Apparatus and method for inspecting multilayer film

Abstract

An apparatus and method for inspecting a multilayer film using a predetermined material irradiation are disclosed. The multilayer film inspection method comprises the steps of: irradiating a predetermined material in a linear fashion through a material generator that moves horizontally in a predetermined direction of movement on the upper surface of a multilayer film in which a metal layer is protected by an insulating sheet, wherein the material generator performs a first irradiation operation such that the longitudinal direction of the predetermined material in the linear fashion being irradiated has a first angle with the direction of movement; measuring a signal generated from the multilayer film while the material generator performs the first irradiation operation; and analyzing the signal measured during the first irradiation operation to determine whether the metal layer is exposed to the outside.

Description

Technology Field

[0001] The present disclosure relates to a multilayer film inspection apparatus and method, and more specifically, to a multilayer film inspection apparatus and method for inspecting a metal layer of a multilayer film. Background Technology

[0002] Recently, there has been an increasing demand for energy storage devices, energy generation devices, and display devices, and various types of multilayer films were laminated on substrates in these devices.

[0003] These substrates could experience performance degradation depending on temperature, and posed a risk of overheating and explosion, particularly when temperatures rose.

[0004] Furthermore, for example, various flammable materials are embedded inside energy storage devices, and the resulting heat generation or explosion can cause ignition or explosion of other external components, which could lead to casualties and property damage.

[0005] Furthermore, if the temperature of the energy storage device rises and the shape of components such as separators deforms, ignition or explosion could occur due to an internal short circuit between the anode and cathode.

[0006] For example, devices using multilayer films with exposed metal layers often resulted in even more dangerous situations.

[0007] Therefore, thorough inspection of components (multilayer films) used in energy storage devices, energy generation devices, and display devices is required. In particular, there is a need to be able to inspect multilayer films laminated on substrates quickly and easily, while also accurately detecting defects in metal layers that may cause danger. Prior art literature

[0008] Korean Published Patent Application No. 10-2020-0007292 (Publication Date: January 22, 2020) The problem to be solved

[0009] The present disclosure provides a multilayer film inspection apparatus and method for detecting defect factors by inspecting a multilayer film quickly and easily, non-destructively, and non-contactually through irradiation (emission) of a predetermined material.

[0010] Meanwhile, the present disclosure provides a multilayer film inspection apparatus and method that can determine whether a defect factor exists in the multilayer film and the exact location of the defect factor on the surface of the multilayer film by setting the signal measuring the emitted material to have different angles and performing an inspection on the multilayer film.

[0011] The problems that this disclosure aims to solve are not limited to those mentioned above, and other unmentioned problems will be clearly understood by a person skilled in the art from the description below. means of solving the problem

[0012] A multilayer film inspection method according to one aspect of the present disclosure for achieving the aforementioned technical problem comprises the steps of: irradiating a predetermined material in a linear manner through a material generator that moves horizontally in a predetermined direction of movement on the upper surface of a substrate in which a metal layer is protected by an insulating sheet, wherein the material generator performs a first irradiation operation such that the longitudinal direction of the predetermined material in the linear manner being irradiated has a first angle with the direction of movement; measuring a signal generated on the substrate while the material generator performs the first irradiation operation; and analyzing the signal measured during the first irradiation operation to determine whether the metal layer is externally exposed.

[0013] In one embodiment, the line-shaped material irradiated by the material generator while moving horizontally can cover the front surface of the substrate.

[0014] In one embodiment, if it is determined that there is no external exposure of the metal layer based on the signal measured during the first irradiation operation, the step of determining the substrate as a good product may be included.

[0015] In one embodiment, if it is determined that there is external exposure of the metal layer based on a signal measured during the first investigation operation, the step of determining the substrate as a defective product may be included.

[0016] In one embodiment, if it is determined that there is external exposure of the metal layer based on a signal measured during the first irradiation operation, the method may further include the step of performing a second irradiation operation by moving the material generator to a second angle different from the first angle of the first irradiation operation and then moving it horizontally.

[0017] In one embodiment, the method may further include the step of detecting the intersection point between the line-shaped first region where an abnormal signal is detected during the first irradiation operation and the line-shaped second region where an abnormal signal is detected during the second irradiation operation as the external exposure point of the metal layer.

[0018] In one embodiment, the step of detecting the external exposure point of the metal layer may be provided by extracting the coordinates of the intersection point on an overall coordinate system set based on the substrate and providing them as location information of the external exposure point of the metal layer.

[0019] In one embodiment, after the material generator moves in the direction of movement from a preset starting point and performs the first irradiation operation, the material generator may return to the preset starting point and move in the direction of movement from the preset starting point to perform the second irradiation operation.

[0020] In one embodiment, after the material generator moves in the direction of movement from a preset starting point and performs the first irradiation operation, the material generator may move in the opposite direction of the direction of movement and perform the second irradiation operation.

