Display device and electronic device including the same

Abstract

The present invention relates to a display device and an electronic device including the same. Specifically, according to one embodiment of the present invention, a display device may be provided comprising a display panel and a driving circuit board connected to the display panel, wherein the driving circuit board includes a connection module connected to a signal pin, and the connection module includes a connection pad, a dummy pad spaced apart from the connection pad, a first expansion pad connected to the connection pad, and a second expansion pad connected to the first expansion pad, and wherein the signal pin is connected to the first expansion pad or the second expansion pad.

Description

Technology Field

[0001] The present invention relates to a display device and an electronic device including the same. Background Technology

[0002] Display devices that output video information, such as TVs or monitors, consist of an image display unit that implements an image and a circuit unit that outputs video signals for implementing the image. With the development of the information society, the demand for display devices has diversified, leading to an increase in the use of flat panel displays, such as liquid crystal displays and organic light-emitting diodes (OLEDs). Flat panel displays are composed of a display panel consisting of multiple pixels and a circuit unit that supplies signals to the display panel.

[0003] The display panel consists of a substrate on which signal wiring for transmitting signals to implement an image and switching elements for driving pixels are formed.

[0004] The circuit section consists of a control circuit board having a system that supplies signals and power for implementing an image, a controller that converts the signals received from the system into signals to be supplied to the display panel, and a driving circuit board that processes the signals converted by the control circuit board and transmits them to the display panel.

[0005] The driving circuit board may include a connection module for receiving a signal converted from the control circuit board. The connection module may include a plurality of connection pads. The problem to be solved

[0006] The purpose of the present invention is to provide a display device capable of improving the connection rate between a connection module of a driving circuit board and a signal pin, and an electronic device including the same.

[0007] The problems of the present invention are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0008] A display device according to one embodiment of the present invention for achieving the above-mentioned purpose comprises a display panel and a driving circuit board connected to the display panel, wherein the driving circuit board comprises a connection module connected to a signal pin, and the connection module comprises a connection pad, a dummy pad spaced apart from the connection pad, a first expansion pad connected to the connection pad, and a second expansion pad connected to the first expansion pad, and the signal pin is connected to the first expansion pad or the second expansion pad.

[0009] The above connection pad and the dummy pad extend in one direction, and the connection pad and the dummy pad may be spaced apart in another direction intersecting the one direction.

[0010] The above connection pad and the above dummy pad can be arranged side by side.

[0011] The first expansion pad extends in one direction from the connection pad, and the second expansion pad may extend in the other direction from the first expansion pad.

[0012] The extension length of the second extension pad above may correspond to the distance between the connection pad and the dummy pad.

[0013] The first expansion pad may extend from one end of the connection pad in one direction, and the second expansion pad may extend from one end of the first expansion pad in the other direction.

[0014] The length of the first expansion pad in one direction may correspond to the length of the second expansion pad in one direction.

[0015] A display device according to one embodiment of the present invention may further include a flood prevention member formed in the boundary area between the connection pad and the first expansion pad.

[0016] The above flood prevention member may be formed to protrude from the connection pad in the thickness direction of the connection pad.

[0017] The above connection pads and the dummy pads are provided in a plurality, and the plurality of connection pads and the plurality of dummy pads extend in one direction, and the plurality of connection pads and the plurality of dummy pads may be spaced apart in another direction intersecting the one direction.

[0018] The plurality of dummy pads mentioned above can be placed between the plurality of connection pads.

[0019] The first expansion pad and the second expansion pad are provided in a plurality, and the plurality of first expansion pads extend in the one direction from the plurality of connection pads, and the plurality of second expansion pads may extend in the other direction from the plurality of first expansion pads.

[0020] The extension length of the second extension pad may correspond to the spacing distance of the connection pads, or the spacing distance between the connection pad and the dummy pad.

[0021] The first expansion pads extend from one end of the connection pads in one direction, and the second expansion pads may extend from one end or the other end of the first expansion pads in the other direction.

[0022] The length of the first expansion pads in one direction may correspond to the length of the second expansion pads in one direction.

[0023] A display device according to one embodiment of the present invention may further include a plurality of flood prevention members formed in the boundary area of ​​the plurality of connection pads and the plurality of first expansion pads.

[0024] The above plurality of flood prevention members may be formed to protrude from the connection pads in the thickness direction of the connection pads.

[0025] An electronic device according to one embodiment of the present invention comprises a display panel, a driving circuit board connected to the display panel, a processor, a memory in which data of one or more of the display panel and the processor is stored, and a power module that supplies power to the display panel, the processor and the memory, wherein the driving circuit board comprises a connection module connected to a signal pin, and the connection module comprises a connection pad, a dummy pad spaced apart from the connection pad, a first expansion pad connected to the connection pad, and a second expansion pad connected to the first expansion pad, and the signal pin is connected to the first expansion pad or the second expansion pad.

