LED module and manufacturing method of LED module

Abstract

The present invention relates to an LED module and a method for manufacturing an LED module. The LED module comprises a light-emitting part, a substrate part electrically connected to the light-emitting part, a heat dissipation part disposed below the light-emitting part and the substrate part, and a fastening part for connecting the heat dissipation part and the substrate part. The substrate part includes a through hole through which the fastening part passes. The fastening part may include a fastening part body that passes through the through hole and is connected to the heat dissipation part, and a fastening part head that is connected to the upper side of the fastening part body, is located on the upper side of the substrate part, and has a diameter larger than the diameter of the through hole.

Description

Technology Field

[0001] The present invention relates to an LED module and a method for manufacturing an LED module. Background Technology

[0002] LED modules are used in various fields, such as automotive lamps. Among LED modules, conventional SMD type modules have a problem with relatively low heat dissipation efficiency because heat generated by the LEDs is transferred to the air through the PCB board and heat dissipation components. This low heat dissipation efficiency leads to an increase in the amount of heat generated by the LEDs, which can cause deformation of optical components and colorimetric issues.

[0003] Accordingly, top electrode LED modules are primarily being used recently. A top electrode LED module refers to a structure in which the top electrode LED is directly attached to a heat dissipation component (H / Sink, H / Plate, etc.) to increase heat dissipation efficiency, and power is transferred to the LED board through wires connecting the top electrode of the LED to a separate PCB board.

[0004] While the heat dissipation efficiency of top electrode LED modules has been significantly increased compared to conventional SMD type LED modules, there were issues regarding constraints on securing the shape and size required to meet the necessary heat dissipation area and on the assembly of surrounding components when the heat dissipation component is in the form of a plate (H / Plate). Therefore, a structure capable of further securing heat dissipation efficiency is required.

[0005] In addition, structurally, separate wires for current supply are exposed externally, and since separate PCB boards are required for wires, connectors, and other components, there was a problem requiring an assembly structure for this. The problem to be solved

[0006] The objective of the present invention is to provide an LED module that can increase heat dissipation performance and reduce size and weight.

[0007] In addition, the objective of the present invention is to provide an LED module that is easy to assemble and does not require a separate structure for assembly.

[0008] In addition, the objective of the present invention is to provide an LED module capable of protecting a wire for current supply. means of solving the problem

[0009] In one example, the LED module includes a light-emitting part, a substrate part electrically connected to the light-emitting part, a heat dissipation part disposed below the light-emitting part and the substrate part, and a fastening part that connects the heat dissipation part and the substrate part. The substrate part includes a through hole through which the fastening part passes, and the fastening part may include a fastening part body that passes through the through hole and is connected to the heat dissipation part, and a fastening part head that is connected to the upper side of the fastening part body, is located on the upper side of the substrate part, and has a diameter larger than the diameter of the through hole.

[0010] In another example, the above-mentioned fastening part is formed integrally with respect to the heat dissipation part, and the diameter of the fastening part head may be larger than the diameter of the fastening part body.

[0011] In another example, the through hole comprises a first through hole and a second through hole spaced rearward from the first through hole, and the fastening part may comprise a first fastening part penetrating the first through hole and a second fastening part penetrating the second through hole.

[0012] In another example, the heat dissipation member may include a heat dissipation member body provided to allow the substrate member and the light-emitting member to be seated on the upper surface, and a heat dissipation member protrusion formed to protrude upward from the heat dissipation member body.

[0013] In another example, the heat dissipation protrusions are provided in a pair, and the substrate portion may be positioned between the pair of heat dissipation protrusions.

[0014] In another example, the substrate portion is electrically connected to the light-emitting portion and includes a first substrate area extending rearward and a second substrate area formed integrally with the first substrate area and protruding to the left and right from the first substrate area, wherein the first substrate area is positioned between the pair of heat dissipation portion protrusions and the second substrate area may be positioned behind the pair of heat dissipation portion protrusions.

[0015] In another example, the LED module further includes a wire portion that electrically connects the light-emitting portion and the substrate portion, and the upper portion of the heat dissipation portion protrusion may be provided higher than the upper portion of the wire portion.

