Electrode Plate Anti-Collision Device

KR1020260138828APending Publication Date: 2026-09-21(주)대원프리시전
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Patent Information

Application Number
KR1020250032046
Authority / Receiving Office
KR · KR
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-12
Publication Date
2026-09-21

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Abstract

The present invention relates to a device for preventing a punched electrode from colliding with a mold, and more specifically, to an electrode collision prevention device that prevents the electrode from getting caught on the edge of the die and being damaged by covering a punching hole formed inside the die with a guide plate through the downward and upward movement of an upper mold.
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Description

Technology Field

[0001] The present invention relates to a device for preventing a punched electrode from colliding with a mold, and more specifically, to an electrode collision prevention device that prevents the electrode from getting caught on the edge of the die and being damaged by covering a punching hole formed inside the die with a guide plate through the downward and upward movement of an upper mold. Background Technology

[0003] Batteries for electric and hybrid vehicles are required to have high charge-discharge efficiency and excellent durability, and various battery manufacturing technologies are being developed to meet these requirements. In particular, batteries are constructed by stacking positive and negative plates, and these plates are critical components that store and release energy through electrochemical reactions. Tabs are formed on the plates to connect with battery cells, and the shape and dimensions of these tabs significantly influence the battery's performance and assembly process.

[0004] Generally, manufacturing electrode tabs requires processing thin metal sheets to cut them into a specific shape. This process utilizes a notching process, and a cutting die is essential for performing this operation.

[0005] The process of a cutting die generally proceeds as follows. First, a thin metal sheet is supplied to a designated position via a transfer device. Subsequently, a guide inside the die aligns the electrode plate to the correct position, and a punch descends to cut a specific part of the electrode plate. The cut electrode plate is separated from the die by a stripper, and any scrap remaining after cutting is removed through a separate discharge path. The processed electrode plate then moves to the subsequent assembly process.

[0006] During the process of performing punching to form a tab after inserting an electrode into a punching die, the upper die (punch) rapidly rises and falls, causing rapid pressure changes in the surrounding air. This generates strong winds around the punching area, which act as a factor hindering the transport and positional stability of the electrode. In particular, thin and flexible electrodes may experience shaking or deformation due to the influence of these winds. This prevents the electrode from being maintained in an accurate position and further leads to a decrease in precision during the assembly process.

[0007] Furthermore, as the electrode is continuously transported during the stamping process, there is a high probability that it will sag due to its own weight and get caught on the edge of the die. In this case, the electrode cannot be transported smoothly and may come into contact with the sharp edge of the die, causing scratches or, in severe cases, tearing. Such damage not only degrades the electrical properties of the electrode but also negatively affects the battery's performance and lifespan. In particular, even minute damage to the electrode reduces electrochemical reaction efficiency and is a major cause of compromised long-term reliability.

[0008] Various methods have been attempted in existing technologies to address these issues. For instance, techniques such as optimizing the structure of the stamping die or increasing the precision of the transfer system have been applied. Additionally, attempts have been made to prevent deformation during the electrode transfer process by introducing precise guide systems. However, it remains difficult to completely resolve the problems arising from high stamping speeds and continuous transfer processes using only these existing technologies.

[0009] In particular, to prevent damage caused by electrodes coming into contact with the die edges, conventional methods have involved adjusting the feed rate or improving the mold shape. However, these methods carry the risk of reducing process speed, and modifying the mold structure incurs significant costs. Furthermore, given that high productivity and uniform quality are essential in battery manufacturing processes, simply adjusting speed may not be suitable for mass production environments. Therefore, a more effective solution is required to prevent electrode quality degradation while maintaining productivity. Prior art literature

[0011] KR 10-2609712 (B1) 2023.11.30. The problem to be solved

[0012] To solve the above-mentioned problem, the objective of the present invention is to provide an electrode collision prevention device that prevents the electrode from getting caught on the edge of the die and being damaged by covering the punching hole formed inside the die with the guide plate through the downward and upward movement of the upper mold.

[0013] Another objective of the present invention is to provide an electrode collision prevention device that operates without delay even during high-speed stamping operations and exhibits excellent operational responsiveness with a simple structure by installing a sliding roller on an upper mold and providing a roller guide on a lower mold that moves translationally in the front-rear direction while sliding with the sliding roller, and connecting a guide plate to move together with the roller guide.