[0021] Additionally, a multilayer film inspection device according to one aspect of the present disclosure for achieving the objective comprises: a material generator that performs a first irradiation operation by horizontally moving in a predetermined direction of movement and emitting a predetermined material in a linear manner on the upper surface of a substrate in which a metal layer is protected by an insulating sheet, such that the length direction of the emitted predetermined material has a first angle with the direction of movement; a measuring unit that measures a signal generated on the substrate while the material generator performs the first irradiation operation; and a detection unit that analyzes the signal measured during the first irradiation operation to determine whether the metal layer is externally exposed.

[0022] In addition, a computer program stored on a computer-readable recording medium for executing a method for implementing the present disclosure may be further provided.

[0023] In addition, a computer-readable recording medium for recording a computer program for executing a method for implementing the present disclosure may be further provided. Effects of the invention

[0024] According to the aforementioned means for solving the problem of the present disclosure, by using a predetermined material irradiation to inspect a substrate quickly and easily in a non-contact and non-destructive manner, defect factors can be detected and defective products can be filtered out.

[0025] Meanwhile, according to the present disclosure, by setting different angles to be measured for a predetermined material emitted from a material generator and performing an inspection on the substrate, it is possible to determine not only whether a defect factor exists in the substrate but also the exact location of the defect factor on the surface of the substrate.

[0026] The effects of the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by a person skilled in the art from the description below. Brief explanation of the drawing

[0027] FIG. 1 is a diagram illustrating the configuration of a multilayer film inspection device for inspecting a multilayer film using a predetermined material inspection according to one embodiment of the present disclosure. FIG. 2 is a diagram illustrating an exemplary arrangement of a configuration of a multilayer film inspection device for inspecting a multilayer film according to one embodiment of the present disclosure. FIG. 3 is a diagram exemplarily illustrating a multilayer film structure to be inspected according to one embodiment of the present disclosure. FIG. 4 is a flowchart exemplarily illustrating a method for inspecting a multilayer film using a predetermined material irradiation according to one embodiment of the present disclosure. FIG. 5 is a flowchart exemplifying a specific operation for detecting an external exposure point of a metal layer in a multilayer film according to one embodiment of the present disclosure. FIG. 6 is a flowchart exemplifying a specific operation for detecting an external exposure point of a metal layer in a multilayer film according to another embodiment of the present disclosure. FIGS. 7 to 9 are drawings for exemplarily illustrating a process in which a material generator according to one embodiment of the present disclosure moves and detects a defect factor (S) on the surface of a multilayer film. Specific details for implementing the invention

[0028] The advantages and features of the present disclosure and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present disclosure is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to make the present disclosure complete and to fully inform those skilled in the art of the scope of the present disclosure, and the present disclosure is defined only by the scope of the claims.

[0029] The terms used in this specification are for describing embodiments and are not intended to limit the disclosure. In this specification, the singular form includes the plural form unless specifically stated otherwise in the text. The terms “comprises” and / or “comprising” as used in this specification do not exclude the presence or addition of one or more other components in addition to the components mentioned. Throughout the specification, the same reference numerals refer to the same components, and “and / or” includes each of the mentioned components and all combinations of one or more. Although terms such as “first,” “second,” etc., are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the technical scope of this disclosure.

[0030] Unless otherwise defined, all terms used herein (including technical and scientific terms) may be used in a meaning commonly understood by those skilled in the art to which this disclosure pertains. Additionally, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise.

[0031] Throughout this disclosure, the same reference numerals denote the same components. This disclosure does not describe all elements of the embodiments, and general content in the art to which this disclosure pertains or content that overlaps between embodiments is omitted. As used in the specification, the terms “part” or “module” refer to hardware components such as software, FPGAs, or ASICs, and the “part” or “module” performs certain roles. However, the term “part” or “module” is not limited to software or hardware. The “part” or “module” may be configured to reside in an addressable storage medium or may be configured to run one or more processors. Accordingly, by example, the “part” or “module” includes components such as software components, object-oriented software components, class components, and task components, as well as processes, functions, attributes, procedures, subroutines, segments of program code, drivers, firmware, microcode, circuits, data, databases, data structures, tables, arrays, and variables. The functions provided within the components and "parts" or "modules" may be combined into a smaller number of components and "parts" or "modules," or further separated into additional components and "parts" or "modules."

[0032] Throughout the specification, when a part is described as being "connected" to another part, this includes not only cases where they are directly connected but also cases where they are indirectly connected, and indirect connections include connections made via a wireless communication network.

[0033] Furthermore, when it is stated that a part "includes" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components.

[0034] Throughout the specification, when it is stated that a component is located "on" another component, this includes not only cases where a component is in contact with another component, but also cases where another component exists between the two components.

[0035] Terms such as "first," "second," etc., are used to distinguish one component from another, and the components are not limited by the aforementioned terms.

[0036] Singular expressions include plural expressions unless there is an obvious exception in the context.

[0037] In each step, identification codes are used for convenience of explanation and do not describe the order of the steps; the steps may be performed differently from the specified order unless a specific order is clearly indicated in the context.

[0038] The operating principles and embodiments of the present disclosure will be described below with reference to the attached drawings.

