Transient voltage protection apparatus, and printed circuit board and electronic apparatus having the same

Abstract

The present invention provides a transient voltage protection device comprising at least one first transient voltage protection unit provided inside an electronic device to protect a circuit from transient voltage noise, and at least one second transient voltage protection unit provided inside the electronic device spaced apart from the first transient voltage protection unit to protect a circuit from transient voltage noise, wherein the first and second transient voltage protection units are manufactured in different forms, a printed circuit board equipped with the same, and an electronic device.

Description

Technology Field

[0001] The present invention relates to an overvoltage protection device, and more particularly to an overvoltage protection device capable of protecting an electronic device from an overvoltage introduced from the outside, and to a printed circuit board and an electronic device equipped with the same. Background Technology

[0003] Rechargeable secondary batteries, or batteries, are used as energy sources for mobile devices such as smartphones. Furthermore, batteries are also used as energy sources for electric vehicles and hybrid electric vehicles, which are being proposed as solutions to address air pollution caused by fossil fuel-powered gasoline and diesel vehicles. Due to the advantages of batteries, the types of applications utilizing batteries—including not only Electric Vehicles (EVs) and Light Electric Vehicles (LEVs)—are becoming increasingly diverse, and it is expected that batteries will be applied to a wider range of fields and products in the future than they are today.

[0004] Electronic devices that utilize batteries as a power source must be equipped with a battery management system (BMS) and the like to control the operation of the battery. Additionally, various components, including a controller, must be provided for the operation and control of the electronic device. Multiple components for operating the electronic device and the BMS for battery management are mounted on a circuit board. In this case, the controller and the BMS may be mounted on different boards. That is, components for the operation and control of the electric vehicle and components for battery management may be mounted on different boards. For such boards, a Printed Circuit Board (PCB) with a predetermined circuit pattern printed on it may be used.

[0005] Printed circuit boards are used for mounting components and wiring in electronic devices. They are manufactured by attaching a thin film, such as copper, to one side of a phenolic resin insulating board or an epoxy resin insulating board, etching it according to the wiring pattern to form the necessary circuit, and drilling holes to mount components. Printed circuit boards include single-sided PCBs, which have wiring formed on only one side of the insulating board; double-sided PCBs, which have wiring formed on both sides; and MLBs (Multi-Layered Boards), which have wiring in multiple layers. In the past, single-sided PCBs were used because the components and circuit patterns were simple; however, recently, due to the increasing complexity of circuits and the growing demand for high-density and miniaturized circuits, it has become common to use mostly double-sided PCBs or MLBs.

[0006] Electronic devices with multiple components mounted on a printed circuit board may frequently fail due to transient voltage noise such as ESD (ElectroStatic Discharge) or surges. Therefore, surge protection devices (SPDs) are applied to protect the circuit from such transient voltage noise. Surge protection devices can be connected in parallel to the printed circuit board via wires. For example, in the case of electronic devices using batteries, surge protection devices are mounted on the printed circuit board on which the BMS is mounted, and the surge protection device can be mounted between a specific circuit pattern through which a signal flows into the main circuit of the BMS and a ground terminal.

[0007] The circuit can be protected from overvoltage by such surge protection devices. In other words, overvoltage noise may be introduced by user operation of electronic devices or external devices such as PCS; this overvoltage noise flows through wires to surge protection devices, and as energy is dissipated by the surge protection devices, the circuit and components can be protected. For example, when operating a portable electronic device equipped with a metal case, such as a smartphone, ESD generated from the human body depending on the surrounding environment may enter the internal circuit through the metal case of the electronic device, and this ESD can be dissipated by the internal surge protection device. That is, overvoltage noise caused by externally introduced ESD and surges flows through wires along the circuit patterns of a copper printed circuit board, passes through the surge protection device, and has its energy dissipated.

[0008] However, frequent ESD ingress or excessive noise ingress exceeding the allowable limit of the surge protection device can increase the degradation or stress of the surge protection device, thereby shortening its lifespan. Furthermore, the shortened lifespan or failure of the surge protection device can cause failure of the printed circuit board or the components mounted thereon during the use of the electronic device. In other words, if frequent noise ingress or noise with energy exceeding the allowable limit of the surge protection device is introduced, the device loses function due to degradation or stress, causing component failure in the electronic device due to excessive noise. Prior art literature

[0010] Korean Patent Publication No. 10-2018-0110661 The problem to be solved

[0011] The present invention provides a surge protection device capable of reducing stress applied to a surge protection device by transient voltages such as ESD and surges, thereby improving the lifespan of the surge protection device and improving the noise immunity of a circuit board, a printed circuit board equipped with the same, and an electronic device.