[0014] Another objective of the present invention is to provide an electrode collision prevention device in which a guide plate and a roller guide are coupled to a sliding block, and a sliding rail is provided on the sliding block to guide translational movement, thereby preventing the guide plate from moving in an oscillating or twisted manner and preventing unnecessary friction and damage with the die.

[0015] Another objective of the present invention is to provide an electrode collision prevention device having rapid operational response even during high-speed stamping, in which the extensional movement of the return spring aligns with the direction of movement of the guide plate so that the guide plate, which has retracted when the upper mold is lowered, is returned to cover the punching hole quickly when the upper mold is raised.

[0016] Another objective of the present invention is to provide an electrode collision prevention device that positions the upper surface of the guide plate higher than the upper surface of the die, thereby allowing the electrode, after punching is completed, to be transported smoothly and seamlessly to the outside of the mold without getting caught on the inner edge of the die.

[0017] Another objective of the present invention is to provide an electrode collision prevention device that ensures intuitive movement without a rotating configuration by converting the vertical movement of an upper mold into the horizontal movement of a guide plate through a sliding inclined surface formed on a roller guide, and has excellent maintenance stability because the roller guide has a fixed shape and position. means of solving the problem

[0019] To achieve the above-mentioned purpose, the present invention comprises: a sliding roller (100) provided to rotate on a roller bracket (110) coupled to an upper mold (10); a roller guide (400) provided on a lower mold (20), wherein the sliding inclined surface (410) in contact with the sliding roller (100) is formed to be inclined upward toward the rear, so as to move toward the rear when the sliding roller (100) descends; a sliding block (300) coupled to the lower mold (20) to slide in the front and rear directions, to which the roller guide (400) is coupled from the top; a guide plate (500) coupled to the front side of the sliding block (300) to move together with the sliding block (300) and to cover a punching hole (26) formed in the die (25) of the lower mold (20); and a return spring (610) that presses the sliding block (300) toward the front.

[0020] In addition, the roller guide (400) of the present invention is fixedly coupled to the sliding block (300) so as not to rotate and converts the vertical movement of the upper mold (10) in the up-and-down direction into the horizontal movement of the sliding block (300) in the forward-and-backward direction.

[0021] In addition, the expansion and compression directions of the return spring (610) of the present invention coincide with the forward and backward movement directions of the sliding block (300).

[0022] The present invention further comprises a rail plate (200) having a guide rail (210) that is fixedly coupled to the upper surface of a lower mold (20) and engages with a sliding rail (310) provided at the lower part of the sliding block (300) to guide the movement of the sliding block (300) in the forward and backward directions.

[0023] In addition, a recess portion (23) for accommodating the guide plate (500) is formed in the die (25) of the lower mold (20) of the present invention, so that the upper surface of the guide plate (500) and the upper surface of the die (25) are arranged on the same plane; and a receiving hole (24) is formed in the recess portion (23), which is a space for accommodating the front end of the sliding block (300).

[0024] The present invention further comprises a fixed block (600) that is fixedly coupled to the lower mold (20) and connected to the rear end of the return spring (610); and a return block (320) that is fixedly coupled to the sliding block (300) and supports the front end of the return spring (610). Effects of the invention

[0026] The electrode collision prevention device according to the present invention has the effect of preventing the electrode from getting caught on the edge of the die and being damaged by covering the punching hole formed inside the die with the guide plate through the lowering and raising movements of the upper mold.

[0027] In addition, the present invention is equipped with a sliding roller installed on an upper mold and a roller guide on a lower mold that moves translationally in the front-rear direction while sliding with the sliding roller, and by connecting a guide plate to move together with the roller guide, it has excellent operational responsiveness even with a simple structure and operates without delay even during high-speed stamping operations.

[0028] In addition, the present invention has the effect of preventing unnecessary friction and damage to the die by preventing the guide plate from oscillating or twisting as the guide plate moves by guiding translational movement through a sliding block equipped with a sliding rail, and a guide plate and a roller guide coupled to a sliding block.

[0029] In addition, the present invention has the effect of providing rapid operational responsiveness even during high-speed stamping by ensuring that the elastic movement of the return spring aligns with the direction of movement of the guide plate so that the guide plate, which has retracted as the upper mold descends, returns to cover the punching hole quickly when the upper mold ascends.

[0030] In addition, the present invention has the advantage of positioning the upper surface of the guide plate higher than the upper surface of the die, thereby allowing the electrode, after punching is completed, to be transported smoothly and seamlessly to the outside of the mold without getting caught on the inner edge of the die.

