Printed circuit board bonding apparatus

Abstract

The present invention relates to a printed circuit board bonding device for attaching a printed circuit board to a panel that can minimize process time, comprising: a plurality of transfer devices equipped to adsorb and move a panel; a bonding unit including a first bonding unit that attaches an object capable of electrically communicating with the TCP of the panel transmitted from the transfer device and attaches an anisotropic conductive film, and a second bonding unit that attaches a printed circuit board; and a support unit disposed opposite the transfer device with respect to the panel and adsorbing and supporting the panel during the process in which the bonding unit attaches the anisotropic conductive film or the printed circuit board to the panel.

Description

Technology Field

[0001] The present invention relates to a printed circuit board bonding device for attaching a printed circuit board to a panel. Background Technology

[0002] In the process of manufacturing flat panel displays, after the panel and TAB IC are bonded, a process is required to attach a printed circuit board to the assembly formed by the bonding of the panel and TAB IC. A printed circuit board bonding device is used to perform this process.

[0003] For example, a display device such as an LCD may be composed of a tape carrier package (TCP) attached to a display panel body containing liquid crystal via an anisotropic conductive film (ACF), and a printed circuit board (PCB) attached to the TCP via an anisotropic conductive film.

[0004] Here, the TCP may be composed of a base film made of a flexible material, input and output wiring that are patterned on the base film to transmit electrical signals, and a drive IC bonded to the input and output wiring.

[0005] In a conventional device for manufacturing such a display device, the panel is supplied with the TCP already attached. The printed circuit board supply unit also supplies the printed circuit board to the bonding unit. The bonding unit bonds the supplied panel and the printed circuit board using a heating method with a heater tool. The extraction unit extracts the panel with the attached printed circuit board from the bonding unit and transfers it to a subsequent assembly line.

[0006] According to the conventional system, printed circuit boards could be attached one by one during the panel and printed circuit board mounting process. Additionally, since the panel transporter holds the panel while the printed circuit board is being attached to the panel's TCP, a time loss occurs before the next panel can be transported, resulting in a problem of prolonged process time.

[0007] Therefore, research is needed on methods to reduce the time required to bond these panels and printed circuit boards. The problem to be solved

[0008] The present invention aims to solve the aforementioned problems and other problems, and aims to provide a printed circuit board bonding device that can reduce the time required to bond a panel and a printed circuit board.

[0009] In addition, the present invention aims to provide a printed circuit board bonding device that can reduce time loss by preparing the next panel to be bonded to the printed circuit board while the panel and the printed circuit board are being bonded. means of solving the problem

[0010] According to one aspect of the present invention for achieving the above or other purposes, a printed circuit board bonding device related to an embodiment of the present invention comprises: a plurality of transfer devices for adsorbing and moving a panel; a bonding unit including a first bonding unit for attaching an anisotropic conductive film and an object capable of electrically communicating with the TCP of the panel transmitted from the transfer device; and a second bonding unit for attaching a printed circuit board; and a support unit disposed opposite the transfer device with respect to the panel, and adsorbing and supporting the panel during the process in which the bonding unit attaches the anisotropic conductive film or the printed circuit board to the panel.

[0011] In one embodiment, the bonding unit includes a bonding portion, and the bonding portion may include a backup portion on which the anisotropic conductive film or printed circuit board is disposed, and a pressing portion that presses the anisotropic conductive film or printed circuit board from the top.

[0012] In one embodiment, the bonding unit may include two or more bonding portions.

[0013] In one embodiment, the two or more bonding portions may be spaced apart from each other by a distance greater than the length of the printed circuit board placed in the backup portion.

[0014] In one embodiment, the bonding unit may further comprise a pop-up unit for supporting a Tape Carrier Package (TCP) that is positioned on the front of the backup unit, attached to the panel, and spaced apart from at least a portion of one side of the panel.