[0026] The above connection pads and the dummy pads are provided in a plurality, and the plurality of connection pads and the plurality of dummy pads extend in one direction, and the plurality of connection pads and the plurality of dummy pads are spaced apart in another direction intersecting the one direction, and the first expansion pad and the second expansion pad are provided in a plurality, and the plurality of first expansion pads extend from the plurality of connection pads in the one direction, and the plurality of second expansion pads may extend from the plurality of first expansion pads in the other direction.

[0027] An electronic device according to one embodiment of the present invention may further include a plurality of flood prevention members formed in the boundary region of the plurality of connection pads and the plurality of first expansion pads.

[0028] Specific details of other embodiments are included in the detailed description and drawings. Effects of the invention

[0029] According to the display device and electronic device including the same according to the present invention, by arranging a first expansion pad and a second expansion pad on a connection module of a driving circuit board to expand the connection area between the connection module and the signal pin, the connection rate between the connection module of the driving circuit board and the signal pin can be improved.

[0030] Meanwhile, the effects obtainable from the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present invention belongs from the description below. Brief explanation of the drawing

[0031] FIG. 1 is a plan view schematically showing a bent state of a connecting member of a display device according to one embodiment of the present invention. FIG. 2 is a plan view schematically showing the unfolded state of a connecting member of a display device according to one embodiment of the present invention. Figure 3 is a partial side view of Figure 2. Figure 4 is a cross-sectional view schematically showing the display panel of Figure 3. Figure 5 is an enlarged view of part A of Figure 2. Figure 6 is an enlarged view of part B of Figure 5. FIGS. 7 and FIGS. 8 are drawings showing the state in which a signal pin is connected to the first expansion pad or the second expansion pad. Figure 9 is a drawing showing the state in which the flood prevention member is arranged in Figure 6. Figure 10 is an enlarged view of part C of Figure 9. FIG. 11 is a drawing showing FIG. 9 viewed from a second direction. FIG. 12 is a block diagram of an electronic device according to one embodiment. FIG. 13 is a schematic diagram of an electronic device according to various embodiments. Specific details for implementing the invention

[0032] The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims.

[0033] When elements or layers are referred to as being "on" another element or layer, this includes cases where another layer or element is interposed directly on or in the middle of another element. Throughout the specification, the same reference numerals refer to the same components. Shapes, sizes, ratios, angles, numbers, etc., disclosed in the drawings for describing embodiments are exemplary and therefore the invention is not limited to the depicted details.

[0034] Although terms such as "first," "second," etc., are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may also be the second component within the technical scope of the present invention.

[0035] The features of each of the various embodiments of the present invention may be combined or combined with one another, either partially or wholly, and may technically enable various interlocking and operation. Each embodiment may be implemented independently of one another or may be implemented together in an associated relationship.

[0036] Specific embodiments will be described below with reference to the attached drawings.

[0037] FIG. 1 is a plan view schematically showing a bent state of a connecting member of a display device according to one embodiment of the present invention. FIG. 2 is a plan view schematically showing an unfolded state of a connecting member of a display device according to one embodiment of the present invention. FIG. 3 is a partial side view of FIG. 2.

[0038] A display device (10) according to one embodiment of the present invention is a device for displaying video or still images, and can be used as a display screen for various products such as televisions, laptops, monitors, billboards, and the Internet of Things (IOT), as well as portable electronic devices such as mobile phones, smartphones, tablet PCs, smart watches, watch phones, mobile communication terminals, electronic notebooks, electronic books, PMPs (portable multimedia players), navigation systems, and UMPCs (Ultra Mobile PCs). Alternatively, the display device (10) can be used as a display screen applied to the center fascia of a vehicle.

[0039] The display device (10) may be an organic light-emitting display device using an organic light-emitting diode, a quantum dot light-emitting display device including a quantum dot light-emitting layer, an inorganic light-emitting display device including an inorganic semiconductor, and a micro light-emitting display device using a micro light-emitting diode (LED). Although the following description focuses on the display device (10) being an organic light-emitting display device, the present invention is not limited thereto.

[0040] In FIG. 1, the first direction (D1) may be a direction parallel to one side of the display device (10) when viewed on a plane, for example, the horizontal direction of the display device (10). The second direction (D2) may be a direction parallel to the other side that touches one side of the display device (10) when viewed on a plane, and may be the vertical direction of the display device (10). The third direction (D3) may be the thickness direction of the display device (10).

[0041] The planar shape of the display device (10) may have a rectangular shape, such as a rectangle. For example, the display device (10) may have a rectangular planar shape having a long side in the first direction (D1) and a short side in the second direction (D2). The corner where the long side in the first direction (D1) and the short side in the second direction (D2) meet may be formed rounded to have a predetermined curvature or formed at a right angle. The planar shape of the display device (10) is not limited to a rectangle and may be formed as other polygons, circles, or ellipses.

