Novel diamine compounds, polyamide polymer and polybenzooxazole formed therefrom

A novel diamine compound facilitates the synthesis of a polyamide polymer that is converted into polybenzoxazole at lower temperatures, addressing degradation issues and enhancing flexibility and heat resistance, suitable for semiconductor and flexible substrate applications.

KR102992674B1Active Publication Date: 2026-07-21한인정밀화학(주) +1
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Patent Information

Application Number
KR1020230063676
Authority / Receiving Office
KR · KR
Patent Type
Patents
Current Assignee / Owner
Priority Date
2022-05-23
Filing Date
2023-05-17
Publication Date
2026-07-21
Estimated Expiration
2043-05-17

AI Technical Summary

Technical Problem

Existing polybenzoxazole manufacturing processes face issues with degradation at high temperatures and incomplete cyclization, leading to reduced moisture resistance and corrosion resistance, and there is a need for a polybenzoxazole film with improved flexibility and heat resistance.

Method used

A novel diamine compound is used to synthesize a polyamide polymer, which is then converted into polybenzoxazole at lower temperatures, avoiding degradation and enhancing flexibility and heat resistance through structural units that suppress charge transfer complexes and reduce crystallinity.

Benefits of technology

The process results in a polybenzoxazole film with improved optical properties, dielectric constant, and heat resistance, suitable for applications in semiconductor devices and flexible substrates.

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Abstract

A diamine compound represented by the following chemical formula 1 is provided. Additionally, a polyamide comprising a structural unit derived from the diamine compound is provided. Additionally, a polybenzoxazole and a polybenzoxazole film formed from the polyamide are provided. [Chemical Formula 1]
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Citation Information

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