Substrate preform, display module preform and preparation method thereof

Abstract

The present application discloses a substrate preform, a display module preform, and a method for manufacturing the same, wherein the substrate preform comprises a base, a metal layer, and a first organic layer, wherein the metal layer is located on one side of the base, and the metal layer comprises a metal wiring located in the functional area and a binding solder pad located in the binding area, and the first organic layer is located on one side of the metal layer facing away from the base, and the first organic layer covers the metal wiring and covers at least the sidewall of the binding solder pad. The touch panel preform provided by the present application can improve the protective effect of the binding solder pad, thereby helping to improve the yield of the product.

Description

Technology Field

[0001] The present application belongs to the field of display technology, and in particular relates to a substrate preform, a display module preform, and a method for manufacturing the same. Background Technology

[0002] With the advancement of display technology, the requirements for display devices are becoming increasingly high, and current display devices require improvements in the performance of binding solder pads used to implement electrical connections between chips and circuits within the device.

[0003] The embodiments of the present application provide a substrate preform, a display module preform, and a method for manufacturing the same, and can improve the protective effect of binding solder pads, thereby helping to improve the yield of the product.

[0004] An embodiment of the first aspect of the embodiment of the present application provides a substrate preform comprising a functional region and a binding region, and said substrate preform, said substrate preform,

[0005] base,

[0006] A metal layer located on one side of the base, comprising metal wiring located in the functional area and binding solder pads located in the binding area,

[0007] A first organic layer located on one side facing away from the base of the metal layer, covering the metal wiring and covering at least the side wall of the binding solder pad.

[0008] Includes

[0009] According to an embodiment of the first aspect of the present invention, the first organic layer covers the metal wiring and the binding solder pad, and

[0010] Preferably, the first organic layer covers the functional region and the binding region, and

[0011] Preferably, the thickness of the first organic layer located in the functional area is greater than or equal to the thickness of the first organic layer located in the binding area, and

[0012] Preferably, the first organic layer comprises an organic adhesive, and

[0013] Preferably, the first organic layer comprises an acrylic adhesive layer, a silicone adhesive layer, a polyurethane adhesive layer, a UV-curing adhesive layer, a polyimide adhesive layer, or a photoresist layer, and

[0014] Preferably, the binding solder pad comprises at least two layers of metal installed in a laminated manner, and

[0015] Preferably, the binding solder pad comprises a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer installed in a laminated manner.

[0016] According to any one of the aforementioned embodiments of the first aspect of the present invention, the metal layer is a touch metal layer, the touch metal layer includes the first metal layer, and the first organic layer is installed on one side away from the base of the first metal layer.

[0017] Preferably, the touch metal layer further includes a second metal layer located on one side facing away from the base of the first metal layer, and the first metal layer includes a binding solder pad located in the binding area.

[0018] Preferably, the first organic layer is located between the first metal layer and the second metal layer, or the first organic layer is located on one side away from the base of the second metal layer, and

[0019] Preferably, the touch metal layer further comprises a second metal layer located on one side facing away from the base of the first metal layer, the second metal layer comprises a binding solder pad located in the binding region, and the first organic layer is located on one side facing away from the base of the second metal layer.

[0020] Preferably, the first metal layer includes a touch lead located in the binding region, and the touch lead is electrically connected to the binding solder pad.

[0021] Preferably, the metal layer is an array metal layer, and the first organic layer is a planarization layer.

[0022] An embodiment of the second aspect of the present application also provides a display module preform comprising any substrate preform provided by the first aspect of the present application.

[0023] According to an embodiment of the second aspect of the present application, the optical improvement layer is further included, which is located on one side away from the base of the first organic layer.

[0024] Preferably, the optical improvement layer comprises a second organic layer, and the orthographic projection of the second organic layer on the base does not overlap with the orthographic projection of the binding solder pad on the base, and

[0025] Preferably, the second organic layer covers the functional region, and

[0026] Preferably, the second organic layer comprises an organic adhesive, and

[0027] Preferably, the second organic layer comprises an acrylic adhesive layer, a silicone adhesive layer, a polyurethane adhesive layer, a UV-curing adhesive layer, a polyimide adhesive layer, or a photoresist layer, and

[0028] Preferably, the material of the second organic layer is the same as the material of the first organic layer, and

[0029] Preferably, the optical improvement layer comprises at least one of a color filter layer and a microlens layer, and

[0030] Preferably, the display module preform further comprises a light-emitting layer, the light-emitting layer comprises a plurality of light-emitting units, the optical improvement layer comprises a color filter layer, the second organic layer is located on one side away from the base of the color filter layer, the color filter layer comprises a light-blocking layer and a color filter portion, the orthographic projection of the color filter portion on the base overlaps at least partially with the orthographic projection of the light-emitting unit on the base, and the light-blocking layer is located between the color filter portions.

[0031] and / or, the optical improvement layer comprises a microlens layer, the microlens layer comprises a first optical functional layer and a second optical functional layer installed in a stacked manner, the refractive index of the first optical functional layer is different from the refractive index of the second optical functional layer, and the second organic layer is located on one side away from the base of the microlens layer.

[0032] An embodiment of a third aspect of the present application also provides a display module comprising a display area and a binding area, wherein the display module comprises a substrate, the substrate comprises a stacked base, a metal layer and a third organic layer, wherein the metal layer has a binding solder pad installed in the binding area, the third organic layer covers the display area, and the orthographic projection of the third organic layer on the base does not overlap with the orthographic projection of the binding solder pad on the base.

[0033] According to an embodiment of the third aspect of the present application, the substrate is a touch substrate, the metal layer is a touch metal layer, the touch metal layer includes the first metal layer, and the third organic layer is installed on one side away from the base of the first metal layer.

[0034] Preferably, the touch metal layer further includes a second metal layer located on one side facing away from the base of the first metal layer, and the first metal layer includes a binding solder pad located in the binding area.

[0035] Preferably, the third organic layer is located between the first metal layer and the second metal layer, or the third organic layer is located on one side away from the base of the second metal layer, and

[0036] Preferably, the touch metal layer further comprises a second metal layer located on one side facing away from the base of the first metal layer, the second metal layer comprises a binding solder pad located in the binding region, and the third organic layer is located on one side facing away from the base of the second metal layer.

[0037] Preferably, the first metal layer includes a touch lead located in the binding region, and the touch lead is electrically connected to the binding solder pad.

[0038] Preferably, the substrate is an array substrate, the metal layer is an array metal layer, and the third organic layer is a planarization layer.

[0039] According to any one of the aforementioned embodiments of the third aspect of the present application, the binding solder pad comprises at least two layers of metal layers installed in a laminated manner, and

[0040] Preferably, the binding solder pad comprises a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer installed in a laminated manner.

[0041] According to any one of the aforementioned embodiments of the third aspect of the present application, the display module further comprises an optical improvement layer, wherein the optical improvement layer is installed on one side away from the base of the third organic layer, and the optical improvement layer comprises a fourth organic layer, and the orthographic projection of the fourth organic layer on the display panel does not overlap with the orthographic projection of the binding solder pad on the display panel, and

[0042] Preferably, the fourth organic layer covers the display area, and

[0043] Preferably, the optical improvement layer comprises at least one of a color filter layer and a microlens layer, and

[0044] Preferably, the display module further comprises a light-emitting layer, the light-emitting layer comprises a plurality of light-emitting units, the optical improvement layer comprises a color filter layer, the second organic layer is located on one side away from the base of the color filter layer, the color filter layer comprises a light-blocking layer and a color filter portion, the orthographic projection of the color filter portion on the base overlaps at least partially with the orthographic projection of the light-emitting unit on the base, and the light-blocking layer is located between the color filter portions.

[0045] and / or, the optical improvement layer comprises a microlens layer, the microlens layer comprises a first optical functional layer and a second optical functional layer installed in a stacked manner, the refractive index of the first optical functional layer is different from the refractive index of the second optical functional layer, and the second organic layer is located on one side away from the base of the microlens layer.

[0046] According to any one of the aforementioned embodiments of the third aspect of the present application, another film layer is not installed in the same layer as the binding solder pad within the binding region, and preferably, the third organic layer and the fourth organic layer comprise an organic adhesive,

[0047] Preferably, the third organic layer and the fourth organic layer comprise an acrylic adhesive layer, a silicone adhesive layer, a polyurethane adhesive layer, a UV-curing adhesive layer, a polyimide adhesive layer, or a photoresist layer.

[0048] An embodiment of the fourth aspect of the present application also provides a method for manufacturing a substrate preform, wherein the substrate preform includes a binding region and a functional region, and the manufacturing method comprises

[0049] Step of providing a base,

[0050] A step of forming a metal layer on one side of the base, comprising metal wiring located in the functional area and binding solder pads located in the binding area,

[0051] A step of covering the metal wiring on one side facing away from the base of the metal layer and forming a first organic layer covering at least the side wall of the binding solder pad.

