Display apparatus

Abstract

A display device according to one embodiment of the present specification comprises a display panel, a printed circuit board attached to the display panel, a first plate disposed below the display panel, a second plate disposed below the first plate, a cushioning member disposed on the side of each of the display panel, the first plate, and the second plate, and an impact protection film disposed on the lower surface of the second plate, wherein at least a portion of the impact protection film is disposed between the printed circuit board and the cushioning member.

Description

Technology Field

[0001] This specification relates to a display device. Background Technology

[0002] As the information society develops, there is an increasing demand for display devices that display images, and various types of display devices, such as Liquid Crystal Display Apparatuses and Organic Light Emitting Diode Display Apparatuses, are being utilized.

[0003] Generally, a display device includes a display area that displays the screen and a non-display area formed around the display area. In a display device, the non-display area is also referred to as the bezel area, and recently, there has been an increasing demand from consumers for display devices with minimized bezel areas.

[0004] A display device can be formed by assembling a display unit, which includes a window member and a display panel, with a housing member or other electronic module. From assembly until it is formed into a final electronic device, the display unit is moved by an operator or through a process line, and during this process, vibrations or shocks from the outside may be transmitted. The problem to be solved

[0005] The problem that this specification aims to solve is to provide a display device capable of suppressing or preventing contact between a printed circuit board and a plate layer.

[0006] Another problem that this specification aims to solve is to provide a display device having a structure capable of mitigating external shocks and vibrations.

[0007] Another problem that this specification aims to solve is to provide a display device with improved reliability by minimizing defects through minimizing the transmission of external shocks and vibrations to the interior.

[0008] The problems of this specification are not limited to those mentioned above, and other technical problems may be inferred from the following embodiments. means of solving the problem

[0009] A display device according to one embodiment of the present specification comprises a display panel, a printed circuit board attached to the display panel, a first plate disposed below the display panel, a second plate disposed below the first plate, a cushioning member disposed on the side of each of the display panel, the first plate, and the second plate, and an impact protection film disposed on the lower surface of the second plate, wherein at least a portion of the impact protection film is disposed between the printed circuit board and the cushioning member.

[0010] Specific details of other embodiments are included in the detailed description and drawings. Effects of the invention

[0011] According to the embodiments of the present specification, a display device capable of suppressing or preventing contact between a printed circuit board and a plate layer can be provided.

[0012] According to the embodiments of the present specification, a display device having a structure capable of mitigating external shocks and vibrations can be provided.

[0013] According to the embodiments of the present specification, by minimizing the transfer of external shock and heat into the interior, a display device with improved reliability can be provided by minimizing defects.

[0014] According to the embodiments of the present specification, as the reliability of the display device is improved, the lifespan of the display device and low power consumption can be achieved, and furthermore, power consumption can be reduced.

[0015] However, the effects obtainable in this specification are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which this specification belongs from the description below. Brief explanation of the drawing

[0016] FIG. 1 is a configuration diagram of a display device according to one embodiment of the present specification. FIG. 2 is a plan view showing the display panel and printed circuit board of the display device according to FIG. 1. FIG. 3 is a cross-sectional view showing a bent state of a display panel according to one embodiment. FIG. 4 is a cross-sectional view of a pixel of a display panel according to one embodiment. Figure 5 is a rear view of a display device with a bent display panel. Figure 6 is a cross-sectional view taken along the line AA' of Figure 5. Figure 7 is a cross-sectional view taken along the BB' line of Figure 5. FIG. 8 is a cross-sectional view of a display device according to one embodiment. Specific details for implementing the invention

[0017] Hereinafter, embodiments are described with reference to the drawings. In this specification, where a component (or region, layer, part, etc.) is described as being "on," "connected," or "joined" to another component, it means that it may be directly connected / joined to the other component or that a third component may be placed between them.

[0018] Identical reference numerals denote identical components. Additionally, in the drawings, the thicknesses, proportions, and dimensions of the components are exaggerated for the effective illustration of the technical content. "And / or" includes all of one or more combinations that the associated components may define.

[0019] Terms such as "first," "second," etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the embodiments, the first component may be named the second component, and similarly, the second component may be named the first component. A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0020] Terms such as "below," "lower side," "above," and "upper side" are used to describe the relationships between the components depicted in the drawings. These terms are relative concepts and are described based on the directions indicated in the drawings.

[0021] Terms such as "include" or "have" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0023] FIG. 1 is a configuration diagram of a display device according to one embodiment of the present specification.

[0024] A display device (10) according to one embodiment can perform an image display function and a touch detection function (touch input function).

[0025] Referring to FIG. 1, a display device (10) according to one embodiment may include a display panel (100), a source driving circuit (SDC), a gate driving circuit (GDC), and a display controller (DSIP), etc. The embodiments of this specification are not limited thereto.

[0026] A display panel (100) may include a plurality of pixels disposed in a display area of ​​a base substrate, and driving units disposed in a non-display area around the display area to drive the pixels.

