Frame member-including inductor and frame member-including laminated sheet

Abstract

The frame member additional inductor (25) comprises an inductor (3) having a plurality of wires (14) and a magnetic layer (15) that encloses the plurality of wires (14), and a frame member (2) on which the inductor (3) is set.

Description

Technology Field

[0001] The present invention relates to a frame member added inductor and a frame member added laminated sheet. Background Technology

[0002] Conventionally, it is known that inductors are mounted in electronic devices. As such an inductor, a small inductor has been proposed comprising wiring and a magnetic layer covering the wiring and containing flat magnetic particles (see, for example, Patent Document 1 below). Prior art literature

[0003] Japanese Patent Publication No. 2019-220618 The problem to be solved

[0004] However, it is necessary to form vias in the magnetic layer of the inductor for wiring to electrically connect with electronic devices. However, for the transport device that transports the inductor to the processing device for forming vias and also transports the inductor after processing, from the perspective of industrial manufacturing efficiency, large workpieces are typically used and the device is designed accordingly. In this case, there is a problem that small inductors, such as those described in Patent Document 1, cannot be transported by the transport device.

[0005] Therefore, it is considered to enlarge small inductors. However, it is very difficult to enlarge them while maintaining the precision of wiring spacing and layer thickness. Furthermore, manufacturing small sheet-type inductors using conveying devices designed for each company's large workpieces results in increased costs. In addition, compared to small sheet-type inductors, large sheet-type inductors are more susceptible to warping, which further degrades precision.

[0006] The present invention provides an inductor with a frame member and a laminated sheet with a frame member, which can be efficiently and reliably processed even if the inductor is small in size and sheet-like. means of solving the problem

[0007] The present invention (1) includes a sheet-type inductor having a plurality of wires and a magnetic layer that buries the plurality of wires, and a frame member-added inductor having a frame member on which the inductor is set.

[0008] In this frame member-added inductor, the inductor is set in the frame member. Therefore, even if the inductor is small, if the frame member has dimensions that allow it to be transported by a transport device, the frame member and the inductor can be reliably transported by the transport device, and furthermore, they can be transported to a conventional device for forming vias to reliably form vias in the magnetic layer of the inductor. In addition, if the inductor is small, the effect of bending can be reduced. As a result, in this frame member-added inductor, vias can be efficiently and reliably formed in the inductor.

[0009] The present invention (2) includes a frame member additional inductor described in (1), wherein a plurality of the inductors are set in the frame member.

[0010] In this frame member additional inductor, since multiple inductors are set in the frame member, vias can be formed more efficiently.

[0011] The present invention (3) comprises a frame member additional laminated sheet having a frame member additional inductor as described in (1) or (2), and a processing stabilization layer formed on one side in the thickness direction of the inductor and the frame member and comprising a cured product of a thermosetting resin composition.

[0012] This frame member additional laminated sheet can improve the processability of one side of the inductor and frame member by additionally providing a processing stabilization layer.

[0013] The present invention (4) includes a frame member additional laminated sheet described in (3), which further comprises a second processing stabilization layer formed on the other side of the thickness direction of the inductor and the frame member and comprising a cured product of a thermosetting resin composition.

[0014] This frame member additional laminated sheet further comprises a second processing stabilization layer, thereby improving the processability of the inductor and the other side of the frame member. Effects of the invention

[0015] In the frame member additional inductor of the present invention, vias can be efficiently and reliably formed in the inductor.

[0016] In the laminated sheet with additional frame member of the present invention, the processability of one side of the inductor and the frame member can be improved. Brief explanation of the drawing

[0017] [Fig. 1] Figs. 1A to 1D are process diagrams illustrating a method of manufacturing and processing of an embodiment of a laminated sheet with a frame member added according to the present invention, where Fig. 1A is the fourth process, Fig. 1B is the first process, Fig. 1C is the third process, and Fig. 1D is the second process. [Fig. 2] Figs. 2A to 2C are process diagrams illustrating an embodiment and a processing step of the method for manufacturing a laminated sheet with a frame member added according to the present invention, where Fig. 2A is the fourth process, Fig. 2B is the first process, and Fig. 2C is the second process. [Fig. 3] Figs. 3A to 3B show a process in which a frame member additionally places a processing stabilization layer on a laminated sheet, Fig. 3A is a process of filling the processing stabilization layer into vias, and Fig. 3B is a process of forming vias in the processing stabilization layer. [Fig. 4] Figs. 4A to 4D are process diagrams illustrating a modified example of a laminated sheet with a frame member added to Fig. 1C and a processing step thereof, Fig. 4A is a laminated sheet with a frame member added that does not have a processing stabilization layer, Fig. 4B is a process of forming vias in the laminated sheet with a frame member added to Fig. 4A, Fig. 4C is a process of placing a processing stabilization layer in the laminated sheet with a frame member added to Fig. 4B, and Fig. 4D is a process of forming vias in the processing stabilization layer of Fig. 4C. [Fig. 5] Figs. 5A to 5E are process diagrams illustrating an embodiment of the frame member added inductor of the present invention and a processing step thereof, Fig. 5A is a process of placing a frame member on a carrier sheet, Fig. 5B is a first process, Fig. 5C is a second process, Fig. 5D is a third process, and Fig. 5E is a process of forming vias on a processing stable layer. Specific details for implementing the invention

[0018] <One embodiment>

[0019] An embodiment of the laminated sheet with a frame member addition according to the present invention will be described with reference to FIG. 1C and FIG. 2B.

[0020] The frame member additional laminated sheet (21) has a predetermined thickness and has a sheet shape extending in a plane direction orthogonal to the thickness direction. For example, the frame member additional laminated sheet (21) has an approximately rectangular shape when viewed in planar view. The frame member additional laminated sheet (21) comprises a frame member (2), an inductor (3) on the sheet, a processing stabilization layer (4), and a second processing stabilization layer (5).

