Substrate transfer device, substrate processing system and method of controlling substrate transfer

Abstract

A lifting robot assembly according to one aspect of the present invention comprises: a robot module for carrying and moving an object; a lifting drive unit extending in a vertical direction and rotatably coupled to the robot module to lift the robot module by rotational drive; a motor unit coupled to the lifting drive unit to rotate the lifting drive unit; a rotational sensing unit for monitoring the rotational speed of the lifting drive unit; a brake unit for braking the rotation of the lifting drive unit; and a control unit that controls the operation of the brake unit to prevent abnormal falling of the robot module when it is determined from data related to the rotational speed of the lifting drive unit received from the rotational sensing unit that the rotational speed of the lifting drive unit exceeds a preset reference rotational speed.

Description

Technology Field

[0001] The present invention relates to semiconductor equipment, and more specifically, to a substrate transfer device and a substrate processing system including the same. Background Technology

[0002] To manufacture semiconductor devices, various substrate processing is performed in substrate processing systems. For example, in a batch-type substrate processing system, a boat section in which substrates are stacked is placed within a process tube, and a process of simultaneously depositing a thin film on the substrates can be carried out.

[0003] In this substrate processing system, substrates within the boat are transported using a substrate transfer robot. The substrate transfer robot can pick up substrates placed in each slot within the boat based on information regarding previously stored teaching positions. However, when the substrates within the boat undergo a heat treatment step or when a thin film is deposited on the substrates, warping may occur in the substrates within the boat. As shown in Fig. 8a, there is almost no positional deviation between the substrates according to the slots within the boat before heating, but as shown in Fig. 8b, it can be seen that after heating, the positional deviation between the substrates within the boat is large due to the warping of the substrates.

[0004] When substrates bend in this manner, positional deviations between them increase, and collisions may occur between the robot arm and the substrates when the substrate transfer robot picks them up. Such collisions can cause substrate breakage or defects, such as scratches, thereby reducing process yield. The problem to be solved

[0005] The objective of the present invention is to solve various problems, including those mentioned above, and to provide a substrate transfer device capable of improving process reliability by preventing substrate collisions during substrate transfer by a substrate transfer robot, a substrate processing system including the same, or a substrate transfer method. However, this objective is exemplary and does not limit the scope of the present invention. means of solving the problem

[0006] A substrate transfer device according to one aspect of the present invention for solving the above problem comprises a substrate transfer robot for transferring substrates from a boat portion on which substrates are placed on slots, a substrate mapping unit for obtaining position information of the substrates placed on the slots, and a control unit for calculating position deviation values ​​of the substrates on the slots by comparing the position information of the substrates obtained from the substrate mapping unit with previously stored reference position information, and determining whether to correct the teaching position of the substrate transfer robot based on the position deviation values.

[0007] In the above substrate transfer device, the substrate mapping unit includes a pair of arms extending from the substrate transfer robot in the direction of the boat unit, and a sensor unit including a light-emitting sensor and a light-receiving sensor installed facing each other on the pair of arms, and the substrate mapping unit can measure the mounting position information of the substrates mounted on the slots through the sensor unit while vertically scanning the slots.

[0008] In the above-described substrate transfer device, the control unit can correct the teaching position of the substrate transfer robot based on the position deviation values ​​when the position deviation values ​​are smaller than or equal to a preset maximum correction position deviation value.

[0009] In the above-described substrate transfer device, the control unit can generate an alarm when the position deviation values ​​are greater than a preset maximum correction position deviation value.

[0010] In the above-described substrate transfer device, the control unit can correct the teaching position of the substrate transfer robot based on the position deviation values ​​when the position deviation values ​​are greater than or equal to a preset reference position deviation value.

[0011] In the above substrate transfer device, the substrate transfer robot sequentially groups the slots into a predetermined number and divides them into multiple groups, and simultaneously transfers the substrates placed on the slots of each group, and the control unit can determine whether to collectively correct the teaching position of the substrate transfer robot for the slots of each group based on the maximum position deviation value among the position deviation values ​​of the substrates placed on the slots of each group.

[0012] In the above substrate transfer device, the substrate mapping unit obtains the seating position information for the substrates for which the process is completed within the boat unit, and the control unit can determine whether to correct the teaching position of the substrate transfer robot when unloading the substrates from the boat unit.

