Antenna using high durable power feeding method

Abstract

Shipborne radar systems generally use lightweight, low-cost patch array antennas and can be continuously exposed to external shocks due to the harsh marine environment. Therefore, high durability is essential for the array antennas of shipborne radar systems. An antenna device according to an exemplary embodiment is configured by stacking multiple substrates, and the feed pins electrically connecting each substrate can maintain an electrical connection even when the alignment of the substrates is misaligned due to an external impact, thereby allowing the antenna device to maintain its function and performance even when subjected to an external impact.

Description

Technology Field

[0001] The following embodiments relate to an antenna with a high-durability feeding method, specifically an antenna composed of multiple stacked substrates that can maintain feeding even when the substrates become misaligned due to external impact. Background Technology

[0002] Recently, various studies have been conducted on Long Range Radar (LRR) capable of simultaneously detecting and tracking targets on warships, and the demand for such equipment is gradually increasing. These shipboard radar systems generally utilize lightweight, low-cost patch array antennas, which can be continuously exposed to external shocks due to the harsh marine environment. To protect the antennas from external shocks in radar systems, a method of covering the antennas with a radome structure is used. However, since the radome structure does not directly improve the durability of the antenna elements, it remains vulnerable to vibrations caused by strong external shocks, making high durability essential for the array antennas of shipboard radar systems.

[0003] Methods such as manufacturing antennas using mold technology or applying arched structures to antenna elements have been reported to improve antenna durability. Additionally, research on applying interface layers to protect the feed pins of array antennas from external shocks has also been reported. Nevertheless, these studies appear to lack technology regarding whether the antenna can function properly when the antenna elements are damaged or deformed by very strong external impacts. The problem to be solved

[0004] The following embodiments are intended to maintain the function and performance of the antenna device even when subjected to external shock.

[0005] The following embodiments aim to maintain the function and performance of an antenna composed of multiple stacked substrates even when the alignment of the substrates is misaligned due to external impact. means of solving the problem

[0006] According to an exemplary embodiment, an antenna device is provided comprising: a first substrate having a flat shape; a second substrate having a flat shape that is overlapped with the first substrate on the top of the first substrate; a first conductive portion formed of a conductive material that penetrates the first substrate; a first horizontal pad formed of a conductive material that extends from the top of the first substrate in a direction parallel to the first substrate and is connected to the first conductive portion; a second conductive portion formed of a conductive material that penetrates the second substrate; a second horizontal pad formed of a conductive material that extends from the bottom of the second substrate in a direction parallel to the second substrate and is connected to the second conductive portion and is electrically connected to the first horizontal pad; and a first radiator disposed on the top of the second substrate and connected to the second conductive portion.

[0007] Here, the second substrate may be composed of a dielectric.

[0008] In addition, a space connecting the top and bottom of the first substrate may be formed inside the first conductive part, and a space connecting the top and bottom of the second substrate may be formed inside the second conductive part.

[0009] In addition, the space formed inside the first conductive part and the space formed inside the second conductive part can be arranged in a straight line.

[0010] Here, an inner core may be located in the space formed inside the first conductive part and the space formed inside the second conductive part.

[0011] In addition, the first radiator operates by receiving power through the first conductive part, the first horizontal pad, the second horizontal pad, and the second conductive part, which are electrically connected to each other. Even if the first conductive part and the second conductive part are not positioned in a straight line due to an external shock, the electrical connection between the first conductive part, the first horizontal pad, the second horizontal pad, and the second conductive part is maintained, and the first radiator can operate by receiving power.

[0012] In addition, a power supply connector is formed at the bottom of the first substrate, and the power supply connector and the bottom of the first conductive part can be connected with a conductive material.

[0013] Here, a third substrate in the shape of a flat plate is spaced apart from the second substrate by a predetermined distance and arranged in a direction parallel to the second substrate; and a second radiator is arranged on a portion of the third substrate.

[0014] And, the second radiator can be operated by being indirectly fed from the first radiator. Effects of the invention

[0015] According to the following embodiments, the function and performance of the antenna device can be maintained even when subjected to external impact.

