Display panel and method of manufacturing the same, and display device

Abstract

Embodiments of the present invention disclose a display panel, a method for manufacturing the same, and a display device. The display panel provided in the embodiment of the present invention comprises: a display substrate including a driving array layer and a plurality of micro-light-emitting elements, wherein the plurality of micro-light-emitting elements are in contact with and electrically connected to the driving array layer; and a capacitive touch sensing structure located on one side of the driving array layer close to the plurality of micro-light-emitting elements, spaced apart from the plurality of micro-light-emitting elements, and electrically connected to the driving array layer. The embodiment of the present invention is characterized by a simple structure, low cost, and accurate detection.

Description

Technology Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel, a method for manufacturing a display panel, and a display device. Background Technology

[0002] Micro LED (Micro Light Emitting Diode) display technology is currently widely used in various display devices, and these devices generally require touchscreen functionality. Conventional touchscreen production processes are broadly divided into two types: in-cell touch and on-cell touch. The in-cell process is generally used for LCD (Liquid Crystal Display) or OLED (Organic Light-Emitting Diode) displays. However, if the conventional in-cell structure is applied to Micro LED displays, problems can easily arise where the location of a touch object is inaccurately determined due to the influence of the parasitic capacitance of the Micro LED itself. In the on-cell process, since the sensing circuit or electrode must be manufactured on the on-cell glass substrate, there are issues such as high manufacturing costs and difficult processes. Consequently, conventional Micro LED touch display panels have suffered from issues of high precision, low complexity, and incompatibility.

[0003] Therefore, there is an urgent need to provide a new solution to address at least some of the aforementioned problems with micro LED touch panels. The problem to be solved

[0004] Accordingly, to solve at least some of the problems of the prior art, embodiments of the present invention provide a display panel, a method for manufacturing a display panel, and a display device, which are characterized by being inexpensive and having accurate detection. means of solving the problem

[0005] According to one aspect, an embodiment of the present invention provides a display panel comprising a driving array layer and a plurality of micro light-emitting elements, wherein the plurality of micro light-emitting elements are in contact with and electrically connected to the driving array layer; and a capacitive touch sensing structure positioned on one side of the driving array layer close to the plurality of micro light-emitting elements and spaced apart from the plurality of micro light-emitting elements, and electrically connected to the driving array layer.

[0006] In one embodiment, the display panel further includes a light-blocking layer installed between the plurality of micro-light-emitting elements to expose one side of the plurality of micro-light-emitting elements located far from the driving array layer.

[0007] In one embodiment, the display panel further comprises a flattening layer covering one side of the plurality of micro-elements located far from the light-shielding layer and the driving array layer; and a conductive via hole extending through the flattening layer and the light-shielding layer to the driving array layer, and the capacitive touch sensing structure comprises a transparent sensing circuit layer covering one side of the flattening layer located far from the light-shielding layer and electrically connected to the driving array layer through the conductive via hole.

[0008] In one embodiment, the capacitive touch sensing structure is installed within the light-shielding layer and is located between the plurality of micro light-emitting elements; or the capacitive touch sensing structure is installed on one side of the light-shielding layer far from the driving array layer and is located between the plurality of micro light-emitting elements.

[0009] In one embodiment, the light-blocking layer includes a plurality of separation pillars protruding from the driving array layer in a direction close to one side of the plurality of micro-light-emitting elements, and a single separation pillar is installed correspondingly between any two adjacent micro-light-emitting elements, and the height at which each of the separation pillars protrudes from the driving array layer is not smaller than the height at which the plurality of micro-light-emitting elements protrude from the driving array layer.

[0010] In one embodiment, the capacitive touch sensing structure is installed to correspond to one side of the target separation pillar among the plurality of separation pillars, far from the driving array layer.

[0011] In one embodiment, the plurality of separation pillars are made of a light-reflecting material.

[0012] Another embodiment of the present invention provides a method for manufacturing a display panel, the method comprising: a step of providing a display substrate comprising a driving array layer and a plurality of micro light-emitting elements, wherein the plurality of micro light-emitting elements are in contact with and electrically connected to the driving array layer; and a step of forming a capacitive touch sensing structure on one side of the display substrate close to the plurality of micro light-emitting elements, such that the capacitive touch sensing structure is installed spaced apart from the plurality of micro light-emitting elements and is electrically connected to the driving array layer.

[0013] In one embodiment, the method for manufacturing the display panel further includes the step of manufacturing a light-blocking layer between the plurality of micro-light-emitting elements and exposing one side of the micro-light-emitting element located far from the driving array layer.

