Probe device

Abstract

A probe device comprises a housing having a first surface and a second surface, a probe supported by the housing having a first contact portion exposed on the first surface and a second contact portion exposed on the second surface, wherein at least one of the first contact portion and the second contact portion is made of a conductive ceramic material, and an elastic member disposed inside the housing in contact with the probe and the housing. The probe changes its orientation inside the housing so that the position of the contact area in contact with the electrode pad at the second contact portion changes in response to the displacement of the first contact portion. The elastic member elastically deforms in response to the change in the orientation of the probe inside the housing and applies force to the probe in a direction that eliminates the displacement of the first contact portion.

Description

Technology Field

[0001] The present invention relates to a probe device used for testing the electrical characteristics of a device. Background Technology

[0002] In the inspection of electrical characteristics of a device in which a semiconductor integrated circuit or the like is mounted in a package, a probe device is used to electrically connect the device and the inspection device. The probe device electrically connects the electrode terminals of the device to electrode pads disposed on a substrate, such as a printed circuit board (PCB). The electrode pads are electrically connected to the inspection device through wiring patterns formed on the substrate. Prior art literature

[0003] Japanese Patent Publication No. 2019-35660 The problem to be solved

[0004] In a probe device, the electrode terminal and the electrode pad are electrically connected by a contactor that contacts the electrode terminal and the electrode pad. A metal, which is a conductive material, is used for the contactor. However, as the contactor comes into contact with the electrode terminal and the electrode pad, the material of the electrode terminal and the electrode pad adheres to the surface of the contactor, thereby reducing the contactability of the contactor with the electrode terminal and the electrode pad (hereinafter simply referred to as "contactability").

[0005] In order to restore the contactability of a contactor, a cleaning operation is required to remove metal attached to the surface of the contactor. In the cleaning operation, metal attached to the surface of the contactor is removed, for example, by a brush or a cleaning sheet. However, mechanical cleaning operations using a brush or a cleaning sheet cause the contactor to wear out, thereby reducing its contactability.

[0006] The present invention aims to provide a probe device capable of suppressing a decrease in contact with an electrode terminal and an electrode pad. means of solving the problem

[0007] A probe device according to one embodiment of the present invention comprises a housing having a first surface and a second surface, a probe having at least one of a first contact portion exposed on the first surface and a second contact portion exposed on the second surface made of a conductive ceramic material, and an elastic member disposed inside the housing in contact with the probe and the housing. The probe changes its orientation inside the housing so that the position of the contact area in contact with the electrode pad at the second contact portion changes in response to the displacement of the first contact portion. The elastic member elastically deforms in response to the change in the orientation of the probe inside the housing and applies force to the probe in a direction that eliminates the displacement of the first contact portion. Effects of the invention

[0008] According to the present invention, a probe device capable of suppressing a decrease in contact with an electrode terminal and an electrode pad can be provided. Brief explanation of the drawing

[0009] FIG. 1 is a schematic diagram showing the configuration of a probe device according to a first embodiment. FIG. 2 is a schematic diagram showing a change in the orientation of the probe of a probe device according to a first embodiment. Figure 3 is a table showing the hardness and volume resistivity of the material. FIG. 4 is a schematic diagram showing the configuration of a probe device according to a second embodiment. FIG. 5 is a schematic diagram for explaining a method of manufacturing a probe device according to a second embodiment. FIG. 6 is a schematic diagram showing the configuration of a probe device according to a third embodiment. FIG. 7 is a schematic diagram for explaining a method of manufacturing a probe device according to a third embodiment. Figure 8 is a schematic diagram showing an example of the arrangement of probes of a comparative example probe device. Specific details for implementing the invention

[0010] Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, identical or similar parts are given identical or similar reference numerals. However, it should be noted that the drawings are schematic and that the ratios of the thicknesses of each part may differ from reality. Furthermore, it is understood that there are parts with different dimensional relationships or ratios between the drawings. The embodiments described below are intended to illustrate devices or methods for embodying the technical concept of the present invention, and the embodiments of the present invention are not limited to the materials, shapes, structures, arrangements, etc., of the constituent parts.

[0011] (First embodiment)

[0012] The probe device (1) according to the first embodiment shown in FIG. 1 is used to test the electrical characteristics of a device (100) to be tested. The device (100) is a test object that has a semiconductor integrated circuit, etc. mounted in a package. The probe device (1) electrically connects the electrode terminal (101) of the device (100) and the electrode pad (201) of the substrate (200). FIG. 1 illustrates an example where the electrode terminal (101) is a lead electrode of the package. The electrode pad (201) is electrically connected to the test device through a wiring pattern (not shown), etc. formed on the substrate (200).