[0016] In another example, when a virtual plane that simultaneously contacts the front end of the heat dissipation part and the protrusion of the heat dissipation part is called a first reference plane, the wire part may be spaced downward from the first reference plane.

[0017] In another example, the above-mentioned heat dissipation part may further include an extension part that extends upward from the rear end of the above-mentioned heat dissipation part and includes a rear extension area whose vertical length is longer than the vertical length of the above-mentioned heat dissipation part protrusion, and when a virtual plane that simultaneously contacts the upper end of the rear extension area and the above-mentioned heat dissipation part protrusion is called a second reference plane, the above-mentioned wire part may be spaced downward from the second reference plane.

[0018] In another example, the above-mentioned wire portion may be convex toward the upper side.

[0019] In another example, the LED module may further include a mounting portion disposed between the light-emitting portion and the heat-dissipating portion.

[0020] In another example, the vertical thickness of the substrate portion may correspond to the sum of the vertical thicknesses of the light-emitting portion and the mounting portion.

[0021] In another example, when viewed from above, the area of ​​the seating portion may be larger than the area of ​​the light-emitting portion.

[0022] For example, a method for manufacturing an LED module may include a placement step of positioning a substrate portion above a heat dissipation portion and passing a fastening portion formed integrally with the heat dissipation portion through a through hole of the substrate portion, and a processing step of forming a fastening portion head with a larger diameter than the through hole by compression processing of the fastening portion to form a fastening portion head above the through hole.

[0023] In another example, the above processing step may include caulking.

[0024] In another example, the above processing step may include driving. Effects of the invention

[0025] According to the present invention, the wire for current supply can be protected through a heat dissipation protrusion protruding upward from the heat dissipation part, thereby increasing the lifespan of the LED module.

[0026] In addition, according to the present invention, the surface area of ​​the heat dissipation part is increased, thereby enhancing heat dissipation performance, and accordingly, the size and weight of the heat dissipation part can be reduced.

[0027] In addition, according to the present invention, a structure for assembling the heat dissipation part and the substrate part is formed in the heat dissipation part, so assembly is easy and no separate structure for assembly is required, which can increase productivity.

[0028] In addition, according to the present invention, the substrate can be attached to the heat dissipation part, making assembly easy and eliminating the need for a separate structure for assembly, thereby increasing productivity.

[0029] In addition, according to the present invention, the exterior of the heat dissipation part is surface-treated, thereby increasing heat dissipation performance and, accordingly, reducing the size and weight of the heat dissipation part. Brief explanation of the drawing

[0030] FIG. 1 is a perspective view illustrating an LED module according to Embodiment 1 of the present invention. Figure 2 is an enlarged view of Figure 1. Figure 3 is a top view of Figure 1. Figure 4 is a lower view of Figure 1. Fig. 5 is a side view of Fig. 1. Fig. 6 is a rear view of Fig. 1. FIG. 7 is a perspective view illustrating an LED module according to Embodiment 2 of the present invention. FIG. 8 is a perspective view illustrating an LED module according to Embodiment 3 of the present invention. Figure 9 is a table comparing the required heat dissipation area and the weight of heat dissipation components when no surface treatment is applied and when anodizing is applied. Specific details for implementing the invention

[0031] Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. In assigning reference numerals to the components of each drawing, the same components are given the same reference numeral whenever possible, even if they are shown in different drawings. Furthermore, in describing the embodiments of the present invention, if it is determined that a detailed description of related known components or functions would hinder understanding of the embodiments of the present invention, such detailed description is omitted.

[0032] Basic components of an LED module according to Example 1

[0033] The LED module according to Embodiment 1 of the present invention relates to a top electrode LED module. FIG. 1 is a perspective view illustrating an LED module according to Embodiment 1 of the present invention. FIG. 2 is an enlarged view of FIG. 1. FIG. 3 is a top view of FIG. 1. FIG. 4 is a bottom view of FIG. 1. FIG. 5 is a side view of FIG. 1. FIG. 6 is a rear view of FIG. 1.