[0014] In one embodiment, the step of manufacturing a light-shielding layer between the plurality of micro-light-emitting elements and exposing one side of the micro-light-emitting element located far from the driving array layer comprises: a step of covering one side of the plurality of micro-light-emitting elements located far from the driving array layer with a light-shielding film and exposing one side of the micro-light-emitting element located far from the driving array layer to form the light-shielding layer; or a step of filling a light-shielding material liquid between the plurality of micro-light-emitting elements, wherein the light-shielding material liquid exposes one side of the micro-light-emitting element located far from the driving array layer, and curing the light-shielding material liquid to form the light-shielding layer.

[0015] In one embodiment, the method further comprises the step of manufacturing a flattening layer on one side of the light-shielding layer located far from the driving array layer; and the step of forming a capacitive touch sensing structure on one side of the display substrate close to the plurality of micro light-emitting elements so that the capacitive touch sensing structure is installed spaced apart from the plurality of micro light-emitting elements and electrically connected to the driving array layer, wherein the method comprises the step of forming a conductive via hole penetrating the flattening layer and the light-shielding layer; and the step of covering a transparent sensing circuit layer on one side of the flattening layer located far from the light-shielding layer, so that the transparent sensing circuit layer is electrically connected to the driving array layer through the conductive via hole, and so that the transparent sensing circuit layer forms the capacitive touch sensing structure.

[0016] In one embodiment, the step of forming a capacitive touch sensing structure on one side of the display substrate close to the plurality of micro light-emitting elements, so that the capacitive touch sensing structure is installed spaced apart from the plurality of micro light-emitting elements and electrically connected to the driving array layer, includes the step of forming a capacitive touch sensing structure between two adjacent target micro light-emitting elements among the plurality of micro light-emitting elements.

[0017] In one embodiment, the method for manufacturing the display panel further includes the step of forming a plurality of separation pillars in the light-blocking layer so that one separation pillar is formed between any two adjacent micro light-emitting elements, and the height of each separation pillar protruding from the driving array layer is not smaller than the height of the plurality of micro light-emitting elements protruding from the driving array layer.

[0018] In one embodiment, the step of forming a capacitive touch sensing structure between two adjacent micro light-emitting elements among the plurality of micro light-emitting elements includes the step of forming a capacitive touch sensing structure on one side of the target separation pillar among the plurality of separation pillars, far from the driving array layer.

[0019] Another embodiment of the present invention includes a display panel according to any of the above embodiments or a display panel manufactured by a method for manufacturing a display panel according to any of the above embodiments. Effects of the invention

[0020] The above embodiment of the present invention has at least one of the following beneficial effects. A capacitive touch sensing structure and a plurality of micro-luminescent elements are installed on the same side of a driving array layer, and the capacitive touch sensing structure is installed on the upper surface of a micro-luminescent element far from the driving array layer, or a plurality of micro-luminescent elements are installed surrounding a plurality of micro-luminescent elements between them. This prevents the capacitive touch sensing structure from being affected by the parasitic capacitance of the micro-luminescent elements themselves, and the process is less difficult and less expensive compared to an on-cell touch process.

[0021] Other aspects and features of the present invention will become apparent from the following detailed description with reference to the accompanying drawings. However, it should be understood that the drawings are designed merely for illustrative purposes and are not intended to limit the scope of the invention. Unless otherwise stated, it should be understood that the drawings are not drawn in a fixed scale and are intended only to conceptually illustrate the structures and processes described herein. Brief explanation of the drawing

[0022] Specific embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a structural diagram of a display panel provided in the first embodiment of the present invention. FIG. 2 is a structural diagram of a display panel provided in a second embodiment of the present invention. FIG. 3 is a structural diagram of another display panel provided in the second embodiment of the present invention. FIG. 4 is a structural diagram of another display panel provided in the second embodiment of the present invention. FIG. 5 is a structural diagram of one specific embodiment of the display panel shown in FIG. 2. FIG. 6 is a structural diagram of one specific embodiment of the display panel shown in FIG. 4. FIG. 7 is a structural diagram of one specific embodiment of the display panel shown in FIG. 6. FIG. 8 is a planar structural diagram of a display panel in one embodiment of the present invention. FIG. 9 is a flow block diagram of a method for manufacturing a display panel provided in one embodiment of the present invention. FIG. 10 is a flowchart of a method for manufacturing a display panel provided in one embodiment of the present invention. FIG. 11 is a flowchart of a method for manufacturing a display panel provided in another embodiment of the present invention. FIG. 12 is a structural diagram of a display device provided in one embodiment of the present invention. Specific details for implementing the invention

[0023] In order to make the above objectives, features, and advantages of the present invention clearer and easier to understand, specific embodiments of the present invention will be described in detail below with reference to the attached drawings.

