Cooling unit, objective lens module, and semiconductor inspection device

Abstract

The cooling unit is equipped with a jacket, and the jacket has a central portion and an outer portion. An opening is formed in the central portion through which light from a semiconductor device passes. The outer portion has a contact portion that contacts a stage on which the semiconductor device is placed. A supply channel is formed in the jacket through which a cooling fluid for cooling the semiconductor device flows. Between the central portion and the outer portion of the jacket, a groove is formed configured to allow the cooling fluid to flow down from the upper surface of the central portion. A discharge channel through which the cooling fluid discharged to the outside flows is connected to the groove.

Description

Technology Field

[0001] The present disclosure relates to a cooling unit, an objective lens module, and a semiconductor inspection device. Background Technology

[0002] Patent documents 1 to 4 describe a cooling unit used in the inspection of a semiconductor device. Such a cooling unit is used to observe a semiconductor device while it is in operation. In the cooling units described in patent documents 1 to 3, the semiconductor device is cooled by spraying a cooling liquid onto the semiconductor device. In the cooling unit described in patent document 4, the cooling unit is arranged so that a space is formed between the cooling unit and the semiconductor device, and the semiconductor device is cooled by flowing a cooling fluid into the space from a supply channel provided in the cooling unit. Prior art literature

[0003] U.S. Patent No. 6621275, Japanese Patent Publication No. 2006-519359, U.S. Patent Publication No. 2009-0095097, Japanese Patent Publication No. 2020-106361 The problem to be solved

[0004] In the cooling unit described in Patent Document 4, an elastic member is disposed on the periphery edge portion of the cooling unit, and the outer edge portion of the space described above is sealed by the elastic member contacting a stage on which a semiconductor device is disposed. Such a cooling unit is required to improve waterproof performance and suppress leakage of cooling fluid from the outer edge portion of the space.

[0005] Therefore, one aspect of the present disclosure aims to provide a cooling unit, an objective lens module, and a semiconductor inspection device capable of improving waterproof performance. means of solving the problem

[0006] A cooling unit according to one aspect of the present disclosure is a cooling unit used in the inspection of a semiconductor device, and comprises a jacket for dissipating heat from the semiconductor device, wherein the jacket has a central portion and an outer portion located around the central portion, wherein an opening is formed in the central portion through which light from the semiconductor device passes, and the outer portion has a contact portion that contacts a stage on which the semiconductor device is placed, wherein a supply channel is formed in the jacket through which a cooling fluid for cooling the semiconductor device flows, and between the central portion and the outer portion of the jacket, a groove is formed configured to allow the cooling fluid to flow down from the upper surface of the central portion, and a discharge channel through which the cooling fluid discharged to the outside flows is connected to the groove.

[0007] In this cooling unit, a groove is formed between the central part and the outer part of the jacket, configured to allow cooling fluid to flow down from the upper surface of the central part, and a discharge channel through which cooling fluid discharged to the outside flows is connected to the groove. By this, when cooling a semiconductor device by flowing cooling fluid from a supply channel into the space formed by the contact part of the outer part contacting the stage, the cooling fluid can be prevented from reaching the outer edge of the space. As a result, leakage of cooling fluid from the outer edge of the space can be prevented, and waterproof performance can be improved.

[0008] Between the central part and the outer part of the jacket, a bridge portion connecting the central part and the outer part is formed, and the supply flow path may be formed to pass through the bridge portion. In this case, the supply flow path can be appropriately formed.

[0009] A bridge portion is formed between the central portion and the outer portion of the jacket to connect the central portion and the outer portion, and the surface connected to the upper surface of the central portion in the bridge portion may have a portion located at a lower position than the upper surface of the central portion. In this case, by having the surface connected to the upper surface of the central portion in the bridge portion located at a lower position than the upper surface of the central portion, it is possible to prevent the cooling fluid from reaching the outer edge of the space along the surface from the upper surface of the central portion.

[0010] The groove portion comprises a first portion and a second portion located on the side opposite to the upper surface of the central portion in a direction perpendicular to the upper surface of the central portion, and the second portion is formed narrower than the first portion, and a discharge channel may be connected to the second portion. In this case, the first portion located on the upper surface side of the central portion can be formed wide to increase the opening area of ​​the groove portion, making it easier for cooling fluid to flow into the groove portion. Additionally, by forming the second portion located on the side opposite to the upper surface of the central portion narrowly, cooling fluid can be easily retained in the second portion, and as a result, cooling fluid can be efficiently discharged from the discharge channel connected to the second portion.

[0011] If the side where the central part is located is made inner with respect to the outer part, the side where the outer part is located is made outer with respect to the central part, and the side where the groove is located is made lower with respect to the upper surface of the central part, the inner surface of the outer side of the groove may include an inclined surface that slopes inward as it moves downward. In this case, the volume of the groove can be increased, and the cooling fluid flowing into the groove can be appropriately allowed to flow downward.

[0012] The groove may have a ring-shaped portion that surrounds the upper surface when viewed from a direction perpendicular to the upper surface of the central portion. In this case, cooling fluid can be efficiently stored in the groove, and the stored cooling fluid can be efficiently discharged to the outside.

[0013] In the jacket, a ventilation path is formed to connect the space to the outside of the jacket so that air can flow between the space formed by the outer contact portion contacting the stage and the outside of the jacket, and the ventilation path may be connected to the groove portion. In this case, it is possible to suppress the pressure within the space from becoming negative pressure. Therefore, when moving the cooling unit along the stage where the semiconductor device is placed while the cooling fluid is flowing, it is possible to avoid situations where the cooling unit sticks to the stage due to negative pressure, making it impossible to move the cooling unit or causing a decrease in movement precision. As a result, it becomes possible to move the cooling unit with high precision while the cooling fluid is flowing.

[0014] An objective lens module according to one aspect of the present disclosure comprises the cooling unit, an immersion lens disposed in an aperture, and an objective lens facing the immersion lens. According to this objective lens module, waterproof performance can be improved for the reasons described above.

[0015] A semiconductor inspection device according to one aspect of the present disclosure comprises the cooling unit, an immersion lens disposed in an aperture, a stage on which a semiconductor device is disposed, an objective lens facing the immersion lens, and a photodetector that detects light from the semiconductor device through the immersion lens and the objective lens. According to this semiconductor inspection device, waterproof performance can be improved for the reasons described above. Effects of the invention

[0016] According to one aspect of the present disclosure, it is possible to provide a cooling unit, an objective lens module, and a semiconductor inspection device capable of improving waterproof performance. Brief explanation of the drawing

[0017] Figure 1 is a configuration diagram of a semiconductor inspection device according to an embodiment. Figure 2 is a cross-sectional view of the periphery of the objective lens module. Figure 3 is a plan view of the objective lens module. Figure 4 is a cross-sectional view of a cooling unit along line IV-IV of Figure 3, and is a partial enlarged view of Figure 2. Figure 5 is a cross-sectional view of a cooling unit along the VV line of Figure 3. Figure 6 is a partial enlarged view of Figure 5. Figure 7 is a cross-sectional view of a cooling unit along line VII-VII of Figure 3. Figure 8 is a partial enlarged view of Figure 7. Figure 9 is a perspective view of the objective lens module. FIG. 10 is an exploded perspective view of a ventilation member. Figures 11 (a) and (b) are drawings for explaining the operation of an objective lens module according to an embodiment. Figures 12 (a) and (b) are drawings for explaining the operation of an objective lens module according to an embodiment. Figures 13 (a) and (b) are drawings for explaining the operation of an objective lens module according to a first modified example. Figures 14 (a) and (b) are drawings for explaining the operation of an objective lens module according to a first modified example. FIG. 15 is a plan view of an objective lens module according to a second modified example. Specific details for implementing the invention

[0018] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the following description, the same or equivalent elements are denoted by the same reference numerals, and redundant descriptions are omitted.

