Charged particle beam apparatus

Abstract

The present disclosure relates to a charged particle beam device, wherein a charged particle beam device according to one embodiment comprises a plurality of columns each injecting an electron beam into a sample, a shielding cover surrounding each of the plurality of columns, a chamber including a stage coupled to the columns and spaced apart from the ends of the columns to support the sample, and a detector for detecting electrons emitted from the sample, wherein each of the plurality of columns may have a polygonal shape in a planar shape.

Description

Technology Field

[0001] The present disclosure relates to a charged particle beam device. Background Technology

[0002] As the high integration and miniaturization of semiconductor devices continue, ensuring the precision and reliability of masks used in semiconductor manufacturing processes is becoming increasingly critical. Masks are used in the photolithography process to form fine patterns on wafers, and the presence of defects can lead to performance degradation and reduced manufacturing yields. Therefore, technology for precisely inspecting mask defects is essential.

[0003] Charged particle beam devices can be used to analyze surfaces, such as detecting patterns or defects on a substrate or inspecting the electrical properties of a sample. In particular, using charged particle beams, such as electron beams or ion beams, allows for the high-resolution detection of even minute defects that are difficult to detect using optical methods.

[0004] Recent charged particle beam devices are designed with a structure containing multiple electron beam columns to reduce inspection time. While utilizing multiple electron beams can significantly improve inspection speed compared to a single-beam method, there is a possibility that system stability may be compromised due to interference between the beams and heat generation in the columns. The problem to be solved

[0005] The embodiments are intended to provide a charged particle beam device having a plurality of electron beam columns, which improves the performance and ease of maintenance of the device by optimizing the arrangement method and shape of the electron beam columns. means of solving the problem

[0006] A charged particle beam device according to one embodiment comprises a plurality of columns that each inject an electron beam into a sample, a shielding cover surrounding each of the plurality of columns, a chamber including a stage coupled to the columns and spaced apart from the ends of the columns to support the sample, and a detector for detecting electrons emitted from the sample, wherein each of the plurality of columns may have a polygonal shape in a planar shape.

[0007] A charged particle beam device according to one embodiment may include a plurality of shielding covers each having a polygonal shape on a plane, a plurality of columns mounted within the shielding covers and each injecting an electron beam into a sample, a chamber including a stage coupled to the columns and spaced apart from the ends of the columns to support the sample, and a detector for detecting electrons emitted from the sample.

[0008] A charged particle beam device according to one embodiment comprises a plurality of columns, each having a polygonal shape on a plane and each injecting an electron beam into a sample, wherein the charged particle beam device comprises a memory and a processor, and the memory may store instructions that, when executed by the processor, cause the charged particle beam device to designate a first area to be inspected in the sample, control the power of at least some of the plurality of columns to be turned on, scan the first area using the columns controlled to be turned on, and generate image data based on a signal obtained by scanning the first area.

[0009] A method of operating a charged particle beam device according to one embodiment may include an operation of designating a first region to be inspected in a sample, an operation of controlling the power of at least some of a plurality of columns to be turned on, an operation of scanning the first region using the columns controlled to be turned on, and an operation of generating image data based on a signal obtained by scanning the first region.

[0010] A method of operation of a charged particle beam device according to one embodiment may further include an operation of outputting image data scanned from a first region through a display.

[0011] A method of operation of a charged particle beam device according to one embodiment can output each image data scanned using the columns controlled to be on together.

[0012] A method of operation of a charged particle beam device according to one embodiment can control the power of all of the plurality of columns to be turned on.

[0013] A method of operating a charged particle beam device according to one embodiment may designate a portion of the first region as a second region and control the power of the columns corresponding to the second region among the plurality of columns to be turned on.

[0014] In a method of operation of a charged particle beam device according to one embodiment, the charged particle beam device may include a plurality of columns, each having a polygonal shape on a plane and each injecting an electron beam into a sample.

[0015] In a method of operation of a charged particle beam device according to one embodiment, a plurality of columns included in the charged particle beam device may be arranged in a honeycomb shape from a planar perspective.

[0016] In a method of operation of a charged particle beam device according to one embodiment, the charged particle beam device may further include a plurality of shielding covers surrounding each of the plurality of columns.

[0017] In a method of operation of a charged particle beam device according to one embodiment, the plurality of shielding covers may include a material having a shielding effect, such as permalloy foil.

[0018] In a method of operation of a charged particle beam device according to one embodiment, the plurality of shielding covers may each have a hexagonal shape on a plane.

[0019] In a method of operation of a charged particle beam device according to one embodiment, the plurality of shielding covers may be arranged in a honeycomb shape from a planar perspective. Effects of the invention

[0020] According to the embodiments, in a charged particle beam device comprising a plurality of electron beam columns, the arrangement method and shape of the electron beam columns can be optimized to improve the performance and ease of maintenance of the device. Brief explanation of the drawing

[0021] FIG. 1 is a schematic diagram illustrating a charged particle beam device according to an embodiment of the present invention. FIG. 2 is a block diagram of a control device included in a charged particle beam device according to an embodiment of the present invention. FIG. 3 is a cross-sectional view of one electron beam column included in a charged particle beam device according to an embodiment of the present invention. FIG. 4 is a perspective view of one electron beam column included in a charged particle beam device according to an embodiment of the present invention. FIG. 5 is a plan view of one electron beam column included in a charged particle beam device according to an embodiment of the present invention. FIG. 6 is a plan view of one electron beam column included in a charged particle beam device according to an embodiment of the present invention. FIG. 7 is a drawing showing a plurality of column assemblies included in a charged particle beam device according to an embodiment of the present invention. FIG. 8 is a drawing showing a plurality of column assemblies included in a charged particle beam device according to an embodiment of the present invention. Figure 9 is a diagram illustrating scanning an inspection area of ​​a sample in a conventional charged particle beam device. FIG. 10 is a diagram illustrating scanning an inspection area of ​​a sample in a charged particle beam device according to an embodiment of the present invention. FIG. 11 is a flowchart illustrating the operation method of a charged particle beam device according to one embodiment. FIG. 12 is a flowchart illustrating the operation method of a charged particle beam device according to one embodiment. FIG. 13 is a diagram illustrating an example of a computer device implementing a charged particle beam device according to one embodiment. Specific details for implementing the invention

[0022] Hereinafter, various embodiments of the present invention will be described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein.

[0023] To clearly explain the present invention, parts unrelated to the explanation have been omitted, and the same reference numerals are used for identical or similar components throughout the specification.

[0024] Furthermore, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, and thus the present invention is not necessarily limited to what is illustrated. Thicknesses have been enlarged in the drawings to clearly represent various layers and regions. Additionally, for convenience of explanation, the thickness of some layers and regions has been exaggerated in the drawings.

[0025] Furthermore, when a part such as a layer, membrane, region, or plate is said to be "on" or "on" another part, this includes not only the case where it is "directly above" the other part, but also the case where there is another part in between. Conversely, when a part is said to be "directly above" another part, it means that there is no other part in between. Also, being "on" or "on" a reference part means being located above or below the reference part, and does not necessarily mean being located "on" or "on" in the direction opposite to gravity.

[0026] Furthermore, throughout the specification, when a part is described as "including" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components.

[0027] Additionally, throughout the specification, "planar" means when the subject part is viewed from above, and "cross-sectional" means when the cross-section obtained by vertically cutting the subject part is viewed from the side.

