Determination method, program, information processing apparatus, exposure apparatus, and article manufacturing method

Abstract

[Project] Regarding the measurement of the surface shape of a substrate, we provide a technology that is advantageous for achieving both high-precision measurement and high throughput. [Solution] A method for determining multiple measurement points to perform a process of measuring the surface position of a substrate at multiple measurement points, comprising: a process of acquiring a first set of parameters including first and second parameter values ​​and acquiring a second set of parameters including third and fourth parameter values; a process of setting a first group of measurement points specified by the first set of parameters and a process of setting a second group of measurement points specified by the second set of parameters; and a process of detecting a set of measurement points among the first and second groups of measurement points in which the distance between measurement points is less than a predetermined threshold, and among the detected set, leaving one measurement point and deleting other measurement points.

Description

Technology Field

[0001] The present invention relates to a determination method, a program, an information processing device, an exposure device, and a method for manufacturing an article. Background Technology

[0002] Lithography devices, such as photolithography devices and imprint devices, are used as devices for manufacturing semiconductor devices, liquid crystal display devices, etc. As device patterns become more miniaturized, there is a demand for improved dimensional accuracy and overlapping accuracy of resist patterns. For this reason, it is considered important to measure surface features, such as flatness or curvature of the substrate, in advance (Patent Document 1).

[0003] As a method for measuring the amount of bending of a substrate, there is a method of measuring by scanning the measurement point in the radial direction while rotating the substrate (Patent Document 2). Prior art literature

[0004] Patent Publication No. 6191534 Patent Publication No. 3841452 The problem to be solved

[0005] To obtain the surface shape of a substrate with high precision, it is necessary to perform height measurements at multiple measurement points. However, increasing the number of measurement points can be disadvantageous in terms of measurement time, or measurement throughput. Conversely, if the number of measurement points is too low, the surface shape of the substrate cannot be accurately determined, which can be disadvantageous in terms of measurement precision. A method is required to easily determine multiple measurement points that strike a good balance in this trade-off relationship.

[0006] The present invention provides a technology advantageous for achieving both high-precision measurement and high throughput with respect to measuring the surface shape of a substrate. means of solving the problem

[0007] According to one aspect of the present invention, a determination method for determining a plurality of measurement points to perform a process of measuring the surface position of a substrate at a plurality of measurement points in order to specify the surface shape of the substrate comprises: a first acquisition process for acquiring a first parameter set including a first parameter value and a second parameter value; a second acquisition process for acquiring a second parameter set including a third parameter value and a fourth parameter value; a first setting process for setting a first group of measurement points specified by the acquired first parameter set; a second setting process for setting a second group of measurement points specified by the acquired second parameter set; and a deletion process for detecting a set of measurement points among the set first group of measurement points and the set second group of measurement points, wherein the distance between the measurement points is less than a predetermined threshold, and among the detected set, leaving one measurement point and deleting other measurement points, wherein the measurement point remaining after deletion in the deletion process among the first group of measurement points and the second group of measurement points is determined as the plurality of measurement points. A decision method is provided. Effects of the invention

[0008] According to the present invention, regarding the measurement of the surface shape of a substrate, a technology advantageous for achieving both high-precision measurement and high throughput can be provided. Brief explanation of the drawing

[0009] [Fig. 1] A diagram showing the configuration of an exposure device. [Fig. 2] Flowchart of a method for determining multiple measurement points. [Fig. 3] A diagram illustrating the process of determining multiple measurement points. [Fig. 4] A diagram illustrating the process of determining multiple measurement points. [Fig. 5] A drawing illustrating an example of multiple measurement points arranged on a rectangular substrate. [Fig. 6] A drawing illustrating an example of multiple measurement points arranged on a calculation grid. [Fig. 7] A drawing illustrating an example of a parameter value input screen. [Fig. 8] A drawing illustrating the configuration of the measuring device. [Fig. 9] A diagram illustrating the configuration of a host computer. Specific details for implementing the invention

[0010] Embodiments are described in detail below with reference to the attached drawings. Furthermore, the following embodiments are not intended to limit the invention related to the claims. Although multiple features are described in the embodiments, not all of these multiple features are essential to the invention, and multiple features may be combined at will. Moreover, in the attached drawings, the same reference number is attached to identical or similar components, and redundant descriptions are omitted.

[0011] <First Embodiment>

[0012] FIG. 1 is a schematic diagram of an exposure device (1) which is an example of a lithography device in an embodiment. This embodiment is applied, for example, when measuring the amount of bending of a substrate in a step-and-repeat or step-and-scan type exposure device. These methods involve moving the substrate in a direction orthogonal to the optical axis of the projection optical system and sequentially exposing the image of the mask to each shot position on the substrate located in the projection area of ​​the projection optical system.

[0013] The exposure device (1) is a type of lithography device used in the photolithography process, which is a manufacturing process of a device. The exposure device (1) exposes a substrate through a plate using a step-and-repeat method or a step-and-scan method and transfers the pattern of a mask to the substrate.