[0039] FIG. 1 is a diagram illustrating the configuration of a multilayer film inspection device for inspecting a multilayer film using material inspection according to one embodiment of the present disclosure, FIG. 2 is a diagram exemplarily illustrating the actual arrangement of the configuration of a multilayer film inspection device for inspecting a multilayer film according to one embodiment of the present disclosure, and FIG. 3 is a diagram exemplarily illustrating a multilayer film structure to be inspected according to one embodiment of the present disclosure.

[0040] As described, a multilayer film inspection device (100) using a predetermined material irradiation according to one embodiment of the present disclosure includes a material generator (110), a measuring unit (120), and a detection unit (130).

[0041] In one embodiment, the material generator (110) can irradiate by moving in a preset direction on the surface of the multilayer film (10) which is the object to be inspected and releasing a predetermined material toward the multilayer film (10).

[0042] At this time, the specific substance being investigated is preferably an ionized gas or an activated substance, and the ionized gas may include plasma gas. This plasma gas may be an atmospheric pressure plasma, but is not necessarily limited thereto, and may be one of various forms such as, for example, negative ions, positive ions, negative charges, positive charges, neutrons, radicals, etc.

[0043] In this case, the material generator (110) according to one embodiment may be a plasma generator (not shown). Accordingly, the plasma generator can irradiate by emitting plasma gas toward the multilayer film (10) while moving in a preset direction on the surface of the multilayer film (10) which is the object to be inspected.

[0044] Alternatively, photons may be irradiated instead of a specific material. In this case, it may be a light generator (not shown) rather than a material generator (110). Accordingly, the light generator can generate photons and irradiate the multilayer film (10) by emitting the generated photons toward the multilayer film (10) while moving in a predetermined direction on the surface of the multilayer film (10) which is the object to be inspected. Below, the description will be limited to specific materials as examples.

[0045] Here, the multilayer film (10) that is the subject of inspection may include a metal layer (204) and an insulating layer, and the insulating layer serves as an insulating sheet to protect the metal layer (204) from being exposed to the outside. At this time, the metal layer (204) is preferably an aluminum foil layer, but is not necessarily limited thereto.

[0046] As shown in FIG. 3, the insulating layer is a collective term for polypropylene (201), adhesive (202), corrosion-resistant layer (203), corrosion-resistant layer (205), adhesive (206), and nylon (207) layers, excluding, for example, the metal layer (204) made of aluminum foil, and may be a composite layer located on one or both sides of the metal layer (204). Accordingly, such a multilayer film (10) may also be referred to as a multilayer film by other terms.

[0047] Here, the polypropylene (201), adhesive (202), and anti-corrosion layer (203) mentioned are shown in FIG. 3 but not in FIG. 2. This is because, in this embodiment, the metal layer (204) of the multilayer film (10), which is the subject of inspection, is substantially inspected for appearance.

[0048] Meanwhile, when the multilayer film (10) mentioned as the subject of inspection is configured in a form in which multiple films are arranged in a row, the material generator (110) can sequentially move each multilayer film (10) in a direction in which multiple multilayer films (10) are arranged and emit a predetermined material to irradiate them.

[0049] Alternatively, when multiple of the mentioned multilayer films (10) are arranged in a row during the appearance inspection stage, the appearance inspection may be performed by the material generator (110) as the multiple multilayer films (10) are moved sequentially.

[0050] In another embodiment, the material generator (110) may be configured such that a plurality of them are arranged in a row. In this case, each material generator (110) may move along one direction over each multilayer film (10) and emit a predetermined material to irradiate it.

[0051] In these various embodiments, it is preferable that at least one material generator (110) used moves to cover the length of one side of the arranged multilayer film (10) and emits a predetermined material.

[0052] Meanwhile, the emission (irradiation) of a specific substance from the aforementioned substance generator (110) is preferably radiated in a linear form, but is not limited thereto and may be emitted in a straight line or radial form.

[0053] Specifically, the material generator (110) can move horizontally in a predetermined direction of movement on the upper surface of a multilayer film (10) in which a metal layer (204) is protected by an insulating sheet, and can perform an irradiation operation to irradiate a predetermined material in a linear manner.

[0054] At this time, to confirm the exact location of the point where the metal layer (204) is exposed to the outside (or the point where a defect factor is detected), an inspection operation may be performed two or more times on the same multilayer film (10). At this time, a predetermined line-shaped material that is inspected while the material generator (110) moves horizontally moves while covering the front surface of the multilayer film (10), or it may be inspected while covering an inspection area, for example, a specific section or area suspected through vision inspection.

[0055] To this end, when a material generator (110) according to one embodiment performs multiple irradiation operations on the same multilayer film (10), the angle between the longitudinal direction of a predetermined linear material irradiated from the material generator (110) and the direction of movement of the material generator (110) may be different each time an irradiation operation is performed.

[0056] For example, a certain substance may be emitted through a plurality of discharge ports (not shown) provided at the bottom of the substance generator (110), and in this case, the plurality of discharge ports may be spaced apart at regular intervals in the longitudinal direction.