[0019] [Semiconductor Inspection Device]

[0020] The semiconductor inspection device (1) shown in FIG. 1 is a device for observing and inspecting a semiconductor device (2) which is a device under test (DUT). The semiconductor inspection device (1) is used, for example, to identify a fault location in the semiconductor device (2).

[0021] The semiconductor device (2) is, for example, a device including a logic LSI (Large Scale Integration). The logic LSI is composed of transistors with a Metal-Oxide-Semiconductor (MOS) structure, transistors with a bipolar structure, etc. The power consumption of the semiconductor device (2) is, for example, about 200W. The semiconductor device (2) is placed (fixed) on the stage (3).

[0022] A semiconductor testing device (1) is equipped with a signal input device (11), a light source (12), an optical system (13), a light detector (14), and a control unit (15). The signal input device (11) is electrically connected to a semiconductor device (2) and drives the semiconductor device (2) by inputting a signal to the semiconductor device (2). The signal input device (11) is, for example, a pulse generator that applies a stimulus signal to the semiconductor device (2), or a tester unit that inputs a test signal to the semiconductor device (2). The signal input device (11) repeatedly inputs a signal, such as a predetermined test pattern, to the semiconductor device (2). The signal input by the signal input device (11) may be a modulated voltage signal or a DC voltage signal.

[0023] The light source (12) outputs light that illuminates the semiconductor device (2). The light source (12) is, for example, an LED (Light Emitting Diode), an LD (Laser Diode), an SLD (Super Luminescent Diode), or a lamp light source. The wavelength of the light output from the light source (12) may be, for example, 1064 nm or greater. The light output from the light source (12) is guided to an optical system (13).

[0024] The optical system (13) guides light output from the light source (12) to the surface (2a) of the semiconductor device (2), and also guides light from the surface (2a) of the semiconductor device (2) to the light detector (14). The optical system (13) is configured to include, for example, an objective lens (16), a light scanner (not shown), and a beam splitter (not shown). The objective lens (16) collects light output from the light source (12) and guided by the beam splitter and the light scanner into an observation area or scans it from the observation area. The optical system (13) is mounted on, for example, an XYZ stage (not shown). The XYZ stage is configured to be movable in the Z direction, and in the X and Y directions orthogonal to the Z direction, if the direction parallel to the optical axis of the objective lens (16) is defined as the Z direction. The observation area is determined by the position of the XYZ stage.

[0025] Light output from the light source (12) and emitted from the optical system (13) is reflected by the semiconductor device (2) in operation and passes through the optical system (13) to the light detector (14). At this time, the intensity of the light reflected by the semiconductor device (2) is modulated according to the operating state of the semiconductor device (2).

[0026] The photodetector (14) detects modulated light from the semiconductor device (2) and outputs waveform data. The photodetector (14) may also detect incident light while light is being scanned onto the semiconductor device (2) by a light scanner and output a measurement image. Based on this waveform data or measurement image, the location of the fault in the semiconductor device (2) can be identified.

[0027] The light detector (14) may detect incident light while light is being scanned on the semiconductor device (2) and output a pattern image. The pattern image is an image captured so that the circuit pattern of the semiconductor device (2) can be verified. As the light detector (14), for example, a photodiode, an APD (Avalanche Photodiode), a SiPM (Silicon Photomultiplier), etc., capable of detecting light of a wavelength that passes through the substrate of the semiconductor device (2) can be used.

[0028] The control unit (15) is electrically connected to the signal input device (11), light source (12), optical system (13), and photodetector (14), and performs control of the entire semiconductor inspection device (1). The control unit (15) is configured by a computer including, for example, a processor (CPU: Central Processing Unit) and a storage medium such as RAM (Random Access Memory), ROM (Read Only Memory), and HDD (Hard Disk Drive). The control unit (15) performs processing by the processor on data stored in the storage medium. The control unit (15) performs specific processing of the fault location in the semiconductor device (2) based on, for example, the detection result of the photodetector (14).

[0029] [Configuration for Cooling Semiconductor Devices]

[0030] The semiconductor inspection device (1) further comprises a cooling unit (21), a storage tank (22), four regulators (pressure adjustment units) (23), a drain tank (24), and a chiller (25). The cooling unit (21), storage tank (22), regulators (23), drain tank (24), and chiller (25) are used to cool the semiconductor device (2) during inspection. The cooling unit (21) is combined with an objective lens (16) to form an objective lens module (70).

[0031] [Cooling Unit]

[0032] Referring to FIGS. 2 to 10, a cooling unit (21) is described. The cooling unit (21) is positioned to face the semiconductor device (2) and defines a space (gap) (S1) between it and the semiconductor device (2). In the semiconductor inspection device (1), the semiconductor device (2) is cooled by flowing a cooling fluid (5) through the space (S1). The cooling fluid (5) is, for example, water or pure water, but may also be an electrically insulating liquid of the Fluorinert (registered trademark) type.

[0033] A cooling unit (21) is positioned to contact a stage (3) on which a semiconductor device (2) is placed (mounted on the stage (3)). In this example, the stage (3) is provided with a DUT board (3a) and a holding portion (3b). The DUT board (3a) is formed, for example, in a plate shape and forms a connection portion between a signal input device (11) and a semiconductor device (2). A socket forming a connection portion between a signal input device (11) and a semiconductor device (2) may be fitted into the DUT board (3a). In this example, the semiconductor device (2) has a package (2b) and a die (2c) protruding from the package (2b). As an example, the package (2b) is a PC board, and the die (2c) is a semiconductor portion mounted (bonded) on the package (2b).

[0034] The holding portion (3b) is fixed to the DUT board (3a) and holds the semiconductor device (2). The holding portion (3b) is formed in a plate shape, for example, by metal. The holding portion (3b) is provided with an opening (3c) into which the semiconductor device (2) is placed. The holding portion (3b) has a catch portion (3d) that contacts the periphery edge of the package of the semiconductor device (2) to prevent the semiconductor device (2) from falling out of the opening (3c) and catches on the semiconductor device (2).

[0035] The cooling unit (21) is equipped with a jacket (31) for dissipating heat from the semiconductor device (2). The jacket (31) is formed in a roughly cylindrical shape with a bottom made of, for example, a metal material. The jacket (31) is positioned to face the semiconductor device (2) and the holding part (3b). The objective lens (16) described above is positioned within this jacket (31).

