Gripper for Correcting Bending Of Semiconductor Substrate

Abstract

The present invention relates to a semiconductor substrate sagging prevention gripper that corrects the sagging of a thin substrate for Panel Level Packaging (PLP) inserted into a FOUP and transports the thin substrate. This semiconductor substrate sagging prevention gripper comprises a hand body part installed on the link arm of a conveyor robot; a blade part installed to protrude forward on one side of the hand body part and supporting a substrate on its upper side; a front clamp part including a front pneumatic cylinder installed on the lower side of the blade part and operated by a signal applied by a control unit, a front slider connected to the front pneumatic cylinder and moving linearly according to the operation of the front pneumatic cylinder, and a front end clamp connected to the front slider and swinging in response to the forward and backward movement of the front slider; a rear clamp operating part including a rear pneumatic cylinder installed on the upper side of the blade part between the front end clamp and the hand body part, a rear slider connected to the rear pneumatic cylinder and moving linearly according to the operation of the rear pneumatic cylinder, a gripper clamp connector having at least one of one side and the other side protruding toward one side and the other side of the blade part on one side of the rear slider, and connected to the gripper clamp connector of the rear clamp operating part It includes a clamp clamp part located on one side or the other of the blade part, which operates the clamp according to a signal applied from the control part.

Description

Technology Field

[0001] The present invention relates to a robot gripper designed to stably handle thin substrates used in semiconductor manufacturing and electronic device manufacturing processes. More specifically, the present invention relates to a semiconductor substrate sagging prevention gripper that corrects the sagging of a thin substrate mounted on a FOUP (Front Opening Unified Pod) that holds substrates produced in a semiconductor manufacturing process and transports the thin substrate. Background Technology

[0002] Thin-film substrates are widely used in the manufacturing of electronic devices and semiconductor processes. Because these substrates are thin and flexible, they are prone to sagging or deformation during transport and processing. This can lead to various problems. For example, it can cause a decline in process quality, substrate damage, and interference issues in confined spaces. More specifically, sagging reduces the positional precision of thin-film substrates, which can lead to alignment errors and quality degradation during the manufacturing process. In particular, surface uniformity is critical in optical inspection and coating processes, and sagging can cause defects. Furthermore, because thin-film substrates are thin, they may crack or break if improper force is applied during transport. This can lead to high manufacturing costs. Such thin-film substrates are often processed in confined spaces, such as in Front Opening Unified Pods (FOUPs).

[0003] Thin substrates are fed into and withdrawn from the FOUP via a gripper device. However, current gripper devices for thin substrates have a problem of damaging the substrate when feeding in and out of thin substrates in confined spaces such as FOUPs. For example, the gripper device has the problem of failing to compensate for substrate sagging or prevent interference. Furthermore, current gripper devices cannot operate efficiently inside the FOUP due to limitations in clamp height, shape, or movement. Additionally, current gripper devices cannot precisely control the magnitude of force, making it impossible to perform delicate operations that take into account the characteristics of thin substrates. In other words, existing gripper devices suffer from poor work quality due to an ineffective prevention of sagging, reduced efficiency due to line issues in confined workspaces, and an inability to perform a stable grip. Prior art literature

[0004] Republic of Korea Registered Patent No. 10-0657502 'Method for manufacturing a substrate loading holder for a semiconductor manufacturing apparatus and a batch-type boat equipped with this holder' (Date of publication: December 20, 2006) The problem to be solved

[0005] The objective of the present invention, devised to solve the aforementioned problems, is to provide a semiconductor substrate sagging prevention gripper that can safely transport a thin substrate for PLP inserted into a FOUP by compensating for its sagging.

[0006] In addition, the objective of the present invention is to provide a semiconductor substrate sagging prevention gripper that prevents damage to the surface of a thin substrate by minimizing the contact area between the clamp and the substrate and precisely fixing and moving only specific positions.

[0007] In addition, the objective of the present invention is to provide a semiconductor substrate sagging prevention gripper that improves the productivity and quality of the entire process by enhancing the stability of substrate transportation and handling.