[0034] <Light emitting part (100), substrate part (200), heat dissipation part (300)>

[0035] As illustrated in FIG. 1, an LED module according to Embodiment 1 of the present invention may include a light-emitting part (100), a substrate part (200), and a heat dissipation part (300). The light-emitting part (100) may be an LED. The light-emitting part (100) may include an electrode (101) for electrical connection with an external component. The substrate part (200) may be electrically connected to the light-emitting part (100). For example, the substrate part (200) may be an FR-4 PCB. The substrate part (200) may include an electrode terminal (201) arranged to be electrically connected to the electrode (101) and a connector terminal (202) arranged to be connected to a connector. The heat dissipation part (300) may be disposed on the lower side of the light-emitting part (100) and the substrate part (200). The heat dissipation part (300) may dissipate heat generated from the substrate part (200). The heat dissipation part (300) can be positioned in close contact with the light-emitting part (100) and the substrate part (200).

[0036] <Specific shape of the heat dissipation part (300)>

[0037] As illustrated in FIG. 1, the heat dissipation unit (300) may include a heat dissipation unit body (310) and a heat dissipation unit protrusion (320). The heat dissipation unit body (310) may be provided so that a substrate unit (200) and a light-emitting unit (100) are seated on its upper surface. The heat dissipation unit protrusion (320) may be formed to protrude upward from the heat dissipation unit body (310). The heat dissipation unit protrusion (320) may be provided to face the front area of ​​the substrate unit (200).

[0038] As illustrated in FIG. 1, the heat dissipation protrusions (320) are provided in pairs, and the substrate portion (200) can be positioned between the pair of heat dissipation protrusions (320). To explain the positioning in more detail, the shape of the substrate portion (200) is described in detail.

[0039] <Shape of the substrate part (200)>

[0040] As illustrated in FIG. 1, the substrate portion (200) may include a first substrate area (220) and a second substrate area (230). The first substrate area (220) is electrically connected to the light-emitting portion (100) and may extend to the rear. The second substrate area (230) is formed integrally with the first substrate area (220) and may protrude to the left and right from the first substrate area (220). As illustrated in FIG. 1, the first substrate area (220) may be positioned between a pair of heat dissipation protrusions (320), and the second substrate area (230) may be positioned behind a pair of heat dissipation protrusions (320). Meanwhile, the area of ​​the substrate portion (200) facing the heat dissipation protrusions (320) may have a shape that is indented inward while having a shape corresponding to the heat dissipation protrusions (320).

[0041] Additionally, the substrate portion (200) may include a third substrate area. The third substrate area may protrude to the left and right from the first substrate area (220) and may be spaced apart from the second substrate area (230) at the rear. When viewed from above, the third substrate area may include an area that protrudes rearward compared to the first substrate area (220).

[0042] <Role of the heat dissipation protrusion (320) - Protection of the wire section (500)>

[0043] As illustrated in FIG. 1, the LED module according to Embodiment 1 of the present invention may further include a wire portion (500). The wire portion (500) may electrically connect the substrate portion (200) and the light-emitting portion (100). One side of the wire portion (500) may be fixed to an electrode (101), and the other side of the wire portion (500) may be fixed to an electrode terminal (201). The wire portion (500) may be in a convex shape toward the upper side.

[0044] The heat dissipation protrusion (320) can perform the function of protecting the wire section (500). As the heat dissipation protrusion (320) protects the wire section (500), the risk of problems such as disconnection is reduced, and the lifespan of the LED module can be increased.

[0045] This is described in detail with reference to FIG. 5. As shown in FIG. 5, the upper portion of the heat dissipation protrusion (320) may be provided higher than the upper portion of the wire portion (500). Since the upper portion of the heat dissipation protrusion (320) is higher than the upper portion of the wire portion (500), the wire portion (500) can be protected by preventing an object approaching from the upper side of the wire portion (500) from touching the wire portion (500).

[0046] Additionally, the wire section (500) may be spaced downward from the first reference plane (S1). The first reference plane (S1) may be a virtual plane that simultaneously contacts the front end of the heat dissipation section (300) and the heat dissipation section protrusion (320).