[0027] The pixels may include transistors connected to driving units and control signal lines, and light-emitting elements connected to the transistors.

[0028] The transistors can be turned on or turned off according to a control signal applied through a control signal line to control the amount of current applied to the light-emitting element.

[0029] The light-emitting element can emit light with a brightness corresponding to the amount of current applied through the transistor. The light-emitting element may include an organic light-emitting diode, but the embodiments of this specification are not limited thereto. For example, the light-emitting element may include an inorganic light-emitting diode, a quantum dot diode, a micro LED diode, or a mini LED diode, but the embodiments of this specification are not limited thereto.

[0030] A display panel (100) may have a plurality of data lines (DL) and a plurality of gate lines (GL) arranged thereon. The display panel (100) may include a plurality of pixels (or, pixels). A plurality of pixels may display an image. A plurality of pixels may be arranged as defined by a plurality of data lines (DL) and / or a plurality of gate lines (GL).

[0031] The source driving circuit (SDC) can drive multiple data lines (DL). The gate driving circuit (GDC) can drive multiple gate lines (GL).

[0032] The display controller (DSIP) can control the source driving circuit (SDC) and the gate driving circuit (GDC). The display controller (DSIP) can control the source driving circuit (SDC) and the gate driving circuit (GDC) by supplying various driving control signals (DCS, GCS) to the source driving circuit (SDC) and the gate driving circuit (GDC).

[0033] The display controller (DSIP) starts scanning according to the timing implemented in each frame, converts externally input image data to match the data signal format used by the source driving circuit (SDC), outputs the converted image data (Data), and can control data driving at an appropriate time in accordance with the scan.

[0034] The display controller (DSIP) can receive various timing signals, including, for example, a vertical synchronization signal, a horizontal synchronization signal, an input data enable signal, and a clock signal, along with input image data from an external source (for example, a host system).

[0035] In addition to converting input image data received from an external source to match the data signal format used by the source driving circuit (SDC) and outputting the converted image data, the display controller (DSIP) can receive timing signals such as a vertical synchronization signal, a horizontal synchronization signal, an input data enable signal, or a clock signal to control the source driving circuit (SDC) and the gate driving circuit (GDC), generate various driving control signals (DCS, GCS), and output them to the source driving circuit (SDC) and the gate driving circuit (GDC).

[0036] The source driving circuit (SDC) can drive multiple data lines (DL) by receiving image data (Data) from the display controller (DSIP) and supplying data voltage to multiple data lines (DL). The source driving circuit (SDC) may be a data driving circuit, but the embodiments of this specification are not limited thereto.

[0037] The source driver circuit (SDC) may be implemented by including at least one source driver integrated circuit (SDIC), but the embodiments of this specification are not limited thereto.

[0038] A gate driving circuit (GDC) can drive a plurality of gate lines (GL) by supplying a scan signal to a plurality of gate lines (GL). The gate driving circuit (GDC) may be a scan driving circuit, but the embodiments of this specification are not limited thereto.

[0039] A gate driver circuit (GDC) may be implemented by including at least one gate driver integrated circuit (GDIC), but the embodiments of this specification are not limited thereto.

[0040] Referring to FIG. 1, a display device (10) according to one embodiment may further include a touch panel, a touch driving circuit, and a touch controller, etc., to provide a touch detection function. The touch panel may be formed integrally with the display panel (100), but is not limited thereto. The touch panel may also be formed separately on the display panel (100). The touch driving circuit may be integrated with a source driving circuit (SDC) and included in an integrated integrated circuit (see SRIC in FIG. 2), but the embodiments of this specification are not limited thereto.

[0042] FIG. 2 is a plan view showing a display panel and a printed circuit board of a display device according to FIG. 1. FIG. 3 is a cross-sectional view showing a bent state of a display panel according to one embodiment. FIG. 4 is a cross-sectional view of a pixel of a display panel according to one embodiment.

[0043] Referring to FIGS. 2 to 4, the display panel (100) may include a display area (DA) comprising a plurality of pixels (PX) and a non-display area (NDA) around the display area (DA).

[0044] The display area (DA) may include short sides extended along a first direction (DR1) and long sides extended along a second direction (DR2). The non-display area (NDA) may surround the display area (DA). The non-display area (NDA) may be positioned on one side of the first direction (DR1), the other side of the first direction (DR1), one side of the second direction (DR2), and the other side of the second direction (DR2) of the display area (DA), but the embodiments of this specification are not limited thereto.

[0045] A non-display area (NDA) located on the other side of the second direction (DR2) of the display area (DA) may be extended further in the direction of the other side of the second direction (DR2) from the central part of the other side of the second direction (DR2) of the display area (DA). The width of the first direction (DR1) of the non-display area (NDA) extended further in the direction of the other side of the second direction (DR2) from the central part of the other side of the second direction (DR2) of the display area (DA) may be smaller than the width of the first direction (DR1) of the non-display area (NDA) adjacent to the other side of the second direction (DR2) of the display area (DA).