[0014] The light source (100) can output light of multiple wavelength bands as exposure light. The light emitted from the light source (100) is shaped into a predetermined shape through a shaping optical system (not shown) of the illumination optical system (104). The shaped light is incident on an optical integrator (not shown), where a plurality of secondary light sources are formed to illuminate a reticle (109), which is a plate (mask), with a uniform illumination distribution.

[0015] The shape of the opening of the aperture (105) of the lighting optical system (104) is nearly circular, and the diameter of the opening, and furthermore the number of apertures (NA) of the lighting optical system (104), can be set to a desired value by the lighting system control unit (108). In this case, since the value of the ratio of the number of apertures of the lighting optical system (104) to the number of apertures of the projection optical system (110) is the coherence factor (σ value), the lighting system control unit (108) can set the σ value by controlling the aperture (105) of the lighting optical system (104).

[0016] A half mirror (106) is placed in the optical path of the illumination optical system (104), and a portion of the exposure light illuminating the reticle (109) is reflected and extracted by this half mirror (106). A photo sensor (107) for ultraviolet light is placed in the optical path of the reflected light of the half mirror (106) and generates an output corresponding to the intensity (exposure energy) of the exposure light. A pattern of the circuit of a semiconductor device to be printed is formed on the reticle (109) and is illuminated by the illumination optical system (104). A projection optical system (110) is arranged to reduce the pattern of the reticle (109) by a reduction ratio β (e.g., β=1 / 2) and project a single shot area on a substrate (115) coated with photoresist. The projection optical system (110) may be an optical system such as a refractive or catadioptric type.

[0017] On the pupil plane (Fourier transform plane for the reticle) of the projection optical system (110), an aperture diaphragm (111) with an opening that is nearly circular is arranged, and the diameter of the opening can be controlled by an aperture diaphragm driving unit (112), such as a motor. An optical element driving unit (113) moves an optical element, such as a field lens, which constitutes part of the lens system within the projection optical system (110), along the optical axis of the projection optical system (110). Accordingly, all aberrations of the projection optical system (110) are reduced, and the projection magnification is improved to reduce distortion errors. A projection system control unit (114) controls the aperture diaphragm driving unit (112) and the optical element driving unit (113) under the control of the main control unit (103).

[0018] A substrate stage (116) holding a substrate (115) is movable in a three-dimensional direction and can move in the direction of the optical axis (Z direction) of the projection optical system (110) and in a plane orthogonal to that direction (X-Y plane). Accordingly, in FIG. 1, the Z-axis is parallel to the optical axis of the projection optical system (110) and extends in a direction from the substrate (115) toward the reticle (109), and the X-axis and Y-axis extend in mutually orthogonal directions on a plane perpendicular to the Z-axis. In FIG. 1, the Y-axis is in the ground, and the X-axis is perpendicular to the ground and in the direction in front of the ground. The X-Y plane position of the substrate stage (116) is detected by measuring the distance between the substrate stage (116) and a moving mirror (117) fixed to the substrate stage (116) using a laser interferometer (118). Additionally, the positional misalignment between the substrate (115) and the substrate stage (116) is measured using an alignment measuring instrument (124). The stage control unit (120), which is under the control of the main control unit (103), moves the substrate stage (116) to a predetermined X-Y plane position by controlling a stage driving unit (119), such as a motor, based on the measurement result using the alignment measuring instrument (124).

[0019] The light-transmitting optical system (121) and the detection optical system (122) detect the focus plane. The light-transmitting optical system (121) transmits a plurality of light beams consisting of non-exposure light that does not sensitize the photoresist on the substrate (115), and each of these light beams is collected and reflected on the substrate (115). The light beams reflected from the substrate (115) are incident on the detection optical system (122). Although not shown in the illustration, a plurality of position detection light-receiving elements are arranged within the detection optical system (122) in correspondence with each reflected light beam, and the light-receiving surface of each light-receiving element and the reflection point of each light beam on the substrate (115) are configured to be almost conjugated by the imaging optical system. The positional misalignment of the surface of the substrate (115) in the direction of the optical axis of the projection optical system (110) is measured as the positional misalignment of the light incident on the position detection light-receiving element within the detection optical system (122).

[0020] An aberration correction member (21) may be disposed in the optical path of the exposure light between the reticle (109) and the substrate (115). In the example of FIG. 1, the aberration correction member (21) is disposed between the reticle (109) and the projection optical system (110). The aberration correction member (21) may be configured as a unit independent of the projection optical system (110) or as a part of the projection optical system (110).

[0021] The main control unit (103) controls each part of the exposure device comprehensively to perform exposure processing. The main control unit (103) may be configured by an information processing device (computer device). The relevant information processing device is, for example, a PLD (abbreviation of Prandpammambale, Patoe, Age) such as FFGA (abbreviation of FFGAmmambale, Patoe, Age), or ASIC (Apsition It may be composed of a general-purpose computer with a built-in program, or a combination of all or part of these.

[0022] The exposure device (1) is connected to a host computer (information processing device), which is an external device distinct from the exposure device (1). The connection between such a host computer and the exposure device does not matter whether it is a wired connection or a wireless connection.

