Ultrasonic Inspection Apparatus Capable of Selective Inversion of Test Specimens and Method Using the Same

Abstract

The present invention provides an ultrasonic inspection system comprising: a tray jig for mounting a plurality of specimens in a matrix array form; a first inspection module for performing ultrasonic scanning on specimens on the tray jig, wherein the first ultrasonic scanning is performed on the first surface using a first probe unit positioned toward the first surface of the specimen; an inversion module for picking up specimens located on the tray jig after ultrasonic scanning is completed in the first inspection module, inverting them vertically, and then mounting specimens back onto the tray jig; and a second inspection module for performing ultrasonic scanning on specimens transferred from the inversion module, wherein, when specimens are inverted vertically by the inversion module, the second ultrasonic scanning is performed on a second surface opposite to the first surface using a second probe unit; wherein the inversion module includes a gripper for gripping specimens, and the gripper simultaneously inverts a plurality of specimens vertically.

Description

Technology Field

[0001] The present invention relates to an ultrasonic examination device capable of selective up-and-down inversion of a subject and a method using the same. Background Technology

[0002] Power modules are essential components for controlling and converting power in various high-power applications, such as electric vehicles, renewable energy, and industrial power converters; they require high-speed switching characteristics and stable operation even in high-temperature environments. In particular, as power semiconductor technology transitions from Si (silicon)-based materials to wide-bandgap materials like SiC (silicon carbide) and GaN (gallium nitride), power modules are increasingly evolving to withstand high-voltage, high-current, and high-temperature environments.

[0003] In such high-temperature environments, power modules may develop physical defects such as interfacial defects, voids, delamination, and microcracks due to differences in coefficients of thermal expansion (CTE) between internal components. This can lead to performance degradation of power semiconductor devices and a shortened overall lifespan of the power module. In particular, since the substrate (DCB, AMB), semiconductor die, bonding material, and bonding wires are all composed of different materials, stress concentration can accumulate due to repetitive thermal cycling during operation.

[0004] For the quality assurance of power modules, non-destructive testing techniques capable of accurately identifying such internal defects, particularly internal defect detection technology using ultrasonic scanning, are critically utilized. While ultrasound can diagnose internal voids and delamination, most existing inspection equipment relies on a single probe to perform individual scans; consequently, in mass production environments, this method presents the problem of excessive inspection time and difficulty in aligning with productivity.

[0005] As prior art, Korean Published Patent No. 10-2014-0001138, titled "Ultrasonic Inspection Device and Ultrasonic Inspection Method," is disclosed. The prior art discloses a structure capable of obtaining a stable inspection image by forming the distance between the lens and the surface of the workpiece (meaning "subject to be examined") to be adjustable through a holder and a height adjustment means.

[0006] However, since the aforementioned prior art does not disclose a structure for simultaneously inspecting multiple test subjects, a problem arises in which the inspection speed is inevitably significantly low in fields requiring full inspection.

[0007] (Patent Document 1) Korean Published Patent No. 10-2014-0001138 The problem to be solved

[0008] To solve the above-mentioned problems, the present invention proposes an inspection system based on a multi-probe and tray circulation system that enables high-speed and high-volume ultrasonic inspection with multiple power modules loaded in a matrix form on a tray jig.

[0009] In addition, the present invention proposes a configuration that improves inspection efficiency by selectively inverting only specific specimens or row-unit specimens based on the inspection results after inspecting the top surface of a specimen.

[0010] The technical problems to be solved in the various embodiments are not limited to those mentioned above, and other unmentioned technical problems may be considered by those skilled in the art from the various embodiments described below. means of solving the problem

[0011] An embodiment of the present invention for solving the above-mentioned problem comprises: an ultrasonic inspection system comprising: a tray jig for mounting a plurality of specimens in a matrix array form; a first inspection module for performing ultrasonic scanning on specimens on the tray jig, wherein the first ultrasonic scanning is performed on the first surface using a first probe unit positioned toward the first surface of the specimen; a reversal module for picking up specimens located on the tray jig after ultrasonic scanning is completed in the first inspection module, reversing them vertically, and then mounting specimens back onto the tray jig; and a second inspection module for performing ultrasonic scanning on specimens transferred from the reversal module, wherein, when specimens are vertically reversed by the reversal module, the second ultrasonic scanning is performed on a second surface opposite to the first surface using a second probe unit. The ultrasonic inspection system includes, wherein the inversion module includes a gripper for gripping the subject, and the gripper simultaneously inverts a plurality of subjects up and down.