[0024] To enable those skilled in the art to better understand the technical solution of the present invention, the technical solution of the embodiments of the present invention will be described clearly and completely below together with the accompanying drawings of the embodiments of the present invention. Clearly, the described embodiments are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort fall within the scope of protection of the present invention.

[0025] It should be noted that in the description of the invention, the claims, and the drawings, terms such as "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific number or sequence. It should be understood that such terms are interchangeable under appropriate circumstances, so that embodiments of the invention described herein may be practiced in an order other than those exemplified or described herein. Furthermore, the terms "comprising" and "having," and variations thereof, include non-exclusive inclusions, such as a process, method, system, product, or device of a series of steps or units, and are not limited to the steps or units explicitly listed, but may include other steps or units not explicitly listed or unique to the process, method, system, product, or device.

[0026] In addition, it should be noted that the various embodiments in the present invention are distinguished merely for convenience of explanation and should not constitute any special limitations, and that the features of various embodiments can be combined and referenced as long as there is no contradiction.

[0027] First embodiment

[0028] As illustrated in FIG. 1, a first embodiment of the present invention provides a display panel (10), the display panel (10) comprises, for example, a display substrate (11), a capacitive touch sensing structure (12), a light-blocking layer (13), and a flattening layer (14). The display substrate (11) comprises a driving array layer (111) and a plurality of micro light-emitting elements (112), and the plurality of micro light-emitting elements (112) are in contact with and electrically connected to the driving array layer (111). The light-blocking layer (13) is installed between the plurality of micro light-emitting elements (112) to expose one side of the plurality of micro light-emitting elements (112) located far from the driving array layer (111). The flattening layer (14) covers one side of the plurality of micro light-emitting elements (112) located far from the light-blocking layer (13) and the driving array layer (111). A conductive via hole (15) is further formed in the display substrate (11), and the conductive via hole (15) extends through the flattening layer (14) and the light-blocking layer (13) to the driving array layer (111). A capacitive touch sensing structure (12) is located on one side of a driving array layer (111) close to a plurality of micro light-emitting elements (112) and is installed spaced apart from the plurality of micro light-emitting elements (112), and the capacitive touch sensing structure (12) is electrically connected to the driving array layer (111). Specifically, in this embodiment, the capacitive touch sensing structure (12) includes a transparent sensing circuit layer (121), and the transparent sensing circuit layer (121) covers one side of a flattening layer (14) far from the light-blocking layer (13) and is electrically connected to the driving array layer (111) through a conductive via hole (15). The flattening layer (14) separates the transparent sensing circuit layer (121) from the micro light-emitting elements (112), that is, the capacitive touch sensing structure (12) is installed spaced apart from the plurality of micro light-emitting elements (112) through the flattening layer (14).

