Dehumidification efem with cooling and filter function

Abstract

The present invention relates to a dehumidifying EFEM equipped with cooling and filtering functions, and specifically, to an EFEM comprising: a Front-Opening Unified Pod (FOUP) on which a substrate is loaded; a main body communicating with the FOUP through a door and having a retention space formed inside in which the substrate being transported can stay; a dehumidifying device for dehumidifying gas supplied to the retention space; a blower for receiving the gas dehumidified by the dehumidifying device and supplying it to the retention space; and a supply unit including a cooling device that provides a passage through which the gas dehumidified from the dehumidifying device is supplied to the blower and cools the dehumidified gas.

Description

Technology Field

[0001] This embodiment relates to a dehumidifying EFEM equipped with cooling and filtering functions. Background Technology

[0002] With the recent acceleration of the transition to an information society, the demand for highly integrated electronic devices is surging. Representative examples of these devices include high-resolution display devices and high-density, high-performance semiconductor devices, which are manufactured by integrating multiple electronic structures onto a single surface area through high-precision surface treatment processes.

[0003] Processes used in the manufacture of highly integrated electronic devices include thin film deposition, photolithography, and etching processes, and highly integrated electronic devices are manufactured by a composite process in which these different processes are applied one or more times.

[0004] A process system may have process processing devices such as an Equipment Front End Module (EFEM), a transfer robot, and a process chamber to apply multiple processes to a highly integrated electronic device. A substrate to be processed—for example, a semiconductor wafer—waits in the EFEM among these process processing devices, is moved to an appropriate process chamber by a transfer robot, and then undergoes the necessary processes.

[0005] The EFEM may have a Load Port Module (LPM), a Front-Opening Unified Pod (FOUP), an EFEM chamber, etc.

[0006] A load port module is a device to which a semiconductor wafer storage device called a pod is combined. Multiple semiconductor wafers can be loaded in the pod, and a transfer device including a transfer robot sequentially transfers the semiconductor wafers loaded in the pod to a process chamber. Although the processing of semiconductor wafers takes place in a cleanroom with a high level of cleanliness, semiconductor wafers can be loaded in the pod to provide an even higher level of cleanliness.

[0007] Meanwhile, moisture can react with fumes generated from process equipment to oxidize or etch the device. Additionally, moisture can react with fine reaction particles to form foreign substances. Such oxidation of the device, etching of the device, and / or formation of foreign substances can be factors that reduce the device yield. Since the substrate to be processed—e.g., a semiconductor wafer—resides in the EFEM for a significant amount of time, humidity control within process equipment such as the EFEM is recognized in the industrial field as an important factor for improving yield. The problem to be solved

[0008] Against this backdrop, the objective of the present embodiment is, in one aspect, to provide a technology for reducing humidity within an EFEM.

[0009] In another aspect, the objective of the present embodiment is to provide a technology capable of reducing the humidity of an EFEM while performing cooling and purification of the gas.

[0010] In another aspect, the objective of the present embodiment is to provide a technology that reduces humidity in key areas affecting the substrate without replacing the existing EFEM chamber.

[0011] In another aspect, the objective of the present embodiment is to provide a technology that can reduce the humidity of the EFEM while increasing space utilization. means of solving the problem

[0012] To achieve the aforementioned objective, one embodiment provides an EFEM comprising: a Front-Opening Unified Pod (FOUP) on which a substrate is loaded; a main body communicating with the FOUP through a door and having a retention space formed inside where the substrate being transported can stay; a dehumidifying device for dehumidifying gas supplied to the retention space; a blower for receiving the gas dehumidified by the dehumidifying device and supplying it to the retention space; and a supply unit including a cooling device that provides a passage through which the gas dehumidified from the dehumidifying device is supplied to the blower and cools the gas.

[0013] In an EFEM according to one embodiment, the supply unit may additionally include a drain unit that collects condensate generated during the cooling process of the dehumidified gas and discharges the condensate to the outside.

[0014] In an EFEM according to one embodiment, the supply unit may include one or more of a chemical filter and an Ultra-Low Penetration Air (ULPA) filter.

[0015] In an EFEM according to one embodiment, the cooling device may include a cooling coil that receives cooling water and performs cooling of the gas.

[0016] In an EFEM according to one embodiment, the gas that has passed through the retention space can be discharged to the outside.

[0017] In an EFEM according to one embodiment, a recovery unit may additionally be included to provide a passage for the gas passing through the retention space to be recovered to the dehumidification device.

[0018] In an EFEM according to one embodiment, the recovery unit may additionally include a cooling device for cooling the gas.

[0019] In an EFEM according to one embodiment, the recovery unit may additionally include a drain unit that collects cooling water generated during the process of cooling the gas passing through the retention space or cooling water generated as a leak, and discharges it to the outside.

[0020] In an EFEM according to one embodiment, the recovery unit may additionally include one or more of a chemical filter and a ULPA filter.

[0021] In an EFEM according to one embodiment, the dehumidification device may include: a dehumidification unit that performs dehumidification of gas; a heater that heats a regeneration container gas used for regeneration of the dehumidification unit; a regeneration blower that discharges the regeneration container gas used for regeneration of the dehumidification unit to the outside; and a dehumidification blower that discharges the dehumidified gas that has passed through the dehumidification unit.

[0022] In an EFEM according to one embodiment, a differential pressure sensor that senses the differential pressure of a gas by being positioned before and after the chemical filter and ULPA filter in the supply unit, before and after the chemical filter and ULPA in the recovery unit, and before and after the blower; a temperature and humidity sensor that senses the temperature and humidity by being positioned in the supply unit, the recovery unit, and the retention space; and a flow sensor that senses the flow rate of a gas by being positioned in the supply unit and the retention space.

