Display device

Abstract

A display device is provided. A display device according to one embodiment includes a display area comprising a plurality of pixels, a substrate having a non-display area including a pad area located around the display area, and a circuit board attached to the pad area, wherein the pad area comprises a plurality of pad electrodes arranged along a first direction on the substrate, and a first alignment mark positioned on one side of the first direction of the plurality of pad electrodes and protruding further in the thickness direction than the plurality of pad electrodes, wherein the circuit board comprises a base portion, a plurality of lead electrodes positioned on one surface of the base portion and each facing the plurality of pad electrodes, and a first alignment mark hole positioned on one side of the first direction of the plurality of lead electrodes and completely penetrating the base portion in the thickness direction, wherein the shape of the first alignment mark is identical to the shape of the first alignment mark hole, and the first alignment mark is received in the first alignment mark hole.

Description

Technology Field

[0001] The present invention relates to a display device. Background Technology

[0002] As the information society develops, the demand for display devices to display images is increasing in various forms. For example, display devices are being applied to a wide range of electronic devices, such as smartphones, digital cameras, laptop computers, navigation systems, and smart televisions. Display devices may be flat-panel displays, such as Liquid Crystal Display Devices, Field Emission Display Devices, and Organic Light Emitting Display Devices.

[0003] The driving chip functions as a data driver or a scan driver and can be mounted on the substrate of a display panel using the chip-on-glass (COG) method. The printed circuit board outputs a signal for controlling the driving chip to the driving chip and can be composed of a flexible printed circuit (FPC) that can be bent.

[0004] Meanwhile, in order to drive the screen of a display device, data voltage and / or scan signals are applied from an external device, and as the resolution of the display device increases, the number of input pad electrodes for receiving data voltage and / or scan signals from an external device must increase.

[0005] These input pad electrodes are electrically connected to lead electrodes of external devices, such as printed circuit films. To prevent screen driving failures of the display device, alignment between the input pad electrodes, which are required in large numbers at high resolution, and their corresponding lead electrodes is important. The problem to be solved

[0006] The problem that the present invention aims to solve is to provide a display device capable of reducing alignment tolerance by preventing the lifting phenomenon of lead electrodes disposed on the side of a printed circuit board attached to the pad area of ​​a display panel.

[0007] The problems of the present invention are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0008] A display device according to an embodiment for solving the above problem comprises a display area including a plurality of pixels, a substrate having a non-display area including a pad area located around the display area, and a circuit board attached to the pad area, wherein the pad area includes a plurality of pad electrodes arranged along a first direction on the substrate, and a first alignment mark located on one side of the first direction of the plurality of pad electrodes and protruding further in the thickness direction than the plurality of pad electrodes, wherein the circuit board includes a base portion, a plurality of lead electrodes disposed on one surface of the base portion and each facing the plurality of pad electrodes, and a first alignment mark hole disposed on one side of the first direction of the plurality of lead electrodes and completely penetrating the base portion in the thickness direction, wherein the shape of the first alignment mark is identical to the shape of the first alignment mark hole, and the first alignment mark is received in the first alignment mark hole.

[0009] The first alignment mark and the plurality of pad electrodes may be made of the same material.

[0010] The thickness of the plurality of pad electrodes may be 1 / 4 to 1 / 3 of the thickness of the first alignment mark.

[0011] The first alignment mark may include a first portion extending in a second direction intersecting the first direction and a second portion extending from the first portion to one side of the first direction.

[0012] The first alignment mark may further include a third part extending from the first part toward the other side of the first direction.

[0013] The first alignment mark above may have the same shape as the plurality of pad electrodes.

[0014] The apparatus further includes a second alignment mark located on the other side of the first direction of the plurality of pad electrodes and protruding further in the thickness direction than the plurality of pad electrodes, and a second alignment mark hole located on the other side of the first direction of the plurality of lead electrodes and completely penetrating the base portion in the thickness direction, wherein the shape of the second alignment mark is identical to the shape of the second alignment mark hole and the second alignment mark can be received in the second alignment mark hole.

[0015] The shape of the first alignment mark and the shape of the second alignment mark may be different.

[0016] The apparatus further includes a third alignment mark located on one side of the first direction of the first alignment mark and protruding further in the thickness direction than the plurality of pad electrodes, and a third alignment mark hole located on one side of the first direction of the first alignment mark and completely penetrating the base portion in the thickness direction, wherein the shape of the third alignment mark is identical to the shape of the third alignment mark hole and the third alignment mark can be received in the third alignment mark hole.

[0017] The apparatus further includes a third alignment mark located between the plurality of pad electrodes and protruding further in the thickness direction than the plurality of pad electrodes, and a third alignment mark hole located between the plurality of lead electrodes and completely penetrating the base portion in the thickness direction, wherein the third alignment mark can be received in the third alignment mark hole.

[0018] The above circuit board may be made of a rigid material.

[0019] On a plane, the first alignment mark may be surrounded by the inner surface of the first alignment mark hole.

[0020] The side of the first alignment mark can overlap with the inner side of the first alignment mark hole.

[0021] The anisotropic conductive film is further included, which is disposed between the pad area of ​​the substrate and the circuit board and includes an adhesive member and a plurality of conductive balls dispersed and disposed within the adhesive member, and the plurality of pad electrodes and the plurality of lead electrodes can be electrically connected through the conductive balls.

[0022] The above anisotropic conductive film is in direct contact with the side and top surfaces of the first alignment mark and the inner surface of the first alignment mark hole, and can fill the first alignment mark hole.

[0023] A display device according to another embodiment for solving the above problem comprises a display area including a plurality of pixels, a substrate having a non-display area including a pad area located around the display area, a circuit board attached to the pad area, and a plurality of driving chips arranged along a first direction on the substrate in a non-display area between the display area and the pad area and electrically connected to the plurality of pixels and the circuit board, wherein the pad area comprises a plurality of pad electrodes arranged along the first direction, and a first alignment mark positioned on one side of the first direction of the plurality of pad electrodes and protruding further toward the thickness direction than the plurality of pad electrodes, wherein the circuit board comprises a base portion including one surface and another surface opposite to the one surface, a plurality of lead electrodes disposed on the other surface of the base portion and each facing the plurality of pad electrodes, and a first alignment mark receiving portion disposed on one side of the first direction of the plurality of lead electrodes and recessed from the other surface of the base portion toward the one surface, wherein the first alignment mark and the first alignment mark receiving portion have the same shape, and the first alignment mark It is received in the first alignment mark receiving section.

[0024] The apparatus further comprises a second alignment mark located on the other side of the first direction of the plurality of pad electrodes, protruding further toward the thickness direction than the plurality of pad electrodes, and having the same shape as the first alignment mark, and a second alignment mark receiving portion located on the other side of the first direction of the plurality of lead electrodes and recessed from the other surface of the base portion toward the one surface, wherein the shape of the second alignment mark is the same as the shape of the second alignment mark receiving portion, and the second alignment mark can be received in the second alignment mark receiving portion.

[0025] The anisotropic conductive film is further included, which is disposed between the pad area of ​​the substrate and the circuit board and includes an adhesive member and a plurality of conductive balls dispersed and disposed within the adhesive member, and the plurality of pad electrodes and the plurality of lead electrodes can be electrically connected through the conductive balls.

[0026] The above anisotropic conductive film may be placed between the first alignment mark and the first alignment mark receiving portion and between the second alignment mark and the second alignment mark receiving portion.

[0027] The above anisotropic conductive film is non-overlapping with the first alignment mark, the first alignment mark receiving portion, the second alignment mark, and the second alignment mark receiving portion, and the first alignment mark is in direct contact with the first alignment mark receiving portion, and the second alignment mark can be in direct contact with the second alignment mark receiving portion.

[0028] Specific details of other embodiments are included in the detailed description and drawings. Effects of the invention

[0029] A display device according to one embodiment may include an alignment mark located on both sides of a plurality of pad electrodes and having a thickness greater than that of the plurality of pad electrodes, and an alignment mark hole located on a printed circuit board attached to a pad area and physically coupled with the alignment mark.

[0030] Accordingly, when a printed circuit board is bonded to the pad area of ​​a display panel, the lifting phenomenon of lead electrodes placed on the side of the printed circuit board due to the difference in the coefficient of thermal expansion between the substrate of the display panel and the printed circuit board can be prevented, and the alignment tolerance between the pad electrodes and the lead electrodes can be reduced.

[0031] The effects according to the embodiments are not limited to those exemplified above, and a wider variety of effects are included in this specification. Brief explanation of the drawing

[0032] FIG. 1 is a perspective view showing a display device according to one embodiment. Figure 2 is a schematic cross-sectional view of a display device according to Figure 1. FIGS. 3 and FIGS. 4 are plan views of a display panel according to one embodiment. Figure 5 is an enlarged view of area A of Figure 4. FIG. 6 is a perspective view showing a first pad area of ​​a display panel and a printed circuit board attached to the first pad area according to one embodiment. FIG. 7 is a plan view of the first pad area of ​​a display panel according to one embodiment. Figure 8 is a cross-sectional view taken along the line I-I' of Figure 7. FIG. 9 is a plan view of a printed circuit board according to one embodiment. FIG. 10 is a cross-sectional view taken along the line II-II' of FIG. 9. FIG. 11 is a plan view showing a first pad area of ​​a display panel and a printed circuit board attached to the first pad area according to one embodiment. FIG. 12 is a cross-sectional view taken along the line III-III' of FIG. 11. FIG. 13 is a plan view of the first pad area of ​​a display panel according to another embodiment. FIG. 14 is a plan view of a printed circuit board according to another embodiment. FIG. 15 is a plan view of the first pad area of ​​a display panel according to another embodiment. FIG. 16 is a plan view of the first pad area of ​​a display panel according to another embodiment. FIG. 17 is a plan view of the first pad area of ​​a display panel according to another embodiment. FIG. 18 is a plan view of the first pad area of ​​a display panel according to another embodiment. FIG. 19 is a cross-sectional view taken along the line III-III' of FIG. 11 according to another embodiment. FIG. 20 is a perspective view of a printed circuit board according to another embodiment. FIG. 21 is a plan view of a printed circuit board according to another embodiment. FIG. 22 is a cross-sectional view taken along the line IV-IV' of FIG. 21. FIG. 23 is a plan view showing a first pad area of ​​a display panel and a printed circuit board attached to the first pad area according to another embodiment. FIG. 24 is a cross-sectional view taken along the line V-V' of FIG. 23. Specific details for implementing the invention

[0033] The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims.