[0036] Hereinafter, the direction parallel to the optical axis (L) of the objective lens (16) is described as direction D1. Direction D1 is a direction parallel to the Z direction described above. In addition, when the semiconductor device (2) placed on the stage (3) and the objective lens (16) are facing each other, the side where the objective lens (16) is located relative to the semiconductor device (2) is designated as the lower side, and the side where the semiconductor device (2) is located relative to the objective lens (16) is designated as the upper side. The cooling unit (21) is used when the semiconductor device (2) is located on the upper side in the vertical direction relative to the objective lens (16).

[0037] The jacket (31) has a central part (32), an outer part (33), and an intermediate part (34) when viewed from direction D1. Below, the arrangement and shape of each part when viewed from direction D1 will be described. The central part (32) is a part that includes the center of the jacket (31), and in this example, it is a circular part. The outer part (33) is a part located around the central part (32) and surrounds the central part (32). In this example, the outer part (33) is a toroidal part that constitutes the outer edge (periphery) of the jacket (31). The intermediate part (34) is a part located between the central part (32) and the outer part (33). The intermediate part (34) is positioned on the inner side of the outer part (33) and surrounds the central part (32). In this example, the intermediate part (34) is a toroidal part. Hereinafter, regarding the outer part (33), the side where the central part (32) is located is described as the inner side (inner side in the diameter direction), and regarding the central part (32), the side where the outer part (33) is located is described as the outer side (outer side in the diameter direction).

[0038] As described above, the jacket (31) is formed in a roughly cylindrical shape with a bottom, and is generally composed of a first member (M1) that forms a portion including the upper bottom, a second member (M2) that forms a cylindrical portion, and a third member (M3) that forms a portion including the lower bottom. The jacket (31) is formed by connecting the first member (M1) and the second member (M2) to each other, and by connecting the second member (M2) and the third member (M3) to each other. The central portion (32) is formed by the first member (M1), and the outer portion (33) and the middle portion (34) are each formed by the first member (M1) and the second member (M2), respectively. The central portion (32) is formed in a roughly circular shape, and the outer portion (33) and the middle portion (34) are formed in a roughly toroidal shape (cylindrical shape) with a thickness greater than that of the central portion (32).

[0039] In the central portion (32), an opening (35) is formed that penetrates the central portion (32) along direction D1. When viewed from direction D1, the opening (35) has a roughly circular shape, for example. The opening (35) is located on the optical axis (L), and light from the semiconductor device (2) passes through the opening (35). An immersion lens (72) into which light from the semiconductor device (2) is incident is disposed in the opening (35). Details of the immersion lens (72) will be described later.

[0040] As shown in FIGS. 3 and 4, a flexible member (45) and a fixed member (37, 38) are further disposed in the opening (35). The flexible member (45) is formed by a resin such as silicone (e.g., silicone rubber) and has a shape in which a flat member is partially bent into a bellows shape. The flexible member (45) has an opening in its center, and a fixing lens (72) is disposed in the opening. The flexible member (45) contacts the periphery of the fixing lens (72) at the edge of the opening, thereby sealing the space between the fixing lens (72) and the flexible member (45) watertightly. The flexible member (45) is fixed to the center (32) by the fixed member (37, 38). The fixed member (37) is formed in the shape of a toroidal plate and is fixed to the flexible member (45) by a fastening member (37a), such as a bolt. The fixed member (38) is formed in the shape of a toroidal plate and is arranged to surround the fixed member (37). The fixed member (38) is fixed to the central part (32) by a fastening member (38a), such as a bolt, and holds the outer edge of the flexible member (45) between the protrusion (35a) formed at the edge of the opening (35). By this, the space between the flexible member (45) and the central part (32) is watertightly sealed.

[0041] The central part (32) has a space delimiting surface (32a) that faces the semiconductor device (2) and defines a space (S1) between the semiconductor device (2) when the cooling unit (21) is mounted on the stage (3) (when the opening (35) faces the semiconductor device (2)). The space delimiting surface (32a) is the upper surface of the central part (32). In this example, the space delimiting surface (32a) is a circular flat surface that extends along a plane perpendicular to direction D1 and faces the semiconductor device (2) and the holding part (3b). When viewed from direction D1, the space delimiting surface (32a) is adjacent to the aforementioned opening (35) and surrounds the opening (35). The thickness of the space (S1) (minimum thickness in direction D1, i.e., the distance between the die (2c) and the space delimitation plane (32a) in direction D1) is, for example, about 0.05 mm or more and 1.0 mm or less.

[0042] The outer part (33) has a contact portion (39) that contacts the stage (3) to define the outer edge portion of the space (S1). That is, the space (S1) is formed by the contact portion (39) of the outer part (33) contacting the stage (3). On the upper surface (33a) of the outer part (33), a pair of placement grooves (33b) are formed, each in which an elastic member (41, 42) is placed (Fig. 4). The elastic member (41, 42) is a member that is sandwiched between the jacket (31) and the retaining portion (3b) to seal the outer edge portion of the space (S1), and is, for example, an O-ring. As shown in Fig. 3, the elastic member (41, 42) is formed in a ring shape, for example. In Fig. 3, the elastic member (41, 42) is shown as a hatching for ease of understanding. In this example, a contact portion (39) is configured to define the outer edge portion of the space (S1) by contacting the stage (3) through the outer portion (33) and elastic members (41, 42).

[0043] As shown in FIGS. 3, 5 and 6, a groove (51) is formed in the middle section (34) so ​​that a cooling fluid (5) flows down from the space demarcation surface (32a). The groove (51) has a first section (52) and a second section (53) located on the lower side (opposite side to the space demarcation surface (32a)) relative to the first section (52) in direction D1. The first section (52) is formed in a roughly ring shape so as to be continuous along the circumferential direction when viewed from direction D1, but is divided into multiple sections (52a) by multiple (eight in this example) bridge sections (36). That is, the first section (52) has multiple sections (52a) (pocket sections) spaced apart by adjacent bridge sections (36). Each part (52a) forms an approximately annular fan shape when viewed from direction D1. Each bridge part (36) connects the central part (32) and the outer part (33) to each other. Multiple bridge parts (36) are arranged at regular intervals in the circumferential direction. Each bridge part (36) is composed of a wall section extending along the diameter direction.

[0044] As shown in FIG. 4, the upper surface (36a) of the bridge portion (36) has a portion (36b) located at a lower position than the space delimitation surface (32a). The upper surface (36a) is a surface connected to the space delimitation surface (32a) in the bridge portion (36). In this example, the portion (36b) is formed by forming a concave portion on the upper surface (36a). The portion (36b) has an inclined surface (36b1) connected to the outer edge of the space delimitation surface (32a), a flat surface (36b2) connected to the outer edge of the inclined surface (36b1), an inclined surface (36b3) connected to the outer edge of the flat surface (36b2), and a flat surface (36b4) connected to the outer edge of the inclined surface (36b3). The inclined surfaces (36b1, 36b3) are inclined so that they face outward as they face downward. The angle of inclination of the inclined surface (36b3) relative to a plane parallel to the spatial demarcation plane (32a) is greater than the angle of inclination of the inclined surface (36b1) relative to the plane. The flat surface (36b4) forms the bottom surface of the concave portion and is located lower than the flat surface (36b2). The flat surface (36b4) is adjacent to the outer portion (33) when viewed from direction D1. The flat surface (36b4) is located at a lower position than the upper surface (33a) of the outer portion (33), and thus a step is formed between the bridge portion (36) and the outer portion (33).