[0047] Additionally, the wire section (500) may be spaced downward from the second reference plane (S2). The second reference plane (S2) may be a virtual plane that simultaneously contacts the upper end of the rear extension area (632) described later and the heat dissipation protrusion (320). By doing so, the wire section (500) can be protected by preventing an object approaching the wire section (500) from touching the wire section (500).

[0048] <Conclusion part (400)>

[0049] As illustrated in FIG. 1, the LED module according to Embodiment 1 of the present invention may include a fastening portion (400). The fastening portion (400) may fasten the heat dissipation portion (300) and the substrate portion (200). Specifically, the substrate portion (200) may include a through hole (210) through which the fastening portion (400) passes.

[0050] As illustrated in FIGS. 5 and 6, the fastening portion (400) may include a fastening portion body (410) and a fastening portion head (420). The fastening portion body (410) may pass through a through hole (210) and be connected to a heat dissipation portion (300). The through hole (210) may be a hole provided in the substrate portion (200) through which the fastening portion body (410) passes.

[0051] The fastening head (420) is connected to the upper side of the fastening body (410) and is located on the upper side of the substrate part (200), and may have a diameter larger than the diameter of the through hole (210). Additionally, the diameter of the fastening head (420) may be larger than the diameter of the fastening body (410). As the fastening head (420) is larger than the diameter of the through hole (210), the substrate part (200) can be constrained between the fastening head (420) and the heat dissipation part (300).

[0052] The fastening portion (400) may be formed integrally with the heat dissipation portion (300). For example, the fastening portion (400) may be produced by extrusion molding together with the heat dissipation portion (300). Alternatively, the fastening portion (400) may be produced by injection molding together with the heat dissipation portion (300). Since the fastening portion (400) is formed integrally with the heat dissipation portion (300), a separate component (e.g., a rivet) for fastening the heat dissipation portion (300) and the substrate portion (200) is not required, thereby increasing productivity and reducing costs.

[0053] <Method for manufacturing an LED module according to Example 1>

[0054] Hereinafter, a method for manufacturing an LED module according to Example 1 is described in detail. The details described below can be understood as a method of connecting a substrate portion (200) to a heat dissipation portion (300). The method for manufacturing an LED module according to Example 1 may include a placement step and a processing step.

[0055] The placement step may be a step of positioning the substrate portion (200) on the upper side of the heat dissipation portion (300) and passing a fastening portion (400), which is integrally formed with the heat dissipation portion (300), through the through hole (210) of the substrate portion (200). At this time, the diameter of the fastening portion head (420) may correspond to or be smaller than the diameter of the through hole (210).

[0056] The processing step may be a step of forming a fastening head (420) that is formed on the upper side of the through hole (210) by compressing the fastening part (400) and has a diameter larger than that of the through hole (210). As an example, the processing step may include caulking. Or, as another example, the processing step may include driving.

[0057] As described above, in the method for manufacturing an LED module according to Example 1, the shape of the fastening head (420) may be changed. Before the LED module is manufactured and the fastening head (420) is pressed, the diameter of the fastening head (420) may correspond to or be smaller than the diameter of the through hole (210), and after the fastening body (410) passes through the through hole (210) and the fastening head (420) is pressed, the diameter of the fastening head (420) may become larger than the diameter of the through hole (210).

[0058] As illustrated in FIG. 3, the through hole (210) may include a first through hole (211) and a second through hole (212). The second through hole (212) may be spaced rearward from the first through hole (211). The fastening part (400) may include a first fastening part (401) and a second fastening part (402). The first fastening part (401) may pass through the first through hole (211). The second fastening part (402) may pass through the second through hole (212).

[0059] <Extension part (600)>

[0060] As illustrated in FIG. 1, the LED module according to Embodiment 1 of the present invention may include an extension portion (600). The extension portion (600) may extend downward or upward from the end of the heat dissipation portion (300). The extension portion (600) may be formed integrally with the heat dissipation portion (300). Since the LED module according to Embodiment 1 of the present invention has an increased surface area due to having the extension portion (600), the heat dissipation area can be further secured. The extension portion (600) will be described in detail below.