[0013] In the above substrate transfer device, the control unit may include a position deviation generation unit that calculates position deviation values ​​on the slots of the substrates by comparing the seating position information of the substrates obtained from the substrate mapping unit with previously stored reference position information, and a correction determination unit that determines whether to correct the teaching position of the substrate transfer robot based on the position deviation values ​​obtained from the position deviation generation unit.

[0014] In the above-described substrate transfer device, the correction determination unit corrects the teaching position of the substrate transfer robot based on the position deviation values ​​when the position deviation values ​​are greater than or equal to a preset reference position deviation value and less than or equal to a preset maximum correction position deviation value, and the control unit may include an alarm generating unit that generates an alarm when the position deviation values ​​are greater than the maximum correction position deviation value.

[0015] A substrate processing system according to another aspect of the present invention for solving the above problem may include a boat section having slots on which substrates can be placed, a process tube capable of receiving the boat section and processing the substrates stacked within the boat section, and the aforementioned substrate transfer device.

[0016] A substrate transfer control method according to another aspect of the present invention for solving the above problem comprises: a step of obtaining seating position information of substrates placed on slots of a boat unit using a substrate mapping unit; a step of calculating position deviation values ​​on the slots of the substrates by comparing the seating position information of the substrates obtained from the substrate mapping unit with previously stored reference position information; and a step of determining whether to correct the teaching position of a substrate transfer robot for transferring the substrates from the boat unit based on the position deviation values.

[0017] The above substrate transfer control method may include a step of correcting the teaching position of the substrate transfer robot based on the position deviation values ​​when the position deviation values ​​are smaller than or equal to a preset maximum correction position deviation value. Effects of the invention

[0018] According to the substrate transfer device, substrate transfer control method, and substrate processing device of some embodiments of the present invention as described above, process reliability can be improved by preventing substrate collisions during substrate transfer by a substrate transfer robot. Of course, the scope of the present invention is not limited by this effect. Brief explanation of the drawing

[0019] FIG. 1 is a schematic cross-sectional view showing a substrate transfer device according to one embodiment of the present invention. Figure 2 is a schematic plan view showing an enlarged view of the substrate mapping section of the substrate transfer device of Figure 1. FIG. 3 is a schematic plan view showing a modified example of the substrate mapping section of FIG. 2. Figure 4 is a schematic block diagram showing an example of the control unit of Figure 1. FIG. 5 is a flowchart showing a substrate transfer control method according to another embodiment of the present invention. FIG. 6a is a schematic cross-sectional view showing a substrate unloading operation using a substrate transfer device when no bending occurs in the substrates, FIG. 6b is a schematic cross-sectional view showing a substrate unloading operation using a substrate transfer device when bending occurs in the substrates, and FIG. 6c is a schematic cross-sectional view showing a substrate unloading operation through teaching position correction of the substrate transfer device when bending occurs in the substrates. FIG. 7 is a schematic cross-sectional view showing a substrate processing system according to another embodiment of the present invention. Figures 8a and 8b are graphs showing the positional deviations of substrates before and after heating of the boat section in a conventional substrate processing system, respectively. Specific details for implementing the invention

[0020] Hereinafter, several preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0021] The embodiments of the present invention are provided to more fully explain the invention to those skilled in the art, and the following embodiments may be modified in various different forms, and the scope of the invention is not limited to the following embodiments. Rather, these embodiments are provided to make the disclosure more faithful and complete and to fully convey the spirit of the invention to those skilled in the art. In addition, the thickness or size of each layer in the drawings is exaggerated for convenience and clarity of explanation.

[0022] FIG. 1 is a schematic cross-sectional view showing a substrate transfer device (100) according to one embodiment of the present invention, and FIG. 2 is a schematic plan view showing an enlarged view of a substrate mapping unit (130) in the substrate transfer device (100) of FIG. 1.

[0023] Referring to FIGS. 1 and 2, the substrate transfer device (100) may include a substrate transfer robot (110), a substrate mapping unit (130), and a control unit (150).

[0024] A substrate transfer robot (110) may be provided to transfer substrates (S) from a boat section (242). For example, substrates (S) may be stacked vertically in the boat section (242), and the substrate transfer robot (110) may be used to load substrates (S) into the boat section (242) or to unload and transfer substrates (S) from the boat section (242). Slots (243) may be arranged vertically within the boat section (242), and substrates (S) may be placed on these slots (243).

