Hybrid qfn package structure with RF input and output module

Abstract

The present invention relates to a hybrid QFN package having an RF input / output module, comprising: a ceramic-based inorganic layer including HTCC (High Temperature Co-fired Ceramic) stacked in multiple layers, and a plurality of signal lines, a plurality of grounds, and a plurality of vias for handling RF input / output, comprising a first RF input / output module and a second RF input / output module; a heat sink provided in the space between the first RF input / output module and the second RF input / output module; and a housing provided on the side of the first RF input / output module, the second RF input / output module, and the heat sink; thereby enabling improved RF performance while being advantageous for mass production.

Description

Technology Field

[0001] The present invention relates to a hybrid QFN package having RF input / output modules that can improve RF performance while being advantageous for mass production by providing a package comprising a plurality of RF input / output modules responsible for RF input / output, wherein a plurality of ceramic-based inorganic layers including HTCC (High Temperature Co-fired Ceramic) are stacked and a plurality of signal lines, a plurality of grounds, and a plurality of vias are provided, a heat sink provided in the space between the plurality of RF input / output modules, and a housing provided on the side of the plurality of RF input / output modules and the heat sink. Background Technology

[0002] As is well known, as the commercialization of millimeter wave (mmWave, 30-300 GHz) systems, such as 5G / 6G mobile communications and automotive radar, accelerates, the importance of packaging technology that simultaneously satisfies high RF performance and price competitiveness is emerging.

[0003] Conventional high-temperature co-fired ceramic (HTCC) packages are ceramic substrate packages formed by laminating a green sheet of glass powder mixed with ceramic powder such as alumina (Al2O3), printing a metal pattern, and co-firing at a high temperature of approximately 1600°C or higher. When using ceramics with low dielectric loss to transmit millimeter wave signals, they exhibit excellent RF characteristics with reduced signal attenuation. They also have high thermal conductivity and a low coefficient of thermal expansion, making them suitable for high-power devices and high-temperature environments. Furthermore, they allow for the integration of structures such as resonators and filters, and offer advantages in long-term moisture resistance and heat resistance.

[0004] As such, while High Temperature Co-fired Ceramic (HTCC) packages offer excellent performance, there are limitations to mass production due to high manufacturing costs and process complexity.

[0005] In addition, standard organic-based packages utilize organic insulating substrates based on epoxy resin and are widely used in applications such as semiconductor substrates, mobile devices, and high-speed communication equipment. They offer advantages such as low material costs and a simple production process, making them suitable for mass production; the ability to apply PCB-based automation processes; excellent processability resulting in high productivity; and the flexibility to design by enabling compatibility with various package form factors through the use of complex designs, multilayer structures, and integration.

[0006] As such, standard organic-based packages are inexpensive but suffer from performance degradation due to significant signal loss at high frequencies.

[0007] Meanwhile, as the demand for 100 Gbps to 800 Gbps optical communication systems required in data centers, ultra-high-speed switching equipment, and optical interconnects has recently increased rapidly, there is a demand for high-performance packaging technology applied to optical transceivers and optical transceiver modules.

[0008] Conventional optical communication packages primarily utilize TO-CAN (Transistor Outline Can) packages, TOSA (Transmitter Optical Sub-Assembly), ROSA (Receiver Optical Sub-Assembly) forms, or ceramic-based optical packages. These packages house internal components such as laser diodes (e.g., DFB (Distributed Feedback) lasers, EML (Electro-absorption Modulated Laser)), photodiodes (PD), and transimpedance amplifiers (TIA) to convert high-speed optical signals into electrical signals or perform the reverse function.

[0009] While these optical packages offer advantages such as high optical alignment accuracy, thermal stability, low signal distortion, and high reliability, they require manual alignment, involve complex processes, and present disadvantages for mass production due to the high difficulty of assembling individual components and increased manufacturing costs.

[0010] Furthermore, in recent highly integrated optical communication technologies such as Co-Packaged Optics (CPO), Silicon Photonics (SiPh)-based optical modules, and Active Optical Cables (AOC), high-speed electrical signal routing and thermal management of optical devices are simultaneously required; consequently, it is becoming difficult to satisfy the combined demands of high frequency and optical communication using only existing ceramic-based or organic-based packages.

[0011] As such, optical communication packages also face challenges such as signal loss in high-frequency bands, thermal management limitations, and manufacturing process complexity, necessitating a new type of hybrid packaging technology that balances electrical high-frequency performance, thermal characteristics, and manufacturing costs.