[0052] Includes,

[0053] Preferably, a step of forming a first organic layer covering the functional area and the binding area on one side facing away from the base of the metal layer,

[0054] Includes

[0055] According to an embodiment of the fourth aspect of the present invention, the step of forming a first organic layer covering the functional area and the binding area on one side facing away from the base of the metal layer comprises the step of making the thickness of the first organic layer formed in the functional area greater than or equal to the thickness of the first organic layer formed in the binding area.

[0056] Preferably, the step of making the thickness of the first organic layer formed in the functional region greater than the thickness of the first organic layer formed in the binding region is

[0057] A step of installing a mask plate on one side facing away from the display panel of the first organic layer - the mask plate includes a non-transparent area and a semi-transparent area, the non-transparent area and the functional area are installed to correspond, and the semi-transparent area and the binding area are installed to correspond -,

[0058] A step of performing light irradiation on one side of the mask plate away from the first organic layer,

[0059] A step of developing an area of ​​a substrate preform corresponding to a semi-transparent region with a developer such that the thickness of the first organic layer located in the functional region is greater than the thickness of the first organic layer located in the binding region.

[0060] Includes,

[0061] Preferably, the semitransparent region includes a light-blocking film layer, or the semitransparent region includes a plurality of rod-shaped through-holes penetrating the thickness direction of the mask, and the spacing between adjacent rod-shaped through-holes is 1 μm to 2 μm, and

[0062] Preferably, the first organic layer comprises an acrylic adhesive layer, a silicone adhesive layer, a polyurethane adhesive layer, a UV-curing adhesive layer, a polyimide adhesive layer, or a photoresist layer.

[0063] An embodiment of the fifth aspect of the present application also provides a method for manufacturing a display module, said manufacturing method

[0064] A step of providing a substrate preform provided by any one of the first aspects of the present application or a substrate preform manufactured using any one of the manufacturing methods provided by the fourth aspect of the present application,

[0065] A step of forming an optical improvement layer on one side of the first organic layer away from the base - the optical improvement layer includes a second organic layer formed on one side facing away from the base of the first organic layer, and the orthographic projection of the second organic layer on the base does not overlap with the orthographic projection of the binding solder pad on the base -,

[0066] A step of performing a thinning treatment on the second organic layer and the first organic layer located in the binding region so that the second organic layer is thinned to form a fourth organic layer, and removing the portion of the first organic layer located in the binding region to form a third organic layer so that the third organic layer covers the functional region.

[0067] Includes,

[0068] Preferably, the step of forming a second organic layer on one side facing away from the base of the first organic layer includes the step of the second organic layer covering the functional area.

[0069] Preferably, the step of performing a thinning treatment on the second organic layer and the first organic layer located in the binding region includes the step of performing an ashing treatment on the second organic layer and the first organic layer located in the binding region.

[0070] An embodiment of the sixth aspect of the present application also provides a display device and includes any one of the display modules provided by the second aspect of the present application, or a display module manufactured and formed using the manufacturing method of the fifth aspect of the present application.

[0071] The substrate preform provided by the present application includes a functional region and a binding region, and the substrate preform includes a base, a metal layer, and a first organic layer. Herein, the metal layer is located on one side of the base and includes metal wiring and a binding solder pad, the metal wiring is used to transmit signals to implement a corresponding function, and the binding solder pad is used to bind to a chip. The first organic layer is located on one side facing away from the base of the metal layer, and the first organic layer covers the metal wiring to provide protection and insulation for the metal wiring, and the first organic layer also covers at least the sidewall of the binding solder pad to provide protection for the binding solder pad, specifically, it can protect the material inside the binding solder pad and mitigate damage caused by a subsequent process, and damage to the binding solder pad caused by a subsequent process specifically may include the problem of the binding solder pad being improperly etched on the side by the etching solution of the subsequent process, whereby the material inside the binding solder pad is corroded. In addition, the first organic layer can cover the binding solder pad more completely, thereby further enhancing the protective effect of the binding solder pad, which helps to improve the product yield. Brief explanation of the drawing

[0072] In order to more clearly explain the technical solution means according to the embodiments of the present application, the drawings to be used in the embodiments of the present application are briefly introduced below. Of course, the drawings described below are merely some embodiments of the present application, and a person skilled in the art can obtain other drawings based on these drawings without creative effort. FIG. 1 is a plan view of a substrate preform provided by an embodiment of the present application. Figure 2 is a cross-sectional view along M-M' of Figure 1. Figure 3 is a cross-sectional view along M-M' of Figure 1. Figure 4 is a cross-sectional view along M-M' of Figure 1. Figure 5 is a cross-sectional view along M-M' of Figure 1. Figure 6 is a cross-sectional view along M-M' of Figure 1. FIG. 7 is a cross-sectional view of another substrate preform provided by an embodiment of the present application. FIG. 8 is a schematic diagram of the structure of a display module preform provided by an embodiment of the present application. FIG. 9 is a schematic diagram of the structure of another display module preform provided by an embodiment of the present application. FIG. 10 is a schematic diagram of the structure of another display module preform provided by an embodiment of the present application. FIG. 11 is a schematic diagram of the structure of another display module preform provided by an embodiment of the present application. FIG. 12 is a schematic diagram of the structure of another display module preform provided by an embodiment of the present application. FIG. 13 is a schematic diagram of the structure of a display module provided by an embodiment of the present application. FIG. 14 is a schematic diagram of the structure of a display module provided by an embodiment of the present application. FIG. 15 is a schematic diagram of the structure of a display module provided by an embodiment of the present application. FIG. 16 is a schematic diagram of the structure of a display module provided by an embodiment of the present application. FIG. 17 is a schematic diagram of the structure of a display module provided by an embodiment of the present application. FIG. 18 is a schematic diagram of the structure of a display module provided by an embodiment of the present application. FIG. 19 is a schematic diagram of the structure of a display module provided by an embodiment of the present application. FIG. 20 is a flowchart of a method for manufacturing a substrate preform provided by an embodiment of the present application. FIG. 21 is a schematic diagram of a method for manufacturing a substrate preform provided by an embodiment of the present application. FIG. 22 is a schematic diagram of a method for manufacturing a substrate preform provided by an embodiment of the present application. FIG. 23 is a schematic diagram of a method for manufacturing a substrate preform provided by an embodiment of the present application. FIG. 24 is a flowchart of a method for manufacturing a display module provided by an embodiment of the present application. FIG. 25 is a schematic diagram of the structure of a display device provided by an embodiment of the present application. Specific details for implementing the invention

[0073] The features of various aspects of the present application and exemplary embodiments are described in detail below. Many specific details are provided in the detailed description below to provide a complete understanding of the present application. However, it will be apparent to those skilled in the art that the present application can be implemented without some of these specific details. The description of the embodiments below is intended only to provide a better understanding of the present application by presenting examples of the application.

[0074] It should be noted that in this disclosure, similar relational terms, such as, for example, first and second, are used merely to distinguish one entity or action from another, and do not require or imply that there is an actual relationship or order between such entities or actions. Furthermore, the terms “include,” “include,” or other variations thereof mean to include a non-exclusive inclusion, thereby causing a process, method, article, or apparatus comprising a series of components to include not only these components but also other components not explicitly listed, or to include components inherent to such process, method, article, or apparatus. Unless otherwise limited, a component limited by the phrase “...includes” does not exclude the presence of additional identical components in the process, method, article, or apparatus comprising that component.

[0075] To better understand the present application, a touch panel preform and a method for manufacturing the same, a display module preform, a display module and a method for manufacturing the same, and a display device according to an embodiment of the present application will be described in detail below in conjunction with FIGS. 1 to 25.

[0076] Referring to FIGS. 1 to 3, an embodiment of the present application provides a substrate preform (1) comprising a functional region (A1) and a binding region (B), wherein the substrate preform (1) comprises a base (11), a metal layer (12), and a first organic layer (13). The metal layer (12) is located on one side of the base (11), and the metal layer (12) comprises a metal wiring (120) located in the functional region (A1) and a binding solder pad (121) located in the binding region (B). The first organic layer (13) is located on one side facing away from the base (11) of the metal layer (12), and the first organic layer (13) covers the metal wiring (120) and at least the side wall of the binding solder pad (121).

