Position alignment device

Abstract

A substrate bonding device (positioning device) comprises a first substrate holder, a second substrate holder, a second moving actuator, an imaging unit, and a control unit. The second moving actuator moves either the first substrate holder or the second substrate holder in a horizontal direction. The imaging unit captures a second mark of the second substrate holder through a first forming area of ​​the first substrate holder. Based on the imaging result of the imaging unit, the control unit controls the second moving actuator so that the first mark and the second mark have a predetermined positional relationship. At least one of the first forming area and the second forming area is wider than the field of view of the imaging unit.

Description

Technology Field

[0001] The present invention relates to a position alignment device. Background Technology

[0002] Conventionally, there is a device known for holding a first substrate, a second member positioned opposite to the first member and holding a second substrate, an actuator for moving the second member, and an imaging unit for capturing a first alignment mark formed on the first member and a second alignment mark formed on the second member, and for bonding the first substrate and the second substrate after aligning the first member and the second member. As such a device, for example, Patent Document 1 describes a device having a first holding means for holding a first plate-shaped body having a first alignment mark formed thereon, a second holding means for holding a second plate-shaped body having light transmittance having a second alignment mark formed thereon, and an imaging means positioned opposite to the first plate-shaped body with respect to the second plate-shaped body and capturing the first plate-shaped body and the second plate-shaped body. In this device, the imaging means images the first alignment mark and the second alignment mark in the same field of view. Prior art literature

[0003] Japanese Patent Publication No. 2014-165331 The problem to be solved

[0004] However, for example, in a substrate bonding device that bonds two substrates, since the two substrates are electrically connected to each other, it is required to align the two substrates with high precision. When aligning the two substrates with high precision, it is necessary to increase the magnification of the imaging unit. Because of this, the field of view of the imaging unit becomes narrow.

[0005] However, if the field of view of the imaging unit is narrowed, there are cases where both the first alignment mark and the second alignment mark do not fit within the same field of view. In this case, it is difficult to align the two substrates with high precision.

[0006] At least one aspect of the present invention provides a positioning device capable of positioning a first member and a second member with high precision. means of solving the problem

[0007] According to one aspect of the present invention, a position alignment device comprises a first member, a second member, a moving actuator, a mark capturing unit, and a control unit. A first mark is formed on the first member. The second member is positioned opposite the first member. A second mark is formed on the second member. The moving actuator moves one of the first member and the second member in a direction that intersects with the direction in which the first member and the second member face each other. The mark capturing unit captures the first mark and the second mark. The control unit controls the moving actuator. The first member has a first forming area in which one or more of the first marks are formed. The second member has a second forming area in which one or more of the second marks are formed. The mark imaging unit captures the second mark of the second member through the first forming area of ​​the first member. The control unit controls the moving actuator so that the first mark and the second mark have a predetermined positional relationship based on the imaging result of the mark imaging unit. At least one of the first forming area and the second forming area is wider than the field of view of the mark imaging unit. The mark formed in the at least one includes coordinate information.

[0008] In one embodiment, the mark formed on at least one side has a main mark positioned at the center and a plurality of sub-marks positioned around the main mark.

[0009] In one embodiment, the main mark and the sub-mark differ in at least one of their shape, size, and spacing.

[0010] In one embodiment, the sub-mark is formed such that as it moves away from the center, at least one of the spacing between adjacent sub-marks and the size of the sub-mark increases.

[0011] In one embodiment, the sub-mark has a different shape depending on the distance from the center.

[0012] In one embodiment, the mark imaging unit is fixed to the first member. The moving actuator moves the second member. The second forming area is wider than the field of view of the mark imaging unit. The second mark includes the coordinate information.

[0013] In one embodiment, a first imaging unit and a second imaging unit are additionally provided. The first member has a first chuck that holds a first substrate on which a first substrate mark is formed. The second member has a second chuck that holds a second substrate on which a second substrate mark is formed. The first imaging unit images the first mark and the first substrate mark. The second imaging unit images the second mark and the second substrate mark. The control unit calculates a first positional relationship between the first mark and the first substrate mark based on the imaging result of the first imaging unit. The control unit calculates a second positional relationship between the second mark and the second substrate mark based on the imaging result of the second imaging unit. The control unit calculates a predetermined positional relationship based on the first positional relationship and the second positional relationship. Effects of the invention

[0014] According to the present invention, a positioning device capable of positioning a first member and a second member with high precision can be provided. Brief explanation of the drawing

[0015] FIG. 1 is a plan view showing the schematic configuration of a substrate bonding device according to one embodiment of the present invention. Figure 2 is a block diagram showing the configuration of a substrate bonding device. FIG. 3 is a flowchart showing a method of joining a first substrate and a second substrate by a substrate joining device of the present embodiment. FIG. 4 is a perspective view schematically showing the structure of a joining unit. Figure 5 is a schematic diagram showing the structure around the second chuck of the joining unit in the X direction. Figure 6 is a schematic diagram showing the structure around the second chuck of the joining unit in the Y direction. Figure 7 is a schematic diagram showing the structure around the support from below. FIG. 8 is a perspective view schematically showing the structure of a joining unit from below. FIG. 9 is a diagram showing a structure viewed from the first substrate detection sensor side (lower side) around the first mark of the first reference mask when one side of the first stage is facing downward. FIG. 10 is a diagram showing the structure viewed from the second substrate detection sensor side (upper side) around the second mark of the second reference mask. Figure 11 is a flowchart showing the substrate bonding method of the bonding unit. FIG. 12 is a schematic diagram showing the structure of the first chuck viewed from below, with one side of the first stage facing downward. FIG. 13 is a schematic diagram showing the structure of the second chuck viewed from above. FIG. 14 is a schematic diagram showing the structure of the first chuck viewed from below, with one side of the first stage facing downward. FIG. 15 is a schematic diagram showing the structure of the second chuck viewed from above. FIG. 16 is a plan view showing the positional relationship between the first substrate and the second substrate when the second chuck is placed at a reference position. FIG. 17 is a plan view showing the positional relationship between the first mark and the second mark when the second mark is placed in a reference position. FIG. 18 is a plan view showing the first substrate and the second substrate aligned in position. FIG. 19 is a drawing showing another example of the second mark of the second reference mask on the second substrate detection sensor side (upper side). Specific details for implementing the invention

[0016] Hereinafter, embodiments of a position alignment device according to the present invention will be described with reference to the drawings. In addition, the same or substantial parts in the drawings are given the same reference numerals and descriptions are not repeated. In this specification, to facilitate understanding of the invention, mutually orthogonal X-axis, Y-axis, and Z-axis may be described. In this embodiment, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0017] Referring to FIGS. 1 to 18, a substrate bonding device (1) according to an embodiment of the present invention will be described. In this embodiment, a substrate bonding device (1) will be described as an example of a positioning device of the present invention. First, referring to FIG. 1, the overall configuration of the substrate bonding device (1) will be described. FIG. 1 is a plan view showing the schematic configuration of a substrate bonding device (1) according to an embodiment of the present invention.