[0023] In an EFEM according to one embodiment, a control device may additionally be included that receives sensing information from the differential pressure sensor, the temperature and humidity sensor and the flow sensor, and controls the dehumidification device and the blower based thereon. Effects of the invention

[0024] As described above, according to the present embodiment, a technology for reducing humidity within an EFEM can be provided.

[0025] In addition, according to the present embodiment, the humidity of the EFEM can be reduced while minimizing costs, and the humidity in the key areas affecting the substrate can be reduced without replacing the existing EFEM chamber.

[0026] In addition, according to the present embodiment, the humidity of the EFEM can be reduced without occupying much space, and the humidity of the EFEM can be reduced without significantly increasing power consumption. Brief explanation of the drawing

[0027] FIG. 1 is a side view showing the configuration of a process system according to one embodiment. FIG. 2 is a top view showing the configuration of a process system according to one embodiment. FIG. 3 is a drawing illustrating a first exemplary technique for lowering the humidity of an EFEM chamber. FIG. 4 is a configuration diagram of a dehumidification device according to a first embodiment. FIG. 5 is a configuration diagram of a dehumidification device according to a second embodiment. FIG. 6 is a drawing for explaining a first exemplary technology of an EFEM chamber equipped with cooling and filtering functions. FIG. 7 is a drawing for explaining a second exemplary technology of an EFEM chamber equipped with cooling and filtering functions. FIG. 8 is a drawing for explaining a third exemplary technology of an EFEM chamber equipped with cooling and filtering functions. FIG. 9 is a drawing for explaining a fourth exemplary technology of an EFEM chamber equipped with cooling and filtering functions. FIG. 10 is a drawing for explaining a fifth exemplary technology of an EFEM chamber equipped with cooling and filtering functions. FIG. 11 is a drawing for explaining the sixth exemplary technology of an EFEM chamber equipped with cooling and filtering functions. FIG. 12 is a drawing for explaining the seventh exemplary technology of an EFEM chamber equipped with cooling and filtering functions. FIG. 13 is an example diagram illustrating a sensor placed in an EFEM chamber equipped with cooling and filtering functions. FIG. 14 is a drawing for explaining a control device used in an EFEM chamber according to one embodiment. Specific details for implementing the invention

[0028] Some embodiments are described in detail below with reference to exemplary drawings. It should be noted that in assigning reference numerals to the components of each drawing, the same components are given the same reference numeral whenever possible, even if they are shown in different drawings. Furthermore, in describing the present invention, if it is determined that a detailed description of related known components or functions could obscure the essence of the invention, such detailed description is omitted.

[0029] Additionally, terms such as first, second, A, B, (a), (b), etc., may be used when describing components. These terms are intended only to distinguish the component from other components and do not limit the nature, order, or sequence of the component. Where it is stated that a component is "connected," "combined," or "joined" to another component, it should be understood that the component may be directly connected or joined to the other component, but that another component may also be "connected," "combined," or "joined" between each component.

[0030] FIG. 1 is a side view showing the configuration of a process system according to one embodiment, and FIG. 2 is a top view showing the configuration of a process system according to one embodiment.

[0031] Referring to FIGS. 1 and 2, the process system (100) may include an EFEM (110), a load lock device (120), a return chamber (130), a process chamber (140), etc.

[0032] The EFEM (110) is an interface module for supplying a substrate (W), such as a wafer, to a process chamber (140), and the substrate (W) can be introduced into and removed from the process system (100) through the EFEM (110).

[0033] The substrate (W) to be processed can stay in the EFEM before being transferred to the process chamber (140) and then be transferred to the process chamber (140) via the return chamber (130) when necessary.

[0034] Substrates (W) staying in the EFEM can be sequentially transferred to the load lock device (120). Then, the substrate (W) transferred to the load lock device (120) is transferred to the return chamber (130), and the return robot placed in the return chamber (130) transfers the substrate (W) to the process chamber (140) so that the substrate (W) can be processed.

[0035] The process system (100) may include a plurality of process chambers (140a, 140b, 140c), and each of the process chambers (140a, 140b, 140c) may apply different processes to the substrate (W). A return robot placed in the return chamber (130) may introduce the substrate (W) into the first process chamber (140a) to allow the first process to be applied to the substrate (W), and the substrate (W) removed from the first process chamber (140a) may be introduced into the second process chamber (140b) to allow the second process to be applied to the substrate (W). Additionally, the return robot may introduce the substrate (W) into the third process chamber (140c) to allow the third process to be applied to the substrate.

[0036] Doors (D1, D2, D3, D4) are arranged between each device to minimize the mixing of gases between each device. For example, a second door (D2) may be arranged between the EFEM (110) and the load lock device (120), a third door (D3) may be arranged between the load lock device (120) and the return chamber (130), and a fourth door (D4) may be arranged between the return chamber (130) and the process chamber (140). Additionally, each door (D1, D2, D3, D4) may be opened only when the substrate (W) is being moved and may remain closed at other times.

[0037] The EFEM (110) may include an EFEM chamber (112), a pod (114), a load port module (116), etc.

[0038] A number of substrates (W) can be loaded into the pod (114). The number of substrates (W) can be transferred sequentially to the EFEM chamber (112).

[0039] The pod (114) can be connected to the EFEM chamber (112) through the first door (D1). A transfer device may be placed inside the EFEM chamber (112), and when the first door (D1) is opened, the transfer device can take out the substrate (W) from the pod (114) and transfer it to the load lock device (120).