[0012] The above grippers are configured as a pair, extending in one direction and facing each other, and a plurality of test subjects are spaced apart and seated between the grippers along the said one direction. The said one direction is the row or column direction of the tray jig, and can be configured to simultaneously grip test subjects located in any row or column among the test subjects seated on the tray jig.

[0013] Between the aforementioned pair of opposing grippers, an alignment bar is provided to check the horizontal state of the gripped specimen, and a seating groove for gripping the end of the specimen may be formed on each of the opposing sides of the grippers.

[0014] The gripper may perform an up-and-down inversion on a test subject in the Mth row located on the tray jig, and after gripping the test subject in the Mth row and performing an up-and-down inversion, move toward the test subject in the M+1th row and repeat the gripping and up-and-down inversion on the test subject in the M+1th row.

[0015] The above ultrasonic inspection system further includes a scanning analysis module that analyzes ultrasonic scanning results in a preset manner; wherein the scanning analysis module analyzes the first ultrasonic scanning results from the first row of subjects to the Nth row of subjects located on the tray jig, and if, based on the results of the first ultrasonic scanning, it is determined that the subject in the Kth row on the tray jig corresponds to a preset defect condition, the inversion module may be configured to selectively perform gripping and up-and-down inversion only on the subject located in the Kth row.

[0016] The inversion module can be configured to determine whether to perform selective gripping and vertical inversion based on thickness information of the subject that is pre-entered or sensed, and to perform gripping and vertical inversion of the subject only when the thickness information of the subject is greater than or equal to a preset reference value.

[0017] The second inspection module activates the operation of the second probe unit for a subject located in the k-th row and deactivates the operation of the second probe unit for a subject located in a row other than the k-th row, and the frequency of the second probe unit may be set differently from the frequency of the first probe unit.

[0018] The above-described inversion module further includes a rotator equipped with a rotation axis to control the angle of the pair of opposing grippers; and the rotator may be coupled to the grippers so as to be rotatable from 0 to 360 degrees around the rotation axis while the grippers are gripping the test specimen.

[0019] In addition, the present invention provides a method using the aforementioned ultrasonic inspection system, comprising: (a1) a step of placing a plurality of specimens in a matrix array form on a tray jig; (a2) a step of performing ultrasonic scanning on the specimens on the tray jig in a first inspection module, wherein a first ultrasonic scanning is performed on the first surface using a first probe unit positioned toward the first surface of the specimens; (a3) ​​a step of transferring the specimens, for which ultrasonic scanning is completed in the first inspection module, to an inversion module; (a4) a step of picking the specimens located on the tray jig in the inversion module, inverting them vertically, and then placing the specimens back on the tray jig; (a5) a step of transferring the specimens inverted vertically in step (a4) to a second inspection module; and (a6) a step of performing ultrasonic scanning on the subject transferred from the inversion module in the second inspection module, wherein if the subject is inverted vertically by the inversion module, a second ultrasonic scanning is performed using a second probe unit on the second surface which is the surface opposite to the first surface; the method is provided. Effects of the invention

[0020] The present invention is a technology suitable for mass and high-speed inspection of power semiconductor components having complex structures, such as power modules, and provides various technical effects.

[0021] The present invention enables a high-speed mass inspection process for multiple specimens by including an inversion module that performs selective up-and-down inversion of specimens. Accordingly, inspection speed and efficiency can be maximized compared to the conventional inspection method that required manual processing of individual specimens using a single probe method.