[0018] As shown in FIG. 1, the substrate bonding device (1) laminates and bonds the first substrate (W1) and the second substrate (W2). In this embodiment, the substrate bonding device (1) performs, for example, an activation treatment, a cleaning treatment, and a bonding treatment on the first substrate (W1) and the second substrate (W2). In addition, in this embodiment, the first substrate (W1) and the second substrate (W2) are bonded by bonding the first substrate (W1) and the second substrate (W2). For this reason, in the following description, bonding the first substrate (W1) and the second substrate (W2) may be described as bonding the first substrate (W1) and the second substrate (W2).

[0019] The first substrate (W1) and the second substrate (W2) are, for example, semiconductor substrates, glass substrates, etc. In the present embodiment, the first substrate (W1) and the second substrate (W2) are roughly disc-shaped semiconductor wafers.

[0020] Hereinafter, except where specifically necessary, the first substrate (W1) and the second substrate (W2) may be referred to as substrate (W).

[0021] In addition, in this embodiment, the substrate (W) has a surface (Wa) (see FIG. 4) and a back surface located opposite to the surface (Wa). The surface (Wa) is a device forming surface on which a device is formed. The back surface is a non-device forming surface on which no device is formed.

[0022] Each substrate (W) has a plurality (e.g., tens to hundreds) of semiconductor chips (not shown). The semiconductor chips constitute an integrated circuit, for example, a CPU and / or DRAM. The semiconductor chips have a semiconductor device layer (not shown) in which a plurality of semiconductor devices, such as transistors, are formed, and a plurality of electrodes (not shown). The electrodes are formed from a metal material such as copper, gold, or aluminum. In this embodiment, the electrodes are formed from copper, for example. Additionally, the semiconductor device layer and the electrodes are formed on the surface (Wa) of the substrate (W).

[0023] The electrode of the first substrate (W1) and the electrode of the second substrate (W2) are joined and electrically connected. The electrode of the second substrate (W2) is positioned at a location corresponding to the electrode of the first substrate (W1).

[0024] The electrode of the substrate (W) is formed, for example, as a bump and / or electrode pad. In this embodiment, the electrode of the substrate (W) is formed as a bump. Also, in this embodiment, an insulating film is formed on the surface of the substrate (W) to fill the area around the electrode. The electrode is exposed from the insulating film, and the electrode and the insulating film are formed approximately as one plane.

[0025] The substrate bonding device (1) is equipped with a return path (CP), a first load port (LP1), a second load port (LP2), a third load port (LP3), an activation unit (AU), a cleaning unit (CU), a pre-alignment unit (PU), a return unit (TU), a bonding unit (JU), a center robot (CR), a return robot (TR), and a control device (90).

[0026] The center robot (CR), the first load port (LP1), the second load port (LP2), the third load port (LP3), the activation unit (AU), the cleaning unit (CU), the pre-alignment unit (PU), the return unit (TU), and the bonding unit (JU) are arranged to be in contact with the return path (CP).

[0027] The center robot (CR) holds and transports the substrate (W). The center robot (CR) moves within the transport path (CP).

[0028] The first load port (LP1) accommodates a plurality (e.g., 25) of first substrates (W1). Specifically, the first load port (LP1) has a hoop (also called a carriage) not shown that can accommodate a plurality of first substrates (W1) in a stacked state.

[0029] The second load port (LP2) accommodates a plurality (e.g., 25) of second substrates (W2). Specifically, the second load port (LP2) has a hoop not shown that can accommodate a plurality of second substrates (W2) in a stacked state.

[0030] The third load port (LP3) accommodates a plurality (e.g., 25) of laminated substrates (WL). Specifically, the third load port (LP3) has a hoop not shown that can accommodate a plurality of laminated substrates (WL) in a stacked state. The laminated substrate (WL) is a substrate in which a first substrate (W1) and a second substrate (W2) are laminated together.

[0031] The activation unit (AU) activates the surface (Wa) of the substrate (W). The activation unit (AU) activates at least the surface of the electrode of the substrate (W). Specifically, the activation unit (AU) performs plasma treatment on the substrate (W). The type of gas used for plasma treatment is not particularly limited, but is, for example, oxygen or nitrogen.

[0032] The activation unit (AU) has, for example, a high-frequency power source and a pair of electrodes to which a high-frequency voltage is applied. By applying a high-frequency voltage between the pair of electrodes, the processing gas is plasmafied. For example, when oxygen gas is used as the processing gas, the oxygen gas is plasmafied and becomes oxygen ions. When oxygen ions are irradiated onto the surface (Wa) of the substrate (W), dangling bonds (unbonded losses) are formed on the surface of the electrodes.

[0033] The cleaning unit (CU) cleans the substrate (W). In this embodiment, the substrate (W) activated by the activation unit (AU) is cleaned. The cleaning unit (CU) has a cleaning nozzle (not shown) that discharges a cleaning solution. Examples of cleaning solutions include deionized water (DIW), carbonated water, electrolytic ionized water, ozone water, ammonia water, hydrochloric acid water with a dilution concentration (e.g., 10 ppm to 100 ppm), or reduced water (hydrogen water).

[0034] By cleaning the substrate (W) with a cleaning unit (CU), the electrodes of the substrate (W) are cleaned. At this time, hydroxyl groups are formed on the surface of the electrodes.

[0035] The return unit (TU) is positioned to be in contact with the return path (CP), pre-alignment unit (PU), and joining unit (JU). The return unit (TU) accommodates a return robot (TR).

[0036] The return robot (TR) holds and returns the substrate (W). The return robot (TR) returns the substrate (W) between the center robot (CR), the pre-alignment unit (PU), and the bonding unit (JU).

[0037] The pre-alignment unit (PU) aligns the substrates (W) one by one before alignment in the bonding unit (JU). Hereinafter, alignment by the pre-alignment unit (PU) may be referred to as pre-alignment.

[0038] The bonding unit (JU) bonds two substrates (W) (first substrate (W1) and second substrate (W2)) aligned by the pre-alignment unit (PU) under atmospheric pressure. The detailed structure of the bonding unit (JU) will be described later.

[0039] FIG. 2 is a block diagram showing the configuration of a substrate bonding device (1). As shown in FIG. 2, a control device (90) controls various operations of the substrate bonding device (1). The control device (90) includes a control unit (91) and a memory unit (93). The control unit (91) has a processor. The control unit (91) has, for example, a Central Processing Unit (CPU). Alternatively, the control unit (91) may have a general-purpose arithmetic unit.

[0040] The memory unit (93) stores data and computer programs. The data defines, for example, processing content and processing order for joining.

[0041] The memory unit (93) includes a main memory and an auxiliary memory. The main memory is, for example, a semiconductor memory. The auxiliary memory is, for example, a semiconductor memory and / or a hard disk drive. The memory unit (93) may include removable media. The control unit (91) executes a computer program stored in the memory unit (93) to perform a joining operation.

[0042] The control unit (91) controls the center robot (CR), activation unit (AU), cleaning unit (CU), return robot (TR), pre-alignment unit (PU), and bonding unit (JU) by transmitting control signals to the center robot (CR), activation unit (AU), cleaning unit (CU), return robot (TR), pre-alignment unit (PU), and bonding unit (JU).