[0023] FIG. 9 is a block diagram illustrating an example configuration of a host computer H. A CPU (201) is a processor that executes OPRANG STEM (OS) and various application programs. A ROM (202) is a memory that stores fixed data among the parameters for programs or calculations executed by the CPU (201). A ROM (203) is a memory that provides a work area or temporary storage area for data of the CPU (201). The ROM (202) and ROM (203) are connected to the CPU (201) via the bus (208). The input device (205) may include a mouse or keyboard, etc. The display device (206) may be composed of a CRTT or a liquid crystal display, etc. The external storage device (204) may be composed of a hard disk device, CD, DVD, memory card, etc. The external storage device (204) stores various programs including a control program for exposure processing and history data (log) of exposure processing, etc. The input device (205), the display device (206), and the external storage device (204) are each connected to the bus (208) via an interface not shown. Additionally, a communication device (207) for connecting to a network and performing communication is also connected to the bus (208). The communication device (207) is used when connecting to a network N (e.g., LAN) to perform data communication using a communication protocol such as TCP / IP and to communicate with the exposure device (1). The communication device (207) functions as a data transmission and reception unit, and, for example, can receive operation information from the main control unit (103) within the exposure device (1) and record it in a log stored in an external memory device (204). Some or all of the functions of the main control unit (103) may be realized by a host computer H.

[0024] Below, the function of measuring the surface shape of the substrate (115) by the exposure device (1) is described.

[0025] The light-emitting optical system (121) and the detection optical system (122) can function as a focus detection system that projects a measurement light onto the surface of the substrate (115) for each shot area during an exposure operation to measure the surface position (height position) of the substrate (115). Furthermore, in this embodiment, the light-emitting optical system (121) and the detection optical system (122) can also function as a measuring device that measures the height position (height measurement) for each of a plurality of measurement points on the substrate (115) before an exposure operation. By measuring the height for a plurality of measurement points in advance, the flatness or amount of curvature of the substrate (115) can be determined. The main control unit (103) can control the movement of the substrate stage (116) based on the surface shape of the substrate determined from the result measured by the corresponding measuring device.

[0026] The light-transmitting optical system (121) projects a measurement light, which consists of unexposed light that does not sensitize the photoresist on the substrate (115), onto one measurement point. The measurement light reflected from the corresponding measurement point is incident on the detection optical system (122). The signal of the measurement light detected by the detection optical system (122) is transmitted to the host computer H, for example, through the main control unit (103). This processing is performed for each of the multiple measurement points. The host computer H obtains the height position at each measurement point from the signal obtained in this way, and obtains the surface shape (flatness or amount of curvature) of the substrate (115) from the height position at each measurement point.

[0027] To obtain the surface shape of a substrate with high precision, it is necessary to perform height measurements at multiple measurement points. However, increasing the number of measurement points can be disadvantageous in terms of measurement time, or measurement throughput. Conversely, if the number of measurement points is too low, the surface shape of the substrate cannot be accurately determined, which can be disadvantageous in terms of measurement precision. Below, we explain a method for easily determining multiple measurement points that strike a good balance in this trade-off relationship.

[0028] In the present embodiment, a plurality of measurement points are set on the boundary lines of the regions when the substrate is divided into regions. For example, as shown in FIG. 3(a'), the regions of the substrate are divided such that the center angles are equal by one or more straight lines (center lines) passing through the center of the circular substrate. In addition, the radius constituting the region boundary line (i.e., the center line) is divided into a predetermined number of equal parts. At that time, measurement points are set at each of the division points (including the center and the outer periphery points). FIG. 3(a) and (a') illustrate an example in which the substrate is divided into eight regions by a plurality of center lines, and each radius is divided into three regions d1, d2, and d3. The plurality of measurement points obtained in this way are referred to as "measurement points of the first group." The number of regions divided such that the center angles are equal by one or more center lines is referred to as the "angle division number" (first parameter value). In addition, the number of regions (d1, d2, d3) obtained by dividing the radius constituting their centerlines equally is called the “linear division number” (second parameter value). In the examples of FIGS. 3(a) and (a'), the angle division number (first parameter value) is 8, and the line division number (second parameter value) is 3. The measurement points of the first group are determined by the angle division number and the line division number.

[0029] In this embodiment, a second group of measurement points different from the first group of measurement points is further set. The second group of measurement points is determined by an angle division number (third parameter value) and a line division number (fourth parameter value) that are different from the angle division number and line division number determined by the first group of measurement points. In the examples of FIGS. 3(b) and (b'), the angle division number (third parameter value) is 16 and the line division number (fourth parameter value) is 4.

[0030] In addition, the parameter does not necessarily have to be the number of angle divisions or the number of line divisions. For example, as a parameter, the value of the central angle may be used instead of the number of angle divisions, and the length of the divided line segment (distance between division points) may be used instead of the number of line divisions.

[0031] In this embodiment, a plurality of measurement points are set on the boundary lines of the regions when the substrate is divided into regions.

[0032] Referring to the flowchart of FIG. 2, a determination method for determining a plurality of measurement points in the present embodiment will be explained in detail. In one example, a program corresponding to the flowchart of FIG. 2 is stored in an external memory device (204) of a host computer H. The program is loaded into an RAM (203) in accordance with a startup instruction from a CPU (201), and then executed by the CPU (201).