[0012] The present invention provides a transient voltage protection device equipped with a spark pad that can reduce stress applied to a surge protection device by removing transient voltage noise, such as ESD and surge, that enters the electronic device through the spark pad, a printed circuit board equipped with the same, and an electronic device. means of solving the problem

[0014] An overvoltage protection device according to one embodiment of the present invention includes at least one first overvoltage protection unit provided inside an electronic device to protect a circuit from overvoltage noise, and at least one second overvoltage protection unit provided inside the electronic device spaced apart from the first overvoltage protection unit to protect a circuit from overvoltage noise, wherein the first and second overvoltage protection units are manufactured in different forms.

[0015] The first transient voltage protection unit is a surge protection element mounted on a PCB, and the second transient voltage protection unit is formed from a part of a conductive pattern formed on the PCB.

[0016] The second transient voltage protection unit includes a first discharge pattern connected to a part of the conduction pattern and a second discharge pattern spaced apart from the first discharge pattern and connected to a ground terminal.

[0017] The first and second discharge patterns above face each other such that at least some areas are closer than other areas.

[0018] The above first and second discharge patterns maintain a gap of 1 mm or less between the areas facing each other closely.

[0020] A printed circuit board according to another aspect of the present invention comprises at least one laminated insulating layer and a conductive pattern formed on the at least one insulating layer, and at least one spark pad extending from the conductive pattern to protect the circuit from transient voltage noise.

[0021] It includes two or more printed circuit boards spaced apart from each other, and the two or more printed circuit boards are electrically connected.

[0022] The spark pads are each formed on the two or more printed circuit boards mentioned above.

[0023] It further includes at least one surge protection element mounted on a printed circuit board and spaced apart from the spark pad.

[0024] The spark pad includes a first discharge pattern connected to a part of the conductive pattern and a second discharge pattern spaced apart from the first discharge pattern and connected to a ground terminal.

[0025] The first and second discharge patterns above face each other such that at least some areas are closer than other areas.

[0026] The above first and second discharge patterns maintain a gap of 1 mm or less between the areas facing each other closely.

[0028] An electronic device according to another aspect of the present invention comprises at least one printed circuit board having a plurality of components mounted thereon, at least one first transient voltage protection unit mounted on the printed circuit board to protect a circuit from transient voltage noise, and at least one second transient voltage protection unit spaced apart from the first transient voltage protection unit and formed on the printed circuit board using at least a portion of the printed circuit board to protect a circuit from transient voltage noise.

[0029] It further includes a rechargeable battery and a BMS implemented on the printed circuit board and managing the battery.

[0030] The second transient voltage protection unit is formed using a conductive pattern of the PCB and includes a first discharge pattern connected to a part of the conductive pattern and a second discharge pattern spaced apart from the first discharge pattern and connected to a ground terminal.

[0031] The first and second discharge patterns above face each other such that at least some areas are closer than other areas.

[0032] The above first and second discharge patterns maintain a gap of 1 mm or less between the areas facing each other closely.

[0033] The device further includes a case for housing the printed circuit board and a fastening member for fixing the printed circuit board to the case, and the second discharge pattern is connected to the ground terminal through the fastening member. Effects of the invention

[0035] The transient voltage protection device of the present invention may include a first transient voltage protection unit manufactured in the form of a chip and mounted on a PCB, and a second transient voltage protection unit formed using at least a portion of the conductive pattern of the PCB. That is, the present invention may additionally include a second transient voltage protection unit formed using the circuit pattern of the PCB. By providing the first and second transient voltage protection units, the present invention can primarily remove transient voltages entering from the outside through the second transient voltage protection unit and secondarily remove them through the first transient voltage protection unit. Therefore, since no separate component is additionally mounted, the stress on the first transient voltage protection unit is reduced without additional cost, thereby extending the lifespan of the first transient voltage protection unit and improving the noise immunity of the PCB. In other words, immunity to transient voltage noise can be improved from the existing 2kV to 4kV or more without additional cost. Brief explanation of the drawing

[0037] FIG. 1 is a block diagram of an electronic device having an overvoltage protection device according to one embodiment of the present invention. FIG. 2 is a schematic diagram of an electronic device having an overvoltage protection device according to one embodiment of the present invention. FIG. 3 is a schematic diagram illustrating a method for removing an overvoltage of an electronic device equipped with an overvoltage protection device according to an embodiment of the present invention. FIG. 4 is a schematic diagram illustrating various forms of an overvoltage protection device according to one embodiment of the present invention. Specific details for implementing the invention

[0038] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms; these embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention. In the drawings, thicknesses have been enlarged to clearly represent various layers and regions, and identical reference numerals in the drawings refer to identical elements.

