Substrate processing apparatus and substrate processing method

KR103003586B1Active Publication Date: 2026-08-11TOKYO ELECTRON LTD
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Patent Information

Application Number
KR1020230016360
Authority / Receiving Office
KR · KR
Patent Type
Patents
Current Assignee / Owner
Priority Date
2022-02-16
Filing Date
2023-02-07
Publication Date
2026-08-11
Estimated Expiration
2043-02-07

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Abstract

[Project] Reduce the particle level of the substrate after supercritical drying. [Solution] The substrate processing apparatus of the present disclosure is a substrate processing apparatus that performs supercritical drying treatment using a processing fluid in a supercritical state on a substrate having a liquid attached to its surface, and comprises a processing vessel having an internal space in which supercritical drying treatment is performed on the substrate, a processing area in which the processing vessel is arranged, a housing having an incoming / outgoing area for receiving and receiving substrates set therein, a transfer unit installed in the incoming / outgoing area and transferring substrates between a substrate transfer arm that enters the incoming / outgoing area from the outside of the housing, a substrate transfer mechanism that transfers substrates between the transfer unit and the processing vessel, and a gas supply unit installed to supply dry gas to the incoming / outgoing area.
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Citation Information

Patent Citations

  • Supercritical drying method and supercritical drying apparatus

    JP2011192835A

  • Substrate processing system, substrate processing method, and storage medium

    KR1020130110005A

  • Apparatus and Method for treating substrate

    KR1020170137245A

  • Substrate processing device and substrate processing method

    WO2021033588A1