[0045] As shown in FIG. 6, the second part (53) is connected to the bottom of the first part (52). The second part (53) is formed in a ring shape that extends along the circumferential direction when viewed from direction D1, and surrounds the spatial demarcation surface (32a). That is, unlike the first part (52), the second part (53) is formed to be continuous over the entire circumference. The second part (53) is formed to be narrower than the first part (52). That is, the groove (51) is narrowed at the boundary between the second part (53) and the first part (52). In this example, the second part (53) is formed to be narrower than the first part (52) because the width of the second part (53) in the radial direction is narrower than the width of the first part (52) in the radial direction.

[0046] The inner surface (53a) of the second part (53) includes an inclined surface (53b) that slopes inward as it moves downward. The inner surface (53a) is the outer inner surface in the radial direction of the second part (53) and constitutes a part of the outer inner surface in the radial direction of the groove (51). The inclined surface (53b) is formed at the boundary with the first part (52) in the inner surface (53a) and is connected to the first part (52) at the top. In the circumferential direction, the inclined surface (53b) is formed over the entire circumference.

[0047] The space within the groove (51) is connected to the space (S1) defined between the space delimitation surface (32a) and the semiconductor device (2). Alternatively, the space within the groove (51) may be considered to constitute a part of the space (S1). The groove (51) extends downward from the space delimitation surface (32a). Therefore, the cooling fluid (5) flowing through the space (S1) flows down from the space delimitation surface (32a) to the groove (51). That is, the cooling fluid (5) falls by gravity and moves from the space delimitation surface (32a) into the groove (51). The cooling fluid (5) that flows down into the groove (51) moves, for example, from the first part (52) along the inclined surface (53b) to the second part (53) and is stored in the second part (53). The cooling fluid (5) stored in the second part (53) is discharged from the discharge path (62) described later.

[0048] In the jacket (31), four supply channels (61) through which cooling fluid (5) supplied to the space (S1) flows, and four discharge channels (62) through which cooling fluid (5) discharged from the space (S1) to the outside flow. As shown in FIGS. 2 and 4, the supply channels (61) are opened to the outside of the jacket (31) from the side of the jacket (31) and are also opened to the space demarcation surface (32a) of the central part (32). A pipe (P1) through which cooling fluid (5) supplied from the storage tank (22) flows is connected to the opening at the side of the jacket (31).

[0049] As shown in FIG. 4, the supply channel (61) has a first part (61a) and a second part (61b). The first part (61a) is formed to pass through the outer part (33) and is open to the outside of the jacket (31). The second part (61b) is connected to the first part (61a) and is formed to pass through the bridge part (36) and has a supply port (61c) that is open to the space delimitation surface (32a) (Figs. 3 and 4). Cooling fluid (5) is supplied from the supply port (61c) to the space delimitation surface (32a) (space (S1)). The second part (61b) is continuous along the diameter direction and is inclined upward as it extends inward. Four supply channels (61) are arranged at regular intervals in the circumferential direction. In this example, supply channels (61) are formed at positions corresponding to four of the eight bridge sections (36). The cooling fluid (5) supplied from the supply channels (61) to the space (S1) flows through the space (S1) toward the fixing lens (72) (opening (35)). In FIG. 4, an example of the path through which the cooling fluid (5) is supplied via the supply channels (61) is indicated by dashed arrows.

[0050] As shown in FIGS. 5 and 6, the discharge channel (62) is formed to pass through the outer portion (33) and is opened to the outside of the jacket (31) from the side of the jacket (31) and to the second portion (53) of the groove portion (51). A pipe (P2) through which cooling fluid (5) is discharged to the drain tank (24) is connected to the opening at the side of the jacket (31). The discharge channel (62) has an outlet (62a) opened at the bottom of the second portion (53) and is connected to the second portion (53) at the outlet (62a). The cooling fluid (5) is discharged from the second portion (53) through the outlet (62a). The four discharge channels (62) may be placed at any location. In this example, each discharge channel (62) is positioned between two adjacent bridge sections (36) in the circumferential direction. In FIG. 6, an example of a path through which the cooling fluid (5) is discharged through the groove (51) and the discharge channel (62) is indicated by a dashed arrow.

[0051] Additionally, the jacket (31) has a ventilation path (65) formed to connect the space (S1) to the outside of the jacket (31) so that air can circulate between the space (S1) (inside of the outer part (33)) and the outside of the jacket (31) (air-open structure). As shown in FIGS. 8 to 10, the ventilation path (65) is opened to the outside of the jacket (31) from the side of the jacket (31) and is also opened to the groove (51) via a ventilation member (66). The opening from the side of the jacket (31) is open (not blocked).

[0052] The ventilation member (66) is positioned in the first part (52) of the groove (51). The ventilation member (66) has a main body (67) and a cover (68). The main body (67) is formed in a roughly rectangular shape and has a pair of opposing sides (67a). A groove (67c) is formed on the surface (67b) of the main body (67). The surface (67b) is a surface covered by the cover (68). The groove (67c) extends from one side (67a) to the other side (67a). In this example, the groove (67c) has a pair of straight-shaped sections (67c1) extending from the side (67a), a pair of straight-shaped sections (67c2) extending perpendicularly from the pair of straight-shaped sections (67c1), and a straight-shaped section (67c3) extending parallel to the straight-shaped section (67c1) to connect the pair of straight-shaped sections (67c2) to each other.

[0053] By covering the upper part of the groove (67c) with a cover (68), an internal space (S2) with a shape corresponding to the groove (67c) is defined. A through hole (67d) that penetrates the main body (67) is formed in the straight portion (67c3) of the groove (67c). The internal space (S2) (groove (67c)) is connected to a ventilation path (65) via the through hole (67d). Additionally, as the groove (67c) extends to each side (67a), the internal space (S2) is opened at each side (67a) and connected to the first portion (52) of the groove (51). In this example, the cover (68) is positioned on the main body (67) so as to protrude from each side (67a). That is, the length of the cover (68) in a direction perpendicular to the side (67a) is longer than the length of the main body (67) in that direction (the distance between a pair of side (67a)), and the cover (68) protrudes from each side (67a) in that direction. By this, the cooling fluid (5) flowing down from the space demarcation surface (32a) to the groove (51) is prevented from entering the internal space (S2). The cover (68) is located vertically above the main body (67).

