electronic devices
Patent Information
- Application Number
- KR1020267025157
- Authority / Receiving Office
- KR · KR
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-01-17
- Publication Date
- 2026-09-18
Smart Images
Figure P1020267025157_ABST
Abstract
Description
Technology Field
[0001] The present disclosure relates to electronic devices. More specifically, it relates to electronic devices used in virtual reality (VR), augmented reality (AR), mixed reality (MR), extended reality (XR), etc. Background Technology
[0002] Virtual Reality (VR) refers to a specific environment or situation, or the technology itself, created using artificial technology that utilizes computing power and resembles reality but is not actually real.
[0003] Augmented Reality (AR) refers to a technology that superimposes virtual objects or information onto a real environment to make them appear as if they exist in the original environment.
[0004] Mixed Reality (MR) or Hybrid Reality refers to the creation of new environments or new information by combining the virtual world and the real world. In particular, it is called Mixed Reality when referring to the ability to interact in real time between things existing in the real world and the virtual world.
[0005] Extended Reality (XR) refers to the collective term for Virtual Reality (VR), Augmented Reality (AR), and Mixed Reality (MR).
[0006] Created virtual environments or situations stimulate the user's five senses and allow for spatial and temporal experiences similar to reality, thereby enabling free movement between reality and imagination. Users can not only simply immerse themselves in these environments but also interact with the elements implemented within them, such as by using actual devices to perform operations or issue commands.
[0007] Recently, active research is being conducted on the equipment (gear) used in these technology fields. The problem to be solved
[0008] The present disclosure aims to solve the aforementioned problems and other problems.
[0009] Another purpose may be to provide electronic devices used in VR (Virtual Reality), AR (Augmented Reality), MR (Mixed Reality), XR (eXtended Reality), etc.
[0010] Another purpose may be to provide the structure of electronic devices used in AR (Augmented Reality).
[0011] Another purpose may be to provide an ergonomic structure for electronic devices used in AR (Augmented Reality).
[0012] Another purpose may be to provide an ergonomic weight distribution structure for electronic devices used in AR (Augmented Reality).
[0013] Another objective may be to provide a user-wearable structure for electronic devices used in AR (Augmented Reality).
[0014] Another purpose may be to provide a temple hinge structure for electronic devices used in AR (Augmented Reality).
[0015] Another purpose may be to provide a heat dissipation structure for electronic devices used in AR (Augmented Reality). means of solving the problem
[0016] According to one aspect of the present disclosure for achieving the above or other purposes, an electronic device comprises: a front frame to which a light-transmitting display portion is coupled; and a temple that is extended and hinged to the front frame, wherein the front frame comprises: a PCB embedded in the front frame and extending from the front frame toward the temple; and a display panel embedded in the front frame at one side of the display portion and electrically connected to the PCB, wherein the temple comprises: a plurality of heat dissipation holes formed on the upper side of the temple and on the lower side of the temple and extending in a direction intersecting with the direction from the upper side toward the lower side of the temple; and a heat dissipation member coupled to at least one of the plurality of heat dissipation holes, wherein the heat dissipation member may be fixed to the inside of at least one of the plurality of heat dissipation holes. Effects of the invention
[0017] The effects of the electronic device according to the present disclosure are described as follows.
[0018] According to at least one of the embodiments of the present disclosure, an electronic device used in VR (Virtual Reality), AR (Augmented Reality), MR (Mixed Reality), etc. can be provided.
[0019] According to at least one of the embodiments of the present disclosure, a structure of an electronic device used in Augmented Reality (AR) can be provided.
[0020] According to at least one of the embodiments of the present disclosure, an ergonomic structure of an electronic device used in Augmented Reality (AR) can be provided.
[0021] According to at least one of the embodiments of the present disclosure, an ergonomic weight distribution structure for an electronic device used in Augmented Reality (AR) can be provided.
[0022] According to at least one of the embodiments of the present disclosure, a user-wearable structure for an electronic device used in Augmented Reality (AR) can be provided.
[0023] According to at least one of the embodiments of the present disclosure, a temple hinge structure for an electronic device used in Augmented Reality (AR) can be provided.
[0024] According to at least one of the embodiments of the present disclosure, a heat dissipation structure for an electronic device used in Augmented Reality (AR) can be provided.
[0025] Further scopes of the applicability of the present disclosure will become apparent from the following detailed description. However, since various changes and modifications within the spirit and scope of the present disclosure are clearly understood by those skilled in the art, specific embodiments, such as the detailed description and preferred embodiments of the present disclosure, should be understood as being given merely as examples. Brief explanation of the drawing
[0026] FIGS. 1 to 22 are drawings illustrating examples of electronic devices according to embodiments of the present disclosure. Specific details for implementing the invention
[0027] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components regardless of drawing symbols are given the same reference number, and redundant descriptions thereof will be omitted.
[0028] The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably solely for the ease of drafting the specification, and do not inherently possess distinct meanings or roles.
[0029] In addition, when describing the embodiments disclosed in this specification, if it is determined that a detailed description of related prior art may obscure the essence of the embodiments disclosed in this specification, such detailed description is omitted. Furthermore, the attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification, and the technical concept disclosed in this specification is not limited by the attached drawings; it should be understood that they include all modifications, equivalents, and substitutions that fall within the concept and technical scope of this disclosure.
[0030] Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.
[0031] When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. On the other hand, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between.
[0032] Singular expressions include plural expressions unless the context clearly indicates otherwise.
[0033] In this application, terms such as "comprising" or "having" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.
[0034] Referring to FIG. 1, the electronic device (100) may have the shape of glasses or goggles overall. The electronic device (100) may include a frame (110, 120) and a display unit (130).
[0035] The frame (110, 120) may include a front frame (110), a side frame (120), and a nose support (115). The front frame (110) may include a plurality of rims (111, 112), a bridge (113), and end pieces (116, 117). The bridge (113) may connect the first rim (111) and the second rim (112).