[0015] In one embodiment, the bonding portion may attach the printed circuit board to the TCP such that the printed circuit board is attached to the inner surface of the TCP while the TCP is spaced apart from the panel, and the printed circuit board comes into contact with the panel.

[0016] In one embodiment, the bonding portion may attach the printed circuit board to the TCP such that it is positioned further away from one end of the panel than the TCP.

[0017] In one embodiment, the apparatus may further include a suction unit that adsorbs and moves at least a portion of the TCP in contact with the panel so that the TCP is separated from the panel.

[0018] In one embodiment, the release device can be separated from the panel while the panel is attached to the support unit.

[0019] In one embodiment, the transfer device may include a first transfer device that transfers the panel to the support unit, and a second transfer device that receives the panel from the support unit and transports it to the next process.

[0020] In one embodiment, the panel may further include an alignment unit for measuring the overlapping length of a printed circuit board attached to a TCP (Tape Carrier Package) and a TCP attached to the panel.

[0021] In one embodiment, the alignment portion is positioned in a direction perpendicular to the direction in which the material transfer device moves, and may further include a rotating portion that adsorbs the panel and rotates it horizontally so that the connection portion between the TCP of the panel and the printed circuit board can easily approach the alignment portion.

[0022] In one embodiment, the alignment unit may include a camera unit configured to capture a screen, and a lighting unit positioned around the camera unit to illuminate the object captured by the camera unit from at least both sides.

[0023] In one embodiment, the transfer device may include a tilting part for adjusting the angle of the panel relative to the reference plane. Effects of the invention

[0024] According to at least one embodiment of the present invention, the process time for attaching a printed circuit board to a panel can be reduced through the first bonding part and the second bonding part, and interference that may occur during the attachment of the printed circuit board can be minimized.

[0025] In addition, according to at least one embodiment of the present invention, while the bonding unit is operating, the support unit adsorbs the panel, thereby allowing the transfer machine to move to transport the next panel, so that the tact time between processes is reduced.

[0026] In addition, according to at least one embodiment of the present invention, the pop-up unit supports one side of the TCP spaced apart from the panel, so that the TCP may be prevented from detaching from the backup unit when the panel and the printed circuit board are combined.

[0027] In addition, according to at least one embodiment of the present invention, the present invention can make the attachment between the TCP and the printed circuit board strong by taking a reverse bonding structure between the TCP and the printed circuit board. Brief explanation of the drawing

[0028] FIG. 1 is a conceptual diagram showing a part of the overall system of a printed circuit board bonding device according to an embodiment of the present invention. FIG. 2 is a conceptual diagram illustrating a bonding unit, a support unit, and a material release device in a printed circuit board bonding device according to an embodiment of the present invention. FIGS. 3 and 4 are conceptual diagrams for explaining the bonding unit, pop-up unit, and suction unit of a printed circuit board bonding device according to an embodiment of the present invention. FIG. 5 is a perspective view showing a printed circuit board attached to a TCP in a printed circuit board bonding device according to one embodiment of the present invention (reverse bonding). FIGS. 6 and 7 are conceptual diagrams for explaining a rotating part and an alignment part in a printed circuit board bonding device according to an embodiment of the present invention. FIG. 8 is a conceptual diagram illustrating the superimposed appearance of a printed circuit board and a TCP according to an embodiment of the present invention and an alignment unit that photographs the same. FIGS. 9a to 9d are conceptual diagrams for explaining the direction of movement of the panel and the driving of the alignment unit in the alignment unit according to an embodiment of the present invention. Specific details for implementing the invention

[0029] It should be noted that technical terms used in this specification are used merely to describe specific embodiments and are not intended to limit the invention. Additionally, singular expressions used in this specification include plural expressions unless the context clearly indicates otherwise. The suffixes "module" and "part" for components used in the following description are assigned or used interchangeably solely for the ease of drafting the specification and do not inherently possess distinct meanings or roles.