[0012] Accordingly, there is a need for the development of hybrid QFN (Quad Flat No-lead) packages that are advantageous for mass production and can improve RF performance. Prior art literature

[0013] 1. Korean Patent Publication No. 10-2021-0128189 (Published Oct. 26, 2021) The problem to be solved

[0014] The present invention aims to provide a hybrid QFN package having RF input / output modules that can improve RF performance while being advantageous for mass production by providing a package comprising a plurality of RF input / output modules responsible for RF input / output, wherein a plurality of ceramic-based inorganic layers including HTCC are stacked and a plurality of signal lines, a plurality of grounds, and a plurality of vias are provided, a heat sink provided in the space between the plurality of RF input / output modules, and a housing provided on the side of the plurality of RF input / output modules and the heat sink.

[0015] The purposes of the embodiments of the present invention are not limited to those mentioned above, and other unmentioned purposes will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0016] According to an embodiment of the present invention, a hybrid QFN package may be provided having RF input / output modules comprising: a plurality of RF input / output modules responsible for RF input / output, wherein a plurality of ceramic-based inorganic layers including HTCC (High Temperature Co-fired Ceramic) are stacked, and a plurality of signal lines, a plurality of grounds, and a plurality of vias are provided; a heat sink provided in the space between the plurality of RF input / output modules; and a housing provided on the side of the plurality of RF input / output modules and the heat sink.

[0017] In addition, according to an embodiment of the present invention, a hybrid QFN package may be provided in which the plurality of RF input / output modules are each configured with a Grounded Coplanar Waveguide (GCPW) structure and an RF input / output module is disposed on at least one of the four sides of the package.

[0018] Additionally, according to an embodiment of the present invention, one RF input / output module among the plurality of RF input / output modules comprises: a 1-1 signal line provided in a lower central portion, a 1-1 lower ground provided on both sides of the 1-1 signal line, and a 1-1 upper ground provided on the upper portion corresponding to the 1-1 lower ground, wherein the 1-1 lower ground and the 1-1 upper ground are vertically connected through a plurality of 1-1 ground vias; and a 1-2 HTCC layer provided on the upper portion of the 1-1 HTCC layer, wherein a 1-2 signal line is provided in an upper central portion corresponding to the 1-1 signal line and is vertically connected via a 1-1 signal line via, and a 1-2 upper ground is provided on both sides of the 1-2 signal line and is vertically connected to the 1-1 upper ground through a plurality of 1-2 ground vias. A hybrid QFN package having an RF input / output module may be provided, comprising: a first-3 HTCC layer provided on the upper portion of the first-2 HTCC layer such that the inner portion of the first-2 upper ground is exposed while the first-2 signal line is exposed, wherein the first-3 upper ground is provided on the upper portion and the first-3 HTCC layer is vertically connected to the first-2 upper ground through a plurality of first-3 ground vias.

[0019] Additionally, according to an embodiment of the present invention, among the plurality of RF input / output modules, the other RF input / output module comprises: a 2-1 signal line provided in a lower central portion, a 2-1 lower ground provided on both sides of the 2-1 signal line, and a 2-1 upper ground provided on the upper portion corresponding to the 2-1 lower ground, wherein the 2-1 lower ground and the 2-1 upper ground are vertically connected through a plurality of 2-1 ground vias; and a 2-2 HTCC layer provided on the upper portion of the 2-1 HTCC layer, wherein a 2-2 signal line is provided in an upper central portion corresponding to the 2-1 signal line and is vertically connected via a 2-1 signal line via, and a 2-2 upper ground is provided on both sides of the 2-2 signal line and is vertically connected to the 2-1 upper ground through a plurality of 2-2 ground vias. A hybrid QFN package having an RF input / output module may be provided, comprising: a second-3 HTCC layer provided on the upper portion of the second-2 HTCC layer such that the inner portion of the second-2 upper ground is exposed while the second-2 signal line is exposed, wherein the second-3 upper ground is provided on the upper portion and the second-3 HTCC layer is vertically connected to the second-2 upper ground through a plurality of second-3 ground vias.

[0020] Additionally, according to an embodiment of the present invention, a hybrid QFN package having an RF input / output module may be provided, wherein the housing comprises a first-side housing and a second-side housing, wherein the first-side housing and the second-side housing are each formed as a rectangular stepped block corresponding to the first-side RF input / output module and the second-side RF input / output module, and an electrode pattern having a plurality of DC electrodes provided on the inner upper portion exposed according to the rectangular stepped block and a plurality of lower electrode pads provided on the lower portion of the housing body, and vertically connected through a plurality of electrode vias.