[0077] A substrate preform (1) provided by the present application includes a functional region (A1) and a binding region (B), and the substrate preform (1) includes a base (11), a metal layer (12), and a first organic layer (13). Here, the metal layer (12) is located on one side of the base (11) and includes a metal wiring (120) and a binding solder pad (121), the metal wiring (120) is used to transmit a signal for implementing a corresponding function, and the binding solder pad (121) is used to bind to a chip. The first organic layer (13) is located on one side facing away from the base (11) of the metal layer (12), and the first organic layer (13) covers the metal wiring (120) to provide protection and insulation for the metal wiring (120), and the first organic layer (13) also covers at least the side wall of the binding solder pad (121) to provide protection for the binding solder pad (121), specifically, it can protect the material inside the binding solder pad (121) and improve damage caused by subsequent processes. Damage to the binding solder pad (121) caused by subsequent processes may specifically include the problem of the binding solder pad (121) being improperly etched on the side by the etching solution of the subsequent process, whereby the material inside the binding solder pad (121) is corroded. In addition, the first organic layer (13) can more completely cover the binding solder pad (121), thereby further enhancing the protective effect on the binding solder pad (121), which helps to improve the yield of the product.

[0078] In a possible embodiment, as shown in FIG. 3, the first organic layer (13) covers the metal wiring (120) and the binding solder pad (121).

[0079] In the above embodiment, when the first organic layer (13) completely covers the binding solder pad (121), the first organic layer (13) can be synchronously removed after protecting the binding solder pad (121) in some subsequent process, thereby reducing the removal process by one, which simplifies the manufacturing process, improves production efficiency, and reduces costs.

[0080] In a possible embodiment, as shown in FIG. 3, the first organic layer (13) covers the functional area (A1) and the binding area (B).

[0081] In the above embodiment, the first organic layer (13) can be manufactured on the entire surface, that is, the first organic layer (13) can cover the functional area (A1) and the binding area (B), thereby simplifying the manufacturing process on one hand and enabling the first organic layer (13) to provide good insulation and protection effects on the other.

[0082] In a possible embodiment, as shown in FIGS. 3 and 4, the thickness of the first organic layer (13) located in the functional area (A1) is greater than or equal to the thickness of the first organic layer (13) located in the binding area (B).

[0083] Specifically, the thickness of the first organic layer (13) located in the functional area (A1) may be the same as the thickness of the first organic layer (13) located in the binding area (B), so that the first organic layer (13) can be manufactured as a whole layer without the need to manufacture it by dividing it separately, thereby simplifying the manufacturing process and reducing manufacturing costs.

[0084] Specifically, the thickness of the first organic layer (13) located in the functional area (A1) is greater than the thickness of the first organic layer (13) located in the binding area (B). At this time, the portion of the first organic layer (13) located in the functional area (A1) is relatively thick, thereby providing good protection and insulation effects for the metal wiring (120) and preventing failure of protection and insulation due to exposure of the metal wiring (120). The portion of the first organic layer (13) located in the binding region (B) is relatively thin, which is advantageous for synchronously removing the portion of the first organic layer (13) located in the binding region (B) during a subsequent manufacturing process, that is, the first organic layer (13) is removed after providing protection for the binding solder pad (121), that is, protection for the binding solder pad (121) can be provided using the first organic layer (13), and after the protection effect is achieved, it is synchronously removed by a subsequent process to expose the binding solder pad (121) and is advantageous for providing electrical connection of the binding solder pad (121), and the process of removing the first organic layer (13) can be reduced, thereby simplifying the process and reducing costs.

[0085] In a possible embodiment, the first organic layer (13) includes an organic adhesive. Using an organic adhesive is advantageous for bending the substrate preform (1), and the substrate preform (1) can be applied to a flexible product such as a flexible display module during the application process, thereby ensuring the bending performance of the product and effectively preventing the problem of the film layer separating during the bending process.

[0086] In the above embodiment, if the first organic layer (13) uses an organic adhesive, the removal process can be simplified and the subsequent process can be removed synchronously, which is advantageous for exposing the binding solder pad (121) and thus advantageous for subsequent binding.

[0087] In a possible embodiment, the first organic layer (13) comprises an acrylic adhesive layer, a silicone adhesive layer, a polyurethane adhesive layer, a UV-curing adhesive layer, a polyimide adhesive layer, or a photoresist layer, and the organic adhesive material is readily available and inexpensive, and other organic adhesives may also be used, and the present application is not particularly limited thereto.

[0088] In a possible embodiment, the binding solder pad (121) comprises at least two layers of metal (not shown in the drawing) installed in a stacked manner, and specifically, one of the two layers of metal may have stronger corrosion resistance than the one away from the base (11) to protect the other layer of metal.

[0089] In a possible embodiment, the binding solder pad (121) comprises a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer installed in a stacked manner.

[0090] In the above embodiment, the aluminum metal layer is easily corroded by the etching solution, and the edge of the first organic layer (13) covering the binding solder pad (121) may specifically include covering the edge of the aluminum metal layer to protect the aluminum metal layer and prevent it from corroding.

[0091] In a possible embodiment, as illustrated in FIG. 4, the substrate preform may be a touch substrate preform, and the functional area may be a touch area. The metal layer (12) is a touch metal layer, and the touch metal layer includes a first metal layer (122), and the first organic layer (13) is installed on one side away from the base (11) of the first metal layer (122).

[0092] In the above embodiment, the first metal layer (122) includes a metal wiring (120), and the metal wiring (120) is located in a functional area (A1), i.e., a touch area. The first metal layer (122) may further include a binding solder pad (121), and the binding solder pad (121) is located in a binding area (B), i.e., the first metal layer (122) and the binding solder pad (121) are formed by using the same material and manufacturing by the same process.

[0093] In the above embodiment, the first organic layer (13) is installed on one side away from the base (11) of the first metal layer (122) and can be used to provide insulation of the metal wiring (120) and protection of the metal wiring (120), and at the same time can also be used to provide protection of the binding solder pad (121).

[0094] In a possible embodiment, as shown in FIG. 5, the touch metal layer further includes a second metal layer (123) located on one side facing away from the base (11) of the first metal layer (122), and the first metal layer (122) includes a binding solder pad (121) located in a binding area (B).

[0095] In the above embodiment, the metal layer (12) may further include a second metal layer (123), and the second metal layer (123) includes metal wiring (120) located in the functional area (A1), i.e., metal wiring (120) located in the touch area. When a binding solder pad (121) is formed on the first metal layer (122), the orthographic projection of the second metal layer (123) on the base (11) does not overlap with the orthographic projection of the binding solder pad (121) on the base (11). Specifically, the orthographic projection of the second metal layer (123) on the base (11) does not overlap with the orthographic projection of the binding area (B) on the base (11).

[0096] In the above embodiment, the first organic layer (13) is located between the first metal layer (122) and the second metal layer (123). Insulation between the first metal layer (122) and the second metal layer (123) can be achieved, and at the same time, the binding solder pad (121) located in the binding region (B) of the first metal layer (122) can be protected.

[0097] Alternatively, as illustrated in FIG. 5, the first organic layer (13) is located on one side away from the base (11) of the second metal layer (123), and the portion of the first organic layer (13) located in the binding area (B) covers at least the periphery of the binding solder pad (121). At this time, an insulating layer (14) may be further installed between the first metal layer (122) and the second metal layer (123), that is, between the portion of the first metal layer (122) located in the functional area (A1) and the portion of the second metal layer (123) located in the functional area (A1). The material of the insulating layer (14) may include at least one of an organic material and an inorganic material, and the insulating layer (14) is used to provide insulation between the first metal layer (122) and the second metal layer (123).

[0098] Specifically, when the insulating layer (14) uses an inorganic material, materials such as silicon nitride and silicon oxide may be used. When an organic material is used, an organic adhesive may be used, and specifically, the insulating layer (14) may include an acrylic adhesive layer, a silicone adhesive layer, a polyurethane adhesive layer, a UV-curing adhesive layer, a polyimide adhesive layer, or a photoresist layer.

[0099] In another possible embodiment, as illustrated in FIG. 6, the touch metal layer further includes a second metal layer (123) located on one side facing away from the base (11) of the first metal layer (122), the second metal layer (123) includes a binding solder pad (121) located in a binding area (B), and the first organic layer (13) is located on one side facing away from the base (11) of the second metal layer (123).

[0100] In the above embodiment, the binding solder pad (121) is located on the second metal layer (123), and the second metal layer (123) can also form metal wiring located in the functional area (A1), that is, the metal wiring and the binding solder pad (121) can be formed synchronously, and the first organic layer (13) is located on one side facing away from the base (11) of the second metal layer (123), so that the first organic layer (13) protects and insulates the second metal layer (123) and at the same time also protects the binding solder pad (121) and can improve the side etching problem of the binding solder pad (121).

[0101] In the above embodiment, the first metal layer (122) includes a touch lead wire (1221) located in the binding area (B), and the touch lead wire (1221) is electrically connected to the binding solder pad (121).

[0102] In the above embodiment, an insulating layer (14) may be further installed between the first metal layer (122) and the second metal layer (123), and the material of the insulating layer (14) may include at least one of an organic material and an inorganic material, and the insulating layer (14) is used to provide insulation between the first metal layer (122) and the second metal layer (123), and specifically, the specific components of the above-described embodiment may be referenced.

