Display device

Abstract

A display device may include a substrate comprising a display area and a pad area, a plurality of input pads disposed in a first portion of the pad area on the substrate, a plurality of output pads disposed in a second portion of the pad area on the substrate, a driving unit disposed on the input pads and output pads, a plurality of discharge patterns disposed adjacent to the driving unit in the pad area on the substrate, and a plurality of ground wirings connecting at least one of the input pads and the discharge patterns in the pad area on the substrate. Accordingly, damage to the driving unit due to static electricity during the manufacturing process of the display device can be prevented.

Description

Technology Field

[0001] The present invention relates to a display device. More specifically, the present invention relates to a display device comprising a driving unit. Background Technology

[0002] Flat panel displays are being used as replacements for cathode ray tube displays due to their characteristics, such as lightweight and thin profiles. Representative examples of such flat panel displays include liquid crystal displays and organic light-emitting diode displays.

[0003] A display device may include a substrate, and the substrate may be divided into a display area and a pad area. A pixel structure may be disposed in the display area on the substrate, and an image may be displayed through the pixel structure. A driving unit, signal pads, etc. may be disposed in the pad area on the substrate, and after image signals from an external device capable of generating image signals are provided to the driving unit through the signal pads, the image signals provided to the driving unit may be provided to the pixel structure.

[0004] Meanwhile, static electricity may be generated during the manufacturing process of the display device, and said static electricity may damage pixel structures, driving parts, etc. formed on the substrate. The problem to be solved

[0005] The objective of the present invention is to provide a display device including a driving unit.

[0006] However, the present invention is not limited to the purposes described above and may be extended in various ways without departing from the spirit and scope of the invention. means of solving the problem

[0007] To achieve the aforementioned objective of the present invention, a display device according to one embodiment of the present invention may include a substrate comprising a display area and a pad area, a plurality of input pads disposed in a first portion of the pad area on the substrate, a plurality of output pads disposed in a second portion of the pad area on the substrate, a driving unit disposed on the input pads and the output pads, a plurality of discharge patterns disposed adjacent to the driving unit in the pad area on the substrate, and a plurality of ground wirings connecting at least one of the input pads and the discharge patterns in the pad area on the substrate.

[0008] In one embodiment, the discharge patterns include a metallic material, and the discharge patterns may be arranged to overlap with at least a portion of the driving unit in the pad area on the substrate.

[0009] In one embodiment, the input pads may be spaced apart from each other in a first direction, and the discharge patterns may be spaced apart from each other in a second direction different from the first direction.

[0010] In one embodiment, the discharge patterns include first discharge patterns disposed in a third portion of the pad area and second discharge patterns disposed in a fourth portion of the pad area, and the first and second portions of the pad area may face each other, and the third and fourth portions of the pad area may face each other.

[0011] In one embodiment, the device may further include a touch circuit portion disposed around the driving portion in the pad area on the substrate and a plurality of touch ground wires connecting the touch circuit portion and the discharge patterns.

[0012] In one embodiment, the device may further include a gate electrode disposed in the display area on the substrate, a drain electrode disposed on the gate electrode, a pixel structure disposed on the drain electrode, a connecting electrode disposed between the drain electrode and the pixel structure and connecting the drain electrode and the pixel structure, and a sensing structure disposed on the pixel structure.

[0013] In one embodiment, each of the ground wirings may have a multilayer structure including at least one conductive layer.

[0014] In one embodiment, each of the ground wirings may include a first conductive layer disposed in the pad area on the substrate, a second conductive layer disposed on the first conductive layer, and a third conductive layer disposed on the second conductive layer.

[0015] In one embodiment, the first conductive layer may be disposed on the same layer as the gate electrode, the second conductive layer may be disposed on the same layer as the drain electrode, and the third conductive layer may be disposed on the same layer as the connecting electrode.

[0016] In one embodiment, the sensing structure may include a lower touch insulating layer disposed on the pixel structure, a sensing connection pattern disposed on the lower touch insulating layer, an interlayer touch insulating layer disposed on the sensing connection pattern, and a sensing electrode pattern disposed on the interlayer touch insulating layer.

[0017] In one embodiment, the discharge patterns may be disposed on the same layer as any one of the gate electrode, the drain electrode, the connection electrode, the sensing connection pattern, and the sensing electrode pattern.

[0018] In one embodiment, the touch ground wiring may be disposed on the same layer as either the sensing connection pattern and the sensing electrode pattern.

[0019] To achieve the aforementioned objective of the present invention, a display device according to another embodiment of the present invention may include a substrate comprising a display area and a pad area, a plurality of input pads disposed in a first portion of the pad area on the substrate, a plurality of output pads disposed in a second portion of the pad area on the substrate, a driving unit disposed on the input pads and the output pads, a plurality of discharge patterns disposed adjacent to the driving unit in the pad area on the substrate, a guard pattern disposed adjacent to the driving unit in the pad area on the substrate, and a plurality of ground wirings connecting at least one of the input pads, the discharge patterns, and the guard pattern in the pad area on the substrate.

[0020] In one embodiment, the guard pattern may have a rectangular shape with one side open.

[0021] In one embodiment, the guard pattern may be disposed on the same layer as the discharge patterns.

[0022] In one embodiment, the discharge patterns and the guard pattern may include a metallic material.

[0023] In one embodiment, the guard pattern may surround the output pads and the discharge patterns.

[0024] In one embodiment, the discharge patterns and the guard pattern in the pad area on the substrate may be arranged to overlap with at least a part of the driving unit.

[0025] In one embodiment, the discharge patterns include first discharge patterns disposed in a third portion of the pad area and second discharge patterns disposed in a fourth portion of the pad area, and the first and second portions of the pad area may face each other, and the third and fourth portions of the pad area may face each other.