[0042] The display device (10) may include a display area and a non-display area. The planar shape of the display area may follow the shape of the display device (10). For example, if the planar shape of the display device (10) is rectangular, the planar shape of the display area may also be rectangular.

[0043] The display area may be an area that includes multiple pixels to display an image. The non-display area may be an area that does not include pixels and therefore does not display an image. The non-display area may be positioned around the display area. The non-display area may be positioned to surround the display area, but the embodiments of this specification are not limited thereto. The display area may be partially surrounded by the non-display area.

[0044] Referring to FIGS. 1 to 3, a display device (10) according to one embodiment of the present invention may include a cover window (100), a display panel (200), a panel lower member (300), a connecting member (400), and a driving circuit board (500).

[0045] The cover window (100) may include a material with high light transmittance. The cover window (100) may include a polymer resin such as polyimide or glass. The cover window (100) may be attached to the polarizing film (PF) described later on the display panel (200) by an adhesive member such as an optically clear adhesive (OCA) film.

[0046] The display panel (200) may be positioned at the bottom of the cover window (100). The display panel (200) may have a rectangular planar shape having a long side in the first direction (D1) and a short side in the second direction (D2). The corner where the long side in the first direction (D1) and the short side in the second direction (D2) meet in the display panel (200) may be formed at a right angle or rounded to have a predetermined curvature. The display panel (200) may have a planar shape other than a rectangle, a polygon other than a rectangle, a circle, an ellipse, or an irregular shape.

[0047] The display panel (200) may include a display area in which a plurality of light-emitting regions are arranged and a non-display area arranged around the display area. The non-display area may be arranged to surround the display area. A plurality of display pads may be arranged in the non-display area at one edge of the display panel (200).

[0048] The display panel (200) may include a substrate (SUB), a display unit (PAL), a sensor unit (SENL), and a polarizing film (PF).

[0049] The substrate (SUB) may be made of insulating materials such as glass, quartz, or polymer resin. The substrate (SUB) may be a rigid substrate or a flexible substrate capable of bending, folding, rolling, etc.

[0050] A display unit (PAL) may be disposed on a substrate (SUB). The display unit (PAL) may be a layer comprising a plurality of light-emitting regions that emit light. The display unit (PAL) may include a buffer film, a thin-film transistor layer on which thin-film transistors are disposed, a light-emitting element layer that emits light, and an encapsulation layer for encapsulating the light-emitting element layer.

[0051] The sensor unit (SENL) may be placed on the display unit (PAL). The sensor unit (SENL) includes sensor electrodes and may be a layer for detecting whether a user touches it.

[0052] A polarizing film (PF) may be placed on a sensor unit (SENL). The polarizing film (PF) may serve to prevent a decrease in image visibility of the display panel (200) due to external light reflection. The polarizing film (PF) may include a phase delay film such as a linear polarizer and a λ / 4 plate (quarter-wave plate). The phase delay film may be placed on the sensor unit (SENL), and the linear polarizer may be placed on the phase delay film. A cover window (100) may be placed on the upper side of the polarizing film (PF).

[0053] A panel lower member (300) may be positioned on the lower surface of a substrate (SUB). The panel lower member (300) may be attached to the lower surface of the substrate (SUB) through an adhesive member. The adhesive member may be a pressure-sensitive adhesive (PSA). The panel lower member (300) may include at least one of a light-absorbing member for absorbing light incident from the outside, a buffering member for absorbing shock from the outside, and a heat dissipation member for efficiently dissipating heat from the display panel (200).

[0054] A light-absorbing member may be placed on the lower part of a substrate (SUB). The light-absorbing member prevents the transmission of light, thereby preventing components placed on the lower part of the light-absorbing member, such as a driving circuit board (500), from being visible from the upper part of the display panel (200). The light-absorbing member may include a light-absorbing material such as a black pigment or a black dye.

[0055] A cushioning member may be placed below the light-absorbing member. The cushioning member absorbs external shocks to prevent the display panel (200) from being damaged. The cushioning member may be composed of a single layer or multiple layers. For example, the cushioning member may be formed from a polymer resin such as polyurethane, polycarbonate, polypropylene, or polyethylene, or may be made of an elastic material such as a sponge formed by foam molding rubber, a urethane-based material, or an acrylic-based material.

[0056] A heat dissipation member may be placed at the bottom of a buffer member. The heat dissipation member may include a first heat dissipation layer comprising graphite or carbon nanotubes, and a second heat dissipation layer formed of a metal thin film such as copper, nickel, ferrite, or silver, which can shield electromagnetic waves and has excellent thermal conductivity.

[0057] The connecting member (400) can be connected to a plurality of display pads of the display panel (200) through a conductive adhesive member such as an anisotropic conductive film. As a result, the display panel (200) and the connecting member (400) can be electrically connected.