[0036] The shape of the opening of the rim (111, 112) may correspond to the shape of the display unit (130). For example, the display unit (130) may be coupled to or fixed to the opening of the rim (111, 112). The first end piece (117) may face the bridge (113) with respect to the first rim (111), and the second end piece (116) may face the bridge (113) with respect to the second rim (112). The front frame (110) may be symmetrical with respect to the bridge (113).
[0037] The side frame (120) can be attached to the front frame (110). The side frame (120) can be hinged to the end pieces (116, 117). For example, the first side frame (120a) can be hinged to the first end piece (117), and the second side frame (120b) can be hinged to the second end piece (116). The side frame (120) may include temples (121a, 121b) and temple tips (122a, 122b). The temples (121a, 121b) can be hinged to the end pieces (116, 117). The temple tips (122a, 122b) can be connected to the temples (121a, 121b) opposite the end pieces (116, 117) with respect to the temples (121a, 121b).
[0038] The nose pads (115a, 115b) may be attached to the bridge (113) or the rims (111, 112). For example, the first nose pad (115a) may be attached to the first rim (111) or the bridge (113), and the second nose pad (115b) may be attached to the second rim (112) or the bridge (113). Depending on the structure of the frame (110, 120), the nose pads (115a, 115b) may be omitted or formed integrally with the front frame (110). The nose pads (115a, 115b) may be movable up and down.
[0039] Referring to FIG. 2 together with FIG. 1, the electronic device (100) may include a main PCB (142) and a sub PCB (141). For example, the main PCB (142) and / or the sub PCB (141) may be a flexible circuit board (F-PCB). The sub PCB (141) may be extended and embedded in a frame (110, 120). For example, the sub PCB (141) may be embedded in a front frame (110), a second end piece (116), and / or a second side frame (120b). For another example, the sub PCB (141) may be embedded in a front frame (110), a first end piece (117), a second end piece (116), a first side frame (120a), and / or a second side frame (120b).
[0040] The main PCB (142) can be embedded in the frame (110, 120) and electrically connected to the sub PCB (141). For example, the main PCB (142) can be embedded in the first side frame (120a) and connected to the sub PCB (141).
[0041] The first battery (146a) is electrically connected to the main PCB (142) and can supply power to the main PCB (142). The second battery (146b) is electrically connected to the sub PCB (141) and can supply power to the sub PCB (141). The first speaker (145a) is electrically connected to the main PCB (142) and can output sound by receiving a signal from the main PCB (142). The second speaker (145b) is electrically connected to the sub PCB (141) and can output sound by receiving a signal from the sub PCB (141).
[0042] The first display engine (143a) and / or the second display engine (143b) may be electrically connected to the sub-PCB (141). The first display panel (144a) and / or the second display panel (144b) may be electrically connected to the sub-PCB (141). The first display engine (143a) may provide an image signal, a video signal, or a text signal to the first display panel (144a), and the second display engine (143b) may provide an image signal, a video signal, or a text signal to the second display panel (144b). For example, the display panels (144a, 144b) may be micro LED, OLED, or OLEDos (OLED on silicon). The display engine (143) and the display panel (144) may be referred to as an imaging module (143, 144) or an imaging engine (143, 144) or an image generator (143, 144) or a display module (143, 144).
[0043] The first display engine (143a) may be embedded in the first end piece (117), and the first display panel (144a) may be embedded in the first rim (111). The second display engine (143b) may be embedded in the second end piece (116), and the second display panel (144b) may be embedded in the second rim (112). The main camera (148) may be electrically connected to the sub-PCB (141) and mounted on the front frame (110). The main camera (148) may also be embedded in the first end piece (117) and / or the second end piece (116).
[0044] The main camera (148) may include an image camera (148a) and depth of field (DoF) cameras (148b, 148c). The image camera (148a) may acquire external image information through an imaging element. The depth cameras (148b, 148c) may sense the depth of a subject required for identification at the focal length of the image camera (148a) to improve the quality of the image information acquired by the image camera (148a). There may be multiple depth cameras (148b, 148c). The first depth camera (148b) may be mounted on the first end piece (117) and / or the front frame (110), and the second depth camera (148c) may be mounted on the second end piece (116) and / or the front frame (110). The image camera (148a) can acquire accurate image information through the dual depth cameras (148b, 148c).
[0045] Referring to FIG. 3 together with FIG. 2, the sub-PCB (141) may include a main line (141a), a first display connector (141b), a camera module connector (141d), a first display board (141c), a main board connector (141e), a second display connector (141f), a second display board (141g) and / or a sensor connector (141m).
[0046] The main line (141a) is extended and may have a width smaller than the width of the rims (111, 112) of the front frame (110, see FIG. 1). A first display connector (141b) may be connected to the main line (141a). A first display panel (144a) may be connected to the first display connector (141b). A first display engine (143a) including electronic components for image generation may be mounted on the first display board (141c). For example, an image processing processor, a T-CON board, etc. may be mounted on the first display board (141c).
[0047] The main camera (148) can be connected to the camera module connector (141d). The main board connector (141e) can extend from the first display board (141c) or the main line (141a). The main PCB (142) can be connected to the main board connector (141e).
[0048] The second display connector (141f) can be connected to the main line (141a). The second display panel (144b) can be connected to the second display connector (141f). A second display engine (143b) including electronic components for image generation can be mounted on the second display board (141g). For example, an image processing processor, a T-CON board, etc., can be mounted on the second display board (141g).
[0049] The sensor connector (141m) can be connected to the main line (141a). Sensors that detect the external environment can be connected to the sensor connector (141m). For example, the sensor (149) can be a light sensor.
[0050] The main board connector (141e) can be connected to the main line (141a) by the first hinge FPCB (141v).
[0051] The first display unit (131) may include a first upper frame (131c) and a first display lens (131a). The first display lens (131a) may be inserted into and fixed to the first opening (111a, see FIG. 1) in a shape corresponding to the first opening (111a, see FIG. 1) of the first rim (111, see FIG. 1). The first upper frame (131c) may cover the upper surface of the first display lens (131a) and be fixed to the first display lens (131a). The first upper frame (131c) may be coupled to the first rim (111).