[0046] The display panel (100) may include a first area (MR), a second area (SR), and a third area (BR) between the first area (MR) and the second area (SR).

[0047] A display area (DA) and a non-display area (NDA) surrounding the display area (DA) on four sides can constitute a first area (MR).

[0048] At the central portion of the other side of the second direction (DR2) of the display area (DA), the portion further extended toward the other side of the second direction (DR2) may constitute a third area (BR) and a second area (SR). The second area (SR) may include a first pad area (PA1) and a second pad area (PA2) located at the other end of the second direction (DR2) of the second area (SR).

[0049] A third region (BR) may be positioned between the second region (SR) and the first region (MR). The third region (BR) of the display panel (100) may be bent in the thickness direction (or the third direction (DR3)). By doing so, the first region (MR) and the second region (SR) may overlap in the thickness direction. The display panel (100) may be bent such that the lower surface of the first region (MR) and the upper surface of the second region (SR) face each other.

[0050] For example, the first area (MR) may be a main area or a display area, but is not limited thereto. For example, the second area (SR) may be a sub-area, but is not limited thereto. For example, the third area (BR) may be a bending area or a variable area, but is not limited thereto.

[0051] The display device (10) may further include an integrated circuit (SRIC) placed in a first pad area (PA1) and a printed circuit board (FPCB) attached to a second pad area (PA2).

[0052] A plurality of pads connected to an integrated circuit (SRIC) and a printed circuit board (FPCB) may each be disposed in the first pad area (PA1) and the second pad area (PA2). The integrated circuit (SRIC) may be formed in the form of, for example, a driver chip (IC), but is not limited thereto. In one embodiment, a case was exemplified in which the integrated circuit (SRIC) is disposed in a chip-on-plastic manner, which is directly mounted on the display panel (100).

[0053] A controller may be disposed on a printed circuit board (FPCB). The controller may include at least one controller. Only one controller may be disposed on the printed circuit board (FPCB). For example, the controller may be a display controller (DSIP), but the embodiments of this specification are not limited thereto. If multiple controllers are provided, controllers other than the display controller (DSIP) may include a touch controller, but the embodiments of this specification are not limited thereto.

[0054] The printed circuit board (FPCB) may further include a connector (CN) and may be electrically connected to a main circuit board, etc. through the connector (CN), but the embodiments of the present specification are not limited thereto.

[0055] Below, the cross-sectional structure of the display panel (100) is described.

[0056] The display panel (100) may include a substrate (101), a first thin-film transistor (120), a second thin-film transistor (130), a light-emitting part (150), and an encapsulation part (170).

[0057] The substrate (101) may include a flexible substrate. The substrate (101) may include one or more plastic materials. Since the substrate (101) of the display panel (100) includes a flexible substrate, the display device (10) may be implemented as a foldable, stretchable, or bendable display device, but the embodiments of the present specification are not limited thereto.

[0058] A buffer layer (102) may be disposed on the substrate (101). The buffer layer (102) may minimize or delay the diffusion of moisture or oxygen penetrating the substrate (101).

[0059] A first light-blocking layer (126) may be disposed on the buffer layer (102). The first light-blocking layer (126) can prevent light from being transmitted to the first semiconductor layer (123) of the first thin-film transistor (120).

[0060] A first insulating layer (103) may be placed on the first light-blocking layer (126).

[0061] A first thin-film transistor (120) may be disposed on the first insulating layer (103). The first thin-film transistor (120) may include a first source electrode (121), a first gate electrode (122), a first semiconductor layer (123), and a first drain electrode (124).

[0062] The first semiconductor layer (123) may be disposed on the first insulating layer (103). The first semiconductor layer (123) may include a silicon-based semiconductor material such as a metal oxide semiconductor such as IGZO (Indium-Gallium-Zinc Oxide), amorphous silicon, or polycrystalline silicon. The first semiconductor layer (123) may include a channel region, a source region, and a drain region.

[0063] A second insulating layer (104) may be disposed on the first semiconductor layer (123).

[0064] A first gate electrode (122) may be disposed on the second insulating layer (104). The first gate electrode (122) may be disposed on the second insulating layer (104) so ​​as to overlap with the channel region of the first semiconductor layer (123).

[0065] A third insulating layer (105) can be disposed on the first gate electrode (122).

[0066] A first source electrode (121) and a first drain electrode (124) may be disposed on the third insulating layer (105).

[0067] The first source electrode (121) and the first drain electrode (124) can be electrically connected to the first semiconductor layer (123) through a contact hole.

[0068] A storage electrode (140) may be disposed spaced apart from the first thin-film transistor (120). The storage electrode (140) may include a first storage electrode (141), a second storage electrode (142), and a third storage electrode (143).

[0069] A second storage electrode (142) may be disposed on the first storage electrode (141). The second storage electrode (142) may be disposed on the third insulating layer (105), and a capacitance may be formed by using the third insulating layer (105) between the first storage electrode (141) and the second storage electrode (142) as a dielectric.