[0029] Here, the micro light-emitting element (112) is, for example, specifically a micro light-emitting diode element, i.e., a Micro LED. The driving array layer (111) includes a TFT driving array for driving the micro light-emitting element (112) to emit light, and specifically includes, for example, a buffer layer, an active layer, a gate insulation layer (GI layer), a first metal layer, a first passivation layer, a second metal layer and a second passivation layer, and a third metal layer (not shown in FIG. 1) that are sequentially stacked on the substrate glass and the substrate glass surface. The active layer, the first metal layer, and the second metal layer form a TFT (Thin Film Transistor) element structure, and the gate insulation layer, the first passivation layer, and the second passivation layer are mainly for insulation and separation between the active layer, the first metal layer, and the second metal layer, and the third metal layer is for electrical connection with an element other than the driving array layer (111). In other words, the driving array layer (111) is specifically a TFT driving plate for driving a micro light-emitting element (112) to emit light, that is, the display substrate (11) refers to a TFT driving array plate on which a plurality of micro light-emitting elements (112) are welded. The micro light-emitting element (112) is specifically, for example, welded to a third metal layer of the driving array layer (111) and electrically connected to the driving array layer (111). Referring to FIG. 1, the light-blocking layer (13) is, for example, the entire layer is a BM (Black Matrix) thin film, that is, a single layer of black thin film or other BM material.A light-blocking layer (13) is installed between a plurality of micro light-emitting elements (112), and the aforementioned light-blocking layer (13) exposes one side of a micro light-emitting element (112) that is far from the driving array layer (111). Specifically, the light-blocking layer (13) does not block one side of a micro light-emitting element (112) that is far from the driving array layer (111). For example, if the entire layer of the light-blocking layer (13) is a BM thin film, the upper surface of the light-blocking layer (13) is formed at the same height as the upper surface of the micro light-emitting element (112) and exposes the upper surface of the micro light-emitting element (112) to prevent optical crosstalk between adjacent micro light-emitting elements (112), thereby causing a plurality of micro light-emitting elements (112) to emit light upward. Alternatively, in some embodiments, if the height of the light-blocking layer (13) is greater than the height of the micro-light-emitting element (112), the upper surface position corresponding to the micro-light-emitting element (112) is left empty so that the surface of the micro-light-emitting element (112) is exposed without being blocked by the light-blocking layer (13). The flattening layer (14) covers the light-blocking layer (13) and a plurality of micro-light-emitting elements (112) to flatten the upper surface of the display substrate (11), and the thickness from the upper surface of the flattening layer (14) to the upper surface of the driving array layer (111) is 7 to 15 μm. Conductive via holes (15) are formed, for example, through a yellow light process or plasma etching. The transparent sensing circuit layer (121) is, for example, specifically an ITO (Indium tin oxide) thin film and detects a change in capacitance caused by a touch target. The transparent sensing circuit layer (121) is electrically connected to the third metal layer of the driving array layer (111) through, for example, a conductive via hole (15), and transmits a detection signal from the internal circuit of the driving array layer (111) to the IC (Integrated Circuit) chip of the TFT driving plate to determine the location of the touch signal source, thereby implementing a touch function that identifies the touch target.The display panel (10) provided in this embodiment can prevent the problem of judgment failure occurring when the internal capacitance value of the Micro LED changes according to the applied current and voltage in the conventional technology, thereby blocking or changing the difference in the capacitance value irradiated by the touch target. That is, the display panel (10) provided in this embodiment has a simple structure and has the effect of accurate touch.

[0030] 2nd embodiment

[0031] Referring to FIG. 2, a second embodiment of the present invention provides a different display panel (10), the display panel (10) comprises, for example, a display substrate (11), a capacitive touch sensing structure (12), and a light-blocking layer (13). The display substrate (11) comprises a driving array layer (111) and a plurality of micro light-emitting elements (112), and the plurality of micro light-emitting elements (112) are in contact with the driving array layer (111) and are electrically connected to the driving array layer (111). The light-blocking layer (13) is installed between the plurality of micro light-emitting elements (112) to expose one side of the plurality of micro light-emitting elements (112) that are far from the driving array layer (111). A capacitive touch sensing structure (12) is located on one side of a driving array layer (111) close to a plurality of micro light-emitting elements (112) and is installed spaced apart from the plurality of micro light-emitting elements (112), and the capacitive touch sensing structure (12) is electrically connected to the driving array layer (111).

[0032] Here, the micro light-emitting element (112) is, for example, specifically a micro light-emitting diode element, i.e., a Micro LED. The driving array layer (111) includes a TFT driving array for driving the micro light-emitting element (112) to emit light, and specifically includes, for example, a buffer layer, an active layer, a gate insulation layer (GI layer), a first metal layer, a first passivation layer, a second metal layer and a second passivation layer, and a third metal layer (not shown in FIG. 1) that are sequentially stacked on the substrate glass and the substrate glass surface. The active layer, the first metal layer, and the second metal layer form a TFT (Thin Film Transistor) element structure, and the gate insulation layer, the first passivation layer, and the second passivation layer are mainly for insulation and separation between the active layer, the first metal layer, and the second metal layer, and the third metal layer is for electrical connection with an element other than the driving array layer (111). In other words, the driving array layer (111) is specifically part of a TFT driving array for driving a micro light-emitting element (112) to emit light, that is, the display substrate (11) refers to a TFT driving plate on which a plurality of micro light-emitting elements (112) are welded. The micro light-emitting elements (112) are specifically, for example, welded to a third metal layer of the driving array layer (111) and electrically connected to the driving array layer (111).

