Semiconductor package manufacturing apparatus and semiconductor package manufacturing method using the same

Abstract

An apparatus for manufacturing a semiconductor package is provided. An apparatus for manufacturing a semiconductor package according to some embodiments includes a pin holder having a plurality of through holes, a plurality of ejector pins corresponding to the plurality of through holes, a first pin disk having a first protrusion having a first arrangement to adjust the height of the plurality of ejector pins, a second pin disk having a second protrusion having a second arrangement to adjust the height of the plurality of ejector pins, and a control unit for selecting one of the first and second pin disks to select a plurality of ejector pins protruding above the pin holder.

Description

Technology Field

[0001] The present invention relates to an apparatus for manufacturing a semiconductor package and a method for manufacturing a semiconductor package using the same. Background Technology

[0002] Generally, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The wafer on which the semiconductor devices are formed can be divided into multiple dies through a dicing process, and the dies can be bonded onto the substrate through a bonding process.

[0003] To this end, a die ejecting device installed to be drivable in a vertical direction to separate a die from a wafer and a pickup unit for picking up the die from the wafer and attaching it to a substrate may be used.

[0004] Such a die ejecting device may be equipped with multiple ejector pins to separate the die from the tape. Meanwhile, if the size of the die to be bonded changes, it may be necessary to change the number and position of the ejector pins. Although changing the number and position of the ejector pins can be performed by an operator, a problem may arise in that the time required increases significantly depending on the operator's skill level. The problem to be solved

[0005] The technical problem that the present invention aims to solve is to provide an apparatus for manufacturing semiconductor packages to perform the replacement of ejector pins more efficiently.

[0006] Another technical problem that the present invention aims to solve is to provide a semiconductor package manufacturing method for performing the replacement of ejector pins more efficiently.

[0007] The technical problems of the present invention are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0008] An apparatus for manufacturing a semiconductor package according to some embodiments of the present invention for achieving the above technical problem comprises: a pin holder having a plurality of through holes; a plurality of ejector pins corresponding to the plurality of through holes; a first pin disk having a first protrusion having a first arrangement to adjust the height of the plurality of ejector pins; a second pin disk having a second protrusion having a second arrangement to adjust the height of the plurality of ejector pins; and a control unit for selecting one of the first and second pin disks to select a plurality of ejector pins protruding above the pin holder.

[0009] An apparatus for manufacturing a semiconductor package according to some embodiments of the present invention for achieving the above technical problem comprises: a plurality of ejector pins; a pin holder including a plurality of through holes corresponding to the plurality of ejector pins; a pin base for setting a reference height of the plurality of ejector pins; a pin disk disposed at the lower part of the pin base and including a protrusion that raises the plurality of ejector pins by a first height spaced apart from the reference height; and a control unit for selecting a plurality of ejector pins protruding from the upper part of the pin holder by selecting the pin disk.

[0010] A semiconductor package manufacturing method according to some embodiments of the present invention for achieving the above technical problem comprises: a pin holder having a plurality of through holes; a plurality of ejector pins corresponding to the plurality of through holes; a first pin disk having a first protrusion having a first arrangement to adjust the height of the plurality of ejector pins; a second pin disk having a second protrusion having a second arrangement to adjust the height of the plurality of ejector pins; and a support member on which the first and second pin disks are seated and rotatable, wherein the first pin disk on the support member is replaced with the second pin disk to select a plurality of ejector pins protruding above the pin holder.

[0011] Specific details of other embodiments are included in the detailed description and drawings. Brief explanation of the drawing