[0028] Additionally, terms such as "...part," "...device," and "...module" described in the specification perform at least one function or operation and may be implemented in hardware or software, or a combination of hardware and software. Furthermore, a plurality of "...modules," a plurality of "...devices," or a plurality of "...modules" may be integrated into at least one module and implemented by at least one processor, except for the "...part," "...device," or "...module" that needs to be implemented in specific hardware.

[0029] In this specification, "transmission," "sending," "provision," or "reception" may include not only directly transmitting, sending, providing, or receiving, but also indirectly transmitting, sending, providing, or receiving through another device or by using an alternative route.

[0030] Expressions described in the singular in this specification may be interpreted as singular or plural unless explicit expressions such as "one" or "single" are used.

[0031] FIG. 1 is a schematic diagram illustrating a charged particle beam device according to an embodiment of the present invention.

[0032] Referring to FIG. 1, a charged particle beam device (100) may be provided. According to one embodiment, the charged particle beam device (100) may include a plurality of columns (110), a chamber (120), a stage (123) supporting a sample (121) within the chamber (120), a stage driving device (125), a vacuum pump (130) connected to the chamber (120), a detector (115) for detecting electrons emitted from the sample (121), a column control unit (135), a control unit (101), and a display (180). According to one embodiment, the charged particle beam device (100) may include a shielding cover (112) surrounding each of the plurality of columns (110). In some embodiments, the charged particle beam device (100) may omit at least one of the above-described components or additionally include other components (e.g., a sample transfer module).

[0033] In the present disclosure, the x direction and the y direction may be intersecting directions. For example, the x direction and the y direction may be orthogonal to each other. In the present disclosure, the x direction may be the direction of movement of the stage (123) supporting the sample (121). The y direction may be the direction in which the electron beam scans along the surface of the sample (121) (scanning direction). The z direction may be a direction perpendicular to the x direction and the y direction, and may be the direction in which the electron beam is incident on the sample (121) (beam incident direction).

[0034] According to one embodiment, the chamber (120) may provide an inspection space for inspecting a sample (121). The inspection space may be maintained in a vacuum state. The inspection space may be maintained in a vacuum state by a vacuum pump (130). In other words, the interior of the chamber (120) may be maintained in a vacuum state by a vacuum pump (130).

[0035] According to one embodiment, a sample (121) may be placed within a chamber (120). More specifically, the sample (121) may be placed on a stage (123) within the chamber (120). In this specification, the sample (121) may be understood as a concept including a photomask, a reticle, a wafer, etc. However, it is not limited thereto, and the sample (121) may include various objects or elements that are subject to inspection or analysis.

[0036] According to one embodiment, the charged particle beam device (100) may include a plurality of columns (110). For example, the charged particle beam device (100) may include a plurality of columns (110) to improve the speed of inspection or analysis. In this specification, a column may be referred to as an electron beam column.

[0037] According to one embodiment, at least some of each of the plurality of columns (110) may be located within the chamber (120). Each of the plurality of columns (110) may irradiate an electron beam toward a sample (121) on a stage (123). The columns (110) may irradiate the sample (121) with an electron beam to charge a specific area of ​​the sample (121), for example, a metal pattern (electrode), a chromium layer, or an insulating substrate. Generally, if the secondary electron yield is greater than 1, the corresponding area of ​​the irradiated sample (121) may be charged with a positive charge (+). Alternatively, if the secondary electron yield is less than 1, the corresponding area of ​​the irradiated sample (121) may be charged with a negative charge (-).

[0038] According to one embodiment, the column (110) can irradiate a scanning electron beam toward a sample (121) on a stage (123), and a specific region of the charged sample (121) can be scanned again by the scanning electron beam. Through this, the charged particle beam device (100) can precisely identify specific defects in the sample (121) by analyzing local potential changes and differences in emitted electron yields due to charge accumulation.

[0039] According to one embodiment, a plurality of columns (110) may be arranged spaced apart at regular intervals along one direction. Here, one direction may refer to a direction that forms a predetermined angle with the x direction and the y direction. Specific details regarding the arrangement of the plurality of columns (110) will be described below with reference to FIGS. 7 and FIGS. 8.

[0040] Meanwhile, although four columns (110) are shown arranged in FIG. 1, this is not limited thereto. In other words, the number of columns (110) can be varied. At this time, each of the columns (110) can generate an electron beam and scan it toward the sample (121).

[0041] According to one embodiment, the shielding cover (112) may surround each of the plurality of columns (110). According to one embodiment, the shielding cover (112) may include an alloy having high permeability or a material capable of magnetic shielding. For example, the shielding cover (112) may include permalloy. For example, the shielding cover (112) may be composed of permalloy foil, but is not limited thereto.

[0042] Here, permalloy generally refers to a high-permeability alloy having nickel (Ni) and iron (Fe), and may refer to an ultra-high-permeability material having high permeability, wear resistance, malleability, and ductility. However, it is not limited thereto, and the shielding cover (112) may include various materials having electromagnetic shielding performance.

[0043] According to one embodiment, the stage (123) may be located within the chamber (120). According to one embodiment, the stage (123) may be located below the columns (110). Specifically, the stage (123) may be positioned spaced apart from the ends of the columns (110) to support a sample (121). The sample (121) may be placed on the upper surface of the stage (123).

[0044] According to one embodiment, the stage (123) may include a chuck, etc. for fixing a sample (121). For example, the stage (123) may include an electrostatic chuck (ESC) that fixes the sample (121) by electrostatic force or a vacuum chuck that fixes the sample (121) by vacuum pressure.

[0045] According to one embodiment, the stage (123) can move in a horizontal direction (e.g., x direction) relative to the column (110). Accordingly, the sample (121) on the stage (123) can also move in a horizontal direction (e.g., x direction) relative to the column (110).

[0046] According to one embodiment, the stage driving device (125) can move the stage (123). For example, the stage driving device (125) can move the stage (123) on which the sample (121) is placed in a horizontal direction (e.g., x direction).

[0047] According to one embodiment, the column control unit (135) can control a plurality of columns (110). Specifically, the column control unit (135) can control each or all of the plurality of columns (110).

[0048] According to one embodiment, the column control unit (135) can control the power of each of the plurality of columns (110). For example, the column control unit (135) can control the power of at least some of the plurality of columns (110) to be on and control the power of other some to be off as needed. In addition, for example, the column control unit (135) can control the power of all of the plurality of columns (110) to be on or off.

[0049] For example, the column control unit (135) can control the angle of the electron beam that the column (110) scans, the secondary electron yield, and / or the irradiation time. Additionally, the column control unit (135) can control the path of the electron beam that the column (110) scans.

[0050] According to one embodiment, the detector (115) can detect emitted electrons and / or backscatter electrons emitted from the sample (121) by an electron beam. In the following specification, emitted electrons may be referred to as secondary electrons.

[0051] According to one embodiment, the detector (115) may be installed within the columns (110). However, it is not limited thereto, and the detector (115) may also be installed within the chamber (120). Since the amount of emitted secondary electrons and backscattered electrons may vary depending on the type of sample (121) to be inspected, and the intensity and angle of the electron beam injected into the sample (121), the detector (115) may detect either the secondary electrons or the backscattered electrons, or detect both simultaneously.

[0052] According to one embodiment, the detector (115) can transmit information about secondary electrons and / or backscattered electrons to the control unit (101).

[0053] According to one embodiment, the control unit (101) can control the column control unit (135), the detector (115), and / or the stage drive unit (125). For example, the control unit (101) can control each component so that the column control unit (135), the detector (115), and / or the stage drive unit (125) perform the operations described above.