[0008] The problems that the present invention aims to solve are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0009] A semiconductor substrate sagging prevention gripper of the present invention for achieving the above-mentioned problem comprises, in a gripper of a semiconductor substrate transfer robot, a hand body part installed on a link arm of a transfer robot; a blade part installed to protrude forward on one side of the hand body part and supporting a substrate on its upper side; a front pneumatic cylinder installed on the lower side of the blade part and operated by a signal applied by a control unit; a front clamp part including a front slider connected to the front pneumatic cylinder and moving linearly according to the operation of the front pneumatic cylinder, and a front end clamp connected to the front slider and swinging in response to the forward and backward movement of the front slider; a rear pneumatic cylinder installed on the upper side of the blade part between the front end clamp and the hand body part; a rear slider connected to the rear pneumatic cylinder and moving linearly according to the operation of the rear pneumatic cylinder; and a gripper clamp connector having at least one of one side and the other side protruding toward one side and the other side of the blade part on one side of the rear slider. It includes a rear clamp operating part and a clamp clamp part connected to a clamp clamp connector of the rear clamp operating part, located on one side or the other side of the blade part, and operates according to a signal applied from a control part; when the clamp clamp part is advanced so that the front clamp part and the clamp clamp part together grasp the substrate, the clamp clamp part is retracted to pull the substrate and flatten it, and the front clamp part includes a joint block on which a front end clamp is installed on one surface, and the front end clamp includes a first link arm connected to one surface of the joint block, a second link arm hinge-connected to the first link arm, and a third link arm, one end of which is connected to the second link arm and the other end of which is connected to the upper surface of the blade part.

[0010] The blade portion includes a first blade installed at one end of one side of the hand body portion, and a second blade installed at the other end of one side of the hand body portion, spaced apart from the first blade.

[0011] delete

[0012] The front clamp section further includes a photosensor that emits light and measures the time it takes for the emitted light to be reflected and received, and a sensor detection bar connected to the front slider that moves according to the linear movement of the front slider and adjusts its distance from the photosensor.

[0013] The blade section is formed as a square at one end where the horizontal and vertical lengths are greater than the width of the blade section, and includes a front housing installed on the lower side, which has a front pneumatic cylinder, a front slider, a photosensor, and a sensor detection bar connected to the front slider that moves linearly between the photosensors. Effects of the invention

[0014] As described above, the present invention provides a semiconductor substrate sagging prevention gripper that transports a substrate to correct the sagging of a thin substrate for PLP (Panel Level Packaging) inserted into a FOUP.

[0015] In addition, the present invention provides a semiconductor substrate sagging prevention gripper for transporting a substrate that corrects panel sagging, thereby preventing damage to the surface of a thin substrate by minimizing the contact area between the clamp and the substrate and precisely fixing and moving only specific positions.

[0016] In addition, the present invention provides a semiconductor substrate sagging prevention gripper that improves the productivity and quality of the entire process by improving the stability of substrate transportation and handling. Brief explanation of the drawing

[0017] FIG. 1 is a drawing showing the usage state of a semiconductor substrate sagging prevention gripper according to one embodiment of the present invention. FIG. 2 is a plan view of a semiconductor substrate sagging prevention gripper according to an embodiment of the present invention of FIG. 1. Figure 3 is a diagram showing the state in which the semiconductor substrate sagging prevention gripper of Figure 2 supports a PLP substrate. Figure 4 is a view of the front end of the semiconductor substrate sagging prevention gripper of Figure 2, seen from side I. FIG. 5 is a diagram showing the state in which a semiconductor substrate sagging prevention gripper according to one embodiment of the present invention of FIG. 1 clamps a thin film substrate mounted on a FOUP. FIG. 6 is a diagram showing the state in which a semiconductor substrate sagging prevention gripper according to one embodiment of the present invention of FIG. 1 places a thin substrate on a FOUP. Figures 7 and 8 are drawings showing the operating state of the clamp clamp part and the rear clamp operating part. Figure 9 is a drawing showing the operating state of the first front clamp part of Figure 3. FIG. 10 is a drawing showing the operating state of the first front clamp part of FIG. 3. Specific details for implementing the invention

[0018] The advantages and features of the present invention and the apparatus for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited by the embodiments disclosed below. The limitation of the present invention may be limited solely by the claims. That is, the scope of the claims of the present invention may be defined by the claims. Furthermore, the embodiments in this specification are provided merely to fully inform those skilled in the art of the scope of the invention, and the present invention may be implemented in various different forms. Identical reference numerals used to describe the embodiments in this specification refer to identical components.