[0061] The extension portion (600) may include a front bending area (611) and a front extension area (612). The front bending area (611) may be an area that bends downward from the front end of the heat dissipation portion (300) and extends. The front bending area (611) may be spaced apart in the left and right directions with the protrusion area (311) in between. The protrusion area (311) may be an area that protrudes from a part of the front end of the heat dissipation portion body (310).

[0062] The front extension area (612) may be an area extending downward from the lower end of the front bending area (611). Additionally, the width of the front extension area (612) may be formed to be longer than the width of the heat dissipation body (310).

[0063] Additionally, the extension portion (600) may include a first side bending area (621) and a first side extension area (622). The first side bending area (621) may be bent downward and extended from at least one end of the left or right side of the heat dissipation portion (300). FIG. 1 illustrates the first side bending area (621) being extended from both the left and right sides of the heat dissipation portion (300).

[0064] The first side extension area (622) may extend downward from the lower end of the first side bending area (621). The lengths of the front bending area (611) and the first side bending area (621) along the vertical direction may correspond to each other. Additionally, the lengths of the front extension area (612) and the first side extension area (622) along the vertical direction may correspond to each other.

[0065] The extension portion (600) may include a second side bending area (623) and a second side extension area (624). The second side bending area (623) may be bent inward and extended from the lower end of the first side extension area (622). Here, "inward" may mean the left side when extended from the right end of the heat dissipation body (310), and the right side when extended from the left end. The overall shape connecting the first side bending area (621), the first side extension area (622), and the second side bending area (623) may have a shape similar to a rotated C or U.

[0066] The second side extension area (624) may extend inward from the inner end of the second side bending area (623). The width of the second side extension area (624) may be formed to be shorter than half the width of the heat dissipation part (300).

[0067] The first side bending area (621) may include a first-1 side bending area (621a) and a first-2 side bending area (621b). The first-1 side bending area (621a) may be an area positioned adjacent to the front end of the heat dissipation part (300). The first-2 side bending area (621b) may be an area spaced rearward from the first-1 side bending area (621a).

[0068] The 1-1 side bending area (621a) can be connected to the 1-1 side extension area, the 2-1 side bending area, and the 2-1 side extension area, and the 1-2 side bending area (621b) can be connected to the 1-2 side extension area, the 2-2 side bending area, and the 2-2 side extension area. A detailed description of these is omitted as it corresponds to the description of the 1 side extension area (622), the 2 side bending area (623), and the 2 side extension area (624).

[0069] The extension portion (600) may include a rear bending area (631) and a rear extension area (632). The rear bending area (631) may be bent upward from the rear end of the heat dissipation portion (300). As shown in FIG. 1, the rear bending area (631) may protrude in the left and right directions relative to the substrate portion (200). The rear extension area (632) may be extended upward from the upper end of the rear bending area (631).

[0070] <Settlement part (700)>

[0071] As illustrated in FIG. 1, the LED module according to Embodiment 1 of the present invention may further include a mounting portion (700). The mounting portion (700) may be positioned between the light-emitting portion (100) and the heat-dissipating portion (300). As illustrated in FIG. 3, when viewed from above, the area of ​​the mounting portion (700) may be larger than the area of ​​the light-emitting portion (100). As illustrated in FIG. 5, the vertical thickness of the substrate portion (200) may correspond to the combined vertical thickness of the light-emitting portion (100) and the mounting portion (700).

[0072] LED module according to Example 2

[0073] FIG. 7 is a perspective view illustrating an LED module according to Embodiment 2 of the present invention. Hereinafter, the LED module of Embodiment 2 of the present invention will be described with reference to FIG. 7 and FIG. 1 to 6.

[0074] The LED module according to Embodiment 2 of the present invention differs from the LED module according to Embodiment 1 in the type of substrate portion (200') and the method of combining the heat dissipation portion and the substrate portion. Additionally, due to this, it differs from the LED module according to Embodiment 1 in the presence or absence of a fastening portion and a seating portion. For configurations identical or equivalent to the LED module according to Embodiment 1, identical or equivalent reference numerals are assigned, and a detailed description is omitted.