[0026] In one embodiment, the device may further include a touch circuit portion disposed around the driving portion in the pad area on the substrate, and a plurality of touch ground wirings connecting the touch circuit portion, the discharge patterns, and the guard pattern. Effects of the invention

[0027] A display device according to one embodiment of the present invention may include a plurality of discharge patterns disposed adjacent to a driving unit in a pad area on a substrate and a plurality of ground wirings connecting at least one of the input pads to the discharge patterns. Accordingly, during the manufacturing process of the display device, static electricity introduced into the driving unit is induced into the discharge patterns and discharged to the outside through the ground wirings and input pads, thereby preventing damage to the driving unit caused by static electricity.

[0028] However, the effects of the present invention are not limited to the effects described above, and may be extended in various ways without departing from the spirit and scope of the present invention. Brief explanation of the drawing

[0029] FIG. 1 is a plan view showing a display device according to one embodiment of the present invention. FIG. 2 is a perspective view showing the bent shape of the display device of FIG. 1. FIG. 3 is a block diagram illustrating an external device electrically connected to the display device of FIG. 1. Figure 4 is a cross-sectional view taken along the line I-I' of Figure 1. FIG. 5 is a plan view for explaining a touch sensing structure included in the display device of FIG. 4. Figure 6 is a plan view showing an enlarged view of area 'A' in Figure 1. Figure 7 is a cross-sectional view taken along the line II-II' of Figure 5. FIG. 8 is a plan view showing a pad area of ​​a display device according to another embodiment of the present invention. Figure 9 is a cross-sectional view taken along the line III-III' of Figure 8. FIG. 10 is a plan view showing a pad area of ​​another display device in another embodiment of the present invention. Figure 11 is a cross-sectional view taken along the line IV-IV' of Figure 10. FIG. 12 is a plan view showing a pad area of ​​a display device according to another embodiment of the present invention. Specific details for implementing the invention

[0030] Hereinafter, a display device according to exemplary embodiments of the present invention will be described in detail with reference to the attached drawings. In the attached drawings, identical or similar reference numerals are used for identical or similar components.

[0031] FIG. 1 is a plan view showing a display device according to an embodiment of the present invention. FIG. 2 is a perspective view showing the shape of the display device of FIG. 1 bent. FIG. 3 is a block diagram for explaining an external device electrically connected to the display device of FIG. 1.

[0032] Referring to FIGS. 1, 2 and 3, the display device (100) may include a substrate (110), a pixel structure (300), a driving unit (310), signal pads (320), etc.

[0033] The substrate (110) may include a transparent or opaque material. The substrate (110) may be made of a transparent resin substrate. For example, the transparent resin substrate that can be used as the substrate (110) may be a polyimide substrate. In this case, the polyimide substrate may include a first polyimide layer, a barrier film layer, a second polyimide layer, etc.

[0034] A substrate (110) may include a display area (10), a bending area (20), and a pad area (30). A pad area (30) may be positioned in a second direction (D2) parallel to the upper surface of the substrate (110) from one side of the display area (10), and a bending area (20) may be positioned between the display area (10) and the pad area (30). As shown in FIG. 2, the bending area (20) may be bent with a first direction (D1) that is orthogonal to the second direction (D2) as an axis. In this case, the pad area (30) and the display area (10) may overlap in a third direction (D3) that is perpendicular to the first direction (D1) and the second direction (D2).

[0035] Signal pads (320) may be disposed in a pad area (30) on a substrate (110). The signal pads (320) may be disposed spaced apart from each other in a first direction (D1). Each of the signal pads (320) may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in combination with each other. Optionally, each of the signal pads (320) may have a multilayer structure including a plurality of metal layers. For example, the metal layers may have different thicknesses or may include different materials. Additionally, an external device (101) may be electrically connected to a display device (100) through a flexible printed circuit board (FPCB) and signal pads (320), and may provide a gate signal, a data signal, a gate initialization signal, an initialization voltage, a light emission control signal, a power supply voltage, etc. to a pixel structure (300).

[0036] Pixel structures (300) that emit light may be disposed on a display area (10) on a substrate (110). The pixel structures (300) may be arranged in a first direction (D1) and a second direction (D2) orthogonal to the first direction (D1) in the display area (10). Although not illustrated in detail in FIG. 1, wiring connected to the pixel structures (300) may be disposed in the display area (10). For example, the wiring may include data signal wiring, gate signal wiring, light emission control signal wiring, gate initialization signal wiring, power supply voltage wiring, etc.

[0037] However, although the display device (100) of the present invention has been described as having a rectangular planar shape for each of the display area (10), bending area (20), and pad area (30), the shape is not limited thereto. For example, the shape of each of the display area (10), bending area (20), and pad area (30) may have a triangular planar shape, a rhombus planar shape, a polygonal planar shape, a circular planar shape, a track-shaped planar shape, or an elliptical planar shape.

[0038] In one embodiment, the driving unit (310) may be disposed on the pad area (30) on the substrate (110). That is, the driving unit (310) may be mounted on the substrate (110).

[0039] FIG. 4 is a cross-sectional view taken along the line I-I' of FIG. 1. FIG. 5 is a plan view for explaining a sensing structure included in the display device of FIG. 4. For example, FIG. 4 is a cross-sectional view showing the display area (10) of the display device (100) of FIG. 1.

[0040] Referring to FIGS. 4 and 5, the display device (100) may include a substrate (110), a gate insulating layer (120), a first interlayer insulating layer (130a), a second interlayer insulating layer (130b), a semiconductor device (150), a first planarization layer (140a), a second planarization layer (140b), a connecting electrode (CE), a pixel defining film (160), a pixel structure (300), a thin film encapsulation structure (180), a sensing structure (260), etc. Here, the semiconductor device (150) may include an active layer (ACT), a first gate electrode (GE1), a second gate electrode (GE2), a source electrode (SE), and a drain electrode (DE), and the pixel structure (300) may include a lower electrode (171), a light-emitting layer (172), and an upper electrode (173). Additionally, the thin film encapsulation structure (180) may include a first inorganic thin film encapsulation layer (181), an organic encapsulation layer (182), and a second inorganic thin film encapsulation layer (183), and the sensing structure (260) may include a sensing connection pattern (220), a first sensing electrode pattern (240a), a second sensing electrode pattern (240b), and a connection portion (241).

