Tool reference body for setting multi-plane references and apparatus and method for determining the orientation and / or position of a component using the same

Abstract

A tool reference body (200) for determining at least one orientation and / or position of a reference member, wherein the tool reference body (200) is attached to the reference member, a device for positioning one or more components (600) including the tool reference body (200), and a method for determining at least one orientation and / or position of a reference member using the tool reference body (200) in the device for positioning one or more components (600).

Description

Technology Field

[0001] Cross-reference regarding related applications

[0002] This application claims priority to DE 10 2023 136 907.5 filed on December 31, 2023, the entirety of which is incorporated herein by reference.

[0003] Technology field

[0004] The present disclosure relates to an optical tool reference member for determining at least one orientation and / or position of a reference member, and an apparatus comprising one or more tool reference members, wherein the reference member is included in a pick and place actuator. In particular, the pick and place actuator comprises a gripper, and such apparatus may be positioned to modify at least one position and / or orientation of the pick and place actuator using at least one up-position and / or up-orientation of the gripper. Background Technology

[0005] From the prior art, similar devices and components such as those described in US 2021 / 0195816 are known. This document discloses an apparatus comprising a bond head having a component gripper, a first drive system for moving a carrier over a relatively long distance, a second drive system attached to the carrier for reciprocating the bond head between a nominal working position and a standby position, a drive unit attached to the bond head for rotating the component gripper or a rotary drive unit for rotating a substrate around an axis, at least one substrate camera and at least one component camera attached to the carrier. The second drive system is also designed to perform high-precision corrective movement to the bond head, or a third drive system is provided for performing high-precision corrective movement to the substrate. At least one reference mark is attached to the bond head or the component gripper.

[0006] In a system using one or more cameras for alignment, multiple measurements may be performed using one or more substrate cameras (or look-down cameras) and / or one or more component cameras (or look-up cameras). The solution described in US 2021 / 0195816 places at least one reference mark so that it can be measured using both the substrate camera and the component camera. However, mechanical inaccuracies and thermal effects can cause measurement errors in such systems, resulting in an unwanted offset between the component and the substrate. As the attachment precision that must be consistently achieved increases significantly, there is a growing need to further reduce this unwanted offset.

[0007] The present invention is proposed to solve the problems of the prior art described above, and the object of the present invention is to provide an optical tool reference body for setting a multi-plane reference according to the features of independent claim 1, an apparatus according to the features of independent claim 8, and a method for orienting and / or positioning a component using the same according to the features of independent claim 12. Additional advantageous embodiments and embodiments are shown in the respective dependent claims and drawings. Brief explanation of the drawing

[0008] Additional advantages and features of the present invention are illustrated in the following drawings, namely: FIG. 1 illustrates a schematic front view of a relevant part of a device for aligning one or more components with one or more substrates before and / or during attachment; FIG. 2 illustrates a schematic side view of a relevant part of a pick-and-place actuator of a device for aligning one or more components with one or more substrates before and / or during attachment; and FIG. 3 illustrates a schematic cross-sectional view of a tool reference arranged to be imaged by one or more lookup cameras. Specific details for implementing the invention

[0009] Description of the drawing

[0010] The drawing shows a first axis (910), a second axis (920), and a third axis (930). The first axis (910) is perpendicular to the second axis (920), and the third axis (930) is perpendicular to both the first axis (910) and the second axis (920). In use, the first axis (910) is assumed to be oriented in the Y direction, the second axis (920) is assumed to be oriented in the X direction, and the third axis (930) is assumed to be oriented in the Z direction. By convention, in use, the axes of the corresponding directions are named the Y axis (910) and the X axis (920) and are substantially horizontal, horizontal, or approximately horizontal.

[0011] Functionally, the X-axis (920) and the Y-axis (910) can be interchanged. By convention, when in use, the axis of the corresponding direction is designated as the Z-axis (930) and is substantially perpendicular, perpendicular, or approximately perpendicular. To clarify the description of various components, the drawings depict parts in this conventional orientation. To clarify the description of various components, some relative terms such as top, side, and base have been used in accordance with this convention. “For” should be interpreted as “suitable for”.

[0012] The device described in this disclosure may be configured by those skilled in the art to operate at different deviations from the usual orientation and nominal coordinate axes.

[0013] FIG. 1 illustrates a schematic cross-sectional view from the side of a relevant part of a device (100) suitable for aligning one or more components (600) with one or more substrates (300) before and / or during attachment, according to any method disclosed herein. More specifically, the device (100) is illustrated in a direction facing a plane including an X-axis (920) nominally indicated as having a positive direction from left to right, and a Z-axis (930) nominally indicated as having a positive direction from bottom to top. The Y-axis (910) is nominally illustrated as having a positive direction inward from the observer's perspective of the plane of the drawing.

[0014] For example, the device (100) may be an attachment device such as a die bonding device. Typically, the die is rectangular in shape, but circular or trapezoidal shapes are also possible.

[0015] Generally, alignment can be corrected if at least a small degree of relative movement is possible in one or more directions between the component (600) and the substrate (300), which may be possible during the initial stage of attachment. Such relative movement may be approximately linear along one or more axes (910, 920, 930) and / or rotation around one or more axes (910, 920, 930). Significant alignment is not possible after one or more components (600) are firmly attached to the substrate (300).

[0016] One or more substrates (300) may include one or more substrate marks (or substrate alignment targets) (340) suitable for determining the position and / or orientation of one or more substrates (300), thereby allowing one or more components (600) to be mounted and attached with a precision in the micrometer range or sub-micrometer range. One or more substrate marks (340) may be any suitable alignment targets. For example, the substrate marks (340) may be one or more physical features of at least a portion of the substrate (300), one or more optical properties of at least a portion of the substrate (300), at least a portion of the fiducial, or any combination thereof.

[0017] The method and apparatus for aligning one or more components (600) described herein are not limited to a die. For example, the component (600) may be a die, a semiconductor package, a chip, a flip chip, an integrated circuit, an additional substrate, an optical element, an electronic element, an electro-optical element, or any combination thereof. For example, one component (600) may be attached to one substrate. For example, one or more components (600) may be attached to one substrate (300). For example, one component (600) may be attached to one or more substrates (300).

[0018] During one or more steps of the method described herein, the device may be pre-configured to perform one or more predetermined operations to improve throughput. Additionally or alternatively, the device may be pre-configured to control one or more operations during use.

[0019] One or more substrates (300) may be one or more metal substrates, also described as one or more lead frames, wherein one or more components (600) are soldered in turn and optionally onto islands placed next to each other. However, the method and apparatus described herein are not limited to lead frames, and one or more substrates (300) may be any object having one or more attachable surfaces and one or more devices or attachment locations. For example, the substrate may be a metal substrate, a substrate strip, a lead frame, a wafer, additional components, or any combination thereof. One or more substrates (300) may also be described as one or more media.

