Inspection system, inspection method, and storage medium

Abstract

In a substrate processing apparatus, an inspection system, an inspection method, and a program effective for improving the stability of processing on a peripheral portion are provided. An inspection system according to one aspect of the present disclosure is a system for inspecting a substrate processing apparatus having a holding support member that holds and supports a substrate, and a peripheral processing member that performs processing on the peripheral portion and has an opposing surface facing the peripheral portion of the surface of the substrate held and supported by the holding support member. The inspection system comprises a support plate held and supported instead of a substrate by the holding support member, an inspection substrate including an imaging unit provided on the support plate to photograph the periphery of the support plate, an imaging target provided on the peripheral processing member to enter the field of view of the imaging unit, a memory unit that stores a positional relationship with the opposing surface, an acquisition unit that acquires an image including the imaging target from the imaging unit, and a position detection unit that detects the position of the opposing surface based on the position of the imaging target in the image and the positional relationship.

Description

Technology Field

[0001] The present disclosure relates to a testing system, a testing method, and a memory medium. Background Technology

[0002] Patent Document 1 discloses a substrate processing apparatus that performs peripheral exposure processing to expose the periphery of a substrate. Additionally, it discloses that the peripheral exposure processing is performed after a carrier unit holding and supporting the substrate moves to an alignment position. Prior art literature

[0003] Japanese Patent Publication No. 2012-222086 The problem to be solved

[0004] The present disclosure provides an inspection system, an inspection method, and a program effective for improving the stability of processing of a peripheral portion in a substrate processing apparatus. means of solving the problem

[0005] An inspection system according to one aspect of the present disclosure is a system for inspecting a substrate processing device having a holding support member that holds and supports a substrate, and a peripheral processing member that performs processing on the peripheral portion of the surface of the substrate held and supported by the holding support member, wherein the system comprises a support plate held and supported instead of the substrate by the holding support member, an imaging unit provided on the support plate to photograph the surroundings of the support plate, an imaging target provided on the peripheral processing member to enter the field of view of the imaging unit, a memory unit that stores a positional relationship with the opposite surface, an acquisition unit that acquires an image including the imaging target from the imaging unit, and a position detection unit that detects the position of the opposite surface based on the position of the imaging target in the image and the positional relationship. Effects of the invention

[0006] According to the present disclosure, an inspection system, an inspection method, and a program effective for improving the stability of processing of a peripheral portion in a substrate processing apparatus can be provided. Brief explanation of the drawing

[0007] FIG. 1 is a plan view schematically illustrating the configuration of a wafer processing system. FIG. 2 is a front view schematically illustrating the configuration of a wafer processing system. Figure 3 is a schematic diagram illustrating an example of a main processing device. Figure 4 is a schematic diagram illustrating an example of an inspection system. Figure 5 is a schematic diagram illustrating an example of an imaging target provided on a mask. Figure 6 is a schematic diagram for explaining the method of detecting slope. Figure 7 is a schematic diagram for explaining an image captured by an imaging unit. FIG. 8 is a schematic diagram for explaining a method for detecting the position of the opposing surface. FIG. 9 is a schematic diagram illustrating an example of an inspection system regarding deformation examples. FIG. 10 is a diagram illustrating an example of the hardware configuration of a control device. FIG. 11 is a flowchart showing an example of a procedure for detecting the position of an opposing surface. FIG. 12 is a flowchart showing an example of a procedure for detecting the position of the opposing surface. Specific details for implementing the invention

[0008] Hereinafter, a wafer processing system as a substrate processing device according to the present embodiment will be described with reference to the drawings. Furthermore, in this specification, elements having substantially the same functional configuration are assigned the same number to omit redundant descriptions. In some drawings, an orthogonal coordinate system defined by the X-axis, Y-axis, and Z-axis is shown. In the following embodiments, the Z-axis corresponds to the vertical direction, and the X-axis and Y-axis correspond to the horizontal direction.

[0009] [Wafer Processing System]

[0010] First, the configuration of the wafer processing system according to the present embodiment will be described. FIGS. 1 and 2 are a plan view and a front view, respectively, schematically illustrating the configuration of the wafer processing system (1) (substrate processing device). In the present embodiment, the case where the wafer processing system (1) is a photolithography processing system that performs a resist film formation process and a development process on a wafer (W) (substrate) will be described as an example.

[0011] As shown in FIG. 1, the wafer processing system (1) has a cassette station (2) into which a cassette (C) containing multiple wafers (W) is loaded and unloaded, and a processing station (3) equipped with multiple various processing devices for performing a predetermined processing on the wafer (W). The wafer processing system (1) has a configuration in which an interface station (4) that performs the transfer of wafers (W) between the cassette station (2), the processing station (3), and an exposure device (not shown) adjacent to the opposite side of the processing station (3) is integrally connected. Additionally, as shown in FIG. 1, two processing stations (3) are installed between the cassette station (2) and the interface station (4), but one station may be installed, or three or more stations may be installed.

[0012] The cassette station (2) is provided with a plurality of cassette loading platforms (21) and wafer transport devices (22 and 23). The cassette station (2) transports wafers (W) between the cassette (C) loaded on the cassette loading platform (21) and the processing station (3) by means of the wafer transport devices (22 or 23). Accordingly, the wafer transport devices (22 and 23) may each be provided with a driving mechanism having a movement path in each direction, such as the horizontal direction (X direction, Y direction), the vertical direction (Z direction), and the vertical axis (θ direction), as needed, or may be provided with a driving mechanism having a movement path in all directions.

[0013] At least one of the wafer transport devices (22 and 23) is capable of receiving and receiving the cassette (C) and the wafer (W), and also capable of receiving and receiving the wafer (W) with the processing station (3). Furthermore, the operation of receiving and receiving the wafer (W) with the processing station (3) is, for example, to perform the receiving and receiving of the wafer (W) between the third block (G3), which is equipped with an accessible receiving device, and the wafer transport device (33) within the processing station (3) described later. The third block (G3) may be equipped with a plurality of receiving devices (not shown) arranged in an up-and-down direction.

[0014] In addition, an inspection device (not shown) for inspecting the wafer (W) may be provided at a location accessible to either of the wafer transport devices (22 and 23).

[0015] In the processing station (3), a plurality of blocks, for example, first, second, fourth, and third blocks (G1, G2, G4), are provided. Additionally, as shown in FIG. 2, a plurality of layers (31) having the first and second blocks (G1, G2) are stacked in the vertical direction. For example, the first block (G1) is provided on the front side of the processing station (3) (the X-direction side in FIG. 1), and the second block (G2) is provided on the back side of the processing station (3) (the X-direction side in FIG. 1). The fourth block (G4) is provided on the interface station (4) side of the processing station (3) (the Y-direction side in FIG. 1) or at the connection portion with an adjacent processing station (3). The fourth block (G4) may be equipped with a plurality of receiving devices arranged in the vertical direction. Additionally, the aforementioned third block (G3) may be provided within the processing station (3).

[0016] In the first block (G1), a plurality of processing devices are arranged, for example, a patterning film forming device and a developing device not all of which are not shown. As for the patterning film forming device, for example, in addition to a resist film forming device, an anti-reflective film forming device may be included. For example, a plurality of processing devices are arranged in a horizontal direction. In addition, the number, arrangement, and type of these processing devices can be selected arbitrarily.

[0017] In these patterning film forming devices or developing devices, for example, a predetermined processing liquid or a predetermined gas is supplied onto a wafer (W). In this way, in the patterning film forming device, a resist film used as a mask when forming a pattern of the lower layer film is formed, or an anti-reflective film is formed to efficiently perform light irradiation treatment, such as exposure treatment. Furthermore, in the developing device, a portion of the exposed resist film is removed to form an uneven shape that serves as the mask.

[0018] For example, in the second block (G2), a heat treatment device (not shown) for performing heat treatment, such as heating or cooling of the wafer (W), is arranged in the vertical and horizontal directions. In addition, in the second block (G2), although not all are shown, a hydrophobization treatment device for performing hydrophobization treatment to increase adhesion between the resist liquid and the wafer (W), and a peripheral exposure device for exposing the outer edge of the wafer (W) are arranged in the vertical direction (Z direction in FIG. 2) and horizontal directions. The number and arrangement of these heat treatment devices, hydrophobization treatment devices, and peripheral exposure devices can also be selected arbitrarily.