[0016] According to the following embodiments, in an antenna composed of multiple stacked substrates, the function and performance of the antenna can be maintained even when the alignment of the substrates is misaligned due to external impact. Brief explanation of the drawing

[0017] FIG. 1 is a drawing illustrating an environment in which an antenna according to an exemplary embodiment is applied. Figure 2 is a diagram illustrating how an antenna composed of multiple layers is destroyed or its performance is reduced due to external impact. FIG. 3 is a perspective view of an antenna according to an exemplary embodiment. FIG. 4 is a side view of an antenna according to an exemplary embodiment. FIG. 5 is a drawing showing a photograph taken of an antenna manufactured according to an exemplary embodiment. FIG. 6 is a drawing showing a photograph of an array antenna fabricated using an antenna according to an exemplary embodiment. FIG. 7 is a diagram illustrating the performance of an array antenna using an antenna according to an exemplary embodiment. FIG. 8 is a diagram illustrating the bandwidth according to impact of an array antenna using an antenna according to an exemplary embodiment. FIG. 9 is a diagram illustrating the gain of an array antenna due to impact using an antenna according to an exemplary embodiment. Specific details for implementing the invention

[0018] Hereinafter, embodiments will be described in detail with reference to the attached drawings.

[0019] FIG. 1 is a drawing illustrating an environment in which an antenna according to an exemplary embodiment is applied.

[0020] FIG. 1(a) illustrates an antenna according to an exemplary embodiment mounted on a vessel (110). The antennas according to the exemplary embodiment can be used as antenna elements to form an array antenna, and the array antenna can be used to form a beam (130) as part of a radar system to track a target (120), etc.

[0021] In recent warships (110), X-band radars capable of detecting and tracking targets (120), such as enemy aircraft at long range, are commonly used.

[0022] Figure 1(b) is a diagram illustrating the structure of an X-band radar used in ships, etc. The X-band radar is composed of a transmission / reception layer (140) and an antenna layer (150). The transmission / reception layer (140) is equipped with a transmission / reception module and has a connector (141) for coupling with the antenna layer (150).

[0023] In the antenna layer (150), a radiator (160) for receiving or radiating radio waves, a connector (151), and a feed line (161) connecting the radiator and the connector (151) and penetrating the antenna layer (150) are arranged.

[0024] As illustrated in Fig. 1(b), the radar can be configured by stacking multiple layers (140, 160) that perform different roles, and in this case, connectors are used to electrically connect each layer.

[0025] However, when the trap (110) is attacked or subjected to external impact such as waves, the parts connecting the layers of the antenna may be destroyed or the performance of the antenna may decrease.

[0027] In FIG. 1(b), a radar composed of only one antenna layer (150) is shown, but according to another embodiment, the radar may be composed of multiple antenna layers (150) stacked vertically. As the number of layers constituting the radar increases, the likelihood of the parts connecting the different layers of the antenna constituting the radar being destroyed by external impact or the antenna performance being reduced increases.

[0029] Figure 2 is a diagram illustrating how an antenna composed of multiple layers is destroyed or its performance is reduced due to external impact.

[0030] FIG. 2(a) is a drawing showing a multi-layered antenna destroyed by a lateral impact (240), and FIG. 2(b) is a drawing showing a multi-layered antenna destroyed by a vertical impact (280).

[0031] In FIG. 2, the antenna consists of a first layer (211, 251) located at the bottom and a second layer (212, 252) located at the top of the first layer (211, 251). A radiator (230, 270) capable of receiving or radiating radio waves is disposed at the top of the second layer (212, 252), and a feed line (221, 222, 261, 262) passing through the first layer (211, 251) and the second layer (212, 252) is connected to connect the radiator (230, 270) and the bottom of the first layer (211, 251). A connector used to supply power may be disposed at the bottom of the feed line (221, 222, 261, 262).

[0032] In FIG. 2(a), two layers (211, 212) are separated horizontally due to a lateral impact (240), and in FIG. 2(b), two layers (251, 252) are separated vertically due to a vertical impact (280). Accordingly, the feed lines (221, 222, 261, 262) penetrating the two layers (211, 212, 251, 252) are severed, and each layer (211, 212, 251, 252) is no longer electrically connected. Therefore, the radiator (230, 270) cannot receive power and cannot receive or radiate radio waves.

[0033] If the radar is composed solely of the antenna shown in Fig. 2, the radar may cease to function completely. Additionally, if the radar is configured using an array antenna that includes the antenna elements shown in Fig. 2, some of the antenna elements constituting the array antenna are not functioning, so the performance of the array antenna as well as the overall performance of the radar may be reduced.