[0012] FIG. 1 is a schematic diagram showing a conventional semiconductor package manufacturing apparatus. FIG. 2 is a schematic diagram showing an apparatus for manufacturing a semiconductor package according to some embodiments. Figure 3 is a drawing showing the pin holder and through hole of Figure 2. FIG. 4 is a drawing showing the shape of a pin ejector according to some embodiments. FIG. 5 is a drawing showing a pin disk according to some embodiments. FIGS. 6 and 7 are drawings illustrating the operation of a pin disk and a pin ejector according to some embodiments. FIG. 8 is a drawing showing a pin disk according to some embodiments. FIGS. 9 to 11 are drawings illustrating the operation of a pin disk and a pin ejector according to some embodiments. FIGS. 12 to 15 are drawings showing pin disks according to some embodiments. FIGS. 16 to 18 are drawings showing the shapes of pin ejectors according to some embodiments. FIGS. 19(a) to 19(b) are drawings showing the shapes of a pin holder and a pin disk according to some embodiments. FIGS. 20(a) to 20(b) are drawings showing the shapes of a pin holder and a pin disk according to some embodiments. FIGS. 21(a) to 21(b) are drawings showing the shapes of a pin holder and a pin disk according to some embodiments. FIGS. 22(a) to 22(b) are drawings showing the shapes of a pin holder and a pin disk according to some embodiments. FIGS. 23 to 25 are drawings for explaining a method of manufacturing a semiconductor package using a semiconductor package manufacturing apparatus according to some embodiments. Specific details for implementing the invention

[0013] FIG. 1 is a schematic diagram showing a conventional semiconductor package manufacturing apparatus.

[0014] Referring to FIG. 1, a conventional semiconductor package manufacturing device (1001) may include a die ejecting unit (1001A) and a pickup unit (1001B).

[0015] The die ejecting unit (1001A) can be installed to be driven in a vertical direction to separate the tape (TA) and the die (DI).

[0016] The die ejecting unit (1001A) may include a pin ejector (200A) for separating a tape (TA) and a die (DI), a pin holder (110A) equipped with the pin ejector (200A), and a pin disk (300A) located below the pin ejector (200A).

[0017] Although not specifically illustrated, the pickup unit (1001B) can pick up the separated die (DI) and attach it to the substrate.

[0018] FIG. 2 is a schematic diagram showing an apparatus for manufacturing a semiconductor package according to some embodiments. FIG. 3 is a diagram showing the pin holder and through hole of FIG. 2.

[0019] Referring to FIG. 2, a semiconductor package manufacturing device (1000) according to some embodiments may include a pin holder (110), an ejector pin (200), a pin base (300), a pin base (400), and a support member (500).

[0020] In some embodiments, the first direction (X) and the second direction (Y) may refer to directions parallel to the lower surface of the pin holder (110) or the upper surface of the pin base (400) described later. The first direction (X) and the second direction (Y) may refer to directions that intersect each other. The third direction (Z) may refer to a direction perpendicular to each of the first direction (X) and the second direction (Y).

[0021] The housing (100) may provide an area where the ejector pin (200) is driven. The housing (100) may have a cylindrical shape extending in a third direction (Z). The ejector pin (200), pin base (300), and pin base (400), which will be described later, may be disposed inside the housing (100).

[0022] A pin holder (110) may be disposed on the upper part of the housing (100). A portion of an ejector pin (200) may be inserted into the pin holder (110). The pin holder (110) includes a plurality of through holes (PH) that penetrate its upper surface (110U) and lower surface (110B). Ejector pins (200) may be inserted into the plurality of through holes (PH).

[0023] A moving part (120) that is driven to enable rotation or vertical movement (Z) of the pin disk (300) may be disposed within the pin holder (100). The moving part (120) is disposed at the bottom of the pin disk (300). The moving part (120) can raise or lower the ejector pins (200) through the pin disk (300).

[0024] A pin ejector (200) can be formed to correspond to each of a plurality of through holes (PH). Referring to FIG. 3, from a planar perspective in the first and second directions (X, Y), the pin ejector (200) can be formed to correspond one-to-one with each of the plurality of through holes (PH). Accordingly, all of the plurality of ejector pins (200) may protrude outside the plurality of through holes (PH), or only some of the plurality of ejector pins (200) may protrude outside the plurality of through holes (PH).

[0025] Referring to FIG. 4, each of the plurality of ejector pins (200) may include an upper region (UP) between the pin holder (110) and the pin base (400), a lower region (LP) between the pin base (400) and the first protrusion (311), and a stopper (210) between the upper region (UP) and the lower region (LP).