[0052] The second display unit (132) may include a second upper frame (132c) and a second display lens (132a). The second display lens (132a) may be inserted into and fixed to the second opening (112a, see FIG. 1) in a shape corresponding to the second opening (112a, see FIG. 1) of the second rim (112, see FIG. 1). The second upper frame (132c) may cover the upper surface of the second display lens (132a) and be fixed to the second display lens (132a). The second upper frame (132c) may be coupled to the second rim (112).
[0053] The first display panel (144a) is mounted on the first upper frame (131c) and can provide image light to the first display lens (131a). The first display panel cable (144ca) can be connected to the first display panel (144a).
[0054] The second display panel (144b) is mounted on the second upper frame (132c) and can provide image light to the second display lens (132a). The second display panel cable (144cb) can be connected to the second display panel (144b).
[0055] In the following, the description of the first display unit (131) can be applied in the same way to the second display unit (132).
[0056] Referring to FIG. 4, the front frame (110) may include a rear cover (110R), a middle cover (110M), and a front cover (110F). A sub-PCB (141) may be embedded in the rear cover (110R). The sub-PCB (141) may be coupled to the upper edge of the first rim (111R) and the upper edge of the second rim (112R) of the rear cover (110R). The sub-PCB (141) may be mounted to the first rim (111R) and the second rim (112R) via a bridge (113R) of the rear cover (110R). The sub-PCB (141) can be mounted on the upper edge of the first rim (111R) of the rear cover (110R) and the first end piece (117R), and can be mounted on the upper edge of the second rim (112R) of the rear cover (110R) and the second end piece (116R).
[0057] The middle cover (110M) may be attached to or fixed to the rear cover (110R). The middle cover (110M) may face the rear cover (110R) with respect to the first display unit (131) and / or the second display unit (132). The middle cover (110M) may fix the first display unit (131) and the second display unit (132) to the rear cover (110R).
[0058] The camera module (148a) of the main camera (148) can be fixed to the camera module connector (141d), and the middle cover (110M) can cover the camera module (148a) while being coupled to the rear cover (110R). The lens of the camera module (148a) can be exposed to the outside through the lens hole (CH) of the middle cover (110M) and the front cover (110F). The front cover (110F) can be coupled to or fixed to the middle cover (110M).
[0059] The first display unit (131) can be coupled to the first rim (111F, 111M, 111R) of the front cover (110F), middle cover (110M), and rear cover (110R), and the second display unit (132) can be coupled to the second rim (112F, 112M, 112R) of the front cover (110F), middle cover (110M), and rear cover (110R). The bridge (113F) of the front cover (110F), the bridge (113M) of the middle cover (110M), and / or the bridge (113R) of the rear cover (110R) can connect the first display unit (131) and the second display unit (132).
[0060] Referring to FIG. 5, the leveling module (115) may be attached to or embedded in the bridge (113R) and / or rim (111R, 112R) of the rear cover (110R). The nose arm (115c) may be connected to the leveling module (115), and the nose pads (115a, 115b) may be connected to the nose arm (115c). The leveling module (115) may move the nose arm (115c) and / or nose pads (115a, 115b) up and down.
[0061] The hinge module (200) can be connected to or coupled with the end pieces (116R, 117R). The first hinge module (200a) can be connected to or coupled with the first end piece (117R), and the second hinge module (200b) can be connected to or coupled with the second end piece (116R).
[0062] Referring to FIGS. 6 and 7, the main PCB (142) may be embedded in the temple (121a) of the first side frame (120a). The first side frame (120a) may be hinge-connected to the first end piece (117, see FIG. 4). The first switch (152) may be exposed to the outside through the temple (121a) of the first side frame (120a). For example, the first switch (152) may be a camera shutter. The main PCB (142) may be referred to as the first main board (142).
[0063] The first speaker (145a) is electrically connected to the main PCB (142) and can be embedded in the temple (121a) of the first side frame (120a). The first battery (146a) can be embedded in the temple tip (122a) of the first side frame (120a). The first battery (146a) can be electrically connected to the main PCB (142) by a wire (146w). The first battery (146a) can supply power to the main PCB (142).
[0064] The side frames (120a, 120b) may be provided with a connecting portion (123a, 123b) that connects the temples (121a, 121b) and the temple tips (122a, 122b). The wire (146w) can electrically connect the first battery (146a) and the main PCB (142) inside the temple (121a) of the first side frame (120a), inside the connecting portion (123a), and inside the temple tip (122a).
[0065] The weight of the battery (146a) may be relatively heavy due to other electronic components. The battery (146a) may be embedded in the temple tip (122a), and other electronic components may be embedded in the front frame (110, see FIG. 4) and the temple (121a).
[0066] A terminal board (141n) may be embedded in a temple tip (122a). Electrodes (EL) may be formed on one side of the terminal board (141n). There may be multiple electrodes (EL). Multiple electrodes (EL) may be arranged in a row. For example, the terminal board (141n) may be a PCB. As another example, the terminal board (141n) may be an F-PCB. The terminal board (141n) may include a connection board (141w). The terminal board (141n) may be connected to the main PCB (142) by the connection board (141w). A terminal hole (EH) may be formed in the temple tip (122a). The terminal hole (EH) may be exposed to the outside of the temple tip (122a). There may be multiple terminal holes (EH), and the multiple terminal holes (EH) may correspond to multiple electrodes (EL).
[0067] A magnetic body (M) can be embedded in the temple tip (122a). The magnetic body (M) can be positioned around the terminal hole (EH) and fixed to the inner surface of the temple tip (122a). The magnetic body (M) can be positioned on both sides of a plurality of terminal holes (EH).