[0019] Hereinafter, a semiconductor substrate sagging prevention gripper according to one embodiment of the present invention will be described in general terms with reference to FIG. 1 so that the description of the present invention can be concise and clear.

[0020] FIG. 1 is a drawing showing the usage state of a semiconductor substrate sagging prevention gripper according to one embodiment of the present invention.

[0021] A semiconductor substrate sagging prevention gripper (100) according to one embodiment of the present invention corrects the sagging of a thin substrate (C) for PLP (Panel Level Packaging) inserted into a FOUP (B, Front Opening Unified Pod). The semiconductor substrate sagging prevention gripper (100) has a front clamp part (130) and a gripper clamp part (150) that minimize the contact area between the substrates to precisely fix only a specific position and then move the substrate, thereby preventing damage to the surface of the thin substrate. The thin substrate for PLP that is grasped and moved by the semiconductor substrate sagging prevention gripper (100) according to one embodiment of the present invention is formed of a very thin and flexible material, so sagging (deformation) easily occurs due to gravity or movement during transport.

[0022] A semiconductor substrate sagging prevention gripper (100) according to one embodiment of the present invention stably holds and transports a thin-plate substrate as described above, while simultaneously correcting sagging or positional instability of the substrate. In addition, it supports the substrate with even pressure from below and maintains the substrate flat by pulling it slightly in one direction mechanically or pneumatically. In other words, the semiconductor substrate sagging prevention gripper (100) according to one embodiment of the present invention exhibits the features of fixing the position of the substrate and then pulling one side of the substrate to maintain it in an accurately aligned state, preventing deformation caused by shaking or twisting during the process of transporting the substrate, and maintaining the substrate flat by clamping and fixing one side and then pulling it slightly in one direction. Here, the thin-plate substrate (C) is a substrate with a thickness of 0.2t to 0.4t.

[0023] A semiconductor substrate sagging prevention gripper (100) according to one embodiment of the present invention comprises a hand body part (110), a blade part (120), a front clamp part (130), a rear clamp operating part (140), a gripper clamp part (150), a front housing (160), and an antistatic pad (170) as components.

[0024] Hereinafter, a semiconductor substrate sagging prevention gripper according to an embodiment of the present invention will be described in detail with reference to FIGS. 2 to 4.

[0025] FIG. 2 is a plan view of a semiconductor substrate sagging prevention gripper according to an embodiment of the present invention of FIG. 1, and FIG. 3 is a drawing showing the semiconductor substrate sagging prevention gripper of FIG. 2 supporting a PLP substrate. FIG. 4 is a drawing of the front end of the semiconductor substrate sagging prevention gripper of FIG. 2 viewed from side I.

[0026] The hand body part (110) is installed on the link arm of the return robot. This hand body part (110) is formed in the shape of 'ya' as shown in FIG. 2. The lower side of this hand body part (110) is connected to the link arm of the return robot, and one side is connected to the blade part (120).

[0027] The blade portion (120) serves as a blade that directly supports the substrate. The blade portion (120) protrudes forward from one side of the hand body portion (110) and is positioned below the substrate, allowing the thin substrate (C) to be placed stably. Such a blade portion (120) is made of a thin and hard material, such as ceramic, aluminum, or carbon fiber, to prevent sagging or damage to the substrate and to maintain balance aligned with the center of the substrate.

[0028] As shown in FIG. 2, the blade portion (120) includes a first blade (121) installed at one end of one side of the hand body portion (110), and a second blade (122) installed at the other end of one side of the hand body portion (110), spaced apart from the first blade (121). In addition, the blade portion (120) further includes a front housing (160) formed as a square at one end, with the horizontal and vertical lengths being larger than the width of the blade portion. More specifically, the first blade (121) includes the first front housing (161), and the second blade (122) includes the second front housing (162).

