Electrical connection device, alignment mark used for manufacturing electrical connection device, and method of manufacturing electrical connection device
Patent Information
- Application Number
- KR1020260028631
- Authority / Receiving Office
- KR · KR
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-25
- Filing Date
- 2026-02-12
- Publication Date
- 2026-09-01
Smart Images
Figure PAT00001_ABST
Abstract
Description
Technology Field
[0001] The present invention relates to an electrical connection device used for inspecting the electrical characteristics of an object to be inspected, a position alignment mark used for manufacturing the electrical connection device, and a method for manufacturing the electrical connection device. Background Technology
[0002] An electrical connection device is used to inspect the electrical characteristics of an object to be inspected, such as a semiconductor integrated circuit, in a wafer state. The electrical connection device includes a probe that contacts the object to be inspected and a substrate on which internal wiring is arranged to be electrically connected to the probe. In inspection using the probe, one end of the probe contacts the object to be inspected. The other end of the probe is placed on a placement pad arranged on the substrate. The placement pad is electrically connected to an inspection device, such as a tester, through the internal wiring of the substrate.
[0003] In order to place a probe on a placement pad, it is necessary to accurately align the substrate on which the placement pad is placed with the connector that holds the probe for connection to the placement pad. For this reason, a manufacturing method is used in which a positioning mark is formed on the substrate, and the connector is aligned with the substrate while referring to this positioning mark. Therefore, it is necessary to clearly identify the shape of the positioning mark that serves as the reference for the alignment. Prior art literature
[0004] [Patent Document 1] Japanese Patent Publication No. 2018-179934 The problem to be solved
[0005] A placement pad requires mechanical strength and a certain film thickness. For this reason, a stacked structure with overlapping metal layers is used for placement pads. When a positioning mark is formed on a substrate simultaneously with the placement pad, the positioning mark also becomes a stacked structure. The present invention aims to provide an electrical connection device in which the shape of a positioning mark with a stacked metal layer structure can be clearly seen, a positioning mark used in the manufacture of the electrical connection device, and a method for manufacturing the electrical connection device. means of solving the problem
[0006] An electrical connection device according to one embodiment of the present invention comprises a probe, a substrate, a probe pad, and a position alignment mark. The probe pad has a structure in which a first pad layer and a second pad layer are stacked and is disposed on the substrate. The position alignment mark has a structure in which a first position alignment mark layer and a second position alignment mark layer are stacked and is disposed on the substrate spaced apart from the probe pad. When viewed from the stacking direction in which the first position alignment mark layer and the second position alignment mark layer are stacked, the first position alignment mark layer and the second position alignment mark layer have similar shapes, and furthermore, the outer edge of the first position alignment mark layer is located inside the outer edge of the second position alignment mark layer. Effects of the invention
[0007] According to the present invention, an electrical connection device in which the shape of a position alignment mark of a structure having a stacked metal layer can be clearly seen, a position alignment mark used in the manufacture of the electrical connection device, and a method for manufacturing the electrical connection device can be provided. Brief explanation of the drawing
[0008] FIG. 1 is a schematic diagram illustrating the configuration of an electrical connection device according to an embodiment. FIG. 2 is a schematic plan view illustrating the configuration of an electrical connection device according to an embodiment. Figure 3 is a schematic cross-sectional view of area A of Figure 2. FIG. 4 is a schematic plan view illustrating the shape of a position alignment mark of an electrical connection device according to an embodiment. FIG. 5 is a schematic cross-sectional view for explaining a method of manufacturing an electrical connection device according to an embodiment (the 1). FIG. 6 is a schematic cross-sectional view illustrating a method for manufacturing an electrical connection device according to an embodiment (the 2). FIG. 7 is a schematic cross-sectional view illustrating a method for manufacturing an electrical connection device according to an embodiment (Fig. 3). FIG. 8 is a schematic cross-sectional view illustrating a method for manufacturing an electrical connection device according to an embodiment (the 4). FIG. 9 is a schematic cross-sectional view illustrating a method for manufacturing an electrical connection device according to an embodiment (the 5). FIG. 10 is a schematic cross-sectional view illustrating a method for manufacturing an electrical connection device according to an embodiment (Fig. 6). FIG. 11 is a schematic plan view illustrating the structure of the position alignment mark of the first comparative example. FIG. 12 is a cross-sectional view along the XII-XII direction of FIG. 11. FIG. 13 is a schematic plan view illustrating the structure of the position alignment mark of the second comparative example. FIG. 14 is a cross-sectional view along the XIV-XIV direction of FIG. 13. FIG. 15 is a schematic plan view to explain the problem occurring in the position alignment mark of the second comparative example. Specific details for implementing the invention
[0009] Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, identical or similar parts are denoted by identical or similar reference numerals. However, it should be noted that the drawings are schematic and that the ratios of the thicknesses of each part may differ from reality. Furthermore, it is understood that there are parts in which the dimensional relationships or ratios differ from one another. The embodiments described below are intended to illustrate devices or methods for embodying the technical concept of the present invention, and the embodiments of the present invention do not specify the material, shape, structure, and arrangement of the constituent parts as described below.