[0030] In this specification, terms such as "composed of" or "comprising" should not be interpreted as necessarily including all of the various components or steps described in the specification, and should be interpreted as potentially excluding some of the components or steps, or including additional components or steps.

[0031] In addition, when describing the technology disclosed in this specification, if it is determined that a detailed description of related prior art could obscure the essence of the technology disclosed in this specification, such detailed description is omitted.

[0032] In addition, the attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification, and the technical concept disclosed in this specification is not limited by the attached drawings; it should be understood that they include all modifications, equivalents, and substitutions that fall within the concept and technical scope of the present invention. Furthermore, in addition to each of the embodiments described below, combinations of embodiments may fall within the concept and technical scope of the present invention as modifications, equivalents, and substitutions that fall within the concept and technical scope of the present invention.

[0033] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings.

[0034] FIG. 1 is a conceptual diagram showing a part of the overall system of a printed circuit board bonding device according to an embodiment of the present invention. FIG. 2 is a conceptual diagram for explaining a bonding unit, a support unit, and a material release device in a printed circuit board bonding device according to an embodiment of the present invention. FIG. 3 and FIG. 4 are conceptual diagrams for explaining a bonding unit, a pop-up unit, and a suction unit in a printed circuit board bonding device according to an embodiment of the present invention. FIG. 5 is a perspective view showing a printed circuit board attached to a TCP in a printed circuit board bonding device according to an embodiment of the present invention.

[0035] A printed circuit board bonding device (1000) according to an embodiment of the present invention includes a material release device, a bonding unit (400), and a support unit (300).

[0036] Referring to FIG. 1, the printed circuit board bonding device (1000) may have areas for performing each process. Specifically, the printed circuit board bonding device (1000) may include an introduction area (Z1) for introducing a panel (10), a movement area (Z2) for moving the introduced panel (10), an attachment area (Z3) for attaching an anisotropic conductive film or a printed circuit board (30) to the panel (10) using bonding units (U2), and an alignment area (Z4) for inspecting the alignment of the printed circuit board (30) attached to the panel (10) using alignment units (U3). Meanwhile, in the movement area (Z2), tilting to correct the angle of the panel (10) may occur. This will be described later.

[0037] In addition, as described below, the printed circuit board bonding device (1000) may not end with a single attachment and inspection process, but may perform two or more attachment and inspection processes. In such cases, the process illustrated in FIG. 1 may be repeated in a similar manner. That is, after going through the processes Z1 to Z4, it may be repeated again starting from Z1. Also, the process may be configured so that the Z3 and Z4 processes are repeated again after Z3 and Z4.

[0038] The transfer device (110, 120, 130) moves the panel (10) by adsorbing it. The transfer device is provided in multiple numbers. The transfer device can move the panel (10) from a previous process of the printed circuit board bonding device (1000) to a process of the printed circuit board bonding device (1000), and can move the panel (10) within the process of the printed circuit board bonding device (1000).

[0039] Specifically, referring to FIG. 1, the introduction transfer device (110) can introduce the panel (10) from the previous process into the printed circuit board bonding device (1000). Then, the introduction transfer device (110) can transport the panel (10) to the first transfer device (120). At this time, the introduction transfer device (110), the first transfer device (120), and the second transfer device (130) are terms distinguished for convenience, and although the introduction transfer device (110), the first transfer device (120), and the second transfer device (130) are each different transfer devices, they can perform the same or similar configuration and function of adsorption and movement of the panel (10).

[0040] At this time, the transfer device may include a tilting part (U1) for adjusting the angle of the panel (10) relative to the reference plane. The tilting part (U1) can adjust the angle formed between the panel (10) adsorbed to the transfer device and the transfer device, as well as the angle required for the panel (10) to be transferred to the next process. That is, the tilting part (U1) can function to correct the panel (10) if it is tilted horizontally, tilted vertically, or rotated.