[0070] A second thin-film transistor (130) may be disposed spaced apart from the first thin-film transistor (120) and the storage electrode (140). The second thin-film transistor (130) may include a second source electrode (131), a second gate electrode (132), a second semiconductor layer (133), and a second drain electrode (134).

[0071] A second light-blocking layer (136) may be placed on the same layer as the second storage electrode (142).

[0072] A fourth insulating layer (106) may be placed on the second light-blocking layer (136).

[0073] A second semiconductor layer (133) may be disposed on the fourth insulating layer (106). The second semiconductor layer (133) may include a source region, a drain region, and a channel region between the source region and the drain region.

[0074] The second semiconductor layer (133) may include a silicon-based semiconductor material such as a metal oxide semiconductor such as IGZO (Indium-Gallium-Zinc Oxide), amorphous silicon, or polycrystalline silicon, but the embodiments of the present specification are not limited thereto.

[0075] A fifth insulating layer (108) can be disposed on the second semiconductor layer (133).

[0076] A second gate electrode (132) can be placed on the fifth insulating layer (108).

[0077] A sixth insulating layer (109) may be disposed on the second gate electrode (132).

[0078] A first source electrode (121), a first drain electrode (124), a third storage electrode (143), a second source electrode (131), and a second drain electrode (134) may be disposed on the sixth insulating layer (109).

[0079] The first thin-film transistor (120) may be a driving transistor and the second thin-film transistor (130) may be a switching transistor, but the embodiments of the present specification are not limited thereto.

[0080] A first protective layer (111) may be disposed on the first source electrode (121) and the first drain electrode (124).

[0081] The first protective layer (111) can flatten the upper surface of the first thin-film transistor (120) and protect the first thin-film transistor (120). The first protective layer (111) may be made of an organic material.

[0082] A second protective layer (112) may be disposed on the first protective layer (111). The second protective layer (112) may be formed of the same material as the first protective layer (111), but the embodiments of this specification are not limited thereto.

[0083] A connecting electrode (145) may be disposed between the first protective layer (111) and the second protective layer (112). The connecting electrode (145) can electrically connect the first thin-film transistor (120) and the light-emitting part (150).

[0084] A light-emitting part (150) may be disposed on the second protective layer (112). The light-emitting part (150) may include an anode electrode (151), an organic layer (152), and a cathode electrode (153).

[0085] An anode electrode (151) may be disposed on the second protective layer (112). The anode electrode (151) may be electrically connected to the first thin-film transistor (120) through a contact hole formed in the second protective layer (112). The anode electrode (151) may be a reflective electrode that reflects light, but the embodiments of the present specification are not limited thereto.

[0086] An organic layer (152) may be disposed on the anode electrode (151). The organic layer (152) may include one or more light-emitting structures (or light-emitting elements or elements) stacked on the anode electrode (151) in the order of a hole transport layer and an electron transport layer or in reverse order.

[0087] The organic layer (152) may be an organic light-emitting layer, an inorganic light-emitting layer, a quantum dot light-emitting layer, a micro light-emitting diode, or a micro mini light-emitting diode, but the embodiments of the present specification are not limited thereto.

[0088] A cathode electrode (153) may be disposed on the organic layer (152). The cathode electrode (153) may be a transparent electrode that transmits light, but the embodiments of this specification are not limited thereto.

[0089] The bank (154) may be positioned to expose the anode electrode (151). The bank (154) may be positioned to define the opening (or light-emitting region) of the pixel (PX) and to cover the edge portion of the anode electrode (151).

[0090] If the bank (154) is composed of a material including black pigment or black dye, it may be a black bank. In this case, it can block light from the outside or block light reflected from the outside, so the brightness of the display device can be further improved.

[0091] More spacers may be placed on the bank (154).

[0092] A sealing portion (170) may be disposed on the bank (154) or the light-emitting portion (150). The sealing portion (170) may include one or more insulating layers. For example, the sealing portion (170) may include a first sealing layer (171), a second sealing layer (172) on the first sealing layer (171), and a third sealing layer (173) on the second sealing layer (172). The sealing portion (170) may include one or more layers of inorganic material and one or more layers of organic material. For example, the first sealing layer (171) and the third sealing layer (173) may include inorganic material, and the second sealing layer (172) may include organic material, but the embodiments of the present specification are not limited thereto.

[0093] Although not shown in the diagram, a touch portion capable of detecting a user's touch may be further placed on the bag portion (170).

[0095] FIG. 5 is a rear view of a display device with a bent display panel. FIG. 6 is a cross-sectional view taken along the line AA' of FIG. 5. FIG. 7 is a cross-sectional view taken along the line BB' of FIG. 5.

[0096] FIG. 5 shows a rear view of a display device (10) viewed from the back after the display panel (100) is bent as in FIG. 3.