[0040] The EFEM (110) may include a plurality of pods (114a, 114b, 114c). Each pod (114a, 114b, 114c) may be connected to the EFEM chamber (112) at different locations. A transfer device placed in the EFEM chamber (112) may sequentially open first doors (D1a, D1b, D1c) placed in each pod (114a, 114b, 114c) and sequentially remove substrates (W) from each pod (114a, 114b, 114c).

[0041] The internal space of the pod (114) may be relatively narrow compared to the EFEM chamber (112). Because the pod (114) has a relatively narrow space, the gas atmosphere surrounding the substrate can be well controlled. For example, when a substrate such as a semiconductor wafer is exposed to moisture, oxygen, etc., an oxide film may form on its surface, but this problem can be minimized by purging the internal space of the pod (114) with N2 (nitrogen).

[0042] A load port module (116) supporting the pod (114) can supply N2 into the internal space of the pod (114). The load port module (116) may include an N2 supply device, N2 piping, a Mass Flow Controller (MFC), a filter, etc. N2 supplied from the N2 supply device can be delivered into the internal space of the pod (114) through the N2 piping, at which time the MFC can control the flow of the N2 fluid and a filter in the N2 distribution path can remove foreign substances.

[0043] According to this structure in which the load port module (116) purges N2 into the internal space of the pod (114), the time required to lower the internal humidity of the pod (114) can be shortened, the effect of suppressing contamination of a substrate (W), such as a semiconductor wafer, can be increased, static electricity generation during transport of the substrate (W) can be suppressed, the diffusion of particles can be prevented, and the possibility of corrosion of the substrate (W) by particles can be reduced.

[0044] Meanwhile, since moisture can react with fumes generated from process processing devices to oxidize or etch the device and can react with fine reaction particles to form foreign matter, it is important to minimize moisture within the EFEM (110). Since the pod (114) has a relatively narrow space, it may be easy to reduce humidity, but since the EFEM chamber (112) has a relatively wide space, it may not be easy to reduce humidity.

[0045] Various technologies have been attempted to lower humidity in these EFEM chambers, but most had problems such as being expensive or having low effectiveness.

[0046] Figure 3 is a diagram illustrating an example technique for lowering the humidity of an EFEM chamber.

[0047] Referring to FIG. 3, the N2 circulating EFEM chamber (10) can control the humidity in the space by circulating N2 (50) in the space where the substrate (W) is exposed.

[0048] An N2 supply pipe (311) may be connected to the upper side of the N2 circulating EFEM chamber (10), and a differential pressure exhaust unit (312) may be connected to the lower side. Additionally, a pod (20) may be connected to one side of the EFEM chamber (10).

[0049] The EFEM chamber (10) can supply N2 (50) into the internal space through the N2 supply pipe (311). The internal space of the EFEM chamber (10) may have a certain path formed through which N2 (50) can circulate, and the N2 (50) supplied through the N2 supply pipe (311) can circulate in the internal space along the path.

[0050] The EFEM chamber (10) can regulate the air pressure in the internal space through the differential pressure exhaust section (312) and regulate the density of N2 (50) in the internal space.

[0051] The pod (20) can be purged from N2 through a load port module (not shown).

[0052] The internal space of the pod (20) can be connected to the EFEM chamber (10) when the door is opened, and since both spaces are filled with N2, the humidity of the entire EFEM can be controlled to a low state.

[0053] Meanwhile, the N2 circulating EFEM chamber (10) can be designed with a sealed structure because N2 must not leak to the outside. However, since conventional EFEM chambers are not sealed structures, the problem of having to replace the EFEM chamber to introduce the N2 circulating EFEM chamber (10) may arise. Generally, replacing process equipment in a semiconductor manufacturing process results in enormous costs and time losses. Therefore, it may be necessary to apply other technologies that can minimize these costs and time losses.

[0054] FIG. 4 is a configuration diagram of a dehumidification device according to a first embodiment.

[0055] Referring to FIG. 4, the dehumidification device (500) according to the first embodiment may include a dehumidification box (510), a heater (520), a blower (530, 540), and a cooling device (550).

[0056] Additionally, the dehumidifying device (500) may include a regeneration container gas intake port (561), a regeneration container gas discharge port (562), a dehumidifying gas intake port (563), and a dehumidifying gas discharge port (564), and may include a pre-filter (571, 572, 573) and a dehumidifying filter (574).

[0057] The regeneration container gas intake port (561) may be configured to supply gas used for regeneration of the dehumidification box (510). The gas sucked in through the regeneration container gas intake port (561) may be purified through a pre-filter (571) and then heated by a heater (520).

[0058] The heater (520) can heat the gas used for regenerating the dehumidification box (510), and the regeneration gas can be heated to a temperature of about 80 to 200°C by the heater (520). In addition, the regeneration gas can be heated to 100 to 180°C, and, for example, to 120°C.

[0059] The regeneration gas heated by the heater (520) moves to the dehumidification box (510) and can regenerate the absorbent contained in the dehumidification box (510). For example, regeneration can be achieved by evaporating the moisture contained in the absorbent as the heated regeneration gas passes through the absorbent in the dehumidification box (510).

[0060] The dehumidification box (510) may include a desiccant and, for example, may include a dehumidification rotor. The dehumidification rotor of the dehumidification box (510) rotates so that the part requiring regeneration of the dehumidification rotor receives a regeneration gas, and the part to perform dehumidification receives a supply gas. The desiccant or the dehumidification rotor may be formed of a material including silica gel, a polymer, zeolite, etc.

[0061] The regeneration gas that has passed through the dehumidification box (510) can be blown through the blower (530), passed through the pre-filter (572), and discharged through the regeneration gas outlet (562). For example, the regeneration gas can be discharged to the outside.

[0062] The gas requiring dehumidification supplied into the EFEM chamber (112) can be drawn in through the dehumidifying gas intake port (563). The gas can be drawn in through the dehumidifying gas intake port (563), passed through the pre-filter (573), and supplied to the dehumidifying box (510).

