Substrate control device and semiconductor reaction chamber

Abstract

The present application provides a substrate control device and a semiconductor reaction chamber. The substrate control device comprises a substrate placement section, a first driving section, a second driving section, and a bottom tray. The substrate placement section is used for placing a substrate. The first driving section is installed below the substrate placement section and is used to drive the substrate placement section to rotate within a horizontal plane. A hollow region is provided inside the first driving section. The second driving section comprises a cylinder section and a rod section. The cylinder section is installed in the hollow region. One end of the rod section is installed inside the cylinder section, and the other end of the rod section is fixedly installed on the bottom tray. The second driving section is configured to drive the cylinder section to move up and down along the rod section, thereby driving the substrate placement section and the first driving section to move up and down along a vertical direction. The substrate control device of the present application is compact in volume, convenient to install, and suitable for application in semiconductor equipment where space is limited.

Description

Technology Field

[0001] The present application relates to the field of semiconductors, and in particular to a substrate control device and a semiconductor reaction chamber. Background Technology

[0002] As the global science and technology industry develops rapidly, the importance of chip manufacturing technology is increasing day by day. Semiconductor equipment serves as a platform for chip manufacturing and is fundamental to implementing high-precision, advanced chip processes. Various types of equipment, including semiconductor electroplating equipment, involve the lifting and rotational movement of substrates; however, some current substrate lifting and rotating devices are relatively bulky, occupying a significant amount of space and being unsuitable for use in confined areas. Furthermore, taking electroplating equipment as an example, some devices have limited available space. Therefore, it is crucial to implement high-precision lifting and rotational movements within a limited space.

[0003] The technical problem that this application aims to solve is the relatively large volume of the current substrate lifting and rotating device.

[0004] To solve the aforementioned technical problem, the present application provides a substrate control device, wherein the substrate control device comprises a substrate placement unit, a first driving unit, a second driving unit, and a bottom tray, wherein the substrate placement unit is used for placing a substrate, the first driving unit is installed below the substrate placement unit and is used to drive the substrate placement unit to rotate within a horizontal plane, and a hollow region is provided inside the first driving unit, and the second driving unit comprises a cylinder part and a rod part, wherein the cylinder part is installed in the hollow region, one end of the rod part is installed inside the cylinder part, and the other end of the rod part is fixedly installed on the bottom tray, and the second driving unit is configured to drive the cylinder part to move up and down along the rod part, thereby driving the substrate placement unit and the first driving unit to move up and down along the vertical direction.

[0005] The present application further provides a semiconductor reaction chamber to solve the aforementioned technical problem, wherein the semiconductor reaction chamber includes at least two process positions and includes a substrate control device as described above, and the substrate control device is used to drive a substrate to move to any one of the at least two process positions.

[0006] The substrate control device of the present application sequentially stacks a substrate placement unit, a first driving unit, and a second driving unit along a vertical direction, and the second driving unit and the first driving unit are installed over each other. Since the structure of the substrate control device is compact, it has a relatively smaller volume and occupies a relatively smaller space compared to other conventional designs, making it suitable for application in semiconductor equipment where space is limited. The substrate control device of the present application installs a lifting guide member on a bottom tray, making installation convenient and eliminating the need for centering operations, thus simplifying installation. The substrate control device of the present application prevents mutual interference between the substrate control device and the semiconductor reaction chamber by installing a plurality of sealing members to seal the connection between the substrate control device itself and between the substrate control device and the semiconductor reaction chamber. Brief explanation of the drawing

[0007] The features and performance of the present application are further explained in detail by the following embodiments and the accompanying drawings. The accompanying drawings are intended to aid in a further understanding of the present application and are included and configured as part of the present application; the accompanying drawings illustrate embodiments of the present application and serve to explain the principles of the present application together with the specification. FIG. 1 is a three-dimensional view of a substrate control device according to one embodiment of the present application. FIG. 2 is a side cross-sectional view of a substrate control device of an embodiment shown in FIG. 1. FIG. 3 is a schematic plan view 1 of a semiconductor reaction chamber according to one embodiment of the present application. FIG. 4 is a schematic plan view 2 of a semiconductor reaction chamber according to one embodiment of the present application. Specific details for implementing the invention

[0008] To more clearly explain the technical means of the embodiments of the present application, the accompanying drawings that need to be used in the description of the embodiments are briefly introduced below. Obviously, the accompanying drawings in the description below are merely examples or embodiments of the present application, and a person skilled in the art may apply the present application to other similar situations based on these accompanying drawings without making any creative effort. Unless otherwise evident in the context of language or otherwise explained, the same reference numerals in the drawings indicate the same structure or operation.