[0026] The length (D1) of the upper region (UP) may be longer than the length (D2) of the lower region (LP). The ends of the upper region (UP) or the lower region (LP) may each be flat. The top surface of the upper region (UP) may be flat.

[0027] The diameter (R) of the upper region (UP) may be the same as the diameter of the lower region (LP). The diameter (R) of the upper region (UP) may be 0.5 mm or more and 0.68 mm or less.

[0028] Based on the third direction (Z), the stopper (210) may be located at a point corresponding to 1 / 2 or more and 1 / 3 or less of the total length (DP) of the ejector pin (200). The total length (DP) of the ejector pin (200) may be 6 mm or more and 13 mm or less.

[0029] The width (W) of the stopper (210) may be wider than the diameter (R) of the upper region (UP) or lower region (LP). The width (W) of the stopper (210) may be wider than the diameter of the through hole (PH).

[0030] A plurality of ejector pins (200) may include a metallic material. For example, the ejector pins (200) may include stainless steel, aluminum, or carbide. If the ejector pins (200) include carbide, they may include a tungsten carbide and cobalt alloy. Alternatively, the ejector pins (200) may include a ceramic material.

[0031] The pin disk (300) may include a first pin disk (310) comprising a first protrusion (311) that adjusts the height of a plurality of ejector pins (200). The pin disk (300) may include a metallic material.

[0032] Referring to FIG. 5, the first protrusion (311) may be disposed on the upper surface of the first pin disk (310). Each of the first protrusions (311) may be formed in multiple numbers to correspond to all of the multiple ejector pins (200). In this case, the first protrusions (311) may have a first arrangement.

[0033] The first protrusion (311) may include a magnetic material. For example, the first protrusion (311) may include a cobalt-based magnetic material. Accordingly, the first protrusion (311) can maintain the height of the pin disk (300) appropriately and minimize vibration during the process of repeated vertical movement of the pin disk (300) described later.

[0034] Referring to FIG. 6, before the vertical movement of the pin disk (300), the first protrusion (311) may be spaced apart from each of the ejector pins (200) in the third direction (Z).

[0035] The pin base (400) can set a reference height (H0) of a plurality of ejector pins (200). A stopper (210) of the ejector pin (200) may be placed on the upper surface of the pin base (400).

[0036] Referring to FIG. 7, when the pin disk (300) moves vertically, the ejector pins (200) can each be inserted into the through hole (PH) and protrude outside the pin holder (110). The first protrusion (311) can be positioned at the bottom of the pin base (400). By means of the moving part (120), the first protrusion (311) can raise a plurality of ejector pins (200) by a first height (H1) spaced apart from the reference height (H0). The stopper (210) of the ejector pin (200) can be positioned on the lower surface of the pin holder (110).

[0037] Accordingly, ejector pins (200) protruding outside the pin holder (110) can separate the die and the tape.

[0038] Referring to FIG. 8, the pin disk (300) may further include a second pin disk (320) comprising a second protrusion (321) that adjusts the height of a plurality of ejector pins (200).

[0039] The second protrusion (321) may be disposed on the upper surface of the second pin disk (320). Each of the second protrusions (321) may be formed in multiple numbers to correspond to some of the multiple ejector pins (200). In this case, the second protrusions (321) may have a second arrangement.

[0040] For example, the second arrangement of the second protrusion (321) may mean an arrangement in the form of a 3x3 matrix. However, the technical concept of the present invention is not limited thereto and can be varied in various ways depending on the die placement area (DR). Accordingly, even if the size of the die to be bonded is changed, the position and number of ejector pins can be efficiently changed.

[0041] Referring to FIG. 9, before the vertical rise of the pin disk (300), the second protrusion (321) may be spaced apart from each of the ejector pins (200) in the third direction (Z).

[0042] The pin base (400) can set a reference height (H0) of a plurality of ejector pins (200). A stopper (210) of the ejector pin (200) may be placed on the upper surface of the pin base (400).

[0043] Referring to FIG. 10, when the pin disk (300) rises vertically, a portion of the ejector pin (200) may be inserted into the through hole (PH) and protrude outside the pin holder (110). A second protrusion (321) may be positioned at the bottom of the pin base (400). The second protrusion (321) may raise a portion of a plurality of ejector pins (200) by a second height (H2) spaced apart from a reference height (H0). A stopper (210) of the ejector pin (200) may be positioned on the lower surface of the pin holder (110).