[0063] The dehumidification box (510) can perform the function of removing moisture from the gas that requires dehumidification.

[0064] The gas dehumidified in the dehumidification box (510) can be cooled through a cooling device (550). Here, the cooling device (550) may include a cooling coil, and the cooling coil may be operated in such a way that cooling water circulates inside it and the gas is cooled as it comes into contact with the cooling coil.

[0065] The gas cooled through the cooling device (550) can be discharged from the dehumidification device (500) through the blower (540), and impurities, etc., can be purified by the dehumidification filter (574) before being discharged. For example, the dehumidification filter (574) can be formed as an Ultra-Low Penetration Air (ULPA) filter, but is not limited thereto, and a High Efficiency Particulate Air (HEPA) filter, a filter made of glass fiber, an activated carbon filter, etc., can be used, and can be changed in various ways as needed.

[0066] The dehumidified gas can be discharged through the dehumidified gas outlet (564).

[0067] The dehumidification box (510) may include a regeneration section where the absorbent is regenerated and a dehumidification section where the absorbent performs dehumidification of the gas.

[0068] The configuration in which gas regeneration takes place within the dehumidification device (500) may be positioned above the configuration that performs dehumidification. Specifically, the regeneration container gas intake port (561), the regeneration container gas exhaust port (562), the pre-filter (571), the heater (520), the blower (530), and the pre-filter (572) may be positioned in the upper part of the dehumidification device (500). In addition, the dehumidifying gas intake port (563), the dehumidifying gas exhaust port (564), the pre-filter (573), the cooling device (550), the blower (540), and the dehumidifying filter (574) may be positioned in the lower part of the dehumidification device (500).

[0069] A cooling device (550) may be placed between the dehumidification box (510) and the blower (540) that discharges the dehumidified gas, and accordingly, a void space may be formed between the heater (520) that heats the dehumidification gas and the dehumidification box (510). Such a void space may be called a dead zone.

[0070] A cooling device (550) and a dehumidification filter (574) are placed within the dehumidification device (500), so that the volume of the dehumidification device (500) may increase, and if cooling water leaks from the cooling device (550), the cooling water may be discharged along with the dehumidified gas. Additionally, the dehumidification filter (574) placed within the dehumidification device (500) may require maintenance and management.

[0072] FIG. 5 is a configuration diagram of a dehumidification device according to a second embodiment.

[0073] Referring to FIG. 5, the dehumidification device (600) according to the second embodiment may include a dehumidification box (610), a heater (620), and a blower (630, 640).

[0074] Additionally, the dehumidifying device (600) may include a regeneration container gas intake port (661), a regeneration container gas exhaust port (662), a dehumidifying gas intake port (663), and a dehumidifying gas exhaust port (664), and may include a pre-filter (671, 672) and a dehumidifying filter (674).

[0075] The regeneration container gas intake port (661) may be configured to supply gas used for regeneration of the dehumidification box (610). The gas sucked in through the regeneration container gas intake port (661) may be purified through a pre-filter (671) and then heated by a heater (620).

[0076] The heater (620) can heat the gas used for regenerating the dehumidification box (610), and the regeneration gas can be heated to a temperature of about 80 to 200°C by the heater (620). In addition, the regeneration gas can be heated to 100 to 180°C, and, for example, to 120°C.

[0077] The regeneration gas heated by the heater (620) moves to the dehumidification box (610) and can regenerate the absorbent contained in the dehumidification box (610). For example, regeneration can be achieved by the heated regeneration gas passing through the absorbent in the dehumidification box (610) and evaporating the moisture contained in the absorbent.

[0078] The dehumidification box (610) may include a desiccant and, for example, may include a dehumidification rotor. The dehumidification rotor of the dehumidification box (610) rotates so that the part requiring regeneration of the dehumidification rotor receives a regeneration gas, and the part to perform dehumidification receives a supply gas. The desiccant or the dehumidification rotor may be formed of a material including silica gel, a polymer, zeolite, etc.

[0079] The regeneration gas that has passed through the dehumidification box (610) can be blown through the blower (630), passed through the pre-filter (672), and discharged through the regeneration gas outlet (662). For example, the regeneration gas can be discharged to the outside.

[0080] The gas requiring dehumidification supplied into the EFEM chamber (112) can be drawn in through the dehumidifying gas intake port (663). The gas can be drawn in through the dehumidifying gas intake port (563) and supplied to the dehumidifying box (610).

[0081] The dehumidification box (610) can perform the function of removing moisture from the gas that requires dehumidification.

[0082] The dehumidified gas can be discharged from the dehumidification device (600) through a blower (640), and impurities, etc., can be purified by a dehumidification filter (674) before being discharged. For example, the dehumidification filter (674) can be formed as an Ultra-Low Penetration Air (ULPA) filter, but is not limited thereto, and a High Efficiency Particulate Air (HEPA) filter, a filter made of glass fiber, an activated carbon filter, etc., may be used, and can be varied as needed.

[0083] The dehumidified gas can be discharged through the dehumidified gas outlet (664).

[0084] The dehumidification box (610) may include a regeneration section where the absorbent is regenerated and a dehumidification section where the absorbent performs dehumidification of the gas.

[0085] The configuration in which gas regeneration takes place within the dehumidification device (600) may be positioned above the configuration that performs dehumidification. Specifically, the regeneration container gas intake port (661), the regeneration container gas exhaust port (662), the pre-filter (671), the heater (620), the blower (630), and the pre-filter (672) may be positioned in the upper part of the dehumidification device (600). In addition, the dehumidifying gas intake port (663), the dehumidifying gas exhaust port (664), the blower (640), and the dehumidifying filter (674) may be positioned in the lower part of the dehumidification device (600).