[0041] The bonding unit (400) attaches an object capable of electrically communicating with the TCP (20) of the panel (10) transmitted from the transfer machine. Specifically, the object capable of electrically communicating with the TCP (20) may be an anisotropic conductive film or a printed circuit board (30). However, it is understood that other films capable of transmitting electrical signals may be used, not limited to anisotropic conductive films.

[0042] The bonding unit (400) may include a first bonding unit (400) for attaching an anisotropic conductive film (ACF) and a second bonding unit (400) for attaching a printed circuit board (30).

[0043] The anisotropic conductive film can be configured to allow electrical signals to easily pass between the TCP (20) and the printed circuit board (30). However, the anisotropic conductive film and the printed circuit board (30) may be formed as one unit by design, etc. In this case, the bonding unit (400) may not be composed of a first bonding unit (400) and a second bonding unit (400), but may be composed of a single bonding unit (400).

[0044] Meanwhile, the difference between the first bonding unit (400) and the second bonding unit (400) lies in whether an anisotropic conductive film is attached or a printed circuit board (30) is attached. Additionally, there is a difference in the order in which the printed circuit board (30) is attached by the second bonding unit (400) after the anisotropic conductive film is attached by the first bonding unit (400). Since the first bonding unit (400) and the second bonding unit (400) have many identical or similar configurations, they can be collectively referred to as the bonding unit (400).

[0045] The support unit (300) is positioned on the opposite side of the transfer machine with the panel (10) at the center, and can adsorb and support the panel (10) during the process in which the bonding unit (400) attaches an anisotropic conductive film or a printed circuit board (30) to the panel (10).

[0046] Specifically, referring to FIGS. 2 to 4, the support unit (300) is positioned on the opposite side of the transfer machine with respect to the panel (10). Although FIG. 2 shows the support unit (300) separated from the panel (10), the support unit (300) receives the panel (10) by adsorbing it from the transfer machine. Specifically, the support unit (300) can adsorb the panel (10) attached to the first transfer machine (120) through the adsorption hole (305).

[0047] Referring to FIG. 3, the support unit (300) adsorbs and fixes the panel (10). While fixed by the support unit (300), a printed circuit board (30) can be attached to the TCP (20) of the panel (10). At this time, the first release device (120) can be separated from the panel (10).

[0048] The bonding unit (400) may include bonding sections (402, 404). Additionally, the bonding sections (402, 404) may include a backup section (405) and a pressurizing section (407).

[0049] An anisotropic conductive film or a printed circuit board (30) may be placed on the backup section (405). Specifically, as shown in FIG. 3, a printed circuit board (30) may be placed on the backup section (405).

[0050] The pressing part (407) can press the anisotropic conductive film or the printed circuit board (30) from the top. Specifically, as shown in FIG. 3, the pressing part (407) can press the TCP (20) from the top of the area where the printed circuit board (30) and the TCP (20) overlap each other so that the printed circuit board (30) and the TCP (20) can be bonded to each other.

[0051] At this time, the pressurizing part (407) can apply pressure at a relatively low temperature and low pressure when attaching an anisotropic conductive film, and can apply pressure at a relatively high temperature and high pressure when attaching a printed circuit board (30).

[0052] As described above, the bonding unit (400) may include two or more bonding parts. Specifically, referring to FIG. 2, the bonding unit (400) may include a first bonding part (402) and a second bonding part (404) arranged parallel to the planar direction of the panel (10) on the body (401) of the bonding unit (400).

[0053] The printed circuit board bonding device (1000) of the present invention has two or more bonding parts, thereby enabling rapid attachment of multiple printed circuit boards (30) and reducing the process time (tact time) required to attach the printed circuit boards (30) to the panel (10).

[0054] The first bonding section (402) and the second bonding section (404) are spaced apart from each other. At this time, they may be spaced apart from each other by a distance greater than the length of the printed circuit board (30) placed in the backup section (405).