[0025] In some embodiments, the substrate transfer robot (110) may include a lifting axis (116), a body part (112), an arm part (113), and at least one end effector (114). The lifting axis (116) may be positioned vertically to correspond to the boat part (242) and may be rotated for changing direction. The body part (112) may be vertically lifted along the lifting axis (116) or rotated together with the lifting axis (116). The arm part (113) may be flexibly coupled to the body part (112). For example, while coupled to the body part (112), the arm part (113) may advance or retract toward the boat part (242) in various ways, such as horizontal movement or joint movement.

[0026] The end effector (114) is a component for picking up substrates (S) and can be coupled to the arm (112) and moved together with the arm (112). The end effector (114) may be provided as one or multiple units. When a set of end effectors (114) is vertically arranged and coupled to the arm (112), multiple substrates (S) can be transported in a single pickup operation. In this case, the substrate transport robot (110) can sequentially group the slots (243) into a predetermined number and divide them into multiple groups, and simultaneously transport the substrates (S) placed on the slots (243) of each group. Meanwhile, as shown in FIGS. 6a to 6c, a set of end effectors (114) and one end effector (114a) may be separately installed in the body (112) or the arm (113).

[0027] A substrate mapping unit (130) may be provided to obtain mounting position information (see SP in FIG. 6c) of substrates (S) mounted on slots (243) within the boat unit (242). The substrate mapping unit (130) may measure whether the substrates (S) are mounted and / or the mounting position information while moving vertically along the boat unit (242). For example, the substrate mapping unit (130) may detect position or thickness information of the substrates (S) in an optical manner.

[0028] More specifically, as illustrated in FIG. 2, the substrate mapping unit (130) may include a pair of arms (132a, 132b) extending from the substrate transfer robot (110) toward the boat unit (242), and a sensor unit (134) comprising a light-emitting sensor (134a) and a light-receiving sensor (134b) respectively installed facing each other on the pair of arms (132a, 132b). For example, the light-emitting sensor (134a) may include a light source for irradiating light, and the light-receiving sensor (134b) may include a photodetector for receiving light. Thus, while the light-emitting sensor (134a) is irradiating light, the substrates (S) can be detected through whether the light-receiving sensor (134b) receives light. Furthermore, by continuing measurements while moving the sensor unit (134) vertically, additional information regarding the thickness, warping, or seating state of the substrates (S) can be obtained.

[0029] When substrate mapping is required, the substrate mapping unit (130) can position the arms (132a, 132b) toward the boat unit (242) and, while scanning the slots (243) vertically, measure the mounting position information (SP) of the substrates (S) mounted on the slots (243) through the sensor unit (134). For example, as the body unit (112) moves vertically along the lifting axis (116), the substrate mapping unit (130) can vertically scan the slots (243) of the boat unit (242). This mounting position information (SP) can be obtained for each slot (243), and thus the mounting position information (SP) of the substrates (S) in the slots (243) can be obtained respectively.

[0030] In some embodiments, as shown in FIG. 3, a pair of arms (132a, 132b) in the substrate mapping unit (130a) may be installed at both ends of the end effector (114). Thus, the arms (132a, 132b) move in conjunction with the end effector (114), and when substrate mapping is required, the sensor unit (134) can be operated to perform the substrate mapping operation.

[0031] The control unit (150) can determine whether to correct the transfer position of the substrate transfer robot (110) based on the seating state of the substrates (S) within the boat section (242). For example, if the substrates (S) are bent due to thermal deformation or thin film stress after the process, the control unit can determine whether to correct the transfer position of the substrate transfer robot (110) by considering the degree of bending of the substrates (S). Considering this function, the control unit (150) may be called a transfer position correction unit.

[0032] In some embodiments, the control unit (150) may be the main control unit of the substrate transfer device (110). In this case, the control unit (150) may control the overall operation of the substrate transfer device (110) and further determine whether to correct the transfer position of the substrate transfer robot (110). In this case, the aforementioned transfer position correction unit may be provided as a single function block within the control unit (150).

[0033] The configuration and function of the control unit (150) will be explained in more detail below.