[0039] FIG. 1 is a block diagram of an electronic device having an overvoltage protection device according to an embodiment of the present invention, and is a block diagram of an electronic device having a battery. FIG. 2 is a schematic diagram of an electronic device having an overvoltage protection device according to an embodiment of the present invention, and FIG. 3 is a schematic diagram for explaining an overvoltage removal method using FIG. 2. FIG. 4 is a schematic diagram for explaining various possible forms of an overvoltage protection device according to an embodiment of the present invention. An embodiment of the present invention is described as follows using these drawings.

[0040] Referring to FIGS. 1 to 4, an overvoltage protection device (300) according to one embodiment of the present invention may include at least one first overvoltage protection unit (310) provided inside an electronic device (100) and at least one second overvoltage protection unit (320) provided inside the electronic device (100) spaced apart from the first overvoltage protection unit (310). Here, the first and second overvoltage protection units (310, 320) may be manufactured in different forms and provided inside the electronic device (100). That is, the overvoltage protection device (300) may be provided on a printed circuit board (hereinafter referred to as PCB) (200), wherein the first overvoltage protection unit (310) is mounted on the first PCB (210), and the second overvoltage protection unit (320) may be manufactured using at least a part of the PCB (200) on at least one of the first and second PCBs (210, 220). That is, the PCB (200) may have a circuit pattern using copper printed on at least one surface of an insulating plate, and the second overvoltage protection unit (320) may be formed using a part of the circuit pattern. In addition, the electronic device (100) equipped with the overvoltage protection device (300) may be equipped with a battery as an example. An embodiment of the present invention is described in the order of an electronic device, a PCB provided within the electronic device, and an overvoltage protection device provided on the PCB as follows.

[0041] 1. Electronic devices

[0042] The electronic device (100) may include an electric drive device that performs an operation by receiving a predetermined power supply from an external source. For example, the electronic device (100) may include home appliances such as TVs, portable terminals such as smartphones, and motor-driven mobile devices such as electric vehicles (EVs) and hybrid electric vehicles. Of course, in addition to these, the electronic device (100) may include various electric drive devices that operate by receiving a predetermined power supply, in which a PCB (200) is provided internally and a plurality of components are mounted. In particular, the electronic device (100) may be equipped with a battery having at least one rechargeable secondary battery. An embodiment of the present invention is described by way of example using an electronic device equipped with a battery. As shown in FIG. 1, such an electronic device may include a rechargeable battery (110), a battery management system (BMS) (120) that manages and controls the battery (110), and an external control unit (130) that inputs user operations or commands.

[0043] 1.1. Battery

[0044] The battery (110) is an electric energy source capable of charging and discharging, and provides energy to drive an electronic device. Here, the battery (110) may include at least one battery pack, and each of the at least one battery pack may include a plurality of battery modules, and each battery module may include a plurality of rechargeable battery cells. That is, the battery (110) may include a plurality of battery cells, and the plurality of battery cells may be grouped into a predetermined unit to form a battery module, and the plurality of battery modules may form a single battery pack. Here, at least a portion of the battery (110) may be detachable. That is, the battery (110) may include at least one battery pack having a plurality of battery cells, and the battery pack containing the defective battery cells may be replaceable, and for this purpose, the battery (110) may be detachable. Meanwhile, the plurality of battery cells may be connected in series and / or in parallel in various ways to meet the specifications of the electrical and electronic device. Of course, the plurality of battery packs each containing a plurality of battery cells may also be connected in series and / or in parallel. Here, the battery cell may include a lithium-ion battery. However, the battery cell may consist not only of a lithium-ion battery but also of a lithium polymer battery, a nickel-cadmium battery, a nickel-hydrogen battery, a nickel-zinc battery, etc.