[0034] Since it may be difficult to perform a mission smoothly if the radar stops functioning or its performance decreases during the mission, there is an increasing need for an antenna that can maintain an electrical connection between the layers (211, 212, 251, 252) even when the layers are separated due to an external shock (240, 280).

[0036] FIG. 3 is a perspective view of an antenna according to an exemplary embodiment.

[0037] An antenna according to an exemplary embodiment includes a first substrate (310), a second substrate (320), a third substrate (340), feed pins (312, 313, 314), a feed connector (311), and a radiator (321, 341).

[0038] The first substrate (310) is a general substrate in the shape of a flat plate and may be composed of a dielectric.

[0039] The second substrate (320) is a flat substrate made of dielectric material and is placed on top of the first substrate (310) overlapping with the first substrate (310). A first radiator (321) may be placed on top of the second substrate.

[0040] The third substrate (340) is a flat substrate made of dielectric material and is placed on top of the second substrate (320) overlapping with the second substrate (320). There is an air gap (330) between the third substrate (340) and the second substrate (320), so that the third substrate (340) and the second substrate (320) are separated by a predetermined distance. A second radiator (341) may be placed on top of the third substrate (340).

[0041] A power supply connector (311) is formed at the bottom of the first substrate (310). The power supply connector (311) is connected to the bottom of the power supply pins (312, 313, 314) by a conductive material. The power supply pins (312, 313, 314) pass through the first substrate (310) and the second substrate (320) and are connected to the first radiator (321), and the first radiator (321) is directly powered and operates using the power supply connector (311) and the power supply pins (312, 313, 314).

[0042] The second radiator (341) located on the top of the third substrate (340) can be operated by being indirectly fed from the first radiator (321).

[0043] The feed pins (312, 313, 314) shown in FIG. 3 are structured to be separated into upper and lower sections, and can maintain an electrical connection even when the first substrate (310) and the second substrate (311) are separated from each other by impact, thereby minimizing the cessation of radar function or reduction of radar performance during mission execution.

[0044] The design parameters of the antenna shown in Fig. 3 are as shown in the table below.

[0046]

[0048] Here, is the horizontal length (322) of the first radiator, and is the longitudinal length (321) of the first radiator. Also, is the horizontal length (342) of the second radiator, and is the vertical length (343) of the second radiator. is the height of the first substrate (310), and is the height of the second substrate (320), and is the height of the air gap (330), and is the height of the third substrate (340). is the distance from the center of the radiator to the via hole.

[0049] According to one aspect, the first substrate (310) may be composed of a dielectric with a relative permittivity of 4.6, the second substrate may be composed of a dielectric with a relative permittivity of 3.5, and the third substrate (340) may be composed of a dielectric with a relative permittivity of 3.5.

[0051] The structure of the feed pins (312, 313, 314) below will be explained with reference to FIG. 4.

[0053] FIG. 4 is a drawing illustrating a side view of an antenna and the structure of a feed pin according to an exemplary embodiment.

[0054] FIG. 4(a) is a side view of an antenna according to an exemplary embodiment.

[0055] A power supply connector (411) is connected to the bottom of the first substrate (410), and a power supply pin (440) is connected from the bottom of the first substrate (410) to the first radiator (421) located at the top of the first substrate (410) and the second substrate (420). The third substrate (430) is located at the top of the second substrate (420), and a power supply line, etc., may not be connected to the second radiator (431).

[0056] The feed pin (440) according to the exemplary embodiment transmits the current supplied from the feed connector (411) to the first radiator (421). If an external shock is applied to the antenna, the feed pin (440) may be separated into an upper and lower section. The feed pin (440) according to the exemplary embodiment can maintain an electrical connection even when separated into an upper and lower section.

[0058] Figure 4(b) is a drawing illustrating the structure of a power supply pin according to an exemplary embodiment.

[0059] The power supply pin can be divided into an upper part (453, 454) and a lower part (451, 452). The lower part (451, 452) of the power supply pin penetrates the first substrate (461) and is electrically connected to the power supply connector (411) at the bottom of the first substrate (461), and can be connected to the upper part (453, 454) of the power supply pin at the top of the first substrate (461).

[0060] According to one side, the lower part (451, 452) of the power supply pin can be soldered to a transmission line connected to the power supply pin at the bottom of the first substrate.