[0097] Referring to FIGS. 5 to 7, the display device (10) may include a plurality of laminated members. The display device (10) may further include a polarizing layer (200) disposed on the upper surface of the display panel (100), a cover layer (300) disposed on the upper surface of the polarizing layer (200), a first plate (400) disposed on the lower surface (back surface) of the display panel (100), and a second plate (500) disposed on the lower surface of the first plate.

[0098] However, it is not limited thereto, and although not illustrated, the display device (10) may further include a metal frame positioned below the second plate (500) and a system frame capable of housing each stacked member.

[0099] The display device (10) may further include bonding layers disposed between the laminated members. Specifically, the display device (10) may further include bonding layers disposed between the display panel (100), the polarizing layer (200), the cover layer (300), the first plate (400), and the second plate (500) to bond and fix each component. The bonding layer may include an optical adhesive layer (OCA), a first bonding layer (PSA1), a second bonding layer (PSA2), and a third bonding layer (PSA3).

[0100] An optical adhesive layer (OCA) can be placed between the polarization layer (200) and the cover layer (300). The optical adhesive layer (OCA) can fix the polarization layer (200) and the cover layer (300) by bonding them together.

[0101] The optical adhesive layer (OCA) may include a clear adhesive. For example, the clear adhesive may be an optically clear adhesive or an optically clear resin, but the embodiments of this specification are not limited thereto.

[0102] The first bonding layer (PSA1) can be placed between the display panel (100) and the polarization layer (200). The first bonding layer (PSA1) can fix the display panel (100) and the polarization layer (200) by bonding them together.

[0103] The second bonding layer (PSA2) can be placed between the first plate (400) and the display panel (100). The second bonding layer (PSA2) can fix the first plate (400) and the display panel (100) by bonding them together.

[0104] A third bonding layer (PSA3) may be placed between the first plate (400) and the second plate (500). The third bonding layer (PSA3) may bond the first plate (400) and the second plate (500) together to fix them.

[0105] Each of the first bonding layer (PSA1), the second bonding layer (PSA2), and the third bonding layer (PSA3) may include an adhesive or a transparent adhesive, but the embodiments of this specification are not limited thereto. For example, the transparent adhesive may be an optically clear adhesive, an optically clear resin, or a pressure-sensitive adhesive, but the embodiments of this specification are not limited thereto.

[0106] A polarizing layer (200) may be disposed on the upper part of the display panel (100). The polarizing layer (200) may polarize light emitted from the display panel (100) at a polarization angle. The polarizing layer (200) may emit light polarized at a polarization angle to the outside. The polarizing layer (200) may include a function to block the reflection of light from the outside, excluding light polarized at a polarization angle.

[0107] The polarization layer (200) may include a first phase delay layer, a second phase delay layer on the first phase delay layer, and a polarization layer on the second phase delay layer, but the embodiments of the present specification are not limited thereto. In 3, the polarization layer (200) and the display panel (100) are illustrated as being separate from each other, but are not limited thereto, and the polarization layer (200) may be included in the display panel (100).

[0108] A cover layer (300) may be disposed on the polarization layer (200).

[0109] The cover layer (300) can protect the components (e.g., display panel (100), etc.) placed on the lower part of the cover layer (300) from the outside.

[0110] The cover layer (300) may be formed of glass or a glass material including quartz, but the embodiments of the present specification are not limited thereto. The cover layer (300) may be a cover layer formed by chemical strengthening, but the embodiments of the present specification are not limited thereto. The cover layer (300) may be a cover window, a window cover, or a cover member, but the embodiments of the present specification are not limited thereto.

[0111] The cover layer (300) may be formed of a glass material, in which case the cover layer (300) may be damaged by an external force, and glass fragments may be created. In order to prevent glass fragments from scattering due to damage to the cover layer (300) or to improve the durability of the cover layer (300), the display device (10) may further include at least one other layer on the cover layer (300).

[0112] The display device (10) may further include a black matrix (BM). The black matrix (BM) may define a non-display area (NDA) of the display device (10). That is, the black matrix (BM) may be placed in the non-display area (NDA). The black matrix (BM) may block light from leaking into the non-display area (NDA).

[0113] The black matrix (BM) can be placed on the lower surface (back surface) of the cover layer (300). The black matrix (BM) can be placed so as to protrude toward the optical adhesive layer (OCA) on the cover layer (300). A step may occur due to the black matrix (BM), but the step may be eliminated by the optical adhesive layer (OCA). In this case, the black matrix (BM) can be placed between the cover layer (300) and the optical adhesive layer (OCA).

[0114] The black matrix (BM) may be composed of a photosensitive organic material to which a black pigment has been added, but the embodiments of this specification are not limited thereto. The black pigment may include carbon black or titanium oxide, but the embodiments of this specification are not limited thereto.

[0115] A first plate (400) may be disposed at the bottom of the display panel (100). The first plate (400) may be disposed at the bottom of the display panel (100) to support the display panel (100). The first plate (400) may have a certain strength and thickness to complement the rigidity of the display panel (100). The first plate (400) may suppress wrinkles occurring on the display panel (100).