[0054] According to one embodiment, the control unit (101) can obtain information about secondary electrons from the detector (115). According to one embodiment, the control unit (101) can generate image and / or numerical data based on the secondary electron information obtained from the detector (115). For example, the control unit (101) can generate a Voltage Contrast Image (VC image) based on the obtained secondary electron information. Alternatively, the control unit (101) can generate numerical data by quantitatively analyzing the amount of secondary electrons detected by the detector (115). In other words, the control unit (101) can process the secondary electron signal received by the detector (115) to generate not only an SEM image but also numerical data regarding the amount of secondary electrons.

[0055] Here, the SEM image may be a grayscale image, but is not limited thereto. Here, a grayscale image refers to an image expressed in grayscale. For example, a single pixel can have an integer value between 0 and 255. Here, 0 corresponds to black and 1 corresponds to white. In this case, if the total 256 integer values ​​that a single pixel can have are expressed in 256 levels of brightness, it becomes a color image, and if the total 256 integer values ​​that a single pixel can have are expressed in 8 levels of brightness, it becomes a grayscale image. The higher the gray level of the SEM image, the brighter the brightness may be.

[0056] According to one embodiment, the display (180) may be operatively connected to the control unit (101). The display (180) may visually provide data generated by the control unit (101) to the user. Specifically, the display (180) may visually provide various data related to defects in the sample (121) to the user. For example, the display (180) may output image data generated by the control unit (101). Details regarding this will be described later with reference to FIG. 2.

[0057] Meanwhile, although not illustrated, a charged particle beam device (100) according to one embodiment may further include a sample transfer module (not illustrated). According to one embodiment, the sample transfer module (not illustrated) can transfer a sample (121) into the chamber (120). By transferring the sample (121) into the chamber (120) using the sample transfer module (not illustrated), contamination of the sample (121) can be prevented and the accuracy of alignment of the sample (121) can be improved.

[0058] FIG. 2 is a block diagram of a charged particle beam device (100) according to an embodiment of the present invention.

[0059] Referring to FIG. 2, a charged particle beam device (100) according to one embodiment may include a control unit (101) and a display (180) connected to the control unit (101).

[0060] According to one embodiment, the control unit (101) may include at least one processor (150), a memory (160), and a communication circuit (170). According to one embodiment, the charged particle beam device (100) may further include a display (180). In some embodiments, the charged particle beam device (100) may omit at least one of the components described above or additionally include other components.

[0061] According to one embodiment, the processor (150) can control the overall operation of the charged particle beam device (100). The processor (150) may include an accelerator, which is a dedicated circuit for data computation. The accelerator may be a functional block that specializes in performing specific functions of the processor (150). The accelerator may include a Graphic Processing Unit (GPU), a Neural Processing Unit (NPU), or a Data Processing Unit (DPU). The GPU may be a block that specializes in processing graphic data. The NPU may be a block that specializes in performing AI computation and inference. The DPU may be a block that specializes in data transmission.

[0062] According to one embodiment, the processor (150) can execute instructions stored in memory (160). The processor (150) can execute applications stored in memory (160). Each application may be a set of instructions. By executing instructions stored in memory (160), the processor (150) can cause the charged particle beam device (100) to perform the operations described below. The operations described below as being performed by the processor (150) may be understood as being performed by the charged particle beam device (100) because they may be performed by the processor (150) and / or at least one other component of the charged particle beam device (100) connected to the processor (150).

[0063] According to one embodiment, the memory (160) can store data used or received by at least one component of the charged particle beam device (100) (e.g., processor (150), communication circuit (170), display (180)). The memory (160) can store instructions executed by at least one processor (150).

[0064] According to one embodiment, the memory (160) may store instructions for executing a method of analyzing (or inspecting) defects in a sample (e.g., sample (121) of FIG. 1). For example, the memory (160) may store instructions for executing a method of correcting an image of the surface of the sample (121). Also, for example, the memory (160) may store instructions for executing a method of analyzing an image of the surface of the sample (121). The instructions may be stored in the memory (160) as code of a computer program.

[0065] According to one embodiment, the memory (160) may store one or more artificial intelligence (or neural network) models and data sets used for training said models. For example, the learning algorithms used by the artificial intelligence models may include various algorithms such as supervised, unsupervised, semi-supervised, and reinforcement learning. Additionally, the artificial intelligence models may include multiple artificial neural network layers, and may use, for example, deep neural networks, CNNs, RNNs, RBMs, DBNs, BRDNNs, deep Q-networks, or combinations thereof, but are not limited to the examples described above.

[0066] According to one embodiment, the memory (160) can store data transmitted and received through the communication circuit (170). For example, the memory (160) can store information about secondary electrons received from the detection unit (e.g., the detector (115) of FIG. 1) through the communication circuit (170).

[0067] According to one embodiment, the memory (160) can store data generated by the processor (150). For example, the memory (160) can store numerical data regarding SEM images and / or the amount of secondary electrons generated by the processor (150).

[0068] In some embodiments, the memory (160) may be implemented as a non-volatile memory such as ROM (Read-Only Memory), MRAM (Magnetic RAM), SpinTransfer Torque MRAM (SpinTransfer Torque MRAM), Conductive Bridging RAM (CBRAM), FeRAM (Ferroelectric RAM), PRAM (Phase RAM), Resistive RAM, etc. However, it is not limited thereto.

[0069] In other embodiments, the memory (160) may be implemented as a volatile memory such as DRAM (Dynamic Random-Access Memory), SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate SDRAM), LPDDR SDRAM (Low Power Double Data Rate SDRAM), GDDR SDRAM (Graphics Double Data Rate SDRAM), DDR2 SDRAM, DDR3 SDRAM, DDR4 SDRAM, DDR5 SDRAM, etc. However, it is not limited thereto.

[0070] According to one embodiment, the communication circuit (170) can support the establishment of a wired or wireless communication channel between the control unit (101) and an external electronic device, and the performance of communication through the established communication channel. For example, the processor (150) can obtain data related to a secondary battery emitted from a sample (121) through the communication circuit (170). Specifically, the control unit (101) can obtain data related to a secondary battery from a detector (115) through the communication circuit (170).

[0071] According to one embodiment, the communication circuit (170) may include a wireless communication module (e.g., a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module (e.g., a LAN (local area network) communication module, or a power line communication module).

[0072] According to one embodiment, the processor (150) can communicate with an external electronic device through a first network (e.g., a short-range communication network such as Bluetooth, WiFi Direct, or IrDA (infrared data association)) or a second network (e.g., a cellular network, the Internet, or a long-range communication network such as a computer network (e.g., a LAN or WAN)) using a communication circuit (170). The various types of communication circuits (170) described above may be implemented as a single chip or each as a separate chip.

[0073] According to one embodiment, the display (180) may display information processed on the display (180) under the control of the processor (150). For example, the display (180) may display various content (e.g., text, images, videos, icons, and / or symbols). According to one embodiment, the display (180) may include a liquid crystal display (LCD), a light-emitting diode (LED) display, or an organic light-emitting diode (OLED) display.

[0074] According to one embodiment, the display (180) may include, for example, a touch screen and may receive touch, gesture, proximity, or hovering input using an electronic pen or a part of the user's body. In this case, the display (180) may also be used as an input device, but is not limited thereto. In some embodiments, the charged particle beam device (100) may include a separate input device.