[0068] A heat dissipation hole may be formed on the upper and / or lower side of the temple (121a). The heat dissipation hole (121v) may be referred to as a heat dissipation slot (121v), a heat dissipation opening (121v), or an air path opening (121v). An air filter (121c) may cover the heat dissipation hole (121v). The air filter (121c) may be referred to as a heat dissipation cover (121c) or an opening cover (121c).
[0069] A touch pad (151) can be connected to a main PCB (142). The touch pad (151a) may include a touch panel (151a) and a panel electrode (151b). The touch panel (151a) may be located on the outer surface of the main PCB (142) and may face the outer surface of the main PCB (142). For example, the touch panel (151a) may be a capacitive sensing panel. As another example, the touch panel (151a) may be a pressure-sensitive panel. The panel electrode (151b) may electrically connect the main PCB (142) and the touch panel (151a).
[0070] The flat board (141s) can be embedded in the temple (121b) of the second side frame (120b). The flat board (141s) can be referred to as the second main board (141s).
[0071] The temple (121b) of the second side frame (120b) can be connected to the second end piece (116, see FIG. 4) by a hinge (200b, see FIG. 4). The second hinge (200b) can hinge the second side frame (120b) to the second end piece (116).
[0072] The second speaker (145b) may be embedded in the temple (121b) of the second side frame (120b). The second battery (146b) may be embedded in the temple tip (122b) of the second side frame (120b). A wire (146w) may electrically connect the second battery (146b) to the flat board (141s). For example, the wire (146w) may be embedded in the second temple tip (122b), the ear portion (123b), and / or the second temple (121b), and may electrically connect the second battery (146b) to the flat board (141s).
[0073] The weight of the battery (146b) may be relatively heavy due to other electronic components. The battery (146b) may be embedded in the temple tip (122b), and other electronic components may be embedded in the front frame (110) and the temple (121b).
[0074] Referring to FIG. 8, the hinge module (200) may be referred to as a hinge assembly (200) or a hinge unit (200). The hinge module (200) may include a first body (210), a second body (220), a cap (240), and a slider (250).
[0075] The cap (240) can be coupled to the first body (210). The first body (210) can be inserted into the cap (240). The cap (240) can cover the outer surface of the first body (210). The second body (220) can be coupled to the first body (210). The second body (220) can rotate relative to the first body (210).
[0076] The slider (250) can be coupled to the second body (220). The slider (250) can move linearly while sliding relative to the second body (220).
[0077] The hinge module (200) may include an inner cover assembly (270). The inner cover assembly (270) may be attached to or fixed to the first body (210) and / or the second body (220). The inner cover assembly (270) may include a front bracket (271), a rear bracket (272), and a middle seat (273). The front bracket (271) may be attached to or fixed to the first body (210), and the rear bracket (272) may be attached to or fixed to the slider (250). The middle seat (273) may be attached to or fixed to the front bracket (271) and / or the rear bracket (272) while connecting the front bracket (271) and the rear bracket (272). The inner cover assembly (270) may cover the first body (210) and / or the second body (220). The inner cover assembly (270) can cover the slider (250). The middle seat (273) may have an opening (273P). The opening (273P) may be located between the front bracket (271) and / or the rear bracket (272).
[0078] Referring to FIG. 9, the first body (210) may include side walls (211, 212), a rotating drum (213), a rotating guide (215, 216), a connecting part (217), and a fixed gate (218). The side walls (211, 212) may form both sides of the first body (210). The connecting part (217) may be located between the first side wall (211) and the second side wall (212).
[0079] The rotating drum (213) may be adjacent to the connecting portion (217) and located between the first sidewall (211) and the second sidewall (212). The first sidewall (211) and the second sidewall (212) may form both ends of the rotating drum (213). For example, the rotating drum (213) may be in the shape of a half pipe.
[0080] Rotation guides (215, 216) may be formed on the inner side of the side walls (211, 212) adjacent to the rotation drum (213). A first rotation guide (215) may be formed on the inner side of the first side wall (211), and a second rotation guide (216) may be formed on the inner side of the second side wall (212). The first rotation guide (215) may face the second rotation guide (216). For example, the rotation guides (215, 216) may be in the shape of semicircular rings. The curvature of the rotation guides (215, 216) may be the same as the curvature of the rotation drum (213, 214).
[0081] The fixed gate (218) may be a slot connected to the joint (217). The fixed gate (218) may be a square frame overall. The fixed gate (218) may be connected to or fixed to the end pieces (116, 117).
[0082] The elastic member (230) may be coupled to the first body (210). The elastic member (230) may include a fixed plate (231) and an arc plate (232). For example, the elastic member (230) may be a plate spring. The fixed plate (231) may be fixed to the coupling portion (217) of the first body (210) by a fastening member (f).
[0083] The arc plate (232) may be extended by bending from the fixed plate (231). The arc plate (232) may be semicircular in shape. The curvature of the arc plate (232) may be the same as the curvature of the rotating drum (213). The arc plate (232) may include a friction portion (234) and slits (233). Multiple slits (233) may be formed on both sides of the friction portion (234). Multiple slits (233) may be formed by penetrating the arc plate (232). A first slit (233a) may be opposite to a second slit (233b) with respect to the friction portion (234). The friction portion (234) may be formed by being pressed so as to protrude from the arc plate (232). The curvature of the friction portion (234) may be the same as the curvature of the arc plate (232). The friction part (234) can form a step that rises from the arc plate (232).
[0084] The cap (240) may include an outer cover (241) and bridges (242, 243). The outer cover (241) may cover the rotating drum (213) and / or the first sidewall (211) and / or the second sidewall (212) of the first body (210). The bridges (242, 243) may extend from the outer cover (241). There may be multiple bridges (242, 243). The first bridge (242) may be spaced apart from the second bridge (243). The bridges (242, 243) may include fastening grooves (240c). The fastening member (f) can be inserted into or fixed in the fastening groove (240c) of the bridge (242, 243) by penetrating the elastic member (230) and / or the fixing part (217) of the first body (210).