[0055] For example, when four printed circuit boards (30) shown in FIG. 5 are attached to a panel (10), the first printed circuit board (30) and the third printed circuit board (30) from the left side of the figure shown in the drawing can be attached by the first bonding part (402) and the second bonding part (404).

[0056] And, when the process of attaching the printed circuit board (30) to the panel (10) is repeated, the second printed circuit board (30) and the fourth printed circuit board (30) can be attached by the first bonding part (402) and the second bonding part (404). That is, among the four printed circuit boards (30), two printed circuit boards (30) that are separated from each other can be attached respectively.

[0057] Through the above-described embodiment, the present invention can reduce the process time and minimize interference that may occur when attaching the printed circuit board (30).

[0058] The bonding unit (400) may further be provided with a pop-up unit (450) for supporting a TCP (20, Tape Carrier Package) that is positioned on the front of the backup unit (405) and attached to the panel (10), and is spaced at least partially from one side of the panel (10).

[0059] Specifically, referring to FIG. 3, the pop-up unit (450) is positioned on the front of the backup unit (405). The pop-up unit (450) supports one side of the TCP (20) spaced apart from the panel (10). Additionally, the upper surface (451) of the pop-up unit (450) supports the inner surface of the TCP (20) after the suction unit (460), which will be described later, sucks and moves one side of the TCP (20). Accordingly, when the panel (10) and the printed circuit board (30) are combined, the TCP (20) can be prevented from being detached from the backup unit (405).

[0060] When the bonding of the printed circuit board (30) with the TCP (20) by the bonding unit (400) is completed, it may be moved downward so as not to support the TCP (20) any further.

[0061] Meanwhile, a printed circuit board bonding device (1000) according to one embodiment of the present invention may further include a suction unit (460) for separating the TCP (20) from the panel (10). The suction unit (460) can adsorb and move at least a portion of the TCP (20) in contact with the panel (10) so that the TCP (20) is separated from the panel (10).

[0062] Specifically, referring to FIG. 4(a), the suction unit (460) can be moved adjacent to the TCP (20) attached to the panel (10) on one side. Referring to FIG. 4(b), the TCP (20) is adsorbed through the suction hole (462) formed in the suction unit (460). Then, the adsorbed TCP (20) can be moved. Referring to FIG. 4(c), the pop-up unit (450) supports one side of the TCP (20) that has been adsorbed and moved by the suction unit (460).

[0063] The bonding part can attach a printed circuit board (30) to the TCP (20) such that the printed circuit board (30) is attached to the inner surface of the TCP (20) while the TCP (20) is spaced apart from the panel (10), so that the printed circuit board (30) comes into contact with the panel (10). Specifically, referring to FIGS. 3 and 4, the bonding part is configured such that the printed circuit board (30) is attached to the inner surface of the TCP (20), which is the surface that contacts the panel (10).

[0064] Additionally, the bonding portion can be attached to the TCP (20) such that the printed circuit board (30) is positioned further away from the TCP (20) than from one end of the panel (10). Specifically, referring to FIG. 5, the printed circuit board (30) is positioned far away from one end of the panel (10) to which the TCP (20) is attached.

[0065] This type of attachment method can be called reverse bonding. That is, reverse bonding is not a method of attaching a printed circuit board (30) to cover a TCP (20) placed on a panel (10), but rather a method of lifting one end of the TCP (20) and attaching the printed circuit board (30) to the inner surface of the TCP (20).

[0066] This reverse bonding prevents the bond between the TCP (20) and the printed circuit board (30) from detaching due to external force, thereby ensuring a secure attachment between the TCP (20) and the printed circuit board (30). Additionally, by attaching the printed circuit board (30) far from the end of the panel (10), there is an advantage of securing a space for mounting the printed circuit board (30).

[0067] Meanwhile, the panel (10) can be detached from the panel (10) while the panel (10) is attached to the support unit (300).