[0033] In one embodiment, specifically, the capacitive touch sensing structure (12) is installed within the light-blocking layer (13) and is positioned between a plurality of micro-light-emitting elements (112). Referring to FIG. 2, the light-blocking layer (13) is, for example, entirely made of a BM (Black Matrix) thin film or other BM material and is installed between a plurality of micro-light-emitting elements (112). Specifically, the light-blocking layer (13) does not block one side of the micro-light-emitting element (112) that is far from the driving array layer (111). For example, when the light-blocking layer (13) entirely made of a BM thin film, the upper surface of the light-blocking layer (13) is formed at the same height as the upper surface of the micro-light-emitting element (112) and exposes the upper surface of the micro-light-emitting element (112) to prevent optical crosstalk between adjacent micro-light-emitting elements (112), thereby causing a plurality of micro-light-emitting elements (112) to emit light upward. Alternatively, in some embodiments, if the height of the light-blocking layer (13) is greater than the height of the micro-light-emitting element (112), the upper surface position corresponding to the micro-light-emitting element (112) is left empty so that the surface of the micro-light-emitting element (112) is exposed without being blocked by the light-blocking layer (13). The capacitive touch sensing structure (12) is located between a plurality of micro-light-emitting elements (112), and specifically, as shown in FIG. 2, it is located, for example, on the bottom side of the light-blocking layer (13) close to the driving array layer (111). Or, as shown in FIG. 3, in another embodiment, the capacitive touch sensing structure (12) is located, for example, between the upper and lower surfaces of the light-blocking layer (13). Or, as shown in FIG. 4, in another embodiment, the capacitive touch sensing structure (12) is located, for example, on the upper side of one side of the light-blocking layer far from the driving array layer (111).When a capacitive touch sensing structure (12) is installed at the middle and upper positions of the light-blocking layer (13), the change in the capacitance value of the touch target can be increased, thereby increasing the sensitivity of the touch signal and the detection sensitivity. For example, the schematic diagram of the planar structure of the display panel (10) shown in FIGS. 2, FIGS. 3, and FIGS. 4 may be referenced to FIGS. 8. The capacitive touch sensing structure (12) forms a circuit surrounding a micro light-emitting element (112), and for example, FIGS. 8 has four sensing regions formed. Of course, the regions in FIGS. 8 are merely examples, and the capacitive touch sensing structure (12) of different sensing regions is electrically connected to the third metal layer of the driving array layer through conductive via holes (not shown in FIGS. 2) at different locations within the light-blocking layer (13), for example. A touch function is implemented to identify the touch target by transmitting a sensing signal from the internal circuit of the driving array layer (111) to the IC (Integrated Circuit) chip of the TFT driving plate and determining the location of the touch signal source. At this time, the capacitive touch sensing structure (12) can use an ITO material or other metal material, and can ensure the light emission of the micro light-emitting element (112) while preventing a judgment failure problem caused by the influence of the parasitic capacitance of the micro light-emitting element itself.

[0034] More specifically, in one embodiment, the light-blocking layer (13) further includes a plurality of separation pillars (131) protruding from the driving array layer (111) in a direction close to one side of a plurality of micro light-emitting elements (112), and a separation pillar (131) is installed correspondingly between any two adjacent micro light-emitting elements (112), and the height at which each separation pillar (131) protrudes from the driving array layer (111) is not smaller than the height at which a plurality of micro light-emitting elements (112) protrude from the driving array layer (111). For example, referring to FIG. 5, it is a structural diagram of one specific embodiment of the display panel (10) shown in FIG. 2. A light-blocking layer (13) is patterned and etched to form a plurality of separation pillars (131), and the height at which the separation pillars (131) protrude from the driving array layer (111) is, for example, H1 as shown in FIG. 5, and the height at which the micro light-emitting element (112) protrudes from the driving array layer (111) is, for example, H2 as shown in FIG. 5, where H1 is not smaller than H2. Alternatively, referring to FIG. 6, it is a structural diagram of one specific embodiment of the display panel (10) shown in FIG. 4. A capacitive touch sensing structure (12) is installed to correspond to one side of the target separation pillar among the plurality of separation pillars (131) that is far from the driving array layer (111). The capacitive touch sensing structure (12) is installed at the upper end of the target separation pillar. For example, referring to the planar structure diagram of FIG. 8, a capacitive touch sensing structure (12) is installed on a separating pillar (131) between the first row, first column and the first row, second column of the micro light-emitting element (112), that is, this separating pillar (131) is the aforementioned target separating pillar. There is no capacitive touch sensing structure (12) on the separating pillar between the first row, first column and the second row, first column of the micro light-emitting element (112), and this separating pillar is not the target separating pillar.The separation pillar (131) prevents crosstalk of adjacent micro-light-emitting elements (112) and exposes the upper surface of the micro-light-emitting elements (112) so that the micro-light-emitting elements (112) emit light upward. Additionally, referring to FIG. 7, this is a schematic diagram of a specific embodiment of FIG. 6, wherein the separation pillar (131) uses a light-reflecting material so that the light emitted from the micro-light-emitting elements (112) can be recovered as much as possible.