[0013] The probe device (1) comprises a housing (10) having a first surface (11) and a second surface (12) facing the first surface (11), a probe (20) supported by the housing (10) having a first contact portion (21) and a second contact portion (22), and an elastic portion (30) disposed inside the housing (10). The probe (20) functions as a contactor that electrically connects an electrode terminal (101) and an electrode pad (201). Hereinafter, if the first contact portion (21) and the second contact portion (22) are not limited, they are also referred to as "contact portions." The first contact portion (21) that contacts the electrode terminal (101) and the second contact portion (22) that contacts the electrode pad (201) of the probe (20) are at least made of a conductive ceramic material. The parts of the probe (20) that are not made of a conductive ceramic material are made of a conductive material such as a metal material. For example, the probe (20) may have a structure in which a metal material, such as beryllium copper (Be-Cu) or palladium (Pd) alloy, is used for the material between the first contact portion (21) and the second contact portion (22) of the conductive ceramic material. Alternatively, not only the contact portion but also the entire probe (20) may be made of conductive ceramic material. Below, an exemplary case in which the entire probe (20) is made of conductive ceramic material is described. The elastic portion (30) is placed inside the housing (10) in contact with the housing (10) and the probe (20).

[0014] To make it easier to understand the operation of the probe device (1), the X direction, Y direction, and Z direction are defined as shown in FIG. 1. In FIG. 1, the X direction is the left-right direction of the ground, the Y direction is the depth direction of the ground, and the Z direction is the up-down direction of the ground. In addition, regarding the Z direction, the direction in which the device (100) is located as viewed from the probe device (1) is the upward direction, and the direction in which the probe device (1) is located as viewed from the device (100) is the downward direction.

[0015] Additionally, although only one probe (20) of the probe device (1) is shown in FIG. 1, the probe device (1) may have multiple probes (20). For example, the probe device (1) may be configured to have multiple probes (20) arranged along the Y direction. The thickness of the probe (20) in the Y direction (hereinafter simply referred to as "thickness") is, for example, about 0.1 to 0.2 mm. Furthermore, the thickness of the probe is not limited to 0.1 to 0.2 mm and can be arbitrarily set according to the size or spacing of the electrode terminal (101), the magnitude of the current flowing through the probe (20) during inspection of the device (100), etc. The probe (20) may be formed, for example, by punching a plate of conductive ceramic material into a predetermined shape using a wire discharge method or a laser processing method. Because of this, the processing precision of the thickness of the probe (20) can be improved compared to forming the probe (20) by processing a metal material. That is, in a probe (20) made of conductive ceramic material, it is difficult for processing deviations in the thickness of the probe (20) to occur. On the other hand, since metal materials are softer than conductive ceramic materials, processing deviations in the thickness of a probe (20) made of metal material are likely to occur.

[0016] In FIG. 1, a probe device (1) is positioned in the lower direction of the device (100) when viewed from the Z direction. The first contact portion (21) of the probe (20) is exposed to the first surface (11) of the housing (10), and the second contact portion (22) of the probe (20) is exposed to the second surface (12) of the housing (10). The probe (20) is positioned in the housing (10) such that when the distance between the probe device (1) and the device (100) narrows along the Z direction, the first contact portion (21) and the electrode terminal (101) of the device (100) come into contact. Additionally, the probe device (1) is positioned in the housing (10) such that the contact area (220) of the second contact portion (22) comes into contact with the electrode pad (201) of the substrate (200). As described below, during the inspection of the device (100), the position of the contact area (220) in contact with the electrode pad (201) at the second contact part (22) changes due to a change in the position of the first contact part (21) in the Z direction.

[0017] When viewed from the Y direction, the probe (20) has a curved shape with an upward-facing concave portion. One end of the probe (20) located far from the outer part of the probe (20) facing the concave portion (hereinafter referred to as the "curved portion") is the first contact portion (21). The other end of the probe (20) closer to the concave portion is the second contact portion (22). A part of the arched area of ​​the outer edge of the curved portion is the contact area (220). When the XY plane defined by the X and Y directions is used as the projection plane, the projection line of the direction connecting the first contact portion (21) and the second contact portion (22) (hereinafter referred to as the "extension direction" of the probe (20)) extends in the X direction. In other words, when viewed from the Z direction, the probe (20) extends in the X direction.