[0058] Additionally, the connecting member (400) can be connected to a plurality of circuit pads of the driving circuit board (500) through a conductive adhesive member such as an anisotropic conductive film, so that the connecting member (400) and the driving circuit board (500) can be electrically connected.

[0059] The connecting member (400) may be a flexible printed circuit board or a chip on film.

[0060] Figure 4 is a cross-sectional view schematically showing the display panel of Figure 3.

[0061] Referring to FIG. 4, the display unit (PAL) may include a buffer film (202), a thin film transistor layer (203), a light-emitting element layer (204), and an encapsulation layer (205).

[0062] A buffer film (202) may be formed on the substrate (SUB). The buffer film (202) may be formed on the substrate (SUB) to protect thin-film transistors (235) and light-emitting elements from moisture penetrating through the substrate (SUB), which is vulnerable to moisture permeability. The buffer film (202) may be composed of a plurality of inorganic films that are alternately stacked. For example, the buffer film (202) may be formed as a multilayer film in which one or more inorganic films selected from silicon oxide (SiOx), silicon nitride (SiNx), and SiON are alternately stacked. The buffer film (202) may be omitted.

[0063] A thin-film transistor layer (203) is formed on the buffer film (202). The thin-film transistor layer (203) includes thin-film transistors (235), a gate insulating film (236), an interlayer insulating film (237), a protective film (238), and an organic film (239).

[0064] Each of the thin-film transistors (235) includes an active layer (231), a gate electrode (232), a source electrode (233), and a drain electrode (234). In FIG. 4, the thin-film transistor (235) is illustrated as being formed in a top gate configuration where the gate electrode (232) is located above the active layer (231), but it should be noted that this is not limited thereto. That is, the thin-film transistors (235) may be formed in a bottom gate configuration where the gate electrode (232) is located below the active layer (231), or in a double gate configuration where the gate electrode (232) is located above and below the active layer (231).

[0065] An active layer (231) is formed on the buffer film (202). The active layer (231) may be formed from a silicon-based semiconductor material or an oxide-based semiconductor material. For example, the active layer (231) may be formed from polycrystalline silicon, amorphous silicon, or an oxide semiconductor. A light-blocking layer may be formed between the buffer film (202) and the active layer (231) to block external light incident on the active layer (231).

[0066] A gate insulating film (236) may be formed on the active layer (231). The gate insulating film (236) may be formed from an inorganic film, for example, a silicon oxide film (SiOx), a silicon nitride film (SiNx), or a combination thereof.

[0067] A gate electrode (232) may be formed on the gate insulating film (236). The gate electrode (232) and the gate wiring may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0068] An interlayer insulating film (237) may be formed on the gate electrode (232) and the gate wiring. The interlayer insulating film (237) may be formed from an inorganic film, for example, a silicon oxide film (SiOx), a silicon nitride film (SiNx), or a combination thereof.

[0069] A source electrode (233) and a drain electrode (234) may be formed on the interlayer insulating film (237). Each of the source electrode (233) and the drain electrode (234) may be connected to the active layer (231) through a contact hole penetrating the gate insulating film (236) and the interlayer insulating film (237). The source electrode (233) and the drain electrode (234) may be formed as a single layer or a multilayer made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0070] A protective film (238) for insulating a thin-film transistor (235) may be formed on the source electrode (233) and the drain electrode (234). The protective film (238) may be formed of an inorganic film, for example, a silicon oxide film (SiOx), a silicon nitride film (SiNx), or a combination thereof.

[0071] An organic film (239) may be formed on the protective film (238) to flatten the step caused by the thin-film transistor (235). The organic film (239) may be formed from an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0072] A light-emitting element layer (204) is formed on the thin-film transistor layer (203). The light-emitting element layer (204) includes light-emitting elements and a bank.

[0073] The light-emitting elements and banks are formed on the organic film (239). The light-emitting element is exemplified as an organic light-emitting device comprising an anode electrode (241), light-emitting layers (242), and a cathode electrode (243).

[0074] The anode electrode (241) can be formed on the organic film (239). The anode electrode (241) can be connected to the source electrode (233) of the thin-film transistor (235) through a contact hole penetrating the protective film (238) and the organic film (239).

[0075] A bank may be formed to cover the edge of an anode electrode (241) on an organic film (239) to partition the light-emitting regions (EA) of the pixels. That is, the bank serves to define the light-emitting regions (EA) of the pixels. Each pixel represents a region in which an anode electrode (241), a light-emitting layer (242), and a cathode electrode (243) are sequentially stacked so that holes from the anode electrode (241) and electrons from the cathode electrode (243) combine with each other in the light-emitting layer (242) to emit light.