[0075] According to one embodiment, the display (180) can visually provide various information to the user of the charged particle beam device (100). According to one embodiment, the display (180) can display image data obtained by the columns (110) scanning the surface of the sample (121).

[0076] According to one embodiment, the display (180) can output each image data scanned using a plurality of columns (110) together. In other words, the display (180) can simultaneously output a plurality of image data scanned using a plurality of columns (110). However, it is not limited thereto, and the display (180) may also output each image data scanned using a plurality of columns (110) separately.

[0077] According to one embodiment, the display (180) can display data processed by the processor (150). According to one embodiment, the display (180) can display a graphic user interface (GUI) indicating the result of determining whether the sample (121) is defective after the defect of the sample (121) is analyzed by the processor (150).

[0078] According to one embodiment, the display (180) may display a surface image of the sample (121) and data related to defects of the sample (121) together. For example, the display (180) may display the surface image of the sample (121) and data related to defects of the sample (121) superimposed, but is not limited thereto, and the display form may be changed according to various embodiments.

[0079] FIG. 3 is a cross-sectional view of one electron beam column included in a charged particle beam device according to an embodiment of the present invention.

[0080] Referring to FIG. 3, the column (110) may include an electron gun (111), a shielding cover (112), a focusing lens (113), a detector (115), an objective lens (117), and a deflector (119).

[0081] According to one embodiment, a shielding cover (112) can wrap around a column (110). As illustrated in FIG. 1, each of the plurality of shielding covers (112) can wrap around each of the plurality of columns (110). In other words, the shielding covers (112) can be placed independently for the plurality of columns (110). That is, a shielding cover (112) can be applied individually to each column (110), thereby minimizing interference between each column (110).

[0082] According to one embodiment, the shielding cover (112) can provide a beam generating space. The shielding cover (112) can protect the electron gun (111), focusing lens (113), and objective lens (117), etc., from external interference.

[0083] According to one embodiment, the shielding cover (112) can perform an electromagnetic shielding function. The shielding cover (112) can reflect or absorb electromagnetic waves to prevent the electron beam inside the column (110) from being affected by external interference. In addition, the shielding cover (112) can prevent static electricity from entering from the outside, thereby enabling stable operation of the column (110).

[0084] As described above, the shielding cover (112) according to the present invention provides an independent shielding function for each column (110) in a multi-column structure, thereby minimizing electron beam interference and supporting precise analysis.

[0085] In addition, as described above, the shielding cover (112) according to the present invention can improve the convenience of maintenance by independently separating each column (110) in a multi-column structure.

[0086] According to one embodiment, the electron gun (111) may be located within a beam generating space provided by a shielding cover (112). The electron gun (111) may irradiate an electron beam onto a sample (121). The sample (121) may be located on a stage (123). For example, the sample (121) may include a photomask, a reticle, or a wafer, but is not limited thereto.

[0087] According to one embodiment, the electron gun (111) can generate and accelerate electrons. The electron gun (111) may include a filament made of a metal such as tungsten. When the electron gun (111) heats the filament to a high temperature, electrons bound to atoms on the surface of the filament can be emitted into a vacuum.

[0088] According to one embodiment, an electron beam emitted from an electron gun (111) can pass through a focusing lens (113) and a deflector (119) and move outside of a shielding cover (112). Additionally, the electron gun (111) may include an accelerating electrode (not shown), and the accelerating electrode can accelerate electrons emitted from a filament using a high voltage. The accelerated electron beam then passes through a focusing lens (113) and an objective lens (117) and can be precisely irradiated onto a sample (121).

[0089] According to one embodiment, a condenser lens (113) may be located at the bottom of an electron gun (111). The condenser lens (113) can concentrate an electron beam emitted from the electron gun (111) into a narrow area. The condenser lens (113) may include a cylindrical shape, but is not limited thereto. The condenser lens (113) may include an electromagnet and / or a capacitor. The condenser lens (113) can control the direction of travel of the electron beam by utilizing the Lorentz force received by the electron beam moving within a magnetic field.

[0090] According to one embodiment, it may include a first focusing lens (113a) that primarily focuses a generated and accelerated electron beam and a second focusing lens (113b) that secondarily focuses an electron beam focused from the first focusing lens (113a). Here, the diameter of the electron beam focused by the second focusing lens (113b) may be smaller than the diameter of the electron beam focused by the first focusing lens (113a). Through this, the diameter of the focused electron beam can be reduced to the level of tens of nanometers.

[0091] According to one embodiment, the detector (115) can detect and output a secondary electron beam emitted in correspondence with the pattern of the sample (121) when the electron beam is irradiated onto the sample (121). According to one embodiment, the detection signal obtained by the detector (115) can be transmitted to a control unit (e.g., the control unit (101) of FIGS. 1 and 2).

[0092] According to one embodiment, the objective lens (117) can focus the electron beam focused through the focusing lens (113) onto the sample (121). For example, the objective lens (117) can determine the size of the electron beam irradiated onto the sample (121) and can be positioned close to the surface of the sample (121) to have a short focal length to create an electron beam with a small diameter. That is, the shorter the distance between the objective lens (117) and the surface of the sample (121), the smaller the spot of the electron beam can be formed. In this way, the objective lens (117) can control the resolution (i.e., magnification) of the sample image by controlling the diameter of the electron beam.

[0093] According to one embodiment, the deflector (119) can adjust the scanning angle and scanning direction of the electron beam so that the electron beam can be scanned by scanning the surface of the sample (121). For example, when current is applied to the deflector (119), the electron beam can move in the y-direction and be scanned on the surface of the sample (121). Specifically, the degree of bending of the electron beam can be adjusted according to the magnitude of the current applied to the deflector (119), and the direction of bending of the electron beam can be adjusted according to the direction of the applied current. Thus, the scanning angle and scanning direction of the electron beam can be adjusted by adjusting the magnitude and direction of the current applied to the deflector (119). The deflector (119) may include, for example, an electromagnet and / or a capacitor. However, it is not limited thereto, and the deflector (119) may include other structures capable of changing the path of the electron beam.

[0094] FIG. 4 is a perspective view of one electron beam column included in a charged particle beam device according to an embodiment of the present invention.

[0095] Referring to FIG. 4, a charged particle beam device (e.g., the charged particle beam device (100) of FIG. 1) may include a plurality of columns (110), and each of the columns (110) may have the shape of a hexagonal prism. For example, if the housing of the plurality of columns (110) is a shielding cover (112), each column (110) may have the shape of a hexagonal prism. Or, for example, if the shielding cover (112) is separated from the housing of the columns (110) and surrounds the columns (110), the shielding cover (112) may have the shape of a hexagonal prism.

[0096] For convenience of explanation, in FIG. 4, each column (110) is described as having a hexagonal column shape.

[0097] According to one embodiment, a column (110) in the shape of a hexagonal prism can maximize space utilization and provide optimal placement efficiency in a multi-column system in which a plurality of columns (110) are integrated, while simultaneously improving structural stability. This is because the hexagon has a geometric characteristic that allows it to be arranged at a higher density than a circle or a square relative to the same area.

[0098] Specifically, since each of the multiple columns (110) has a hexagonal column shape, the spacing between the electron beams scanned by the columns (110) can be maintained more widely compared to having circular or square column shapes of the same size. Accordingly, cross-talk between the columns (110) is reduced while the electron beam scans the sample surface, and signal distortion can be minimized, thereby enabling more precise inspection and analysis.