[0022] The effects obtainable from various embodiments are not limited to those mentioned above, and other unmentioned effects can be clearly derived and understood by a person skilled in the art based on the detailed description below. Brief explanation of the drawing

[0023] FIG. 1 is a perspective view showing the overall configuration of an ultrasonic inspection system according to one embodiment of the present invention. FIG. 2 is a drawing showing the main parts of an ultrasonic inspection system according to one embodiment of the present invention. FIG. 3 is a schematic diagram showing the main processes processed in an ultrasonic inspection system according to one embodiment of the present invention. FIG. 4 is a configuration diagram showing the overall configuration of an ultrasonic inspection system according to one embodiment of the present invention. FIG. 5 is a perspective view showing the overall configuration of a first inspection module of an ultrasonic inspection system according to one embodiment of the present invention. FIG. 6 is a perspective view showing an inversion module of an ultrasonic inspection system according to one embodiment of the present invention. Figure 7 (a) shows the state before the subject is grasped on the gripper of Figure 6, and Figure 6 (b) shows the state after the subject is grasped. FIG. 8 is a flowchart of a method using an ultrasonic inspection system according to one embodiment of the present invention. Specific details for implementing the invention

[0024] Embodiments of the present invention will be described in detail below with reference to the drawings. The description below is intended only to illustrate the embodiments and is not intended to limit or restrict the scope of the rights according to the present invention. Anything that can be easily inferred by a person skilled in the art from the detailed description of the invention and the embodiments should be interpreted as falling within the scope of the rights according to the present invention.

[0025] The terms used in this invention are described as general terms widely used in the technical field relating to this invention; however, the meaning of the terms used in this invention may vary depending on the intent of those skilled in the field, the emergence of new technologies, examination standards, or case law. Some terms may be selected at the discretion of the applicant, and in such cases, the meaning of the arbitrarily selected terms will be explained in detail. The terms used in this invention should be interpreted not merely in their dictionary meanings, but in a sense that reflects the overall context of the specification.

[0026] Terms such as 'composed' or 'comprising' used in the present invention should not be interpreted as necessarily including all of the components or steps described in the specification, and should also be interpreted as intended by such terms if some components or steps are not included and if additional components or steps are included.

[0027] The terms described below are defined in consideration of their functions in the present invention, and these may vary depending on the intentions or practices of the user, operator, and designer. Therefore, their definitions should be based on the content throughout this specification.

[0028] As used herein, the term 'subject' includes semiconductor devices subject to inspection, but also encompasses all objects capable of performing inspection using ultrasonic scanning, and is also referred to as a 'workpiece'. While this description assumes that the subject is in the shape of a rectangular plate, the shape of the subject is not limited thereto.

[0029] FIG. 1 is a perspective view showing the overall configuration of an ultrasonic inspection system according to one embodiment of the present invention, FIG. 2 is a drawing showing a major part of an ultrasonic inspection system according to one embodiment of the present invention, and FIG. 3 is a schematic diagram showing the major process processed in an ultrasonic inspection system according to one embodiment of the present invention.

[0030] Referring to FIGS. 1 to 3, the ultrasonic inspection system (100) includes a loading magazine module (160), a first inspection module (110), an inversion module (130), a second inspection module (120), a drying module (150), and an unloading magazine module (170).

[0031] The ultrasonic inspection system (100) is connected to the first inspection module (110), the inversion module (130), the second inspection module (120), and the unloading module (170) according to a sequential process flow, centered around the tray jig (101). Additionally, a loading magazine module (160) and a drying module (150) are positioned at both ends of the system (100) to perform automatic feeding and drying functions for the specimen.

[0032] This series of configurations eliminates the need for a separate line for upper and lower double-sided inspection and enables continuous upper and lower double-sided inspection within a single system.

[0033] The loading magazine module (160) is a device for storing test subjects (e.g., power modules, etc.) awaiting inspection, and can sequentially supply a plurality of tray jigs (101) loaded thereon. The loading magazine module (160) is connected to a loading transfer unit (161).

[0034] The loading transfer unit (161) is configured to withdraw the tray jig (101) from the loading magazine module (160) and transfer it to an inspection line, precisely control the position of the tray jig (101), and synchronize it with the subsequent process.