[0020] FIG. 1 illustrates an apparatus (100) comprising a pick-and-place actuator (150), an optional feeding unit (120) for providing one or more components (600), and an optional substrate chuck (140) for providing one or more substrates (300). The feeding unit (120) is located at a loading position (820) for loading components and may include a component handling system such as a wafer or tape. The substrate chuck (140) is located at an attachment position (800) for attaching components. Optionally, the apparatus (100) may be configured as a bonding apparatus through appropriate modifications, including configuring the pick-and-place actuator (150) as a bond head.

[0021] FIG. 1 illustrates an embodiment of a pick-and-place drive unit comprising a first drive system (111) for a drive member (130) and a second drive system (112) for a pick-and-place actuator (150). The second drive system (112) is positioned to provide relative movement of the pick-and-place actuator (150) with respect to one or more second cameras (510) positioned as one or more look-down cameras. Optionally, the second drive system (112) may be positioned to provide movement of the pick-and-place actuator (150) using one or more drive guides (115). The second drive system (112) may optionally be attached to the drive member (130) or be an independent handling system. Any suitable drive configuration may be included in the device (100). For example, the first drive system (111) may be positioned to move the drive member (130) in a positive and negative direction along the X-axis (920), and the second drive system (112) may be positioned to move the pick and place actuator (150) in a positive and negative direction along the Y-axis (910), thereby allowing the pick and place actuator (150) to move between the loading position (820) and the attachment position (800).

[0022] In the example illustrated in FIG. 1, one or more lookup cameras (410) are placed at a component inspection position (810) of the device (100), and a pick-and-place actuator (150) is moved over one or more lookup cameras (410) while moving from a loading position (820) to an attachment position (800), and one or more upward images are generated. Optionally, the speed of the pick-and-place actuator (150) is decelerated or stopped so that one or more images can be generated.

[0023] As illustrated in FIG. 1, the device comprises one or more first cameras (410) positioned as one or more look-up cameras and further comprises one or more second cameras (510) positioned as one or more look-down cameras. In the context of the present disclosure, look-up means that the camera is oriented approximately in the positive direction of the Z-axis (930). In the context of the present disclosure, look-down means that the camera is oriented approximately in the negative direction of the Z-axis (930). One or more look-up cameras (410) are positioned to generate an image of the attachment surface of a component while attached to the gripper (160), and thus may be referred to by those skilled in the art as component cameras (410). One or more look-down cameras (510) may optionally include one or more illumination radiation sources (530), are positioned to illuminate the attachment surface of one or more substrates (300), and are positioned to generate an image of one or more substrates, and thus may be referred to by those skilled in the art as substrate cameras (510).

[0024] Each camera (410, 510) includes one or more radiation detectors, such as one or more image sensors (not shown), and one or more optical elements (not shown). One or more image sensors may use any suitable optical detection technology, such as CMOS. If necessary, one or more deflecting mirrors (not shown) appropriately configured may be used to deflect the optical beam path. Radiation detectors may be positioned to detect any convenient wavelength, such as UV (ultraviolet) wavelengths, visible light wavelengths, IR (infrared) wavelengths, or any combination thereof. In the context of this disclosure, directing should be understood as determining the optical path of a beam to a significant degree using one or more physical and / or optical properties. For example, directing may be reflection, diffraction, transmission, or any combination thereof.

[0025] As illustrated in FIG. 1, the pick-and-place actuator (150) includes a component gripper (160) which is detachably attached to one or more components (600) during use and is positioned to maintain the attachment state during movement of the pick-and-place actuator (150) and / or the gripper (160). The gripper (160) is operated, for example, by vacuum, and thus some suction force may be used to hold one or more components (600) within the gripper (160), or alternatively, one or more components (600) may be held by electrostatic force or a mechanical gripper. The gripper (160) may be positioned to be rotatable around the Z-axis (930), but it is also possible to rotate the substrate around the Z-axis.

[0026] The device (100) is positioned to provide at least a portion of an attachment process (not shown) at an attachment location (800). During at least a portion of the attachment process, one or more components (600) are in contact with one or more substrates (300) so that one or more attachment operations can be performed on at least a portion of one or more attachment surfaces (not shown) of one or more components (600) and / or one or more substrates (300). The one or more attachment surfaces are typically at least a portion of the mutual contact area between one or more components (600) and / or one or more substrates (300).

[0027] In the example illustrated in FIGS. 1 and 2, the range of motion of the second drive system (112) is typically smaller or very small compared to the range of motion of the first drive system (111). However, the second drive system (112) is also positioned to provide a long distance of movement between the feeding unit (120) and the substrate chuck (140), so that it can move relative to the pick-and-place actuator (150). One or more small corrective movements for aligning one or more components (600) with one or more substrates (300) may be performed by the second drive system (112) or the drive system for the substrate chuck (140), or any combination thereof. The second drive system (112) is positioned to move the pick-and-place actuator (150) to one or more processing positions and is positioned to provide high-precision corrective movements of the pick-and-place actuator (150) in two different directions (910, 920). For this purpose, it is sufficient that the range of motion of the second drive system (112) is relatively long along the X-axis (920) and relatively short along the Y-axis (910). The range of motion along the X-axis (920) may be several tens of millimeters, for example, 20 mm or 30 mm or more, and the range of motion along the Y-axis (910) may be only a few micrometers. The device (100) is positioned to move one or more components (600) attached to the gripper (160) at the attachment position (800) toward one or more substrates (300) along the Z-axis (930) and to maintain a close position between the attachment surface of one or more components (600) and the attachment surface of the substrate (300) while an image is being generated. For example, the average distance between the component attachment surface and the substrate attachment surface is 10 to 200 μm.

[0028] Optionally, the device (100) includes one or more second cameras positioned as one or more look-down cameras (510) and is positioned to generate one or more downward images of the attachment surface of one or more substrates (300). In the context of the present disclosure, the downward image is an image generated by one or more second cameras positioned as one or more look-down cameras (510). Optionally, one or more look-down cameras (510) may be additionally positioned to determine the position and / or orientation of the substrate mark (340) on a portion of the substrate (300) on which the component (600) is placed and attached. Optionally, the determination may be performed before attaching the component (600) to the substrate (300), while attaching the component (600) to the substrate (300), or after attaching the component (600) to the substrate (300).

[0029] Additionally or alternatively, one or more lookup cameras may be attached to the drive member (130). For example, one or more lookup cameras or pick-and-place actuators are attached to the drive member (130) by a retractable and extendable swivel mechanism. Then, one or more lookup cameras or pick-and-place actuators (150) may each be retracted to an image capture position while moving from a loading position (820) to an attachment position (800), so that one or more upward images per lookup camera may be generated during movement. For loading one or more components (600) and for recording downward images by one or more look-down cameras (410) and recording one or more components (600), it is preferable that one or more lookup cameras (410) be extended or rotated to a standby position, and the pick-and-place actuator (150) is similarly extended or rotated to a working position.