[0086] The dehumidification device (600) according to the second embodiment has a reduced size compared to a dehumidification device including a cooling device and a dehumidification filter, which may have advantages in terms of space utilization. In addition, the problem of cooling water leakage may not occur.

[0088] FIG. 6 is a drawing for explaining a first exemplary technology of an EFEM chamber equipped with cooling and filtering functions.

[0089] The EFEM chamber (112) according to the first example technology may include a dehumidifying device (500), a supply unit (462), a blower (440), a main filter (450), a first space (410), a perforated plate (481), a collection unit (480), and a recovery unit (461).

[0090] Additionally, a second space (430) may be formed between the blower (440) and the dehumidification device (500), but may not exist as needed.

[0091] The dehumidified gas from the dehumidification device (500) can be supplied to the blower (440) through the supply unit (462).

[0092] Here, the supply unit (462) may be configured to provide a passage for the movement of dehumidified gas.

[0093] The blower (440) may be configured to supply dehumidified gas to the first space (410).

[0094] The gas blown by the blower (440) can be purified through the main filter (450). Here, the main filter (450) may be formed as an Ultra-Low Penetration Air (ULPA) filter, but is not limited thereto, and may use a High Efficiency Particulate Air (HEPA) filter, a filter made of glass fiber, an Activated Carbon Filter, etc., and may be varied as needed.

[0095] The blower (440) and the main filter (450) can be called a fan-filter unit (FFU) as a single component.

[0096] The gas that has passed through the main filter (450) can be supplied to the first space (410).

[0097] The first space (410) may be a space formed within the main body (411), may be a space where the substrate temporarily stays, and may be called a stay space.

[0098] Specifically, the first space (410) is a space formed within the EFEM chamber (112), and the first space (410) may be a configuration formed within the main body (411) that constitutes a part of the EFEM chamber (112). Within the first space (410), the gas may form a vertical laminar flow flowing from top to bottom—a direction perpendicular to the ground. The first space (410) may be maintained at a low humidity state to prevent contamination of the substrate (W). Here, low humidity may mean, for example, relative humidity of 1% or less, 2% or less, 3% or less, 4% or less, 5% or less, 6% or less, 7% or less, 8% or less, 9% or less, or 10% or less.

[0099] The gas passing through the first space (410) can pass through a perforated plate (481) having a plurality of perforations and be collected in a collection unit (480). The perforated plate (481) can ensure that the flow of the gas is uniform.

[0100] The gas collected in the collection unit (480) can be supplied back to the dehumidification device (500) through the recovery unit (461).

[0101] Here, the recovery unit (461) may be configured to provide a passage that allows the gas to be supplied back to the dehumidification device (500).

[0102] The gas recovered through the recovery unit (461) can be dehumidified and cooled again through the dehumidification device (500) and supplied back to the first space (410).

[0103] In this way, an EFEM chamber in which gas circulates can be called a circulating EFEM.

[0105] FIG. 7 is a drawing for explaining a second exemplary technology of an EFEM chamber equipped with cooling and filtering functions.

[0106] The EFEM chamber (112) according to the second example technology may include a dehumidification device (600), a supply unit (462), a blower (440), a first space (410), and a recovery unit (461).

[0107] Since the dehumidification device (600) does not include a cooling device and a dehumidification filter, its size is reduced, which is advantageous for space utilization.

[0108] The supply unit (462) may include a filter (4621, 4624), a cooling device (4622), and a drain unit (4623).

[0109] The filter (4621, 4624) may be a chemical filter or formed as an Ultra-Low Penetration Air (ULPA) filter, but is not limited thereto, and may be a High Efficiency Particulate Air (HEPA) filter, a filter made of glass fiber, an activated carbon filter, etc., and may be changed in various ways as needed.

[0110] Additionally, the supply unit (462) may include, for example, two filters, but is not limited thereto, and may include one or three or more filters, and the placement position of the filters may be varied as needed.

[0111] The cooling device (4622) may include a cooling coil, and the cooling coil may be operated in such a way that cooling water flows inside and the gas is cooled as it comes into contact with the cooling coil.

[0112] The drain section (4623) may be configured to collect condensate generated from the cooling device (4622) and discharge it to the outside. Additionally, the drain section (4623) may also collect impurities generated from the dehumidification device (600) and discharge them to the outside.

[0113] By placing the filter and cooling device in the supply section (462), which is a component exposed to the outside of the EFEM chamber (112), instead of placing the filter and cooling device inside the dehumidification device (600), it may be advantageous for managing each component and space utilization.

[0115] FIG. 8 is a drawing for explaining a third exemplary technology of an EFEM chamber equipped with cooling and filtering functions.

[0116] The EFEM chamber (112) according to the third example technology may include a dehumidification device (600), a supply unit (462), a blower (440), a first space (410), and a recovery unit (461).

[0117] The recovery unit (461) may include a filter (4611, 4614), a cooling device (4612), and a drain unit (4613).

[0118] The filter (4611) may be a chemical filter or formed as an Ultra-Low Penetration Air (ULPA) filter, but is not limited thereto; it may be a High Efficiency Particulate Air (HEPA) filter, a filter made of glass fiber, an Activated Carbon Filter, etc., and may be varied as needed.

[0119] Additionally, the recovery unit (461) may include, for example, one filter, but is not limited thereto, and may include two or three or more filters, and the placement position of the filters may be varied as needed.

[0120] The cooling device (4612) may include a cooling coil, and the cooling coil may be operated in such a way that cooling water flows inside and the gas is cooled as it comes into contact with the cooling coil.