[0029] The front clamp section (130) enables the front clamp (1303) to perform a swing motion around a pivot axis. Additionally, the front clamp section (130) detects whether the swing motion is being performed. This front clamp section (130) allows for the accurate gripping of a thin substrate while minimizing interference even in a narrow space. Such a front clamp section (130) includes a first-1 front clamp section (1311) and a first-2 front clamp section (1312) installed on the first blade (121), and includes a second-1 front clamp section (1321) and a second-2 front clamp section (1322) installed on the second blade (122). The front clamp section (130), that is, the first-1 front clamp section (1311), the first-2 front clamp section (1312), the second-1 front clamp section (1321), and the second-2 front clamp section (1322), includes components such as a front pneumatic cylinder (1301), a front slider (1302), a front end clamp (1303), a photosensor (1304), and a sensor detection bar (1305). Here, the front pneumatic cylinder (1301) is installed on the lower side of one end of the blade section (120) or on the lower side of the front housing (160), as shown in FIG. 3, and is operated by a signal applied by the control unit. This front pneumatic cylinder (1301) uses compressed air to cause the piston and rod to move in a straight line. A front pneumatic cylinder (1301) of this type is composed of a cylinder body, a piston, a rod, a port, and a seal, and can be operated in a single-acting cylinder and double-acting cylinder manner.

[0030] The front slider (1302) is connected to the rod of the front pneumatic cylinder (1301) and moves linearly according to the operation of the front pneumatic cylinder (1301). For example, the front slider (1302) can be formed in a shape such as '┛'. A joint block (13021) on which a front end clamp (1303) is installed is installed on one side of the front slider (1302).

[0031] The front clamp (1303) is connected to the front slider (1302) and acts as a clamp that holds one end of a thin substrate as the front slider (1302) moves forward and backward. More specifically, the front clamp (1303) is composed of a first link arm (13031), a second link arm (13032), a third link arm (13033), and a urethane pad (13034). Here, the first link arm (13031) is an arm to which one end of a joint block (13021) connected to the front slider (1302) is connected. The second link arm (13032) is an arm to which one end is hinge-connected to the first link arm (13031). And the third link arm (13033) is an arm in which one end is connected to the middle portion of the second link arm (13032) and the other end is connected to the upper surface of the blade portion (120). A urethane pad (13034) is attached to the front end of the second link arm (13032), that is, the part that contacts the upper surface of the third link arm (13033). This urethane pad (13034) is a pad made of polyurethane (PU) material and is a multi-purpose product that performs shock absorption, friction prevention, sealing, or cushioning functions.

[0032] In the front clamp (1303) of this structure, when the front slider (1302) moves forward, the second link arm (13032) rotates so that the second link arm (13032) rotates toward the upper side of the other end of the third link arm (13033). And when the front slider (1302) moves backward, the second link arm (13032) rotates so that the second link arm (13032) rotates toward the outside from the upper side of the third link arm (13033).

[0033] The photosensor (1304) emits light and measures the time it takes for the emitted light to be reflected and received, and detects the distance of the sensor detection bar (1305) moving between the photosensors (1304). At this time, the sensor detection bar (1305) is connected to the front slider (1302) and moves according to the linear movement of the front slider (1302), and the distance from the photosensor (1304) is adjusted.

[0034] The rear clamp operating unit (140) is installed between the front clamp (1303) and the hand body (110) and serves as a device that moves the gripper clamp unit (150) back and forth. Such a rear clamp operating unit (140) includes a rear pneumatic cylinder (1401), a rear slider (1402), and a gripper clamp connector (1403). Here, the rear pneumatic cylinder (1401) is installed on the upper side of the blade unit (120) as shown in FIG. 1. It is installed on the upper side of the blade unit (120) and is operated by a signal applied by the control unit. Such a rear pneumatic cylinder (1401) uses compressed air to cause the piston and rod to move in a straight line. Such a rear pneumatic cylinder (1401) is composed of a cylinder body, a piston, a rod, a port, and a seal, and can be operated in a single-acting cylinder and double-acting cylinder manner.

[0035] The rear slider (1402) is connected to the rear pneumatic cylinder (1401) and moves in a straight line according to the operation of the rear pneumatic cylinder (1401). The rear slider (1402) is connected to the rod of the rear pneumatic cylinder (1401) and moves in a straight line according to the operation of the rear pneumatic cylinder (1401). A clamp clamp connector (1403) is installed on the upper surface of the rear slider (1402). At least one of the one side and the other side of the clamp clamp connector (1403) protrudes from one side of the rear slider (1402) toward the one side and the other side of the blade portion (120).