[0054] The cover (68) is fixed to the main body (67) by a fastening member (68a), such as a bolt. The ventilation member (66) is fixed to the jacket (31) by a fastening member (66a), such as a bolt. In this example, the jacket (31) has a fixing part (311) formed to protrude from the outer part (33) to the first part (52) of the groove part (51), and the ventilation member (66) is fixed to the fixing part (311). The ventilation path (65) is formed to pass through the fixing part (311). In FIG. 8, an example of a path through which air flows between the space (S1) and the outside of the jacket (31) through the ventilation path (65) and the ventilation member (66) is indicated by a dashed arrow. As described above, the opening of the ventilation path (65) on the side of the jacket (31) is open, and the ventilation path (65) is always open. That is, in the cooling unit (21), air circulation between the space (S1) and the outside of the jacket (31) is always possible (the space (S1) is not sealed).

[0055] Referring again to FIG. 1, the path through which the cooling fluid (5) flows is described. The cooling fluid (5) is stored in a storage tank (22). The cooling fluid (5) in the storage tank (22) is pressurized by a compressor (not shown) and supplied to a supply path (61) via a regulator (23). Four regulators (23) are each connected to the supply path (61) via a pipe (P1). Each regulator (23) is controlled by a control unit (15) and changes the pressure of the fluid flowing through the supply path (61). By doing so, the pressure of the cooling fluid (5) flowing through the space (S1) is adjusted. The cooling fluid (5) discharged from the discharge path (62) is stored in the drain tank (24). The chiller (25) cools the cooling fluid (5) to a predetermined set temperature. Cooling fluid (5) discharged from the discharge channel (62) is introduced into the chiller (25). The chiller (25) cools the introduced cooling fluid (5). The cooling fluid (5) cooled by the chiller (25) is returned to the storage tank (22) and supplied again to the supply channel (61). The jacket (31) may be cooled by allowing a refrigerant to flow into the refrigerant channel formed within the jacket (31). In this case, the refrigerant may be, for example, water or air. That is, the jacket (31) may be cooled by liquid cooling or air cooling.

[0056] [Objective Lens Module]

[0057] As shown in FIGS. 2 and 4, the cooling unit (21) is combined with the objective lens (16) to form an objective lens module (70). In addition to the cooling unit (21) and the objective lens (16) described above, the objective lens module (70) is equipped with a fixing lens unit (immersion lens unit) (71) mounted on the objective lens (16). The fixing lens unit (71) is equipped with a fixing lens (72) and a holder (73). The objective lens (16) is positioned to face the semiconductor device (2) with the opening (35) of the jacket (31) in between. The fixing lens (72) is held within the opening (35) by the holder (73) and is positioned on the optical axis (L) of the objective lens (16).

[0058] The fixing lens (72) has a contact surface (72a), a spherical surface (72b), and a tapered surface (72c). The contact surface (72a) is a flat surface and contacts the die (2c) of the semiconductor device (2). The spherical surface (72b) is a hemispherical surface that is convex toward the lower side and faces the objective lens (16). The tapered surface (72c) is a truncated cone-shaped surface that widens toward the lower side and extends downward from the outer edge of the contact surface (72a) and is connected to the outer edge of the spherical surface (72b). The vertex of the virtual cone containing the tapered surface (72c) coincides with the center of the fixing lens (72) (the center of curvature of the spherical surface (72b)) and is located on the optical axis (L) of the objective lens (16) above the contact surface (72a). The center of the fixing lens (72) coincides with the focal point of the fixing lens (72). The fixing lens (72) may also have a cylindrical surface positioned between the spherical surface (72b) and the tapered surface (72c). In addition to the fixing lens, other immersion lenses such as liquid immersion lenses or oil immersion lenses may be used.

[0059] The correction lens (72) is formed from a high refractive index material that is substantially the same as or close to the refractive index of the substrate material of the semiconductor device (2). Representative examples include Si, GaP, GaAs, etc. The correction lens (72) transmits observation light. By optically attaching the correction lens (72) to the semiconductor device (2), the semiconductor device (2) itself can be used as part of the correction lens (72). According to the analysis of the back side of the semiconductor device (2) using the correction lens (72), when the focus of the objective lens (16) is aligned with the integrated circuit formed on the substrate surface of the semiconductor device (2), the effect of the correction lens (72) allows a light beam with a high numerical aperture (NA) to pass through the semiconductor device (2), thereby enabling high resolution.

[0060] The holder (73) is mounted on the objective lens (16) and holds the fixed lens (72) together with the flexible member (45) described above. The holder (73) has a side wall portion (74) and a cover portion (75). The holder (73) is formed of a non-magnetic material (e.g., aluminum, aluminum alloy, non-magnetic stainless steel, etc.). The side wall portion (74) is formed in a roughly tubular shape. The cover portion (75) is configured to block the opening on the upper side of the side wall portion (74).

[0061] In the cover portion (75), an opening (75a) is formed in which a fixing lens (72) is disposed. The cover portion (75) has a plurality (e.g., three) of protrusions (76) extending from the inner surface of the opening (75a) toward the center of the opening (75a). The protrusions (76) have a tapered shape and are inclined surfaces such that the surface facing the semiconductor device (2) approaches the objective lens (16) as it approaches the center of the opening (75a). The plurality of protrusions (76) are arranged at regular intervals in the circumferential direction, for example.

[0062] The fixing lens (72) is positioned in the opening (75a) such that the contact surface (72a) and the tapered surface (72c) protrude upward from the opening (75a) of the cover portion (75), and the spherical surface (72b) protrudes downward from the opening (75a) of the cover portion (75). The spherical surface (72b) is in contact with the tip of each protrusion (76), and the contact surface (72a) and the tapered surface (72c) are in contact with the flexible member (45) and protrude upward from the flexible member (45). The fixing lens (72) is oscillating in a state before the contact surface (72a) comes into contact with the semiconductor device (2). For example, when the fixing lens (72) moves, the spherical surface (72b) slides against the tip of the protrusion (76), and the flexible member (45) is deformed in accordance with the movement of the fixing lens (72). Since the fixing lens (72) is movable, when the contact surface (72a) is brought into contact with the semiconductor device (2), it is easy to make the fixing lens (72) adhere to the semiconductor device (2). As a result, for example, even if the semiconductor device (2) is positioned at an angle with respect to the optical axis (L), the fixing lens (72) can be made to adhere well to the semiconductor device (2), and it is possible to observe the semiconductor device (2).

[0063] Between the side wall portion (74) and the cover portion (75) in the holder (73), a plurality (two in this example) of first pressing members (81) are provided to press the fixing lens (72) upward (opposite side to the objective lens (16)) by pressing the cover portion (75) upward. The first pressing members (81) are configured, for example, by a spring maintained within the side wall portion (74).

[0064] Between the second member (M2) and the third member (M3) in the jacket (31), a plurality (four in this example) of second pressing members (82) are provided to press the jacket (31) toward the stage (3) (upward) by pressing the second member (M2) upward. The second pressing members (82) are configured, for example, by a spring held by a guide member (M3a). The guide member (M3a) is a cylindrical part that extends along direction D1 provided in the third member (M3). The second pressing members (82) are provided separately / independently from the first pressing member (81), and the pressing force of the second pressing members (82) does not act on the fixing lens (72) (objective lens (16) and fixing lens unit (71)). The lower part of the objective lens (16) is supported by the third member (M3).