[0034] When an element or layer is referred to as being "on" another element or layer, this includes all cases where another layer or element is interposed directly on or in the middle of another element. Throughout the specification, the same reference numerals refer to the same components. Shapes, sizes, ratios, angles, numbers, etc., disclosed in the drawings for describing embodiments are exemplary, and therefore the present invention is not limited to the depicted details.

[0035] Although terms such as "first," "second," etc., are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may also be the second component within the technical scope of the present invention.

[0036] Specific embodiments will be described below with reference to the attached drawings.

[0037] FIG. 1 is a perspective view showing a display device according to one embodiment. FIG. 2 is a schematic cross-sectional view of the display device according to FIG. 1.

[0038] The thickness direction of the display device (1) is indicated by the third direction (DR3). The front (or top) and back (or bottom) surfaces of each component described below are distinguished by the third direction (DR3). However, the illustrated first to third directions (DR1, DR2, DR3) are merely examples. Hereinafter, the first to third directions are defined as the direction indicated by each of the first to third directions (DR1, DR2, DR3), and refer to the same reference numerals.

[0039] Referring to FIGS. 1 and 2, the display device (1) displays a video or a still image. The display device (1) may refer to any electronic device that provides a display screen. For example, a television, laptop, monitor, billboard, Internet of Things, mobile phone, smartphone, tablet PC (Personal Computer), electronic watch, smart watch, watch phone, head-mounted display, mobile communication terminal, electronic notebook, electronic book, PMP (Portable Multimedia Player), navigation, game console, digital camera, camcorder, etc. that provide a display screen may be included in the display device (1).

[0040] The display device (1) includes a display panel (10) that provides a display screen. Examples of the display panel (10) include an LED display panel, an organic light-emitting display panel, a quantum dot light-emitting display panel, a plasma display panel, a field emission display panel, etc. In the following description, an LED display panel is used as an example of a display panel, but it is not limited thereto, and the same technical concept can be applied to other display panels as long as it is applicable.

[0041] As illustrated in FIG. 1, the display device (1) may include a display area (DA) for displaying an image and a non-display area (NDA) disposed around the display area (DA). That is, the display area (DA) may be parallel to the plane defined by the first direction (DR1) and the second direction (DR2). The non-display area (NDA) is defined along the border of the display area (DA).

[0042] The display area (DA) may be a rectangular shape with vertical corners or a rectangular shape with rounded corners on a plane. The planar shape of the display area (DA) is not limited to a rectangle and may have a circular, elliptical, or various other shapes. The non-display area (NDA) may be positioned adjacent to the four sides of the display area (DA). The non-display area (NDA) may form the bezel of the display device.

[0043] The display area (DA) may include a plurality of pixels. The plurality of pixels may be arranged in a matrix direction. The shape of each pixel may be a planar rectangle or a square, but is not limited thereto, and may be a rhombus shape with each side tilted toward one direction. Each pixel may be arranged alternately in a stripe type or a pentile type. Additionally, each pixel may include one or more light-emitting elements that emit light of a specific wavelength range to display a specific color.

[0044] The display panel (10) may include a first substrate (100) and a second substrate (200) disposed on the first substrate (100). Although not illustrated, the display panel (10) may further include a sealing member (not illustrated) that joins the first substrate (100) and the second substrate (200).

[0045] The first substrate (100) includes a plurality of pixels and may include a light-emitting element disposed at each pixel. The first substrate (100) may be a display substrate that provides light necessary for image display. The first substrate (100) may be a rigid substrate including a rigid material such as glass or quartz, or a flexible substrate including a flexible material such as soft glass or polyimide.

[0046] The second substrate (200) may be positioned opposite the first substrate (100). For example, the second substrate (200) may be a sealing substrate that is positioned on the first substrate (100) to encapsulate a light-emitting element. The second substrate (200) may prevent damage to the light-emitting element from air or moisture, etc. The second substrate (200) may include a transparent plate or a transparent film. For example, the second substrate (200) may include a glass material, a quartz material, etc.

[0047] The first substrate (100) is positioned across the display area (DA) and the non-display area (NDA) and may have a larger planar area than the second substrate (200). A portion of one side of the second direction (DR2) of the first substrate (100) may not overlap with the second substrate (200). For example, the first substrate (100) may protrude further toward one side of the second direction (DR2) from a long side of the second direction (DR2) that extends along the first direction (DR1) of the second substrate (200). The remaining sides of the first substrate (100) may be aligned with the remaining sides of the second substrate (200).

[0048] A non-display area (NDA) located on one side of the second direction (DR2) of the first substrate (100) that does not overlap with the second substrate (200) may include a pad area (PA).

[0049] The pad area (PA) may include a first pad area (PA1) and a second pad area (PA2). The first pad area (PA1) and the second pad area (PA2) may be areas where pad electrodes to be described later are disposed and electrically connected to a display panel (10), a driving chip (DIC) to be described later, and a printed circuit board (PCB) to be described later. That is, each of the printed circuit board (PCB) and the driving chip (DIC) to be described later may be electrically connected to the display panel (10) by the first pad area (PA1) and the second pad area (PA2).

[0050] The display device (1) may further include a printed circuit board (PCB) and a driving chip (DIC).

[0051] A printed circuit board (PCB) can be attached to the first pad area (PA1).

[0052] A printed circuit board (PCB) has a long side extended in a first direction (DR1) and a short side extended in a second direction (DR2), and can be electrically connected to a plurality of pad electrodes disposed in a first pad area (PA1) by a first anisotropic conductive film (ACF) disposed between a first pad area (PA1) and the printed circuit board (PCB).

[0053] A printed circuit board (PCB) is made of a rigid material having rigidity and may be opaque. However, it is not limited thereto, and in some embodiments, the printed circuit board (PCB) may be a flexible printed circuit film capable of bending.

[0054] In FIG. 1, a single printed circuit board (PCB) is shown attached to the first pad area (PA1) of the display panel (10), but is not limited thereto, and in some embodiments, a plurality of printed circuit boards (PCBs) may be attached to the first pad area (PA1) of the display panel (10). For example, the printed circuit boards (PCBs) may be arranged spaced apart from each other in a first direction (DR1) and attached to the first pad area (PA1).

[0055] A plurality of driving chips (DICs) may be mounted in the second pad area (PA2). The plurality of driving chips (DICs) may be arranged along a first direction (DR1) in the second pad area (PA2) located between the display area (DA) and the first pad area (PA1). The plurality of driving chips (DICs) may be electrically connected to a plurality of pad electrodes disposed in the second pad area (PA2) by a second anisotropic conductive film (ACF2) disposed between the second pad area (PA2) and the plurality of driving chips (DICs).

[0056] Multiple driving chips (DICs) can be attached to a display panel (10) using a Chip on Glass (COG), Chip on Plastic (COP), or Chip on Film (COF) method. For example, as shown in FIGS. 1 and 2, multiple driving chips (DICs) can be directly mounted in a second pad area (PA2) of the display panel (10) using a Chip on Glass (COG) method. Although FIGS. 1 and 2 show multiple driving chips (DICs) being directly mounted in a second pad area (PA2) included in a non-display area (NDA) of the display panel (10), this is not limited thereto, and in some embodiments, multiple driving chips (DICs) can be mounted on a printed circuit board (PCB) using a Chip on Film (COF) method.

[0057] FIGS. 3 and FIGS. 4 are plan views of a display panel according to one embodiment. FIG. 5 is an enlarged view of area A of FIG. 4. FIG. 6 is a perspective view showing a first pad area of ​​a display panel according to one embodiment and a printed circuit board attached to the first pad area.

[0058] Specifically, FIG. 3 is a plan view showing the appearance of a printed circuit board (PCB) before it is attached to a first pad area (PA1) of a display panel (10) according to one embodiment, and FIG. 4 is a plan view showing the appearance of a printed circuit board (PCB) attached to a first pad area (PA1) of a display panel (10) according to one embodiment.

[0059] Referring to FIGS. 3 through 6, a plurality of pixels (SP) as well as scan lines (SL), data lines (DL), and driving voltage lines (VDDL) connected to the pixels (SP) may be arranged in the display area (DA). The scan lines (SL) may be formed parallel in a first direction (DR1), and the data lines (DL) may be formed parallel in a second direction (DR2) that intersects the first direction (DR1). The driving voltage lines (VDDL) may be formed parallel in the second direction (DR2) in the display area (DA). The driving voltage lines (VDDL) formed parallel in the second direction (DR2) in the display area (DA) may be connected to each other in the non-display area (NDA).

[0060] Each pixel (SP) may be connected to at least one of the scan lines (SL), any one of the data lines (DL), and any one of the driving voltage lines (VDDL). In FIGS. 3 and 4, for convenience of explanation, each pixel (SP) is illustrated as being connected to one scan line (SL), one data line (DL), and one driving voltage line (VDDL), but is not limited thereto. For example, each of the multiple pixels (SP) may be connected to three scan lines (SL) instead of two scan lines (SL).