[0021] The frame member (2) has dimensions that allow it to be transported by a transport device described later. The frame member (2) has an external shape that is approximately rectangular when flat. The frame member (2) has an approximate grid pattern when flat. Specifically, the frame member (2) integrally has an outer frame (7) and an inner frame (8).

[0022] The outer frame (7) has a roughly rectangular frame shape in plan view. The outer frame (7) has four sides.

[0023] The inner frame (8) has a shape that is approximately like a well in planar form. Specifically, the inner frame (8) is continuous with the inner portion located inward from both ends of each of the four sides of the outer frame (7). The inner frame (8) includes a vertical frame and a horizontal frame. The vertical frame and the horizontal frame are orthogonal in planar form.

[0024] Additionally, the frame member (2) has a thickness direction side (9), a different side (10), an outer side (11), and an inner side (12).

[0025] One side (9) of the outer frame (7) and one side (9) of the inner frame (8) are a single surface. Therefore, one side (9) has the same thickness along the surface direction.

[0026] The other side (10) is spaced apart in the thickness direction opposite to that of the one side (9). The other side (10) of the inner frame (8) and the other side (10) of the one side (9) are a single plane. Therefore, the other side (10) has the same thickness across the plane direction.

[0027] The outer surface (11) is the main side surface of the outer frame (7). The outer surface (11) connects the main end edge of one side (9) of the outer frame (7) and the main end edge of the other side (10) of the outer frame (7).

[0028] The inner side (12) is the inner side of the frame member (2). In this embodiment, the inner side (12) is included in the side of the outer frame (7), the side facing the outer side (11), and the side of the inner frame (8). The inner side (12) divides a receiving room (see FIG. 2A) (13) that is approximately rectangular in plan view. The receiving rooms (13) are arranged in multiple spaces spaced apart in the planar direction.

[0029] The material of the frame member (2) is not particularly limited and may be, for example, metal, resin, ceramics, etc. Preferably, resin may be used.

[0030] The lower limit of the thickness of the frame member (2) is, for example, 10 μm, and the upper limit is, for example, 10,000 μm.

[0031] The frame member (2) has a larger dimension than the inductor (3) described below in planar form. For example, the lower limit of the length in the direction in which the four sides of the outer frame (7) extend is, for example, 100 mm, preferably 200 mm, more preferably 300 mm, and also, for example, the upper limit is 1,000 mm.

[0032] The inductor (3) is set inside the frame member (2). Specifically, the inductor (3) is housed in each of the plurality of receiving chambers (13) in a planar view. Accordingly, the plurality of inductors (3) are arranged in alignment in the vertical direction (a direction included in the plane direction, in which the vertical frame of the inner frame (8) extends) and the horizontal direction (a direction included in the plane direction, in which the horizontal frame of the inner frame (8) extends) by raising the inner frame (8) of the frame member (2).

[0033] The inductor (3) has a predetermined thickness and extends in a planar direction. The inductor (3) has a roughly rectangular shape in planar form. The inductor (3) is provided with a plurality of wires (14) and a magnetic layer (15).

[0034] A plurality of wirings (14) are spaced apart from each other in the horizontal direction and are adjacent. A plurality of wirings (14) run parallel. A plurality of wirings (14) extend in the vertical direction. The shape, dimensions, composition, material, formulation (filling rate, content ratio, etc.) of the wirings (14) are described, for example, in Japanese Patent Publication No. 2019-220618. Preferably, the wirings (14) form a roughly circular shape in cross-section along the thickness direction and the horizontal direction, and the lower limit of the diameter is, for example, 25 μm, and the upper limit of the diameter is, for example, 2,000 μm. The wirings (14) preferably include a conductor made of a conductor and an insulating film covering the main surface of the conductor. The lower limit of the spacing between adjacent wires (14) is, for example, 10 μm, preferably 50 μm, and the upper limit of the spacing between adjacent wires (14) is, for example, 5,000 μm, preferably 3,000 μm. The upper limit of the ratio of the diameter of the wire (14) to the spacing between adjacent wires (14) (diameter / spacing) is, for example, 200, preferably 50, and the lower limit is, for example, 0.01, preferably 0.1.

[0035] The magnetic layer (15) improves the inductance of the inductor (3). In a planar view, the magnetic layer (15) has the same external shape as the inductor (3). The magnetic layer (15) has a plate shape extending in the plane direction. In addition, the magnetic layer (15) has a plurality of wires (14) embedded in a cross-sectional view. The magnetic layer (15) has a one-sided surface (16), a other-sided surface (17), an outer surface (18), and an inner surface (19).

[0036] One side (16) forms one side in the thickness direction in the magnetic layer (15).

[0037] The other side (17) forms a thickness direction other side in the magnetic layer (15). The other side (17) is spaced apart from the thickness direction other side of the one side (16).

[0038] The outer surface (18) is the outer surface of the magnetic layer (15). The outer surface (18) connects the main end of one side (16) and the main end of the other side (17).

[0039] The inner surface (19) is spaced apart in the thickness direction from the one side (16) and the other side (17). The inner surface (19) is located between the one side (16) and the other side (17) in the thickness direction. Additionally, the inner surface (19) is located between two opposing outer surfaces (18) in the transverse direction. The inner surface (19) contacts the outer surface of the wiring (14).

[0040] The magnetic layer (15) comprises a binder and magnetic particles. Specifically, the material of the magnetic layer (15) is a magnetic composition containing a binder and magnetic particles.