[0044] Accordingly, some ejector pins (200) protruding outside the pin holder (110) can separate the die and the tape.

[0045] Referring to FIG. 11, a portion of the ejector pin (200) used to separate the die and the tape can be lowered vertically while in contact with the second pin disk (320). The second protrusion (321) can be lowered to a reference height (H0) by the moving part (120). The stopper (210) of the ejector pin (200) can be placed back on the upper surface of the pin base (400).

[0046] In this process, the maximum height at which the ejector pin (200) rises or falls can be maintained at a constant distance from the upper surface (400U) of the pin base (400) to the lower surface (110B) of the pin holder (110).

[0047] Referring to FIG. 12, the pin disk (300) may further include a third pin disk (330) comprising a third protrusion (331) that adjusts the height of a plurality of ejector pins (200).

[0048] The third protrusion (331) may be disposed on the upper surface of the third pin disk (330). Each of the third protrusions (331) may be formed in multiple numbers to correspond to some of the multiple ejector pins (200). In this case, the third protrusions (331) may have a third arrangement.

[0049] For example, the third arrangement of the third protrusion (331) may mean a form in which four protrusions (331_E) are each arranged at the corner portions of the die placement area (DR) and one protrusion (331_C) is arranged in the center portion. In this case, the size of the die placement area (DR) may be smaller than the size of the die placement area (DR) described using FIGS. 1 to 11.

[0050] Referring to FIG. 13, the pin disk (300) may further include a fourth pin disk (340) comprising a fourth protrusion (341) that adjusts the height of a plurality of ejector pins (200).

[0051] The fourth protrusion (341) may be disposed on the upper surface of the fourth pin disk (340). The fourth protrusion (341) may be formed to correspond to one of the plurality of ejector pins (200). In this case, the fourth protrusion (341) may have a fourth arrangement.

[0052] For example, the fourth arrangement of the fourth protrusion (341) may mean a form in which one protrusion is arranged in the die placement area (DR). In this case, the size of the die placement area (DR) may be smaller than the size of the die placement area (DR) described using FIGS. 1 to 12.

[0053] Referring to FIG. 14, the pin disk (300) may further include a fifth pin disk (350) comprising a fifth protrusion (351) that adjusts the height of a plurality of ejector pins (200).

[0054] The fifth protrusion (351) may be disposed on the upper surface of the fifth pin disk (350). Each of the fifth protrusions (351) may be formed in multiple numbers to correspond to some of the multiple ejector pins (200). In this case, the fifth protrusions (351) may have a fifth arrangement.

[0055] For example, the fifth array of the fifth protrusion (351) may mean an array in the form of a 5*5 matrix.

[0056] Referring to FIG. 15, the pin disk (300) may further include a sixth pin disk (360) comprising a sixth protrusion (361) that adjusts the height of a plurality of ejector pins (200).

[0057] The sixth protrusion (361) may be disposed on the upper surface of the sixth pin disk (360). Each of the sixth protrusions (361) may be formed in multiple numbers to correspond to some of the plurality of ejector pins (200). In this case, the sixth protrusion (361) may have a sixth arrangement.

[0058] For example, the sixth arrangement of the sixth protrusion (361) may mean an arrangement in the form of a 3x3 matrix. In this case, the size of the die placement area (DR) may be smaller than the size of the die placement area (DR) described using FIG. 8. Additionally, the distance between the protrusions (361) in the first direction (X) or the second direction (Y) may be smaller than the distance between the protrusions (321) shown in FIG. 8.

[0059] Referring to FIG. 16, the upper surface (UP_S) of the upper region (UP) may include a curved surface. In this case, the diameter of the upper region (UP) may be smaller than the diameter (R) of the upper region (UP) shown in FIG. 4.