[0075] An LED module according to Embodiment 2 of the present invention may include a light-emitting part (100), a substrate part (200'), and a heat dissipation part (300). The substrate part (200') may be a flexible printed circuit board (Flexible-PCB). In the case of the LED module according to Embodiment 2 of the present invention, since a flexible printed circuit board is used, the thickness of the substrate part (200') may be thin (0.1T to 0.2T) compared to the thickness of a general FR-4 PCB, so that thermal conductivity is increased and heat dissipation performance can be secured.

[0076] More specifically, the flexible printed circuit board is made of flexible copper clad laminate (FCCL) as the main material and is in the form of an insulating film, a conductor, and a protective film combined. In other words, since it is in the form of a copper foil layer for circuit pattern / device mounting placed on a thin film-like material, it can have a thin thickness of 0.1T to 0.2T.

[0077] For example, a flexible printed circuit board can be combined with a base plate. The base plate can be combined with the flexible printed circuit board to prevent damage to the components. In addition, as the base plate is combined with the flexible printed circuit board, the planar state of the flexible printed circuit board can be well maintained, and heat dissipation performance can be further enhanced.

[0078] The heat dissipation portion (300) can be attached to the lower side of the substrate portion (200'). For example, the substrate portion (200') can be attached to the upper side of the heat dissipation portion (300) through a heat-curing treatment. For another example, the substrate portion (200') can be attached to the upper side of the heat dissipation portion (300) through a pressure-sensitive attachment method.

[0079] According to the LED module of Embodiment 2 of the present invention, as the substrate portion (200') is attached to the heat dissipation portion (300), the assembly process for connecting the substrate portion (200') and the heat dissipation portion (300) can be eliminated, thereby increasing productivity.

[0080] As shown in FIG. 7, the second substrate region (230') may overlap with an inner portion of a pair of heat dissipation protrusions (320). Additionally, the vertical thickness of the substrate portion (200') may be thinner than the vertical thickness of the light-emitting portion (100).

[0081] <Method for manufacturing an LED module according to Example 2>

[0082] Hereinafter, a method for manufacturing an LED module according to Embodiment 2 of the present invention is described in detail. The details described below can be understood as a method for attaching a substrate portion (200') to a heat dissipation portion (300). The method for manufacturing an LED module according to Embodiment 2 may include an attachment step of attaching the substrate portion (200') to the upper side of the heat dissipation portion (300). The attachment step may be a step of attaching the substrate portion (200') to the upper side of the heat dissipation portion (300) through a thermal curing treatment. As another example, the attachment step may be a step of attaching the substrate portion to the upper side of the heat dissipation portion (300) through a pressure-sensitive attachment method.

[0083] The thermal curing treatment step may be a step of attaching the substrate portion (200') to the upper side of the heat dissipation portion (300) through thermal curing treatment using a thermal curing tape. After the thermal curing treatment step, processes such as OSP surface treatment and component mounting through an SMT reflow process may be performed.

[0084] The pressure-sensitive attachment method may be a step of attaching the substrate portion (200') to the upper side of the heat dissipation portion (300) using a general pressure-sensitive double-sided attachment tape.

[0085] According to the method for manufacturing an LED module according to Embodiment 2 of the present invention, due to the thin thickness of the substrate portion (200'), the substrate portion (200) can be directly attached to the heat dissipation portion (300) through a heat-curing treatment or a pressure-sensitive attachment method instead of a separate complex fastening process, thereby improving the efficiency of the process.

[0086] LED module according to Example 3

[0087] FIG. 8 is a perspective view illustrating an LED module according to Embodiment 3 of the present invention. FIG. 9 is a table comparing the required heat dissipation area and the weight of heat dissipation components when no surface treatment is applied and when anodizing is applied. Hereinafter, the LED module of Embodiment 3 of the present invention will be described with reference to FIG. 8 and 9 and FIG. 1 to 6.

[0088] The LED module according to Embodiment 3 of the present invention differs from the LED module according to Embodiment 1 in the surface treatment of the heat dissipation part (300'). Identical or substantial configurations to the LED module according to Embodiment 1 are given identical or substantial reference numerals, and a detailed description is omitted.