[0116] The first plate (400) may include a material capable of supporting the display panel (100). For example, the first plate (400) may include polyethylene terephthalate (PET), polyimide (PI), or polycarbonate (PC), but the embodiments of this specification are not limited thereto.

[0117] A second plate (500) may be disposed on the lower part of the first plate (400). The second plate (500) may be composed of a single layer, but is not limited thereto and may be composed of multiple layers.

[0118] The second plate (500) may include metal. However, it is not limited thereto. For example, the second plate (500) may include one or more materials selected from stainless steel (SUS), glass, ceramic, and metal, but the embodiments of this specification are not limited thereto.

[0119] The display device (10) may further include a third plate (600). The third plate (600) may be placed on a second area (SR) of the display panel (100). The third plate (600) may be placed between a first area (MR) and a second area (SR) of the bent display panel (100). The third plate (600) may be placed below the second plate (500) and face the second plate (500).

[0120] A fourth bonding layer (PSA4) may be disposed between the second region (SR) of the display panel (100) and the third plate (600). The display panel (100) and the third plate (600) may be bonded together and fixed through the fourth bonding layer (PSA4). The fourth bonding layer (PSA4) may include an adhesive, a transparent adhesive, or a pressure-sensitive adhesive.

[0121] The third plate (600) may be made of the same material as the first plate (400). The third plate (600) may protect the second area (SR) of the display panel (100).

[0122] A printed circuit board (FPCB) may overlap with a first region (MR). The printed circuit board (FPCB) may be placed on or attached to a second plate (500) on the first region (MR). A fifth bonding layer (PSA5) may be placed between the printed circuit board (FPCB) and the second plate (500) of the first region (MR).

[0123] A display controller (DSIP) may be placed on one side of the printed circuit board (FPCB). One side of the printed circuit board (FPCB) may be opposite to the other side attached to the second plate (500). In FIG. 7, only a display controller (DSIP) is shown placed on one side of the printed circuit board (FPCB), but this is not limited thereto, and a touch controller, etc., may also be placed together.

[0124] The display panel (100) includes a third region (BR), and in the third region (BR), the display panel (100) can be bent. By doing so, the bezel area of ​​the display panel (100) can be reduced.

[0125] A printed circuit board (FPCB) may be attached to the end of the bent display panel (100). The printed circuit board (FPCB) may extend along the end and side of the second region (SR) of the display panel (100), the side of the third plate (600), and the lower surface of the second plate (500). The printed circuit board (FPCB) may be attached and fixed to the second plate (500) through a fifth bonding layer (PSA5).

[0126] By doing so, the thickness of the display device (10) can be reduced, and the flow of the printed circuit board (FPCB) can be minimized. Furthermore, physical interference between the printed circuit board (FPCB) and the set components can be minimized, and the durability of the display device can be strengthened and the lifespan of the display device can be improved.

[0127] The display device (10) may further include a buffer member (BF) disposed on the side of the stacked members of the display device (10).

[0128] The buffer member (BF) may be placed near the edge of the display device (10). The buffer member (BF) may be placed in a non-display area (NDA). The buffer member (BF) may be placed across three sides of the display device (10). The buffer member (BF) may be placed on one side and the other side of the first direction (DR1) and on one side of the second direction (DR2) of the display device (1). The buffer member (BF) may be formed integrally, but is not limited thereto.

[0129] The buffer member (BF) can cover each of the display panel (100), the polarizing layer (200), the first plate (400), the second plate (500), the first bonding layer (PSA1), the second bonding layer (PSA2), and the third bonding layer (PSA3). The buffer member (BF) may also cover a portion of the lower surface of the second plate (500). In addition, the buffer member (BF) may cover a portion of the side surface of the optical adhesive layer (OCA).

[0130] The cushioning member (BF) may be made of resin, but is not limited thereto. By placing the cushioning member (BF), external vibrations or shocks transmitted to each laminated member can be mitigated. For example, when each laminated member of the display device (10) is housed in a different configuration and moved, the cushioning member (BF) can mitigate shocks during the housing process or vibrations and shocks that may occur during movement. Accordingly, damage to each laminated member of the display device (10) can be suppressed or prevented, thereby improving the reliability of the display device (10).

[0131] The display device (10) may further include a metal protection film (MPF) and an impact protection film (SPF) disposed on the lower surface of the second plate (500). Here, the lower surface of the second plate (500) refers to the surface opposite to the upper surface facing the first plate (400).

[0132] The metal protective film (MPF) can protect the second plate (500) from external impacts, etc. Although not limited thereto, the metal protective film (MPF) may consist of two layers. The first layer (MPF1) and the second layer (MPF2) may be stacked and arranged sequentially. The first layer (MPF1) may be placed between the second layer (MPF2) and the second plate (500).

[0133] The first layer (MPF1) may be formed including an adhesive, but is not limited thereto. The second layer (MPF2) may be formed of a film capable of protecting the second plate (500), but is not limited thereto.