[0045] 1.2. BMS

[0046] The BMS (120) estimates the state of the battery (110) and manages the battery (110) using the estimated state information. For example, the BMS (120) measures the state of the battery (110), such as voltage, current, and temperature, and estimates the State of Charge (SOC), State of Health (SOH), and State of Power (SOP) using the state information. SOC represents the remaining capacity of the battery, and an accurate prediction of SOC allows for the prediction of future driving distance. SOH represents the capacity of the battery, which signifies the aging state of the battery and affects the number of charge and discharge cycles of the battery. SOP represents the maximum power that the battery can support. Predicting the maximum power helps prevent overcharging or heat loss of the battery. Using this state information, the BMS (120) controls the charging or discharging of the battery (110). Meanwhile, to manage the battery (110) using the BMS (120), a sensing unit that senses the state of the battery (110) may be further included. The sensing unit may include a current sensor for sensing the current of the battery (110), a voltage sensor for sensing the voltage, and a temperature sensor for sensing the temperature. At this time, at least one current sensor, a voltage sensor, and a temperature sensor may each be provided. Such a BMS (120) may be composed of a plurality of components mounted on the first PCB (210). That is, a plurality of components for managing and controlling the battery (110) may be mounted on the first PCB (210) to form the BMS (120).

[0047] 1.3. External Control Unit

[0048] The external control unit (130) inputs a user's command through user operation so that the electronic device performs the desired operation. That is, the external control unit (130) allows a user's command to be input from the outside so that the electronic device performs the desired operation. Such an external control unit (130) may include a touch screen, an input button, a start button, etc. For example, in the case of a smartphone, the external control unit (130) may include a touch screen provided on the front of the electronic device to perform a desired function according to the user's touch operation, and an input button provided on the side or bottom of the smartphone. Also, taking an electric vehicle as an example, the external control unit (130) may include a touch screen provided in the driver's seat to perform a desired function according to the user's touch operation, and a start button serving as an ignition switch for turning the car's engine on or off.

[0049] 2. Printed circuit board

[0050] Multiple components may be provided inside the electronic device (100). Multiple components may be mounted on a PCB (200) and provided inside the electronic device. At least one PCB may be provided inside the electronic device. For example, as shown in FIGS. 1 and 2, it may include a first PCB (210) on which multiple components forming the BMS (120) are mounted, and a second PCB (220) on which at least one component forming the external input part is mounted.

[0051] The first and second PCBs (210, 220) may be provided spaced apart by a predetermined distance. Here, the first and second PCBs (210, 220) may have the same size or different sizes. Additionally, the first and second PCBs (210, 220) may have the same structure or different structures. That is, the first and second PCBs (210, 220) may be composed of at least one insulating layer and at least one conductive pattern (211, 221), and the first and second PCBs (210, 220) may have different numbers of insulating layers and different shapes of conductive patterns (211, 221). The insulating layer of the first and second PCBs (210, 220) may be ceramic, an organic-inorganic composite material, or glass fiber impregnated. If a polymer resin is included, it may include an epoxy-based insulating resin such as FR-4, BT (Bismaleimide Triazine), or ABF (Ajinomoto Build-up Film), or alternatively, a polyimide-based resin. Meanwhile, when the insulating layer is laminated in multiple layers, the multiple insulating layers may all be formed of the same material, or at least one may be formed of a different material. Additionally, a conductive pattern (211, 221) may be formed in a predetermined shape on at least one surface of the insulating layer. For example, a copper clad laminate (CCL) having a conductive layer formed on one surface and the other surface of the insulating layer may be used, and the conductive pattern (211, 221) may be formed by patterning the conductive layer on the insulating layer. Of course, a plating process may be performed to form conductive patterns (211, 221) on one side and the other side of the insulating layer, respectively.Additionally, when multiple insulating layers are stacked, a conductive pattern (211, 221) is formed on one side and the other side of a central insulating layer, and an upper and lower insulating layer are formed on the upper and lower sides of the central insulating layer, respectively, and a conductive pattern (211, 221) of a predetermined shape can be formed on one side of the upper insulating layer (e.g., the upper side) and one side of the lower insulating layer (e.g., the lower side). The conductive pattern (211, 221) on the upper and lower insulating layers may be formed by patterning the conductive layer, or it may be formed into a predetermined pattern by performing a plating process on the insulating layer. As described above, the first and second PCBs (210, 220) may be configured such that a conductive pattern (211, 221) of a predetermined shape is formed on the surface of the insulating layer, and multiple insulating layers on which the conductive pattern (211, 221) is formed are stacked. These first and second PCBs (210, 220) can be formed as single-sided substrates, double-sided substrates, multilayer substrates, etc., depending on the number of layers of insulating layers and conductive patterns (211, 221). Since a higher number of layers provides better mounting capability for electronic components and is used in high-precision products, the number of layers can be selected according to the number and integration density of components mounted on the PCB. Meanwhile, the conductive patterns (211, 221) formed on the first and second PCBs (21, 220) can be formed in different shapes.