[0121] The drain section (4613) may be configured to collect condensate generated in the cooling device (4612) and discharge it to the outside. Additionally, the drain section (4613) may also collect impurities contained during the process of the gas passing through the first space (410) and discharge them to the outside.

[0123] FIG. 9 is a drawing for explaining a fourth exemplary technology of an EFEM chamber equipped with cooling and filtering functions.

[0124] The EFEM chamber (112) according to the fourth example technology may include a dehumidification device (500), a supply unit (462), a blower (440), a main filter (450), a first space (410), and a recovery unit (461).

[0125] The dehumidification device (500) may include a cooling device (550), and condensation or cooling water leaking from the cooling device (550) may occur, which can be collected in the drain section (4623) and discharged to the outside.

[0126] Referring to FIGS. 6 through 9, a cooling device for cooling the gas may be placed in one or more of a dehumidifying device, a supply unit (462), and a recovery unit (461). This may be selectively changed according to the convenience of the user. That is, if the temperature of the gas needs to be kept low, three or more cooling devices may be placed in the EFEM chamber (112).

[0127] The gas circulating in the EFEM chamber (112) can be cooled in multiple stages through cooling devices placed in the dehumidification device (500), supply unit (462), and recovery unit (461).

[0128] FIG. 10 is a drawing for explaining a fifth exemplary technology of an EFEM chamber equipped with cooling and filtering functions.

[0129] The EFEM chamber (112) according to the fifth example technology may include a dehumidifying device (600), a supply unit (462), a blower (440), a main filter (450), and a first space (410).

[0130] The dehumidification device (600) can perform dehumidification by receiving gas from the outside. The dehumidified gas from the dehumidification device (600) can be supplied to the blower (440) through the supply unit (462).

[0131] The supply unit (462) may include a filter (4621, 4624), and may also include a cooling device (4622) and a drain unit (4623).

[0132] The filter (4621, 4624) may be a chemical filter or formed as an Ultra-Low Penetration Air (ULPA) filter, but is not limited thereto, and may be a High Efficiency Particulate Air (HEPA) filter, a filter made of glass fiber, an activated carbon filter, etc., and may be changed in various ways as needed.

[0133] Additionally, the supply unit (462) may include, for example, two filters, but is not limited thereto, and may include one or three or more filters, and the placement position of the filters may be varied as needed.

[0134] The cooling device (4622) may include a cooling coil, and the cooling coil may be operated in such a way that cooling water flows inside and the gas is cooled as it comes into contact with the cooling coil.

[0135] The drain section (4623) may be configured to collect condensate generated from the cooling device (4622) and discharge it to the outside. Additionally, the drain section (4623) may also collect impurities generated from the dehumidification device (600) and discharge them to the outside.

[0136] The dehumidified gas supplied to the blower (440) can be supplied to the first space (410) via the main filter (450).

[0137] The first space (410) may be a space formed within the main body (411), may be a space where the substrate temporarily stays, and may be called a stay space.

[0138] Specifically, the first space (410) is a space formed within the EFEM chamber (112), and the first space (410) may be a configuration formed within the main body (411) that constitutes a part of the EFEM chamber (112). Within the first space (410), the gas may form a vertical laminar flow flowing from top to bottom—a direction perpendicular to the ground. The first space (410) may be maintained at a low humidity state to prevent contamination of the substrate (W). Here, low humidity may mean, for example, relative humidity of 1% or less, 2% or less, 3% or less, 4% or less, 5% or less, 6% or less, 7% or less, 8% or less, 9% or less, or 10% or less.

[0139] The gas passing through the first space (410) can pass through a perforated plate (481) having a plurality of perforations and be collected in a collection unit (480). The perforated plate (481) can ensure that the flow of the gas is uniform.

[0140] The gas that passes through the first space (410) can be discharged to the outside.

[0141] An EFEM chamber in which the gas passing through the first space (410) is not supplied to a dehumidification device but is discharged to the outside can be called a non-circulating EFEM chamber.

[0143] FIG. 11 is a drawing for explaining the sixth exemplary technology of an EFEM chamber equipped with cooling and filtering functions.

[0144] The EFEM chamber (112) according to the 6th example technology may include a dehumidifying device (500), a supply unit (462), a blower (440), a main filter (450), and a first space (410).

[0145] Here, the dehumidification device (500) may include a cooling device (550), and accordingly, the cooling of the dehumidified gas may be performed inside the dehumidification device (500).

[0146] The gas passing through the first space (410) passes through the perforated plate (481) and is collected in the collection unit (480) and can be discharged to the outside.

[0147] FIG. 12 is a drawing for explaining the seventh exemplary technology of an EFEM chamber equipped with cooling and filtering functions.

[0148] The EFEM chamber (112) according to the seventh example technology may include a dehumidifying device (500), a supply unit (462), a blower (440), a main filter (450), and a first space (410).

[0149] Here, the supply unit (462) may include a filter (4621, 4624), a cooling device (4622), and a drain unit (4623).

[0150] Accordingly, the gas dehumidified in the dehumidification device (500) can be cooled through a cooling device (550) placed inside the dehumidification device (500) and a cooling device (4622) placed in the supply unit (462).

[0151] The gas passing through the first space (410) passes through the perforated plate (481) and is collected in the collection unit (480) and can be discharged to the outside.

[0153] FIG. 13 is an example diagram illustrating a sensor placed in an EFEM chamber equipped with cooling and filtering functions.

[0154] Referring to FIG. 13, sensors may be placed within an EFEM chamber (112) according to one embodiment. Specifically, a differential pressure sensor (491), a temperature and humidity sensor (492), and a flow sensor (493) may be placed.