[0021] In addition, according to an embodiment of the present invention, the housing may be provided with a hybrid QFN package having an RF input / output module manufactured by any one of plastic molding, injection molding, compression molding, metal powder injection (MIM), and ceramic molding methods.

[0022] In addition, according to an embodiment of the present invention, the hybrid QFN package may be provided with an RF input / output module further comprising an optical communication connector provided on one side of the housing. Effects of the invention

[0023] The present invention provides a package comprising a plurality of RF input / output modules responsible for RF input / output, wherein a plurality of ceramic-based inorganic layers including HTCC are stacked and a plurality of signal lines, a plurality of grounds, and a plurality of vias are provided, a heat sink provided in the space between the plurality of RF input / output modules, and a housing provided on the side of the plurality of RF input / output modules and the heat sink, thereby making it advantageous for mass production and improving RF performance. Brief explanation of the drawing

[0024] FIG. 1 is a diagram illustrating a hybrid QFN package equipped with an RF input / output module according to an embodiment of the present invention, and FIGS. 2 to 8 are drawings for explaining the detailed configuration of a hybrid QFN package equipped with an RF input / output module according to an embodiment of the present invention, and FIG. 9 is a drawing illustrating another form of a hybrid QFN package equipped with an RF input / output module according to an embodiment of the present invention. Specific details for implementing the invention

[0025] The advantages and features of the embodiments of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same components.

[0026] In describing the embodiments of the present invention, specific descriptions of known functions or configurations will be omitted if it is determined that such detailed descriptions could unnecessarily obscure the essence of the invention. Furthermore, the terms described below are defined in consideration of their functions in the embodiments of the present invention, and these definitions may vary depending on the intentions or practices of the user or operator. Therefore, such definitions should be based on the content throughout this specification.

[0027] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.

[0028] FIG. 1 is a drawing illustrating a hybrid QFN package equipped with an RF input / output module according to an embodiment of the present invention, and FIG. 2 to 8 are drawings for explaining the detailed configuration of a hybrid QFN package equipped with an RF input / output module according to an embodiment of the present invention.

[0029] Referring to FIGS. 1 to 8, a hybrid QFN package having an RF input / output module according to an embodiment of the present invention may include a plurality of RF input / output modules (10), including one side RF input / output module (100), another side RF input / output module (200), etc., a heat sink (300), a housing (400), etc.

[0030] A plurality of RF input / output modules (10) are modules responsible for RF input / output, having a plurality of stacked ceramic-based inorganic layers including HTCC (High Temperature Co-fired Ceramic), a plurality of signal lines, a plurality of grounds, and a plurality of vias, and may include one side RF input / output module (100), another side RF input / output module (200), etc.

[0031] Each of these multiple RF input / output modules (10) is provided with a Grounded Coplanar Waveguide (GCPW) structure and can be positioned on at least one of the four sides of the package.

[0032] Here, one side RF input / output module (100) and the other side RF input / output module (200) have a plurality of ceramic-based inorganic layers including HTCC (High Temperature Co-fired Ceramic) stacked, and are equipped with a plurality of signal lines, a plurality of grounds, and a plurality of vias to handle RF input / output.

[0033] These one-sided RF input / output module (100) and the other-sided RF input / output module (200) can each be provided with a Grounded Coplanar Waveguide (GCPW) structure, wherein a signal line through which an RF signal flows is arranged in the center, left and right side grounds are arranged to surround both sides of the signal line on the same plane, and a bottom ground can be arranged on the bottom of the substrate.

[0034] This GCPW structure allows for the design of desired characteristic impedance, facilitating impedance control. It also provides effective signal shielding to reduce electromagnetic radiation and minimize radiation loss. Furthermore, it offers the advantages of low signal loss in the millimeter wave band and the ability to secure stable RF performance even with fine patterns.

[0035] The RF input / output module (100) described above may include a first-1 HTCC layer (110), a first-2 HTCC layer (120), a first-3 HTCC layer (130), etc.