[0010] (First embodiment)
[0011] The electrical connection device (1) according to the embodiment illustrated in FIG. 1 is used to inspect the electrical characteristics of an object (2) to be inspected. The electrical connection device (1) comprises a probe (10), a substrate (20), a probe pad (30), and a position alignment mark (40).
[0012] A substrate (20) has a first surface (201) and a second surface (202) facing in the opposite direction to the first surface (201). On the first surface (201), a first region (211) and a second region (212), each having conductivity, are formed spaced apart from each other. An insulating region (213) surrounds the first region (211) and the second region (212). The substrate (20) includes internal wiring (not shown) that is electrically connected to the first region (211).
[0013] The substrate (20) may include a substrate in which a conductive layer and an insulating layer are alternately stacked (hereinafter referred to as a “stacked substrate”). For example, the substrate (20) may include a stacked substrate (22) having a first surface (201) as shown in FIG. 1, and a ceramic substrate (21) disposed on the main surface of the stacked substrate (22) facing the opposite direction of the first surface (201). The insulating region (213) of the first surface (201) of the stacked substrate (22) may be, for example, a resin layer. The stacked substrate (22) may have a stacked structure in which internal wiring is disposed in a plurality of wiring layers. The internal wiring disposed in the stacked substrate (22) and the internal wiring disposed in the ceramic substrate (21) are electrically connected.
[0014] The probe pad (30) is disposed in a first region (211) of the substrate (20). The probe pad (30) has a laminated structure having a first pad layer (31) connected to the first region (211) and a second pad layer (32) laminated on the first pad layer (31).
[0015] The probe (10) is placed on the second pad layer (32) of the probe pad (30). Hereinafter, one end of the probe (10) facing the object to be inspected (2) is referred to as the "tip end" and the other end as the "base end." The base end of the probe (10) is electrically connected to the internal wiring of the substrate (20) through the probe pad (30).
[0016] The position alignment mark (40) is placed in a second region (212) of the substrate (20). The position alignment mark (40) is a stacked structure having a first position alignment mark layer (41) connected to the second region (212) and a second position alignment mark layer (42) stacked on the first position alignment mark layer (41).
[0017] In the description of the embodiment, the vertical direction of FIG. 1 is the Z direction, the horizontal direction is the X direction, and the depth direction is the Y direction. The direction in which the first position alignment mark layer (41) and the second position alignment mark layer (42) are stacked and the direction in which the first pad layer (31) and the second pad layer (32) are stacked are both the Z direction, and the direction in which these layers are stacked is also referred to as the “stacking direction” below.
[0018] On the second surface (202) of the substrate (20) where the ceramic substrate (21) is exposed, the other end of the internal wiring of the substrate (20), one end of which is electrically connected to the probe pad (30), is exposed. The other end of the internal wiring exposed on the second surface (202) is connected to a terminal (not shown; hereinafter referred to as a “connection terminal”) disposed on the second surface (202). In other words, the connection terminal of the probe pad (30) and the substrate (20) is electrically connected through the internal wiring.