[0103] In the above embodiment, the metal layer (12) includes a first metal layer (122) and a second metal layer (123), and the metal layer (12) is a touch metal layer, that is, the substrate preform (1) is a touch substrate preform, and the first metal layer (122) and the second metal layer (123) are used as touch wiring layers, for example, the first metal layer (122) is used as a bridge point electrode layer and the second metal layer (123) is used as a touch electrode layer.

[0104] In a possible embodiment, the metal layer (12) is an array metal layer, that is, the substrate preform (1) is an array substrate preform, and the first organic layer (13) is a flattening layer installed on one side away from the base (11) of the array metal layer.

[0105] In the above embodiment, specifically referring to FIG. 7, the array metal layer may include a first conductive layer (124), a second conductive layer (125), a third conductive layer (126), and a fourth conductive layer (127) stacked along a direction away from the base, and may also include a fifth conductive layer (128). The present application is not particularly limited thereto, and only the array metal layer shown in FIG. 7 is described as an example. Here, the first conductive layer (124) is used to form the source-drain region and the channel region of the transistor, and specifically, the first conductive layer (124) may be a semiconductor layer, and the materials of the second conductive layer (125), the third conductive layer (126), the fourth conductive layer (127), and the fifth conductive layer (128) may be metal. For ease of manufacturing, the metal layer (12) may be any one of the second conductive layer (125), the third conductive layer (126), the fourth conductive layer (127), and the fifth conductive layer (128), and preferably, the metal layer (12) may use the fifth conductive layer (128), and the fifth conductive layer (128) includes a binding solder pad (121) located in the binding area (B), that is, when the fifth conductive layer (128) is formed, the binding solder pad (121) located in the binding area (B) is manufactured synchronously.

[0106] Specifically, the fourth conductive layer (127) and the fifth conductive layer (128) include a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer that are laminated. The present application also provides a display module preform (2) comprising any substrate preform (1) provided by the above embodiment, as shown in FIG. 8. The display module preform (2) includes the substrate preform (1) provided by the present application, thereby enabling protection of the binding solder pad (121) through the first organic layer (13), and reducing damage to the binding solder pad (121) caused by a process after the manufacturing process of the substrate preform (1) in the manufacturing process of the display module preform (2), specifically reducing problems such as the binding solder pad (121) being improperly etched on the side due to corrosion of the material inside the binding solder pad (121) by the etching solution of the subsequent process.

[0107] In a possible embodiment, as illustrated in FIG. 8, for example, when the substrate preform (1) is a touch substrate preform, the display module preform (2) further includes an optical improvement layer (22), and the optical improvement layer (22) is located on one side away from the base (11) of the first organic layer (13).

[0108] Specifically, it may include a display area (A2) and a binding area (B) surrounding at least a portion of the display area (A2), and the functional area (A1) and the display area (A2) correspond to each other along a direction perpendicular to the base (11), that is, the orthographic projections of the functional area (A1) and the display area (A2) on the base (11) overlap.

[0109] In the above embodiment, the display module preform (2) further includes a display panel (21), the substrate preform (1) is located on one side of the light-emitting surface of the display panel (21), and the optical improvement layer (22) is located on one side of the substrate preform (1) facing away from the display panel (21) and is used to improve the light emitted from the display panel (21) to enhance the light-emitting effect.

[0110] In a possible embodiment, as shown in FIG. 8, the optical improvement layer (22) includes a second organic layer (221), and the orthographic projection of the second organic layer (221) on the base (11) does not overlap with the orthographic projection of the binding solder pad (121) on the base (11).

[0111] In the above embodiment, the optical improvement layer (22) includes a second organic layer (221), and the second organic layer (221) is located on one side away from the display panel (21) of the optical improvement layer (22) and can serve a protective role.

[0112] Specifically, the orthographic projection of the optical improvement layer (22) on the base (11) does not overlap with the orthographic projection of the binding solder pad (121) on the base (11), so that the optical improvement layer (22) can prevent the binding solder pad (121) from shielding.

[0113] Specifically, the orthographic projection of the second organic layer (221) on the base (11) does not overlap with the orthographic projection of the binding solder pad (121) on the base (11), so that the second organic layer (221) covers the binding area (B), thereby preventing the problem of the film layer on top of the binding solder pad (121) not being easily removed in the same process.

[0114] In the above embodiment, the second organic layer (221) covers the display area (A2), that is, the second organic layer (221) covers the functional area (A1) to protect the functional area (A1), and the second organic layer (221) covers the binding area (B), thereby preventing the problem of the film layer on the upper part of the binding solder pad (121) not being easily removed in the same process.

[0115] In the above embodiment, the second organic layer (221) includes an organic adhesive, and using an organic adhesive in the second organic layer (221) may facilitate subsequent roughening of the second organic layer (221) on one hand, and on the other hand, it may be convenient to remove a portion of the first organic layer (13) located in the binding area (B) during the process of performing roughening treatment on the second organic layer (221).

[0116] Specifically, since the thickness of the second organic layer (221) along the direction perpendicular to the base (11) is greater than the thickness of the first organic layer (13) located in the binding area (B), the second organic layer (221) is still maintained even after a portion of the first organic layer (13) located in the binding area (B) is removed, thereby protecting the lower film layer through the remaining second organic layer (221).

[0117] Specifically, the second organic layer (221) comprises an acrylic adhesive layer, a silicone adhesive layer, a polyurethane adhesive layer, a UV-curing adhesive layer, a polyimide adhesive layer, or a photoresist layer, and the organic adhesive material is easily obtainable and inexpensive, and other organic adhesives may also be used, and the present application is not particularly limited thereto.

[0118] In a desirable solution, the materials of the first organic layer (13) and the second organic layer (221) are the same, and subsequently, the first organic layer (13) and the second organic layer (221) can be processed in the same process.

[0119] In the above embodiment, with reference to FIGS. 8 to 12, the optical improvement layer (22) includes at least one of a color filter layer (222) and a microlens layer (223) to control light emitted from the display panel (21) to achieve a better display effect.

[0120] In the above embodiment, the display panel (21) includes a light-emitting layer, the light-emitting layer includes a plurality of light-emitting units (210), the optical improvement layer (22) includes a color filter layer (222), and the second organic layer (221) is located on one side away from the base (11) of the color filter layer (222). The second organic layer (221) can protect the color filter layer (222).

[0121] Specifically, the light-emitting unit (210) may include a first electrode (211), a light-emitting functional layer (212), and a second electrode (213).

[0122] In a possible embodiment, as shown in FIG. 8, the color filter layer (222) includes a light blocking layer (2221) and a color filter section (2222), the orthographic projection of the color filter section (2222) on the base (11) overlaps at least partially with the orthographic projection of the light-emitting unit (210) on the base (11), and the light blocking layer (2221) is located between the color filter sections (2222).

[0123] In the above embodiment, the color filter unit (2222) may correspond to the color of the light-emitting unit (210), and the color filter unit (2222) may improve the purity of light by filtering the light emitted from the light-emitting unit (210) and reduce the incidence rate of external light entering the display panel (21), thereby reducing the reflectance of the display panel (21) for the light incident on the display panel (21).

[0124] In the above embodiment, the light-blocking layer (2221) can prevent crosstalk and reduce reflection by absorbing external light rays incident into the display module. The light-blocking layer (2221) may use a material capable of absorbing light rays, and specifically, the light-blocking layer (2221) may be black and may include a black coloring agent. The black coloring agent may include a black dye or a black pigment, such as carbon black.

[0125] In another possible embodiment, as illustrated in FIG. 9, the color filter layer (222) comprises a light blocking layer (2221) and a reflection control layer (2223), and the reflection control layer (2223) can selectively absorb light of a specific wavelength band among light reflected from inside the display module or light incident from outside the display module. For example, the reflection control layer (2223) can absorb light of a first wavelength band of about 490 nm to about 505 nm and a second wavelength band of about 585 nm to about 600 nm, thereby reducing the transmittance of light of the first wavelength band and the second wavelength band. The reflection control layer (2223) can absorb light of a wavelength outside the wavelength range of red light, green light, and blue light emitted from the light-emitting unit (210), respectively. The reflection control layer (2223) absorbs light of wavelengths that do not fall within the wavelength range of red, green, and blue light emitted from the display panel (21), thereby improving the problem of reduced brightness of the display module. In addition, it can prevent or minimize the reduction in the luminous efficiency of the display module and improve the visibility of the display module.

[0126] The reflection control layer (2223) may include an organic material layer comprising dyes, pigments and / or any combination thereof. The reflection control layer (2223) may include tetraazaporpyrinyl (TAP) compounds, porphyrinyl compounds, metal porphyrinyl compounds, oxazinyl compounds, squaric acid compounds, triarylmethane compounds, polymethinyl compounds, anthraquinone compounds, phthalocyanine compounds, azo compounds, perylene compounds, xanthenic compounds, diamino compounds, dipyrrolylmethene compounds, cyanine compounds and / or any combination thereof.