[0065] [Semiconductor Inspection Methods]

[0066] In a semiconductor inspection method using a semiconductor inspection device (1), first, a semiconductor device (2) is placed (fixed) on a stage (3) (first step). Next, a cooling unit (21) is placed so that its opening (35) faces the semiconductor device (2), and a space (S1) is defined between the space delimitation surface (32a) and the semiconductor device (2) (second step). More specifically, for example, the objective lens module (70) is moved by the XYZ stage described above to mount the cooling unit (21) on the stage (3) so that its opening (35) faces the semiconductor device (2). By doing so, a space (S1) is formed between the cooling unit (21), the semiconductor device (2), and the stage (3). In the second step, a contact portion (39) consisting of an outer portion (33) and elastic members (41, 42) contacts the stage (3) to define the outer edge portion of the space (S1).

[0067] Next, the objective lens (16) is moved by the XYZ stage to move the fixing lens (72) closer to the semiconductor device (2), and the contact surface (72a) of the fixing lens (72) is brought into contact with the semiconductor device (2) (3rd step). Next, the semiconductor device (2) is driven by the signal input device (11) (4th step). Next, while the cooling fluid (5) flows in the space (S1), the light arriving from the semiconductor device (2) in operation and passing through the aperture (35) is detected by the photodetector (14) (5th step). By the above process, the semiconductor device (2) can be inspected. Additionally, the 4th step of driving the semiconductor device (2) may be performed before the 2nd step or the 3rd step.

[0068] With reference to FIGS. 11 and 12, a semiconductor inspection method using a semiconductor inspection device (1) will be further described. In FIGS. 11 and 12, each configuration is schematically shown. As described above, first, a semiconductor device (2) is placed (fixed) on a stage (3) (first step, FIG. 11 (a)). Next, the XYZ stage is raised to move the objective lens module (70) upward, and a contact part (39) consisting of an outer part (33) and elastic members (41, 42) is brought into contact with the stage (3). By doing so, a space (S1) is formed between the cooling unit (21), the semiconductor device (2), and the stage (3) (second step, FIG. 11 (b)). The contact between this contact part (39) and the stage (3) is detected by, for example, a first sensor (not shown) provided in a jacket (31). In the second step, the control unit (15) controls the XYZ stage based on the detection result of the first sensor. The first sensor may be configured, for example, by a photo sensor that turns on and off by blocking light.

[0069] Next, the XYZ stage is raised further. At this time, the cooling unit (21) does not move because it is in contact with the stage (3) at the contact portion (39), and the second pressing member (82) provided between the second member (M2) and the third member (M3) in the jacket (31) contracts. Meanwhile, the objective lens (16) and the fixing lens (72) are raised along with the movement of the XYZ stage, and the fixing lens (72) comes into contact with the semiconductor device (2) (third step, FIG. 12 (a)). The contact between the fixing lens (72) and the semiconductor device (2) is detected by, for example, a second sensor (not shown) provided in a holder (73). In the third step, the control unit (15) controls the XYZ stage based on the detection result of the second sensor. The second sensor may be configured, for example, by a photo sensor that turns on and off by blocking light. The arrangement of this photo sensor is not particularly limited. For example, a photo sensor may be provided on the side wall (74), and a dock member that blocks light from the photo sensor may be provided on the cover (75). Alternatively, a photo sensor may be provided on the cover (75), and a dock member may be provided on the side wall (74). This applies equally to the case where the third sensor described later is configured by the photo sensor.

[0070] After the third step and before the fourth step of driving the semiconductor device (2), an adjustment step may be performed to adjust the focus position by further raising the XYZ stage (Fig. 12(b)). Even when raising the XYZ stage in the adjustment step, the cooling unit (21) does not move because it is in contact with the stage (3) at the contact portion (39), and the second pressure member (82) contracts. Also, the fixing lens (72) does not move because it is in contact with the semiconductor device (2), and the objective lens (16) rises along with the movement of the XYZ stage. At this time, the first pressure member (81) provided between the side wall portion (74) and the cover portion (75) in the holder (73) contracts. The holder (73) is provided with a third sensor (not shown) to prevent overrun of the XYZ stage (objective lens (16)). The third sensor detects, for example, that the XYZ stage has risen to a predetermined position. The predetermined position is a position corresponding to the position where damage to the device occurs due to the rise of the XYZ stage. In the adjustment step, the control unit (15) controls the XYZ stage based on the detection result of the third sensor. By doing so, it is possible to suppress the XYZ stage from rising excessively and causing damage to the device. The third sensor may be configured, for example, by a photo sensor that turns on and off by blocking light.

[0071] After that, as described above, the semiconductor device (2) is driven by the signal input device (11) (4th step), and while the cooling fluid (5) is flowing in the space (S1), light from the semiconductor device (2) being driven is detected by the light detector (14) (5th step). By doing this, the semiconductor device (2) can be inspected.

[0072] Next, an example of a process for changing the observation area (inspection position) on the semiconductor device (2) will be described. In the semiconductor inspection device (1) according to the embodiment, the observation area can be changed while the cooling fluid (5) is flowing in the space (S1). That is, the observation area can be changed while the semiconductor device (2) is driven and the cooling performance is maintained. When changing the observation area, first, the XYZ stage is lowered from the state shown in, for example, FIG. 12 (a) or FIG. 12 (b), and the fixing lens (72) is separated from the semiconductor device (2) ( FIG. 11 (b)). This is because if the objective lens module (70) is moved in the X direction and / or Y direction while the fixing lens (72) is in close contact with the semiconductor device (2), there is a risk of damage to the fixing lens (72) or the semiconductor device (2). For example, the control unit (15) lowers the XYZ stage to a position where the second sensor is turned off, thereby separating the fixing lens (72) from the semiconductor device (2). At this time, the contact portion (39) of the cooling unit (21) remains in contact with the stage (3), and a space (S1) is formed between the cooling unit (21), the semiconductor device (2), and the stage (3). Additionally, the supply of cooling fluid (5) to the space (S1) continues. Subsequently, the objective lens module (70) is moved in the X direction and / or Y direction relative to the stage (3) by the XYZ stage, thereby moving the fixing lens (72) to a position corresponding to a desired observation area. Subsequently, the XYZ stage is raised to raise the objective lens (16) and the fixing lens (72), and the fixing lens (72) is brought into contact with the semiconductor device. By the above process, the observation area can be changed while the cooling fluid (5) flows in the space (S1).

[0073] [Mechanisms and Effects]

[0074] In the cooling unit (21), a groove (51) is formed between the central part (32) and the outer part (33) of the jacket (31) such that a cooling fluid (5) flows down from the space delimitation surface (32a) (the upper surface of the central part (32)), and a discharge channel (62) through which the cooling fluid (5) discharged to the outside flows is connected to the groove (51). By this, when cooling a semiconductor device (2) by causing the cooling fluid (5) to flow from the supply channel (61) into the space (S1) formed by the contact part (39) of the outer part (33) contacting the stage (3), the cooling fluid (5) can be prevented from reaching the outer edge part (the location where the outer part (33) of the jacket (31) and the stage (3) come into contact. As a result, leakage of the cooling fluid (5) from the outer edge of the space (S1) can be suppressed, and waterproofing performance can be improved. Additionally, by forming the groove (51), the space (S1) can be suppressed from being filled with the cooling fluid (5), and waterproofing performance can also be improved. Furthermore, since the cooling fluid (5) is suppressed from reaching the outer edge of the space (S1), the elastic members (41, 42) for sealing the outer edge can be omitted or simplified. For example, the elastic members (41, 42) can be replaced with flexible members.