[0034] FIG. 6a is a schematic cross-sectional view showing a substrate unloading operation using a substrate transfer device when no bending occurs in the substrates, FIG. 6b is a schematic cross-sectional view showing a substrate unloading operation using a substrate transfer device when bending occurs in the substrates, and FIG. 6c is a schematic cross-sectional view showing a substrate unloading operation through teaching position correction of the substrate transfer device when bending occurs in the substrates.

[0035] Referring to FIGS. 1 and FIG. 6a, the substrate transfer robot (110) stores information regarding a predetermined position, i.e., a teaching position (TP), below each slot (243) to pick up substrates (S) placed on the slots (243) within the boat section (242). For example, the substrate transfer robot (110) can be used to manually load substrates (S) into several slots (243) within the boat section (242), such as the lowest slot (243) and the highest slot (243), and the teaching position (TP) for all slots (243) can be calculated from the corresponding position information. Thus, the teaching position (TP) may be information regarding the height at which the end effectors (114, 114a) of the substrate transfer robot (110) enter between the slots (243) to pick up or load the substrates (S).

[0036] As illustrated in FIG. 6a, when no bending occurs in the substrates (S), the substrates (S) can be seated in a normal position on the slots (243) within the boat section (242). The position information of these substrates (S) can be stored as reference position information (RP). For example, the position information for these substrates (S) can be measured in the substrate mapping section (130) and stored as reference position information (RP). As another example, the reference position information (RP) may be obtained by measuring the position information for the substrates (S) for a plurality of boat sections (242) in which normal substrates (S) are stacked and averaging the values. As yet another example, the reference position information (RP) may be calculated from the height of the slots (243) of the boat section (242) and the thickness information of the substrates (S).

[0037] Therefore, if no bending occurs in the substrates (S), the substrates (S) can be picked up and unloaded by the substrate transfer robot (110) using the previously stored teaching position (TP) of the substrate transfer robot (110).

[0038] However, as illustrated in FIG. 6b, when the substrates (S) are bent, depending on the degree of bending, when the substrate transfer robot (110) picks up the substrates (S) using a stored teaching position (TP), a collision or scratch may occur between the substrate transfer robot (110), such as an end effector (114, 114a), and the substrates (S). Therefore, it is necessary to correct the stored teaching position (TP) of the substrate transfer robot (110) by taking into account the degree of bending of the substrates (S).

[0039] Referring to FIG. 1 and FIG. 6c, when bending occurs in the substrates (S), it is necessary to determine whether to correct the teaching position (TP) of the substrate transfer robot (110) and correct the teaching position (TP) according to the result.

[0040] For example, the control unit (150) can compare the mounting position information (SP) of the substrates (S) obtained from the substrate mapping unit (130) with the previously stored reference position information (RP) to calculate position deviation values ​​(OS1) on the slots (243) of the substrates (S) and determine whether to correct the teaching position (TP) of the substrate transfer robot (110) based on these position deviation values ​​(OS1).

[0041] In some embodiments, the control unit (150) can correct the teaching position (TP) of the substrate transfer robot (110) based on the position deviation values ​​(OS1) when the position deviation values ​​(OS1) are less than or equal to a preset maximum correction position deviation value. By setting the maximum correction position deviation value in this way, it is possible to prevent the substrate transfer robot (110) from colliding with another substrate (S) adjacent to the substrate (S) to be picked up due to excessive correction of the teaching position (TP). For example, the maximum correction position deviation value may be smaller than the distance between adjacent slots (243) within the boat unit (242) or the distance between substrates (S) seated within adjacent slots (243).

[0042] Optionally, the control unit (150) may generate an alarm if the position deviation values ​​(OS1) are greater than a preset maximum correction position deviation value. For example, if an alarm is generated by the control unit (150), the transfer operation of the substrate transfer robot (110) may be stopped.

[0043] In some embodiments, the control unit (150) can correct the teaching position (TP) of the substrate transfer robot (110) based on the position deviation values ​​(OS1) when the position deviation values ​​(OS1) are greater than or equal to a preset reference position deviation value. This setting of the reference position deviation value, i.e., the minimum corrected position deviation value, is because there is no need to correct the teaching position (TP) when the position deviation values ​​(OS1) are too small. For example, the reference position deviation value may be smaller than the distance between the end effector (114, 114a) and the substrate (S) when the end effector (114, 114a) is positioned at the preset teaching position (TP) without position deviation. However, the setting of this reference position deviation value is optional.