[0035] Third embodiment

[0036] A third embodiment of the present invention provides a method for manufacturing a display panel, and with reference to FIG. 9, the method for manufacturing a display panel provided in this embodiment comprises, for example, steps S1 and S2, wherein in step S1, a display substrate is provided that includes a driving array layer and a plurality of micro light-emitting elements, wherein the plurality of micro light-emitting elements are in contact with the driving array layer and are electrically connected to the driving array layer; and in step S2, a capacitive touch sensing structure is formed on one side of the display substrate close to the plurality of micro light-emitting elements so that the capacitive touch sensing structure is installed spaced apart from the plurality of micro light-emitting elements and is electrically connected to the driving array layer.

[0037] Here, the display substrate provided in step S1 is identical to the structure of the display substrate (11) of, for example, the first embodiment and the second embodiment, and this embodiment will not be described again. In one specific embodiment, between step S1 and step S2, a light-blocking layer is further provided, for example, between the plurality of micro-light-emitting elements, and one side of the micro-light-emitting element far from the driving array layer is exposed.

[0038] The method further includes step S4, which manufactures a flattening layer on one side of the light-shielding layer located far from the driving array layer between step S3 and step S2. After flattening the surface of the light-shielding layer through step S4, step S2 is performed. Specifically, step S21 includes forming a conductive via hole penetrating the flattening layer and the light-shielding layer; and step S22, which covers a transparent sensing circuit layer on one side of the flattening layer located far from the light-shielding layer, so that the transparent sensing circuit layer is electrically connected to the driving array layer through the conductive via hole, and so that the transparent sensing circuit layer forms the capacitive touch sensing structure.

[0039] Here, in step S21, a conductive via hole is formed, for example, through a yellow light process or plasma etching. Step S3 includes, for example, step S31, a step of covering a light-shielding thin film on one side of a plurality of micro-light-emitting elements located far from the driving array layer and exposing the side of the micro-light-emitting element located far from the driving array layer to form the light-shielding layer. Specifically, for example, after covering with the light-shielding thin film, the excess portion is polished and removed using a polisher or grinder, etc., so that the upper surface of the micro-light-emitting element is exposed without being blocked by the light-shielding layer. In this embodiment, the manufacturing steps of the display panel, referring to steps (a) to (f) of FIG. 10, for example, include (a) providing a display substrate → (b) covering with a light-shielding thin film → (c) polishing to form a light-shielding layer → (d) manufacturing a planarization layer → (e) forming a via hole → (f) covering with a transparent conductive layer.

[0040] Alternatively, in another embodiment, step S3 includes, for example, step S32, filling a light-shielding material liquid between the plurality of micro-light-emitting elements, thereby exposing one side of the micro-light-emitting element far from the driving array layer, and curing the light-shielding material liquid to form the light-shielding layer. Specifically, the light-shielding material liquid may be selected as a material that is, for example, liquid in a heated state and has high fluidity, and has an internal aggregation function, and by coating the light-shielding material liquid onto the micro-light-emitting element, for example, by drop application or spin coating, the light-shielding material liquid is not retained on the surface of the micro-light-emitting element due to the internal aggregation force of the light-shielding material liquid itself, so that the upper surface of the micro-light-emitting element is not blocked and is exposed in the light-shielding layer. In this embodiment, the manufacturing steps of the display panel, for example, referring to steps (g) to (l) of FIG. 11, include (g) providing a display substrate → (h) drop application or spin coating of the light-shielding material liquid → (i) curing the light-shielding material liquid to form a light-shielding layer → (j) manufacturing a planarization layer → (k) forming via holes → (l) covering with a transparent conductive layer. Comparing the steps of Fig. 10 and Fig. 11, it can be seen that step S3 is simpler than the process that adopts step S32 because the polishing step is omitted.

[0041] The above embodiment of the present invention can be used to manufacture a display panel of the first embodiment described above, which has the effect of a simple process and the same beneficial effect as the first embodiment described above, and this embodiment is not described again.