[0019] As shown in FIG. 1, a wafer transport area (32) is formed in the area fitted between the first block (G1) and the second block (G2) when viewed in a planar view. In the wafer transport area (32), for example, a wafer transport device (33) is disposed.

[0020] The wafer transport device (33) has a transport arm (33a) that can move, for example, in the Y direction, forward direction, θ direction, and up and down direction. The wafer transport device (33) can move within the wafer transport area (32) and transport a wafer (W) to a predetermined device in the surrounding first block (G1), second block (G2), third block (G3), and fourth block (G4). When there are multiple processing stations (3) as in FIG. 1, the wafer transport device (33) provided in the processing station (3) located on the side of the interface station (4) can transport a wafer (W) to a predetermined device in the fifth block (G5) described later, in addition to the first, second, and fourth blocks (G1, G2, G4).

[0021] A wafer transport device (33) is arranged in multiple units vertically, for example, as shown in FIG. 2. One wafer transport device (33) can transport a wafer (W) to a predetermined device located at the height of a plurality of layers (31) on the upper side among a plurality of layers (31) stacked vertically. For a predetermined device located at the height of a plurality of layers (31) located below those layers (31), another wafer transport device (33) can transport the wafer (W). A plurality of wafer transport areas (32) are provided to enable such transport of the wafer (W). Additionally, the number of wafer transport devices (33) or the number of layers (31) corresponding to one wafer transport device (33) can be arbitrarily selected, such as by providing a wafer transport device (33) for each layer (31).

[0022] Additionally, a shuttle transport device (not shown) may be provided in the wafer transport area (32) or in the first block (G1) or the second block (G2). The shuttle transport device transports the wafer (W) in a straight line between a space adjacent to one side of the processing station (3) and another space adjacent to the opposite side.

[0023] The interface station (4) is provided with a fifth block (G5) having a plurality of receiving devices and wafer transport devices (41 and 42). The interface station (4) transports the wafer (W) using the wafer transport device (41 or 42) between the fifth block (G5), where the wafer (W) is received by the wafer transport device (33), and the exposure device. Accordingly, the wafer transport devices (41 and 42) may each be provided with a driving mechanism having a movement path in each direction, such as the horizontal direction (X direction, Y direction), the vertical direction (Z direction), and the vertical axis (θ direction), as needed, or may be provided with a driving mechanism having a movement path in all directions. At least one of the wafer transport devices (41 and 42) can support the wafer (W) and transport the wafer (W) between the receiving device and the exposure device within the fifth block (G5).

[0024] A cleaning device for cleaning the surface of a wafer (W) or the aforementioned peripheral exposure device may be provided in a location within the interface station (4) where either of the wafer transport devices (41 and 42) can be accessed.

[0025] The inspection device may be provided in the cassette station (2) as described above, but in the processing station (3) and the interface station (4), either of the conveying devices (33, 41, 42 in FIG. 1 or FIG. 2) provided inside each may also be provided in an accessible location.

[0026] The above wafer processing system (1) is provided with a control device (100). The control device (100) is, for example, a computer and has a program storage unit (not shown). The program storage unit stores a program for controlling the processing of a wafer (W) in the wafer processing system (1). In addition, the program storage unit also stores a program for realizing wafer processing in the wafer processing system (1) by controlling the operation of various processing devices or transport devices, etc. described above. In addition, the above program may be recorded on a computer-readable storage medium (H) and installed on the control device (100) from said storage medium (H). The above storage medium (H) may include ROM, RAM, or a hard disk, but its structure or type is not limited, and it may be temporary or non-temporary. Additionally, the control device (100) may include a part that performs program memory, reading, and execution for realizing wafer processing and communication that affects it, and additionally, the material of each part may be placed either inside or outside the wafer processing system (1). The control device (100) may be one or more circuits, may be integrated as a whole, or may be provided in a partially divided manner.

[0027] [Operation of Wafer Processing System]

[0028] The wafer processing system (1) is configured as described above. Next, an example of wafer processing performed using the wafer processing system (1) configured as described above will be explained.

[0029] First, a cassette (C) containing multiple wafers (W) is brought into the cassette station (2) of the wafer processing system (1) and loaded onto the cassette loading platform (21). Subsequently, each wafer (W) in the cassette (C) is sequentially extracted by a wafer transport device (22 or 23) and transported to the receiving device of the third block (G3).

[0030] A wafer (W) that has been returned to the receiving device of the third block (G3) is supported by a wafer receiving device (33) and returned to a hydrophobization processing device provided in the second block (G2) to perform hydrophobization processing. Subsequently, it is returned to a resist film forming device by the wafer receiving device (33) to form a resist film on the wafer (W), and then returned to a heat treatment device to perform pre-baking processing, and then returned to the receiving device of the fifth block (G5). In addition, as shown in FIGS. 1 and 2, if there are multiple processing stations (3), the wafer (W) is first placed in the receiving device of the fourth block (G4) before being returned to the receiving device of the fifth block (G5), and then the receiving process is performed between the multiple wafer receiving devices (33). Additionally, if necessary, the wafer (W) may be returned to a peripheral exposure device by the wafer receiving device (33) to perform exposure processing on the periphery of the wafer (W).

[0031] The wafer (W) returned to the receiving device of the fifth block (G5) is returned to the exposure device by the wafer transport device (41 and 42) and is exposed to a predetermined pattern. Additionally, the wafer (W) may be cleaned with a cleaning device before the exposure process.

[0032] The photo-exposed wafer (W) is returned to the receiving device of the fifth block (G5) by the wafer transport device (41 and 42). After that, it is returned to the heat treatment device by the wafer transport device (33) and baked after exposure.

[0033] After exposure, the wafer (W) that has been baked is returned to a developing device by the wafer transport device (33) and developed. After development is finished, the wafer (W) is returned to a heat treatment device by the wafer transport device (33) and post-baked.

[0034] After that, the wafer (W) is returned to the receiving device of the third block (G3) by the wafer return device (33), and is returned to the cassette (C) of the predetermined cassette loading stand (21) by the wafer return device (22 or 23) of the cassette station (2). In this way, a series of photolithography processes is completed.

[0035] Furthermore, the wafer processing system in the present disclosure is not limited to the configuration and operation described above. For example, in the form of the above-described embodiment, the wafer processing system (1) is directly connected to an exposure device and transfers wafers (W) between the interface station (4) and the exposure device, but the wafer processing system does not need to be directly connected to the exposure device. In that case, for example, the wafer (W) is transferred from the cassette station (2) to the processing station (3), and after the necessary processing is performed, it is transferred back to the cassette station (2) to be transferred outside the system. Additionally, regarding the processing device that was exemplified but is not required, it does not need to be provided in the wafer processing system, or processing in that device does not need to be performed.

[0036] [Main Processing Unit]

[0037] The wafer processing system (1) may further include a peripheral processing device (50). An example of the peripheral processing device (50) is the peripheral exposure device described above. As shown in FIG. 3, the peripheral processing device (50) is equipped with a holding support member (51) and a peripheral processing member (60).

[0038] The holding support member (51) has a loading surface (51a) on which a wafer (W) is loaded. The loading surface (51a) holds and supports the wafer (W) so that the surface (Wa) of the wafer (W) is horizontal. For example, the loading surface (51a) holds and supports the wafer (W) by contacting the back surface (Wb) (a side opposite to the surface (Wa)) of the wafer (W) from below and adsorbing the back surface (Wb). The holding support member (51) is configured to be detachable from the main processing device (50). The wafer processing system (1) may have a plurality of holding support members (51) with different sizes (size in the direction along the back surface (Wb)). The plurality of holding support members (51) can be used separately according to the size of the wafer (W) to be processed.

[0039] The edge processing device (50) performs edge processing on the edge portion (We) of the surface (Wa) of the wafer (W). The edge portion (We) is an annular region that includes the edge of the surface (Wa) and its vicinity. As an example, the edge processing device (50) performs exposure processing on the edge portion (We) of the wafer (W) to remove the edge portion of the resist film formed on the surface (Wa).

[0040] The main processing unit (60) has an irradiation head (61) and a mask (62). The mask (62) is detachably installed on the irradiation head (61). The mask (62) includes an opposing surface (62a) and a periphery surface (62b). The opposing surface (62a) is a surface that faces the main part (We) in the vertical direction during main processing. For example, the opposing surface (62a) faces vertically downward so as to face the main part (We) from above. The periphery surface (62b) is above the opposing surface (62a) and faces the entire periphery of the Z-axis. The periphery surface (62b) is cylindrical and includes a flat surface (62c) formed by cutting out a part of the cylinder (see FIG. 7). The flat surface (62c) follows the vertical direction (Z-direction).