[0075] A bridge portion (36) connecting the central portion (32) and the outer portion (33) is formed between the central portion (32) and the outer portion (33) in the jacket (31) (intermediate portion (34)), and a supply channel (61) is formed to pass through the bridge portion (36). By this, the supply channel (61) can be appropriately formed. For example, compared to the case where the supply channel (61) is formed to go around the groove portion (51) without passing through the bridge portion (36), the configuration of the supply channel (61) can be simplified.

[0076] The upper surface (36a) of the bridge portion (36) (a surface connected to the space delimitation surface (32a)) has a portion (36b) located at a lower position than the space delimitation surface (32a). By doing so, the cooling fluid (5) can be prevented from reaching the outer edge of the space (S1) along the upper surface (36a) from the space delimitation surface (32a).

[0077] The groove (51) has a first part (52) and a second part (53) located opposite to the first part (52) in direction D1 (a direction perpendicular to the space delimitation plane (32a)), the second part (53) is formed narrower than the first part (52), and a discharge channel (62) is connected to the second part (53). By doing so, the first part (52) located on the space delimitation plane (32a) side can be formed wide, thereby increasing the opening area of ​​the groove (51) and making it easier for the cooling fluid (5) to flow into the groove (51). In addition, by forming a second part (53) located on the opposite side of the space demarcation surface (32a) narrowly, the cooling fluid (5) can be easily stored in the second part (53), and as a result, the cooling fluid (5) can be efficiently discharged from the discharge channel (62) connected to the second part (53).

[0078] The outer inner surface (53a) of the groove (51) includes an inclined surface (53b) that slopes inward as it moves downward. By doing so, the volume of the groove (51) can be increased, and the cooling fluid (5) flowing into the groove (51) can be appropriately allowed to flow downward.

[0079] The groove (51) has a ring-shaped second part (53) that surrounds the spatial demarcation surface (32a) when viewed from direction D1. By this, the cooling fluid (5) can be efficiently stored in the groove (51), and the stored cooling fluid (5) can be efficiently discharged to the outside.

[0080] In the jacket (31), a ventilation path (65) is formed to connect the space (S1) to the outside of the jacket (31) so that air can circulate between the space (S1) and the outside of the jacket (31), and the ventilation path (65) is connected to the groove (51). By this, the pressure inside the space (S1) can be suppressed from becoming negative pressure. Therefore, when moving the cooling unit (21) along the stage (3) where the semiconductor device (2) is placed while the cooling fluid (5) is flowing, the occurrence of a situation where the cooling unit (21) sticks to the stage (3) due to negative pressure, making it impossible to move the cooling unit (21) or causing the movement precision to decrease can be suppressed. As a result, it becomes possible to move the cooling unit (21) with high precision while the cooling fluid (5) is flowing.

[0081] A groove (51) is formed between the central part (32) and the outer part (33) of the jacket (31) (intermediate part (34)), and a ventilation path (65) is connected to the groove (51). By this, since the groove (51) is difficult to fill with cooling fluid (5), air circulation between the space (S1) and the outside of the jacket (31) via the ventilation path (65) can be ensured.

[0082] A ventilation path (65) is connected to the groove (51) via a ventilation member (66) disposed in the groove (51). By doing so, the intrusion of cooling fluid (5) into the ventilation path (65) can be prevented.

[0083] A ventilation member (66) has an internal space (S2) connected to a ventilation path (65), and the internal space (S2) is opened at the side (67a) of the ventilation member (66) and connected to a groove (51). By doing so, the intrusion of a cooling fluid (5) into the ventilation path (65) (internal space (S2)) can be effectively suppressed.

[0084] A ventilation member (66) has a main body part (67) including a side (67a) and a cover (68), and the cover (68) is positioned on the main body part (67) so as to protrude relative to the side (67a). By doing so, the intrusion of the cooling fluid (5) into the ventilation path (65) (internal space (S2)) can be suppressed even more effectively.

[0085] The ventilation path (65) is always open. By doing so, the pressure in the space (S1) between the space demarcation surface (32a) and the semiconductor device (2) can be reliably suppressed from becoming negative pressure.

[0086] [Variation Example]

[0087] In the cooling unit (21) of the first modified example shown in FIGS. 13 and 14, a pressing member (83) is provided between the jacket (31) and the holder (73) to press the jacket (31) toward the stage (3) (upward side) in place of the second pressing member (82). While the second pressing member (82) of the above embodiment was provided separated / independently from the first pressing member (81) (in parallel with the first pressing member (81)), the pressing member (83) of the first modified example is provided in series with the first pressing member (81), and in the first modified example, the pressing force of the pressing member (83) acts on the fixing lens (72). The spring constant of the pressing member (83) is smaller than the spring constant of the first pressing member (81). In addition, the spring constant of the pressure member (83) may be larger than the spring constant of the first pressure member (81).

[0088] An example of a semiconductor inspection method using a semiconductor inspection device (1) according to a first modified example is described. First, a semiconductor device (2) is placed (fixed) on a stage (3) (first step, FIG. 13 (a)). Next, the XYZ stage is raised to move the objective lens module (70) upward, and the contact portion (39), consisting of an outer portion (33) and elastic members (41, 42), is brought into contact with the stage (3). By doing so, a space (S1) is formed between the cooling unit (21), the semiconductor device (2), and the stage (3) (second step, FIG. 13 (b)).

[0089] Next, the XYZ stage is raised further. At this time, the cooling unit (21) does not move because it is in contact with the stage (3) at the contact portion (39), and the pressure member (83) provided between the jacket (31) and the holder (73) contracts. Meanwhile, the objective lens (16) and the fixing lens (72) are raised along with the movement of the XYZ stage, and the fixing lens (72) comes into contact with the semiconductor device (2) (third step, FIG. 14 (a)). Next, an adjustment step for adjusting the focus position can be performed by raising the XYZ stage further (Fig. 14 (b)). Even when the XYZ stage is raised in the adjustment step, the cooling unit (21) does not move because it is in contact with the stage (3) at the contact portion (39). Also, the fixing lens (72) does not move because it is in contact with the semiconductor device (2), and the objective lens (16) rises along with the movement of the XYZ stage. At this time, the pressurizing member (83) does not contract, and the first pressurizing member (81) provided between the side wall portion (74) and the cover portion (75) in the holder (73) contracts. After that, the semiconductor device (2) is driven by the signal input device (11) (4th step), and while the cooling fluid (5) flows in the space (S1), light from the semiconductor device (2) being driven is detected by the photodetector (14) (5th step).