[0127] In an embodiment, the reflection control layer (2223) may have a transmittance of about 64% to about 72%. The transmittance of the reflection control layer (2223) can be controlled according to the amount of pigment and / or dye included in the reflection control layer (2223).

[0128] and / or, as illustrated in FIG. 10, the optical improvement layer (22) comprises a microlens layer (223), the microlens layer (223) comprises a first optical functional layer (2231) and a second optical functional layer (2232) installed in a stacked manner, the refractive index of the first optical functional layer (2231) is different from the refractive index of the second optical functional layer (2232), and the second organic layer (221) is located on one side away from the base (11) of the microlens layer (223).

[0129] In the above embodiment, the second optical functional layer (2232) is located on one side away from the display panel (21) of the first optical functional layer (2231), and the refractive index of the second optical functional layer (2232) is smaller than the refractive index of the first optical functional layer (2231). The first optical functional layer (2231) may include a plurality of pattern portions, and the pattern portions are installed facing the light-emitting unit (210). The pattern portions include a middle portion and an edge portion surrounding the middle portion, and the thickness of the edge portion tends to decrease from the middle portion toward the edge portion. Accordingly, when a light ray (an oblique light ray emitted from the light-emitting unit (210)) passes through the first optical functional layer (2231) having a higher refractive index and enters the second optical functional layer (2232), refraction occurs, causing the oblique light ray to be converted into a light ray closer to the frontal view, that is, by achieving the effect of the light ray moving closer to the center and concentrating the light ray, the display brightness of the display module is further improved.

[0130] Specifically, the display module further includes an encapsulation layer located between the optical improvement layer (22) and the display panel (21).

[0131] In the above embodiment, as shown in FIG. 11, the refractive index of the second optical functional layer (2232) is greater than the refractive index of the first optical functional layer (2231), and the first optical functional layer (2231) may include a plurality of pattern portions, and the pattern portions are installed offset from the light-emitting unit (210), that is, the pattern portions are located between adjacent light-emitting units (210), and the pattern portions include a middle portion and an edge portion surrounding the middle portion, and the thickness of the edge portion tends to decrease from the middle portion toward the edge portion. Accordingly, when a light ray (a ray emitted by the upper film layer from an oblique light ray emitted from the light-emitting unit (210)) passes through the second optical functional layer (2232) having a higher refractive index and is incident on the first optical functional layer (2231) having a lower refractive index, total reflection occurs, causing the oblique light ray to be converted into a light ray closer to the frontal view, that is, by achieving the effect of the light ray moving closer to the center and concentrating the light ray, the display brightness of the display module is further improved.

[0132] In a possible embodiment, as illustrated in FIG. 12, the optical improvement layer (22) simultaneously includes a color filter layer (222) and a microlens layer (223), wherein the color filter layer (222) is located on one side facing away from the display panel (21) of the microlens layer (223). A second organic layer (221) is located on one side facing away from the display panel (21) of the optical improvement layer (22) and is used to protect the optical improvement layer (22).

[0133] In a possible embodiment, the substrate preform (1) is an array substrate preform, and the specific structural design may refer to the specific structural design related to the substrate preform (1), and the description is omitted here.

[0134] The present application also provides a display module (6), and as illustrated in FIG. 13, the display module (6) includes a display area (A2) and a binding area (B), and a binding solder pad (121) is installed in the binding area (B), the display module includes a substrate, and the substrate includes a stacked base (11), a metal layer (12), and a third organic layer (31), and the third organic layer (31) covers the display area (A2), and the orthographic projection of the third organic layer (31) on the base (11) does not overlap with the orthographic projection of the binding solder pad (121) on the base (11).

[0135] In the above embodiment, the display area (A2) of the display module (6) corresponds to the functional area (A1) of the substrate.

[0136] In the above embodiment, the substrate comprises a stacked base (11), a metal layer (12), and a third organic layer (31). Specifically, the third organic layer (31) can be obtained by thinning the first organic layer (13), and the portion of the first organic layer (13) located in the binding area (B) is removed to obtain the third organic layer (31) located in the display area (A2), for example, by using an ashing process. That is, the substrate is obtained by processing the substrate preform (1).

[0137] In the above embodiment, the display module (6) may further include an optical improvement layer (22), the optical improvement layer (22) is installed on one side away from the base (11) of the third organic layer (31) and includes a fourth organic layer (220), and the orthographic projection of the fourth organic layer (220) on the base (11) does not overlap with the orthographic projection of the binding solder pad (121) on the base (11).

[0138] The optical improvement layer (22) includes a fourth organic layer (220), and the fourth organic layer (220) can be obtained by thinning the second organic layer (221). For example, if an ashing treatment is used, the surface roughness on one side facing away from the base (11) of the fourth organic layer (220) is further increased, so that the reflectance of the fourth organic layer (220) is lower than the reflectance of the second organic layer (221), thereby improving the visual effect of the display module.

[0139] Specifically, the fourth organic layer (220) covers the display area (A2) and protects the optical improvement layer (22).

[0140] In a possible embodiment, as illustrated in FIG. 13, for example, when the substrate is a touch substrate, the metal layer (12) is a touch metal layer, the touch metal layer includes a first metal layer (122), and a third organic layer (31) is installed on one side away from the base (11) of the first metal layer (122).

[0141] In the above embodiment, the third organic layer (31) can protect a portion of the first metal layer (122) located in the display area (A2), and specifically, the first metal layer (122) may include metal wiring (120) located in the display area (A2), and the third organic layer (31) can protect the metal wiring (120).

[0142] In a possible embodiment, as shown in FIG. 13, the touch metal layer further includes a second metal layer (123) located on one side facing away from the base (11) of the first metal layer (122), and the first metal layer (122) includes a binding solder pad (121) located in a binding area (B).

[0143] In the above embodiment, the metal layer (12) may further include a second metal layer (123), and the second metal layer (123) includes metal wiring (120) located in the display area (A2). When a binding solder pad (121) is formed on the first metal layer (122), the orthographic projection of the second metal layer (123) on the base (11) does not overlap with the orthographic projection of the binding solder pad (121) on the base (11). Specifically, the orthographic projection of the second metal layer (123) on the base (11) may not overlap with the orthographic projection of the binding area (B) on the base (11).

[0144] In the above embodiment, as shown in FIG. 13, the third organic layer (31) may be positioned between the first metal layer (122) and the second metal layer (123) to provide insulation between the first metal layer (122) and the second metal layer (123). At this time, an insulating layer (14) may be installed on one side facing away from the display of the second metal layer (123) to insulate and protect the second metal layer (123), and the material of the insulating layer (14) may include at least one of an inorganic material and an organic material.

[0145] Alternatively, as illustrated in FIG. 14, the third organic layer (31) is located on one side away from the base (11) of the second metal layer (123). At this time, an insulating layer (14) may be further installed between the first metal layer (122) and the second metal layer (123), that is, between the portion of the first metal layer (122) located in the functional area (A1) and the portion of the second metal layer (123) located in the functional area (A1). The material of the insulating layer (14) may include at least one of an organic material and an inorganic material, and the insulating layer (14) is used to provide insulation between the first metal layer (122) and the second metal layer (123).

[0146] In another possible embodiment, as illustrated in FIG. 15, the second metal layer (123) includes a binding solder pad (121) located in the binding area (B), and the third organic layer (31) is located on one side away from the base (11) of the second metal layer (123).

[0147] In the above embodiment, the binding solder pad (121) is located on the second metal layer (123), and the second metal layer (123) can also form a metal wiring (120) located in the display area (A2), and the third organic layer (31) is located on one side away from the base (11) of the metal wiring (120), so that the third organic layer (31) can protect and insulate the metal wiring (120).

[0148] In the above embodiment, the first metal layer (122) includes a touch lead wire (1221) located in the binding area (B), and the touch lead wire (1221) is electrically connected to the binding solder pad (121).

[0149] In a possible embodiment, the binding solder pad (121) comprises at least two layers of metal installed in a stacked manner.

[0150] In the above embodiment, the binding solder pad (121) includes a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer installed in a stacked manner.

[0151] In a possible embodiment, the substrate is an array substrate, the metal layer (12) is an array metal layer, and the third organic layer (31) is a planarization layer. The specific structure of the substrate is omitted here with reference to the previous embodiment.

[0152] In a possible embodiment, as shown in FIGS. 13 to 18, the optical improvement layer (22) includes at least one of a color filter layer (222) and a microlens layer (223), and the display module further includes a display panel (21), and by controlling the light emitted from the display panel (21) through the optical improvement layer (22), a better display effect is achieved.

[0153] In a possible embodiment, the display panel (21) includes a light-emitting layer, the light-emitting layer includes a plurality of light-emitting units (210), the optical improvement layer (22) includes a color filter layer (222), and the second organic layer (221) is located on one side away from the base (11) of the color filter layer (222), and the second organic layer (221) can protect the color filter layer (222).