[0085] Referring to FIG. 10, the second body (220) may be rotatably or pivotally coupled to the first body (210, see FIG. 8). The rotating head (223) of the second body (220) may be positioned on the rotating drum (213, see FIG. 9) of the first body (210). The outer surface of the rotating head (223) of the second body (220) may come into contact with the inner surface of the rotating drum (213) of the first body (210) and / or the inner surface of the friction portion (234) of the elastic member (230, see FIG. 9).
[0086] The rotation guides (215, 216, see FIG. 9) of the first body (210) can be inserted into the rotation slots (223a, 223b) of the rotation head (223) of the second body (220). The rotation guides (215, 216) can move frictionally in the rotation slots (223a, 223b).
[0087] The slider (250) may face the sliding body (221) of the second body (220). The slider (250) may move linearly on the second body (220). A guide pole (262) may be installed on the sliding body (221). A first guide pole (262a) may be installed on the sliding body (221) parallel to a second guide pole (262b). The first guide pole (262a) may be inserted into a first coil spring (261a), and the second guide pole (262b) may be inserted into a second coil spring (261b). The slider (250) may move reciprocally on the guide pole (262). The guide pole (262) may be inserted into the slider (250). The coil spring (261) may provide elastic force to the slider (250). When the slider (250) moves in a straight line on the sliding body (221), the coil spring (261) can restore the position of the slider (250).
[0088] When the second body (220) rotates or pivots relative to the first body (210, see FIG. 8), the rotation slots (223a, 223b) of the rotation head (223) may move along the rotation guides (215, 216, see FIG. 9) of the rotation drum (213, see FIG. 9). The rotation head (223) may rotate on the rotation drum (213) and / or the arc plate (232, see FIG. 9) while in contact with the friction portion (234, see FIG. 9) of the elastic member (230, see FIG. 9). When the friction portion (234) of the elastic member (230) is in close contact with the outer surface of the rotation head (223), and the second body (220) stops rotating or pivoting relative to the first body (210), the second body (220) may maintain a constant rotation angle relative to the first body (210).
[0089] Referring to FIG. 11, the description of the first end piece (117) and the first hinge module (200a) may be applied to the second end piece (200b, see FIG. 4) and the second hinge module (116, see FIG. 4). The first end piece (117) may include a hinge gate (119).
[0090] The hinge gate (119) may be a square frame shape that opens in the front-rear direction of the front frame (110). The hinge gate (119) may form a rear slot (119s2) in the center. The hinge gate (119) may be provided with a support member (119a). The support member (119a) may be formed on the inner side of the hinge gate (119). The support member (119a) may form a front slot (119s1). The length of the rear slot (119s2) may correspond to the length of the front slot (119s1). The width of the rear slot (119s2) may be greater than the width of the front slot (119s1).
[0091] The hinge gate (119) may be provided with a hinge fixing part (119c). The hinge fixing part (119c) may be formed on the outer wall (119b) of the hinge gate (119). The hinge fixing part (119c) may form a step inward from the outer wall (119b) of the hinge gate (119). The hinge fixing part (119c) may include a fastening hole (h).
[0092] The fixed gate (218) of the first body (210) of the first hinge module (200a) can be inserted into the hinge gate (119) of the first end piece (117). The slot (218s) of the fixed gate (218) of the first hinge module (200a) can face the front slot (119s1) of the hinge gate (119). The fixed gate (218) of the first hinge module (200a) can be supported by or in contact with the support portion (119a) of the hinge gate (119) of the first end piece (117). The hinge fixed portion (119c) of the first end piece (117) can be located between the bridges (242, 243) of the first hinge module (200a). The fastening hole (h) formed in the coupling portion (217) of the first hinge module (200a) can be aligned with the fastening hole (h) formed in the hinge fixing portion (119c) of the hinge gate (119).
[0093] Referring to FIGS. 12 and 13, the sealing member (141R) may be inserted or press-fitted into the front slot (119s1, see FIG. 11) of the hinge gate (119) and / or the fixed gate (218). The outer surface of the sealing member (141R) may come into contact with the inner surface of the front slot (119s1) of the hinge gate (119) and / or the inner surface of the fixed gate (218). For example, the sealing member (141R) may be formed integrally with the fixed gate (218) by insert injection.
[0094] The sealing member (141R) may have an FPCB slot (141RS), and the main board connector (141e) and / or the first hinge FPCB (141v) may be inserted into the FPCB slot (141RS) of the sealing member (141R). For example, the sealing member (141R) may be rubber. As the main board connector (141e) is inserted into the FPCB slot (141RS) of the sealing member (141R), the sealing member (141R) may be stretched, and when the first hinge FPCB (141v) is inserted into the FPCB slot (141RS) of the sealing member (141R), the sealing member (141R) may be restored to its original state.
[0095] The main board connector (141e) and the first hinge FPCB (141v) can pass through an opening (273P) formed in the middle sheet (273) of the inner cover assembly (270). The main board connector (141e) and the first hinge FPCB (141v) passing through the opening (273P) of the middle sheet (273) can face or come into contact with the inner cover assembly (270).
[0096] Referring to FIGS. 14 and 15 together with FIGS. 12, the fixing gate (218) of the hinge module (200a, 200, see FIG. 12) is inserted into the hinge gate (119), and the fixing gate (218) of the hinge module (200a, 200) can be fixed to the hinge gate (119) by screw-coupled to the fastening hole (h) of the hinge fixing part (119c) and the fastening hole (h) formed in the coupling part (217) of the hinge module (200a, 200). Accordingly, the rigidity of the hinge module (200) being coupled to the end piece (116, 117) of the front frame (110) can be improved. By improving the coupling rigidity with which the hinge module (200) is fixed to the front frame (110), it is possible to prevent misalignment of the main camera (148, see FIG. 1), for example, the image camera (148a) and / or the depth camera (148b, 148c) mounted on the front frame (110).
[0097] The first hinge FPCB (141v) is inserted into the sealing member (141R), and the sealing member (141R) fills the space between the fixed gate (218) and the first hinge FPCB (141v), thereby preventing external foreign matter from entering and improving dustproof and moistureproof functions.