[0090] In the semiconductor inspection device (1) according to the first modified example, the observation area can be changed while the cooling fluid (5) flows in the space (S1). The process for changing the observation area is the same as in the above embodiment. With this first modified example, waterproof performance can be improved in the same way as in the above embodiment.

[0091] In the second modified example shown in FIG. 15, the bridge portion (36) is not formed in the jacket (31), and the first portion (52) of the groove portion (51) (i.e., the entire groove portion (51)) is formed in a ring shape that extends along the circumferential direction when viewed from direction D1. With this second modified example, waterproof performance can be improved in the same way as in the above embodiment.

[0092] As another variation, the supply channels (61) through which the cooling fluid (5) is supplied may be switchable depending on the observation position on the semiconductor device (2). For example, eight supply channels (61) may be arranged at regular intervals in the circumferential direction, and in the first state, the cooling fluid (5) may be supplied from four of the eight supply channels (61), and in the second state, the cooling fluid (5) may be supplied from the remaining four of the eight supply channels (61). For example, in the first state, the cooling fluid (5) may be supplied to four supply channels (61) so that the cooling fluid (5) flows from four directions, both sides in the X direction and both sides in the Y direction, with respect to the fixing lens (72), and in the second state, the cooling fluid (5) may be supplied to the remaining four supply channels (61) so that the cooling fluid (5) flows from four directions shifted by 45 degrees from the four directions in the first state with respect to the fixing lens (72). Since the heat source may change depending on the observation position on the semiconductor device (2), by adopting such a configuration, effective cooling according to the observation position on the semiconductor device (2) becomes possible. The number of cooling fluids (5) or the switching pattern may be appropriately set.

[0093] The present disclosure is not limited to the above embodiments and variations. For example, the materials and shapes of each component may be various materials and shapes, not limited to the materials and shapes described above. Only one supply channel (61) and / or discharge channel (62) may be provided. The elastic members (41, 42) may be omitted or replaced with flexible members.

[0094] The upper surface (36a) of the bridge portion (36) does not have a portion positioned lower than the space delimitation surface (32a), and, for example, may be in line with the space delimitation surface (32a). The second portion (53) of the groove portion (51) does not have to be formed narrower than the first portion (52), and, for example, may have a width equal to that of the first portion (52). The outer inner surface (53a) of the groove portion (51) does not have to include an inclined surface (53b). The groove portion (51) does not have to have a ring-shaped portion surrounding the space delimitation surface (32a) when viewed from direction D1. The groove portion (51) is configured to allow the cooling fluid (5) to flow down from the space delimitation surface (32a), and may have any shape and arrangement. The ventilation path (65) does not need to be formed, and air circulation between the space (S1) and the outside of the jacket (31) does not need to be made possible.

[0095] The ventilation path (65) may be connected to the outside of the jacket (31) so as to allow air circulation between the space (S1) and the outside of the jacket (31), and may not be connected to the groove (51). The ventilation member (66) may be omitted, and the ventilation path (65) may be connected to the groove (51) without the ventilation member (66) as an intermediary.

[0096] The semiconductor device (2) is not limited to a device including a logic LSI. The semiconductor device (2) may be an individual semiconductor element (discrete), an optoelectronics element, a sensor / actuator, a memory element, or a linear IC (Integrated Circuit), or a hybrid device thereof. Individual semiconductor elements include diodes, power transistors, etc. The semiconductor device (2) may be a package including a semiconductor device, a composite substrate, etc. For example, the semiconductor device (2) may be formed by making and placing a plurality of elements (capacitors, etc.) on a silicon substrate. Explanation of the symbols

[0097] 1… Semiconductor inspection device 2… Semiconductor device 3… Stage 5… Cooling fluid 14… Photodetector 16… Objective lens 21… Cooling unit 31… Jacket 32… Central part 32a… Spatial demarcation surface 33… Lateral part 35… Opening 36… Bridge section 36a… Top surface 36b… part 53b… slope 39… Contact part 51… Groove part 52… Part 1 53… Part 2 53a… inner surface 53b… inclined surface 61… Supply Euro 62… Emission Euro 65… Ventilation path 66… Ventilation absence 67… Main body 67a… Side 68… Cover 70… Objective lens module 72… Fixing Lens (Immersion Lens) S1… Space S2… Interior space

Claims

Claim 1 A cooling unit used in the inspection of a semiconductor device, comprising a jacket for dissipating heat from the semiconductor device, wherein the jacket has a central portion and an outer portion located around the central portion, wherein an opening is formed in the central portion through which light from the semiconductor device passes, and wherein the outer portion has a contact portion that contacts a stage on which the semiconductor device is placed, wherein a supply channel is formed in the jacket through which a cooling fluid for cooling the semiconductor device flows, wherein a groove is formed between the central portion and the outer portion of the jacket so that the cooling fluid flows down from the upper surface of the central portion, and wherein a discharge channel through which the cooling fluid is discharged to the outside is connected to the groove, wherein a ventilation path is formed in the jacket to connect the space formed by the contact portion of the outer portion contacting the stage to the outside of the jacket so as to enable air circulation between the space and the outside of the jacket, and wherein the ventilation path is connected to the groove. Claim 2 A cooling unit according to claim 1, wherein a bridge portion connecting the central portion and the outer portion is formed between the central portion and the outer portion in the jacket, the groove portion is divided into a plurality of parts by a plurality of the bridge portions, and the supply flow path is formed to pass through the bridge portions. Claim 3 A cooling unit according to claim 1 or claim 2, wherein a bridge portion connecting the central portion and the outer portion is formed between the central portion and the outer portion in the jacket, the groove portion is divided into a plurality of parts by a plurality of the bridge portions, and the surface connected to the upper surface of the central portion in the bridge portion has a portion located at a lower position than the upper surface of the central portion. Claim 4 A cooling unit according to claim 1 or claim 2, wherein the groove portion has a first portion and a second portion located opposite to the upper surface of the central portion in a direction perpendicular to the upper surface of the central portion, the second portion is formed narrower than the first portion, and the discharge flow path is connected to the second portion. Claim 5 A cooling unit according to claim 1 or claim 2, wherein the side where the central part is located with respect to the outer part is considered the inner side, the side where the outer part is located with respect to the central part is considered the outer side, and the side where the groove part is located with respect to the upper surface of the central part is considered the lower side, wherein the inner surface of the outer side in the groove part includes an inclined surface inclined such that it faces the inner side as it faces the lower side. Claim 6 A cooling unit according to claim 1 or claim 2, wherein the groove portion has a ring-shaped portion surrounding the upper surface when viewed from a direction perpendicular to the upper surface of the central portion. Claim 7 delete Claim 8 An objective lens module comprising a cooling unit as described in claim 1 or claim 2, an immersion lens disposed in the opening, and an objective lens facing the immersion lens. Claim 9 A semiconductor inspection device comprising a cooling unit as described in claim 1 or claim 2, an immersion lens disposed in the opening, a stage on which the semiconductor device is disposed, an objective lens facing the immersion lens, and a photodetector that detects light from the semiconductor device through the immersion lens and the objective lens.

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