[0061] As described above, a pad area (PA) in which a plurality of pad electrodes (PE) are arranged may be arranged on one side of the second direction (DR2) of the non-display area (NDA). Specifically, the pad area (PA) may include a first pad area (PA1) to which a printed circuit board (PCB) is attached and which is arranged at the edge of one side of the second direction (DR2), and a second pad area (PA2) arranged between the display area (DA) and the first pad area (PA1). That is, the first pad area (PA1) and the second pad area (PA2) may be spaced apart from each other in the second direction (DR2).

[0062] A plurality of pad electrodes (PE) disposed in the pad area (PA) may include first pad electrodes (PE1), second pad electrodes (PE2), and third pad electrodes (PE3).

[0063] The area where the first pad electrodes (PE1) are placed is defined as the first pad area (PA1), and the area where the second pad electrodes (PE2) and the third pad electrode (PE3) are placed is defined as the second pad area (PA2).

[0064] In the first pad area (PA1), the first pad electrodes (PE1) may be arranged spaced apart from each other along the first direction (DR1). In the second pad area (PA2), the second pad electrodes (PE2) and the third pad electrodes (PE3) may be arranged spaced apart from each other along the first direction (DR1) to form multiple rows. That is, in the second pad area (PA2), the second pad electrodes (PE2) may be arranged spaced apart from each other along the first direction (DR1) to form a first row, and the third pad electrodes (PE3) may be arranged spaced apart from each other along the first direction (DR1) to form a second row. In other words, in the second pad area (PA2), the second pad electrodes (PE2) and the third pad electrodes (PE3) may be arranged to form two rows in a plane. However, this is not limited thereto, and the number and arrangement method of the multiple pad electrodes (PE) are not limited thereto.

[0065] As illustrated in FIGS. 3 to 5, at least some of the third pad electrodes (PE3) are each connected to a plurality of data lines (DL) extending from a display area (DA), and the second pad electrodes (PE2) and the first pad electrodes (PE) can be connected to each other through a plurality of connection signal lines (FL) extending in a second direction (DR2).

[0066] A scan driver (410) for applying scan signals to scan lines (SL) may be disposed on one side of the first direction (DR1) of the non-display area (NDA). The scan driver (410) may be connected to a driving chip (DIC) through a plurality of scan control lines (SCL). The scan driver (410) may receive scan control signals from the first pad electrodes (PE1) through a plurality of scan control lines (SCL) connected to some of the first pad electrodes (PE1) disposed in the first pad area (PA1). The scan driver (410) may generate scan signals according to the scan control signals and sequentially output the scan signals to the scan lines (SL).

[0067] Pixels (SP) to which data voltages are to be supplied are selected by the scan signals of the scan driver (410), and data voltages are supplied to the selected pixels (SP). In FIGS. 3 and 4, the scan driver (410) is shown positioned on one side of the first direction (DR1) of the non-display area (NDA), but is not limited thereto. For example, the scan driver (410) may be positioned on both the one side and the other side of the first direction (DR1) of the non-display area (NDA).

[0068] As illustrated in FIGS. 5 and 6, a printed circuit board (PCB) is disposed on one side of a base substrate (BS) facing a display panel (10) and may include a plurality of lead electrodes (LE) electrically connected to first pad electrodes (PE1). The printed circuit board (PCB) may be bonded to a first pad region (PA1) through a first anisotropic conductive film (ACF1). Each of the plurality of lead electrodes (LE) may have an approximate rectangular shape in a planar shape, but is not limited thereto.

[0069] A plurality of lead electrodes (LE) may each be arranged to overlap with a plurality of first pad electrodes (PE1) in a plane. A plurality of lead electrodes (LE) may be arranged in a plane in a shape corresponding to a plurality of first pad electrodes (PE1). A plurality of lead electrodes (LE) may be arranged to form at least one row and / or at least one column in a plane. In FIG. 5, a plurality of lead electrodes (LE) may be arranged to form a column extending from a first pad area (PA1) to a first direction (DR1), but the number and arrangement method of the plurality of lead electrodes (LE) are not limited thereto.

[0070] The driving chip (DIC) is disposed on one side of the circuit board (DIS) facing the circuit board (DIS) and the display panel (10), and may include a plurality of first bump electrodes (BP1) electrically connected to second pad electrodes (PE2) and second bump electrodes (BP2) electrically connected to third pad electrodes (PE3). The driving chip (DIC) may be bonded to the second pad region (PA2) through a second anisotropic conductive film (ACF2). Each of the plurality of bump electrodes (BP) may have an approximate rectangular shape in a planar plane, but is not limited thereto.

[0071] A plurality of bump electrodes (BP) may each be arranged to overlap a plurality of second pad electrodes (PE2) and a third pad electrode (PE3) on a plane. A plurality of lead electrodes (LE) may be arranged on a plane in a shape corresponding to a plurality of first pad electrodes (PE1). A plurality of lead electrodes (LE) may be arranged to form at least one row and / or at least one column on a plane. In FIG. 5, a plurality of bump electrodes (BP) may be arranged to form a plurality of rows that extend in the first direction (DR1) from the second pad area (PA2) and are spaced apart from each other in the second direction (DR2), but the number and arrangement method of the plurality of bump electrodes (BP) are not limited thereto.

[0072] The planar size of the pad electrodes (PE) may be larger than that of the lead electrodes (LE) and bump electrodes (BP), but the size relationship of the pad electrodes (PE), lead electrodes (LE), and bump electrodes (BP) is not limited thereto.

[0073] The pad electrode (PE), bump electrode (BP), lead electrode (LE), data wiring (DL), and connection signal wiring (FL) may include a conductive material. Examples of conductive materials include one or more metals selected from molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu).

[0074] The first pad region (PA1) may further include a first alignment mark (AM1) and a second alignment mark (AM2) disposed on both sides of the first pad electrodes (PE1). That is, the first alignment mark (AM1) and the second alignment mark (AM2) may be disposed at the edges of both sides of the first pad region (PA1), spaced apart in a first direction (DR1) with a plurality of first pad electrodes (PE1) in between. The first alignment mark (AM1) and the second alignment mark (AM2) may protrude further in a third direction (DR3) than the first pad electrodes (PE1). A detailed description of the first alignment mark (AM1) and the second alignment mark (AM2) will be provided later.

[0075] A printed circuit board (PCB) attached to a first pad area (PA1) may further include a first alignment mark hole (AMH1) disposed on one side of the first direction (DR1) of a plurality of lead electrodes (LE), and a second alignment mark hole (AMH2) disposed on the other side of the first direction (DR1) of the plurality of lead electrodes (LE). Each of the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2) may have the same shape as the planar shape of the first alignment mark (AM1) and the second alignment mark (AM2).

[0076] When the first pad area (PA1) is attached to the printed circuit board (PCB), the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2) each overlap in the thickness direction with the first alignment mark (AM1) and the second alignment mark (AM2), respectively, and can be physically coupled. That is, the first alignment mark (AM1) and the second alignment mark (AM2) each are inserted from one side of the printed circuit board (PCB) toward the other side and can be physically coupled to the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2). In other words, the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2) each surround the first alignment mark (AM1) and the second alignment mark (AM2) on a plane, and the first alignment mark (AM1) and the second alignment mark (AM2) each can be accommodated in the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2).

[0077] A detailed description of the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2) will be provided later.

[0078] FIG. 7 is a plan view of a first pad area of ​​a display panel according to one embodiment. FIG. 8 is a cross-sectional view taken along line I-I' of FIG. 7. FIG. 9 is a plan view of a printed circuit board according to one embodiment. FIG. 10 is a cross-sectional view taken along line II-II' of FIG. 9. FIG. 11 is a plan view showing a first pad area of ​​a display panel according to one embodiment and a printed circuit board attached to the first pad area. FIG. 12 is a cross-sectional view taken along line III-III' of FIG. 11.

[0079] Referring to FIGS. 7 and 8, the first pad region (PA1) may include first pad electrodes (PE1) arranged extending along a first direction (DR1), a first alignment mark (AM1) disposed on one side of the first direction (DR1) of the first pad electrodes (PE1), and a second alignment mark (AM2) disposed on the other side of the first direction (DR1) of the first pad electrodes (PE1).

[0080] The first alignment mark (AM1) may include a first portion (AM1_1) extended in a second direction (DR2) in a plane and a second portion (AM1_2) extending from the center of the first portion (AM1_1) toward one side of the first direction (DR1). However, it is not limited thereto, and in some embodiments, the second portion (AM1_2) of the first alignment mark (AM1) may extend from one side or the other side of the second direction (DR2) of the first portion (AM_1) of the first alignment mark (AM1) toward one side or the other side of the first direction (DR1).

[0081] The second alignment mark (AM2) may have the same shape as the first alignment mark (AM1) in a plane, but may be arranged symmetrically with respect to the first alignment mark (AM1). That is, the second alignment mark (AM2) may include a first part (AM2_1) extended in the second direction (DR2) and a second part (AM2_2) extended from the center of the first part (AM2_1) toward the other side of the first direction (DR1). However, it is not limited thereto, and in some embodiments, the second part (AM2_2) of the second alignment mark (AM2) may be extended from one side or the other side of the second direction (DR2) of the first part (AM2_1) toward one side or the other side of the first direction (DR1). In some other embodiments, the first alignment mark (AM1) and the second alignment mark (AM2) have the same shape in a planar plane, and the extension directions of the second part (AM1_2) of the first alignment mark (AM1) and the second part (AM2_2) of the second alignment mark (AM2) may be the same. However, this is not limited thereto, and in some embodiments, the shape of the first alignment mark (AM1) and the shape of the second alignment mark (AM2) may be different.