[0041] The binder is a matrix that disperses magnetic particles. Examples of binders include thermoplastic resins such as acrylic resins, and thermosetting resins such as epoxy resin compositions. Acrylic resins include, for example, carboxyl group-containing acrylic acid ester copolymers. The epoxy resin composition includes, for example, a main epoxy resin (cresol novolak-type epoxy resin, etc.), a curing agent for epoxy resin (phenol resin, etc.), and a curing accelerator for epoxy resin (imidazole compound, etc.). As binders, thermoplastic resins and thermosetting resins may be used individually or in combination, and preferably, thermoplastic resins and thermosetting resins are used in combination. The volume ratio of the binder in the magnetic composition is the remainder of the volume ratio of the magnetic particles described below.

[0042] Magnetic particles are dispersed, for example, in a binder. In the present embodiment, the magnetic particles have a roughly flat shape. Meanwhile, the roughly flat shape includes a roughly plate shape.

[0043] The lower limit of the flatness ratio (flatness) of the magnetic particles is, for example, 8, preferably 15, and the upper limit is, for example, 500, preferably 450. The flatness ratio is calculated, for example, as the aspect ratio obtained by dividing the median diameter of the magnetic particles by the average thickness of the magnetic particles.

[0044] The lower limit of the median diameter of the magnetic particles is, for example, 3.5 μm, preferably 10 μm, and the upper limit is, for example, 200 μm, preferably 150 μm. The lower limit of the average thickness of the magnetic particles is, for example, 0.1 μm, preferably 0.2 μm, and the upper limit is, for example, 3.0 μm, preferably 2.5 μm.

[0045] In addition, the material of the magnetic particles is a metal. Examples of metals include magnetic materials such as soft magnetic materials and hard magnetic materials. Preferably, soft magnetic materials are used to ensure good inductance.

[0046] Examples of soft magnetic materials include, for instance, a single metal body containing one type of metal element in a pure state, or, for instance, an alloy body that is a eutectic (mixture) of one or more types of metal elements (first metal element), one or more types of metal elements (second metal element), and / or non-metal elements (carbon, nitrogen, silicon, phosphorus, etc.). These may be used alone or in combination.

[0047] As a single metal body, for example, a metal element composed of only one type of metal element (first metal element) can be cited. As the first metal element, for example, iron (Fe), cobalt (Co), nickel (Ni), and other metal elements that can be contained as the first metal element of a soft magnetic material are appropriately selected.

[0048] In addition, as a single metal body, examples include a form comprising a core containing only one type of metal element and a surface layer containing inorganic and / or organic materials that modify part or all of the surface of the core, for example, a form in which an organometallic compound or an inorganic metal compound containing a first metal element has been decomposed (thermal decomposition, etc.). As for the latter form, more specifically, examples include iron powder (which is sometimes referred to as carbonyl iron powder) obtained by thermal decomposition of an organoiril compound (specifically, carbonyl iron) containing iron as the first metal element. Meanwhile, the location of the layer containing inorganic and / or organic materials that modifies the part containing only one type of metal element is not limited to the surface as described above. Meanwhile, the organometallic compound or inorganic metal compound capable of obtaining a single metal body is not particularly limited and can be appropriately selected from known or conventional organometallic compounds or inorganic metal compounds capable of obtaining a single metal body of a soft magnetic material.

[0049] The alloy is a eutectic of one or more metal elements (first metal element) and one or more metal elements (second metal element) and / or non-metal elements (carbon, nitrogen, silicon, phosphorus, etc.), and is not particularly limited as long as it can be used as an alloy of a soft magnetic material.

[0050] The first metallic element is an essential element in the alloy, and examples include iron (Fe), cobalt (Co), nickel (Ni), etc. Meanwhile, if the first metallic element is Fe, the alloy becomes an Fe-based alloy, if the first metallic element is Co, the alloy becomes a Co-based alloy, and if the first metallic element is Ni, the alloy becomes a Ni-based alloy.

[0051] The second metallic element is an element (minor component) secondarily contained in the alloy and is a metallic element that eutectically combines with the first metallic element, for example, iron (Fe) (when the first metallic element is other than Fe), cobalt (Co) (when the first metallic element is other than Co), nickel (Ni) (when the first metallic element is other than Ni), chromium (Cr), aluminum (Al), silicon (Si), copper (Cu), silver (Ag), manganese (Mn), calcium (Ca), barium (Ba), titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), molybdenum (Mo), tungsten (W), ruthenium (Ru), rhodium (Rh), zinc (Zn), gallium (Ga), indium (In), germanium (Ge), tin (Sn), lead (Pb), scandium (Sc). Examples include yttrium (Y), strontium (Sr), and various rare earth elements. These can be used individually or in combination of two or more types.

[0052] Non-metallic elements are elements (minor components) that are secondarily contained in the alloy and are non-metallic elements that eutectic with the first metal element, such as boron (B), carbon (C), nitrogen (N), silicon (Si), phosphorus (P), sulfur (S), etc. These can be used alone or in combination of two or more types.

[0053] As an example of an alloying body, an Fe-based alloy, for example, magnetic stainless (Fe-Cr-Al-Si alloy) (including electronic stainless), Sendust (Fe-Si-Al alloy) (including super Sendust), Permalloy (Fe-Ni alloy), Fe-Ni-Mo alloy, Fe-Ni-Mo-Cu alloy, Fe-Ni-Co alloy, Fe-Cr alloy, Fe-Cr-Al alloy, Fe-Ni-Cr alloy, Fe-Ni-Cr-Si alloy, silicon copper (Fe-Cu-Si alloy), Fe-Si alloy, Fe-Si-B(-Cu-Nb) alloy, Fe-B-Si-Cr alloy, Fe-Si-Cr-Ni alloy, Fe-Si-Cr alloy, Fe-Si-Al-Ni-Cr alloy, Fe-Ni-Si-Co alloy, Fe-N alloy, Fe-C alloy, Fe-B alloy, Fe-P alloy, ferrite (stainless-based ferrite, furthermore Examples include soft ferrites such as Mn-Mg ferrite, Mn-Zn ferrite, Ni-Zn ferrite, Ni-Zn-Cu ferrite, Cu-Zn ferrite, and Cu-Mg-Zn ferrite), fermendur (Fe-Co alloy), Fe-Co-V alloy, and Fe-based amorphous alloy.