[0043] Next, with reference to FIG. 3, a substrate bonding method using the substrate bonding device (1) of the present embodiment will be described. FIG. 3 is a flowchart showing a bonding method of a first substrate (W1) and a second substrate (W2) using the substrate bonding device (1) of the present embodiment. In the present embodiment, the bonding method of the first substrate (W1) and the second substrate (W2) includes steps SA to SD. Steps SA to SD are executed by a control unit (91).

[0044] As shown in FIG. 3, in step SA, the control unit (91) performs an activation process. Specifically, the control unit (91) controls the center robot (CR) to bring the first substrate (W1) from the first load port (LP1) into the activation unit (AU). Then, the control unit (91) controls the activation unit (AU) to perform plasma treatment on the first substrate (W1). Likewise, the control unit (91) controls the center robot (CR) to bring the second substrate (W2) from the second load port (LP2) into the activation unit (AU). Then, the control unit (91) controls the activation unit (AU) to perform plasma treatment on the second substrate (W2).

[0045] Next, in step SB, the control unit (91) performs a cleaning process. Specifically, the control unit (91) controls the center robot (CR) to bring the first substrate (W1) from the activation unit (AU) to the cleaning unit (CU). Then, the control unit (91) controls the cleaning unit (CU) to perform a cleaning process on the first substrate (W1). Likewise, the control unit (91) controls the center robot (CR) to bring the second substrate (W2) from the activation unit (AU) to the cleaning unit (CU). Then, the control unit (91) controls the cleaning unit (CU) to perform a cleaning process on the second substrate (W2).

[0046] Next, in step SC, the control unit (91) performs pre-alignment processing. Specifically, the control unit (91) controls the center robot (CR) and the transport robot (TR) to remove the first substrate (W1) from the cleaning unit (CU) and bring it into the pre-alignment unit (PU). Then, the control unit (91) controls the pre-alignment unit (PU) to perform pre-alignment processing on the first substrate (W1).

[0047] Likewise, the control unit (91) controls the center robot (CR) and the transport robot (TR) to remove the second substrate (W2) from the cleaning unit (CU) and bring it into the pre-alignment unit (PU). Then, the control unit (91) controls the pre-alignment unit (PU) to perform pre-alignment processing on the second substrate (W2).

[0048] Next, in step SD, the control unit (91) performs a bonding process. Specifically, the control unit (91) controls the transport robot (TR) to bring the first substrate (W1) from the pre-alignment unit (PU) to the bonding unit (JU). Likewise, the control unit (91) controls the transport robot (TR) to bring the second substrate (W2) from the pre-alignment unit (PU) to the bonding unit (JU). Then, the control unit (91) controls the bonding unit (JU) to align the first substrate (W1) and the second substrate (W2), and then performs a bonding process to bond them together.

[0049] As described above, the substrate bonding process by the substrate bonding device (1) of the present embodiment is completed.

[0050] In addition, in this embodiment, although it is described that the first substrate (W1) and the second substrate (W2) are processed in parallel in step SA, the activation treatment of the first substrate (W1) and the activation treatment of the second substrate (W2) may be performed sequentially. Likewise, although it is described that the first substrate (W1) and the second substrate (W2) are processed in parallel in each of steps SB to SC, the treatment for the first substrate (W1) and the treatment for the second substrate (W2) may be performed sequentially. Also, the treatment of steps SA to SC for the first substrate (W1) and the treatment of steps SA to SC for the second substrate (W2) may be performed in parallel.

[0051] Next, the bonding unit (JU) of the present embodiment will be described with reference to FIGS. 4 to 8. FIG. 4 is a perspective view schematically showing the structure of the bonding unit (JU). As shown in FIG. 4, the bonding unit (JU) comprises a base (2), a first substrate holder (10), a second substrate holder (20), a first moving actuator (100), and a second moving actuator (200). In addition, the first substrate holder (10) is an example of the "first member" of the present invention. The second substrate holder (20) is an example of the "second member" of the present invention. The second moving actuator (200) is an example of the "moving actuator" of the present invention.

[0052] The support (2) supports the first substrate holder (10), the second substrate holder (20), the first moving actuator (100), and the second moving actuator (200), etc. The support (2) is formed, for example, by stone.

[0053] In this embodiment, the first substrate holder (10) holds the back side of the first substrate (W1) (the side opposite to the side that is bonded to the second substrate (W2)).

[0054] The first substrate holder (10) has a first stage (11) and a first chuck (12) fixed to the first stage (11). The first stage (11) has a side surface (11a) on which the first chuck (12) is mounted. The first stage (11) is, for example, a plate having a rectangular shape. The first stage (11) is, for example, formed of ceramic or metal, etc.

[0055] The first chuck (12) holds the back surface of the first substrate (W1). The holding method by the first chuck (12) is not particularly limited, but, for example, vacuum type. The first chuck (12) is, for example, a plate having a cylindrical shape or a disc shape. The first chuck (12) is formed of, for example, ceramic or metal, etc. Also, the first chuck (12) is configured to be rotatable around the center of the first chuck (12).

[0056] In this embodiment, the second substrate holder (20) holds the back side of the second substrate (W2) (the side opposite to the side that is bonded to the first substrate (W1)).

[0057] The second substrate holder (20) has a second stage (21) and a second chuck (22) fixed to the second stage (21). The second stage (21) holds the second chuck (22). The second stage (21) is, for example, a plate having a rectangular shape. The second stage (21) is, for example, formed of ceramic or metal, etc.

[0058] The second chuck (22) holds the back surface of the second substrate (W2). The holding method by the second chuck (22) is not particularly limited, but, for example, vacuum type. The second chuck (22) is, for example, a plate having a cylindrical shape or a disc shape. The second chuck (22) is formed of, for example, ceramic or metal, etc. Also, the second chuck (22) is configured to be rotatable around the center of the second chuck (22).

[0059] The first moving actuator (100) has a reversing actuator (110), a lifting actuator (120), and a first gantry (130). In FIG. 4, the first gantry (130) is drawn with a dotted line.

[0060] The inversion actuator (110) inverts the first substrate holder (10) up and down. The inversion actuator (110) has a rotating shaft (111) fixed to the first substrate holder (10) and a rotary drive unit (not shown) that rotates the rotating shaft (111). The rotary drive unit has, for example, a stepping motor. By rotating the rotary drive unit rotates the rotating shaft (111) 180°, the first substrate holder (10) is inverted up and down.

[0061] Additionally, the first moving actuator (100) has a first rotary drive unit (140). The first rotary drive unit (140) is mounted on the first substrate holder (10). The first rotary drive unit (140) rotates the first chuck (12) in a circumferential direction. The first rotary drive unit (140) includes, for example, a direct drive motor.

[0062] In this embodiment, the bonding unit (JU) is equipped with an angle detection sensor (150). The angle detection sensor (150) includes, for example, three or more distance measuring sensors (151). The distance measuring sensors (151) are, for example, mounted on one side (11a) of the first substrate holder (10) and measure the distance to the second substrate holder (20). By rotating the rotation shaft (111) based on the detection result of the distance measuring sensors (151), the first substrate holder (10) can be positioned parallel to the second substrate holder (20).