[0031] In addition, the present invention ensures intuitive movement without a rotating component by converting the vertical movement of the upper mold into the horizontal movement of the guide plate through a sliding inclined surface formed on the roller guide, and provides excellent maintenance stability as the roller guide has a fixed shape and position. Brief explanation of the drawing

[0033] FIG. 1 is a perspective view of a mold in which the electrode collision prevention device of the present invention is installed. FIG. 2 is a perspective view of the electrode collision prevention device of the present invention. FIG. 3 is an exploded perspective view of the electrode collision prevention device of the present invention. FIG. 4 is a plan view showing the reciprocating movement of a guide plate to a die in the electrode collision prevention device of the present invention. FIG. 5 is a side view of the electrode collision prevention device of the present invention with the upper mold positioned at top dead center (TDC). FIG. 6 is a side view of the electrode collision prevention device of the present invention with the upper mold positioned at the bottom dead center (BDC). Specific details for implementing the invention

[0034] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings so that those skilled in the art can easily implement them.

[0036] The electrode collision prevention device according to the present invention is a device that prevents damage to the electrode by being installed in a stamping mold that stamps the electrode and moving horizontally forward and backward according to the lifting operation of the upper mold (10).

[0037] A sliding roller (100) that is rotatably coupled to a roller bracket (110) that is fixedly coupled to an upper mold (10);

[0038] A roller guide (400) provided in a lower mold (20), wherein a sliding inclined surface (410) in contact with the sliding roller (100) is formed to be inclined upward toward the rear, so as to move toward the rear when the sliding roller (100) descends;

[0039] A sliding block (300) coupled to the lower mold (20) so as to slide in the front and rear directions;

[0040] A guide plate (500) coupled to the front side of the sliding block (300) and moving together with the sliding block (300), and covering a punching hole (26) formed in the die (25) of the lower mold (20);

[0041] It includes a return spring (610) that presses the sliding block (300) forward.

[0043] In order to solve the problem where the edge of the electrode gets caught on the inner edge of the die (25) and is damaged when the electrode is transferred outside the mold during high-speed stamping of the electrode using a stamping die, the present invention provides a device for preventing collision of the electrode.

[0044] The device of the present invention is mounted on a mold and covers the punching hole (26) of the die (25) in accordance with the punching timing of the electrode, so that the electrode that has been punched is transported and does not get caught on the edge of the die (25).

[0045] To this end, when the upper mold (10) descends to punch the electrode below, the sliding roller (100) provided in the upper mold (10) presses the sliding inclined surface (410) of the roller guide (400) provided in the lower mold (20) to cause the roller guide (400) to retract, the sliding block (300) coupled to the roller guide (400) retracts together, and the guide plate (500) coupled to the sliding block (300) retracts to open the punching hole (26) of the die (25). The punch (13) is inserted into the opened punching hole (26) to cut the electrode located between the punch (13) and the die (25).

[0046] After the cutting of the electrode is completed, the upper mold (10) rises, and the force that the sliding roller was pressing against the roller guide (400) in the rearward direction is released, and the return spring (610) pushes the sliding block (300) in the frontward direction so that the guide plate (500) moves to cover the punching hole (26) and supports the electrode from below so that the electrode does not sag downward and is prevented from getting caught on the edge of the die (25).

[0047] This prevents damage such as scratches, folds, or tears caused by the electrode getting caught on the die (25) when it is transferred outside the mold.

[0049] In the present invention, the front direction refers to the direction in which the guide plate (500) moves toward the die (25) as the return spring (610) expands, and the rear direction refers to the direction in which the return spring (610) is compressed as the guide plate (500) moves toward the fixed block (600).

[0050] Also, ‘electrode’ refers to a thin metal sheet that is the subject of cutting processing in a stamping die, and ‘guide plate (500) covers the punching hole (26)’ means that the guide plate (500) covers the open upper surface of the punching hole (26).

[0052] FIG. 1 is a perspective view showing a mold equipped with an electrode collision prevention device of the present invention, and the upper base (11) is shown transparently to illustrate the punch holder (12) and the punch (13). Referring to FIG. 1, the upper mold (10) includes an upper base (11), a punch holder (12), and a punch (13). The upper base (11) is a large frame of the upper mold (10) and is coupled to the punch holder (12) on its bottom surface, and the punch (13) is coupled to the bottom surface of the punch holder (12). As the upper mold (10) descends, the punch (13) is inserted into the punching hole (26) of the lower mold (20), and the electrode is cut.