[0036] As shown in FIG. 2, the rear clamp operating unit (140) includes a first rear clamp operating unit (141) installed on the first blade (121) and a second rear clamp operating unit (142) installed on the second blade (122). At this time, the first rear clamp operating unit (141) and the second rear clamp operating unit (142) are installed on a single imaginary straight line, so that the distance between the first rear clamp operating unit (141) and the first front clamp unit (1310) and the distance between the second rear clamp operating unit (142) and the second front clamp unit (1320) are the same. At this time, the first rear clamp operating part (141) includes a first rear pneumatic cylinder (1411), a first rear slider (1412), and a first clamp clamp connector (1413). And the second rear clamp operating part (142) includes a second rear pneumatic cylinder (1421), a second rear slider (1422), and a second clamp clamp connector (1423).

[0037] As shown in FIG. 1, the clamp clamp part (150) is connected to the clamp clamp connector (1403) of the rear clamp operating part (140) and is located on at least one side or the other side of the blade part (120) and operates according to a signal applied from the control part and grips the thin plate substrate. Such a clamp clamp part (150) includes, for example, a first-1 clamp clamp part (1511) installed at one end of a first clamp clamp connector (1413) and a first-2 clamp clamp part (1512) installed at the other end of the first clamp clamp connector (1413), as shown in FIG. 2, and a second-1 clamp clamp part (1521) installed at one end of a second clamp clamp connector (1423) and a second-2 clamp clamp part (1522) installed at the other end of the second clamp clamp connector (1423). At this time, the 1-1 clamp part (1511), the 1-2 clamp part (1512), the 2-1 clamp part (1521), and the installed 2-2 clamp part (1522) are all formed with the same structure and the same shape, and operate according to a signal applied from the control unit and can grip a thin plate substrate.

[0038] The anti-static pad (170) serves as a pad that prevents static electricity and protects the substrate. The anti-static pad (170) can prevent interference with the substrate when the rear clamp is pushed at the mid position during the clamp sequence. Additionally, the anti-static pad (170) is a first anti-static pad (171) installed on the first blade (121) and a second anti-static pad (172) installed on the second blade (122). At this time, the first anti-static pad (171) is installed in front of the first rear clamp operating part (141), and the second anti-static pad (172) is installed in front of the second rear clamp operating part (142).

[0039] These antistatic pads (170) are manufactured from carbon-containing rubber, conductive polyurethane (PU), and silicone-based antistatic materials, and have an electrostatic discharge function and can reduce friction when in contact with the substrate. In addition, they exhibit high durability and grounding characteristics. Such antistatic pads (170) reduce the failure rate caused by electrostatic discharge or physical damage and prevent damage to the surface of the substrate due to friction or impact during the process in which the first blade (121) and the second blade (122) grasp or move the substrate.

[0040] Hereinafter, the operation of a semiconductor substrate sagging prevention gripper according to an embodiment of the present invention will be described in detail with reference to FIGS. 5 and 6.

[0041] FIG. 5 is a diagram showing a state in which a semiconductor substrate sagging prevention gripper according to an embodiment of the present invention of FIG. 1 clamps a thin film substrate mounted on a FOUP, and FIG. 6 is a diagram showing a state in which a semiconductor substrate sagging prevention gripper according to an embodiment of the present invention of FIG. 1 mounts a thin film substrate on a FOUP.

[0042] A substrate sagging correction robot gripper (100) according to one embodiment of the present invention is operated to pull out a thin substrate placed on a FOUP (B) or to insert a thin substrate into the FOUP (B).