[0054] Examples of Co-based alloys that serve as examples of alloys include Co-Ta-Zr and cobalt (Co)-based amorphous alloys.

[0055] Examples of Ni-based alloys that serve as examples of alloy bodies include, for instance, Ni-Cr alloys.

[0056] Meanwhile, a more detailed formulation of the magnetic composition described above is described in Japanese Patent Publication No. 2014-165363, etc.

[0057] The lower limit of the volume ratio of magnetic particles in the magnetic composition is, for example, 40 volume%, preferably 50 volume%, more preferably 60 volume%, and the upper limit is, for example, 95 volume%, preferably 90 volume%.

[0058] The lower limit of the thickness of the inductor (3) is, for example, 30 μm, preferably 40 μm, and the upper limit of the thickness of the inductor (3) is, for example, 2,500 μm, preferably 2,000 μm.

[0059] Meanwhile, for each of the multiple inductors (3), the thickness of the inductor (3) is adjusted with high precision.

[0060] In addition, the lower limit of the ratio of the thickness of the inductor (3) to the thickness of the frame member (2) is, for example, 0.1, preferably 0.5, more preferably 0.8, and the upper limit is, for example, 10, preferably 2, more preferably 1.2.

[0061] Meanwhile, the above-mentioned frame member (2) and inductor (3) form an inductor (25) (see FIG. 5B) with the frame member added.

[0062] The processing stabilization layer (4) improves surface processability for one side (16) of the inductor (3). The processing stabilization layer (4) forms one side in the thickness direction of the laminated sheet (21) of the frame member. The processing stabilization layer (4) is in contact with one side (9) of the frame member (2) and one side (16) of the magnetic layer (15) in the frame member (2). The processing stabilization layer (4) has a sheet shape that extends in the plane direction. Specifically, the processing stabilization layer (4) has an external shape similar to that of the laminated sheet (21) of the frame member when viewed in a planar state. Meanwhile, the processing stabilization layer (4) has an external shape larger than that of the frame member (2). In addition, the processing stabilization layer (4) blocks one end in the thickness direction of the receiving chamber (13) of the frame member (2).

[0063] The processing stabilization layer (4) comprises a cured product of a thermosetting resin composition. That is, the material of the processing stabilization layer (4) comprises a thermosetting resin composition. The thermosetting resin composition comprises a thermosetting resin as an essential component.

[0064] The thermosetting resin includes a main component, a curing agent, and a curing accelerator.

[0065] Examples of the subject matter include epoxy resins, silicone resins, etc., and preferably epoxy resins. Examples of epoxy resins include bifunctional epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, modified bisphenol A type epoxy resin, modified bisphenol F type epoxy resin, modified bisphenol S type epoxy resin, and biphenyl type epoxy resin; examples of polyfunctional epoxy resins with three or more functions such as phenol novolak type epoxy resin, cresol novolak type epoxy resin, trihydroxyphenylmethane type epoxy resin, tetraphenylolethane type epoxy resin, and dicyclopentadiene type epoxy resin. These epoxy resins may be used alone or in combination of two or more types. Preferably, bifunctional epoxy resins may be used, and more preferably, bisphenol A type epoxy resins may be used.

[0066] The lower limit of the epoxy equivalent of the epoxy resin is, for example, 10 g / eq., and the upper limit is, for example, 1,000 g / eq.

[0067] As a curing agent, if the main component is an epoxy resin, examples include phenol resin, isocyanate resin, etc. Examples of phenol resins include polyfunctional phenol resins such as phenol novolak resin, cresol novolak resin, phenol aralkyl resin, phenol biphenylene resin, dicyclopentadiene-type phenol resin, and resol resin. These may be used alone or in combination of two or more types. Preferably, examples of phenol resins include phenol novolak resin and phenol biphenylene resin. When the main component is an epoxy resin and the curing agent is a phenol resin, the lower limit of the total hydroxyl groups in the phenol resin is, for example, 0.7 equivalents, preferably 0.9 equivalents, and the upper limit is, for example, 1.5 equivalents, preferably 1.2 equivalents, with respect to 1 equivalent of an epoxy group in the epoxy resin. Specifically, the lower limit of the mass portion of the curing agent is, for example, 1 mass portion and, for example, 50 mass portions, for every 100 mass portions of the main component.

[0068] As a curing accelerator, a catalyst (thermal curing catalyst) that promotes the curing of the main component (preferably, an epoxy resin curing accelerator) may be used, for example, an organic phosphorus compound, or an imidazole compound such as 2-phenyl-4-methyl-5-hydroxymethylimidazole (2P4MHZ). The lower limit of the mass of the curing accelerator is, for example, 0.05 mass parts per 100 mass parts of the main component, and the upper limit is, for example, 5 mass parts.

[0069] In addition, the thermosetting resin composition may include particles as optional components, for example. The particles are dispersed in the thermosetting resin. The particles are, for example, at least one type selected from the group consisting of a first particle and a second particle.