[0053] The lower mold (20) includes a lower base (21), a die holder (22), and a die (25). The lower base (21) is a large frame of the lower mold (20) and is coupled to the die holder (22) on its upper surface. The die (25) is inserted into a hole formed in the die holder (22), and the upper surfaces of the die holder (22) and the die (25) are arranged on the same plane.

[0054] The electrode collision prevention device of the present invention is mounted on a mold, and the remaining components, excluding the sliding roller (100) and roller bracket (110) placed on the upper mold (10), are placed on the lower mold (20).

[0055] The roller bracket (110) and sliding roller (100) are shown as being coupled to the bottom surface of the upper base (11) as an embodiment of the present invention, but are not limited thereto; any position where the roller guide (400) provided in the lower mold (20) can be pressed by the lowering of the upper mold (10) is sufficient.

[0056] Meanwhile, a rail plate (200) is attached to the upper surface of the lower base (21), a fixed block (600) is attached to the rear side of the lower base (21), a sliding block (300) is attached to the rail plate (200), and a roller guide (400) and a guide plate (500) are attached to the sliding block (300).

[0058] FIG. 2 is a perspective view showing the configuration of the electrode collision prevention device of the present invention, and FIG. 3 is an exploded perspective view. Referring to FIG. 2 and FIG. 3, the sliding roller (100) is a rotating roller hinged to the roller bracket (110) and is connected to the upper mold (10) through the roller bracket (110). As the upper mold (10) is raised for stamping the electrode, the sliding roller (100) is also raised together. The roller bracket (110) is fixedly connected to the upper base (11) by bolting.

[0059] A plate-shaped rail plate (200) is bolted and fixedly connected to the upper surface of the lower base (21) of the lower mold (20). A guide rail (210) that guides the movement of the sliding block (300) is formed on the upper surface of the rail plate (200), and the guide rail (210) is connected to the sliding rail (310) of the sliding block (300) so as to slide.

[0060] A sliding block (300) is placed on the rail plate (200). A sliding rail (310) is provided at the bottom of the sliding block (300) to be coupled to slide with the guide rail (210), thereby allowing the sliding block (300) to move smoothly and seamlessly in the forward and backward directions.

[0061] A roller guide (400) is bolted and fixedly connected to the upper part of the sliding block (300) and moves integrally with the sliding block (300). The upper part of the roller guide (400) is formed in a triangular shape, and is positioned so that its hypotenuse faces the upper front side. The hypotenuse is referred to as the sliding inclined surface (410).

[0062] The above sliding inclined surface (410) is a surface that slides with the sliding roller (100), and is formed to slope upward toward the rear and downward toward the front. When the sliding roller (100) presses against the sliding inclined surface (410) due to the lowering of the upper mold (10), the roller guide (400) retracts, and the sliding roller (100) slides to the bottom of the sliding inclined surface (410). On the other hand, when the force pressing against the sliding inclined surface (410) by the sliding roller (100) is removed due to the raising of the upper mold (10), the sliding roller (100) slides to the top of the sliding inclined surface (410), and the roller guide (400) advances. Regardless of the raising and lowering movement of the upper mold (10), the sliding inclined surface (410) and the sliding roller (100) are always in contact.

[0063] The above sliding roller (100) and roller guide (400) are conversion bodies that convert the vertical movement of the upper mold (10) in the up-and-down direction through the sliding inclined surface (410) into the horizontal movement of the sliding block (300) in the front-and-back direction. The roller guide (400), which receives the lifting and lowering motion of the upper mold (10), is fixedly coupled to the sliding block (300) and does not rotate, so its durability against the pressure transmitted from the sliding roller (100) can be improved and it can be used for a long time.

[0064] In addition, since the lifting and lowering motion of the upper mold (10) is converted into the forward and backward horizontal movement direction of the sliding block (300) with very fast responsiveness, it is advantageous to apply to high-speed stamping molds and the operation delay of the guide plate (500) is minimized.

[0065] A return block (320) is bolted and fixed to the sliding block (300), and the front end of a return spring (610) is connected to the return block (320). When the roller guide (400) and the sliding block (300) retract due to the downward movement of the sliding roller (100), the return block (320) compresses the return spring (610). When the force pressing the roller guide (400) is released due to the upward movement of the sliding roller (100), the compressed return spring (610) expands and pushes the return block (320) forward, thereby advancing the sliding block (300) and the roller guide (400).