[0041] Here, an example of the aforementioned exposure treatment is described. Light for the exposure treatment is generated by a light source (not shown), such as an ultra-high pressure mercury lamp, and is directed to an irradiation head (61) via a light-guiding member, such as an optical fiber (not shown). The shape of the light beam of the exposure treatment guided to the irradiation head (61) is changed by an optical member, such as a lens provided inside the irradiation head (61), and a slit provided in the mask (62). By irradiating the light beam with the shape changed in this way from the opposing surface (62a) to the peripheral portion (We), peripheral treatment is performed on the wafer (W).

[0042] The main processing device (50) may further include a housing (55) that accommodates the above-described holding support member (51) and main processing member (60), etc. The housing (55) has a bottom part (55a), a top part (55b), and a surrounding wall (55c) that surrounds the space between the bottom part (55a) and the top part (55b). The housing (55) may be formed to extend along the X direction. An inlet / outlet port (55d) for loading and unloading a wafer (W) is formed in a part of the surrounding wall (55c). For example, the inlet / outlet port (55d) is opened toward one side of the length direction of the housing (55) (for example, the X-axis direction). The wafer (W) is brought into the inside of the housing (55) from the wafer transport area (32) via the inlet / outlet (55d), and after the main processing is performed, it is discharged from the inside of the housing (55) to the wafer transport area (32).

[0043] The main processing device (50) may further be equipped with a rotary drive unit (52). The rotary drive unit (52) is connected to the holding support unit (51) from below. The rotary drive unit (52) rotates the holding support unit (51) around a vertical axis (an axis along the out-of-plane direction of the surface (Wa)) by means of a driving source, such as an electric motor. A wafer (W) is loaded on the holding support unit (51) such that the center of the wafer (W) roughly coincides with the rotation axis of the rotary drive unit (52). As the rotary drive unit (52) rotates the holding support unit (51), the wafer (W) held and supported by the holding support unit (51) rotates around a vertical axis line passing through its center (including the vicinity of the center).

[0044] The main processing unit (50) may further be equipped with a linear drive unit (53). The linear drive unit (53) moves the holding support unit (51) (and the rotation drive unit (52)) along a displacement direction (D) perpendicular to the rotation axis of the holding support unit (51). In this embodiment, the displacement direction (D) is a direction extending between the main processing unit (60) and the inlet / outlet (55d) (the length direction of the housing (55), X direction). The linear drive unit (53) is, for example, a ball screw type that moves the holding support unit (51) by rotating a ball screw (53a) along the X direction by a moving motor (53b). The linear drive unit (53) may be a cylinder type that moves the holding support unit (51) by means of a cylinder, or a belt type that moves the holding support unit (51) by means of a belt and a pulley. The linear drive unit (53) is movable between a first position (P1) of one end portion in the X direction of the housing (55) and a second position (P2) of the other end portion in the X direction of the housing (55). In the X direction, the inlet / outlet (55d) of the housing (55), the first position (P1), and the second position (P2) are arranged in this order.

[0045] A wafer (W) brought into the peripheral processing unit (50) from the wafer transport area (32) is held and supported by a holding support member (51) at a first position (P1), and then transported to a second position (P2) by a linear drive member (53). The opposing surface (62a) of the peripheral processing unit (60) faces from above the peripheral portion (We) of the wafer (W) transported to the second position (P2). In the peripheral processing unit (60), while the peripheral processing unit (60) is irradiating light for exposure, the wafer (W) at the second position (P2) is rotated by a rotation drive member (52), thereby irradiating light for exposure over the entire circumference of the peripheral portion (We) of the wafer (W).

[0046] [Inspection System]

[0047] In the wafer processing system (1), the position of the opposing surface (62a) (e.g., the position in the Z direction) affects the result of the peripheral processing. For example, if the position of the opposing surface (62a) changes, the intensity and range of the processing may change. In addition, there is a risk that the wafer (W) and the mask (62) may come into contact during transport by the linear drive unit (53), making it impossible to perform the processing. Therefore, the wafer processing system (1) further includes an inspection system (70).

[0048] Referring to FIG. 4, an inspection system (70) is described. The inspection system (70) is equipped with an inspection substrate (71), an imaging target (63), a memory unit (111), an acquisition unit (112), and a position detection unit (113). The inspection substrate (71) has a support plate (72) and an imaging unit (73). The memory unit (111), the acquisition unit (112), and the position detection unit (113) are functional components (hereinafter referred to as "functional blocks") and are configured by a control device (100).

[0049] The support plate (72) is supported by the holding support member (51) instead of the wafer (W). The support plate (72) has an external shape (e.g., circular) similar to the wafer (W) when viewed in a flat plane. Additionally, the support plate (72) may have an external shape that allows it to be brought into the inside of the housing (55) via the inlet / outlet (55d), just like the wafer (W). The support plate (72) is formed from a material such as ceramic, for example.

[0050] The imaging unit (73) is provided on the support plate (72) (on the surface (72a)) to photograph the area around the support plate (72). That is, the support plate (72) supports the imaging unit (73). Here, "photographing the area around the support plate (72)" means photographing the area spaced apart from the center (CP) (see FIG. 6) of the support plate (72), and includes photographing the area around the space located on the support plate (72). For example, the imaging unit (73) is provided on the peripheral portion of the surface (72a) and is oriented toward the area spaced apart from the center (CP) along the diameter direction passing through the center (CP). For example, a camera is used as the imaging unit (73). Near the imaging unit (73), lighting (not shown) may be provided to illuminate the area being photographed by the imaging unit (73). The imaging unit (73) may be provided on a concave portion (72b) partially formed on the surface (72a). By suppressing the height of the imaging unit (73), it becomes easier to prevent the imaging unit (73) from colliding with surrounding objects during rotation or movement of the holding support member (51).

[0051] The inspection substrate (71) may also have an acceleration sensor (74). The acceleration sensor (74) is provided, for example, on a support plate (72). The acceleration sensor (74) detects the direction and magnitude of acceleration occurring on the support plate (72) along a direction parallel to the surface (72a).

[0052] The imaging target (63) is provided to be within the field of view of the imaging unit (73). For example, the imaging target (63) is provided on the periphery surface (62b) so as to be within the field of view of the imaging unit (73) when the imaging unit (73) is facing the peripheral processing unit (60). For example, the flat surface (62c) of the periphery surface (62b) faces the inlet / outlet (55d), and the imaging target (63) is provided on the flat surface (62c). The imaging target (63) is a rectangle extended in a direction perpendicular to the vertical direction (Z direction) and the displacement direction (D) (e.g., Y direction). The imaging target (63) has a first section (63b) and a second section (63c) in the Y direction, and an upper section (63d) and a lower section (63a) in the Z direction. For example, the imaging target (63) is an unpainted part that is masked when painting the mask (62).

[0053] As shown in FIG. 5, the imaging target (63) may have a mark (64) for position determination. The mark (64) is formed between the first section (63b) and the second section (63c). For example, the mark (64) is extended along the Z direction to connect the upper section (63d) and the lower section (63a). Accordingly, the imaging target (63) is divided into a first section (631) and a second section (632) arranged in a horizontal direction. The mark (64) may be located at an intermediate position between the first section (63b) and the second section (63c). For example, the distance between the first section (63b) and the mark (64) is equal to the distance between the second section (63c) and the mark (64).

[0054] The memory unit (111) stores the positional relationship between the imaging target (63) and the opposing surface (62a). The positional relationship is, for example, the positional relationship between the imaging target (63) and the opposing surface (62a) in the vertical direction. The positional relationship may be the relative position (for example, relative height) of the opposing surface (62a) relative to the imaging target (63), or the relative position (for example, relative height) of the imaging target (63) relative to the opposing surface (62a). As an example, the memory unit (111) stores the vertical relationship between the bottom (63a) of the imaging target (63) and the opposing surface (62a), and the vertical distance (d1) between the bottom (63a) and the opposing surface (62a). In addition, as shown in FIG. 5, if the opposing surface (62a) is not composed of a flat plane, the lowest part located in the vertical direction of the opposing surface (62a) is designated as the position of the opposing surface (62a).

[0055] The acquisition unit (112) acquires an image (I) including an image target (63) from the imaging unit (73). The image (I) is, for example, a digital image. Also, as an example, the size of the image (I) is a VGA size of 480 pixels vertically × 640 pixels horizontally.