[0036] Here, the first-1 HTCC layer (110) is provided with a first-1 signal line (111) in the lower central part, and a first-1 lower ground (112) is provided on both sides of the first-1 signal line (111), and a first-1 upper ground (113) is provided on the upper part corresponding to the first-1 lower ground (112), and the first-1 lower ground (112) and the first-1 upper ground (113) can be vertically connected through a plurality of first-1 ground vias (114).

[0037] This first-1 HTCC layer (110) can be provided as a ceramic material through processes such as cutting after producing a sheet by mixing alumina (Al2O3) powder, and a first-1 signal line (111) can be printed by screen printing or the like in the lower central part of the first-1 HTCC layer (110), and a first-1 lower ground (112) can be printed by screen printing or the like on both sides of the first-1 signal line (111), and a first-1 upper ground (113) can be printed by screen printing or the like in a shape that wraps the first-1 signal line via (122) described later on the upper part of the first-1 HTCC layer (110) corresponding to the area where the first-1 lower ground (112) is printed.

[0038] Here, the 1-1 lower ground (112) and the 1-1 upper ground (113) can be vertically connected through a plurality of 1-1 ground vias (114) in which a conductive material such as tungsten, gold, silver, or copper is filled, for example, after forming a plurality of through grooves in the 1-1 HTCC layer (110) in the corresponding area by means such as punching.

[0039] The first-2 HTCC layer (120) is provided on the upper part of the first-1 HTCC layer (110), and a first-2 signal line (121) is provided in the upper central part corresponding to the first-1 signal line (111) and is vertically connected to the first-1 signal line via (122), and a first-2 upper ground (123) is provided on both sides of the first-2 signal line (121) and can be vertically connected to the first-1 upper ground (113) through a plurality of first-2 ground vias (124).

[0040] These first-2 HTCC layers (120) can be provided as ceramic materials through processes such as cutting after producing a sheet by mixing alumina (Al2O3) powder, and can be laminated on the upper part of the first-1 HTCC layer (110) with a similar size, and a first-2 signal line (121) can be printed in the upper central part by a method such as screen printing corresponding to the first-1 signal line (111) provided on the lower part of the first-1 HTCC layer (110), and after forming a through groove in the first-1 HTCC layer (110) and the first-2 HTCC layer (120) in the central part of the first-2 HTCC layer (120) in the area by a method such as punching, a first-1 signal line via (122) can be vertically connected to which a conductive material such as tungsten, gold, silver, or copper is filled inside.

[0041] And, a first-2 upper ground (123) can be printed on both sides of a first-2 signal line (121) formed on the upper side of the first-2 HTCC layer (120) by a method such as screen printing, and the first-2 upper ground (123) can be vertically connected to the first-1 upper ground (113) of the first-1 HTCC layer (110) through a plurality of first-2 ground vias (124) in which a conductive material such as tungsten, gold, silver, or copper is filled inside, for example, after forming a plurality of through grooves in the first-2 HTCC layer (120) by a method such as punching.

[0042] The 1-3 HTCC layer (130) is provided on the upper part of the 1-2 HTCC layer (120) such that the inner part of the 1-2 upper ground (123) is exposed while the 1-2 signal line (121) is exposed, and the 1-3 upper ground (131) is provided on the upper part and can be vertically connected to the 1-2 upper ground (123) through a plurality of 1-3 ground vias (132).

[0043] These first-3rd HTCC layers (130) can be provided as ceramic material by mixing alumina (Al2O3) powder to produce a sheet and then cutting it, and can be laminated on top of the first-2nd HTCC layer (120) in a form having a width length of approximately half the width of the first-1st HTCC layer (110) and the first-2nd HTCC layer (120), with a concave groove formed in the central part where the signal line is placed.

[0044] And, depending on the shape of the first-3rd HTCC layer (130), when the first-3rd HTCC layer (130) is laminated on top of the first-2nd HTCC layer (120), the first-2nd signal line (121) provided on top of the first-2nd HTCC layer (120) may be exposed, and the inner portion of the first-2nd upper ground (123) provided on top of the first-2nd HTCC layer (120) may be exposed, and the first-3rd upper ground (131) may be printed on top of the first-3rd HTCC layer (130) by a method such as screen printing.

[0045] Additionally, a plurality of through grooves are formed in the 1-3 upper ground (131) provided on the upper part of the 1-3 HTCC layer (130) by means such as punching, and then the 1-2 upper ground (123) provided on the upper part of the 1-2 HTCC layer (120) can be vertically connected through a plurality of 1-3 ground vias (132) filled with a conductive material, for example, tungsten, gold, silver, copper.