[0066] Since the direction in which the return spring (610) compresses and expands coincides with the direction in which the roller guide (400) and the sliding block (300) move, the elastic force of the return spring (610) is transmitted to the sliding block (300) without changing the direction in which it is stored and released, thereby providing a rapid response for the force transmission to the sliding block (300).

[0067] A guide plate (500) covering the punching hole (26) of the die (25) is bolted and fixed to the front end of the sliding block (300). The guide plate (500) is in the form of a flat plate and moves integrally with the sliding block (300) while coming into contact with the edge of the die (25). When the sliding block (300) retracts, the guide plate (500) also retracts together to open the punching hole (26), creating a space for the punch (13) to be inserted into the punching hole (26). When the sliding block (300) advances, the guide plate (500) also advances together to cover the punching hole (26), thereby supporting the electrode from below and preventing the electrode from sagging into the punching hole (26).

[0068] A fixing block (600) is bolted to the rear side of the lower base (21) and fixedly connected. The fixing block (600) is connected to and supports the rear end of the return spring (610). The return spring (610) is connected to the fixing block (600) at its rear end and does not move, while its front end is supported by the return block (320) and moves in the forward and backward directions according to the movement of the return block (320).

[0069] The longitudinal direction of the return spring (610) is arranged in the front-rear direction, and it is compressed when the return block (320) coupled to the sliding block (300) retracts. The return block (320) and the sliding block (300) retract due to the pressure transmitted to the roller guide (400), thereby compressing the return spring (610). On the other hand, when the pressure transmitted to the roller guide (400) is released, the compressed return spring (610) expands and presses to push the return block (320) forward, and as the sliding block (300) advances, the guide plate (500) covers the punching hole (26).

[0070] As shown in FIG. 3, the die holder (22) positioned at the bottom is coupled to the lower mold (20), and a die (25) is positioned in a hole formed inside to form a punching hole (26). The die (25) is formed in a 'U' shape. The front upper surface of the die holder (22) and the upper surface of the die (25) are positioned on the same plane and are flat without any step.

[0071] Additionally, a recess (23) is formed on the rear side of the die holder (22) to accommodate the guide plate (500) in order to secure a space for forward and backward movement. The recess (23) is a groove formed concavely at the rear of the die holder (22) to form a step. The upper surface of the guide plate (500) accommodated in the recess (23) is positioned on the same plane as the upper surface of the die (25), or is positioned slightly higher than the upper surface of the die (25) to prevent the electrode from getting caught on the inner edge of the die (25).

[0072] A receiving hole (24) is formed in the above recess (23). To avoid interference with the die holder (22) as the sliding block (300) moves in the forward and backward directions, a receiving hole (24) is formed in the die holder (22) and the front side of the sliding block (300) is received in the receiving hole (24). Additionally, a portion of the rail plate (200) can be further received in the receiving hole (24), and since the rail plate (200) and the sliding block (300) can be positioned as close as possible to the punching hole (26), the length of the guide plate (500) protruding forward from the front end of the sliding block (300) can be shortened, and shaking caused by forward and backward reciprocating movement can be minimized, which is advantageous for high-speed movement.

[0074] FIG. 4 is a plan view showing the reciprocating movement of the guide plate (500) of the present invention to the die (25). As shown in FIG. 4, a 'C'-shaped die (25) is disposed in the die holder (22), and the front upper surface of the die holder (22) and the upper surface of the die (25) are at the same height.

[0075] When the upper mold (10) is raised, as shown in FIG. 4(a), the guide plate (500) advances and enters the punching hole (26) inside the die (25) through the open corner (rear edge) of the die (25) and comes into contact with the inner edge of the die (25). Thus, when the electrode is transferred to the outside of the mold, the edge of the electrode is supported by the guide plate (500) and is not positioned lower than the upper surface of the die (25), so it does not get caught on the die (25). The upper surface of the guide plate (500) does not need to be lower than the upper surface of the die (25), and may have the same height as the upper surface of the die (25) or be slightly higher.

[0076] On the other hand, when the upper mold (10) is lowered, as shown in FIG. 4(b), the guide plate (500) moves to the rear side to open the punching hole (26), and the punch (13) is inserted into the opened punching hole (26) to punch the electrode.