[0057] In this case, when a material generator (110) performs a first irradiation operation and a second irradiation operation on the same multilayer film (10), the first irradiation operation can be performed in a state where the angle between the length direction and the direction of movement of a predetermined linear material has a first angle, and after the first irradiation operation is completed, the second irradiation operation can be performed in a state where it has a second angle different from the first angle.

[0058] For example, a material generator (110) may perform a first irradiation operation at a first angle while moving along the upper part of a multilayer film (10) in a moving direction, and then return to the initial position and perform a second irradiation operation at a second angle while moving in the same moving direction, or after performing the first irradiation operation, it may not return to the initial position but instead perform a second irradiation operation while moving in the opposite direction of the moving direction with a second angle different from the first angle.

[0059] Alternatively, when the multilayer film (10) rotates 180 degrees during the various forms of the second irradiation operation described above, one material generator (110) may perform the second irradiation operation with a first angle toward it.

[0060] In this way, the material generator (110), which performs investigation operations in various forms, can have its central axis rotated to have different angles so that the angle can be set.

[0061] Meanwhile, if a signal corresponding to the external exposure area of ​​the metal layer (204) is not detected during the first irradiation operation, the second irradiation operation may be omitted. That is, if it is determined that there is no external exposure of the metal layer (204) based on the signal measured during the first irradiation operation, the multilayer film (10) can be determined to be a good product, and if it is determined that there is external exposure of the metal layer based on the signal measured during the first irradiation operation, the multilayer film (10) can be determined to be a defective product.

[0062] Meanwhile, as described above, the line-shaped material irradiated by various forms of first irradiation operation and second irradiation operation has an intersection angle, and the intersection point of the point where an abnormal signal is detected through the first irradiation operation and the point where an abnormal signal is detected through the second irradiation operation can be determined as the defect factor detection point.

[0063] At this time, the intersection angle is not limited to a specific angle and can be set or changed by the user (manager, worker, etc.) of the inspection device (100).

[0064] Such a material generator (110) may be positioned at a preset starting point and its range of movement may be limited to a preset ending point, and the range of movement may be set by the user of the inspection device (100) and may be changed according to the size and shape of the multilayer film.

[0065] Meanwhile, at least one material generator (110) may be provided. For example, if multiple material generators (110) are provided, each material generator (110) may be arranged to have different angles and may sequentially perform irradiation operations according to a preset order.

[0066] For example, if the material generator (110) is equipped with a first material generator set to have a first angle and a second material generator set to have a second angle, the first material generator and the second material generator may operate sequentially according to a preset order and irradiate a material onto a multilayer film.

[0067] First, a first material generator moves from a starting point to an ending point in a preset direction and irradiates a predetermined material at a first angle, and thereafter, a second material generator moves from a starting point to an ending point in a preset direction and irradiates a predetermined material at a second angle. At this time, the first material generator and the second material generator may be set to have the same movement speed, but this is merely one embodiment and is not limiting.

[0068] In addition, if only one material generator (110) is provided, the position of the material generator (110) can be changed to have different angles for each irradiation operation, and the irradiation operation can be performed sequentially.

[0069] First, with the material generator (110) positioned to have a first angle, it can move horizontally from the starting point to the ending point in a preset direction of movement to irradiate a predetermined material, and then return to the starting point. After that, with the material generator (110) positioned to have a second angle, it can move horizontally from the starting point to the ending point in a preset direction of movement to irradiate a predetermined material.

[0070] In one embodiment, the measuring unit (120) can measure a signal generated in the multilayer film (10) while the material generator (110) irradiates a predetermined material. As previously described, the irradiation operation can be performed multiple times on the same multilayer film (10), so the measuring unit (120) can measure a signal generated in the multilayer film (10) by the irradiation operation each time the material generator (110) performs the irradiation operation.

[0071] For example, the measuring unit (120) can obtain the signal measured during the first investigation operation and the signal measured during the second investigation operation separately.

[0072] To this end, if a probe is connected to an exposed area of ​​the metal layer (204) of the multilayer film (10), for example, to both unfolded side areas (211, 212) as in FIG. 2, the measuring unit (120) can thereby measure a signal including current and voltage.

[0073] Accordingly, the occurrence of noise due to non-uniformity in signal measurement in the insulated area, that is, the insulating layer (205, 206, 207), can be suppressed. Meanwhile, when the entire area of ​​both sides of the multilayer film (10) is protected by insulating layers (201, 202, 203, 205, 206, 207) as in FIG. 3, a hole may be made in the dummy area for inspection to expose the metal layer (204) and measure the signal.

[0074] In one embodiment, the detection unit (130) can determine whether the metal layer (204) is externally exposed by analyzing the characteristics of the signal measured by the measurement unit (120). At this time, the analysis of the signal characteristics may include deriving a peak value, generating displacement, changing a waveform, etc.

[0075] For example, the detection unit (130) checks the waveform of the measured signal and compares the displacement value with a preset threshold. If a change greater than the preset threshold is detected (if the displacement value is greater than the preset threshold), it is determined that the metal layer (204) is exposed to the outside, and the multilayer film (10) can be classified as a defective product. If only the waveform according to the dielectric constant of the insulating layer (205, 206, 207) is detected (if the displacement value is less than or equal to the preset threshold), it is determined that the metal layer (204) is not exposed to the outside, and the multilayer film (10) can be classified as a normal product.