[0044] In some embodiments, the control unit (150) can correct the teaching position (TP) of the substrate transfer robot (110) based on the position deviation values ​​(OS1) when the position deviation values ​​(OS1) are greater than or equal to a preset reference position deviation value and less than or equal to a preset maximum correction position deviation value. In this case, the control unit (150) can correct the teaching position (TP) of the substrate transfer robot (110) only when the position deviation values ​​(OS1) are within the aforementioned predetermined range.

[0045] Meanwhile, FIGS. 6a to 6c illustrate an operation of picking up a single substrate (S) using a single end effector (114a), but as illustrated in FIG. 1, a set of end effectors (114) may pick up the substrates (S) placed on the slots (243) belonging to each group at once. In this case, the control unit (150) may determine whether to correct the teaching position (TP) of the substrate transfer robot (110) for each group of slots (243) collectively based on the maximum position deviation value among the position deviation values ​​(OS1) of the substrates (S) placed on the slots (243) of each group. The determination of whether to correct the teaching position (TP) may be based on the substrate (S) with the greatest bend among the substrates (S) placed on the slots (243) of each group.

[0046] As described above, when the control unit (150) determines that the teaching position (TP) requires correction, it can offset the teaching position (TP) based on position deviation values ​​(OS1). For example, the offset value (OS2) of the teaching position (TP) for the slots (243) can be set to be equal to the position deviation values ​​(OS1) or proportional to the position deviation values ​​(OS1). The teaching position (TP) after correction can be set by adding the offset value (OS2) to the teaching position (TP) before correction.

[0047] FIG. 4 is a schematic block diagram showing an example of the control unit (150) of FIG. 1.

[0048] Referring to FIG. 4, the control unit (150) may include a position deviation generating unit (152) and a correction judgment unit (154).

[0049] For example, the position deviation generation unit (152) can calculate position deviation values ​​(OS1) on the slots (243) of the substrates (S) by comparing the seating position information (SP) of the substrates (S) obtained from the substrate mapping unit (130) with the previously stored reference position information (RP). The correction judgment unit (154) can determine whether to correct the teaching position (TP) of the substrate transfer robot (110) based on the position deviation values ​​(OS1) obtained from the position deviation generation unit (152).

[0050] Optionally, the control unit (150) may further include an alarm generating unit (156) and / or an offset value generating unit (158). The alarm generating unit (156) may generate an alarm when the position deviation values ​​(OS1) are greater than the maximum corrected position deviation value. The offset value generating unit (158) may generate an offset value of the teaching position (TP) based on the position deviation values ​​(OS1) when the correction judgment unit (154) determines that correction is necessary.

[0051] Below, a substrate transfer control method using a substrate transfer device (100) is described.

[0052] FIG. 5 is a flowchart showing a substrate transfer control method according to another embodiment of the present invention.

[0053] Referring to FIGS. 1 and FIGS. 5, the substrate transfer control method may include a step (S10) of obtaining mounting position information (SP) of substrates (S) mounted on slots (243) of a boat unit (242) using a substrate mapping unit (130); a step (S20) of calculating position deviation values ​​(OS1) on the slots (243) of substrates (S) by comparing the mounting position information (SP) of substrates (S) obtained from the substrate mapping unit (130) with previously stored reference position information (RP); and a step (S30) of determining whether to correct the teaching position (TP) of a substrate transfer robot (110) for transferring substrates (S) from the boat unit (242) based on the position deviation values ​​(OS1).

[0054] Furthermore, the substrate transfer control method may further include a step (S40) of correcting the teaching position (TP) of the substrate transfer robot (110) based on the position deviation values ​​(OS1) when the position deviation values ​​(OS1) are less than or equal to a preset maximum correction position deviation value. Optionally, in this correction step (S40), the teaching position (TP) of the substrate transfer robot (110) may be corrected based on the position deviation values ​​(OS1) when the position deviation values ​​(OS1) are greater than or equal to a preset reference position deviation value and less than or equal to a preset maximum correction position deviation value.