[0052] Meanwhile, the first and second PCBs (210, 220) can be connected via a wire (230). That is, the first and second PCBs (210, 220), on which they are respectively mounted, can be connected via a wire (230) for signal transmission between the external control unit (130) and internal modules such as the BMS (120). Additionally, connectors (241, 242) can be provided on the external control unit (130) and the BMS (120) for the connection of the wire (230), as shown in FIG. 2. That is, a connector can be provided on the first and second PCBs (210, 220) of the BMS (120) and the external control unit (130), respectively, and a connector can also be provided at both ends of the wire (230). For example, a male connector is provided on the first and second PCBs (210, 220) of the BMS (120) and the external control unit (130), respectively, and a female connector is provided at both ends of the wire (230), so that the BMS (120) and the external control unit (130) can be connected through the wire (230) by combining the male connector and the female connector.

[0053] 3. Overvoltage protection device

[0054] The overvoltage protection device (300) may include at least one first overvoltage protection unit (310) provided inside the electronic device (100) and at least one second overvoltage protection unit (320) provided inside the electronic device (100) and spaced apart from the first overvoltage protection unit (310). Here, the first and second overvoltage protection units (310, 320) may be manufactured in different forms and provided inside the electronic device (100). The overvoltage protection device (300) may be provided on a PCB (200), wherein the first overvoltage protection unit (310) is mounted on the PCB (200) and the second overvoltage protection unit (320) may be manufactured using at least a part of the PCB (200). That is, the first transient voltage protection unit (310) may be manufactured in the form of a chip, for example, and mounted on the PCB (200), and the second transient voltage protection unit (320) may be formed using a portion of the conductive pattern of the PCB (200). Here, the first transient voltage protection unit (310) may be mounted on the first PCB (210), for example, and the second transient voltage protection unit (320) may be formed on at least one of the first and second PCBs (210, 220).

[0055] 3.1. First Transient Voltage Protection Unit

[0056] The first transient voltage protection unit (310) can be manufactured in the form of a chip and mounted on the PCB (200). That is, the first transient voltage protection unit (310) may correspond to a surge protection element described in the prior art. At least one first transient voltage protection unit (310) may be provided within the electronic device (100), for example, mounted on the first PCB (210). That is, the first transient voltage protection unit (310) may be mounted on the first PCB (210) by being connected to a conductive pattern (211) on the first PCB (210). At this time, the first transient voltage protection unit (310) may be provided between a part of the conductive pattern (211) and a ground terminal. Accordingly, the first transient voltage protection unit (310) can protect circuit components mounted on the first PCB (210) from transient voltage noise by diverting transient voltage noise caused by surges or ESD, etc., entering through the conduction pattern (211) to the ground terminal. This first transient voltage protection unit (310) may utilize various components. For example, the first transient voltage protection unit (310) may include a diverting component, such as a lightning tube, which serves to divert the propagation path of transient current generated in the line to the ground terminal and limit the transient voltage to the breakdown voltage of the component; a blocking component, such as a resistor or inductor, which suppresses the passage of transient current to prevent it from propagating inside the electronic device; and a clamping component, such as a MOV (Metal Oxide Varistor) or a voltage regulator diode, which limits the incoming abnormal transient voltage to the limiting voltage of the component. An example of a discharge-type device is the gas tube arrester, which has a structure in which two electrodes face each other inside a tube filled with inert gas and is characterized by discharging when the surge voltage exceeds the sparkover voltage of the arrester.Blocking devices primarily utilize resistors or inductors and are components that suppress current flowing into electronic devices and reduce the voltage applied to equipment. Blocking devices utilize the non-linear characteristics in which the impedance of a component changes depending on the voltage applied to terminals or the current flowing through the component; they may include avalanche diodes, Zener diodes, and varistors made of SiC or ZnO materials. When a surge voltage occurs in a circuit with a specified impedance, blocking devices suppress it to a limiting voltage due to the non-linear voltage-current characteristics of the MOV.