[0076] Furthermore, according to one embodiment, the detection unit (130) may detect not only whether the metal layer (204) is exposed to the outside due to a defect factor on the multilayer film (10), but also the location of the defect factor present on the surface of the multilayer film (10), when a specific substance irradiated from the material generator (110) comes into contact with the metal layer (204) of the aluminum foil and a sudden rapid signal change occurs.

[0077] To do this, as explained above, the measured signal for each investigation operation based on different angles can be used.

[0078] For example, when a first irradiation operation and a second irradiation operation are performed through a material generator (110), the measuring unit (120) can measure a signal for each of the irradiation operations, and thus, when the detection unit (130) obtains the two signals measured by the measuring unit (120), it can analyze the two signals to detect the external exposure point of the metal layer (204), that is, the location of the defect factor.

[0079] For example, as one embodiment, the detection unit (130) can detect whether an abnormal signal is generated by checking the signal measured through the measurement unit (120) while the material generator (110) performs a first irradiation operation on the multilayer film (10), and can perform a second irradiation operation only on at least one specific point where an abnormal signal is detected on the multilayer film (10).

[0080] Thus, the exact location of the defect factor can be detected by confirming the intersection point through a second investigation operation performed for each specific point thereafter.

[0081] In another embodiment, the detection unit (130) can identify an overlapping point among the parts where an abnormal signal occurs in the waveform of each measured signal, that is, identify the parts where an abnormal signal occurs identically in the waveforms of the two signals, and determine a position corresponding to the identified overlapping point on the multilayer film (10).

[0082] More specifically, the detection unit (130) can identify the part where an abnormal signal occurred and the time of occurrence based on the signal measured while the material generator (110) irradiates a predetermined material at a first angle, and can first predict the area of ​​the defect factor on the surface of the multilayer film by considering the identified time of occurrence and the moving speed of the material generator (110).

[0083] Subsequently, the detection unit (130) identifies the part where an abnormal signal occurred and the time of occurrence based on the signal measured while the material generator (110) irradiates a predetermined material at a second angle, and secondarily predicts the area of ​​the defect factor on the surface of the multilayer film by considering the confirmed time of occurrence and the movement speed of the material generator (110). Accordingly, the intersection point of the first predicted area and the second predicted area can be determined as a location corresponding to the previously identified overlapping point, and the coordinates of the determined location can be extracted.

[0084] That is, the coordinates of the determined position on the entire coordinate system set based on the multilayer film can be extracted and obtained as coordinate information.

[0085] In one embodiment described above, the location of the defect factor is detected by analyzing the signal being measured while performing each inspection operation and checking for the occurrence of an abnormal signal, whereas in another embodiment, after performing all inspection operations, the location of the defect factor is detected by analyzing the signal measured by each inspection operation and identifying the location on the multilayer film corresponding to the point where the abnormal signal occurred.

[0086] Meanwhile, although not illustrated in FIGS. 1 and 2, the inspection device (100) may be configured to include a communication unit, a storage unit, and a sensor unit.

[0087] The communication unit transmits and receives at least one piece of information or data with at least one device / terminal. Here, the at least one device / terminal may be a device / terminal that wishes to receive a test result from the test device (100), and its type and form are not limited.

[0088] In addition, this communication unit may also perform communication with other devices and transmits and receives wireless signals in a communication network according to wireless internet technologies.

[0089] Wireless internet technologies include, for example, WLAN (Wireless LAN), Wi-Fi (Wireless-Fidelity), Wi-Fi (Wireless Fidelity) Direct, DLNA (Digital Living Network Alliance), WiBro (Wireless Broadband), WiMAX (World Interoperability for Microwave Access), HSDPA (High Speed ​​Downlink Packet Access), HSUPA (High Speed ​​Uplink Packet Access), LTE (Long Term Evolution), LTE-A (Long Term Evolution-Advanced), etc., and the inspection device (100) transmits and receives data according to at least one wireless internet technology within a range that includes internet technologies not listed above.

[0090] For short-range communication, short-range communication can be supported by utilizing at least one of the following technologies: Bluetooth™, RFID (Radio Frequency Identification), Infrared Data Association (IrDA), Ultra-Wideband (UWB), ZigBee, Near Field Communication (NFC), Wireless-Fidelity (Wi-Fi), Wi-Fi Direct, and Wireless Universal Serial Bus (Wireless USB). Such a short-range wireless communication network can support wireless communication between an inspection device (100) and at least one terminal. In this case, the short-range wireless communication network may be a short-range wireless personal area network.

[0091] The storage unit may store data for at least one process (algorithm) for inspecting a multilayer film using a predetermined material, or for a program that reproduces the process. In addition, the storage unit may store additional processes for performing other operations, but is not limited thereto.

[0092] Meanwhile, the storage unit can store at least one pre-learned model (including a language model) used to inspect a multilayer film using a predetermined material investigation, and various information / data that supports various functions of the inspection device (100).