[0041] A buffer layer may be disposed on the substrate (110). The buffer layer can prevent metal atoms or impurities from the substrate (110) from diffusing into an upper structure (e.g., semiconductor device (150), pixel structure (300), etc.) and can control the rate of heat transfer during the crystallization process for forming an active layer (ACT) to obtain a substantially uniform active layer (ACT). Additionally, if the surface of the substrate (110) is not uniform, the buffer layer can serve to improve the flatness of the surface of the substrate (110). For example, the buffer layer may include an organic insulating material or an inorganic insulating material.

[0042] An active layer (ACT) may be disposed on a display area (10) on a substrate (110). The active layer (ACT) may include a metal oxide semiconductor, an inorganic semiconductor (e.g., amorphous silicon, polysilicon), or an organic semiconductor. The active layer (ACT) may include a source region, a drain region, and a channel region located between the source region and the drain region.

[0043] A gate insulating layer (120) may be disposed on a display area (10) and a pad area (30) on a substrate (110) (see FIG. 4 and FIG. 7). The gate insulating layer (120) covers an active layer (ACT) on the substrate (110) and may be disposed along the profile of the active layer (ACT) with a uniform thickness. Optionally, the gate insulating layer (120) may sufficiently cover the active layer (ACT) on the substrate (110) and may have a substantially flat top surface without creating a step around the active layer (ACT). The gate insulating layer (120) may include silicon compounds, metal oxides, etc. For example, the gate insulating layer (120) may include silicon oxide (SiOx), silicon nitride (SiNx), silicon carbide (SiCx), silicon oxynitride (SiOxNy), silicon oxycarbide (SiOxCy), etc.

[0044] A first gate electrode (GE1) may be disposed in a display area (10) on a gate insulating layer (120). The first gate electrode (GE1) may overlap with the channel area of ​​the active layer (ACT). For example, the first gate electrode (GE1) may include a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc.

[0045] A first interlayer insulating layer (130a) may be disposed on the display area (10) and pad area (30) on the gate insulating layer (120) (see FIG. 4 and FIG. 7). The first interlayer insulating layer (130a) covers the first gate electrode (GE1) and may be disposed with a uniform thickness. Optionally, the first interlayer insulating layer (130a) may have a substantially flat upper surface on the gate insulating layer (120) without creating a step around the first gate electrode (GE1). The first interlayer insulating layer (130a) may include a silicon compound, a metal oxide, etc.

[0046] A second gate electrode (GE2) may be disposed on a display area (10) on the first interlayer insulating layer (130a). That is, the second gate electrode (GE2) may overlap with the first gate electrode (GE1). For example, the second gate electrode (GE2) may include a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in combination with each other.

[0047] A second interlayer insulating layer (130b) may be disposed on the display area (10) and pad area (30) on the first interlayer insulating layer (130a) (see FIG. 4 and FIG. 7). The second interlayer insulating layer (130b) covers the second gate electrode (GE2) and may be disposed with a uniform thickness. Optionally, the second interlayer insulating layer (130b) may have a substantially flat top surface on the first interlayer insulating layer (130a) without creating a step around the second gate electrode (GE2). For example, the second interlayer insulating layer (130b) may include silicon compounds, metal oxides, etc. These may be used alone or in combination with each other.

[0048] A source electrode (SE) and a drain electrode (DE) may be disposed on a display area (10) on the second interlayer insulating layer (130b). The source electrode (SE) may be connected to the source area of ​​the active layer (ACT) through a contact hole formed by removing a first portion of the gate insulating layer (120), the first interlayer insulating layer (130a), and the second interlayer insulating layer (130b), and the drain electrode (DE) may be connected to the drain area of ​​the active layer (ACT) through a contact hole formed by removing a second portion of the gate insulating layer (120), the first interlayer insulating layer (130a), and the second interlayer insulating layer (130b). For example, the source electrode (SE) and the drain electrode (DE) may each include a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in combination with each other.

[0049] A first flattening layer (140a) may be disposed on a display area (10) on the second interlayer insulating layer (130b), source electrode (SE), and drain electrode (DE). That is, the first flattening layer (140a) may not be disposed on the pad area (30) on the second interlayer insulating layer (130b). In other words, the first flattening layer (140a) may not be disposed on the area overlapping with the driving unit (310) on the second interlayer insulating layer (130b) (see FIG. 1 and FIG. 7). For example, the first flattening layer (140a) may be disposed with a relatively thick thickness to sufficiently cover the source electrode (SE) and the drain electrode (DE) on the second interlayer insulating layer (130b), in which case the first flattening layer (140a) may have a substantially flat top surface, and a flattening process may be added to the first flattening layer (140a) to realize such a flat top surface of the first flattening layer (140a). Additionally, the first flattening layer (140a) may have a contact hole that exposes the top surface of the drain electrode (DE). The first flattening layer (140a) may comprise an organic insulating material or an inorganic insulating material. In one embodiment, the first flattening layer (140a) may comprise an organic insulating material. For example, the first planarization layer (140a) may include photoresist, polyacryl-based resin, polyimide-based resin, polyamide-based resin, siloxane-based resin, acrylic-based resin, epoxy-based resin, etc.

[0050] A connecting electrode (CE) may be disposed on a display area (10) on the first flattening layer (140a). The connecting electrode (CE) may come into direct contact with a drain electrode (DE) through the contact hole of the first flattening layer (140a). For example, the connecting electrode (CE) may include a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in combination with each other.

[0051] A second flattening layer (140b) may be disposed on the connecting electrode (CE) and the first flattening layer (140a). That is, the second flattening layer (140b) may not be disposed in the pad area (30). In other words, the second flattening layer (140b) may not be disposed in an area overlapping with the driving unit (310). (See FIG. 1 and FIG. 7). For example, the second flattening layer (140b) may be disposed with a relatively thick thickness to sufficiently cover the connecting electrode (CE) on the first flattening layer (140a), in which case the second flattening layer (140b) may have a substantially flat upper surface, and a flattening process may be added to the second flattening layer (140b) to achieve such a flat upper surface of the second flattening layer (140b). Additionally, the second flattening layer (140b) may have a contact hole that exposes the upper surface of the connecting electrode (CE). For example, the second flattening layer (140b) may include an organic insulating material or an inorganic insulating material.