[0009] As described in this application, unless clearly exceptional circumstances are indicated in the context, terms such as “one,” “one,” “one kind,” and / or “the above” do not specify the singular and may include the plural. Generally, the terms “include” and “comprehensively” mean merely that they include steps and elements that are already clearly identified, and such steps and elements do not constitute an exclusive listing, and the method or apparatus may include other steps or elements.

[0010] Unless otherwise specifically stated, the relative arrangement, numerical representation, and numerical values ​​of the components and steps described in these embodiments do not limit the scope of this application. At the same time, for convenience of explanation, it should be understood that the dimensions of each part shown in the accompanying drawings are not drawn according to actual proportional relationships. Techniques, methods, and apparatus known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and apparatus should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as illustrative only and not restrictive. Accordingly, other examples of exemplary embodiments may have different values. It should be noted that similar symbols and characters represent similar items in the following accompanying drawings; therefore, once an item is defined in one accompanying drawing, further discussion regarding it in subsequent accompanying drawings is not necessary.

[0011] In the description of this application, it should be understood that the orientation or positional relationship indicated by orientation terms such as “front, back, up, down, left, right,” “transverse, longitudinal, vertical, horizontal,” and “top, bottom,” etc., is based on the orientation or positional relationship typically depicted in the accompanying drawings and is intended merely to describe and simplify the description of this application; unless otherwise stated, such orientation terms do not indicate or imply that the indicated device or element must have a specific orientation or be configured and operated in a specific orientation, and thus should not be understood as a limitation on the scope of protection of this application. The orientation terms “inside, outside” refer to the inside and outside of the contour of each member itself.

[0012] For convenience of explanation, relative spatial terms such as "above of...", "upper of...", "upper surface of...", and "of the upper surface" may be used herein to describe the spatial positional relationship between one element or feature and another element or feature as illustrated in the drawings. It should be understood that relative spatial terms are intended to include different orientations of the element during use or operation in addition to the orientation described in the drawings. For example, if the element in the attached drawings is inverted, the element described as "upper of the other element or structure" or "above of the other element or structure" will subsequently be positioned as "lower of the other element or structure" or "below of the other element or structure." Accordingly, the exemplary term "upper of..." may include both orientations: "upper of..." and "lower of...". The element may also be positioned in other different ways (rotated 90 degrees or positioned in other orientations), and an interpretation corresponding to the relative spatial descriptions used herein shall be applied.

[0013] Furthermore, it should be noted that the use of terms such as "first," "second," etc., to define parts is merely for the purpose of easily distinguishing corresponding parts, and unless otherwise stated, these terms have no special meaning and should not be understood as a limitation on the scope of protection of this application. Additionally, while the terms used in this application are selected from known common terms, some terms mentioned in this specification may have been selected at the applicant's discretion, and their detailed meanings are explained in the relevant parts of this application. Moreover, this application should be understood not only through the actual terms used but also through the meanings implied by each term.

[0014] The substrate control device of the present application is primarily used for placing a substrate and driving the substrate to be raised and rotated, and can be used in any scenario requiring control of the raising and rotating of the substrate, and includes, but is not limited to, an annealing device in semiconductor electroplating equipment.

[0015] FIG. 1 is a three-dimensional view of a substrate control device according to one embodiment of the present application. FIG. 2 is a side cross-sectional view of the substrate control device of the embodiment shown in FIG. 1. Referring to FIG. 1 and FIG. 2 together, the substrate control device (100) of the embodiment includes a substrate placement section (110), a first driving section (120), a second driving section (130), and a bottom tray (140). Here, the substrate placement section (110) is used to place a substrate (W). As shown in FIG. 1, a substrate (W) is shown and is placed by the substrate placement section (110). In the corresponding example, the substrate placement section (110) is a flat-plate shaped manipulator arm and has a small end (111) and a large end (112), the shape and size of the large end (112) match with the substrate (W), and includes a plurality of support rods, and the substrate (W) can be placed on the support rods. The small end (111) is connected to a lifting and rotating mechanism in the substrate control device (100), and when the small end (111) is lifted or rotated, the large end (112) and the substrate (W) can be driven to be lifted and rotated.