[0043] First, the substrate sagging correction robot gripper (100) according to one embodiment of the present invention starts operating by lowering the blade portion (120) into the FOUP (B) by a downstroke of about 15 mm as shown in FIG. 5 (A). Subsequently, the substrate sagging correction robot gripper (100) according to one embodiment of the present invention raises the blade portion (120) to the Mid Zone (red dotted line) position inside the FOUP (B). Subsequently, the substrate sagging correction robot gripper (100) according to one embodiment of the present invention advances the gripper clamp portion (150) and operates it together with the front clamp portion (130) to fix the first thin substrate (C1) placed on the FOUP (B) as shown in FIG. 5 (B). Subsequently, as shown in FIG. 5 (C), after fixing the first thin substrate (C1), it is raised by about 2 mm by an upstroke. Afterwards, the clamping part (150) is retracted to pull the bent first thin substrate (C) and perform the process of flattening the first thin substrate (C1). Next, the substrate sagging correction robot gripper (100) according to one embodiment of the present invention fixes the first thin substrate (C1) located outside to the blade part (120), then inserts the blade part (120) into the up position inside the FOUP (B), and then advances the clamping part (150). Afterwards, considering the sagging of the first thin substrate (C1) that is seated on the FOUP (B), the blade part (120) is lowered to the mid zone (red dotted line) position inside the FOUP (B). Afterwards, the clamp part (150) is advanced and operated together with the front clamp part (130) to mount the first thin plate substrate (C1) held in the FOUP (B) as shown in (B) of FIG. 6. Afterwards, as shown in (C) of FIG. 6, the first thin plate substrate (C1) is released, and the blade part (120) is lowered by a downstroke of about 15 mm. Afterwards, the clamp part (150) is retracted.

[0044] Hereinafter, with reference to FIGS. 7 to 10, the operation of the front clamp part, the rear clamp operating part, and the gripper clamp part will be explained in detail.

[0045] FIGS. 7 and 8 are drawings showing the operating state of the gripper clamp part and the rear clamp operating part, and FIG. 9 is a drawing showing the operating state of the first front clamp part of FIG. 3. FIG. 10 is a drawing showing the operating state of the front clamp part of FIG. 2.

[0046] The rear clamp operating unit (140) operates the rear pneumatic cylinder (1401) in the win position according to a signal applied from the control unit, as shown in FIG. 7 (a), and advances the rear slider (1402) as shown in FIG. 7 (b). For example, when a signal is applied from the control unit, the rear clamp operating unit (140) can move the rear slider (1402) by 'ΔL' as shown in FIG. 7 (b). Subsequently, the gripper clamp unit (150) moves forward and backward in accordance with the operation of the rear clamp operating unit (140). More specifically, the gripper clamp unit (150) is connected to the gripper clamp connector (1403) of the rear clamp operating unit (140) and moves in accordance with the operation of the rear clamp operating unit (140). The clamping part (150) is operated by a signal applied from the control unit. For example, after the clamping part (150) moves toward the thin substrate (C), when an electrical signal is applied to the clamping part (150) from the control unit, the clamping part (150) grabs the thin substrate (C) as shown in FIG. 8 (b). Afterwards, the rear clamp operating part (140) is operated to retract the rear slider (1402) and pull the thin substrate (C) as shown in FIG. 8 (c).

[0047] As shown in FIG. 9, the front clamp section (130) ensures that the front clamp (1303) is in an unfolded state while the front pneumatic cylinder (1301) and the front slider (1302) remain stationary. That is, the front clamp section (130) is in a state where it does not hold the thin substrate (C) while the front pneumatic cylinder (1301) and the front slider (1302) remain stationary. At this time, the sensor detection bar (1305) installed on the joint block (13021) moves between the photosensors (1304), and the state in which the front clamp (1303) is unfolded can be determined based on the distance of the sensor detection bar (1305) detected by the photosensors (1304). Additionally, as shown in FIG. 10, the front clamp section (130) causes the front end clamp (1303) installed on the joint block (13021) to be in a folded state when the front pneumatic cylinder (1301) is operated and the front slider (1302) moves forward. Here, the sensor detection bar (1305) installed on the joint block (13021) moves between the photosensors (1304), and the folded state of the front end clamp (1303) can be determined according to the distance of the sensor detection bar (1305) detected by the photosensors (1304).

[0048] A semiconductor substrate sagging prevention gripper (100) according to one embodiment of the present invention has a front clamp part (130), a gripper clamp part (150), etc., which minimize the contact area between substrates and precisely fix and move only specific positions, thereby enabling the thin substrate to be transported stably without damaging the surface of the thin substrate.