[0057] 3.2. Second Transient Voltage Protection Unit

[0058] At least one second transient voltage protection unit (320) may be provided within the electronic device (100). Additionally, the second transient voltage protection unit (320) may be provided spaced apart from the first transient voltage protection unit (310). The present invention additionally provides a second transient voltage protection unit (320) in addition to the first transient voltage protection unit (310), and accordingly, transient voltage flowing into the electronic device can be dispersed and removed by the first transient voltage protection unit (320). That is, by providing the first and second transient voltage protection units (310, 320) and dispersing the transient voltage, deterioration of the first transient voltage protection unit (310) due to continuous stress can be prevented. Such a second transient voltage protection unit (320) may be formed as at least a part of the PCB (200). That is, the second transient voltage protection unit (320) can be formed from a part of the conductive pattern (211) on the PCB (200). The second transient voltage protection unit (320) can be provided between a part of the conductive pattern (211) that serves as a path for current movement and a ground terminal. Thus, when a transient voltage is introduced, at least a portion of the transient voltage can be removed by flowing to the ground terminal through the second transient voltage protection unit (320). Of course, at least a portion of the transient voltage can also be removed through the first transient voltage protection unit (310). Here, at least one second transient voltage protection unit (320) can be provided on at least one PCB (200). That is, at least one second transient voltage protection unit (320) may be provided on a first PCB (210) on which a BMS (120) is mounted, and at least one second transient voltage protection unit (320) may be provided on a second PCB (220) on which an external operation unit (130), such as an input button, is mounted.For example, a second transient voltage protection unit (320) may be formed between the conductive pattern (221) between the input button and the connector (242) and the ground terminal, and a second transient voltage protection unit (320) may be formed between the conductive pattern (211) between the connector (241) and the first transient voltage protection unit (310) and the ground terminal.

[0059] This second transient voltage protection unit (320) may be provided between a conductive pattern (211) on the PCB (200) and a ground terminal. That is, the second transient voltage protection unit (320) may include a first discharge pattern (321) connected to the conductive pattern (211), a second discharge pattern (322) spaced apart from the first discharge pattern (321) and connected to a ground terminal, and a separation part (323) provided between the first and second discharge patterns (321, 322). In other words, the second transient voltage protection unit (320) may be formed such that the first and second discharge patterns (321, 322) are spaced apart by a predetermined distance with the separation part (323) in between and face each other. Additionally, the second transient voltage protection section (320) may be formed as a spike pad with a pointed end so that transient voltage can be effectively induced on the PCB (200). Sparking electricity tends to flow through pointed conductors, such as lightning rods, due to physical properties, for example. That is, at least one area of ​​the first and second discharge patterns (321, 322) facing each other may be formed closer than the other area. By forming the ends of the first and second discharge patterns (321, 322) that are spaced apart from each other in a pointed or rounded manner, the distance between the first and second discharge patterns (321, 322) is reduced, thereby allowing discharge to occur effectively between the first and second discharge patterns (321, 322). At this time, the gap between the first and second discharge electrodes (321, 322), i.e., the separation portion (323), is opened to less than 1 mm so that a signal can flow well through the conductive pattern (211) under normal conditions, and when spark-like noise such as ESD or surge is introduced, the noise is discharged through a spark pad such as a lightning rod and sent to the ground terminal.At this time, the spacing portion (323) can maintain a spacing of 1 mm or less, for example, 1 μm to 1 mm. The smaller the spacing of the spacing portion (323), the lower the transient voltage noise can be removed, and the larger the spacing of the spacing portion (323), the higher the transient voltage noise can be controlled. Therefore, the spacing of the spacing portion (323) can be set by considering the operating voltage of the electronic device, the voltage resistance of the circuit and / or component to transient voltage noise, etc. Meanwhile, to increase the allowable range of transient voltage, the noise resistance rating can be increased by removing the solder mask from the corresponding pattern during PCB design and soldering to create a solder trace on the pattern. By providing the first and second transient voltage protection units (310, 320) in this way, as shown in FIG. 3, transient voltages introduced from the outside can be primarily removed through the second transient voltage protection unit (320) and secondarily removed through the first transient voltage protection unit (310). Therefore, since no separate component is installed, the stress received by the first transient voltage protection unit (310) can be reduced without additional cost, thereby extending the lifespan of the first transient voltage protection unit (310) and improving the noise immunity of the BMS.