[0060] Meanwhile, the size of the die placement area (DR) and the number of protrusions (300) may not be limited to those shown in FIG. 8, FIG. 12 to FIG. 15. For example, one protrusion may be placed in the die placement area (DR) of FIG. 8, such as the protrusion (341) of FIG. 13. However, this is merely an example, and the technical concept of the present invention is not limited thereto.

[0061] Referring to FIG. 17, the diameter (R1) of the upper region (UP) may be larger than the diameter (R2) of the lower region (LP). In this case, one cross-section of the ejector pin (200) may have a tapered shape. Accordingly, in the case where only a part of the ejector pin (200) corresponds to a protrusion, the lower region (LP) of the ejector pin (200) that is not used for separating the die and the tape can be smoothly placed in the region between the protrusions.

[0062] Referring to FIG. 18, the diameter (R1) of the upper region (UP) may be larger than the diameter (R2) of the lower region (LP). In this case, one cross-section of the ejector pin (200) may be rectangular in shape.

[0063] Referring to FIG. 19(a) and FIG. 19(b), the first pin disk (310) may include a first identification portion (301a) protruding in a second direction (Y) parallel to the upper surface of the first pin disk (310). In this case, the pin holder (110) may include a first groove portion (101a) formed concavely to correspond to the protruding first identification portion (301a). In this case, the first identification portion (301a) and the first groove portion (101a) may each be formed in a rectangular shape.

[0064] Accordingly, the direction in which the first pin disk (310) is positioned on the support member (500) described later can be identified. Additionally, accordingly, when the first pin disk (310) moves vertically, the first protrusion (311) can move smoothly without getting caught on the pin holder (110).

[0065] Meanwhile, the shapes of the identification portion and the groove portion are not limited to those shown in FIGS. 19(a) and FIGS. 19(b) and can be formed in various ways. For example, the shapes of the identification portion and the groove portion may be formed as a triangular shape as shown in FIGS. 20(a) and FIGS. 20(b), a pentagonal shape as shown in FIGS. 21(a) and FIGS. 21(b), or a circular shape as shown in FIGS. 22(a) and FIGS. 22(b).

[0066] In addition, while the first protrusion (311) is illustrated in FIG. 19(b), the technical concept of the present invention is not limited thereto. The protrusions applied in FIG. 19(b), FIG. 20(b), FIG. 21(b) and FIG. 22(b) may be any one of the aforementioned first to sixth protrusions (311 to 361) or protrusions of various other shapes.

[0067] The aforementioned pin disk (300) is seated on the support member (500). Referring to FIG. 23, the support member (500) may include a turntable type that is rotatable and seated with the first and second pin disks (310, 320).

[0068] Although not specifically described, the support member (500) can be connected to a motor that provides rotational force.

[0069] The control unit (600) can select or replace a plurality of ejector pins (200) protruding from the upper part of the pin holder (110). Specifically, the control unit (600) can select a plurality of ejector pins (200) protruding from the upper part of the pin holder (110) by replacing the first pin disk (310) on the support unit (500) with the second pin disk (320).

[0070] Meanwhile, the number and type of pin discs selected or replaced in a turntable manner are not limited to those shown in FIG. 23. For example, the control unit (600) may select a plurality of ejector pins (200) protruding above the pin holder (110) by replacing the first pin disc (310) on the support unit (500) with the second to sixth pin discs (320 to 360). However, the technical concept of the present invention is not limited thereto, and it is understood that pin discs including protrusions of various shapes can be selected depending on the size of the die to be bonded.

[0071] For example, referring to FIG. 24, the first to fourth pin disks (310 to 340) may be seated on a turntable-type support member (500) that is rotatable. The support member (500) may rotate in one direction. The support member (500) may be placed on a moving member (120) that enables rotational movement and may rotate the first to fourth pin disks (310 to 340).

[0072] The first to fourth pin disks (310 to 340) are not limited to those shown in FIG. 24 and may refer to any one of the first to sixth pin disks (310 to 360) described above. However, the technical concept of the present invention is not limited thereto and may include pin disks of various shapes depending on the size of the die to be bonded.