[0068] Specifically, with reference to FIGS. 1 and 2, the transfer machine may include a first transfer machine (120) that transfers a panel (10) to a support unit (300), and a second transfer machine (130) that receives the panel (10) from the support unit (300) and transports it to the next process.

[0069] The first transfer device (120) moves the panel (10) to a support unit (300) positioned adjacent to the bonding unit (400). The support unit (300) is then attached to the panel (10) that is attached to the first transfer device (120). At this time, the first transfer device (120) can be separated from the panel (10). Then, the first transfer device (120) can return to its original starting position.

[0070] Through this, the first transfer device (120) of the present invention returns to its original position to receive the next panel (10) while the bonding unit (400) is attaching an anisotropic conductive film or a printed circuit board (30) to the panel (10), thereby reducing the time the first transfer device (120) must hold and wait for the panel (10) while the bonding unit (400) is attaching the printed circuit board (30) to the panel (10). In other words, the process time can be reduced.

[0071] However, for reasons such as design, the first transfer unit (120) may support the panel (10) together with the support unit (300) while the bonding unit (400) attaches the anisotropic conductive film or printed circuit board (30).

[0072] FIGS. 6 and 7 are conceptual diagrams for explaining a rotating part (600) and an alignment part (700) in a printed circuit board bonding device (1000) according to an embodiment of the present invention. FIG. 8 is a conceptual diagram for explaining an alignment part (700) that captures an overlapping view of a printed circuit board (30) and a TCP (20) according to an embodiment of the present invention. FIGS. 9a to 9d are conceptual diagrams for explaining the movement direction of the panel (10) and the driving of the alignment part (700) in the alignment part (700) according to an embodiment of the present invention.

[0073] Referring to FIGS. 6 to 8, a printed circuit board bonding device (1000) according to one embodiment of the present invention may further include an alignment part (700).

[0074] The alignment unit (700) can measure the overlapping length of the TCP (20, Tape Carrier Package) attached to the panel (10) and the printed circuit board (30) attached to the TCP (20).

[0075] The alignment unit (700) may include a camera unit configured to capture a screen, and a lighting unit (720) positioned around the camera unit to illuminate the object captured by the camera unit from at least both sides.

[0076] Specifically, referring to FIGS. 6 to 8, a camera unit that photographs an overlapping area of ​​the TCP (20) and the printed circuit board (30) and a lighting unit (720) that illuminates the object being photographed by the camera unit on both sides of the camera unit are arranged.

[0077] Specifically, referring to FIG. 8(a), the connection lines (21) of the TCP (20) and the connection lines (31) of the printed circuit board (30) are arranged to overlap each other. Referring to FIG. 8(b), the overlapping portion of the TCP (20) and the printed circuit board (30) is photographed using a camera unit. At this time, a lighting unit (720) may be arranged surrounding the camera unit.

[0078] Referring to FIG. 8 (c), the degree of overlap between the connection lines (21) of the TCP (20) and the connection lines (31) of the printed circuit board (30), captured by the camera unit, is shown. The camera unit and / or the control unit can determine the degree of alignment between the TCP (20) and the printed circuit board (30) through this information.

[0079] Specifically, referring to (c) of FIG. 8, the gap between the connection line (21) of TCP (20) and the connection line (21) of the next TCP (20) can be denoted as a. And, the gap between the connection line (31) of the printed circuit board (30) and the connection line (31) of the next printed circuit board (30) can be denoted as b.

[0080] Additionally, the non-overlapping distance between the connection line (21) of the TCP (20) and the connection line (31) of the printed circuit board (30) can be denoted as c. At this time, by determining the length of distance a and the length of distance b, it can be determined that the alignment between the TCP (20) and the printed circuit board (30) satisfies a certain level when distance a and distance b are maintained at a constant level within the error range and the non-overlapping distance c is below a certain level.