[0060] Meanwhile, the second transient voltage protection unit (320) can be formed in various shapes. For example, as shown in FIG. 4(a), the first and second discharge patterns (321, 322) may be formed with two central regions facing each other in a pointed shape, or as shown in FIG. 4(b), two or more first and second discharge patterns (321, 322) may be formed with two regions facing each other in a pointed shape. Additionally, as shown in FIG. 4(c), the first and second discharge patterns (321, 322) may be formed in a round shape so as to be convex toward the center, or as shown in FIG. 4(d), the first and second discharge patterns (321, 322) may be formed with two edges facing each other closely and moving further apart toward the center. That is, the discharge patterns (321, 322) of the present invention may be formed such that at least one region facing each other is formed closer than another region, and a spacing portion (322) may be formed to maintain a gap of 1 mm or less between the two close discharge patterns (321, 322).

[0061] 4. Case

[0062] A case (400) may be provided to accommodate a plurality of components and a PCB (200) on which the plurality of components are mounted, forming the external shape of the electronic device (100). That is, the case (400) accommodates the plurality of components and the PCB (200) to form the external shape of the electronic device (100). In other words, the case (400) is a part of the electronic device (100) that forms the external shape of the electronic device (100). For example, the case (400) may have a flat portion having a rectangular shape and a side portion extending upward from the edge of the flat portion. In this case, the flat portion may correspond to the rear of the electronic device (100) and the side portion may correspond to the side of the electronic device (100). Also, a touch screen, etc., may be provided as a cover portion facing the flat portion, and the touch screen may correspond to the front of the electronic device (100). Of course, the case (400) may be manufactured in various forms having a space inside to accommodate the plurality of components and the PCB (200). Meanwhile, the PCB (200) can be fixed to the case (400) by a predetermined fastening member (410) including a bolt. That is, fastening members (410) are provided at the four corners of the first PCB (210) and the four corners of the second PCB (220), and the PCB (200) can be fixed to the case (400) by the fastening members (410). In addition, a part of the fastening member (410) can be connected to the second transient voltage protection unit (320). That is, the second discharge pattern (322) of the second transient voltage protection unit (320) can be formed extending to a part of the fastening member (410). In addition, the second discharge pattern (322) of the second transient voltage protection unit (320) can be connected to the ground terminal of the case (320) through the fastening member (410). Accordingly, transient voltage noise caused by ESD, surge, etc. can be discharged to the ground terminal through the discharge patterns (321, 322) of the second transient voltage protection unit (320), the fastening member (410), and the case (400).

[0064] As described above, an overvoltage protection device (300) according to one embodiment of the present invention may include first and second overvoltage protection units (310, 320) spaced apart from each other by a predetermined distance. The first and second overvoltage protection units (310, 320) may be manufactured in different forms; the first overvoltage protection unit (310) may be manufactured in the form of a chip and mounted on a PCB (200), and the second overvoltage protection unit (320) may be formed using a circuit pattern on at least a part of the PCB (200). Additionally, the second overvoltage protection unit (320) may include first and second discharge patterns (321, 322) and a spacing portion (322) provided between the discharge patterns (321, 322) by spaced apart from each other by a predetermined distance. Thus, by configuring the second transient voltage protection unit (320) such that the first and second discharge patterns (321, 322) are spaced apart at a predetermined interval with the separation portion (322) in between, if transient voltage noise is not introduced, a signal flows through the conduction pattern (211) of the PCB (200), and if transient voltage noise is introduced, the transient voltage noise flows through the discharge patterns (321, 322) of the second transient voltage protection unit (320). The transient voltage noise flowing through the discharge patterns (321, 322) flows through the fastening member (410) and the case (400) and is extinguished through the ground terminal. The present invention is provided with first and second transient voltage protection units (310, 320) so that transient voltage introduced from the outside can be primarily removed through the second transient voltage protection unit (320) and secondarily removed through the first transient voltage protection unit (310). Therefore, since no additional separate component is mounted, the stress received by the first transient voltage protection unit (310) is reduced without additional cost, thereby extending the lifespan of the first transient voltage protection unit (310) and improving the noise immunity of the PCB.