[0033] In S1 (first acquisition process), the CPU (201) acquires a first parameter set including at least a first parameter value and a second parameter value for setting a measurement point of the first group.

[0034] In S2 (second acquisition process), the CPU (201) acquires a second set of parameters including at least a third parameter value and a fourth parameter value for setting the measurement points of the second group. These parameter sets can be acquired through user operation via a setting screen displayed on a display device (206). For example, a setting screen such as that shown in FIG. 7 is displayed on the display device (206). The setting screen may include, for example, the following.

[0035] · Input field 701 for the number of angle divisions of the first group (first parameter value),

[0036] · Input field 702 for the number of linear divisions of the first group (second parameter value),

[0037] · Input field 703 for the number of angle divisions of the 2nd group (3rd parameter value),

[0038] · Input field 704 for the number of linear divisions of the 2nd group (4th parameter value).

[0039] Input fields 701 to 704 can be entered by user operation using an input device (205). Additionally, each input field may be in a form where the user directly inputs numerical values, or may be configured to present options via a pull-down menu or the like. In this embodiment, the distribution of measurement points between the first group and the second group must be set to be different. Therefore, the same number of angle divisions and the same number of straight line divisions cannot exist between the first group and the second group. Specifically, the number of angle divisions of the first group (first parameter value) and the number of angle divisions of the second group (third parameter value) are different from each other. Also, the number of straight line divisions of the first group (second parameter value) and the number of straight line divisions of the second group (fourth parameter value) are different from each other. In one example, the angle division number (third parameter value) is greater than the angle division number of the first group (first parameter value), and the linear division number of the second group (fourth parameter value) is greater than the linear division number of the first group (second parameter value).

[0040] In the input field 703 for the angle division number of the second group and the input field 704 for the line division number, it may be prohibited to enter a value that is the same as the value entered in the input field 701 for the angle division number of the first group and the input field 702 for the line division number, respectively.

[0041] The value entered in each input field is confirmed by pressing (clicking) the confirmation button (705). Additionally, the value entered in each input field is cleared by pressing (clicking) the cancel button (706).

[0042] In addition, instead of setting parameter values ​​through this setting screen, the configuration may be designed to acquire parameter values ​​from other external devices.

[0043] In S3 (first setting process), the CPU (201) sets the measurement points of the first group based on the first parameter set (first parameter value and second parameter value) obtained in S1. In S1, the angle division number (first parameter value) and the line division number (second parameter value) of the first group are obtained. The CPU (201) creates one or more center lines following these parameter values ​​and sets the measurement points of the first group at coordinate points on each center line. FIG. 3(a) is an example of the measurement points of the first group obtained in this way. According to S1 and S3, regarding the plane of the substrate, measurement points are set at first equal intervals on a first plurality of center lines, each having a first angle formed between the center lines.

[0044] In S4 (second setting process), the CPU (201) sets the measurement points of the second group based on the second parameter set (third parameter value and fourth parameter value) input in S2. In S2, the angle division number (third parameter value) and the line division number (fourth parameter value) of the second group are obtained. The CPU (201) creates one or more center lines following these parameter values ​​and sets the measurement points of the second group at coordinate points on each center line. FIG. 3(b) is an example of the measurement points of the second group obtained in this way. According to S2 and S4, with respect to the plane of the substrate, measurement points are set at second equal intervals different from the first equal intervals on a plurality of second center lines, each having a second angle formed between the center lines that is different from the first angle.

[0045] In S5 (deletion process), if there is a set of measurement points that overlap or approximate each other among the measurement points of the first group and the measurement points of the second group, the CPU (201) deletes the others while leaving only one measurement point for that set. For example, when comparing FIG. 3(a') and FIG. 3(b'), there may be measurement points of the first group and measurement points of the second group that overlap at the same coordinate point. For example, measurement points located at the center of the substrate are a typical example of this. Thus, the CPU (201) detects a set of measurement points among the measurement points of the first group and the measurement points of the second group in which the distance between the measurement points is smaller than a predetermined threshold. When such a set of measurement points is detected, the CPU (201) deletes the other measurement points while leaving only one measurement point in the corresponding set. For example, the CPU (201) deletes measurement points belonging to a predetermined group (e.g., the second group) among the set.

[0046] In this embodiment, individual measurement points can be added or deleted. For example, in S6, the CPU (201) adds or deletes measurement points designated by the user through the input device (205). This process is advantageous, for example, when the tendency of the surface shape of each substrate used is known in advance.

[0047] By the above processing, the CPU (201) determines the measurement points remaining after deletion in the deletion process S5 among the measurement points of the first group and the measurement points of the second group as a plurality of measurement points used to obtain the surface shape of the substrate.

[0048] According to the determination method described above, multiple measurement points balanced in the trade-off relationship with measurement time, i.e., measurement throughput, can be easily determined from a user operation perspective. Accordingly, a method for determining measurement points advantageous for achieving both high-precision measurement and high throughput is realized.