[0099] Furthermore, the symmetrical structure of the hexagonal prism shape enhances the physical stability of multi-column systems and minimizes structural deformation caused by external environments (e.g., temperature changes or vibrations). This can be an important factor in improving the reliability of charged particle beam devices that perform high-resolution imaging and precise patterning.

[0100] Hereinafter, with reference to FIGS. 5 and FIGS. 6, the planar shape of each of the columns (110) will be described in more detail later.

[0101] In addition, as described below, a plurality of columns (110) according to the present invention each have a hexagonal column shape and can be arranged in a honeycomb structure. The honeycomb structure utilizes the geometric characteristics of a hexagon to secure maximum density with minimal wasted space, while simultaneously providing the advantage of effectively reducing interference between columns (110). Specific details related to this will be described below with reference to FIGS. 7 and FIGS. 8.

[0102] FIG. 5 is a plan view of one electron beam column included in a charged particle beam device according to an embodiment of the present invention.

[0103] Referring to FIG. 5, each of the plurality of columns (110) (e.g., columns (110) of FIG. 1) included in a charged particle beam device (e.g., charged particle beam device (100) of FIG. 1) according to one embodiment may have a first hexagonal shape (500) in a planar plane. Or, for example, if a shielding cover (e.g., shielding cover (112) of FIG. 1) is separated from the housing of the columns (110) and surrounds the columns (110), the shielding cover (112) may have a first hexagonal shape (500) in a planar plane.

[0104] For convenience of explanation, in FIG. 5, each column (110) is described as having a hexagonal column shape.

[0105] According to one embodiment, the first hexagonal shape (500) may include six sides. Specifically, the first hexagonal shape (500) may be composed of first sides (5a) facing each other side by side, and second sides (5b) and third sides (5c) connecting the first sides (5a).

[0106] In the first hexagonal shape (500), a first imaginary line (501) may be established that is positioned parallel to the first side (5a) and passes through the center (510) of the column (110), and the second side (5b) and the third side (5c) may be symmetrical with respect to the first imaginary line (501). That is, the first hexagonal shape (500) may form a symmetrical structure with respect to the first imaginary line (501). Here, the center (510) of the column (110) corresponds to the position where the electron beam passes.

[0107] According to one embodiment, the first side (5a) may have a first length (d11), the second side (5b) may have a second length (d12), and the third side (5c) may have a third length (d13). According to one embodiment, the second length (d12) may be different from the first length (d11) and identical to the third length (d13). In other words, the first length (d11) may be different from the second length (d12) and the third length (d13), and the second length (d12) and the third length (d13) may be identical to each other.

[0108] According to one embodiment, the first angle (a1) between the first side (5a) and the second side (5b) may be different from the second angle (b1) between the second side (5b) and the third side (5c).

[0109] As a plurality of columns (110) according to an embodiment of the present invention have the first hexagonal shape (500) described above on a plane, the arrangement between the columns (110) can be optimized. In addition, accordingly, the integration density in a multi-column system can be maximized and inter-beam interference phenomena can be minimized.

[0110] FIG. 6 is a plan view of one electron beam column included in a charged particle beam device according to an embodiment of the present invention.

[0111] Referring to FIG. 6, each of the plurality of columns (110) (e.g., columns (110) of FIG. 1) included in a charged particle beam device (e.g., charged particle beam device (100) of FIG. 1) according to one embodiment may have a second hexagonal shape (600) in a planar plane. Or, for example, if a shielding cover (e.g., shielding cover (112) of FIG. 1) is separated from the housing of the columns (110) and surrounds the columns (110), the shielding cover (112) may have a second hexagonal shape (600) in a planar plane.

[0112] For convenience of explanation, in FIG. 6, each column (110) is described as having a hexagonal column shape.

[0113] According to one embodiment, the second hexagonal shape (600) may include six sides. The second hexagonal shape (600) may be a regular hexagon. Specifically, the second hexagonal shape (600) may be composed of fourth sides (6a) facing each other, and fifth sides (6b) and sixth sides (6c) connecting the fourth sides (6a).

[0114] In the second hexagonal shape (600), a second imaginary line (601) may be established that is positioned parallel to the fourth side (6a) and passes through the center (610) of the column (110), and the fifth side (6b) and the sixth side (6c) may be symmetrical with respect to the second imaginary line (601). That is, the second hexagonal shape (600) may form a symmetrical structure with respect to the second imaginary line (601). Here, the center (610) of the column (110) corresponds to the position where the electron beam passes.

[0115] According to one embodiment, the fourth side (6a) may have a fourth length (d21), the fifth side (6b) may have a fifth length (d22), and the sixth side (6c) may have a sixth length (d23). According to one embodiment, the fourth length (d21), the fifth length (d22), and the sixth length (d23) may all be the same as each other. According to one embodiment, the third angle (a2) between the fourth side (6a) and the fifth side (6b) may be the same as the fourth angle (b2) between the fifth side (6b) and the sixth side (6c).

[0116] As a plurality of columns (110) according to an embodiment of the present invention have the second hexagonal shape (600) described above on a plane, the arrangement between the columns (110) can be optimized. In addition, accordingly, the integration density in a multi-column system can be maximized and inter-beam interference phenomena can be minimized.

[0117] FIG. 7 is a drawing showing a plurality of column assemblies included in a charged particle beam device according to an embodiment of the present invention.

[0118] Referring to FIG. 7, a charged particle beam device according to one embodiment of the present invention (e.g., the charged particle beam device (100) of FIG. 1) may include a first assembly (700) composed of a plurality of columns (710). Here, the first assembly (700) may refer to a structure in which a plurality of columns (710) are integrated along a specific arrangement pattern.

[0119] According to one embodiment, the first assembly (700) may be composed of columns (710) arranged in a honeycomb shape. The honeycomb arrangement provides a geometrically optimized structure that allows the maximum number of columns to be placed within the same area, and may have the effect of minimizing crosstalk between columns (710) and improving beam quality.

[0120] Additionally, the centers (720) of the columns (710) can be arranged at regular intervals along the first direction (701). In other words, the columns (710) can be arranged at regular intervals along the first direction (701). Accordingly, when the charged particle beam device (100) is in operation, a uniform beam spacing can be maintained during the scanning and irradiation process of the electron beam.

[0121] According to one embodiment, the first direction (701) may form an acute angle with the x direction. Additionally, the first direction (701) may form an acute angle with the y direction. Here, the x direction may be the direction of movement of the stage (e.g., the stage (123) of FIG. 1) supporting the sample (e.g., the sample (121) of FIG. 1). The y direction may be the direction in which the electron beam scans along the surface of the sample (121) (scanning direction).

[0122] According to one embodiment, the columns (710) are not simply arranged in series along the x direction or the y direction, but are arranged along a first direction (701) that forms an acute angle with the x direction and the y direction, thereby forming an optimized arrangement structure.

[0123] Specifically, the first assembly (700) according to the present invention has a honeycomb structure and an aligned arrangement method in the first direction (701), so that as many columns (710) as possible can be arranged within the same area, while maximizing the spacing between beams scanned by individual columns.

[0124] FIG. 8 is a drawing showing a plurality of column assemblies included in a charged particle beam device according to an embodiment of the present invention.

[0125] Referring to FIG. 8, when a shielding cover (830) (e.g., shielding cover (112) of FIG. 1) is separated from the housing of columns (810) (e.g., columns (110) of FIG. 1) and surrounds the columns (810), the charged particle beam device (e.g., charged particle beam device (100) of FIG. 1) may include a second assembly (800) composed of a plurality of shielding covers (830). Here, the second assembly (800) may refer to a structure in which a plurality of shielding covers (830) are integrated along a specific arrangement pattern.