[0052] A lower electrode (171) may be disposed on a display area (10) on the second flattening layer (140b). The lower electrode (171) may come into direct contact with a connecting electrode (CE) through the contact hole of the second flattening layer (140b), and the lower electrode (171) may be electrically connected to a semiconductor device (150). For example, the lower electrode (171) may include a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in combination with each other.

[0053] A pixel defining film (160) may be disposed on the display area (10) on the second flattening layer (140b). That is, the pixel defining film (160) may not be disposed on the pad area (30) (see FIG. 7). In other words, the pixel defining film (160) may be disposed on a part of the lower electrode (171) and on the second flattening layer (140b) in the display area (10). The pixel defining film (160) may cover both sides of the lower electrode (171) and may have an opening that exposes the upper surface of the lower electrode (171). For example, the pixel defining film (160) may include an organic insulating material or an inorganic insulating material.

[0054] A light-emitting layer (172) may be disposed on the display area (10) on the lower electrode (171). That is, the light-emitting layer (172) may be disposed on the lower electrode (171) exposed by the opening of the pixel defining film (160). The light-emitting layer (172) may be formed using at least one of light-emitting materials capable of emitting red light, green light, blue light, etc., depending on the type of subpixel. Optionally, the light-emitting layer (172) may emit white light overall by stacking a plurality of light-emitting materials capable of generating other colors of light, such as red light, green light, and blue light.

[0055] An upper electrode (173) may be disposed on a display area (10) on a pixel defining film (160) and a light-emitting layer (172). For example, the upper electrode (173) may include a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in combination with each other.

[0056] A first inorganic thin film encapsulation layer (181) may be disposed on the upper electrode (173). The first inorganic thin film encapsulation layer (181) covers the upper electrode (173) and may be disposed along the profile of the upper electrode (173) with a uniform thickness. The first inorganic thin film encapsulation layer (181) can prevent the pixel structure (300) from deteriorating due to the penetration of moisture, oxygen, etc. Additionally, the first inorganic thin film encapsulation layer (181) can also perform the function of protecting the pixel structure (300) from external impacts. For example, the first inorganic thin film encapsulation layer (181) may include flexible inorganic insulating materials.

[0057] An organic thin film encapsulation layer (182) may be disposed on the first inorganic thin film encapsulation layer (181). The organic thin film encapsulation layer (182) can improve the flatness of the display device (100) and can protect the pixel structure (300) together with the first inorganic thin film encapsulation layer (181). For example, the organic thin film encapsulation layer (182) may include flexible organic materials.

[0058] A second inorganic thin film encapsulation layer (183) may be disposed on an organic thin film encapsulation layer (182). The second inorganic thin film encapsulation layer (183) covers the organic thin film encapsulation layer (182) and may be disposed along the profile of the organic thin film encapsulation layer (182) with a uniform thickness. Together with the first inorganic thin film encapsulation layer (181), the second inorganic thin film encapsulation layer (183) can prevent the pixel structure (300) from deteriorating due to the penetration of moisture, oxygen, etc. Additionally, together with the first inorganic thin film encapsulation layer (181) and the organic thin film encapsulation layer (182), the second inorganic thin film encapsulation layer (183) can also perform the function of protecting the pixel structure (300) from external impact. For example, the second inorganic thin film encapsulation layer (183) may include flexible inorganic insulating materials.

[0059] Optionally, the thin film encapsulation structure (180) may have a 5-layer structure stacked with 3 inorganic thin film encapsulation layers and 2 organic thin film encapsulation layers, or a 7-layer structure stacked with 4 inorganic thin film encapsulation layers and 3 organic thin film encapsulation layers.

[0060] A lower touch insulating layer (210) may be disposed on a display area (10) on a second inorganic thin film encapsulation layer (183). For example, the lower touch insulating layer (210) may include an inorganic insulating material or an organic insulating material. Optionally, the lower touch insulating layer (210) may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses or include different materials.

[0061] A sensing connection pattern (220) may be disposed on a display area (10) on a lower touch insulating layer (210). As illustrated in FIG. 5, the sensing connection pattern (220) may electrically connect a first sensing electrode pattern (240a) and a second sensing electrode pattern (240b) through contact holes. For example, the sensing connection pattern (220) may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in combination with each other.

[0062] An interlayer touch insulating layer (230) may be disposed on a display area (10) on a lower touch insulating layer (210) and a sensing connection pattern (220). The interlayer touch insulating layer (230) may sufficiently cover the sensing connection pattern (220). For example, the interlayer touch insulating layer (230) may include an organic insulating material or an inorganic insulating material. Optionally, the interlayer touch insulating layer (230) may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses or include different materials.

[0063] A first sensing electrode pattern (240a), a second sensing electrode pattern (240b), and a connection part (241) may be disposed on a display area (10) on an interlayer touch insulating layer (230). Additionally, as shown in FIG. 5, a third sensing electrode pattern (242) may be disposed on a display area (10) on an interlayer touch insulating layer (230), and the third sensing electrode pattern (242) may be disposed on the same layer as the connection part (241). In one embodiment, each of the first sensing electrode pattern (240a), the second sensing electrode pattern (240b), the third sensing electrode pattern (242), and the connecting portion (241) may include carbon nanotubes (CNT), transparent conductive oxide, indium tin oxide (ITO), indium gallium zinc oxide (IGZO), zinc oxide (ZnO), graphene, silver nanowires (Ag nanowire AgNW), copper (Cu), chromium (Cr), etc.

[0064] For example, the first sensing electrode pattern (240a) and the second sensing electrode pattern (240b) may include an electrode pattern array arranged spaced apart from each other in the second direction (D2). Additionally, the third sensing electrode pattern (242) may include an electrode pattern array that extends in the second direction (D2) and is arranged spaced apart from each other in the first direction (D1).