[0073] For example, referring to FIG. 25, the first to fourth identification parts (301a to 301d) may each be positioned in different directions on the support part (500). On the support part (500), the first identification part (301a) may be positioned in the 12 o'clock direction, the second identification part (301b) in the 9 o'clock direction, the third identification part (301c) in the 18 o'clock direction, and the fourth identification part (301d) in the 21 o'clock direction. Accordingly, a disk having a protrusion corresponding to the ejector pin used can be more easily identified. As a result, the selection or replacement of the disk can be performed more efficiently.

[0074] A semiconductor package can be manufactured using a semiconductor package manufacturing device according to some of the embodiments described above.

[0075] In this case, a semiconductor package manufacturing device comprising the aforementioned pin holder (110), a plurality of ejector pins (200), a first pin disk (310), a second pin disk (320), a pin base (400), a support member (500), and a control member (600) may be used.

[0076] The pin base (400) can set the reference height (H0) of a plurality of ejector pins (200).

[0077] Each of the plurality of ejector pins (200) may include an upper region (UP) between the pin holder (110) and the pin base (400), a lower region (LP) between the pin base (400) and the first and second protrusions (311, 321), and a stopper (210) between the upper region (UP) and the lower region (LP).

[0078] The pin holder (110) may include a plurality of through holes (PH). A plurality of ejector pins (200) are formed to correspond to the plurality of through holes (PH) and can separate the die and the tape as described below.

[0079] First, a first pin disk (310) including a first protrusion (311) of a first array can be placed on a support (500).

[0080] The first pin disk (310) may include a first protrusion (311) having a first arrangement to adjust the height of a plurality of ejector pins (200). For example, the first arrangement of the first protrusion (311) may have a shape that corresponds one-to-one with each of the plurality of ejector pins (200).

[0081] In the first state, each stopper (210) of a plurality of ejector pins (200) can be placed on the upper surface (400U) of the pin base (400).

[0082] In the second state, the stopper (210) of the plurality of ejector pins (200) corresponding to the first protrusion (311) among the plurality of ejector pins (200) can be positioned on the lower surface (110B) of the pin holder (110) spaced apart by a first height (H1) from the upper surface (400U) of the pin base (400).

[0083] Accordingly, the first protrusion (311) can raise a plurality of ejector pins (200) by a first height (H1).

[0084] Afterwards, a plurality of ejector pins (200) can be protruded to the upper part of the pin holder (110) using the first pin disk (310).

[0085] Afterwards, the first die and tape (TA) can be separated.

[0086] Afterward, the support member (500) can be rotated to replace the first pin disk (310) with the second pin disk (320). The replacement of the pin disk can be done using the aforementioned turntable method. The replacement of the pin disk can be performed by the control member (600). As a result, the operator can select an ejector pin suitable for the size of the die simply by replacing the pin disk, without having to replace the ejector pins one by one.

[0087] Next, a second pin disk (320) including a second protrusion (321) of a second array can be placed on the support (500).

[0088] The second pin disk (320) may include a second protrusion (321) having a second arrangement to adjust the height of a plurality of ejector pins (200). For example, the second arrangement of the second protrusion (321) may have a shape corresponding to each part of the plurality of ejector pins (200).

[0089] In the first state, each stopper (210) of a plurality of ejector pins (200) can be placed on the upper surface (400U) of the pin base (400).

[0090] In the second state, the stopper (210) of the plurality of ejector pins (200) corresponding to the second protrusion (321) among the plurality of ejector pins (200) can be positioned on the lower surface (110B) of the pin holder (110) spaced apart by a first height (H1) from the upper surface (400U) of the pin base (400).

[0091] Accordingly, the second protrusion (321) can raise a plurality of ejector pins (200) by the first height (H1).

[0092] Afterwards, some of the multiple ejector pins (200) can be protruded to the upper part of the pin holder (110) using the second pin disk (320).

[0093] Afterwards, the second die and tape (TA) can be separated.

[0094] According to some embodiments, a third pin disk (330) including a third protrusion (331) of a third array and a fourth pin disk (340) including a fourth protrusion (341) of a fourth array may be placed on a support (500). The third and fourth arrays may be different from the first and second arrays described above.

[0095] A plurality of ejector pins (200) protruding from the upper part of the pin holder (110) can be selected by replacing the first pin disk (310) on the support member (500) with any one of the second to fourth pin disks (320 to 340).