[0046] Additionally, the other side RF input / output module (200) may include a 2-1 HTCC layer (110), a 2-2 HTCC layer (220), a 2-3 HTCC layer (230), etc.

[0047] Here, the 2-1 HTCC layer (210) is provided with a 2-1 signal line (211) in the lower central part, and a 2-1 lower ground (212) is provided on both sides of the 2-1 signal line (211), and a 2-1 upper ground (213) is provided on the upper part corresponding to the 2-1 lower ground (212), and the 2-1 lower ground (212) and the 2-1 upper ground (213) can be vertically connected through a plurality of 2-1 ground vias (214).

[0048] This second-1 HTCC layer (210) can be provided as a ceramic material by mixing alumina (Al2O3) powder to produce a sheet and then cutting it. A second-1 signal line (211) can be printed in the lower central part of the second-1 HTCC layer (210) by a screen printing method, and a second-1 lower ground (212) can be printed on both sides of the second-1 signal line (211) by a screen printing method. A second-1 upper ground (213) can be printed on the upper part of the second-1 HTCC layer (210) by a screen printing method in a manner that surrounds the second-1 signal line via (222) described later, corresponding to the area where the second-1 lower ground (212) is printed.

[0049] Here, the 2-1 lower ground (212) and the 2-1 upper ground (213) can be vertically connected through a plurality of 2-1 ground vias (214) in which a conductive material such as tungsten, gold, silver, or copper is filled, for example, after forming a plurality of through grooves in the 2-1 HTCC layer (210) in the corresponding area by means such as punching.

[0050] The 2-2 HTCC layer (220) is provided on the upper part of the 2-1 HTCC layer (210), and a 2-2 signal line (221) is provided in the upper central part corresponding to the 2-1 signal line (211) and is vertically connected to the 2-1 signal line via (222), and a 2-2 upper ground (223) is provided on both sides of the 2-2 signal line (221) and can be vertically connected to the 2-1 upper ground (213) through a plurality of 2-2 ground vias (224).

[0051] This second-2nd HTCC layer (220) can be provided as a ceramic material by mixing alumina (Al2O3) powder to produce a sheet and then cutting it, and can be laminated on the upper part of the second-1st HTCC layer (210) with a similar size, and a second-2nd signal line (221) can be printed in the upper central part by a method such as screen printing in correspondence with the second-1st signal line (211) provided on the lower part of the second-1st HTCC layer (210), and after forming a through groove in the second-1st HTCC layer (210) and the second-2nd HTCC layer (220) in the central part of the second-2nd HTCC layer (220) in the area by a method such as punching, it can be vertically connected to a second-1st signal line via (222) in which a conductive material such as tungsten, gold, silver, or copper is filled inside.

[0052] And, a second-2 upper ground (223) can be printed on both sides of a second-2 signal line (221) formed on the upper side of the second-2 HTCC layer (220) by a method such as screen printing, and the second-2 upper ground (223) can be vertically connected to the second-1 upper ground (213) of the second-1 HTCC layer (210) through a plurality of second-2 ground vias (224) in which a conductive material such as tungsten, gold, silver, or copper is filled inside, for example, after forming a plurality of through grooves in the second-2 HTCC layer (220) by a method such as punching.

[0053] The 2-3 HTCC layer (230) is provided on the upper part of the 2-2 HTCC layer (220) such that the inner part of the 2-2 upper ground (223) is exposed while the 2-2 signal line (221) is exposed, and the 2-3 upper ground (231) is provided on the upper part and can be vertically connected to the 2-2 upper ground (223) through a plurality of 2-3 ground vias (232).

[0054] This second-third HTCC layer (230) can be provided as a ceramic material by mixing alumina (Al2O3) powder to produce a sheet and then cutting it, and can be laminated on top of the second-second HTCC layer (220) in a form having a width length of approximately 1 / 2 based on the width of the second-first HTCC layer (210) and the second-second HTCC layer (220), with a concave groove formed in the central part where the signal line is arranged.

[0055] And, depending on the shape of the second-third HTCC layer (230), when the second-third HTCC layer (230) is laminated on top of the second-second HTCC layer (220), the second-second signal line (221) provided on top of the second-second HTCC layer (220) may be exposed, and the inner portion of the second-second upper ground (223) provided on top of the second-second HTCC layer (220) may be exposed, and the second-third upper ground (231) may be printed on top of the second-third HTCC layer (230) by a method such as screen printing.