[0030] Additionally or alternatively, one or more lookup cameras may be attached to the drive member (130). For example, one or more lookup cameras or pick-and-place actuators are attached to the drive member (130) by a retractable and extendable swivel mechanism. Then, one or more lookup cameras or pick-and-place actuators (150) may each be retracted to an image capture position while moving from a loading position (820) to an attachment position (800), so that one or more upward images per lookup camera may be generated during movement. For loading one or more components (600) and for recording downward images by one or more look-down cameras (510) and recording one or more components (600), it is preferable that one or more look-up cameras (410) be extended or rotated to a standby position, and that the pick-and-place actuator (150) is similarly extended or rotated to a working position. FIG. 2 illustrates a schematic cross-sectional view of the pick-and-place actuator (150) as described in relation to FIG. 1. More specifically, the pick-and-place actuator (150) is illustrated in a direction facing a plane including a Y-axis (910) nominally indicated as having a positive direction from left to right and a Z-axis (930) nominally indicated as having a positive direction from bottom to top. The X-axis (920) is nominally illustrated as having a positive direction extending out of the drawing toward the observer. As illustrated in FIG. 2, one or more components (600) are held by a gripper (160). In the illustrated example, the component attachment device (100) includes one or more tool reference bodies (200) (or optical tool reference bodies or multi-level tool reference bodies) that are firmly attached to the gripper (160). One or more tool reference bodies (200) are positioned to determine at least one orientation and / or position of a reference member (not illustrated).

[0031] In the illustrated example, a reference member is included in a pick-and-place actuator (150), and one or more tool reference bodies (200) are positioned so that at least one position and / or orientation of the gripper (160) can be determined. Optionally, the reference member may be included in the gripper (160). In the view of the present disclosure, an upward position and / or upward orientation is determined by one or more first cameras positioned as one or more look-up cameras. In the view of the present disclosure, a downward position and / or downward orientation is determined by one or more second cameras positioned as one or more look-down cameras.

[0032] In the example illustrated in FIGS. 1 and 2, the first drive system (111) is configured to transport the pick-and-place actuator (150) over a relatively long distance, namely from a loading position (820) where the pick-and-place actuator (150) and the gripper (160) receive one or more components (600) from a feeding unit (120) to an attachment position (800) where the pick-and-place actuator (150) and the gripper (160) place one or more components (600) on one or more substrates (300). The requirements for the positional accuracy of the first drive system (111) are relatively low, and a positional accuracy of + / - 10 μm is usually sufficient. In the example illustrated in FIG. 1, the first drive system (111) is designed as a so-called "gantry" having two or more mechanically very stable axes of motion, two of which allow movement along the axis (910) and axis (920) of the drive member (130), and the two axes are operated perpendicular to each other.

[0033] Typically, movement of the pick-and-place actuator (150) along the Z-axis (930) is required to remove the component (600) from the feeding unit (120) and to place the component (600) at an intended attachment location on one or more substrates (300). This movement along the Z-axis (930) can be performed in a wide variety of ways, such as providing a third stable or very stable axis of motion positioned to provide the first drive system (111) with movement of the drive member (130) along the Z-axis (930). Additionally, or alternatively, the second drive system (112) may be provided with an additional high-precision drive unit positioned to provide movement of the pick-and-place actuator (150) along the Z-axis (930). Additionally or alternatively, the pick and place actuator (150) may include a high-precision drive unit positioned to provide movement of the gripper (160) along the Z-axis (930).

[0034] In the example illustrated in FIGS. 1 and 2, the second drive system (112) is positioned to move the pick-and-place actuator (150) between processing positions and also to enable high-precision corrective movement of the pick-and-place actuator (150) in two different directions along the axis (910) and / or the axis (920).

[0035] In the example illustrated in FIG. 2, the pick-and-place actuator (150) optionally includes a drive unit (113) for rotating the component gripper (160) around the Z-axis (930). Additionally or alternatively, a feeding unit (120) may be positioned to rotate one or more components (600) around the Z-axis (930) to reduce or eliminate at least some degree of angular error. Additionally or alternatively, a substrate chuck (140) may be positioned to rotate one or more substrates (300) around the Z-axis (930) to reduce or eliminate at least some degree of angular error.

[0036] FIG. 3 illustrates a schematic cross-sectional view from the side of one or more tool reference bodies (200) rigidly attached to a gripper (160), and one or more lookup cameras (410) positioned to generate one or more upward images of the one or more tool reference bodies (200). In particular, one or more tool reference bodies (200) are located within the lookup camera field of view (FOV) (440). In the context of the present disclosure, the upward image is an image generated by one or more first cameras positioned as one or more lookup cameras. As illustrated, one or more lookup cameras (410) are depicted facing a plane including a Y-axis (910) nominally indicated as having a positive direction from left to right and a Z-axis (930) nominally indicated as having a positive direction from bottom to top. The X-axis (920) is nominally depicted as having a positive direction extending out of the drawing toward the observer. The field of view described herein refers to an angular range that can be imaged at a given moment.

[0037] One or more tool reference bodies (200) are positioned by direct and / or indirect rigid attachments so that at least one upward position and / or upward orientation of the gripper (160) can be determined by one or more lookup cameras (410). For example, one or more tool reference bodies (200) may be directly attached by one or more rigid attachments, for example, directly attached to the gripper (160), included in the gripper (160), or attached by any combination thereof. For example, one or more tool reference bodies (200) may be indirectly attached to the gripper (160) by one or more rigid attachments, for example, included in the pick-and-place actuator (150), attached to the pick-and-place actuator (150), or attached by any combination thereof.

[0038] In the example illustrated in FIGS. 2 and 3, one or more tool reference bodies (200) are illustrated as a single member. However, one or more tool reference bodies (200) may include two or more members that are firmly attached to two or more locations of a common attachment member, such as a gripper (160).

[0039] In the example illustrated in FIGS. 2 and 3, one or more look-down cameras (510) are optionally positioned to generate one or more downward images of one or more tool reference bodies (200). In particular, one or more tool reference bodies (200) may be located within the field of view (540) of one or more look-down cameras (510).

[0040] Optionally, one or more look-up cameras (410) may include one or more illumination radiation sources (430) positioned to provide illumination radiation suitable for generating an upward image of one or more portions of one or more tool reference bodies (200). Optionally, one or more look-down cameras (510) may include one or more illumination radiation sources (530) positioned to provide illumination radiation suitable for generating a downward image of one or more portions of one or more tool reference bodies (200).

[0041] The device is positioned so that one or more tool reference bodies (200) can be upwardly imaged by one or more look-up cameras (410). Optionally, the device is positioned so that one or more tool reference bodies (200) can be downwardly imaged by one or more look-down cameras (510). For example, upward and downward imaging may occur at the same location of the pick-and-place actuator (150), at an overlapping location of the pick-and-place actuator (150), at a different location of the pick-and-place actuator (150), or any combination thereof. Optionally, the device is positioned so that upward and downward imaging may occur at the same time point, at a different time point, at an overlapping time point, or any combination thereof.