[0081] However, the camera unit or the control unit may determine that the alignment between the TCP (20) and the printed circuit board (30) is not within the normal range and may determine that it is defective if the distance a or distance b is not constant and changes, or if the distance c is at a certain level, for example, greater than 1 / 3 of the distance a or distance b.

[0082] Additionally, the alignment unit (700) is positioned in a direction perpendicular to the direction in which the material is moved, and may further include a rotating unit (600) that adsorbs the panel (10) and rotates it horizontally so that the connection portion between the TCP (20) of the panel (10) and the printed circuit board (30) can easily access the alignment unit (700).

[0083] Specifically, as illustrated in FIG. 6, the panel (10) is transported by a transfer machine in a vertically positioned state. However, in the vertically positioned state, it is difficult to accurately photograph the overlapping area of ​​the TCP (20) and the printed circuit board (30). Therefore, the panel (10) must be changed to a horizontally positioned state. Accordingly, the alignment unit (700) can be positioned to photograph the horizontally positioned panel (10).

[0084] At this time, the panel (10) can be rotated approximately 90 degrees by the rotation unit (600). Referring to FIG. 7, the overlapping area of ​​the TCP (20) and the printed circuit board (30) of the panel (10) can be positioned so that it is easy to photograph by the alignment unit (700). At this time, the alignment unit (700) can press the overlapping area of ​​the TCP (20) and the printed circuit board (30). Specifically, the alignment unit (700) can press the panel (10) to measure the alignment of the overlapping area of ​​the TCP (20) and the printed circuit board (30).

[0085] The alignment unit (700) according to one embodiment of the present invention has the effect of obtaining a clear image of the portion where the TCP (20) and the printed circuit board (30) overlap each other by the illumination surrounding the camera unit.

[0086] Meanwhile, the alignment unit (700) may be provided in two or more. For example, referring to FIG. 9 (a), the alignment unit (700) may include a first alignment unit (702) and a second alignment unit (704) capable of inspecting the first printed circuit board (30) and the third printed circuit board (30) from the left, respectively, among the four printed circuit boards (30) attached to the panel (10). Since the alignment unit (700) is provided in multiple numbers, it can quickly inspect the overlapping area of ​​multiple printed circuit boards (30) and TCP (20), thereby having the advantage of reducing the time required for inspection.

[0087] Referring to FIGS. 9a to 9d, the method of the alignment unit (700) inspecting the overlapping area of ​​the TCP (20) and the printed circuit board (30) is described as follows.

[0088] In FIG. 9a, the panel (10) approaches the alignment section (700) while standing upright in a vertical direction. Referring to FIG. 9b, the panel (10) is rotated toward the alignment section (700) by the rotation section (600). At this time, the distance between the alignment section (700) and the panel (10) can be reduced as the panel (10) rises or the alignment section (700) descends.

[0089] At this time, the alignment unit (700) that has inspected the first and third printed circuit boards (30) can move its position to inspect the second and fourth printed circuit boards (30). Accordingly, the time required for the alignment unit (700) to inspect the overlapping area of ​​the printed circuit boards (30) and TCP (20) can be shortened.

[0090] Referring to FIG. 9c, the panel (10) that has been inspected by the alignment unit (700) can be moved to the right to rotate it vertically again. And, referring to FIG. 9d, the panel (10) that has been inspected can be moved vertically and moved to the next process.

[0091] According to one embodiment of the present invention, the alignment unit (700) is provided in multiple units, which has the effect of quickly performing inspection of a large area and multiple printed circuit boards (30). Furthermore, the alignment unit (700) is provided with an illumination unit (720) so that clearer and more accurate inspection results can be obtained.

[0092] Additionally, the panel (10) that was positioned vertically can be moved horizontally by the rotating part (600) so that inspection can be performed more easily by the alignment part (700). The panel (10) that has finished inspection can be rotated vertically again so that it can be easily moved to the next process.