[0070] The first particle has, for example, a roughly spherical shape. The lower limit of the median diameter of the first particle is, for example, 1 μm, preferably 5 μm, and the upper limit of the median diameter of the first particle is, for example, 250 μm, preferably 200 μm. The median diameter of the first particle is obtained using a laser diffraction particle size distribution measuring device. Additionally, the median diameter of the first particle may also be obtained, for example, by binarization processing by cross-sectional observation.

[0071] The material of the first particle is not particularly limited. Examples of the material of the first particle include metals, inorganic compounds, organic compounds, etc., and in order to increase the coefficient of thermal expansion, metals and inorganic compounds are preferably used.

[0072] Metals are included in the thermosetting resin composition when the processing stabilization layer (4) functions as an inductance enhancing layer. Examples of metals include the magnetic material exemplified in the magnetic layer (15), preferably an organic iron compound containing iron as the first metal element, more preferably carbonyl iron.

[0073] An inorganic compound is included in the thermosetting resin composition when the processing stabilization layer (4) functions as a thermal expansion coefficient suppression layer. Examples of inorganic compounds include inorganic fillers, specifically silica, alumina, etc., and preferably silica.

[0074] Specifically, as the first particle, preferably spherical silica can be cited, and also preferably spherical carbonyl iron can be cited.

[0075] The second particle has, for example, a roughly flat shape. The roughly flat shape includes a roughly plate shape.

[0076] The lower limit of the flatness (flatness) of the second particle is, for example, 8, preferably 15, and the upper limit is, for example, 500, preferably 450. The flatness of the second particle is obtained by the same calculation method as the flatness of the magnetic particle in the magnetic layer (15) described above.

[0077] The lower limit of the median diameter of the second particle is, for example, 1 μm, preferably 5 μm, and the upper limit of the median diameter of the second particle is, for example, 250 μm, preferably 200 μm. The median diameter of the second particle is obtained in the same way as that of the first particle.

[0078] The lower limit of the average thickness of the second particle is, for example, 0.1 μm, preferably 0.2 μm, and the upper limit is, for example, 3.0 μm, preferably 2.5 μm.

[0079] The material of the second particle is, for example, an inorganic compound. Examples of inorganic compounds include thermally conductive compounds such as boron nitride. Therefore, preferably, the inorganic compound is included in the thermosetting resin composition when the processing stabilization layer (4) functions as a thermal conductivity enhancing layer.

[0080] Specifically, as a second particle, preferably flat boron nitride can be cited.

[0081] The first particle and the second particle are included in the thermosetting resin composition as a single type or as both.

[0082] The lower limit of the number of parts by mass of particles (first particles and / or second particles) per 100 parts by mass of thermosetting resin is, for example, 10 parts by mass, preferably 50 parts by mass, and the upper limit is, for example, 2,000 parts by mass, preferably 1,500 parts by mass. In addition, the lower limit of the particle content ratio in the cured product is, for example, 10% by mass, and the upper limit is, for example, 90% by mass. When both the first particles and the second particles are included in the thermosetting resin composition, the lower limit of the number of parts by mass of the second particles per 100 parts by mass of the first particles is, for example, 30 parts by mass, and the upper limit is, for example, 300 parts by mass.

[0083] On the other hand, since particles are optional components in the thermosetting resin composition, the thermosetting resin composition does not need to contain particles.

[0084] Meanwhile, the material of the processing stabilization layer (4) may additionally contain a thermoplastic resin. As for the thermoplastic resin, the thermoplastic resin exemplified in the binder of the wiring (14) can be used. The lower limit of the number of parts by mass of the thermoplastic resin relative to 100 parts by mass of the thermosetting resin is, for example, 1 part by mass, and the upper limit is, for example, 100 parts by mass.

[0085] The lower limit of the thickness of the processing stabilization layer (4) is, for example, 1 μm, preferably 10 μm, and the upper limit is, for example, 1,000 μm, preferably 100 μm. The lower limit of the ratio of the thickness of the processing stabilization layer (4) to the thickness of the inductor (3) is, for example, 0.001, preferably 0.005, more preferably 0.01, and the upper limit is, for example, 0.5, preferably 0.3, more preferably 0.1.

[0086] Meanwhile, the thickness of the processing stabilization layer (4) is adjusted with high precision.

[0087] The second processing stabilization layer (5) improves the surface processability of the inductor (3). The second processing stabilization layer (5) forms the other side in the thickness direction of the laminated sheet (21) on the frame member. The second processing stabilization layer (5) contacts the other side (10) of the frame member (2) and the other side (17) of the magnetic layer (15) in the frame member (2). The second processing stabilization layer (5) has a sheet shape that extends in the plane direction. Specifically, the second processing stabilization layer (5) has the same external shape as, for example, the processing stabilization layer (4) when viewed in a planar state. In addition, the second processing stabilization layer (5) blocks the other end in the thickness direction of the receiving chamber (13) of the frame member (2). By doing so, communication between the receiving chamber (13) and the outside is blocked.

[0088] The second processing stabilization layer (5) comprises a cured product of a thermosetting resin composition, and the material of the second processing stabilization layer (5) comprises the thermosetting resin composition exemplified in the processing stabilization layer (4).

[0089] The lower limit of the thickness of the second processing stabilization layer (5) is, for example, 1 μm, preferably 10 μm, and the upper limit is, for example, 1,000 μm, preferably 100 μm. The lower limit of the ratio of the thickness of the second processing stabilization layer (5) to the thickness of the inductor (3) is, for example, 0.001, preferably 0.005, more preferably 0.01, and the upper limit is, for example, 0.5, preferably 0.3, more preferably 0.1.

[0090] Meanwhile, the thickness of the second processing stabilization layer (5) is adjusted with high precision.