[0154] In a possible embodiment, as illustrated in FIGS. 13 to 15, the color filter layer (222) comprises a light blocking layer (2221) and a color filter section (2222), the orthographic projection of the color filter section (2222) on the base (11) overlaps at least partially with the orthographic projection of the light-emitting unit (210) on the base (11), and the light blocking layer (2221) is located between the color filter sections (2222).

[0155] In the above embodiment, the color filter unit (2222) may correspond to the color of the light-emitting unit (210), and the color filter unit (2222) may improve the purity of light by filtering the light emitted from the light-emitting unit (210) and reduce the incidence rate of external light entering the display panel (21), thereby reducing the reflectance of the display panel (21) for the light incident on the display panel (21).

[0156] In the above embodiment, the light-blocking layer (2221) can prevent crosstalk and reduce reflection by absorbing external light rays incident into the display module. The light-blocking layer (2221) may use a material capable of absorbing light rays, and specifically, the light-blocking layer (2221) may be black and may include a black coloring agent. The black coloring agent may include a black dye or a black pigment, such as carbon black.

[0157] In another possible embodiment, as illustrated in FIG. 16, the color filter layer (222) comprises a light blocking layer (2221) and a reflection control layer (2223), and the reflection control layer (2223) can selectively absorb light of a specific wavelength band among light reflected from inside the display module or light incident from outside the display module. For example, the reflection control layer (2223) can absorb light of a first wavelength band of about 490 nm to about 505 nm and a second wavelength band of about 585 nm to about 600 nm, thereby reducing the transmittance of light of the first wavelength band and the second wavelength band. The reflection control layer (2223) can absorb light of a wavelength outside the wavelength range of red light, green light, and blue light emitted from the light-emitting unit (210), respectively. The reflection control layer (2223) absorbs light of wavelengths that do not fall within the wavelength range of red, green, and blue light emitted from the display panel (21), thereby improving the problem of reduced brightness of the display module. In addition, it can prevent or minimize the reduction in the luminous efficiency of the display module and improve the visibility of the display module.

[0158] The reflection control layer (2223) may include an organic material layer comprising dyes, pigments and / or any combination thereof. The reflection control layer (2223) may include tetraazaporpyrinyl (TAP) compounds, porphyrinyl compounds, metal porphyrinyl compounds, oxazinyl compounds, squaric acid compounds, triarylmethane compounds, polymethinyl compounds, anthraquinone compounds, phthalocyanine compounds, azo compounds, perylene compounds, xanthenic compounds, diamino compounds, dipyrrolylmethene compounds, cyanine compounds and / or any combination thereof.

[0159] In an embodiment, the reflection control layer (2223) may have a transmittance of about 64% to about 72%. The transmittance of the reflection control layer (2223) can be controlled according to the amount of pigment and / or dye included in the reflection control layer (2223).

[0160] and / or, as illustrated in FIG. 17, the optical improvement layer (22) comprises a microlens layer (223), the microlens layer (223) comprises a first optical functional layer (2231) and a second optical functional layer (2232) installed in a stacked manner, the refractive index of the first optical functional layer (2231) is different from the refractive index of the second optical functional layer (2232), and the second organic layer (221) is located on one side away from the base (11) of the microlens layer (223).

[0161] In the above embodiment, the second optical functional layer (2232) is located on one side facing away from the display panel (21) of the first optical functional layer (2231), and the refractive index of the second optical functional layer (2232) is smaller than the refractive index of the first optical functional layer (2231). The first optical functional layer (2231) may include a plurality of pattern portions, and the pattern portions are installed facing the light-emitting unit (210). The pattern portions include a middle portion and an edge portion surrounding the middle portion, and the thickness of the edge portion tends to decrease from the middle portion toward the edge portion. Accordingly, when a light ray (an oblique light ray emitted from the light-emitting unit (210)) passes through the first optical functional layer (2231) having a higher refractive index and enters the second optical functional layer (2232), refraction occurs, causing the oblique light ray to be converted into a light ray closer to the frontal view. That is, the light ray approaches the center of the light-emitting element, thereby achieving the effect of concentrating the light ray and further improving the display brightness of the display module.

[0162] In the above embodiment, as shown in FIG. 18, the refractive index of the second optical functional layer (2232) is greater than the refractive index of the first optical functional layer (2231), and the first optical functional layer (2231) may include a plurality of pattern portions, and the pattern portions are installed offset from the light-emitting unit (210), that is, the pattern portions are located between adjacent light-emitting units (210), and the pattern portions include a middle portion and an edge portion surrounding the middle portion, and the thickness of the edge portion tends to decrease from the middle portion toward the edge portion. Accordingly, when a light ray (a ray emitted by the upper film layer from an oblique light ray emitted from the light-emitting unit (210)) passes through the second optical functional layer (2232) having a higher refractive index and is incident on the first optical functional layer (2231) having a lower refractive index, total reflection occurs, causing the oblique light ray to be converted into a light ray closer to the frontal view, that is, the light ray moves closer to the center and achieves the effect of concentrating the light ray, thereby improving the display brightness of the display module.

[0163] Specifically, the display module further includes an encapsulation layer (not shown in the drawing), and the encapsulation layer is located between the optical enhancement layer (22) and the display panel (21). Specifically, the encapsulation layer includes one used to encapsulate the display panel (21).

[0164] In a possible embodiment, as illustrated in FIG. 19, the optical improvement layer (22) simultaneously includes a color filter layer (222) and a microlens layer (223), wherein the color filter layer (222) is located on one side facing away from the display panel (21) of the microlens layer (223). A fourth organic layer (220) is located on one side facing away from the display panel (21) of the optical improvement layer (22) and is used to protect the optical improvement layer (22).

[0165] Specifically, the light-blocking layer (2221) within the color filter layer (222) may also be located between a plurality of pattern portions of the first optical functional layer (2231) of the microlens layer (223), and the color filter portion (2222) / reflection control layer (2223) may be installed opposite the pattern portion, and the present application is not particularly limited thereto.

[0166] In a possible embodiment, the third organic layer (31) and the fourth organic layer (220) include an organic adhesive, and the third organic layer (31) and the fourth organic layer (220) can be manufactured using an organic adhesive, so that on one hand, the manufacturing process is easy, and on the other hand, the portion of the first organic layer (13) located in the binding area (B) can be easily removed to form the third organic layer (31) during the process of forming the fourth organic layer (220) by thinning the second organic layer (221), thereby simplifying the manufacturing process.

[0167] In the above embodiment, the third organic layer (31) and the second organic layer (221) comprise an acrylic adhesive layer, a silicone adhesive layer, a polyurethane adhesive layer, a UV-curing adhesive layer, a polyimide adhesive layer, or a photoresist layer. The organic adhesive material is readily available and inexpensive, and other organic adhesives may also be used, and the present application does not particularly limit this.

[0168] In a possible embodiment, as shown in FIG. 19, another film layer is not installed in the same layer as the binding solder pad (121) within the binding area (B) of the display module (6). Since the third organic layer (31) and the fourth organic layer (220) contain an organic adhesive, specifically, the third organic layer (31) and the fourth organic layer (220) can be formed after ashing the first organic layer and the second organic layer, that is, by forming the third organic layer (31) by removing the portion of the first organic layer (13) located in the binding area (B) during the process of forming the fourth organic layer (220) by thinning the second organic layer (221), the manufacturing process can be simplified, and at the same time, by completely removing the portion of the first organic layer (13) located in the binding area (B) so that a film layer is not installed on the side facing away from the base (11) and the periphery side of the same layer as the binding solder pad (121), the binding solder pad (121) is well exposed so that subsequent electrical connection is easy.

[0169] The present application also provides a method for manufacturing a substrate preform (1) comprising a binding region (B) and a functional region (A1), and as illustrated in FIG. 20, the manufacturing method comprises the following steps.

[0170] In step (S200), a base (11) is provided.

[0171] In step (S400), a metal layer (12) is formed on one side of the base (11), comprising a metal wiring (120) located in a functional area (A1) and a binding solder pad (121) located in a binding area (B).

[0172] In step (S600), a metal wiring (120) is covered on one side facing away from the base (11) of the metal layer, and a first organic layer (13) is formed covering at least the side wall of the binding solder pad (121).

[0173] In the above manufacturing method, by forming a first organic layer (13) to protect the metal wiring (120) and the binding solder pad (121), the material inside the binding solder pad (121) can be protected and damage caused by subsequent processes can be improved. Specifically, damage to the binding solder pad (121) caused by subsequent processes may include the problem of the binding solder pad (121) being improperly etched on the side by the etching solution of the subsequent process, which corrodes the material inside the binding solder pad (121).