[0016] The first driving unit (120) is installed below the substrate mounting unit (110) and is used to drive the substrate mounting unit (110) to rotate within a horizontal plane, and a hollow area is provided inside the first driving unit (110). The second driving unit (130) includes a cylinder unit (131) and a rod unit (132), the cylinder unit (131) is installed in the hollow area, one end of the rod unit (132) is installed inside the cylinder unit (131), and the other end of the rod unit (132) is fixedly installed on the bottom tray (140). The second driving unit (130) is configured to drive the cylinder unit (131) to move up and down along the rod unit (132), thereby driving the substrate mounting unit (110) and the first driving unit (120) to move up and down along the vertical direction (D).

[0017] As illustrated in FIG. 2, since the illustrated state is after the substrate control device (100) is assembled, the space where the cylinder part (131) of the second driving part (130) is located is the hollow area inside the first driving part (110), and there may be some gap between the two.

[0018] In some embodiments, the substrate mounting section (110) may be directly fixedly installed above the first driving section (120) through its small section (111), and may be driven so that the substrate mounting section (110) rotates immediately when the first driving section (120) rotates. The cylinder section (131) of the second driving section (130) is fixedly connected to the first driving section (120), and when the second driving section (130) drives the cylinder section (131) to move up and down along the load section (132), the cylinder section (131) drives the first driving section (120) to move up and down together, thereby driving the substrate mounting section (110) and the substrate (W) to move up and down together.

[0019] The substrate control device (100) of the present application sequentially stacks a substrate placement unit (110), a first driving unit (120), and a second driving unit (130) along a vertical direction (D), and the second driving unit (130) and the first driving unit (120) are installed over each other, so the structure of the substrate control device (100) is compact, so the volume is relatively small compared to other conventional designs and the space occupied is relatively small, making it suitable for application to semiconductor equipment with limited space.

[0020] Specifically, in some embodiments, the substrate control device (100) further includes an inner sleeve (150) and an outer sleeve (160), the outer sleeve (160) is installed over the outer circumference of the inner sleeve (150), the bottom (161) of the outer sleeve (160) is fixedly installed on the bottom tray (140), the inner sleeve (150) and the outer sleeve (160) are sealedly connected, the inner sleeve (150) includes a sleeve bottom (151) and a sleeve wall (152), the upper surface of the sleeve bottom (151) is connected to the substrate mounting portion (110), the lower surface of the sleeve bottom (151) is connected to the first driving unit (120), and the sleeve wall (152) is located between the outer circumference of the first driving unit (120) and the outer sleeve (160).

[0021] Referring to FIGS. 1 and 2, the inner sleeve (150) and the outer sleeve (160) can both be specifically implemented as cylinders. In other embodiments, the inner sleeve (150) and the outer sleeve (160) may have other shapes. The sleeve bottom (151) and the sleeve wall (152) of the inner sleeve (150) may be installed separately and then interconnected, or they may be integrally molded. The bottom (161) of the outer sleeve (160) may be fixedly installed on the bottom tray (140) by adopting methods such as bonding, welding, or screw connection, and may be enclosed together by the outer sleeve (160) and the bottom tray (140) to form a cylinder shape. As shown in FIG. 2, the inner sleeve (150) and the outer sleeve (160) are installed over each other, and the relative positions of the two are variable along the vertical direction (D). At the same time, when the second drive unit (130) is raised and lowered, the inner sleeve (150) and the outer sleeve (160) are always in a sealed connection state and the two are not separated.

[0022] Since the lower surface of the sleeve bottom (151) is connected to the first driving unit (120), when the first driving unit (120) rotates, the inner sleeve (150) is also driven to rotate at the same time. Specifically, a plurality of screws (113) shown in FIG. 1 can be adopted to fix and connect the substrate mounting unit (110), the sleeve bottom (151), and the rotating member within the first driving unit (120).