[0093] Additionally, the storage unit may store a plurality of application programs (or applications) running on the inspection device (100), data for the operation of the inspection device (100), and instructions. At least some of these application programs may be downloaded from an external server via wireless communication. Meanwhile, the application program may be stored in at least one memory provided in the storage unit and installed on the inspection device (100), and may be driven to perform an operation (or function) by at least one processor stored in the storage unit.

[0094] Meanwhile, at least one memory may include a storage medium of at least one type among flash memory type, hard disk type, multimedia card micro type, card type memory (e.g., SD or XD memory, etc.), RAM (Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), PROM (Programmable Read-Only Memory), magnetic memory, magnetic disk, and optical disk. In addition, the memory may store information temporarily, permanently, or semi-permanently, and may be provided as an embedded or removable type.

[0095] This storage unit may also be linked with a separate external server.

[0096] Meanwhile, the sensor unit may be configured to include at least one vision sensor, and defect factors present on the surface can be detected by scanning the surface using the at least one vision sensor before irradiating the surface of the multilayer film with a predetermined material. In this case, the material generator (110) performs an irradiation operation only on the area where the defect factor is detected. For example, when a defect factor is detected in a specific area by the vision sensor, the material generator (110) can sequentially irradiate the defect factor in the detected specific area with a predetermined material while moving along a preset direction of movement.

[0097] FIG. 4 is a flowchart exemplarily illustrating a method for inspecting a multilayer film using a predetermined material irradiation according to one embodiment of the present disclosure.

[0098] Referring to FIG. 4, the material generator (110) of the embodiments moves horizontally in a preset direction of movement on the upper surface of a multilayer film (10) in which a metal layer is protected by an insulating layer (205, 206, 207), and moves sequentially twice such that the longitudinal direction of a predetermined linear material has a first angle and a second angle with the direction of movement, and can sequentially irradiate the predetermined material (S101), and the measuring unit (120) can measure the signals generated from the multilayer film (10) while the material generator (110) moves twice (S103).

[0099] Next, the detector (130) can measure each of the specific substances irradiated from the material generator (110) while the material generator (110) moves twice in step S103, and can detect the external exposure point of the metal layer (204) by analyzing the characteristics of each measured signal (S105).

[0100] Meanwhile, although not shown in FIG. 4, an operation to scan the surface of the multilayer film (10) using at least one vision sensor can be performed first prior to step S101. By doing so, an area where a defect factor exists on the surface of the multilayer film (10) is primarily detected, and each inspection operation is performed only on the detected area, thereby enabling rapid inspection.

[0101] FIG. 5 is a flowchart exemplifying a specific operation for detecting an external exposure point of a metal layer in a multilayer film according to one embodiment of the present disclosure.

[0102] At this time, FIG. 5 is described as being limited to the case where the material generator performs a first irradiation operation and a second irradiation operation, that is, two irradiation operations, and is merely one embodiment and does not limit the number of irradiation operations.

[0103] Referring to FIG. 5, the multilayer film inspection device (100) starts a first irradiation operation (S201) of irradiating a predetermined material while moving horizontally in a predetermined direction of movement, with the material generator (110) positioned at a point where the length direction of a predetermined material in a linear shape forms a first angle with a predetermined direction of movement, and can measure a signal generated from the multilayer film through a measuring unit (120) while the first irradiation operation is being performed (S203).

[0104] Next, the inspection device (100) can detect at least one external exposure point of the metal layer (204) by analyzing the signal measured by step S203 through the detection unit (130) (S205).

[0105] If no external exposure point of the metal layer is detected in step S205, the investigation operation for the multilayer film (10) may be terminated as is.

[0106] Meanwhile, if at least one external exposure point of the metal layer (204) is detected in step S205, the inspection device (100) may perform a second irradiation operation (S207) of irradiating the predetermined material while moving horizontally in the predetermined direction of movement for at least one external exposure point detected by step S205, while positioning the material generator (110) at a point where the length direction of the predetermined material of the line form a second angle with the predetermined direction of movement.

[0107] Next, the inspection device (100) can measure a signal generated from the multilayer film (10) through the measuring unit (120) while the second inspection operation is being performed (S209), and can detect at least one external exposure point of the metal layer (204) by analyzing the signal measured by step S209 through the detection unit (130) (S211).

[0108] Next, the detection unit (130) can determine the location of the defect factor by identifying the intersection point based on at least one external exposure point detected by step S205 and at least one external exposure point detected by step S211 (S213). At this time, the location of the defect factor can be extracted as coordinates.

[0109] FIG. 6 is a flowchart illustrating an exemplary operation for detecting an external exposure point of a metal layer in a multilayer film according to another embodiment of the present disclosure, and illustrates step S105 of FIG. 4 in more detail.

[0110] Referring to FIG. 6, the detection unit (130) can first predict the area of ​​a defect factor on the surface of the multilayer film (10) by considering the time when an abnormal signal is generated in the waveform of the signal (hereinafter referred to as the 'first signal') measured by the measurement unit (120) and the moving speed of the material generator (110) when the material generator (110) irradiates a predetermined material at a first angle (S1051).