[0061] The lower part (451, 452) of the power supply pin penetrates the first substrate (461) and is composed of a first conductive part (451) made of a conductive material, and a first horizontal pad (452) made of a conductive material that extends from the top of the first substrate (461) in a direction parallel to the first substrate (461) and is connected to the first conductive part (451).

[0062] The upper part (453, 454) of the power supply pin penetrates the second substrate (462) and is composed of a second conductive part (453) made of a conductive material, and a second horizontal pad (454) made of a conductive material that extends from the bottom of the second substrate (462) in a direction parallel to the second substrate (462) and is connected to the second conductive part (453).

[0063] Here, the first conductive part (451) and the first horizontal pad (452) are connected to each other using soldering or the like, and the second conductive part (453) and the second horizontal pad (454) can also be connected to each other using soldering or the like. However, the first horizontal pad (452) and the second horizontal pad (454) are electrically connected by being adjacent to each other, and are not connected using soldering or the like.

[0064] The upper end of the second conduction part (453) can be connected to the first radiator (455).

[0065] A space connecting the upper and lower ends of the first substrate (461) may be formed inside the first conductive part (451), and a space (457) connecting the upper and lower ends of the second substrate (462) may be formed inside the second conductive part (453).

[0066] According to one aspect, the space formed inside the first conductive part (451) and the space (457) formed inside the second conductive part (453) are arranged in a straight line, and an inner core (456) may be located in this space.

[0067] The inner core (456) can support the first substrate (461) and the second substrate (462) by being soldered and fixed to the bottom of the first radiator (455) or the first substrate (461).

[0068] In FIG. 4(b), the first radiator (455) operates by receiving power through the first conductive part (451), the first horizontal pad (452), the second horizontal pad (454), and the second conductive part (453) which are electrically connected to each other.

[0070] If an external impact exceeds the limit that the inner core (456) can support, the first substrate (461) and the second substrate (462) can be separated and spaced apart from each other.

[0072] Figure 4(c) is a drawing illustrating the state of an antenna with a feed pin applied according to an exemplary embodiment receiving an external impact.

[0073] If the core (456) is destroyed due to an external impact, the first substrate (461) and the second substrate (462) may be separated from each other. In this case, the first conductive part (451) and the second conductive part (453) are not located in a straight line, but the power supply pin according to the exemplary embodiment can maintain an electrical connection between the first conductive part (451), the first horizontal pad (452), the second horizontal pad (454), and the second conductive part (453) by using horizontal pads (452, 454) that are extended in the horizontal direction.

[0074] Therefore, if a feed pin according to an exemplary embodiment is used, even if the antenna applied to the radar system receives an external shock, the electrical connection between the substrates is maintained so that the radar system can continue to operate or the degradation of the radar system's performance can be minimized.

[0076] According to one aspect, the inner core (456) may be composed of a flexible conductive material. In this case, even if the antenna is subjected to impact, the length of the inner core (456) may increase, and an electrical connection may be maintained using the inner core (456) even if the first substrate (461) and the second substrate (462) are separated.

[0078] FIG. 5 is a drawing showing a photograph taken of an antenna manufactured according to an exemplary embodiment.

[0079] Figure 5(a) is a diagram showing a side view of a hole punched in a stacked antenna substrate.

[0080] Referring to FIG. 5(a), via holes (511, 512) are drilled in each substrate, and each substrate can be assembled by aligning the positions of the via holes (511, 512).

[0082] Figure 5(b) is a drawing showing photographs taken from above and below of a hole drilled in an antenna substrate.

[0083] In the upper part of FIG. 5(b), a via hole (521) and a second horizontal pad (522) formed at the lower part of the second substrate are shown, and in the lower part of FIG. 5(b), a via hole (521) and a first horizontal pad (532) formed at the upper part of the first substrate are shown.

[0084] Figure 5 (c) is a drawing showing an inner core inserted into a hole drilled in an antenna substrate.

[0085] In the upper part of FIG. 5(c), an inner core (541) is shown inserted into a via hole, and in the lower part of FIG. 5(c), an inner core is shown soldered (542) to each substrate.

[0087] FIG. 6 is a drawing showing a photograph of an array antenna fabricated using an antenna according to an exemplary embodiment.

[0088] FIG. 6(a) illustrates an array antenna using antenna elements formed on a second substrate. A plurality of antenna elements (611, 612) are arranged on the top of the second substrate, and a cavity (613) is formed on the outer edge. According to one aspect, the operating frequency band of the antenna elements formed on the second substrate may be an X band.