[0098] A first hinge FPCB (141v) passing through a hinge module (200a, 200) is embedded in a temple (121a) of a side frame (120a), and a middle sheet (273) of an inner cover assembly (270) is positioned between an end piece (117) and a temple (121a), thereby preventing the first hinge FPCB (141v) from being damaged or exposed to the outside by the gap formed between the end piece (117) and the temple (121a). Damage to an electronic device that may occur while the side frame (120a) repeatedly pivots with respect to the hinge module (200a, 200) can be improved.
[0099] Referring to FIG. 16, the temple (121a) may include an inner case (121a2) and an outer case (121a1). The description of the temple (121a) of the first side frame (120a, see FIG. 6) may also apply to the temple (121b, see FIG. 7) of the second side frame (120b, see FIG. 7).
[0100] The outer case (121a1) may form the outer surface, upper surface, and / or lower surface of the temple (121a). The inner case (121a2) may be attached to the outer case (121a1). The inner case (121a2) may be attached to or fixed to the upper surface and / or lower surface of the outer case (121a1). The inner case (121a2) may come into contact with the user's skin.
[0101] A heat dissipation hole (121v) may be formed on the upper surface and / or lower surface of the outer case (121a1). The upper and lower sides of the temple (121a) may be connected to the outside through the heat dissipation hole (121v).
[0102] The heat dissipation member (125) can be coupled to the heat dissipation hole (121v). The heat dissipation member (125) may include metal. For example, the heat dissipation member (125) may be coupled to the outer case (121a1) as the outer case (121a1) is insert-molded. The heat dissipation member (125) may narrow the area of the heat dissipation hole (121v). The heat dissipation member (125) may have a flow slot or a flow hole.
[0103] The touch pad (151, see FIG. 6) may face the inner surface of the outer case (121a1) or be supported by the inner surface of the outer case (121a1). For example, the touch panel (151a, see FIG. 6) may be supported by the inner surface of the outer case (121a1) or be in contact with the inner surface of the outer case (121a1).
[0104] The heat dissipation sheet (126) may face the outer case (121a1) with respect to the touch panel (151a). The heat dissipation sheet (126) may come into contact with the touch panel (151a). For example, the heat dissipation sheet (126) may be a graphite sheet.
[0105] A vapor chamber (127a) may be in contact with a heat dissipation sheet (126). The vapor chamber (127a) may cool a heat source by vaporizing and / or condensing a fluid. An insulating layer (127b) may be in contact with the heat dissipation sheet (126) with respect to the vapor chamber (127a). The insulating layer (127b) may be in contact with the vapor chamber (127a).
[0106] A high-performance integrated device (AP) may be mounted on the main PCB (142). For example, the integrated device (AP) may be a microprocessor or an application processor. The integrated device (AP) may be spaced apart from the heat dissipation sheet (126).
[0107] Heat generated from the main PCB (142) and / or integrated element (AP) is cooled by an airflow entering from the lower heat dissipation hole (121v), and the airflow that has absorbed heat can be naturally convected through the upper heat dissipation hole (121v). Heat generated by the main PCB (142) and / or integrated element (AP) is not only diffused and dissipated by the heat dissipation sheet (126) and / or vapor chamber (127a), but is also air-cooled by natural convection, which can reduce the heat sensation of the inner case (121a2) that comes into contact with the user.
[0108] Referring to FIG. 17, the heat dissipation member (125) may be referred to as a heat dissipation bracket (125), an insert bracket (125), or an insert frame (125). The heat dissipation member (125) may include a first heat dissipation member (125a) and a second heat dissipation member (125b). The first heat dissipation member (125a) may be referred to as an insert top bracket (125a), and the second heat dissipation member (125b) may be referred to as an insert bottom bracket (125b).
[0109] The heat dissipation member (125) may include a center bracket (1251), a side bracket (1252), and an arm (1253). The center bracket (1251) may be in the shape of a long, extended ring. The center bracket (1251) may form a closed loop. The side bracket (1252) may be formed at one or both ends of the center bracket (1251). The side bracket (1252) may be connected to the center frame (1252) in an overall rectangular or U-shape. The arm (1253) may extend from the side bracket (1252) in the longitudinal direction of the center bracket (1251). The arm (1253) may be a single arm or a plurality of arms. The heat dissipation member (125) can be aligned with the heat dissipation hole (121v) and coupled or fixed to the outer cover (121a1) of the temple (121a).
[0110] Referring to FIGS. 18 and 19, the outer cover (121a1) of the temple (121a) may be formed by insert injection molding of the heat dissipation member (125). The heat dissipation hole (121v) may be formed surrounding the center bracket (1251), side bracket (1252), and / or arm (1253) of the heat dissipation member (125). The heat dissipation hole (121v) may correspond to the outline of the heat dissipation member (125).
[0111] The outer cover (121a1) may include an arm fixing portion (1211, 1212) and a center rib (1213). The arm fixing portion (1211, 1212) may be able to catch the arm (1253) of the heat dissipation member (125). There may be multiple arm fixing portions (1211, 1212). A portion of the center rib (1213) may cover one side of the center bracket (1251), and a portion may be inserted into the central opening of the center bracket (1251).
[0112] The center rib (1213) may include a first rib (1213a) and a second rib (1213b). The first rib (1213a) may cover or hold one side of the center bracket (1251). The second rib (1213b) may form a step from the first rib (1213a) and be inserted into the central opening of the center bracket (1251).
[0113] Accordingly, after the heat dissipation member (125) is inserted into the outer cover (121a1) of the temple (121a), it can be prevented from being detached or separated from the outer cover (121a1). The first rib (1213a) can prevent the heat dissipation member (125) from being detached or separated from the heat dissipation hole (121v), and the second rib (1213b) can prevent the heat dissipation member (125) from being pushed out as the outer cover (121a1) is inserted injection molded together with the heat dissipation member (125).