[0023] According to this embodiment, the inner sleeve (150) and the outer sleeve (160) are sealed together, and at the same time, the first driving unit (120) and the second driving unit (130) are placed within a single sealed space, thereby preventing the sealed space and the external space from communicating with each other. When the substrate control device (100) is installed in the semiconductor reaction chamber, the sealed connection prevents gas or liquid within the semiconductor reaction chamber from entering the substrate control device (100) and causing corrosion or aging of the components.

[0024] The present application does not limit how the inner sleeve (150) and the outer sleeve (160) are sealedly connected. As illustrated in FIG. 2, in some embodiments, a first sealing member (171) is installed between the sleeve wall (152) and the inner wall of the outer sleeve (160) and is used to seally connect the inner sleeve (150) and the outer sleeve (160). Specifically, the first sealing member (171) may be a sealing ring. More specifically, a first sealing member receiving groove may be installed on the sleeve wall (152) to receive the first sealing member (171). In other embodiments, the first sealing member (171) may be a multilayer sealing ring, a vari-sealed sealing ring, or a magnetic fluid sealing member, and may be a plurality of separately installed sealing members.

[0025] In some embodiments, the second driving unit (130) is an air cylinder, and one end of the rod portion (132) is a piston portion (134), and the piston portion (134) is located inside the cylinder portion (131) and divides the interior into an upper space (135) and a lower space (136), and the rod portion (132) includes a first gas channel (137) and a second gas channel (138), wherein the first gas channel (137) is in communication with the upper space (135) and the second gas channel (138) is in communication with the lower space (136). Specifically, the second driving unit (130) may further include a first gas inlet (211) and a second gas inlet (212), wherein the first gas inlet (211) is used to provide gas to the first gas channel (137) and the second gas inlet (212) is used to provide gas to the second gas channel (138). When upward movement is required, gas is supplied to the first gas inlet (211) through a gas supply source, and the gas enters the upper space (135) through the first gas channel (137), the upper space (135) expands, the lower space (136) contracts, and the cylinder part (131) moves upward, thereby driving the first driving part (120) and the substrate placement part (110) to rise. When downward movement is required, gas is supplied to the second gas inlet (212) through a gas supply source, and the gas enters the lower space (136) through the second gas channel (138), the lower space (136) expands, the upper space (135) contracts, and the cylinder part (131) moves downward, thereby driving the first driving part (120) and the substrate placement part (110) to descend.

[0026] When the second drive unit (130) is an air cylinder, since it is connected to an external gas supply source, the air cylinder is involved in processes such as gas filling and gas discharge during the control process, and leaked gas may exist in the space surrounded by the inner sleeve (150) and the outer sleeve (160). Therefore, the sealing connection of the inner sleeve (150) and the outer sleeve (160) may prevent gas from entering the semiconductor reaction chamber and affecting the process of the substrate.

[0027] In some embodiments, the first drive unit (120) includes a stator (121) and a rotor (122), the rotor (122) is installed to surround the outer circumference of the cylinder unit (131), the stator (121) is installed to surround the outer circumference of the rotor (122), and the upper surface of the rotor (122) is fixedly connected to the lower surface of the sleeve bottom (151) and is used to rotate the inner sleeve (150) and the substrate mounting unit (110). According to this embodiment, a hollow area is provided in the middle portion of the rotor (122) and can be used to place the cylinder unit (131).

[0028] In some embodiments, the first drive unit (120) is specifically a direct drive motor (DD-motor). The encoder of the direct drive motor can control the rotation angle, and since the motor speed is uniform, high-precision control can be performed.

[0029] In some embodiments, the substrate control device (100) further includes an intermediate connecting plate (180) which is fixedly connected to both the cylinder part (131) and the stator (121) so that the cylinder part (131) drives the first driving part (120) to move up and down in a vertical direction. Specifically, the intermediate connecting plate (180) may be a flat plate, and a screw (181) is installed on its circumferential direction, and a threaded hole corresponding to the screw (181) is installed on the lower surface of the stator (121), and the stator (121) and the intermediate connecting plate (180) may be fixedly connected through the screw. A through hole is also further provided in the central part of the intermediate connecting plate (180) and is used to insert the cylinder part (131) into the through hole and to pass the rod part (132) through. The through hole is provided with a stepped structure and the upper surface of the intermediate connecting plate (180) is joined so that the intermediate connecting plate (180) can accommodate the cylinder part (131) and maintain a fixed positional relationship relative to the cylinder part (131). The diameter of the portion near the lower surface within the intermediate connecting plate (180) of the through hole is matched with the rod part (132), thereby allowing the intermediate connecting plate (180) to move up and down relative to the rod part (132). By installing the intermediate connecting plate (180), it helps to ensure that the stator (121) can be raised and lowered stably while maintaining a horizontal position during the lifting process.