[0035] The loading alignment camera (162) can be understood as a vision sensor for visualizing and correcting the alignment status of the tray jig (101) or the test object (P). It can secure an accurate inspection position by linking with an automatic correction function in case of misalignment.

[0036] The jig stage check camera (134) is configured to check the condition of the jig stage and detect whether the test object (P) is loaded correctly. This performs a pre-inspection function to prevent inspection errors and defects.

[0037] The tray jig (101) can be formed in a pre-set matrix array shape as illustrated in FIGS. 1 to 3. Based on the movement direction (meaning inspection direction) of the probe unit (111), it can be defined as an A*B matrix array shape, and the test object can be placed in an A*B matrix array shape. In the present invention, the tray jig (101) is mounted in a 4*2 matrix array shape, but this is merely an example, and it is specified in advance that the arrangement shape of the tray jig (101) can be designed in various array shapes considering the mounting structure of the probe unit (111), etc.

[0038] The first inspection module (110) is composed of an ultrasonic scanning unit for inspecting a first surface (meaning the upper surface) of a specimen (P) placed on a tray jig (101), and includes a first probe unit (111).

[0039] For the explanation of the first probe unit (111), refer first to FIG. 5. FIG. 5 is a perspective view showing the overall configuration of the first inspection module of an ultrasonic inspection system according to an embodiment of the present invention. The first inspection module (110) includes a probe unit (111), a laser displacement sensor (112), a receiving unit (113, 114), a moving unit (115), and a vibration absorbing unit (116). The first inspection module (110) illustrated in FIG. 5 is shown in a state where a total of four probe units (including 111a, 111b, and 111c) are configured in a 2*2 matrix array form, but the array form can be modified in any form as long as it is an X*Y matrix array form.

[0040] The first probe unit (111) performs the function of transmitting and receiving ultrasound to and from the upper surface of the subject. It may include a plurality of independent ultrasound probes. The individual probe unit (111a) is a sensor head that transmits and receives ultrasound and detects the presence of minute defects or internal abnormalities in the target object.

[0041] The laser displacement sensor (112) corrects for height deviations or inclinations of the subject and controls the probe unit (111) to perform a precise inspection at a constant distance. This ensures inspection reliability by precisely detecting the relative position between the sensor and the subject.

[0042] The receiving unit (113, 114) receives the ultrasonic signal reflected back from the subject (P) and converts the signal into an electrical signal. When the probe of the probe unit (111) transmits the ultrasonic signal, the receiving unit (113) is configured to receive the signal that hits the subject and is reflected.

[0043] The moving unit (115) enables the probe unit (111) to move in the X-axis, Y-axis, and Z-axis directions. To this end, the moving unit (115) may have a linear system built into it. As an example, it may include a linear guide, a ball screw or a linear motor, a motor and encoder, a top linear system, a bottom linear system, etc. Additionally, the moving unit (115) can perform elevation adjustment for contact or close-up scanning of a subject by raising and lowering the probe unit (111) in the Z-axis direction.

[0044] The vibration absorption unit (116) is configured to absorb mechanical shocks that occur when the units move at high speed or stop suddenly, and it is preferable that multiple units be provided at the top and bottom.

[0045] The structure of the first inspection module (11) can be designed similarly to the second inspection module (120), so a redundant description of the structure of the second inspection module (120) is omitted. However, the placement of the probe unit and the alignment of the sensor in the second inspection module (120) may vary depending on the position and direction (up / down) of the test subject.

[0046] The drying module (150) may be positioned at the rear end of the second inspection module (120), and an air knife method may be applied for drying the specimen. As an example, it includes at least one blowing unit that sprays air onto the specimen using a pair of air knives. At this time, the air knife is configured to be capable of reciprocating movement, and a guide rail may be provided to guide the movement of the air knife. In this way, the drying efficiency of the specimen can be maximized by the movement of the air knife.

[0047] Here, the dry module (150) may be connected to a withdrawal drive module (not shown). Through the second inspection module (120), a subject may be waiting in a state where ultrasonic scanning of the upper and lower surfaces of the subject has already been completed. The subject may be moved from the second inspection module (120) to the dry module (150) by the withdrawal drive module. Various known methods may be applied.