[0056] The position detection unit (113) detects the position of the opposing surface (62a) based on the position of the imaging target (63) in the image (I) and the position relationship (e.g., distance (d1)). For example, the position detection unit (113) detects the actual position of the bottom (63a) of the imaging target (63) from the position of the pixel in the image (I) where the bottom (63a) of the imaging target (63) is captured. The position detection unit (113) detects the position of the opposing surface (62a) based on the detected actual position of the bottom (63a), the upper limit relationship between the bottom (63a) and the opposing surface (62a), and the distance (d1) from the bottom (63a) to the opposing surface (62a).

[0057] The inspection system (70) may further be provided with a rotation control unit (114). The rotation control unit (114) is a functional block configured by the control device (100). The rotation control unit (114) directs the imaging unit (73) toward the imaging target (63) by controlling the rotation drive unit (52). Additionally, the inspection system (70) may further be provided with an imaging direction detection unit (115). The imaging direction detection unit (115) detects the inclination (α1) of the imaging direction of the imaging unit (73) relative to the displacement direction (D) based on the detection result of the acceleration sensor (74).

[0058] Referring to FIG. 6, the detection of the inclination (α1) is described. As described above, the acceleration sensor (74) detects the direction and magnitude of the acceleration occurring in the support plate (72) along a direction parallel to the surface (72a). The imaging direction detection unit (115) detects the direction of acceleration detected by the acceleration sensor (74) as the inclination (α2) of the displacement direction (D) relative to the acceleration sensor (74) when the holding support member (51) holding the support plate (72) moves along the displacement direction (D). The imaging direction detection unit (115) calculates the inclination (α1) of the imaging direction relative to the displacement direction (D) based on the detected inclination (α2) and the inclination (α3) of the imaging direction relative to the acceleration sensor (74). The inclination (α3) is stored in advance. For example, the imaging direction detection unit (115) calculates the inclination (α1) of the imaging direction relative to the displacement direction (D) based on the difference from α3 and the inclination (α2). The rotation control unit (114) may direct the imaging unit (73) toward the imaging target (63) by the rotation drive unit (52) based on the detection result of the inclination (α1). For example, the rotation control unit (114) rotates the holding support unit (51) so that the inclination (α1) becomes zero.

[0059] As shown in FIG. 7(a), the rotation control unit (114) may further control the rotation drive unit (52) so that the mark (64) of the imaging target (63) falls within a predetermined range (R) in the image (I). The predetermined range (R) is set in pixel units in the horizontal direction of the image (I), for example.

[0060] The rotation control unit (114) may rotate the holding support unit (51) so that when the mark (64) is outside the image (I) and the first stage (63b) described above is inside the image (I), the imaging unit (73) moves the holding support unit (51) so that the second stage (63c) described above moves the mark (64) to a predetermined range (R) by rotating the holding support unit (51) so that when the mark (64) is outside the image (I) and the second stage (63c) is inside the image (I), the imaging unit (73) moves the mark (64) so ​​that the second stage (63c) moves the mark (64) to a predetermined range (R).

[0061] FIG. 7(b) shows a state in which the mark (64) is not included in the image (I) and the first stage (63b) is included. At this time, the tilt (α1) of the imaging unit (73) is shown as α1b in FIG. 7. When the image (I) is as described above, the rotation control unit (114) rotates the holding support unit (51) so that the imaging unit (73) is displaced from the first stage (63b) toward the second stage (63c), thereby moving the mark (64) into a predetermined range (R) as in FIG. 7(a).

[0062] FIG. 7(c) shows a state in which the mark (64) is not included in the image (I) and the second stage (63c) is included. At this time, the tilt (α1) of the imaging unit (73) is shown as α1c in FIG. 7. When the image (I) is as described above, the rotation control unit (114) moves the mark (64) into a predetermined range (R) as in FIG. 7(a) by rotating the holding support unit (51) so that the imaging unit (73) is displaced from the second stage (63c) toward the first stage (63b).

[0063] The inspection system (70) may further be equipped with an abnormality detection unit (116). The abnormality detection unit (116) is a functional block configured by the control device (100). The abnormality detection unit (116) detects various abnormalities in the inspection system (70). As an example, the abnormality detection unit (116) detects an abnormality when the image (I) does not contain the image target (63) after the rotation control unit (114) rotates the holding support unit (51) by the rotation drive unit (52) so that the imaging unit (73) is directed toward the imaging target (63) based on the detection result of the tilt (α1). Fig. 7 (d) shows a state in which the image (I) does not contain the imaging target (63).

[0064] Additionally, the imaging target (63) is not limited to the configuration described above. For example, the imaging target (63) may be a cross-shaped mark. In this case, the vertical line of the cross may be used as the mark (64), and the two ends of the horizontal line of the cross may be used as the first section (63b) and the second section (63c) described above. The mark (64) does not necessarily have to be extended in the vertical direction and may be a dot. The imaging target (63) may have three elements arranged in the horizontal direction in a form different from the first section (63b), the mark (64), and the second section (63c). The three elements may be three dots arranged in the horizontal direction, or three line segments each extending in the vertical direction. Instead of painting the area around the imaging target (63) and leaving the imaging target (63) unpainted, the area may be left unpainted and the imaging target (63) may be formed by painting.

[0065] The inspection system (70) may further be equipped with a notification control unit (117). The notification control unit (117) is a functional block configured by the control device (100). When an abnormality is detected by the abnormality detection unit (116), the notification control unit (117) activates a notification device (not shown) that notifies the outside of the abnormality. The notification device is, for example, a monitor, and the notification control unit (117) sends a signal to the notification device to indicate that an abnormality has occurred on the monitor. The means indicating that an abnormality has occurred is not limited to visual information and may be auditory information such as a buzzer.

[0066] The inspection system (70) may further include a linear control unit (118). The linear control unit (118) is a functional block configured by the control device (100). The linear control unit (118) adjusts the position of the imaging unit (73) by the linear driving unit (53) so that the imaging target (63) converges within the depth of focus of the imaging unit (73). Depth of focus refers to a range in which the required resolution can be maintained along a line along the center of the optical axis of the imaging unit (73). As an example, the linear control unit (118) controls the linear driving unit (53) so that the holding support unit (51) is positioned at a third position (P3). When the holding support unit (51) is positioned at the third position (P3), the imaging target (63) converges within the depth of focus of the imaging unit (73). In this embodiment, when the holding support member (51) is positioned at the third position (P3), the distance in the X direction between the inspection substrate (71) and the mask (62) is about 3 mm.

[0067] The inspection system (70) may detect the position of the opposing surface (62a) by the position detection unit (113) described above while the holding support member (51) is positioned at the third position (P3) as described above. Additionally, the position detection unit (113) may also detect the position of the opposing surface (62a) based on the relationship between the size of the imaging target (63) in the image (I) and the actual size of the imaging target (63).

[0068] For example, the position detection unit (113) may also detect the position of the opposite surface (62a) based on the relationship between the width (W1) (see FIG. 7) and the actual width (W2) (see FIG. 5) within the image (I) of the imaging target (63) in a direction perpendicular to the opposite surface (62a). When the imaging target (63) is rectangular, the width (W1) and the width (W2) are, for example, the distance between the top (63d) and the bottom (63a). When the width (W2) is known, by measuring the number of pixels of the width (W1) within the image (I), a coefficient (X) that converts one pixel of the image (I) into an actual distance can be determined from the number of pixels and the width (W2). By this, the position of the lower part (63a) of the imaging target (63) in the vertical direction can be detected with high precision from the image (I), so the position of the opposing surface (62a) can be detected with higher precision.

[0069] Additionally, the width of the imaging target (63) in a direction perpendicular to the opposing surface (62a) is not necessarily limited to the distance between the top (63d) and bottom (63a) of the rectangular imaging target (63). For example, in the case of the cross-shaped imaging target (63) described above, the length of the vertical line can be used as the width of the imaging target (63). Also, if the imaging target (63) has three line segments arranged in a horizontal direction, the length of at least one of the three line segments can be used as the width of the imaging target (63). The imaging target (63) may have two points arranged in an up-and-down direction. In this case, the distance between the two points can be used as the width of the imaging target (63). That is, the imaging target (63) may have two elements spaced apart in the vertical direction, or elements having a finite size in the vertical direction, just like the upper (63d) and lower (63a).