[0030] In some embodiments, the substrate control device (100) further includes at least one lifting guide member (220). In the embodiment illustrated in FIG. 2, two lifting guide members (220) are provided, both installed between the intermediate connecting plate (180) and the bottom tray (140) along the vertical direction (D), and when the cylinder part (131) is lifted along the vertical direction (D), the lifting guide members (220) are lifted synchronously with the cylinder part (131). In a preferred embodiment, three lifting guide members (220) are uniformly installed around the load part (132) and are used to assist the first driving member (120), the second driving member (130), and the substrate placement part (110) to be stably lifted along the vertical direction when the cylinder part (131) is lifted.

[0031] In the embodiment illustrated in FIG. 2, the lifting guide member (220) includes a linear bearing (221) and a guide shaft (222), wherein one end of the linear bearing (221) is fixedly installed on a bottom tray (140), the guide shaft (222) is installed so as to be vertically movable on the linear bearing (221), and one end of the guide shaft (222) (the top end in FIG. 2) is fixedly installed on an intermediate connecting plate (180). Here, a threaded hole may be opened in the top end of the guide shaft (222), the top end is embedded inside the intermediate connecting plate (180), and is locked with a screw.

[0032] In this application, by installing a lifting guide member (220) on a bottom tray (140), it is possible to ensure that a plurality of lifting guide members (220) have the same level of horizontality by adjusting only the level of the bottom tray (140), thereby making installation convenient, leveling simple, and significantly reducing the required level of fitting tolerance for the element, thus reducing processing costs.

[0033] In some embodiments, the substrate control device (100) further includes a guide member (172) installed between the sleeve wall (152) and the outer sleeve (160), and the guide member (172) is used to move up and down synchronously with the inner sleeve (150) when the inner sleeve (150) moves up and down, and to maintain frictional contact with the inner wall of the outer sleeve (160) during the moving process. The guide member (172) can specifically be implemented as a guide ring and is installed to surround the sleeve wall (152) of the inner sleeve (150) to serve to stabilize the inner sleeve (150) and prevent it from shaking left and right when the inner sleeve (150) moves, thereby maintaining a horizontal position when the inner sleeve (150) moves up and down and rotates, and furthermore, is used to ensure horizontal stability when the substrate (W) moves up and down and rotates. Accordingly, a receiving groove for accommodating a guide member (172) may be installed on the sleeve wall (152).

[0034] As illustrated in FIG. 2, in some embodiments, the outer sleeve (160) further comprises a sleeve edge (162) protruding radially, and the substrate control device (100) further comprises a second sealing member (173) installed on the lower surface of the sleeve edge (162) and / or on the outer wall of the outer sleeve (160), and when the outer sleeve (160) is installed in a semiconductor reaction chamber, the sleeve edge (162) is used to connect with the semiconductor reaction chamber, and the second sealing member (173) is used to seal between the outer sleeve (160) and the semiconductor reaction chamber. Here, the fact that the second sealing member (173) is installed on the lower surface of the sleeve edge (162) and the outer wall of the outer sleeve (160) indicates that the second sealing member (173) is positioned at a narrow angle point between the lower surface of the sleeve edge (162) and the outer wall of the outer sleeve (160), so that it can simultaneously contact the lower surface of the sleeve edge (162) and the outer wall of the outer sleeve (160). Correspondingly, a second sealing member receiving groove that matches the second sealing member (173) may be installed on the lower surface of the sleeve edge (162) and / or the outer wall of the outer sleeve (160).

[0035] In the embodiment illustrated in FIG. 2, the second sealing member (173) is also a sealing ring. In other embodiments, the second sealing member (173) may be a plurality of separately installed sealing members.