[0048] The tray jig (101) or the specimen (P) of the tray jig (101) is transferred to and loaded into the unloading magazine module (170) by the unloading transfer unit (171). The unloading magazine module (170) receives the specimen after inspection and allows for automatic retrieval or connection to a subsequent process.

[0049] Referring to FIG. 3, the main process of a series of processes in which a test subject is introduced into and discharged from a tray jig (101) is described. The tray jig (101) is configured to circulate repeatedly within a system according to one embodiment of the present invention. It is configured to pass through a first inspection module (110), an inversion module (130), and a second inspection module (120). FIG. 3 is an example showing the process of the tray jig (101) circulating, and can be designed so that the test subject on the tray jig (101) is discharged or the tray jig (101) itself is discharged.

[0050] The inversion module (130) is configured to simultaneously grasp a subject located in the kth row. To this end, the inversion module (130) includes a gripper (131), a rotator (132) that rotates the gripper (131), a drive unit (133) that provides rotational power to the rotator (132), and a guide rail (134).

[0051] FIG. 4 is a block diagram schematically showing the overall configuration of an ultrasonic inspection system according to one embodiment of the present invention. The ultrasonic inspection system (100) of the present invention is configured to include a first inspection module (110), an inversion module (130), a second inspection module (120), and a scanning analysis module (140), and each component is functionally linked to perform ultrasonic scanning on a subject on both sides and to perform inversion control and probe operation control based on the inspection results.

[0052] In this system, a plurality of specimens (P) are placed on the tray jig (101) in a matrix arrangement (M*N form), and based on this arrangement structure, inspection and inversion are performed on each specimen in a row or column unit. The tray jig (101) is mechanically designed to be precise and can be stably maintained in a fixed position by an automatic transfer device. It also serves as a positional reference coordinate system for specimens. In this system, it is configured to load eight specimens (P), and the position where specimens (P) are scheduled to be placed can be left open. Additionally, being made of metal material, it does not experience wear or warping, and can be used stably for a long time without being affected by water during ultrasonic scanning. After placing specimens (P), they may be secured with a separate metal cover to prevent them from falling off.

[0053] The first inspection module (110) performs a first ultrasonic scanning by transmitting an ultrasonic signal and receiving a reflected signal using a first probe unit (111) positioned toward the upper surface (first surface) of a subject on the tray jig (101). At this time, the scanning may be performed sequentially in rows or in individual subjects, and it is preferable that the laser displacement sensor (112) senses the distance and height error with respect to the inspection surface in real time.

[0054] The first probe unit (111) is configured in a matrix form with a plurality of sensor elements arranged therein, and the inspection frequency and scanning resolution can be set according to the shape of the object to be inspected and defect detection criteria.

[0055] The inversion module (130) performs the function of grasping a specimen whose scanning by the first inspection module (110) is completed and inverting it vertically. The inversion module (130) includes a gripper (131) and a rotator (132), and the gripper is composed of a pair of clamp structures, allowing multiple specimens to be grasped and inverted simultaneously. In particular, the extension direction of the gripper is configured to match the row direction or column direction of the tray jig, so that specimens located in a specific row or column can be selectively inverted simultaneously.

[0056] Additionally, the gripper (131) includes a pair of gripping frames (1311, 1312) that extend in one direction, and an alignment bar (133) is positioned between the gripping frames (1311, 1312) to perform an alignment function so that the subject is maintained in a horizontal state before and after inversion. Each gripper (131) has a seating groove (1314) formed therein for gripping the end of the subject (P), allowing for stable fixation even with fine movement (see FIGS. 6 and 7).

[0057] The rotator (132) is connected to the gripper (131) and can rotate from 0 to 360 degrees around the rotation axis, allowing for flexible reversal in various directions. In this invention, up-and-down reversal with a 180-degree rotation is described, but multi-stage control can be performed to enable reversal at various angles, such as 90 degrees and 270 degrees, in addition to 180 degrees. This is to accurately detect various internal defects of the test specimen (P) by adjusting to an optimal angle according to the structural complexity of the test specimen (P).