[0114] Referring to FIG. 20, the outer cover (121a1) may have a chamfered portion (121a1c) formed on the inner surface of the heat dissipation hole (121v). The chamfered portion (121a1c) may be formed at the bottom of the heat dissipation hole (121v). The chamfered portion (121a1c) may form an obtuse angle with respect to the side wall of the heat dissipation hole (121v). Due to the chamfered portion (121a1c), the heat dissipation hole (121v) may have a width or length that gradually narrows.
[0115] The heat dissipation member (125) can be placed on the chamfer portion (121a1c). The heat dissipation member (125) can form an outer cover (121a1) by being insert-molded together with the chamfer portion (121a1c). The chamfer portion (121a1c) can prevent the heat dissipation member (125) from being displaced or separated into the inner side of the temple (121a).
[0116] Referring to FIGS. 21 and 22, an air filter (121c) may be coupled to a heat dissipation hole (121v) to cover the heat dissipation hole (121v). The air filter (121c) may be referred to as a heat dissipation cap (121c) or a hole cover (121c). For example, the air filter (121c) may include metal. Airflow holes for airflow may be formed in the air filter (121c).
[0117] The temple (121a) may include an inner case (121a2) and an outer case (121a1). The description of the temple (121a) of the first side frame (120a, see FIG. 6) may also apply to the temple (121b, see FIG. 7) of the second side frame (120b, see FIG. 7).
[0118] The outer case (121a1) may form the outer surface, upper surface, and / or lower surface of the temple (121a). The inner case (121a2) may be coupled to the outer case (121a1) while covering the internal receiving space provided by the outer case (121a1). The inner case (121a2) may be coupled to or fixed to the upper surface and / or lower surface of the outer case (121a1). The inner case (121a2) may come into contact with the user's skin.
[0119] A heat dissipation hole (121v) may be formed on the upper surface and / or lower surface of the outer case (121a1). The upper and lower sides of the temple (121a) may be connected to the outside through the heat dissipation hole (121v).
[0120] The heat dissipation member (125) can be coupled to the heat dissipation hole (121v). The heat dissipation member (125) may include metal. For example, the heat dissipation member (125) may be coupled to the outer case (121a1) as the outer case (121a1) is insert-molded. The heat dissipation member (125) may narrow the area of the heat dissipation hole (121v). The heat dissipation member (125) may have a flow slot or a flow hole.
[0121] The touch pad (151, see FIG. 6) may face the inner surface of the outer case (121a1) or be supported by the inner surface of the outer case (121a1). For example, the touch panel (151a, see FIG. 6) may be supported by the inner surface of the outer case (121a1) or be in contact with the inner surface of the outer case (121a1).
[0122] The heat dissipation sheet (126) may face the outer case (121a1) with respect to the touch panel (151a). The heat dissipation sheet (126) may come into contact with the touch panel (151a). For example, the heat dissipation sheet (126) may be a graphite sheet.
[0123] A vapor chamber (127a) may be in contact with a heat dissipation sheet (126). The vapor chamber (127a) may cool a heat source by vaporizing and / or condensing a fluid. An insulating layer (127b) may be in contact with the heat dissipation sheet (126) with respect to the vapor chamber (127a). The insulating layer (127b) may be in contact with the vapor chamber (127a).
[0124] A high-performance integrated device (AP) may be mounted on the main PCB (142). For example, the integrated device (AP) may be a microprocessor or an application processor. The integrated device (AP) may be spaced apart from the heat dissipation sheet (126). Air may flow through the spaced-apart space.
[0125] Electronic components (EC) can be mounted on the main PCB (142). The electronic components (EC) can be located adjacent to or adjacent to the integrated circuit (AP). The electronic components (EC) can be positioned opposite the integrated circuit (AP) with respect to the main PCB (142).
[0126] The insulating sheet (128) can be bonded to the inner case (121a2) between the inner case (121a2) and the main PCB (142). The insulating sheet (128) can be positioned between the inner case (121a2) and the electronic components (EC). For example, the insulating sheet (128) can be bonded to the inner surface of the inner case (121a2).
[0127] Thermal grease (129) can be applied between electronic components (EC) and an insulating sheet (128). Thermal grease (129) can extend from the electronic components (EC) and the insulating sheet (128) and be connected to a heat dissipation member (125). Thermal grease (129) can transfer heat generated from the main PCB (142) or electronic components (EC) to the heat dissipation member (125). Thermal grease (129) can be applied between an integrated component (AP) and a heat dissipation sheet (126). Thermal grease (129) can extend from the integrated component (AP) and the heat dissipation sheet (126) and be connected to a heat dissipation member (125). Thermal grease (129) can be connected to the electronic components (EC). Thermal grease (129) can transfer heat generated from an integrated device (AP) or electronic devices (EC) to a heat dissipation member (125).
[0128] Heat generated inside the temple (121a) can be transferred to a heat dissipation member (125) and discharged to the outside of the temple (121a) through an air filter (121c). Heat generated inside the temple (121a) can be transferred and / or air-cooled and discharged to the outside of the temple (121a). Accordingly, the heat sensation of the inner case (121a2) of the temple (121a) that the user contacts can be reduced, and the performance of the electronic device can be prevented from degrading.
[0129] Referring to FIGS. 1 to 22, the electronic device comprises: a front frame to which a light-transmitting display portion is coupled; and a temple that is extended and hinge-connected to the front frame, wherein the front frame comprises: a PCB embedded in the front frame and extending from the front frame toward the temple; and a display panel embedded in the front frame at one side of the display portion and electrically connected to the PCB, wherein the temple comprises: a plurality of heat dissipation holes formed on the upper side and the lower side of the temple and extending in a direction intersecting with the direction from the upper side toward the lower side of the temple; and a heat dissipation member coupled to at least one of the plurality of heat dissipation holes, wherein the heat dissipation member may be fixed to the inside of at least one of the plurality of heat dissipation holes.