[0049] <Second Embodiment>

[0050] In the second embodiment, the area of ​​the substrate is divided into an inner circumference area including the center of the substrate and an outer circumference area outside the inner circumference area. In the first setting process S3, the CPU (201) sets a first group of measurement points in the inner circumference area. FIG. 4(a) illustrates an example of a first group of measurement points set in the inner circumference area. FIG. 4(a) is an example where the number of angle divisions is 8 and the number of line divisions is 1. Furthermore, a number of line divisions of 1 means that the corresponding line is not divided, and measurement points are set only at the intersection of the outermost edge of the inner circumference area (excluding the center) and the corresponding line.

[0051] Next, in the second setting process S4, the CPU (201) sets a second group of measurement points in the outer area. An example of a second group of measurement points set in the outer area is shown in FIG. 4(b). FIG. 4(b) is an example where the number of angle divisions is 16 and the number of line divisions is 2. Also, since the number of line divisions is 2, measurement points are set at the intersection point of the innermost edge of the outer area and the corresponding line, the intersection point of the outermost edge of the outer area and the corresponding line, and at one point between those two intersection points on the corresponding line.

[0052] FIG. 4(c) illustrates an example in which the measurement points of the first group and the measurement points of the second group are superimposed.

[0053] The second embodiment is advantageous when it is known that the surface shape tendency of each substrate used tends to differ in the inner and outer regions.

[0054] <Third Embodiment>

[0055] The processing described in the first and second embodiments is applicable not only to circular substrates but also to rectangular substrates. FIGS. 5(a) to (c) illustrate the shape in which multiple measurement points are determined for a rectangular substrate. FIG. 5(a) shows the first group of measurement points set when the number of angle divisions is 8 and the number of linear divisions is 6. Also, in the case of a rectangular substrate, since the lengths of each center line (division line) may differ, as an example, the "number of linear divisions" here represents the number of linear divisions of the longest center line among the multiple center lines. FIG. 5(b) shows the second group of measurement points set when the number of angle divisions is 16 and the number of linear divisions is 8. FIG. 5(c) shows an example in which the measurement points of the first group and the measurement points of the second group are superimposed.

[0056] Furthermore, there are no particular limitations on the means for specifying the location of the measurement point. For example, the location may be specified by the center angle of the centerline where the measurement point is set and the distance from the center on the said centerline. Alternatively, the location may be specified by coordinate values ​​in a calculation grid set within a plane representing the substrate surface. Alternatively, the location may be specified by specific coordinate values ​​in the exposure area (shot area) on the substrate. Alternatively, the location may be specified by the spacing of the curve in a spiral scan line from the center of the substrate and the spacing of measurement points on the curve.

[0057] FIGS. 6(a) to (c) illustrate an example in which, similar to the second embodiment, the area of ​​a rectangular substrate is divided into an inner circumference area including the center of the substrate and an outer circumference area outside the inner circumference area to set the first group of measurement points and the second group of measurement points. The peripheral shape of the inner circumference area resembles the peripheral shape of the substrate. For example, as shown in FIG. 4(a), the peripheral shape of the inner circumference area in the case of a circular substrate is circular. Also, as shown in FIG. 6(a), the peripheral shape of the inner circumference area in the case of a rectangular substrate is rectangular.

[0058] Here, as an example in which the first group of measurement points and the second group of measurement points are placed at equal intervals at the intersection points of a plurality of straight lines (calculation grid) arranged in a grid pattern, an example is shown in which the positions of the measurement points are indicated in a plurality of XY coordinates. In this embodiment, in the first setting process S3, the CPU (201) sets the first group of measurement points in the inner circumference area. FIG. 6(a) shows an example of the first group of measurement points set in a rectangular inner circumference area. Here, in each upper limit of the area on the substrate center side divided by X = ±120 mm and Y = ±75 mm within the XY coordinates, the number of divisions in the X direction is 2, and the number of divisions in the Y direction is 1 (i.e., no division).

[0059] In the second setting process S4, the CPU (201) sets the second group of measurement points in the outer area of ​​the rectangle. FIG. 6(b) shows the second group of measurement points set in the outer area. Here, at each upper limit of the area on the end side of the substrate, which is outside the area divided by X = ±200mm and Y = ±150mm in the XY coordinates, the number of divisions in the X direction is 1 (i.e., no divisions), and the number of divisions in the Y direction is 1 (i.e., no divisions).

[0060] FIG. 6(c) illustrates an example in which the measurement points of the first group and the measurement points of the second group are superimposed.

[0061] In addition, the specific values ​​of the number of divisions or XY coordinates shown in each of the embodiments described above are examples, and the present invention is not limited by such values. Furthermore, although examples of measurement points of the first group and the second group were shown in each of the embodiments described above, measurement points of the third group or subsequent groups may also be set. That is, there is no limit to the number of groups to be divided.

[0062] <Fourth Embodiment>

[0063] In the first embodiment, an example was shown in which an exposure device is used as a measuring device, but it is possible to perform the processing shown in each of the above embodiments by using a measuring device other than an exposure device. FIG. 8 is a diagram illustrating an example of the configuration of a measuring device (semiconductor measuring device).