[0091] The thickness of the second processing stabilization layer (5) may be the same as or different from the thickness of the processing stabilization layer (4). The lower limit of the ratio of the thickness of the processing stabilization layer (4) to the thickness of the second processing stabilization layer (5) (thickness of the processing stabilization layer (4) / thickness of the second processing stabilization layer (5)) is, for example, 0.05, preferably 0.1, preferably 0.2, and the upper limit is, for example, 10, preferably 5.

[0092] Next, an embodiment of a method for manufacturing a laminated sheet (21) with a frame member added will be described with reference to FIGS. 1A to 2C.

[0093] The method for manufacturing a laminated sheet (21) with a frame member added comprises a fourth process, a first process, and a third process in order. That is, in this method, the fourth process, the first process, and the third process are carried out in order.

[0094] In addition, in the method of manufacturing and processing the laminated sheet (21) with the frame member added (processing including the formation of vias (6) in the second process), the member produced in each process is conveyed to a conveying device and provided to the device of the next process. The conveying device is large and, for example, can convey a conveyed object (frame member (2)) with a width (length in a direction orthogonal to the conveying direction and thickness direction) of 100 mm or more, preferably 200 mm or more, more preferably 300 mm or more.

[0095] In the fourth process, as shown in FIG. 1A and FIG. 2A, the second processing stabilization layer (5) is placed on the other side of the frame member (2).

[0096] For example, a solvent is additionally added to the material of the second processing stabilization layer (5) to prepare a varnish, and this is applied to the surface of a release sheet (not shown) and dried to form the second processing stabilization layer (5). In this second processing stabilization layer (5), the thermosetting resin composition is, for example, stage B or stage C.

[0097] Next, one side in the thickness direction of the second processing stabilization layer (5) and the other side (10) of the frame member (2) are brought into contact. Specifically, the frame member (2) is placed on one side of the second processing stabilization layer (5).

[0098] Next, in the first process, as shown in FIGS. 1B and FIGS. 2B, a plurality of inductors (3) are set inside the frame member (2). Specifically, each of the other sides (17) of the plurality of inductors (3) is brought into contact with one side in the thickness direction of the second processing stabilization layer (5) exposed from the plurality of receiving chambers (13). Meanwhile, if the second processing stabilization layer (5) is in stage B, the inductors (3) are in close contact with the second processing stabilization layer (5).

[0099] In addition, when setting the inductor (3) inside the frame member (2), additional fixing means such as fitting by a fitting member, screwing, magnetic attraction, or adhesive bonding may be used.

[0100] In the third process, as shown in FIG. 1C, a processing stabilization layer (4) is formed on one side (16) of the inductor (3) and one side (9) of the frame member (2).

[0101] Specifically, a solvent is additionally added to the material of the processing stabilization layer (4) to prepare a varnish, and this is applied to the surface of a release sheet (not shown) and dried to form the processing stabilization layer (4). In this processing stabilization layer (4), the thermosetting resin composition is stage B or stage C, and preferably stage B. After that, the processing stabilization layer (4) is brought into contact with the entire one-sided surface (16) of the inductor (3) and the entire one-sided surface (9) of the frame member (2). If the processing stabilization layer (4) is stage B, the processing stabilization layer (4) adheres to the inductor (3) and the frame member (2).

[0102] After that, if the processing stabilization layer (4) and the second processing stabilization layer (5) are in stage B, the processing stabilization layer (4) and the second processing stabilization layer (5) are heated to become stage C. By doing so, the processing stabilization layer (4) adheres to the inductor (3) and the frame member (2). At the same time, the second processing stabilization layer (5) adheres to the inductor (3) and the frame member (2).

[0103] Alternatively, if the second processing stabilization layer (5) is already in stage C or the processing stabilization layer (4) is in stage B, the processing stabilization layer (4) is made into stage C. By doing so, the processing stabilization layer (4) is bonded to the inductor (3) and the frame member (2). Meanwhile, in this case, the frame member (2) is merely placed on the second processing stabilization layer (5), that is, the frame member (2) is in contact with the second processing stabilization layer (5) but is not bonded (fixed).

[0104] Accordingly, a frame member additional laminated sheet (21) having a frame member (2), an inductor (3), a processing stabilization layer (4), and a second processing stabilization layer (5) is manufactured. Meanwhile, the frame member additional laminated sheet (21) may be equipped with a fixing means not shown.

[0105] This frame member additional laminated sheet (21) is an intermediate part for manufacturing the via additional laminated sheet (1) described below, and is not yet the via additional laminated sheet (1) because it does not have vias (6). The frame member additional laminated sheet (21) is an industrially available device that can be distributed as a part alone.

[0106] The frame member additional laminated sheet (21) is immersed in various chemical solutions (including a cleaning solution for cleaning resin smears, a conditioner for electrolytic plating or electroless plating, an activator, a plating solution, etc.) after manufacturing or during manufacturing, depending on its purpose and use, and the surface is processed.

[0107] Additionally, a slit (not shown) may be formed in the processing stabilization layer (4) facing the inductor (3) in the laminated sheet (21) of the frame member. The slit not shown extends, for example, from one side in the thickness direction of the processing stabilization layer (4) to the middle of the thickness direction of the magnetic layer (15). However, the slit does not open the wiring (14).

[0108] As shown in FIG. 1D and FIG. 2C, thereafter, a via additional laminated sheet (1) is manufactured by carrying out the second process.

[0109] In the second process, vias (6) are formed in the magnetic layer (15) of the frame member part of the laminated sheet (21).

[0110] Via (6) is disposed at both ends of the extending direction (corresponding to the vertical direction) of the wiring (14) in the inductor (3). In cross-section, the via (6) is a through hole that exposes the central portion of one side of the thickness direction of the wiring (14) and penetrates the thickness direction of the magnetic layer (15) and the processing stabilization layer (3) located on one side of the thickness direction of the wiring (14). The via (6) has a roughly circular shape in plan view (not shown). In addition, in cross-section, the via (6) has a tapered shape in which the opening area widens toward one side of the thickness direction.