[0082] The first portion (AM1_1) of the first alignment mark (AM1) on the plane, the first portion (AM2_1) of the second alignment mark (AM2), and the length (d1) of the second direction (DR2) of the first pad electrodes (PE1) may be the same as each other. However, this is not limited thereto, and in some embodiments, the length of the second direction (DR2) of the first portion (AM_1) of the first alignment mark (AM1) on the plane and the first portion (AM2_1) of the second alignment mark (AM2) on the plane may be different from the length of the second direction (DR2) of the first pad electrodes (PE1). For example, the first portion (AM_1) of the first alignment mark (AM1) on the plane and the first portion (AM2_1) of the second alignment mark (AM2) on the plane may be arranged to extend further toward one side or the other side of the second direction (DR2) than the first pad electrodes (PE1). In some other embodiments, the planar first pad electrodes (PE1) may be arranged to extend further toward one side or the other of the second direction (DR2) than the first part (AM1_1) of the first alignment mark (AM1) and the first part (AM2_1) of the second alignment mark (AM2).

[0083] The width (WM1) of the first part (AM1_1) of the first alignment mark (AM1) and the width (WM2) of the second part (AM1_2) may be the same. However, this is not limited thereto, and the width (WM1) of the first part (AM1_1) of the first alignment mark (AM1) and the width (WM2) of the second part (AM1_2) may be different. For example, the width (WM1) of the first part (AM_1) of the first alignment mark (AM1) may be greater than the width (WM2) of the second part (AM1_2), or the width (WM2) of the second part (AM1_2) may be greater than the width (WM1) of the first part (AM1_1).

[0084] The width (WM3) of the first part (AM2_1) of the second alignment mark (AM2) and the width (WM4) of the second part (AM2_2) may be the same. However, this is not limited thereto, and similar to the first alignment mark (AM1), the width (WM3) of the first part (AM2_1) and the width (WM4) of the second part (AM2_2) of the second alignment mark (AM2) may be different. Each of the width (WM1) of the first part (AM1_1) of the first alignment mark (AM1), the width (WM2) of the second part (AM1_2), the width (WM3) of the first part (AM2_1) of the second alignment mark (AM2), and the width (WM4) of the second part (AM2_2) may be the same as the width (WP) of the first pad electrode (PE1). However, not limited thereto, at least one of the width (WM1) of the first part (AM1_1) of the first alignment mark (AM1), the width (WM2) of the second part, the width (WM3) of the first part (AM2_1) of the second alignment mark (AM2), and the width (WM4) of the second part (AM2_2) may be different from the width (WP) of the first pad electrode (PE1).

[0085] The first alignment mark (AM1) and the second alignment mark (AM2) may protrude further toward the third direction (DR3) than the first pad electrodes (PE1). That is, the thickness (h1) of the first alignment mark (AM1) and the second alignment mark (AM2) in the third direction (DR3) may be thicker than the thickness (h2) of the first pad electrodes (PE1) in the third direction (DR3). Specifically, the thickness (h2) of the first pad electrodes (PE1) may have a thickness of 1 / 4 to 1 / 3 of the thickness (h1) of the first alignment mark (AM1) and the second alignment mark (AM2). However, the thickness (h1) of the first alignment mark (AM1) and the second alignment mark (AM2) is not limited to the above numerical range.

[0086] As the first alignment mark (AM1) and the second alignment mark (AM2) each have a thickness greater than the thickness of the first pad electrodes (PE1), they can be physically coupled to the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2) included in the printed circuit board (PCB).

[0087] The first alignment mark (AM1) and the second alignment mark (AM2) may be made of the same conductive material as the first pad electrode (PE1) described above. However, this is not limited thereto, and in some embodiments, the first alignment mark (AM1) and the second alignment mark (AM2) may be made of a material different from that of the first pad electrodes (PE1).

[0088] Referring to FIGS. 9 and 10, a printed circuit board (PCB) may include lead electrodes (LE) arranged extending along a first direction (DR1), a first alignment mark hole (AMH1) disposed on one side of the first direction (DR1) of the lead electrodes (LE), and a second alignment mark hole (AMH2) disposed on the other side of the first direction (DR1) of the lead electrodes (LE).

[0089] As described above, the first alignment mark hole (AMH1) may have the same shape as the first alignment mark (AM1). Specifically, the first alignment mark hole (AMH1), identical to the first alignment mark (AM1), may include a first part (AMH1_1) extending in a second direction (DR2) in a plane and a second part (AMH1_2) extending from the center of the first part (AMH1_1) toward one side of the first direction (DR1). However, it is not limited thereto, and in some embodiments, the second part (AMH1_2) of the first alignment mark hole (AMH1) may extend toward the first direction (DR1) from one side or the other side of the second direction (DR2) of the first part (AMH1_1) of the first alignment mark hole (AMH1).

[0090] The second alignment mark hole (AMH2) may have the same shape as the first alignment mark hole (AMH1) in a planar manner, but may be arranged symmetrically with respect to the first alignment mark hole (AMH1). That is, the second alignment mark hole (AMH2) may include a first part (AMH2_1) extended in the second direction (DR2) and a second part (AMH2_2) extended from the center of the first part (AMH2_1) toward the other side of the first direction (DR1). However, it is not limited thereto, and in some embodiments, the second part (AMH2_2) of the second alignment mark hole (AMH2) may be extended toward the first direction (DR1) from one side or the other side of the second direction (DR2) of the first part (AMH2_1) of the second alignment mark (AMH2). In some other embodiments, the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2) have the same shape in a planar plane, and the extension direction of the second part (AMH1_2) of the first alignment mark hole (AMH1) and the second part (AMH2_2) of the second alignment mark hole (AMH2) may be the same as each other.

[0091] Since the first alignment mark (AM1) and the second alignment mark (AM2) are each accommodated in the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2), the length (d2) of the second direction (DR2) of the first part (AMH1_1) of the first alignment mark hole (AMH1) and the first part (AMH2_1) of the second alignment mark hole (AMH2) on the plane may be greater than the length (d1) of the second direction (DR2) of the first part (AM1_1) of the first alignment mark (AM1) and the first part (AM2_1) of the second alignment mark (AM2) shown in FIG. 7.

[0092] Additionally, as described above in FIG. 5, since the first pad electrodes (PE1) have a larger area than the planar lead electrodes (LE), the length (d2) of the second direction (DR2) of the first part (AMH1_1) of the planar first alignment mark hole (AMH1) and the first part (AMH2_1) of the second alignment mark hole (AMH2) may be larger than the length (d3) of the second direction (DR2) of the planar lead electrodes (LE). However, this is not limited thereto, and in some embodiments, when the first pad electrodes (PE1) and lead electrodes (LE) have the same area in a planar plane, the length (d2) of the first part (AMH1_1) of the first alignment mark hole (AMH1) and the first part (AMH2_1) of the second alignment mark hole (AMH2) in a planar plane and the length (d3) of the second direction (DR2) of the lead electrodes (LE) in a planar plane may be the same.

[0093] The thickness (h3) of the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2) in the third direction (DR3), which completely penetrates the base substrate (BS) of the printed circuit board (PCB) in the third direction (DR3), that is, in the thickness direction, may be greater than the thickness (h1) of the first alignment mark (AM1) and the second alignment mark (AM2) in the third direction (DR3) shown in FIG. 8. As the thickness (h3) of the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2) is greater than the thickness (h1) of the third direction (DR3) of the first alignment mark (AM1) and the second alignment mark (AM2), when each of the first alignment mark (AM1) and the second alignment mark (AM2) is physically coupled to each of the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2), it is possible to prevent each of the first alignment mark (AM1) and the second alignment mark (AM2) from completely penetrating the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2) and being exposed to the outside. However, this is not limited thereto, and in some embodiments, the thickness (h3) of the third direction (DR3) of the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2) may be the same as the thickness (h1) of the third direction (DR3) of the first alignment mark (AM1) and the second alignment mark (AM2).

[0094] The width (WH1) of the first direction (DR1) of the first part (AMH1_1) of the first alignment mark hole (AMH1) and the width (WH2) of the first direction (DR1) of the second part (AMH1_2) may be the same. However, this is not limited thereto, and the width (WH1) of the first part (AMH1_1) of the first alignment mark hole (AMH1) and the width (WH2) of the second part (AMH1_2) may vary in correspondence with changes in the width (WM1) of the first part (AM1_1) and the width (WM2) of the second part (AM1_2) of the first alignment mark (AM1). For example, if the width (WM1) of the first part (AM_1) of the first alignment mark (AM1) is greater than the width (WM2) of the second part (AM1_2), the width (WH1) of the first part (AMH1_1) of the first alignment mark hole (AMH1) may be greater than the width (WH2) of the second part (AMH1_2).

[0095] The width (WH3) of the first part (AMH2_1) and the width (WH4) of the second part (AMH2_2) of the second alignment mark hole (AMH2) may be the same. However, this is not limited thereto, and just like the first alignment mark hole (AMH1), the width (WH3) of the first part (AMH2_1) and the width (WH4) of the second part (AMH2_2) of the second alignment mark hole (AMH2) may each vary in correspondence with the change in the width (WM3) of the first part (AM2_1) and the width (WM4) of the second part (AM2_2) of the second alignment mark (AM2).

[0096] FIGS. 11 and 12 show a printed circuit board (PCB) attached to the pad area (PA) of a first substrate (100) when the first pad electrodes (PE1) placed in the first pad area (PA1) of the first substrate (100) and the lead electrodes (LE) of the printed circuit board (PCB) are completely aligned.

[0097] Referring to FIGS. 11 and 12, a printed circuit board (PCB) and a first substrate (100) may be arranged to face each other in a first pad area (PA1) with a first anisotropic conductive film (ACF1) in between. The first anisotropic conductive film (ACF1) may include an adhesive member (RS) and a plurality of conductive balls (CB) arranged intermittently within the adhesive member (RS).