[0076] Light-emitting layers (242) are formed on the anode electrode (241) and the bank. The light-emitting layer (242) may be an organic light-emitting layer. The light-emitting layer (242) may emit one of red light, green light, and blue light. Alternatively, the light-emitting layer (242) may be a white light-emitting layer that emits white light, in which case it may have a stacked form of a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer, and may be a common layer formed in common with the pixels. In this case, the display panel (200) may further include separate color filters for displaying red, green, and blue.

[0077] The light-emitting layer (242) may include a hole transporting layer, a light-emitting layer, and an electron transporting layer. Additionally, the light-emitting layer (242) may be formed in a tandem structure of two or more stacks, in which case a charge-generating layer may be formed between the stacks.

[0078] A cathode electrode (243) is formed on the light-emitting layer (242). The cathode electrode (243) may be formed to cover the light-emitting layer (242). The cathode electrode (243) may be a common layer formed in common across the pixels.

[0079] When the light-emitting element layer (204) is formed in a top emission manner that emits light in an upward direction, the anode electrode (241) may be formed from a highly reflective metallic material such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu). Additionally, the cathode electrode (243) may be formed from a transparent metallic material (TCO, Transparent Conductive Material) such as ITO or IZO that can transmit light, or a semi-transmissive metallic material (Semi-transmissive Conductive Material) such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). When the cathode electrode (243) is formed of a semi-transparent metal material, the light emission efficiency can be increased by micro-cavity.

[0080] When the light-emitting element layer (204) is formed in a bottom emission manner that emits light in a downward direction, the anode electrode (241) may be formed from a transparent conductive material (TCO) such as ITO or IZO, or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). The cathode electrode (243) may be formed from a highly reflective conductive material such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO). When the anode electrode (241) is formed from a semi-transmissive conductive material, the light emission efficiency may be increased by micro-cavity.

[0081] An encapsulation layer (205) is formed on the light-emitting element layer (204). The encapsulation layer (205) serves to prevent oxygen or moisture from penetrating into the light-emitting layer (242) and the cathode electrode (243). To this end, the encapsulation layer (205) may include at least one inorganic film. The inorganic film may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. Additionally, the encapsulation layer (205) may further include at least one organic film. The organic film may be formed with a sufficient thickness to prevent foreign particles from penetrating the encapsulation layer (205) and entering the light-emitting layer (242) and the cathode electrode (243). The organic film may include any one of epoxy, acrylate, or urethane acrylate.

[0082] A sensor unit (SENL) may be formed on the encapsulation layer (205). When the sensor unit (SENL) is formed directly on the encapsulation layer (205), there is an advantage in that the thickness of the display device (10) can be reduced compared to when a separate touch panel is attached to the encapsulation layer (205).

[0083] The sensor unit (SENL) may include sensor electrodes for detecting a user's touch in a capacitive manner and touch wiring connecting the pads and the sensor electrodes. For example, the sensor unit (SENL) may detect a user's touch in a self-capacitance manner or a mutual capacitance manner. FIG. 4 describes the sensor unit (SENL) as being formed in a two-layer mutual capacitance manner, comprising driving electrodes (TE), sensing electrodes (RE), and connecting portions (BE) connecting the driving electrodes (TE).

[0084] Connections (BE) may be formed on the encapsulation layer (205). The connection (BE) may be formed from a laminated structure of aluminum and titanium (Ti / Al / Ti), a laminated structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a laminated structure of APC alloy and ITO (ITO / APC / ITO), but is not limited thereto. For example, the connection (BE) may be formed from a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), aluminum (Al), or ITO.

[0085] A first sensing insulating film (TINS1) is formed on the connection portions (BE). The first sensing insulating film (TINS1) may be formed of an inorganic film, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0086] Driving electrodes (TE) and sensing electrodes (RE) may be formed on the first sensing insulating film (TINS1). The driving electrodes (TE) and sensing electrodes (RE) may be formed from a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO), but are not limited thereto. For example, the driving electrodes (TE) and sensing electrodes (RE) may be formed from a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), aluminum (Al), or ITO.

[0087] Contact holes may be formed in the first sensing insulating film (TINS1) to penetrate the first sensing insulating film (TINS1) and expose connection portions (BE). Driving electrodes (TE) may be connected to the connection portions (BE) through the contact holes.

[0088] A second sensing insulating film (TINS2) is formed on the driving electrodes (TE) and the sensing electrodes (RE). The second sensing insulating film (TINS2) can serve to flatten the step difference caused by the driving electrodes (TE), the sensing electrodes (RE), and the connection portions (BE). The second sensing insulating film (TINS2) can be formed from an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0089] Connection portions (BE) connecting adjacent driving electrodes (TE) are disposed on the encapsulation layer (205), and the driving electrodes (TE) and sensing electrodes (RE) can be disposed on the first sensing insulating film (TINS1). Thus, the driving electrodes (TE) and sensing electrodes (RE) are electrically separated at their intersections, the sensing electrodes (RE) are electrically connected in one direction, and the driving electrodes (TE) can be electrically connected in the other direction.