[0058] The second inspection module (120) performs a second ultrasonic scanning on the lower surface (second surface) of an inverted subject using a second probe unit (121). At this time, the scanning target surface is automatically set depending on whether the subject is inverted, and the second probe unit (121) can be set to operate at a frequency different from that of the first probe unit (111), thereby improving the accuracy of the double inspection. Additionally, if scanning of the second surface is required only for a specific row of subjects, selective operation control of the probe unit is possible according to a control signal provided by the scanning analysis module (140).

[0059] The scanning analysis module (140) analyzes the ultrasonic scanning data received from the first inspection module (110) and determines whether each subject has defects or abnormalities. For example, if it is determined that a subject in the kth row corresponds to a preset defect condition based on the first ultrasonic scanning results, the inversion module (130) is configured to selectively perform inversion only on the subject in that row.

[0060] In addition, when determining whether to invert, if the thickness information of the test subject is pre-entered or sensed, the operating condition may be set so that inversion occurs only when it is greater than or equal to a set threshold value. Such selective inversion can reduce unnecessary machine operation. This is because it is inefficient to perform up-and-down inversion through the inversion module (130) when the thickness of the test subject is relatively thin.

[0061] For example, when the thickness of the specimen is 5 mm or less, there are issues such as mechanical shaking or fixation instability that may occur during inversion. Since the accuracy of the results is high even if ultrasonic scanning is performed on only one of the upper or lower surfaces for thin thicknesses, the system is configured to omit the inversion operation for the specimen. At this time, the thickness information of the specimen can be measured in real time through a laser displacement sensor or a contact gauge, or information pre-entered according to the product design can be referenced.

[0062] In addition, the setting threshold value can be flexibly adjusted according to the purpose of inspection, and as an example, a manual approval mode in which the user confirms whether to invert when the thickness is 6mm or more and 10mm or less, or a conditional logic such as unconditionally performing automatic inversion when the thickness is 15mm or more may be applied.

[0063] FIG. 6 is a perspective view showing an inversion module of an ultrasonic inspection system according to one embodiment of the present invention, FIG. 7 (a) shows the state before a test subject is grasped on the gripper of FIG. 6, and FIG. 6 (b) shows the state after the test subject is grasped.

[0064] This is explained with reference to FIGS. 6 and 7. The gripper (131) can simultaneously grasp all specimens in any row or column of specimens (which is a 4*2 matrix in FIG. 3) placed on the tray jig (101) and perform an up-and-down inversion. The gripper (131) is composed of a pair and is formed to extend in one direction and face each other, and a plurality of specimens (P) can be placed spaced apart along the one direction between the grippers (131). In this invention, the gripper (131) is described as having a structure capable of simultaneously grasping all specimens in any row.

[0065] The gripper (131) is configured to perform up-and-down inversion on a subject in the Mth row located on the tray jig (101), and after gripping the subject in the Mth row and inverting it up-and-down, move toward the subject in the M+1th row and repeat the gripping and up-and-down inversion on the subject in the M+1th row. Referring again to FIG. 3, two subjects (P) can be placed on the gripper (131), and after inverting the subjects (P) up-and-down starting from the 1st row to the 4th row, they can be placed back on the tray jig (101).

[0066] The gripper (131) can be positioned on the upper side of the tray jig (101) and is configured to move downward to grasp the specimen (P), and then move upward again to prevent interference with other components when the rotator (132) rotates.

[0067] The scanning analysis module (140) provides an embodiment in which, to increase the efficiency of the present invention, only some rows of specimens (P) of the tray jig (101) are inverted vertically, without inverting all specimens (P) vertically. An ultrasonic inspection system according to one embodiment of the present invention may further include a scanning analysis module (140) to improve the efficiency and precision of the inspection process through real-time analysis of ultrasonic scanning results.

[0068] The scanning analysis module (140) performs the function of receiving and analyzing the results of the first ultrasound scanning performed by the first inspection module (110). More specifically, for a plurality of specimens (P) placed in a matrix array form on the tray jig (101), the scanning results are separated and processed on a row-by-row basis.