[0065] A protective layer (250) may be disposed on the interlayer touch insulating layer (230), the first sensing electrode pattern (240a), the second sensing electrode pattern (240b), and the connection portion (241). The protective layer (250) may sufficiently cover the first sensing electrode pattern (240a), the second sensing electrode pattern (240b), and the connection portion (241).

[0066] Embodiments of the present invention are not limited to the structures shown in FIGS. 4 and 5 and may have various known structures. For example, in other embodiments, the lower touch insulating layer (210) may be omitted. Additionally, the first and second sensing electrode patterns (240a, 240b) and the third sensing electrode pattern (242) may be disposed on different layers, so that the first and second sensing electrode patterns (240a, 240b) may have a continuous structure without a sensing connection pattern (220).

[0067] Additionally, although the display device (100) of the present invention is described as being limited to an organic light-emitting display device, the configuration of the present invention is not limited thereto. In other embodiments, the display device (100) may include a liquid crystal display device (LCD), a field emission display device (FED), a plasma display device (PDP), or an electrophoretic image display device (EPD).

[0068] FIG. 6 is a plan view showing an enlarged view of area 'A' of FIG. 1. For example, FIG. 6 is a drawing showing the pad area (30) of the display device (100) of FIG. 1.

[0069] Referring to FIGS. 1 and FIGS. 6, the display device (100) may include a substrate (110), a driving unit (310), a plurality of output pads (312), a plurality of input pads (311), a plurality of first discharge patterns (330), a plurality of ground wirings (340), etc.

[0070] In one embodiment, the driving unit (310) may be disposed on the output pads (312) and the input pads (311). Additionally, the driving unit (310) may be bonded to the output pads (312) and the input pads (311).

[0071] The pad area (30) illustrated in FIG. 1 may be divided into a first part (32), a second part (31), a third part (33), and a fourth part (34). For example, the second part (31) may be located adjacent to the display area (10), and the first part (32) may be located adjacent to the signal pads (320). Additionally, the third part (33) and the fourth part (34) may be located adjacent to the input pads (311) and output pads (312). The first part (32) and the second part (31) may face each other, and the third part (33) and the fourth part (34) may face each other.

[0072] In one embodiment, the driving unit (310) may be a driving IC chip including an integrated circuit. For example, the driving IC chip may be embedded between the first part (31) and the second part (32). One side of the driving IC chip may be electrically connected to input pads (311) through circuit wiring, and the other side of the driving IC chip may be electrically connected to output pads (312) through circuit wiring. The driving IC chip may receive an input signal and a driving IC power supply voltage through signal pads (320) and input pads (311) from an external device (101) of FIG. 3, and the driving IC chip may provide an output signal through wiring connecting output pads (312) and the pixel structure (300) to the pixel structure (300) based on the input signal.

[0073] Output pads (312) and input pads (311) may be disposed in a pad area (30) on a substrate (110). In one embodiment, input pads (311) may be disposed in a first portion (32) of the pad area (30), and output pads (312) may be disposed in a second portion (31) of the pad area (30). For example, output pads (312) may be disposed spaced apart from each other in a first direction (D1) and a second direction (D2) orthogonal to the first direction (D1), and input pads (311) may be disposed spaced apart from each other in the first direction (D1).

[0074] For example, each of the output pads (312) and input pads (311) may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in combination with each other. Optionally, each of the output pads (312) and input pads (311) may have a multilayer structure including a plurality of metal layers.

[0075] As described in FIG. 1, signal pads (320) may be disposed in a pad area (30) on a substrate (110). That is, the signal pads (320) may be disposed in a position adjacent to a second portion (32) in the pad area (30) on the substrate (110). In one embodiment, each of the signal pads (320) may be electrically connected to input pads (311) through wirings (321).

[0076] In one embodiment, discharge patterns (330) comprising a metal material may be disposed on a pad region (30) on a substrate (110). The discharge patterns (330) may include first discharge patterns disposed in a third portion (33) of the pad region (30) and second discharge patterns disposed in a fourth portion (34) of the pad region (30). For example, the discharge patterns (330) may be disposed spaced apart from each other in a first direction (D1) and a second direction (D2) different from each other.

[0077] In one embodiment, discharge patterns (330) may be disposed adjacent to the driving unit (310) in the pad area (30) on the substrate (110). Additionally, discharge patterns (330) may be disposed to overlap with at least a portion of the driving unit (310) in the pad area (30) on the substrate (110). Each of the discharge patterns (330) may be disposed between the substrate (110) and the driving unit (310) in the pad area (30).

[0078] In one embodiment, each of the ground wires (340) in the pad area (30) on the substrate (110) may be electrically connected to the discharge patterns (330). Additionally, each of the ground wires (340) may be electrically connected to at least one of the input pads (311).

[0079] In one embodiment, ground wiring (340) can connect at least one of the input pads (311) with the discharge patterns (330). For example, each of the first extensions of the ground wiring (340) that are spaced apart from each other in the second direction (D2) is connected to the discharge patterns (330), and a second extension of the ground wiring (340) that extends in the second direction (D2) is connected to each of the first extensions, and a third extension of the ground wiring (340) can connect the second extension to at least one of the input pads (311). Accordingly, static electricity introduced into the driving unit (310) during the manufacturing process of the display device (100) can be induced into the discharge patterns (330) and discharged to the outside through the ground wiring (340) and the input pads (311).

[0080] Conventional display devices lacked metal patterns capable of inducing static electricity from the outside, so the driving unit was damaged due to static electricity entering the driving unit during the manufacturing process of the display device. In particular, static electricity entering the output pads damaged the components inside the driving unit.

[0081] In the display device (100) of the present invention, discharge patterns (330) containing a metal material may be disposed in a pad area (30) on a substrate (110), and each of the input pads (311) may be electrically connected to the discharge patterns (330) through ground wiring (340). Accordingly, static electricity introduced into the driving unit (310) during the manufacturing process of the display device (100) can be induced into the discharge patterns (330) and discharged to the outside through the ground wiring (340) and the input pads (311). As a result, damage to the driving unit (310) caused by the introduction of static electricity can be prevented.