[0155] In FIG. 13, for convenience of explanation, one example of an EFEM chamber embodiment of the present invention is described, but it is not limited thereto and can be applied to various EFEM chambers.

[0156] The differential pressure sensor (491) is positioned before and after the filter to sense information regarding the pressure difference before and after the filter. For example, it can be positioned before and after the filter (4621, 4624) placed in the supply unit (462), before and after the main filter (450), and before and after the filter (4611) placed in the recovery unit (461).

[0157] The differential pressure sensor (491) can sense the pressure difference before and after the filter to sense information for controlling the airflow within the EFEM chamber (112). Accordingly, the lifespan of the filters used in the EFEM chamber (112) can be managed.

[0158] The temperature and humidity sensor (492) can sense information about the temperature and humidity of the space where the sensor is placed. For example, the temperature and humidity sensor (492) can be placed inside the first space (410), inside the supply unit (462), and inside the recovery unit (461).

[0159] The temperature and humidity sensor (492) can sense the temperature and humidity information of the space in which it is placed, and by controlling the dehumidification device (500, 600) and cooling device based on this, the humidity and temperature of the gas flowing in the EFEM chamber (112) can be appropriately controlled.

[0160] The flow sensor (493) can sense information about the gas flow in the space in which it is placed, and based on this, can sense information that serves as the basis for controlling the fan or other blowing devices that can be used in the blower (440) and the EFEM chamber (112).

[0161] Information sensed through the differential pressure sensor (491), temperature and humidity sensor (492), and flow sensor (493) can be transmitted to the control device (700), and accordingly, the user can appropriately control the configuration within the EFEM chamber (112).

[0162] FIG. 14 is a drawing for explaining a control device used in an EFEM chamber according to one embodiment.

[0163] The EFEM chamber (112) may include a control device (700). Here, for convenience of explanation, the control device (700) is described as a component of the EFEM chamber (112), but it may be formed as a separate component that can be separated from the EFEM chamber (112).

[0164] The control device (700) may be a configuration that performs information processing related to the EFEM, and may also be a configuration that controls the operation of the EFEM and the EFEM chamber configuration.

[0165] The control device (700) may be placed on the upper part of the EFEM chamber (112), but is not limited thereto and can be varied as needed. It may also be placed in a second space (430) formed between the dehumidification device (500, 600) of the EFEM chamber and the blower (440). Here, the second space (430) may be called a rack. Additionally, the control device (700) may be placed outside the EFEM or the EFEM chamber.

[0166] The control device (700) may include a command processing unit (710), a temperature acquisition unit (721), a humidity acquisition unit (722), a pressure acquisition unit (723), a blower operation controller (730), a memory unit (741), an input unit (742), an other operation controller (750), a valve operation controller (760), a dehumidifier controller (770), a dehumidification controller (771), a regeneration controller (772), an airflow controller (773), a communication module (780), and a screen display unit (790).

[0167] The command processing unit (710) may be a component that processes signals received from each component—e.g., a processor, etc.

[0168] The temperature acquisition unit (721) may be configured to acquire temperature information by measuring the temperature of the EFEM and the EFEM chamber. Specifically, it may be configured to acquire the temperature of the components of the EFEM, such as the outside air intake, the recovery unit, the dehumidification device, the blower and main filter inside the FFU, the collection unit, the perforated plate, and the retention space inside the main body. To acquire the temperature, a temperature sensor may be placed in each component of the EFEM and the EFEM chamber.

[0169] The humidity acquisition unit (722) may be configured to acquire humidity information by measuring the humidity of the EFEM and the EFEM chamber. Specifically, it may be configured to acquire humidity of the components of the EFEM, such as an outside air intake, a recovery unit, a dehumidification device, a blower and main filter inside the FFU, a collection unit, a perforated plate, a purification unit, a main valve, an outside air valve, a circulation valve, and a retention space inside the main body. To acquire humidity, a humidity sensor may be placed in each component of the EFEM and the EFEM chamber.

[0170] The pressure acquisition unit (723) may be configured to acquire pressure information by measuring the pressure of the EFEM and the EFEM chamber. Specifically, it may be configured to acquire pressure of the components of the EFEM, such as the outside air intake, recovery unit, dehumidification device, blower and main filter inside the FFU, collection unit, perforated plate, purification unit, main valve, outside air valve, circulation valve, and retention space inside the main body. To acquire pressure, a pressure sensor may be placed in each component of the EFEM and the EFEM chamber.

[0171] The blower operation controller (730) may be configured to control the operation of the blower in the EFEM chamber. That is, the blower operation controller (730) may control the on / off or wind speed of the blower included in the FFU.

[0172] The memory unit (741) may be a configuration that remembers the operation of each component of the EFEM chamber and may be a configuration that stores a process recipe.

[0173] The input unit (742) may be configured to input commands to operate each component of the EFEM and EFEM chamber. Additionally, the input unit (742) may be configured to transmit the received commands to the command processing unit (710).

[0174] The other operation controller (750) may be a component that controls the operation of additional components of the EFEM chamber. For example, the other operation controller (750) may control the operation of an ion controller that controls an ion bar. Here, the ion bar may be placed in the upper part of the space within the main body of the EFEM chamber and may remove static electricity generated by the gas flowing within the space where the gas flows. Here, various types of ion bars may be applied.

[0175] The valve operation controller (760) may be configured to control the on / off of a valve included in the EFEM chamber. That is, the operating mode of the EFEM chamber may be controlled by the valve operation controller (760). That is, the recovery unit (461), the supply unit (462), etc. may include a valve that controls the flow of gas, and the valve operation controller (760) may control the on / off of such valve.