[0019] A printed circuit board may be placed on the second surface (202) of the substrate (20), and the electrode terminals placed on the printed circuit board and the connection terminals of the substrate (20) may be connected by an interposer. For example, spring-type pogo pins may be used as the interposer. The electrode terminals placed on the printed circuit board are electrically connected to a test device, such as an IC tester, through the wiring of the printed circuit board. By contacting the tip of the probe (10) with the object to be tested (2), the object to be tested (2) and the test device are electrically connected through the electrical connection device (1).
[0020] FIG. 2 is a view taken from the normal direction (Z direction) of the first plane (201). FIG. 1 is a cross-sectional view along the II direction of FIG. 2.
[0021] As illustrated in FIG. 2, the electrical connection device (1) may be provided with a plurality of probe pads (30) arranged on a first surface (201) of a substrate (20). Hereinafter, the area of the first surface (201) where the plurality of probe pads (30) are arranged is referred to as the "probe placement area (100)." In the example illustrated in FIG. 2, the probe placement area (100) is set near the center of the first surface (201) of a rectangular substrate (20) when viewed from the stacking direction.
[0022] In the first surface (201), position alignment marks (40) may be placed in the peripheral area outside the probe placement area (100), for example, as shown in FIG. 2. In the example shown in FIG. 2, position alignment marks (40) are placed at each of the four corners of the first surface (201) which has a rectangular shape.
[0023] In the case of a configuration in which a probe (10) is disposed on each of a plurality of probe pads (30), the stacked substrate (22) of the substrate (20) may include a space transformer. This space transformer widens the spacing of the internal wiring of the ceramic substrate (21) electrically connected to each of the adjacent probes (10) more than the spacing of the probe pads (30) to which the adjacent probes (10) are connected. In other words, by including a space transformer in the stacked substrate (22), the spacing of the connection terminals of the substrate (20) and the electrode terminals of the printed circuit board can be widened more than the spacing of the probe pads (30).
[0024] As described below, the position alignment mark (40) is used for position alignment in the process of joining the probe (10) to the probe pad (30) in the manufacture of the electrical connection device (1). FIG. 3 shows a cross-sectional view of area A of FIG. 2, each containing one probe pad (30) and one position alignment mark (40). In FIG. 3, the drawing of the probe (10) is omitted.
[0025] As illustrated in FIG. 3, the position alignment mark (40) comprises a first position alignment mark layer (41) disposed in a second region (212) of the substrate (20) and a second position alignment mark layer (42) laminated on the first position alignment mark layer (41). When viewed from the lamination direction (hereinafter also referred to as "planar view"), the first position alignment mark layer (41) and the second position alignment mark layer (42) have similar shapes. Additionally, the outer edge of the first position alignment mark layer (41) is located on the inner side of the outer edge of the second position alignment mark layer (42). For example, as illustrated in FIG. 4, when viewed from the lamination direction, the first position alignment mark layer (41) and the second position alignment mark layer (42) may have a cross shape. In FIG. 4, the first position alignment mark layer (41) is shown through the second position alignment mark layer (42).
[0026] As illustrated in FIGS. 3 and 4, the second position alignment mark layer (42) is formed to cover the first position alignment mark layer (41), and the upper and side surfaces of the first position alignment mark layer (41) are covered by the second position alignment mark layer (42). Additionally, when viewed from the stacking direction, the second region (212) and the second position alignment mark layer (42) have the same shape. Because of this, in a planar view, an insulating region (213) is exposed adjacent to the outer edge of the second position alignment mark layer (42).
[0027] Meanwhile, in a planar view from the stacking direction, the first pad layer (31) and the second pad layer (32) have the same shape. In other words, the sides of the first pad layer (31) and the second pad layer (32) are linearly continuous in the Z direction. When viewed from the stacking direction, the first pad layer (31) and the second pad layer (32) may have a rectangular shape.
[0028] The materials of the first pad layer (31) and the second pad layer (32) may be the same. The materials of the first position alignment mark layer (41) and the second position alignment mark layer (42) may also be the same. Additionally, the materials of the first pad layer (31) and the first position alignment mark layer (41) may be the same, and the materials of the second pad layer (32) and the second position alignment mark layer (42) may also be the same. For example, the materials of the first position alignment mark layer (41) and the second position alignment mark layer (42) may be copper (Cu). Additionally, a nickel (Ni) layer and a gold (Au) layer may be stacked sequentially on the surface of the second position alignment mark layer (42).