[0174] In step (S600), a first organic layer (13) covering a functional area (A1) and a binding area (B) is formed on one side facing away from the base (11) of the metal layer, that is, the first organic layer (13) can more completely cover the binding solder pad (121), thereby further enhancing the protective effect of the binding solder pad (121).

[0175] In the above embodiment, the thickness of the first organic layer (13) located in the functional area (A1) is greater than or equal to the thickness of the first organic layer (13) located in the binding area (B), so the first organic layer (13) is advantageous for protecting the binding solder pad (121) during the subsequent manufacturing process. Additionally, by installing the portion of the first organic layer (13) located in the binding area (B) thinner, the process of removing the portion of the first organic layer (13) located in the binding area (B) can be reduced by simultaneously performing thinning treatment of another film layer during the subsequent manufacturing process, thereby simplifying the process and reducing costs.

[0176] In the above embodiment, the first organic layer (13) comprises an acrylic adhesive layer, a silicone adhesive layer, a polyurethane adhesive layer, a UV-curing adhesive layer, a polyimide adhesive layer, or a photoresist layer, which is advantageous for synchronously removing a portion of the first organic layer (13) located in the binding area (B) during a subsequent thinning process, and at the same time, the organic adhesive material is easily obtainable and inexpensive, and other organic adhesives may also be used, and the present application does not particularly limit thereto.

[0177] In the above embodiment, a specific method for installing the first organic layer (13) such that the thickness of the first organic layer (13) located in the functional area (A1) is greater than the thickness of the first organic layer (13) located in the binding area (B) includes the following steps.

[0178] In step (S601), as shown in FIG. 21, a mask plate (5) is installed on one side facing away from the display panel (21) of the first organic layer (13), and the mask plate (5) includes a non-transparent area (51) and a semi-transparent area (52), and the non-transparent area (51) is installed so as to correspond to the functional area (A1), and the semi-transparent area (52) is installed so as to correspond to the binding area (B).

[0179] In step (S602), light irradiation is performed on the first organic layer (13) from one side away from the first organic layer (13) of the mask plate (5).

[0180] In step (S603), the area of ​​the substrate preform (1) corresponding to the semi-transparent region is developed with a developer solution such that the thickness of the first organic layer (13) located in the functional region (A1) is greater than the thickness of the first organic layer (13) located in the binding region (B).

[0181] Referring to FIG. 13, thinning is performed on a portion of the first organic layer (13) located in the binding region (B) through exposure and development so that the thickness of the first organic layer (13) located in the functional region (A1) is greater than the thickness of the first organic layer (13) located in the binding region (B).

[0182] Specifically, the material of the first organic layer (13) is an organic adhesive, and thinning can be performed through exposure and development processes. The mask plate (5) is installed on one side facing away from the display panel (21) of the first organic layer (13) so that exposure can be performed only in a partial area. Specifically, the semi-transparent area (52) of the mask plate (5) is exposed so as to face the binding area (B), thereby facilitating subsequent thinning of the portion of the first organic layer (13) located in the binding area (B).

[0183] Specifically, the semi-transparent region (52) includes a light-blocking film layer, and the material of the light-blocking film layer may include chromium oxide, and the material of the non-transparent region (51) may include chromium.

[0184] Alternatively, as illustrated in FIG. 23, the semi-transparent region (52) includes a plurality of rod-shaped through holes (521) penetrating the thickness direction of the mask, and the spacing between adjacent rod-shaped through holes (521) is 1 μm to 2 μm, for example, 1 μm, 1.2 μm, 1.4 μm, 1.5 μm, 1.8 μm, 2 μm, etc. Specifically, the rod-shaped through holes (521) may be rectangular rod-shaped through holes (521). Due to the slit diffraction effect, the exposure intensity at the slit is weakened. In this case, the portion of the first organic layer (13) located in the binding area (B) faces the semi-transparent area (52) and is partially exposed. Since the rod-shaped through-hole (521) is relatively small and the exposure energy is relatively weak, the depth of exposure of the first organic layer (13) is different. Subsequently, when developed with a developer, the exposed portion of the first organic layer (13) is removed, thereby lowering the height of the first organic layer (13). In this embodiment, the cost of the mask plate (5) is low, which can reduce the manufacturing cost of the display module.

[0185] In another possible embodiment, the thickness of the first organic layer (13) located in the functional area (A1) is equal to the thickness of the portion located in the binding area (B), so the manufacturing process of the first organic layer (13) can be simplified.

[0186] The present application also provides a method for manufacturing a display module as illustrated in FIG. 24, comprising the following steps.

[0187] In step (S100), a substrate preform (1) is provided.

[0188] The above substrate preform (1) may use any one of the above embodiments of the substrate preform (1), or may use a substrate preform (1) manufactured by the manufacturing method of any of the above substrate preforms (1).

[0189] The step of forming a substrate preform (1) specifically includes: a step of providing a base (11) (S200); a step of forming a metal layer (12) comprising a metal wiring (120) located in a functional area (A1) on one side of the base (11) and a binding solder pad (121) located in a binding area (B) (S400); and a step of forming a first organic layer (13) covering the metal wiring (120) on one side facing away from the base (11) of the metal layer and covering at least the side wall of the binding solder pad (121) (S600).

[0190] In step (S800), an optical improvement layer (22) is formed on one side away from the base (11) of the first organic layer (13).

[0191] In the above manufacturing method, by forming a first organic layer (13) to protect the metal wiring (120) and the binding solder pad (121), the material inside the binding solder pad (121) can be protected and damage caused by subsequent processes can be improved. Specifically, damage to the binding solder pad (121) caused by subsequent processes may include the problem of the binding solder pad (121) being improperly etched on the side by the etching solution of the subsequent process, which corrodes the material inside the binding solder pad (121). Additionally, the first organic layer (13) can cover the binding solder pad (121) more completely, thereby further improving the protective effect of the binding solder pad (121).

[0192] In step (S800), the step of forming an optical improvement layer (22) on one side away from the base (11) of the first organic layer (13) includes the following steps.

[0193] In step (S801), a second organic layer (221) is formed on one side facing away from the base (11) of the first organic layer (13), and the orthographic projection of the second organic layer (221) on the base (11) does not overlap with the orthographic projection of the binding solder pad (121) on the base (11).

[0194] Here, the second organic layer (221) is used to protect the optical improvement layer (22), and since the optical improvement layer (22) is located in the functional area (A1), it is possible to prevent the second organic layer (221) from being located in the display area (A2) and shielding the binding solder pad (121) of the binding area (B).

[0195] In step (S802), a thinning treatment is performed on the first organic layer (13) located in the second organic layer (221) and the binding area (B) so that the second organic layer (221) is thinned to form a fourth organic layer (220), and the portion of the first organic layer (13) located in the binding area (B) is removed to form a third organic layer (31) so that the third organic layer (31) covers the functional area (A1).

[0196] Specifically, since the materials of the second organic layer (221) and the first organic layer (13) may be the same, they can be manufactured using the same manufacturing process, thereby simplifying the types of manufacturing processes for the display module and simplifying the manufacturing process.

[0197] In the above embodiment, the second organic layer (221) and the first organic layer (13) can be simultaneously thinned using an ashing process, thereby reducing the process of removing the portion of the first organic layer (13) located in the binding area (B) to expose the binding solder pad (121), which can simplify the manufacturing process. At the same time, due to the ashing process, the surface roughness on one side facing away from the base (11) of the formed fourth organic layer (220) is further increased, so that the reflectance of the fourth organic layer (220) is lower than that of the second organic layer (221), thereby improving the visual effect of the display module.

[0198] Specifically, in the above embodiment, the thickness of the first organic layer (13) located in the functional area (A1) is greater than or equal to the thickness of the first organic layer (13) located in the binding area (B). When the thickness of the first organic layer (13) located in the functional area (A1) is greater than the thickness of the first organic layer (13) located in the binding area (B), that is, when the thickness of the portion of the first organic layer (13) located in the binding area (B) is thinner, during the process of synchronously ashing the portion of the first organic layer (13) located in the binding area (B) and the second organic layer (221), the portion of the first organic layer (13) located in the binding area (B) can be effectively removed to expose the binding solder pad (121), and at the same time, the second organic layer (221) can be prevented from being excessively thinned and losing its protective effect. When the thickness of the first organic layer (13) located in the functional area (A1) is the same as the thickness of the first organic layer (13) located in the binding area (B), the thickness of the second organic layer (221) is increased to remove the portion of the first organic layer (13) located in the binding area (B) and expose the solder pad, thereby preventing the second organic layer (221) from being excessively thinned and losing its protective effect.

[0199] The present application also provides a display device (4), as illustrated in FIG. 25, the display device (4) includes a display module (6) provided by the above embodiment of the present application, or a display module (6) manufactured and formed by the manufacturing method provided by the above embodiment of the present application.