[0042] In the example illustrated in FIG. 3, one or more lookup cameras (410) are positioned to generate upward images of two or more reference marks included in the tool reference body (200). In particular, two or more reference marks may be located within the lookup camera field of view (440). The tool reference body (200) includes a mark carrier (250) having a first surface of a first level (251) and a second surface of a second level (252), wherein the second level (252) is positioned at a significant distance from the first level (251) along a positive Z-axis (930) which is a direction away from one or more lookup cameras (410). As described below, the significant distance is predetermined. The tool reference body (200) includes one or more first reference marks (261) located on or near the first surface of the first level (251) and one or more second reference marks (262) located on or near the second surface of the second level (252). When one or more reference marks (261, 262) are optionally positioned to be imaged by one or more look-down cameras (510), the mark carrier (250) includes one or more transparent imaging portions that are sufficiently transparent for one or more look-down cameras (510) to image the one or more reference marks (261, 262).

[0043] The material used for the mark carrier (250) is preferably selected to have a low or very low coefficient of thermal expansion. If one or more reference marks (261, 262) are positioned so that images are generated only by one or more look-up cameras, the mark carrier (250) may be one or more solid blocks for enhanced rigidity and stability. If one or more reference marks (261, 262) are positioned so that images are also generated by one or more look-down cameras (510), it may be advantageous to position the areas adjacent to one or more reference marks (261, 262) to have at least similar optical and / or physical properties, preferably the same optical and / or physical properties, such as one or more transparent areas having similar or the same thickness as shown in FIG. 3.

[0044] One or more reference marks (261, 262) may include one or more shapes suitable for determining position and / or orientation. For example, one or more cross shapes, one or more annular rings, one or more openings, one or more rectangles, one or more squares, one or more corners, one or more edges, one or more lines, one or more circles, one or more ovals, one or more ellipses, or any combination thereof.

[0045] One or more first reference marks (261) are positioned so that one or more first upward images can be generated by one or more lookup cameras (410) when the first level (251) is located within the field of view (440) of one or more lookup cameras (410) as shown in FIG. 3. One or more second reference marks (262) are positioned so that one or more second upward images can be generated by one or more lookup cameras (410) when the second level (252) is located within the field of view (440) of one or more lookup cameras (410) as shown in FIG. 3. One or more lookup cameras (410) are positioned to collect radiation directed toward one or more lookup cameras (410) to generate upward images.

[0046] Generally, one or more first upward images are positioned to provide a first upward orientation and / or upward position of a reference member. Generally, one or more second upward images are positioned to provide a second upward orientation and / or upward position of a reference member. In the embodiment illustrated in FIG. 3, the reference member is included in a pick-and-place actuator (150) and is positioned so that at least one upward position and / or upward orientation of a gripper (160) can be determined. Thus, in this embodiment, the device is positioned to determine at least one upward position and / or upward orientation of the gripper (160) with respect to one or more first reference marks (261) using one or more first upward images, and to determine at least one upward position and / or upward orientation with respect to one or more second reference marks (262) using one or more second upward images.

[0047] As illustrated in the example of FIG. 3, the tool reference body (200) comprises two or more surfaces on two or more different levels (251, 252, 253). A tool reference body (200) having two different levels (251, 252, 253) may be described as bi-level or double-decked. A tool reference body (200) having two or more different levels (252, 252, 253) may be described as multiple-level or multiple-decked. In the example of FIG. 3, the mark carrier (250) is illustrated as a single member. However, one or more tool reference bodies (200) may comprise two or more members attached directly and / or indirectly to the reference member.

[0048] Generally, when the mark carrier is tilted, the measurement performed by the camera may have an unwanted offset depending on the angle of inclination of the mark carrier from the camera optical axis. When the mark carrier (250) shown in FIG. 3 is tilted, the upward image and / or upward measurement performed by one or more lookup cameras (410) may have an unwanted offset depending on the angle of inclination of the mark carrier (250) from the lookup camera optical axis (not shown). If the relevant parameters are known, a predetermined offset may be applied to provide appropriate correction for the tilt. However, in practice, unpredictable tilt may occur due to, for example, mechanical tolerances, parasitic motor forces, linearity of the bearings, rigidity of the system, thermal drift, manufacturing limitations, static deformation, inaccuracy of the motion drive, and / or actuator movement. Similarly, the tilt of the camera used and / or the tilt of the pick-and-place actuator (150) and / or the tilt of the gripper (160) may vary over time and / or depend on the position along the first (Y) axis (910) and / or the position along the second (X) axis (920). For example, in practice, a small angle change of less than 1 millidegree may result in this unwanted offset.

[0049] By measuring at least one upward position and / or upward orientation of at least two reference marks (261, 262, 263) on at least two substantially different levels (251, 252, 253), multiple degrees of freedom, e.g., six degrees of freedom (DOF), can be determined for one or more tool reference bodies (200). Since one or more tool reference bodies (200) are positioned to determine at least one upward orientation and / or upward position of the gripper (160), multiple degrees of freedom, e.g., six degrees of freedom (DOF), can be determined for the gripper (150). Similarly, multiple degrees of freedom, e.g., six degrees of freedom (DOF), can be determined for a member attached to the gripper (150), such as one or more components (600).

[0050] To measure one or more first reference marks (261), a first level (251) is positioned within the field of view (440) of one or more lookup cameras (410), and one or more first upward images are generated by one or more lookup cameras (410). To measure one or more second reference marks (262), a second level (252) is positioned within the field of view (440) of one or more lookup cameras (410), and one or more second upward images are generated by one or more lookup cameras (410). One or more first upward images and one or more second upward images may be generated in the same field of view, overlapping fields of view, or different fields of view. One or more lookup cameras (410) may be positioned to have a depth of field sufficient to image both the first level (251) and the second level (252). Additionally or alternatively, one or more lookup cameras (410) may be positioned to modify at least one optical and / or physical property to modify the focus sufficient to image both the first level (251) and the second level (252). Additionally or alternatively, one or more lookup cameras (410) may be positioned to modify at least one position and / or orientation of at least one optical component to modify the focus sufficient to image both the first level (251) and the second level (252). Additionally or alternatively, one or more lookup cameras (410) may be positioned to focus simultaneously to image both the first level (251) and the second level (252). This may be provided, for example, by including one or more optical elements in one or more lookup cameras (410) such that at least one focal length can be changed between two or more substantially different focus settings. This can be provided, for example, by using one or more beam dividers having two or more different optical path lengths for two or more image sensors.

[0051] One or more first upward images by one or more lookup cameras (410) may be used to determine the first upward orientation and / or upward position (TF1) of one or more first reference marks (261). One or more second upward images by one or more lookup cameras (410) may be used to determine the second upward orientation and / or upward position (TF2) of one or more second reference marks (261).

[0052] A significant separation distance between one or more first reference marks (261) and one or more second reference marks (262) means that when generated by the same lookup camera (410), there is a significant difference in focal distance at optimal focus between the first upward image and the second upward image. This can also be described by positioning one or more first reference marks (261) so that they are on different focal planes from one or more second reference marks (262). As illustrated in the example of FIG. 3, this significant distance difference may primarily follow the third axis (Z) (930). This can also be described as a significant height difference when the multi-level optical tool reference body (200) is positioned on a substantially flat horizontal surface.