[0056] Additionally, a plurality of through grooves are formed in the 2-3 upper ground (231) provided on the upper part of the 2-3 HTCC layer (230) by means such as punching, and then the 2-2 upper ground (223) provided on the upper part of the 2-2 HTCC layer (220) can be vertically connected through a plurality of 2-3 ground vias (232) filled with a conductive material, for example, tungsten, gold, silver, copper.

[0057] The heat sink (300) is a component provided in the space between the RF input / output module (100) on one side and the RF input / output module (100) on the other side, and can not only stabilize RF performance but also perform a heat dissipation management function.

[0058] These heat sinks (300) are provided in the internal center of the housing (400) which is positioned on both sides (front and rear in the drawing), and on one side of the RF input / output module (100) and the other side of the RF input / output module (200) which are positioned on each of the four sides, so as to cool the heat-generating element inside the package.

[0059] The housing (400) is a component provided on the side of the RF input / output module (100), the RF input / output module (200), and the heat sink (300), and includes a housing (400A) and a housing (400B), wherein the housing (400A) and the housing (400B) may each include a housing body (410), an electrode pattern (420), etc.

[0060] Here, the housing body (410) is formed as a rectangular stepped block corresponding to one side RF input / output module (100) and the other side RF input / output module (200), and can be manufactured by a plastic molding method using materials such as EMC (Epoxy Molding Compound), BT resin (Bismalemide-Triazine Resin), and polyimide.

[0061] This housing body (410) is positioned on the side (front and rear in the drawing) of the RF input / output module (100) and the other RF input / output module (200), and may be provided as a stepped block according to the stepped shape formed by the first-2nd HTCC layer (120) and the first-3rd HTCC layer (130) of the RF input / output module (100) and the stepped shape formed by the second-2nd HTCC layer (220) and the second-3rd HTCC layer (230) of the RF input / output module (200).

[0062] The electrode pattern (420) is provided with a plurality of DC electrodes (421) on the inner upper portion exposed according to the rectangular stepped shape of the housing body (410), and a plurality of lower electrode pads (422) on the lower portion of the housing body (410), and can be vertically connected through a plurality of electrode vias (423).

[0063] Here, a plurality of DC electrodes (421) may be arranged in a radially inclined manner toward the center, a plurality of lower electrode pads (422) may be arranged horizontally in a number corresponding to the number of DC electrodes (421), and a plurality of electrode vias (423) may be provided to be arranged in an internal position within the thick area of ​​the stepped block.

[0064] The housing (400) described above can be manufactured using any one of the following methods: plastic molding, injection molding, compression molding, metal powder injection (MIM), and ceramic molding. First, a plurality of DC electrodes (421), a plurality of lower electrode pads (422), and a plurality of electrode vias (423) included in the metal pattern (420) can each be manufactured from a conductive material such as tungsten, gold, silver, or copper. The surfaces of these plurality of DC electrodes (421), the plurality of lower electrode pads (422), and the plurality of electrode vias (423) can be plated with a material such as gold, silver, or nickel to improve adhesion and electrical properties.

[0065] Then, after preparing a mold that defines the external shape and internal space of the housing (400), a plurality of DC electrodes (421), a plurality of lower electrode pads (422), and a plurality of electrode vias (423) included in the metal pattern (420) can be inserted and fixed inside the mold.

[0066] Next, a housing body (410) can be formed by preheating and pressing EMC, BT resin, etc. into a mold in which a metal pattern (420) is fixed, and then separating it from the mold after performing a predetermined curing process and cooling process, thereby manufacturing the housing (400) by a plastic molding method.

[0067] Meanwhile, in the embodiment of the present invention as described above, the hybrid QFN package equipped with an RF input / output module is described as including a plurality of RF input / output modules (10), including one side RF input / output module (100) and the other side RF input / output module (200), a heat sink (300), a housing (400), etc., but as shown in FIG. 9, an optical communication connector (500) may be further provided on the housing (400) on one side.

[0068] Such optical communication connectors (500) may be provided in the form of cylindrical terminals to connect optical fibers for optical communication, including, for example, a snout.

[0069] Accordingly, according to an embodiment of the present invention, by providing a package comprising a plurality of RF input / output modules responsible for RF input / output, wherein a plurality of ceramic-based inorganic layers including HTCC are stacked and a plurality of signal lines, a plurality of grounds, and a plurality of vias are provided, a heat sink provided in the space between the plurality of RF input / output modules, and a housing provided on the side of the plurality of RF input / output modules and the heat sink, it is possible to improve RF performance while being advantageous for mass production.