[0042] 4th embodiment

[0043] A fourth embodiment of the present invention provides a method for manufacturing a display panel, and with reference to FIG. 9, the method for manufacturing a display panel provided in this embodiment comprises, for example, steps S1 and S2, wherein in step S1, a display substrate is provided that includes a driving array layer and a plurality of micro light-emitting elements, wherein the plurality of micro light-emitting elements are in contact with the driving array layer and are electrically connected to the driving array layer; and in step S2, a capacitive touch sensing structure is formed on one side of the display substrate close to the plurality of micro light-emitting elements so that the capacitive touch sensing structure is installed spaced apart from the plurality of micro light-emitting elements and is electrically connected to the driving array layer.

[0044] Here, the display substrate provided in step S1 is identical to the structure of the display substrate (11) of, for example, the first embodiment and the second embodiment, and this embodiment will not be described again. In one specific embodiment, step S2 includes, for example, specifically, step S23, forming a capacitive touch sensing structure between two adjacent target micro-light emitting elements among the plurality of micro-light emitting elements. Here, the target micro-light emitting elements are some or all of the plurality of micro-light emitting elements, that is, the capacitive touch sensing structure may be provided between some of the micro-light emitting elements among the plurality of micro-light emitting elements, or may be formed between any two adjacent micro-light emitting elements, and this embodiment is not limited thereto.

[0045] Step S3 further includes, for example, manufacturing a light-blocking layer between the plurality of micro-light-emitting elements prior to step S23 and exposing one side of the micro-light-emitting element located far from the driving array layer. Alternatively, in some embodiments, step S3 may be performed, for example, after step S23. Step S23 may be performed prior to step S3 to manufacture the structure of the display panel (10) illustrated in FIG. 2 and FIG. 3 described above. Step S22 may be performed after step S3 to manufacture the structure of the display panel (10) illustrated in FIG. 4. Here, prior to step S23, the method further includes, for example, a step of forming a conductive via hole, so that a capacitive touch sensing structure is electrically connected to the driving array layer through the conductive via hole.

[0046] Additionally, in another embodiment, step S3 further comprises step S33, wherein, for example, a plurality of separation pillars are formed in the light-shielding layer to form a single separation pillar between any two adjacent micro-light-emitting elements, and the height of each separation pillar protruding from the driving array layer is not less than the height of the plurality of micro-light-emitting elements protruding from the driving array layer. Here, the plurality of separation pillars may be formed, for example, by patterning and etching the light-shielding layer. The separation pillars prevent crosstalk between adjacent micro-light-emitting elements and expose the upper surface of the micro-light-emitting elements so that the micro-light-emitting elements emit light upward. Alternatively, in some embodiments, the separation pillars are formed using a light-reflecting material, for example, to maximize the recovery of light emitted from the micro-light-emitting elements. The light-reflecting material may be, for example, a metallic reflective material such as Ag (silver) or Cr (chromium), a DBR (Distributed Bragg Reflector) material, or a mixture of TiO2 nanoparticles. Likewise, step S33 can be performed after step S22 to manufacture the display panel shown in FIG. 5. Step S33 may also be performed, for example, before step S22, and step S22 specifically includes step S221, which manufactures the display panel shown in FIG. 6 or FIG. 7 by forming a capacitive touch sensing structure on one side of the target separation pillar among the plurality of separation pillars, far from the driving array layer.

[0047] The method for manufacturing a display panel provided in this embodiment can be used to manufacture the display panel (10) of the second embodiment described above, and has the same beneficial effect as the second embodiment.

[0048] Fifth embodiment

[0049] Referring to FIG. 12, a fifth embodiment of the present invention provides a display device (100), and the display device (100) includes, for example, any one of the display panels (10) of the first and second embodiments described above. The display device (100) includes, for example, a television, a laptop computer, a desktop monitor, a tablet computer, a digital camera, a smart bracelet, smart glasses, a car monitor, medical device equipment, an industrial control setting, a touch interactive terminal, etc., but the embodiments of the present invention are not limited thereto. Since the display device (100) uses the display panel (10) of the embodiments described above, it has the same beneficial effects as the embodiments described above.