[0029] Below, an example of a method for manufacturing an electrical connection device (1) using a position alignment mark (40) according to an embodiment is described.
[0030] First, as illustrated in FIG. 5, a substrate (20) is prepared in which a conductive layer (210) laminated on an insulating layer (220) is exposed on a first surface (201). The insulating layer (220) may be, for example, a resin layer.
[0031] Next, as described in detail below, a probe pad (30) is formed by stacking a first pad layer (31) and a second pad layer (32), and a position alignment mark (40) is formed by stacking a first position alignment mark layer (41) and a second position alignment mark layer (42). The probe pad (30) is formed in a first region (211) of a first surface (201), and the position alignment mark (40) is formed in a second region (212) of the first surface (201) spaced apart from the first region (211). For example, the position alignment mark (40) may be cross-shaped in the planar view. The probe pad (30) may be rectangular in the planar view.
[0032] More specifically, as illustrated in FIG. 6, a first photoresist film (701) formed on a first surface (201) is patterned so that a first region (211) where a first pad layer (31) is to be formed and a second region (212) where a first position-aligned mark layer (41) is to be formed are exposed. Then, a first pad layer (31) is formed in the first region (211), and a first position-aligned mark layer (41) is formed in the second region (212).
[0033] Next, after removing the first photoresist film (701), a second photoresist film (702) is formed on the first surface (201) as shown in FIG. 7, and the second photoresist film (702) is patterned so that the upper surface of the first pad layer (31) and the upper surface of the first position alignment mark layer (41) are exposed. At this time, as shown in FIG. 7, the second photoresist film (702) is patterned so that a conductive layer (210) is exposed around the outer edge of the first position alignment mark layer (41). Then, as shown in FIG. 8, a second pad layer (32) is laminated on the first pad layer (31) to form a probe pad (30), and a second position alignment mark layer (42) is laminated on the first position alignment mark layer (41) to form a position alignment mark (40). Accordingly, a position alignment mark (40) is formed such that the outer edge of the first position alignment mark layer (41) is located on the inner side of the outer edge of the second position alignment mark layer (42).
[0034] As described above, the process of forming the probe pad (30) and the position alignment mark (40) may include the step of simultaneously forming the first pad layer (31) and the first position alignment mark layer (41), and the step of simultaneously forming the second pad layer (32) and the second position alignment mark layer (42). That is, a first metal layer including the first pad layer (31) and the first position alignment mark layer (41) is formed on the first surface (201) of the substrate (20). Then, a second metal layer including the second pad layer (32) disposed on the upper surface of the first pad layer (31) and the second position alignment mark layer (42) disposed on the upper surface of the first position alignment mark layer (41) is laminated onto the first metal layer. By doing so, the first pad layer (31) and the first position alignment mark layer (41) are arranged at the same plane level, and the second pad layer (32) and the second position alignment mark layer (42) are arranged at the same plane level. The first metal layer and the second metal layer may be formed, for example, by copper plating.
[0035] Additionally, a nickel layer (51) and a gold layer (52) may be formed sequentially on the upper surface of the second metal layer. That is, a nickel layer (51) and a gold layer (52) may be laminated on the upper surface of the second pad layer (32) and the second position alignment mark layer (42). By making the surface of the probe pad (30) a gold layer (52), the contact resistance between the probe (10) and the probe pad (30) can be reduced. The nickel layer (51) serves as a barrier layer when the gold layer (52) is formed by a plating method.
[0036] After forming the probe pad (30) and the alignment mark (40), the second photoresist film (702) is removed. Subsequently, the conductive layer (210) in the remaining area, excluding the area where the probe pad (30) and the alignment mark (40) were formed on the first surface (201), is removed to expose the insulating layer (220) as shown in FIG. 9. The surface where the insulating layer (220) is exposed is the insulating area (213).