[0070] Although various embodiments of the present invention have been presented and described in the above description, the present invention is not necessarily limited thereto, and those skilled in the art will readily understand that various substitutions, modifications, and changes are possible within the scope of the technical concept of the present invention. Explanation of the symbols

[0071] 10: Multiple RF input / output modules 100: One-sided RF input / output module 110 : 1-1 HTCC layer 120 : 1st-2nd HTCC layer 130 : 1st-3rd HTCC layers 200 : Other side RF input / output module 210 : HTCC layer 2-1 220 : 2-2 HTCC layer 230 : 2nd-3rd HTCC layer 300 : Heatsink 400 : Housing 410 : Housing body 420 : Electrode pattern 500 : Optical communication connector

Claims

Claim 1 A plurality of RF input / output modules responsible for RF input / output, wherein a plurality of ceramic-based inorganic layers including HTCC (High Temperature Co-fired Ceramic) are stacked and a plurality of signal lines, a plurality of grounds, and a plurality of vias are provided; and a heatsink provided in the space between the plurality of RF input / output modules; and a housing provided on the side of the plurality of RF input / output modules and heat sinks; wherein each of the plurality of RF input / output modules is provided with a GCPW (Grounded Coplanar Waveguide) structure and is disposed on at least one of the four sides of a package, a signal line through which an RF signal flows is disposed in the central part, left and right side grounds are disposed to surround both sides of the signal line in the same plane, and a lower ground is disposed on the lower part of the substrate, and one of the plurality of RF input / output modules has a first-1 signal line provided in the lower central part, first-1 lower grounds provided on both sides of the first-1 signal line, and a first-1 upper ground provided on the upper part corresponding to the first-1 lower ground, wherein the first-1 lower ground and the first-1 upper ground are vertically connected through a plurality of first-1 ground vias; and a first-1 HTCC layer provided on the upper part of the first-1 HTCC layer, wherein the first-1 signal line is to Correspondingly, a first-2 signal line is provided in the upper central portion and is vertically connected via a first-1 signal line via, and a first-2 upper ground is provided on both sides of the first-2 signal line, and a first-2 HTCC layer is vertically connected to the first-1 upper ground through a plurality of first-2 ground vias; and a first-3 HTCC layer is provided on the upper portion of the first-2 HTCC layer such that the inner portion of the first-2 upper ground is exposed while the first-2 signal line is exposed, and a first-3 upper ground is provided on the upper portion and is vertically connected to the first-2 upper ground through a plurality of first-3 ground vias; wherein the first-1 HTCC layer comprisesA sheet is produced by mixing alumina (Al2O3) powder and then provided as a ceramic material through a cutting process, wherein the 1-1 signal line, 1-1 lower ground, and 1-1 upper ground are each printed by a screen printing method, and the 1-1 lower ground and 1-1 upper ground are vertically connected through the plurality of 1-1 ground vias, in which a plurality of through grooves are formed in the 1-1 HTCC layer by a punching method in the corresponding area and a conductive material selected from tungsten, gold, silver, and copper is filled inside; and the 1-2 HTCC layer is provided as a ceramic material through a cutting process after producing a sheet by mixing alumina (Al2O3) powder, wherein the 1-2 signal line is printed by a screen printing method, and after forming through grooves in the 1-1 HTCC layer and the 1-2 HTCC layer by a punching method, tungsten, gold, silver, and The first signal line via is vertically connected to the first signal line via, which is filled with a conductive material selected from copper; the first upper ground is printed by a screen printing method; the first upper ground is vertically connected to the first upper ground through a plurality of first ground vias, which are filled with a conductive material selected from tungsten, gold, silver, and copper, after forming a plurality of through grooves in the first HTCC layer by a punching method; the first HTCC layer is provided as a ceramic material through a cutting process after producing a sheet by mixing alumina (Al2O3) powder, and is laminated on the upper part of the first HTCC layer in a form having a relatively smaller width length based on the width of the first HTCC layer and the first HTCC layer, and having a concave groove formed in the central part where the signal line is arranged; and when the first HTCC layer is laminated on the upper part of the first HTCC layer, the As the 1-2 signal line is exposed, the inner part of the 1-2 upper ground is exposed, and the 1-3 upper ground is printed on the upper part using