substrate processing system according to claim 1, wherein the irradiation module is configured to irradiate light collectively over the entire area of ​​the substrate and the mold. Claim 12 A substrate processing system according to claim 1, wherein the centers of the plurality of operating modules are arranged on a circumference centered on the pivot axis. Claim 13 A substrate processing system according to claim 1, wherein the mold has a flat surface configured to contact the curable composition on the substrate, and the substrate processing system is configured to form a flattened film composed of a cured product of the curable composition. Claim 14 A substrate processing system according to paragraph 2, wherein each of the plurality of operating modules comprises a stage mechanism configured to hold and drive the substrate and a mold head configured to hold and drive the mold, and the measuring module is configured to be positioned between the stage mechanism and the mold head of each of the plurality of operating modules. Claim 15 A method for manufacturing an article, comprising the steps of: forming a film on a substrate using a substrate processing system according to any one of claims 1 to 14, the film being formed on the substrate, and processing the substrate on which the film is formed to obtain an article.

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