[0063] The lifting actuator (120) moves the first substrate holder (10) up and down. The lifting actuator (120) has a pair of support members (121) and a pair of lifting mechanisms (122). The support members (121) support the reversing actuator (110). The support members (121) rotatably support the rotation shaft (111) of the reversing actuator (110).

[0064] The lifting mechanism (122) has a plurality of actuators (122a) and a plurality of rails (not shown). The actuators (122a) are fixed to a support member (121). Two actuators (122a) are fixed to one support member (121). The actuators (122a) move along the rails. The actuators (122a) have, for example, a coil. Also, the actuators (122a) have an encoder that detects the distance traveled along the rails (not shown).

[0065] A rail (city omitted) is fixed to a first gantry (130) so as to extend in a vertical direction. The rail has a plurality of magnets. The plurality of magnets are arranged so that the N pole and the S pole are alternately arranged along the vertical direction. By passing current through the coil of the actuator (122a), the actuator (122a) moves along the rail. As the actuator (122a) moves up and down along the rail, the first substrate holder (10) moves up and down.

[0066] The second moving actuator (200) has a parallel moving part (210) and a second rotary driving part (230) (see FIG. 5). The parallel moving part (210) moves the second substrate holder (20) in a parallel horizontal direction along the upper surface of the support (2). The parallel moving part (210) has a moving part (211) that moves the second substrate holder (20) in the X direction, a moving part (212) that moves the second substrate holder (20) in the Y direction, and a support (213) disposed between the moving part (211) and the moving part (212).

[0067] FIG. 5 is a schematic diagram showing the structure around the second substrate holder (20) of the bonding unit (JU) in the X direction. As shown in FIG. 4 and FIG. 5, the moving part (211) is placed on a support (213). The moving part (211) has a linear motor (2111) and a linear guide (2112). In this embodiment, the moving part (211) has a pair of linear motors (2111) and a pair of linear guides (2112).

[0068] A pair of linear motors (2111) are positioned outside the second stage (21) of the second substrate holder (20) in the Y direction. A pair of linear motors (2111) are positioned at a predetermined distance from each other in the Y direction.

[0069] Each linear motor (2111) has a mover (2111a) and a rail (2111b). The mover (2111a) is fixed to the side of the second stage (21). The mover (2111a) moves along the rail (2111b). The rail (2111b) is fixed to a support (213) so as to extend in the X direction. As the mover (2111a) moves along the rail (2111b), the second substrate holder (20) moves in the X direction.

[0070] A pair of linear guides (2112) are positioned between the second stage (21) of the second substrate holder (20) and the support (213). A pair of linear guides (2112) are positioned at a predetermined distance in the Y direction.

[0071] Each linear guide (2112) has a actuator (2112a) and a rail (2112b) extending in the X direction. The actuator (2112a) is fixed to the lower surface of the second stage (21) (the surface facing the support (213). The actuator (2112a) moves along the rail (2112b).

[0072] FIG. 6 is a schematic diagram showing the structure around the second substrate holder (20) of the bonding unit (JU) in the Y direction. As shown in FIG. 4 and FIG. 6, the moving part (212) is placed on the support (2). The moving part (212) has a linear motor (2121) and a linear guide (2122). In this embodiment, the moving part (212) has a pair of linear motors (2121) and a pair of linear guides (2122).

[0073] A pair of linear motors (2121) are positioned between the support (213) and the base (2). A pair of linear motors (2121) are positioned at a predetermined distance from each other in the X direction.

[0074] Each linear motor (2121) has a mover (2121a) and a rail (2121b). The mover (2121a) is fixed to the lower surface of the support (213) (the surface facing the base (2)). The mover (2121a) moves along the rail (2121b). The rail (2121b) is fixed to the base (2) so as to extend in the Y direction. As the mover (2121a) moves along the rail (2121b), the support (213) and the second substrate holder (20) move in the Y direction.

[0075] A pair of linear guides (2122) are positioned between the support (213) and the base (2). A pair of linear guides (2122) are positioned at a predetermined distance in the X direction.

[0076] Each linear guide (2122) has a mover (2122a) and a rail (2122b). The mover (2122a) is fixed to the lower surface of the support (213) (the surface facing the support (2)). The mover (2122a) moves along the rail (2122b).

[0077] The second rotary drive unit (230) is mounted on the lower part of the second chuck (22) of the second substrate holder (20). The second rotary drive unit (230) rotates the second chuck (22) in a circumferential direction. The second rotary drive unit (230) includes, for example, a direct drive motor.

[0078] FIG. 7 is a schematic diagram showing the structure around the support (213) from below. As shown in FIG. 5 and FIG. 7, the bonding unit (JU) is equipped with a detection mechanism (300). The detection mechanism (300) detects movement within the XY plane of either the first substrate holder (10) and the second substrate holder (20). In this embodiment, the detection mechanism (300) detects movement within the XY plane of the second substrate holder (20).

[0079] Specifically, the detection mechanism (300) has, for example, a two-dimensional scale (301) (hereinafter referred to as 2D scale (301)) and a detection sensor (302). The 2D scale (301) is mounted on the lower surface of the second stage (21) of the second substrate holder (20). The 2D scale (301) has a rectangular shape that expands in the XY direction. The 2D scale (301) is, for example, a reflective diffraction grating scale.

[0080] An opening (213a) is formed in the support (213). The opening (213a) is located below the 2D scale (301).

[0081] The detection sensor (302) is mounted on the upper surface of the base (2). The detection sensor (302) protrudes upward from the opening (213a) of the support (213). The detection sensor (302) emits laser light toward the 2D scale (301) and receives light reflected from the 2D scale (301). As the second substrate holder (20) moves, the light reception signal of the detection sensor (302) changes. In this way, the amount of movement of the second substrate holder (20) in the X direction and Y direction is detected.

[0082] Returning to FIG. 4, the bonding unit (JU) is described further. As shown in FIG. 4, the bonding unit (JU) is equipped with a first substrate detection sensor (310), and the first substrate holder (10) has a first reference mask (410). Additionally, the first substrate detection sensor (310) is an example of the "first imaging unit" of the present invention.

[0083] The first substrate detection sensor (310) is fixed to the second stage (21). The first substrate detection sensor (310) has a camera (311). The first substrate detection sensor (310) transmits image data captured by the camera (311) to the control device (90).

[0084] The first reference mask (410) has a plurality of first marks that are alignment marks. The first marks of the first reference mask (410) will be described later.

[0085] The first reference mask (410) is fixed to the first stage (11). The first reference mask (410) has a mark member (411) on which a first mark is formed, and a pair of supports (412) that support the mark member (411). The mark member (411) is formed, for example, by a transparent member. The mark member (411) is formed, for example, by glass that transmits visible light.