[0037] By the above process, when viewed from the stacking direction, the first position alignment mark layer (41) and the second position alignment mark layer (42) have similar shapes, and a position alignment mark (40) is formed such that the outer edge of the first position alignment mark layer (41) is located inside the outer edge of the second position alignment mark layer (42). Additionally, when viewed from the stacking direction, the second region (212) and the second position alignment mark layer (42) have the same shape, and an insulating layer (220) is exposed adjacent to the outer edge of the second position alignment mark layer (42). Meanwhile, when viewed from the stacking direction, the first pad layer (31) and the second pad layer (32) have the same shape.
[0038] After that, as shown in FIG. 10, a probe (10) connected to an object to be inspected (2) is placed on a probe pad (30) using a position alignment mark (40). For example, a connector is prepared in which the probe (10) is held in place, corresponding to the placement position of the probe pad (30) on the first surface (201) of the substrate (20). Then, the substrate (20) and the probe (10) are aligned in the X and Y directions by referring to the position alignment mark (40). After that, the relative positions of the substrate (20) and the probe (10) are changed in the Z direction so that the base end of the probe (10) comes into contact with the probe pad (30), and the probe (10) is joined to the probe pad (30). For example, the base end of the probe (10) may be joined to the probe pad (30) by soldering. By the above, an electrical connection device (1) is completed.
[0039] In aligning the positions of the probe (10) and the probe pad (30), the edges of the alignment mark (40) are visually checked. For example, in the case of a cross-shaped alignment mark (40) in a flat state, the corner portion at the intersection of the vertical and horizontal axes of the cross shape of the alignment mark (40) may be used as a reference for visual confirmation during the process of aligning the bonder and the substrate (20). In the process of bonding the probe (10) to the probe pad (30), the alignment mark (40) is captured by, for example, an imaging device installed on the bonder while the bonder is overlaid on the substrate (20), and the cross shape is confirmed to be in a predetermined position. After confirming that the corner portion is in a predetermined position, the base portion of the probe (10) is bonded to the probe pad (30). By doing so, all probes (10) can be accurately bonded to the probe pad (30). The position confirmation of the alignment mark (40) may be performed by automatic judgment.
[0040] Additionally, before joining the base portion of the probe (10) to the probe pad (30), the upper surface of the probe pad (30) may be polished and flattened. For example, in FIG. 8, the second photoresist film (702), the second pad layer (32), and the second position alignment mark layer (42) are flattened so that their front surfaces become the same surface, then the second photoresist film (702) is removed and the exposed conductive layer (210) is removed. Then, the second photoresist film (702) is formed again to flatten the front surface, then the nickel layer (51) and the gold layer (52) are deposited, and the second photoresist film (702) is removed. Although the probe pad (30) requires a certain film thickness, due to process capability, it cannot be formed with a single layer to the required film thickness, so the probe pad (30) is made into a two-layer structure. For flattening, the thickness of the second film layer, on which the upper surface is polished, may be formed to be thicker than the thickness of the first film layer. Since the probe pad (30) has a two-layer structure, the position alignment mark (40) formed simultaneously with the probe pad (30) also has a two-layer structure. In addition, since a heating process is performed after the process of forming the probe pad (30), mechanical strength is required for the position alignment mark (40) so that it does not peel off from the substrate (20). By making the position alignment mark (40) a two-layer structure, the film thickness and mechanical strength of the position alignment mark (40) can be secured. The film thickness of the probe pad (30) and the position alignment mark (40) after completion may be, for example, about 20 μm to 35 μm.
[0041] Below, a position alignment mark of a comparative example is described in order to compare it with a position alignment mark (40) according to an embodiment.
[0042] FIGS. 11 and FIGS. 12 illustrate a position alignment mark of a first comparative example (hereinafter referred to as the "first comparative position alignment mark (401)"). The first comparative position alignment mark (401) is a two-layer structure formed by stacking a first metal layer (81) and a second metal layer (82). FIG. 11 is a top view of the first comparative position alignment mark (401) viewed from the stacking direction of the first metal layer (81) and the second metal layer (82). FIG. 12 is a cross-sectional view along the XII-XII direction of FIG. 11.
[0043] In the first comparison position alignment mark (401), the first metal layer (81) is rectangular in shape and the second metal layer (82) is cross-shaped. In the position alignment of the bonder holding the substrate (20) and the probe (10), the cross-shaped edge of the second metal layer (82) is used as a reference for visual inspection. Since the first metal layer (81) is rectangular, an area of the upper surface of the first metal layer (81) that is not covered by the second metal layer (82) and is exposed exists around the second metal layer (82). The exposed area of the first metal layer (81) is discolored, for example, by oxidation. Because of this, it becomes difficult to identify the cross-shaped edge of the second metal layer (82).