[0036] In some embodiments, the first sealing member (171) and the second sealing member (173) are made of a flexible material.

[0037] FIG. 3 is a planar schematic diagram 1 of a semiconductor reaction chamber according to one embodiment of the present application. The semiconductor reaction chamber (300) includes at least two process positions, and as shown in FIG. 3, two process positions (P1, P2) are shown. As can be understood, a receiving cavity is installed in the semiconductor reaction chamber (300), and a substrate control device (100) may be installed in the receiving cavity, coupled and connected to the receiving cavity through a sleeve edge (162), and sealed to the receiving cavity through a second sealing member (173) to seal the substrate control device (100) and the semiconductor reaction chamber (300).

[0038] In some embodiments, the semiconductor reaction chamber (300) is an annealing chamber, which includes a cooling disk (301) and a heating disk (302), the cooling disk (301) is located at a process position (P1), and the heating disk (302) is located at a process position (P2). Fig. 3 shows a state in which the substrate placement portion (110) is located on the cooling disk (301), and Fig. 4 shows a state in which the substrate placement portion (110) is located on the heating disk (302).

[0039] The sequence of motion of the substrate control device (100) according to the present application in the semiconductor reaction chamber will be explained below with reference to FIGS. 3 and FIGS. 4. Assuming the state shown in FIGS. 3 is the initial state, the DD motor rotates so that the manipulator arm of the substrate placement section (110) rotates to the right and moves to the cooling disk (301) position (P1), and the air cylinder descends to drive the manipulator arm to descend. The external manipulator brings the substrate (W) in from the inlet (310) and places the substrate (W) at the cooling disk (301) station, and the air cylinder rises to drive the manipulator arm to rise, and the DD motor rotates so that the manipulator arm rotates to the left and descends to the heating disk (302) position, and places the substrate (W) at the heating disk (302) station, as shown in FIGS. 4. When the annealing process is completed, the air cylinder rises to drive the manipulator arm to rise and lift the substrate (W), and the DD motor rotates to drive the manipulator arm to rotate to the right to the initial position of the cooling disk (301), and as shown in FIG. 3, the air cylinder lowers to drive the manipulator arm to lower, placing the substrate (W) on the cooling disk (301) station, and waiting for the external manipulator to pick up the substrate.

[0040] The basic concepts have been described above. Clearly, to those skilled in the art, the disclosure of this application is provided only as an example and is not intended to limit the application. Although not explicitly described herein, those skilled in the art may make various modifications, improvements, and enhancements to this application. Since such modifications, improvements, and corrections are proposed in this application, they still fall within the spirit and scope of the exemplary embodiments of this application.

[0041] At the same time, the present application describes embodiments of the present application using specific terms. For example, "one embodiment," "one embodiment," and / or "some embodiments" refer to any feature, structure, or characteristic associated with at least one embodiment of the present application. Accordingly, it should be emphasized and noted that "one embodiment," "one embodiment," or "alternative embodiment" mentioned two or more times in different places in this specification does not necessarily refer to the same embodiment. Furthermore, any feature, structure, or characteristic may be appropriately combined in one or more embodiments of the present application.

[0042] Likewise, it should be noted that, in order to simplify the expression of the disclosure of this application and to aid in understanding one or more embodiments of the invention, in the description of the embodiments of this application described above, several features may sometimes be attributed to a single embodiment, the accompanying drawings, or the description thereof. However, such a method of disclosure does not imply that the features required for the subject matter of this application are greater than the features mentioned in the claims. In fact, the features of the embodiments are fewer than all the features of the single disclosed embodiment.

[0043] In some embodiments, numbers have been used to describe the quantities of components and attributes, and it should be understood that the numbers used in the description of these embodiments are used to be modified by the modifiers “about,” “approximately,” or “generally” in some examples. Unless otherwise specified, “about,” “approximately,” or “generally” indicates that the numbers allow for a variation of ±20%. Correspondingly, in some embodiments, all numeric parameters used in this application are approximations, and such approximations may be modified according to the necessary features of individual embodiments. In some embodiments, numeric parameters must take into account the prescribed significant digits and adopt general digit preservation methods. Even though the numeric ranges and parameters used to confirm the breadth of the range in some embodiments of this application are approximations, in specific embodiments, these figures are set as accurately as possible within a feasible range.