[0086] With one side (11a) of the first stage (11) facing downward, the first substrate detection sensor (310) is moved horizontally so that the alignment mark of the first substrate (W1) and the first mark of the first reference mask (410) are detected by the first substrate detection sensor (310). At this time, the direction and distance moved by the first substrate detection sensor (310) and the second substrate holder (20) during the period from when the alignment mark of the first substrate (W1) is detected by the first substrate detection sensor (310) until the first mark of the first reference mask (410) is detected are detected by the detection mechanism (300). By doing so, the relative position of the alignment mark of the first substrate (W1) with respect to the first mark of the first reference mask (410) can be detected.

[0087] The bonding unit (JU) is equipped with a second substrate detection sensor (320), and the second substrate holder (20) has a second reference mask (420). Additionally, the second substrate detection sensor (320) is an example of the “second imaging unit” of the present invention.

[0088] The bonding unit (JU) is equipped with a second gantry (350), and the second substrate detection sensor (320) is fixed to the second gantry (350). Also, in FIG. 4, a part of the second gantry (350) is drawn with a dotted line. The second substrate detection sensor (320) has a camera (321). The second substrate detection sensor (320) transmits image data captured by the camera (321) to the control device (90).

[0089] The second reference mask (420) has a plurality of second marks that are alignment marks. The second marks of the second reference mask (420) will be described later.

[0090] The second reference mask (420) is fixed to the second stage (21). The second reference mask (420) has a mark member (421) on which a second mark is formed and a support (422) that supports the mark member (421).

[0091] Here, by moving the second substrate holder (20) and the second substrate (W2) in a horizontal direction, the alignment mark of the second substrate (W2) and the second mark of the second reference mask (420) are detected by the second substrate detection sensor (320). At this time, the direction and distance in which the second substrate holder (20) and the second substrate (W2) have moved are detected by the detection mechanism (300) during the period from when the alignment mark of the second substrate (W2) is detected by the second substrate detection sensor (320) until the second mark of the second reference mask (420) is detected. By doing so, the relative position of the alignment mark of the second substrate (W2) with respect to the second mark of the second reference mask (420) can be detected.

[0092] FIG. 8 is a perspective view schematically showing the structure of a bonding unit (JU) from below. As shown in FIG. 8, the bonding unit (JU) is equipped with an imaging unit (50). The imaging unit (50) transmits the captured imaging data to a control device (90). In addition, the imaging unit (50) is an example of a "mark imaging unit" of the present invention.

[0093] The imaging unit (50) is mounted on the first stage (11) so as to penetrate the first stage (11) in the thickness direction.

[0094] When bonding the first substrate (W1) held in the first substrate holder (10) and the second substrate (W2) held in the second substrate holder (20), the first reference mask (410) and the second reference mask (420) are arranged facing each other in the vertical direction. At this time, the first mark of the first reference mask (410) and the second mark of the second reference mask (420) are positioned together within the imaging field of the imaging unit (50), so that the imaging unit (50) can simultaneously image the first mark of the first reference mask (410) and the second mark of the second reference mask (420).

[0095] The control unit (91) (see FIG. 1) controls the first moving actuator (100) and the second moving actuator (200).

[0096] The control unit (91) controls the first moving actuator (100) to invert the first substrate (W1) held in the first substrate holder (10). The control unit (91) controls the first moving actuator (100) to move the inverted first substrate (W1) downward, thereby joining the first substrate (W1) and the second substrate (W2).

[0097] The control unit (91) can calculate the relative positional relationship between the alignment mark of the first substrate (W1) and the alignment mark of the second substrate (W2) based on the detection results of the detection mechanism (300), the first substrate detection sensor (310), the second substrate detection sensor (320), and the imaging unit (50).

[0098] Next, with reference to FIG. 9, the first mark (M1) of the first reference mask (410) will be described. FIG. 9 is a diagram showing the structure viewed from the first substrate detection sensor (310) side (lower side) around the first mark (M1) of the first reference mask (410) when one side (11a) of the first stage (11) is facing downward.

[0099] As shown in FIG. 9, a plurality (here, 4) of first marks (M1) are formed on the mark member (411) of the first reference mask (410). The 4 first marks (M1) are arranged at predetermined positions. The first marks (M1) have a square shape, for example, and are formed with the same size as each other. The first marks (M1) are formed on the surface of the mark member (411) by etching, etc.

[0100] Also, the first reference mask (410) has a first forming area (R1) in which a plurality of first marks (M1) are formed. The first forming area (R1) is an area that surrounds all the first marks (M1). Also, in FIG. 9, the first forming area (R1) is shown as a dashed line. The first forming area (R1) is located at the end of one side (X1 direction) of the X direction of the first reference mask (410). The first forming area (R1) is narrower than the field of view (R50) of the imaging unit (50). Also, in FIG. 9, the field of view (R50) is shown as a dotted line. Also, in FIG. 9, the field of view (R50) is shown as a square, but the field of view (R50) may be circular, for example.

[0101] Next, with reference to FIG. 10, the second mark (M2) of the second reference mask (420) will be described. FIG. 10 is a diagram showing the structure around the second mark (M2) of the second reference mask (420) viewed from the side (upper side) of the second substrate detection sensor (320).

[0102] As shown in FIG. 10, a plurality (here, dozens or more) of second marks (M2) are formed on the mark member (421) of the second reference mask (420). The plurality of second marks (M2) are arranged radially. The second marks (M2) are, for example, square in shape. All second marks (M2) may be the same or different sizes, and some of the second marks (M2) may be the same size but different from the remaining second marks (M2). FIG. 10 shows an example in which a plurality of main marks (M21) are the same size but different from a plurality of sub-marks (M22). The second marks (M2) are formed on the surface of the mark member (421) by etching, etc.

[0103] Additionally, the second reference mask (420) has a second forming area (R2) in which a plurality of second marks (M2) are formed. The second forming area (R2) is an area that surrounds all the second marks (M2). Also, in FIG. 10, the second forming area (R2) is shown as a dashed line. The second forming area (R2) is located at the end of one side (X1 direction) of the X direction of the second reference mask (420). When the imaging unit (50) is focused on the second marks (M2), the second forming area (R2) is wider than the field of view (R50) (see FIG. 9) of the imaging unit (50). However, the field of view (R50) is a size that includes one or more (in this embodiment, four or more) second marks (M2).

[0104] Here, in this embodiment, the second mark (M2) includes coordinate information. Specifically, the second mark (M2) has a plurality (here, 5) main marks (M21) positioned at the center of the second forming area (R2), and a plurality (here, tens or more) sub-marks (M22) positioned around the main marks (M21). In this embodiment, the sub-marks (M22) are formed three times around the main marks (M21).

[0105] The main mark (M21) and the sub-mark (M22) have the same shape. On the other hand, the main mark (M21) and the sub-mark (M22) have different sizes (areas). In this embodiment, the size of the sub-mark (M22) is smaller than the size of the main mark (M21).

[0106] Also, the main mark (M21) and the sub-mark (M22) have different spacing from each other. In other words, the spacing between adjacent main marks (M21) and the spacing between adjacent sub-marks (M22) are different. In this embodiment, the spacing between adjacent sub-marks (M22) is smaller than the spacing between adjacent main marks (M21).