[0066] Although the technical concept of the present invention as described above has been specifically explained according to the above embodiments, it should be noted that the above embodiments are for illustrative purposes only and are not intended to be limiting. Furthermore, those skilled in the art will understand that various embodiments are possible within the scope of the technical concept of the present invention. Explanation of the symbols

[0068] 100 : Electronic devices 200 : PCB 300: Overvoltage protection device 310, 320: 1st and 2nd transient voltage protection units 321: 1st discharge pad 322: 2nd discharge pad 323 : Separation

Claims

Claim 1 A transient voltage protection device comprising at least one first transient voltage protection unit provided inside an electronic device to protect a circuit from transient voltage noise input from an external operating unit, and at least one second transient voltage protection unit provided inside the electronic device spaced apart from the first transient voltage protection unit to protect a circuit from transient voltage noise, wherein the second transient voltage protection unit comprises one second-1 transient voltage protection unit formed between the external operating unit and the first transient voltage protection unit, and another second-2 transient voltage protection unit formed between the second-1 transient voltage protection unit and the first transient voltage protection unit, wherein the second-1 transient voltage protection unit and the second-2 transient voltage protection unit are mounted on a PCB spaced apart from each other. Claim 2 In claim 1, the first transient voltage protection part is a surge protection element mounted on a PCB, and the second transient voltage protection part is a transient voltage protection device formed from a part of a conductive pattern formed on the PCB. Claim 3 The transient voltage protection device of claim 2, wherein the second transient voltage protection unit comprises a first discharge pattern connected to a part of the conductive pattern and a second discharge pattern spaced apart from the first discharge pattern and connected to a ground terminal. Claim 4 The transient voltage protection device of claim 3, wherein the first and second discharge patterns face each other such that at least some regions are closer than other regions. Claim 5 A transient voltage protection device according to claim 4, wherein the first and second discharge patterns maintain a gap of 1 mm or less between regions facing each other closely. Claim 6 A printed circuit board comprising at least one stacked insulating layer and a conductive pattern formed on the at least one insulating layer, at least one spark pad extending from the conductive pattern and for protecting the circuit from transient voltage noise input from an external operating unit, and at least one surge protection element mounted on a printed circuit board and spaced apart from the spark pad, wherein the spark pad comprises a first spark pad formed between the external operating unit and the surge protection element and another second spark pad formed between the surge protection element and the first spark pad, and wherein the first spark pad and the second spark pad are spaced apart from each other. Claim 7 A printed circuit board according to claim 6, comprising two or more printed circuit boards spaced apart from each other, wherein two or more printed circuit boards are electrically connected. Claim 8 In claim 7, the printed circuit boards having spark pads formed respectively on the two or more printed circuit boards. Claim 9 delete Claim 10 In claim 6, the spark pad comprises a first discharge pattern connected to a part of the conductive pattern and a second discharge pattern spaced apart from the first discharge pattern and connected to a ground terminal, forming a printed circuit board. Claim 11 In claim 10, the first and second discharge patterns are printed circuit boards facing each other such that at least some regions are closer than other regions. Claim 12 In claim 11, the first and second discharge patterns are printed circuit boards in which the areas facing each other closely maintain a gap of 1 mm or less. Claim 13 An electronic device comprising at least one printed circuit board having a plurality of components mounted thereon, at least one first transient voltage protection unit mounted on the printed circuit board to protect the circuit from transient voltage noise input from an external operating unit, and at least one second transient voltage protection unit formed on the printed circuit board using at least a portion of the printed circuit board spaced apart from the first transient voltage protection unit to protect the circuit from transient voltage noise input from the external operating unit, wherein the second transient voltage protection unit comprises one second-1 transient voltage protection unit formed between the external operating unit and the first transient voltage protection unit, and another second-2 transient voltage protection unit formed between the second-1 transient voltage protection unit and the first transient voltage protection unit, wherein the second-1 transient voltage protection unit and the second-2 transient voltage protection unit are mounted on the printed circuit board spaced apart from each other. Claim 14 An electronic device according to claim 13, further comprising a rechargeable battery and a BMS implemented on the printed circuit board and managing the battery. Claim 15 An electronic device according to claim 13 or claim 14, wherein the second transient voltage protection unit is formed using a conductive pattern of the printed circuit board, and comprises a first discharge pattern connected to a part of the conductive pattern and a second discharge pattern spaced apart from the first discharge pattern and connected to a ground terminal. Claim 16 In claim 15, the first and second discharge patterns are electronic devices facing each other such that at least some regions are closer than other regions. Claim 17 An electronic device according to claim 16, wherein the first and second discharge patterns have a distance of 1 mm or less between areas facing each other in close proximity. Claim 18 An electronic device according to claim 17, further comprising a case for housing the printed circuit board and a fastening member for fixing the printed circuit board to the case, wherein the second discharge pattern is connected to the ground terminal through the fastening member.

Images