[0064] When the substrate (1005) is mounted on the substrate stage (1006), the surface position of the substrate (1005) is measured by the detection unit (1010) at a plurality of measurement points determined according to the determination method described in the above-described embodiment. The detection unit (1010) may include a projection optical system (1004) and an imaging unit (1012). The imaging unit (1012) has an imaging element (1012f). The control unit (1008) determines the surface shape of the substrate (1005) based on the position information of the substrate stage (1006) obtained by measurement in the measurement unit (1007) and the detection result by the detection unit (1010).

[0065] <Example>

[0066] The effects of multiple measurement points determined according to each embodiment described above were verified. As an example, the results of specifying the surface shape of the substrate at multiple measurement points determined according to the first embodiment were compared with the results obtained by a conventional method.

[0067] When the measurement score was set to 108 and when the measurement score was set to 56, a substrate whose amount of bending had been determined in advance was measured, and a comparison of the amount of bending of the substrate was performed. Here, 56 measurement points were obtained by setting the first group of measurement points with an angle division number of 8 and a line division number of 4, and by setting the second group of measurement points with an angle division number of 16 and a line division number of 3. Additionally, 108 measurement points were obtained by setting the first group of measurement points with an angle division number of 9 and a line division number of 7, and by setting the second group of measurement points with an angle division number of 16 and a line division number of 3.

[0068] An equivalent amount of bending could be obtained for either measurement point. Therefore, according to the method of the embodiment, the surface shape of the substrate can be determined at fewer measurement points than in conventional methods.

[0069] <Effective form of method for manufacturing an article>

[0070] The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing articles such as microdevices, such as semiconductor devices, or devices having a microstructure, for example. The method for manufacturing an article according to the present embodiment includes a process of forming a latent image pattern on a photosensitive material coated on a substrate using the above-described exposure device (a process of exposing the substrate), and a process of developing the substrate on which the latent image pattern is formed by such a process. Furthermore, this manufacturing method includes other well-known processes (oxidation, film formation, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). Compared to conventional methods, the method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article.

[0071] (Other embodiments)

[0072] The present invention can also be realized in a process in which a program realizing one or more functions of the above-described embodiment is supplied to a system or device through a network or storage medium, and one or more processors in a computer of the system or device read and execute the program. In addition, it can also be realized by a circuit realizing one or more functions (e.g., an ASIC).

[0073] The disclosure of this specification includes at least the following determination method, program, information processing device, exposure device, and method for manufacturing an article.

[0074] (Item 1)

[0075] A determination method for determining a plurality of measurement points in order to perform a process of measuring the surface position of the substrate at a plurality of measurement points in order to specify the surface shape of the substrate,

[0076] A first acquisition process for acquiring a first parameter set including a first parameter value and a second parameter value, and

[0077] A second acquisition process for acquiring a second parameter set including a third parameter value and a fourth parameter value, and

[0078] A first setting process for setting measurement points of a first group specified by the first parameter set obtained above, and

[0079] A second setting process for setting measurement points of a second group specified by the second parameter set obtained above, and

[0080] A deletion process for detecting a set of measurement points among the first group of measurement points set above and the second group of measurement points set above, wherein the distance between the measurement points is smaller than a predetermined threshold, and deleting other measurement points while leaving one measurement point among the detected set.

[0081] A determination method characterized by having, and determining the measurement points remaining after deletion in the deletion process among the measurement points of the first group and the measurement points of the second group as the plurality of measurement points.

[0082] (Item 2)

[0083] In the first item,

[0084] A determination method characterized by setting measurement points on each center line when the area of ​​the substrate is equally divided into one or more center lines in the first setting process and the second setting process.

[0085] (Item 3)

[0086] Regarding item 2,

[0087] The first parameter value and the third parameter value represent the number of divisions when the area of ​​the substrate is equally divided by one or more center lines, and

[0088] The above second parameter value and the above fourth parameter value represent the number of divisions when each of the one or more center lines is equally divided, and

[0089] The above first parameter value and the above third parameter value are different from each other,

[0090] The above second parameter value and the above fourth parameter value are different,

[0091] A determination method characterized by the following.

[0092] (Item 4)

[0093] Regarding item 2,

[0094] The first parameter value and the third parameter value represent the central angle when the region of the substrate is equally divided by one or more center lines, and

[0095] The above second parameter value and the above fourth parameter value represent the distance between the division points when each of the one or more center lines is equally divided, and

[0096] The above first parameter value and the above third parameter value are different from each other,

[0097] The above second parameter value and the above fourth parameter value are different,

[0098] A determination method characterized by the following.

[0099] (Item 5)

[0100] Regarding Item 3,

[0101] The above third parameter value is greater than the above first parameter value, and

[0102] The above fourth parameter value is greater than the above second parameter value,

[0103] A determination method characterized by the following.

[0104] (Item 6)

[0105] Regarding item 2,

[0106] In the first setting process above, measurement points of the first group are set in an inner circumference region including the center of the substrate, and

[0107] In the above second setting process, a measurement point of the second group is set in the outer circumference region outside the inner circumference region.

[0108] A determination method characterized by the following.

[0109] (Item 7)

[0110] In item 6,

[0111] A determination method characterized in that the peripheral shape of the inner region is similar to the peripheral shape of the substrate.