[0098] In the first pad area (PA1), the printed circuit board (PCB) is attached to the first substrate (100) by an adhesive member (RS) and can be electrically connected by a conductive ball (CB) interposed between a plurality of first pad electrodes (PE1) and a plurality of lead electrodes (LE). That is, the plurality of first pad electrodes (PE1) and the plurality of lead electrodes (LE) can be arranged to face each other in cross-section. For example, the plurality of first pad electrodes (PE1) can be arranged on the upper surface of the first substrate (100), and the plurality of lead electrodes (LE) can be arranged on the lower surface of the base substrate (BS) of the printed circuit board (PCB) facing the upper surface of the first substrate (100).

[0099] An adhesive member (RS) may be interposed between a base substrate (BS) of a printed circuit board (PCB) and a display panel (10). The adhesive member (RS) may be made of an insulating adhesive material. The adhesive member (RS) may include a thermosetting resin, a UV-curing resin, and a thermoplastic resin. For example, the adhesive member (RS) may include styrene butadiene resin, polyvinyl butylene resin, epoxy resin, polyurethane resin, acrylic resin, etc.

[0100] The conductive balls (CB) may include a conductive material, for example, a metal. The conductive balls (CB) may have a fine size and may be arranged intermittently within the adhesive member (RS). For example, the conductive balls (CB) may have a fine size of 3 μm to 15 μm in diameter and may include polymer particles and a metal coating layer such as Au, Ni, or Pd coating them. However, they are not limited thereto, and the conductive balls (CB) may be nanowires or conductive paste made of a conductive material.

[0101] The adhesive member (RS) may include a first adhesive area, a second adhesive area, and a third adhesive area. As shown in FIG. 12, a plurality of first adhesive areas and a plurality of second adhesive areas are arranged to alternate with each other, and a third adhesive area may be arranged between the second adhesive areas.

[0102] The first adhesive region may be an area where at least a portion of the first pad electrode (PE1) and at least a portion of the lead electrode (LE) overlap in the thickness direction, i.e., the third direction (DR3). In FIG. 12, the width of the first pad electrode (PE1) is greater than the width of the lead electrode (LE), but is not limited thereto. In some embodiments, the width of the first pad electrode (PE1) may be equal to or smaller than the width of the lead electrode (LE).

[0103] The second adhesive region may be an area where the first pad electrode (PE1) and the lead electrode (LE) do not overlap in the thickness direction. The second adhesive region may be an area between a plurality of first pad electrodes (PE1) and / or between a plurality of lead electrodes (LE). The second adhesive region may be an area between a plurality of first adhesive regions.

[0104] The third adhesive area may be an area where the first alignment mark (AM1) and the second alignment mark (AM2) each overlap with the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2), respectively.

[0105] In the first adhesive region, some of the plurality of conductive balls (CB) are interposed between the first pad electrode (PE1) and the lead electrode (LE), and can be electrically connected by contacting the first pad electrode (PE1) and the lead electrode (LE).

[0106] In the second adhesive area, some of the other conductive balls (CB) may be arranged intermittently in the space between the plurality of first pad electrodes (PE1) and / or between the plurality of lead electrodes (LE).

[0107] In the third adhesive area, the first alignment mark (AM1) and the second alignment mark (AM2) can each be physically coupled to the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2), respectively, with an adhesive member (RS) in between. That is, a portion of the first part (AM1_1) and the second part (AM1_2) of the first alignment mark (AM1) are received in the first part (AMH1_1) and the second part (AMH1_2) of the first alignment mark hole (AMH1), respectively, and can be physically coupled.

[0108] Specifically, when a printed circuit board (PCB) is attached to a first pad area (PA1) of a first substrate (100), a first alignment mark (AM1) that protrudes further in a third direction (DR3) than the first pad electrodes (PE1) can be received within a first alignment mark hole (AMH1) that overlaps in the thickness direction. In other words, a first part (AM1_1) of the first alignment mark (AM1) can be received in the first part (AMH1_1) of the first alignment mark hole (AMH1), and a second part (AM1_2) of the first alignment mark (AM1) can be received in the second part (AMH1_2) of the first alignment mark hole (AMH1).

[0109] At least a portion of the side of the first part (AM1_1) of the first alignment mark (AM1) may overlap with at least a portion of the inner surface of the first part (AMH1_1) of the first alignment mark hole (AMH1) in the second direction (DR2). That is, at least a portion of the side of the first part (AM1_1) of the first alignment mark (AM1) may face at least a portion of the inner surface of the first part (AMH1_1) of the first alignment mark hole (AMH1) in the second direction (DR2) with the adhesive member (RS) in between.

[0110] Likewise, at least a portion of the side of the second portion (AM1_2) of the first alignment mark (AM1) may face at least a portion of the inner surface of the second portion (AMH1_2) of the first alignment mark hole (AMH1) in the second direction (DR2) with an adhesive member (RS) in between. The adhesive member (RS) may come into direct contact with the side of the first alignment mark (AM1) that does not overlap with the inner surface of the first alignment mark hole (AMH1).

[0111] Accordingly, the bonding force between the first alignment mark (AM1) and the first alignment mark hole (AMH1) can be improved by the contact member (RS) located between the first alignment mark (AM1) and the first alignment mark hole (AMH1).

[0112] Additionally, the adhesive member (RS) covers the upper surface of the first alignment mark (AM1) and can fill at least a portion of the first alignment mark hole (AMH1). Thus, the adhesive member (RS) located on the upper surface of the first alignment mark (AM1) may be exposed by the first alignment mark hole (AMH1) in a planar manner. However, it is not limited thereto, and in some embodiments, the adhesive member (RS) may fill the entire space within the first alignment mark hole (AMH1) excluding the space in which the first alignment mark (AM1) is accommodated.

[0113] Although the above explanation was based on the first alignment mark (AM1) and the first alignment mark hole (AMH1), the same explanation can be applied to the second alignment mark (AM2) and the second alignment mark hole (AMH2).

[0114] The density of conductive balls (CB) distributed in the first adhesive area may be greater than the density of conductive balls (CB) distributed in the second adhesive area. The density of conductive balls (CB) may be the number of conductive balls (CB) placed in the first adhesive area or the second adhesive area. In other words, the density of conductive balls (CB) placed on a plurality of first pad electrodes (PE1) and / or a plurality of lead electrodes (LE) may be greater than the density of conductive balls (CB) placed in the space between the plurality of first pad electrodes (PE1) and / or a plurality of lead electrodes (LE). Such a difference in the density of conductive balls (CB) may be due to the alignment of conductive balls (CB) by an electric field before the curing of the adhesive member (RS). Although not shown in FIG. 12, conductive balls (CB) may be placed only in the first adhesive area, and conductive balls (CB) may not be placed in the second adhesive area.

[0115] Additionally, although FIG. 12 shows that no conductive balls (CB) are placed in the third adhesive area, conductive balls (CB) may be placed in the third adhesive area, but the density may be lower than that of the conductive balls (CB) placed in the first adhesive area. In other words, conductive balls (CB) may be scattered within the adhesive member (RS) located between the upper surface of the first alignment mark (AM) and the first alignment mark (AM1) and the first alignment mark hole (AMH1).

[0116] The thickness of the adhesive member (RS) located in the first adhesive region, the second adhesive region, and the third adhesive region may be different. Specifically, the thickness of the adhesive member (RS) located in the second adhesive region is thicker than the thickness of the adhesive member (RS) located in the first adhesive region and the third adhesive region, and the thickness of the adhesive member (RS) located in the first adhesive region may be thicker than the thickness of the adhesive member (RS) located in the third adhesive region.

[0117] Additionally, the thickness of the adhesive member (RS) located between the side of the first alignment mark (AM1) and the inner surface of the first alignment mark hole (AMH1) and between the side of the second alignment mark (AM2) and the inner surface of the second alignment mark hole (AMH2) in the third adhesive area may be thinner than the thickness of the adhesive member (RS) located on the upper surface of the first alignment mark (AM1) and the second alignment mark (AM2).

[0118] In this way, the difference in thickness of the adhesive member (RS) located in the first adhesive region, the second adhesive region, and the third adhesive region may be due to the difference in the combination between the components included in the first pad region (PA1) of the printed circuit board (PCB) and the first substrate (100).

[0119] In this way, a display device (1) according to one embodiment can easily bond a rigid printed circuit board (PCB) to the first pad area (PA1) of a display panel (10) by including a first alignment mark (AM1) and a second alignment mark (AM2) located on both sides of a first pad area (PA1) and a first alignment mark hole (AMH1) and a second alignment mark hole (AMH2) that are physically coupled to each of the first alignment mark (AM1) and the second alignment mark (AM2).

[0120] In addition, as the first alignment mark (AM1) and the second alignment mark (AM2) are physically bonded to the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2), respectively, the bonding strength at both edges of the printed circuit board (PCB) and the display panel (10) can be improved. Accordingly, when the printed circuit board (PCB) is bonded to the display panel (10), it is possible to prevent misalignment at both edges of the printed circuit board (PCB) due to the difference in thermal expansion coefficients between the display panel (10) and the printed circuit board (PCB), and at the same time, prevent the printed circuit board (PCB) from detaching from the display panel (10) after bonding.

[0121] Other embodiments of the display device are described below. In the following embodiments, components identical to those in the previously described embodiments are referred to by the same reference numerals, and redundant descriptions are omitted or simplified, with the focus on the differences.

[0122] FIG. 13 is a plan view of a first pad area of ​​a display panel according to another embodiment. FIG. 14 is a plan view of a printed circuit board according to another embodiment.

[0123] Referring to FIG. 13, there is a difference in that the planar shape of the first alignment mark (AM1_a) and the second alignment mark (AM2_a) is different from that of the embodiment shown in FIG. 7.