[0126] According to one embodiment, the second assembly (800) may be composed of a plurality of shielding covers (830) arranged in a honeycomb shape. According to one embodiment, a plurality of columns (810) may each be mounted within the shielding covers (830). In FIG. 8, each of the plurality of columns (810) is shown to have a circular shape in a planar shape, but is not limited thereto and can be varied in many ways.

[0127] The honeycomb-shaped arrangement of the second assembly (800) provides a geometrically optimized structure that allows the maximum number of columns to be arranged within the same area, and can have the effect of minimizing cross talk between columns (810) and improving beam quality.

[0128] Additionally, the centers (820) of the shielding covers (830) can be arranged at regular intervals along the second direction (801). In other words, the shielding covers (830) can be arranged at regular intervals along the second direction (801). Since a plurality of columns (810) are each mounted within the shielding covers (830), a uniform beam spacing can be maintained during the scanning and irradiation processes of the electron beam when the charged particle beam device (100) is in operation.

[0129] According to one embodiment, the second direction (801) may form an acute angle with the x direction. Additionally, the second direction (801) may form an acute angle with the y direction. Here, the x direction may be the direction of movement of the stage (e.g., the stage (123) of FIG. 1) supporting the sample (e.g., the sample (121) of FIG. 1). The y direction may be the direction in which the electron beam scans along the surface of the sample (121) (scanning direction).

[0130] According to one embodiment, the columns (810) are not simply arranged in series along the x direction or the y direction, but are arranged along a second direction (801) that forms an acute angle with the x direction and the y direction, thereby forming an optimized arrangement structure.

[0131] Specifically, the second assembly (800) according to the present invention has a honeycomb structure and an aligned arrangement method in the second direction (801), so that as many columns (810) as possible can be arranged within the same area, while maximizing the spacing between beams scanned by individual columns.

[0132] FIG. 9 is a diagram illustrating scanning an inspection area of ​​a sample in a conventional charged particle beam device. FIG. 10 is a diagram illustrating scanning an inspection area of ​​a sample in a charged particle beam device according to an embodiment of the present invention. In FIG. 9 and FIG. 10, the x direction is the direction of movement of the stage, and the y direction is the scanning direction.

[0133] Additionally, in FIGS. 9 and 10, the sample (121) may include a substrate used in various semiconductor processes, such as a photomask, reticle, or wafer. It can be understood that the sample (121) shown in FIG. 9 and the sample (121) shown in FIG. 10 have the same area.

[0134] Referring to FIG. 9, the columns of a conventional charged particle beam device may not have a hexagonal prism shape. That is, the shape of each column may be cylindrical, rectangular, or have other modified structures.

[0135] Accordingly, a conventional charged particle beam device uses a first column array (900) in which a plurality of columns are arranged in a collinear array. Specifically, the conventional charged particle beam device inspects a sample (121) by irradiating a first electron beam (910) using the first column array (900) and scanning a first inspection area (905).

[0136] For example, as illustrated in FIG. 9, the first column array (900) may be configured as a 4 x 6 array to inspect a sample (121) in a conventional charged particle beam device. In other words, 24 columns are arranged to inspect the first inspection area (905) in a conventional charged particle beam device. However, this is merely an example, and the first column array (900) may be configured as an m x n array (m and n are natural numbers) and may be varied depending on the area of ​​the sample (121).

[0137] Referring to FIG. 10, the columns of the charged particle beam device according to the present invention (e.g., the charged particle beam device (100) of FIG. 1) may have a hexagonal column shape. That is, the columns of the charged particle beam device (100) may each have a hexagonal shape in a plane.

[0138] Accordingly, the charged particle beam device (100) uses a second column array (1000) in which a plurality of columns are arranged in a honeycomb structure. Specifically, the charged particle beam device (100) inspects a sample (121) by irradiating a second electron beam (1010) using the second column array (1000) and scanning a second inspection area (1005).

[0139] For example, as illustrated in FIG. 10, 14 columns are arranged to inspect a sample (121) in a charged particle beam device (100). However, this is merely an example, and the number of columns included in the second column array (1000) can be varied depending on the area of ​​the sample (121).

[0140] Referring to FIG. 9 and FIG. 10 together, as the columns of the charged particle beam device (100) according to the present invention have a hexagonal column shape, the number of columns required to inspect a sample (121) can be reduced. For example, while the first column array (900) includes 24 columns, the second column array (1000) may include 14 columns. As the number of columns is reduced, the volume and power consumption of the charged particle beam device (100) can be reduced.

[0141] Referring together to FIG. 9 and FIG. 10, as the second column array (1000) of the charged particle beam device (100) according to the present invention has a honeycomb arrangement, the spacing between electron beams can be increased. In the present disclosure, a large spacing between electron beams may mean a wide spacing between columns. For example, a first spacing (r1) between first electron beams (910) and a second spacing (r2) between second electron beams (1010) may be larger than the first spacing (r1). As the spacing between electron beams increases, electron beam interference phenomena are reduced, and inspection accuracy can be improved.

[0142] Referring to FIG. 9 and FIG. 10 together, as the spacing between the columns of the charged particle beam device (100) according to the present invention widens, the heat generated in each column can be evenly distributed. Accordingly, compared to conventional charged particle beam devices, the heat generation problem can be effectively controlled, making it possible to perform stable inspections for a long time.

[0143] As described above, the charged particle beam device (100) according to the present invention can achieve a stable structure by applying a honeycomb-shaped inclined array to the column array instead of a conventional orthogonal array to secure the spacing between beams. Through this, the integration density of the column array can be increased while minimizing cross-talk between beams.

[0144] FIG. 11 is a flowchart illustrating the operation method of a charged particle beam device according to one embodiment.

[0145] The operations described below can be performed by the charged particle beam device (100) of FIG. 1.

[0146] Each of the operations in FIG. 11 may be performed sequentially, but is not necessarily performed sequentially. For example, the order of the operations may be changed, and at least two operations may be performed in parallel. In some embodiments, some of the operations shown in FIG. 11 may be omitted, some operations may be integrated, some operations may be changed in order, or other operations may be added. Here, content that overlaps with the foregoing may be simplified or omitted.

[0147] Referring to FIG. 11, in operation 1110, a charged particle beam device according to one embodiment (e.g., the charged particle beam device (100) of FIG. 1) can designate a first area in a sample (e.g., the sample (121) of FIG. 1) to be inspected.

[0148] According to one embodiment, a charged particle beam device (100) can place and align a sample (121) on a stage (e.g., stage (123) of FIG. 1). Although not illustrated, the sample (121) can be placed and aligned on the stage (123) by a sample transfer module (not illustrated).

[0149] Subsequently, the charged particle beam device (100) may designate a first region according to user settings or select it as a Region of Interest (ROI) using an automatic analysis algorithm. For example, the charged particle beam device (100) may optimize the first region based on resolution, signal contrast, interaction characteristics with the electron beam, etc.

[0150] According to one embodiment, the charged particle beam device (100) can map the position of a first region based on a coordinate system inside the device. The charged particle beam device (100) may also automatically perform position correction by detecting minute deformation or deviation of the sample (121) during the scanning process.

[0151] In operation 1120, a charged particle beam device (100) according to one embodiment can control the power of at least some of a plurality of columns (e.g., columns (110) of FIG. 1) to turn on.