a screen printing method, andAfter forming a plurality of through grooves in the 1-3 upper ground by a punching method, the plurality of 1-3 ground vias, which are filled with a conductive material selected from tungsten, gold, silver, and copper, are vertically connected to the 1-2 upper ground through the plurality of 1-3 ground vias, and among the plurality of RF input / output modules, the other RF input / output module comprises: a 2-1 signal line provided in the lower central portion, a 2-1 lower ground provided on both sides of the 2-1 signal line, a 2-1 upper ground provided above corresponding to the 2-1 lower ground, wherein the 2-1 lower ground and the 2-1 upper ground are vertically connected through a plurality of 2-1 ground vias; and a 2-1 HTCC layer provided above the 2-1 HTCC layer, wherein a 2-2 signal line is provided in the upper central portion corresponding to the 2-1 signal line and is vertically connected via a 2-1 signal line via, and the 2-2 A 2-2 upper ground is provided on both sides of a signal line, and a 2-2 HTCC layer vertically connected to the 2-1 upper ground through a plurality of 2-2 ground vias; and a 2-3 HTCC layer provided on the upper portion of the 2-2 HTCC layer such that the inner portion of the 2-2 upper ground is exposed as the 2-2 signal line is exposed, wherein the 2-3 upper ground is provided on the upper portion and the 2-3 HTCC layer is vertically connected to the 2-2 upper ground through a plurality of 2-3 ground vias; wherein the 2-1 HTCC layer is provided as a ceramic material through a cutting process after producing a sheet by mixing alumina (Al2O3) powder, wherein the 2-1 signal line, the 2-1 lower ground, and the 2-1 upper ground are each printed by a screen printing method, and the 2-1 lower ground and the 2-1 upper ground form a plurality of through grooves in the 2-1 HTCC layer by a punching method in the corresponding area, and then vertically through the plurality of 2-1 ground vias in which a conductive material selected from tungsten, gold, silver, and copper is filled inside Connected,The above 2-2 HTCC layer is provided as a ceramic material through a cutting process after producing a sheet by mixing alumina (Al2O3) powder, wherein the 2-2 signal line is printed by a screen printing method, and after forming through grooves by a punching method in the 2-1 HTCC layer and the 2-2 HTCC layer, it is vertically connected to the 2-1 signal line via, which is filled with a conductive material selected from tungsten, gold, silver, and copper, and the 2-2 upper ground is printed by a screen printing method, and the 2-2 upper ground is vertically connected to the 2-1 upper ground through the plurality of 2-2 ground vias, which are filled with a conductive material selected from tungsten, gold, silver, and copper, after forming a plurality of through grooves by a punching method in the 2-2 HTCC layer, and the 2-3 HTCC layer is alumina (Al2O3) powder A hybrid QFN package having an RF input / output module that is vertically connected to the 2-2 upper ground through a plurality of 2-3 ground vias, wherein the 2-3 HTCC layer is provided as a ceramic material through a cutting process after producing a sheet by mixing, and has a relatively smaller width length based on the widths of the 2-1 HTCC layer and the 2-2 HTCC layer, with a concave groove formed in the central part where a signal line is arranged, and when the 2-3 HTCC layer is laminated on the upper part of the 2-2 HTCC layer, the 2-2 signal line is exposed and the inner part of the 2-2 upper ground is exposed, the 2-3 upper ground is printed on the upper part by a screen printing method, a plurality of through grooves are formed in the 2-3 upper ground by a punching method, and a conductive material selected from tungsten, gold, silver, and copper is filled inside. Claim 2 delete Claim 3 delete Claim 4 delete Claim 5 A hybrid QFN package having an RF input / output module according to claim 1, wherein the housing comprises a one-sided housing and a other-sided housing, wherein the one-sided housing and the other-sided housing are each formed as a rectangular stepped block corresponding to the one-sided RF input / output module and the other-sided RF input / output module; and an electrode pattern having a plurality of DC electrodes provided on the inner upper portion exposed according to the rectangular stepped block and a plurality of lower electrode pads provided on the lower portion of the housing body, and vertically connected through a plurality of electrode vias. Claim 6 In claim 5, the housing is a hybrid QFN package having an RF input / output module manufactured by any one of plastic molding, injection molding, compression molding, metal powder injection (MIM), and ceramic molding. Claim 7 In claim 6, the hybrid QFN package further comprises an RF input / output module including an optical communication connector provided on one side of the housing.

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