[0070] The position detection unit (113) may detect the distance (d2) between the plane (PL) where the surface (Wa) of the wafer (W) is located when it is held and supported by the holding support unit (51) and the opposing plane (62a) as the position of the opposing plane (62a). As an example, the position detection unit (113) may detect the distance (d2) between the plane (PL) and the opposing plane (62a) based on the position of the imaging target (63) in the image (I), the position relationship (up-down relationship and distance (d1)), the relationship between the size of the imaging target (63) in the image (I) and the actual size of the imaging target (63), the position of the imaging unit (73) relative to the holding support unit (51), and the thickness (T) of the wafer (W).

[0071] The above detection procedure will be explained in detail with reference to FIG. 8. Here, the distance in the vertical direction is simply referred to as the distance. Also, the height at which the loading surface (51a) of the holding support member (51) is located is set as the reference height O. The position of the imaging unit (73) relative to the holding support member (51) is, for example, the distance (d3) between the loading surface (51a) of the holding support member (51) and the center of the light receiving element of the imaging unit (73), and corresponds to the height (H1) in FIG. 8.

[0072] Next, within the image (I), the number of pixels (PN) from the center pixel of the image (I) to the bottom (63a) of the imaging target (63) is measured. Additionally, a coefficient (X) that converts one pixel into an actual distance is calculated from the relationship between the size of the imaging target (63) within the image (I) and the actual size of the imaging target (63), and by multiplying the coefficient (X) by the number of pixels (PN), the height (H1) and the distance (d4) between the bottom (63a) can be obtained. By doing so, the height (H2) of the bottom (63a) is obtained.

[0073] Next, based on the positional relationship between the imaging target (63) and the opposing surface (62a) (distance (d1) between the bottom (63a) and the opposing surface (62a)) and the height (H2) stored in the memory unit (111), the height (H3) of the opposing surface (62a) relative to the reference height O is obtained.

[0074] Next, based on the thickness (T) of the wafer (W), the height of the surface (Wa) relative to the reference height O (i.e., the height of the plane (PL)) (H4) is obtained. Then, based on the height (H3) and the height (H4) obtained in the order described above, the gap (d2) between the plane (PL) and the opposing surface (62a) is obtained. Combining the above, the gap (d2) is calculated by the following formula.

[0075] d2=d3+PN×X-d1-T···(1)

[0076] Additionally, as the position of the imaging target (63), it is not necessary to use the bottom (63a); the top (63d) or the center of the imaging target (63) may also be used.

[0077] FIG. 9 shows a modified configuration example of an inspection system (70). As shown in FIG. 9, the imaging direction detection unit (115) may be provided on an inspection substrate (71). For example, the inspection substrate (71) may further include a computing device (700), and the imaging direction detection unit (115) may be a functional block configured by the computing device (700).

[0078] The inspection system (70) may further be provided with a reaction force amount (bending amount) memory unit (711). The reaction force amount memory unit (711) stores the reaction force amount of the wafer (W) while it is in a state of being held and supported by the holding support unit (51). The reaction force amount (bending amount) is, for example, the amount of downward movement of the peripheral portion (We) caused by the reaction force of the wafer (W). The reaction force amount can be measured in advance using a laser displacement meter, for example, while the wafer for adjustment is loaded onto the holding support unit (51). In addition, since the reaction force amount changes depending on the size of the holding support unit (51), the reaction force amount memory unit (711) may store multiple reaction force amounts corresponding to each of the multiple sizes of the holding support unit (51). As illustrated, the reaction force amount memory unit (711) may be provided on the inspection substrate (71). For example, the reaction force amount memory unit (711) may be a functional block configured by the computing device (700).

[0079] The position detection unit (113) may also detect the gap (d2) between the plane (PL) and the opposing surface (62a) based on the above-described amount of reaction force. For example, the position detection unit (113) may detect the gap (d2) by adding the amount of reaction force to the gap (d2) calculated by the above-described equation (1). The position detection unit (113) may acquire size information of the holding support unit (51), and extract the amount of reaction force of the wafer (W) corresponding to the size of the holding support unit (51) from the amount of reaction force memory unit (711) and use it to detect the gap (d2).

[0080] The reaction force amount memory unit (711) may also store the reaction force amount of the inspection substrate (71) in addition to the reaction force amount of the wafer (W). The reaction force amount of the inspection substrate (71) is, for example, the amount of downward movement of the imaging unit (73) caused by the reaction force of the inspection substrate (71). The reaction force amount of the inspection substrate (71) may also be measured in advance using a laser displacement meter, etc. The reaction force amount memory unit (711) may also store multiple reaction force amounts corresponding to each of the multiple sizes of the holding support unit (51) for the inspection substrate (71).

[0081] If the reaction force amount memory unit (711) also stores the reaction force amount of the inspection substrate (71), the position detection unit (113) may detect the above-described gap (d2) based on both the reaction force amount of the wafer (W) and the reaction force amount of the inspection substrate (71). For example, the position detection unit (113) may detect the gap (d2) by adding the reaction force amount of the wafer (W) and subtracting the reaction force amount of the inspection substrate (71) to the gap (d2) calculated by the above-described equation (1). The position detection unit (113) may acquire size information of the holding support unit (51), and extract the reaction force amount of the wafer (W) and the reaction force amount of the inspection substrate (71) corresponding to the size of the holding support unit (51) from the reaction force amount memory unit (711) and use them for detecting the gap (d2).

[0082] The abnormality detection unit (116) may also detect an abnormality when the gap (d2) between the plane (PL) and the opposing surface (62a) is outside a predetermined range. As an example, the abnormality detection unit (116) is set to detect an abnormality when the gap (d2) is 0.2 mm or less. By doing so, contact between the opposing surface (62a) and the wafer (W) is suppressed when the edge processing is performed on the wafer (W) by the edge processing device (50). The threshold of the gap (d2) that is judged to be an abnormality can be set by adding various tolerances that may occur in the inspection system (70) for the desired gap (d2). Additionally, the abnormality detection unit (116) may detect an abnormality when the gap (d2) is greater than the predetermined threshold.

[0083] The inspection system (70) may further be equipped with an adsorption control unit (119). The adsorption control unit (119) is a functional block configured by the control device (100). The adsorption control unit (119) releases the adsorption of the inspection substrate (71) by the holding support unit (51) and re-adsorbs the inspection substrate (71) by the holding support unit (51). During the process of the inspection substrate (71) being transported within the wafer processing system (1), some of the heat generated from the CPU (not shown) provided on the inspection substrate (71) is transferred to the holding support unit (51), causing the support plate (72), etc., to expand and generate a reaction force. As described above, by releasing the inspection substrate (71) that has been adsorbed and held by the holding support unit (51) and then adsorbing it again, the reaction force generated as described above can be suppressed. The position detection unit (113) may detect the position of the opposing surface (62a) based on the image (I) acquired after the holding support unit (51) re-adsorbs the inspection substrate (71).

[0084] In addition, the use of the inspection substrate (71) is not limited to the inspection of the main processing device (50). For example, the inspection substrate (71) may be used to inspect a patterning film forming device or a developing device. For example, it may be used to inspect whether the height of a component constituting the developing device (such as a circular cup arranged to surround the wafer) is appropriate. In addition, at that time, at least any of the above-described function blocks may be used. For example, the inspection substrate (71) may be directed so that the imaging unit (73) faces a desired direction based on the detection result by the imaging direction detection unit (115) and the image (I) in which the processing nozzle of the developing device or the cup, etc., is captured by the imaging unit (73).

[0085] In addition, in the above examples, the functional block configured by the control device (100) may be configured by the arithmetic device (700). Likewise, in the above examples, the functional block configured by the arithmetic device (700) may be configured by the control device (100). For example, the acquisition unit (112) may be configured by the arithmetic device (700) of the inspection board (71), and the reaction force amount memory unit (711) may be configured by the control device (100).

[0086] FIG. 10 is a block diagram illustrating the hardware configuration of a control device (100). As shown in FIG. 10, the control device has a circuit (190). The circuit (190) has a processor (191), a memory (192), a storage (193), a communication port (194), and a driving circuit (195).