[0018] The elastic part (30) is a cylindrical shape that extends in the axial direction in the Y direction. That is, the axial direction of the elastic part (30) is perpendicular to the direction of displacement of the first contact part (21) of the probe (20) and also perpendicular to the direction of extension of the probe (20). The elastic part (30) is in contact with the inner side of the concave part of the probe (20). In other words, the elastic part (30) is sandwiched between the surface of the concave part of the probe (20) and the inner wall of the housing (10).

[0019] When inspecting the device (100), as shown in FIG. 2, the electrode terminal (101) of the device (100) and the electrode pad (201) of the substrate (200) are electrically connected by a conductive probe (20). That is, when inspecting the device (100), the device (100) is moved relative to the probe device (1) along the Z direction, and the first contact portion (21) of the probe (20) is pushed against the electrode terminal (101) of the device (100). At this time, the probe (20) changes its position inside the housing (10) while the second contact portion (22) is in contact with the surface of the electrode pad (201) due to the pressure applied to the first contact portion (21) between the first contact portion (21) and the electrode terminal (101).

[0020] Specifically, in response to the displacement of the first contact part (21) in the Z direction caused by the pressure applied to the first contact part (21), the position of the probe (20) inside the housing (10) changes while the second contact part (22) remains in contact with the electrode pad (201). As the position of the probe (20) changes, the position of the contact area (220) in contact with the electrode pad (201) at the second contact part (22) changes. In FIG. 2, the position of the probe (20) and the shape of the elastic part (30) in the state where the first contact part (21) and the electrode terminal (101) are in contact (hereinafter also referred to as the "contact state") are shown in a fresh manner. In addition, in FIG. 2, the position of the probe (20) and the shape of the elastic part (30) in a state where the first contact part (21) and the electrode terminal (101) are not in contact (hereinafter also referred to as the "non-contact state") are shown by dashed lines. In the contact state during inspection of the device (100), the position of the probe (20) changes so that the position of the contact area (220) becomes closer to the first contact part (21) than in the non-contact state.

[0021] The probe (20) requires conductivity for electrically connecting the electrode terminal (101) and the electrode pad (201), and mechanical strength such that its shape does not change in contact and non-contact states. The probe (20), made of a conductive ceramic material, possesses both conductivity and mechanical strength.

[0022] In the contact state, the elastic part (30) is compressed by being sandwiched between the probe (20) and the housing (10) in response to a change in posture inside the housing (10) of the probe (20). That is, in the contact state, the elastic part (30) is elastically deformed. The elastically deformed elastic part (30) applies force to the probe (20) in a direction that returns the posture of the probe (20) to a non-contact state posture. In other words, the elastic part (30) applies force to the probe (20) to push the first contact part (21) against the electrode terminal (101).

[0023] While the device (100) is being inspected, the first contact portion (21) is in contact with the electrode terminal (101) and the second contact portion (22) is in contact with the electrode pad (201) by the elastic force of the elastic portion (30). By doing so, during the inspection of the device (100), an electrical connection between the electrode terminal (101) of the device (100) and the electrode pad (201) of the substrate (200) is secured through the probe (20).

[0024] In the probe device (1), a part of the arched region of the outer edge of the curved portion of the probe (20) contacts the electrode pad (201) as a contact area (220) along a line extending in the Y direction. As shown in FIG. 2, the position of the contact area (220) in the contact state is closer to the first contact portion (21) than the position of the contact area (220) in the non-contact state. The reason the position of the contact area (220) changes between the contact state and the non-contact state is that the position of the contact area (220) changes along the outer edge of the curved portion according to the change in the posture of the probe (20). Since the contact area (220) is included in the arched region of the curved portion, the position of the contact area (220) that contacts the electrode pad (201) changes smoothly according to the change in the posture of the probe (20). Because of this, damage to the second contact portion (22) and the electrode pad (201) can be suppressed even if the posture of the probe (20) changes.