[0053] The average separation distance (Zav) of one or more first reference marks (261) and one or more second reference marks (262) may be 1 mm or more, or 3 mm or more, or 5 mm or more, or 6 mm or more, or 10 mm or more, or 25 mm or more.

[0054] At least one average separation distance between one or more first reference marks (261) at the first level (251) and one or more second reference marks (262) at the second level (252) is predetermined. Thus, at least one known average separation distance may be used to determine the degree of an unforeseen or unforeseen offset. For example, CAD data of one or more tool reference bodies (200) may be used, and / or measurements may be performed on a measurement table before mounting on the device. Additionally or alternatively, the device may be positioned to measure at least one average separation distance (in-situ) after mounting.

[0055] Thus, the measurement of one or more first reference marks (261) determines at least TF1-X and TF1-Y values ​​using one or more first upward images, and the measurement of one or more second reference marks (262) thus determines at least TF2-X and TF2-Y values. At least one predetermined value of Zav is known. Using these values ​​as initial starting points, an appropriate iteration algorithm may be used until convergence is achieved. For example, the so-called “Kabsch algorithm” may be used with at least one predetermined Zav value to provide an initial estimate of the transformation T. Applying T to at least one predetermined Zav value provides an improved estimate of at least one in situ Zav value. Iteration may be performed until convergence is achieved using the improved estimate of at least one in situ Zav value together with the measured TF1-X, TF1-Y, TF2-X, and TF2-Y values, which is expected to be within 5 to 10 steps.

[0056] After convergence, one or more unforeseen or unforeseen slope values ​​may be used to determine an appropriate tool reference alignment correction for any subsequent measurement performed on one or more reference marks (261, 262, 263) included in one or more tool references (200). Similarly, after convergence, one or more unforeseen or unforeseen slope values ​​may be used to determine an appropriate gripper alignment correction for any subsequent measurement performed on one or more reference marks attached directly or indirectly to the gripper (160). For example, if Zav is 3 mm and a tool reference slope of 1 millidegree is measured, a tool reference alignment correction (or gripper alignment correction) of about 52 nm may be applied.

[0057] In the example illustrated in FIG. 3, the component (600) is received by the gripper (160) and thereby is directly and firmly attached to the gripper (160). The component (600) includes one or more component marks (640) located at the component mark level (641). The one or more component marks (640) are positioned so that one or more component upward images can be generated by one or more lookup cameras (410) when the component mark level (641) is located within the field of view of one or more lookup cameras (410). The one or more component upward images by the one or more lookup cameras (410) are positioned to provide at least one component orientation and / or component position of one or more components (600). Thus, the upward images and / or upward measurements of the one or more component marks (640) can determine at least the CF1-X value and the CF1-Y value. Optionally, one or more gripper alignment corrections determined using one or more tool reference bodies (200) may be applied to at least partially correct CF1-X and / or CF1-Y, for example.

[0058] In the example illustrated in FIG. 3, the device is positioned such that the first level (251) is located at a significant distance from the component mark level (641) along the positive Z-axis (930), which is the direction away from one or more lookup cameras (410). A significant distance between one or more component marks (640) at the component mark level (641) and one or more first reference marks (261) at the first level (251) may be advantageous in reducing the risk of collision during attachment, particularly when components (600) are attached closely together. For example, the significant distance between the component mark level (641) and the first level (251) may be 1 mm or more. A significant distance between one or more component marks (640) and one or more first reference marks (261) means that there is a significant difference in the focal distance at the optimal focus between the component up-image and the first up-image when generated by the same lookup camera (410). This can also be described as arranging one or more first reference marks (261) so that they are in a different focal plane from one or more component marks (640).

[0059] One or more first upward images and one or more second upward images may be generated in the same field of view, an overlapping field of view, or a different field of view as one or more component upward images. One or more lookup cameras (410) may be positioned to have a depth of field sufficient to generate images of both the component mark level (641) and the first level (251). Optionally, one or more lookup cameras (410) may be positioned to have a depth of field sufficient to generate images of the component mark level (641), the first level (251), and the second level (252). Additionally or alternatively, one or more lookup cameras (410) may be positioned to modify at least one optical and / or physical property to modify the focus sufficient to image the component mark level (641), the first level (251), and optionally the second level (252). Additionally or alternatively, one or more lookup cameras (410) may be positioned to modify at least one position and / or orientation of at least one optical component to modify the focal length sufficient to image the component mark level (641), the first level (251), and optionally the second level (252). This may be provided, for example, by including one or more optical elements in the one or more lookup cameras (410) such that at least one focal length can be changed between two or more substantially different focal settings. This may be provided, for example, by using one or more beam dividers having two or more different optical path lengths for two or more image sensors.

[0060] It may be advantageous to position the component mark level (641) and the first level (251) such that the average distance between them is approximately equal to the average distance between the first level (251) and the second level (252). This may be advantageous because some degree of unwanted inclination of the gripper (160) can cause some degree of unwanted offset, measured using one or more optical tool references (200), to be similar to some degree of unwanted offset when measuring the component orientation and / or position relative to one or more tool references (200). Additionally, or alternatively, if one or more lookup cameras (410) are positioned to image one or more component marks (640), one or more first reference marks (261), and one or more second reference marks (262), at least one alignment requirement for one or more lookup cameras (410) may be relaxed.

[0061] In the example illustrated in FIG. 3, the mark carrier (250) has a third surface of an optional third level (253), and one or more tool reference bodies (200) include one or more third reference marks (263) that are optionally located on or near the third surface of the third level (253). The one or more third reference marks (263) are positioned so that one or more third upward images can be generated by one or more lookup cameras (410) when the third level (253) is located within the field of view (440) of the first camera (410). Generally, the optional one or more third upward images are positioned to provide a third upward orientation and / or upward position of the reference member. When one or more third reference marks (263) are arranged so that an image is also generated by one or more lookdown cameras (510), the mark carrier (250) includes one or more transparent imaging sections that are sufficiently transparent for one or more lookdown cameras (510) to generate an image of one or more third reference marks (263).

[0062] Optionally, to improve the accuracy of the measurements described above by using one or more first reference marks (261) and one or more second reference marks (262), the measurement and / or imaging of one or more third reference marks (263) may be positioned to provide at least one additional upward orientation and / or upward position of the reference member. Additionally or alternatively, the measurement and / or imaging of one or more third reference marks (263) may be positioned together with one or more first reference marks (261) as described above, but one or more third reference marks (263) may be used instead of one or more second reference marks (262) for an advantageously larger separation distance. Additionally or alternatively, the measurement and / or imaging of one or more third reference marks (263) may be positioned together with one or more second reference marks (262) as described above, but one or more third reference marks (263) may be used instead of one or more first reference marks (261).