[0069] As an example, based on the data of all specimens (P) for which top surface scanning has been performed by the first inspection module (110), the scanning analysis module (140) automatically reads the scanning results from the first row to the Nth row and determines whether there are internal defects in each specimen. At this time, the determination criteria are determined according to a defect condition (threshold condition) that is pre-set by the user or defined by a system built-in algorithm. The defect condition may include, for example, conditions such as the intensity of the ultrasonic reflection signal, the depth and area of ​​discontinuous locations, and the presence or absence of abnormalities in the time domain reflection waveform. If it is determined that a specific specimen has a defect, the Kth row containing the specimen is selectively identified.

[0070] Next, the judgment result of the scanning analysis module (140) is transmitted to the inversion module (130), and the inversion module (130) operates to selectively invert only the k-th row where the defect exists, without inverting the entire row. This selective inversion method can significantly improve the processing speed and machine operation efficiency of the entire inspection system. In other words, it is intended to reduce unnecessary inversion operations.

[0071] This configuration is particularly advantageous when the types of test subjects and defect rates vary in a mass production environment, and the scanning analysis module (140) can be configured to perform real-time judgments by applying automated AI algorithms or rule-based logic. The scanning analysis module (140) can be implemented as an extended structure capable of integrated analysis of not only the analysis results of the first inspection module (110) but also the results of the second inspection module (120), and in this case, a multi-layer defect detection function can also be performed by comparing and analyzing the top and bottom surface scanning results within the same row.

[0072] Meanwhile, the second inspection module (120) receives the subject (P) that has been inverted vertically by the inversion module (130) and performs ultrasonic scanning on the lower surface (second surface), but does not necessarily perform it on the entire subject. That is, based on the judgment result of the scanning analysis module (140), the operation of the second probe unit (121) is activated only for the kth row suspected of having a defect, and the operation is controlled to be deactivated for the remaining rows (rows other than the kth).

[0073] Additionally, the second probe unit (121) included in the second inspection module (120) is designed to operate at a different frequency from the first probe unit (111) included in the first inspection module (110). This is to enable the detection of defects at different depths and locations at different resolutions by setting optimized frequency conditions according to the structural characteristics of the upper and lower surfaces or defect types of the specimen (P). As an example, the first probe unit (111) may be designed to use a high frequency to precisely detect shallow surface defects, whereas the second probe unit (121) may be designed to search for deeper internal defects using a low frequency.

[0074] FIG. 8 is a flowchart of a method using an ultrasonic inspection system according to an embodiment of the present invention. Referring to FIG. 8, the present method includes steps (S11) to (S16).

[0075] Step (S11) is a step in which a plurality of specimens (P) are placed on a tray jig (101) in the form of a matrix array.

[0076] Step (S12) is a step of performing ultrasonic scanning on a subject on the tray jig (101) in the first inspection module (110), and a step of performing a first ultrasonic scanning on the first surface using a first probe unit positioned toward the first surface of the subject.

[0077] Step (S13) is a step in which the subject, having completed ultrasonic scanning in the first inspection module (110), is transferred to the inversion module (130).

[0078] Step (S14) is a step of picking up the specimen (P) located on the tray jig (101) in the inversion module (130), inverting it vertically, and then placing the specimen (P) back onto the tray jig (101).

[0079] Step (S15) is the step in which the specimen (P) that was inverted vertically in Step (S14) is transferred to the second inspection module (120).

[0080] Step (S16) is a step of performing ultrasonic scanning on the subject transferred from the inversion module (130) in the second inspection module (120). When the subject (P) is inverted vertically by the inversion module (130), a second ultrasonic scanning is performed using the second probe unit (121) on the second surface which is the surface opposite to the first surface.