[0025] As described above, during the inspection of the device (100), the elastic part (30) sandwiched between the probe (20) and the case (10) undergoes elastic deformation as the position of the probe (20) changes. Then, the elastic part (30) applies force to the probe (20) so that the first contact part (21) contacts the electrode terminal (101) of the device (100) with a predetermined pressure. That is, the elastic part (30) applies force to the probe (20) in a direction that eliminates the displacement of the first contact part (21) caused by the pressure applied to the first contact part (21) when the first contact part (21) is pushed against the electrode terminal (101). During the inspection of the device (100), that is, while the first contact part (21) is in contact with the electrode terminal (101), the elastic part (30) is in a state of compression deformation.

[0026] After the inspection of the device (100) is completed, the relative position of the device (100) in the Z direction with respect to the probe device (1) is changed to widen the gap between the device (100) and the probe device (1). By separating the electrode terminal (101) of the device (100) and the first contact portion (21) of the probe (20), the pressure applied to the first contact portion (21) is eliminated. As a result, the shape of the elastic portion (30) returns to a non-contact state, and the position of the probe (20) returns to a non-contact state due to the elastic force of the elastic portion (30).

[0027] The probe (20) is supported by a housing (10) so that the position of the probe (20) can change in response to the displacement of the position of the first contact portion (21) in the Z direction. The position of the probe (20) changes within the housing (10) so that the position of the contact area (220) in contact with the electrode pad (201) at the second contact portion (22) changes in response to the displacement of the first contact portion (21) in the Z direction. For example, although not illustrated, a part of the probe (20) may be protruded and the protruding part of the probe (20) may be inserted into a support hole provided in the housing (10). Alternatively, a part of the probe (20) may be placed on a support portion of the housing (10) provided in the downward direction of the probe (20).

[0028] As described above, the probe device (1) includes a probe (20) made of a conductive ceramic material that simultaneously contacts an electrode terminal (101) and an electrode pad (201), and an elastic part (30) that applies force to the probe (20) by means of elastic force when the probe (20) is in contact with the electrode terminal (101). The contact load applied to the probe (20) when the probe (20) and the electrode terminal (101) are in contact is controlled by the elastic force of the elastic part (30). The contact load increases by increasing the elastic force of the elastic part (30), and the contact load decreases by decreasing the elastic force of the elastic part (30). In addition, in the probe device (1), the amount of displacement of the first contact part (21) by contact with the electrode terminal (101) (hereinafter also referred to as "stroke") is controlled by the elastic force of the elastic part (30). That is, the stroke is reduced by strengthening the elastic force of the elastic part (30), and the stroke is increased by weakening the elastic force of the elastic part (30).

[0029] For example, an elastomer is used as the material for the elastic part (30). Additionally, the elastic part (30) may be in a cylindrical shape having a hollow structure. By making the elastic part (30) cylindrical, it is easy to control the contact load and the stroke size. That is, by making the thickness of the cylindrical elastic part (30) thicker, the contact load can be increased or the stroke can be decreased. On the other hand, by making the thickness of the cylindrical elastic part (30) thinner, the contact load can be decreased or the stroke can be increased.

[0030] The elastic part (30) may be a conductive material or an insulating material. However, the materials of the housing (10) and the elastic part (30) and the arrangement of the elastic part (30) inside the housing (10) are set so that the probe (20) is electrically insulated.

[0031] Conventionally, a metal material has been used as a contactor to electrically connect the electrode terminal (101) and the electrode pad (201). The contactor corresponds to the probe (20) in the probe device (1). By repeatedly inspecting the device (100), the metal material (tin or nickel palladium (Ni-Pd), etc.) of the electrode terminal (101) and the electrode pad (201) adheres to the surface of the contactor. In order to prevent a decrease in the contactability of the contactor between the electrode terminal (101) and the electrode pad (201), it is necessary to remove the metal attached to the surface of the contactor by a cleaning operation. However, the surface of the contactor is worn or damaged by the cleaning operation, and the contactability of the contactor is reduced.

[0032] Meanwhile, in the probe device (1), by using a conductive ceramic material, which has higher hardness and wear resistance than metal materials, as the material for the probe (20), the decrease in contactability of the probe (20) can be suppressed. For example, according to the probe device (1), wear of the probe (20) caused by a cleaning operation to remove metal attached to the surface of the probe (20) can be suppressed. Therefore, according to the probe device (1), stable contact between the probe (20), the electrode terminal (101), and the electrode pad (201) is possible. FIG. 3 shows a table comparing the hardness and volume resistivity of a conductive ceramic material with that of a representative beryllium copper (Be-Cu) material and a palladium (Pd) alloy material as metal materials for the contactor. As shown in FIG. 3, the conductive ceramic material has a higher hardness than the metal material, and its volume resistivity is equal to or lower than that of the metal material. Therefore, the conductive ceramic material can be suitably used as the material for the probe (20).