[0044] In this regard, in the position alignment mark (40) according to the embodiment, when viewed from the stacking direction, the first position alignment mark layer (41) and the second position alignment mark layer (42) have similar shapes, and the outer edge of the first position alignment mark layer (41) is located inside the outer edge of the second position alignment mark layer (42). Because of this, there is no exposed area of the first position alignment mark layer (41). Therefore, with the position alignment mark (40) that does not have discoloration or the like in exposed areas, it is prevented that the edge of the position alignment mark (40), for example, which is shaped like a cross, becomes difficult to identify.
[0045] FIGS. 13 and 14 illustrate a position alignment mark of a second comparative example (hereinafter referred to as "second comparative position alignment mark (402)"). The second comparative position alignment mark (402) is a two-layer structure formed by stacking a first metal layer (81) and a second metal layer (82). FIG. 13 is a top view of the second comparative position alignment mark (402) viewed from the stacking direction. FIG. 14 is a cross-sectional view along the XIV-XIV direction of FIG. 13. The second comparative position alignment mark (402) has the first metal layer (81) and the second metal layer (82) in the same cross shape when viewed in a planar view.
[0046] In the second comparison position alignment mark (402), if a misalignment occurs between the first metal layer (81) and the second metal layer (82) during manufacturing, the cross-shaped edge becomes doubled as shown in FIG. 15. As a result, in the alignment of the bonding device holding the substrate (20) and the probe (10), it is difficult to identify the edge of the second comparison position alignment mark (402).
[0047] In this regard, in the position alignment mark (40) according to the embodiment, when viewed from the stacking direction, the first position alignment mark layer (41) and the second position alignment mark layer (42) have similar shapes, and the outer edge of the first position alignment mark layer (41) is located inside the outer edge of the second position alignment mark layer (42). That is, there is a difference in size (hereinafter referred to as "size difference") between the first position alignment mark layer (41) and the second position alignment mark layer (42). Because of this, even if a misalignment occurs in the overlap between the first position alignment mark layer (41) and the second position alignment mark layer (42), the first position alignment mark layer (41) is covered by the second position alignment mark layer (42) within the margin of the size difference. Because of this, the outer edge of the second position alignment mark layer (42) is visible as the edge of the position alignment mark (40). Therefore, the position alignment mark (40) can prevent the edge from becoming double.
[0048] The size difference between the first position alignment mark layer (41) and the second position alignment mark layer (42) may be set according to the manufacturing precision in the process of forming the position alignment mark (40). That is, even if misalignment occurs in the overlap between the first position alignment mark layer (41) and the second position alignment mark layer (42) due to the precision of the manufacturing device, the size difference is set so that the first position alignment mark layer (41) is covered by the second position alignment mark layer (42). For example, the spacing of the cross-shaped corner portions may be approximately 28 μm for the first position alignment mark layer (41) and approximately 35 μm for the second position alignment mark layer (42). Additionally, as long as the edges are identifiable, the size of the position alignment mark (40) can be set arbitrarily.
[0049] In addition, in the position alignment mark (40), an insulating region (213) is exposed adjacent to the outer edge of the second position alignment mark layer (42). Because of this, the contrast between the position alignment mark (40) and the surroundings in the image is clearer than when a metal layer is exposed on the outer edge of the second position alignment mark layer (42) in a planar view, making it easy to identify the edge of the position alignment mark (40).
[0050] As described above, in the position alignment mark (40), when viewed from the stacking direction, the first position alignment mark layer (41) and the second position alignment mark layer (42) have similar shapes, and the outer edge of the first position alignment mark layer (41) is located inside the outer edge of the second position alignment mark layer (42). Because of this, the position alignment mark (40) makes it easy to identify the edge of the position alignment mark (40). In addition, by making the position alignment mark (40) a two-layer structure, the visibility of the edge of the position alignment mark (40) can be maintained at a high level, and the film thickness and mechanical strength can be secured. Furthermore, by manufacturing using the position alignment mark (40), the positional precision of the probe (10) in the electrical connection device (1) can be improved.