[0055] Additionally, the substrate transfer control method may further include a step of generating an alarm if the position deviation values ​​(OS1) are greater than a preset maximum correction position deviation value after the step of determining whether to correct (S30).

[0056] According to the aforementioned substrate transfer device (100) and substrate transfer control method, when deformation such as bending occurs in the substrates (S) within the boat section (242), the substrate mapping section (130) and the control section (150) are used to generate position deviation values ​​(OS1) of the substrates (S), and based on this, the teaching position (TP) of the substrate transfer robot (110) is determined to be corrected, and an offset value is generated to perform the correction. Accordingly, it is possible to prevent the substrate transfer robot (110) and the substrate (S) from colliding or coming into contact due to the bending of the substrates (S), and as a result, process reliability can be improved.

[0057] FIG. 7 is a schematic cross-sectional view showing a substrate processing system (200) according to another embodiment of the present invention.

[0058] Referring to FIG. 7, the substrate processing system (200) may include a boat section (242), a process tube (244), and a substrate transfer device (234).

[0059] The boat section (242) may include slots (243) on which substrates (S) can be seated, as illustrated in FIG. 1. A process tube (244) may accommodate the boat section (242) and provide a reaction space for processing substrates (S) stacked within the boat section (242). A substrate transfer device (234) may transfer substrates (S) by loading or unloading them into or out of the boat section (242). For example, the substrate transfer device (234) may be identical to the substrate transfer device (100) of FIG. 1, and thus may refer to the descriptions of FIG. 1 to 5 and FIG. 6a to 6c mentioned above.

[0060] In some embodiments, the substrate processing system (200) may include a load port section (210), a container transfer section (220), a substrate transfer section (230), and a substrate processing section (240).

[0061] A substrate receiving container (50) can be placed in the load port section (210). In the container transfer section (220), shelves (222) on which the substrate receiving container (50) can be placed are formed, and a container transfer robot device (224) capable of transferring the substrate receiving container (50) can be arranged. The container transfer robot device (224) can move the substrate receiving container (50) from the load port section (210) to the shelves (222).

[0062] A substrate transfer unit (230) is positioned adjacent to a container transfer unit (220), and a substrate transfer device (234) may be positioned in the substrate transfer unit (230). The substrate transfer device (234) can transfer substrates (S) from a substrate receiving container (50) within the container transfer unit (220) to a boat unit (242) through a door unit (232), or transfer substrates (S) from a boat unit (242) to a substrate receiving container (50) within the container transfer unit (220) through a door unit (232).

[0063] The substrate processing unit (240) may include a boat unit (242) in which substrates (S) are stacked, and a process tube (244) capable of receiving the boat unit (242) to process the substrates (S). When the substrates (S) in the boat unit (242) are loaded, the boat unit (242) may be raised and placed within the process tube (244). Process gases may be injected from the process tube (244) to deposit a thin film on the substrates (S).

[0064] This substrate processing system (200) represents an example of a batch deposition system capable of processing multiple substrates (S) at once.

[0065] In the substrate processing system (200), the control unit (150) in the substrate transfer device (100) may be a transfer position correction unit in the substrate transfer device (100) or may be a part block of the central processing unit in the substrate processing system (200).

[0066] According to the substrate processing system (200), when the heat treatment or deposition process for the substrates (S) is completed, the position information of the substrates (S) is measured to perform correction on the teaching position (TP) of the substrate transfer robot (110), thereby preventing collision between the substrate transfer robot (110) and the substrates (S) even when the substrates (S) are bent due to thermal deformation, etc.

[0067] The present invention has been described with reference to the embodiments illustrated in the drawings, but this is merely illustrative, and those skilled in the art will understand that various modifications and equivalent alternative embodiments are possible therefrom. Accordingly, the true technical scope of protection of the present invention should be determined by the technical spirit of the appended claims. Explanation of the symbols

[0068] 100: Substrate transfer device 110: Substrate Transfer Robot 112: Body part 114: End Effector 130: Board mapping section 150: Control unit 200: Substrate processing system 242: Boat Department 234: Substrate transfer device 244: Process Tube