[0033] It is preferable to set the hardness of the probe (20) to, for example, 1400 HV or higher. Additionally, it is preferable to set the hardness of the probe (20) to a degree that ensures a certain toughness, such as preventing damage like defects when an external force is applied to the probe (20) during inspection. For example, by setting the hardness of the probe (20) to 1000 HV or higher, the effect of having a higher hardness than the metal material generally used for probes and being difficult to cut during cleaning can be obtained. The metal material generally used for probes can be, for example, Be-Cu (about 380 HV), palladium alloy (360 HV), or rhenium tungsten (900 HV), all of which have a hardness lower than 1000 HV.

[0034] In addition, it is preferable to set the volume resistivity of the probe (20) to, for example, 10 μΩ·cm or less. For example, by setting the volume resistivity of the probe (20) to 30 μΩ·cm or less, the probe (20) can have a volume resistivity of the same degree as that of the metal material (palladium alloy (32 μΩ·cm)) generally used for probes. Therefore, by using a conductive ceramic material for the probe (20), the effect of extending the lifespan of the probe (20) by suppressing wear during cleaning while securing electrical characteristics of the same degree as that of the metal material can be obtained.

[0035] Additionally, it is preferable to use a conductive ceramic material with a higher hardness than that of the electrode terminal (101) and the electrode pad (201) for the probe (20). By making the hardness of the probe (20) higher than that of the electrode terminal (101) and the electrode pad (201), wear of the first contact portion (21) and the second contact portion (22) of the probe (20) caused by repeated inspection of the device (100) can be suppressed.

[0036] Meanwhile, if the contactor is made of a metal material, metal plating may be applied to the surface of the metal material of the contactor to improve the contactability of the contactor. For example, a contactor with gold plating on the surface of a base metal material such as Be-Cu or palladium alloy is used. However, there is a risk that problems may occur when using a contactor with a metal plating on its surface for inspection of the device (100). For example, metal plating peeled off from the contactor due to contact with the electrode terminal (101) and the electrode pad (201) adheres to the surface of the substrate (200), causing a short circuit between the electrode pads (201). Meanwhile, the surface of the probe (20) of the probe device (1) is not metal-plated, and a conductive ceramic material contacts the electrode terminal (101) at the first contact portion (21), and a conductive ceramic material contacts the electrode pad (201) at the second contact portion (22). Therefore, short circuits on the substrate (200) caused by peeling off the metal plating from the surface of the probe (20) can be prevented.

[0037] As described above, in the probe device (1) according to the first embodiment, a probe (20) made of a conductive ceramic material is used, which has conductivity equal to or greater than that of a metal material and also has higher hardness and wear resistance than a metal material. Since at least the part of the probe (20) that contacts the electrode terminal (101) and the electrode pad (201) is made of a conductive ceramic material, wear of the contact part is suppressed. Therefore, according to the probe device (1), the decrease in contact with the electrode terminal (101) and the electrode pad (201) can be suppressed, so the electrical characteristics of the device (100) can be accurately inspected. Not only when the entire probe (20) is made of a conductive ceramic material, but also when at least the first contact part (21) and the second contact part (22) are made of a conductive ceramic material probe (20), the decrease in contact with the electrode terminal (101) and the electrode pad (201) can be suppressed.

[0038] (Second embodiment)

[0039] In the probe device (1) according to the second embodiment, as shown in FIG. 4, two probes (20) are arranged in parallel along the Y direction with a shield plate (25) of insulating material in between. FIG. 4 shows the configuration of the probe device (1) viewed from the X direction, and the elastic part (30) is indicated by a dashed line through the probe (20) and the shield plate (25). The fact that two probes (20) are arranged along the Y direction with the shield plate (25) in between is a difference between the probe device (1) shown in FIG. 4 and the first embodiment. As for other configurations, the probe device (1) according to the second embodiment is the same as the first embodiment. A set of probes (20) arranged with the shield plate (25) in between is also referred to as a "probe pair" below.