[0111] Methods for forming vias (6) include, for example, contact openings using a drilling device, or non-contact openings using a laser device. The above-mentioned device (processing device) is interposed in the conveying line of a conveying device. The via (6) is formed on an inductor (3) on the conveying line of the above-mentioned conveying device. The processing device forms vias (6) on the inductor (3) by gripping a frame member (2) with a predetermined gripping part, etc.

[0112] <Effect of operation of one embodiment>

[0113] In addition, in the frame member addition laminated sheet (21) including the inductor (25) of this frame member addition, the inductor (3) is set in the frame member (2). Therefore, even if the inductor (3) is small, if the frame member (2) has dimensions that allow it to be transported by a transport device, the frame member (3) and the inductor (2) can be reliably transported by the transport device, and furthermore, they can be transported to a conventional device for forming vias (6) to reliably form vias (6) in the magnetic layer (15) of the inductor (3). Also, if the inductor (3) is small, the effect of bending can be reduced. As a result, in this frame member addition laminated sheet (21), vias (6) can be efficiently and reliably formed in the inductor (3).

[0114] In addition, in this frame member part of the laminated sheet (21), since a plurality of inductors (3) are set in the frame member (2), vias (6) can be formed more efficiently.

[0115] In addition, since the laminated sheet (21) for the frame member additionally has a processing stabilization layer (4), the processability of one side (16) of the inductor (3) and one side (9) of the frame member (2) can be improved.

[0116] For example, when one side (9) of the outer frame (7) and the other side of the processing stabilization layer (4) are in contact, the thermosetting resin composition of the processing stabilization layer (4) is heat-cured to become a hardened material, and the processing stabilization layer (4) can be adhered to one side (9) of the outer frame (7). By doing so, even if the frame member (2) and the inductor (3) on which the processing stabilization layer (4) is formed are immersed in various chemical solutions (including a cleaning solution for cleaning resin smears, a conditioner for electrolytic plating or electroless plating, an activator, a plating solution, etc.) and the inductor (3) is processed, it is possible to prevent the chemical solution from penetrating between the outer frame (7) and the processing stabilization layer (4).

[0117] In addition, even if a slit is formed in the processing stabilization layer (4) facing the inductor (3), deformation of one side (16) of the inductor (3) can be suppressed.

[0118] Furthermore, the laminated sheet (21) having the frame member additionally has a second processing stabilization layer (5) as shown in FIG. 1A and FIG. 1B, so that the processability of the other side (17) of the inductor (3) and the other side (10) of the frame member (2) can be improved.

[0119] For example, if the second processing stabilization layer (5) contains a thermosetting resin composition of stage B, that is, if the second processing stabilization layer (5) is stage B, the inductor (3) is brought into contact with one side of the second processing stabilization layer (5), and then the second processing stabilization layer (5) is converted to stage C, the inductor (3) is bonded to the second processing stabilization layer (5). In addition, the frame member (2) is also bonded to the second processing stabilization layer (5). In this way, the inductor (3) can move in the plane direction together with the frame member (2). Then, in the second process, the positional precision of the inductor (3) is increased, and therefore, vias (6) can be formed in the inductor (3) with high precision.

[0120] Meanwhile, the second processing stabilization layer (5) of the B stage and the processing stabilization layer (4) of the B stage can be simultaneously converted into the C stage. In this case, the second processing stabilization layer (5) and the processing stabilization layer (4) are simultaneously converted into the C stage in a single heating process. Therefore, the manufacturing efficiency is excellent.

[0121] Additionally, for example, when the other side (10) of the outer frame (7) and one side of the second processing stabilization layer (5) are in contact, the thermosetting resin composition of the second processing stabilization layer (5) is thermosetting to become a hardened material, the second processing stabilization layer (5) can be bonded to the other side (10) of the outer frame (7). Then, even if the frame member (2) and the inductor (3) (frame member additional laminated sheet (21)) on which the second processing stabilization layer (5) is formed are immersed in various chemical solutions (including a cleaning solution for cleaning resin smears, a conditioner for electroplating or electroless plating, an activator, a plating solution, etc.) and the inductor (3) is processed, the chemical solution can be prevented from penetrating between the outer frame (7) and the second processing stabilization layer (5).

[0122] Accordingly, since each of the one side (9) and the other side (10) of the outer frame (7) is bonded to the processing stabilization layer (4) and the second processing stabilization layer (5), the intrusion of the liquid into the receiving chamber (13) can be prevented.

[0123] Also, each of the one side (9) and the other side (10) of the inner frame (8) is bonded to each of the processing stabilization layer (4) and the second processing stabilization layer (5).

[0124] <Examples of Variations and Uses>

[0125] In each of the following variations, the same reference numerals are used for components and processes identical to those in the above-described embodiment, and their detailed descriptions are omitted. Additionally, each variation may exhibit the same functional effects as the embodiment, except as not specified otherwise. Furthermore, the embodiment and its variations may be appropriately combined.

[0126] In one embodiment, a plurality of inductors (3) are set in the frame member (2), but, for example, a single inductor (3) may be set in the frame member (2). Preferably, a plurality of inductors (3) are set in the frame member (2). By doing so, manufacturing efficiency is excellent.

[0127] The number of inductors (3) is not particularly limited if multiple, and specifically, for one frame member (2), it is 2 or more and 10 or less.

[0128] As shown in FIG. 3B, a processing stabilization layer (4) may be additionally formed on the inner surface of the magnetic layer (15) exposed from the via (6).