[0063] It may be advantageous to position one or more tool reference bodies (200) so that measurement and imaging are possible only by one or more lookdown cameras (510) instead of one or more lookup cameras (410). This can be achieved by orienting the reference markers (261, 262, 263) of one or more tool reference bodies (200) toward one or more lookdown cameras (510).

[0064] It may be advantageous to maintain the function of one or more tool reference bodies (200) that can be measured and imaged by one or more lookup cameras (410), and to provide one or more additional tool reference bodies (200) that can be measured and imaged only by one or more lookdown cameras (510).

[0065] It may be advantageous to position one or more tool reference bodies (200) illustrated in FIG. 3 so that they can be measured and imaged by both one or more look-down cameras (510) and one or more look-up cameras (410). For example, the mark carrier (250) may include one or more transparent imaging parts (255). Advantageously, the average refractive index (n) of the imaging part (255) may be approximately 2, or 1.0 to 3.0, or 1.5 to 2.5, or 1.7 to 2.3, or 1.75 to 2.25, or 1.8 to 2.2, or 1.85 to 2.15, or 1.9 to 2.1; or 1.95 to 2.05. Advantageously, one or more imaging sections comprise a material selected from the group comprising glass, lanthanum dense flint glass, crystal, plastic, semiconductor, silicon, liquid, metal, or any combination thereof.

[0066] One or more first reference marks (261) may be additionally positioned so that when the first level (251) is located within the field of view (540) of one or more lookdown cameras (510), one or more first downward images can be generated by one or more lookdown cameras (510) through one or more imaging units (255). One or more second reference marks (262) may be additionally positioned so that when the second level (251) is located within the field of view (540) of one or more lookdown cameras (510), one or more second downward images can be generated by one or more lookdown cameras (510) through one or more imaging units (255). One or more first images by one or more lookdown cameras (510) may be positioned to provide a first downward orientation and / or downward position of the reference member. One or more second downward images by one or more lookdown cameras (510) may be positioned to provide a second downward orientation and / or downward position of the reference member. One or more optional third reference marks (263) may be additionally positioned so that when the third level (253) is located within the field of view (540) of one or more look-down cameras (510), one or more third downward images can be generated by one or more look-down cameras (510) through one or more imaging units (255). One or more third downward images by one or more look-down cameras (510) may be positioned to provide a third downward orientation and / or downward position of the reference member.

[0067] For example, a transparent mark carrier (250) may be provided on a portion of a glass plate. One or more reference marks (261, 262, 263) may be at least partially embedded or at least partially recessed in a portion of the surface of the mark carrier (250). Optionally, one or more reference marks (261, 262, 263) may be completely embedded in a portion of the surface of the mark carrier (250). For example, a transparent imaging area may be provided within a metal layer, such as chrome, deposited on the surface of a glass platelet. Additionally, one or more reference marks (261, 262, 263) may be provided by selective etching or masking of a metal layer, such as chrome, deposited on the surface of the glass platelet. The material used for the mark carrier (250), such as glass, must be sufficiently transparent to the radiation used for downward imaging.

[0068] As described above, one or more lookup cameras (410) may be additionally positioned to determine the position and / or orientation of at least one component of one or more component marks (640). Optionally, the determination may be performed before, during, or after attaching the component (600) to the gripper (160). Any suitable component mark (640) may be used. For example, the component mark (640) may be a physical feature of at least a part of the component, an optical feature of at least a part of the component (600), at least a part of the fiducial, or any combination thereof.

[0069] The apparatus described in this specification, and all variations and embodiments described in this specification, are suitable for carrying out the methods disclosed below.

[0070] One or more tool reference bodies described in this specification are suitable for performing at least one alignment or calibration procedure, wherein at least one orientation and / or position of a reference member attached to one or more tool reference bodies described in this specification is aligned or calibrated.

[0071] For example, a method for performing at least one alignment or calibration procedure includes the steps of: generating one or more first upward images using one or more first cameras (410); generating one or more second upward images using one or more first cameras (410); determining a first upward orientation and / or upward position of a reference member using one or more first upward images; and determining a second upward orientation and / or upward position of a reference member using one or more second upward images.

[0072] Additionally or alternatively, if the mark carrier (250) includes one or more transparent imaging units (255), a method for performing at least one alignment or calibration procedure may include the steps of: generating one or more first downward images using one or more second cameras (510); generating one or more second downward images using one or more second cameras (510); determining a first downward orientation and / or downward position of a reference member using one or more first downward images; and determining a second downward orientation and / or downward position of a reference member using one or more second downward images.

[0073] One or more tool reference bodies described in this specification are also suitable for positioning one or more components (600) using a pick and place actuator (150), wherein the pick and place actuator (150) includes a gripper (160) for detachably attaching to one or more components (600), and a reference member of one or more tool reference bodies as described in this specification is included in the pick and place actuator (150).

[0074] For example, a method for positioning one or more components (600) includes the step of generating one or more first upward images of one or more first reference marks (261) using one or more first cameras (410) positioned as one or more lookup cameras; the step of generating one or more second upward images of one or more second reference marks (262) using one or more first cameras (410); and the step of determining at least one upward orientation and / or upward position of a gripper (160) using one or more first upward images and / or one or more second upward images.

[0075] Optionally, a method for positioning one or more components may include the step of modifying at least one position and / or orientation of a pick-and-place actuator (150) using at least one upward orientation and / or upward position of a gripper (160).

[0076] Optionally, when one or more components (600) include one or more component marks (640) at a component mark level (641), wherein one or more component marks (640) are positioned so that one or more component images can be generated by one or more first cameras (410), a method for positioning one or more components (600) may additionally include the step of attaching one or more components (600) to a gripper (160); the step of generating one or more component images of one or more component marks (640) using one or more first cameras (410); and the step of determining at least one component orientation and / or component position using one or more component images. Optionally, a method for positioning one or more components (600) may additionally include the step of modifying at least one position and / or orientation of the gripper (160) using at least one component orientation and / or component position.

[0077] One or more tool references described in this specification are also suitable for both positioning one or more components (600) and aligning one or more components (600) with one or more substrates (300) before attachment.

[0078] For example, a method for aligning one or more components (600) with one or more substrates (300) before attachment includes the step of providing one or more substrates (300) to an attachment location (800), wherein one or more substrates (300) include one or more substrate marks (340); using one or more first cameras (410) positioned as one or more lookup cameras, generating one or more first upward images of one or more first reference marks (261) and generating one or more second upward images of one or more second reference marks (262); determining a first upward orientation and / or upward position using one or more first upward images of one or more first reference marks (261); determining a second upward orientation and / or upward position using one or more second upward images of one or more second reference marks (262); and determining a gripper alignment correction using the first upward orientation and / or upward position together with the second upward orientation and / or upward position. The method includes the steps of: moving a gripper (160) to an attachment position (800); generating one or more substrate mark images of one or more substrate marks (340) using one or more look-down cameras at the attachment position (800); determining the substrate mark orientation and / or position using one or more substrate mark images of one or more substrate marks (340); and determining a substrate mark alignment correction using the substrate mark position and / or orientation.