Claims

Claim 1 A substrate control device comprising a substrate placement unit, a first driving unit, a second driving unit, and a bottom tray, wherein the substrate placement unit is used for placing a substrate, the first driving unit is installed below the substrate placement unit and is used to drive the substrate placement unit to rotate within a horizontal plane, and a hollow area is provided inside the first driving unit, and the second driving unit comprises a cylinder unit and a rod unit, wherein the cylinder unit is installed in the hollow area, one end of the rod unit is installed inside the cylinder unit, and the other end of the rod unit is fixedly installed on the bottom tray, and the second driving unit is configured to drive the cylinder unit to move up and down along the rod unit, thereby driving the substrate placement unit and the first driving unit to move up and down along a vertical direction. Claim 2 A substrate control device according to claim 1, further comprising an inner sleeve and an outer sleeve, wherein the outer sleeve is installed over the outer circumference of the inner sleeve, the lower end of the outer sleeve is fixedly installed on the bottom tray, the inner sleeve and the outer sleeve are sealedly connected, the inner sleeve includes a sleeve bottom and a sleeve wall, the upper surface of the sleeve bottom is connected to the substrate mounting portion, the lower surface of the sleeve bottom is connected to the first driving portion, and the sleeve wall is located between the outer circumference of the first driving portion and the outer sleeve. Claim 3 A substrate control device according to paragraph 2, further comprising a first sealing member installed between the sleeve wall and the outer sleeve. Claim 4 A substrate control device according to claim 3, wherein the outer sleeve further comprises a sleeve edge protruding radially, and the substrate control device further comprises a second sealing member installed on the lower surface of the sleeve edge and / or the outer wall of the outer sleeve, and when the outer sleeve is installed in a semiconductor reaction chamber, the sleeve edge is used to connect with the semiconductor reaction chamber, and the second sealing member is used to seal between the outer sleeve and the semiconductor reaction chamber. Claim 5 A substrate control device according to paragraph 3, wherein the first sealing member comprises a combination of one or more of a multilayer sealing ring, a vari-seal sealing ring, and a magnetic fluid sealing member. Claim 6 A substrate control device according to paragraph 2, further comprising a guide member installed between the sleeve wall and the outer sleeve, wherein the guide member moves up and down synchronously with the inner sleeve when the inner sleeve moves up and down, and is used to maintain frictional contact with the inner wall of the outer sleeve during the moving process. Claim 7 A substrate control device according to paragraph 2, wherein the first driving unit comprises a stator and a rotor, the rotor is installed to surround the outer circumference of the cylinder unit, the stator is installed to surround the outer circumference of the rotor, and the upper surface of the rotor is fixedly connected to the lower surface of the sleeve bottom. Claim 8 A substrate control device according to claim 7, further comprising an intermediate connecting plate fixedly connected to both the cylinder part and the stator, which drives the cylinder part to move up and down in a vertical direction. Claim 9 A substrate control device according to claim 8, further comprising at least one lifting guide member installed between the intermediate connecting plate and the bottom tray along a vertical direction, wherein when the cylinder part is lifted along a vertical direction, the lifting guide member is lifted synchronously with the cylinder part. Claim 10 A substrate control device according to claim 9, wherein the lifting guide member comprises a linear bearing and a guide shaft, one end of the linear bearing is fixedly installed on the bottom tray, the guide shaft is installed so as to be vertically movable on the linear bearing, and one end of the guide shaft is fixedly installed on the intermediate connecting plate. Claim 11 A substrate control device according to claim 1, wherein the second driving unit is an air cylinder, one end of the rod unit is a piston unit, the piston unit is located inside the cylinder unit and divides the interior into an upper space and a lower space, the rod unit includes a first gas channel and a second gas channel, the first gas channel is in communication with the upper space, and the second gas channel is in communication with the lower space. Claim 12 A semiconductor reaction chamber comprising at least two process positions, wherein the semiconductor reaction chamber comprises a substrate control device according to any one of claims 1 to 11, and wherein the substrate control device is used to drive a substrate to move to any one of the at least two process positions.

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