[0050] The foregoing is merely a preferred embodiment of the present invention and is not intended to limit the invention in any form. Although preferred embodiments of the present invention have been disclosed above, this is not intended to limit the invention, and those skilled in the art will be able to obtain equivalent embodiments including equivalent modifications by making changes or modifications based on the technical content disclosed above without departing from the scope of the technical method of the present invention. Simple modifications, equivalent modifications, and modifications made to the above embodiments based on the technical essence of the present invention without departing from the scope of the technical method of the present invention still fall within the scope of the technical method of the present invention. Explanation of the symbols

[0051] 100: Display device; 10: Display panel; 11: Display substrate; 111: Driving array layer; 112: Multiple micro-luminescent elements; 12: Capacitive touch sensing structure; 121: Transparent sensing circuit layer; 13: Shading layer; 131: Separating column; 14: Leveling layer; 15: Challenging via hole.

Claims

Claim 1 A display substrate comprising a driving array layer and a plurality of micro light-emitting elements, wherein the plurality of micro light-emitting elements are in contact with the driving array layer and are electrically connected to the driving array layer; and a capacitive touch sensing structure installed on one side of the driving array layer facing the plurality of micro light-emitting elements and spaced apart from the plurality of micro light-emitting elements, while being electrically connected to the driving array layer; a light-blocking layer installed between the plurality of micro light-emitting elements and exposing one side of the plurality of micro light-emitting elements located on the opposite side of the driving array layer; and a flattening layer that flattens the upper surface of the display substrate by covering one side of the plurality of micro elements located on the opposite side of the light-blocking layer and the driving array layer, wherein the flattening layer includes a flattening layer in contact with one side of the plurality of micro elements located on the opposite side of the driving array layer, and a conductive via hole penetrating the flattening layer and the light-blocking layer while extending to the driving array layer, and the capacitive touch sensing structure includes a transparent sensing circuit layer that covers one side of the flattening layer located on the opposite side of the light-blocking layer and is electrically connected to the driving array layer through the conductive via hole, and on the driving array layer A display panel characterized in that a portion of the orthogonal projection of the formed transparent sensing circuit layer and a portion of the orthogonal projection of the plurality of micro light-emitting elements formed in the driving array layer overlap. Claim 2 delete Claim 3 delete Claim 4 delete Claim 5 delete Claim 6 delete Claim 7 delete Claim 8 The method comprises the steps of providing a display substrate including a driving array layer and a plurality of micro light-emitting elements, wherein the plurality of micro light-emitting elements are in contact with the driving array layer and are electrically connected to the driving array layer; forming a light-blocking layer installed between the plurality of micro light-emitting elements and exposing one side of the plurality of micro light-emitting elements located on the opposite side of the driving array layer; and forming a capacitive touch sensing structure on one side of the display substrate facing the plurality of micro light-emitting elements, wherein the capacitive touch sensing structure is installed to be spaced apart from the plurality of micro light-emitting elements and is electrically connected to the driving array layer, and wherein the step of forming a capacitive touch sensing structure on one side of the display substrate facing the plurality of micro light-emitting elements comprises forming a flattening layer covering one side of the plurality of micro elements located on the opposite side of the light-blocking layer and the driving array layer, thereby making the upper surface of the display substrate flattened, wherein the flattening layer is in contact with one side of the plurality of micro elements located on the opposite side of the driving array layer, and A method for manufacturing a display panel, characterized by comprising the steps of: forming a conductive via hole that penetrates the flattening layer and the light-shielding layer and extends to the driving array layer; forming a capacitive touch sensing structure that covers one side of the flattening layer located on the opposite side of the light-shielding layer; wherein the capacitive touch sensing structure includes a transparent sensing circuit layer electrically connected to the driving array layer through the conductive via hole; and wherein a portion of the orthogonal projection of the transparent sensing circuit layer formed on the driving array layer and a portion of the orthogonal projection of the plurality of micro light-emitting elements formed on the driving array layer overlap. Claim 9 delete Claim 10 A method for manufacturing a display panel according to claim 8, wherein the step of forming a light-blocking layer that is installed between the plurality of micro light-emitting elements and exposes one side of the micro light-emitting element located opposite the driving array layer comprises: a step of forming the light-blocking layer by forming a light-blocking thin film formed on one side of the plurality of micro light-emitting elements located opposite the driving array layer and exposing one side of the micro light-emitting element located opposite the driving array layer; or a step of forming the light-blocking layer by forming a light-blocking thin film that cures the light-blocking material liquid after injecting the light-blocking material liquid between the plurality of micro light-emitting elements to expose one side of the micro light-emitting element located opposite the driving array layer. Claim 11 delete Claim 12 delete Claim 13 delete Claim 14 delete Claim 15 A display device comprising a display panel manufactured by the method of manufacturing a display panel according to claim 1 or a display panel according to claim 8 or 10.

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