[0079] Optionally, a method for aligning one or more components (600) with one or more substrates (300) before attachment may additionally include a step of modifying at least one orientation and / or position of the gripper (160) with respect to the substrate (300) based on gripper alignment correction. Optionally, a method for aligning one or more components (600) with one or more substrates (300) before attachment may additionally include a step of modifying at least one orientation and / or position of the gripper (160) with respect to the substrate (300) based on substrate mark alignment correction. Optionally, a method for aligning one or more components (600) with one or more substrates (300) before attachment may additionally include a step of attaching one or more components (600) to one or more substrates (300).

[0080] Optionally, if the mark carrier (250) includes one or more transparent imaging parts (255), a method for aligning one or more components (600) with one or more substrates (300) before attachment may additionally include the steps of: generating one or more first downward images of one or more first reference marks (261) and generating one or more second downward images of one or more second reference marks (262) using one or more first downward images of one or more first reference marks (261); determining a first downward orientation and / or downward position using one or more first downward images of one or more first reference marks (261); determining a second downward orientation and / or downward position using one or more second downward images of one or more second reference marks (262); and determining an additional gripper alignment correction using the first downward orientation and / or downward position together with the second downward orientation and / or downward position. Optionally, a method for aligning one or more components (600) with one or more substrates (300) before attachment may additionally include a step of modifying at least one orientation and / or position of the gripper (160) based on additional gripper alignment correction.

[0081] The above-described embodiment refers to methods for attaching one or more components (600) and one or more substrates (300) using an attachment device (100) to provide one embodiment. The above-described alignment method and alignment and attachment device may be adapted by obvious modification to provide any additional processing method and each any additional processing device.

[0082] The pick-and-place actuator (150) is illustrated as an assembly in FIG. 2, with an approximate cross-sectional area indicated by a dashed line. Although many functions and features are described in this disclosure as being included in, attached to, or associated with the pick-and-place actuator, this should be accepted only as an example. Those skilled in the art may configure and arrange one or more of these functions and features so that they are included only partially in the pick-and-place actuator, attached only partially to the pick-and-place actuator, or associated only partially with the pick-and-place actuator. Explanation of the symbols

[0083] number Simple explanation 100 Component attachment device 111 1st drive system 112 2nd drive system 113 Gripper rotation drive unit 115 Drive guide 120 feeder unit 130 driving member 140 substrate chuck 150 Pick and place actuator 160 Component Gripper 200 Tool reference body 250 Mark Carrier 251 Level 1 252 Level 2 253 Level 3 255 Imaging unit 261 First reference mark at Level 1 262 Second reference mark at Level 2 263 Third standard mark at the third level 300 substrate 340 Circuit board mark 410 A first camera positioned as a lookup camera 430 Radiation source for lookup camera lighting 440 Look-up camera view 510 A second camera deployed as a look-down camera 530 Radiation source for lighting for lookdown cameras 540 Lookdown camera view 600 component 640 Component Mark 641 Component Mark Level 800 Attachment location 810 Component inspection location 820 Loading location 910 First axis in the Y direction 920 Second axis in the X direction 930 Third axis in the Z direction