[0049] Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention may be implemented in other specific forms without changing its technical concept or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. Explanation of the symbols

[0050] 100: Semiconductor substrate sagging prevention gripper 110: Hand main body 120: Blade Section 121: 1st Blade 122: 2nd Blade 130: Front clamp section 1301: Front pneumatic cylinder 1302: Front Slider 13021: Joint Block 1303: Front clamp 13031: 1st Link Arm 13032: 2nd Link Arm 13033: 3rd Link Arm 13034: Urethane pad 1304: Photosensor 1305: Sensor detection bar 1310: 1st front clamp section 1320: 2nd front clamp section 1311: 1-1 Front Clamp Section 1312: 1-2 Front Clamp Section 1321: Section 2-1 Front Clamp 1322: Section 2-2 Front Clamp Part 140: Rear clamp operating part 1401: Rear pneumatic cylinder 1402: Rear slider 1403: Clamp connector 141: First rear clamp operating part 1411: 1st rear pneumatic cylinder 1412: 1st rear slider 1413: 1st clamp connector 142: Second rear clamp operating part 1421: 2nd rear pneumatic cylinder 1422: 2nd rear slider 1423: Second clamp connector 150: Clamp part 1511: 1-1 Clamp Section 1512: 1-2 Clamp Section 1521: Section 2-1 Clamp Part 1522: Section 2-2 Clamp Part 160: Front housing 161: 1st Front Housing 162: 2nd Front Housing 170: Anti-static pad 171: 1st Anti-static Pad 172: 2nd Anti-static Pad A: Return Robot B: FOUP C: Thin substrate

Claims

Claim 1 In a gripper of a semiconductor substrate transfer robot, the hand body part (110) installed on the link arm of the transfer robot; a blade part (120) installed to protrude forward on one side of the hand body part (110) and supporting a substrate on the upper side; a front clamp part (130) including a front pneumatic cylinder (1301) installed on the lower side of the blade part (120) and operated by a signal applied by a control unit, a front slider (1302) connected to the front pneumatic cylinder (1301) and moving linearly according to the operation of the front pneumatic cylinder (1301), and a front end clamp (1303) connected to the front slider (1302) and swinging in response to the forward and backward movement of the front slider (1302); and a blade part (120) installed on the upper side of the blade part (120) between the front end clamp (1303) and the hand body part (110). A rear clamp operating unit (140) comprising a rear pneumatic cylinder (1401), a rear slider (1402) connected to the rear pneumatic cylinder (1401) and moving linearly according to the operation of the rear pneumatic cylinder (1401), and a clamp clamp connector (1403) having at least one of one side and the other side protruding from one side of the rear slider (1402) toward one side and the other side of the blade unit (120), and a clamp clamp unit (150) connected to the clamp clamp connector (1403) of the rear clamp operating unit (140), positioned on one side or the other side of the blade unit (120), and operating according to a signal applied from a control unit, wherein the clamp clamp unit (150) is advanced so that the front clamp unit (130) and the clamp clamp unit (150) together grasp the substrate, A semiconductor substrate sagging prevention gripper (100), wherein the clamp clamp portion (150) is retracted to pull and flatten the substrate, and the front clamp portion (130) includes a joint block (13021) on which a front clamp (1303) is installed on one side, and the front clamp (1303) includes a first link arm (13031) connected to one side of the joint block (13021), a second link arm (13032) hinge-connected to the first link arm (13031), and a third link arm (13033) having one end connected to the second link arm (13032) and the other end connected to the upper side of the blade portion (120). Claim 2 In claim 1, the blade portion (120) comprises a first blade (121) installed at one end of one side of the hand body portion (110) and a second blade (122) installed at the other end of one side of the hand body portion (110) spaced apart from the first blade (121), forming a semiconductor substrate sagging prevention gripper (100). Claim 3 delete Claim 4 In claim 1, the front clamp portion (130) further comprises a photosensor (1304) that outputs light and measures the time for the output light to be reflected and received, and a sensor detection bar (1305) connected to a front slider (1302) that moves according to the linear movement of the front slider (1302) and adjusts the distance from the photosensor (1304), forming a semiconductor substrate sagging prevention gripper (100). Claim 5 In paragraph 4, the blade portion (120) is formed as a square at one end with the horizontal and vertical lengths being greater than the width of the blade portion, and the front housing (160) is installed with a front pneumatic cylinder (1301), a front slider (1302), a photosensor (1304), and a sensor detection bar (1305) connected to the front slider (1302) and moving linearly between the photosensors (1304), thereby forming a semiconductor substrate sagging prevention gripper (100).

Images