[0096] In some embodiments, the position and number of ejector pins can be efficiently changed by replacing the pin disk through an automated system.

[0097] Although embodiments of the present invention have been described above with reference to the attached drawings, the present invention is not limited to the above embodiments and can be manufactured in various different forms, and those skilled in the art will understand that the present invention can be implemented in other specific forms without changing the technical concept or essential features of the present invention. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. Explanation of the symbols

[0098] 100: Housing 110: Pin holder 200: Ejector pin 210: Stopper 310: 1st pin disk 311: 1st protrusion 301a: First identification unit 320: Second pin disk 321: Second protrusion 301b: Second identification part 330: Third pin disk 331: Third protrusion 301c: Third identification section 340: Fourth pin disk 341: 4th protrusion 301d: 4th identification part 400: Pin base 500: Support part 600: Control unit 1000: Device for manufacturing semiconductor packages

Claims

Claim 1 A pin holder comprising a plurality of through holes; a plurality of ejector pins corresponding to the plurality of through holes; a first pin disk comprising a first protrusion having a first arrangement to adjust the height of the plurality of ejector pins; a second pin disk comprising a second protrusion having a second arrangement to adjust the height of the plurality of ejector pins; a third pin disk comprising a third protrusion having a third arrangement to adjust the height of the plurality of ejector pins; a fourth pin disk comprising a fourth protrusion having a fourth arrangement to adjust the height of the plurality of ejector pins; and a support member on which the first to fourth pin disks are seated and rotatable. A semiconductor package manufacturing apparatus comprising a control unit for selecting one of the first to fourth pin disks and selecting the plurality of ejector pins protruding above the pin holder, wherein the first pin disk includes a first identification unit, the second pin disk includes a second identification unit, the third pin disk includes a third identification unit, and the fourth pin disk includes a fourth identification unit, each of the first to fourth identification units has a different shape, and the first to fourth identification units are each arranged in different directions on the support member. Claim 2 A semiconductor package manufacturing apparatus according to claim 1, further comprising a pin base for setting a reference height of the plurality of ejector pins, wherein the first and second protrusions are disposed at the lower part of the pin base and the plurality of ejector pins are raised by a first height spaced apart from the reference height. Claim 3 A semiconductor package manufacturing apparatus according to claim 1, wherein the first protrusions are formed in a plurality of numbers, and each of the plurality of first protrusions is arranged to correspond to each of the plurality of ejector pins. Claim 4 A semiconductor package manufacturing apparatus according to claim 1, wherein the second protrusions are formed in a plurality of numbers, and each of the plurality of second protrusions is arranged to correspond to some of the plurality of ejector pins. Claim 5 A semiconductor package manufacturing apparatus according to claim 1, wherein the first pin disk includes a first identification portion protruding in a first direction parallel to the upper surface of the first pin disk, and the pin holder includes a first groove portion corresponding to the first identification portion and formed concavely in the first direction. Claim 6 delete Claim 7 In claim 1, the control unit selects the plurality of ejector pins protruding above the pin holder by replacing the first pin disk on the support member with any one of the second to fourth pin disks. Claim 8 delete Claim 9 A semiconductor package manufacturing apparatus comprising: a plurality of ejector pins; a pin holder including a plurality of through holes corresponding to the plurality of ejector pins; a pin base for setting a reference height of the plurality of ejector pins; a plurality of pin discs disposed at the lower part of the pin base and including a protrusion for raising the plurality of ejector pins by a first height spaced apart from the reference height; a support member on which the plurality of pin discs are seated and rotatable; and a control member for selecting one of the plurality of pin discs and selecting the plurality of ejector pins protruding to the upper part of the pin holder, wherein each of the plurality of pin discs includes an identification member of a different shape, and the identification member is disposed in a different direction on the support member. Claim 10 In claim 9, each of the plurality of ejector pins comprises an upper region between the pin holder and the pin base, a lower region between the pin base and the first and second protrusions, and a stopper between the upper region and the lower region, for a semiconductor package manufacturing apparatus.

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