[0089] A surface treatment may be applied to the heat dissipation portion (300') of the LED module according to Embodiment 3 of the present invention. The surface treatment for the heat dissipation portion (300') may also be applied in the same way to the fastening portion (400'), extension portion (600'), and seating portion (700') which can be formed integrally with the heat dissipation portion (300').

[0090] For example, the surface treatment may be anodizing. As another example, the surface treatment may be thermal coating. Figure 9 is a table comparing the required heat dissipation area and the weight of the heat dissipation component when no surface treatment is applied and when anodizing is applied.

[0091] As shown in Fig. 9, by applying a surface treatment to the heat dissipation part, the heat dissipation efficiency is increased, and the required heat dissipation area can be reduced by more than 30%. As the required heat dissipation area is minimized, the overall size of the LED module can be minimized, and a weight reduction of more than 30% can be achieved.

[0092] In addition, as heat dissipation performance is increased through surface treatment, it is possible to accommodate a higher specification light-emitting part in a heat dissipation part of the same shape. For example, a heat dissipation part used in a 2-chip light-emitting part can be applied to a 3-chip light-emitting part after surface treatment. As a result, there is no need to create separate molds depending on the specifications of the light-emitting part, allowing for mold standardization and cost reduction.

[0093] As another example, the outer surface of the heat dissipation part (300') can be surface-treated in black. As another example, the outer surface of the heat dissipation part (300') can be surface-treated in a matte finish.

[0094] In the case of a general LED module, if the LED location and the surrounding area become vulnerable depending on the angle of sunlight irradiation, damage such as deformation and discoloration, and a decrease in durability may occur due to concentrated light and heat on the LED module and surrounding fixtures (due to reflection). The LED module according to Embodiment 3 of the present invention can prevent damage such as deformation and discoloration, and a decrease in durability, by controlling the surface color and reflectivity.

[0095] The foregoing description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are intended to explain, not limit, the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by these embodiments. The scope of protection of the present invention shall be interpreted by the claims below, and all technical concepts within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention. Explanation of the symbols

[0096] 100: Light-emitting part 101: Electrode 200, 200': Substrate section 201: Electrode terminal 202: Connector terminal 210: Through hole 211: First through hole 212: Second penetration hole 220: First substrate area 230, 230': Second substrate area 300, 300': Heat dissipation section 310: Heat dissipation body 311: Protrusion area 320: Heat dissipation protrusion 400, 400': Connecting part 401: First connecting part 402: Second connecting part 410: Fastening body 420: Fastening head 500: Wire section 600, 600': Extension part 611: Anterior bending area 612: Anterior extension area 621: First lateral banding area 621a: Section 1-1 Side Banding Area 621b: 1st-2nd side banding area 622: First lateral extension area 623: Second lateral banding area 624: Second lateral extension area 631: Rear banding area 632: Posterior extension area 700, 700': Settlement S1: First reference plane S2: Second reference plane

