Additives for improving particle dispersion in CMP slurries

By using a C2-C10 alkylenediol dispersant at a pH of 2 to 6 in CMP slurries, the abrasive particle aggregation issue is addressed, resulting in reduced micro-scratches and improved surface quality during polishing.

KR103000109B1Active Publication Date: 2026-08-05CMC MATERIALS INC
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Patent Information

Application Number
KR1020217033901
Authority / Receiving Office
KR · KR
Patent Type
Patents
Current Assignee / Owner
Priority Date
2019-03-25
Filing Date
2020-03-23
Publication Date
2026-08-05
Estimated Expiration
2040-03-23

AI Technical Summary

Technical Problem

Existing abrasive compositions in chemical-mechanical polishing (CMP) slurries suffer from abrasive particle aggregation, leading to increased particle sizes and micro-scratches on polished surfaces, which fail to meet stringent quality requirements.

Method used

Incorporating a dispersant, specifically a linear or branched C2-C10 alkylenediol, into the CMP slurry composition at a pH of 2 to 6, stabilizes abrasive particles such as alumina or colloidal silica, preventing aggregation and maintaining a consistent particle size.

Benefits of technology

The solution enhances abrasive stability, reducing micro-scratches and improving substrate surface quality by maintaining a stable particle size distribution over time, particularly in polishing processes involving tungsten and silicon oxide layers.

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Abstract

The present invention provides a chemical-mechanical polishing composition comprising (a) about 0.05 to about 10 weight% of an abrasive; (b) a dispersant which is a linear or branched C2-C10 alkylenediol; and (c) water, wherein the chemical-mechanical polishing composition has a pH of about 2 to about 6. The present invention also provides a method for chemical-mechanical polishing of a substrate by contacting the substrate with the chemical-mechanical polishing composition of the present invention.
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