[0129] For example, first, as shown in FIG. 3A, a processing stabilization layer (4) is additionally filled into the wiring (14) and magnetic layer (15) exposed from the via (6).

[0130] After that, as shown in FIG. 3B, a via (6) is formed again. However, this via (6) exposes the central portion of one side in the thickness direction of the wiring (14) but does not expose the magnetic layer (15). That is, the inner surface of the magnetic layer (15) is covered by a newly filled processing stabilization layer (4).

[0131] As shown in FIG. 4A, the frame member additional laminated sheet (21) does not need to have a processing stabilization layer (4). In the frame member additional laminated sheet (21), one side (9) of the frame member (2) and one side (16) of the inductor (3) are exposed in one side in the thickness direction.

[0132] After that, for example, as shown in FIG. 4B, a via (6) is first formed in the inductor (3) of the laminated sheet (21) of the frame member portion shown in FIG. 4A, and then, as shown in FIG. 4C, a processing stabilization layer (4) is formed on one side (16) of the inductor (3) and one side (9) of the frame member (2) to fill the via (6), and then, as shown in FIG. 4D, a via (6) may be formed in the processing stabilization layer (4).

[0133] As shown in FIG. 4B, a via (6) is formed in the magnetic layer (15) of the frame member part of the laminated sheet (21).

[0134] Next, as shown in FIG. 4C, the second processing stabilization layer (5) is filled into the via (6). By doing so, the second processing stabilization layer (5) covers the inner surface of the magnetic layer (15).

[0135] After that, as shown in FIG. 4D, vias (6) are formed again so that a processing stabilization layer (4) covering the inner surface of the magnetic layer (15) remains. By doing so, the inner surface of the magnetic layer (15) is covered by the processing stabilization layer (4).

[0136] Additionally, as shown in FIGS. 5A to 5E, a carrier sheet (31) may be used instead of the second processing stabilization layer (5). That is, as shown in FIG. 5A, a frame member (2) is placed on one side (32) in the thickness direction of the carrier sheet (31). The carrier sheet (31) extends in the plane direction. The one side (32) in the thickness direction of the carrier sheet (31) may be subjected to a peeling treatment.

[0137] As shown in FIG. 5B, in the first process, an inductor (3) is brought into contact with one side (32) of a carrier sheet (31) exposed from a frame member (2). By doing so, a frame member-attached inductor (25) is manufactured that is supported by the carrier sheet (31) and has the frame member (2) and the inductor (3). The frame member-attached inductor (25) is an intermediate component for manufacturing a frame member-attached laminated sheet (21), and is not yet a frame member-attached laminated sheet (21) because it does not yet have a processing stabilization layer (4) and a second processing stabilization layer (5). The frame member-attached inductor (25) is a device that can be distributed as a component alone and is industrially usable.

[0138] As shown in FIG. 5C, after the first process, a fourth process is performed. In the fourth process, a via (6) is formed in the inductor (3) (magnetic layer (15)) of the frame member part of the inductor (25).

[0139] As shown in FIG. 5D, the inner surface of the magnetic layer (15) is covered by the processing stabilization layer (4), and then, as shown in FIG. 5E, a via (6) is formed so that the processing stabilization layer (4) covering the inner surface of the magnetic layer (15) remains.

[0140] After that, although not shown, the carrier sheet (31) is removed. Specifically, the carrier sheet (31) is peeled off from the inductor (3) and the frame member (2).

[0141] Additionally, although not illustrated, a release sheet not illustrated may be interposed between one side (9) of the frame member (2) and the other side in the thickness direction of the processing stabilization layer (4). By doing so, the frame member (2) can be peeled off from the release sheet and reused.

[0142] As an example of processing in the second process, the formation of vias (6) is exemplified, but is not limited thereto, and may include the formation of a conductive layer, cutting, coating, lamination, marking, cleaning, and etching.

[0143] In forming the conductive layer, the conductive layer (45) is formed in the via (6) as shown by the dashed line in FIG. 1D, the dashed line in FIG. 3B, the dashed line in FIG. 4D, the dashed line in FIG. 5E, etc. As the material of the conductive layer (45), a conductive material such as copper can be used, for example. In forming the conductive layer (45), an electrolytic copper plating solution is used, for example. By doing so, a via-added laminated sheet (1) having the conductive layer (45) is obtained.

[0144] The coating includes, for example, covering the inductor (3) with a processing stabilization layer (4). The cleaning includes, for example, desmearing.

[0145] Meanwhile, although the above invention has been provided as an exemplary embodiment of the present invention, it is merely an example and should not be interpreted restrictively. Variations of the present invention that are obvious to those skilled in the art are included in the latter claims. Explanation of the symbols

[0146] 1 via additional laminated sheet 2 Frame missing 3 inductors 4 Processing Stabilization Layer 5. Second processing stabilization layer 9 One-way (frame member) 10 Other side (frame member) 14 wiring 15 Magnetic layer 16 Unidirectional (Inductor) 17 Other side (inductor) 21 Frame member additional laminated sheet 25 Frame missing additional inductor

Claims

Claim 1 A frame member additional inductor characterized by having a plurality of wires and a magnetic layer for burying the plurality of wires, a sheet-type inductor having a plurality of inductors and a frame member on which the plurality of inductors are set, wherein each of the inductors is partitioned by the frame member. Claim 2 A frame member additional laminated sheet characterized by having a frame member additional inductor described in claim 1, and a processing stabilization layer formed on one side in the thickness direction of the inductor and the frame member and comprising a cured product of a thermosetting resin composition. Claim 3 A frame member additional laminated sheet according to claim 2, characterized by further comprising a second processing stabilization layer formed on the other side in the thickness direction of the inductor and the frame member and comprising a cured product of a thermosetting resin composition. Claim 4 delete

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