[0111] Next, the detection unit (130) can secondarily predict the area of ​​a defect factor on the surface of the multilayer film by considering the time at which an abnormal signal occurred in the waveform of the signal (hereinafter referred to as the 'second signal') measured by the measurement unit (120) when the material generator (110) irradiated a predetermined material at a second angle and the moving speed of the material generator (110) (S1052).

[0112] Next, the detection unit (130) can determine the intersection point of the first predicted area based on the waveform of the first signal by step S1051 and the second predicted area based on the waveform of the second signal by step S1052 as the location of the defect factor (S1053). At this time, the location of the defect factor can be extracted as coordinates.

[0113] FIGS. 7 to 9 are drawings illustrating an exemplary process for detecting defect factors (S) on the surface of a multilayer film while moving a material generator according to one embodiment of the present disclosure, and are limited to cases where a first material generator (111) and a second material generator (1112) are positioned to have different angles to a single multilayer film (A, 10).

[0114] Referring to FIG. 7, as in FIG. 7(a), the first material generator (111) can irradiate a predetermined material emitted while moving horizontally in a preset direction of movement on the surface of the multilayer film (A, 10) while first positioned to have a first angle relative to the position of the multilayer film (A, 10) (first irradiation operation).

[0115] Afterwards, as shown in FIG. 7(b), the second material generator (112) can be positioned to have a second angle relative to the position of the multilayer film (A, 10) and can irradiate the surface of the multilayer film (A, 10) by moving horizontally in a preset direction of movement (second irradiation operation).

[0116] At this time, a predetermined substance is emitted in a line shape toward a multilayer film (A, 10) from the lower part of the first substance generator (111) and the second substance generator (112), but is not limited to a line shape.

[0117] Meanwhile, while performing the first investigation operation and the second investigation operation, each of the signals, namely the first signal and the second signal, is measured by the measuring unit (120). Based on the waveforms of the measured first signal and the second signal, the part where the abnormal signal occurred, as well as the time of occurrence, can be identified.

[0118] Meanwhile, referring to FIG. 8, as in FIG. 8 (a), a certain substance emitted through the first substance generator (111) passes over a defect factor (S) present on the surface of the multilayer film (A, 10), and the detection unit (130) can identify the section where the emitted certain substance passes over the defect factor (S) as the part where an abnormal signal is generated in the waveform of the first signal.

[0119] Likewise, as in FIG. 8 (b), a certain substance emitted through the second substance generator (112) passes over a defect factor (S) present on the surface of the multilayer film (A, 10), and the detector (130) can identify the section where the emitted certain substance passes over the defect factor (S) as the part where an abnormal signal is generated in the waveform of the second signal.

[0120] Thus, as shown in FIG. 9, the part where an abnormal signal occurs identically in the waveforms of the first signal and the second signal (hereinafter referred to as the 'abnormal section'), and the time of occurrence corresponding to the abnormal section in each of the first investigation operation and the second investigation operation can be identified, and by identifying the positions of the first material generator (111) and the second material generator (112) at each time of occurrence, the intersection point can be determined as the point of the defect factor (S).

[0121] Specifically, the angles at which the first material generator (111) and the second material generator (112) are positioned are set with respect to the multilayer film (A, 10) as the first angle and the second angle different from the first angle, respectively, and as a predetermined material is emitted, the predetermined material in the form of a line also has an intersection angle. Accordingly, the intersection point can be determined as the location of the corresponding defect factor (S) based on the position of the first material generator (111) at the time when the defect factor (S) is detected through the first irradiation operation (the time when an abnormal signal occurs on the waveform of the first signal) and the position of the second material generator (112) at the time when the defect factor (S) is detected through the second irradiation operation (the time when an abnormal signal occurs on the waveform of the second signal).

[0122] At this time, the multilayer film (A, 10) can be used as the entire coordinate system to extract the determined point as a coordinate and provide coordinate information.

[0123] Although FIGS. 7 to 9 are illustrated as being limited to two material generators (111, 112) moving from the top to the bottom of a multilayer film (A, 10), a single material generator (110) can perform the operation described in FIGS. 7 to 9, and various variations are possible, such as multiple material generators or a single material generator continuously moving across a multilayer film arranged in multiple numbers, as previously mentioned in the description of FIGS. 1 and 2.

[0124] For example, after one material generator (110) performs the operation (a) of FIGS. 7 and 8, it may perform the operation (b) of FIGS. 7 and 8 at a second angle while moving in the opposite direction of the direction of movement from that position.

[0125] Meanwhile, the aforementioned program may include code encoded in computer languages ​​such as C, C++, JAVA, and machine language, which can be read by the computer's processor (CPU) through the computer's device interface, in order for the computer to read the program and execute the methods implemented in the program. Such code may include functional code related to functions that define the necessary functions for executing the methods, and may include control code related to execution procedures necessary for the computer's processor to execute the functions according to a predetermined procedure. Furthermore, such code may further include memory reference code regarding where (address) additional information or media necessary for the computer's processor to execute the functions should be referenced in the computer's internal or external memory. In addition, if the processor of the computer needs to communicate with any other computer or server located remotely in order to execute the above functions, the code may further include communication-related code regarding how to communicate with any other computer or server located remotely using the communication module of the computer, and what information or media to transmit or receive during communication.