[0082] FIG. 7 is a cross-sectional view taken along the line II-II' of FIG. 6. For example, FIG. 7 is a cross-sectional view showing an example of a discharge pattern (330) and ground wiring (340) placed in the pad area (30) of the display device (100) of FIG. 6.

[0083] Referring to FIGS. 4 and 7, the display device (100) may include a substrate (110), a gate insulating layer (120), ground wiring (340), a first interlayer insulating layer (130a), a second interlayer insulating layer (130b), a lower touch insulating layer (210), an interlayer touch insulating layer (230), a discharge pattern (330), etc. The ground wiring (340) may include a first conductive layer (341), a second conductive layer (342), and a third conductive layer (343).

[0084] A first conductive layer (341) may be disposed on a gate insulating layer (120), a second conductive layer (342) may be disposed on a second interlayer insulating layer (130a), and a third conductive layer (343) may be disposed on the second conductive layer (342). In one embodiment, the first conductive layer (341) may be disposed on the same layer as the first gate electrode (GE1) shown in FIG. 4, the second conductive layer (342) may be disposed on the same layer as the source electrode (SE) and drain electrode (DE) shown in FIG. 4, and the third conductive layer (343) may be disposed on the same layer as the connection electrode (CE) shown in FIG. 4. That is, the first conductive layer (341) may contain the same material as the first gate electrode (GE1), the second conductive layer (342) may contain the same material as the source electrode (SE) and the drain electrode (DE), and the third conductive layer (343) may contain the same material as the connection electrode (CE). For example, each of the first to third conductive layers (341, 342, 343) may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in combination with each other.

[0085] Additionally, the second conductive layer (342) can be connected to the first conductive layer (341) through a contact hole formed by removing a portion of the first and second interlayer insulating layers (130a, 130b), and the bottom surface of the third conductive layer (343) can be in direct contact with the top surface of the second conductive layer (342).

[0086] Although FIG. 7 describes the ground wiring (340) as including first to third conductive layers (341, 342, 343), the configuration of the present invention is not limited thereto. That is, the ground wiring (340) may have a multilayer structure including at least one conductive layer. For example, the ground wiring (340) may have a structure including one or two conductive layers. Optionally, the ground wiring (340) may have a structure including four or more conductive layers.

[0087] A discharge pattern (330) may be disposed on an interlayer touch insulating layer (230). In one embodiment, the discharge pattern (330) may be disposed on the same layer as the first sensing electrode pattern (240a) and the second sensing electrode pattern (240b) shown in FIG. 4. That is, the discharge pattern (330) may contain the same material as the first sensing electrode pattern (240a) and the second sensing electrode pattern (240b). For example, the discharge pattern (330) may include carbon nanotubes, transparent conductive oxide, indium tin oxide, indium gallium zinc oxide, zinc oxide, graphene, silver nanowires, copper, chromium, etc. (see FIG. 4).

[0088] Additionally, the discharge pattern (330) can be connected to the third conductive layer (343) through a contact hole formed by removing a portion of the lower touch insulating layer (210) and the interlayer touch insulating layer (230).

[0089] Although FIG. 7 describes the discharge pattern (330) being disposed on the same layer as the first and second sensing electrode patterns (240a, 240b) shown in FIG. 4, the configuration of the present invention is not limited thereto. For example, the discharge pattern (330) may be disposed on the same layer as any one of the first gate electrode (GE1), second gate electrode (GE2), drain electrode (DE), connection electrode (CE), and sensing connection pattern (220) shown in FIG. 4.

[0090] FIG. 8 is a plan view showing a pad area of ​​a display device according to another embodiment of the present invention. However, the display device (1000) illustrated in FIG. 8 may have a configuration substantially identical or similar to the display device (100) described in FIG. 1 to 7, except for the touch circuit portion (350). In FIG. 8, redundant descriptions of components substantially identical or similar to those described with reference to FIG. 1 to 7 are omitted. For example, FIG. 8 is a cross-sectional view showing an enlarged view of area 'A' of FIG. 1.

[0091] Referring to FIGS. 1 and FIGS. 8, the display device (1000) may include a driving unit (310), a plurality of output pads (312), a plurality of input pads (311), a plurality of discharge patterns (330), a plurality of ground wirings (340), a touch circuit unit (350), etc.

[0092] In one embodiment, a touch circuit (350) may be disposed around a driving unit (310) in a pad area (30) on a substrate (110). The touch circuit (350) may be electrically connected to a sensing structure (260) illustrated in FIG. 4 through touch ground wiring (351). That is, the touch circuit (350) may provide a signal necessary for driving the sensing structure (260) through the touch ground wiring (351).

[0093] In one embodiment, in the pad area (30) on the substrate (110), the touch ground wiring (351) can connect the touch circuit (350) and the discharge patterns (330). Accordingly, static electricity introduced into the driving unit (310) during the manufacturing process of the display device (1000) can be induced into the discharge patterns (330) and discharged to the outside through the ground wiring (340) and input pads (311), and can be discharged to the outside through the touch ground wiring (351) and the touch circuit (350). As a result, damage to the driving unit (310) caused by static electricity can be prevented more effectively.

[0094] FIG. 9 is a cross-sectional view taken along the line III-III' of FIG. 8. However, the display device (1000) of FIG. 9 may have a configuration substantially identical or similar to the display device (100) described in FIG. 1 to 7, except for the touch ground wiring (351) of the touch circuit part (350). In FIG. 9, redundant descriptions of components that are substantially identical or similar to the components described with reference to FIG. 1 to 7 are omitted.

[0095] Referring to FIG. 9, the display device (1000) may include a substrate (110), a gate insulating layer (120), ground wiring (340), a first interlayer insulating layer (130a), a second interlayer insulating layer (130b), a lower touch insulating layer (210), an interlayer touch insulating layer (230), a discharge pattern (330), touch ground wiring (351), etc. The ground wiring (340) may include a first conductive layer (341), a second conductive layer (342), and a third conductive layer (343).