[0093] The above-described invention may be implemented as computer-readable code on a medium on which a program is recorded. A computer-readable medium includes all types of recording devices in which data that can be read by a computer system is stored. Examples of computer-readable media include HDD (Hard Disk Drive), SSD (Solid State Disk), SSD (Silicon Disk Drive), ROM, RAM, CD-ROM, magnetic tape, floppy disk, optical data storage device, etc., and also include implementation in the form of a carrier wave (e.g., transmission via the Internet). Furthermore, the computer may include a control unit (100) of a printed circuit board bonding device (10) according to an embodiment of the present invention. Accordingly, the above detailed description should not be interpreted restrictively in all respects and should be considered exemplary. The scope of the present invention should be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the present invention are included within the scope of the present invention.

Claims

Claim 1 A printed circuit board bonding device comprising: a plurality of transfer devices equipped with a plurality of transfer devices for adsorbing and moving a panel; a bonding unit including a first bonding unit for attaching an object capable of electrically communicating with the TCP (Tape Carrier Package) of the panel transmitted from the transfer device and an anisotropic conductive film, and a second bonding unit for attaching a printed circuit board; a support unit positioned opposite the transfer device with the panel as the center and adsorbing and supporting the panel during the process in which the bonding unit attaches the anisotropic conductive film or the printed circuit board to the panel; an alignment unit positioned facing a direction perpendicular to the direction in which the transfer device moves and for measuring the overlapping length of the TCP attached to the panel and the printed circuit board attached to the TCP; and a rotating unit for adsorbing the panel and rotating it horizontally so that the connection portion between the TCP of the panel and the printed circuit board can easily approach the alignment unit, wherein the alignment unit measures the non-overlapping distance between the connection line of the TCP and the connection line of the printed circuit board. Claim 2 A printed circuit board bonding device according to claim 1, wherein the bonding unit comprises a bonding portion, and the bonding portion comprises a backup portion on which the anisotropic conductive film or printed circuit board is disposed; and a pressing portion for pressing the anisotropic conductive film or printed circuit board from the top. Claim 3 In paragraph 2, the bonding unit comprises two or more bonding portions, forming a printed circuit board bonding device. Claim 4 A printed circuit board bonding device according to paragraph 3, wherein the two or more bonding parts are spaced apart from each other by a distance greater than the length of the printed circuit board disposed in the backup part. Claim 5 A printed circuit board bonding device according to paragraph 2, wherein the bonding unit further comprises a pop-up unit for supporting a TCP (Tape Carrier Package) that is positioned on the front of the backup unit, attached to the panel, and spaced apart from at least a portion of one side of the panel. Claim 6 In claim 5, the bonding part is a printed circuit board bonding device that attaches the printed circuit board to the TCP such that the printed circuit board is attached to the inner surface of the TCP while the TCP is spaced apart from the panel, and the printed circuit board comes into contact with the panel. Claim 7 In claim 6, the bonding portion is a printed circuit board bonding device that attaches the printed circuit board to the TCP such that it is positioned further away from one end of the panel than the TCP. Claim 8 A printed circuit board bonding device according to claim 5, further comprising a suction unit that adsorbs and moves at least a portion of the TCP in contact with the panel so that the TCP is separated from the panel. Claim 9 In claim 1, the above-mentioned release device is a printed circuit board bonding device that is separated from the panel while the panel is attached to the support unit. Claim 10 A printed circuit board bonding device according to claim 9, wherein the transfer device comprises: a first transfer device for transferring the panel to the support unit; and a second transfer device for receiving the panel from the support unit and transporting it to the next process. Claim 11 delete Claim 12 delete Claim 13 A printed circuit board bonding device according to claim 1, wherein the alignment unit comprises: a camera unit configured to capture a screen; and a lighting unit disposed around the camera unit configured to illuminate the object captured by the camera unit from at least both sides. Claim 14 A printed circuit board bonding device according to claim 1, wherein the transfer device comprises a tilting part for adjusting the angle of the panel relative to a reference plane.

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