[0107] In addition, in this embodiment, the sub-marks (M22) are formed such that the spacing between adjacent sub-marks (M22) increases as they move away from the center of the second forming area (R2). Specifically, the spacing (L12) between the first sub-mark (M221) and the second sub-mark (M222) from the inside is smaller than the spacing (L23) between the second sub-mark (M222) and the third sub-mark (M223) from the inside. Thus, even when only a part of the second forming area (R2) is captured by the imaging unit (50) (when the field of view (R50) is narrower than the second forming area (R2)), the coordinates of each second mark (M2) can be detected. In other words, even if only a part of the second forming area (R2) is captured by the imaging unit (50), the direction and distance of each second mark (M2) with respect to the center (Pr2) of the second forming area (R2) can be detected.

[0108] As described above using FIGS. 1 to 10, in this embodiment, the second forming area (R2) is wider than the field of view (R50) of the imaging unit (50). Because of this, it is possible to prevent the second mark (M2) from being excluded from the field of view (R50) of the imaging unit (50). Also, the second mark (M2) contains coordinate information. Because of this, even if only a part of the second forming area (R2) is captured by the imaging unit (50), the coordinates of each second mark (M2) can be detected. Therefore, since the first substrate holder (10) and the second substrate holder (20) can be aligned with high precision, the first substrate (W1) and the second substrate (W2) can be aligned with high precision.

[0109] Also, as described above, the second mark (M2) has a main mark (M21) positioned in the center and a plurality of sub-marks (M22) positioned around the main mark (M21). Accordingly, the second forming area (R2) can be made wider than the field of view (R50) of the imaging unit (50).

[0110] In addition, as described above, the main mark (M21) and the sub-mark (M22) have different sizes and spacing. Therefore, the main mark (M21) and the sub-mark (M22) can be easily distinguished.

[0111] In addition, as described above, the sub-marks (M22) are formed such that the distance between adjacent sub-marks (M22) increases as they move away from the center. Therefore, the coordinates of each sub-mark (M22) can be easily detected.

[0112] In addition, as described above, in a configuration where the imaging unit (50) is fixed to the first substrate holder (10) and the second moving actuator (200) moves the second substrate holder (20), the second forming area (R2) is wider than the field of view of the imaging unit (50), and the second mark (M2) includes coordinate information. Therefore, even if the second mark (M2) moves in a horizontal direction relative to the imaging unit (50), it is easy to prevent the second mark (M2) from being excluded from the field of view (R50) of the imaging unit (50). Also, even if only a part of the second forming area (R2) is captured by the imaging unit (50), the coordinates of each second mark (M2) can be easily detected.

[0113] Next, with reference to FIGS. 11 to 18, a substrate bonding method of a bonding unit (JU) of the present embodiment will be described. FIG. 11 is a flowchart illustrating a substrate bonding method of a bonding unit (JU). In the present embodiment, the substrate bonding method of a bonding unit (JU) includes steps S101 to S114.

[0114] FIGS. 12 to 18 are drawings for explaining a substrate bonding method of a bonding unit (JU). Also, FIGS. 12 and 14 are drawings schematically showing the structure of the first substrate holder (10) viewed from the lower side when one side (11a) of the first stage (11) is facing downward. FIGS. 13 and 15 are drawings schematically showing the structure of the second substrate holder (20) viewed from the upper side. FIG. 16 is a plan view showing the positional relationship between the first substrate (W1) and the second substrate (W2) when the second substrate holder (20) is placed at a reference position. FIG. 17 is a plan view showing the positional relationship between the first mark (M1) and the second mark (M2) when the second substrate holder (20) is placed at a reference position. FIG. 18 is a plan view showing the first substrate (W1) and the second substrate (W2) in a positioned state. Also, in FIG. 16 to FIG. 18, for ease of understanding, the second substrate holder (20) and the second substrate (W2) are shown with solid lines, and the first substrate holder (10) and the first substrate (W1) are shown with dashed lines.

[0115] As shown in FIG. 11, in step S101, the control unit (91) brings the first substrate (W1), which is handed from the pre-alignment unit (PU) to the transfer robot (TR), into the bonding unit (JU). Additionally, the first substrate (W1) is held by the first substrate holder (10) with the bonding surface (surface (Wa)) facing upward (see FIG. 12).

[0116] Next, in step S102, the control unit (91) brings the second substrate (W2), which has been handed from the pre-alignment unit (PU) to the transfer robot (TR), into the bonding unit (JU). Additionally, the second substrate (W2) is held by the second substrate holder (20) with the bonding surface (surface (Wa)) facing upward (see FIG. 13).

[0117] Next, in step S103, the control unit (91) controls the first moving actuator (100) to invert the first substrate holder (10) vertically. As a result, the bonding surface of the first substrate (W1) faces downward.

[0118] Next, in step S104, the control unit (91) controls the second moving actuator (200) and the first substrate detection sensor (310) to capture an alignment mark (Mw1) of the first substrate (W1) (see FIG. 12) and a plurality of first marks (M1) of the first reference mask (410) (see FIG. 9). The alignment mark (Mw1) has, for example, a square shape and is formed on the surface (Wa) of the first substrate (W1). The alignment mark (Mw1) is an example of the "first substrate mark" of the present invention. In addition, the first substrate (W1) has a plurality (here, 4) of alignment marks (Mw1).

[0119] Additionally, the control unit (91) controls the second moving actuator (200) and the second substrate detection sensor (320) to capture an alignment mark (Mw2) of the second substrate (W2) (see FIG. 13) and a plurality of second marks (M2) of the second reference mask (420) (see FIG. 10). The alignment mark (Mw2) has, for example, a cross shape (or a plus shape) and is formed on the surface (Wa) of the second substrate (W2). The alignment mark (Mw2) is an example of the “second substrate mark” of the present invention. Furthermore, the second substrate (W2) has a plurality (here, 4) of alignment marks (Mw2).

[0120] The control unit (91) acquires image data captured by the first substrate detection sensor (310) and the second substrate detection sensor (320).

[0121] Next, in step S105, the control unit (91) calculates the angular position of the first substrate (W1) based on image data acquired from the first substrate detection sensor (310). At this time, the control unit (91) calculates the angular position of the first substrate (W1) based on image data of the alignment mark (Mw1) of the first substrate (W1). The control unit (91) may also calculate the angular position of the first substrate (W1) based on image data of the alignment mark (Mw1) of the first substrate (W1) and image data of the first mark (M1) of the first reference mask (410). Furthermore, in this embodiment, the angular position of the substrate (W) refers to the rotational angular position of the substrate (W) in a rotational direction centered on a central axis line perpendicular to the surface (Wa) of the substrate (W). In the following description, the angular position of the substrate (W) may be described as the rotational angular position of the substrate (W).

[0122] Likewise, the control unit (91) calculates the angular position of the second substrate (W2) based on the image data acquired from the second substrate detection sensor (320). At this time, the control unit (91) calculates the angular position of the second substrate (W2) based on the image data of the alignment mark (Mw2) of the second substrate (W2). The control unit (91) may also calculate the angular position of the second substrate (W2) based on the image data of the alignment mark (Mw2) of the second substrate (W2) and the image data of the second mark (M2) of the second reference mask (420).