[0040] In the probe device (1) shown in FIG. 4, the Y-direction spacing of the first contact portions (21) of the two probes (20) constituting the probe pair is determined by the Y-direction thickness of the shield plate (25) (hereinafter referred to as "plate thickness"). According to the probe device (1) having a probe pair, the first contact portions (21) of each probe (20) can be independently contacted to two electrode terminals (101) that are placed in close proximity. The plate thickness of the shield plate (25) may be set to match the spacing along the Y-direction of the electrode terminals (101).

[0041] According to the probe device (1) shown in FIG. 4, a Kelvin connection can be made to the device (100) using a probe pair. That is, the probe device (1) having a probe pair can be used as a Kelvin contact measuring device.

[0042] A probe pair may be manufactured by processing a sheet material (20C) in which an insulating ceramic material (20B) is sandwiched between two conductive ceramic materials (20A), as shown in FIG. 5, for example. The sheet material (20C) is punched into a predetermined shape of a probe (20) by a wire discharge method or a laser processing method. Through the above process, a probe pair having a shield plate (25) processed from an insulating ceramic material (20B) and a probe (20) processed from a conductive ceramic material (20A) is manufactured. The sheet material (20C) may be formed by diffusion bonding of the insulating ceramic material (20B) and the conductive ceramic material (20A). When the bonding temperature of the diffusion bond is high, such that it is 800 degrees or higher, it is desirable that the thermal expansion coefficient of the insulating ceramic material (20B) and the thermal expansion coefficient of the conductive ceramic material (20A) be close so that cracks or deformation do not occur in the sheet material (20C) when it is cooled to room temperature after bonding.

[0043] The spacing of the probes (20) of the probe pair is determined by the plate thickness of the shield plate (25) made of insulating ceramic material. Accordingly, according to the probe device (1) shown in FIG. 4, it is possible to manufacture a probe device (1) in which the spacing of the probes (20) is set with high precision.

[0044] As described above, according to the probe device (1) of the second embodiment, by using a conductive ceramic material with high hardness as the material for the probe (20), the contactability of the probe (20) can be improved, and the spacing of the probe (20) can be set with high precision. Furthermore, the probe device (1) according to the second embodiment is substantially the same as the probe device (1) according to the first embodiment, and duplicate descriptions are omitted. For example, only the contact portion of the probe (20) may be made of a conductive ceramic material, or the entire probe (20) may be made of a conductive ceramic material.

[0045] (Third embodiment)

[0046] In the probe device (1) according to the third embodiment, as shown in FIG. 6, a probe (20) is fitted from both sides by a shield plate (25) made of an insulating material. In addition, a plurality of probes (20) with the shield plates (25) in contact with each other are arranged in parallel in the Y direction inside a single slit (13) provided in the housing (10). FIG. 6 shows the configuration of the probe device (1) viewed from the X direction, and the elastic part (30) is indicated by a dashed line through the probe (20) and the shield plate (25). The probe device (1) shown in FIG. 6 differs from the first embodiment in that the probe (20) is fitted into the shield plate (25) and a plurality of probes (20) are arranged within the same slit (13) of the housing (10). As for other configurations, the probe device (1) according to the third embodiment is the same as the first embodiment. A plurality of probes (20) connected to each other through a shield plate (25) are also referred to as a “probe group” below. The probe device (1) shown in FIG. 6 illustrates an example where one probe group consists of three probes (20). The number of probes (20) constituting the probe group can be arbitrarily set.

[0047] A probe group may be manufactured by processing a laminated material (20D) in which a structure is formed by stacking a conductive ceramic material (20A) and an insulating ceramic material (20B) from both sides, as shown in FIG. 7, for example. The laminated material (20D) is punched into a predetermined shape of a probe (20) by a wire discharge method or a laser processing method. Through the above process, a probe group having a plurality of probes (20) is manufactured. By processing the laminated material (20D), a plurality of probes (20) can be manufactured in a single processing process.

[0048] In a comparative example probe device in which the probe (20) is not fitted by an insulating shield plate (25), one probe (20) is placed in one slit (13) of the housing (10), as shown in FIG. 8. By placing one probe (20) in one slit (13), a short circuit between the probes (20) is prevented by the guide portion (14) of the housing (10) that partitions the slits (13).

[0049] Meanwhile, in a probe device (1) having a probe group, as shown in FIG. 6, a plurality of probes (20) can be arranged in a single slit (13). Because of this, the probe device (1) can be miniaturized. Since the spacing of the probes (20) in the probe group can be set by the plate thickness of the shield plate (25), it is easy to manage the precision of the spacing of the probes (20) and the precision of the overall size of the probe group.