[0112] (Item 8)

[0113] A program stored in a computer-readable storage medium for executing each process of the determination method described in any one of items 1 through 7 on a computer.

[0114] (Item 9)

[0115] An information processing device for determining a plurality of measurement points in order to measure the surface position of a substrate at a plurality of measurement points by a measuring device and perform a process to specify the surface shape of the substrate, said information processing device

[0116] A first acquisition means for acquiring a first parameter set including a first parameter value and a second parameter value, and

[0117] A second acquisition means for acquiring a second parameter set including a third parameter value and a fourth parameter value, and

[0118] A first setting means for setting a measurement point of a first group specified by the first parameter set obtained above, and

[0119] A second setting means for setting measurement points of a second group specified by the second parameter set obtained above, and

[0120] A deletion means for detecting a set of measurement points among the first group of measurement points set above and the second group of measurement points set above, wherein the distance between the measurement points is smaller than a predetermined threshold, and for deleting other measurement points while leaving one measurement point among the detected set.

[0121] An information processing device characterized by having, and determining the measurement points remaining after deletion by the deletion means among the measurement points of the first group and the measurement points of the second group as the plurality of measurement points.

[0122] (Item 10)

[0123] In item 9,

[0124] An information processing device characterized in that the first setting means and the second setting means set measurement points on each centerline when the area of ​​the substrate is equally divided into one or more centerlines.

[0125] (Item 11)

[0126] In item 10,

[0127] The first parameter value and the third parameter value represent the number of divisions when the area of ​​the substrate is equally divided by one or more center lines, and

[0128] The above second parameter value and the above fourth parameter value represent the number of divisions when each of the one or more center lines is equally divided, and

[0129] The above first parameter value and the above third parameter value are different from each other,

[0130] The above second parameter value and the above fourth parameter value are different,

[0131] Information processing device characterized by the following.

[0132] (Item 12)

[0133] In item 10,

[0134] The first parameter value and the third parameter value represent the central angle when the region of the substrate is equally divided by one or more center lines, and

[0135] The above second parameter value and the above fourth parameter value represent the distance between the division points when each of the one or more center lines is equally divided, and

[0136] The above first parameter value and the above third parameter value are different from each other,

[0137] The above second parameter value and the above fourth parameter value are different,

[0138] Information processing device characterized by the following.

[0139] (Item 13)

[0140] In item 11,

[0141] The present invention further has a display means for displaying a setting screen for setting the first parameter value, the second parameter value, the third parameter value, and the fourth parameter value, and

[0142] The first acquisition means acquires the first parameter value and the second parameter value according to user operation through the setting screen, and

[0143] The second acquisition means above acquires the third parameter value and the fourth parameter value according to user operation through the setting screen,

[0144] Information processing device characterized by the following.

[0145] (Item 14)

[0146] In item 13,

[0147] The above setting screen has input fields for inputting the first parameter value, the second parameter value, the third parameter value, and the fourth parameter value, respectively, by user operation.

[0148] In the input field for entering the third parameter value, a value identical to the first parameter value is prohibited, and in the input field for entering the fourth parameter value, a value identical to the second parameter value is prohibited.

[0149] Information processing device characterized by the following.

[0150] (Item 15)

[0151] A measuring device characterized by measuring the surface position of a substrate at a plurality of measuring points determined according to a determination method described in any one of items 1 to 7.

[0152] (Item 16)

[0153] An exposure device that projects a pattern of a disc onto a substrate by means of a projection optical system and exposes the substrate,

[0154] A substrate stage that holds and moves the above substrate, and

[0155] A measuring device described in item 15 arranged to measure the surface position of the substrate held by the substrate stage, and

[0156] A control unit that controls the movement of the substrate stage based on the surface shape of the substrate determined from the result measured by the above measuring device,

[0157] An exposure device characterized by having

[0158] (Item 17)

[0159] A process of exposing a substrate using the exposure apparatus described in Item 16, and

[0160] The process of developing the above-mentioned exposed substrate,

[0161] A method for manufacturing an article, characterized by including, manufacturing an article from the above-mentioned developed substrate.

[0162] The invention is not limited to the above embodiments, and various changes and modifications are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to clarify the scope of the invention. Explanation of the symbols

[0163] 1: Exposure device, 100: Light source, 103: Main control unit, 104: Illumination optical system, 110: Projection optical system, 116: Substrate stage