[0123] Next, in step S106, the control unit (91) controls the first rotation drive unit (140) based on the calculated rotation angle position of the first substrate (W1) to rotate the first substrate (W1) by a predetermined angle. At this time, the control unit (91) rotates the first substrate (W1) so that, for example, a straight line (not shown) connecting two alignment marks (Mw1) passing through the center of the first substrate (W1) becomes parallel to the X direction or the Y direction. As a result, the first substrate (W1) becomes the state shown in FIG. 14.

[0124] Likewise, the control unit (91) controls the second rotation drive unit (230) based on the calculated rotation angle position of the second substrate (W2) to rotate the second substrate (W2) by a predetermined angle. At this time, the control unit (91) rotates the second substrate (W2) so that, for example, a straight line (not shown) connecting two alignment marks (Mw2) passing through the center of the second substrate (W2) becomes parallel to the X direction or the Y direction. As a result, the second substrate (W2) becomes the state shown in FIG. 15.

[0125] Next, in step S107, the control unit (91) controls the second moving actuator (200) and the first substrate detection sensor (310) to capture an alignment mark (Mw1) of the first substrate (W1). Also, the control unit (91) controls the second moving actuator (200) and the second substrate detection sensor (320) to capture an alignment mark (Mw2) of the second substrate (W2). The control unit (91) acquires image data captured by the first substrate detection sensor (310) and the second substrate detection sensor (320). Additionally, the first substrate detection sensor (310) and the second substrate detection sensor (320) may not capture the first mark (M1) of the first reference mask (410) and the second mark (M2) of the second reference mask (420) in step S104, but may capture the first mark (M1) of the first reference mask (410) and the second mark (M2) of the second reference mask (420) in step S107.

[0126] Next, in step S108, the control unit (91) controls the second moving actuator (200) to move the second substrate holder (20) to a reference position. The reference position is, for example, the position of the second substrate holder (20) when the center of the second chuck (22) of the second substrate holder (20) is located directly below the center of the first chuck (12) of the first substrate holder (10). At this time, in the present embodiment, as shown in FIGS. 16 and 17, the center (Pr1) of the first forming region (R1) of the first reference mask (410) and the center (Pr2) of the second forming region (R2) of the second reference mask (420) coincide when viewed from a plane. On the other hand, due to the misalignment of the first substrate (W1) with respect to the first chuck (12) and the misalignment of the second substrate (W2) with respect to the second chuck (22), the alignment mark (Mw1) of the first substrate (W1) and the alignment mark (Mw2) of the second substrate (W2) are misaligned. In addition, in this state, the distance between the first substrate (W1) and the second substrate (W2) is, for example, several mm to several tens of mm or more.

[0127] Next, in step S109, based on the image data captured by the first substrate detection sensor (310) and the second substrate detection sensor (320) in step S107, the alignment mark (Mw1) and the alignment mark (Mw2), and the image data captured by the first mark (M1) and the second mark (M2) in step S104 or step S107, the control unit (91) calculates the positional relationship of each mark.

[0128] Specifically, the control unit (91) calculates a first positional relationship between a first mark (M1) and an alignment mark (Mw1) based on the image result of the first substrate detection sensor (310), and calculates a second positional relationship between a second mark (M2) and an alignment mark (Mw2) based on the image result of the second substrate detection sensor (320). Then, the control unit (91) calculates a predetermined positional relationship based on the first positional relationship and the second positional relationship. Furthermore, the predetermined positional relationship is, for example, the positional relationship between the first mark (M1) and the second mark (M2) when the center of the alignment mark (Mw1) of the first substrate (W1) coincides with the alignment mark (Mw2) of the second substrate (W2).

[0129] Next, in step S110, the control unit (91) controls the second moving actuator (200) to move the second substrate holder (20) horizontally so that the center of the alignment mark (Mw2) of the second substrate (W2) roughly coincides horizontally with the center of the alignment mark (Mw1) of the first substrate (W1), based on a predetermined positional relationship calculated in step S109. As a result, the center (Pr1) of the first forming region (R1) and the center (Pr2) of the second forming region (R2) are horizontally misaligned by an amount roughly equal to the amount by which the alignment mark (Mw1) of the first substrate (W1) and the alignment mark (Mw2) of the second substrate (W2) were misaligned in step S108 (see FIG. 18).

[0130] Next, in step S111, the control unit (91) controls the lifting actuator (120) to lower the first substrate holder (10) by a predetermined amount. As a result, the distance between the first substrate (W1) and the second substrate (W2) becomes, for example, between several μm and several tens of μm.

[0131] Next, in step S112, the imaging unit (50) captures the first mark (M1) of the first reference mask (410) and the second mark (M2) of the second reference mask (420). Specifically, the imaging unit (50) captures the second mark (M2) by passing through (transmitting through) the first forming area (R1). The control unit (91) acquires the image data captured by the imaging unit (50).

[0132] Here, the magnification ratio of the imaging unit (50) is relatively large, and the field of view (R50) of the imaging unit (50) is relatively narrow. Because of this, if the first substrate (W1) is misaligned relative to the first chuck (12) or the second substrate (W2) is misaligned relative to the second chuck (22), the center of the second mark (M2) is not located within the field of view (R50) of the imaging unit (50).

[0133] However, in this embodiment, as described above, the second mark (M2) has a main mark (M21) and a sub-mark (M22) positioned around the main mark (M21), so the sub-mark (M22) of the second mark (M2) can be positioned within the field of view (R50) of the imaging unit (50). In short, even if the first substrate (W1) and the second substrate (W2) are misaligned, the first mark (M1) and the second mark (M2) can be captured by the imaging unit (50).

[0134] In addition, in this embodiment, since the imaging unit (50) is mounted on the first substrate holder (10) on which the first mark (M1) is formed, all of the first marks (M1) (or the first formed area (R1)) are located within the field of view (R50) of the imaging unit (50).

[0135] Next, in step S113, the control unit (91) drives the second moving actuator (200) based on the image data acquired in step S112 so that the positional relationship between the first mark (M1) and the second mark (M2) becomes a predetermined positional relationship calculated in step S109. As a result, the first substrate (W1) and the second substrate (W2) are positionally aligned with high precision.

[0136] Next, in step S114, the control unit (91) controls the first moving actuator (100) to move the first substrate holder (10) and the first substrate (W1) downward. As a result, the first substrate (W1) and the second substrate (W2) are joined together.

[0137] In this way, the bonding of the first substrate (W1) and the second substrate (W2) by the bonding unit (JU) is completed.

[0138] As described using FIGS. 11 to 18, in this embodiment, the control unit (91) calculates a first positional relationship between a first mark (M1) and an alignment mark (Mw1) based on the image result of the first substrate detection sensor (310). Also, the control unit (91) calculates a second positional relationship between a second mark (M2) and an alignment mark (Mw2) based on the image result of the second substrate detection sensor (320). Then, the control unit (91) calculates a predetermined positional relationship based on the first positional relationship and the second positional relationship. Accordingly, by capturing the first mark (M1) and the second mark (M2) by the image unit (50), the first substrate (W1) and the second substrate (W2) can be aligned with high precision.