[0096] A touch ground wiring (351) may be disposed on the lower touch insulating layer (210). In one embodiment, the touch ground wiring (351) may be disposed on the same layer as the sensing connection pattern (220) shown in FIG. 4. That is, the touch ground wiring (351) may contain the same material as the sensing connection pattern (220). For example, the touch ground wiring (351) may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in combination with each other.

[0097] Additionally, the discharge pattern (330) can be connected to the touch ground wiring (351) through a contact hole formed by removing a portion of the interlayer touch insulation layer (230).

[0098] Although FIG. 9 describes the touch ground wiring (351) being disposed on the same layer as the sensing connection pattern (220) shown in FIG. 4, the configuration of the present invention is not limited thereto. For example, the touch ground wiring (351) may be disposed on the same layer as the first and second sensing electrode patterns (240a, 240b) shown in FIG. 4. That is, the touch ground wiring (351) may contain the same material as the first and second sensing electrode patterns (240a, 240b) shown in FIG. 4.

[0099] FIG. 10 is a plan view showing a pad area of ​​another display device in another embodiment of the present invention, provided that the display device (1100) of FIG. 10 may have a configuration substantially identical or similar to the display device (100) described in FIG. 1 to 7, except for the guard pattern (360). In FIG. 10, redundant descriptions of components substantially identical or similar to those described with reference to FIG. 1 to 7 are omitted. For example, FIG. 10 is a cross-sectional view showing an enlarged view of area 'A' of FIG. 1.

[0100] Referring to FIG. 1 and FIG. 10, the display device (1100) may include a substrate (110), a driving unit (310), a plurality of output pads (312), a plurality of input pads (311), a plurality of discharge patterns (330), a plurality of ground wirings (340), a guard pattern (360), etc.

[0101] In one embodiment, a guard pattern (360) comprising a metal material may be disposed in a pad area (30) on a substrate (110). The guard pattern (360) may be disposed adjacent to the driving unit (310). Additionally, the guard pattern (360) may be disposed to overlap with at least a portion of the driving unit (310). For example, in a plan view, the guard pattern (360) may have a rectangular shape with one side open. Additionally, in a plan view, the guard pattern (360) may surround the output pads (312) and discharge patterns (330).

[0102] In one embodiment, ground wiring (340) in a pad area (30) on a substrate (110) can connect at least one of the input pads (311), discharge patterns (330), and guard patterns (360). For example, first extensions of the ground wiring (340) are spaced apart from each other in a second direction (D2), and each of the first extensions can extend in a first direction (D1) orthogonal to the second direction (D2) and be connected to a guard pattern (360). Accordingly, static electricity flowing into a specific direction of the driving unit (310) during the manufacturing process of the display device (1100) can be guided to the guard pattern (360) and discharged to the outside through the ground wiring (340) and the input pads (311). As a result, damage to the driving unit (310) caused by static electricity can be prevented more effectively.

[0103] FIG. 11 is a cross-sectional view taken along the line IV-IV' of FIG. 10. However, the display device (1100) of FIG. 11 may have a configuration substantially identical or similar to the display device (100) described in FIG. 1 through 7, except that it further includes a guard pattern (360). In FIG. 11, redundant descriptions of components that are substantially identical or similar to those described with reference to FIG. 1 through 7 are omitted.

[0104] Referring to FIG. 11, the display device (1100) may include a substrate (110), a gate insulating layer (120), ground wiring (340), a first interlayer insulating layer (130a), a second interlayer insulating layer (130b), a lower touch insulating layer (210), an interlayer touch insulating layer (230), a discharge pattern (330), a guard pattern (360), etc. The ground wiring (340) may include a first conductive layer (341), a second conductive layer (342), and a third conductive layer (343).

[0105] A guard pattern (360) may be disposed on an interlayer touch insulating layer (230). In one embodiment, the guard pattern (360) may be disposed on the same layer as the first and second sensing electrode patterns (240a, 240b). That is, the guard pattern (360) may contain the same material as the first and second sensing electrode patterns (240a, 240b). For example, the guard pattern (360) may include carbon nanotubes, transparent conductive oxide, indium tin oxide, indium gallium zinc oxide, zinc oxide, graphene, silver nanowires, copper, chromium, etc. (see FIG. 4).

[0106] In one embodiment, the guard pattern (360) may be placed on the same layer as the discharge pattern (330). Optionally, the guard pattern (360) may be placed on a different layer from the discharge pattern (330). Additionally, the guard pattern (360) may be connected to the third conductive layer (343) through a contact hole formed by removing a portion of the lower touch insulating layer (210) and the interlayer touch insulating layer (230).

[0107] Although FIG. 11 describes the guard pattern (360) being disposed on the same layer as the first and second sensing electrode patterns (240a, 240b) shown in FIG. 4, the configuration of the present invention is not limited thereto. For example, the guard pattern (360) may be disposed on the same layer as any one of the first gate electrode (GE1), second gate electrode (GE2), drain electrode (DE), connection electrode (CE), and sensing connection pattern (220) shown in FIG. 4.

[0108] FIG. 12 is a plan view showing a pad area of ​​a display device according to another embodiment of the present invention. However, the display device (1200) of FIG. 12 may have a configuration substantially identical or similar to the display device (1100) of FIG. 10, except that it further includes a touch circuit portion (350). In FIG. 12, redundant descriptions of components substantially identical or similar to those described with reference to FIG. 10 are omitted. For example, FIG. 12 is a plan view showing an enlarged view of area 'A' of FIG. 1.

[0109] Referring to FIGS. 1 and FIGS. 12, the display device (1200) may include a substrate (110), a driving unit (310), a plurality of ground wirings (340), a plurality of discharge patterns (330), a plurality of input pads (311), a plurality of output pads (312), a plurality of signal pads (320), a guard pattern (360), a touch circuit unit (350), etc.