[0090] A polarizing film (PF) is placed on the second sensing insulating film (TINS2) and can serve to prevent the deterioration of image visibility of the display panel (200) due to external light reflection.

[0091] Figure 5 is an enlarged view of part A of Figure 2.

[0092] Referring to FIG. 5, the driving circuit board (500) can be electrically connected to the display panel (200) by a connecting member (400). The driving circuit board (500) may be a flexible printed circuit board (FPCB) that can be bent, a rigid printed circuit board (PCB) that is rigid and does not bend easily, or a composite printed circuit board that includes both a rigid printed circuit board and a flexible printed circuit board. The driving circuit board (500) can be placed on the lower part of the panel lower member (300) when the connecting member (400) is bent.

[0093] The driving circuit board (500) can process a signal converted by a control circuit board (not shown) and transmit it to a display panel (200). The driving circuit board (500) may include a connection module (B) for connecting to a signal pin (600, see FIG. 7) into which the signal converted by the control circuit board (not shown) is input.

[0094] FIG. 6 is an enlarged view of part B of FIG. 5. FIG. 7 and FIG. 8 are drawings showing the state in which a signal pin is connected to the first expansion pad or the second expansion pad.

[0095] Referring to FIGS. 6 to 8, the connection module (B) may include a connection pad (510), a dummy pad (520), a first expansion pad (530), and a second expansion pad (540). The connection pad (510), the dummy pad (520), the first expansion pad (530), and the second expansion pad (540) may be provided in multiple numbers.

[0096] Multiple connection pads (510) can be electrically connected to a connector (not shown). The connection pads (510) can be extended in one direction. The one direction may be a second direction (D2). The connection pads (510) can be spaced apart in another direction intersecting the one direction. The other direction may be a first direction (D1). The connection pads (510) may be electrode patterns containing a conductive material.

[0097] Multiple dummy pads (520) may be spaced apart from the connection pads (510). The dummy pads (520) may be placed between the connection pads (510). The dummy pads (520) may not be electrically connected to a connector (not shown). The dummy pads (520) may extend in a second direction (D2).

[0098] The extension length in the second direction (D2) of the connection pads (510) and dummy pads (520) may be the same, and the width in the first direction (D1) may also be the same. In other words, the planar shape of each connection pad (510) and the planar shape of each dummy pad (520) may be the same. The connection pads (510) and dummy pads (520) may be arranged side by side. The thickness of the dummy pads (520) may be the same as the thickness of the connection pads (510).

[0099] The connection pads (510) and dummy pads (520) may be spaced apart from each other in a first direction (D1). Each dummy pad (520) may be placed between the connection pads (510). Each connection pad (510) may be placed alternately with the dummy pad (520), or a plurality of connection pads (510) may be placed in succession and then alternately with the dummy pad (520).

[0100] Multiple first expansion pads (530) can be connected to connection pads (510). The first expansion pads (530) can be connected to signal pins (600). The first expansion pads (530) can be extended from the connection pads (510) into a second direction (D2). For example, the first expansion pads (530) can be extended into the second direction (D2) from one end (upper side in FIG. 6) of the connection pads (510) into the second direction (D2).

[0101] The first expansion pads (530) may be electrode patterns containing a conductive material. For example, the first expansion pads (530) may contain the same conductive material as the conductive material of the connection pads (510).

[0102] The length of the plurality of first expansion pads (530) in the first direction (D1) may correspond to the length of the connection pads (510) in the first direction (D1). The thickness of the first expansion pads (530) may be the same as the thickness of the connection pads (510).

[0103] Multiple second expansion pads (540) can be connected to the first expansion pads (530). The second expansion pads (540) can be connected to a signal pin (600). The second expansion pads (540) can extend from the first expansion pads (530) into a first direction (D1). For example, the second expansion pads (540) can extend into the first direction (D1) from one end (left side of FIG. 6) or the other end (right side of FIG. 6) of the first expansion pads (530) into the first direction (D1).

[0104] The second expansion pads (540) may be electrode patterns containing a conductive material. For example, the second expansion pads (540) may contain the same conductive material as the conductive material of the connection pads (510) and the first expansion pads (530).

[0105] The extension length of the second expansion pads (540) in the first direction (D1) may correspond to the spacing distance of the connection pads (510), or the spacing distance between the connection pads (510) and the dummy pad (520). The extension end of the second expansion pads (540) in the first direction (D1) may be positioned on the same line as one or the other end of the connection pads (510) in the first direction (D1), and may be positioned on the same line as one or the other end of the dummy pads (520) in the first direction (D1). The thickness of the second expansion pads (540) may be the same as the thickness of the connection pads (510) and the first expansion pads (530).