[0050] In addition, since the outer side of the probe (20) in the probe group is covered with an insulating shield plate (25), the guide portion (14) of the housing (10) positioned on both sides of the slit (13) may be conductive. In other words, it is possible to make the material of the housing (10) a conductive material. Because of this, the housing (10) can be set to a predetermined potential. For example, in the case where high precision inspection can be performed by setting the housing (10) to a ground potential during device inspection, the housing (10) may be set to a ground potential by using a conductive material. In addition, the manufacturing cost of the probe device (1) may be reduced by selecting the material with the lower cost between the conductive material and the insulating material for the materials of the housing (10) and the elastic part (30).

[0051] As described above, according to the probe device (1) of the third embodiment, by using a conductive ceramic material with high hardness as the material for the probe (20), the contactability of the probe (20) can be improved, and the spacing of the probe (20) can be set with high precision. In addition, according to the probe device (1) of the third embodiment, the selection of component materials around the probe (20) is increased, allowing for cost reduction and functional improvement. Furthermore, the probe device (1) according to the third embodiment is substantially the same as the first embodiment, and redundant descriptions are omitted. For example, only the contact portion of the probe (20) may be made of a conductive ceramic material, or the entire probe (20) may be made of a conductive ceramic material.

[0052] (Other embodiments)

[0053] As described above, the present invention has been described by way of embodiments, but the descriptions and drawings that make up part of this disclosure should not be understood as limiting the invention. From this disclosure, various alternative embodiments, examples, and operating techniques will become apparent to those skilled in the art.

[0054] For example, although the above description describes a case where the first contact part (21) and the second contact part (22) are made of conductive ceramic material, either the first contact part (21) or the second contact part (22) may be made of conductive ceramic material. For example, if either the first contact part (21) or the second contact part (22) is worn out by a cleaning operation, only the contact part worn out by the cleaning operation may be made of conductive ceramic material. That is, the electrical characteristics of the device (100) can be accurately inspected by a probe (20) in which at least one of the first contact part (21) and the second contact part (22) is made of conductive ceramic material.

[0055] Additionally, although the above description describes the case where the elastic part (30) is cylindrical in shape as an example, the shape of the elastic part (30) is not limited to a cylindrical shape. For example, the elastic part (30) may be cylindrical without a hollow part, and the outer edge of the elastic part (30) viewed from the Y direction may be polygonal rather than circular. Also, although the case where the electrode terminal (101) of the device (100) is a lead electrode has been shown as an example, the electrode terminal (101) may be a pad electrode, a bump electrode, or an electrode of any other shape.

[0056] As such, the present invention naturally includes various embodiments not described herein. Explanation of the symbols

[0057] 1; Probe device 10; Housing 11; 1st side 12; 2nd side 13; slit 14; Guide section 20; probe 21; first contact part 22; second contact part 25; shield plate 30; elastic part 100; device 101; electrode terminal 200; substrate 201; electrode pad

Claims

Claim 1 A probe device for electrically connecting an electrode terminal of a device to be inspected and an electrode pad connected to an inspection device, comprising: a housing having a first surface and a second surface facing the first surface; a probe supported by the housing having a first contact portion exposed to the first surface and a second contact portion exposed to the second surface, wherein at least the first contact portion and the second contact portion are probes made of a conductive ceramic material having a hardness of 1000 HV or more, and wherein the position of a contact area in contact with the electrode pad in the second contact portion changes in response to the displacement of the first contact portion, and an elastic portion disposed inside the housing in contact with the probe and the housing, and which elastically deforms in response to the change in the position of the probe inside the housing and applies force to the probe in a direction to eliminate the displacement of the first contact portion; wherein the probe is fitted from both sides by a shield plate made of an insulating material, and a plurality of the probes are arranged in parallel with the shield plates in contact with each other inside a single slit provided in the housing. Claim 2 A probe device according to claim 1, wherein the entire probe is made of conductive ceramic material. Claim 3 A probe device according to claim 1, wherein the probe has a curved shape and the contact area is included in an arched area outside the curved shape. Claim 4 A probe device according to claim 1, wherein the hardness of the probe is higher than the hardness of the probe formed by rhenium tungsten. Claim 5 A probe device according to any one of claims 1 to 4, wherein two probes are arranged in parallel with a shield plate of insulating material between them. Claim 6 delete

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