[0110] Referring again to FIG. 8, the touch circuit portion (350) may be positioned around the driving portion (310) in the pad area (30) on the substrate (110). In one embodiment, touch ground wiring (351) may connect the touch circuit portion (350), discharge patterns (330), and guard pattern (360). Accordingly, static electricity introduced in a specific direction of the driving portion (310) during the manufacturing process of the display device (1200) can be guided to the guard pattern (360) and discharged to the outside through the ground wiring (340) and input pads (311), and discharged to the outside through the touch ground wiring (351) and the touch circuit portion (350). As a result, damage to the driving portion (310) caused by static electricity can be prevented more effectively.

[0111] Although the foregoing description refers to exemplary embodiments of the present invention, those skilled in the art will understand that various modifications and changes can be made to the present invention without departing from the spirit and scope of the invention as set forth in the following claims. Industrial applicability

[0112] The present invention may be applied to display devices and electronic devices including the same. For example, the present invention may be applied to high-resolution smartphones, mobile phones, smartpads, smartwatches, tablet PCs, vehicle navigation systems, televisions, computer monitors, laptops, etc.

[0113] Although the present invention has been described above with reference to exemplary embodiments, those skilled in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and scope of the invention as set forth in the following claims. Explanation of the symbols

[0114] 100, 1000, 1100, 1200: Display device 110: Substrate 300: Pixel structure 310: Driving unit 320: Signal pads 10: Display area 20: Bending area 30: Pad area 32: Part 1 31: Part 2 33: Part 3 34: Part 4 311: Input Pads 312: Output pads 321: Wiring 330: Discharge patterns 340: Ground wiring 350: Touch circuit section 351: Touch ground wiring 360: Guard Pattern

Claims

Claim 1 A display device comprising: a substrate including a display area and a pad area; a plurality of input pads disposed in a first portion of the pad area on the substrate; a plurality of output pads disposed in a second portion of the pad area on the substrate; a driving unit disposed on the input pads and the output pads; a plurality of discharge patterns disposed adjacent to the driving unit in the pad area on the substrate; and a plurality of ground wirings connecting at least one of the input pads and the discharge patterns in the pad area on the substrate, wherein the discharge patterns are disposed overlapping the driving unit on a plane. Claim 2 A display device according to claim 1, wherein the discharge patterns include a metallic material. Claim 3 A display device according to claim 1, wherein the input pads are spaced apart from each other in a first direction, and the discharge patterns are spaced apart from each other in a second direction different from the first direction. Claim 4 A display device according to claim 1, wherein the discharge patterns include first discharge patterns disposed in a third portion of the pad area; and second discharge patterns disposed in a fourth portion of the pad area, wherein the first and second portions of the pad area face each other, and the third and fourth portions of the pad area face each other. Claim 5 A display device according to claim 1, further comprising: a touch circuit portion disposed around the driving portion in the pad area on the substrate; and a plurality of touch ground wirings connecting the touch circuit portion and the discharge patterns. Claim 6 A display device according to claim 5, further comprising: a gate electrode disposed in the display area on the substrate; a drain electrode disposed on the gate electrode; a pixel structure disposed on the drain electrode; a connecting electrode disposed between the drain electrode and the pixel structure and connecting the drain electrode and the pixel structure; and a sensing structure disposed on the pixel structure. Claim 7 A display device according to claim 6, characterized in that each of the ground wirings has a multilayer structure comprising at least one conductive layer. Claim 8 A display device according to claim 6, wherein each of the ground wirings comprises: a first conductive layer disposed in the pad area on the substrate; a second conductive layer disposed on the first conductive layer; and a third conductive layer disposed on the second conductive layer. Claim 9 A display device according to claim 8, wherein the first conductive layer is disposed on the same layer as the gate electrode, the second conductive layer is disposed on the same layer as the drain electrode, and the third conductive layer is disposed on the same layer as the connecting electrode. Claim 10 A display device according to claim 6, wherein the sensing structure comprises: a lower touch insulating layer disposed on the pixel structure; a sensing connection pattern disposed on the lower touch insulating layer; an interlayer touch insulating layer disposed on the sensing connection pattern; and a sensing electrode pattern disposed on the interlayer touch insulating layer. Claim 11 A display device according to claim 10, wherein the discharge patterns are disposed on the same layer as any one of the gate electrode, the drain electrode, the connecting electrode, the sensing connecting pattern, and the sensing electrode pattern. Claim 12 A display device according to claim 10, characterized in that the touch ground wiring is disposed on the same layer as either the sensing connection pattern or the sensing electrode pattern. Claim 13 A display device comprising: a substrate including a display area and a pad area; a plurality of input pads disposed in a first portion of the pad area on the substrate; a plurality of output pads disposed in a second portion of the pad area on the substrate; a driving unit disposed on the input pads and the output pads; a plurality of discharge patterns disposed adjacent to the driving unit in the pad area on the substrate; a guard pattern disposed adjacent to the driving unit in the pad area on the substrate; and a plurality of ground wirings connecting at least one of the input pads, the discharge patterns, and the guard pattern in the pad area on the substrate, wherein the discharge patterns are disposed overlapping the driving unit on a plane. Claim 14 A display device according to claim 13, wherein the guard pattern has a rectangular shape with one side open. Claim 15 A display device characterized in that, in claim 13, the guard pattern is disposed on the same layer as the discharge patterns. Claim 16 A display device according to claim 13, wherein the discharge patterns and the guard patterns comprise a metallic material. Claim 17 A display device according to claim 13, wherein the guard pattern surrounds the output pads and the discharge patterns. Claim 18 A display device characterized in that, in claim 13, the guard pattern in the pad area on the substrate is arranged to overlap with at least a part of the driving part. Claim 19 A display device according to claim 13, wherein the discharge patterns include first discharge patterns disposed in a third portion of the pad area; and second discharge patterns disposed in a fourth portion of the pad area, wherein the first and second portions of the pad area face each other, and the third and fourth portions of the pad area face each other. Claim 20 A display device according to claim 13, further comprising: a touch circuit portion disposed around the driving portion in the pad area on the substrate; and a plurality of touch ground wirings connecting the touch circuit portion, the discharge patterns, and the guard pattern.

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