[0176] The dehumidifier controller (770) may be configured to control the operation of the dehumidifier within the EFEM chamber, and the dehumidifier controller (770) may include a dehumidification controller (771), a regeneration controller (772), and an airflow controller (773). Specifically, the dehumidification controller (771) may be configured to control the dehumidification section of the dehumidification device, the regeneration controller (772) may be configured to control the supply of regeneration gas to the dehumidification device (500, 600), and the airflow controller (773) may be configured to control the flow of gas supplied to the dehumidification device (500, 600) by controlling the fan included in the dehumidification device (500, 600). Here, the dehumidification controller (771) may be configured to determine the degree of dehumidification of air in the dehumidification device (500, 600) and to control the size and location of the dehumidification unit, and the regeneration controller (772) may determine the degree of regeneration of the dehumidification unit and to control the heater and fan used for regeneration of the dehumidification unit. The airflow controller (773) may control the airflow by controlling the fan placed inside the dehumidifier used for the inflow and outflow of regeneration gas.

[0177] The communication module (780) may be configured to perform communication with the outside.

[0178] The display unit (790) may be configured to display the conditions inside the EFEM chamber on the screen, such as the process recipe, the temperature, humidity, and pressure inside the EFEM chamber, the airflow of the blower included in the dehumidifying FFU, and the on / off of the valve.

[0179] Terms such as "include," "compose," or "have" as described above, unless specifically stated otherwise, mean that the relevant component may be inherent; therefore, they should be interpreted as allowing for the inclusion of additional components rather than excluding them. All terms, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains, unless otherwise defined. Commonly used terms, such as those defined in advance, should be interpreted in accordance with their meaning in the context of the relevant technology and should not be interpreted in an ideal or overly formal sense unless explicitly defined in the present invention.

[0180] The foregoing description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are intended to explain, not limit, the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by these embodiments. The scope of protection of the present invention shall be interpreted by the claims below, and all technical concepts within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention. Explanation of the symbols

[0181] 100: Process System 110: EFEM 112: EFEM Chamber 114: Hehe 116: Load port module 120: Load lock device 130: Return chamber 140: Process Chamber W: Substrate D1, D2, D3, D4: Door 10: EFEM Chamber 20: Hehe 50: N2 311: N2 supply pipe 312: Differential pressure exhaust unit 500: Dehumidifier 510: Dehumidifying box 520: Heater 530, 540: Blower 550: Cooling device 600: Dehumidifier 610: Dehumidification unit 620: Heater 630, 640: Blower 410: First Space (Stay Space) 411: Main body 430: Second space (rack) 440: Blower 450: Main filter 491: Differential pressure sensor 492: Temperature and humidity sensor 493: Flow sensor

Claims

Claim 1 A Front-Opening Unified Pod (FOUP) on which a substrate is loaded; a main body communicating with the FOUP through a door and having a retention space formed inside where the transported substrate can stay; a dehumidifying device for dehumidifying gas supplied to the retention space; and a blower for receiving the gas dehumidified by the dehumidifying device and supplying it to the retention space. The apparatus comprises: a supply unit exposed to the outside of the EFEM chamber, which includes a cooling device that cools the gas and provides a passage for the gas dehumidified from the dehumidification device to be supplied to the blower; wherein the supply unit further includes a drain unit that collects condensate generated during the cooling process of the dehumidified gas and discharges the condensate to the outside; wherein the supply unit includes one or more of a chemical filter and a ULPA (Ultra-Low Penetration Air) filter; and wherein the dehumidification device comprises: a dehumidification unit that performs dehumidification of the gas; a heater that heats the regeneration gas used for regeneration of the dehumidification rotor of the dehumidification unit; a regeneration blower that discharges the regeneration gas used for regeneration of the dehumidification rotor of the dehumidification unit to the outside; a dehumidification blower that discharges the gas dehumidified after passing through the dehumidification unit; a regeneration gas intake port to which the regeneration gas is supplied; and a regeneration gas discharge port to which the regeneration gas is blown through the regeneration blower and discharged after passing through a pre-filter. EFEM further comprises: a pre-filter that purifies gas sucked in through the regeneration container gas intake port or purifies gas discharged through the regeneration container gas outlet port; wherein the heater, the regeneration blower, the regeneration container gas intake port, the regeneration container gas outlet port, and the pre-filter are positioned above the dehumidification blower within the dehumidification device, and a differential pressure sensor that senses the differential pressure of the gas by being positioned before and after the chemical filter and ULPA filter within the supply unit and before and after the blower. Claim 2 delete Claim 3 delete Claim 4 In claim 1, the cooling device comprises a cooling coil that receives cooling water and performs cooling of the gas, EFEM. Claim 5 In claim 1, the gas passing through the retention space is discharged to the outside, EFEM. Claim 6 EFEM according to claim 1, further comprising a recovery unit that provides a passage for the gas passing through the retention space to be recovered to the dehumidification device. Claim 7 In claim 6, the recovery unit further comprises a cooling device for cooling the gas, EFEM. Claim 8 In claim 7, the recovery unit further comprises a drain unit that collects cooling water generated during the process of cooling the gas passing through the retention space or cooling water generated from a leak, and discharges it to the outside, EFEM. Claim 9 In claim 6, the recovery unit further comprises one or more of a chemical filter and a ULPA filter, EFEM. Claim 10 delete Claim 11 delete Claim 12 The EFEM of claim 1 further comprises: a temperature and humidity sensor disposed in the supply unit and the residence space for sensing temperature and humidity; and a flow sensor disposed in the supply unit and the residence space for sensing the flow rate of gas. Claim 13 In claim 12, the EFEM further comprises a control device that receives sensing information from the differential pressure sensor, the temperature and humidity sensor, and the flow sensor, and controls the dehumidification device and the blower based thereon.

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