[0130] The heat dissipation member comprises: a center bracket forming a slot; and a side bracket formed at one end of the center bracket in the longitudinal direction of the slot, and at least one of the center bracket or the side bracket may be fixed to the inner surface of the temple.
[0131] The heat dissipation member comprises: a center bracket forming a slot; and an arm extending from the center bracket in the longitudinal direction of the slot, wherein at least one of the center bracket or the arm may be fixed to the inner surface of the temple.
[0132] The heat dissipation member comprises: a center bracket forming a slot; a side bracket formed at one end of the center bracket in the longitudinal direction of the slot; and an arm extending from the side bracket in the longitudinal direction of the slot, wherein at least one of the center bracket, the side bracket, or the arm may be fixed to the inner surface of the temple.
[0133] It may further include a main board accommodated on the inner side of the above-mentioned temple and electrically connected to the PCB; an integrated element located between the main board and the inner surface of the above-mentioned temple and mounted on the main board; a touch pad located between the integrated element and the inner surface of the above-mentioned temple; and a heat dissipation sheet located between the touch pad and the integrated element.
[0134] The above-mentioned temple includes a plurality of heat dissipation members each coupled to a plurality of heat dissipation holes, and an airflow flowing from the outside of the temple into the interior of the temple through a heat dissipation hole and a heat dissipation member formed on the lower side of the temple can flow out from the interior of the temple to the exterior of the temple through a heat dissipation hole and a heat dissipation member formed on the upper side of the temple.
[0135] The above temple may include an air filter covering at least one of the plurality of heat dissipation holes.
[0136] The above air filter can be supported by the heat dissipation member.
[0137] A main board accommodated on the inner side of the above-mentioned temple and electrically connected to the PCB; an integrated element located between the main board and the inner surface of the above-mentioned temple and mounted on the main board; a touch pad located between the integrated element and the inner surface of the above-mentioned temple; a heat dissipation sheet located between the integrated element and the touch pad; and a vapor chamber in contact with the heat dissipation sheet may be further included.
[0138] An insulating layer covering the above vapor chamber; and further comprising thermal grease connecting the integrated element and the heat dissipation member, wherein the thermal grease can come into contact with the insulating layer.
[0139] Information provided by the above display panel can be displayed on the light transmission path of the above display unit.
[0140] Some or other embodiments of the present disclosure described above are not exclusive or distinct from one another. Some or other embodiments of the present disclosure described above may be used in combination or combined for their respective configurations or functions.
[0141] For example, this means that configuration A described in a specific embodiment and / or drawing and configuration B described in another embodiment and / or drawing can be combined. That is, even if the combination between configurations is not directly described, it means that combination is possible, except in cases where it is described that combination is impossible.
[0142] The foregoing detailed description should not be interpreted restrictively in all respects and should be considered exemplary. The scope of the invention shall be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the invention are included within the scope of the invention.
Claims
Claim 1 An electronic device comprising: a front frame to which a light-transmitting display portion is coupled; and a temple that is extended and hinge-connected to the front frame, wherein the front frame comprises: a PCB embedded in the front frame and extending from the front frame toward the temple; and a display panel embedded in the front frame at one side of the display portion and electrically connected to the PCB, wherein the temple comprises: a plurality of heat dissipation holes formed on the upper side and the lower side of the temple and extending in a direction intersecting the direction from the upper side toward the lower side of the temple; and a heat dissipation member coupled to at least one of the plurality of heat dissipation holes, wherein the heat dissipation member is fixed to the inside of at least one of the plurality of heat dissipation holes. Claim 2 In claim 1, the heat dissipation member comprises: a center bracket forming a slot; and a side bracket formed at one end of the center bracket in the longitudinal direction of the slot, wherein at least one of the center bracket or the side bracket is fixed to an electronic device on the inner surface of the temple. Claim 3 In claim 1, the heat dissipation member comprises: a center bracket forming a slot; and an arm extending from the center bracket in the longitudinal direction of the slot, wherein at least one of the center bracket or the arm is fixed to an inner surface of the temple, an electronic device. Claim 4 In claim 1, the heat dissipation member comprises: a center bracket forming a slot; a side bracket formed at one end of the center bracket in the longitudinal direction of the slot; and an arm extending from the side bracket in the longitudinal direction of the slot, wherein at least one of the center bracket, the side bracket, or the arm is fixed to the inner surface of the temple, an electronic device. Claim 5 An electronic device according to claim 4, further comprising: a main board accommodated inside the temple and electrically connected to the PCB; an integrated element located between the main board and the inner surface of the temple and mounted on the main board; a touch pad located between the integrated element and the inner surface of the temple; and a heat dissipation sheet located between the touch pad and the integrated element. Claim 6 In claim 5, the temple comprises: a plurality of heat dissipation members each coupled to each of the plurality of heat dissipation holes, and an electronic device in which an airflow flowing from the outside of the temple into the interior of the temple through a heat dissipation hole and a heat dissipation member formed on the lower side of the temple flows out from the interior of the temple to the outside of the temple through a heat dissipation hole and a heat dissipation member formed on the upper side of the temple. Claim 7 In claim 6, the above-mentioned temple is: an electronic device comprising an air filter covering at least one of the plurality of heat dissipation holes. Claim 8 In claim 7, the air filter is an electronic device supported by the heat dissipation member. Claim 9 An electronic device according to claim 4, further comprising: a main board accommodated inside the temple and electrically connected to the PCB; an integrated element located between the main board and the inner surface of the temple and mounted on the main board; a touch pad located between the integrated element and the inner surface of the temple; a heat dissipation sheet located between the integrated element and the touch pad; and a vapor chamber in contact with the heat dissipation sheet. Claim 10 In claim 9, the device further comprises an insulating layer covering the vapor chamber; and a thermal grease connecting the integrated element and the heat dissipation member, wherein the thermal grease is in contact with the insulating layer. Claim 11 An electronic device according to claim 1, wherein information provided by the display panel is displayed on the light transmission path of the display unit.