[0152] According to one embodiment, the charged particle beam device (100) can activate the electron beam by switching the power of at least some of the plurality of columns (110) to an on state. For example, the charged particle beam device (100) can automatically select a column (110) optimized for inspection. Also, for example, the charged particle beam device (100) can select a specific column based on user input. According to one embodiment, the charged particle beam device (100) can activate the selected column by supplying power to it.

[0153] According to one embodiment, the charged particle beam device (100) can control the power of all columns (110) to be turned on. The charged particle beam device (100) according to this embodiment can expand the scan range or improve the inspection speed by simultaneously using multiple columns (110) to inspect a sample (121).

[0154] According to some embodiments, the charged particle beam device (100) can control the power of some of the columns (110) to be turned on. For example, the charged particle beam device (100) can control the power of only some of the columns (110) to be turned on depending on specific inspection conditions or analysis purposes.

[0155] For example, if the charged particle beam device (100) determines that inspection or re-inspection is necessary for a second region corresponding to a specific region among the first regions, it may activate only the column (110) corresponding to the second region. Additionally, for example, the charged particle beam device (100) may activate only the necessary column (110) to minimize power consumption and heat generation. In this way, the number of columns (110) activated by the charged particle beam device (100) can be varied as needed.

[0156] In operation 1130, the first region can be scanned using columns (110) controlled to ON.

[0157] According to one embodiment, the charged particle beam device (100) can scan a designated first region using an activated column (110). According to one embodiment, the charged particle beam device (100) can determine a scanning method to move an electron beam within the first region.

[0158] Although not clearly illustrated, a charged particle beam device (100) according to one embodiment can utilize an electron lens and a deflection coil to precisely aim an electron beam and move the beam at a uniform speed along a designated first area. Additionally, a charged particle beam device (100) according to one embodiment can maintain optimal scanning conditions to effectively detect signals such as secondary electrons and backscattered electrons generated by the electron beam interacting with a sample (121).

[0159] According to some embodiments, the charged particle beam device (100) may adjust the scan path in real time or dynamically adjust the scan speed based on surface characteristics detected during inspection. Through this, the charged particle beam device (100) can precisely scan the first area to maximize inspection efficiency and secure optimal image quality.

[0160] In operation 1140, image data can be generated based on the signal obtained by scanning the first area.

[0161] According to one embodiment, the charged particle beam device (100) can acquire signals emitted from a sample (121). Specifically, the charged particle beam device (100) can detect various signals generated when an electron beam interacts with the surface of the sample (121). For example, the charged particle beam device (100) can detect signals such as secondary electrons, backscattered electrons, and X-rays.

[0162] According to one embodiment, the charged particle beam device (100) can generate image data based on the acquired signal. For example, the charged particle beam device (100) can convert the detected signal into digital image data and apply a noise removal filter to improve the signal-to-noise ratio (SNR). Additionally, for example, the charged particle beam device (100) can perform post-processing steps such as contrast adjustment, resolution enhancement, and pattern analysis on the acquired image data.

[0163] According to one embodiment, the charged particle beam device (100) may store the generated image data in a memory (e.g., the memory (160) of FIG. 2). However, it is not limited thereto, and the charged particle beam device (100) may also store the image data in an external storage device.

[0164] According to one embodiment, the charged particle beam device (100) can output the generated image data through a display (e.g., the display (180) of FIGS. 1 and FIGS. 2).

[0165] According to one embodiment, the charged particle beam device (100) can output image data corresponding to each scanned area using a plurality of columns (e.g., columns (110)) through a display (180).

[0166] For example, the charged particle beam device (100) can simultaneously output image data scanned individually by columns (110) through a display (180). Additionally, for example, the charged particle beam device (100) can configure multiple screens on the display (180) to display the data scanned by each column (110) individually, or integrate images obtained from multiple columns (110) into a single composite image and output it. Furthermore, the charged particle beam device (100) can selectively enlarge and output only the image data of a specific column (110) according to the user's settings.

[0167] As described above, the charged particle beam device (100) can enable more accurate and intuitive analysis by effectively displaying image data obtained from a plurality of columns (110) through a display (180).

[0168] FIG. 12 is a flowchart illustrating the operation method of a charged particle beam device according to one embodiment.

[0169] The operations described below can be performed by the charged particle beam device (100) of FIG. 1.

[0170] Each of the operations in FIG. 12 may be performed sequentially, but is not necessarily performed sequentially. For example, the order of the operations may be changed, and at least two operations may be performed in parallel. In some embodiments, some of the operations shown in FIG. 12 may be omitted, some operations may be integrated, some operations may be changed in order, or other operations may be added. Here, content that overlaps with the foregoing may be simplified or omitted.

[0171] Referring to FIG. 12, in operation 1210, a charged particle beam device according to one embodiment (e.g., the charged particle beam device (100) of FIG. 1) can move a sample (e.g., the sample (121) of FIG. 1) onto a stage (e.g., the stage (123) of FIG. 1).

[0172] According to one embodiment, the charged particle beam device (100) can move a sample (121) onto a stage (123). Although not illustrated, the charged particle beam device (100) can move the sample onto the stage (123) using a sample transfer module (not illustrated). The charged particle beam device (100) can perform position adjustment and alignment functions so that the sample (121) is accurately positioned in a predetermined direction and angle.

[0173] In operation 1220, the charged particle beam device (100) can move the stage to an inspection area.

[0174] According to one embodiment, the charged particle beam device (100) can move the stage (123) to an inspection area so that the sample (121) is placed in a position suitable for inspection. According to one embodiment, the charged particle beam device (100) can move the sample (121) to the inspection area by utilizing a stage driving device (e.g., the stage driving device (125) of FIG. 1).

[0175] According to one embodiment, the charged particle beam device (100) can monitor the movement status of the stage (123) in real time and automatically adjust the position by detecting an error.

[0176] In operation 1230, the charged particle beam device (100) can designate a first area in the sample (121) where an inspection is to be performed.

[0177] According to one embodiment, the charged particle beam device (100) may designate a specific area in the sample (121) where an inspection is to be performed as a first area. For example, the first area may be set directly by the user, or it may be selected as a Region of Interest (ROI) through an automatic analysis algorithm of the charged particle beam device (100).

[0178] According to one embodiment, the charged particle beam device (100) may designate a first region based on resolution, signal contrast, interaction characteristics with the electron beam, etc. According to some embodiments, the charged particle beam device (100) may designate a region with a high need for inspection as the first region by analyzing the surface characteristics of the sample (121).

[0179] In operation 1240, the charged particle beam device (100) can selectively control the power of a plurality of columns.

[0180] According to one embodiment, the charged particle beam device (100) can selectively control the power of some or all of the plurality of columns (110). For example, the charged particle beam device (100) may activate only the necessary columns (110) or activate all columns (110) simultaneously, depending on the inspection purpose.

[0181] According to one embodiment, the charged particle beam device (100) may select some columns (110) to optimize specific resolution or signal contrast. According to one embodiment, the charged particle beam device (100) may keep the power of some columns (110) off to reduce power consumption. As described above, the charged particle beam device (100) may dynamically adjust the power of the columns according to the inspection environment to provide optimal inspection conditions.

[0182] In operation 1250, the charged particle beam device (100) can scan a first region using a column (110) with the power controlled to be on.

[0183] According to one embodiment, the charged particle beam device (100) can scan a first region using a column (110) with the power controlled to be on. According to one embodiment, the charged particle beam device (100) can scan a designated first region at a uniform speed using an electron beam.

