Bottom cover plate for reducing wafer planar non-uniformity

Abstract

The embodiments of the disclosure provided herein generally relate to a bottom cover plate (BCP) that enables the control of radiation loss from a heating element inside a chamber for processing a substrate. The heating element is used to heat the substrate before or during processing and may heat the substrate unevenly due to non-uniform heat loss within the chamber. For example, uneven heating of the substrate may cause uneven deposition of material on the substrate, which may lead to excessive processing to compensate for deposition or wasted products from batches of improperly processed substrates. A BCP can be used to compensate for uneven heating of the substrate.

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