Claims

Claim 1 A light-emitting part; a substrate part electrically connected to the light-emitting part; a heat dissipation part disposed below the light-emitting part and the substrate part; a fastening part for connecting the heat dissipation part and the substrate part; and a wire part electrically connecting the light-emitting part and the substrate part, wherein the substrate part includes a through hole provided for the fastening part to pass through, and the fastening part includes a fastening part body that passes through the through hole and is connected to the heat dissipation part; and a fastening part head connected to the upper side of the fastening part body, located on the upper side of the substrate part, and having a diameter larger than the diameter of the through hole, and the heat dissipation part includes a heat dissipation part body provided for the substrate part and the light-emitting part to be seated on its upper surface; An LED module comprising a heat dissipation member protrusion formed to protrude upward from the heat dissipation member body, wherein the upper portion of the heat dissipation member protrusion is provided higher than the upper portion of the wire portion, and when a virtual plane simultaneously contacting the front end of the heat dissipation member and the upper portion of the heat dissipation member protrusion is called a first reference plane, the light-emitting member, the substrate portion, and the wire portion are spaced downward from the first reference plane. Claim 2 An LED module according to claim 1, wherein the fastening portion is integrally formed with respect to the heat dissipation portion, and the diameter of the fastening portion head is larger than the diameter of the fastening portion body. Claim 3 The LED module according to claim 2, wherein the through hole comprises a first through hole; and a second through hole spaced rearward from the first through hole, and the fastening portion comprises a first fastening portion penetrating the first through hole; and a second fastening portion penetrating the second through hole. Claim 4 delete Claim 5 An LED module according to claim 4, wherein the heat dissipation protrusions are provided in a pair, and the substrate portion is disposed between the pair of heat dissipation protrusions. Claim 6 An LED module according to claim 5, wherein the substrate portion comprises: a first substrate region electrically connected to the light-emitting portion and extending rearward; and a second substrate region formed integrally with the first substrate region and protruding to the left and right from the first substrate region, wherein the first substrate region is disposed between the pair of heat dissipation portion protrusions and the second substrate region is disposed behind the pair of heat dissipation portion protrusions. Claim 7 delete Claim 8 delete Claim 9 The LED module according to claim 8 further comprises an extension portion that extends upward from the rear end of the heat dissipation portion and includes a rear extension area whose vertical length is longer than the vertical length of the heat dissipation portion projection, wherein when a virtual plane simultaneously contacting the upper end of the rear extension area and the heat dissipation portion projection is called a second reference plane, the wire portion is spaced downward from the second reference plane. Claim 10 An LED module according to claim 7, wherein the wire portion is convex toward the upper side. Claim 11 An LED module according to claim 1, further comprising a mounting portion disposed between the emitting portion and the heat dissipation portion. Claim 12 An LED module according to claim 11, wherein the vertical thickness of the substrate portion corresponds to the sum of the vertical thicknesses of the light-emitting portion and the mounting portion. Claim 13 An LED module according to claim 11, wherein, when viewed from above, the area of ​​the mounting portion is larger than the area of ​​the light-emitting portion. Claim 14 A method for manufacturing an LED module, comprising: a step of electrically connecting a substrate part and a light-emitting part through a wire part; a placement step of positioning the substrate part on the upper side of a heat dissipation part and passing a fastening part formed integrally with the heat dissipation part through a through hole of the substrate part; a processing step of forming a fastening part head with a diameter larger than that of the through hole by compression processing the fastening part to form a fastening part head formed on the upper side of the through hole; a step of providing the upper end of a heat dissipation part protruding upward from the heat dissipation part at a higher level than the upper end of the wire part; and a step of arranging the light-emitting part, the substrate part, and the wire part so as to be spaced downward from the first reference plane, wherein a virtual plane that simultaneously contacts the front end of the heat dissipation part and the upper end of the heat dissipation part protruding is called a first reference plane. Claim 15 A method for manufacturing an LED module according to claim 14, wherein the processing step includes caulking. Claim 16 A method for manufacturing an LED module according to claim 15, wherein the processing step includes driving. Claim 17 A light-emitting part; a substrate part electrically connected to the light-emitting part; a heat dissipation part disposed below the light-emitting part and the substrate part; and a fastening part for connecting the heat dissipation part and the substrate part, wherein the substrate part includes a through hole through which the fastening part passes, and the fastening part includes a fastening part body that passes through the through hole and is connected to the heat dissipation part; and a fastening part head that is connected to the upper side of the fastening part body, is located on the upper side of the substrate part, and has a diameter larger than the diameter of the through hole, and the heat dissipation part includes a heat dissipation part body on which the substrate part and the light-emitting part are seated on the upper surface; and a heat dissipation part protrusion formed to protrude upward from the heat dissipation part body, wherein the heat dissipation part protrusion is provided as a pair, and the substrate part is disposed between the pair of heat dissipation part protrusions, and the substrate part includes a first substrate area that is electrically connected to the light-emitting part and extends rearward. An LED module comprising a first substrate region formed integrally with the first substrate region and a second substrate region protruding to the left and right from the first substrate region, wherein the first substrate region is positioned between the pair of heat dissipation protrusions and the second substrate region is positioned behind the pair of heat dissipation protrusions.

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