[0124] As illustrated in FIG. 13, in this embodiment, the planar shape of the first pad electrodes (PE1) arranged along the first direction (DR1), the first alignment mark (AM1_a) disposed on one side of the first direction (DR1) of the first pad electrodes (PE1), and the second alignment mark (AM2_a) disposed on the other side of the first direction (DR1) of the first pad electrodes (PE1) may have a roughly cross shape.

[0125] The first alignment mark (AM1_a) according to the present embodiment differs from the first alignment mark (AM1) shown in FIG. 7 in that it further includes a third part (AM1_3a) extended to the other side of the first direction (DR1).

[0126] Specifically, the first alignment mark (AM1_a) may include a first part (AM1_1a) extended in a second direction (DR2) in a plane, a second part (AM1_2a) extended from the center of the first part (AM1_1a) to one side of the first direction (DR1), and a third part (AM1_3a) extended from the center of the first part (AM1_1a) to the other side of the first direction (DR1). That is, the first alignment mark (AM1_a) may have a cross shape in a plane as it includes the second part (AM1_2a) and the third part (AM1_3a) which extend symmetrically from the first part (AM1_1a) to one side and the other side of the first direction (DR1), respectively.

[0127] However, not limited thereto, in some embodiments, a second part (AM1_2a) of the first alignment mark (AM1_a) may be extended from one side or the other side of the second direction (DR2) of the first part (AM1_1a) toward one side or the other side of the first direction (DR1), and a third part (AM1_3a) may also be extended from one side or the other side of the second direction (DR2) of the first part (AM1_1a) toward one side or the other side of the first direction (DR1).

[0128] The second alignment mark (AM2_a) has the same shape as the first alignment mark (AM1_a) in a planar plane, but can be positioned on the other side of the first direction (DR1) of the first pad electrodes (PE1) symmetrically with respect to the first alignment mark (AM1_a). That is, the second alignment mark (AM2_a) can have a cross shape in a planar plane by including a second part (AM2_2a) and a third part (AM2_3a) that extend symmetrically from the first part (AM2_1a) to the other side and one side of the first direction (DR1), respectively, just like the first alignment mark (AM1_a).

[0129] However, this is not limited thereto, and in some embodiments, the planar shapes of the first alignment mark (AM1_a) and the second alignment mark (AM2_a) may differ. For example, the planar shapes of the first alignment mark (AM1_a) and the second alignment mark (AM2_a) may vary depending on the position or direction in which the second part (AM1_2a) and the third part (AM1_3a) of the first alignment mark (AM1_a) and the second part (AM2_2a) and the third part (AM2_3a) of the second alignment mark (AM2_a) are extended.

[0130] Referring to FIG. 14, there is a difference in that the planar shape of the first alignment mark hole (AMH1_a) and the second alignment mark hole (AMH2_a) is different compared to the embodiment shown in FIG. 9.

[0131] Specifically, the printed circuit board (PCB) may have lead electrodes (LE) arranged along a first direction (DR1), a first alignment mark hole (AMH1_a) disposed on one side of the first direction (DR1) of the lead electrodes (LE), and a second alignment mark hole (AMH2_a) disposed on the other side of the first direction (DR1) of the lead electrodes (LE), and may have the same planar shape as the first alignment mark (AM1_a) and the second alignment mark (AM2_a) shown in FIG. 13. That is, the alignment mark (AM1_a) and the second alignment mark (AM2_a) may have an approximate cross shape in a planar shape.

[0132] That is, the first alignment mark hole (AMH1_a) may include a first part (AMH1_1a) extended in a second direction (DR2) in a plane, a second part (AMH1_2a) and a third part (AMH1_3a) extended from the center of the first part (AMH1_1a) to one side and the other side, respectively, of the first direction (DR1).

[0133] Additionally, the second alignment mark hole (AMH2_a) may include a first part (AMH2_1a) extended in a second direction (DR2) in a plane, similar to the first alignment mark hole (AMH1_a), a second part (AMH2_2a) and a third part (AMH2_3a) extended from the center of the first part (AMH2_1a) to the other side and one side, respectively, of the first direction (DR1).

[0134] As illustrated in FIGS. 13 and 14, the shapes of the first alignment mark hole (AMH1_a) and the second alignment mark hole (AMH2_a) may have various shapes corresponding to the shapes of the first alignment mark (AM1_a) and the second alignment mark (AM2_a) to accommodate the first alignment mark (AM1_a) and the second alignment mark (AM2_a) while physically coupled with the first alignment mark (AM1_a) and the second alignment mark (AM2_a), respectively.

[0135] FIG. 15 is a plan view of the first pad area of ​​a display panel according to another embodiment.

[0136] Referring to FIG. 15, compared to the embodiment shown in FIG. 7, there is a difference in that the first alignment mark (AM1_b) and the second alignment mark (AM2_b) have different planar shapes.

[0137] As illustrated in FIG. 15, in this embodiment, the shape of the first pad electrodes (PE1) arranged extending along the first direction (DR1), the first alignment mark (AM1_b) disposed on one side of the first direction (DR1) of the first pad electrodes (PE1), and the second alignment mark (AM2_b) disposed on the other side of the first direction (DR1) of the first pad electrodes (PE1) may be identical in planar shape.

[0138] Specifically, the first alignment mark (AM1_b) and the second alignment mark (AM2_b) may have an approximate rectangular shape in a plane. That is, they may have a short side extended in the first direction (DR1) and a long side extended in the second direction (DR2).

[0139] Additionally, the sizes of the first alignment mark (AM1_b) and the second alignment mark (AM2_b) may be the same as the planar sizes of the first pad electrodes (PE1). In other words, the lengths of the short side in the first direction (DR1) and the long side in the second direction (DR2) of the first alignment mark (AM1_b) and the second alignment mark (AM2_b), respectively, may be the same as the short side and long side lengths of the first pad electrodes (PE1). However, this is not limited thereto, and in some embodiments, the planar sizes of the first alignment mark (AM1_b) and the second alignment mark (AM2_b) may differ from the planar sizes of the first pad electrodes (PE1).

[0140] In the case according to the embodiments shown in FIGS. 13 to 15, just as in the case according to the embodiments shown in FIGS. 6 to 12, the printed circuit board (PCB) can be easily bonded to the first pad area (PA1) of the display panel (10) by means of an alignment mark and an alignment mark hole that is physically coupled to the alignment mark.

[0141] FIG. 16 is a plan view of the first pad area of ​​a display panel according to another embodiment.

[0142] Referring to FIG. 16, there is a difference from the embodiment shown in FIG. 7 in that a plurality of alignment marks are arranged on both sides of the first pad area (PA1).

[0143] Specifically, the first pad region (PA1) according to the present embodiment includes first pad electrodes (PE1), a first alignment mark (AM1_c) disposed on one side of the first direction (DR1) of the first pad electrodes (PE1), and a second alignment mark (AM2_c) disposed on the other side of the first direction (DR1) of the first pad electrodes (PE1). Additionally, a third alignment mark (AM3_c) and a fourth alignment mark (AM4_c) may be further included, disposed on one side of the first direction (DR1) of the first alignment mark (AM1_c) and the other side of the first direction (DR1) of the second alignment mark (AM2_c), respectively. That is, a plurality of alignment marks may be disposed on each side of the first pad region (PA1).

[0144] The first alignment mark (AM1_c) is symmetrically arranged in the first direction (DR1) with the second alignment mark (AM2_c) between the plurality of first pad electrodes (PE1), and the third alignment mark (AM3_c) and the fourth alignment mark (AM4_c) can be symmetrically arranged in the first direction (DR1) with the plurality of first pad electrodes (PE1), the first alignment mark (AM1_c), and the second alignment mark (AM2_c) between them.

[0145] In addition, the first alignment mark (AM1_c), the second alignment mark (AM2_c), the third alignment mark (AM3_c), and the fourth alignment mark (AM4_c) may have the same shape in plan as the first alignment mark (AM1) shown in FIG. 7.

[0146] The first alignment mark (AM1_c) and the third alignment mark (AM3_c) may be arranged in the same direction on one side of the first direction (DR1) of the first pad electrodes (PE1), and the second alignment mark (AM2_c) and the fourth alignment mark (AM4_c) may be arranged in the same direction on the other side of the first direction (DR1) of the first pad electrodes (PE1). However, this is not limited thereto, and in some embodiments, the arrangement direction of the first alignment mark (AM1_c) and the third alignment mark (AM3_c) and the arrangement direction of the second alignment mark (AM2_c) and the fourth alignment mark (AM4_c) may be different.

[0147] In the embodiment according to FIG. 16, two alignment marks are shown placed on each side of the first pad electrodes (PE1), but this is not limited thereto, and in some embodiments, two or more alignment marks may be placed on each side of the first pad electrodes (PE1).

[0148] FIG. 17 is a plan view of the first pad area of ​​a display panel according to another embodiment.

[0149] Referring to FIG. 17, there is a difference in that, compared to the embodiment shown in FIG. 16, the planar shape of the plurality of alignment marks arranged on one side and the other side in the first direction (DR1) of the first pad electrode (PE1) is different.

[0150] Specifically, the first alignment mark (AM1_d) disposed on one side of the first direction (DR1) of the first pad electrodes (PE1) and the second alignment mark (AM2_d) disposed on the other side of the first direction (DR1) of the first pad electrodes (PE1) have the same shape in a plane as the first alignment mark (AM1) and the second alignment mark (AM2) respectively according to the embodiment of FIG. 7, and the third alignment mark (AM3_d) and the fourth alignment mark (AM4_d) disposed on one side of the first direction (DR1) of the first alignment mark (AM1_d) and the other side of the first direction (DR1) of the second alignment mark (AM2_d) respectively have the same shape as the first alignment mark (AM1_a) and the second alignment mark (AM2_a) respectively according to the embodiment of FIG. 13.