[0087] Storage (193) includes, for example, one or more computer-readable non-volatile memory media. The non-volatile memory media includes one or more storage devices. Examples of one or more storage devices include a hard disk drive, a solid-state drive, flash memory, etc. The non-volatile memory media may include portable memory media such as an optical disc. Storage (193) stores a program for executing to the control device (100) the following: holding and supporting the support plate (72) by the holding support member (51); photographing the surroundings of the support plate (72) by the imaging member (73) provided on the support plate (72); storing the positional relationship between the imaging target (63) provided in the peripheral processing member (60) and the opposing surface (62a) that enters the field of view of the imaging member (73); acquiring an image (I) including the imaging target (63) by the imaging member (73); and detecting the position of the opposing surface (62a) based on the positional relationship between the imaging target (63) in the image (I). For example, storage (193) stores a program for configuring each of the above-described function blocks in the control device (100).

[0088] Memory (192) includes one or more computer-readable volatile memory media. The volatile memory media includes one or more memory devices. Examples of one or more memory devices include random access memory. Memory (192) temporarily stores a program loaded from storage (193). The processor (191) includes one or more computation devices. Examples of computation devices include a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit). The processor (191) configures each of the above-described function blocks in the control device (100) by executing the program loaded in memory (192). The processor (191) may temporarily store the computation result in memory (192).

[0089] The communication port (194) performs wireless communication between the inspection boards (71) in accordance with instructions from the processor (191). Examples of wireless communication include Wi-Fi (registered trademark) and Bluetooth (registered trademark).

[0090] The driving circuit (195) controls the rotary driving unit (52), the linear driving unit (53), and the arms provided in each wafer transport device (22, 23, 33, 41, 42) (except for the transport arm (33a) of the wafer transport device (33), which is not shown) in response to a request from the processor (191).

[0091] [Inspection Procedure]

[0092] As an example of an inspection method, an inspection sequence executed by an inspection system (70) is exemplified. The inspection sequence includes holding and supporting a support plate (72) that constitutes an inspection substrate (71) instead of a wafer (W) by a holding support member (51), photographing the surroundings of the support plate (72) by an imaging unit (73) provided on the support plate (72), recording the positional relationship between an imaging target (63) provided in a peripheral processing unit (60) that enters the field of view of the imaging unit (73) and an opposing surface (62a), acquiring an image (I) including the imaging target (63) by the imaging unit (73), and detecting the position of the opposing surface (62a) based on the position of the imaging target (63) in the image (I) and the positional relationship.

[0093] FIGS. 11 and FIGS. 12 are flowcharts illustrating the sequence for detecting the position of the opposing surface (62a). The wafer processing system (1) executes steps S01 and S02. In step S01, a cassette (C) containing a test substrate (71) is loaded onto a cassette loading platform (21) of a cassette station (2). In step S02, a wafer transport device (22) or a wafer transport device (23) extracts the test substrate (71) from the cassette (C), and the test substrate (71) is brought into a peripheral processing device (50) via a block (G3), a wafer transport device (33), and an inlet / outlet port (55d).

[0094] Next, the inspection system (70) executes steps S03, S04, S05, S06, and S07. In step S03, a linear control unit (118) controls a linear drive unit (53) so that the inspection substrate (71) is returned from a first position (P1) toward a third position (P3). In step S04, based on the detection result of the acceleration sensor (74), the imaging direction detection unit (115) detects the inclination (α1) of the imaging direction of the imaging unit (73) toward the displacement direction (D). In step S05, a rotation control unit (114) controls a rotation drive unit (52) so that the imaging unit (73) faces the imaging target (63). In step S06, the linear control unit (118) controls the linear driving unit (53) so that the imaging target (63) converges within the depth of focus of the imaging unit (73). In step S07, the adsorption control unit (119) controls the holding support unit (51) so that the inspection substrate (71), which is adsorbed and held by the holding support unit (51), is released and then adsorbed again.

[0095] Next, the inspection system (70) executes steps S08 and S09. In step S08, the acquisition unit (112) acquires an image (I) including an image target (63) from the imaging unit (73). In step S09, the rotation control unit (114) determines whether the position of the mark (64) in the image (I) is within a predetermined range (R).

[0096] In step S09, if it is determined that the position of the mark (64) in the image (I) is within a predetermined range (R), the inspection system executes steps S10 and S11. In step S10, the position detection unit (113) detects the distance (d2) between the plane (PL) where the surface (Wa) of the wafer (W) is located when held and supported by the holding support unit (51) and the opposing surface (62a) as the position of the opposing surface (62a). In step S11, the abnormality detection unit (116) determines whether the distance (d2) between the plane (PL) and the opposing surface (62a) is within a predetermined range.

[0097] In step S09, if it is determined that the position of the mark (64) in the image (I) is outside the predetermined range (R), the inspection system executes step S12. In step S12, the rotation control unit (114) determines whether the mark (64) is imprinted on the image (I).

[0098] In step S12, if it is determined that the mark (64) is imprinted on the image (I), the inspection system (70) executes step S13. In step S13, the rotation control unit (114) controls the rotation drive unit (52) so that the mark (64) falls within a predetermined range (R). After executing step S13, the inspection system (70) executes step S08 again.

[0099] In step S12, if it is determined that the mark (64) is not imprinted on the image (I), the inspection system (70) executes step S14. In step S14, the rotation control unit (114) determines whether the first stage (63b) is imprinted on the image (I).

[0100] In step S14, if it is determined that the first stage (63b) is captured in the image (I), the inspection system (70) executes step S15. In step S15, the rotation control unit (114) rotates the holding support unit (51) so that the imaging unit (73) is displaced from the first stage (63b) toward the second stage (63c). After executing step S15, the inspection system (70) executes step S08 again.

[0101] In step S14, if it is determined that the first stage (63b) is not captured in the image (I), the inspection system (70) executes step S16. In step S16, the rotation control unit (114) determines whether the second stage (63c) is captured in the image (I).

[0102] In step S16, if it is determined that the second stage (63c) is captured in the image (I), the inspection system (70) executes step S17. In step S17, the rotation control unit (114) rotates the holding support unit (51) so that the imaging unit (73) is displaced from the second stage (63c) toward the first stage (63b). After executing step S17, the inspection system (70) executes step S08 again.

[0103] In step S11, if it is determined that the gap (d2) between the plane (PL) and the opposing surface (62a) is outside a predetermined range, the inspection system (70) executes step S18. In step S18, as an abnormality is detected by the abnormality detection unit (116), a notification device that notifies the outside of the abnormality is operated by the notification control unit (117). In step S16, if it is determined that the second stage (63c) is not captured in the image (I), the inspection system (70) likewise executes step S18.

[0104] In step S11, if it is determined that the distance (d2) between the plane (PL) and the opposing surface (62a) is within a predetermined range, or after executing step S18, the inspection system (70) terminates the detection of the position of the opposing surface (62a).

[0105] [organize]

[0106] The embodiments exemplified above include the following configurations.

[0107] (1) A wafer processing system (1) having a holding support member (51) that holds and supports a wafer (W), a facing surface (62a) that faces a facing portion (We) of the surface (Wa) of the wafer (W) held and supported by the holding support member (51), and a facing processing member (60) that performs processing on the facing portion (We). The system includes a support plate (72) that is held and supported instead of the wafer (W) by the holding support member (51), an inspection substrate (71) including an imaging unit (73) provided on the support plate (72) to photograph the surroundings of the support plate (72), an imaging target (63) provided on the facing processing member (60) to enter the field of view of the imaging unit (73), a memory unit (111) that remembers the positional relationship with the facing surface (62a), and an image (I) including the imaging target (63) acquired from the imaging unit (73). An inspection system (70) comprising an acquisition unit (112), a position detection unit (113) that detects the position of an opposing surface (62a) based on the position of an imaging target (63) in an image (I) and a position relationship.

[0108] In a wafer processing system (1), the position of the opposing surface (62a) affects the result of the processing performed on the wafer (W). In particular, when processing is performed with a small gap between the opposing surface (62a) and the wafer (W), even a small error significantly affects the processing result. Therefore, it is desired to detect the position of the opposing surface (62a) and manage the positional relationship between the wafer (W) and the opposing surface (62a) based on the detection result. To avoid complicating the processing device for detecting the position of the opposing surface (62a), it is possible to consider placing a sensor on the support plate (72) instead of permanently installing a sensor for detecting the opposing surface (62a). If a sensor is placed on the support plate (72), the sensor can be easily brought into the device using a substrate transport system to detect the opposing surface (62a).