[0089] FIG. 6(b) illustrates an array antenna using antenna elements formed on a third substrate. A plurality of antenna elements (621) are arranged on the top of the third substrate, and a cavity (622) is formed on the outer edge. According to one aspect, the operating frequency band of the antenna elements formed on the second substrate may be an X band.

[0090] Figure 6(c) illustrates the bottom of the first substrate. A power supply connector (631) and a cavity (632) are formed at the bottom of the first substrate, and a first conductive part or inner core is soldered (632).

[0091] FIG. 6 (d) illustrates the top of the first substrate. A via hole and a first horizontal pad (641) are formed on the top of the first substrate.

[0093] FIG. 7 is a diagram illustrating the performance of an array antenna using an antenna according to an exemplary embodiment.

[0094] Figure 7(a) shows the reflection coefficients according to frequency on a dB scale, where the horizontal axis represents frequency and the vertical axis represents the reflection coefficient of the array antenna. In Figure 7(a), the dotted line represents the result obtained through simulation, and the solid line represents the result obtained by measuring the actual fabricated antenna.

[0095] Referring to Figure 7(a), the actual fabricated antenna is found to have a bandwidth of 15.7% based on -10dB, which is judged to be similar to the bandwidth of 18.7% in the simulation.

[0096] Figure 7(b) shows the gain as a function of frequency on a dBi scale, where the horizontal axis represents frequency and the vertical axis represents the gain of the array antenna. In Figure 7(b), the dotted line represents the result obtained through simulation, and the solid line represents the result obtained by measuring the actual fabricated antenna.

[0097] Referring to Figure 7(a), the actual fabricated antenna shows a front direction gain of 5.6 dBi at 9.5 GHz, which is judged to be a value similar to the gain in the simulation.

[0099] FIG. 8 is a diagram illustrating the bandwidth according to impact of an array antenna using an antenna according to an exemplary embodiment.

[0100] FIG. 8(a) shows the bandwidth according to the intensity of the impact when there is a vertical impact, where the horizontal axis represents the intensity of the impact and the vertical axis represents the ratio of the bandwidth to the center frequency. In FIG. 8(a), the solid line with a circle represents the value for an antenna with a high-durability feed pin according to an exemplary embodiment, and the dotted line with an X mark represents the value for a general antenna without a high-durability feed pin.

[0101] Referring to Figure 8(a), it can be seen that in the case of a standard antenna without a high-durability feed pin, the bandwidth becomes '0' when a shock of 982 MPa is applied, so it no longer operates. On the other hand, it can be seen that an antenna with a high-durability feed pin maintains a bandwidth of approximately 17.1% even in an environment where a shock of 982 MPa is applied.

[0102] FIG. 8(b) shows the bandwidth according to the intensity of the impact when there is a horizontal impact, where the horizontal axis represents the intensity of the impact and the vertical axis represents the ratio of the bandwidth to the center frequency. In FIG. 8(b), the solid line with a circle represents the value for an antenna with a high-durability feed pin according to an exemplary embodiment, and the dotted line with an X mark represents the value for a general antenna without a high-durability feed pin.

[0103] Referring to Fig. 8(b), it can be seen that in the case of a standard antenna without a high-durability feed pin, the bandwidth becomes '0' when a shock exceeding 1035 MPa is applied, so it no longer operates. On the other hand, it can be seen that an antenna with a high-durability feed pin maintains approximately 16.3% of its bandwidth even in an environment where a shock of 1035 MPa is applied.

[0105] FIG. 9 is a diagram illustrating the gain of an array antenna due to impact using an antenna according to an exemplary embodiment.

[0106] FIG. 9(a) shows the magnitude of the gain according to the intensity of the impact when there is a vertical impact, where the horizontal axis represents the intensity of the impact and the vertical axis represents the magnitude of the gain. In FIG. 9(a), the solid line with a circle represents the value for an antenna with a high-durability feed pin according to an exemplary embodiment, and the dotted line with an X mark represents the value for a general antenna without a high-durability feed pin.

[0107] Referring to Figure 9(a), it can be seen that a standard antenna without a high-durability feed pin exhibits a gain of less than 0 dBi when subjected to a shock of 978 MPa, whereas an antenna with a high-durability feed pin maintains a gain of approximately 4.56 dBi even in an environment where a shock of 978 MPa is applied.