[0151] The arrangement order of the first alignment mark (AM1_d) and the third alignment mark (AM3_d) sequentially placed on one side of the first direction (DR1) of the first pad electrodes (PE1), and the arrangement order of the second alignment mark (AM2_d) and the fourth alignment mark (AM4_d) sequentially placed on the other side of the first direction (DR1) of the first pad electrodes (PE1) are not limited to the embodiment shown in FIG. 17.

[0152] For example, a third alignment mark (AM3_d) and a first alignment mark (AM1_d) may be sequentially placed on one side of the first direction (DR1) of the first pad electrodes (PE1), and a fourth alignment mark (AM4_d) and a second alignment mark (AM2_d) may be sequentially placed on the other side of the first direction (DR1) of the first pad electrodes (PE1).

[0153] FIG. 18 is a plan view of the first pad area of ​​a display panel according to another embodiment.

[0154] Referring to FIG. 18, there is a difference in that the placement positions of the plurality of alignment marks are different compared to the embodiment shown in FIG. 16.

[0155] Specifically, a first alignment mark (AM1_e) disposed on one side of the first direction (DR1) of a plurality of first pad electrodes (PE1) and a second alignment mark (AM2_e) disposed on the other side of the first direction (DR1) of the first pad electrodes (PE1) each have the same shape in a plane as the first alignment mark (AM1) and the second alignment mark (AM2) respectively according to the embodiment of FIG. 7, and a third alignment mark (AM3_e) and a fourth alignment mark (AM4_e) have the same shape in a plane as the first alignment mark (AM1_e) and can be disposed between the first pad electrodes (PE1).

[0156] In this embodiment, the planar shape of the third alignment mark (AM3_e) and the fourth alignment mark (AM4_e) is illustrated as being identical to the planar shape of the first alignment mark (AM1_e); however, this embodiment is not limited thereto, and in some embodiments, the planar shape of the third alignment mark (AM3_e) and the fourth alignment mark (AM4_e) may be different from the planar shape of the first alignment mark (AM1_e).

[0157] For example, in some embodiments, the planar shape of the third alignment mark (AM3_e) and the fourth alignment mark (AM4_e) may have a generally cross shape, such as the planar shape of the first alignment mark (AM1_a) according to FIG. 14.

[0158] As another example, the planar shape of the third alignment mark (AM3_e) and the fourth alignment mark (AM4_e) may be identical to the planar shape of the first pad electrodes (PE1), such as the planar shape of the first alignment mark (AM1_b) according to FIG. 15.

[0159] In the embodiment illustrated in FIG. 18, the first alignment mark (AM1_e), the third alignment mark (AM3_e), the second alignment mark (AM2_e), and the fourth alignment mark (AM4_e) are shown to be spaced apart with a plurality of first pad electrodes (PE1) in between, but the number of first pad electrodes (PE1) located between the first alignment mark (AM1_e) and the third alignment mark (AM3_e) and between the second alignment mark (AM2_e) and the fourth alignment mark (AM4_e) is not limited thereto.

[0160] In the case according to the embodiments illustrated in FIGS. 16 to 18, by including a plurality of alignment marks and a plurality of alignment mark holes, the bonding strength at both edges of the printed circuit board (PCB) and the display panel (10) can be further improved. Accordingly, the printed circuit board (PCB) can be easily bonded to the first pad area (PA1) of the display panel (10), just as in the case according to the embodiments illustrated in FIGS. 6 to 12.

[0161] FIG. 19 is a cross-sectional view taken along the line III-III' of FIG. 11 according to another embodiment.

[0162] Referring to FIG. 19, there is a difference in that the area where the adhesive member (RS) of the first anisotropic conductive film (ACF1) is placed is different from the embodiment shown in FIG. 12.

[0163] In this embodiment, the adhesive member (RS) may be placed only between the first alignment mark (AM1_f) and the second alignment mark (AM2_f). That is, the first alignment mark (AM1_f) and the second alignment mark (AM2_f) may be spaced apart in the first direction (DR1) with the adhesive member (RS) in between.

[0164] Accordingly, the first alignment mark (AM1_f) and the second alignment mark (AM2_f) each come into direct contact with the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2), and can be physically joined. That is, at least a portion of the side surface of the first part (AM1_1f) of the first alignment mark (AM1_f) comes into direct contact with at least a portion of the inner surface of the first part (AMH1_1) of the first alignment mark hole (AMH1), and at least a portion of the side surface of the second part (AM1_2f) of the first alignment mark (AM1_f) comes into direct contact with at least a portion of the inner surface of the first part (AMH1_2) of the first alignment mark hole (AMH1).

[0165] As the adhesive member (RS) is positioned only between the first alignment mark (AM1_f) and the second alignment mark (AM2_f), the adhesive member (RS) is not in contact with one side of the first alignment mark (AM1_f) located on one side of the first direction (DR1), and may be in contact with a part of the other side of the first alignment mark (AM1_f) located on the other side of the first direction (DR1).

[0166] Additionally, the upper surface of the first alignment mark (AM1_f) is not placed on the adhesive member (RS), and the upper surface of the first alignment mark (AM1_f) can be directly exposed by the first alignment mark hole (AHM1).

[0167] Although the above explanation was based on the first alignment mark (AM1_f) and the first alignment mark hole (AMH1), the same explanation can be applied to the second alignment mark (AM2_f) and the second alignment mark hole (AMH2).

[0168] According to the present embodiment, since the adhesive member (RS) of the first anisotropic conductive film (ACF1) is not placed between the first alignment mark (AM1_f) and the first alignment mark hole (AMH1) and between the second alignment mark (AM2_f) and the second alignment mark hole (AMH2), the physical bonding strength between the first alignment mark (AM1_f) and the first alignment mark hole (AMH1) and between the second alignment mark (AM2_f) and the second alignment mark hole (AMH2) can be improved as the spacing between the side of the first alignment mark (AM1_f) and the inner side of the first alignment mark hole (AMH1) and the spacing between the side of the second alignment mark (AM2_f) and the inner side of the second alignment mark hole (AMH2) is reduced.

[0169] FIG. 20 is a perspective view of a printed circuit board according to another embodiment. FIG. 21 is a plan view of a printed circuit board according to another embodiment. FIG. 22 is a cross-sectional view taken along line IV-IV' of FIG. 21.

[0170] Referring to FIGS. 20 to 22, there is a difference from the embodiment shown in FIGS. 9 and FIGS. 10 in that the printed circuit board (PCB) includes a first alignment mark receiving portion (AMH1_b) and a second alignment mark receiving portion (AMH2_b) having a shape different from the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2).

[0171] Referring to FIGS. 20 to 22, a printed circuit board (PCB) may include lead electrodes (LE) arranged extending along a first direction (DR1), a first alignment mark receiving portion (AMH1_b) disposed on one side of the first direction (DR1) of the lead electrodes (LE), and a second alignment mark receiving portion (AMH2_b) disposed on the other side of the first direction (DR1) of the lead electrodes (LE).

[0172] Specifically, the base substrate (BS) of the printed circuit board (PCB) may include an upper surface and a lower surface opposite to the upper surface. A plurality of lead electrodes (LE) arranged along a first direction (DR1) may be disposed on the lower surface of the base substrate (BS). The lower surface of the base substrate (BS) may be a surface facing the first pad area (PA1) when the printed circuit board (PCB), which will be described later, is attached to the first pad area (PA1).

[0173] The first alignment mark receiving portion (AMH1_b) and the second alignment mark receiving portion (AMH2_b) may have a shape that is recessed from the lower surface of the base substrate (BS) toward the upper surface. That is, unlike the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2) according to the embodiment shown in FIGS. 9 and 10, the first alignment mark receiving portion (AMH1_b) and the second alignment mark receiving portion (AMH2_b) do not completely penetrate the printed circuit board (PCB) in the thickness direction and may have a shape that is recessed from the lower surface of the printed circuit board (PCB) toward the upper surface.

[0174] The planar shape of the first alignment mark receiving portion (AMH1_b) and the second alignment mark receiving portion (AMH2_b) may have the same shape as the planar shape of the first alignment mark hole (AMH1) and the second alignment mark hole (AMH2) according to the embodiment shown in FIG. 9.

[0175] That is, the first alignment mark receiving portion (AMH1_b) may include a first portion (AMH1_1b) extended in a second direction (DR2) in a plane and a second portion (AMH1_2b) extended from the center of the first portion (AMH1_1b) to one side of the first direction (DR1).

[0176] Similar to the first alignment mark receiving portion (AMH1_b), the second alignment mark receiving portion (AMH2_b) may also include a first portion (AMH2_1b) extended in a second direction (DR2) in a plane and a second portion (AMH2_2b) extended from the center of the first portion (AMH1_1b) to the other side of the first direction (DR1). However, this is not limited thereto, and the planar shapes of the first alignment mark receiving portion (AMH1_b) and the second alignment mark receiving portion (AMH2_b) may have various shapes corresponding to the shape of the alignment mark placed in the first pad area (PA1), as described above.

[0177] The depth (h4) in the third direction (DR3), that is, the thickness direction, of the first alignment mark receiving portion (AMH1_b) and the second alignment mark receiving portion (AMH2_b) may be smaller than the thickness (h1) in the third direction (DR3) of the first alignment mark (AM1) and the second alignment mark (AM2) shown in FIG. 8. However, this is not limited thereto, and in some embodiments, the third depth (h4) of the first alignment mark receiving portion (AMH1_b) and the second alignment mark receiving portion (AMH2_b) may be equal to or greater than the thickness (h1) in the third direction (DR3) of the first alignment mark (AM1) and the second alignment mark (AM2) shown in FIG. 8.