[0109] However, the opposing surface (62a) may be located slightly away from the surface (Wa) of the wafer (W). In such cases, the sensor installed on the support plate (72) may not be able to detect the opposing surface (62a) due to the physical size or the like. In this regard, according to the system configuration described above, it is possible to directly capture the position of the imaging target (63) from the sensor (imaging unit (73)) provided on the support plate (72), and since the positional relationship between the imaging target (63) and the opposing surface (62a) is stored in the memory unit (111), the position of the opposing surface (62a) can be detected with high precision even in cases where the opposing surface (62a) cannot be directly detected based on the image (I) containing the imaging target (63) captured by the imaging unit (73) and the positional relationship between the imaging target (63) and the opposing surface (62a). Therefore, it is effective in improving the stability of processing for the main part (We).

[0110] (2) The wafer processing system (1) further has a rotation drive unit (52) that rotates a holding support unit (51), and the inspection system (70) further has a rotation control unit (114) that directs an imaging unit (73) toward an imaging target (63) by the rotation drive unit (52), and the acquisition unit (112) acquires an image (I) from the imaging unit (73) that is directed toward the imaging target (63) by the rotation control unit (114), the inspection system (70) described in (1).

[0111] In this case, since the imaging unit (73) can be directed toward the imaging target (63) by the rotary drive unit (52), there is no need to adjust the direction of the imaging unit (73) before the holding support unit (51) holds and supports the support plate (72). Because of this, the inspection substrate (71) can be easily transported.

[0112] (3) The imaging target (63) has a mark (64) for determining position, and the rotation control unit (114) further controls the rotation drive unit (52) so that the mark (64) enters a predetermined range (R) within the image (I) based on the image (I), and the position detection unit (113) detects the position of the opposing surface (62a) based on the position relationship with the position of the imaging target (63) in the image (I) acquired when the mark (64) enters the predetermined range (R), (2) inspection system (70).

[0113] In this case, since the image (I) is acquired while the positioning mark (64) of the imaging target (63) is within a predetermined range (R), the relative position of the imaging unit (73) to the imaging target (63) can be suppressed whenever an inspection is performed. Therefore, the detection precision of the position of the opposing surface (62a) can be improved.

[0114] (4) A mark (64) is positioned between the first stage (63b) and the second stage (63c) of an imaging target (63), and a rotation control unit (114) rotates the holding support unit (51) so that the imaging unit (73) is displaced from the first stage (63b) toward the second stage (63c) when the mark (64) is outside the image (I) and the first stage (63b) is inside the image (I), and rotates the holding support unit (51) so that the imaging unit (73) is displaced from the second stage (63c) toward the first stage (63b) when the mark (64) is outside the image (I) and the second stage (63c) is inside the image (I), thereby moving the mark (64) into a predetermined range (R), (3) inspection system (70).

[0115] Accordingly, when the mark (64) is located outside the image (I), the direction in which the holding support member (51) must be rotated can be easily determined depending on whether the first stage (63b) or the second stage (63c) is inside the image (I).

[0116] (5) A wafer processing system (1) further has a linear driving unit (53) that moves the holding support member (51) toward the main processing unit (60) according to a displacement direction (D) perpendicular to the rotation axis of the holding support member (51), and an inspection substrate (71) further includes an acceleration sensor (74) provided on a support plate (72), and an inspection system (70) further has an imaging direction detection unit (115) that detects the tilt (α1) of the viewing direction of the imaging unit (73) with respect to the displacement direction (D) based on the detection result of the acceleration sensor (74), and a rotation control unit (114) that directs the imaging unit (73) toward the imaging target (63) by means of a rotation driving unit (52) based on the detection result of the tilt (α1), an inspection system (70) according to any one of claims (2) to (4).

[0117] In this case, before the image (I) of the imaging target (63) is obtained by the imaging unit (73), the imaging unit (73) can be directed toward the imaging target (63) early based on the tilt of the viewing direction with respect to the displacement direction (D).

[0118] (6) The inspection system (70) of the (5) further comprises an abnormality detection unit (116) that detects an abnormality when the image (I) does not include the image target (63) after the rotation control unit (114) rotates the holding support unit (51) by the rotation drive unit (52) so that the image unit (73) is directed toward the image target (63) based on the detection result of the tilt (α1).

[0119] In this case, even though the imaging unit (73) is directed toward the imaging target (63), the imaging target (63) is not included in the image (I), so the problem of the inspection system (70) can be easily detected.

[0120] (7) The imaging direction detection unit (115) is an inspection system (70) of the (5) or (6) provided on an inspection substrate (71).

[0121] In this case, the information of the inclination (α1) output from the inspection substrate (71) can be used as is for controlling the direction of the imaging unit (73). Because of this, the inspection system (70) can be easily constructed.

[0122] (8) A wafer processing system (1) further has a linear driving unit (53) that moves the holding support member (51) toward the peripheral processing unit (60) according to a displacement direction (D) perpendicular to the rotation axis of the holding support member (51), and further has a linear control unit (118) that adjusts the position of the imaging unit (73) by the linear driving unit (53) so that the imaging target (63) converges within the depth of focus of the imaging unit (73), and an acquisition unit (112) acquires an image (I) from the imaging unit (73) while the imaging target (63) converges within the depth of focus, an inspection system (70) according to any one of claims (1) to (7).

[0123] In this case, since the imaging target (63) is clearly captured in the image (I), the detection precision of the position of the opposing surface (62a) can be improved.

[0124] (9) The position detection unit (113) detects the position of the opposing surface (62a) based on the relationship between the size of the imaging target (63) in the image (I) and the actual size of the imaging target (63), in the inspection system (70) described in any one of claims (1) to (8).

[0125] In this case, the relationship between the position of the imaging target (63) in the image (I) and the actual position of the imaging target (63) is suppressed from changing according to the imaging magnification, thereby further improving the detection precision of the position of the opposing surface (62a).

[0126] (10) The position detection unit (113) detects the position of the opposite surface (62a) based on the relationship between the width (W1) and the actual width (W2) within the image (I) of the imaging target (63) in a direction perpendicular to the opposite surface (62a), in the inspection system (70) described in any one of claims (1) to (9).

[0127] In this case, the detection precision of the position of the opposing surface (62a) in the direction perpendicular to the opposing surface (62a) can be further improved by being based on the imaging magnification in the direction perpendicular to the opposing surface (62a).

[0128] (11) The position detection unit (113) detects the distance (d2) between the plane (PL) where the surface (Wa) of the wafer (W) is located when it is held and supported by the holding support unit (51) and the opposing surface (62a) as the position of the opposing surface (62a), in the inspection system (70) described in any one of claims (1) to (10).

[0129] In this case, a detection result can be output that makes it easy to determine whether the position of the opposing surface (62a) is appropriate or not.

[0130] (12) The position detection unit (113) detects the distance (d2) between the plane (PL) and the opposite surface (62a) based on the position of the imaging target (63) in the image (I), the positional relationship, the relationship between the size of the imaging target (63) in the image (I) and the actual size of the imaging target (63), the position of the imaging unit (73) relative to the holding support unit (51), and the thickness (T) of the wafer (W), in the inspection system (70) described in (11).

[0131] In this case, the gap (d2) between the plane (PL) and the opposing surface (62a) can be detected with higher precision.

[0132] (13) A reaction force amount memory unit (711) that stores the reaction force amount of a wafer (W) in a state where it is held and supported by a holding support unit (51), and a position detection unit (113) that detects the distance (d2) between a plane (PL) and an opposing surface (62a) based also on the reaction force amount, an inspection system (70) of the (11) or (12)

[0133] In this case, by reflecting the amount of reaction force at the position of the plane (PL), the distance (d2) between the plane (PL) and the opposing surface (62a) can be detected with higher precision.

[0134] (14) The reaction force amount memory unit (711) stores a plurality of reaction force amounts corresponding to a plurality of sizes of the holding support unit (51), and the position detection unit (113) detects the distance (d2) between the plane (PL) and the opposing surface (62a) based on the reaction force amount corresponding to the actual size of the holding support unit (51) among the plurality of reaction force amounts. (13) Inspection system (70).

[0135] In this case, by reflecting the difference in the amount of reaction force due to the size of the wafer (W) in the position of the plane (PL), the gap (d2) between the plane (PL) and the opposing surface (62a) can be detected with higher precision.

[0136] (15) The reaction force amount memory unit (711) is provided on the inspection board (71), and is an inspection system (70) of the (13) or (14) material.

[0137] In this case, since the amount of reaction force can be obtained from the inspection substrate (71), an inspection system (70) that takes into account the amount of reaction force can be easily constructed.

[0138] (16) An inspection system (70) according to any one of claims (11) to (15), further comprising an abnormality detection unit (116) that detects an abnormality when the distance (d2) between the plane (PL) and the opposing surface (62a) is outside a predetermined range.