[0134] The shock protection film (SPF) can be positioned so that at least a portion overlaps the printed circuit board (FPCB) in the thickness direction (third direction (DR3)).

[0135] The shock protection film (SPF) can cover the second plate (500) and the buffer member (BF) that are exposed and not covered by the metal protection film (MPF) in the area overlapping with the printed circuit board (FPCB).

[0136] The shock protection film (SPF) may be placed between the printed circuit board (FPCB) and the second plate (500), and between the printed circuit board (FPCB) and the buffer member (BF). The shock protection film (SPF) may be placed spaced apart from the buffer member (BF). The shock protection film (SPF) can prevent the printed circuit board (FPCB) from coming into contact with the second plate (500) and the buffer member (BF).

[0137] Some areas of the impact protection film (SPF) may be placed on the metal protection film (MPF), but are not limited thereto. In this case, some areas of the impact protection film (SPF) may overlap with the metal protection film (MPF) in the thickness direction (third direction (DR3)).

[0138] In the area overlapping with the printed circuit board (FPCB), the shock protection film (SPF) may protrude further outward than the display panel (100). In the area overlapping with the printed circuit board (FPCB), the shock protection film (SPF) may protrude further in a first direction (DR1) than the display panel (100). Not limited thereto, in the area overlapping with the printed circuit board (FPCB), the shock protection film (SPF) may protrude further in a first direction (DR1) than the polarizing layer (200), the first plate (400), and the second plate (500).

[0139] The cover layer (300) may protrude further in the first direction (DR1) than the printed circuit board (FPCB), but is not limited thereto.

[0140] In the area overlapping with the printed circuit board (FPCB), the shock protection film (SPF) may protrude further outward than the metal protection film (MPF). In other words, in the area overlapping with the printed circuit board (FPCB), the shock protection film (SPF) may protrude further toward the end of the display device (10) than the metal protection film (MPF). For example, in the area overlapping with the printed circuit board (FPCB), the buffer member (BF) may be placed on the lower surface near the end of the second plate (500), and the metal protection film (MPF) may be placed spaced apart from the buffer member (BF).

[0141] In other words, the cushioning member (BF) is mainly placed on the side of the laminated members, but can also be placed on the lower surface near the end of the second plate (500) during the formation process. The metal protective film (MPF) is placed on the lower surface of the second plate (500), thereby exposing a portion of the lower surface near the end of the second plate (500). Accordingly, a space can be provided in which the cushioning member (BF) can be stably placed.

[0142] The shock protection film (SPF) extends further in the first direction (DR1) than the metal protection film (MPF) and may protrude further in the first direction (DR1) than the buffer member (BF). The shock protection film (SPF) may overlap with the buffer member (BF) in the thickness direction (third direction (DR3)) in the area where it overlaps with the printed circuit board (FPCB) in the thickness direction (third direction (DR3)). That is, the shock protection film (SPF) may be placed between the printed circuit board (FPCB) and the buffer member (BF).

[0143] Shock protection films (SPF) can absorb and mitigate external shocks. In addition, shock protection films (SPF) may be made of insulating materials with high electrical resistance. However, they are not limited to this.

[0144] As the shock protection film (SPF) is placed between the printed circuit board (FPCB) and the exposed second plate (500), it is possible to prevent the printed circuit board (FPCB) from coming into direct contact with the exposed second plate (500).

[0145] As the shock protection film (SPF) is made of an insulating material, the printed circuit board (FPCB) and the second plate (500) can be electrically insulated. Accordingly, the printed circuit board (FPCB) can operate stably, and electrical errors and defects can be suppressed or prevented.

[0146] As the shock protection film (SPF) is placed between the printed circuit board (FPCB) and the buffer member (BF), it is possible to prevent the printed circuit board (FPCB) from coming into direct contact with the buffer member (BF). In other words, even if the printed circuit board (FPCB) shakes because the display device (10) is shaken, the shock protection film (SPF) can mitigate the direct impact of the printed circuit board (FPCB) on the buffer member (BF).

[0147] Accordingly, damage to the cushioning member (BF) can be suppressed or prevented, allowing for smoother mitigation of external vibrations or shocks through the cushioning member (BF).

[0148] In addition, even if the printed circuit board (FPCB) is attached to the second plate (500) and the distance between the second plate (500) and the buffer member (BF) is reduced, by placing an impact protection film (SPF), direct contact between the printed circuit board (FPCB) and the second plate (500) and the buffer member (BF) can be more smoothly suppressed or prevented.

[0149] As a result, by placing an impact protection film (SPF), the reliability of the display device (10) can be improved, the lifespan of the display device (10) can be increased, low power consumption of the display device (10) can be achieved, and furthermore, the power consumption of the display device (10) can be reduced.

[0151] FIG. 8 is a cross-sectional view of a display device according to one embodiment.

[0152] Referring to FIGS. 6 and FIGS. 8, when a display device (10) is housed in a housing or the like, a portion of the printed circuit board (FPCB) may be bent.