[0184] According to some embodiments, the charged particle beam device (100) may adjust the scan path in real time or automatically adjust the scan speed according to changes in the characteristics of the sample (121).

[0185] In operation 1260, the charged particle beam device (100) can scan a first area to acquire image data.

[0186] According to one embodiment, the charged particle beam device (100) can scan a first region to acquire image data. According to one embodiment, the charged particle beam device (100) can detect a signal emitted from a sample (121) and convert it into image data.

[0187] For example, the charged particle beam device (100) may apply a noise removal filter to improve the signal-to-noise ratio (SNR) and may also perform image contrast adjustment and resolution optimization. According to some embodiments, the charged particle beam device (100) may analyze the acquired data in real time.

[0188] In operation 1270, the charged particle beam device (100) can output image data through a display (e.g., the display (180) of FIG. 1).

[0189] According to one embodiment, the charged particle beam device (100) can output generated image data through a display (180). For example, the charged particle beam device (100) can display scanned image data in real time on the display (180) to support analysis by a user.

[0190] For example, the charged particle beam device (100) can output image data scanned individually by columns (110) simultaneously (or together) through a display (180). Additionally, for example, the charged particle beam device (100) can configure multiple screens on the display (180) to display the data scanned by each column (110) individually, or integrate images obtained from multiple columns (110) into a single composite image and output it. Furthermore, the charged particle beam device (100) can selectively enlarge and output only the image data of a specific column (110) according to the user's settings.

[0191] According to one embodiment, the charged particle beam device (100) may provide inspection results more intuitively by applying image zoom in / out functions, color enhancement processing, data overlay, etc. According to some embodiments, the charged particle beam device (100) may perform additional analysis based on data output on the display (180) or re-inspect a specific area based on user input.

[0192] FIG. 13 is a diagram illustrating an example of a computer device implementing a charged particle beam device according to one embodiment.

[0193] FIG. 13 is a drawing illustrating an example of a computer device implementing a charged particle beam device according to one embodiment. The charged particle beam device (100) of FIG. 1 can be implemented by the computer device (1300) shown in FIG. 13.

[0194] Referring to FIG. 13, the computer device (1300) may include memory (1310), a processor (1320), a communication interface (1330), and an input / output interface (1340).

[0195] Memory (1310) is a computer-readable recording medium and may include a non-perishable mass storage device such as RAM (random access memory), ROM (read only memory), and a disk drive. Additionally, an operating system and at least one program code may be stored in memory (1310). These software components may be loaded into memory (1310) from a computer-readable recording medium separate from memory (1310). This separate computer-readable recording medium may include a computer-readable recording medium such as a hard disk, flash memory, optical disk, or external hard disk. Additionally, these software components may be loaded into memory (1310) via a communication interface (1330).

[0196] The processor (1320) may be configured to process instructions of a computer program by performing basic arithmetic, logic, and input / output operations. Instructions may be provided to the processor (1320) via memory (1310) or a communication interface (1330).

[0197] A communication interface (1330) may provide a function for a computer device (1300) to communicate with another device through a network (1400). The communication method is not limited and may include communication methods utilizing a communication network (e.g., a mobile communication network, wired internet, wireless internet, or broadcasting network) that the network (1400) may include, as well as short-range wireless communication between devices. For example, the network (1400) may include any one or more networks such as a PAN (personal area network), LAN (local area network), CAN (campus area network), MAN (metropolitan area network), WAN (wide area network), BBN (broadband network), and the Internet. Additionally, the network (1400) may include any one or more network topologies such as a bus network, a star network, a ring network, a mesh network, a star-bus network, a tree or hierarchical network, but is not limited thereto.

[0198] The input / output interface (1340) can serve as an interface capable of transmitting commands or data input from a user or an input / output device (1350) to other component(s) of the computer device (1300). Additionally, the input / output interface (1340) can output commands or data received from other component(s) of the computer device (1300) to the user or the input / output device (1350). For example, the input / output device (1350) may include an input device such as a microphone, keyboard, or mouse, and the output device may include an output device such as a display or speaker.

[0199] The embodiments described above may be implemented in the form of a computer program that can be executed through various components on a computer, and such a program may be recorded on a computer-readable medium. In this case, the medium may include magnetic media such as hard disks, floppy disks, and magnetic tapes, optical recording media such as CD-ROMs and DVDs, magneto-optical media such as floptical disks, and hardware devices specifically configured to store and execute program instructions, such as ROM, RAM, flash memory, etc.

[0200] Unless there is an explicit description of the order of the steps constituting the method according to the embodiment or a description contrary to it, said steps may be performed in a suitable order. The present invention is not necessarily limited to the order in which said steps are described.

[0201] All examples or use of exemplary terms in this specification are merely for the detailed description of the invention and do not limit the scope of the invention. Furthermore, a person skilled in the art will understand that various modifications, combinations, and changes may be made within the scope of the claims or their equivalents.

[0202] Although embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements by those skilled in the art using the basic concept of the present invention as defined in the following claims also fall within the scope of the present invention. Explanation of the symbols

[0203] 100: Charged particle beam device 101: Control unit 110: Column 112: Shielding cover 115: Detector 120: Chamber 121: Sample 123: Stage 125: Stage drive unit 130: Vacuum pump 135: Column control unit 180: Display

Claims

Claim 1 A charged particle beam device comprising a plurality of columns each injecting an electron beam into a sample, a shielding cover surrounding each of the plurality of columns, a chamber including a stage coupled to the columns and spaced apart from the ends of the columns to support the sample, and a detector for detecting electrons emitted from the sample, wherein each of the plurality of columns has a polygonal shape in a planar shape. Claim 2 In claim 1, each of the plurality of columns is a charged particle beam device having a hexagonal shape in a plane. Claim 3 In paragraph 2, the hexagonal shape comprises first sides facing each other, second sides connecting the first sides, and third sides, wherein the second side and the third side are symmetrical with respect to an imaginary line parallel to the first side and passing through the center of the column, and the second side has a different length from the first side and the same length as the third side, in a charged particle beam device. Claim 4 A charged particle beam device according to claim 1, wherein the centers of the plurality of columns are spaced apart from each other at regular intervals along one direction, and said one direction forms an acute angle with the direction of movement of the stage. Claim 5 In paragraph 4, the plurality of columns are arranged in a honeycomb shape in a planar view of a charged particle beam device. Claim 6 A charged particle beam device according to claim 1, further comprising a control unit that is communicably connected to the detector, wherein the control unit generates image data related to defects in the sample based on data obtained from the detector. Claim 7 A charged particle beam device according to claim 6, further comprising a display, wherein the control unit outputs the image data through the display. Claim 8 A charged particle beam device comprising: a plurality of shielding covers each having a polygonal shape in a planar plane; a plurality of columns mounted within the shielding covers and each injecting an electron beam into a sample; a chamber including a stage coupled to the columns and spaced apart from the ends of the columns to support the sample; and a detector for detecting electrons emitted from the sample. Claim 9 In claim 8, each of the plurality of shielding covers is a charged particle beam device having a hexagonal shape in a plane. Claim 10 A charged particle beam device comprising a plurality of columns, each having a polygonal shape on a plane and each injecting an electron beam into a sample, wherein the device comprises a memory and a processor, wherein the memory stores instructions that, when executed by the processor, cause the charged particle beam device to designate a first area to be inspected in the sample, control the power of at least some of the plurality of columns to turn on, scan the first area using the columns controlled to turn on, and generate image data based on a signal obtained by scanning the first area.

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