[0126] The above-mentioned storage medium refers to a medium that stores data semi-permanently and is readable by a device, rather than a medium that stores data for a short period of time, such as a register, cache, or memory. Specifically, examples of the above-mentioned storage medium include, but are not limited to, ROM, RAM, CD-ROM, magnetic tape, floppy disk, and optical data storage device. That is, the above-mentioned program may be stored on various recording media on various servers that the computer can access, or on various recording media on the user's computer. Additionally, the above-mentioned medium may be distributed across networked computer systems, and computer-readable code may be stored in a distributed manner.

[0127] The steps of the method or algorithm described in connection with the embodiments of the present disclosure may be implemented directly in hardware, implemented as a software module executed by hardware, or implemented by a combination thereof. The software module may reside in RAM (Random Access Memory), ROM (Read Only Memory), EPROM (Erasable Programmable ROM), EEPROM (Electrically Erasable Programmable ROM), Flash Memory, a hard disk, a removable disk, a CD-ROM, or any form of computer-readable recording medium well known in the art to which the present disclosure belongs.

[0128] Although embodiments of the present disclosure have been described above with reference to the attached drawings, those skilled in the art will understand that the present disclosure may be implemented in other specific forms without altering its technical concept or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. Explanation of the symbols

[0129] 10: Multilayer film 100: Inspection device 110: Matter Generator 120: Measurement section 130: Detector A: Multilayer film S: Defective factors

Claims

Claim 1 A method for inspecting a multilayer film using ionized gas irradiation, performed by a device, comprising: a step of irradiating a linear ionized gas through an ionized gas generator that moves horizontally in a predetermined direction of movement on the upper surface of a multilayer film in which a metal layer is protected by an insulating sheet, wherein the ionized gas generator performs a first irradiation operation such that the longitudinal direction of the irradiated linear ionized gas has a first angle with the direction of movement; a step of measuring a signal generated from the multilayer film while the ionized gas generator performs the first irradiation operation; a step of analyzing the signal measured during the first irradiation operation to determine whether the metal layer is externally exposed; and a step of, if it is determined that the metal layer is externally exposed based on the signal measured during the first irradiation operation, performing a second irradiation operation by moving the ionized gas generator horizontally to have a second angle different from the first angle of the first irradiation operation. A multilayer film inspection method comprising the step of detecting the intersection point between a line-shaped first region where an abnormal signal is detected during the first inspection operation and a line-shaped second region where an abnormal signal is detected during the second inspection operation as the external exposure point of the metal layer. Claim 2 A multilayer film inspection method according to claim 1, characterized in that the line-shaped ionized gas irradiated by the ionized gas generator moving horizontally covers the entire surface of the multilayer film. Claim 3 A multilayer film inspection method according to claim 1, comprising the step of determining the multilayer film as good if it is determined that there is no external exposure of the metal layer based on a signal measured during the first inspection operation. Claim 4 A multilayer film inspection method according to claim 1, comprising the step of determining the multilayer film as defective if it is determined that there is external exposure of the metal layer based on a signal measured during the first inspection operation. Claim 5 delete Claim 6 delete Claim 7 A multilayer film inspection method according to claim 1, wherein the step of detecting the external exposure point of the metal layer is to extract the coordinates of the intersection point on an overall coordinate system set based on the multilayer film and provide them as location information of the external exposure point of the metal layer. Claim 8 A multilayer film inspection method according to claim 1, wherein the ionized gas generator moves in the direction of movement from a preset starting point and performs the first irradiation operation, and then the ionized gas generator returns to the preset starting point and moves in the direction of movement from the preset starting point to perform the second irradiation operation. Claim 9 A multilayer film inspection method according to claim 1, wherein the ionized gas generator moves in the direction of movement from a preset starting point and performs the first irradiation operation, and then the ionized gas generator moves in the opposite direction of the direction of movement and performs the second irradiation operation. Claim 10 A multilayer film inspection device comprising: an ionized gas generator that irradiates a line-shaped ionized gas while moving horizontally in a preset direction of movement on the upper surface of a multilayer film in which a metal layer is protected by an insulating sheet, performing a first irradiation operation such that the length direction of the irradiated ionized gas has a first angle with the direction of movement, and after the first irradiation operation is terminated, performs a second irradiation operation in a positioned such that it has a second angle different from the first angle; a measuring unit that measures a signal generated in the multilayer film while the ionized gas generator performs the first irradiation operation and the second irradiation operation; and a detection unit that analyzes the signal measured during the first irradiation operation to determine whether the metal layer is externally exposed, and detects the intersection point between a line-shaped first region where an abnormal signal is detected during the first irradiation operation and a line-shaped second region where an abnormal signal is detected during the second irradiation operation as the point of external exposure of the metal layer.

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