Semiconductor chip, semiconductor package comprising the same and method of fabricating the same

Abstract

A semiconductor chip, a semiconductor package including the same, and a method for manufacturing the same are provided. The semiconductor chip comprises: a semiconductor substrate having a first surface and a second surface opposite to each other; transistors disposed on the first surface; a first interlayer insulating film covering the transistors; a second interlayer insulating film covering the first interlayer insulating film; wiring disposed within the second interlayer insulating film; a first conductive pad disposed on the second interlayer insulating film; a first passivation film covering the second interlayer insulating film and the first conductive pad; a second conductive pad disposed within the first passivation film and connected to the first conductive pad; a through-via connecting to the wirings by penetrating the semiconductor substrate and the first interlayer insulating film; and a second passivation film covering the second surface. and includes a third conductive pad disposed within the second passivation film and connected to the through via, wherein the first passivation film has a first thickness, and the first thickness is 0.4 to 0.6 times the second thickness from the upper surface of the second passivation film to the first surface.

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