[0106] When the connection pads (510) are arranged in succession, the second expansion pads (540) can connect the first expansion pads (530) to each other. For example, when the connection pads (510) are arranged in succession, the second expansion pads (540) can extend from one end and the other end of the first expansion pads (530) in the first direction (D1).

[0107] The length of the second expansion pads (540) in the second direction (D2) can correspond to the length of the first expansion pads (530) in the second direction (D2).

[0108] A signal pin (600) can be positioned on the upper portion of the first expansion pads (530) and the second expansion pad (540), and can be connected to the first expansion pads (530) or the second expansion pad (540) by moving downward. Since the first expansion pads (530) are electrically connected to the connection pads (510) and the second expansion pads (540) are electrically connected to the first expansion pads (530), the signal pin (600) connected to the first expansion pads (530) or the second expansion pad (540) can be electrically connected to the connection pads (510).

[0109] The signal pin (600) must be connected to the connection pads (510), and since the actual area of ​​the connection pads (510) is increased by the first expansion pads (530) and the second expansion pad (540), the connection rate between the signal pin (600) and the connection pads (510) can be improved.

[0110] FIG. 9 is a drawing showing the state in which the flood prevention member is arranged in FIG. 6. FIG. 10 is an enlarged drawing of section C of FIG. 9. FIG. 11 is a drawing showing FIG. 9 viewed from a second direction.

[0111] Referring to FIGS. 9 to 11, the connection module (B) may further include a flood prevention member (550). The flood prevention member (550) may be provided in multiple numbers.

[0112] A plurality of flood prevention members (550) may be formed in the boundary area between the connection pads (510) and the first expansion pads (530). The flood prevention members (550) may be formed to protrude from the connection pads (510) in the thickness direction of the connection pads (510) in the boundary area between the connection pads (510) and the first expansion pads (530). One end (upper side in FIG. 9) of the flood prevention members (550) in the second direction (D2) may be positioned on the boundary line between the connection pads (510) and the first expansion pads (530).

[0113] The length of the flood prevention members (550) in the first direction (D1) corresponds to the length of the connection pads (510) in the first direction (D1) and may correspond to the length of the first expansion pads (530) in the first direction (D1). Additionally, the length of the flood prevention members (550) in the second direction (D2) may be smaller than the length of the first expansion pad (530) in the second direction (D2). The thickness of the flood prevention members (550) may be thinner than the thickness of the connection pads (510) and thinner than the thickness of the first expansion pad (530).

[0114] A connector (not shown) can be connected to the connection pads (510) by solder. During the process of connecting the connector (not shown) and the connection pads (510), solder is applied to the connection pads (510). If the solder applied to the connection pads (510) encroaches upon the first expansion pads (530), it may cause a connection failure between the signal pin (600) and the first expansion pads (530). However, since flood prevention members (550) are placed in the boundary area between the connection pads (510) and the first expansion pads (530), the solder applied to the connection pads (510) can be prevented from encroaching upon the first expansion pads (530), thereby preventing a connection failure between the signal pin (600) and the first expansion pads (530).

[0115] A display device according to one embodiment of the present invention can be applied to various electronic devices. An electronic device according to one embodiment includes the display device described above and may further include a module or device having additional functions other than the display device.

[0116] FIG. 12 is a block diagram of an electronic device according to one embodiment.

[0117] Referring to FIG. 12, an electronic device (10000) according to one embodiment may include a display module (10001), a processor (10002), a memory (10003), and a power module (10004).

[0118] The processor (10002) may include at least one of a central processing unit (CPU), an application processor (AP), a graphic processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0119] The memory (10003) may store data information necessary for the operation of the processor (10002) or the display module (10001). When the processor (10002) executes an application stored in the memory (10003), a video data signal and / or an input control signal is transmitted to the display module (10001), and the display module (10001) can process the received signal and output video information through a display screen.

[0120] The power module (10004) may include a power supply module, such as a power adapter or battery device, and a power conversion module that converts the power supplied by the power supply module to generate power necessary for the operation of the electronic device (10000).

[0121] At least one of each component of the electronic device (10000) described above may be included within a display device according to the embodiments described above. Additionally, some of the individual modules functionally included within a single module may be included within the display device, while others may be provided separately from the display device. For example, the display device may include a display module (10001), and the processor (10002), memory (10003), and power module (10004) may be provided in the form of other devices within the electronic device (10000) other than the display device.

[0122] FIG. 13 is a schematic diagram of an electronic device according to various embodiments.

[0123] Referring to FIG. 13, various electronic devices to which a display device according to the embodiments is applied may include not only image display electronic devices such as a smartphone (10000_1a), a tablet PC (10000_1b), a laptop (10000_1c), a TV (10000_1d), and a desk monitor (10000_1e), but also wearable electronic devices including display modules such as smart glasses (10000_2a), a head-mounted display (10000_2b), and a smart watch (10000_2c), and automotive electronic devices (10000_3) including display modules such as a CID (Center Information Display) and a room mirror display placed on the instrument panel, center fascia, and dashboard of a car.