[0051] (Other embodiments)
[0052] As described above, the present invention has been described by way of embodiments; however, the descriptions and drawings constituting part of this disclosure should not be understood as limiting the invention. From this disclosure, various alternative embodiments, examples, and operating techniques will become apparent to those skilled in the art.
[0053] For example, the above description describes an example in which position alignment marks (40) are placed at the four corners of the first rectangular surface (201) of the substrate (20), but the number of position alignment marks (40) placed on the first surface (201) and the placement locations can be arbitrarily set. For example, the number of position alignment marks (40) and the placement locations may be set according to the size of the substrate (20) or the precision of the manufacturing device.
[0054] As such, the present invention naturally includes various embodiments not described above. Explanation of the symbols
[0055] 1: Electrical connection device 2: Subject of inspection 10: Probe 20: Substrate 21: Ceramic substrate 22: Laminated substrate 30: Probe pad 31: 1st pad layer 32: Second pad layer 40: Position alignment mark 41: 1st position-aligned mark layer 42: Second position-aligned mark layer 51: Nickel layer 52: Gold layer 100: Probe placement area 201: Page 1 202: Page 2 210: Challenge Floor 211: First Zone 212: Second Zone 213: Insulation area 220: Insulating layer
Claims
Claim 1 An electrical connection device used for testing the electrical characteristics of an object to be tested, comprising: a substrate having a first surface in which a first region and a second region each having conductivity are formed and an insulating region surrounds the first region and the second region; a structure in which a first pad layer and a second pad layer are stacked; a probe pad disposed in the first region of the substrate; a probe disposed on the upper surface of the second pad layer of the probe pad; a structure in which a first position alignment mark layer and a second position alignment mark layer are stacked; and a position alignment mark disposed in the second region of the substrate, wherein when viewed from the stacking direction in which the first position alignment mark layer and the second position alignment mark layer are stacked, the first position alignment mark layer and the second position alignment mark layer have similar shapes, and furthermore, the outer edge of the first position alignment mark layer is located on the inner side of the outer edge of the second position alignment mark layer. Claim 2 An electrical connection device according to claim 1, wherein, when viewed from the stacking direction, the second region and the second position alignment mark layer have similar shapes, and the insulating region is exposed adjacent to the outer edge of the second position alignment mark layer. Claim 3 An electrical connection device according to claim 1, wherein, when viewed in the stacking direction, the first pad layer and the second pad layer have the same shape. Claim 4 An electrical connection device according to any one of claims 1 to 3, wherein a probe placement area in which a plurality of probe pads are disposed is set on the first surface, and the position alignment mark is disposed in a peripheral area outside the probe placement area. Claim 5 An electrical connection device according to claim 4, wherein, when viewed from the stacking direction, the substrate has a rectangular shape and the position alignment marks are each placed at the four corners of the first surface. Claim 6 In any one of paragraphs 1 to 3, the substrate is, A laminated substrate including the first surface above, and A ceramic substrate disposed on the main surface of the laminated substrate facing the opposite direction of the first surface, and An electrical connection device comprising internal wiring that is electrically connected to the first region, wherein the internal wiring disposed on the laminated substrate and the internal wiring disposed on the ceramic substrate are electrically connected. Claim 7 An electrical connection device according to claim 6, comprising a plurality of probe pads arranged on the first surface and a plurality of probes disposed on each of the plurality of probe pads, wherein the laminated substrate includes a space transformer that widens the spacing of the internal wiring of the ceramic substrate electrically connected to each of the adjacent probes more than the spacing of the probe pads to which the adjacent probes each connect. Claim 8 An electrical connection device used for testing the electrical characteristics of an object to be tested, comprising a substrate and a structure in which a first position alignment mark layer and a second position alignment mark layer are stacked, and having a position alignment mark disposed on the substrate, wherein when viewed from the stacking direction in which the first position alignment mark layer and the second position alignment mark layer are stacked, the first position alignment mark layer and the second position alignment mark layer have similar shapes, and furthermore, the outer edge of the first position alignment mark layer is located on the inner side of the outer edge of the second position alignment mark layer. Claim 9 A position alignment mark used in the manufacture of an electrical connection device comprising: a substrate having a first