Claims

Claim 1 A substrate transfer device comprising: a substrate transfer robot for transferring substrates from a boat section on which substrates are placed on slots; a substrate mapping unit for obtaining placement position information of the substrates placed on the slots; and a control unit that calculates position deviation values ​​of the substrates on the slots by comparing the placement position information of the substrates obtained from the substrate mapping unit with previously stored reference position information and determines whether to correct the teaching position of the substrate transfer robot based on the position deviation values, wherein the substrate mapping unit obtains the placement position information for the substrates on which the process is completed within the boat section, and the control unit determines the degree of warping caused by heating of the substrates based on the position deviation values ​​and determines whether to correct the teaching position of the substrate transfer robot when unloading the substrates from the boat section. Claim 2 A substrate transfer device according to claim 1, wherein the substrate mapping unit comprises: a pair of arms extending from the substrate transfer robot in the direction of the boat unit; and a sensor unit including a light-emitting sensor and a light-receiving sensor respectively installed facing each other on the pair of arms, and wherein the substrate mapping unit measures the mounting position information of the substrates mounted on the slots through the sensor unit while vertically scanning the slots. Claim 3 A substrate transfer device according to claim 1, wherein the control unit corrects the teaching position of the substrate transfer robot based on the position deviation values ​​when the position deviation values ​​are smaller than or equal to a preset maximum correction position deviation value. Claim 4 In claim 3, the control unit generates an alarm when the position deviation values ​​are greater than a preset maximum correction position deviation value, in a substrate transfer device. Claim 5 A substrate transfer device according to claim 1, wherein the control unit corrects the teaching position of the substrate transfer robot based on the position deviation values ​​when the position deviation values ​​are greater than or equal to a preset reference position deviation value. Claim 6 A substrate transfer device comprising: a substrate transfer robot for transferring substrates from a boat portion on which substrates are placed on slots; a substrate mapping unit for obtaining placement position information of the substrates placed on the slots; and a control unit that calculates position deviation values ​​of the substrates on the slots by comparing the placement position information of the substrates obtained from the substrate mapping unit with previously stored reference position information and determines whether to correct the teaching position of the substrate transfer robot based on the position deviation values, wherein the substrate transfer robot sequentially groups the slots into a predetermined number and divides them into a plurality of groups, and simultaneously transfers the substrates placed on the slots of each group, and the control unit determines whether to correct the teaching position of the substrate transfer robot for the slots of each group collectively based on the maximum position deviation value among the position deviation values ​​of the substrates placed on the slots of each group. Claim 7 delete Claim 8 A substrate transfer device according to claim 1, wherein the control unit comprises: a position deviation generating unit that calculates position deviation values ​​on the slots of the substrates by comparing the seating position information of the substrates obtained from the substrate mapping unit with previously stored reference position information; and a correction determining unit that determines whether to correct the teaching position of the substrate transfer robot based on the position deviation values ​​obtained from the position deviation generating unit. Claim 9 In claim 8, the correction judgment unit corrects the teaching position of the substrate transfer robot based on the position deviation values ​​when the position deviation values ​​are greater than or equal to a preset reference position deviation value and less than or equal to a preset maximum correction position deviation value, and the control unit includes an alarm generating unit that generates an alarm when the position deviation values ​​are greater than the maximum correction position deviation value. Claim 10 A substrate processing system comprising: a boat portion including slots on which substrates can be seated; a process tube capable of receiving the boat portion and processing the substrates stacked within the boat portion; and a substrate transfer device according to any one of claims 1 to 6, 8, and 9. Claim 11 A substrate transfer control method comprising: a step of obtaining mounting position information of substrates mounted on slots of a boat unit using a substrate mapping unit; a step of calculating position deviation values ​​on the slots of the substrates by comparing the mounting position information of the substrates obtained from the substrate mapping unit with previously stored reference position information; and a step of determining whether to correct the teaching position of a substrate transfer robot for transferring the substrates from the boat unit based on the position deviation values, wherein in the step of obtaining mounting position information of the substrates, the substrate mapping unit obtains the mounting position information for the substrates for which the process is completed within the boat unit, and in the step of determining whether to correct, the degree of warping caused by heating of the substrates is determined based on the position deviation values, and when unloading the substrates from the boat unit, the teaching position of the substrate transfer robot is determined. Claim 12 A substrate transfer control method according to claim 11, comprising the step of correcting the teaching position of the substrate transfer robot based on the position deviation values ​​when the position deviation values ​​are smaller than or equal to a preset maximum correction position deviation value.

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