Claims

Claim 1 A determination method for determining a plurality of measurement points for performing a process of measuring the surface position of a substrate at a plurality of measurement points to specify the surface shape of the substrate, comprising: a first setting process for setting a first group of measurement points specified by a first parameter set including a first parameter value and a second parameter value; a second setting process for setting a second group of measurement points specified by a second parameter set including a third parameter value and a fourth parameter value; and a deletion process for detecting a set of measurement points among the first group of measurement points and the second group of measurement points where the distance between the measurement points is less than a predetermined threshold, and deleting other measurement points while leaving one measurement point among the detected set, wherein the measurement points remaining after deletion in the deletion process among the first group of measurement points and the second group of measurement points are determined as the plurality of measurement points, wherein the first parameter value and the third parameter value represent the number of divisions when the area of ​​the substrate is angle-divided by one or more center lines, and A determination method characterized in that the second parameter value and the fourth parameter value represent the number of divisions when one or more center lines are divided. Claim 2 A determination method according to claim 1, characterized in that, in the first setting process and the second setting process, measurement points are set on each centerline when the area of ​​the substrate is equally divided by one or more centerlines. Claim 3 A determination method according to claim 2, wherein the first parameter value and the third parameter value represent the number of divisions when the area of ​​the substrate is equally divided by the one or more center lines, the second parameter value and the fourth parameter value represent the number of divisions when each of the one or more center lines is equally divided, and wherein the first parameter value and the third parameter value are different from each other, and the second parameter value and the fourth parameter value are different from each other. Claim 4 A determination method characterized in that, in the second item, the first parameter value and the third parameter value represent the central angle when the area of ​​the substrate is equally divided by one or more center lines, the second parameter value and the fourth parameter value represent the distance between the division points when each of the one or more center lines is equally divided, the first parameter value and the third parameter value are different from each other, and the second parameter value and the fourth parameter value are different from each other. Claim 5 A determination method according to claim 3, characterized in that the third parameter value is greater than the first parameter value and the fourth parameter value is greater than the second parameter value. Claim 6 A determination method according to claim 2, characterized in that, in the first setting process, the measurement points of the first group are set in an inner circumference region including the center of the substrate, and in the second setting process, the measurement points of the second group are set in an outer circumference region outside the inner circumference region. Claim 7 A determination method according to claim 6, characterized in that the peripheral shape of the inner circumference region is similar to the peripheral shape of the substrate. Claim 8 A program stored in a computer-readable storage medium for executing each process of the determination method described in any one of claims 1 to 7 on a computer. Claim 9 In order to measure the surface position of a substrate at a plurality of measurement points by a measuring device and perform a process to specify the surface shape of the substrate, the information processing device for determining the plurality of measurement points comprises: a first setting means for setting a first group of measurement points specified by a first parameter set including a first parameter value and a second parameter value; a second setting means for setting a second group of measurement points specified by a second parameter set including a third parameter value and a fourth parameter value; and a deletion means for detecting a set of measurement points among the set first group of measurement points and the set second group of measurement points, wherein the distance between measurement points is less than a predetermined threshold, and among the detected set, leaving one measurement point and deleting other measurement points, wherein the measurement point remaining after deletion by the deletion means among the first group of measurement points and the second group of measurement points is determined as the plurality of measurement points, and the first parameter value and the third parameter value are the number of divisions when the area of ​​the substrate is angle-divided by one or more center lines An information processing device characterized by representing, wherein the second parameter value and the fourth parameter value represent the number of divisions when one or more center lines are divided. Claim 10 An information processing device according to claim 9, wherein the first setting means and the second setting means set measurement points on each centerline when the area of ​​the substrate is equally divided by one or more centerlines. Claim 11 An information processing device according to claim 10, wherein the first parameter value and the third parameter value represent the number of divisions when the area of ​​the substrate is equally divided by the one or more center lines, the second parameter value and the fourth parameter value represent the number of divisions when each of the one or more center lines is equally divided, the first parameter value and the third parameter value are different from each other, and the second parameter value and the fourth parameter value are different from each other. Claim 12 An information processing device according to claim 10, wherein the first parameter value and the third parameter value represent the central angle when the area of ​​the substrate is equally divided by one or more center lines, the second parameter value and the fourth parameter value represent the distance between the division points when each of the one or more center lines is equally divided, and wherein the first parameter value and the third parameter value are different from each other, and the second parameter value and the fourth parameter value are different from each other. Claim 13 An information processing device according to claim 11, further comprising: a display means for displaying a setting screen for setting the first parameter value, the second parameter value, the third parameter value, and the fourth parameter value; a first acquisition means for acquiring the first parameter value and the second parameter value according to user operation through the setting screen; and a second acquisition means for acquiring the third parameter value and the fourth parameter value according to user operation through the setting screen. Claim 14 An information processing device according to claim 13, wherein the setting screen has input fields for inputting the first parameter value, the second parameter value, the third parameter value, and the fourth parameter value by user operation, wherein the input field for inputting the third parameter value is prohibited from having a value equal to the first parameter value, and the input field for inputting the fourth parameter value is prohibited from having a value equal to the second parameter value. Claim 15 A measuring device characterized by measuring the surface position of a substrate at a plurality of measuring points determined according to a determination method described in any one of claims 1 to 7. Claim 16 An exposure device for exposing a substrate by projecting a pattern of a disc onto a substrate using a projection optical system, the exposure device comprising: a substrate stage that holds and moves the substrate; a measuring device described in claim 15 arranged to measure the surface position of the substrate held by the substrate stage; and a control unit that controls the movement of the substrate stage based on the surface shape of the substrate determined from the result measured by the measuring device. Claim 17 A method for manufacturing an article, characterized by including a process of exposing a substrate using an exposure device described in claim 16 and a process of developing the exposed substrate, thereby manufacturing an article from the developed substrate.

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