surface in which a first region and a second region having conductive properties are formed and an insulating region surrounds the first region and the second region; a probe pad disposed in the first region of the substrate having a structure in which a first pad layer and a second pad layer are stacked; and a probe disposed on the upper surface of the second pad layer of the probe pad, wherein the position alignment mark comprises a first position alignment mark layer disposed in the second region of the substrate and a second position alignment mark layer stacked on the first position alignment mark layer, wherein when viewed from the stacking direction in which the first position alignment mark layer and the second position alignment mark layer are stacked, the first position alignment mark layer and the second position alignment mark layer have similar shapes, and furthermore, the outer edge of the first position alignment mark layer is located on the inner side of the outer edge of the second position alignment mark layer. Claim 10 In claim 9, the position alignment mark, when viewed from the stacking direction, the second region and the second position alignment mark layer have the same shape, and the insulating region is exposed adjacent to the outer edge of the second position alignment mark layer. Claim 11 A position alignment mark according to claim 9 or 10, wherein the material of the first pad layer and the first position alignment mark layer are the same, and the first pad layer and the first position alignment mark layer are arranged at the same plane level, and the material of the second pad layer and the second position alignment mark layer are the same, and the second pad layer and the second position alignment mark layer are arranged at the same plane level. Claim 12 A position alignment mark according to claim 9 or 10, wherein, when viewed from the stacking direction, the first position alignment mark layer and the second position alignment mark layer are cross-shaped. Claim 13 A position alignment mark according to claim 9 or 10, wherein the material of the first position alignment mark layer and the second position alignment mark layer is copper. Claim 14 In paragraph 13, a position alignment mark having a nickel layer and a gold layer sequentially laminated on the surface of the second position alignment mark layer. Claim 15 A method for manufacturing an electrical connection device used for testing the electrical characteristics of an object to be tested, comprising: a process of preparing a substrate in which a conductive layer laminated on an insulating layer is exposed on a first surface; a process of forming a probe pad by laminating a first pad layer and a second pad layer in a first area of the first surface, and forming a position alignment mark by laminating a first position alignment mark layer and a second position alignment mark layer in a second area spaced apart from the first area of the first surface; a process of removing the conductive layer in the remaining area excluding the first area and the second area of the first surface to expose the insulating layer; and a process of bonding a probe to the object to be tested to the probe pad using the position alignment mark, wherein, when viewed from the lamination direction in which the first position alignment mark layer and the second position alignment mark layer are laminated, the first position alignment mark layer and the second position alignment mark layer have similar shapes, and furthermore, the outer edge of the first position alignment mark layer is located on the inner side of the outer edge of the second position alignment mark layer. Claim 16 A method for manufacturing an electrical connection device according to claim 15, wherein, when viewed from the stacking direction, the second region and the second position alignment mark layer have the same shape, and the insulating layer is exposed adjacent to the outer edge of the second position alignment mark layer. Claim 17 In Clause 16, the process of forming the probe pad and the position alignment mark is, A step of forming a first metal layer comprising the first pad layer of the probe pad and the first position alignment mark layer of the position alignment mark on the first surface of the substrate, and A method for manufacturing an electrical connection device, comprising the step of laminating a second metal layer, the second pad layer disposed on the upper surface of the first pad layer and the second position alignment mark layer disposed on the upper surface of the first position alignment mark layer, onto the first metal layer. Claim 18 A method for manufacturing an electrical connection device according to claim 17, wherein the materials of the first metal layer and the second metal layer are copper. Claim 19 A method for manufacturing an electrical connection device according to claim 18, further comprising a process of forming a nickel layer and a gold layer in sequence on the upper surface of the second metal layer. Claim 20 A method for manufacturing an electrical connection device, wherein, in any one of claims 15 to 19, the first position alignment mark layer and the second position alignment mark layer are cross-shaped when viewed from the stacking direction. Claim 21 A method for manufacturing an electrical connection device, wherein, in any one of claims 15 to 19, the first pad layer and the second pad layer have the same shape when viewed in the stacking direction.