[0108] FIG. 9(b) shows the magnitude of the gain according to the intensity of the impact when there is a horizontal impact, where the horizontal axis represents the intensity of the impact and the horizontal axis represents the magnitude of the gain. In FIG. 9(b), the solid line with a circle represents the value for an antenna with a high-durability feed pin according to an exemplary embodiment, and the dotted line with an X mark represents the value for a general antenna without a high-durability feed pin.

[0109] Referring to Fig. 9(b), it can be seen that a standard antenna without a high-durability feed pin exhibits a gain of less than 0 dBi when subjected to a shock of 1070 MPa, whereas an antenna with a high-durability feed pin maintains a gain of approximately 5.1 dBi even in an environment where a shock of 1070 MPa is applied.

[0111] The method according to the embodiment may be implemented in the form of program instructions that can be executed through various computer means and recorded on a computer-readable medium. The computer-readable medium may include program instructions, data files, data structures, etc., either alone or in combination. The program instructions recorded on the medium may be those specifically designed and configured for the embodiment, or they may be those known and available to those skilled in the art of computer software. Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks, and magnetic tapes; optical recording media such as CD-ROMs and DVDs; magneto-optical media such as floptical disks; and hardware devices specifically configured to store and execute program instructions, such as ROM, RAM, and flash memory. Examples of program instructions include machine code, such as that generated by a compiler, as well as high-level language code that can be executed by a computer using an interpreter, etc. The hardware devices described above may be configured to operate as one or more software modules to perform the operation of the embodiment, and vice versa.

[0112]

[0113] Although the embodiments have been described above with reference to limited examples and drawings, those skilled in the art can make various modifications and variations from the description above. For example, suitable results can be achieved even if the described techniques are performed in a different order than described, and / or the components of the described system, structure, device, circuit, etc. are combined or assembled in a form different from described, or replaced or substituted by other components or equivalents.

[0114] ​Therefore, other implementations, other embodiments, and equivalents to the claims also fall within the scope of the claims set forth below. Explanation of the symbols

[0115] 110: Trap 120: Target 130: Beam 140: Transmitting and receiving layer 141: Connector 150: Antenna layer 151: Connector 160: Radiator 161: Feeder line

Claims

Claim 1 A first substrate having a flat shape; a second substrate having a flat shape disposed overlapping with the first substrate on the upper surface of the first substrate; a first conductive portion formed of a conductive material penetrating the first substrate; a first horizontal pad of a conductive material extending from the upper surface of the first substrate in a direction parallel to the first substrate and connected to the first conductive portion; a second conductive portion formed of a conductive material penetrating the second substrate; a second horizontal pad of a conductive material extending from the lower surface of the second substrate in a direction parallel to the second substrate and connected to the second conductive portion and electrically connected to the first horizontal pad; and a first radiator disposed on the upper surface of the second substrate and connected to the second conductive portion, wherein the first radiator receives power and operates through the first conductive portion, the first horizontal pad, the second horizontal pad, and the second conductive portion which are electrically connected to each other, and even when the first conductive portion and the second conductive portion are not positioned in a straight line due to an external impact, the first conductive portion, the first horizontal pad, the second horizontal pad, and the second conductive portion An antenna device in which an electrical connection is maintained and the first radiator receives power and operates. Claim 2 In claim 1, the second substrate is an antenna device composed of a dielectric. Claim 3 An antenna device according to claim 1, wherein a space connecting the upper and lower ends of a first substrate is formed inside the first conductive part, and a space connecting the upper and lower ends of a second substrate is formed inside the second conductive part. Claim 4 In paragraph 3, the space formed inside the first conductive part and the space formed inside the second conductive part are arranged in a straight line in an antenna device. Claim 5 An antenna device according to claim 4, wherein an inner core is located in the space formed inside the first conductive part and the space formed inside the second conductive part. Claim 6 delete Claim 7 An antenna device according to claim 1, wherein a feed connector is formed at the bottom of the first substrate, and the feed connector and the bottom of the first conductive part are connected by a conductive material. Claim 8 An antenna device according to claim 1, further comprising: a third substrate in the shape of a flat plate that is spaced apart from the second substrate by a predetermined distance and arranged in a direction parallel to the second substrate; and a second radiator disposed on the top of the third substrate. Claim 9 In claim 8, the second radiator is an antenna device that operates by being indirectly fed from the first radiator.

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