[0139] The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the above embodiments and can be implemented in various forms without departing from the gist thereof. Furthermore, various inventions can be formed by appropriately combining a plurality of components disclosed in the above embodiments. For example, some components may be deleted from the entire set of components shown in the embodiments. Additionally, components spanning different embodiments may be appropriately combined. The drawings are schematically illustrated with each component as the main subject for ease of understanding, and the thickness, length, number, spacing, etc., of each illustrated component may differ from the actual state due to the circumstances of drawing preparation. Furthermore, the material, shape, dimensions, etc., of each component shown in the above embodiments are merely examples and are not specifically limited, and various modifications are possible within a range that does not substantially deviate from the effects of the present invention.

[0140] For example, in the above embodiment, an example was described in which the first substrate holder (10) is moved in the up-and-down direction and the second substrate holder (20) is moved in the horizontal direction, but the present invention is not limited thereto. For example, the second substrate holder (20) may be moved in the up-and-down direction and the first substrate holder (10) may be moved in the horizontal direction. Also, either the first substrate holder (10) or the second substrate holder (20) may be moved in the up-and-down direction and the horizontal direction.

[0141] In addition, in the above embodiment, an example of applying the present invention to a substrate bonding device (1) that bonds a first substrate (W1) and a second substrate (W2) has been described, but the present invention is not limited thereto. For example, the present invention may be applied to an exposure device that aligns a mask (first member) and a substrate (second member), etc.

[0142] Additionally, in the above embodiment, an example was described in which the second forming area (R2) where the second mark (M2) is formed is wider than the field of view of the imaging unit (50), but the present invention is not limited thereto. For example, the first forming area (R1) where the first mark (M1) is formed may be wider than the field of view of the imaging unit (50). Also, both the first forming area (R1) and the second forming area (R2) may be wider than the field of view of the imaging unit (50).

[0143] Additionally, in the above embodiment, an example in which the imaging unit (50) is mounted on the first substrate holder (10) has been described, but the present invention is not limited thereto. For example, the imaging unit (50) may be mounted on the second substrate holder (20). Also, the imaging unit (50) may be mounted on a component other than the first substrate holder (10) and the second substrate holder (20), such as the first gantry (130). For example, when the imaging unit (50) is mounted on a component other than the first substrate holder (10) and the second substrate holder (20), such as the first gantry (130), it is preferable that both the first forming area (R1) and the second forming area (R2) are wider than the field of view of the imaging unit (50).

[0144] In addition, in the above embodiment, an example was described in which the main mark (M21) and the sub-mark (M22) have the same shape and different sizes, but the present invention is not limited thereto. The main mark (M21) and the sub-mark (M22) may have different shapes. Also, the main mark (M21) and the sub-mark (M22) may have the same size.

[0145] In addition, in the above embodiment, an example was described in which all sub-marks (M22) have the same shape and the same size, but the present invention is not limited thereto. For example, all sub-marks (M22) may have different shapes and different sizes. By configuring it in this way, the coordinates of the captured sub-mark (M22) can be detected by capturing one sub-mark (M22) by the imaging unit (50). Also, for example, the sub-marks (M22) may have different shapes and different sizes for each week.

[0146] In addition, in the above embodiment, an example was described in which the spacing between adjacent sub-marks (M22) increases as they move away from the center, but the present invention is not limited thereto. The size of the sub-mark (M22) may increase as it moves away from the center. Also, as it moves away from the center, the spacing between adjacent sub-marks (M22) and / or the size of the sub-mark (M22) may decrease. Alternatively, as shown in FIG. 19, the sub-mark (M22) may have different shapes depending on the distance from the center. In this case, for example, the sub-mark (M22) may have different shapes for each week.

[0147] Additionally, in the above embodiment, for ease of understanding, an example in which the second substrate holder (20) is moved to a reference position in step S108 was described, but the present invention is not limited thereto. In short, step S108 may be omitted.

[0148] In addition, in the above embodiment, an example in which the substrate bonding process is completed by bonding the first substrate (W1) and the second substrate (W2) was described, but the present invention is not limited thereto. For example, after bonding the first substrate (W1) and the second substrate (W2), the bonding precision of the first substrate (W1) and the second substrate (W2) may be checked. In this case, for example, the bonding precision of the first substrate (W1) and the second substrate (W2) may be checked by capturing the first mark (M1) and the second mark (M2) by the imaging unit (50).

[0149] The present invention is preferably used in a position alignment device.

[0150] This application claims priority based on Japanese Patent Application No. 2024-010087 filed on January 26, 2024, and the entire contents of this application are incorporated herein by reference.

Claims

Claim 1 The apparatus comprises a first member having a first mark formed thereon, a second member disposed opposite to the first member having a second mark formed thereon, a moving actuator that moves one of the first member and the second member in a direction intersecting the direction in which the first member and the second member face each other, a mark capturing unit that captures the first mark and the second mark, and a control unit that controls the moving actuator. The first member has a first forming area in which one or more of the first marks are formed, and the second member has a second forming area in which one or more of the second marks are formed. The mark capturing unit captures the second mark of the second member through the first forming area of ​​the first member. The control unit, based on the capturing result of the mark capturing unit, moves the moving actuator so that the first mark and the second mark have a predetermined positional relationship. A position alignment device that controls, wherein at least one of the first forming area and the second forming area is wider than the field of view of the mark imaging unit, and the mark formed in the at least one includes coordinate information. Claim 2 A position alignment device according to claim 1, wherein the mark formed on at least one side comprises a main mark positioned at the center and a plurality of sub-marks positioned around the main mark. Claim 3 In claim 2, the main mark and the sub-mark are position-aligned devices in which at least one of the shape, size, and spacing differs. Claim 4 A positioning device according to claim 2 or 3, wherein the sub-mark is formed such that, as it moves away from the center, at least one of the spacing between adjacent sub-marks and the size of the sub-mark increases. Claim 5 In claim 2 or 3, the sub-mark is a position alignment device having a different shape depending on the distance from the center. Claim 6 A position alignment device according to any one of claims 1 to 3, wherein the mark imaging unit is fixed to the first member, the moving actuator moves the second member, the second forming area is wider than the field of view of the mark imaging unit, and the second mark includes the coordinate information. Claim 7 A position alignment device according to any one of claims 1 to 3, further comprising a first imaging unit and a second imaging unit, wherein the first member has a first chuck for holding a first substrate on which a first substrate mark is formed, and the second member has a second chuck for holding a second substrate on which a second substrate mark is formed, wherein the first imaging unit images the first mark and the first substrate mark, the second imaging unit images the second mark and the second substrate mark, and the control unit calculates a first positional relationship between the first mark and the first substrate mark based on the imaging result of the first imaging unit, calculates a second positional relationship between the second mark and the second substrate mark based on the imaging result of the second imaging unit, and calculates a predetermined positional relationship based on the first positional relationship and the second positional relationship.

Images