[0178] FIG. 23 is a plan view showing a first pad area of ​​a display panel and a printed circuit board attached to the first pad area according to another embodiment. FIG. 24 is a cross-sectional view taken along the line V-V' of FIG. 23.

[0179] Referring to FIGS. 23 and 24, the first alignment mark (AM1_g) and the second alignment mark (AM2_g) can each be physically coupled with the first alignment mark receiving portion (AMH1_b) and the second alignment mark receiving portion (AMH2_b) respectively, with an adhesive member (RS) in between. That is, the first part (AM1_1g) of the first alignment mark (AM1_g) can be received in the first part (AMH1_1b) of the first alignment mark receiving portion (AMH1_b), and the second part (AM1_2g) of the first alignment mark (AM1_g) can be received in the second part (AMH1_2b) of the first alignment mark receiving portion (AMH1_b).

[0180] Specifically, at least a portion of the side of the first part (AM1_1g) of the first alignment mark (AM1_g) may face in the second direction (DR2) with at least a portion of the inner wall of the first part (AMH1_1b) of the first alignment mark receiving part (AMH1_b) with an adhesive member (RS) in between. Likewise, at least a portion of the side of the second part (AM1_2g) of the first alignment mark (AM1_g) may face in the second direction (DR2) with at least a portion of the inner wall of the second part (AMH1_2b) of the first alignment mark receiving part (AMH1_b) with an adhesive member (RS) in between.

[0181] Additionally, the upper surface of the first alignment mark (AM1_g) may face the lower surface of the first alignment mark receiving portion (AMH1_b) with the adhesive member (RS) in between. That is, since the first alignment mark receiving portion (AMH1_b) is recessed from the lower surface of the base substrate (BS) toward the upper surface, the lower surface of the first alignment mark receiving portion (AMH1_b) may face the upper surface of the first alignment mark (AM1_g) in the third direction (DR3).

[0182] The upper surface of the first alignment mark (AM1_g) and the contact member (RS) located on the upper surface of the first alignment mark (AM1_g) can be entirely covered by the first alignment mark receiving portion (AMH1_b). Accordingly, unlike the embodiment shown in FIGS. 11 and 12, in this embodiment, when a printed circuit board (PCB) is attached to the first pad area (PA1) of the first substrate (100), the contact member (RS) located on the upper surface of the first alignment mark (AM1_g) is not exposed.

[0183] Although the above explanation was based on the first alignment mark (AM1_g) and the first alignment mark receiving portion (AMH1_b), the same explanation can be applied to the second alignment mark (AM2_g) and the second alignment mark receiving portion (AMH2_b).

[0184] In the case according to the present embodiment, as the first alignment mark (AM1_g) and the second alignment mark (AM2_g) are physically coupled to the first alignment mark receiving portion (AMH1_b) and the second alignment mark receiving portion (AMH2_b), respectively, the coupling force at both edges of the printed circuit board (PCB) and the display panel (10) can be improved, and accordingly, the alignment tolerance of the first pad electrodes (PE1) placed in the printed circuit board (PCB) and the first pad area (PA1) can be reduced.

[0185] Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention may be implemented in other specific forms without changing the technical concept or essential features thereof. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. Explanation of the symbols

[0186] 1: Display device 10: Display panel 100: First substrate 200: Second substrate PA: Pad area PCB: Printed circuit board BS: Base board DIC: Driver chip DIS: Circuit board ACF: Anisotropic conductive film PE: Pad electrode BP: Bump electrode LE: Lead electrode AM1, AM2: Alignment mark AMH1, AMH2: Alignment Mark Hole

Claims

Claim 1 A substrate having a display area including a plurality of pixels, and a non-display area located around the display area and including a pad area; A display device comprising a circuit board attached to a pad area, wherein the pad area comprises a plurality of pad electrodes arranged along a first direction on the substrate, and a first alignment mark positioned on one side of the first direction of the plurality of pad electrodes and protruding further toward the thickness direction than the plurality of pad electrodes, wherein the circuit board comprises a base portion, a plurality of lead electrodes positioned on one surface of the base portion and each facing the plurality of pad electrodes, and a first alignment mark hole positioned on one side of the first direction of the plurality of lead electrodes and completely penetrating the base portion in the thickness direction, wherein the length of the first alignment mark in a second direction orthogonal to the first direction and the length of the pad electrode are the same, and the length of the first alignment mark hole in the second direction is greater than or equal to the length of the lead electrode, wherein the shape of the first alignment mark is the same as the shape of the first alignment mark hole, and the first alignment mark is received in the first alignment mark hole. Claim 2 In claim 1, the first alignment mark and the plurality of pad electrodes are a display device made of the same material. Claim 3 A display device according to claim 1, wherein the thickness of the plurality of pad electrodes is 1 / 4 to 1 / 3 of the thickness of the first alignment mark. Claim 4 A display device according to claim 1, wherein the first alignment mark comprises a first portion extending in a second direction intersecting the first direction and a second portion extending from the first portion to one side of the first direction. Claim 5 In claim 4, the first alignment mark further comprises a third portion extending from the first portion toward the other side of the first direction. Claim 6 In claim 1, the first alignment mark is a display device having the same shape as the plurality of pad electrodes. Claim 7 A display device according to claim 1, further comprising a second alignment mark located on the other side of the first direction of the plurality of pad electrodes and protruding further in the thickness direction than the plurality of pad electrodes, and a second alignment mark hole located on the other side of the first direction of the plurality of lead electrodes and completely penetrating the base portion in the thickness direction, wherein the shape of the second alignment mark is identical to the shape of the second alignment mark hole, and the second alignment mark is received in the second alignment mark hole. Claim 8 In claim 7, the shape of the first alignment mark and the shape of the second alignment mark are different in the display device. Claim 9 A display device according to claim 7, further comprising a third alignment mark located on one side of the first direction of the first alignment mark and protruding further in the thickness direction than the plurality of pad electrodes, and a third alignment mark hole located on one side of the first direction of the first alignment mark and completely penetrating the base portion in the thickness direction, wherein the shape of the third alignment mark is the same as the shape of the third alignment mark hole, and the third alignment mark is received in the third alignment mark hole. Claim 10 A display device according to claim 7, further comprising a third alignment mark located between the plurality of pad electrodes and protruding further in the thickness direction than the plurality of pad electrodes, and a third alignment mark hole located between the plurality of lead electrodes and completely penetrating the base portion in the thickness direction, wherein the third alignment mark is received in the third alignment mark hole. Claim 11 In claim 1, the circuit board is a display device made of a rigid material. Claim 12 In claim 1, the first alignment mark on the plane is a display device surrounded by the inner surface of the first alignment mark hole. Claim 13 In claim 12, the side of the first alignment mark overlaps with the inner side of the first alignment mark hole. Claim 14 A display device according to claim 1, further comprising an anisotropic conductive film disposed between the pad area of ​​the substrate and the circuit board, the film comprising an adhesive member and a plurality of conductive balls dispersed and disposed within the adhesive member, wherein the plurality of pad electrodes and the plurality of lead electrodes are electrically connected through the conductive balls. Claim 15 In claim 14, the anisotropic conductive film is in direct contact with the side and top surfaces of the first alignment mark and the inner surface of the first alignment mark hole, and is a display device that fills the first alignment mark hole. Claim 16 A substrate having a display area including a plurality of pixels, and a non-display area located around the display area and including a pad area; a circuit board attached to the pad area; The circuit board includes a plurality of driving chips arranged along a first direction on the substrate in a non-display area between the display area and the pad area, and electrically connected to the plurality of pixels and the circuit board. The pad area includes a plurality of pad electrodes arranged along the first direction, and a first alignment mark positioned on one side of the first direction of the plurality of pad electrodes and protruding further toward the thickness direction than the plurality of pad electrodes. The circuit board includes a base portion comprising one surface and another surface opposite to the first surface, a plurality of lead electrodes disposed on the other surface of the base portion and each facing the plurality of pad electrodes, and a first alignment mark receiving portion disposed on one side of the first direction of the plurality of lead electrodes and recessed from the other surface of the base portion toward the first surface. The length of the first alignment mark in a second direction orthogonal to the first direction and the length of the pad electrode are the same, and the length of the first alignment mark receiving portion in the second direction is greater than or equal to the length of the lead electrode, and the first alignment mark and the first alignment mark receiving portion are the same. A display device having a shape, wherein the first alignment mark is received in a first alignment mark receiving portion. Claim 17 A display device according to claim 16, further comprising a second alignment mark located on the other side of the first direction of the plurality of pad electrodes, protruding further in the thickness direction than the plurality of pad electrodes, and having the same shape as the first alignment mark, and a second alignment mark receiving portion located on the other side of the first direction of the plurality of lead electrodes and recessed from the other surface of the base portion toward the first surface, wherein the shape of the second alignment mark is the same as the shape of the second alignment mark receiving portion, and the second alignment mark is received in the second alignment mark receiving portion. Claim 18 A display device according to claim 17, further comprising an anisotropic conductive film disposed between the pad area of ​​the substrate and the circuit board, the film comprising an adhesive member and a plurality of conductive balls dispersed and disposed within the adhesive member, wherein the plurality of pad electrodes and the plurality of lead electrodes are electrically connected through the conductive balls. Claim 19 In claim 18, the anisotropic conductive film is a display device placed between the first alignment mark and the first alignment mark receiving portion and between the second alignment mark and the second alignment mark receiving portion. Claim 20 A display device according to claim 18, wherein the anisotropic conductive film is non-overlapping with the first alignment mark, the first alignment mark receiving portion, the second alignment mark, and the second alignment mark receiving portion, wherein the first alignment mark is in direct contact with the first alignment mark receiving portion and the second alignment mark is in direct contact with the second alignment mark receiving portion.

Images