[0081] The above embodiments in the present invention are merely examples, and the present invention is not limited thereto. Any configuration substantially identical to the technical concept described in the claims of the present invention and achieving the same functional effect is included within the technical scope of the present invention. Explanation of the symbols

[0082] 101: Tray Jig 110: First inspection module 120: Second inspection module 130: Inversion Module 140: Scanning Analysis Module

Claims

Claim 1 An ultrasonic inspection system comprising: a tray jig for mounting a plurality of specimens in a matrix array form; a first inspection module for performing ultrasonic scanning on specimens on the tray jig, wherein the first ultrasonic scanning is performed on the first surface using a first probe unit positioned toward the first surface of the specimen; an inversion module for picking up specimens located on the tray jig after ultrasonic scanning is completed in the first inspection module, inverting them vertically, and then mounting specimens back onto the tray jig; and a second inspection module for performing ultrasonic scanning on specimens transferred from the inversion module, wherein, when specimens are inverted vertically by the inversion module, the second ultrasonic scanning is performed on a second surface opposite to the first surface using a second probe unit. An ultrasonic inspection system comprising, wherein the inversion module is composed of a pair and is formed to extend in one direction and face each other, wherein the test subjects are spaced apart and seated along the one direction, and the system comprises a gripper that simultaneously inverts the test subjects up and down, wherein the one direction is the row direction or column direction of the tray jig and is configured to simultaneously grip the test subjects located in any row or column among the test subjects seated on the tray jig. Claim 2 delete Claim 3 An ultrasonic inspection system according to claim 1, wherein an alignment bar for checking the horizontal state of a gripped specimen is provided between a pair of opposing grippers, and a seating groove for gripping the end side of the specimen is formed on each of the opposing sides of the grippers. Claim 4 An ultrasonic inspection system according to claim 1, wherein the gripper performs an up-and-down inversion on a subject in the Mth row located on the tray jig, and after gripping the subject in the Mth row and performing an up-and-down inversion, moves toward a subject in the M+1th row and repeatedly performs gripping and up-and-down inversion on the subject in the M+1th row. Claim 5 The ultrasonic inspection system according to claim 4 further comprises a scanning analysis module that analyzes ultrasonic scanning results in a preset manner; wherein the scanning analysis module analyzes the first ultrasonic scanning results from a subject in a first row to a subject in the Nth row located on the tray jig, and if, based on the results of the first ultrasonic scanning, it is determined that a subject in the Kth row on the tray jig corresponds to a preset defect condition, the inversion module is configured to selectively perform gripping and up-and-down inversion only on the subject located in the Kth row. Claim 6 An ultrasonic inspection system according to claim 5, wherein the inversion module determines whether to perform selective gripping and vertical inversion based on thickness information of the subject that is pre-input or sensed, and is configured so that the subject performs gripping and vertical inversion only when the thickness information of the subject is greater than or equal to a preset reference value. Claim 7 An ultrasonic inspection system according to claim 5, wherein the second inspection module activates the operation of the second probe unit for a subject located in the k-th row and deactivates the operation of the second probe unit for a subject located in a row other than the k-th row, and the frequency of the second probe unit is set differently from the frequency of the first probe unit. Claim 8 The ultrasonic inspection system according to claim 1, wherein the inversion module further comprises a rotator having a rotation axis to control the angle of a pair of opposing grippers, and the rotator is coupled to the grippers so as to be rotatable from 0 to 360 degrees around the rotation axis while the grippers are gripping the specimen. Claim 9 A method using an ultrasonic inspection system according to any one of claims 1 to 8, comprising: (a1) a step of placing a plurality of specimens in a matrix array form on a tray jig; (a2) a step of performing ultrasonic scanning on specimens on the tray jig in a first inspection module, wherein a first ultrasonic scanning is performed on the first surface using a first probe unit positioned toward the first surface of the specimens; (a3) ​​a step of transferring the specimens, for which ultrasonic scanning is completed in the first inspection module, to an inversion module; (a4) a step in which the inversion module includes a gripper for grasping the specimens, wherein the gripper picks up the specimens positioned on the tray jig, inverts them vertically, and then places the specimens back on the tray jig; (a5) a step in which the specimens inverted vertically in step (a4) are transferred to a second inspection module; and (a6) a step of performing ultrasonic scanning on the subject transferred from the inversion module in the second inspection module, wherein if the subject is inverted vertically by the inversion module, a step of performing a second ultrasonic scanning using a second probe unit on a second surface which is a surface opposite to the first surface; comprising.

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