[0078] FIG. 5 shows the upper mold (10) in a state where it is positioned at Top Dead Center (TDC), and FIG. 6 shows the upper mold (10) in a state where it is positioned at Bottom Dead Center (BDC). When the upper mold (10) rises before and after the punch (13) of the upper mold (10) punches the electrode, it becomes the state shown in FIG. 5, and when the punch (13) of the upper mold (10) punches the electrode, it becomes the state shown in FIG. 6. In FIG. 5 and FIG. 6, the die holder (22) is shown in silver lines so that the die (25) inside the die holder (22) is visible.

[0079] Referring to FIG. 5, when the upper mold (10) is at the top dead center, the sliding roller (100) is positioned at the top of the sliding inclined surface (410) of the roller guide (400). The return spring (610) expands to the maximum, and the sliding block (300) advances to the maximum, so that the guide plate (500) covers the punching hole (26) as in FIG. 4(a).

[0080] In order to punch the electrode transferred between the upper mold (10) and the lower mold (20), the upper mold (10) is lowered and the sliding roller (100) transmits pressure to the sliding inclined surface (410) of the roller guide (400), and the roller guide (400), the sliding block (300), and the guide plate (500) are retracted, the return block (320) compresses the return spring (610), and the sliding roller (100) slides to the front lower side of the sliding inclined surface (410) so that the guide plate (500) opens the punching hole (26) in the state as shown in FIG. 4(b) and FIG. 6, and the punch (13) is inserted into the punching hole (26) to cut and process the electrode.

[0081] After the electrode is punched, when the upper mold (10) and the punch (13) rise, the force that the sliding roller (100) was pressing against the sliding inclined surface (410) is released, and the compressed return spring (610) expands and presses the sliding block (300) through the return block (320) to advance it to the state shown in FIG. 5. Accordingly, the guide plate (500) covers the punching hole (26) to support the electrode above it and prevents sagging into the punching hole (26). Explanation of the symbols

[0083] 10: Upper die 11: Upper base 12: Punch holder 13: Punch 20: Lower mold 21: Lower base 22: Die holder 23: Recess section 24: Receiving hole 25: Die 26: Punching hole 100: Sliding roller 110: Roller bracket 200: Rail plate 210: Guide rail 300: Sliding Block 310: Sliding Rail 320: Return Block 400: Roller guide 410: Sliding inclined surface 500: Guide Plate 600: Fixed block 610: Return spring

Claims

Claim 1 An electrode collision prevention device comprising: a sliding roller (100) provided to rotate on a roller bracket (110) coupled to an upper mold (10); a roller guide (400) provided on a lower mold (20), wherein a sliding inclined surface (410) in contact with the sliding roller (100) is formed to be inclined upward toward the rear, so as to move toward the rear when the sliding roller (100) descends; a sliding block (300) coupled to the lower mold (20) to slide in the front and rear directions, to which the roller guide (400) is coupled from the top; a guide plate (500) coupled to the front side of the sliding block (300) to move together with the sliding block (300) and covering a punching hole (26) formed in the die (25) of the lower mold (20); and a return spring (610) that presses the sliding block (300) toward the front. Claim 2 In claim 1, the roller guide (400) is fixedly coupled so as not to rotate with respect to the sliding block (300) and is an electrode collision prevention device that converts the vertical movement of the upper mold (10) in the up-and-down direction into the horizontal movement of the sliding block (300) in the front-and-back direction. Claim 3 In paragraph 2, an electrode collision prevention device in which the expansion and compression directions of the return spring (610) match the forward and backward movement directions of the sliding block (300). Claim 4 The electrode collision prevention device further comprises: a rail plate (200) that is fixedly coupled to the upper surface of the lower mold (20) and is provided with a guide rail (210) that engages with a sliding rail (310) provided at the lower part of the sliding block (300) to guide the movement of the sliding block (300) in the forward and backward directions. Claim 5 In claim 1, a recess (23) is formed in the die (25) of the lower mold (20) to accommodate the guide plate (500), so that the upper surface of the guide plate (500) and the upper surface of the die (25) are arranged on the same plane; and a receiving hole (24) is formed in the recess (23) to accommodate the front end of the sliding block (300); an electrode collision prevention device. Claim 6 An electrode collision prevention device according to claim 1, further comprising: a fixed block (600) that is fixedly coupled to a lower mold (20) and connected to the rear end of a return spring (610); and a return block (320) that is fixedly coupled to a sliding block (300) and supports the front end of a return spring (610).