[0124] Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention may be implemented in other specific forms without changing the technical concept or essential features thereof. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. Explanation of the symbols

[0125] 10: Display device 100: Cover Window 200: Display panel 300: Panel lower member 400: Connecting member 500: Driving circuit board 510: Connection Pad 520: Dummy Pad 530: 1st Expansion Pad 540: 2nd Expansion Pad 550: Lack of flood control 600: Signal pin

Claims

Claim 1 A display device comprising: a display panel; and a driving circuit board connected to the display panel, wherein the driving circuit board includes a connection module connected to a signal pin, and the connection module includes: a connection pad; a dummy pad spaced apart from the connection pad; a first expansion pad connected to the connection pad; and a second expansion pad connected to the first expansion pad, wherein the signal pin is connected to the first expansion pad or the second expansion pad. Claim 2 A display device according to claim 1, wherein the connection pad and the dummy pad extend in one direction, and the connection pad and the dummy pad are spaced apart in another direction intersecting the one direction. Claim 3 A display device according to paragraph 2, wherein the connection pad and the dummy pad are arranged side by side with each other. Claim 4 A display device according to paragraph 2, wherein the first expansion pad extends in one direction from the connection pad, and the second expansion pad extends in the other direction from the first expansion pad. Claim 5 In paragraph 4, the extension length of the second extension pad corresponds to the distance between the connection pad and the dummy pad, in a display device. Claim 6 A display device according to claim 4, wherein the first expansion pad extends from one end in one direction of the connection pad, and the second expansion pad extends from one end in the other direction of the first expansion pad. Claim 7 A display device according to paragraph 4, wherein the length in one direction of the first expansion pad corresponds to the length in one direction of the second expansion pad. Claim 8 A display device according to claim 1, further comprising a flood prevention member formed in the boundary area between the connection pad and the first expansion pad. Claim 9 In claim 8, the above-mentioned flood prevention member is formed to protrude from the above-mentioned connection pad in the thickness direction of the above-mentioned connection pad, a display device. Claim 10 A display device according to claim 1, wherein the connection pads and the dummy pads are provided in a plurality, the plurality of connection pads and the plurality of dummy pads extend in one direction, and the plurality of connection pads and the plurality of dummy pads are spaced apart in another direction intersecting the one direction. Claim 11 In item 10, the plurality of dummy pads are a display device disposed between the plurality of connection pads. Claim 12 A display device according to claim 10, wherein the first expansion pad and the second expansion pad are provided in plurality, the plurality of first expansion pads extend in one direction from the plurality of connection pads, and the plurality of second expansion pads extend in the other direction from the plurality of first expansion pads. Claim 13 In paragraph 12, the extension length of the second extension pad corresponds to the spacing of the connection pads, or the spacing between the connection pad and the dummy pad, in a display device. Claim 14 A display device according to claim 12, wherein the first expansion pads extend from one end of the connection pads in one direction, and the second expansion pads extend from one end or the other end of the first expansion pads in the other direction. Claim 15 A display device according to claim 12, wherein the length in one direction of the first expansion pads corresponds to the length in one direction of the second expansion pads. Claim 16 A display device according to claim 12, further comprising a plurality of flood prevention members formed in the boundary area of ​​the plurality of connection pads and the plurality of first expansion pads. Claim 17 In claim 16, the above-mentioned plurality of flood prevention members are formed to protrude from the connection pads in the thickness direction of the connection pads, a display device. Claim 18 An electronic device comprising: a display panel; a driving circuit board connected to the display panel; a processor; a memory in which data of one or more of the display panel and the processor is stored; and a power module that supplies power to the display panel, the processor and the memory, wherein the driving circuit board includes a connection module connected to a signal pin, and the connection module includes: a connection pad; a dummy pad spaced apart from the connection pad; a first expansion pad connected to the connection pad; and a second expansion pad connected to the first expansion pad, and wherein the signal pin is connected to the first expansion pad or the second expansion pad. Claim 19 An electronic device according to claim 18, wherein the connection pads and dummy pads are provided in plurality, the plurality of connection pads and the plurality of dummy pads extend in one direction, the plurality of connection pads and the plurality of dummy pads are spaced apart in another direction intersecting the one direction, the first expansion pad and the second expansion pad are provided in plurality, the plurality of first expansion pads extend from the plurality of connection pads in the one direction, and the plurality of second expansion pads extend from the plurality of first expansion pads in the other direction. Claim 20 An electronic device according to claim 18, further comprising a plurality of flood prevention members formed in the boundary area of ​​the plurality of connection pads and the plurality of first expansion pads.

Images