Claims

Claim 1 A tool reference body (200) for determining at least one orientation and / or position of a reference member, wherein the tool reference body (200) is attached to a reference member, and the tool reference body (200) is:- A mark carrier (250) having a first surface of a first level (251) and a second surface of a second level (252); One or more first reference marks (261) located on or near the first surface of the first level (251); and- It includes one or more second reference marks (262) positioned on or near the second surface of the second level (252); wherein one or more first reference marks (261) are positioned so that one or more first up-images can be generated by one or more first cameras (410); and wherein one or more second reference marks (262) are positioned so that one or more second up-images can be generated by one or more first cameras (410); Herein, one or more first upward images are positioned to provide a first upward orientation and / or upward position of a reference member; herein, one or more second upward images are positioned to provide a second upward orientation and / or upward position of a reference member; and herein, one or more first reference marks (261) of a first level (251) and one or more second reference marks (262) of a second level (252) have an average separation distance of 1 mm or more, or 3 mm or more, or 5 mm or more, or 10 mm or more, or 25 mm or more, a tool reference body (200). Claim 2 In claim 1, the mark carrier (250) has a third surface of a third level (253), and the tool reference body (200) includes one or more third reference marks (263) located on or near the third surface of the third level (253), wherein one or more third reference marks (263) are arranged so that one or more third upward images can be generated by one or more first cameras (410), and wherein one or more third upward images by one or more first cameras (410) are arranged to provide a third upward orientation and / or upward position of the reference member, the tool reference body (200). Claim 3 In paragraph 2 or 3, the mark carrier (250) comprises one or more transparent imaging units (255), wherein one or more first reference marks (261) are positioned so that one or more first down-images can be generated by one or more second cameras (510) through one or more imaging units (255); wherein one or more second reference marks (262) are positioned so that one or more second down-images can be generated by one or more second cameras (510) through one or more imaging units (255); wherein one or more first down-images are positioned to provide a first down-orientation and / or down-position of a reference member; and wherein one or more second down-images are positioned to provide a second down-orientation and / or down-position of a reference member, a tool reference body (200). Claim 4 In paragraph 3, the tool reference body (200) comprises one or more third reference marks (263) positioned on or near the third surface of the third level (253), wherein one or more third reference marks (263) are positioned so that one or more third downward images can be generated by one or more second cameras (510) through one or more imaging units (255), wherein one or more third downward images are positioned to provide a third downward orientation and / or downward position of the reference member. Claim 5 In paragraph 3 or 4, one or more transparent imaging parts (255) comprise a material selected from the group comprising glass, crystal, plastic, semiconductor, silicon, liquid, metal, or any combination thereof, a tool reference body (200). Claim 6 In any one of claims 1 to 5, the tool reference body (200) comprises one or more code marks arranged so that one or more code images can be generated by an image sensor, wherein the one or more code images are arranged to provide one or more parameters of one or more code marks selected from the group comprising orientation, position, parameter, value, numerical value, or any combination thereof. Claim 7 In any one of claims 1 to 6, the tool reference body (200) comprises an illumination radiation source arranged to provide radiation for one or more camera images. Claim 8 As a device (100) for positioning one or more components (600), the device (100) is,- A pick and place actuator (150), wherein the pick and place actuator (150) comprises a gripper (160) for being detachably attached to one or more components (600); One or more tool reference bodies (200) according to any one of claims 1 to 8, wherein the reference member is included in a pick and place actuator (150), and wherein one or more tool reference bodies (200) are arranged so as to determine at least one upward orientation and / or upward position of a gripper (160); The device (100) comprises one or more first cameras (410) positioned as look-up cameras to generate one or more first upward images of one or more first reference marks (261) and additionally positioned to generate one or more second upward images of one or more second reference marks (262), wherein the device (100) is positioned to modify at least one position and / or orientation of a pick-and-place actuator (150) using at least one upward position and / or upward orientation of a gripper (160). Claim 9 In claim 8, one or more components (600) include one or more component marks (640) at a component mark level (641), wherein after one or more components (600) are attached to a gripper (160), one or more component marks (640) are positioned so that one or more component images can be generated by one or more first cameras (410), wherein one or more component images are positioned to provide at least one orientation and / or position of one or more components (600), wherein the device (100) is positioned to modify at least one position and / or orientation of a pick and place actuator (150) using at least one position and / or orientation of one or more components (600). Claim 10 In claim 8 or 9, the pick and place actuator (150) is positioned to be placed at the attachment position (800), and the device (100) includes a substrate chuck (140) for providing one or more substrates (300) at the attachment position (800), wherein the device (100) is positioned to align one or more components (600) with one or more substrates (300) using at least one upward position and / or upward orientation of the gripper (160) before attachment. Claim 11 In claim 10, the device (100) comprises one or more look-down cameras positioned to generate one or more first downward images of one or more first reference marks (261), and one or more second cameras (510) additionally positioned to generate one or more second downward images of one or more second reference marks (262), wherein one or more first downward images are positioned to provide a first downward orientation and / or downward position of a reference member, and one or more second downward images are positioned to provide a second downward orientation and / or downward position of a reference member, wherein the device (100) is positioned to modify at least one position and / or orientation of a pick-and-place actuator (150) using at least one downward position and / or downward orientation of a gripper (160). Claim 12 A method for determining at least one orientation and / or position of a reference member attached to one or more tool reference bodies (200), wherein one or more tool reference bodies (200) comprises: a mark carrier (250) having a first surface of a first level (251) and a second surface of a second level (252); and one or more first reference marks (261) located on or near the first surface of the first level (251). and includes one or more second reference marks (262) located on or near the second surface of the second level (252), wherein one or more first reference marks (261) are positioned so that one or more first upward images can be generated by one or more first cameras (410), and one or more second reference marks (262) are positioned so that one or more second upward images can be generated by one or more first cameras (410), and one or more first reference marks (261) of the first level (251) and one or more second reference marks (262) of the second level (252) have an average separation distance of 1 mm or more, or 3 mm or more, or 5 mm or more, or 10 mm or more, or 25 mm or more, and the method is:- A step of generating one or more first upward images using one or more first cameras (410); A step of generating one or more second upward images using one or more first cameras (410); A step of determining a first upward orientation and / or upward position of a reference member using one or more first upward images; and- A method comprising the step of determining a second upward orientation and / or upward position of a reference member using one or more second upward images. Claim 13 In claim 12, the mark carrier (250) comprises one or more transparent imaging units (255), wherein one or more first reference marks (261) are positioned so that one or more first downward images can be generated by one or more second cameras (510) through one or more imaging units (255), and one or more second reference marks (262) are positioned so that one or more second downward images can be generated by one or more second cameras (510) through one or more imaging units (255); the method is:- A step of generating one or more first downward images using one or more second cameras (510); A step of generating one or more second downward images using one or more second cameras (510); A step of determining a first downward orientation and / or downward position of a reference member using one or more first downward images; and - A method further comprising the step of determining a second downward orientation and / or downward position of a reference member using one or more second downward images. Claim 14 A method for positioning one or more components (600) using a pick and place actuator (150), wherein the pick and place actuator (150) comprises a gripper (160) for being detachably attached to one or more components (600), and a reference member of one or more tool reference bodies (200) according to any one of claims 1 to 8 is included in the pick and place actuator (150), and the method is:- A step of using one or more first cameras (410) as one or more lookup cameras to generate one or more first upward images of one or more first reference marks (261); A step of generating one or more second upward images of one or more second reference marks (262) using one or more first cameras (410); A step of determining at least one upward orientation and / or upward position of a gripper (160) using one or more first upward images and / or one or more second upward images; and A method comprising the step of modifying at least one position and / or orientation of a pick and place actuator (150) using at least one upward orientation and / or upward position of a gripper (160). Claim 15 In paragraph 14, one or more components (600) include one or more component marks (640) at a component mark level (641), wherein one or more component marks (640) are positioned so that one or more component images can be generated by one or more first cameras (410); and the method is,- A step of attaching one or more components (600) to a gripper (160); A step of generating one or more component images of one or more component marks (640) using one or more first cameras (410); A step of determining at least one component orientation and / or component position using one or more component images; and- A method further comprising the step of modifying at least one position and / or orientation of the gripper (160) using at least one component orientation and / or component position. Claim 16 A method for aligning one or more components (600) with one or more substrates (300) before attachment, comprising a method for positioning one or more components according to claim 14 or 15, wherein the method is:- A step of providing one or more substrates (300) to an attachment location (800), wherein one or more substrates (300) include one or more substrate marks (340); A step of generating one or more first upward images of one or more first reference marks (261) and generating one or more second upward images of one or more second reference marks (262) using one or more first cameras (410) positioned as one or more lookup cameras; A step of determining a first upward orientation and / or upward position using one or more first upward images of one or more first reference marks (261); A step of determining a second upward orientation and / or upward position using one or more second upward images of one or more second reference marks (262); A step of determining gripper alignment correction by using a first upward orientation and / or upward position together with a second upward orientation and / or upward position; Step of moving the gripper (160) to the attachment position (800); - A step of generating one or more substrate mark images of one or more substrate marks (340) using one or more lookdown cameras located at an attachment position (800); A step of determining the orientation and / or position of a substrate mark using one or more substrate mark images of one or more substrate marks (340); and - A method further comprising the step of determining substrate mark alignment correction using substrate mark position and / or orientation. Claim 17 In claim 16, the method further comprises the step of correcting at least one orientation and / or position of the gripper (160) relative to the substrate (300) based on gripper alignment correction. Claim 18 The method of claim 16 or 17 further comprises the step of correcting at least one orientation and / or position of the gripper (160) with respect to the substrate (300) based on substrate mark alignment correction. Claim 19 A method according to any one of claims 16 to 18, wherein the method further comprises the step of attaching one or more components (600) to one or more substrates (300). Claim 20 In any one of claims 16 to 18, one or more first reference marks (261) are positioned so that one or more first downward images can be generated by one or more second cameras (510) through one or more imaging units (255), and one or more second reference marks (262) are positioned so that one or more second downward images can be generated by one or more second cameras (510) through one or more imaging units (255), and the method is:- A step of generating one or more first downward images of one or more first reference marks (261) and generating one or more second downward images of one or more second reference marks (262) using one or more second cameras (510) positioned as one or more look-down cameras; A step of determining a first downward orientation and / or downward position using one or more first downward images of one or more first reference marks (261); A step of determining a second downward orientation and / or downward position using one or more second downward images of one or more second reference marks (262); and- A method further comprising the step of determining additional gripper alignment correction by using a first downward orientation and / or downward position together with a second downward orientation and / or downward position. Claim 21 In paragraph 20, the method further comprises the step of modifying at least one orientation and / or position of the gripper (160) based on additional gripper alignment correction.

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