[0139] In this case, by performing the detection of the above using a system, human errors such as oversight can be prevented.

[0140] (17) A holding support member (51) is configured to hold and support a wafer (W) or a support plate (72) by adsorbing it, and the inspection system (70) further comprises an adsorption control member (119) that releases the adsorption of the support plate (72) by the holding support member (51) and re-adsorbs the support plate (72) by the holding support member (51), and a position detection member (113) detects the position of the opposing surface (62a) based on an image (I) acquired after the holding support member (51) re-adsorbs the support plate (72), the inspection system (70) described in any one of claims (1) to (16).

[0141] In this case, distortion accumulated on the inspection substrate (71) by adhering to the holding support member (51) until the image (I) is acquired can be released before the image (I) is acquired. As a result, fluctuations in the image (I) caused by distortion of the inspection substrate (71) can be suppressed, and the detection precision of the position of the opposing surface (62a) can be improved.

[0142] (18) The main processing unit (60) is an exposure unit that irradiates light for exposure onto the surface (Wa) of a wafer (W) facing the opposite surface (62a), and is an inspection system (70) described in any one of claims (1) to (17).

[0143] In this case, in the exposure device, the position of the opposing surface (62a) is likely to have a significant impact on the processing result. For this reason, when the main processing unit (60) is the exposure unit, it is more advantageous to be able to detect the position of the opposing surface (62a) with high precision.

[0144] (19) A method for inspecting a wafer processing system (1) having a holding support member (51) that holds and supports a wafer (W), a facing surface (62a) that faces a facing portion (We) of the surface (Wa) of the wafer (W) held and supported by the holding support member (51), and a facing processing member (60) that performs processing on the facing portion (We), wherein the holding support member (51) holds and supports a support plate (72) that constitutes an inspection substrate (71) instead of a wafer (W), photographs the surroundings of the support plate (72) by an imaging unit (73) provided on the support plate (72), records the positional relationship between an imaging target (63) provided on the facing processing member (60) that enters the field of view of the imaging unit (73) and the facing surface (62a), acquires an image (I) including the imaging target (63) by the imaging unit (73), and in the image (I) An inspection method comprising detecting the position of the opposing surface (62a) based on the position of the imaging target (63) and the positional relationship.

[0145] According to the above method, the same effect as (1) can be obtained.

[0146] (20) (19) A computer-readable storage medium storing a program that executes the method described in the device.

[0147] According to the above memory medium, the same effect as (1) can be obtained.

Claims

Claim 1 A system for inspecting a substrate processing apparatus comprising: a holding support member for holding and supporting a substrate; a facing surface facing a peripheral portion of the surface of the substrate held and supported by the holding support member; a peripheral processing member for performing processing on said peripheral portion; an inspection substrate comprising a support plate held and supported instead of the substrate by the holding support member; an imaging unit provided on the support plate to photograph the periphery of the support plate; an imaging target provided on the peripheral processing member to enter the field of view of the imaging unit; a memory unit for storing a positional relationship with said facing surface; an acquisition unit for acquiring an image including said imaging target from said imaging unit; and a position detection unit for detecting the position of said facing surface based on the position of said imaging target in said image and said positional relationship. Claim 2 In claim 1, the substrate processing device further includes a rotary drive unit for rotating the holding support member, the inspection system further includes a rotary control unit for directing the imaging unit toward the imaging target by the rotary drive unit, and the acquisition unit acquires the image from the imaging unit directed toward the imaging target by the rotary control unit. Claim 3 In paragraph 2, the imaging target includes a mark for position determination, the rotation control unit also controls the rotation drive unit so that the mark falls within a predetermined range within the image based on the image, and the position detection unit detects the position of the opposing surface based on the position relationship with the position of the imaging target in the image acquired when the mark falls within the predetermined range. Claim 4 In paragraph 3, the mark is positioned between the first and second stages of the imaging target, and the rotation control unit rotates the holding support member in a direction in which the imaging unit is displaced from the first stage toward the second stage when the mark is outside the image and the first stage is inside the image, and rotates the holding support member in a direction in which the imaging unit is displaced from the second stage toward the first stage when the mark is outside the image and the second stage is inside the image, thereby moving the mark into the predetermined range, an inspection system. Claim 5 In any one of claims 2 to 4, the substrate processing device further comprises a linear drive unit that moves the holding support unit toward the peripheral processing unit along a displacement direction perpendicular to the rotation axis of the holding support unit, the inspection substrate further comprises an acceleration sensor provided on the support plate, the inspection system further comprises an imaging direction detection unit that detects the tilt of the viewing direction of the imaging unit relative to the displacement direction based on the detection result of the acceleration sensor, and the rotation control unit directs the imaging unit toward the imaging target by the rotation drive unit based on the detection result of the tilt. Claim 6 An inspection system according to claim 5, further comprising an abnormality detection unit that detects an abnormality when the image does not include the image target after the rotation control unit rotates the holding support member by the rotation drive unit so that the imaging unit is directed toward the image target based on the detection result of the inclination. Claim 7 In claim 5, the imaging direction detection unit is an inspection system provided on the inspection substrate. Claim 8 In claim 1, the substrate processing device further comprises a linear driving unit that moves the holding support toward the peripheral processing unit along a displacement direction perpendicular to the rotation axis of the holding support, and further comprises a linear control unit that adjusts the position of the imaging unit by the linear driving unit so that the imaging target converges within the depth of focus of the imaging unit, and the acquisition unit acquires the image from the imaging unit while the imaging target converges within the depth of focus, an inspection system. Claim 9 In claim 1, the position detection unit detects the position of the opposing surface based on the relationship between the size of the imaging target in the image and the actual size of the imaging target. Claim 10 In claim 1, the position detection unit detects the position of the opposite surface based on the relationship between the width within the image of the imaging target in a direction perpendicular to the opposite surface and the actual width, in an inspection system. Claim 11 In claim 1, the position detection unit detects the distance between the plane where the surface of the substrate is located when it is held and supported by the holding support and the opposing surface as the position of the opposing surface, in an inspection system. Claim 12 In claim 11, the position detection unit detects the gap between the plane and the opposing surface based on the position of the imaging target in the image, the positional relationship, the relationship between the size of the imaging target in the image and the actual size of the imaging target, the position of the imaging unit relative to the holding support member, and the thickness of the substrate. Claim 13 In claim 12, the inspection system further comprises a reaction force amount memory unit that stores the reaction force amount of the substrate in a state in which it is held and supported by the holding support unit, and the position detection unit that detects the gap between the plane and the opposing surface based also on the reaction force amount. Claim 14 In claim 13, the reaction force amount memory unit stores a plurality of reaction force amounts corresponding to a plurality of sizes of the retaining support member, and the position detection unit detects the gap between the plane and the opposing surface based on the reaction force amount corresponding to the actual size of the retaining support member among the plurality of reaction force amounts. Claim 15 In paragraph 13, the above reaction force memory unit is an inspection system provided on the above inspection substrate. Claim 16 An inspection system further comprising an abnormality detection unit that detects an abnormality when the distance between the plane and the opposing surface is outside a predetermined range, in any one of claims 11 to 15. Claim 17 In claim 1, the holding support member is configured to hold and support the substrate or the support plate by adsorbing it, and the inspection system further includes an adsorption control member that releases the adsorption of the support plate by the holding support member and re-adsorbs the support plate by the holding support member, and the position detection member detects the position of the opposing surface based on the image acquired after the holding support member re-adsorbs the support plate. Claim 18 In claim 1, the main processing unit is an exposure unit that irradiates light for exposure onto the surface of the substrate facing the opposing surface, in an inspection system. Claim 19 A method for inspecting a substrate processing apparatus comprising a holding support member for holding and supporting a substrate, a facing surface facing a peripheral portion of the surface of the substrate held and supported by the holding support member, and a peripheral processing member for performing processing on said peripheral portion, the method comprising: holding and supporting a support plate constituting an inspection substrate instead of the substrate by the holding support member; photographing the periphery of the support plate by an imaging unit provided on the support plate; storing a positional relationship between an imaging target provided on the peripheral processing member and said facing surface so as to be within the field of view of the imaging unit; acquiring an image including said imaging target by the imaging unit; and detecting the position of said facing surface based on the position of said imaging target in said image and said positional relationship. Claim 20 A computer-readable storage medium storing a program that executes the inspection method described in paragraph 19 on a device.

Images