[0153] Specifically, as shown in FIG. 6, a portion of the printed circuit board (FPCB) may protrude outward from the cover layer (300) in a first direction (DR1). The printed circuit board (FPCB) protruding outward from the cover layer (300) may be bent downward in a third direction (DR3) and positioned to overlap with the cover layer (300) in the thickness direction (third direction (DR3)).

[0154] As the printed circuit board (FPCB) protruding outwardly from the cover layer (300) is bent and positioned to overlap with the cover layer (300), the display device (1) can be prevented from colliding with the housing, etc. during the process of being housed in the housing, etc., and the display device (1) can be housed more smoothly in the housing, etc.

[0156] A display device according to various embodiments of the present specification may be described as follows.

[0157] A display device according to embodiments of the present specification comprises a display panel, a printed circuit board attached to the display panel, a first plate disposed below the display panel, a second plate disposed below the first plate, a cushioning member disposed on the side of each of the display panel, the first plate, and the second plate, and an impact protection film disposed on the lower surface of the second plate, wherein at least a portion of the impact protection film is disposed between the printed circuit board and the cushioning member.

[0158] According to various embodiments of the present specification, the shock protection film may protrude further outward than the cushioning member.

[0159] According to various embodiments of the present specification, the impact protection film may protrude further outward than the display panel, the first plate, and the second plate.

[0160] According to various embodiments of the present specification, the display panel further comprises a cover layer disposed on top of the display panel, wherein the cover layer may protrude further outward than the impact protection film.

[0161] According to various embodiments of the present specification, the shock protection film may overlap with the cushioning member in the thickness direction in an area that overlaps with the printed circuit board in the thickness direction.

[0162] According to various embodiments of the present specification, the display area for displaying a screen and the non-display area disposed around the display area are further included, and the buffer member may be disposed in the non-display area.

[0163] According to various embodiments of the present specification, the device further comprises a metal protective film disposed on the lower surface of the second plate, and in an area overlapping with the printed circuit board in the thickness direction, the impact protective film may protrude further outward than the metal protective film.

[0164] According to various embodiments of the present specification, the cushioning member may be disposed on the lower surface of the second plate, and the metal protective film may be disposed spaced apart from the cushioning member.

[0165] According to various embodiments of the present specification, a second plate exposed and not covered by the metal protective film and the cushioning member may be covered by the impact protective film in an area overlapping with the printed circuit board in the thickness direction.

[0166] According to various embodiments of the present specification, the shock protection film may be spaced apart from the cushioning member.

[0167] Although embodiments have been described above with reference to the attached drawings, those skilled in the art to which this specification pertains will understand that the technical configurations described above may be implemented in other specific forms without altering the technical concept or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. Furthermore, the scope of the embodiments is defined by the claims set forth below rather than by the detailed description. Additionally, all modifications or variations derived from the meaning and scope of the claims and equivalent concepts should be interpreted as being included within the scope of the embodiments. Explanation of the symbols

[0168] 10: Display device DA: Display area NDA: Non-display area 100: Display panel 200: Polarization layer 300: Cover layer 400: First plate 500: Second plate MPF: Metal protective film SPF: Shock protection film FPCB: Printed Circuit Board BF: Buffer member

Claims

Claim 1 A display device comprising: a display panel; a printed circuit board attached to the display panel; a first plate disposed below the display panel; a second plate disposed below the first plate; a cushioning member disposed on the side of each of the display panel, the first plate, and the second plate; and an impact protection film disposed on the lower surface of the second plate, wherein at least a portion of the impact protection film is disposed between the printed circuit board and the cushioning member. Claim 2 In claim 1, the shock protection film is a display device that protrudes further outward than the cushioning member. Claim 3 In claim 2, the impact protection film is a display device that protrudes further outward than the display panel, the first plate, and the second plate. Claim 4 A display device in claim 3, further comprising a cover layer disposed on top of the display panel, wherein the cover layer protrudes further outward than the impact protection film. Claim 5 In claim 1, the shock protection film is a display device that overlaps with the cushioning member in the thickness direction in an area that overlaps with the printed circuit board in the thickness direction. Claim 6 In claim 5, the display device further comprises a display area for displaying a screen and a non-display area disposed around the display area, wherein the buffer member is disposed in the non-display area. Claim 7 A display device according to claim 1, further comprising a metal protective film disposed on the lower surface of the second plate, wherein in an area overlapping with the printed circuit board in the thickness direction, the impact protective film protrudes further outward than the metal protective film. Claim 8 A display device according to claim 7, wherein the buffer member is disposed on the lower surface of the second plate, and the metal protective film is disposed spaced apart from the buffer member. Claim 9 In claim 8, the second plate exposed and not covered by the metal protective film and the cushioning member is a display device in which the second plate is covered by the impact protective film in an area overlapping with the printed circuit board in the thickness direction. Claim 10 In claim 1, the shock protection film is a display device spaced apart from the cushioning member.

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