[0200] Since the display device (4) provided by the present application includes a display module (6) provided by the above embodiment or a display module (6) manufactured and formed by the manufacturing method provided by the above embodiment of the present application, the display device (4) provided by the present application has the beneficial effects of any display module (6) provided by the above embodiment, and a description thereof is omitted.

[0201] In an embodiment of the present application, the display device (4) includes, but is not limited to, devices having a display function such as a mobile phone, a personal digital assistant (PDA), a tablet computer, an e-book, a television, an access control, a smart wired telephone, a console, etc.

[0202] According to the above embodiments of this application, these embodiments are not described in detail, nor are the invention limited to specific embodiments. It is evident that many modifications and variations can be made based on the description above. This specification selects and describes these embodiments in detail to better explain the principles and practical applications of this application, so that those skilled in the art may make good use of this application and modify and use it based on this application. This application is limited only by the claims, the entire scope thereof, and equivalents. Explanation of the symbols

[0203] 1-Substrate preform, A1-Functional area, B-Binding area, 11-Base, 12-Metal layer, 120-Metal wiring, 121-Binding solder pad, 122-First metal layer, 1221-Touch lead wire, 123-Second metal layer, 124-First conductive layer, 125-Second conductive layer, 126-Third conductive layer, 127-Fourth conductive layer, 128-Fifth conductive layer, 13-First organic layer, 14-Insulating layer, 2-Display module preform, 21-Display panel, 210-Light-emitting unit, 211-First electrode, 212-Light-emitting functional layer, 213-Second electrode, 22-Optical enhancement layer, 221-Second organic layer, 222-Color filter layer, 2221-Light blocking layer, 2222-Color filter section, 223-Microlens layer, 2231-First optical functional layer, 2232-Second optical functional layer, A2-Display area, 3-Touch panel, 31-Third organic layer, 220-Fourth organic layer, 4-Display device, 5-Mask plate, 51-Non-transparent area, 52-Semi-transparent area, 521-Rod-shaped through-hole, 6-Display module.

Claims

Claim 1 A display module preform comprising a substrate preform, wherein the substrate preform comprises a functional area and a binding area, and the substrate preform comprises a base, a metal layer located on one side of the base and including metal wiring located in the functional area and binding solder pads located in the binding area, a first organic layer located on one side of the metal layer facing away from the base and covering the metal wiring and at least covering the sidewalls of the binding solder pads, and the display module preform further comprises an optical improvement layer located on one side of the first organic layer facing away from the base, wherein the optical improvement layer comprises a second organic layer, wherein the second organic layer covers the functional area, and the second organic layer comprises an organic adhesive, and the material of the second organic layer is the same as the material of the first organic layer. Claim 2 In claim 1, the first organic layer is a display module preform covering the metal wiring and the binding solder pad. Claim 3 A display module preform according to claim 1, wherein the first organic layer covers the functional area and the binding area, and the thickness of the first organic layer located in the functional area is greater than or equal to the thickness of the first organic layer located in the binding area. Claim 4 A display module preform according to claim 1, wherein the metal layer is a touch metal layer, the touch metal layer includes a first metal layer, the first organic layer is installed on one side away from the base of the first metal layer, the touch metal layer further includes a second metal layer located on one side facing away from the base of the first metal layer, the first metal layer or the second metal layer includes a binding solder pad located in the binding area, and the first organic layer is located between the first metal layer and the second metal layer, or the first organic layer is located on one side away from the base of the second metal layer. Claim 5 A display module preform according to claim 4, wherein the first metal layer includes a touch lead located in the binding region, the touch lead is electrically connected to the binding solder pad, the metal layer is an array metal layer, and the first organic layer is a planarization layer. Claim 6 A display module preform according to claim 1, wherein the orthographic projection of the second organic layer on the base does not overlap with the orthographic projection of the binding solder pad on the base. Claim 7 In claim 6, the display module preform further comprises a light-emitting layer, the light-emitting layer comprises a plurality of light-emitting units, the optical improvement layer comprises at least one of a color filter layer and a microlens layer, the second organic layer is located on one side away from the base of the color filter layer, the color filter layer comprises a light-blocking layer and a color filter portion, the orthographic projection of the color filter portion on the base overlaps at least partially with the orthographic projection of the light-emitting unit on the base, and the light-blocking layer is located between the color filter portions. Claim 8 In claim 6, the optical improvement layer comprises a microlens layer, the microlens layer comprises a first optical functional layer and a second optical functional layer installed in a stacked manner, the refractive index of the first optical functional layer is different from the refractive index of the second optical functional layer, and the second organic layer is located on one side away from the base of the microlens layer, thereby forming a display module preform. Claim 9 A display module comprising a display area and a binding area, wherein the display module comprises a substrate, the substrate comprises a stacked base, a metal layer, a first organic layer and a third organic layer, wherein the metal layer has a binding solder pad installed in the binding area, the first organic layer covers at least the sidewall of the binding solder pad, the third organic layer covers the display area, the orthographic projection of the third organic layer on the base does not overlap with the orthographic projection of the binding solder pad on the base, the third organic layer comprises an organic adhesive, and the material of the third organic layer is the same as the material of the first organic layer. Claim 10 In claim 9, the substrate is a touch substrate, the metal layer is a touch metal layer, the touch metal layer includes a first metal layer, and the third organic layer is installed on one side away from the base of the first metal layer in a display module. Claim 11 In claim 10, the touch metal layer further comprises a second metal layer located on one side facing away from the base of the first metal layer, and the first metal layer or the second metal layer comprises a binding solder pad located in the binding area, and the third organic layer is located between the first metal layer and the second metal layer, or the third organic layer is located on one side facing away from the base of the second metal layer, thereby forming a display module. Claim 12 In claim 11, the first metal layer includes a touch lead located in the binding region, the touch lead is electrically connected to the binding solder pad, the substrate is an array substrate, the metal layer is an array metal layer, the third organic layer is a planarization layer, the binding solder pad includes at least two layers of metal layers stacked thereon, and the binding solder pad includes a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer stacked thereon, a display module. Claim 13 A method for manufacturing a display module preform including a substrate preform, wherein the substrate preform includes a binding region and a functional region, and the method for manufacturing the substrate preform includes the steps of providing a base, forming a metal layer on one side of the base including metal wiring located in the functional region and binding solder pads located in the binding region, and forming a first organic layer on one side of the metal layer facing away from the base, covering the metal wiring and at least covering the sidewall of the binding solder pads, and further including the step of forming an optical improvement layer on one side of the first organic layer facing away from the base - wherein the optical improvement layer includes a second organic layer formed on one side facing away from the base of the first organic layer, and the orthographic projection of the second organic layer on the base does not overlap with the orthographic projection of the binding solder pad on the base, and the second organic layer covers the functional region, and the second organic layer includes an organic adhesive, and the material of the second organic layer is the same as the material of the first organic layer. Claim 14 A method for manufacturing a display module preform according to claim 13, comprising the step of forming a first organic layer covering the functional area and the binding area on one side facing away from the base of the metal layer, wherein the step of forming the first organic layer covering the functional area and the binding area on one side facing away from the base of the metal layer comprises the step of making the thickness of the first organic layer formed in the functional area greater than or equal to the thickness of the first organic layer formed in the binding area. Claim 15 In claim 14, the step of making the thickness of the first organic layer formed in the functional area greater than the thickness of the first organic layer formed in the binding area comprises: a step of installing a mask plate on one side facing away from the display panel of the first organic layer - wherein the mask plate includes a non-transparent area and a semi-transparent area, and is installed such that the non-transparent area corresponds to the functional area and the semi-transparent area corresponds to the binding area -, a step of performing light irradiation on one side of the mask plate away from the first organic layer, and a step of developing an area of ​​the substrate preform corresponding to the semi-transparent area with a developer solution such that the thickness of the first organic layer located in the functional area is greater than the thickness of the first organic layer located in the binding area. Claim 16 A method for manufacturing a display module comprising: providing a substrate preform according to claim 13; forming an optical improvement layer on one side of the first organic layer away from the base, wherein the optical improvement layer includes a second organic layer formed on one side facing away from the base of the first organic layer, and the orthographic projection of the second organic layer on the base does not overlap with the orthographic projection of the binding solder pad on the base; performing a thinning treatment on the second organic layer and the first organic layer located in the binding area so that the second organic layer is thinned to form a fourth organic layer; and removing the portion of the first organic layer located in the binding area to form a third organic layer so that the third organic layer covers the functional area. Claim 17 A method for manufacturing a display module according to claim 16, wherein the step of forming a second organic layer on one side facing away from the base of the first organic layer comprises the step of causing the second organic layer to cover the functional area, and the step of performing a thinning treatment on the second organic layer and the first organic layer located in the binding area comprises the step of performing an ashing treatment on the second organic layer and the first organic layer located in the binding area. Claim 18 delete Claim 19 delete

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